US20020193058A1 - Polishing apparatus that provides a window - Google Patents
Polishing apparatus that provides a window Download PDFInfo
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- US20020193058A1 US20020193058A1 US10/150,666 US15066602A US2002193058A1 US 20020193058 A1 US20020193058 A1 US 20020193058A1 US 15066602 A US15066602 A US 15066602A US 2002193058 A1 US2002193058 A1 US 2002193058A1
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- Prior art keywords
- polishing pad
- underlay
- polishing
- window
- recited
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
Definitions
- the invention relates to a polishing pad apparatus that provides a window in a polishing pad.
- U.S. Pat. No. 6,045,439 discloses a polishing pad apparatus including, a polishing pad mounted on a polishing platen of a polishing machine.
- An adhesive such as, a pressure sensitive adhesive, adheres the polishing pad to the polishing platen.
- Successive layers of the polishing pad such as, a polishing layer of the polishing pad and one or more sublayers of the polishing pad, adhere to one another by additional adhesive.
- the machine revolves the polishing platen and the polishing pad, and dispenses a polishing fluid onto the polishing pad.
- the polishing pad and the polishing fluid polish a semiconductor substrate, which removes material from the semiconductor substrate, and which provides a smooth, planar polished surface on the semiconductor substrate.
- the polishing pad of the apparatus is adapted with a transparent window.
- the window is framed by an opening through the polishing pad.
- An optical beam is transmitted from an optical detector apparatus, through a rear of the window, to reflect from the surface of the semiconductor substrate.
- the optical beam monitors the surface of the semiconductor substrate, as the substrate is being polished.
- the optical beam is reflected, and transmits through the window for detection by the optical detector apparatus.
- polishing pad apparatus One of the problems associated with such a polishing pad apparatus is, that the polishing fluid seeps behind the polishing pad, and obstructs a rear surface of the window, which contributes to undesired attenuation of the optical beam. Another problem is, that the adhesion strength of the adhesive is reduced when the adhesive becomes wet by leaking polishing fluid, which weakens the adhesion of the polishing pad to the polishing platen, and which weakens the adhesion of successive layers of the polishing pad.
- polishing fluid will seep through a polishing pad that is designed to be wetted with the polishing fluid. Further, the polishing fluid will seep through an unsealed peripheral edge of the polishing pad. Further, the polishing fluid will seep through a leaking seam between the window and the opening. Manufacturing processes have been required to cut and fit the window to the opening, and to apply a sealant material in the seam, or alternatively, to mold both the window and the polishing pad simultaneously to join them together at the seam.
- a fluid impermeable layer is provided to span across a polishing layer and a window in an opening through the polishing layer.
- the fluid impermeable layer is provided with an adhesive forming a bond seal with the polishing layer and a rear surface of the window.
- the bond seal is a source for fluid seepage.
- the optical beam transmits through a first interface at the bond layer and the fluid impermeable layer, and successively through a second interface at the bond layer and a rear surface of the window. Such interfaces tend to attenuate the optical beam. It would be advantageous to eliminate such interfaces.
- the invention provides a polishing pad apparatus having, a polishing pad, an optically transmissive window framed by an opening through the polishing pad, the window being part of an underlay that is unitary with the window, and the underlay having a perimeter that extends substantially beyond the perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by polishing fluid and from obstruction by the underlay.
- FIG. 1 is a top view of a polishing pad, reduced in size.
- FIG. 1A is an isometric view of a polishing pad in the form of a continuous belt that is adapted to be mounted on a polishing platen of belt configuration.
- FIG. 2 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having an opening, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another, duplicate polishing pad
- FIG. 2A is a view similar to FIG. 2, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
- FIG. 2B is a fragmentary, enlarged side view of an underlay of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window of solid structure.
- FIG. 2C is a view similar to FIG. 2B, and disclosing an underlay of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window substantially coplanar with the thickness of the underlay.
- FIG. 3 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
- FIG. 3A is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and, the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
- FIG. 3B is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and a protruding lip on the underlay provides a seal at an edge of the sublayer.
- FIG. 3C is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose an underlay adapted for mounting on a polishing platen, and further wherein, the underlay has a window that is substantially coplanar with the thickness of a remainder of the underlay.
- FIG. 4 is a fragmentary enlarged side view of an underlay having a window that is fabricated as a hollow structure.
- FIG. 4A is a fragmentary enlarged side view of an underlay having a window that is fabricated as a solid structure.
- FIG. 4B is a fragmentary enlarged side view of an underlay having a window, and further disclosing the window as a nonprojecting structure that is coplanar with the thickness of a remainder of the underlay.
- FIG. 4C is a fragmentary enlarged side view of an underlay having a window, and further disclosing underlay having a projecting lip that forms a seal.
- FIGS. 1 and 1A discloses a polishing pad 2 having at least a top layer 4 for polishing a semiconductor substrate, an opening 5 through the top layer 4 , and an optically transmissive window 6 framed by the opening 5 .
- the size of the opening 5 is limited, to occupy a small portion of the top layer 4 , which minimizes any difference in the entirety of the polishing activity provided by the polishing layer 4 .
- Each polishing pad 2 has a perimeter 2 a , with the polishing pad 2 of belt configuration having a perimeter 2 a along each of the continuous edges of the belt configuration.
- FIGS. 2, 2A, 2 B, 2 C, 3 , 3 A, 3 B and 3 C discloses a corresponding embodiment of a polishing pad apparatus 1 that includes, a polishing pad 2 adapted to be mounted on a polishing platen 3 of a known polishing machine.
- the known polishing machine performs a known polishing operation, according to which, the polishing pad 2 is revolved by the known polishing machine.
- the polishing pad is accompanied by a polishing fluid to polish a semiconductor substrate that is held by the known polishing machine.
- the semiconductor substrate includes, and is not limited to, for example, a wafer of silicon, a magnetic storage disk, an optical storage disk, and a semiconductor wafer patterned with conducting circuit interconnects.
- the opening 5 passes over an optical beam of a known optical detector.
- the window 6 is adapted to align directly with an opening 3 a through the polishing platen 3 .
- An optical beam of the known optical detector transmits through the opening 3 a , and through the window 6 to reflect from a surface of a semiconductor substrate being polished by the polishing pad 2 . Reflection of the optical beam transmits the optical beam in a reverse direction through the window 6 and through the opening 3 a for monitoring by the known optical detector. Further details are disclosed by U.S. Pat. No. 6,045,439, incorporated by reference herein.
- each corresponding embodiment includes a polishing pad 2 having a top layer 4 that projects beyond the window 6 .
