US20030021158A1

US20030021158A1 - Load modulation device in a remotely powered integration circut

Info

Publication number: US20030021158A1
Application number: US10/009,101
Authority: US
Inventors: Bertrand Gomez
Original assignee: STMicroelectronics SA; Gemplus SA
Current assignee: STMicroelectronics SA; Gemplus SA
Priority date: 2000-04-05
Filing date: 2001-04-02
Publication date: 2003-01-30
Also published as: FR2807586A1; AU4667201A; WO2001075784A1; US6667914B2; FR2807586B1; CN1222908C; CN1383523A; EP1190376A1

Abstract

A load modulation device in a remotely powered integrated circuit includes an oscillating circuit, and a voltage device for regenerating first and second power supply voltages. The voltage device includes at least one MOS transistor in a well on at least one terminal of the oscillating circuit. The at least MOS transistor includes a source or drain connected to the at least one terminal. A bias circuit biases the well to the first or second power supply voltage based upon a modulation signal.

Description

The present invention relates to a load modulation device in a remotely powered integrated circuit.

Such a device provides data transmission between a remotely powered integrated circuit and a reader, source of an electromagnetic field, by making the equivalent load of the integrated circuit to vary, as seen from the reader.

This invention is notably applied to contactless chip cards and to electronic labels or tags.

In such applications, an oscillating circuit of the LC type for example, is used for regenerating the power supply and transmitting data between the card and the reader. The oscillating circuit may be partly or totally integrated into the integrated circuit or offset on the outside.

The oscillating circuit placed in an electromagnetic field delivers at its terminals an alternating signal with the same frequency as the signal emitted by the reader. The amplitude of this voltage signal is maximum when the resonant frequency of the oscillating circuit is equal to the emission frequency of the reader.

An integrated circuit for such applications usually comprises a circuit for rectifying the alternating signal provided by the oscillating circuit. The function of the rectifier circuit is to connect this alternating voltage to a continuous load, matching the load of the logic circuits of the integrated circuit. In other words, this rectifier circuit converts the power supply alternating voltage into a DC voltage for powering the logic circuitry of the integrated circuit.

The load modulation then consists of making the impedance of the tuning circuit, as seen from the reader, to vary according to the data to be transmitted.

The integrated circuit comprises for this purpose a load modulation circuit, controlled by a modulation logical signal delivered by a data transmission stage of the integrated circuit. The load modulation circuit generally consists of one or more transistors connected between the output pads of the oscillating circuit and controlled by the modulation logic signal.

FIG. 1 illustrates a first exemplary embodiment of a load modulation circuit in a remotely power integrated circuit.

This integrated circuit comprises conventionally, an

oscillating circuit

1 which delivers an alternating voltage signal between its terminals A and B; a rectifier circuit 2 for this alternating voltage signal in order to provide DC power supply voltages Vdd and Gnd to the logic circuitry 3 of the integrated circuit. In the example, the rectifier circuit is provided with a diode bridge D0, D1, D2, D3 and the logic circuitry is illustrated by its equivalent load, with a resistor Re and a capacitor Ce parallel-mounted between supply voltages Vdd and Gnd.

The load modulation circuit of the oscillating circuit is controlled by a modulation binary signal, marked as mod, delivered by a data transmission stage ED provided in the

logical circuitry

3, not shown.

The

load modulation circuit

4 comprises a switching transistor Tm1, controlled by the modulation signal mod on its gate. In the example, this is an N type MOS transistor, connected between a modulation node Nm and the power supply voltage Gnd. The load modulation circuit 4 further comprises two insulation transistors, one per terminal of the oscillating circuit, which protect the switching transistor Tm1 against too high voltages. So, there is an insulation transistor Ti1 connected between the terminal A and the node Nm and an insulation transistor Ti2 connected between terminal B and node Nm. In the example, both of them are N type MOS transistors. Each one is mounted as a diode with its gate and drain connected together.

When the switching transistor Tm 1 is driven by the modulation binary signal mod into the off or blocked state, it is equivalent to a high value resistor which is marked as rdsoff. When the switching transistor is driven into the on or conducting state, it is equivalent to a low value resistor which is marked as rdson. The difference between resistors rdsoff and rdson generates the load variation. The working angular pulsation of the oscillating circuit 1 remains unchanged.

