US20020124195A1 - Method and apparatus for power management in a memory subsystem - Google Patents

Method and apparatus for power management in a memory subsystem Download PDF

Info

Publication number
US20020124195A1
US20020124195A1 US09/187,565 US18756598D US2002124195A1 US 20020124195 A1 US20020124195 A1 US 20020124195A1 US 18756598 D US18756598 D US 18756598D US 2002124195 A1 US2002124195 A1 US 2002124195A1
Authority
US
United States
Prior art keywords
memory
memory device
group
subgroup
pool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/187,565
Other versions
US6442698B2 (en
Inventor
Puthiya K. Nizar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Assigned to INTEL CORPORATION reassignment INTEL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NIZAR, PUTHIYA K.
Publication of US20020124195A1 publication Critical patent/US20020124195A1/en
Granted legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206Monitoring of events, devices or parameters that trigger a change in power modality
    • G06F1/3215Monitoring of peripheral devices
    • G06F1/3225Monitoring of peripheral devices of memory devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234Power saving characterised by the action undertaken
    • G06F1/325Power saving in peripheral device
    • G06F1/3275Power saving in memory, e.g. RAM, cache
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • G06F12/06Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present invention relates to system memory power management in a computer system; more particularly, the present invention relates to power management in memory subsystems.
  • SDRAMs Synchronous Dynamic Random Access Memories
  • RDRAMs Rambus Dynamic Random Access Memories
  • SDRAMs are capable of operating at speeds up to 100 Mhz
  • RDRAMs operate at clock speeds up to 400 Mhz and transfer rate up to 800 MHz.
  • Memory device operating at such high speed result in a significant amount of power being generated within the device (e.g., on the order of 2.1 watts for RDRAMs). The generation of this magnitude of power may potentially create thermal issues at the memory device.
  • a method of managing power in a memory system includes multiple memory devices. Each one of the memory devices is grouped in a first group or a second group. First, access to a memory device is requested. It is next determined whether the requested memory device is located in the first group. If the requested memory device is not located within the first group, it is determined whether the first group is filled to capacity. If the first group is not filled to capacity, the requested memory device is transferred to the first group.
  • FIG. 1 is a block diagram of one embodiment of a computer system
  • FIG. 2 is a block diagram of one embodiment of a computer system
  • FIG. 3 is a power management module in accordance with one embodiment of the present invention.
  • FIG. 4 is a flow diagram of the operation of power management module in accordance with one embodiment of the present invention.
  • FIG. 5 is a block diagram of one embodiment of a computer system
  • FIG. 6 is a block diagram of a logical representation of a memory controller interface in accordance with one embodiment of the present invention.
  • FIG. 7 is a power management module in accordance with one embodiment of the present invention.
  • FIG. 8 is a flow diagram of the operation of one embodiment of a power management module.
  • FIG. 1 is a block diagram of a computer system 100 .
  • Computer system 100 includes a bus 101 , a Central Processing Unit (CPU) 105 , a memory controller 110 and a memory unit 115 .
  • CPU 105 processes information received from memory 115 or other internal and external memory devices of computer system 100 .
  • Memory controller 110 is coupled to CPU 105 . Further, memory controller 110 interfaces with memory unit 115 in order to carry out memory access transactions.
  • Memory unit 115 is coupled to memory controller 110 via bus 101 .
  • memory unit 115 is a Rambus Dynamic Access Memory (RDRAM).
  • Memory unit 115 may be a Direct RDRAM (D-RDRAM) or a Concurrent RDRAM.
  • An RDRAM is a high-speed memory interface that transfers data over a bus called a Rambus Channel.
  • Bus 101 is a Rambus channel that permits memory controller 110 to communicate with memory unit 115 .
  • bus 101 is a high speed bus that operates at a clock rate of 400 MHz and enables a data rate of 800 Mhz.
  • Memory unit 115 includes Rambus In-line Memory Modules (RIMMs) 120 , 130 and 140 .
  • RIMMs 120 , 130 and 140 include memory devices 123 , 133 and 143 , respectively, that are accessed by CPU 105 , or other devices coupled to computer system 100 , in order to store or read data.
  • Each RIMM includes a channel input and channel output (not shown to avoid obscuring the present invention) that is coupled to bus 101 .
  • Bus 101 is coupled to and communicates in parallel with every memory device in each of the RIMMs. Additionally, each memory device within a RIMM operates according to an ACTIVE, STANDBY or NAP state.
  • a memory device is in the ACTIVE state whenever it is ready to transfer, or is actually transferring data.
  • a memory device is in the STANDBY state if the device is not immediately ready to transfer data.
  • a memory device is in the NAP (or sleep) state whenever the device is in a reduced power consumption state which may occur, for example, if the memory device has not been accessed for a long period of time.
  • Bus 101 is received at the channel input of RIMM 120 .
  • Bus 101 is coupled to each of the memory devices 123 within RIMM 120 .
  • Bus 101 exits RIMM 120 at the channel output and is received at the channel input of RIMM 130 .
  • RIMM 130 RIMM 130 .
  • bus 101 is coupled to each memory device 133 before exiting through the output channel.
  • bus 101 is received at RIMM 140 and is coupled to each memory device 143 .
  • bus 101 is exited at the channel output of RIMM 140 and is terminated at bus terminator 102 .
  • each of RIMMs 120 , 130 and 140 includes eight ( 8 ) memory devices. Therefore, a total of twenty-four ( 24 ) memory devices are coupled to bus 101 .
  • RIMMs 120 , 130 and 140 may include any number of memory devices.
  • RIMM 120 may include sixteen ( 16 ) memory devices 123
  • RIMMs 130 and 140 may each include eight ( 8 ) memory devices 133 and 143 , respectively.
  • memory controller 110 may be coupled to multiple memory units by multiple busses. For example, FIG.
  • FIG. 2 illustrates another embodiment in which memory controller 110 may be coupled to multiple memory units 1 15 a- 1 15 c by busses 101 , 102 , 103 , respectively. Nevertheless, one of ordinary skill in the art will appreciate that an alternative number of memory units may be coupled to memory controller 110 .
  • each RIMM may contain multiple memory devices (e.g., 4 , 8 , 12 , 16 , etc.). If all of the memory devices on a RIMM are in the ACTIVE state, the total power generated by the RIMM will be very high (e.g., on the order of 6 . 4 watts). Excessive power generation may create thermal issues within the RIMM.
  • FIG. 3 illustrates one embodiment of a power management module 300 .
  • power memory module 300 resides within memory controller 110 and manages the activity of memory devices 123 , 133 and 143 within RIMMs 120 , 130 and 140 , respectively.
  • Power management module 300 includes device pools 310 and 350 . Each of the memory devices coupled to bus 101 are logically grouped into either pool 310 or pool 350 . All memory devices grouped into pool 310 are either in the ACTIVE or STANDBY state. Memory devices grouped into pool 310 are further grouped into subpools 314 and 318 . All memory devices within pool 310 that are in the ACTIVE state are grouped into subpool 318 . All memory devices within pool 310 that are in the STANDBY state are grouped into subpool 314 .
  • the maximum number of memory devices that may reside in pool 310 at a time is eight ( 8 ). Additionally, a maximum of four ( 4 ) ACTIVE memory devices may reside in subpool 318 at any time. In a further embodiment, the maximum number of memory devices that may reside in pool 310 and ACTIVE devices in subpool 318 is variable and may be programmed. In such an embodiment, a user of computer system 100 may program the maximum number of memory devices that may be grouped in pool 310 , as well as the amount of active devices in subpool 318 . All memory devices that are not grouped into pool 310 reside in pool 350 . All memory devices in pool 350 are in either the STANDBY or NAP state.