- the top layer 4 polishes a semiconductor substrate, and is known as a polishing layer of the polishing pad 2 .
- the window 6 being recessed, avoids contact with the semiconductor substrate, as the top layer 4 contacts the semiconductor substrate during the polishing operation.
- polishing fluid Prior to the invention, polishing fluid would seep behind the top layer 4 , to obstruct a rear surface 6 a of the window 6 , which contributed to attenuation of an optical beam.
- the polishing fluid would seep through the top layer 4 , when the top layer 4 is designed to be wetted with the polishing fluid. Further, the polishing fluid would seep through an unsealed peripheral edge 2 a of the polishing pad 2 .
- the polishing pad 2 included a sublayer 7 , as disclosed by FIGS. 2A, 3A and 3 B, beneath the polishing layer 4 , fluid would seep through an unsealed edge 7 b of the sublayer 7 .
- manufacturing processes Prior to the invention, manufacturing processes have been required to cut and fit the window 6 to the opening 5 , and to apply a sealant material in a seam 5 a that is between the window 6 and the opening 5 .
- manufacturing processes have been required to mold both the window 6 and the polishing pad 2 simultaneously to join them together at the seam 5 a .
- polishing fluid would seep through leaks that would develop in the sealed seam 5 a.
- Each embodiment of the invention provides a polishing pad apparatus 1 having an optically transmissive window 6 framed by an opening 5 through a polishing pad 2 , which apparatus 1 isolates the rear surface 6 a of the window 6 from obstruction by polishing fluid.
- the window 6 is part of an underlay 8 .
- the underlay 8 is unitary with a perimeter 6 b of the window 6 .
- the unitary underlay 8 and window 6 eliminate the need for an adhesive bond seal between the underlay 8 and the window 6 , which bond seal would be a source for fluid seepage. Further, because the underlay 8 joins the perimeter 6 b of the window 6 , the rear surface of the window 6 is free of an interface with the underlay 8 .
- the underlay 8 has a perimeter 8 a that extends substantially beyond the perimeter 6 b of the window 6 to encompass a large area within its perimeter 8 a .
- the perimeter 8 a extends to the perimeter 2 a of the pad 2 disclosed by FIG. 1.
- the perimeter 8 a extends to at least one perimeter 8 a of the pad 2 of belt configuration disclosed by FIG. 1A.
- the perimeter 8 a extends to each perimeter 8 a of the pad 2 of belt configuration disclosed by FIG. 1A.
- the underlay 8 is fabricated and combined with the polishing pad apparatus 1 in a manner to form a fluid impermeable layer that isolates the rear surface 6 a of the window 6 from obstruction by polishing fluid that would otherwise seep behind the polishing pad 2 .
- An adhesive layer 10 or an adhesive layer 12 attaches to the underlayer 8 .
- Another adhesive layer 9 attaches to a rear surface of the underlayer 8 .
- Either one or more than one of the adhesive layers 9 , 10 and 12 against the underlayer 8 provides a corresponding seal extending substantially beyond the perimeter 6 b of the window, which isolates the rear surface 6 a of the window 6 from obstruction by the polishing fluid.
- the underlay 8 is fabricated from an hydrophobic material, such a material by itself repels polishing fluid, and isolates the rear surface 6 a of the window 6 from obstruction by the polishing fluid.
- FIGS. 2, 2A, 2 B and 2 C discloses a corresponding embodiment of a polishing pad apparatus 1 wherein, the underlay 8 is part of the polishing platen 3 .
- the polishing platen 3 is circular for mounting the circular polishing pad 2 disclosed by FIG. 1, or the polishing platen 3 is of belt configuration for mounting the polishing pad 2 of belt configuration disclosed by FIG. 1A.
- the underlay 8 has an adhesive layer 9 on a rear surface of the underlay 8 .
- the adhesive layer 9 has an opening 9 a adapted to be in alignment with an opening 3 a through the polishing platen 3 .
- the adhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape.
- a rear surface of the polishing pad 2 has an adhesive layer 10 with an opening 10 a adapted to be in alignment with the opening 5 .
- a rear surface of the adhesive layer 10 is covered by a removable covering film 11 that initially adheres to and covers the adhesive layer 10 , and is peeled from the adhesive layer 10 , as depicted by the arrow, which exposes the adhesive layer 10 for attachment removably to the underlay 8 .
- the adhesive layer 10 is provided with hollow air transmitting pathways, which pathways allow escape of air that would tend to be entrapped under the adhesive layer 10 .
- the adhesive layer 10 as well as other adhesive layers described herein, have such air transmitting pathways as further disclosed in detail by U.S. patent application Ser. No. 09/660,798 incorporated by reference herein.
- Each of the other adhesive layers 9 and 12 is provided with corresponding, hollow air transmitting pathways.
- the pad 2 and the adhesive layer 10 are removable from the underlay 8 for replacement by another, duplicate polishing pad 2
- the underlay 8 remains as part of the polishing platen 3 , and is easily cleaned in preparation for assembly of a replacement pad 2 .
- the underlay 8 itself is removable, together with the adhesive layer 9 , for replacement by a duplicate underlay 8 .
- the polishing pad 2 is expected to be replaced more frequently than the underlay 8 .
- the adhesive layer 10 is advantageously soluble in a solvent that assists in removal and cleaning of the adhesive layer 10 from the underlay 8 .
- the adhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of the underlay 8 on the polishing platen 3 .
- the embodiment disclosed by FIG. 2A further includes, the polishing pad 2 having the top layer 4 assembled over and on a sublayer 7 .
- the sublayer 7 has an opening 7 a in alignment with the opening 5 . Together, the opening 7 a and the opening 5 combine to provide a composite opening through the polishing pad 2 .
- the adhesive layer 10 attaches the top layer 4 to the sublayer 7 .
- a rear surface of the sublayer 7 has an adhesive layer 12 with an opening 12 a in alignment with the opening 5 .
- the adhesive layer 12 is covered by the removable covering film 11 that is peeled from the adhesive layer 12 , as depicted by the arrow, which exposes the adhesive layer 12 for attachment removably to the underlay 8 .
- the window 6 has a projecting height sufficient to project into both the opening 7 a the opening 5 .
- a seal 7 b is provided at a peripheral edge of the sublayer 7 .
- the seal 7 b includes, but is not limited to, for example, a heat seal, a pressure embossed seal, and a waterproof coating.
- the seal 7 b resists seepage of polishing fluid into the peripheral edge 7 b that is a part of the peripheral edge 2 a of the polishing pad 2 . Further details of the seal 7 b are disclosed by U.S. patent application Ser. No. 09/635,877, incorporated herein by reference.
