US20040047276A1 - Head suspension for a disk device, disk device and head IC testing method - Google Patents
Head suspension for a disk device, disk device and head IC testing method Download PDFInfo
- Publication number
- US20040047276A1 US20040047276A1 US10/659,624 US65962403A US2004047276A1 US 20040047276 A1 US20040047276 A1 US 20040047276A1 US 65962403 A US65962403 A US 65962403A US 2004047276 A1 US2004047276 A1 US 2004047276A1
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- United States
- Prior art keywords
- head
- suspension
- connection terminal
- terminal
- connection
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
- G11B33/126—Arrangements for providing electrical connections, e.g. connectors, cables, switches
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/455—Arrangements for functional testing of heads; Measuring arrangements for heads
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
- G11B2005/001—Controlling recording characteristics of record carriers or transducing characteristics of transducers by means not being part of their structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
- G11B2005/001—Controlling recording characteristics of record carriers or transducing characteristics of transducers by means not being part of their structure
- G11B2005/0013—Controlling recording characteristics of record carriers or transducing characteristics of transducers by means not being part of their structure of transducers, e.g. linearisation, equalisation
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B2220/00—Record carriers by type
- G11B2220/20—Disc-shaped record carriers
- G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
- G11B2220/2508—Magnetic discs
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
- G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49025—Making disc drive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49027—Mounting preformed head/core onto other structure
- Y10T29/49028—Mounting multitrack head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49027—Mounting preformed head/core onto other structure
- Y10T29/4903—Mounting preformed head/core onto other structure with bonding
Definitions
- This invention relates to a head suspension for supporting a head of a disk device, to a disk device which uses it, and to a testing method for a head IC.
- Disk devices for reading a disk storage medium using a head are widely used.
- magnetic disk drives that are used as storage devices for computers comprise a magnetic disk, a spindle motor that rotates the magnetic disk, a magnetic head for reading from or writing to the magnetic disk, and a VCM actuator that positions the magnetic head at a track on the magnetic disk.
- the magnetic head is supported by a suspension.
- the suspension is attached to the carriage arm of a VCM actuator.
- the suspension has springiness and functions such that the magnetic head follow the surface of the magnetic disk.
- the magnetic head performs input/output of an analog signal, so it is equipped with a head IC for processing the analog signal.
- the head IC comprises a preamp for amplifying the read signal of the magnetic head, and a writing amp for supplying writing current to the magnetic head.
- this head IC is attached to the carriage arm located at the rear of the suspension. Moreover, the head IC is connected to the magnetic head by lead wires on the suspension.
- lead wires on the suspension.
- the head and head IC of the HGA unit are checked together so when one is determined to be faulty that fully HGA becomes faulty. Therefore, there is a problem that yield decreases and it is difficult to keep costs down.
- the objective of the invention is to provide a head suspension, a disk device and a testing method for testing the head IC installed in the suspension.
- Another objective of the invention is to provide a head suspension, a disk device and a testing method for simply testing the head IC installed in the suspension.
- a further objective of the invention is to provide a head suspension, a disk device and a testing method for testing the head IC that improves the yield of the head assembly.
- the head suspension of this invention comprises: a first connection terminal that electrically connects to a head; a second connection terminal that connects to external circuits; third and fourth connection terminals that electrically connect to a head IC for processing an electrical signal from the head; a first conductive path that connects the first connection terminal with the third connection terminal; a second conductive path that connects the second connection terminal with the fourth connection terminal; and a measurement terminal that is located between the second connection terminal and fourth connection terminal of the second conductive path, and which is for measuring the head IC.
- the disk device of this invention comprises: a head for at least reading a disk medium, a head IC that processes the electrical signal from the head, a head suspension which contains the head IC and which supports the head, and an actuator that supports the head suspension and moves the head with respect to the disk medium; and where the head suspension comprises: a first connection terminal for electrically connecting to the head, a second connection terminal for connecting to external circuits, third and fourth connection terminals for electrically connecting to the head IC, a first conductive path that connects the first and third connection terminals, a second conductive path that connects the second and fourth connection terminals, and a measurement terminal that is located between the second connection terminal and fourth connection terminal of the second conductive path, and which is for measuring the head IC.
- the testing method for head IC of this invention comprises: a step of installing a head IC for processing the electric signal from the head, and a step of placing a probe on the head suspension terminal to test the electric characteristics of the head IC.
- a head IC is installing on the head suspension and the head IC is checked before installing the head.
- the head IC is checked before installing the head.
- the second terminal for external connection is located in a position that is easy for external connection and it is not easy to place a probe on it. Therefore, in this invention, a measurement terminal is located between the second and fourth connection terminals.
- the measurement terminal and the first connection terminal are located such that they are on the same plane as the suspension, and this makes it even easier for contact with a pair of probes, which makes it possible to check the head IC even more quickly.
- the first, second, third and fourth connection terminals, the first and second conductive paths, and the measurement terminal are formed using a thin-film pattern on the base of the suspension, so the measurement terminal can be formed with the same process as the other terminals and conductive paths, making construction more simple.
- flexible cable is used around the base of the head suspension, which is provided the first, second, third and fourth connection terminal, the first and second conductive paths and the measurement terminal so it is possible to separate the base and the cable.
- FIG. 1 is a top view of the disk device of an embodiment of the invention.
- FIG. 2 is a cross-sectional view of the disk device in FIG. 1.
- FIG. 3 is an enlarged view of the main parts of the disk device in FIG. 2.
- FIG. 4 is a block diagram of the disk device in FIG. 1.
- FIG. 5 is a pictorial view of the head suspension of an embodiment of the invention.
- FIG. 6 is a schematic view of the head IC checking device of an embodiment of the invention.
- FIG. 7 is a drawing explaining the head IC checking method of an embodiment of the invention.
- FIG. 8 is a pictorial drawing of the head suspension of another embodiment of the invention.
- FIG. 9 is a pictorial drawing of the head suspension of yet another embodiment of the invention.
- FIG. 1 is a top view of the disk device of an embodiment of the invention
- FIG. 2 is a cross-sectional view of that disk device
- FIG. 3 is an enlarged view of the part in FIG. 2.
- a hard disk drive is used as the disk device.
- the magnetic disk 6 comprises a magnetic recording layer formed on a base plate (disk).
- the magnetic disk 6 has a diameter of 3.5 inches, and there are three disks installed inside the drive.
- a spindle motor 5 supports the magnetic disk 6 and rotates it.
- a magnetic head (slider) 4 is installed on the actuator.
- the actuator comprises a rotating-type VCM (voice coil motor) 3 , a carriage arm 8 and suspension 9 .
- the magnetic head 4 is installed on the tip of the suspension 9 .
- the magnetic head 4 reads data from or writes data to the magnetic disk 6 .
- the magnetic head 4 comprises a slider that has a MR element (reproduction element) and writing element.
- the actuator 3 positions the magnetic head 4 at a desired track on the magnetic disk 6 .
- the actuator 3 and spindle motor 5 are installed to the drive base 2 .
- a cover 1 covers the drive base 2 and separates the inside of the drive from the outside.
- a printed-circuit board 7 is located below the drive base 2 and it contains the drive control circuit.
- a connector 10 is located below the drive base 2 and it connects the control circuit with the outside.
- the magnetic head 4 and head IC chip 20 are placed on one side of the suspension 9 .
- the rear end of the suspension 9 is attached to the carriage arm 8 with a pin 50 .
- An external-connection terminal 22 (described later using FIG. 5) on the suspension 9 is guided by the surface on the side of the carriage arm 8 . Therefore, the suspension 9 is fastened to the carriage arm 8 .
- the external-connection terminal 22 is connected to a flexible cable (not shown in the figure) in order to connect with external circuits.
- This flexible cable is located on the side of the carriage arm 8 .
- the external-connection terminal 22 is located on the side of the arm 8 , it can be connected without the flexible cable having to bend.
- FIG. 4 is a block diagram of the control circuit on the printed-circuit board 7 and inside the drive.
- An HDC (hard disk controller) 18 generates control signals inside the magnetic disk device for controlling the interface with the CPU for receiving commands or data from the host CPU, and for controlling the read/write format on the magnetic disk medium.
- a buffer 17 is used for temporarily storing write data from the host CPU to be written to the magnetic disk medium, or for temporarily storing read data that is read from the magnetic disk medium.
- a MCU (micro controller) 19 comprises a microprocessor (MPU), memory, DA converter, and AD converter.
- the MCU (called MPU below) 19 performs servo control (positioning control) for positioning the magnetic head.
- the MPU 19 executes a program stored in memory, recognizes the position signal from the servo demodulation circuit 16 , and calculates the control amount of the VCM control current of the actuator for positioning. Furthermore, the MPU 19 controls the driving current of the SPM drive circuit 14 .
- the VCM drive circuit 13 comprises a power amp for causing driving current to flow to the VCM (voice coil motor).
- the SPM drive circuit 14 comprises a power amp for causing driving current to flow to the spindle motor (SPM) 5 that rotates the magnetic disk 6 .
- a read channel 15 is a circuit for performing reading or writing.
- the read channel 15 comprises a modulation circuit for writing write data from the host CPU to the magnetic disk medium 6 , a parallel-to-serial conversion circuit, a demodulation circuit for reading data from the magnetic disk medium 6 , and a serial-to-parallel conversion circuit.
- a servo demodulation circuit 16 is a circuit for demodulating a servo pattern that is written on the magnetic disk medium, and it outputs a position signal to the MPU 19 .
- a head IC 20 (see FIG. 3) which comprises a writing amp, that supplies writing current to the magnetic head 4 , and a preamp, that amplifies the reading voltage from the magnetic head 4 .
- a magnetic disk device is explained as the disk device, however, it is also possible to use an optical disk device such as a DVD or MO. Also, here a device that is capable of reading and writing was used, however it is also possible to use a read-only device.
- FIG. 5 is a pictorial view of the head suspension of an embodiment of the invention, and it shows a magnetic head suspension 9 .
- the suspension base 27 is formed from stainless steel or the like. There is a thin film pattern that is formed from the insulation layer on the base 27 .
- This thin film pattern comprises: a first connection terminal 21 for electrically connecting with the magnetic head 4 ; a second connection terminal 22 for connecting to external circuits; third and fourth connection terminals 23 , 24 for electrically connecting to the head IC that processes the electrical signal from the magnetic head; a first conductive path 28 that connects the first connection terminal 22 and the third connection terminal; a second conductive path 26 that connects the second connection terminal 22 and the fourth connection terminal 24 ; and a measurement terminal 25 , that is located between the second terminal 22 and fourth connection terminal 24 on the second conductive path 26 , and is for measuring the head IC 20 .
- FIG. 6 is a schematic diagram of the testing device of an embodiment of the invention
- FIG. 7 is a drawing explaining the testing method.
- the testing device comprises a receiving cradle 30 for receiving the suspension 9 , a measurement head 31 with a pair of probes 32 , and a connector 33 for connecting to a current waveform measurement device (not shown in the figure).
- a head IC chip 20 is placed on the suspension 9 shown in FIG. 5.
- the head IC chip 20 is attached and connected to the third and fourth connection terminals 23 , 24 on the suspension 9 .
- a plurality of suspensions 9 with the head IC chips 20 are placed in the receiving cradle 30 shown in FIG. 6.
- the measurement head 31 is lowered, a pair of probes 32 are brought into contact with the first head connection terminal 21 and the IC check terminal 25 on the suspension 9 , and measurement current from the probes 32 is output to the a current waveform measurement device (not shown in the figure).
- the head IC chip 20 comprises at least a reading amp and writing amp.
- a representative example could be TLS26A803 and TLS26A801 (model name) amps manufactured by TI. It is possible to check the operating state of these head IC chip amps, the diode characteristics (VI characteristics) and the connection status.
- the measurement probes 32 it is necessary for the measurement probes 32 to come in contact with the terminals. It is possible to check the head IC 20 by bring the probes 32 in contact with the first terminal 21 and second terminal 25 instead of the third and fourth terminals on the head IC.
- the second connection terminal 25 for external connection is located in a position that is easy for external connection (to the side of the suspension 9 in FIG. 5) and it is not easy to place a probe 32 on it. Therefore, in this invention, a measurement terminal 25 is located between the second and fourth connection terminals 22 , 24 . This makes contact with the probe 32 easy and makes it possible to quickly check the head IC.
- the measurement terminal 25 and the first connection terminal are on the same plane of the suspension 9 . In this way it is even easier for contact with the pair of probes 32 , which makes it possible to check the head IC 20 even more quickly.
- the first, second, third and fourth connection terminals 21 , 23 , 24 , 22 , the first and second conductive paths 26 , 28 , and the measurement terminal 25 are formed using a thin-film pattern on the suspension base 27 . Therefore, the measurement terminal 25 can be formed with the same process as the other terminals and conductive paths, making construction more simple.
- FIG. 8 is a pictorial view of ahead suspension of another embodiment of the invention, and parts that are identical to parts shown in FIG. 5 are indicated with the same symbol.
- the head suspension 9 comprises a head suspension base 27 and flexible cable 40 with a first, second, third and fourth connection terminals 22 , 23 , 24 , 25 , first and second conductive paths 26 , 28 , and a measurement terminal 25 .
- a load beam 41 and gimbal 42 are formed on the base 27 .
- This example shows the application of a suspension 9 with a separate base 27 and cable 40 .
- FIG. 9 is a pictorial view of a head suspension of yet another embodiment of the invention, and parts that are identical to parts shown in FIG. 5 and FIG. 8 are indicated with the same symbol.
- the head suspension 9 comprises a head suspension base 27 and a flexible cable 40 with a first, second, third and fourth connection terminals 22 , 23 , 24 , 25 , first and second conductive paths 26 , 28 , and a measurement terminal 25 .
- a load beam 41 is formed in the base 27 and a flexure 43 having a gimbal 42 is attached to the base 27 .
- This example also shows the application of a suspension 9 with a separate base 27 and cable 40 .
- the invention can be applied to a suspension with an optical head or magneto-optical head.
- the head IC is placed on the head suspension and checked before installing the head. By doing so, it is possible to check the operation and connection of the head IC itself, and thus it is possible to divide the head assembly into good and faulty parts before installing the head. Therefore, it is possible to increase yield while keeping down costs of the head assembly.
- a measurement terminal is located between the second and fourth connection terminals in order to check the head IC on the suspension. This makes contact with the probe easy, and makes it possible to quickly check the head IC.
Abstract
This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.
Description
- 1. Field of the Invention
- This invention relates to a head suspension for supporting a head of a disk device, to a disk device which uses it, and to a testing method for a head IC.
- 2. Description of the Related Art
- Disk devices for reading a disk storage medium using a head are widely used. For example, magnetic disk drives that are used as storage devices for computers comprise a magnetic disk, a spindle motor that rotates the magnetic disk, a magnetic head for reading from or writing to the magnetic disk, and a VCM actuator that positions the magnetic head at a track on the magnetic disk.
- The storage density of these kinds of disk drives is greatly increasing, as well as is the density of tracks on the magnetic disk. It is especially possible to increase the density by using a MR (GMR, TMR) head as the magnetic head. Therefore, high precision device is also desired for processing of the head signal.
- In a magnetic disk device, the magnetic head is supported by a suspension. The suspension is attached to the carriage arm of a VCM actuator. The suspension has springiness and functions such that the magnetic head follow the surface of the magnetic disk. The magnetic head performs input/output of an analog signal, so it is equipped with a head IC for processing the analog signal. The head IC comprises a preamp for amplifying the read signal of the magnetic head, and a writing amp for supplying writing current to the magnetic head.
- Normally, this head IC is attached to the carriage arm located at the rear of the suspension. Moreover, the head IC is connected to the magnetic head by lead wires on the suspension. However, in the case of a weak magnetic head output, as in the case of the recent MR heads, it is not possible to ignore the effect of noise that mixes into the long lead wire.
- In addition, when the lead wire is long, the rising time and falling time of the pulse signal (writing pulse) becomes longs, so there is a problem in that it becomes difficult to transfer data at high speed. Therefore, it is proposed to place the head IC chip on the suspension in order to shorten the distance between the magnetic head and the head IC.
- With that kind of construction, it is necessary to test each suspension. Conventionally, a slider on which the head IC and magnetic head are located is attached to the suspension to form a HGA (head gimbal assembly), then this HGA is made to float above the disk medium and by the head magnetically reading/writing, the operation of the head IC and the connection status are checked.
- However, with the prior method, the head and head IC of the HGA unit are checked together so when one is determined to be faulty that fully HGA becomes faulty. Therefore, there is a problem that yield decreases and it is difficult to keep costs down.
- The objective of the invention is to provide a head suspension, a disk device and a testing method for testing the head IC installed in the suspension.
- Another objective of the invention is to provide a head suspension, a disk device and a testing method for simply testing the head IC installed in the suspension.
- A further objective of the invention is to provide a head suspension, a disk device and a testing method for testing the head IC that improves the yield of the head assembly.
- In order to accomplish these objectives, the head suspension of this invention comprises: a first connection terminal that electrically connects to a head; a second connection terminal that connects to external circuits; third and fourth connection terminals that electrically connect to a head IC for processing an electrical signal from the head; a first conductive path that connects the first connection terminal with the third connection terminal; a second conductive path that connects the second connection terminal with the fourth connection terminal; and a measurement terminal that is located between the second connection terminal and fourth connection terminal of the second conductive path, and which is for measuring the head IC.
- Moreover, the disk device of this invention comprises: a head for at least reading a disk medium, a head IC that processes the electrical signal from the head, a head suspension which contains the head IC and which supports the head, and an actuator that supports the head suspension and moves the head with respect to the disk medium; and where the head suspension comprises: a first connection terminal for electrically connecting to the head, a second connection terminal for connecting to external circuits, third and fourth connection terminals for electrically connecting to the head IC, a first conductive path that connects the first and third connection terminals, a second conductive path that connects the second and fourth connection terminals, and a measurement terminal that is located between the second connection terminal and fourth connection terminal of the second conductive path, and which is for measuring the head IC.
- Furthermore, the testing method for head IC of this invention comprises: a step of installing a head IC for processing the electric signal from the head, and a step of placing a probe on the head suspension terminal to test the electric characteristics of the head IC.
- In this invention, first a head IC is installing on the head suspension and the head IC is checked before installing the head. By doing this, it is possible to check the operation and connection of the head IC itself, and to divide the head assembly into good or faulty parts before installing the head. Therefore, it is possible to increase the yield and to keep down costs of the head assembly.
- Second, in order to check the head IC that is installed on the suspension, it is necessary to place a measurement probe on the terminal. Theoretically, by placing the probe on the first and second terminals instead of the third and fourth terminals installed on the head IC, it is possible to check the head IC. However, the second terminal for external connection is located in a position that is easy for external connection and it is not easy to place a probe on it. Therefore, in this invention, a measurement terminal is located between the second and fourth connection terminals.
- This makes contact with the probe easy and makes it possible to quickly check the head IC.
- Moreover, in the head suspension of this invention, the measurement terminal and the first connection terminal are located such that they are on the same plane as the suspension, and this makes it even easier for contact with a pair of probes, which makes it possible to check the head IC even more quickly.
- In addition, in the head suspension of this invention, the first, second, third and fourth connection terminals, the first and second conductive paths, and the measurement terminal are formed using a thin-film pattern on the base of the suspension, so the measurement terminal can be formed with the same process as the other terminals and conductive paths, making construction more simple.
- Furthermore, in the head suspension of this invention, flexible cable is used around the base of the head suspension, which is provided the first, second, third and fourth connection terminal, the first and second conductive paths and the measurement terminal so it is possible to separate the base and the cable.
- FIG. 1 is a top view of the disk device of an embodiment of the invention.
- FIG. 2 is a cross-sectional view of the disk device in FIG. 1.
- FIG. 3 is an enlarged view of the main parts of the disk device in FIG. 2.
- FIG. 4 is a block diagram of the disk device in FIG. 1.
- FIG. 5 is a pictorial view of the head suspension of an embodiment of the invention.
- FIG. 6 is a schematic view of the head IC checking device of an embodiment of the invention.
- FIG. 7 is a drawing explaining the head IC checking method of an embodiment of the invention.
- FIG. 8 is a pictorial drawing of the head suspension of another embodiment of the invention.
- FIG. 9 is a pictorial drawing of the head suspension of yet another embodiment of the invention.
- The embodiments of this invention will be explained below in the order: disk device, head suspension and testing method, and other embodiments.
- Disk Device
- FIG. 1 is a top view of the disk device of an embodiment of the invention, FIG. 2 is a cross-sectional view of that disk device, and FIG. 3 is an enlarged view of the part in FIG. 2. In this example, a hard disk drive is used as the disk device.
