US20020076537A1 - Laminated structure - Google Patents
Laminated structure Download PDFInfo
- Publication number
- US20020076537A1 US20020076537A1 US09/920,370 US92037001A US2002076537A1 US 20020076537 A1 US20020076537 A1 US 20020076537A1 US 92037001 A US92037001 A US 92037001A US 2002076537 A1 US2002076537 A1 US 2002076537A1
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- United States
- Prior art keywords
- conjunction portion
- substrate
- particles
- conjunction
- laminated structure
- Prior art date
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Definitions
- This invention relates to a laminated structure. More particularly, this invention relates to a laminated structure provided with pairs of corresponding bumps or conjunction portions which are electrically connected to each other by particles embedded.
- ACF is a conductive film composed of epoxy resin and a plurality of metal particles and is often used as interlayer clamped between two corresponding bumps or electrodes of a substrate and LSI (Large Scale Integrated Circuit), COG (Chip On Glass), FPC (Flexible Printed Circuit), PCB (Printed Circuit Board), TAB (Tape Automatic Bonding) or TCP (Tape Carrier Package) so as to form a laminated structure for use in LCD panels.
- LSI Large Scale Integrated Circuit
- COG Chip On Glass
- FPC Flexible Printed Circuit
- PCB Printed Circuit Board
- TAB Tape Automatic Bonding
- TCP Tape Carrier Package
- the manufacturing process of ACF is complicated, and the tolerance of the height difference among the bumps of LSI/FPC/PCB/TCP cannot always be precisely controlled. If the design aims to increase the amount of conductive particles captured by the bumps or electrodes, the size of the bumps or electrodes formed on the LSI/FPC/PCB/TCP cannot be too small to contact the conductive particles within the predetermined area. If the design aims to increase the conductivity between two corresponding bumps or electrodes by increasing the number of particles in the ACF, the effective space (Fine Pitch Design) between any two of the adjacent bumps or electrodes cannot be so narrow as to cause a short circuit.
- FIG. 1A, 1B and 1 C are three plan views sequentially depicting the steps for forming a laminated structure 1 according to a prior art.
- the substrate 11 , 12 are two conductive plates of LSI/COG/FPC/PCB/TAB/TCP.
- the laminated structure 1 is composed of two substrates 11 ( 12 ), a plurality of conductive particles 13 and an epoxy 14 .
- the substrate 11 has a surface 110 with a plurality of spaced bumps A 1 -A 3
- the substrate 12 has a surface 120 with a plurality of spaced bumps (B 1 ⁇ B 3 ) corresponding to bumps A 1 ⁇ A 3 .
- the so-called Anisotropic Conductive Film (ACF) is made of epoxy 14 mixed with the particles 13 , and the ACF is used as an intermediate to bond the substrates 11 and the substrates 12 together and electrically connect the substrates 11 to the substrates 12 .
- ACF Anisotropic Conductive Film
- the bumps A 1 ⁇ A 3 of the substrate 11 are respectively provided with end surfaces A 01 , A 02 and A 03
- the bumps B 1 ⁇ B 3 of the substrate 12 are respectively provided with end surfaces B 01 , B 02 and B 03 .
- a height difference t 1 exists between the bump B 1 and the bump B 2
- another height difference t 2 exists between bump B 2 and bump B 3 .
- FIG. 1B shows the substrate 11 and the substrate 12 being brought toward each other by the application of a clamping force F.
- FIG. 1C shows the first substrate 21 and the second substrate 22 being combined together by the epoxy 14 and electrically connected to each other via the particles 13 .
- FIG. 1B a force F is applied on the two substrates 11 , 12 to form the laminated structure 1 .
- the epoxy 14 is gradually deformed and thinned by the approaching substrates 11 and 12 , and then the particles 13 stored in the epoxy 14 are irregularly dispersed during the clamping process. Then, the bump A 1 and the bump B 1 , the bump A 2 and the bump B 2 , the bump A 3 and the bump B 3 respectively clamp the particles 13 stored in the epoxy 14 as shown in FIG. 1C.
- the primary object of this invention is to provide a laminated structure, comprising a first substrate, a second substrate, an intermediate and a plurality of particles.
- the first substrate has a first conjunction portion and a second conjunction portion
- the second substrate has a third conjunction portion and a fourth conjunction portion which are provided with a first hardness.
- the intermediate is disposed between the first substrate and the second substrate.
- the particles with a second hardness larger than the first hardness are coated on the third conjunction portion for contacting the first conjunction portion and coated on the fourth conjunction portion for contacting the second conjunction portion.