FIG. 2 illustrates another exemplary embodiment of the

load modulation circuit

4. In this example, the load modulation circuit comprises a capacitor Cm and a switching transistor Tm2 connected in series between terminals A and B. In the example, the switching transistor is an N type MOS transistor. It receives the modulation binary signal, mod, on its gate. According to the binary level of the signal mod, the switching transistor Tm2 puts or does not put capacitor Cm in parallel on the oscillating circuit. Depending on whether the capacitor Cm is actually put in parallel, the capacitor load and the working pulsation of the oscillating circuit are changed.

These load modulation circuit examples from the state of the art, have in common that they require the connection of extra components on the oscillating circuit, which come and interfere with the quality factor of this circuit. The quality factor is understood as the overvoltage at its terminals at the circuit's oscillation frequency. The current load due to extra components, reduces the overvoltage and therefore the efficiency of the oscillating circuit.

In addition, extra components bring about a cost overrun in terms of implantation area on the integrated circuit. They should actually be able to withstand large voltage changes on the terminals of the oscillating circuit, which may attain 10 to 100 volts.

An object of the invention is a load modulation device in a remotely powered circuit which does not have these different drawbacks.

The idea at the basis of the invention is to use the parasitic drain/substrate diode or source/substrate diode of MOS transistors that are implemented in a well. According to the invention, by applying the modulation to the well of a MOS transistor that is connected through its drain or its source to a terminal of the oscillating circuit, the parasitic drain/well diode or source/well diode may become conductive, which has the effect of pulling the considered terminal up to a given voltage level, which amounts to modifying the load of the oscillating circuit, as seen from the reader.

As characterized, the invention therefore relates to a load modulation device in a remotely powered integrated circuit, a device for regenerating a first and a second power supply voltage of said circuit comprising an oscillating circuit and at least one MOS transistor produced in a well, on at least one terminal of the oscillating circuit, the drain or the source of said transistor being connected to the said at least one terminal, characterized in that the modulation device comprises means for biasing said well to the first or the second power supply voltage according to the level of a modulation binary signal.