- the pad 2 and the adhesive layer 12 are removable from the underlay 8 for replacement by another, duplicate polishing pad 2 .
- the underlay 8 remains as part of the polishing platen 3 , and is easily cleaned in preparation for assembly of a replacement pad 2 .
- the underlay 8 itself is removable, together with the adhesive layer 9 , for replacement by a duplicate underlay 8 .
- the polishing pad 2 is expected to be replaced more frequently than the underlay 8 .
- the adhesive layer 12 is advantageously soluble in a solvent that assists in removal and cleaning of the adhesive layer 12 from the underlay 8 .
- the adhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of the underlay 8 on the polishing platen 3 .
- FIGS. 2 and 2A includes an embodiment of an underlay 8 wherein, the window 6 is a hollow structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5 , or by the composite of numerals 5 and 7 a .
- FIG. 2B discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 is a solid structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5 , or by the composite of numerals 5 and 7 a .
- FIG. 1 discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 is a solid structure that projects into the opening, as well as being framed by the opening indicated by the numeral 5 , or by the composite of numerals 5 and 7 a .
- 2C discloses a portion of a polishing pad apparatus 1 having an alternative embodiment of the underlay 8 wherein, the window 6 has a thickness that is substantially coplanar with a thickness of a remainder of the underlay 8 , as well as, the window 6 being framed by the opening, as indicated by the numeral 5 , or as indicated by the composite of numerals 5 and 7 a .
- the perimeter 6 b of the window 6 is indicated by a broken line through the thickness of the underlay 8 .
- FIGS. 3, 3A, 3 B and 3 C discloses a corresponding embodiment wherein, the underlay 8 is part of the polishing pad 2 , such that, the underlay 8 and a remainder of the polishing pad 2 are removable from the polishing platen 3 for replacement by another, duplicate polishing pad 2 .
- the polishing pad 2 has an adhesive layer 10 with an opening 10 a adapted to be in alignment with the opening 5 .
- the adhesive layer 10 attaches the top layer 4 of the polishing pad 2 to the underlay 8 .
- the rear surface of the underlay has attached thereto an adhesive layer 9 .
- the adhesive layer 9 has an opening 9 a adapted to be in alignment with both the opening 5 and an opening 3 a through the polishing platen 3 .
- the adhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape.
- FIGS. 3 and 3C discloses a corresponding embodiment wherein, the adhesive layer 9 is covered by the removable covering film 11 that is peeled from the adhesive layer 9 , as depicted by the arrow, which exposes the adhesive layer 9 for attachment of the underlay 8 to the polishing platen 3 .
- FIG. 3 includes the same underlay 8 with a window 6 of hollow structure, as disclosed by FIG. 2.
- the embodiment disclosed by FIG. 3C includes the same underlay 8 with a window 6 of substantially the same thickness as a remainder of the underlay 8 , as disclosed by FIG. 2C.
- FIGS. 3A and 3B discloses a corresponding embodiment wherein, the polishing pad 2 has both the top layer 4 and the underlay 8 assembled on a sublayer 7 .
- the sublayer 7 has an opening 7 a through its thickness.
- the opening 7 a is in alignment with the opening 5 .
- the adhesive layer 9 attaches to the sublayer 7 .
- a rear surface of the sublayer 7 has an adhesive layer 12 with an opening 12 a adapted to be in alignment with the opening 5 .
- the adhesive layer 12 is covered by the removable covering film 11 that is peeled from the adhesive layer 12 , as depicted by the arrow, which exposes the adhesive layer 12 for attachment removably to the underlay 8 .
- a seal 7 b is provided at a peripheral edge of the sublayer 7 .
- the seal 7 b is a unitary projecting lip on the perimeter 8 a on the underlay 8 .
- the lip extends at and over the peripheral edge of the sublayer 7 .
- the window 6 has a projecting height sufficient to project into both the opening 7 a and the opening 5 .
- FIG. 3A includes an underlay 8 having a window 6 of hollow structure, similar to that disclosed by FIG. 2.
- the embodiment disclosed by FIG. 3B includes an underlay 8 having a window 6 of solid structure the same as in the embodiment disclosed by FIG. 2B.
- FIGS. 4, 4A, 4 B and 4 C discloses a corresponding embodiment of the underlay 8 and the window 6 fabricated as a unitary structure.
- the underlay 8 and the window 6 are fabricated by shaping a fluent material, and solidifying the fluent material to a solid phase that is optically transparent.
- the fluent material is shaped in a cavity 13 defined between two, opposed shaping dies 14 , 14 a of a known molding apparatus, or alternatively, a known sintering apparatus.
- the dies 14 , 14 a meet along a parting line 14 b .
- the dies 14 , 14 a fabricate the fluent material into the underlay 8 as a thin layer.
- the dies 14 , 14 a fabricate the window 6 in a window shaped recess 14 c defined between the dies 14 , 14 a .
- the window 6 is vacuum formed, by drawing a reduced atmosphere through an exhaust vent 14 d provided in the shaping die 14 to communicate with the window shaped recess 14 c .
- the dies 14 , 14 a are opened along the parting line 14 b , which allows removal of the underlay 8 and unitary window 6 .
- the fluent material is a melt that is shaped and solidified between the dies 14 , 14 a that are molding dies of a known molding apparatus.
- the fluent material is a powder mixed with a sintering binder that is shaped between the dies 14 , 14 a serving as sintering preforms.
- a sintering binder that is shaped between the dies 14 , 14 a serving as sintering preforms.
- the fluent material is solidified as a sintered material that is optically transparent in the solid phase.
- FIG. 4 discloses an embodiment of the underlay 8 having the window 6 fabricated as a thin and hollow structure.
- the recess 14 c is narrowly spaced from the opposed die 14 a , which defines a relatively thin space in the cavity 13 within which the dies 14 , 14 a fabricate the hollow window 6 .
- FIG. 4A discloses an embodiment of the underlay 8 having the window 6 fabricated as a thick and solid structure.
- the recess 14 c is substantially spaced from the opposed die 14 a , defining a relatively wide space in the cavity 13 within which the dies 14 , 14 a fabricate the solid window 6 from the solidified fluent material.
- FIG. 4B discloses an embodiment of the underlay 8 having the window 6 as a nonprojecting structure.
- the cavity 13 is spaced from the opposed die 14 a the same distance as is a remainder of the cavity 13 within which the dies 14 , 14 a fabricate the window 6 from the solidified fluent material.
