US20040069758A1 - Method and device for applying a solder to a substrate - Google Patents

Method and device for applying a solder to a substrate Download PDF

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Publication number
US20040069758A1
US20040069758A1 US10/468,688 US46868803A US2004069758A1 US 20040069758 A1 US20040069758 A1 US 20040069758A1 US 46868803 A US46868803 A US 46868803A US 2004069758 A1 US2004069758 A1 US 2004069758A1
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Prior art keywords
solder
substrate
capillary
diameter
solder ball
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Abandoned
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US10/468,688
Inventor
Ghassem Azdasht
Lars Titerle
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Pac Tech Packaging Technologies GmbH
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Pac Tech Packaging Technologies GmbH
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Application filed by Pac Tech Packaging Technologies GmbH filed Critical Pac Tech Packaging Technologies GmbH
Assigned to PAC TECH - PACKAGING TECHNOLOGIES GMBH reassignment PAC TECH - PACKAGING TECHNOLOGIES GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AZDASHT, GHASSEM, TITERLE, LARS
Publication of US20040069758A1 publication Critical patent/US20040069758A1/en
Priority to US11/787,896 priority Critical patent/US7717316B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas

Definitions

  • the invention concerns a process and a device for applying solder onto a substrate including providing solder in a sold aggregate state, positioning solder relative to the substrate, providing an energy source, and melting the solder by activating the supply of energy,
  • Such processes and devices are known from German patents DE 43 20 055 A1, DE 42 00 492 C2, and DE 195 33 171 A1. These processes and devices have a holder with a capillary. The holder is placed with its tip near the solder point, and then a solder ball is fed through the capillary and the solder ball contacts the solder point. The solder ball is then melted through the capillary. The melting is preferably performed using laser energy.
  • DE 43 20 055 A1 proposes to arrange a movable optical fiber within the capillary, so that the optical fiber acts as a ram for moving the solder ball and is simultaneously also used for feeding laser energy.
  • DE 195 33 171 A1 instead proposes to transport the solder ball by the force of gravity, vibration, particularly ultrasound, and an air flow.
  • solder balls are transported by the pressure of a protective gas.
  • solder ball In the prior art, however, the solder ball always contacts the substrate or the surface to be wetted with the solder material at the moment of melting. This requires that the tip of the holder must be positioned very close against the substrate, wherein on the one hand, the solder ball is still held in the capillary, and on the other hand, however, the solder ball is already in contact with the substrate. Because the solder balls in many cases have a diameter of a few microns, this requires extremely precise positioning of the holder and there is the risk that the holder will collide with parts on the substrate during positioning.
  • the problem of the invention is to improve upon the known process and device in such a way that a sufficiently precise placement of the solder material on the substrate is achieved while simultaneously reducing the positioning accuracy requirements of the holder.
  • the fundamental principle of the invention is to position the solder in a solid aggregate state and to hold it at a distance from the substrate. Then, through the supply of energy, the solder is melted and finally pushed against the substrate by a compressed gas. Regarding the device, the capillary is tapered near the tip so that its diameter is smaller than the diameter of the solder ball.
  • the ball falls down to the tapered section and is held there.
  • the holder is then positioned at a sufficient distance above the substrate.
  • the ball is melted, preferably by laser light, and pushed against the surface to be soldered by compressed gas.
  • the distance between the tip of the holder and the substrate is therefore no longer critical, so that in terms of this distance, the positioning accuracy requirements are reduced.
  • the positioning accuracy requirements in the plane of the substrate are also reduced.
  • the ball could move in the X/Y plane at the solder position if the lower edge of the capillary from the substrate had a greater distance than the radius of the solder ball.
  • the center of the capillary also corresponds to the center of the solder ball.
  • Another advantage is that all of the laser energy is definitely incident on the solder ball and cannot pass the solder ball.
  • the compressed gas for pushing the melted solder material is preferably a protective gas, e.g., an inert gas.
  • solder can be not only solder tin, but also other meltable materials, e.g., also plastics.
  • FIG. 1 a schematic diagram of the device before melting of the solder ball.
  • FIG. 2 a diagram similar to FIG. 1, but after the melting of the solder ball.
  • FIG. 1 shows schematically a holder 1 with a capillary 2 , which has a first diameter D1.
  • a conical tapered section which runs to a conical point starting from the first diameter D1 down to a second diameter D2 and thus forms a tapered outlet 5 at the tip 6 of the holder.
  • the diameter D1 and D2 are set relative to the diameter D3 of the solder ball 7 such that the first diameter D1 of the capillary 2 is larger than the diameter of the solder ball and the second diameter D2 at the outlet 5 of the tapered section is smaller than the diameter D3 of the solder ball.
  • solder ball is easily guided from above in the direction of arrow 8 to the tapered section 4 , even just by the force of gravity.
  • the solder ball is held at the tapered section 4 and it partially seals the capillary from the top.
  • the feeding of a solder ball to the capillary is performed in a known way (cf., e.g., DE 195 44 929 A1 or DE 195 33 171 A1) by a device, which is designated in general by the reference numeral 9 , for gathering single balls, for feeding, for control, and for generating laser light.
  • the holder with the solder ball still held at the tip of the holder is positioned above a substrate 10 , e.g., in the region of a conductive trace 11 , at a certain vertical distance from the substrate or the conductive trace 11 .
  • a substrate 10 e.g., in the region of a conductive trace 11
  • the solder ball 7 is melted by laser light or some other energy source and pushed out of the capillary by compressed gas and “accelerated”, so that it wets the surface to be wetted, e.g., the conductive trace 11 , as a “bumper” 12 , as illustrated in FIG. 2.
  • the wetting is also improved, because the melted solder material also penetrates into small surface irregularities, gaps, or the like in the substrate or the conductive trace due to the impact pulse.