Other features or advantages of the invention are detailed in the following description of the invention, made in an indicative and non-limiting way, and with reference to the appended drawings wherein: [0020]
FIGS. 1 and 2, already described, each illustrate a remotely powered integrated circuit comprising a load modulation circuit according to the state of the art; [0021]
FIG. 3 illustrates a remotely powered integrated circuit comprising a load modulation circuit according to a first exemplary embodiment of the invention; [0022]
FIG. 4 illustrates an alternative of the load modulation circuit illustrated in FIG. 3; [0023]
FIG. 5 illustrates a remotely powered integrated circuit comprising a load modulation circuit according to another exemplary embodiment of the invention; and [0024]
FIG. 6 illustrates an electronic system using remotely powered integrated circuits.[0025]
In the figures, the same components bear the same references. [0026]
As illustrated in FIG. 6, an [0027] electronic system 10 for an application of the chip card, electronic label or tags type, comprises a reader 11 providing i.a. the remote power supply for chip cards or electronic labels 12 by emission of an electromagnetic field B. These chip cards or electronic labels 12 comprise an integrated circuit of the remotely powered type 13.
The remotely powered integrated circuit illustrated in FIG. 3 comprises, as in the previous figures, a device for power supply regeneration comprising an [0028] oscillating circuit 1 and a rectifier circuit 2, electronic circuitry 3 powered by the regenerated power supply voltages Vdd and Gnd and a load modulation circuit 4 of the oscillating circuit.
In the example, the rectifier circuit has a diode bridge structure matching the structure D[0029] 0, D1, D2, D3 illustrated in FIG. 1. In FIG. 3, these diodes are each produced by a MOS transistor mounted as a diode, with gate and drain connected together.
More specifically, diode D[0030] 0 is produced by a N type MOS transistor M1, the source s of which is connected to the power supply voltage Gnd and the gate g and drain d are connected together to terminal A. Also, diode D1 is produced by a N type MOS transistor, M1, the source s of which is connected to the power supply voltage Gnd and the gate g and drain d are connected together to terminal B. Diode D2 is produced by a P type MOS transistor M2, the source s of which is connected to the power supply voltage Vdd and the gate g and drain d are connected together to terminal A. Diode D3 is produced by a P type, MOS transistor, M3, the source s of which is connected to the power supply voltage Vdd and the gate g and drain d are connected together to terminal B.
Usually, the substrate or the well of a transistor is biased to a suitable voltage, generally to the source voltage, in order to prevent the parasitic diodes drain/substrate or drain/well and source/substrate or source/well from conducting, so that leaks may be avoided in the transistor. This bias is embodied in the figures by a “bulk” bias connection, between the channel of the transistor and its source. [0031]
In an example of MOS technology on a P substrate, the N MOS transistors are made in the P substrate and the P MOS transistors are made in N wells. [0032]
It is possible to have a different bias for each well, according to needs, while the bias of the substrate is the same for the whole integrated circuit. [0033]
In the invention, the bias of the well is used in order to maintain the parasitic diode of the well of a MOS transistor which connected to a terminal of the oscillating circuit in the nonconducting state or to cause it to conduct. In this way, if it is the drain of this transistor which is connected to a terminal of the oscillating circuit, this terminal may be pulled up to the well bias voltage which causes the associated parasitic diode to conduct. The equivalent load of the oscillating circuit is thus changed, as seen from the reader. [0034]
If the example illustrated in FIG. 3 is considered, in a MOS technology on P substrate, P MOS transistors M[0035] 2 and M3 are produced in a well, preferably in the same well. The drain of each of these transistors is connected to a terminal of the oscillating circuit.
The [0036] load modulation circuit 4 according to the invention, then comprises means driven by a modulation binary signal mod, for changing the well bias voltage of these transistors M2 and M3. In the example, these means consist of an inverter comprising a P MOS transistor T2 and a N MOS transistor T1 connected between the power supply voltages Vdd and Gnd, the gates of which are connected together and receive the modulation binary signal mod and the drains of which are connected together and provide the output S of the inverter, connected to the well bias connection bkp.
If the modulation binary signal is “1”, it is the transistor T[0037] 1 of the load modulation circuit which is conducting. The output S is pulled down to the power supply voltage Gnd. Thus, according to the level of the alternating signal on terminals A and B of the oscillating circuit, at least one parasitic drain/well diode is conducting, pulling the associated terminal to the power supply voltage Gnd.
If the modulation binary signal is “0”, it is the transistor T[0038] 2 of the load modulation circuit which is conducting. Output S is pulled up to the power supply voltage Vdd. The well of transistors M2 and M3 is then biased to the power supply voltage Vdd and no drain/well diode is conducting.
Transistor T[0039] 1 is dimensioned in order to pull down the well bias connection to the power supply voltage Gnd, more or less rapidly, according to the desired modulation index.
In an alternative illustrated in FIG. 3, a resistive component Rm is provided in series between the transistor T[0040] 1 and the power supply voltage Gnd, which also provides for matching the modulation index of the circuit 4. In practice, this resistive component may be produced by a pure resistor (diffusion, polysilicon, for example) or by an equivalent circuit, for example a transistor circuit.
In FIG. 4, a dual solution of the one illustrated in FIG. 3 is shown, which corresponds to an integrated circuit produced on a N type substrate. In this example, the N MOS transistors are produced in P type wells. These wells are normally biased at the power supply voltage Gnd, typically by their source. The load modulation circuit according to the invention then enables either the well of transistors M[0041] 0 and M1, to be normally biased to the power supply voltage Gnd, or to be biased to the power supply voltage Vdd according to the modulation binary signal mod. In this example, the output S of the load modulation circuit is connected to the well bias connection bkn of transistors M0 and M1. If it comprises a matching resistor Rm′ for the modulation index, this resistor is then provided between the power supply voltage Vdd and transistor T2, in order to raise the output S of the circuit to the power supply voltage Vdd, more or less rapidly.
Another example of a remotely powered integrated circuit with a load modulation circuit according to the invention is illustrated in FIG. 4. The difference with the solution illustrated in FIG. 3 lies in that the MOS transistors of the [0042] rectifier circuit 2 are mounted differently. In this example, transistors M0 and M2 form a first inverter, with their gates connected together on terminal A and their drains connected together on terminal B. Transistors M1 and M3 form another inverter with their gates connected together on terminal B and their drains connected together on terminal A. So a rectifier structure is obtained with inverters with input/output feedback on terminals A and B of the oscillating circuit, for regenerating power supply voltages Vdd and Gnd.
In this example, the load modulation circuit according to the invention is applied in the same way as in FIG. 3. For transistors M[0043] 2 and M3, produced in N wells, the well bias connection is connected to the output of the load modulation circuit, which has the same structure as in FIG. 3.
The invention may also be applied to configurations of the device for regenerating power supply voltages Vdd and Gnd, wherein there would be a transistor produced in a well connected through its source to a terminal of the oscillating circuit. In this well, it is the well source diode which allows the modulation according to the invention, to be applied. [0044]
It will also be noted that the load modulation circuit according to the invention preferably comprises at least one well transistor per terminal of the oscillating circuit. [0045]
However, it may include a well transistor on only one terminal even if the efficiency of the load modulation circuit is lower in this well. [0046]
More generally, as on at least one terminal of the oscillating circuit, at least one MOS transistor produced in a well has its drain or source connected to the relevant terminal, a load modulation circuit according to the invention may be provided in order to change the well bias voltage according to the modulation binary signal mod. [0047]
It will be noted that it is not very important whether the MOS transistors M[0048] 2 and M3 of FIGS. 3 and 5 are each produced in a separate or in a same well. The same remark applies to transistors M0 and M1 of FIG. 4.
The load modulation device according to the invention, is particularly easy to implement and does not add any load onto the oscillating circuit. [0049]
Thus, the quality factor of the oscillating circuit is the same with or without modulation. In addition, the [0050] load modulation circuit 4 does not have to withstand large voltage differences which may occur on the terminals of the oscillating circuits. It is therefore of smaller dimensions, resulting in substantial savings in silicon surface area for the integrated circuit. If, as illustrated in FIGS. 3-5, the integrated circuit comprises an insulating device 5 connected between the power supply output Vdd of the rectifier circuit 2 and the matching input on the internal circuits 3, the load modulation circuit 4 will be placed upstream, between the rectifier circuit 2 and the insulating device 5.

Claims

1. A load modulation device in a remotely powered integrated circuit including a device for regenerating a first and second power supply voltage (Vdd, Gnd) comprising an oscillating circuit (1) and at least one MOS transistor (M2, M3) produced in a well on at least one terminal (A, B) of the oscillating circuit, the drain or the source of said transistor being connected to said terminal, characterized in that the modulation device comprises means (4) for biasing the well of said transistor to the first or the second power supply voltage (Vdd, Gnd) according to the level of a modulation binary signal (mod).

2. The load modulation device according to claim 1, comprising more than one well transistor (M2, M3), characterized in that said transistors are produced in a well of a same type (P).

3. The load modulation device according to claim 1 or 2, characterized in that the transistor(s) are transistors from a voltage rectifier circuit (2) connected between terminals (A, B) of the oscillating circuit (1) and which provides at the output the first and second power supply voltages (Vdd, Gnd).

4. The load modulation device according to any of the preceding claims, characterized in that the biasing means (4) comprise an inverter connected between the first and second power supply voltage (Vdd, Gnd), the control input (E) of which receives the modulation logic signal (mod) provided by a data transmission stage (ED) of the integrated circuit, and the output (S) of which is connected to the well bias connection (bkp) of the transistor(s).

5. The load modulation device according to claim 4, characterized in that the inverter comprises a first transistor (T2) for pulling the output (S) up to the level of the power supply voltage (Vdd) able to block the drain/well diode or the source/well diode and a second transistor (T1) for pulling the output down to the level of the other power supply voltage (Gnd), able to cause the relevant diode to conduct, the dimensions of said second transistor depending on the desired modulation index.

6. The load modulation device according to claim 5, characterized in that the biasing means further comprise a resistive component (Rm) connected between said second transistor (T1) and the associated power supply voltage (Gnd), the resistivity of this component depending on the desired modulation index.

7. A remotely powered integrated circuit comprising a load modulation device according to any of the preceding claims.

8. A chip card or electronic label comprising an integrated circuit according to claim 7.

9. An electronic system comprising a reader providing a remote power supply for chip cards or electronic labels according to claim 8.