- a height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion.
- a height difference is exists between the fourth conjunction portion and the third conjunction portion and the height of the fourth conjunction portion is presupposed lower than that of the third conjunction portion.
- the height difference can be compensated by the particles embedded in the fourth conjunction portion when a clamping force is applied, and therefore the junction between the third conjunction portion and the first conjunction portion can be uniformly bridged by the particles located therebetween.
- FIGS. 1A to 1 C are three plan views sequentially depicting the steps for forming a laminated structure ( 1 ) according to a prior art
- FIGS. 2A to 2 D are four plan views sequentially depicting the steps for forming a laminated structure ( 2 ) according to the present invention.
- FIG. 3 is an enlarged view according to a dotted line (Z) of FIG. 2D.
- FIGS. 2A to 2 D are four plan views sequentially depicting the steps for forming a laminated structure 2 according to the present invention.
- the laminated structure 2 comprises a first substrate 21 , a second substrate 22 , a plurality of particles 23 and an intermediate 24 , wherein the first substrate 21 and the second substrate 22 can be the two conductive plates of LSI (Large Scale Integrated Circuit), COG (Chip On Glass), FPC (Flexible Printed Circuit), PCB (Printed Circuit Board) or TAB (Tape Automatic Bonding), TCP (Tape Carrier Package).
- LSI Large Scale Integrated Circuit
- COG Chip On Glass
- FPC Flexible Printed Circuit
- PCB Printed Circuit Board
- TAB Tape Automatic Bonding
- TCP Tape Carrier Package
- the first substrate 21 has a surface 210 provided with bumps, and a first conjunction portion A 1 ′ and a second conjunction portion A 2 ′ are the two next to each other.
- the first conjunction portion A 1 ′ has an end surface A 01 ′ and the second conjunction portion A 2 ′ has an end surface A 02 ′.
- the second substrate 22 has a base surface 220 with bumps, and a third conjunction portion B 1 ′ and a fourth conjunction portion B 2 ′ are two of them which are next to each other.
- the third conjunction portion B 1 ′ and the fourth conjunction portion B 2 ′ partially made of same conductive material such as gold, provide a first hardness.
- the third conjunction portion B 1 ′ has an end surface B 01 ′ and the fourth conjunction portion B 2 ′ has an end surface B 02 ′.
- a height difference t 3 exists between the third conjunction portion B 1 ′ (end surface B 01 ′) and the fourth conjunction portion B 2 ′ (end surface B 02 ′) with reference to the base surface 220 of the second substrate 22 .
- the particles 23 made of conductive material such as Nickel are provided with a second hardness greater than the first hardness and formed in the shape of ball or cube.
- the particles 23 are coated on the end surface B 01 ′ and the end surface B 02 ′, and the intermediate 24 preferably made of rubber such as epoxy is used as an adhesive material disposed between the first substrate 21 and the second substrate 22 .
- FIG. 2C shows the first substrate 21 and the second substrate 22 being brought together through the application of a clamping force F.
- FIG. 2D shows the first substrate 21 and the second substrate 22 being combined by the intermediate 24 and electrically connected to each other via the particles 23 .
- the particles 23 located on the fourth conjunction portion B 2 ′ first contact the end surface A 02 ′ of the second conjunction portion A 2 ′. Then, the particles 23 , originally located on the end surface B 02 ′ of the fourth conjunction portion B 2 ′, begin to be embedded in the fourth conjunction portion B 2 ′ by the pressure applied by the second conjunction portion A 2 ′. The embedding process can be terminated when the particles 23 located on the end surface B 01 ′ of the third conjunction portion B 1 ′ uniformly contact the end surface A 01 ′ of the first conjunction portion A 1 ′.
- the laminated structure 2 is formed and the clamping force F can be removed of the first substrate 21 and the second substrate 22 when the intermediate 24 disposed between the first substrate 21 and the second substrate 22 is solidified.
- FIG. 3 is an enlarged view according to a dotted line Z of FIG. 2D.
- the height difference t 3 between the third conjunction portion B 1 ′ (end surface B 01 ′) and the fourth conjunction portion B 2 ′ (end surface B 02 ′) with reference to the base surface 220 , can be completely compensated by the embedded particles 23 located on the fourth conjunction portion B 2 ′.
- the junction between the third conjunction portion B 1 ′ and the first conjunction portion A 1 ′ can be uniformly performed by the particles 23 located there.