Abstract

The invention is a method for applying a solder to a substrate by positioning it in its solid physical condition, melting it and then impacting it against a substrate by means of compressed gas. The device for applying a solder (7) to a substrate (10, 11) comprises a holder (1) having a capillary bore (2) whose diameter, at the substrate end (3), has a contraction (4) whose diameter (D2) is smaller than the diameter (D3) of the solder globule (7).

Description

  • The invention concerns a process and a device for applying solder onto a substrate including providing solder in a sold aggregate state, positioning solder relative to the substrate, providing an energy source, and melting the solder by activating the supply of energy, [0001]
  • Such processes and devices are known from German patents DE 43 20 055 A1, DE 42 00 492 C2, and DE 195 33 171 A1. These processes and devices have a holder with a capillary. The holder is placed with its tip near the solder point, and then a solder ball is fed through the capillary and the solder ball contacts the solder point. The solder ball is then melted through the capillary. The melting is preferably performed using laser energy. [0002]
  • To transport the solder ball within the capillary, DE 43 20 055 A1 proposes to arrange a movable optical fiber within the capillary, so that the optical fiber acts as a ram for moving the solder ball and is simultaneously also used for feeding laser energy. [0003]
  • DE 195 33 171 A1 instead proposes to transport the solder ball by the force of gravity, vibration, particularly ultrasound, and an air flow. In addition, for DE 195 44 929 A1, solder balls are transported by the pressure of a protective gas. [0004]
  • In the prior art, however, the solder ball always contacts the substrate or the surface to be wetted with the solder material at the moment of melting. This requires that the tip of the holder must be positioned very close against the substrate, wherein on the one hand, the solder ball is still held in the capillary, and on the other hand, however, the solder ball is already in contact with the substrate. Because the solder balls in many cases have a diameter of a few microns, this requires extremely precise positioning of the holder and there is the risk that the holder will collide with parts on the substrate during positioning. [0005]
  • The problem of the invention is to improve upon the known process and device in such a way that a sufficiently precise placement of the solder material on the substrate is achieved while simultaneously reducing the positioning accuracy requirements of the holder. [0006]
  • This problem is solved by the features given in [0007] claims 1 and 3. Advantageous configurations and refinements of the invention can be found in the subordinate claims.
  • The fundamental principle of the invention is to position the solder in a solid aggregate state and to hold it at a distance from the substrate. Then, through the supply of energy, the solder is melted and finally pushed against the substrate by a compressed gas. Regarding the device, the capillary is tapered near the tip so that its diameter is smaller than the diameter of the solder ball. [0008]
  • Thus, the ball falls down to the tapered section and is held there. The holder is then positioned at a sufficient distance above the substrate. Then the ball is melted, preferably by laser light, and pushed against the surface to be soldered by compressed gas. The distance between the tip of the holder and the substrate is therefore no longer critical, so that in terms of this distance, the positioning accuracy requirements are reduced. simultaneous-ly, the positioning accuracy requirements in the plane of the substrate (X/Y plane) are also reduced. In the prior art, the ball could move in the X/Y plane at the solder position if the lower edge of the capillary from the substrate had a greater distance than the radius of the solder ball. In contrast, such a motion is not possible with the invention and the center of the capillary also corresponds to the center of the solder ball. [0009]
  • Another advantage is that all of the laser energy is definitely incident on the solder ball and cannot pass the solder ball. [0010]
  • The compressed gas for pushing the melted solder material is preferably a protective gas, e.g., an inert gas. [0011]
  • The solder can be not only solder tin, but also other meltable materials, e.g., also plastics.[0012]