- the dies 14 , 14 a fabricate the window 6 with a thickness that is substantially coplanar with the remainder of the underlay 8 .
- FIG. 4C discloses an embodiment of the underlay 8 having a projecting lip 7 b , according to FIG. 3A
- the following materials are suitable for being transmissive of the optical beam of the known optical detector; PET, polyethyleneterapthalate, PE, polyethylene, PP, polypropylene, PU, polyurethane and PVC, polyvinylchloride, could be used in varying thickness of thin sheets.
- the invention further attains a reduced cost of production by eliminating the need for die cutting the shape of the window to interfit with the opening in the pad.
- the invention eliminates the disadvantage of a leaking seal between the window and the opening through the polishing layer 4 of the polishing pad 2 .
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Abstract
A polishing pad apparatus includes, a polishing pad, an optically transmissive window framed by an opening through the polishing pad, the window being part of an underlay, and the underlay having a perimeter that extends substantially beyond the perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by polishing fluid.
Description
- This application claims benefit of U.S. Provisional Patent Application Serial No. 60/298,599 filed Jun. 15, 2001.
- 1. Field of the Invention
- The invention relates to a polishing pad apparatus that provides a window in a polishing pad.
- 2. Related Art
- U.S. Pat. No. 6,045,439 discloses a polishing pad apparatus including, a polishing pad mounted on a polishing platen of a polishing machine. An adhesive, such as, a pressure sensitive adhesive, adheres the polishing pad to the polishing platen. Successive layers of the polishing pad, such as, a polishing layer of the polishing pad and one or more sublayers of the polishing pad, adhere to one another by additional adhesive. The machine revolves the polishing platen and the polishing pad, and dispenses a polishing fluid onto the polishing pad. The polishing pad and the polishing fluid polish a semiconductor substrate, which removes material from the semiconductor substrate, and which provides a smooth, planar polished surface on the semiconductor substrate. Further, the polishing pad of the apparatus is adapted with a transparent window. The window is framed by an opening through the polishing pad. An optical beam is transmitted from an optical detector apparatus, through a rear of the window, to reflect from the surface of the semiconductor substrate. The optical beam monitors the surface of the semiconductor substrate, as the substrate is being polished. The optical beam is reflected, and transmits through the window for detection by the optical detector apparatus.
- One of the problems associated with such a polishing pad apparatus is, that the polishing fluid seeps behind the polishing pad, and obstructs a rear surface of the window, which contributes to undesired attenuation of the optical beam. Another problem is, that the adhesion strength of the adhesive is reduced when the adhesive becomes wet by leaking polishing fluid, which weakens the adhesion of the polishing pad to the polishing platen, and which weakens the adhesion of successive layers of the polishing pad.
- Several sources for fluid seepage exist. The polishing fluid will seep through a polishing pad that is designed to be wetted with the polishing fluid. Further, the polishing fluid will seep through an unsealed peripheral edge of the polishing pad. Further, the polishing fluid will seep through a leaking seam between the window and the opening. Manufacturing processes have been required to cut and fit the window to the opening, and to apply a sealant material in the seam, or alternatively, to mold both the window and the polishing pad simultaneously to join them together at the seam.
- According to WO 01/23141, published PCT application PCT/US00/26652, a fluid impermeable layer is provided to span across a polishing layer and a window in an opening through the polishing layer. The fluid impermeable layer is provided with an adhesive forming a bond seal with the polishing layer and a rear surface of the window. The bond seal is a source for fluid seepage. Further, the optical beam transmits through a first interface at the bond layer and the fluid impermeable layer, and successively through a second interface at the bond layer and a rear surface of the window. Such interfaces tend to attenuate the optical beam. It would be advantageous to eliminate such interfaces.
- A need exists for a polishing pad apparatus having an optically transmissive window framed by an opening through a polishing pad, which apparatus isolates a rear surface of the window from obstruction by polishing fluid.
- The invention provides a polishing pad apparatus having, a polishing pad, an optically transmissive window framed by an opening through the polishing pad, the window being part of an underlay that is unitary with the window, and the underlay having a perimeter that extends substantially beyond the perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by polishing fluid and from obstruction by the underlay.
- Embodiments of the invention will now be described by way of example with reference to the following detailed description taken in conjunction with the accompanying drawings.
- FIG. 1 is a top view of a polishing pad, reduced in size.
- FIG. 1A is an isometric view of a polishing pad in the form of a continuous belt that is adapted to be mounted on a polishing platen of belt configuration.
- FIG. 2 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having an opening, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another, duplicate polishing pad
- FIG. 2A is a view similar to FIG. 2, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
- FIG. 2B is a fragmentary, enlarged side view of an underlay of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window of solid structure.
- FIG. 2C is a view similar to FIG. 2B, and disclosing an underlay of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, adapted for mounting on a polishing platen, with parts of the apparatus broken away to disclose, a window substantially coplanar with the thickness of the underlay.
- FIG. 3 is a fragmentary, enlarged side view of a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad, an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
- FIG. 3A is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and, the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
- FIG. 3B is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose, a polishing pad having a sublayer that is part of the polishing pad, and an underlay having a window, the underlay being adapted for mounting on a polishing platen of a polishing machine, and further wherein, the underlay is a part of the polishing pad, and a protruding lip on the underlay provides a seal at an edge of the sublayer.
- FIG. 3C is a view similar to FIG. 3, and disclosing a polishing pad apparatus, for example, as disclosed by FIG. 1 or by FIG. 1A, with parts of the apparatus broken away to disclose an underlay adapted for mounting on a polishing platen, and further wherein, the underlay has a window that is substantially coplanar with the thickness of a remainder of the underlay.
- FIG. 4 is a fragmentary enlarged side view of an underlay having a window that is fabricated as a hollow structure.
- FIG. 4A is a fragmentary enlarged side view of an underlay having a window that is fabricated as a solid structure.
- FIG. 4B is a fragmentary enlarged side view of an underlay having a window, and further disclosing the window as a nonprojecting structure that is coplanar with the thickness of a remainder of the underlay.
- FIG. 4C is a fragmentary enlarged side view of an underlay having a window, and further disclosing underlay having a projecting lip that forms a seal.