  • a memory device residing in subpool 314 may only enter subpool 318 when the device is accessed by a memory request from memory controller 110 .
  • Memory devices may only enter pool 350 from subpool 314 .
  • a memory device enters pool 350 from subpool 314 whenever another memory device needs to be moved from subpool 318 into subpool 314 and subpool 314 is presently filled to capacity. In this case the LRU device in subpool 314 is selected to be transferred to pool 350 .
  • a timer may be included within memory controller 110 that first moves a memory device from subpool 314 to pool 350 and subsequently moves a memory device from subpool 318 to subpool 314 if the device in subpool 318 has not been accessed in a predetermined period of time.
  • a second timer may be included solely to move memory device from subpool 314 to pool 350 if that device has not been accessed in a predetermined period of time.
  • FIG. 4 is a flow diagram of one embodiment of processing performed by power management module 300 .
  • access to a memory device within one of the RIMMs of memory unit 115 is requested.
  • processing block 410 it is determined whether the requested memory device resides in pool 310 . If it is determined that the device resides in pool 310 , it is next determined whether the memory device also resides in subpool 318 , processing block 415 . If the memory device does reside in subpool 318 control is returned back to processing block 405 where access to another memory device is requested. If it is determined that the memory device does not reside in pool 310 , or that the device resides in pool 310 but not in subpool 318 , it is determined whether the memory device resides in subpool 314 , processing block 420 .
  • subpool 318 is full, processing block 425 . If subpool 318 is full, the LRU memory device of subpool 318 is logically transferred to subpool 314 , processing block 430 . At processing block 435 , the memory device is logically moved from subpool 314 to subpool 318 and is switched to the ACTIVE state. If subpool 318 is not full, the memory device is moved directly from subpool 314 to subpool 318 and is switched to the ACTIVE state, processing block 435 .
  • processing block 420 it is determined whether pool 310 is full, processing block 440 . If subpool 310 is full, the LRU memory device of subpool 314 is logically transferred to pool 350 , processing block 445 . If subpool 310 is not full or after the LRU device has been moved from subpool 314 to pool 350 , it is determined whether subpool 318 is full, processing block 450 . If subpool 318 is full the LRU memory device of subpool 318 is logically transferred to subpool 314 , processing block 455 . At processing block 460 , the memory device is logically moved from pool 350 to subpool 318 and is switched to the ACTIVE state. If subpool 318 is not full, the memory device is moved directly from pool 350 to subpool 318 and is switched to the ACTIVE state, processing block 460 .
  • the pools 310 and 350 support multiple bus (or channel) operation as shown in FIG. 2.
  • the pool logic considers the multiple channels as a single channel.
  • the definition of pool 310 is the same except that memory devices from more than one channel are included.
  • pool 350 represents channels that are either in the NAP or STANDBY states. Each memory device that is coupled to a channel in the NAP state is also in the NAP state. Similarly, each memory device coupled to a channel in the STANDBY state is also in the STANDBY state.
  • FIG. 5 is a block diagram of one embodiment of a computer system 500 .
  • Computer system 500 includes a bus 501 , a memory computer system 500 includes a bus 501 , a memory controller 510 , a memory unit 515 and CPU 105 .
  • CPU 105 processes information received from memory 515 or other internal and external devices of computer system 500 .
  • Memory controller 510 is coupled to CPU 105 .
  • Memory controller 510 interfaces with memory unit 515 in order to carry out memory transactions.
  • Memory unit 515 is coupled to memory controller 110 via bus 501 .
  • memory unit 515 is a Synchronous Dynamic Access Memory (SDRAM).
  • SDRAM Synchronous Dynamic Access Memory
  • An SDRAM is a form of DRAM that can be coordinated or synchronized to the clock speed of CPU 105 .
  • Bus 501 is a DRAM bus that permits memory controller 510 to communicate with memory unit 515 .
  • Bus 501 operates at speeds up to 133 MHz. speeds up to 133 MHz. and 540 .
  • DIMMs 520 , 530 and 540 include memory devices 523 , 533 and 543 , respectively, that are accessed by CPU 105 or other devices in order to store or read data.
  • a DIMM may include one or more rows of memory.
  • FIG. 6 illustrates a logical representation of the interface between memory controller 510 and memory unit 515 wherein DIMMs 520 , 530 and 540 constitute separate rows of memory devices within memory unit 515 . Additionally, each row within memory unit 515 operates according to either an ACTIVE/IDLE state or POWERED DOWN state. A row is in the ACTIVE/IDLE state whenever a memory device within the DIMM is ready to transfer, or is actually transferring data. A row is in the POWERED DOWN state whenever no memory device within the row has been accessed for a long period of time.
  • Bus 501 is received at the input of row 520 and is coupled to each of the memory devices 523 .
  • bus 501 is received at the input of DIMM 530 and is coupled to each memory device 533 .
  • bus 501 is received at that input DIMM 540 and is coupled to each memory device 543 .
  • memory unit 515 includes three rows of DIMMs (e.g., DIMMs 520 , 530 and 540 ). However, one of ordinary skill in the art will appreciate that additional DIMMs may be added to memory unit 515 .
  • each of the DIMMs includes four ( 4 )
  • each of the DIMMs includes four (4) bus 501 .
  • DIMMs 520 , 530 and 540 may each include a different number of memory devices, as well as different combinations.
  • DIMM 520 may include sixteen ( 16 ) memory different combinations.
  • DIMM 520 may include sixteen (16) memory devices 523 and DIMMs 530 and 540 may each include eight (8) memory devices 533
  • FIG. 7 illustrates a power management module 700 .
  • Power memory module 700 resides within memory controller 510 and manages the activity of DIMMs 520 , 530 and 540 .
  • Power management module 700 includes device pools 710 and 750 .
  • Each of the memory device rows coupled to bus 501 are grouped into either pool 710 or pool 750 . All rows that are grouped within pool 710 are in the ACTIVE/IDLE state. All rows that do not reside in pool 710 are grouped within pool 750 . Thus, all rows that are in the POWERED DOWN state reside in pool 750 . According to one embodiment, only one ( 1 ) row may reside in pool 710 at a time. However, the maximum number of rows that may reside in pool 710 may be programmed. In such an embodiment, a user of computer system 500 may program the maximum number of memory devices that may be grouped in pool 710 .
  • a row residing in pool 750 may only enter pool 710 when a memory device within the row is accessed by a memory request from memory controller 510 . Additionally, a row is moved to pool 750 from pool 710 whenever another row needs to be moved from pool 750 into pool 710 and pool 710 is filled to capacity. In this case the LRU device in pool 710 is selected to be transferred to pool 750 . Before the row is moved to pool 750 all open pages must first be closed. According to one embodiment, a timer is included within memory controller 510 that moves a row from pool 710 to pool 750 if a memory device within the row has not been accessed in a predetermined period of time.
  • FIG. 8 is a flow diagram of one embodiment with a process performed by power management module 700 .
  • access to a memory device within one of the rows of memory unit 515 is requested.
  • process block 710 it is determined at memory controller 510 whether the DIMM resides in pool 710 . If it is determined that the row resides in pool 710 , control is returned back to process block 805 wherein access to another memory device is requested. If it is determined that the row does not reside in pool 710 , it is determined whether pool 710 is full, process block 815 .
  • pool 710 is full the LRU row in pool 710 is logically transferred to pool 750 , process block 820 .
  • the requested row is logically moved from pool 750 to pool 710 and is switched to the ACTIVE/IDLE state. If pool 710 is not full the row is moved directly from pool 750 to pool 710 and is switched to the ACTIVE/IDLE state, process block 825 .
  • SLDRAMS Sync Link DRAMS
  • EDO DRAMS etc.