  • In the following, the invention is described in more detail with reference to an embodiment in connection with the drawing. Shown are: [0013]
  • FIG. 1, a schematic diagram of the device before melting of the solder ball; and [0014]
  • FIG. 2, a diagram similar to FIG. 1, but after the melting of the solder ball.[0015]
  • FIG. 1 shows schematically a [0016] holder 1 with a capillary 2, which has a first diameter D1. At the lower end 3 of the capillary 2 there is a conical tapered section, which runs to a conical point starting from the first diameter D1 down to a second diameter D2 and thus forms a tapered outlet 5 at the tip 6 of the holder. The diameter D1 and D2 are set relative to the diameter D3 of the solder ball 7 such that the first diameter D1 of the capillary 2 is larger than the diameter of the solder ball and the second diameter D2 at the outlet 5 of the tapered section is smaller than the diameter D3 of the solder ball. In this way, the solder ball is easily guided from above in the direction of arrow 8 to the tapered section 4, even just by the force of gravity. The solder ball is held at the tapered section 4 and it partially seals the capillary from the top. In an optimum arrangement, there is absolutely no gap, through from which light, particularly laser light, could exit the capillary, when there is a solder ball 7 in the tapered section 4.
  • The feeding of a solder ball to the capillary is performed in a known way (cf., e.g., DE 195 44 929 A1 or DE 195 33 171 A1) by a device, which is designated in general by the [0017] reference numeral 9, for gathering single balls, for feeding, for control, and for generating laser light.
  • As illustrated in FIG. 1, the holder with the solder ball still held at the tip of the holder is positioned above a [0018] substrate 10, e.g., in the region of a conductive trace 11, at a certain vertical distance from the substrate or the conductive trace 11. In this position, there is no contact between the solder ball 7 and the conductive trace 11. Then the solder ball 7 is melted by laser light or some other energy source and pushed out of the capillary by compressed gas and “accelerated”, so that it wets the surface to be wetted, e.g., the conductive trace 11, as a “bumper” 12, as illustrated in FIG. 2.
  • Because the melted solder ball is accelerated by compressed gas, which is preferably activated in pulses, and thus strikes the substrate with some velocity, the wetting is also improved, because the melted solder material also penetrates into small surface irregularities, gaps, or the like in the substrate or the conductive trace due to the impact pulse. [0019]

Claims (7)

What is claimed is:
1. A process for applying solder on a substrate comprising providing solder in a sold aggregate state, positioning solder relative to the substrate, providing an energy source, and melting the solder by activating the supply of energy, characterized in that the positioning is realized by spacing solder a predetermined distance from the substrate, and impacting the solder against the substrate by action of a compressed gas after melting of the solder.
2. A process according to claim 1, characterized in that the melting is performed through laser energy.
3. A device for applying solder onto a substrate comprising a holder having a capillary therein in which a solder ball can be positioned relative to the substrate, the end of the capillary (2) nearer the substrate having a tapered section (4), whose smallest diameter (D2) is smaller than the diameter (D3) of the solder ball (7).
4. A device according to claim 3, characterized in that the tapered section (4) is conical from a larger diameter (D1) of the capillary (2) to a smaller discharge diameter (D2).
5. A device according to claim 3, characterized in that a compressed gas source (9) is connected to the capillary (2).
6. A device according to claim 5, characterized in that means is provided for the compressed gas to be activated in pulses.
7. A device according to claim 5, characterized in that the compressed gas is an inert or protective gas.
US10/468,688 2001-07-10 2002-06-26 Method and device for applying a solder to a substrate Abandoned US20040069758A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/787,896 US7717316B2 (en) 2001-07-10 2007-04-18 Method and device for applying a solder to a substrate

Applications Claiming Priority (3)

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DE10132567.3 2001-07-10
DE10132567A DE10132567B4 (en) 2001-07-10 2001-07-10 Method and apparatus for applying a solder to a substrate
PCT/EP2002/007034 WO2003006197A1 (en) 2001-07-10 2002-06-26 Method and device for applying a solder to a substrate

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US11/787,896 Active 2028-01-14 US7717316B2 (en) 2001-07-10 2007-04-18 Method and device for applying a solder to a substrate

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JP (1) JP3989434B2 (en)
KR (1) KR100932808B1 (en)
DE (1) DE10132567B4 (en)
WO (1) WO2003006197A1 (en)

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US20040060971A1 (en) * 2001-09-14 2004-04-01 Ghassem Azdasht Method for the production of a soldered connection
US20040072986A1 (en) * 2000-11-10 2004-04-15 Youxin Li Novel polyesters, method for producing same, and depot medicaments produced from these polyesters
US20060219760A1 (en) * 2005-03-30 2006-10-05 Tdk Corporation Soldering method, soldering device, bonding method, bonding device, and nozzle unit
US20070075056A1 (en) * 2005-09-30 2007-04-05 Sae Magnetics (H.K.) Ltd. Soldering device and method for forming electrical solder connections in a disk drive unit
KR100704903B1 (en) 2005-09-16 2007-04-06 한국기계연구원 Apparatus for Melting and Adhering and Method for Melting and Adhering Solder Ball using it
US20070123621A1 (en) * 2005-09-15 2007-05-31 Basf Corporation Coating compositions with silylated diols
US20070145564A1 (en) * 2005-03-22 2007-06-28 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US20080165519A1 (en) * 2007-01-05 2008-07-10 Tessera, Inc. Microelectronic assembly with multi-layer support structure
US20080179298A1 (en) * 2007-01-29 2008-07-31 Tdk Corporation Method of detecting an object to be detected in a joining device, joining device, and joining method
US20100089981A1 (en) * 2008-10-10 2010-04-15 Yohsuke Matsumoto Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly
US7810705B2 (en) 2006-09-25 2010-10-12 Tdk Corporation Apparatus and method for supplying electrically conductive material
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20130256281A1 (en) * 2012-03-30 2013-10-03 Tatsumi Tsuchiya Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
CN106271062A (en) * 2016-09-29 2017-01-04 深圳市艾贝特电子科技有限公司 Laser spray welding mouth, spray welding unit and method

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DE102008017180B4 (en) * 2008-04-02 2020-07-02 Pac Tech - Packaging Technologies Gmbh Device for applying an electronic component
DE102013110402A1 (en) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Arrangement and method for the reproducible application of small quantities of liquid
US10029327B2 (en) 2014-10-29 2018-07-24 Western Digital Technologies, Inc. Solder ball jet nozzle having improved reliability
US10556284B2 (en) 2015-08-24 2020-02-11 Seagate Technology Llc Method of forming electrical connections with solder dispensing and reflow
US10646943B2 (en) 2016-11-28 2020-05-12 Seagate Technology Llc Method of forming electrical connections using optical triggering for solder
JP2020006405A (en) * 2018-07-09 2020-01-16 株式会社パラット Soldering device and soldering method
JP7013063B1 (en) 2021-12-13 2022-01-31 アポロソルダーテック株式会社 Soldering equipment and soldering method

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US20040072986A1 (en) * 2000-11-10 2004-04-15 Youxin Li Novel polyesters, method for producing same, and depot medicaments produced from these polyesters
US7726543B2 (en) * 2001-09-14 2010-06-01 Smart Pac Gmbh Technology Services Method for the production of a soldered joint
US7360679B2 (en) * 2001-09-14 2008-04-22 Smart Pac Gmbh Technology Services Method for the production of a soldered connection
US20080142576A1 (en) * 2001-09-14 2008-06-19 Smart Pac Gmbh Technology Services Method for the production of a soldered joint
US20040060971A1 (en) * 2001-09-14 2004-04-01 Ghassem Azdasht Method for the production of a soldered connection
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US7717316B2 (en) 2010-05-18
WO2003006197A1 (en) 2003-01-23
US20070257090A1 (en) 2007-11-08
JP2004534409A (en) 2004-11-11
KR100932808B1 (en) 2009-12-21
KR20030036773A (en) 2003-05-09
DE10132567B4 (en) 2005-03-31
DE10132567A1 (en) 2003-01-30

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