- Each of FIGS. 1 and 1A, discloses a
polishing pad 2 having at least atop layer 4 for polishing a semiconductor substrate, anopening 5 through thetop layer 4, and an opticallytransmissive window 6 framed by theopening 5. The size of theopening 5 is limited, to occupy a small portion of thetop layer 4, which minimizes any difference in the entirety of the polishing activity provided by thepolishing layer 4. Eachpolishing pad 2 has aperimeter 2 a, with thepolishing pad 2 of belt configuration having aperimeter 2 a along each of the continuous edges of the belt configuration. - Each of FIGS. 2, 2A,2B, 2C, 3, 3A, 3B and 3C discloses a corresponding embodiment of a
polishing pad apparatus 1 that includes, apolishing pad 2 adapted to be mounted on a polishingplaten 3 of a known polishing machine. The known polishing machine performs a known polishing operation, according to which, thepolishing pad 2 is revolved by the known polishing machine. The polishing pad is accompanied by a polishing fluid to polish a semiconductor substrate that is held by the known polishing machine. The semiconductor substrate includes, and is not limited to, for example, a wafer of silicon, a magnetic storage disk, an optical storage disk, and a semiconductor wafer patterned with conducting circuit interconnects. - When the
polishing pad 2 is revolved, theopening 5 passes over an optical beam of a known optical detector. Thewindow 6 is adapted to align directly with anopening 3 a through the polishingplaten 3. An optical beam of the known optical detector transmits through theopening 3 a, and through thewindow 6 to reflect from a surface of a semiconductor substrate being polished by thepolishing pad 2. Reflection of the optical beam transmits the optical beam in a reverse direction through thewindow 6 and through theopening 3 a for monitoring by the known optical detector. Further details are disclosed by U.S. Pat. No. 6,045,439, incorporated by reference herein. - Further, each corresponding embodiment includes a
polishing pad 2 having atop layer 4 that projects beyond thewindow 6. During a polishing operation, thetop layer 4 polishes a semiconductor substrate, and is known as a polishing layer of thepolishing pad 2. Thewindow 6, being recessed, avoids contact with the semiconductor substrate, as thetop layer 4 contacts the semiconductor substrate during the polishing operation. - Prior to the invention, polishing fluid would seep behind the
top layer 4, to obstruct arear surface 6 a of thewindow 6, which contributed to attenuation of an optical beam. Several sources for fluid seepage continue to exist. The polishing fluid would seep through thetop layer 4, when thetop layer 4 is designed to be wetted with the polishing fluid. Further, the polishing fluid would seep through an unsealedperipheral edge 2 a of thepolishing pad 2. When thepolishing pad 2 included asublayer 7, as disclosed by FIGS. 2A, 3A and 3B, beneath thepolishing layer 4, fluid would seep through an unsealededge 7 b of thesublayer 7. Prior to the invention, manufacturing processes have been required to cut and fit thewindow 6 to theopening 5, and to apply a sealant material in aseam 5 a that is between thewindow 6 and theopening 5. Alternatively, manufacturing processes have been required to mold both thewindow 6 and thepolishing pad 2 simultaneously to join them together at theseam 5 a. However, polishing fluid would seep through leaks that would develop in the sealedseam 5 a. - Each embodiment of the invention provides a
polishing pad apparatus 1 having an opticallytransmissive window 6 framed by anopening 5 through apolishing pad 2, whichapparatus 1 isolates therear surface 6 a of thewindow 6 from obstruction by polishing fluid. Thewindow 6 is part of anunderlay 8. Theunderlay 8 is unitary with aperimeter 6 b of thewindow 6. Theunitary underlay 8 andwindow 6 eliminate the need for an adhesive bond seal between theunderlay 8 and thewindow 6, which bond seal would be a source for fluid seepage. Further, because theunderlay 8 joins theperimeter 6 b of thewindow 6, the rear surface of thewindow 6 is free of an interface with theunderlay 8. Further, the rear surface of thewindow 6 is without a bond seal between the rear surface of the window and theunderlay 6, which would contribute to attenuation of an optical beam. Theunderlay 8 has aperimeter 8 a that extends substantially beyond theperimeter 6 b of thewindow 6 to encompass a large area within itsperimeter 8 a. In an embodiment, theperimeter 8 a extends to theperimeter 2 a of thepad 2 disclosed by FIG. 1. In another embodiment, theperimeter 8 a extends to at least oneperimeter 8 a of thepad 2 of belt configuration disclosed by FIG. 1A. In another embodiment, theperimeter 8 a extends to eachperimeter 8 a of thepad 2 of belt configuration disclosed by FIG. 1A. - The
underlay 8 is fabricated and combined with thepolishing pad apparatus 1 in a manner to form a fluid impermeable layer that isolates therear surface 6 a of thewindow 6 from obstruction by polishing fluid that would otherwise seep behind thepolishing pad 2. Anadhesive layer 10 or anadhesive layer 12 attaches to theunderlayer 8. Anotheradhesive layer 9 attaches to a rear surface of theunderlayer 8. Either one or more than one of theadhesive layers underlayer 8 provides a corresponding seal extending substantially beyond theperimeter 6 b of the window, which isolates therear surface 6 a of thewindow 6 from obstruction by the polishing fluid. When theunderlay 8 is fabricated from an hydrophobic material, such a material by itself repels polishing fluid, and isolates therear surface 6 a of thewindow 6 from obstruction by the polishing fluid. - Each of FIGS. 2, 2A,2B and 2C discloses a corresponding embodiment of a
polishing pad apparatus 1 wherein, theunderlay 8 is part of the polishingplaten 3. The polishingplaten 3 is circular for mounting thecircular polishing pad 2 disclosed by FIG. 1, or the polishingplaten 3 is of belt configuration for mounting thepolishing pad 2 of belt configuration disclosed by FIG. 1A. Theunderlay 8 has anadhesive layer 9 on a rear surface of theunderlay 8. Theadhesive layer 9 has anopening 9 a adapted to be in alignment with anopening 3 a through the polishingplaten 3. For example, theadhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape. - As disclosed by FIG. 2, a rear surface of the
polishing pad 2 has anadhesive layer 10 with anopening 10 a adapted to be in alignment with theopening 5. A rear surface of theadhesive layer 10 is covered by aremovable covering film 11 that initially adheres to and covers theadhesive layer 10, and is peeled from theadhesive layer 10, as depicted by the arrow, which exposes theadhesive layer 10 for attachment removably to theunderlay 8. - The
adhesive layer 10 is provided with hollow air transmitting pathways, which pathways allow escape of air that would tend to be entrapped under theadhesive layer 10. Theadhesive layer 10, as well as other adhesive layers described herein, have such air transmitting pathways as further disclosed in detail by U.S. patent application Ser. No. 09/660,798 incorporated by reference herein. Each of the otheradhesive layers - When the
polishing pad 2 becomes worn out from polishing, thepad 2 and theadhesive layer 10 are removable from theunderlay 8 for replacement by another,duplicate polishing pad 2 Theunderlay 8 remains as part of the polishingplaten 3, and is easily cleaned in preparation for assembly of areplacement pad 2. - The