Abstract
A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are characterized by a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles provided with a second hardness greater than the first hardness are coated on the third conjunction portion to contact the first conjunction portion and coated on the fourth conjunction portion to contact the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion. A height difference that exists between the fourth conjunction portion and the third conjunction portion can be compensated for by the particles embedded in the fourth conjunction portion. Thus the bridging of the third conjunction portion and the first conjunction portion can be uniformly performed by the particles located between the two.
Description
- This invention relates to a laminated structure. More particularly, this invention relates to a laminated structure provided with pairs of corresponding bumps or conjunction portions which are electrically connected to each other by particles embedded.
- ACF (Anisotropic Conductive Film) is a conductive film composed of epoxy resin and a plurality of metal particles and is often used as interlayer clamped between two corresponding bumps or electrodes of a substrate and LSI (Large Scale Integrated Circuit), COG (Chip On Glass), FPC (Flexible Printed Circuit), PCB (Printed Circuit Board), TAB (Tape Automatic Bonding) or TCP (Tape Carrier Package) so as to form a laminated structure for use in LCD panels.
- However, two adjacent bumps or electrodes of the substrate can easily short-circuit or suffer low conductivity when the laminated structure is bent, causing the particles in the ACF that are located between two electrodes, to crowd together.
- Further, the manufacturing process of ACF is complicated, and the tolerance of the height difference among the bumps of LSI/FPC/PCB/TCP cannot always be precisely controlled. If the design aims to increase the amount of conductive particles captured by the bumps or electrodes, the size of the bumps or electrodes formed on the LSI/FPC/PCB/TCP cannot be too small to contact the conductive particles within the predetermined area. If the design aims to increase the conductivity between two corresponding bumps or electrodes by increasing the number of particles in the ACF, the effective space (Fine Pitch Design) between any two of the adjacent bumps or electrodes cannot be so narrow as to cause a short circuit.
- FIG. 1A, 1B and1C are three plan views sequentially depicting the steps for forming a laminated structure 1 according to a prior art. The
substrate - As shown in FIG. 1A, the laminated structure1 is composed of two substrates 11(12), a plurality of
conductive particles 13 and anepoxy 14. Thesubstrate 11 has asurface 110 with a plurality of spaced bumps A1-A3, and thesubstrate 12 has asurface 120 with a plurality of spaced bumps (B1˜B3) corresponding to bumps A1˜A3. The so-called Anisotropic Conductive Film (ACF) is made ofepoxy 14 mixed with theparticles 13, and the ACF is used as an intermediate to bond thesubstrates 11 and thesubstrates 12 together and electrically connect thesubstrates 11 to thesubstrates 12. The bumps A1˜A3 of thesubstrate 11 are respectively provided with end surfaces A01, A02 and A03, and the bumps B1˜B3 of thesubstrate 12 are respectively provided with end surfaces B01, B02 and B03. A height difference t1 exists between the bump B1 and the bump B2, and another height difference t2 exists between bump B2 and bump B3. - FIG. 1B shows the
substrate 11 and thesubstrate 12 being brought toward each other by the application of a clamping force F. FIG. 1C shows thefirst substrate 21 and thesecond substrate 22 being combined together by theepoxy 14 and electrically connected to each other via theparticles 13. - In FIG. 1B, a force F is applied on the two
substrates epoxy 14 is gradually deformed and thinned by the approachingsubstrates particles 13 stored in theepoxy 14 are irregularly dispersed during the clamping process. Then, the bump A1 and the bump B1, the bump A2 and the bump B2, the bump A3 and the bump B3 respectively clamp theparticles 13 stored in theepoxy 14 as shown in FIG. 1C. - However, with the height differences tl and t2 between bump B2 and bump B1, B2, the number of the
particles 13 clamped between each two corresponding bumps is quite different, i.e. theparticles 13 are not easily captured by the any two corresponding bumps. Moreover, a short circuit may occur between any two of the bumps of thesubstrate particles 13 is dense. - U.S. Pat. No. 5,065,505 disclosed by Hiroshi Matsubara et al, Sharp Kabushiki Kaisha, mentions that the conductive particles are adhered to the electrodes of the glass board by means of the uncured photocuring adhesive. However, height differences existing among the electrodes cannot be effectively compensated while the circuit board is connected to the electrodes of the glass board.
- The primary object of this invention is to provide a laminated structure, comprising a first substrate, a second substrate, an intermediate and a plurality of particles. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are provided with a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles with a second hardness larger than the first hardness are coated on the third conjunction portion for contacting the first conjunction portion and coated on the fourth conjunction portion for contacting the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion.
