US20020162645A1 - Heatsink assembly having stabilzation plate - Google Patents
Heatsink assembly having stabilzation plate Download PDFInfo
- Publication number
- US20020162645A1 US20020162645A1 US09/866,068 US86606801A US2002162645A1 US 20020162645 A1 US20020162645 A1 US 20020162645A1 US 86606801 A US86606801 A US 86606801A US 2002162645 A1 US2002162645 A1 US 2002162645A1
- Authority
- US
- United States
- Prior art keywords
- heatsink
- poron
- slice
- die
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heatsink assembly having a stabilization plate is described. The stabilization plate, such as an n-shaped PORON slice, is disposed under a heatsink, and is surrounding a thermal pad under the heatsink. The stabilization plate is helpful to stabilize the combination of the thermal pad up to the heatsink. With the stabilization, the thermal pad is efficiently stuck on to a die for dissipating the heat therefrom.
Description
- This invention relates to a heatsink, and is more specifically related to a heatsink applied in an apparatus such as a liquid crystal display or a server.
- FIG. 1 is schematic, cross-sectional view of a conventional heatsink and a die cooled with the heatsink. Referring to FIG. 1, a
thermal pad 102, is disposed on the contact between the bottom of theheatsink 104 and thedie 100, it generally serves as a medium for conducting the heat from thedie 100 to theheatsink 104. Usually, the gravity center of aconventional heatsink 104 is located on its right portion, because theright cooling fins 104 b are often more than the left cooling fins 104 a. The left portion of theheatsink 104 is not extended due to the space consideration. That is, a power supply is designed to be disposed on the heatsink's right side. Therefore, if a skilled person wants to increase the efficiency of heat dissipation, they usually increase the right cooling fins 104 b and, simultaneously moves the gravity center further right. When fastening such a center-biased heatsink 104 onto a socket, torque is generated on the left side of the gravity center (since the fastening point is not centralized onto the gravity center). The torque is the reason why thethermal pad 102 could not closely make contact with thedie 100. Without close contact, the heat from thedie 100 cannot be transferred to thethermal pad 102 smoothly. - Still referring to FIG. 1, when the torque creates the deviation, only the left portion of the
thermal pad 102 contact onto thedie 100. In this case, the same heat is transferred through only the small contact area. In other words, the heat density on the contact area is quite high (If the same heat could be transferred through the wholethermal pad 102, the heat density would be lowered). In the case that the included heat is about 31.5 W or 29.5 W, the temperature of the die will continuously be increased to go beyond the tolerable fabrication specification of a CPU manufacture. See the following formula: - wherein K is heat conduction coefficient; A is contact area; ΔT is temperature increase; and ΔX is the thickness of the heatsink.
- Based on the formula, if the contact area A is reduced, the same heat would dramatically increase the temperature, since the K and the ΔX is constant. Referring to FIG. 1 as an example, in which the contact area is reduced to be a half of the original, the temperature increase ΔT may be too great to be within the tolerable fabrication specification of a CPU manufacture.
- In fact, a heatsink manufacture usually adopts the temperature standard requirement concluded by the CPU manufacture. Therefore, if violation of the standard requirement is merely caused by a thermal pad's weak contact, it is more a loss than gain.
- A purpose of the invention is to remedy the problem of the heat conduction between a heatsink and a die. Therefore, in this invention, a stabilization plate is added on the heatsink's surrounding. The stabilization plate makes the heatsink stick well on the die, thereby the heatsink can efficiently dissipate the heat from the die.
- According to a preferred embodiment of the present invention, the stabilization plate can be made of heat-resistant PORON, coated with paste thereon. The stabilization plate is preferably slightly thinner than the die; such design makes the heatsink well contacted onto the die. Experiments show that the temperature of the die is decreased and it becomes stabilized with the use of the stabilization plate.
- In another aspect, this invention provides a cooling assembly. The cooling assembly comprises an n-shaped PORON slice and a heatsink stuck with the n-shaped PORON slice.
- FIG. 1 is schematic, cross-sectional view of a conventional heatsink and a die cooled with the heatsink;
- FIG. 2 is a schematic and three-dimensional view of a heatsink stabilization plate according to a preferred embodiment of the present invention;
- FIG. 3 is a schematic, cross-sectional view of a stabilization plate, a heatsink and a die according to one preferred embodiment of this invention;
- FIG. 4 is a schematic view of a thick stabilization plate, a heatsink and a die;
- FIG. 5 is a schematic view of a stabilization plate having a thickness approximately equal to that of a die; and
- FIG. 6 is a schematic, top view of an n-shaped PORON slice according to one preferred embodiment of this invention.
