US20040100522A1 - Substrate for fluid ejection devices - Google Patents
Substrate for fluid ejection devices Download PDFInfo
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- US20040100522A1 US20040100522A1 US10/681,547 US68154703A US2004100522A1 US 20040100522 A1 US20040100522 A1 US 20040100522A1 US 68154703 A US68154703 A US 68154703A US 2004100522 A1 US2004100522 A1 US 2004100522A1
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- United States
- Prior art keywords
- substrate
- fluid ejection
- frame
- electrical
- fluid
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14024—Assembling head parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/19—Assembling head units
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
Definitions
- the present invention relates generally to fluid ejection devices, and more particularly to a substrate for a fluid ejection assembly.
- a conventional inkjet printing system as one embodiment of a fluid ejection system, includes a printhead, an ink supply which supplies liquid ink to the printhead, and an electronic controller which controls the printhead.
- the printhead as one embodiment of a fluid ejection device, ejects ink drops through a plurality of orifices or nozzles and toward a print medium, such as a sheet of paper, so as to print onto the print medium.
- the orifices are arranged in one or more arrays such that properly sequenced ejection of ink from the orifices causes characters or other images to be printed upon the print medium as the printhead and the print medium are moved relative to each other.
- a plurality of individual printheads are mounted on a single substrate.
- a number of nozzles and, therefore, an overall number of ink drops which can be ejected per second is increased. Since the overall number of drops which can be ejected per second is increased, printing speed can be increased with the wide-array inkjet printing system.
- the single substrate When mounting a plurality of printhead dies on a single substrate, the single substrate performs several functions including fluid and electrical routing as well as printhead die support. More specifically, the single substrate accommodates communication of ink between the ink supply and each of the printhead dies, accommodates communication of electrical signals between the electronic controller and each of the printhead dies, and provides a stable support for each of the printhead dies. Unfortunately, effectively combining these functions in one unitary structure is difficult.
- One aspect of the present invention provides a fluid ejection assembly including a substrate and a plurality of fluid ejection devices each mounted on the substrate.
- the substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
- FIG. 1 is a block diagram illustrating one embodiment of an ink-jet printing system according to the present invention.
- FIG. 2 is a top perspective view of one embodiment of an ink-jet printhead assembly including a plurality of printhead dies according to the present invention.
- FIG. 3 is a bottom perspective view of the inkjet printhead assembly of FIG. 2.
- FIG. 4 is a schematic cross-sectional view illustrating one embodiment of portions of a printhead die according to the present invention.
- FIG. 5 is a schematic cross-sectional view of an inkjet printhead assembly illustrating one embodiment of an electrical connector according to the present invention.
- FIG. 6 is an exploded view of the inkjet printhead assembly of FIG. 5.
- FIG. 7 is an exploded top perspective view of one embodiment of an inkjet printhead assembly according to the present invention.
- FIG. 8 is a schematic cross-sectional view of one embodiment of a portion of an electrical circuit of an inkjet printhead assembly according to the present invention.
- FIG. 9A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 9B is an exploded view of the inkjet printhead assembly of FIG. 9A.
- FIG. 10A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 10B is an exploded view of the inkjet printhead assembly of FIG. 10A.
- FIG. 11A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 11B is an exploded view of the inkjet printhead assembly of FIG. 11A.
- FIG. 12 is a schematic cross-sectional view of one embodiment of a substrate of an inkjet printhead assembly according to the present invention.
- FIG. 13 is a cross-sectional top view of one embodiment of a frame of the substrate of FIG. 12 taken along line 13 - 13 of FIG. 12.
- FIG. 14 is a schematic cross-sectional view of another embodiment of a substrate of an inkjet printhead assembly according to the present invention.
- FIG. 1 illustrates one embodiment of an inkjet printing system 10 according to the present invention.
- Inkjet printing system 10 constitutes one embodiment of a fluid ejection system which includes a fluid ejection assembly, such as an inkjet printhead assembly 12 , and a fluid supply assembly, such as an ink supply assembly 14 .
- inkjet printing system 10 also includes a mounting assembly 16 , a media transport assembly 18 , and an electronic controller 20 .