- A height difference is exists between the fourth conjunction portion and the third conjunction portion and the height of the fourth conjunction portion is presupposed lower than that of the third conjunction portion. The height difference can be compensated by the particles embedded in the fourth conjunction portion when a clamping force is applied, and therefore the junction between the third conjunction portion and the first conjunction portion can be uniformly bridged by the particles located therebetween.
- The present invention can be more fully understood by reading the subsequent detailed description and examples with reference made to accompanying drawings in which:
- FIGS. 1A to1C are three plan views sequentially depicting the steps for forming a laminated structure (1) according to a prior art;
- FIGS. 2A to2D are four plan views sequentially depicting the steps for forming a laminated structure (2) according to the present invention; and
- FIG. 3 is an enlarged view according to a dotted line (Z) of FIG. 2D.
- FIGS. 2A to2D are four plan views sequentially depicting the steps for forming a laminated structure 2 according to the present invention.
- In FIGS. 2A and 2B, the laminated structure2 comprises a
first substrate 21, asecond substrate 22, a plurality ofparticles 23 and an intermediate 24, wherein thefirst substrate 21 and thesecond substrate 22 can be the two conductive plates of LSI (Large Scale Integrated Circuit), COG (Chip On Glass), FPC (Flexible Printed Circuit), PCB (Printed Circuit Board) or TAB (Tape Automatic Bonding), TCP (Tape Carrier Package). - The
first substrate 21 has asurface 210 provided with bumps, and a first conjunction portion A1′ and a second conjunction portion A2′ are the two next to each other. The first conjunction portion A1′ has an end surface A01′ and the second conjunction portion A2′ has an end surface A02′. Thesecond substrate 22 has abase surface 220 with bumps, and a third conjunction portion B1′ and a fourth conjunction portion B2′ are two of them which are next to each other. The third conjunction portion B1′ and the fourth conjunction portion B2′, partially made of same conductive material such as gold, provide a first hardness. The third conjunction portion B1′ has an end surface B01′ and the fourth conjunction portion B2′ has an end surface B02′. - A height difference t3 exists between the third conjunction portion B1′ (end surface B01′) and the fourth conjunction portion B2′ (end surface B02′) with reference to the
base surface 220 of thesecond substrate 22. Theparticles 23 made of conductive material such as Nickel are provided with a second hardness greater than the first hardness and formed in the shape of ball or cube. In FIG. 2B, theparticles 23 are coated on the end surface B01′ and the end surface B02′, and the intermediate 24 preferably made of rubber such as epoxy is used as an adhesive material disposed between thefirst substrate 21 and thesecond substrate 22. - FIG. 2C shows the
first substrate 21 and thesecond substrate 22 being brought together through the application of a clamping force F. FIG. 2D shows thefirst substrate 21 and thesecond substrate 22 being combined by the intermediate 24 and electrically connected to each other via theparticles 23. - With the force F disposed on the
first substrate 21 and thesecond substrate 22, theparticles 23 located on the fourth conjunction portion B2′ first contact the end surface A02′ of the second conjunction portion A2′. Then, theparticles 23, originally located on the end surface B02′ of the fourth conjunction portion B2′, begin to be embedded in the fourth conjunction portion B2′ by the pressure applied by the second conjunction portion A2′. The embedding process can be terminated when theparticles 23 located on the end surface B01′ of the third conjunction portion B1′ uniformly contact the end surface A01′ of the first conjunction portion A1′. - Then, the laminated structure2 is formed and the clamping force F can be removed of the
first substrate 21 and thesecond substrate 22 when the intermediate 24 disposed between thefirst substrate 21 and thesecond substrate 22 is solidified. - FIG. 3 is an enlarged view according to a dotted line Z of FIG. 2D. The height difference t3, between the third conjunction portion B1′ (end surface B01′) and the fourth conjunction portion B2′ (end surface B02′) with reference to the
base surface 220, can be completely compensated by the embeddedparticles 23 located on the fourth conjunction portion B2′. The junction between the third conjunction portion B1′ and the first conjunction portion A1′ can be uniformly performed by theparticles 23 located there. - While this invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (20)
1. A laminated structure, comprising:
a first substrate having a first conjunction portion;
a second substrate having a third conjunction portion which is provided with a first hardness;
an intermediate disposed between the first substrate and the second substrate; and
a plurality of particles provided with a second hardness greater than the first hardness, disposed on the third conjunction portion for contacting the first conjunction portion.