- FIG. 2 is a schematic and three-dimensional view of a heatsink stabilization plate according to a preferred embodiment of the present invention. In general, solid molecules could not completely fill all vacant space between objects such as
heatsink 204 and a die. The unfilled vacant space, therefore, needs to be filled with athermal pad 202. Preferably, thethermal pad 202 is disposed on the contact between the bottom of theheatsink 204 and the die. In this way thethermal pad 202 serves as a medium for heat conduction. Through such a medium, heat is transferred in a surface-to-surface mode instead of a point-to-point mode. To closely stick thethermal pad 202 on the die, a clip (not shown) is added to fasten the die onto a socket thereunder. However, note that the right portion of theheatsink 204 has cooling fins 204 a more than the cooling fins 204 b of the left portion of theheatsink 204. This difference makes the gravity center of the heatsink located on its right portion. The gravity's center generates torque when the clip is used to fasten the die onto the socket, and the torque is usually a reason whythermal pad 202 cannot closely contact with the die. Without close contact, heat conduction from the die to thethermal pad 202 cannot be performed effectively. - Accordingly, in the present invention, an n-
shaped stabilization plate 208 is stuck on the surrounding of thethermal pad 202. By the stabilization of theplate 208, theheatsink 204 is firmly fastened on the die. More technically, the n-shaped stabilization plate compensates the deviation stemmed from the torque. If the left portion of theheatsink 204 bears greater fastening pressure, theleft portion 208 a of the n-shaped stabilization plate 208 provides more buffer room to the fastening pressure. - The n-
shaped stabilization plate 208 is preferably an n-shaped PORON slice coated with an small amount of paste. With the paste, the n-shaped PORON slice is stuck on the 204. Here, the so-called PORON can be a material having a part number 4716 and being fabricated by Rogers, E. Woodstock, Conn., U.S. - FIG. 3 is a schematic, cross-sectional view of a
stabilization plate 308, aheatsink 304 and a die 300 according to one preferred embodiment of this invention. In the figure, omission of a thermal pad under theheatsink 304 is merely for the convenience of describing. According to FIG. 3, the space between theheatsink 304 and thechip 301 is reduced by thestabilization plate 308, this space reduction is also a reason why thestabilization plate 308 can provide a buffer to the fastening pressure. On the other hand, when theheatsink 304 is located on the die 300, a slight inclination may be generated. Besides that, during the in-line combination of theheatsink 304 with the die 300, such an inclination is unavoidable. In these cases, thestabilization plate 308 timely reminds an operator of the presence of the inclination, and the operator can correct the combination deviations immediately. - However, it should be noted that the
stabilization plate 308 cannot be too thick, since a thick stabilization plate may make the thermal pad and the die separate. Athick stabilization plate 408, aheatsink 304 and a die are schematically shown in FIG. 4. In contrast, FIG. 5 schematically shows astabilization plate 508 having a thickness approximately equal to that of thedie 300. In FIG. 5, it seems that a satisfied fastening result occurs. However, this is provided that the fastening fore 310 from the clip can be ignored. If the fastening force 310 is considered, thestabilization plate 508 is still too thick. Note that the achievement wanted is to have stable contact of the thermal pad onto thedie 300. The fastening force 310 from the clip should be considered and this consideration tells us that the most preferable thickness of thestabilization plate 508 is slightly smaller than that of thedie 300. Nevertheless, the thickness of thestabilization plate 508 cannot be too small, since it would make theplate 508 has no contact with the chip under thedie 300. - As for the choice of PORON, it is preferable because PORON can be easily sliced. On the other hand, PORON is quite soft and elastic. If PORON is pressedwith fingers, then fingerprints initially appear on the PORON, but will soon disappear.
- FIG. 6 is a schematic, top view of an n-shaped PORON slice according to one preferred embodiment of this invention. Referring to FIG. 6, the
left bar 608 a and theright bar 608 b of the n-shaped PORON slice respectively have a width of about 9.99 to about 10.01 millimeters. Above the two bars, the n-shaped PORON slice further comprises alateral bar 608 c having a length of about 48.69 millimeters to about 48.71 millimeters. - A heatproof test for the invented stabilization plate has been performed. In this test, the environment was heated to about 100° C., and no stabilization plate reliability problem was found. (Generally, the temperature between a heatsink and a die would be up to only about 60-80° C.).