underlay 8 itself is removable, together with theadhesive layer 9, for replacement by aduplicate underlay 8. Thepolishing pad 2 is expected to be replaced more frequently than theunderlay 8. Theadhesive layer 10 is advantageously soluble in a solvent that assists in removal and cleaning of theadhesive layer 10 from theunderlay 8. Theadhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of theunderlay 8 on the polishingplaten 3. - The embodiment disclosed by FIG. 2A further includes, the
polishing pad 2 having thetop layer 4 assembled over and on asublayer 7. Thesublayer 7 has anopening 7 a in alignment with theopening 5. Together, theopening 7 a and theopening 5 combine to provide a composite opening through thepolishing pad 2. Theadhesive layer 10 attaches thetop layer 4 to thesublayer 7. A rear surface of thesublayer 7 has anadhesive layer 12 with anopening 12 a in alignment with theopening 5. Theadhesive layer 12 is covered by theremovable covering film 11 that is peeled from theadhesive layer 12, as depicted by the arrow, which exposes theadhesive layer 12 for attachment removably to theunderlay 8. Thewindow 6 has a projecting height sufficient to project into both theopening 7 a theopening 5. Aseal 7 b is provided at a peripheral edge of thesublayer 7. Theseal 7 b includes, but is not limited to, for example, a heat seal, a pressure embossed seal, and a waterproof coating. Theseal 7 b resists seepage of polishing fluid into theperipheral edge 7 b that is a part of theperipheral edge 2 a of thepolishing pad 2. Further details of theseal 7 b are disclosed by U.S. patent application Ser. No. 09/635,877, incorporated herein by reference. - With reference to the embodiment disclosed by FIG. 2A, when the
polishing pad 2 becomes worn out from polishing, thepad 2 and theadhesive layer 12 are removable from theunderlay 8 for replacement by another,duplicate polishing pad 2. Theunderlay 8 remains as part of the polishingplaten 3, and is easily cleaned in preparation for assembly of areplacement pad 2. Theunderlay 8 itself is removable, together with theadhesive layer 9, for replacement by aduplicate underlay 8. For this embodiment, thepolishing pad 2 is expected to be replaced more frequently than theunderlay 8. Theadhesive layer 12 is advantageously soluble in a solvent that assists in removal and cleaning of theadhesive layer 12 from theunderlay 8. Theadhesive layer 9 is advantageously insoluble in such a solvent, which promotes retention of theunderlay 8 on the polishingplaten 3. - Each of the embodiments disclosed by FIGS. 2 and 2A includes an embodiment of an
underlay 8 wherein, thewindow 6 is a hollow structure that projects into the opening, as well as being framed by the opening indicated by thenumeral 5, or by the composite ofnumerals polishing pad apparatus 1 having an alternative embodiment of theunderlay 8 wherein, thewindow 6 is a solid structure that projects into the opening, as well as being framed by the opening indicated by thenumeral 5, or by the composite ofnumerals polishing pad apparatus 1 having an alternative embodiment of theunderlay 8 wherein, thewindow 6 has a thickness that is substantially coplanar with a thickness of a remainder of theunderlay 8, as well as, thewindow 6 being framed by the opening, as indicated by thenumeral 5, or as indicated by the composite ofnumerals perimeter 6 b of thewindow 6 is indicated by a broken line through the thickness of theunderlay 8. - Each of FIGS. 3, 3A,3B and 3C discloses a corresponding embodiment wherein, the
underlay 8 is part of thepolishing pad 2, such that, theunderlay 8 and a remainder of thepolishing pad 2 are removable from the polishingplaten 3 for replacement by another,duplicate polishing pad 2. Thepolishing pad 2 has anadhesive layer 10 with anopening 10 a adapted to be in alignment with theopening 5. For each the embodiments disclosed by FIGS. 3, 3A and 3B, theadhesive layer 10 attaches thetop layer 4 of thepolishing pad 2 to theunderlay 8. The rear surface of the underlay has attached thereto anadhesive layer 9. Theadhesive layer 9 has anopening 9 a adapted to be in alignment with both theopening 5 and anopening 3 a through the polishingplaten 3. For example, theadhesive layer 9 is an adhesive tape with adhesive on opposite sides of the tape. - Each of FIGS. 3 and 3C discloses a corresponding embodiment wherein, the
adhesive layer 9 is covered by theremovable covering film 11 that is peeled from theadhesive layer 9, as depicted by the arrow, which exposes theadhesive layer 9 for attachment of theunderlay 8 to the polishingplaten 3. - The embodiment disclosed by FIG. 3 includes the
same underlay 8 with awindow 6 of hollow structure, as disclosed by FIG. 2. The embodiment disclosed by FIG. 3C includes thesame underlay 8 with awindow 6 of substantially the same thickness as a remainder of theunderlay 8, as disclosed by FIG. 2C. - Each of FIGS. 3A and 3B discloses a corresponding embodiment wherein, the
polishing pad 2 has both thetop layer 4 and theunderlay 8 assembled on asublayer 7. Thesublayer 7 has anopening 7 a through its thickness. Theopening 7 a is in alignment with theopening 5. Together, theopening 7 a and theopening 5 combine to provide a composite opening through thepolishing pad 2. Theadhesive layer 9 attaches to thesublayer 7. A rear surface of thesublayer 7 has anadhesive layer 12 with anopening 12 a adapted to be in alignment with theopening 5. Theadhesive layer 12 is covered by theremovable covering film 11 that is peeled from theadhesive layer 12, as depicted by the arrow, which exposes theadhesive layer 12 for attachment removably to theunderlay 8. Aseal 7 b is provided at a peripheral edge of thesublayer 7. For this embodiment, theseal 7 b is a unitary projecting lip on theperimeter 8 a on theunderlay 8. The lip extends at and over the peripheral edge of thesublayer 7. Thewindow 6 has a projecting height sufficient to project into both theopening 7 a and theopening 5. - The embodiment disclosed by FIG. 3A includes an
underlay 8 having awindow 6 of hollow structure, similar to that disclosed by FIG. 2. The embodiment disclosed by FIG. 3B includes anunderlay 8 having awindow 6 of solid structure the same as in the embodiment disclosed by FIG. 2B. - Each of FIGS. 4, 4A,4B and 4C discloses a corresponding embodiment of the
underlay 8 and thewindow 6 fabricated as a unitary structure. For example, theunderlay 8 and thewindow 6 are fabricated by shaping a fluent material, and solidifying the fluent material to a solid phase that is optically transparent. The fluent material is shaped in acavity 13 defined between two, opposed shaping dies 14, 14 a of a known molding apparatus, or alternatively, a known sintering apparatus. The dies 14, 14 a meet along aparting line 14 b. The dies 14, 14 a fabricate the fluent material into theunderlay 8 as a thin layer. Further, the dies 14, 14 a fabricate thewindow 6 in a window shapedrecess 14 c defined between the dies 14, 14 a. Alternatively, as disclosed by FIG. 4, thewindow 6 is vacuum formed, by drawing a reduced atmosphere through anexhaust vent 14 d provided in the shaping die 14 to communicate with the window shapedrecess 14 c. Following solidification of the fluent material between the dies 14, 14 a, the dies 14, 14 a are opened along theparting line 14 b, which allows removal of theunderlay 8 andunitary window 6. Alternatively, the fluent material is a melt that is shaped and solidified between the dies 14, 14 a that are molding dies of a known molding apparatus. Alternatively, the fluent material is a powder mixed with a sintering binder that is shaped between the dies 14, 14 a serving as sintering preforms. During a known heat sintering operation the powder binds to itself, and the binder is driven off by heat. The fluent material is solidified as a sintered material that is optically transparent in the solid phase. - FIG. 4 discloses an embodiment of the
