US20030168344A1 - Selective metal deposition for electrochemical plating - Google Patents
Selective metal deposition for electrochemical plating Download PDFInfo
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- US20030168344A1 US20030168344A1 US10/095,785 US9578502A US2003168344A1 US 20030168344 A1 US20030168344 A1 US 20030168344A1 US 9578502 A US9578502 A US 9578502A US 2003168344 A1 US2003168344 A1 US 2003168344A1
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- Prior art keywords
- anode
- pores
- substrate
- anode spacer
- spacer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Definitions
- the present invention generally relates to a method and apparatus for selectively depositing metals onto a substrate.
- Copper has a lower resistivity, e.g., 1.7 ⁇ -cm compared to 3.1 ⁇ -cm for aluminum, and can carry a higher current density than aluminum. Therefore, it is generally desirable to use copper to form interconnects in semiconductor devices, rather than aluminum.
- Conventional copper electroplating solutions typically consist of copper sulfate, sulfuric acid and additives to aid in depositing copper on the surface of a substrate and in filling sub-micron sized features, e.g., vias and interconnects.
- the additives may include any combination of, but not limited to, levelers, brighteners, inhibitors, suppressors, enhancers, accelerators, and surfactants.
- the additives are typically organic molecules that adsorb onto the surface of the substrate. Certain additives may decrease the ionization rate of metal atoms, thereby inhibiting the deposition process, whereas other additives may increase the deposition rate of metal.
- One problem encountered in electroplating copper on a substrate is that the flow of electroplating solution over the substrate may not be uniform. Non-uniform flow of the electroplating solution provides uneven distribution of the copper ions to the substrate, which can lead to variations in the plating rate on the substrate. Variations in the plating rate may result in an uneven depth of copper deposition on the substrate. In addition, the substrate features often have an uneven topography, which may lead to voids in the feature upon plating.
- Embodiments of the invention generally provide an apparatus for plating metal on a substrate having a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution, and an anode spacer positioned in the plating cell.
- the anode spacer has an anode surface and a substrate contact surface positioned immediate a deposition surface of the substrate.
- the anode spacer is configured to communicate the plating solution to the surface of the substrate.
- Embodiments of the invention further provide an apparatus for controlling metal deposition on a substrate.
- the apparatus includes an anode spacer, wherein the anode spacer has a periphery substantially equivalent to the periphery of the substrate.
- the anode spacer is generally configured to communicate a plating solution therethrough, and the anode spacer generally includes an anode surface and a substrate contact surface positioned immediate a deposition surface of the substrate.
- Embodiments of the invention further provide a method for plating a metal on a substrate, wherein the method includes including positioning a substrate in a plating cell, positioning an anode spacer immediate a deposition surface of the substrate, and flowing a plating solution through the anode spacer to plate a metal onto the deposition surface.
- Embodiments of the invention further provide an apparatus for plating metal on a substrate.
- the apparatus generally includes a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution; and an anode spacer positioned in the plating cell.
- the anode spacer generally includes an anode surface, a substrate contact surface positioned a distance from a deposition surface of the substrate sufficient to uniformly plate a metal to a desired thickness, and a plurality of pores to communicate the plating solution to the deposition surface having an electrical resistance lower than the electrical resistance of the plating solution.
- Embodiments of the invention further provide a method for plating a metal layer on a substrate.
- the method generally includes positioning a substrate having recessed locations and raised locations in a plating cell, positioning an anode spacer having a plurality of pores immediate a deposition surface of the substrate, and flowing a plating solution having a higher resistance than the plurality of pores through the plurality of pores, thereby plating the recessed locations until the substrate is in contact with the plurality of pores.
- FIG. 1 is a cross sectional view of a cell for electroplating a metal onto a substrate.
- FIG. 2 is a cross sectional view of the anode spacer of an exemplary embodiment of the present invention.
- FIG. 3 is a cross sectional view of the anode spacer of an alternative embodiment of the present invention.
- FIG. 4 is a cross sectional view of the anode spacer of an alternative embodiment of the present invention.
- FIG. 1 illustrates a partial cross sectional schematic view of an exemplary electroplating cell 100 of the invention.
- the electroplating cell 100 generally includes a container body 142 having an opening on a top portion of the container body 142 to receive and support a lid 144 .
- the container body 142 is preferably made of an electrically insulative material, such as a plastic, Teflon, or ceramic.
- the lid 144 serves as a top cover having a substrate supporting surface 146 disposed on the lower portion thereof.
- a substrate 148 is shown in parallel abutment to the substrate supporting surface 146 , and may be secured in this orientation via conventional substrate chucking methods.
- the container body 142 is preferably cylindrically shaped in order to accommodate the generally circular substrate 148 at one end thereof. However, other substrate shapes can be used as well.
- An electroplating solution inlet 150 is disposed at the bottom portion of the container body 142 .
- An electroplating solution may be pumped into the container body 142 by a suitable pump 151 connected to the inlet 150 .
- the solution may flow upwardly inside the container body 142 toward the substrate 148 to contact the exposed deposition surface 154 .
- a consumable anode 156 may be disposed in the container body 142 and configured to dissolve in the electroplating solution in order to provide metal particles to be deposited onto the substrate 148 to the plating solution.
- the anode 156 generally does not extend across the entire width of the container body 142 , thus allowing the electroplating solution to flow between the outer surface of the anode 156 and the inner surface of the container body 176 to the deposition surface 154 .
- an anode 156 consisting of an electrode and consumable metal particles may be encased in a fluid permeable membrane, such as a porous ceramic plate, to provide metal particles to be deposited onto the substrate to the plating solution.
- a porous non-consumable anode may also be disposed in the container body 142 so that the electroplating solution may pass therethrough.
- the electroplating solution should include a metal particle supply to continually replenish the metal particles to be deposited on the substrate 148 .
- the container body 142 generally includes an egress gap 158 bounded at an upper limit by a shoulder 164 of a cathode contact ring 152 .
- the gap 158 generally leads to an annular weir 143 that is substantially coplanar with (or slightly above) the substrate seating surface 168 , and thus, the deposition surface 154 .
- the weir 143 is positioned to ensure that the deposition surface 154 is in contact with the electroplating solution when the electroplating solution is flowing out of the egress gap 158 and over the weir 143 .
- the substrate 148 is secured to the substrate supporting surface 146 of the lid 144 by a plurality of vacuum passages 160 formed in the surface 146 , wherein passages 160 are generally connected at one end to a vacuum pump (not shown).
- the cathode contact ring 152 which is shown disposed between the lid 144 and the container body 142 , is connected to a power supply 149 to provide power to the substrate 148 .
- the contact ring 152 generally has a perimeter flange 162 partially disposed through the lid 144 , a sloping shoulder 164 conforming to the weir 143 , and an inner substrate seating surface 168 , which defines the diameter of the deposition surface 154 .
- the shoulder 164 is provided so that the inner substrate seating surface 168 is located below the flange 162 .
- This geometry allows the deposition surface 154 to come into contact with the electroplating solution before the solution flows into the egress gap 158 as discussed above.
- the contact ring design may be varied from that shown in FIG. 1 without departing from the scope of the present invention.
- the angle of the shoulder portion 164 may be altered or the shoulder portion 164 may be eliminated altogether so that the contact ring is substantially planar. Where a planar design is used, seals may be disposed between the contact ring 152 , the container body 142 and/or the lid 144 to form a fluid tight seal therebetween.
- the substrate seating surface 168 preferably extends a minimal radial distance inward below a perimeter edge of the substrate 148 , but a distance sufficient to establish electrical contact with a metal seed layer on the substrate deposition surface 154 .
- the exact inward radial extension of the substrate seating surface 168 may be varied according to application. However, in general this distance is minimized so that a maximum deposition surface 154 is exposed to the electroplating solution.
- the radial width of the seating surface 168 is 2 mm from the edge.
- Embodiments of the invention further include an anode spacer 170 disposed between the anode 156 and the deposition surface 154 .
- the anode spacer 170 includes and anode surface 172 and a substrate contact surface 174 .
- the anode surface 172 is positioned facing the anode 156 .
- the substrate contact surface 174 is positioned immediate the deposition surface of the substrate 154 .
- substrate contact surface 174 generally refers to the surface of the anode spacer 170 nearest the deposition surface 154 .
- the substrate contact surface 174 is defined further in reference to the specific embodiments described below.
- “immediate” refers to the substrate contact surface 174 being in physical contact and generally parallel to the deposition surface 154 when the substrate has been plated to a desired thickness, i.e., the substrate contact surface 174 may be in physical contact with the deposition surface 154 in some locations and may not be in physical contact with the deposition surface 154 in other locations, at any given time during plating, but substantially all of the substrate contact surface 174 will be in physical contact with the deposition surface 154 when the plating is complete.
- the anode spacer 170 is generally constructed to be substantially rigid, wherein, the term “rigid” indicates sufficient structural rigidity of the anode spacer 170 to limit deformation or bending of the anode spacer 170 under the normal operational conditions in the process cell 100 . Such deformation would bend the anode spacer 170 so that the center is nearer the nearest location on the substrate 148 than the periphery is to its closest location on the substrate 148 .
- the anode spacer 170 generally has a periphery substantially equivalent to the periphery of the substrate 148 .
- the anode spacer 170 may be formed from any suitable, nonconductive, substantially rigid material, such as PEEK, i.e., polyethelether ketone, commercially available from Victrex, of Greenville, S.C., for example, or similar plastic materials.
- PEEK i.e., polyethelether ketone
- the anode spacer 170 may be any vertical height and width sufficient to position the substrate contact surface 174 immediate with the deposition surface of the substrate 154 .
- the anode spacer's 170 vertical height may be between about 1 inch and about 12 inches.
- the anode spacer 170 may be disposed at any location in the container body 142 so that the substrate contact surface 174 is positioned immediate with deposition surface 154 .
- the substrate contact surface 174 of the anode spacer 170 may be positioned to physically contact the thickest portions of the deposition surface prior to plating 154 , or the anode spacer 170 may be positioned so that the substrate contact surface 174 is a predetermined distance away from the thickest portion of the deposition surface 154 , where the predetermined distance is equal to a distance that will provide a desired thickness copper to be plated on the substrate 148 .
- the anode spacer 170 may be positioned between the substrate seating surfaces 168 . It is also envisioned that the anode spacer 170 may be positioned above the inner substrate seating surface 168 , below and in contact with the substrate 148 .
- the anode spacer 170 may also be located anywhere in the container body 142 between the anode 156 and the substrate 148 , such that the substrate contact surface 174 is positioned immediate the deposition surface 154 .
- the anode spacer 170 may be secured to the cylindrical wall of the container body 142 so that the substrate contact surface 174 is immediate the deposition surface 146 .
- the anode spacer 170 may be applied to various process cells, having various anode configurations.
- Embodiments of the invention further contemplate rotating the anode spacer 170 in relation to the substrate 148 , thereby providing more uniform metal deposition on the deposition surface 154 .
- Rotating the anode spacer 170 ensures that all locations on the deposition surface 154 have an even layer of metal deposition.
- the anode spacer 170 may be moved horizontally in relation to the substrate 148 to provide uniform metal deposition on the deposition surface 154 . Further still, the anode spacer 170 may be agitated to provide uniform metal deposition of the deposition surface 154 .
- FIG. 2 illustrates a cross sectional view of a substrate 148 and an anode spacer 170 .
- the anode spacer 170 includes a plurality of pores 200 , through which the plating solution flows. Substantially all of the plating solution flows through the pores to contact the substrate deposition surface 154 .
- the pores are sized to permit ions generated by the anode 156 to pass therethrough. However, larger portions of the anode 156 , such as shavings, by-products, and other debris remaining in the solution (otherwise known collectively as anode sludge), do not flow through the anode spacer 170 , thereby keeping them from contacting the deposition surface 154 .
- the anode spacer 170 is designed with pores 200 having a diameter of between about 0.25 inches and about 1 inch.
- the anode spacer 170 may be formed of a metal, alloy, ceramic, plastic, or other suitable material. Although relatively few pores 200 are depicted in FIG. 2, in actuality, there may actually be a much larger number of pores 200 .
- the pores 200 are arranged in a geometric array, and are horizontally spaced from each neighboring pore 200 by about ⁇ fraction (1/10) ⁇ to about 1 ⁇ 2 of the pore's diameter.
- the pores 200 are generally of equal length and diameter.
- the substrate contact surface 174 of the anode spacer 170 is located adjacent the substrate deposition surface 154 , although the substrate contact surface 174 may be positioned a distance from the deposition surface 154 equal to the desired thickness of metal to be plated.
- the substrate contact surface 174 extends substantially across the anode spacer 170 .
- the pores 200 may be lined with a conductive material to deliver electrical current from the anode 156 to the deposition surface 154 via the conductive pore surface or via the electroplating solution flowing through the pore 200 .
- the conductive pore lining may include any suitable conductive material for communicating plating solution therethrough, without attracting metal ions from the plating solution.
- the conductive material may be a metal, such as gold, platinum, or graphite.
- the contact ring 152 is negatively charged to act as a cathode.
- the ions in the electroplating solution are attracted to the surface 154 by the negative charge.
- the ions then react with the surface 154 to form the desired film.
- an auxiliary electrode 167 may be used to control the shape of the electrical field over the deposition surface 154 .
- An auxiliary electrode 167 is shown disposed through the container body 142 adjacent an exhaust channel 169 . By positioning the auxiliary electrode 167 adjacent to the exhaust channel 169 , the electrode 167 able to maintain contact with the electroplating solution during processing and affect the electrical field.
- ionic current flows to the deposition surface 154 via the conductive pore surface.
- the pore lining is not in contact with the deposition surface 154 , therefore ionic current and electroplating solution flow to the deposition surface 154 .
- plating proceeds.
- the conductive pore 200 is in contact with the deposition surface 154 , i.e., at raised substrate locations 202 , ionic current does not flow to the deposition surface 154 , and therefore, no metal is plated on the substrate 148 at that location 202 . Therefore, plating will continue at the recessed location 204 until the conductive lining of the pore 200 is in contact with the substrate deposition surface 154 , thereby filling the recessed locations 202 and forming a uniform metal layer on the substrate 148 .
- the resistance of the pores 200 is lower than the resistance of the electroplating solution in order to maximize the ionic current traveling to the deposition surface 154 via the conductive pore lining. Maximizing the electrical current traveling via the pore lining ensures that the recessed areas of the deposition surface 204 will plate until the pore 200 is in contact with the deposition surface 154 . At the point that the pore 200 contacts the deposition surface 154 , plating ceases because insufficient ionic current will travel to the deposition surface 154 to plate the metal.
- the resistance of the conductive pores is about 10 times less than the resistance of the electroplating solution, thereby providing a higher current traveling to the lowest substrate surfaces via the pore lining.
- Alternative embodiments of the invention may include a plurality of anode spacers 170 located immediate the deposition surface 154 .
- a plurality of anode spacers 170 may be included to provide local uniformity to individual portions of the deposition surface 154 , rather than having the highest portion of the deposition surface 154 determine the thickness of the entire substrate 148 .
- the spacers 170 may be positioned to cooperatively cover the deposition surface, either when stationary or upon rotation.
- FIG. 3 illustrates an alternative embodiment of the present invention.
- the conductive inner surface of the pores 300 extends beyond the body of the anode spacer 170 .
- the plating solution flows from the anode 156 through the extended pores 300 to the deposition surface 154 .
- the substrate contact surface 174 is the position on the pore 300 closest the deposition surface, i.e., the part of the anode spacer 170 that will contact the deposition surface 154 .
- the pore extensions are generally of equal length and consist of the same conductive material as the body of the pore 300 .
- pores 300 of varying length e.g., the pores 300 may be spring loaded 302 , to provide varying levels of local uniformity to the substrate 148 .
- Metal deposition generally will not occur on the pore extensions, because the conductive material is such that it does not attract metal ions.
- An example of a suitable material is graphite.
- the pore extensions may continue from the pore body or may be separate from the pore body.
- FIG. 4 illustrates another embodiment of the present invention.
- the anode spacer 170 does not include pores, and therefore, no electroplating solution flows through the anode spacer 170 .
- the anode spacer 170 comprises a plurality of cylindrical spacers consisting of a conductive material that are configured to extend from the anode 156 to the substrate deposition surface 154 .
- the conductive material may include any suitable conductive material conducting electrical current, without attracting metal ions from the plating solution.
- the conductive material may be a metal, such as gold, platinum, or graphite. No metal deposition will occur on the anode spacers 170 because the conductive material is such that it does not attract metal ions.
Abstract
A method and apparatus for plating metal onto a substrate including positioning an anode spacer including a anode surface and a substrate contact surface with the substrate contact surface immediate a deposition surface of a substrate. The apparatus generally includes a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution, and an anode spacer positioned in the plating cell, the anode spacer having an anode surface, and a substrate contact surface positioned immediate a deposition surface of the substrate, the anode spacer configured to communicated the plating solution therethrough. The method generally includes positioning a substrate in a plating cell, positioning an anode spacer immediate a deposition surface of the substrate, and flowing a plating solution through the anode spacer to plate a metal onto the deposition surface.
Description
- 1. Field of the Invention
- The present invention generally relates to a method and apparatus for selectively depositing metals onto a substrate.
- 2. Description of the Related Art
- The production of sub-micron sized semiconductor features is a key technology for the next generation of very large scale integration (VLSI) and ultra large scale integration (ULSI) semiconductor devices. However, next generation ULSI and VLSI devices require a substantial decrease in interconnect dimensions, thereby imposing substantial manufacturing demands. Further, the features, such as vias and other interconnects, that lie at the heart of these technologies require precise processing. Reliable formation of these features is important to the success of VLSI and ULSI devices, and to the continued effort to increase circuit density and quality of individual substrates. Electroplating and electroless plating techniques have been found to efficiently and effectively fill features on semi-conductor devices.
- Copper has a lower resistivity, e.g., 1.7 μΩ-cm compared to 3.1 μΩ-cm for aluminum, and can carry a higher current density than aluminum. Therefore, it is generally desirable to use copper to form interconnects in semiconductor devices, rather than aluminum. Conventional copper electroplating solutions typically consist of copper sulfate, sulfuric acid and additives to aid in depositing copper on the surface of a substrate and in filling sub-micron sized features, e.g., vias and interconnects. The additives may include any combination of, but not limited to, levelers, brighteners, inhibitors, suppressors, enhancers, accelerators, and surfactants. The additives are typically organic molecules that adsorb onto the surface of the substrate. Certain additives may decrease the ionization rate of metal atoms, thereby inhibiting the deposition process, whereas other additives may increase the deposition rate of metal.
- One problem encountered in electroplating copper on a substrate is that the flow of electroplating solution over the substrate may not be uniform. Non-uniform flow of the electroplating solution provides uneven distribution of the copper ions to the substrate, which can lead to variations in the plating rate on the substrate. Variations in the plating rate may result in an uneven depth of copper deposition on the substrate. In addition, the substrate features often have an uneven topography, which may lead to voids in the feature upon plating.
- There is a need, therefore, for an apparatus and a method for selectively depositing a metal onto a substrate to provide uniform metal deposition across the substrate.
- Embodiments of the invention generally provide an apparatus for plating metal on a substrate having a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution, and an anode spacer positioned in the plating cell. The anode spacer has an anode surface and a substrate contact surface positioned immediate a deposition surface of the substrate. The anode spacer is configured to communicate the plating solution to the surface of the substrate.
- Embodiments of the invention further provide an apparatus for controlling metal deposition on a substrate. The apparatus includes an anode spacer, wherein the anode spacer has a periphery substantially equivalent to the periphery of the substrate. The anode spacer is generally configured to communicate a plating solution therethrough, and the anode spacer generally includes an anode surface and a substrate contact surface positioned immediate a deposition surface of the substrate.
- Embodiments of the invention further provide a method for plating a metal on a substrate, wherein the method includes including positioning a substrate in a plating cell, positioning an anode spacer immediate a deposition surface of the substrate, and flowing a plating solution through the anode spacer to plate a metal onto the deposition surface.
- Embodiments of the invention further provide an apparatus for plating metal on a substrate. The apparatus generally includes a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution; and an anode spacer positioned in the plating cell. The anode spacer generally includes an anode surface, a substrate contact surface positioned a distance from a deposition surface of the substrate sufficient to uniformly plate a metal to a desired thickness, and a plurality of pores to communicate the plating solution to the deposition surface having an electrical resistance lower than the electrical resistance of the plating solution.
- Embodiments of the invention further provide a method for plating a metal layer on a substrate. The method generally includes positioning a substrate having recessed locations and raised locations in a plating cell, positioning an anode spacer having a plurality of pores immediate a deposition surface of the substrate, and flowing a plating solution having a higher resistance than the plurality of pores through the plurality of pores, thereby plating the recessed locations until the substrate is in contact with the plurality of pores.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof, which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention, and are therefore, not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
- FIG. 1 is a cross sectional view of a cell for electroplating a metal onto a substrate.
- FIG. 2 is a cross sectional view of the anode spacer of an exemplary embodiment of the present invention.
- FIG. 3 is a cross sectional view of the anode spacer of an alternative embodiment of the present invention.
- FIG. 4 is a cross sectional view of the anode spacer of an alternative embodiment of the present invention.
- FIG. 1 illustrates a partial cross sectional schematic view of an exemplary
electroplating cell 100 of the invention. Theelectroplating cell 100 generally includes acontainer body 142 having an opening on a top portion of thecontainer body 142 to receive and support alid 144. Thecontainer body 142 is preferably made of an electrically insulative material, such as a plastic, Teflon, or ceramic. Thelid 144 serves as a top cover having asubstrate supporting surface 146 disposed on the lower portion thereof. Asubstrate 148 is shown in parallel abutment to thesubstrate supporting surface 146, and may be secured in this orientation via conventional substrate chucking methods. Thecontainer body 142 is preferably cylindrically shaped in order to accommodate the generallycircular substrate 148 at one end thereof. However, other substrate shapes can be used as well. - An
electroplating solution inlet 150 is disposed at the bottom portion of thecontainer body 142. An electroplating solution may be pumped into thecontainer body 142 by asuitable pump 151 connected to theinlet 150. The solution may flow upwardly inside thecontainer body 142 toward thesubstrate 148 to contact the exposeddeposition surface 154. Aconsumable anode 156 may be disposed in thecontainer body 142 and configured to dissolve in the electroplating solution in order to provide metal particles to be deposited onto thesubstrate 148 to the plating solution. Theanode 156 generally does not extend across the entire width of thecontainer body 142, thus allowing the electroplating solution to flow between the outer surface of theanode 156 and the inner surface of thecontainer body 176 to thedeposition surface 154. Alternatively, ananode 156 consisting of an electrode and consumable metal particles may be encased in a fluid permeable membrane, such as a porous ceramic plate, to provide metal particles to be deposited onto the substrate to the plating solution. A porous non-consumable anode may also be disposed in thecontainer body 142 so that the electroplating solution may pass therethrough. However, when a non-consumable anode is included, the electroplating solution should include a metal particle supply to continually replenish the metal particles to be deposited on thesubstrate 148. - The
container body 142 generally includes anegress gap 158 bounded at an upper limit by ashoulder 164 of acathode contact ring 152. Thegap 158 generally leads to anannular weir 143 that is substantially coplanar with (or slightly above) thesubstrate seating surface 168, and thus, thedeposition surface 154. Theweir 143 is positioned to ensure that thedeposition surface 154 is in contact with the electroplating solution when the electroplating solution is flowing out of theegress gap 158 and over theweir 143. During processing, thesubstrate 148 is secured to thesubstrate supporting surface 146 of thelid 144 by a plurality ofvacuum passages 160 formed in thesurface 146, whereinpassages 160 are generally connected at one end to a vacuum pump (not shown). Thecathode contact ring 152, which is shown disposed between thelid 144 and thecontainer body 142, is connected to apower supply 149 to provide power to thesubstrate 148. Thecontact ring 152 generally has aperimeter flange 162 partially disposed through thelid 144, a slopingshoulder 164 conforming to theweir 143, and an innersubstrate seating surface 168, which defines the diameter of thedeposition surface 154. Theshoulder 164 is provided so that the innersubstrate seating surface 168 is located below theflange 162. This geometry allows thedeposition surface 154 to come into contact with the electroplating solution before the solution flows into theegress gap 158 as discussed above. However, as noted above, the contact ring design may be varied from that shown in FIG. 1 without departing from the scope of the present invention. Thus, the angle of theshoulder portion 164 may be altered or theshoulder portion 164 may be eliminated altogether so that the contact ring is substantially planar. Where a planar design is used, seals may be disposed between thecontact ring 152, thecontainer body 142 and/or thelid 144 to form a fluid tight seal therebetween. - The
substrate seating surface 168 preferably extends a minimal radial distance inward below a perimeter edge of thesubstrate 148, but a distance sufficient to establish electrical contact with a metal seed layer on thesubstrate deposition surface 154. The exact inward radial extension of thesubstrate seating surface 168 may be varied according to application. However, in general this distance is minimized so that amaximum deposition surface 154 is exposed to the electroplating solution. In an exemplary embodiment, the radial width of theseating surface 168 is 2 mm from the edge. - Embodiments of the invention further include an
anode spacer 170 disposed between theanode 156 and thedeposition surface 154. Theanode spacer 170 includes andanode surface 172 and asubstrate contact surface 174. Theanode surface 172 is positioned facing theanode 156. Thesubstrate contact surface 174 is positioned immediate the deposition surface of thesubstrate 154. As used herein,substrate contact surface 174 generally refers to the surface of theanode spacer 170 nearest thedeposition surface 154. Thesubstrate contact surface 174 is defined further in reference to the specific embodiments described below. As used herein, “immediate” refers to thesubstrate contact surface 174 being in physical contact and generally parallel to thedeposition surface 154 when the substrate has been plated to a desired thickness, i.e., thesubstrate contact surface 174 may be in physical contact with thedeposition surface 154 in some locations and may not be in physical contact with thedeposition surface 154 in other locations, at any given time during plating, but substantially all of thesubstrate contact surface 174 will be in physical contact with thedeposition surface 154 when the plating is complete. - The
anode spacer 170 is generally constructed to be substantially rigid, wherein, the term “rigid” indicates sufficient structural rigidity of theanode spacer 170 to limit deformation or bending of theanode spacer 170 under the normal operational conditions in theprocess cell 100. Such deformation would bend theanode spacer 170 so that the center is nearer the nearest location on thesubstrate 148 than the periphery is to its closest location on thesubstrate 148. Theanode spacer 170 generally has a periphery substantially equivalent to the periphery of thesubstrate 148. Theanode spacer 170 may be formed from any suitable, nonconductive, substantially rigid material, such as PEEK, i.e., polyethelether ketone, commercially available from Victrex, of Greenville, S.C., for example, or similar plastic materials. - The
anode spacer 170 may be any vertical height and width sufficient to position thesubstrate contact surface 174 immediate with the deposition surface of thesubstrate 154. The anode spacer's 170 vertical height may be between about 1 inch and about 12 inches. Theanode spacer 170 may be disposed at any location in thecontainer body 142 so that thesubstrate contact surface 174 is positioned immediate withdeposition surface 154. For example, thesubstrate contact surface 174 of theanode spacer 170 may be positioned to physically contact the thickest portions of the deposition surface prior to plating 154, or theanode spacer 170 may be positioned so that thesubstrate contact surface 174 is a predetermined distance away from the thickest portion of thedeposition surface 154, where the predetermined distance is equal to a distance that will provide a desired thickness copper to be plated on thesubstrate 148. In another embodiment, theanode spacer 170 may be positioned between the substrate seating surfaces 168. It is also envisioned that theanode spacer 170 may be positioned above the innersubstrate seating surface 168, below and in contact with thesubstrate 148. Theanode spacer 170 may also be located anywhere in thecontainer body 142 between theanode 156 and thesubstrate 148, such that thesubstrate contact surface 174 is positioned immediate thedeposition surface 154. In an alternative embodiment, theanode spacer 170 may be secured to the cylindrical wall of thecontainer body 142 so that thesubstrate contact surface 174 is immediate thedeposition surface 146. Theanode spacer 170 may be applied to various process cells, having various anode configurations. - Embodiments of the invention further contemplate rotating the
anode spacer 170 in relation to thesubstrate 148, thereby providing more uniform metal deposition on thedeposition surface 154. Rotating theanode spacer 170 ensures that all locations on thedeposition surface 154 have an even layer of metal deposition. Alternatively, theanode spacer 170 may be moved horizontally in relation to thesubstrate 148 to provide uniform metal deposition on thedeposition surface 154. Further still, theanode spacer 170 may be agitated to provide uniform metal deposition of thedeposition surface 154. - FIG. 2 illustrates a cross sectional view of a
substrate 148 and ananode spacer 170. Theanode spacer 170 includes a plurality ofpores 200, through which the plating solution flows. Substantially all of the plating solution flows through the pores to contact thesubstrate deposition surface 154. The pores are sized to permit ions generated by theanode 156 to pass therethrough. However, larger portions of theanode 156, such as shavings, by-products, and other debris remaining in the solution (otherwise known collectively as anode sludge), do not flow through theanode spacer 170, thereby keeping them from contacting thedeposition surface 154. Theanode spacer 170 is designed withpores 200 having a diameter of between about 0.25 inches and about 1 inch. Theanode spacer 170 may be formed of a metal, alloy, ceramic, plastic, or other suitable material. Although relativelyfew pores 200 are depicted in FIG. 2, in actuality, there may actually be a much larger number ofpores 200. Preferably, thepores 200 are arranged in a geometric array, and are horizontally spaced from each neighboringpore 200 by about {fraction (1/10)} to about ½ of the pore's diameter. Thepores 200 are generally of equal length and diameter. Thesubstrate contact surface 174 of theanode spacer 170 is located adjacent thesubstrate deposition surface 154, although thesubstrate contact surface 174 may be positioned a distance from thedeposition surface 154 equal to the desired thickness of metal to be plated. Thesubstrate contact surface 174 extends substantially across theanode spacer 170. - The
pores 200 may be lined with a conductive material to deliver electrical current from theanode 156 to thedeposition surface 154 via the conductive pore surface or via the electroplating solution flowing through thepore 200. The conductive pore lining may include any suitable conductive material for communicating plating solution therethrough, without attracting metal ions from the plating solution. The conductive material may be a metal, such as gold, platinum, or graphite. - In operation, the
contact ring 152 is negatively charged to act as a cathode. As the electroplating solution is flowed across thesubstrate surface 154, the ions in the electroplating solution are attracted to thesurface 154 by the negative charge. The ions then react with thesurface 154 to form the desired film. In addition to theanode 156 and thecathode contact ring 152, anauxiliary electrode 167 may be used to control the shape of the electrical field over thedeposition surface 154. Anauxiliary electrode 167 is shown disposed through thecontainer body 142 adjacent anexhaust channel 169. By positioning theauxiliary electrode 167 adjacent to theexhaust channel 169, theelectrode 167 able to maintain contact with the electroplating solution during processing and affect the electrical field. - Generally, ionic current flows to the
deposition surface 154 via the conductive pore surface. At recessedsubstrate locations 204, the pore lining is not in contact with thedeposition surface 154, therefore ionic current and electroplating solution flow to thedeposition surface 154. As a result, plating proceeds. When theconductive pore 200 is in contact with thedeposition surface 154, i.e., at raisedsubstrate locations 202, ionic current does not flow to thedeposition surface 154, and therefore, no metal is plated on thesubstrate 148 at thatlocation 202. Therefore, plating will continue at the recessedlocation 204 until the conductive lining of thepore 200 is in contact with thesubstrate deposition surface 154, thereby filling the recessedlocations 202 and forming a uniform metal layer on thesubstrate 148. - In one embodiment, the resistance of the
pores 200 is lower than the resistance of the electroplating solution in order to maximize the ionic current traveling to thedeposition surface 154 via the conductive pore lining. Maximizing the electrical current traveling via the pore lining ensures that the recessed areas of thedeposition surface 204 will plate until thepore 200 is in contact with thedeposition surface 154. At the point that thepore 200 contacts thedeposition surface 154, plating ceases because insufficient ionic current will travel to thedeposition surface 154 to plate the metal. In an exemplary embodiment of the invention, the resistance of the conductive pores is about 10 times less than the resistance of the electroplating solution, thereby providing a higher current traveling to the lowest substrate surfaces via the pore lining. - Alternative embodiments of the invention may include a plurality of
anode spacers 170 located immediate thedeposition surface 154. A plurality ofanode spacers 170 may be included to provide local uniformity to individual portions of thedeposition surface 154, rather than having the highest portion of thedeposition surface 154 determine the thickness of theentire substrate 148. Thespacers 170 may be positioned to cooperatively cover the deposition surface, either when stationary or upon rotation. - FIG. 3 illustrates an alternative embodiment of the present invention. In this embodiment, the conductive inner surface of the
pores 300 extends beyond the body of theanode spacer 170. The plating solution flows from theanode 156 through theextended pores 300 to thedeposition surface 154. Thesubstrate contact surface 174 is the position on thepore 300 closest the deposition surface, i.e., the part of theanode spacer 170 that will contact thedeposition surface 154. The pore extensions are generally of equal length and consist of the same conductive material as the body of thepore 300. Alternative embodiments of the invention contemplatepores 300 of varying length, e.g., thepores 300 may be spring loaded 302, to provide varying levels of local uniformity to thesubstrate 148. Metal deposition generally will not occur on the pore extensions, because the conductive material is such that it does not attract metal ions. An example of a suitable material is graphite. The pore extensions may continue from the pore body or may be separate from the pore body. - Generally, current flows to the
deposition surface 154 via the conductive pore extensions. At recessedsubstrate locations 204, ionic current flows to thedeposition surface 154, and therefore, plating proceeds. When the conductive pore lining 300 is in contact with thedeposition surface 154, i.e., at raisedsubstrate locations 202, ionic current no longer flows to thedeposition surface 154, and therefore, no metal is plated on thesubstrate 148 at thatlocation 202. As a result, plating will continue at the recessedlocations 204 until the conductive lining of thepore 300 is in contact with thesubstrate deposition surface 154, thereby filling the recessedlocations 202 and forming a uniform metal layer on thesubstrate 148. - FIG. 4 illustrates another embodiment of the present invention. The
anode spacer 170 does not include pores, and therefore, no electroplating solution flows through theanode spacer 170. In this embodiment, theanode spacer 170 comprises a plurality of cylindrical spacers consisting of a conductive material that are configured to extend from theanode 156 to thesubstrate deposition surface 154. The conductive material may include any suitable conductive material conducting electrical current, without attracting metal ions from the plating solution. The conductive material may be a metal, such as gold, platinum, or graphite. No metal deposition will occur on theanode spacers 170 because the conductive material is such that it does not attract metal ions. - While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (62)
1. An apparatus for plating metal on a substrate, comprising:
a plating cell configured to contain a plating solution therein;
an anode disposed in the plating solution; and
an anode spacer positioned in the plating cell, the anode spacer comprising:
an anode surface; and
a substrate contact surface positioned immediate a deposition surface of the substrate, the anode spacer configured to communicate the plating solution therethrough.
2. The apparatus of claim 1 , wherein the anode spacer is substantially rigid.
3. The apparatus of claim 1 , wherein the anode spacer has a periphery substantially equivalent to a periphery of the substrate.
4. The apparatus of claim 1 , wherein the substrate contact surface is positioned a distance from the substrate deposition surface equal to the thickness of the metal to be plated on the deposition surface.
5. The apparatus of claim 1 , wherein an electrical current passes through a plurality of conductive pores formed into the anode spacer.
6. The apparatus of claim 1 , wherein an electrical current passes through a plurality of conductive pores formed in the anode spacer and the plurality of conductive pore have an electrical resistance lower than an electrical resistance of the plating solution.
7. The apparatus of claim 1 , wherein a plurality of pores disposed in the anode spacer interconnect the anode surface and the substrate contact surface.
8. The apparatus of claim 7 , wherein each of the plurality of pores are of equal longitudinal length.
9. The apparatus of claim 7 , wherein each of the plurality of pores are of equal diameter.
10. The apparatus of claim 7 , wherein the plurality of pores are lined with a conductive material.
11. The apparatus of claim 7 , wherein the plurality of pores are lined with at least one of gold, platinum, and graphite.
12. The apparatus of claim 7 , wherein the plurality of pores are lined with a conductive material extending past the substrate contact surface.
13. The apparatus of claim 12 , wherein the plurality of pores have an adjustable length.
14. The apparatus of claim 12 , wherein each of the plurality of pores are lined with graphite extending past the substrate contact surface an equal longitudinal distance.
15. The apparatus of claim 1 , wherein the anode spacer comprises a plurality of anode spacers.
16. The apparatus of claim 1 , wherein the anode spacer further comprises a plurality of spacers extending from the anode toward the deposition surface.
17. The apparatus of claim 16 , wherein the plurality of spacers are composed of a conductive material.
18. The apparatus of claim 16 , wherein the plurality of spacers are composed of a conductive material selected from the group essentially comprising gold, platinum, and graphite.
19. A method for plating a metal layer on a substrate, comprising:
positioning a substrate in a plating cell;
positioning an anode spacer immediate a deposition surface of the substrate;
and
flowing a plating solution through the anode spacer to plate a metal onto the deposition surface.
20. The method of claim 19 , further comprising rotating the anode spacer in relation to the deposition surface.
21. The method of claim 19 , wherein flowing a plating solution through the anode spacer comprises flowing the plating solution through a plurality of pores extending through the anode spacer.
22. The method of claim 19 , wherein flowing a plating solution through the anode spacer comprises flowing the plating solution through a plurality of pores extending through the anode spacer lined with a conductive material.
23. The method of claim 19 , wherein flowing a plating solution through the anode spacer comprises flowing the plating solution through a plurality of pores extending through the anode spacer lined with a conductive material selected from the group essentially comprising gold, platinum, and graphite.
24. The method of claim 19 , further comprising generating an electrical bias between an anode and the substrate.
25. The method of claim 19 , further comprising generating an electrical current to pass from an anode to the substrate through a plurality of conductive pores in the anode spacer.
26. The method of claim 19 , wherein the metal is copper.
27. The method of claim 19 , wherein positioning the anode spacer comprises positioning a plurality of anode spacers.
28. The method of claim 19 , wherein positioning the anode spacer comprises positioning a plurality of anode spacers in contact with the anode extending toward the deposition surface.
29. The method of claim 28 , wherein the plurality of spacers are composed of a conductive material.
30. The method of claim 28 , wherein the plurality of spacers are composed of gold, platinum, or graphite, or a combination thereof.
31. An apparatus for controlling metal deposition on a substrate, comprising an anode spacer, wherein the anode spacer has a periphery substantially equivalent to the periphery of the substrate, the anode spacer is configured to communicate a plating solution therethrough, and the anode spacer includes an anode surface and a substrate contact surface positioned immediate a deposition surface of the substrate.
32. The apparatus of claim 31 , wherein the anode spacer is substantially rigid.
33. The apparatus of claim 31 , wherein a plurality of pores interconnect the anode surface and the substrate contact surface.
34. The apparatus of claim 33 , wherein each of the plurality of pores are of equal longitudinal length.
35. The apparatus of claim 33 , wherein each of the plurality of pores are of equal diameter.
36. The apparatus of claim 33 , wherein the plurality of pores are lined with a conductive material.
37. The apparatus of claim 33 , wherein the plurality of pores are lined with gold, platinum, or graphite, or a combination thereof.
38. The apparatus of claim 33 , wherein the plurality of pores are lined with a conductive material extending beyond the substrate contact surface.
39. The apparatus of claim 38 , wherein the plurality of pores have an adjustable length.
40. The apparatus of claim 33 , wherein each of the plurality of pores are lined with graphite extending past the substrate contact surface an equal longitudinal distance.
41. The apparatus of claim 31 , wherein the anode spacer comprises a plurality of anode spacers.
42. The apparatus of claim 31 , wherein the anode spacer further comprises a plurality of cylindrical spacers of equal longitudinal length and diameter.
43. The apparatus of claim 42 , wherein the plurality of spacers are composed of a conductive material.
44. The apparatus of claim 42 , wherein the plurality of spacers are composed of a conductive material selected from the group essentially comprising gold, platinum, and graphite.
45. An apparatus for plating metal on a substrate, comprising:
a plating cell configured to contain a plating solution therein;
an anode disposed in the plating solution; and
an anode spacer positioned in the plating cell, the anode spacer comprising:
an anode surface;
a substrate contact surface positioned a distance from a deposition surface of the substrate sufficient to uniformly plate a metal to a desired thickness; and
a plurality of pores to communicate the plating solution to the deposition surface having an electrical resistance higher than the electrical resistance of the plating solution.
46. The apparatus of claim 45 , wherein the anode spacer is substantially rigid.
47. The apparatus of claim 45 , wherein the anode spacer has a periphery substantially equivalent to a periphery of the substrate.
48. The apparatus of claim 45 , wherein the plurality of pores are of equal longitudinal length.
49. The apparatus of claim 45 , wherein each of the plurality of pores are of equal diameter.
50. The apparatus of claim 45 , wherein the plurality of pores are lined with a conductive material.
51. The apparatus of claim 45 , wherein the plurality of pores are lined with at least one of gold, platinum, and graphite.
52. The apparatus of claim 45 , wherein the plurality of pores are lined with a conductive material extending past the substrate contact surface.
53. The apparatus of claim 52 , wherein the plurality of pores have an adjustable length.
54. The apparatus of claim 52 , wherein each of the plurality of pores are lined with graphite extending past the substrate contact surface an equal longitudinal distance.
55. The apparatus of claim 45 , wherein the anode spacer comprises a plurality of anode spacers.
56. A method for plating a metal layer on a substrate, comprising:
positioning a substrate having recessed locations and raised locations in a plating cell;
positioning an anode spacer having a plurality of pores immediate a deposition surface of the substrate; and
flowing a plating solution having a higher resistance than the plurality of pores through the plurality of pores thereby plating the recessed locations until the substrate is in contact with the plurality of pores.
57. The method of claim 56 , further comprising rotating the anode spacer in relation to the deposition surface.
58. The method of claim 56 , wherein the plurality of pores extend through the anode spacer.
59. The method of claim 56 , wherein flowing a plating solution through the plurality of pores comprises flowing the plating solution through a plurality of pores lined with a conductive material extending through the anode spacer.
60. The method of claim 56 , wherein flowing a plating solution through the plurality of pores comprises flowing the plating solution through a plurality of pores extending through the anode spacer lined with a conductive material selected from the group essentially comprising gold, platinum, and graphite.
61. The method of claim 56 , wherein positioning the anode spacer comprises positioning a plurality of anode spacers in contact with the anode extending toward the deposition surface.
62. The method of claim 61 , wherein the plurality of spacers are composed of a conductive material.
Priority Applications (1)
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US10/095,785 US20030168344A1 (en) | 2002-03-08 | 2002-03-08 | Selective metal deposition for electrochemical plating |
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US10/095,785 US20030168344A1 (en) | 2002-03-08 | 2002-03-08 | Selective metal deposition for electrochemical plating |
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US10/095,785 Abandoned US20030168344A1 (en) | 2002-03-08 | 2002-03-08 | Selective metal deposition for electrochemical plating |
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