Abstract

According to one embodiment, the present invention discloses a method of managing power in a memory system. The memory system includes a plurality of memory devices. Each one of the memory devices is grouped in a first group or a second group. First, access to a memory device is requested. It is next determined whether the requested memory device is located in the first group. If the requested memory device is not located within the first group, it is determined whether the first group is filled to capacity. If the first group is not filled to capacity, the requested memory device is transferred to the first group. According to a further embodiment, each one of the memory devices grouped into the first group is further grouped in to a first subgroup or a second subgroup.

Description

    FIELD OF THE INVENTION
  • The present invention relates to system memory power management in a computer system; more particularly, the present invention relates to power management in memory subsystems. [0001]
  • BACKGROUND OF THE INVENTION
  • Traditionally, the power generated by memory chips, in particularly, Synchronous Dynamic Random Access Memories (SDRAMs) was of little concern because of the low speeds at which they operate. For example, typical SDRAMs operate at speeds up to 66Mhz. The power generated by SDRAMs operating at such speeds is relatively low. However, with the increase of the operating speeds of SDRAMs and the advent of the Rambus Dynamic Random Access Memories (RDRAMs), operating speeds have dramatically increased. Presently, SDRAMs are capable of operating at speeds up to 100 Mhz, while RDRAMs operate at clock speeds up to 400 Mhz and transfer rate up to 800 MHz. Memory device operating at such high speed result in a significant amount of power being generated within the device (e.g., on the order of 2.1 watts for RDRAMs). The generation of this magnitude of power may potentially create thermal issues at the memory device. [0002]
  • One current method of remedying the excessive generation of power is by curtailing the bandwidth of a memory. This solution is disadvantageous since it decreases the performance of the memory. Another solution is to use heatsinks and/or cooling fans with memory chips to decrease the heat generated by a memory operating at high speeds. However, this method is disadvantageous because of the cost and amount of space that is consumed by such devices. Therefore, a method and apparatus for managing the power generated by memory chips is desired. [0003]
  • SUMMARY OF THE INVENTION
  • According to one embodiment, a method of managing power in a memory system is disclosed. The memory system includes multiple memory devices. Each one of the memory devices is grouped in a first group or a second group. First, access to a memory device is requested. It is next determined whether the requested memory device is located in the first group. If the requested memory device is not located within the first group, it is determined whether the first group is filled to capacity. If the first group is not filled to capacity, the requested memory device is transferred to the first group. [0004]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the invention. The drawings, however, should not be taken to limit the invention to the specific embodiments, but are for explanation and understanding only. [0005]
  • FIG. 1 is a block diagram of one embodiment of a computer system; [0006]
  • FIG. 2 is a block diagram of one embodiment of a computer system; [0007]
  • FIG. 3 is a power management module in accordance with one embodiment of the present invention; [0008]
  • FIG. 4 is a flow diagram of the operation of power management module in accordance with one embodiment of the present invention; [0009]
  • FIG. 5 is a block diagram of one embodiment of a computer system; [0010]
  • FIG. 6 is a block diagram of a logical representation of a memory controller interface in accordance with one embodiment of the present invention; [0011]
  • FIG. 7 is a power management module in accordance with one embodiment of the present invention; and [0012]
  • FIG. 8 is a flow diagram of the operation of one embodiment of a power management module. [0013]
  • DETAILED DESCRIPTION OF TIE PRESENT INVENTION
  • FIG. 1 is a block diagram of a [0014] computer system 100. Computer system 100 includes a bus 101, a Central Processing Unit (CPU) 105, a memory controller 110 and a memory unit 115. CPU 105 processes information received from memory 115 or other internal and external memory devices of computer system 100. Memory controller 110 is coupled to CPU 105. Further, memory controller 110 interfaces with memory unit 115 in order to carry out memory access transactions.
  • Memory unit [0015] 115 is coupled to memory controller 110 via bus 101. According to one embodiment, memory unit 115 is a Rambus Dynamic Access Memory (RDRAM). Memory unit 115 may be a Direct RDRAM (D-RDRAM) or a Concurrent RDRAM. An RDRAM is a high-speed memory interface that transfers data over a bus called a Rambus Channel. Bus 101 is a Rambus channel that permits memory controller 110 to communicate with memory unit 115. In one embodiment bus 101 is a high speed bus that operates at a clock rate of 400 MHz and enables a data rate of 800 Mhz.
  • Memory unit [0016] 115 includes Rambus In-line Memory Modules (RIMMs) 120, 130 and 140. One of ordinary skill in the art will appreciate that memory unit 115 may include an alternative number of RIMMs. RIMMs 120, 130 and 140 include memory devices 123, 133 and 143, respectively, that are accessed by CPU 105, or other devices coupled to computer system 100, in order to store or read data. Each RIMM includes a channel input and channel output (not shown to avoid obscuring the present invention) that is coupled to bus 101. Bus 101 is coupled to and communicates in parallel with every memory device in each of the RIMMs. Additionally, each memory device within a RIMM operates according to an ACTIVE, STANDBY or NAP state. A memory device is in the ACTIVE state whenever it is ready to transfer, or is actually transferring data. A memory device is in the STANDBY state if the device is not immediately ready to transfer data. A memory device is in the NAP (or sleep) state whenever the device is in a reduced power consumption state which may occur, for example, if the memory device has not been accessed for a long period of time.
  • [0017] Bus 101 is received at the channel input of RIMM 120. Bus 101 is coupled to each of the memory devices 123 within RIMM 120. Bus 101 exits RIMM 120 at the channel output and is received at the channel input of RIMM 130. RIMM 130. At RIMM 130, bus 101 is coupled to each memory device 133 before exiting through the output channel. Further, bus 101 is received at RIMM 140 and is coupled to each memory device 143. Finally, bus 101 is exited at the channel output of RIMM 140 and is terminated at bus terminator 102.