- As shown in FIG. 1 and FIG. 2, the
magnetic disk 6 comprises a magnetic recording layer formed on a base plate (disk). Themagnetic disk 6 has a diameter of 3.5 inches, and there are three disks installed inside the drive. Aspindle motor 5 supports themagnetic disk 6 and rotates it. A magnetic head (slider) 4 is installed on the actuator. The actuator comprises a rotating-type VCM (voice coil motor) 3, acarriage arm 8 andsuspension 9. Themagnetic head 4 is installed on the tip of thesuspension 9. - The
magnetic head 4 reads data from or writes data to themagnetic disk 6. Themagnetic head 4 comprises a slider that has a MR element (reproduction element) and writing element. Theactuator 3 positions themagnetic head 4 at a desired track on themagnetic disk 6. Theactuator 3 andspindle motor 5 are installed to thedrive base 2. A cover 1 covers thedrive base 2 and separates the inside of the drive from the outside. A printed-circuit board 7 is located below thedrive base 2 and it contains the drive control circuit. Aconnector 10 is located below thedrive base 2 and it connects the control circuit with the outside. - As shown in the enlarged view of FIG. 3, the
magnetic head 4 andhead IC chip 20 are placed on one side of thesuspension 9. The rear end of thesuspension 9 is attached to thecarriage arm 8 with apin 50. An external-connection terminal 22 (described later using FIG. 5) on thesuspension 9 is guided by the surface on the side of thecarriage arm 8. Therefore, thesuspension 9 is fastened to thecarriage arm 8. - In addition, the external-
connection terminal 22 is connected to a flexible cable (not shown in the figure) in order to connect with external circuits. This flexible cable is located on the side of thecarriage arm 8. Moreover, since the external-connection terminal 22 is located on the side of thearm 8, it can be connected without the flexible cable having to bend. - FIG. 4 is a block diagram of the control circuit on the printed-
circuit board 7 and inside the drive. An HDC (hard disk controller) 18 generates control signals inside the magnetic disk device for controlling the interface with the CPU for receiving commands or data from the host CPU, and for controlling the read/write format on the magnetic disk medium. Abuffer 17 is used for temporarily storing write data from the host CPU to be written to the magnetic disk medium, or for temporarily storing read data that is read from the magnetic disk medium. - A MCU (micro controller)19 comprises a microprocessor (MPU), memory, DA converter, and AD converter. The MCU (called MPU below) 19 performs servo control (positioning control) for positioning the magnetic head. The
MPU 19 executes a program stored in memory, recognizes the position signal from theservo demodulation circuit 16, and calculates the control amount of the VCM control current of the actuator for positioning. Furthermore, theMPU 19 controls the driving current of theSPM drive circuit 14. - The
VCM drive circuit 13 comprises a power amp for causing driving current to flow to the VCM (voice coil motor). TheSPM drive circuit 14 comprises a power amp for causing driving current to flow to the spindle motor (SPM) 5 that rotates themagnetic disk 6. - A
read channel 15 is a circuit for performing reading or writing. Theread channel 15 comprises a modulation circuit for writing write data from the host CPU to themagnetic disk medium 6, a parallel-to-serial conversion circuit, a demodulation circuit for reading data from themagnetic disk medium 6, and a serial-to-parallel conversion circuit. Aservo demodulation circuit 16 is a circuit for demodulating a servo pattern that is written on the magnetic disk medium, and it outputs a position signal to theMPU 19. - Furthermore, inside the drive HDA, there is a head IC20 (see FIG. 3) which comprises a writing amp, that supplies writing current to the
magnetic head 4, and a preamp, that amplifies the reading voltage from themagnetic head 4. - Here, an example of a magnetic disk device is explained as the disk device, however, it is also possible to use an optical disk device such as a DVD or MO. Also, here a device that is capable of reading and writing was used, however it is also possible to use a read-only device.
- Head Suspension and Testing Method
- FIG. 5 is a pictorial view of the head suspension of an embodiment of the invention, and it shows a
magnetic head suspension 9. - The
suspension base 27 is formed from stainless steel or the like. There is a thin film pattern that is formed from the insulation layer on thebase 27. This thin film pattern comprises: afirst connection terminal 21 for electrically connecting with themagnetic head 4; asecond connection terminal 22 for connecting to external circuits; third andfourth connection terminals conductive path 28 that connects thefirst connection terminal 22 and the third connection terminal; a secondconductive path 26 that connects thesecond connection terminal 22 and thefourth connection terminal 24; and ameasurement terminal 25, that is located between thesecond terminal 22 andfourth connection terminal 24 on the secondconductive path 26, and is for measuring thehead IC 20. - The sections of the base27 except these
terminals hole 29 formed in thesuspension 9 through which thepin 50 shown in FIG. 3 is inserted. - FIG. 6 is a schematic diagram of the testing device of an embodiment of the invention, and FIG. 7 is a drawing explaining the testing method.
- As shown in FIG. 6, the testing device comprises a receiving
cradle 30 for receiving thesuspension 9, a measurement head 31 with a pair ofprobes 32, and aconnector 33 for connecting to a current waveform measurement device (not shown in the figure). - The testing method will be explained. First, a
head IC chip 20 is placed on thesuspension 9 shown in FIG. 5. For example, thehead IC chip 20 is attached and connected to the third andfourth connection terminals suspension 9. In this way, as shown in FIG. 7, a plurality ofsuspensions 9 with the head IC chips 20 are placed in the receivingcradle 30 shown in FIG. 6. - As shown in FIG. 7, the measurement head31 is lowered, a pair of
probes 32 are brought into contact with the firsthead connection terminal 21 and theIC check terminal 25 on thesuspension 9, and measurement current from theprobes 32 is output to the a current waveform measurement device (not shown in the figure). - The
head IC chip 20 comprises at least a reading amp and writing amp. A representative example could be TLS26A803 and TLS26A801 (model name) amps manufactured by TI. It is possible to check the operating state of these head IC chip amps, the diode characteristics (VI characteristics) and the connection status. - In this way, since the
head IC 20 is placed on thehead suspension 9 and checked before installing thehead 4, it is possible to check the operation and connection of thehead IC 20 itself, and thus it is possible to divide the head assembly into good and faulty parts before installing thehead 4. Therefore, it is possible to increase yield while keeping down costs of the head assembly. - Moreover, in order to check the
head IC 20 on thesuspension 9, it is necessary for the measurement probes 32 to come in contact with the terminals. It is possible to check thehead IC 20 by bring theprobes 32 in contact with thefirst terminal 21 andsecond terminal 25 instead of the third and fourth terminals on the head IC. However, thesecond connection terminal 25 for external connection is located in a position that is easy for external connection (to the side of thesuspension 9 in FIG. 5) and it is not easy to place aprobe 32 on it. Therefore, in this invention, ameasurement terminal 25 is located between the second andfourth connection terminals probe 32 easy and makes it possible to quickly check the head IC. - Furthermore, in the head suspension of this invention, the
measurement terminal 25 and the first connection terminal are on the same plane of thesuspension 9. In this way it is even easier for contact with the pair ofprobes 32, which makes it possible to check thehead IC 20 even more quickly. - In addition, in the
head suspension 9 shown in FIG. 5, the first, second, third andfourth connection terminals conductive paths measurement terminal 25 are formed using a thin-film pattern on thesuspension base 27. Therefore, themeasurement terminal 25 can be formed with the same process as the other terminals and conductive paths, making construction more simple. - Other Embodiments
- FIG. 8 is a pictorial view of ahead suspension of another embodiment of the invention, and parts that are identical to parts shown in FIG. 5 are indicated with the same symbol.
- As shown in FIG. 8, the
head suspension 9 comprises ahead suspension base 27 andflexible cable 40 with a first, second, third andfourth connection terminals conductive paths measurement terminal 25. - A
load beam 41 andgimbal 42 are formed on thebase 27. This example, shows the application of asuspension 9 with aseparate base 27 andcable 40. - FIG. 9 is a pictorial view of a head suspension of yet another embodiment of the invention, and parts that are identical to parts shown in FIG. 5 and FIG. 8 are indicated with the same symbol.
- As shown in FIG. 9, the
head suspension 9 comprises ahead suspension base 27 and aflexible cable 40 with a first, second, third andfourth connection terminals conductive paths measurement terminal 25. - A
load beam 41 is formed in thebase 27 and aflexure 43 having agimbal 42 is attached to thebase 27. This example also shows the application of asuspension 9 with aseparate base 27 andcable 40. - In addition to embodiments described above, the invention can be changed as follows.
- (1) An example is given of placing the head IC on one side of the suspension, however it is possible to place the head IC on both sides.
- (2) Instead of a magnetic head, the invention can be applied to a suspension with an optical head or magneto-optical head.
- The preferred embodiments of the present invention have been explained, however the invention is not limited to these embodiments and can be embodied in various forms within the scope of the present invention.
- As described above, this invention has the following effect.
- First, the head IC is placed on the head suspension and checked before installing the head. By doing so, it is possible to check the operation and connection of the head IC itself, and thus it is possible to divide the head assembly into good and faulty parts before installing the head. Therefore, it is possible to increase yield while keeping down costs of the head assembly.
- Second, a measurement terminal is located between the second and fourth connection terminals in order to check the head IC on the suspension. This makes contact with the probe easy, and makes it possible to quickly check the head IC.
Claims (17)
1. A head suspension of a disk device that supports a head for at least reading a disk medium and comprising:
a first connection terminal that electrically connects to said head;
a second connection terminal that connects to external circuits;
third and fourth connection terminals that electrically connect to a head IC, which processes an electrical signal from said head;
a first conductive path that connects said first connection terminal with said third connection terminal;
a second conductive path that connects said second connection terminal with said fourth connection terminal; and
a measurement terminal that is located between said second connection terminal and said fourth connection terminal of said second conductive path, and which is for measuring said head IC.
2. The head suspension of claim 1 wherein;
said measurement terminal and said first connection terminal are located such that they are on the same plane of said suspension.
3. The head suspension of claim 1 wherein;
said first, second, third and fourth connection terminals, said first and second conductive paths, and said measurement terminal are formed using a thin-film pattern on the base of said suspension.
4. The head suspension of claim 1 further comprising:
a base for said head suspension; and
a flexible cable on which said first, second, third and fourth connection terminal, said first and second conductive paths and said measurement terminal are formed.
5. The head suspension of claim 1 wherein said first connection terminal is electrically connected to a magnetic head.
6. A disk device comprising:
a head for at least reading a disk medium;
a head IC that processes an electrical signal from said head;
a head suspension which supports said head and which contains said head IC; and
an actuator that supports said head suspension and moves said head with respect to said disk medium; wherein
said head suspension comprises:
a first connection terminal for electrically connecting to said head;
a second connection terminal for connecting to external circuits;
third and fourth connection terminals for electrically connecting to said head IC;
a first conductive path that connects said first and third connection terminals;
a second conductive path that connects said second and fourth connection terminals; and
a measurement terminal that is located between said second connection terminal and said fourth connection terminal of said second conductive path, and which is for measuring said head IC.
7. The disk device of claim 6 wherein;
said measurement terminal and said first connection terminal are located such that they are on the same plane of said suspension.
8. The disk device of claim 6 wherein;
said first, second, third and fourth connection terminals, said first and second conductive paths, and said measurement terminal are formed using a thin-film pattern on the base of said suspension.
9. The disk device of claim 6 further comprising:
a base for said head suspension; and
a flexible cable on which said first, second, third and fourth connection terminal, said first and second conductive paths and said measurement terminal are formed.
10. The disk device of claim 6 wherein said head comprises a magnetic head.
11. A testing method for a head IC comprising:
a step of installing a head IC for processing an electric signal from a head for at least reading a disk medium, on a head suspension that supports said head; and
a step of placing a probe on a terminal of said head suspension to check electric characteristics of said head IC.
12. The testing method of claim 11 wherein said head suspension comprises:
a first connection terminal for electrically connecting to said head;
a second connection terminal for connecting to external circuits;
third and fourth connection terminals for electrically connecting to said head IC;
a first conductive path that connects said first and third connection terminals;
a second conductive path that connects said second and fourth connection terminals; and
a measurement terminal that is located between said second connection terminal and said fourth connection terminal of said second conductive path, and which is placed said probe.
13. The testing method of claim 11 wherein;
said measurement terminal and said first connection terminal are located such that they are on the same plane of said suspension.
14. The testing method of claim 11 wherein;
said first, second, third and fourth connection terminals, said first and second conductive paths, and said measurement terminal are formed using a thin-film pattern on the base of said suspension.
15. The testing method of claim 11 further comprising:
a base for said head suspension; and
a flexible cable on which said first, second, third and fourth connection terminal, said first and second conductive paths and said measurement terminal are formed.
16. The testing method of claim 11 wherein said head comprises a magnetic head.
17. A manufacturing method for a HGA comprising:
a step of installing a head IC for processing an electric signal from a head for at least reading a disk medium, on a head suspension that supports said head;
a step of placing a probe on a terminal of said head suspension to check electric characteristics of said head IC; and
a step of installing a head on said head suspension with said head IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/659,624 US7051423B2 (en) | 2000-04-27 | 2003-09-10 | Testing method for a head IC |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000128517A JP2001312809A (en) | 2000-04-27 | 2000-04-27 | Head suspension of disk device, disk device, and inspecting method for head ic |
JP2000-128517 | 2000-04-27 | ||
US09/748,918 US6690546B2 (en) | 2000-04-27 | 2000-12-27 | Head suspension for a disk device, disk device and head IC testing method |
US10/659,624 US7051423B2 (en) | 2000-04-27 | 2003-09-10 | Testing method for a head IC |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/748,918 Division US6690546B2 (en) | 2000-04-27 | 2000-12-27 | Head suspension for a disk device, disk device and head IC testing method |
Publications (2)
Publication Number | Publication Date |
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US20040047276A1 true US20040047276A1 (en) | 2004-03-11 |
US7051423B2 US7051423B2 (en) | 2006-05-30 |
Family
ID=18637949
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Application Number | Title | Priority Date | Filing Date |
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US09/748,918 Expired - Fee Related US6690546B2 (en) | 2000-04-27 | 2000-12-27 | Head suspension for a disk device, disk device and head IC testing method |
US10/659,624 Expired - Fee Related US7051423B2 (en) | 2000-04-27 | 2003-09-10 | Testing method for a head IC |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US09/748,918 Expired - Fee Related US6690546B2 (en) | 2000-04-27 | 2000-12-27 | Head suspension for a disk device, disk device and head IC testing method |
Country Status (3)
Country | Link |
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US (2) | US6690546B2 (en) |
JP (1) | JP2001312809A (en) |
KR (1) | KR100695789B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004001763B4 (en) * | 2003-01-23 | 2010-09-16 | Fujitsu Ltd., Kawasaki | Magneto-optical head |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100499869B1 (en) * | 1999-02-22 | 2005-07-07 | 주식회사 하이닉스반도체 | Novel photoresist crosslinker and photoresist composition using the same |
JP3988420B2 (en) * | 2001-09-19 | 2007-10-10 | Tdk株式会社 | Thin film magnetic head wiring member, head gimbal assembly, head gimbal assembly inspection method, and head gimbal assembly manufacturing method |
JP2004241033A (en) * | 2003-02-05 | 2004-08-26 | Toshiba Corp | Wiring board, disk device, and method for identifying head ic |
JP2006004513A (en) * | 2004-06-17 | 2006-01-05 | Hitachi Global Storage Technologies Netherlands Bv | Disk device and arm coil support assembly |
JP4061301B2 (en) * | 2004-12-14 | 2008-03-19 | Tdk株式会社 | Head suspension assembly, rotation detection mechanism, and transport mechanism |
US7532438B1 (en) * | 2005-05-16 | 2009-05-12 | Magnecomp Corporation | Wireless flexure with curved trace geometry against pitch and roll adjustment springback |
JP2007066460A (en) * | 2005-09-01 | 2007-03-15 | Hitachi Global Storage Technologies Netherlands Bv | Magnetic head evaluating apparatus, and manufacturing method of magnetic disk apparatus using it |
US7630174B2 (en) * | 2006-01-20 | 2009-12-08 | Hitachi Global Storage Technologies Netherlands B.V. | Suspension and prober designs for recording head testing |
US8731899B2 (en) * | 2007-06-29 | 2014-05-20 | Seagate Technology Llc | Adapter assembly for concurrent emulation of a native channel |
JP4528869B1 (en) * | 2009-05-22 | 2010-08-25 | 株式会社東芝 | Head gimbal assembly and disk device provided with the same |
CN102044256A (en) * | 2009-10-16 | 2011-05-04 | 新科实业有限公司 | Cantilever and manufacture method thereof, head gimbal assembly with cantilever, and hard disk driver |
US8536875B2 (en) * | 2009-10-28 | 2013-09-17 | Infinitum Solutions, Inc. | Testing flex and APFA assemblies for hard disk drives |
US9841457B1 (en) | 2016-11-01 | 2017-12-12 | Nhk Spring Co., Ltd. | Pseudo flexure for disk drive and method of testing electronic circuit for disk drive |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
US5422764A (en) * | 1993-10-15 | 1995-06-06 | Hewlett-Packard Company | Electrical interconnect for a head/arm assembly of computer disk drives |
US5631786A (en) * | 1994-05-19 | 1997-05-20 | International Business Machines Corporation | Termination pad manipulator for a laminated suspension in a data storage system |
US5864446A (en) * | 1994-02-18 | 1999-01-26 | Fujitsu Limited | Head assembly for recording and reproducing including a head supporting part having a protection member |
US6084746A (en) * | 1997-03-04 | 2000-07-04 | Tdk Corporation | Magnetic head device |
US6134084A (en) * | 1997-09-10 | 2000-10-17 | Fujitsu Limited | Suspension assembly having a head IC chip mounting portion |
US6173485B1 (en) * | 1997-12-26 | 2001-01-16 | Tdk Corporation | Method for manufacturing magnetic head apparatus with slider and suspension |
US6181520B1 (en) * | 1997-07-04 | 2001-01-30 | Fujitsu Limited | Head slider and disk unit having contact detection means |
US6202288B1 (en) * | 1997-12-26 | 2001-03-20 | Tdk Corporation | Method for manufacturing magnetic head suspension assembly with head IC chip |
US6266213B1 (en) * | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
US6339519B1 (en) * | 1998-11-11 | 2002-01-15 | Tdk Corporation | Magnetic head device |
US6351347B1 (en) * | 1998-07-21 | 2002-02-26 | Alps Electric Co., Ltd. | Magnetic head |
US6369985B1 (en) * | 1999-07-15 | 2002-04-09 | Fujitsu Limited | Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension |
US6437944B2 (en) * | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
US6460245B1 (en) * | 1996-03-07 | 2002-10-08 | Tessera, Inc. | Method of fabricating semiconductor chip assemblies |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03121413A (en) * | 1989-10-04 | 1991-05-23 | Seiko Epson Corp | Production of electrode substrate |
JPH0575801A (en) * | 1991-09-10 | 1993-03-26 | Ricoh Co Ltd | Digital copying machine |
JPH11213364A (en) | 1998-01-27 | 1999-08-06 | Tdk Corp | Suspension, magnetic head device and inspecting method and manufacturing methods for the device |
-
2000
- 2000-04-27 JP JP2000128517A patent/JP2001312809A/en active Pending
- 2000-12-27 US US09/748,918 patent/US6690546B2/en not_active Expired - Fee Related
- 2000-12-29 KR KR1020000085660A patent/KR100695789B1/en not_active IP Right Cessation
-
2003
- 2003-09-10 US US10/659,624 patent/US7051423B2/en not_active Expired - Fee Related
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
US5422764A (en) * | 1993-10-15 | 1995-06-06 | Hewlett-Packard Company | Electrical interconnect for a head/arm assembly of computer disk drives |
US5864446A (en) * | 1994-02-18 | 1999-01-26 | Fujitsu Limited | Head assembly for recording and reproducing including a head supporting part having a protection member |
US5631786A (en) * | 1994-05-19 | 1997-05-20 | International Business Machines Corporation | Termination pad manipulator for a laminated suspension in a data storage system |
US6460245B1 (en) * | 1996-03-07 | 2002-10-08 | Tessera, Inc. | Method of fabricating semiconductor chip assemblies |
US6084746A (en) * | 1997-03-04 | 2000-07-04 | Tdk Corporation | Magnetic head device |
US6181520B1 (en) * | 1997-07-04 | 2001-01-30 | Fujitsu Limited | Head slider and disk unit having contact detection means |
US6388840B1 (en) * | 1997-09-10 | 2002-05-14 | Fujitsu Limited | Suspension having a head IC mounting portion formed on a rigid portion between a base portion and a head slider mounting portion |
US6134084A (en) * | 1997-09-10 | 2000-10-17 | Fujitsu Limited | Suspension assembly having a head IC chip mounting portion |
US6437944B2 (en) * | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
US6202288B1 (en) * | 1997-12-26 | 2001-03-20 | Tdk Corporation | Method for manufacturing magnetic head suspension assembly with head IC chip |
US6173485B1 (en) * | 1997-12-26 | 2001-01-16 | Tdk Corporation | Method for manufacturing magnetic head apparatus with slider and suspension |
US6266213B1 (en) * | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
US6351347B1 (en) * | 1998-07-21 | 2002-02-26 | Alps Electric Co., Ltd. | Magnetic head |
US6339519B1 (en) * | 1998-11-11 | 2002-01-15 | Tdk Corporation | Magnetic head device |
US6369985B1 (en) * | 1999-07-15 | 2002-04-09 | Fujitsu Limited | Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004001763B4 (en) * | 2003-01-23 | 2010-09-16 | Fujitsu Ltd., Kawasaki | Magneto-optical head |
Also Published As
Publication number | Publication date |
---|---|
US6690546B2 (en) | 2004-02-10 |
US7051423B2 (en) | 2006-05-30 |
US20010036040A1 (en) | 2001-11-01 |
KR100695789B1 (en) | 2007-03-15 |
KR20010098383A (en) | 2001-11-08 |
JP2001312809A (en) | 2001-11-09 |
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