2. The laminated structure as claimed in claim 1 , wherein the first substrate comprises a second conjunction portion and the second substrate comprises a fourth conjunction portion which is provided with the first hardness, and the particles are disposed on the fourth conjunction portion for contacting the second conjunction portion.
3. The laminated structure as claimed in claim 2 , wherein the third conjunction and the fourth conjunction are two bumps protruding from the second substrate.
4. The laminated structure as claimed in claim 2 , wherein the particles are coated on the third conjunction and the fourth conjunction.
5. The laminated structure as claimed in claim 1 , wherein the particles are coated on the third conjunction.
6. The laminated structure as claimed in claim 1 , wherein the particles are partially made of conductive material.
7. The laminated structure as claimed in claim 1 , wherein the particles are made of nickel and the first conjunction portion is made of gold.
8. The laminated structure as claimed in claim 1 , wherein the intermediate is made of rubber.
9. A laminated structure, comprising:
a first substrate having a first conjunction portion and a second conjunction portion;
a second substrate having a third conjunction portion and a fourth conjunction portion which provide a first hardness;
an intermediate disposed between the first substrate and the second substrate; and
a plurality of particles provided with a second hardness greater than the first hardness, disposed on the third conjunction portion for contacting the first conjunction portion and disposed on the fourth conjunction portion for contacting the second conjunction portion.
10. The laminated structure as claimed in claim 9 , wherein the third conjunction and the fourth conjunction are two bumps protruding from the second substrate.
11. The laminated structure as claimed in claim 9 , wherein the particles are coated on the third conjunction and the fourth conjunction.
12. The laminated structure as claimed in claim 9 , wherein the particles are partially made of conductive material.
13. The laminated structure as claimed in claim 9 , wherein the particles are made of nickel and the first conjunction portion is made of gold.
14. The laminated structure as claimed in claim 9 , wherein the intermediate is made of rubber.
15. A method for forming a laminated structure by connecting a first substrate to a second substrate with a plurality of particles and an intermediate, the first substrate having a first conjunction portion and a second conjunction portion and the second substrate having a third conjunction portion and a fourth conjunction portion, comprising the steps of:
applying the particles on the third conjunction portion and the fourth conjunction portion;
applying the intermediate between the first substrate and the second substrate;
bringing the first substrate and the second substrate close to each other to clamp the intermediate between; and
contacting the particles located on the third conjunction portion and the fourth conjunction portion on the first conjunction portion and the second conjunction portion.
16. The method for forming a laminated structure as claimed in claim 15 , wherein the third conjunction and the fourth conjunction are two bumps protruded from the second substrate.
17. The method for forming a laminated structure as claimed in claim 15 , wherein the third conjunction portion and the fourth conjunction portion are provided with the first hardness, and the particles are provided with a second hardness greater than the first hardness.
18. The method for forming a laminated structure as claimed in claim 15 , wherein the particles are partially made of conductive material.
19. The method for forming a laminated structure as claimed in claim 15 , wherein the particles are made of nickel and the first conjunction portion are made of gold.
20. The method for forming a laminated structure as claimed in claim 15 , wherein the intermediate is made of rubber.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/057,605 US6802930B2 (en) | 2000-12-16 | 2002-01-24 | Method of making a laminated structure |
US10/888,890 US20040244906A1 (en) | 2000-12-16 | 2004-07-08 | Laminated structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89126964 | 2000-12-16 | ||
TW089126964A TW554191B (en) | 2000-12-16 | 2000-12-16 | Laminating structure and its forming method |
Related Child Applications (1)
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US10/057,605 Division US6802930B2 (en) | 2000-12-16 | 2002-01-24 | Method of making a laminated structure |
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US20020076537A1 true US20020076537A1 (en) | 2002-06-20 |
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US10/057,605 Expired - Lifetime US6802930B2 (en) | 2000-12-16 | 2002-01-24 | Method of making a laminated structure |
US10/888,890 Abandoned US20040244906A1 (en) | 2000-12-16 | 2004-07-08 | Laminated structure |
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US10/057,605 Expired - Lifetime US6802930B2 (en) | 2000-12-16 | 2002-01-24 | Method of making a laminated structure |
US10/888,890 Abandoned US20040244906A1 (en) | 2000-12-16 | 2004-07-08 | Laminated structure |
Country Status (2)
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US (3) | US20020076537A1 (en) |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030082301A1 (en) * | 2001-10-26 | 2003-05-01 | Applied Materials, Inc. | Enhanced copper growth with ultrathin barrier layer for high performance interconnects |
US6680517B2 (en) * | 2000-08-23 | 2004-01-20 | Tdk Corporation | Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film |
CN107210287A (en) * | 2015-01-13 | 2017-09-26 | 迪睿合株式会社 | Multilager base plate |
TWI764373B (en) * | 2020-06-17 | 2022-05-11 | 日商東北微科技股份有限公司 | Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device |
US20220303436A1 (en) * | 2019-08-15 | 2022-09-22 | Ningbo Sunny Opotech Co., Ltd | Photosensitive assembly, camera module and manufacturing method thereof |
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WO2003003798A1 (en) * | 2001-06-29 | 2003-01-09 | Toray Engineering Co., Ltd. | Joining method using anisotropic conductive adhesive |
US20050012225A1 (en) * | 2002-11-15 | 2005-01-20 | Choi Seung-Yong | Wafer-level chip scale package and method for fabricating and using the same |
US7807547B2 (en) * | 2006-03-28 | 2010-10-05 | Innovative Micro Technology | Wafer bonding material with embedded rigid particles |
US8510935B2 (en) * | 2007-07-10 | 2013-08-20 | Joseph C Fjelstad | Electronic assemblies without solder and methods for their manufacture |
US7863106B2 (en) * | 2008-12-24 | 2011-01-04 | International Business Machines Corporation | Silicon interposer testing for three dimensional chip stack |
WO2012073739A1 (en) * | 2010-11-29 | 2012-06-07 | シャープ株式会社 | Substrate module |
US10411218B2 (en) * | 2017-10-30 | 2019-09-10 | Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Quasi crystalline conductive particles between a substrate and IC chip |
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JPH0738502B2 (en) | 1989-10-17 | 1995-04-26 | シャープ株式会社 | Circuit board connection method |
JPH07307410A (en) * | 1994-05-16 | 1995-11-21 | Hitachi Ltd | Semiconductor device |
JPH1084014A (en) * | 1996-07-19 | 1998-03-31 | Shinko Electric Ind Co Ltd | Manufacture of semiconductor device |
JP3678547B2 (en) * | 1997-07-24 | 2005-08-03 | ソニーケミカル株式会社 | Multilayer anisotropic conductive adhesive and method for producing the same |
KR100539060B1 (en) * | 1997-10-28 | 2007-04-25 | 소니 케미카루 가부시키가이샤 | Anisotropic conductive adhesive and adhesive film |
KR100265566B1 (en) * | 1998-05-12 | 2000-09-15 | 김영환 | Ship stack package |
-
2000
- 2000-12-16 TW TW089126964A patent/TW554191B/en not_active IP Right Cessation
-
2001
- 2001-08-01 US US09/920,370 patent/US20020076537A1/en not_active Abandoned
-
2002
- 2002-01-24 US US10/057,605 patent/US6802930B2/en not_active Expired - Lifetime
-
2004
- 2004-07-08 US US10/888,890 patent/US20040244906A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US6680517B2 (en) * | 2000-08-23 | 2004-01-20 | Tdk Corporation | Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film |
US20030082301A1 (en) * | 2001-10-26 | 2003-05-01 | Applied Materials, Inc. | Enhanced copper growth with ultrathin barrier layer for high performance interconnects |
CN107210287A (en) * | 2015-01-13 | 2017-09-26 | 迪睿合株式会社 | Multilager base plate |
US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
US20220303436A1 (en) * | 2019-08-15 | 2022-09-22 | Ningbo Sunny Opotech Co., Ltd | Photosensitive assembly, camera module and manufacturing method thereof |
TWI764373B (en) * | 2020-06-17 | 2022-05-11 | 日商東北微科技股份有限公司 | Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device |
US11462668B2 (en) | 2020-06-17 | 2022-10-04 | Tohoku-Microtec Co., Ltd. | Stacked semiconductor device, and set of onboard-components, body and jointing-elements to be used in the stacked semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US20040244906A1 (en) | 2004-12-09 |
US20020074385A1 (en) | 2002-06-20 |
US6802930B2 (en) | 2004-10-12 |
TW554191B (en) | 2003-09-21 |
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Owner name: AU OPTRONICS CORPORATION, TAIWAN Free format text: CHANGE OF NAME;ASSIGNOR:UNIPAC OPTOELECTRONICS CORPORATION;REEL/FRAME:013558/0538 Effective date: 20010314 |
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