  • According to one embodiment, each of [0018] RIMMs 120, 130 and 140 includes eight (8) memory devices. Therefore, a total of twenty-four (24) memory devices are coupled to bus 101. Nevertheless, one of ordinary skill in the art will appreciate that RIMMs 120, 130 and 140 may include any number of memory devices. For example, RIMM 120 may include sixteen (16) memory devices 123, and RIMMs 130 and 140 may each include eight (8) memory devices 133 and 143, respectively. Moreover, memory controller 110 may be coupled to multiple memory units by multiple busses. For example, FIG. 2 illustrates another embodiment in which memory controller 110 may be coupled to multiple memory units 1 15a-1 15c by busses 101, 102, 103, respectively. Nevertheless, one of ordinary skill in the art will appreciate that an alternative number of memory units may be coupled to memory controller 110.
  • As discussed above, each RIMM may contain multiple memory devices (e.g., [0019] 4, 8, 12, 16, etc.). If all of the memory devices on a RIMM are in the ACTIVE state, the total power generated by the RIMM will be very high (e.g., on the order of 6.4 watts). Excessive power generation may create thermal issues within the RIMM. FIG. 3 illustrates one embodiment of a power management module 300. In one embodiment power memory module 300 resides within memory controller 110 and manages the activity of memory devices 123, 133 and 143 within RIMMs 120, 130 and 140, respectively.
  • [0020] Power management module 300 includes device pools 310 and 350. Each of the memory devices coupled to bus 101 are logically grouped into either pool 310 or pool 350. All memory devices grouped into pool 310 are either in the ACTIVE or STANDBY state. Memory devices grouped into pool 310 are further grouped into subpools 314 and 318. All memory devices within pool 310 that are in the ACTIVE state are grouped into subpool 318. All memory devices within pool 310 that are in the STANDBY state are grouped into subpool 314.
  • According to one embodiment, the maximum number of memory devices that may reside in [0021] pool 310 at a time is eight (8). Additionally, a maximum of four (4) ACTIVE memory devices may reside in subpool 318 at any time. In a further embodiment, the maximum number of memory devices that may reside in pool 310 and ACTIVE devices in subpool 318 is variable and may be programmed. In such an embodiment, a user of computer system 100 may program the maximum number of memory devices that may be grouped in pool 310, as well as the amount of active devices in subpool 318. All memory devices that are not grouped into pool 310 reside in pool 350. All memory devices in pool 350 are in either the STANDBY or NAP state.
  • At the startup of [0022] computer system 100 all memory devices are logically grouped into pool 350. Memory devices residing in pool 350 can only enter pool 310 through subpool 318. A memory device residing in pool 350 may only enter subpool 318 when the device is accessed by a memory request from memory controller 110. Memory devices may only enter subpool 314 from subpool 318. A device may enter subpool 314 when all open rows in that device are closed (i.e., row not in ACTIVE state) and the device is put into standby state. Additionally, a memory device is moved from subpool 318 to pool 314 whenever another memory device needs to be moved from pool 350 or subpool 314 into subpool 318 and subpool 318 is filled to capacity. In this case the least recently used (LRU) device in subpool 318 is selected to be transferred to subpool 314.
  • A memory device residing in [0023] subpool 314 may only enter subpool 318 when the device is accessed by a memory request from memory controller 110. Memory devices may only enter pool 350 from subpool 314. A memory device enters pool 350 from subpool 314 whenever another memory device needs to be moved from subpool 318 into subpool 314 and subpool 314 is presently filled to capacity. In this case the LRU device in subpool 314 is selected to be transferred to pool 350.
  • According to one embodiment, a timer may be included within [0024] memory controller 110 that first moves a memory device from subpool 314 to pool 350 and subsequently moves a memory device from subpool 318 to subpool 314 if the device in subpool 318 has not been accessed in a predetermined period of time. In another embodiment, a second timer may be included solely to move memory device from subpool 314 to pool 350 if that device has not been accessed in a predetermined period of time.
  • FIG. 4 is a flow diagram of one embodiment of processing performed by [0025] power management module 300. At processing block 405, access to a memory device within one of the RIMMs of memory unit 115 is requested. Next, at processing block 410 it is determined whether the requested memory device resides in pool 310. If it is determined that the device resides in pool 310, it is next determined whether the memory device also resides in subpool 318, processing block 415. If the memory device does reside in subpool 318 control is returned back to processing block 405 where access to another memory device is requested. If it is determined that the memory device does not reside in pool 310, or that the device resides in pool 310 but not in subpool 318, it is determined whether the memory device resides in subpool 314, processing block 420.
  • If it is determined that the requested memory device resides in [0026] subpool 314, it is next determined whether subpool 318 is full, processing block 425. If subpool 318 is full, the LRU memory device of subpool 318 is logically transferred to subpool 314, processing block 430. At processing block 435, the memory device is logically moved from subpool 314 to subpool 318 and is switched to the ACTIVE state. If subpool 318 is not full, the memory device is moved directly from subpool 314 to subpool 318 and is switched to the ACTIVE state, processing block 435.
  • If at [0027] processing block 420 it is determined that the memory device does not reside in subpool 314, it is determined whether pool 310 is full, processing block 440. If subpool 310 is full, the LRU memory device of subpool 314 is logically transferred to pool 350, processing block 445. If subpool 310 is not full or after the LRU device has been moved from subpool 314 to pool 350, it is determined whether subpool 318 is full, processing block 450. If subpool 318 is full the LRU memory device of subpool 318 is logically transferred to subpool 314, processing block 455. At processing block 460, the memory device is logically moved from pool 350 to subpool 318 and is switched to the ACTIVE state. If subpool 318 is not full, the memory device is moved directly from pool 350 to subpool 318 and is switched to the ACTIVE state, processing block 460.