underlay 8 having thewindow 6 fabricated as a thin and hollow structure. Therecess 14 c is narrowly spaced from the opposed die 14 a, which defines a relatively thin space in thecavity 13 within which the dies 14, 14 a fabricate thehollow window 6. - FIG. 4A discloses an embodiment of the
underlay 8 having thewindow 6 fabricated as a thick and solid structure. Therecess 14 c is substantially spaced from the opposed die 14 a, defining a relatively wide space in thecavity 13 within which the dies 14, 14 a fabricate thesolid window 6 from the solidified fluent material. - FIG. 4B discloses an embodiment of the
underlay 8 having thewindow 6 as a nonprojecting structure. Thecavity 13 is spaced from the opposed die 14 a the same distance as is a remainder of thecavity 13 within which the dies 14, 14 a fabricate thewindow 6 from the solidified fluent material. The dies 14, 14 a fabricate thewindow 6 with a thickness that is substantially coplanar with the remainder of theunderlay 8. - FIG. 4C discloses an embodiment of the
underlay 8 having a projectinglip 7 b, according to FIG. 3A The following materials are suitable for being transmissive of the optical beam of the known optical detector; PET, polyethyleneterapthalate, PE, polyethylene, PP, polypropylene, PU, polyurethane and PVC, polyvinylchloride, could be used in varying thickness of thin sheets. - The invention further attains a reduced cost of production by eliminating the need for die cutting the shape of the window to interfit with the opening in the pad. The invention eliminates the disadvantage of a leaking seal between the window and the opening through the
polishing layer 4 of thepolishing pad 2.
Claims (50)
1. A polishing pad apparatus comprising: a polishing pad for polishing a semiconductor substrate with a polishing fluid, an optically transmissive window framed by an opening through the polishing pad, the window being part of an underlay that is unitary with the window, and the underlay having a perimeter that extends substantially beyond the perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by polishing fluid and from obstruction by the underlay.
2. A polishing pad apparatus as recited in claim 1 wherein, the underlay is fabricated from a hydrophobic material.
3. A polishing pad apparatus as recited in claim 1 wherein, the window projects outwardly of a remainder of the underlay and within the opening.
4. A polishing pad apparatus as recited in claim 1 wherein, the window projects within the opening, and a seam between the window and the opening is sealed.
5. A polishing pad apparatus as recited in claim 1 wherein, the window projects within the opening, and a seam between the window and the opening is unsealed.
6. A polishing pad apparatus as recited in claim 1 , and further comprising: the underlay having a first contact adhesive that attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that removably attaches the polishing pad to the underlay.
7. A polishing pad apparatus as recited in claim 1 , and further comprising: the underlay having a first contact adhesive that removably attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that permanently attaches the polishing pad to the underlay.
8. A polishing pad apparatus as recited in claim 1 wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another polishing pad.
9. A polishing pad apparatus as recited in claim 1 wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad removable from the polishing platen for replacement by another polishing pad.
10. A polishing pad apparatus as recited in claim 1 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
11. A polishing pad apparatus as recited in claim 1 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
12. A polishing pad apparatus as recited in claim 1 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, the underlay having a projecting lip that forms the seal at the edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
13. A polishing pad apparatus, comprising: a polishing pad having at least a top layer for polishing a semiconductor substrate with a polishing fluid, an opening through the top layer, and an optically transmissive window framed by the opening, and further wherein, the window is part of an underlay that is unitary with the window, and the underlay extends substantially from the window and substantially beyond the perimeter of the window to form an uninterrupted and continuous, fluid impermeable layer that isolates a rear surface of the window from obstruction by the underlay and from obstruction by the polishing fluid.
14. A polishing pad apparatus as recited in claim 13 wherein, the underlay is fabricated from a hydrophobic material.
15. A polishing pad apparatus as recited in claim 13 wherein, the window projects outwardly of a remainder of the underlay and within the opening.
16. A polishing pad apparatus as recited in claim 13 wherein, the window projects within the opening, and a seam between the window and the opening is sealed.
17. A polishing pad apparatus as recited in claim 13 wherein, the window projects within the opening, and a seam between the window and the opening is unsealed.
18. A polishing pad apparatus as recited in claim 13 , and further comprising: the underlay having a first contact adhesive that attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that removably attaches the polishing pad to the underlay.
19. A polishing pad apparatus as recited in claim 13 , and further comprising: the underlay having a first contact adhesive that removably attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that permanently attaches the polishing pad to the underlay.
20. A polishing pad apparatus as recited in claim 13 wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another polishing pad.
21. A polishing pad apparatus as recited in claim 13 wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
22. A polishing pad apparatus as recited in claim 13 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
23. A polishing pad apparatus as recited in claim 13 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
24. A polishing pad apparatus as recited in claim 13 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, the underlay having a projecting lip that forms the seal at the edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
25. A polishing pad apparatus, comprising: a polishing pad having at least a top layer for polishing a semiconductor substrate with a polishing fluid, an opening through the top layer, and an optically transmissive window framed by the opening, and further wherein, the window is part of an underlay, a perimeter of the underlay extends substantially beyond a perimeter of the window to form a fluid impermeable layer that isolates a rear surface of the window from obstruction by the polishing fluid.