- To make one of ordinary skill more understand this invention, some tables showing experiment data are provided below herein. In table 1, except for the heatsink and the PORON slice, configuration of the tested hardware is substantially listed. In table 2, test results are shown. In this test, a T-type thermocouple is equipped to measure the temperature of the CPU. Recorder is YOKOGAWA/HR2300.
TABLE 1 SUT Configuration CPU 2 × CPU (Power consumption 26.1 W) Memory 4 × 1G HDD 3 × 15000 rpm FDD Standard CD-ROM Standard Power 200 W PCI Card Mylex Fan 2 × Blower (97 × 94 × 33) -
TABLE 2 Test result CPU Tj (No PORON CPU Tj (PORON CPU on the Heatsink) on the Heatsink) Tj = 70° C. CPU1 CPU2 Result CPU1 CPU2 Result 1 70.1 71.1 Fail 69.3 69.5 Pass 2 69.5 69.8 Fail 69.1 69.3 Pass 3 69.9 70.5 Fail 69.2 69.5 Pass 4 70.2 70.6 Fail 69.3 69.7 Pass 5 70.5 70.9 Fail 69.5 69.7 Pass - According to the test results, without a PORON slice, the temperature of the CPU is high and changes dramatically (69.5° C.˜70.5° C. for CPU 1; 69.8° C.˜71.1° C. for CPU 2). In the contrast, the temperature of the CPU is low and changes slightly (69.1° C.˜69.5° C. for CPU 1; 69.3° C.˜69.7° C. for CPU 2).
- The present invention has at least the following advantages:
- 1. The invention provides enough contact between a thermal pad and a die.
- 2. In this invention, a heatsink absorbs heat through conduction more efficiently. Here, it is emphasized that the conduction plays an important role in heat transfer, even convection and radiation also contribute little to the heat transfer. Therefore, convection and radiation cannot cool a die well enough, if the heat conduction could not be performed efficiently. More precisely, the heat from a die is usually transferred to the heatsink through conduction. After the heat is transferred to the heatsink, convection, generated by a fan over the heatsink, excludes the heat on the heatsink. Here radiation is not critical and is therefore omitted.
- 3. In this invention, the PORON slice is elastic. Due to the elasticity, the clip would not easily shaken after the heatsink is fastened with the clip.
- 4. The invention prevents the heat density from being increased, since the heat density is usually increased by the defect contact between the die and the heatsink.
- Although the invention has been described in detail herein with reference to its preferred embodiment, it is to be understood that this description is by way of example only, and is not to be interpreted in a limiting sense. It is to be further understood that numerous changes in the details of the embodiments of the invention, and additional embodiments of the invention, will be apparent, and may be made by, persons of ordinary skill in the art having reference to this description. It is considered that such changes and additional embodiments are within the spirit and true scope of the invention as claimed below.
Claims (14)
1. A heatsink assembly, comprising:
a heatsink;
a thermal pad located under the heatsink;
a PORON slice, being located on a bottom of the heatsink and surrounding the thermal pad, for making the thermal pad closely compact to a die of a chip when the heatsink is located on the chip; and
an amount of paste, coated on the PORON slice, for sticking the PORON slice on the bottom of the heatsink.
2. The heatsink stabilization plate of claim 1 , wherein the PORON slice is an n-shaped slice in a top view.
3. The heatsink stabilization plate of claim 1 , wherein the PORON slice has a thickness smaller than that of the die.
4. The heatsink stabilization plate of claim 1 , wherein the PORON slice has a fingerprint thereon after being pressed by a finger, but the fingerprint disappears right away.
5. A cooling assembly, comprising:
an n-shaped PORON slice; and
a heatsink, stuck with the n-shaped PORON slice.
6. The cooling assembly of claim 5 , wherein the heatsink comprises a right portion and a left portion respectively having a first plurality of cooling fins and a second plurality of cooling fins.
7. The cooling assembly of claim 6 , wherein the second cooling fins are less than the first cooling fins.
8. The cooling assembly of claim 5 , further comprising a thermal pad through which heat from a socket is conducted to the heatsink.
9. The cooling assembly of claim 8 , wherein the n-shaped PORON slice surrounds the thermal pad for making the thermal pad closely compact to the die when the heatsink is located on the die.
10. The cooling assembly of claim 5 , wherein the n-shaped PORON slice has a thickness smaller than that of the die.
11. The cooling assembly of claim 5 , wherein the n-shaped PORON slice has a fingerprint thereon after being pressed by a finger, but the fingerprint disappears right away.