  • In another embodiment, the [0028] pools 310 and 350 support multiple bus (or channel) operation as shown in FIG. 2. In such an embodiment the pool logic considers the multiple channels as a single channel. For example, the definition of pool 310 is the same except that memory devices from more than one channel are included. Also, pool 350 represents channels that are either in the NAP or STANDBY states. Each memory device that is coupled to a channel in the NAP state is also in the NAP state. Similarly, each memory device coupled to a channel in the STANDBY state is also in the STANDBY state.
  • FIG. 5 is a block diagram of one embodiment of a computer system [0029] 500. Computer system 500 includes a bus 501, a memory computer system 500 includes a bus 501, a memory controller 510, a memory unit 515 and CPU 105. As described above, CPU 105 processes information received from memory 515 or other internal and external devices of computer system 500. Memory controller 510 is coupled to CPU 105. Memory controller 510 interfaces with memory unit 515 in order to carry out memory transactions.
  • [0030] Memory unit 515 is coupled to memory controller 110 via bus 501. According to one embodiment, memory unit 515 is a Synchronous Dynamic Access Memory (SDRAM). An SDRAM is a form of DRAM that can be coordinated or synchronized to the clock speed of CPU 105. Bus 501 is a DRAM bus that permits memory controller 510 to communicate with memory unit 515. Bus 501 operates at speeds up to 133 MHz. speeds up to 133 MHz. and 540. DIMMs 520, 530 and 540 include memory devices 523, 533 and 543, respectively, that are accessed by CPU 105 or other devices in order to store or read data. A DIMM may include one or more rows of memory. Each row within a DIMM is coupled to memory controller 510 by bus 501. For example, FIG. 6 illustrates a logical representation of the interface between memory controller 510 and memory unit 515 wherein DIMMs 520, 530 and 540 constitute separate rows of memory devices within memory unit 515. Additionally, each row within memory unit 515 operates according to either an ACTIVE/IDLE state or POWERED DOWN state. A row is in the ACTIVE/IDLE state whenever a memory device within the DIMM is ready to transfer, or is actually transferring data. A row is in the POWERED DOWN state whenever no memory device within the row has been accessed for a long period of time.
  • [0031] Bus 501 is received at the input of row 520 and is coupled to each of the memory devices 523. In addition, bus 501 is received at the input of DIMM 530 and is coupled to each memory device 533. Further, bus 501 is received at that input DIMM 540 and is coupled to each memory device 543. According to one embodiment, memory unit 515 includes three rows of DIMMs (e.g., DIMMs 520, 530 and 540). However, one of ordinary skill in the art will appreciate that additional DIMMs may be added to memory unit 515.
  • According to a further embodiment, each of the DIMMs includes four ([0032] 4)
  • According to a further embodiment, each of the DIMMs includes four (4) [0033] bus 501. Nevertheless, one of ordinary skill in the art will appreciate that DIMMs 520, 530 and 540 may each include a different number of memory devices, as well as different combinations. For example, DIMM 520 may include sixteen (16) memory different combinations. For example, DIMM 520 may include sixteen (16) memory devices 523 and DIMMs 530 and 540 may each include eight (8) memory devices 533
  • As discussed above with respect to memory unit [0034] 1 15, the total power
  • As discussed above with respect to memory unit [0035] 115, the total power ACTIVE/IDLE state. FIG. 7 illustrates a power management module 700. Power memory module 700 resides within memory controller 510 and manages the activity of DIMMs 520, 530 and 540.
  • [0036] Power management module 700 includes device pools 710 and 750. Each of the memory device rows coupled to bus 501 are grouped into either pool 710 or pool 750. All rows that are grouped within pool 710 are in the ACTIVE/IDLE state. All rows that do not reside in pool 710 are grouped within pool 750. Thus, all rows that are in the POWERED DOWN state reside in pool 750. According to one embodiment, only one (1) row may reside in pool 710 at a time. However, the maximum number of rows that may reside in pool 710 may be programmed. In such an embodiment, a user of computer system 500 may program the maximum number of memory devices that may be grouped in pool 710.
  • At the startup of computer system [0037] 500 all rows are logically arranged into pool 750. A row residing in pool 750 may only enter pool 710 when a memory device within the row is accessed by a memory request from memory controller 510. Additionally, a row is moved to pool 750 from pool 710 whenever another row needs to be moved from pool 750 into pool 710 and pool 710 is filled to capacity. In this case the LRU device in pool 710 is selected to be transferred to pool 750. Before the row is moved to pool 750 all open pages must first be closed. According to one embodiment, a timer is included within memory controller 510 that moves a row from pool 710 to pool 750 if a memory device within the row has not been accessed in a predetermined period of time.
  • FIG. 8 is a flow diagram of one embodiment with a process performed by [0038] power management module 700. At process block 705, access to a memory device within one of the rows of memory unit 515 is requested. Next, at process block 710 it is determined at memory controller 510 whether the DIMM resides in pool 710. If it is determined that the row resides in pool 710, control is returned back to process block 805 wherein access to another memory device is requested. If it is determined that the row does not reside in pool 710, it is determined whether pool 710 is full, process block 815.
  • If [0039] pool 710 is full the LRU row in pool 710 is logically transferred to pool 750, process block 820. At process block 825, the requested row is logically moved from pool 750 to pool 710 and is switched to the ACTIVE/IDLE state. If pool 710 is not full the row is moved directly from pool 750 to pool 710 and is switched to the ACTIVE/IDLE state, process block 825. One of ordinary skill in the art will appreciate that the present invention may be implemented in other memory systems, such as Sync Link DRAMS (SLDRAMS), EDO DRAMS etc.
  • Thus a method and apparatus for memory power management has been described [0040]

Claims (30)

What is claimed is:
1 . In a memory system comprising a plurality of memory devices, wherein each one of said plurality of memory devices is classified as belonging to a first group or second group, a power management method comprising:
requesting access to a first memory device;
determining whether said first memory device is classified as belonging determining whether said first group is filled to capacity; and, if not
determining whether said first group is filled to capacity; and, if not
transferring said first memory device to said first group.
2. The method of claim 1, wherein each of said plurality of memory devices classified as belonging to said first group is further classified as belonging to a first subgroup or a second subgroup.
3. The method of claim 2 further comprising:
determining whether said first memory device is classified as belonging to said first subgroup if said first memory device is classified as belonging to said first group; and, if not
determining whether said first memory device is classified as belonging to said second subgroup.
4. The method of claim 3 further comprising:
determining whether said first subgroup is filled to capacity if said first memory device is classified as belonging to said second subgroup; and, if not
transferring said first memory device to said first subgroup.
5. The method of claim 4 further comprising the steps of:
transferring a second memory device classified as belonging to said first subgroup to said second subgroup if said first subgroup is filled to capacity; and
6. The method of claim 5 wherein said second memory device is the least recently used memory device classified in subgroup one.
7. The method of claim 2 further comprising:
transferring a second memory device classified as belonging to said second subgroup to said second group if said first group is filled to capacity;
determining whether said first subgroup is filled to capacity; and
transferring a third memory device classified as belonging to said first subgroup to said second subgroup.
8. The method of claim 7, wherein the capacity of said first group and said first subgroup are programmable.
9. The method of claim 7, wherein said second memory device is the least recently used memory device classified in said first group and said third memory device is the least recently used memory device classified in said first subgroup.
10. The method of claim 2 further comprising:
determining whether said first subgroup is filled to capacity if said first group is filled to capacity; and
transferring a second memory device classified as belonging to said first subgroup to second subgroup.
11. The method of claim 2, wherein memory devices classified as belonging to said first subgroup are in an active state and memory devices classified as belonging to said second subgroup are in a standby state.
12. The method of claim 2, wherein memory devices classified as belonging to said first group are in either an active state or a standby state, and memory devices classified as belonging to said second group are in either a nap state or a standby state.
13. The method of claim 2 further comprising:
transferring a second memory device classified as belonging to said second subgroup to said second group if said second memory device has not been accessed within a predetermined interval of time.
14. The method of claim 2 further comprising:
transferring a second memory device classified as belonging to said second subgroup to said second group if said second memory device has not been accessed within a predetermined interval of time; and
transferring a third memory device classified as belonging to said first subgroup to said second subgroup if said third memory device has not been accessed within said predetermined interval of time.
15. The method of claim 2 wherein the memory system is a Rambus Dynamic Random Access Memory (RDRAM):
16. In a Synchronous Dynamic Random Access Memory (SDRAM) system comprising a plurality of rows, each row comprising a plurality of memory devices, wherein each of said plurality of rows is classified as belonging to a first group or a second group, a power management method comprising:
requesting access to a first memory in a first row;
determining whether the first row is classified as belonging to the first group; if not
determining whether the first group is filled to capacity; and, if not
transferring said the row to said first group.
17. The method of claim 16 further comprising the step of moving a second row to the second group if the first group is filled to capacity.
18. The method of claim 17, wherein the second row is the least recently used in the first group.
19. The method of claim 17, wherein the capacity of the first group is programmable.
20. The method of claim 16, wherein rows in the first group are active and rows in the second group are powered down.
21. The method of claim 16 further comprising:
A step of transferring a second row classified as belonging to the first group to the second group if the second row has not been accessed in a predetermined interval of time.
22. A computer system comprising:
a Rambus Dynamic Random Access Memory (RDRAM), wherein the RDRAM further comprises a plurality of memory devices, each of the plurality of memory devices operating according to an active state, a standby state or a nap state; and
a memory controller for managing the power generated by the RDRAM by grouping all memory devices operating in the active state in a first pool and grouping all memory devices operating in the nap state in a second pool.
23. The computer system of claim 22, wherein the first pool is subdivided into a first subpool and a second subpool, wherein all memory devices in the active state are logically grouped in the first subpool and memory devices in the standby state within the first pool are logically grouped into the second subpool.
24. The computer system of claim 23, wherein a first memory device is transferred from the first pool to the second pool upon being accessed by the memory controller.
25. The computer system of claim 24, wherein a second memory device is transferred from the first pool to the second pool if the first pool is filled to capacity.
26. The computer system of claim 24, wherein a second memory device is transferred from the second subpool to the second pool and a third memory device is transferred from the first subpool to the second subpool if the first subpool is filled to capacity.
27. The computer system of claim 25, wherein the capacity of the first pool is programmable.
28. The computer system of claim 26, wherein the capacity of the first subpool is programmable.
29. The computer system of claim 26, wherein the memory controller further comprises a timer for transferring a first memory device from the first pool to the second pool if the first memory device has not been accessed by the memory controller within a predetermined period of time.
30. The computer system of claim 24, wherein the memory controller further comprises a timer for transferring a first memory device from the second subpool to the second pool and transferring a second memory device from the first subpool to the second subpool if the first memory device has not been accessed by the memory controller within a predetermined period of time.
US09/187,565 1998-11-04 1998-11-04 Method and apparatus for power management in a memory subsystem Granted US20020124195A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/187,565 US6442698B2 (en) 1998-11-04 1998-11-04 Method and apparatus for power management in a memory subsystem

Publications (1)

Publication Number Publication Date
US20020124195A1 true US20020124195A1 (en) 2002-09-05

Family

ID=22689486

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/187,565 Granted US20020124195A1 (en) 1998-11-04 1998-11-04 Method and apparatus for power management in a memory subsystem
US09/187,565 Expired - Lifetime US6442698B2 (en) 1998-11-04 1998-11-04 Method and apparatus for power management in a memory subsystem

Family Applications After (1)

Application Number Title Priority Date Filing Date
US09/187,565 Expired - Lifetime US6442698B2 (en) 1998-11-04 1998-11-04 Method and apparatus for power management in a memory subsystem

Country Status (9)

Country Link
US (2) US20020124195A1 (en)
EP (1) EP1127308B1 (en)
CN (1) CN100430865C (en)
AU (1) AU1466600A (en)
BR (1) BR9915060A (en)
DE (1) DE69941577D1 (en)
HK (1) HK1036665A1 (en)
TW (1) TW484051B (en)
WO (1) WO2000026755A1 (en)