- Inkjet printhead assembly 12 is formed according to an embodiment of the present invention, and includes one or more printheads or fluid ejection devices which eject drops of ink or fluid through a plurality of orifices or nozzles 13 .
- the drops are directed toward a medium, such as print medium 19 , so as to print onto print medium 19 .
- Print medium 19 is any type of suitable sheet material, such as paper, card stock, transparencies, Mylar, and the like.
- nozzles 13 are arranged in one or more columns or arrays such that properly sequenced ejection of ink from nozzles 13 causes, in one embodiment, characters, symbols, and/or other graphics or images to be printed upon print medium 19 as inkjet printhead assembly 12 and print medium 19 are moved relative to each other.
- Ink supply assembly 14 supplies ink to printhead assembly 12 and includes a reservoir 15 for storing ink. As such, in one embodiment, ink flows from reservoir 15 to inkjet printhead assembly 12 . In one embodiment, inkjet printhead assembly 12 and ink supply assembly 14 are housed together in an inkjet or fluidjet cartridge or pen. In another embodiment, ink supply assembly 14 is separate from inkjet printhead assembly 12 and supplies ink to inkjet printhead assembly 12 through an interface connection, such as a supply tube.
- Mounting assembly 16 positions inkjet printhead assembly 12 relative to media transport assembly 18 and media transport assembly 18 positions print medium 19 relative to inkjet printhead assembly 12 .
- a print zone 17 is defined adjacent to nozzles 13 in an area between inkjet printhead assembly 12 and print medium 19 .
- inkjet printhead assembly 12 is a scanning type printhead assembly and mounting assembly 16 includes a carriage for moving inkjet printhead assembly 12 relative to media transport assembly 18 .
- inkjet printhead assembly 12 is a non-scanning type printhead assembly and mounting assembly 16 fixes ink-jet printhead assembly 12 at a prescribed position relative to media transport assembly 18 .
- Electronic controller 20 communicates with inkjet printhead assembly 12 , mounting assembly 16 , and media transport assembly 18 .
- Electronic controller 20 receives data 21 from a host system, such as a computer, and includes memory for temporarily storing data 21 .
- data 21 is sent to ink-jet printing system 10 along an electronic, infrared, optical or other information transfer path.
- Data 21 represents, for example, a document and/or file to be printed. As such, data 21 forms a print job for inkjet printing system 10 and includes one or more print job commands and/or command parameters.
- electronic controller 20 provides control of ink-jet printhead assembly 12 including timing control for ejection of ink drops from nozzles 13 .
- electronic controller 20 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images on print medium 19 . Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters.
- logic and drive circuitry forming a portion of electronic controller 20 is incorporated in an integrated circuit (IC) 22 located on inkjet printhead assembly 12 (shown in FIG. 5). In another embodiment, logic and drive circuitry is located off inkjet printhead assembly 12 .
- IC integrated circuit
- FIGS. 2 and 3 illustrate one embodiment of a portion of inkjet printhead assembly 12 .
- Inkjet printhead assembly 12 is a wide-array or multi-head printhead assembly and includes a carrier 30 , a plurality of printhead dies 40 , an ink delivery system 50 , and an electronic interface system 60 .
- Carrier 30 has an exposed surface or first face 301 and an exposed surface or second face 302 which is opposite of and oriented substantially parallel with first face 301 .
- Carrier 30 serves to carry or provide mechanical support for printhead dies 40 .
- carrier 30 accommodates fluidic communication between printhead dies 40 and ink supply assembly 14 via ink delivery system 50 and accommodates electrical communication between printhead dies 40 and electronic controller 20 via electronic interface system 60 .
- Printhead dies 40 are mounted on first face 301 of carrier 30 and aligned in one or more rows.
- printhead dies 40 are spaced apart and staggered such that printhead dies 40 in one row overlap at least one printhead die 40 in another row.
- inkjet printhead assembly 12 may span a nominal page width or a width shorter or longer than nominal page width.
- a plurality of inkjet printhead assemblies 12 are mounted in an end-to-end manner.