12. The cooling assembly of claim 5 , wherein the n-shaped PORON slice comprises two bars respectively having length of about 49.29 to about 49.31 millimeters in a top view.
13. The cooling assembly of claim 5 , wherein the bars respectively have width of about 9.99 to about 10.01 millimeters in a top view.
14. The cooling assembly of claim 5 , wherein the n-shaped PORON slice comprises a lateral bar having a length of about 48.69 millimeters to about 48.71 millimeters in a top view.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW090202978U TW535936U (en) | 2001-02-27 | 2001-02-27 | Stabilizing sheet of heat sink |
TW90202978 | 2001-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20020162645A1 true US20020162645A1 (en) | 2002-11-07 |
Family
ID=21681636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/866,068 Abandoned US20020162645A1 (en) | 2001-02-27 | 2001-05-24 | Heatsink assembly having stabilzation plate |
Country Status (2)
Country | Link |
---|---|
US (1) | US20020162645A1 (en) |
TW (1) | TW535936U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130148016A1 (en) * | 2011-12-09 | 2013-06-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4197586A (en) * | 1978-04-24 | 1980-04-08 | Hewlett-Packard Company | Electronic calculator assembly |
US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
US5596485A (en) * | 1995-03-16 | 1997-01-21 | Amkor Electronics, Inc. | Plastic packaged integrated circuit with heat spreader |
US5838064A (en) * | 1994-04-22 | 1998-11-17 | Nec Corporation | Supporting member for cooling means and electronic package using the same |
US5847929A (en) * | 1996-06-28 | 1998-12-08 | International Business Machines Corporation | Attaching heat sinks directly to flip chips and ceramic chip carriers |
-
2001
- 2001-02-27 TW TW090202978U patent/TW535936U/en not_active IP Right Cessation
- 2001-05-24 US US09/866,068 patent/US20020162645A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4197586A (en) * | 1978-04-24 | 1980-04-08 | Hewlett-Packard Company | Electronic calculator assembly |
US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
US5838064A (en) * | 1994-04-22 | 1998-11-17 | Nec Corporation | Supporting member for cooling means and electronic package using the same |
US5596485A (en) * | 1995-03-16 | 1997-01-21 | Amkor Electronics, Inc. | Plastic packaged integrated circuit with heat spreader |
US5847929A (en) * | 1996-06-28 | 1998-12-08 | International Business Machines Corporation | Attaching heat sinks directly to flip chips and ceramic chip carriers |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130148016A1 (en) * | 2011-12-09 | 2013-06-13 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
Also Published As
Publication number | Publication date |
---|---|
TW535936U (en) | 2003-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9313923B2 (en) | Multi-component heatsink with self-adjusting pin fins | |
US6480382B2 (en) | Cooling device for hard disc | |
US7209354B2 (en) | Ball grid array package with heat sink device | |
JP5165017B2 (en) | Electronic equipment cooling structure | |
US6552906B2 (en) | Radiator for electronic parts, electronic device, electric circuit device, and computer | |
US20070119567A1 (en) | Heat dissipation device | |
US8125782B2 (en) | Heat sink assembly | |
US20060198107A1 (en) | Heat sink assembly | |
US6625025B1 (en) | Component cooling in electronic devices | |
US20050270739A1 (en) | System for efficiently cooling a processor | |
Nguyen et al. | Use of heat pipe/heat sink for thermal management of high performance CPUs | |
US7085134B2 (en) | Dual fan heat sink | |
US7038911B2 (en) | Push-pull dual fan fansink | |
US7382615B2 (en) | Heat dissipation device | |
US20060215364A1 (en) | Heatsink for high-power microprocessors | |
US7254029B2 (en) | Printed circuit board with a heat dissipation device | |
US6913069B2 (en) | Cooling device having fins arranged to funnel air | |
JP2009193350A (en) | Electronic device | |
US20020162645A1 (en) | Heatsink assembly having stabilzation plate | |
US9870973B2 (en) | Cooling device and device | |
US20060076121A1 (en) | Heat sink | |
US20050111196A1 (en) | Fastening structure of heat sink | |
US7019969B2 (en) | Dual fan heat sink with flow directors | |
JPH1168360A (en) | Cooling structure for semiconductor element | |
JP6371245B2 (en) | Thermally conductive member, cooling structure and apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: QUANTA COMPUTER, INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, CHIH-CHONG;HUANG, GUO-MING;CHAN, HUNG-CHU;AND OTHERS;REEL/FRAME:011856/0994 Effective date: 20010510 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |