US20030052396A1 - Semiconductor device and method of making the same - Google Patents
Semiconductor device and method of making the same Download PDFInfo
- Publication number
- US20030052396A1 US20030052396A1 US10/246,126 US24612602A US2003052396A1 US 20030052396 A1 US20030052396 A1 US 20030052396A1 US 24612602 A US24612602 A US 24612602A US 2003052396 A1 US2003052396 A1 US 2003052396A1
- Authority
- US
- United States
- Prior art keywords
- package
- polyamide
- housing
- semiconductor device
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to sealing of a semiconductor device in which a semiconductor package and a housing containing the semiconductor package are formed of different synthetic resins. More particularly, the present invention relates to a semiconductor device in which a housing is formed of thermoplastic resin (a first synthetic resin) and a semiconductor package is formed of thermosetting epoxy resin (a second synthetic resin), and a method of making the same.
- thermosetting epoxy resin which is a raw material of the semiconductor package
- thermoplastic resin which is a raw material of the housing
- a semiconductor device has been made by a method different from insert molding.
- a housing 51 having a connector terminal 50 is provided.
- the connector terminal 50 is preformed by injection molding in a predetermined position of the housing 51 .
- a surface of the package 52 that abuts against the housing 51 has an adhesive agent applied thereon.
- the connecting portion 52 a of the package 52 is placed in contact with the connector terminal 50 , the package 52 is fixed to the housing 51 .
- a space 53 in the housing 51 is filled with a sealant 54 such as liquid epoxy and silicone to seal the package 52 .
- the above-mentioned manufacturing method in which the package 52 is sealed with the sealant 54 , requires more steps (i.e. three steps) compared to the manufacturing method by insert molding: a step of making the housing 51 having the connector terminal 50 , a step of adhering the package 52 to the housing 51 , and a step of filling the housing 51 with the sealant 54 . This complicates the manufacturing process as well as increases the manufacturing costs of the semiconductor device.
- An object of the invention is to provide a semiconductor device that is easy to manufacture and has excellent moisture resistance.
- Another object of the invention is to provide a semiconductor device that holds down its manufacturing costs.
- the semiconductor device includes a housing and a semiconductor package.
- the housing is formed of a first synthetic resin that is a thermoplastic resin.
- the semiconductor package is formed of a second synthetic resin that is a thermosetting resin.
- the package is sealed in the housing.
- the package has a modified face that has adhesive properties to the first synthetic resin. The modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.
- the present invention also provides a method of making a semiconductor device.
- the method includes steps of: UV-irradiating a semiconductor package formed of thermosetting epoxy resin to modify its surface to be adhesive to polyamide; placing the package in a die; and filling a space in the die with melted polyamide or a melted thermoplastic resin including polyamide to seal the package by insert molding.
- FIG. 1A is a schematic plan view of a semiconductor device.
- FIG. 1B is a schematic cross-sectional view of the semiconductor device taken along the line B-B of the FIG. 1A.
- FIG. 2 is a schematic cross-sectional view showing insert molding during the manufacturing process of the semiconductor device.
- FIG. 3A is a schematic cross-sectional view showing a conventional manufacturing process before the sealant is applied.
- FIG. 3B is a schematic cross-sectional view showing a conventional manufacturing process after the sealant is applied.
- FIGS. 1 and 2 An embodiment of the present invention is described with reference to FIGS. 1 and 2 hereinafter.
- a semiconductor device 11 includes a housing 12 .
- the housing 12 is generally rectangular solid in shape and formed of thermoplastic resin.
- the housing 12 is formed of polyamide (PA).
- PA polyamide
- a semiconductor package 13 is sealed in the housing 12 .
- the package 13 is generally rectangular solid in shape and formed of thermosetting epoxy resin.
- the surface 13 a of the package 13 is modified by UV irradiation. Specifically, the modified face 13 a of the package 13 has adhesive properties to the polyamide.
- a plurality (two in this embodiment) of connector terminals 14 extend from the package 13 in parallel. Each terminal 14 extends out of the housing 12 with one end of each terminal being sealed in the housing 12 together with the package 13 .
- the package 13 is formed of thermosetting epoxy resin by a conventional method.
- the overall surface of the package 13 is irradiated by ultraviolet rays. This modifies the surface of the package 13 to be adhesive to polyamide.
- the package 13 is then placed in a die 20 .
- the die 20 includes an upper die 20 a and a lower die 20 b .
- the dies 20 a , 20 b have a cavity that faces to each other so that a space 15 is defined in the die 20 when the dies 20 a , 20 b are positioned properly.
- the dies 20 a , 20 b have a semi-cylindrical recess at their opposing end.
- the two recesses forms cylindrical holes 20 c .
- the internal diameter of the holes 20 c is designed to be approximately the same as the external diameter of the terminals 14 .
- thermoplastic resin PA in this embodiment
- PA melted thermoplastic resin
- the housing 12 is insert molded.
- the temperature at which the thermoplastic resin melts is lower than or the same as the temperature at which IC chips (not shown) in the package 13 shows heat resistance.
- the upper and lower dies 20 a , 20 b are opened.
- the housing 12 is formed with the package 13 and a part of the terminals 14 sealed. The semiconductor device 11 is completed.
- the semiconductor device 11 can be manufactured in one step by insert molding. In other words, conventionally required steps: a step of performing a housing only, a step of adhering the package to the housing, and a step of filling the housing with the sealant, are abbreviated. Thus, the number of manufacturing steps is reduced and the semiconductor device 11 can be easily and inexpensively produced.
- the surface of the package 13 is UV-irradiated and modified to have adhesive properties to polyamide.
- the modified face 13 a ensures the adhesiveness between the housing 12 and the package 13 . Thus, and invasion of moisture from the gap between the terminal 14 and the housing 12 is prevented (and the integrity of the semiconductor device 11 is maintained). Thus, conventional problems, such as leaks or shorts, are avoided.
- a single polyamide is used as a thermoplastic resin. This improves the adhesive properties between the package 13 and the housing 12 compared with those when a polymer alloy of polyamide and another resin is used.
- the thermoplastic resin that forms the housing 12 is not limited to single PA.
- a resin of polymer alloy of PA and PPS polyphenylene sulfide
- the combination of PPS with PA improves heat resistance, dimensional stability, and low water absorption rate of the semiconductor device 11 compared with single PA, while keeping the adhesive properties between the package 13 and the housing 12 .
- a resin of polymer alloy of PA and PBT may also be used.
- PBT polybutylene telephthalate
- the combination of PBT with PA improves low water absorption rate and abrasion resistance compared with single PA.
- the terminal 14 may be a male connector.
- the number of the terminal 14 is not limited to two but may be one or more than two.
- the shape of the housing 12 and the package 13 is not limited to generally rectangular solid but may be varied in any suitable form.
Abstract
Description
- The present invention relates to sealing of a semiconductor device in which a semiconductor package and a housing containing the semiconductor package are formed of different synthetic resins. More particularly, the present invention relates to a semiconductor device in which a housing is formed of thermoplastic resin (a first synthetic resin) and a semiconductor package is formed of thermosetting epoxy resin (a second synthetic resin), and a method of making the same.
- Semiconductor devices are sometimes made by insert molding by using thermoplastic resin to seal the semiconductor package made of thermosetting epoxy resin in the housing. However, thermosetting epoxy resin, which is a raw material of the semiconductor package, and thermoplastic resin, which is a raw material of the housing, have different reactions to heat. Thus, the adhesive properties between the two resins become poor after cooling and a gap may generate between them. In such a semiconductor device, problems such as a leak or a short may occur due to moisture that comes in from the gap between the package and the housing in certain circumstances.
- To prevent this, a semiconductor device has been made by a method different from insert molding. First, as shown in FIG. 3A, a
housing 51 having aconnector terminal 50 is provided. Theconnector terminal 50 is preformed by injection molding in a predetermined position of thehousing 51. When asemiconductor package 52 is placed in thehousing 51, a surface of thepackage 52 that abuts against thehousing 51 has an adhesive agent applied thereon. After the connectingportion 52 a of thepackage 52 is placed in contact with theconnector terminal 50, thepackage 52 is fixed to thehousing 51. Next, as shown in FIG. 3B, aspace 53 in thehousing 51 is filled with asealant 54 such as liquid epoxy and silicone to seal thepackage 52. - The above-mentioned manufacturing method, in which the
package 52 is sealed with thesealant 54, requires more steps (i.e. three steps) compared to the manufacturing method by insert molding: a step of making thehousing 51 having theconnector terminal 50, a step of adhering thepackage 52 to thehousing 51, and a step of filling thehousing 51 with thesealant 54. This complicates the manufacturing process as well as increases the manufacturing costs of the semiconductor device. - An object of the invention is to provide a semiconductor device that is easy to manufacture and has excellent moisture resistance.
- Another object of the invention is to provide a semiconductor device that holds down its manufacturing costs.
- To achieve the foregoing and other objectives and in accordance with the purpose of the present invention, a semiconductor device is provided. The semiconductor device includes a housing and a semiconductor package. The housing is formed of a first synthetic resin that is a thermoplastic resin. The semiconductor package is formed of a second synthetic resin that is a thermosetting resin. The package is sealed in the housing. The package has a modified face that has adhesive properties to the first synthetic resin. The modified face is formed on a surface of the package by UV-irradiating the surface before the sealing of the package in the housing.
- The present invention also provides a method of making a semiconductor device. The method includes steps of: UV-irradiating a semiconductor package formed of thermosetting epoxy resin to modify its surface to be adhesive to polyamide; placing the package in a die; and filling a space in the die with melted polyamide or a melted thermoplastic resin including polyamide to seal the package by insert molding.
- Other aspects and advantages of the invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- The invention, together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
- FIG. 1A is a schematic plan view of a semiconductor device.
- FIG. 1B is a schematic cross-sectional view of the semiconductor device taken along the line B-B of the FIG. 1A.
- FIG. 2 is a schematic cross-sectional view showing insert molding during the manufacturing process of the semiconductor device.
- FIG. 3A is a schematic cross-sectional view showing a conventional manufacturing process before the sealant is applied.
- FIG. 3B is a schematic cross-sectional view showing a conventional manufacturing process after the sealant is applied.
- An embodiment of the present invention is described with reference to FIGS. 1 and 2 hereinafter.
- As shown in FIGS. 1A and 1B, a
semiconductor device 11 includes ahousing 12. Thehousing 12 is generally rectangular solid in shape and formed of thermoplastic resin. In this embodiment, thehousing 12 is formed of polyamide (PA). As shown in FIG. 1B, asemiconductor package 13 is sealed in thehousing 12. Thepackage 13 is generally rectangular solid in shape and formed of thermosetting epoxy resin. Thesurface 13 a of thepackage 13 is modified by UV irradiation. Specifically, the modifiedface 13 a of thepackage 13 has adhesive properties to the polyamide. A plurality (two in this embodiment) ofconnector terminals 14 extend from thepackage 13 in parallel. Eachterminal 14 extends out of thehousing 12 with one end of each terminal being sealed in thehousing 12 together with thepackage 13. - A manufacturing process of the above-mentioned
semiconductor device 11 is described with reference to FIG. 2. - First, the
package 13 is formed of thermosetting epoxy resin by a conventional method. Next, the overall surface of thepackage 13 is irradiated by ultraviolet rays. This modifies the surface of thepackage 13 to be adhesive to polyamide. - The
package 13 is then placed in a die 20. The die 20 includes anupper die 20 a and a lower die 20 b . Thedies 20 a, 20 b have a cavity that faces to each other so that aspace 15 is defined in the die 20 when thedies 20 a, 20 b are positioned properly. Thedies 20 a, 20 b have a semi-cylindrical recess at their opposing end. When theupper die 20 a is positioned on the lower die 20 b, the two recesses formscylindrical holes 20 c. The internal diameter of theholes 20 c is designed to be approximately the same as the external diameter of theterminals 14. When thepackage 13 is placed in the die 20 in a predetermined position, theterminals 14 that extend from thepackage 13 is guided through theholes 20 c out of the die 20. - Then, melted thermoplastic resin (PA in this embodiment) is poured through a
gate 20 d provided in the upper die 20 a into thespace 15. Thus, thehousing 12 is insert molded. The temperature at which the thermoplastic resin melts is lower than or the same as the temperature at which IC chips (not shown) in thepackage 13 shows heat resistance. After the thermoplastic resin poured into thespace 15 is cooled and hardened, the upper and lower dies 20 a, 20 b are opened. As shown in FIG. 1B, thehousing 12 is formed with thepackage 13 and a part of theterminals 14 sealed. Thesemiconductor device 11 is completed. - The above-mentioned embodiment has following advantages.
- The
semiconductor device 11 can be manufactured in one step by insert molding. In other words, conventionally required steps: a step of performing a housing only, a step of adhering the package to the housing, and a step of filling the housing with the sealant, are abbreviated. Thus, the number of manufacturing steps is reduced and thesemiconductor device 11 can be easily and inexpensively produced. - The surface of the
package 13 is UV-irradiated and modified to have adhesive properties to polyamide. The modifiedface 13 a ensures the adhesiveness between thehousing 12 and thepackage 13. Thus, and invasion of moisture from the gap between the terminal 14 and thehousing 12 is prevented (and the integrity of thesemiconductor device 11 is maintained). Thus, conventional problems, such as leaks or shorts, are avoided. - A single polyamide is used as a thermoplastic resin. This improves the adhesive properties between the
package 13 and thehousing 12 compared with those when a polymer alloy of polyamide and another resin is used. - It should be apparent to those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention. Particularly, it should be understood that the invention may be embodied in the following forms.
- The thermoplastic resin that forms the
housing 12 is not limited to single PA. For example, a resin of polymer alloy of PA and PPS (polyphenylene sulfide) may be used. The combination of PPS with PA improves heat resistance, dimensional stability, and low water absorption rate of thesemiconductor device 11 compared with single PA, while keeping the adhesive properties between thepackage 13 and thehousing 12. - A resin of polymer alloy of PA and PBT (polybutylene telephthalate) may also be used. The combination of PBT with PA improves low water absorption rate and abrasion resistance compared with single PA.
- The terminal14 may be a male connector.
- The number of the terminal14 is not limited to two but may be one or more than two.
- The shape of the
housing 12 and thepackage 13 is not limited to generally rectangular solid but may be varied in any suitable form. - Therefore, the present examples and embodiments are to be considered as illustrative and not restrictive and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalence of the appended claims.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/204,502 US7588962B2 (en) | 2001-09-20 | 2008-09-04 | Method of making semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-287076 | 2001-09-20 | ||
JP2001287076A JP4620303B2 (en) | 2001-09-20 | 2001-09-20 | Semiconductor device and manufacturing method thereof |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/204,502 Division US7588962B2 (en) | 2001-09-20 | 2008-09-04 | Method of making semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030052396A1 true US20030052396A1 (en) | 2003-03-20 |
Family
ID=19109943
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/246,126 Abandoned US20030052396A1 (en) | 2001-09-20 | 2002-09-18 | Semiconductor device and method of making the same |
US12/204,502 Expired - Fee Related US7588962B2 (en) | 2001-09-20 | 2008-09-04 | Method of making semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/204,502 Expired - Fee Related US7588962B2 (en) | 2001-09-20 | 2008-09-04 | Method of making semiconductor device |
Country Status (3)
Country | Link |
---|---|
US (2) | US20030052396A1 (en) |
EP (1) | EP1296371A3 (en) |
JP (1) | JP4620303B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104471364A (en) * | 2012-07-16 | 2015-03-25 | 株式会社电装 | Electronic device and method for manufacturing same |
US9517532B2 (en) | 2013-12-09 | 2016-12-13 | Denso Corporation | Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body |
US10395947B2 (en) | 2014-02-27 | 2019-08-27 | Denso Corporation | Manufacturing method of a resin molded article |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4620303B2 (en) | 2001-09-20 | 2011-01-26 | 株式会社東海理化電機製作所 | Semiconductor device and manufacturing method thereof |
DE102007051870A1 (en) * | 2007-10-30 | 2009-05-07 | Robert Bosch Gmbh | Module housing and method for producing a module housing |
JP2010071724A (en) * | 2008-09-17 | 2010-04-02 | Mitsubishi Electric Corp | Resin molded semiconductor sensor and method of manufacturing the same |
JP5038273B2 (en) * | 2008-09-17 | 2012-10-03 | 三菱電機株式会社 | Resin molded semiconductor sensor and manufacturing method |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4788583A (en) * | 1986-07-25 | 1988-11-29 | Fujitsu Limited | Semiconductor device and method of producing semiconductor device |
US5519177A (en) * | 1993-05-19 | 1996-05-21 | Ibiden Co., Ltd. | Adhesives, adhesive layers for electroless plating and printed circuit boards |
US5641997A (en) * | 1993-09-14 | 1997-06-24 | Kabushiki Kaisha Toshiba | Plastic-encapsulated semiconductor device |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US5874784A (en) * | 1995-10-25 | 1999-02-23 | Sharp Kabushiki Kaisha | Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor |
US20010033722A1 (en) * | 2000-04-19 | 2001-10-25 | Takeshi Okada | Optoelectronic module |
US20020024439A1 (en) * | 2000-06-21 | 2002-02-28 | Wakahiro Kawai | Coin-shaped IC tag and method of manufacturing the same |
US20020030258A1 (en) * | 1996-07-12 | 2002-03-14 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
US20020037143A1 (en) * | 2000-08-07 | 2002-03-28 | Yoshiki Kuhara | Optical communication device |
US20020195744A1 (en) * | 1999-12-06 | 2002-12-26 | Yusuke Otsuki | Mold release film for sealing semiconductor element and sealing method for semiconductor element using it |
US6605343B1 (en) * | 1999-02-22 | 2003-08-12 | Sekisui Chemical Co., Ltd. | Composite material and synthetic sleeper using the composite material |
US6607825B1 (en) * | 1995-12-26 | 2003-08-19 | Ibiden Co., Ltd. | Metal film bonded body, bonding agent layer and bonding agent |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3689311A (en) | 1970-11-06 | 1972-09-05 | Ler Son Co Inc | Method for external coating of cylindrical objects |
JPS63102246U (en) * | 1986-12-22 | 1988-07-02 | ||
JP2701045B2 (en) * | 1988-07-15 | 1998-01-21 | 東レ・ダウコーニング・シリコーン株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
JP2701072B2 (en) * | 1989-06-20 | 1998-01-21 | 東レ・ダウコーニング・シリコーン株式会社 | Resin-sealed optical coupling semiconductor device and method of manufacturing the same |
WO1990000814A1 (en) * | 1988-07-15 | 1990-01-25 | Toray Silicone Co., Ltd. | Semiconductor device sealed with resin and a method of producing the same |
JPH07196898A (en) * | 1993-12-28 | 1995-08-01 | Kanebo Ltd | Thermoplastic resin composition |
JPH0878582A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | Semiconductor device and manufacture of semiconductor |
JPH10212365A (en) * | 1996-11-29 | 1998-08-11 | Mitsui Chem Inc | Resin molding and its production |
JPH1135915A (en) * | 1997-07-15 | 1999-02-09 | Toray Ind Inc | Resin-sealed semiconductor device |
JPH11254476A (en) * | 1998-03-13 | 1999-09-21 | Mitsubishi Eng Plast Corp | Production of resin-sealed molded product of electric/ electronic part |
JPH11254477A (en) * | 1998-03-13 | 1999-09-21 | Mitsubishi Eng Plast Corp | Production of resin-sealed molded product of electric/ electronic part |
US6274927B1 (en) * | 1999-06-03 | 2001-08-14 | Amkor Technology, Inc. | Plastic package for an optical integrated circuit device and method of making |
US6643919B1 (en) * | 2000-05-19 | 2003-11-11 | Siliconware Precision Industries Co., Ltd. | Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame |
US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
JP4620303B2 (en) | 2001-09-20 | 2011-01-26 | 株式会社東海理化電機製作所 | Semiconductor device and manufacturing method thereof |
-
2001
- 2001-09-20 JP JP2001287076A patent/JP4620303B2/en not_active Expired - Fee Related
-
2002
- 2002-09-16 EP EP02020768A patent/EP1296371A3/en not_active Withdrawn
- 2002-09-18 US US10/246,126 patent/US20030052396A1/en not_active Abandoned
-
2008
- 2008-09-04 US US12/204,502 patent/US7588962B2/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4788583A (en) * | 1986-07-25 | 1988-11-29 | Fujitsu Limited | Semiconductor device and method of producing semiconductor device |
US5519177A (en) * | 1993-05-19 | 1996-05-21 | Ibiden Co., Ltd. | Adhesives, adhesive layers for electroless plating and printed circuit boards |
US5641997A (en) * | 1993-09-14 | 1997-06-24 | Kabushiki Kaisha Toshiba | Plastic-encapsulated semiconductor device |
US5874784A (en) * | 1995-10-25 | 1999-02-23 | Sharp Kabushiki Kaisha | Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor |
US6607825B1 (en) * | 1995-12-26 | 2003-08-19 | Ibiden Co., Ltd. | Metal film bonded body, bonding agent layer and bonding agent |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US20020030258A1 (en) * | 1996-07-12 | 2002-03-14 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
US6605343B1 (en) * | 1999-02-22 | 2003-08-12 | Sekisui Chemical Co., Ltd. | Composite material and synthetic sleeper using the composite material |
US20020195744A1 (en) * | 1999-12-06 | 2002-12-26 | Yusuke Otsuki | Mold release film for sealing semiconductor element and sealing method for semiconductor element using it |
US20010033722A1 (en) * | 2000-04-19 | 2001-10-25 | Takeshi Okada | Optoelectronic module |
US20020024439A1 (en) * | 2000-06-21 | 2002-02-28 | Wakahiro Kawai | Coin-shaped IC tag and method of manufacturing the same |
US20020037143A1 (en) * | 2000-08-07 | 2002-03-28 | Yoshiki Kuhara | Optical communication device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104471364A (en) * | 2012-07-16 | 2015-03-25 | 株式会社电装 | Electronic device and method for manufacturing same |
US20150158221A1 (en) * | 2012-07-16 | 2015-06-11 | Denso Corporation | Electronic device and method for manufacturing the same |
US9789637B2 (en) * | 2012-07-16 | 2017-10-17 | Denso Corporation | Electronic device and method for manufacturing the same |
US9517532B2 (en) | 2013-12-09 | 2016-12-13 | Denso Corporation | Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body |
US10395947B2 (en) | 2014-02-27 | 2019-08-27 | Denso Corporation | Manufacturing method of a resin molded article |
Also Published As
Publication number | Publication date |
---|---|
EP1296371A2 (en) | 2003-03-26 |
JP4620303B2 (en) | 2011-01-26 |
EP1296371A3 (en) | 2006-05-24 |
US7588962B2 (en) | 2009-09-15 |
JP2003094479A (en) | 2003-04-03 |
US20090023253A1 (en) | 2009-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7588962B2 (en) | Method of making semiconductor device | |
US6951981B2 (en) | Asymmetric transfer molding method and an asymmetric encapsulation made therefrom | |
US7225537B2 (en) | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces | |
EP0747942B1 (en) | Improvements in or relating to integrated circuits | |
US4816426A (en) | Process for manufacturing plastic pin grid arrays and the product produced thereby | |
CN102569616B (en) | Methods of forming semiconductor light emitting device packages and molded semiconductor light emitting device strips | |
KR100870374B1 (en) | An ic card and method of manufacturing the same | |
CN101404861B (en) | Electronic circuit device and method of making the same | |
JP3491481B2 (en) | Semiconductor device and manufacturing method thereof | |
US5943558A (en) | Method of making an assembly package having an air tight cavity and a product made by the method | |
KR19980068001A (en) | Manufacturing method of semiconductor package | |
CN102610533B (en) | Injection molding system and method of chip package | |
EP0807973A2 (en) | Plastic molded type semiconductor device and method of manufacturing the same | |
US20160082631A1 (en) | Mold for Manufacturing LED Mounting Substrate | |
US6696006B2 (en) | Mold for flashless injection molding to encapsulate an integrated circuit chip | |
US20020145181A1 (en) | Method for integrated circuit packaging | |
JP4809717B2 (en) | Method for manufacturing resin-encapsulated electronic component and resin-encapsulated electronic component | |
JPH11345297A (en) | Data carrier and manufacture of the same | |
US20030080404A1 (en) | Semiconductor device and manufacturing method thereof | |
JP2011113517A (en) | Rfid tag, method of manufacturing the same, and die | |
JPH06244352A (en) | Lead frame and manufacturing method for semiconductor device | |
CN108269765B (en) | Semiconductor sensor package | |
JPH07335678A (en) | Mold of element | |
JPH06302635A (en) | Manufacture of resin-sealed type semiconductor device | |
JPH07211740A (en) | Resin sealing metal mold |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO, JAPA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TAJIMA, MASAYA;KOGISO, KATSUYA;WATANABE, MITSUO;AND OTHERS;REEL/FRAME:013505/0917 Effective date: 20020917 |
|
AS | Assignment |
Owner name: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO, JAPA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FOURTH ASSIGNOR'S NAME AND THE SPELLING OF THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED ON REEL 013505 FRAME 0917;ASSIGNORS:TAJIMA, MASAYA;KOGISO, KATSUYA;WATANABE, MITSUO;AND OTHERS;REEL/FRAME:014169/0162 Effective date: 20020917 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |