US20030182799A1 - Method for forming heat conductive device of superconductive metal block - Google Patents

Method for forming heat conductive device of superconductive metal block Download PDF

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Publication number
US20030182799A1
US20030182799A1 US10/396,759 US39675903A US2003182799A1 US 20030182799 A1 US20030182799 A1 US 20030182799A1 US 39675903 A US39675903 A US 39675903A US 2003182799 A1 US2003182799 A1 US 2003182799A1
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Prior art keywords
heat conductive
superconductive
heat
containers
metal block
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Abandoned
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US10/396,759
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Jefferson Liu
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/0072—Casting in, on, or around objects which form part of the product for making objects with integrated channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to heat conductive device, and particularly to a method for forming a heat conductive device of superconductive metal block which comprises the steps of: placing at least one heat conductive superconductive tubes or containers and into a die-casting or casting mold; shaping heat conductive superconductive tubes or containers and melting metals into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body.
  • heat dissipating devices for low power CPUs or high heat sources are made by metal bases with metal fin sets so as to absorb heat and then dissipate heat by a fan.
  • a metal base is distant from the distal end of the fins, but only the base is in contact with the heat source (CPU). Thereby, the heat absorbed by the base can not be transferred to the distal end of the fins in short time. Moreover, the heat absorbed by the base is not identical to that in the fin. Thereby, only the roots of the fins near the base have the ability to dissipate heat effectively, but the distal ends of fins have only little effect in heat dissipation. Therefore, the above mentioned prior art can not match to the need of the high speed CPU capacity.
  • the primary object of the present invention is to provide a method for forming a heat conductive device of superconductive metal block comprising the steps of: placing at least one heat conductive superconductive tubes or containers and into a die-casting or casting mold; shaping heat conductive superconductive tubes or containers and melting metals into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body.
  • Another object of the present invention is to provide a method for forming a heat conductive device of superconductive metal block, wherein the metal block is a high heat conductivity metal.
  • the metal block is integrally formed with fins.
  • the heat conductive superconductive tube is bent to have a helical shape.
  • the heat conductive superconductive tube is bent as a U shape.
  • the heat conductive superconductive tube is bent to have a three dimensional shape. There are a plurality of metal blocks which are stack packed one by one.
  • FIG. 1 shows the conductive metal block according to the first embodiment of the present invention.
  • FIG. 2 shows the conductive metal block according to the second embodiment of the present invention.
  • FIG. 3 shows the conductive metal block according to the third embodiment of the present invention.
  • FIG. 4 shows the conductive metal block according to the fourth embodiment of the present invention.
  • FIG. 5 shows the conductive metal block according to the fifth embodiment of the present invention.
  • FIG. 6 shows the conductive metal block according to the sixth embodiment of the present invention.
  • FIGS. 7 and 8 shows the conductive metal block according to the seventh embodiment of the present invention.
  • Inorganic high temperature super conductor compound such as yttrium barium copper oxide (YBCO) super conductor material, thallium barium calcium copper oxide (TBCCO) super conductor material, mercury barium calcium copper oxide (HBCCO) super conductor material, bismuth strontium calcium copper oxide (BSCCO) super conductor material or other inorganic material.
  • YBCO yttrium barium copper oxide
  • TBCCO thallium barium calcium copper oxide
  • HBCCO mercury barium calcium copper oxide
  • BSCCO bismuth strontium calcium copper oxide
  • One of the materials is organic material, such as water or other organ super conductor.
  • the heat conducting element is formed as a heat conduction super conductor tube or container.
  • inorganic material is filled in the heat conductive superconductive tubes or containers, when heat is transferred to the tube or containers, the molecules therein will oscillate dramatically and rubber the wall of the tube or containers so that heat energy will transfer by mechanic waves.
  • the heat conductive superconductive tube 2 is bent to have a rectangular shape. Then melting metal 11 is molded as a rectangular tube so that the heat conductive superconductive tube is being enclosed in the melting metal so as to formed a heat conductive device of superconductive metal block. Thereby, when the metal block is in contact with heat source, heat can be transferred to the other end through the heat conductive superconductive tube 2 so as to improve the heat transfer efficiency of the heat conductive device of superconductive metal block.
  • the metal 11 can be molded to have a flat shape. Then a part of the heat conductive superconductive tube 2 being enclosing in the metal 11 and another portion of the heat conductive superconductive tube is extended out of the metal 11 so that the heat conductive superconductive tube is connected to heat dissipating elements for heat conduction. In this embodiment, two ends of the heat conductive superconductive tube are exposed out.
  • FIG. 4 another embodiment of embodiment is illustrated. Two ends of the heat conductive superconductive tubes 2 are embedded into two metal 11 , and the middle sections of the heat conductive superconductive tubes 2 are exposed.
  • the present invention has the similar structure as those in FIG. 4, while a plurality of fins are formed on a surface of each metal block so as for dissipating heat.
  • the metal block 1 are made as a U shape, wherein a plurality of heat conductive superconductive tubes 2 are whole embedded in the metal 11 .
  • the heat conductive superconductive tube 2 can be formed with a spiral shape and then the heat conductive superconductive tube 2 is placed in the metal 11 so as to formed with a first metal block 1 . Then a CPU 4 is placed upon a second metal block 1 . Then a dissipating fin set 3 is placed upon the first metal block 1 so that heat from the CPU 4 can be transferred out rapidly from the metal block 1 to the dissipating fin set 3 .
  • the metal block can be installed between a heat source and a dissipating fin set or a casing. Then a fan is installed at the side of the dissipating fin set or the casing for dissipating heat.
  • the present invention can be used to improve this condition.
  • the heat conductive superconductive tubes or container can be bent with other three dimensional shape so as to suit the requirement of the installing space and thus have a preferred effect with the metal block.

Abstract

A method for forming a heat conductive device of superconductive metal block comprises the steps of: placing at least one heat conductive superconductive tubes or containers and melting metal material into a mold; shaping heat conductive superconductive tubes or containers and melting metal material into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body. The metal block is a high heat conductivity metal, which may be integrally formed with fins. Furthermore, the heat conductive superconductive tube or container is bent to have a helical shape. The heat conductive superconductive tube or container is bent as a U shape or is bent to have a three dimensional shape. Moreover, there are a plurality of metal blocks which are stack packed one by one.

Description

    FIELD OF THE INVENTION
  • The present invention relates to heat conductive device, and particularly to a method for forming a heat conductive device of superconductive metal block which comprises the steps of: placing at least one heat conductive superconductive tubes or containers and into a die-casting or casting mold; shaping heat conductive superconductive tubes or containers and melting metals into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body. [0001]
    • BACKGROUND OF THE INVENTION
  • Currently, heat dissipating devices for low power CPUs or high heat sources are made by metal bases with metal fin sets so as to absorb heat and then dissipate heat by a fan. [0002]
  • This prior art way of using aluminum to make heat dissipating device is effective by low speed CPUs, but for CPUs with a high operation speed, a larger amount of heat can not be dissipated effectively. Thereby, copper is used to make heat dissipating device, which has a better heat conductivity. However, since the specific density of copper is 8.93 g/cm3 and aluminum is 2.7 g/cm3, to use copper as material for making heat dissipating device is too heavy to be accepted by user. Furthermore, copper is too heavy to pass through the experiment of collision and copper possibly causes the CPU to deform. Moreover, in practical use, copper is embedded into aluminum by forging and welding. [0003]
  • However, there are other materials which are more suitable for making heat dissipating device and other way, such as molding, can be used for making the heat dissipating device. Thereby, the present invention is desired to provide a method for solving the defect in the prior art. [0004]
  • Furthermore, in general design of the heat dissipating device to a CPU, a metal base is distant from the distal end of the fins, but only the base is in contact with the heat source (CPU). Thereby, the heat absorbed by the base can not be transferred to the distal end of the fins in short time. Moreover, the heat absorbed by the base is not identical to that in the fin. Thereby, only the roots of the fins near the base have the ability to dissipate heat effectively, but the distal ends of fins have only little effect in heat dissipation. Therefore, the above mentioned prior art can not match to the need of the high speed CPU capacity. [0005]
    • SUMMARY OF THE INVENTION
  • Accordingly, the primary object of the present invention is to provide a method for forming a heat conductive device of superconductive metal block comprising the steps of: placing at least one heat conductive superconductive tubes or containers and into a die-casting or casting mold; shaping heat conductive superconductive tubes or containers and melting metals into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body. [0006]
  • Another object of the present invention is to provide a method for forming a heat conductive device of superconductive metal block, wherein the metal block is a high heat conductivity metal. The metal block is integrally formed with fins. The heat conductive superconductive tube is bent to have a helical shape. The heat conductive superconductive tube is bent as a U shape. The heat conductive superconductive tube is bent to have a three dimensional shape. There are a plurality of metal blocks which are stack packed one by one. [0007]
  • The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.[0008]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows the conductive metal block according to the first embodiment of the present invention. [0009]
  • FIG. 2 shows the conductive metal block according to the second embodiment of the present invention. [0010]
  • FIG. 3 shows the conductive metal block according to the third embodiment of the present invention. [0011]
  • FIG. 4 shows the conductive metal block according to the fourth embodiment of the present invention. [0012]
  • FIG. 5 shows the conductive metal block according to the fifth embodiment of the present invention. [0013]
  • FIG. 6 shows the conductive metal block according to the sixth embodiment of the present invention. [0014]
  • FIGS. 7 and 8 shows the conductive metal block according to the seventh embodiment of the present invention.[0015]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The method for forming a heat conductive superconductive metal block of the present invention will be described in the following. [0016]
  • Placing heat conductive superconductive tubes or containers and good heat conductive metal into a die-casting or casting mold. [0017]
  • Shaping heat conductive superconductive tubes or containers and melting metals into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metals so as to be as an integral body, wherein the heat conductive superconductive tubes or containers are bendable metal tubes or containers, such as copper, aluminum, etc. The interior of the heat conductive superconductive tube or container is filled with high heat conductive materials, for example: [0018]
  • Inorganic high temperature super conductor compound, such as yttrium barium copper oxide (YBCO) super conductor material, thallium barium calcium copper oxide (TBCCO) super conductor material, mercury barium calcium copper oxide (HBCCO) super conductor material, bismuth strontium calcium copper oxide (BSCCO) super conductor material or other inorganic material. [0019]
  • One of the materials is organic material, such as water or other organ super conductor. [0020]
  • Other material can conduct heat with a high speed. [0021]
  • In the present invention, two sides of the tube or container are closed so that the heat conductor material therein will not drain out. Thereby, the heat conducting element is formed as a heat conduction super conductor tube or container. [0022]
  • If inorganic material is filled in the heat conductive superconductive tubes or containers, when heat is transferred to the tube or containers, the molecules therein will oscillate dramatically and rubber the wall of the tube or containers so that heat energy will transfer by mechanic waves. [0023]
  • When organ material is filled in the heat conductive superconductive tube or containers, the heat transfer is performed by heat convection. The heat transfer speed is very high. By experiment, it is shown that the speed of heat convention is five times of heat transfer speed in copper and over ten times of heat transfer speed in aluminum. [0024]
  • Referring to FIG. 1, the heat conductive [0025] superconductive tube 2 is bent to have a rectangular shape. Then melting metal 11 is molded as a rectangular tube so that the heat conductive superconductive tube is being enclosed in the melting metal so as to formed a heat conductive device of superconductive metal block. Thereby, when the metal block is in contact with heat source, heat can be transferred to the other end through the heat conductive superconductive tube 2 so as to improve the heat transfer efficiency of the heat conductive device of superconductive metal block.
  • As shown in FIG. 2, in the present invention, the [0026] metal 11 can be molded to have a flat shape. Then a part of the heat conductive superconductive tube 2 being enclosing in the metal 11 and another portion of the heat conductive superconductive tube is extended out of the metal 11 so that the heat conductive superconductive tube is connected to heat dissipating elements for heat conduction. In this embodiment, two ends of the heat conductive superconductive tube are exposed out.
  • Referring to FIG. 3, in this the embodiment, it is shown that the one end of both two ends of the heat conductive superconductive tube are exposed out from the [0027] metal 11.
  • Referring to FIG. 4, another embodiment of embodiment is illustrated. Two ends of the heat conductive [0028] superconductive tubes 2 are embedded into two metal 11, and the middle sections of the heat conductive superconductive tubes 2 are exposed.
  • Referring to FIG. 5, in this embodiment, the present invention has the similar structure as those in FIG. 4, while a plurality of fins are formed on a surface of each metal block so as for dissipating heat. [0029]
  • Referring to FIG. 6, the [0030] metal block 1 are made as a U shape, wherein a plurality of heat conductive superconductive tubes 2 are whole embedded in the metal 11.
  • Referring to FIGS. 7 and 8, the heat conductive [0031] superconductive tube 2 can be formed with a spiral shape and then the heat conductive superconductive tube 2 is placed in the metal 11 so as to formed with a first metal block 1. Then a CPU 4 is placed upon a second metal block 1. Then a dissipating fin set 3 is placed upon the first metal block 1 so that heat from the CPU 4 can be transferred out rapidly from the metal block 1 to the dissipating fin set 3.
  • Thereby, by the present invention, the metal block can be installed between a heat source and a dissipating fin set or a casing. Then a fan is installed at the side of the dissipating fin set or the casing for dissipating heat. Thereby, when the space is narrow so that it is difficult to be installed with a fan, the present invention can be used to improve this condition. [0032]
  • Moreover, in the present invention, the heat conductive superconductive tubes or container can be bent with other three dimensional shape so as to suit the requirement of the installing space and thus have a preferred effect with the metal block. [0033]
  • The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. [0034]

Claims (7)

What is claimed is:
1. A method for forming a heat conductive device of superconductive metal block comprising the steps of:
placing at least one heat conductive superconductive tubes or containers and melting metal material into a die-casting or casting mold;
shaping the at least one heat conductive superconductive tubes or containers and melting metal into blocks by die-casting or casting mold so that the heat conductive superconductive tubes or containers are enclosed in the melting metal material to be as an integral body.
2. The method of claim 1, wherein the heat conductive superconductive tubes or containers are enclosed with the high conductivity metal material of the metal block.
3. The method of claim 2, wherein the metal block is integrally formed with fins.
4. The method of claim 2, wherein the heat conductive superconductive tube or container is bent to have a helical shape.
5. The method of claim 2, wherein the heat conductive superconductive tube or container is bent as a U shape.
6. The method of claim 2, wherein the heat conductive superconductive tube or container is bent to have a three dimensional shape.
7. The method of claim 2, wherein there are a plurality of metal blocks which are stack packed one by one.
US10/396,759 2002-03-27 2003-03-24 Method for forming heat conductive device of superconductive metal block Abandoned US20030182799A1 (en)

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TW91106083 2002-03-27
TW091106083A TW532057B (en) 2002-03-27 2002-03-27 Manufacturing method of thermal super-conducting heat conduction block and the structure thereof

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof
WO2013149955A1 (en) * 2012-04-04 2013-10-10 Sma Solar Technology Ag Molded-in heat pipe
CN106735093A (en) * 2017-01-24 2017-05-31 烟台鲁宝有色合金有限公司 Fine copper buries heterogeneous metal pipe cooling wall metallurgical binding casting technique
US20180141114A1 (en) * 2014-04-25 2018-05-24 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Metallic article

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US5381859A (en) * 1990-11-09 1995-01-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof
US6321452B1 (en) * 2000-03-20 2001-11-27 Liken Lin Method for manufacturing the heat pipe integrated into the heat sink
US6432320B1 (en) * 1998-11-02 2002-08-13 Patrick Bonsignore Refrigerant and heat transfer fluid additive
US6817096B2 (en) * 2000-01-11 2004-11-16 Cool Options, Inc. Method of manufacturing a heat pipe construction

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GB8710113D0 (en) * 1987-04-29 1987-06-03 Evetts J E Superconducting composite
JPH08102226A (en) * 1994-09-29 1996-04-16 Hitachi Cable Ltd Composite superconductive conductor
US6088997A (en) * 1997-04-03 2000-07-18 Southpac Trust International, Inc. Method for providing a decorative covering for a flower pot
SE9802564L (en) * 1998-07-17 2000-01-18 Abb Ab Heat sink
WO2003041472A1 (en) * 2001-07-26 2003-05-15 Jefferson Liu Heat dissipating module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5381859A (en) * 1990-11-09 1995-01-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof
US6432320B1 (en) * 1998-11-02 2002-08-13 Patrick Bonsignore Refrigerant and heat transfer fluid additive
US6817096B2 (en) * 2000-01-11 2004-11-16 Cool Options, Inc. Method of manufacturing a heat pipe construction
US6321452B1 (en) * 2000-03-20 2001-11-27 Liken Lin Method for manufacturing the heat pipe integrated into the heat sink

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066628A1 (en) * 2001-07-26 2004-04-08 Jefferson Liu Rapidly self-heat-conductive heat-dissipating module
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof
WO2013149955A1 (en) * 2012-04-04 2013-10-10 Sma Solar Technology Ag Molded-in heat pipe
US20180141114A1 (en) * 2014-04-25 2018-05-24 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Metallic article
CN106735093A (en) * 2017-01-24 2017-05-31 烟台鲁宝有色合金有限公司 Fine copper buries heterogeneous metal pipe cooling wall metallurgical binding casting technique

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GB0306895D0 (en) 2003-04-30
GB2399943A (en) 2004-09-29

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