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060026349A1 (en) * 2004-07-30 2006-02-02 International Business Machines Corporaiton System, method and storage medium for providing a serialized memory interface with a bus repeater
US20060023482A1 (en) * 2004-07-30 2006-02-02 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance
US20060036826A1 (en) * 2004-07-30 2006-02-16 International Business Machines Corporation System, method and storage medium for providing a bus speed multiplier
US20060095671A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for providing data caching and data compression in a memory subsystem
US20060095646A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US20060095703A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for bus calibration in a memory subsystem
US20060136618A1 (en) * 2004-07-30 2006-06-22 International Business Machines Corporation System, method and storage medium for a multi-mode memory buffer device
GB2426360A (en) * 2005-05-18 2006-11-22 Symbian Software Ltd Reorganisation of memory for conserving power in a computing device
US20080037353A1 (en) * 2006-07-31 2008-02-14 Metaram, Inc. Interface circuit system and method for performing power saving operations during a command-related latency
US20080098277A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with power gating and a fault tolerant address and command bus
US7669086B2 (en) 2006-08-02 2010-02-23 International Business Machines Corporation Systems and methods for providing collision detection in a memory system
US7685392B2 (en) 2005-11-28 2010-03-23 International Business Machines Corporation Providing indeterminate read data latency in a memory system
US7721140B2 (en) 2007-01-02 2010-05-18 International Business Machines Corporation Systems and methods for improving serviceability of a memory system
US7724589B2 (en) 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US7730338B2 (en) 2006-07-31 2010-06-01 Google Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US7761724B2 (en) 2006-07-31 2010-07-20 Google Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8019589B2 (en) 2006-07-31 2011-09-13 Google Inc. Memory apparatus operable to perform a power-saving operation
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8140942B2 (en) 2004-10-29 2012-03-20 International Business Machines Corporation System, method and storage medium for providing fault detection and correction in a memory subsystem
US8169233B2 (en) 2009-06-09 2012-05-01 Google Inc. Programming of DIMM termination resistance values
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8280714B2 (en) 2006-07-31 2012-10-02 Google Inc. Memory circuit simulation system and method with refresh capabilities
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8566516B2 (en) 2006-07-31 2013-10-22 Google Inc. Refresh management of memory modules
US8582339B2 (en) 2005-09-02 2013-11-12 Google Inc. System including memory stacks
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8972673B2 (en) 2006-07-31 2015-03-03 Google Inc. Power management of memory circuits by virtual memory simulation
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US9542353B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4265850B2 (en) * 2000-01-17 2009-05-20 富士通株式会社 Mobile switch, home memory node device, and gateway switch
US6633987B2 (en) * 2000-03-24 2003-10-14 Intel Corporation Method and apparatus to implement the ACPI(advanced configuration and power interface) C3 state in a RDRAM based system
US6691237B1 (en) * 2000-08-08 2004-02-10 Dell Products, L.P. Active memory pool management policies
US6925529B2 (en) * 2001-07-12 2005-08-02 International Business Machines Corporation Data storage on a multi-tiered disk system
US6820169B2 (en) * 2001-09-25 2004-11-16 Intel Corporation Memory control with lookahead power management
US20030097519A1 (en) * 2001-11-21 2003-05-22 Yoon Ha Ryong Memory subsystem
US7103730B2 (en) * 2002-04-09 2006-09-05 Intel Corporation Method, system, and apparatus for reducing power consumption of a memory
US7028200B2 (en) * 2002-05-15 2006-04-11 Broadcom Corporation Method and apparatus for adaptive power management of memory subsystem
US7051174B2 (en) * 2002-09-24 2006-05-23 International Business Machines Corporation Method, system, and program for restoring data in cache
US6853603B1 (en) * 2004-03-09 2005-02-08 Altera Corporation Programmable logic device having nonvolatile memory with user selectable power consumption
US7272728B2 (en) * 2004-06-14 2007-09-18 Iovation, Inc. Network security and fraud detection system and method
US7395476B2 (en) 2004-10-29 2008-07-01 International Business Machines Corporation System, method and storage medium for providing a high speed test interface to a memory subsystem
US7356737B2 (en) 2004-10-29 2008-04-08 International Business Machines Corporation System, method and storage medium for testing a memory module
US7512762B2 (en) 2004-10-29 2009-03-31 International Business Machines Corporation System, method and storage medium for a memory subsystem with positional read data latency
US7472220B2 (en) 2006-07-31 2008-12-30 Metaram, Inc. Interface circuit system and method for performing power management operations utilizing power management signals
US7478259B2 (en) 2005-10-31 2009-01-13 International Business Machines Corporation System, method and storage medium for deriving clocks in a memory system
US7539842B2 (en) 2006-08-15 2009-05-26 International Business Machines Corporation Computer memory system for selecting memory buses according to physical memory organization information stored in virtual address translation tables
US7490217B2 (en) 2006-08-15 2009-02-10 International Business Machines Corporation Design structure for selecting memory busses according to physical memory organization information stored in virtual address translation tables
US9105323B2 (en) 2009-01-23 2015-08-11 Micron Technology, Inc. Memory device power managers and methods
US9368214B2 (en) 2013-10-03 2016-06-14 Apple Inc. Programmable peak-current control in non-volatile memory devices
US10379748B2 (en) * 2016-12-19 2019-08-13 International Business Machines Corporation Predictive scheduler for memory rank switching
CN111459261A (en) * 2020-04-03 2020-07-28 北京云宽志业网络技术有限公司 Disk wake-up method and device, electronic equipment and storage medium

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04143819A (en) * 1989-12-15 1992-05-18 Hitachi Ltd Power consumption control method, semiconductor integrated circuit device, and microprocessor
US5430683A (en) * 1994-03-15 1995-07-04 Intel Corporation Method and apparatus for reducing power in on-chip tag SRAM
US5721860A (en) * 1994-05-24 1998-02-24 Intel Corporation Memory controller for independently supporting synchronous and asynchronous DRAM memories
US5923829A (en) * 1994-08-25 1999-07-13 Ricoh Company, Ltd. Memory system, memory control system and image processing system
US5598374A (en) * 1995-07-14 1997-01-28 Cirrus Logic, Inc. Pipeland address memories, and systems and methods using the same
US5881016A (en) * 1997-06-13 1999-03-09 Cirrus Logic, Inc. Method and apparatus for optimizing power consumption and memory bandwidth in a video controller using SGRAM and SDRAM power reduction modes
US5889714A (en) * 1997-11-03 1999-03-30 Digital Equipment Corporation Adaptive precharge management for synchronous DRAM
US5835435A (en) * 1997-12-02 1998-11-10 Intel Corporation Method and apparatus for dynamically placing portions of a memory in a reduced power consumtion state
US6003121A (en) * 1998-05-18 1999-12-14 Intel Corporation Single and multiple channel memory detection and sizing
US6038673A (en) 1998-11-03 2000-03-14 Intel Corporation Computer system with power management scheme for DRAM devices

Cited By (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7403409B2 (en) 2004-07-30 2008-07-22 International Business Machines Corporation 276-pin buffered memory module with enhanced fault tolerance
US20080183957A1 (en) * 2004-07-30 2008-07-31 International Business Machines Corporation 276-pin buffered memory module with enhanced fault tolerance
US20070288679A1 (en) * 2004-07-30 2007-12-13 International Business Machines Corporation 276-pin buffered memory module with enhanced fault tolerance and a performance-optimized pin assignment
US20060026349A1 (en) * 2004-07-30 2006-02-02 International Business Machines Corporaiton System, method and storage medium for providing a serialized memory interface with a bus repeater
US7224595B2 (en) 2004-07-30 2007-05-29 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance
US7551468B2 (en) 2004-07-30 2009-06-23 International Business Machines Corporation 276-pin buffered memory module with enhanced fault tolerance
US20060136618A1 (en) * 2004-07-30 2006-06-22 International Business Machines Corporation System, method and storage medium for a multi-mode memory buffer device
US7529112B2 (en) 2004-07-30 2009-05-05 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance and a performance-optimized pin assignment
US7765368B2 (en) 2004-07-30 2010-07-27 International Business Machines Corporation System, method and storage medium for providing a serialized memory interface with a bus repeater
US20060036826A1 (en) * 2004-07-30 2006-02-16 International Business Machines Corporation System, method and storage medium for providing a bus speed multiplier
US20060023482A1 (en) * 2004-07-30 2006-02-02 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance
US7729153B2 (en) 2004-07-30 2010-06-01 International Business Machines Corporation 276-pin buffered memory module with enhanced fault tolerance
US8140942B2 (en) 2004-10-29 2012-03-20 International Business Machines Corporation System, method and storage medium for providing fault detection and correction in a memory subsystem
US20060095671A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for providing data caching and data compression in a memory subsystem
US20060095703A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for bus calibration in a memory subsystem
US8589769B2 (en) 2004-10-29 2013-11-19 International Business Machines Corporation System, method and storage medium for providing fault detection and correction in a memory subsystem
US20060095646A1 (en) * 2004-10-29 2006-05-04 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
GB2426360A (en) * 2005-05-18 2006-11-22 Symbian Software Ltd Reorganisation of memory for conserving power in a computing device
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8615679B2 (en) 2005-06-24 2013-12-24 Google Inc. Memory modules with reliability and serviceability functions
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US8386833B2 (en) 2005-06-24 2013-02-26 Google Inc. Memory systems and memory modules
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8811065B2 (en) 2005-09-02 2014-08-19 Google Inc. Performing error detection on DRAMs
US8619452B2 (en) 2005-09-02 2013-12-31 Google Inc. Methods and apparatus of stacking DRAMs
US8582339B2 (en) 2005-09-02 2013-11-12 Google Inc. System including memory stacks
US7685392B2 (en) 2005-11-28 2010-03-23 International Business Machines Corporation Providing indeterminate read data latency in a memory system
US8151042B2 (en) 2005-11-28 2012-04-03 International Business Machines Corporation Method and system for providing identification tags in a memory system having indeterminate data response times
US8145868B2 (en) 2005-11-28 2012-03-27 International Business Machines Corporation Method and system for providing frame start indication in a memory system having indeterminate read data latency
US8327105B2 (en) 2005-11-28 2012-12-04 International Business Machines Corporation Providing frame start indication in a memory system having indeterminate read data latency
US8495328B2 (en) 2005-11-28 2013-07-23 International Business Machines Corporation Providing frame start indication in a memory system having indeterminate read data latency
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US8566556B2 (en) 2006-02-09 2013-10-22 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US9727458B2 (en) 2006-02-09 2017-08-08 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US9542353B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US8797779B2 (en) 2006-02-09 2014-08-05 Google Inc. Memory module with memory stack and interface with enhanced capabilites
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8601204B2 (en) 2006-07-31 2013-12-03 Google Inc. Simulating a refresh operation latency
US20080037353A1 (en) * 2006-07-31 2008-02-14 Metaram, Inc. Interface circuit system and method for performing power saving operations during a command-related latency
US8154935B2 (en) 2006-07-31 2012-04-10 Google Inc. Delaying a signal communicated from a system to at least one of a plurality of memory circuits
US8280714B2 (en) 2006-07-31 2012-10-02 Google Inc. Memory circuit simulation system and method with refresh capabilities
US8019589B2 (en) 2006-07-31 2011-09-13 Google Inc. Memory apparatus operable to perform a power-saving operation
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US7724589B2 (en) 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US8340953B2 (en) 2006-07-31 2012-12-25 Google, Inc. Memory circuit simulation with power saving capabilities
US8112266B2 (en) 2006-07-31 2012-02-07 Google Inc. Apparatus for simulating an aspect of a memory circuit
US8671244B2 (en) 2006-07-31 2014-03-11 Google Inc. Simulating a memory standard
US7730338B2 (en) 2006-07-31 2010-06-01 Google Inc. Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
US7761724B2 (en) 2006-07-31 2010-07-20 Google Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8631220B2 (en) 2006-07-31 2014-01-14 Google Inc. Adjusting the timing of signals associated with a memory system
US9047976B2 (en) 2006-07-31 2015-06-02 Google Inc. Combined signal delay and power saving for use with a plurality of memory circuits
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US8972673B2 (en) 2006-07-31 2015-03-03 Google Inc. Power management of memory circuits by virtual memory simulation
US8566516B2 (en) 2006-07-31 2013-10-22 Google Inc. Refresh management of memory modules
US8868829B2 (en) 2006-07-31 2014-10-21 Google Inc. Memory circuit system and method
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8595419B2 (en) 2006-07-31 2013-11-26 Google Inc. Memory apparatus operable to perform a power-saving operation
US8745321B2 (en) 2006-07-31 2014-06-03 Google Inc. Simulating a memory standard
US7669086B2 (en) 2006-08-02 2010-02-23 International Business Machines Corporation Systems and methods for providing collision detection in a memory system
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8977806B1 (en) 2006-10-05 2015-03-10 Google Inc. Hybrid memory module
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8370566B2 (en) 2006-10-05 2013-02-05 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8751732B2 (en) 2006-10-05 2014-06-10 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US7870459B2 (en) 2006-10-23 2011-01-11 International Business Machines Corporation High density high reliability memory module with power gating and a fault tolerant address and command bus
US20080098277A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with power gating and a fault tolerant address and command bus
US8760936B1 (en) 2006-11-13 2014-06-24 Google Inc. Multi-rank partial width memory modules
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8446781B1 (en) 2006-11-13 2013-05-21 Google Inc. Multi-rank partial width memory modules
US7721140B2 (en) 2007-01-02 2010-05-18 International Business Machines Corporation Systems and methods for improving serviceability of a memory system
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8675429B1 (en) 2007-11-16 2014-03-18 Google Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8730670B1 (en) 2007-12-18 2014-05-20 Google Inc. Embossed heat spreader
US8705240B1 (en) 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US8631193B2 (en) 2008-02-21 2014-01-14 Google Inc. Emulation of abstracted DIMMS using abstracted DRAMS
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8762675B2 (en) 2008-06-23 2014-06-24 Google Inc. Memory system for synchronous data transmission
US8819356B2 (en) 2008-07-25 2014-08-26 Google Inc. Configurable multirank memory system with interface circuit
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8169233B2 (en) 2009-06-09 2012-05-01 Google Inc. Programming of DIMM termination resistance values

Also Published As

Publication number Publication date
EP1127308A1 (en) 2001-08-29
BR9915060A (en) 2001-08-07
AU1466600A (en) 2000-05-22
CN1332864A (en) 2002-01-23
WO2000026755A1 (en) 2000-05-11
HK1036665A1 (en) 2002-01-11
EP1127308A4 (en) 2003-05-21
EP1127308B1 (en) 2009-10-21
CN100430865C (en) 2008-11-05
DE69941577D1 (en) 2009-12-03
TW484051B (en) 2002-04-21
US6442698B2 (en) 2002-08-27

Similar Documents

Publication Publication Date Title
US6442698B2 (en) Method and apparatus for power management in a memory subsystem
US7421598B2 (en) Dynamic power management via DIMM read operation limiter
US7353329B2 (en) Memory buffer device integrating refresh logic
US6327664B1 (en) Power management on a memory card having a signal processing element
US7426649B2 (en) Power management via DIMM read operation limiter
EP1442355B1 (en) Dram power management
US7821864B2 (en) Power management of memory via wake/sleep cycles
EP3223281B1 (en) Memory device power managers and methods
EP1839313B1 (en) Directed auto-refresh synchronization
US8438358B1 (en) System-on-chip with memory speed control core
JPH0412859B2 (en)
US6046952A (en) Method and apparatus for optimizing memory performance with opportunistic refreshing
US7650472B2 (en) Method for reducing memory power consumption
CN115516563A (en) Refresh management for DRAM
US6836824B1 (en) Method and apparatus for reducing power consumption in a cache memory system
US6845457B1 (en) Method and apparatus for controlling transitions between a first and a second clock frequency
US11947840B2 (en) Inter-die refresh control
US11379388B1 (en) Credit scheme for multi-queue memory controllers
US11934251B2 (en) Data fabric clock switching
EP1451669A2 (en) Method and apparatus for reducing power consumption
JP2000030452A (en) Memory device of input/output having command stacking and high and narrow frequency band width
US6700421B1 (en) Method and apparatus for reducing power consumption
US20220318161A1 (en) Memory controller power states
CN117480484A (en) Routing of memory transactions
JPH10301839A (en) Memory control system and semiconductor device