26. A polishing pad apparatus as recited in claim 25 wherein, the underlay is fabricated from a hydrophobic material.
27. A polishing pad apparatus as recited in claim 25 wherein, the window projects outwardly of a remainder of the underlay and within the opening.
28. A polishing pad apparatus as recited in claim 25 wherein, the window projects within the opening, and a seam between the window and the opening is sealed.
29. A polishing pad apparatus as recited in claim 25 wherein, the window projects within the opening, and a seam between the window and the opening is unsealed.
30. A polishing pad apparatus as recited in claim 25 , and further comprising: the underlay having a first contact adhesive that attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that removably attaches the polishing pad to the underlay.
31. A polishing pad apparatus as recited in claim 25 , and further comprising: the underlay having a first contact adhesive that removably attaches underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that permanently attaches the polishing pad to the underlay.
32. A polishing pad apparatus as recited in claim 25 wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another polishing pad.
33. A polishing pad apparatus as recited in claim 25 wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
34. A polishing pad apparatus as recited in claim 25 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
35. A polishing pad apparatus as recited in claim 25 , and further comprising: the polishing pad having a sublayer, and further wherein, the underlay has a projecting lip providing a seal at the edge of the sublayer.
36. A polishing pad apparatus as recited in claim 25 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
37. A polishing pad apparatus as recited in claim 25 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, the underlay having a projecting lip that forms the seal at the edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
38. A polishing pad apparatus, comprising: a polishing pad having at least a top layer for polishing a semiconductor substrate with a polishing fluid, an opening through the top layer, and an optically transmissive window framed by opening, and further wherein, the window is part of an underlay that is unitary with the window, the underlay having an adhesive thereon, and a perimeter of the underlay having the adhesive thereon extends substantially beyond a perimeter of the window to form an uninterrupted and continuous, fluid impermeable layer that isolates a rear surface of the window from obstruction by the polishing fluid.
39. A polishing pad apparatus as recited in claim 38 wherein, the underlay is fabricated from a hydrophobic material.
40. A polishing pad apparatus as recited in claim 38 wherein, the window projects outwardly of a remainder of the underlay and within the opening.
41. A polishing pad apparatus as recited in claim 38 wherein, the window projects within the opening, and a seam between the window and the opening is sealed.
42. A polishing pad apparatus as recited in claim 38 wherein, the window projects within the opening, and a seam between the window and the opening is unsealed.
43. A polishing pad apparatus as recited in claim 38 , and further comprising: the underlay having a first contact adhesive that attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that removably attaches the polishing pad to the underlay.
44. A polishing pad apparatus as recited in claim 38 , and further comprising: the underlay having a first contact adhesive that removably attaches the underlay to a polishing platen of a polishing machine, and the polishing pad having a second contact adhesive that permanently attaches the polishing pad to the underlay.
45. A polishing pad apparatus as recited in claim 38 wherein, the underlay is part of the polishing platen, and the polishing pad is removable from the underlay for replacement by another polishing pad.
46. A polishing pad apparatus as recited in claim 38 wherein, the underlay is part of the polishing pad, and the underlay and a remainder of the polishing are removable from the polishing platen for replacement by another polishing pad.
47. A polishing pad apparatus as recited in claim 38 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing platen, and the sublayer and a remainder of the polishing pad are removable from the underlay for replacement by another polishing pad.
48. A polishing pad apparatus as recited in claim 38 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
49. A polishing pad apparatus as recited in claim 38 , and further comprising: the polishing pad having a sublayer that is part of the polishing pad, a seal at an edge of the sublayer, the underlay having a projecting lip that forms the seal at the edge of the sublayer, and further wherein, the underlay is a part of the polishing pad, and the underlay and a remainder of the polishing pad are removable from the polishing platen for replacement by another polishing pad.
50. A polishing pad apparatus as recited in claim 38 , and further comprising: the polishing pad having a sublayer, and further wherein, the underlay has a projecting lip providing a seal at the edge of the sublayer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US10/150,666 US20020193058A1 (en) | 2001-06-15 | 2002-05-16 | Polishing apparatus that provides a window |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US29859901P | 2001-06-15 | 2001-06-15 | |
US10/150,666 US20020193058A1 (en) | 2001-06-15 | 2002-05-16 | Polishing apparatus that provides a window |
Publications (1)
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US20020193058A1 true US20020193058A1 (en) | 2002-12-19 |
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US10/150,666 Abandoned US20020193058A1 (en) | 2001-06-15 | 2002-05-16 | Polishing apparatus that provides a window |
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US (1) | US20020193058A1 (en) |
WO (1) | WO2002102547A1 (en) |
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US20100099344A1 (en) * | 2008-10-17 | 2010-04-22 | Darrell String | Chemical mechanical polishing pad having sealed window |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US20140242893A1 (en) * | 2013-02-26 | 2014-08-28 | Robert Bosch Gmbh | Abrasive Device |
US20150004888A1 (en) * | 2002-07-24 | 2015-01-01 | Applied Materials, Inc. | Polishing pad with two-section window having recess |
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2002
- 2002-05-16 US US10/150,666 patent/US20020193058A1/en not_active Abandoned
- 2002-05-16 WO PCT/US2002/015405 patent/WO2002102547A1/en not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US6261155B1 (en) * | 1997-05-28 | 2001-07-17 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6254459B1 (en) * | 1998-03-10 | 2001-07-03 | Lam Research Corporation | Wafer polishing device with movable window |
US6464576B1 (en) * | 1999-08-31 | 2002-10-15 | Rodel Holdings Inc. | Stacked polishing pad having sealed edge |
US6454630B1 (en) * | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
US6358130B1 (en) * | 1999-09-29 | 2002-03-19 | Rodel Holdings, Inc. | Polishing pad |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150004888A1 (en) * | 2002-07-24 | 2015-01-01 | Applied Materials, Inc. | Polishing pad with two-section window having recess |
US20100099344A1 (en) * | 2008-10-17 | 2010-04-22 | Darrell String | Chemical mechanical polishing pad having sealed window |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US20140242893A1 (en) * | 2013-02-26 | 2014-08-28 | Robert Bosch Gmbh | Abrasive Device |
Also Published As
Publication number | Publication date |
---|---|
WO2002102547A1 (en) | 2002-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: RODEL HOLDINGS, INC., DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FOSTER, STEPHEN P.;BAKER, ARTHUR RICHARD III;JACOBS, JR., JON D.;AND OTHERS;REEL/FRAME:012925/0258 Effective date: 20010615 |
|
STCB | Information on status: application discontinuation |
Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION |