US20030116606A1 - Solder bath with rotatable nozzle - Google Patents
Solder bath with rotatable nozzle Download PDFInfo
- Publication number
- US20030116606A1 US20030116606A1 US10/228,186 US22818602A US2003116606A1 US 20030116606 A1 US20030116606 A1 US 20030116606A1 US 22818602 A US22818602 A US 22818602A US 2003116606 A1 US2003116606 A1 US 2003116606A1
- Authority
- US
- United States
- Prior art keywords
- nozzle
- solder bath
- solder
- threaded rod
- rotate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 138
- 238000005476 soldering Methods 0.000 claims abstract description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 238000005192 partition Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 13
- 230000004907 flux Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001737 promoting effect Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 239000002360 explosive Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Definitions
- the present invention relates to a new solder bath apparatus of soldering furnace, and more specifically, to a solder bath with a rotatable nozzle for adjusting flow of gushing molten solder.
- the key factor of the yields of mounting assembly parts onto printed circuit boards is the soldering procedure for mounting component leads.
- the effective reductions of defects such as bridge, dewetting, blow hole, and etc.
- the wave soldering procedures are mainly applied to assembly printed circuit boards for furthering mass productions.
- the molten solder is driven by a motor pump and forced upward into the through holes beneath the printed circuit boards which are transported obliquely to pass the soldering wave via the transport means.
- the current wave soldering system 10 is illustrated.
- a solder bath 12 is applied to contain molten solder, and a motor pump 14 mounted beside the solder bath 12 can swing its fan blades to drive the molten solder.
- the molten solder gushed upwards from a nozzle 16 disposed in the solder bath 12 forms the rising solder wave.
- printed circuit boards 20 can be transferred to pass over the solder bath 12 through inclined transport rails 18 .
- the rising solder wave can fill into the through holes beneath the printed circuit boards to solder the leads of components.
- the printed circuit board 20 is disposed onto a carrier formed of aluminum alloy or fiberglass wherein the carrier has some hollows for exposing the soldering areas of the printed circuit board. Then the finger 22 chained beneath the transport rails 18 can grab two side of the carrier to transfer the printed circuit board 20 via the transport rails 18 .
- the printed circuit board 20 is coated flux and preheated first in the front part 24 of the transport rails 18 .
- the flux is applied to clean the surfaces of the soldering metal and to avoid rustiness in atmosphere at high temperature.
- the flux is also applied to spread thermal energy uniformly for enhancing the performance of the soldering points.
- the typical flux coating procedures include foaming type, spraying type, and soaking type.
- As to the subsequent preheat procedure is applied to dispel the volatility parts of the flux for promoting the temperatures of the printed circuit boards to enhance the flux activity and to prove the capability of filling molten solder into through holes.
- the typical preheating procedure is to apply infrared tubes beneath the carriers to illuminate the printed circuit boards to a predetermined temperature.
- FIG. 2 illustrates the structure of the solder bath 12 .
- the members of solder bath 12 include a nozzle base 26 , a nozzle 16 and a motor pump 14 .
- the solder bath 12 for containing molten solder has a horizontal partition 28 applied to divide the inner space of solder bath 12 into two rooms, the upper room and the lower room. And the partition 28 has a bar opening 30 through the upper and lower room on central part thereof.
- the nozzle base 26 is located on the opening 30
- the nozzle 16 is mounted on the nozzle base 26 .
- the motor pump 14 disposed beside the solder bath 12 can swing the fan blades to drive molten solder gush from the nozzle 16 in solder bath 12 to form rising solder wave.
- the rising molten solder can fill the through holes beneath the printed circuit board 20 to form solder points.
- a purpose of the present invention is to provide a solder bath with rotatable nozzle to promote yields of soldering procedures.
- Another purpose of the present invention is to provide a nozzle with axial pillars stretching horizonally to provide the operator for adjusting the outlet angle of nozzle by rotating it about the axial pillars.
- a purpose of the present invention is to provide an enclosing frame with axial horizontal pillars for rotating the nozzle.
- the present invention discloses a solder bath apparatus applied to the soldering furnace.
- the solder bath is used for containing molten solder.
- a horizontal partition is disposed in the solder bath to divide space therein to an upper room and a lower room.
- the partition has a bar opening on the center thereof to pass through the lower room and the upper room.
- a nozzle base is located on the bar opening of the partition to gush molten solder upwards into the upper room.
- An enclosing frame with a bar-shaped structure is put around the nozzle base, and has axial horizontal pillars mounted on the two terminal sidewalls thereof.
- the nozzle is manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars, and is put around the enclosing frame.
- the pillar When the nozzle is put around the enclosing frame, the pillar can penetrate through the bearing pedestal to let nozzle rotate around the pillar for adjusting the direction of nozzle's outlet. Further, an adjusting means is connected with the nozzle to drive the nozzle rotate about the axial pillars.
- FIG. 1 is a perspective view of the soldering furnace illustrating members for performing the soldering process
- FIG. 2 is a perspective view of the solder bath illustrating members thereof according to prior art
- FIG. 3 is an explosive view of the solder bath according to the first embodiment of the present invention.
- FIG. 4 is a perspective view of the solder bath illustrating connections of associated members according to the first embodiment of the present invention
- FIG. 5 is an explosive view of the solder bath according to the second embodiment of the present invention.
- FIG. 6 is a perspective view of the solder bath illustrating connections of associated members according to the second embodiment of the present invention.
- FIG. 7 is an explosive view of the solder bath according to the third embodiment of the present invention.
- FIG. 8 is a perspective view of the solder bath illustrating connections of associated members according to the third embodiment of the present invention.
- the present invention discloses a new solder bath apparatus for soldering furnace.
- An extra enclosing frame with two outstanding pillars is provided, and the nozzle is manufactured with two bearing pedestals responsive to the pillars.
- the nozzle can rotate about the pillars by a little angle to adjust the outlet direction of nozzle for promoting the yields of soldering procedures.
- solder bath 112 used for soldering furnace
- the members of solder bath comprise of a solder bath 112 , a nozzle base 126 , an enclosing frame 130 , a nozzle 116 and a motor pump 114 .
- the solder bath 112 applied to contain molten solder has a partition 128 disposed horizontally therein to divide inner space of solder bath 112 into a lower room 111 and an upper room 113 .
- the partition 128 has a bar opening formed on the center thereof through the lower room 111 and the upper room 113 .
- the nozzle base 126 is located on the bar opening of partition 128 to gush molten solder upwards into upper room 113 when the motor pump 114 is applied to drive molten solder in lower space 111 .
- the enclosing frame 130 with a bar-shaped structure is put around the nozzle base 126 to expose the bar opening thereof. Due to the opening of enclosing frame 130 is equal to that of nozzle base 126 , the enclosing frame 130 can be fastened on nozzle base 126 . And on the two terminal sidewalls the enclosing frame 130 has axial pillars 132 stretching outwardly as shown in FIG. 3.
- the nozzle 116 is put around the enclosing frame 130 directly.
- the nozzle 116 has a frontplate 134 and a backplate 136 which constitute the outlet of nozzle 116 to control directions and flow of gushing solder.
- two bearing pedestal 138 are respectively jointed with solder on the lower sidewalls of nozzle 116 .
- Each bearing pedestal 138 has a through hole responsive to the pillar 132 on enclosing frame 130 . So when the nozzle 116 is put around the enclosing frame 130 , the pillar 132 can penetrate through the bearing pedestal 138 to let nozzle 116 rotate around the pillar 132 for adjusting the outlet angle of nozzle 116 .
- the molten solder gushed from nozzle 116 can fill into the through holes beneath the printed circuit boards to solder leads of components.
- the motor pump 114 is disposed to drive molten solder in lower room 111 of solder bath 112 upwardly into the nozzle 116 through the bar opening on partition 128 and nozzle base 126 .
- the motor pump 114 comprises a motor 115 , a drive belt 117 and fan blades 119 .
- the fan blades 119 extending into lower room 111 are driven via drive belt 117 by motor 115 to swing and drive molten solder.
- the motor 115 as shown in FIG. 3 is hanged on outside of solder bath 112 . When the motor 115 swings fan blades 119 via drive belt 117 , the molten solder outside of solder bath 112 can be inhaled thereinto and flow through partition 128 to gush from nozzle 116 .
- an adjusting apparatus is provided in the present invention to rotate the nozzle 116 about axial pillars 132 .
- the adjusting apparatus of the present invention is illustrated. Because the sidewall's width of nozzle 116 is a little bit larger than that of enclosing frame 130 , there is enough space to rotate nozzle 116 for adjusting the outlet direction.
- the nozzle 116 has an adjusting shaft 140 formed on it's sidewall to connect with the adjusting apparatus.
- the adjusting apparatus comprises a threaded rod 144 and an enclosing ring 142 which is connected to the front terminal of the threaded rod 144 and is put around the adjusting shaft 140 .
- a fixing stand 145 is mounted on top surface of a wall of solder bath 112 , which has a spiral hole to let the threaded rod 144 penetrate and screw through. Therefore the threaded rod 144 can be screwed clockwise into solder bath 112 or counter-clockwise out of solder bath 112 .
- the enclosing frame 130 disclosed above is an optional member, and the nozzle 116 can be disposed on the nozzle base 126 directly.
- the associated members of solder bath 112 without the enclosing frame 130 according to the second embodiment of the present invention is illustrated.
- the nozzle base 127 herein is manufactured with two pillars 147 formed on two terminal sidewalls thereof and stretching horizontally outwardly.
- the pillar 147 can penetrate through the bearing pedestal 138 of nozzle 116 as shown in FIG. 6.
- the present invention also provides another structure for rotating the nozzle 116 .
- two bearing pedestal 150 are mounted on top edge of the two sidewalls of solder bath 112 .
- each bearing pedestal 150 has a through hole.
- the through hole of bearing pedestal 150 is manufactured with an arc opening to allow the nozzle 116 rotating in the front direction or in the reverse direction.
- the nozzle 116 has two pillars 148 mounted on two terminal sidewalls thereof responsive to the through holes of bearing pedestal 150 .
- the pillar 148 can penetrate through the bearing pedestal 150 .
- the operator can control the outlet direction of nozzle 116 for adjusting the gushing molten solder flow.
- the width of sidewalls of nozzle 116 is little larger than that of nozzle base 126 for providing the nozzle 116 enough space to rotate.
- the present invention has many advantages as follows:
- the nozzle base is manufactured to have horizontal pillars mounted on two terminal sidewalls thereof, and the nozzle is manufactured with bearing pedestals responsive to the pillars. So when the nozzle is put around the nozzle base, the pillar can penetrate through the bearing pedestal. And the nozzle is rotatable around the axial pillar. Thus the operator can rotate the nozzle to further control the flow of gushing molten solder for promoting yields thereof;
- the pillars can be mounted directly on enclosing frame but nozzle base. So for the industry they just need to manufacture the enclosing frame according to the opening size of nozzle base, and put it around the nozzle base directly. After disposing the nozzle with bearing pedestals on the nozzle base, the operator can have the convenience of rotating the nozzle for adjusting solder flow. Comparatively, it is not necessary to drain off all molten solder in the solder bath for disassembling the partition to mount pillars onto the nozzle base.
Abstract
Description
- The present invention relates to a new solder bath apparatus of soldering furnace, and more specifically, to a solder bath with a rotatable nozzle for adjusting flow of gushing molten solder.
- With the continuing advances and developments of electrical manufactures, the electrical products in new generation have more developed and complicated capability to provide peoples more convenient and comfortable life. For instance, in computer industry, because the manufacture and packaging techniques of integrated circuits are promoted and matured, the high quality multimedia personal computers are widely used. The expenditure enhancement for computers and peripheral products cause the popularization and more vigorous development thereof. However, when the performances of chips are promoted, the amounts of leads to package components on the printed circuit boards (PCBs) also are continuously enhanced. Thus the layout of printed circuit boards becomes more fine and complex. And the difficulties to mount and solder components thereon are also enhanced.
- In general, the key factor of the yields of mounting assembly parts onto printed circuit boards is the soldering procedure for mounting component leads. Especially when the amounts of leads are increased and the arrangement thereof become highly concentrated, the effective reductions of defects such as bridge, dewetting, blow hole, and etc., can promote the yields of PCBs productions and reduce the failure opportunities of components. In prior art the wave soldering procedures are mainly applied to assembly printed circuit boards for furthering mass productions. And in wave soldering process, the molten solder is driven by a motor pump and forced upward into the through holes beneath the printed circuit boards which are transported obliquely to pass the soldering wave via the transport means.
- Please refer to FIG. 1, the current
wave soldering system 10 is illustrated. In thewave soldering system 10, asolder bath 12 is applied to contain molten solder, and amotor pump 14 mounted beside thesolder bath 12 can swing its fan blades to drive the molten solder. The molten solder gushed upwards from anozzle 16 disposed in thesolder bath 12 forms the rising solder wave. And printedcircuit boards 20 can be transferred to pass over thesolder bath 12 throughinclined transport rails 18. Thus the rising solder wave can fill into the through holes beneath the printed circuit boards to solder the leads of components. It is noted that in the wave soldering procedure the printedcircuit board 20 is disposed onto a carrier formed of aluminum alloy or fiberglass wherein the carrier has some hollows for exposing the soldering areas of the printed circuit board. Then thefinger 22 chained beneath thetransport rails 18 can grab two side of the carrier to transfer the printedcircuit board 20 via thetransport rails 18. - In general, the printed
circuit board 20 is coated flux and preheated first in thefront part 24 of thetransport rails 18. The flux is applied to clean the surfaces of the soldering metal and to avoid rustiness in atmosphere at high temperature. Besides, the flux is also applied to spread thermal energy uniformly for enhancing the performance of the soldering points. The typical flux coating procedures include foaming type, spraying type, and soaking type. As to the subsequent preheat procedure is applied to dispel the volatility parts of the flux for promoting the temperatures of the printed circuit boards to enhance the flux activity and to prove the capability of filling molten solder into through holes. The typical preheating procedure is to apply infrared tubes beneath the carriers to illuminate the printed circuit boards to a predetermined temperature. - Please refer to FIG. 2, which illustrates the structure of the
solder bath 12. The members ofsolder bath 12 include anozzle base 26, anozzle 16 and amotor pump 14. Thesolder bath 12 for containing molten solder has ahorizontal partition 28 applied to divide the inner space ofsolder bath 12 into two rooms, the upper room and the lower room. And thepartition 28 has a bar opening 30 through the upper and lower room on central part thereof. Thenozzle base 26 is located on theopening 30, and thenozzle 16 is mounted on thenozzle base 26. Besides, themotor pump 14 disposed beside thesolder bath 12 can swing the fan blades to drive molten solder gush from thenozzle 16 insolder bath 12 to form rising solder wave. Thus, when the printedcircuit board 20 pass over themolten solder 24 via theinclined transport rails 18, the rising molten solder can fill the through holes beneath the printedcircuit board 20 to form solder points. - However, due to the
nozzle 16 in prior art is fastened on thenozzle base 26, the outlet direction of nozzle can not be adjusted, and there is no capability of controlling the solder wave of molten solder gushed therefrom. Therefore the yields of soldering process can not be promoted in advance. And the short circuits occurred on the printed circuit boards can not be eliminated as far as possible. So it is required to apply post-sodering procedures by manpower to reduce the defects on printed circuit boards. For solving this issue, associated manufacturing industries devote themselves to improve the structure of solder bath for promoting the soldering yields and throughput thereof effectively. - A purpose of the present invention is to provide a solder bath with rotatable nozzle to promote yields of soldering procedures.
- Another purpose of the present invention is to provide a nozzle with axial pillars stretching horizonally to provide the operator for adjusting the outlet angle of nozzle by rotating it about the axial pillars.
- Further a purpose of the present invention is to provide an enclosing frame with axial horizontal pillars for rotating the nozzle.
- The present invention discloses a solder bath apparatus applied to the soldering furnace. The solder bath is used for containing molten solder. And a horizontal partition is disposed in the solder bath to divide space therein to an upper room and a lower room. The partition has a bar opening on the center thereof to pass through the lower room and the upper room. A nozzle base is located on the bar opening of the partition to gush molten solder upwards into the upper room. An enclosing frame with a bar-shaped structure is put around the nozzle base, and has axial horizontal pillars mounted on the two terminal sidewalls thereof. The nozzle is manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars, and is put around the enclosing frame. When the nozzle is put around the enclosing frame, the pillar can penetrate through the bearing pedestal to let nozzle rotate around the pillar for adjusting the direction of nozzle's outlet. Further, an adjusting means is connected with the nozzle to drive the nozzle rotate about the axial pillars.
- The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
- FIG. 1 is a perspective view of the soldering furnace illustrating members for performing the soldering process;
- FIG. 2 is a perspective view of the solder bath illustrating members thereof according to prior art;
- FIG. 3 is an explosive view of the solder bath according to the first embodiment of the present invention;
- FIG. 4 is a perspective view of the solder bath illustrating connections of associated members according to the first embodiment of the present invention;
- FIG. 5 is an explosive view of the solder bath according to the second embodiment of the present invention;
- FIG. 6 is a perspective view of the solder bath illustrating connections of associated members according to the second embodiment of the present invention;
- FIG. 7 is an explosive view of the solder bath according to the third embodiment of the present invention; and
- FIG. 8 is a perspective view of the solder bath illustrating connections of associated members according to the third embodiment of the present invention.
- The present invention discloses a new solder bath apparatus for soldering furnace. An extra enclosing frame with two outstanding pillars is provided, and the nozzle is manufactured with two bearing pedestals responsive to the pillars. By putting the nozzle around the enclosing frame, the nozzle can rotate about the pillars by a little angle to adjust the outlet direction of nozzle for promoting the yields of soldering procedures. This invention will be described in further detail by way of example with reference to the accompanying drawings as follows.
- Please refer to FIG. 3, according to first embodiment of the present invention the structure of solder bath used for soldering furnace is illustrated. The members of solder bath comprise of a
solder bath 112, anozzle base 126, an enclosingframe 130, anozzle 116 and amotor pump 114. Thesolder bath 112 applied to contain molten solder has apartition 128 disposed horizontally therein to divide inner space ofsolder bath 112 into alower room 111 and anupper room 113. And thepartition 128 has a bar opening formed on the center thereof through thelower room 111 and theupper room 113. Thenozzle base 126 is located on the bar opening ofpartition 128 to gush molten solder upwards intoupper room 113 when themotor pump 114 is applied to drive molten solder inlower space 111. - It is noted that the enclosing
frame 130 with a bar-shaped structure is put around thenozzle base 126 to expose the bar opening thereof. Due to the opening of enclosingframe 130 is equal to that ofnozzle base 126, the enclosingframe 130 can be fastened onnozzle base 126. And on the two terminal sidewalls the enclosing frame130 hasaxial pillars 132 stretching outwardly as shown in FIG. 3. - Likewise, the
nozzle 116 is put around the enclosingframe 130 directly. Thenozzle 116 has afrontplate 134 and abackplate 136 which constitute the outlet ofnozzle 116 to control directions and flow of gushing solder. And two bearingpedestal 138 are respectively jointed with solder on the lower sidewalls ofnozzle 116. Each bearingpedestal 138 has a through hole responsive to thepillar 132 on enclosingframe 130. So when thenozzle 116 is put around the enclosingframe 130, thepillar 132 can penetrate through the bearingpedestal 138 to letnozzle 116 rotate around thepillar 132 for adjusting the outlet angle ofnozzle 116. Thus, when the printed circuit board is transferred abovesolder bath 112 via transport rails as shown in FIG. 1, the molten solder gushed fromnozzle 116 can fill into the through holes beneath the printed circuit boards to solder leads of components. - Beside
solder bath 112 themotor pump 114 is disposed to drive molten solder inlower room 111 ofsolder bath 112 upwardly into thenozzle 116 through the bar opening onpartition 128 andnozzle base 126. Themotor pump 114 comprises amotor 115, adrive belt 117 andfan blades 119. Thefan blades 119 extending intolower room 111 are driven viadrive belt 117 bymotor 115 to swing and drive molten solder. Themotor 115 as shown in FIG. 3 is hanged on outside ofsolder bath 112. When themotor 115swings fan blades 119 viadrive belt 117, the molten solder outside ofsolder bath 112 can be inhaled thereinto and flow throughpartition 128 to gush fromnozzle 116. - For convenience of adjusting the outlet direction of
nozzle 116, an adjusting apparatus is provided in the present invention to rotate thenozzle 116 aboutaxial pillars 132. Please refer to FIG. 4, the adjusting apparatus of the present invention is illustrated. Because the sidewall's width ofnozzle 116 is a little bit larger than that of enclosingframe 130, there is enough space to rotatenozzle 116 for adjusting the outlet direction. Besides, thenozzle 116 has an adjustingshaft 140 formed on it's sidewall to connect with the adjusting apparatus. In a preferred embodiment, the adjusting apparatus comprises a threadedrod 144 and anenclosing ring 142 which is connected to the front terminal of the threadedrod 144 and is put around the adjustingshaft 140. Further, a fixingstand 145 is mounted on top surface of a wall ofsolder bath 112, which has a spiral hole to let the threadedrod 144 penetrate and screw through. Therefore the threadedrod 144 can be screwed clockwise intosolder bath 112 or counter-clockwise out ofsolder bath 112. - When threaded
rod 144 is screwed intosolder bath 112, the enclosingring 142 can push adjustingshaft 140 to rotatenozzle 116 in a forward direction about thepillars 132. On the contrary, when threadedrod 144 is screwed out ofsolder bath 112, the enclosingring 142 can pull adjustingshaft 140 to rotatenozzle 116 in a reverse direction about thepillars 132. Thus, by screwing threadedrod 144 into/out ofsolder bath 112,nozzle 116 can rotate in the forward of reverse directions to adjust the outlet direction ofnozzle 116 for controlling the solder flow gushed fromnozzle 116. - It is noted that the enclosing
frame 130 disclosed above is an optional member, and thenozzle 116 can be disposed on thenozzle base 126 directly. Please refer to FIG. 5, the associated members ofsolder bath 112 without the enclosingframe 130 according to the second embodiment of the present invention is illustrated. Especially thenozzle base 127 herein is manufactured with twopillars 147 formed on two terminal sidewalls thereof and stretching horizontally outwardly. Thus, whennozzle 116 is put aroundnozzle base 127, thepillar 147 can penetrate through the bearingpedestal 138 ofnozzle 116 as shown in FIG. 6. - Likewise, by screwing threaded
rod 144 intosolder bath 112 the enclosingring 142 can push adjustingshaft 140 to rotatenozzle 116 in the forward direction about thepillars 147 onnozzle base 127. On the contrary, by screwing threadedrod 144 out ofsolder bath 112 the enclosingring 142 can pull adjustingshaft 140 to rotatenozzle 116 in the reverse direction around thepillars 147 onnozzle 116. Thus, by screwing threadedrod 144 clockwise or counter-clockwise the outlet ofnozzle 116 can rotate to adjust molten solder flow. - Besides, the present invention also provides another structure for rotating the nozzle116. Please refer to FIG. 7, according to the third embodiment of the present invention two bearing
pedestal 150 are mounted on top edge of the two sidewalls ofsolder bath 112. And each bearingpedestal 150 has a through hole. In a preferred embodiment, the through hole of bearingpedestal 150 is manufactured with an arc opening to allow thenozzle 116 rotating in the front direction or in the reverse direction. On the other hand, thenozzle 116 has twopillars 148 mounted on two terminal sidewalls thereof responsive to the through holes of bearingpedestal 150. - Referring to FIG. 8, when
nozzle 116 is put around thenozzle base 126, thepillar 148 can penetrate through the bearingpedestal 150. Thus, by rotating thepillar 148 the operator can control the outlet direction ofnozzle 116 for adjusting the gushing molten solder flow. Likewise, in the manufacture of the associated members, the width of sidewalls ofnozzle 116 is little larger than that ofnozzle base 126 for providing thenozzle 116 enough space to rotate. - The present invention has many advantages as follows:
- (1) The nozzle base is manufactured to have horizontal pillars mounted on two terminal sidewalls thereof, and the nozzle is manufactured with bearing pedestals responsive to the pillars. So when the nozzle is put around the nozzle base, the pillar can penetrate through the bearing pedestal. And the nozzle is rotatable around the axial pillar. Thus the operator can rotate the nozzle to further control the flow of gushing molten solder for promoting yields thereof;
- (2) when the enclosing frame is introduced, the pillars can be mounted directly on enclosing frame but nozzle base. So for the industry they just need to manufacture the enclosing frame according to the opening size of nozzle base, and put it around the nozzle base directly. After disposing the nozzle with bearing pedestals on the nozzle base, the operator can have the convenience of rotating the nozzle for adjusting solder flow. Comparatively, it is not necessary to drain off all molten solder in the solder bath for disassembling the partition to mount pillars onto the nozzle base.
- While the preferred embodiment of the invention has been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.
Claims (16)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90222524U | 2001-12-21 | ||
TW90222524 | 2001-12-21 | ||
TW90222523U | 2001-12-21 | ||
TW90222523 | 2001-12-21 | ||
TW90222525 | 2001-12-21 | ||
TW90222525U | 2001-12-21 | ||
TW90222523U TW573573U (en) | 2001-12-21 | 2001-12-21 | Tin tank structure with rotary nozzle |
TW90222524U TW511854U (en) | 2001-12-21 | 2001-12-21 | Tin trough structure having rotary nozzle |
TW90222525U TW511855U (en) | 2001-12-21 | 2001-12-21 | Tin trough structure having rotary nozzle |
Publications (2)
Publication Number | Publication Date |
---|---|
US20030116606A1 true US20030116606A1 (en) | 2003-06-26 |
US6742693B2 US6742693B2 (en) | 2004-06-01 |
Family
ID=27356565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/228,186 Expired - Fee Related US6742693B2 (en) | 2001-12-21 | 2002-08-27 | Solder bath with rotatable nozzle |
Country Status (1)
Country | Link |
---|---|
US (1) | US6742693B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6742693B2 (en) * | 2001-12-21 | 2004-06-01 | Asustek Computer, Inc. | Solder bath with rotatable nozzle |
US11389888B2 (en) * | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007002777A1 (en) * | 2007-01-18 | 2008-07-24 | Linde Ag | Apparatus and method for selective soldering |
GB0716693D0 (en) * | 2007-08-28 | 2007-10-03 | Pillarhouse Int Ltd | Modular soldering apparatus |
CN102361720A (en) * | 2010-02-26 | 2012-02-22 | 松下电器产业株式会社 | Soldering apparatus |
JP6593400B2 (en) * | 2017-08-04 | 2019-10-23 | 千住金属工業株式会社 | Jet solder bath and jet soldering equipment |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4659003A (en) * | 1984-11-15 | 1987-04-21 | Outillages Scientifiques Et De Laboratories O.S.L. S.A. | Heating device for generating a wave of solder in a wave soldering machine |
US4685605A (en) * | 1984-05-25 | 1987-08-11 | The Htc Corporation | Continuous solder system |
US4697730A (en) * | 1984-05-25 | 1987-10-06 | The Htc Corporation | Continuous solder system |
US4796796A (en) * | 1986-04-10 | 1989-01-10 | U.S. Philips Corp. | Soldering apparatus |
US4824010A (en) * | 1980-12-26 | 1989-04-25 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for soldering printed circuit boards |
US4848640A (en) * | 1987-05-22 | 1989-07-18 | Soltec, B.V. | Apparatus for the application of a conductive adhesive medium to a printed circuit board |
US4848642A (en) * | 1987-02-12 | 1989-07-18 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US4886201A (en) * | 1988-06-09 | 1989-12-12 | Electrovert Limited | Solder wave nozzle construction |
US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
US5388752A (en) * | 1993-04-23 | 1995-02-14 | Kawakatsu; Ichiro | Method and apparatus for soldering a workpiece in a non-oxidizing gas atmosphere |
US6138890A (en) * | 1997-10-30 | 2000-10-31 | Nec Corporation | Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality |
US6431431B2 (en) * | 2000-03-09 | 2002-08-13 | Speedline Technologies, Inc. | Apparatus and methods for wave soldering |
US6478215B2 (en) * | 2000-03-07 | 2002-11-12 | Senju Metal Industry Co., Ltd. | Automatic wave soldering apparatus and method |
US20030116607A1 (en) * | 2001-12-26 | 2003-06-26 | Po-Hung Wang | Adjustable nozzle of stannic furnace |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6742693B2 (en) * | 2001-12-21 | 2004-06-01 | Asustek Computer, Inc. | Solder bath with rotatable nozzle |
-
2002
- 2002-08-27 US US10/228,186 patent/US6742693B2/en not_active Expired - Fee Related
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4824010A (en) * | 1980-12-26 | 1989-04-25 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for soldering printed circuit boards |
US4685605A (en) * | 1984-05-25 | 1987-08-11 | The Htc Corporation | Continuous solder system |
US4697730A (en) * | 1984-05-25 | 1987-10-06 | The Htc Corporation | Continuous solder system |
US4659003A (en) * | 1984-11-15 | 1987-04-21 | Outillages Scientifiques Et De Laboratories O.S.L. S.A. | Heating device for generating a wave of solder in a wave soldering machine |
US4796796A (en) * | 1986-04-10 | 1989-01-10 | U.S. Philips Corp. | Soldering apparatus |
US4848642A (en) * | 1987-02-12 | 1989-07-18 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US4848640A (en) * | 1987-05-22 | 1989-07-18 | Soltec, B.V. | Apparatus for the application of a conductive adhesive medium to a printed circuit board |
US4886201A (en) * | 1988-06-09 | 1989-12-12 | Electrovert Limited | Solder wave nozzle construction |
US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
US5388752A (en) * | 1993-04-23 | 1995-02-14 | Kawakatsu; Ichiro | Method and apparatus for soldering a workpiece in a non-oxidizing gas atmosphere |
US6138890A (en) * | 1997-10-30 | 2000-10-31 | Nec Corporation | Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality |
US6478215B2 (en) * | 2000-03-07 | 2002-11-12 | Senju Metal Industry Co., Ltd. | Automatic wave soldering apparatus and method |
US6431431B2 (en) * | 2000-03-09 | 2002-08-13 | Speedline Technologies, Inc. | Apparatus and methods for wave soldering |
US20030116607A1 (en) * | 2001-12-26 | 2003-06-26 | Po-Hung Wang | Adjustable nozzle of stannic furnace |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6742693B2 (en) * | 2001-12-21 | 2004-06-01 | Asustek Computer, Inc. | Solder bath with rotatable nozzle |
US11389888B2 (en) * | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Also Published As
Publication number | Publication date |
---|---|
US6742693B2 (en) | 2004-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6742693B2 (en) | Solder bath with rotatable nozzle | |
CN111530795A (en) | Excessive glue clearing device for integrated circuit packaging | |
JP2001251047A (en) | Method of soldering printed board and automatic soldering apparatus | |
US6817510B2 (en) | Apparatus for increasing wave height of molten solder in solder bath | |
JP4175057B2 (en) | Electronic component mounting system | |
JP2002361472A (en) | Soldering device and soldering method | |
JPH0677638A (en) | Laser soldering equipment | |
JP3161340U (en) | Solder jet nozzle unit and jet solder device | |
JP3186215B2 (en) | Chisso reflow device | |
JP3324459B2 (en) | Center carrier for printed circuit board soldering equipment | |
KR200153131Y1 (en) | Nozzle for soldering apparatus | |
JP3356445B2 (en) | Chisso reflow device | |
JPH0629656A (en) | Automatic soldering equipment | |
JP2001119134A (en) | Soldering device | |
JPH01133667A (en) | Transfer device for automatic soldering device | |
KR200145549Y1 (en) | Soldering apparatus | |
JP2006114556A (en) | Wave solder bath | |
JP2000059020A (en) | Single-sided reflow furnace cooling device for soldering | |
JPH10112582A (en) | Soldering method and soldering apparatus | |
JPH0446670A (en) | Automatic soldering device | |
JPH11186708A (en) | Method for packaging printed board | |
JP3171179B2 (en) | Reflow device and temperature control method in reflow device | |
JPH05211390A (en) | Mounting method of surface mounting part | |
JPH10112583A (en) | Reflow soldering method and its apparatus | |
JP2006173471A (en) | Reflow soldering apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASUSTEK COMPUTER INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, PO-HUNG;CHIU, CHUN-HSIUNG;WANG, PENG-WEI;AND OTHERS;REEL/FRAME:013228/0575;SIGNING DATES FROM 20020806 TO 20020807 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
AS | Assignment |
Owner name: PEGATRON CORPORATION,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ASUSTEK COMPUTER INC.;REEL/FRAME:024218/0450 Effective date: 20100401 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20120601 |