- Carrier 30 therefore, has a staggered or stair-step profile.
- at least one printhead die 40 of one inkjet printhead assembly 12 overlaps at least one printhead die 40 of an adjacent inkjet printhead assembly 12 . While four printhead dies 40 are illustrated as being mounted on carrier 30 , the number of printhead dies 40 mounted on carrier 30 may vary.
- Ink delivery system 50 fluidically couples ink supply assembly 14 with printhead dies 40 .
- ink delivery system 50 includes a manifold 52 and a port 54 .
- Manifold 52 is mounted on second face 302 of carrier 30 and distributes ink through carrier 30 to each printhead die 40 .
- Port 54 communicates with manifold 52 and provides an inlet for ink supplied by ink supply assembly 14 .
- Electronic interface system 60 electrically couples electronic controller 20 with printhead dies 40 .
- electronic interface system 60 includes a plurality of electrical contacts 62 which form input/output (I/O) contacts for electronic interface system 60 .
- electrical contacts 62 provide points for communicating electrical signals between electronic controller 20 and inkjet printhead assembly 12 .
- Examples of electrical contacts 62 include I/O pins which engage corresponding I/O receptacles electrically coupled to electronic controller 20 and I/O contact pads or fingers which mechanically or inductively contact corresponding electrical nodes electrically coupled to electronic controller 20 .
- electrical contacts 62 are illustrated as being provided on second face 302 of carrier 30 , it is within the scope of the present invention for electrical contacts 62 to be provided on other sides of carrier 30 .
- each printhead die 40 includes an array of drop ejecting elements 42 .
- Drop ejecting elements 42 are formed on a substrate 44 which has a fluid (or ink) feed slot 441 formed therein.
- fluid feed slot 441 provides a supply of fluid (or ink) to drop ejecting elements 42 .
- Substrate 44 is formed, for example, of silicon, glass, or a stable polymer.
- each drop ejecting element 42 includes a thin-film structure 46 with a firing resistor 48 and an orifice layer 47 .
- Thin-film structure 46 has a fluid (or ink) feed channel 461 formed therein which communicates with fluid feed slot 441 of substrate 44 .
- Orifice layer 47 has a front face 471 and a nozzle opening 472 formed in front face 471 .
- Orifice layer 47 also has a nozzle chamber 473 formed therein which communicates with nozzle opening 472 and fluid feed channel 461 of thin-film structure 46 .
- Firing resistor 48 is positioned within nozzle chamber 473 and includes leads 481 which electrically couple firing resistor 48 to a drive signal and ground.
- Thin-film structure 46 is formed, for example, by one or more passivation or insulation layers of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly-silicon glass, or other suitable material.
- thin-film structure 46 also includes a conductive layer which defines firing resistor 48 and leads 481 .
- the conductive layer is formed, for example, by aluminum, gold, tantalum, tantalum-aluminum, or other metal or metal alloy.
- fluid flows from fluid feed slot 441 to nozzle chamber 473 via fluid feed channel 461 .
- Nozzle opening 472 is operatively associated with firing resistor 48 such that droplets of fluid are ejected from nozzle chamber 473 through nozzle opening 472 (e.g., normal to the plane of firing resistor 48 ) and toward a medium upon energization of firing resistor 48 .
- Example embodiments of printhead dies 40 include a thermal printhead, as previously described, a piezoelectric printhead, a flex-tensional printhead, or any other type of fluidjet ejection device known in the art.
- printhead dies 40 are fully integrated thermal inkjet printheads.
- carrier 30 includes a substrate 32 and an electrical circuit 34 .
- Substrate 32 provides and accommodates mechanical, electrical, and fluidic functions of inkjet printhead assembly 12 while electrical circuit 34 provides and accommodates electrical and fluidic functions of inkjet printhead assembly 12 .
- substrate 32 supports printhead dies 40 .
- substrate 32 and electrical circuit 34 accommodate electrical interconnection between and among printhead dies 40 and electronic controller 20 via electronic interface system 60 .
- substrate 32 and electrical circuit 34 accommodate fluidic communication between ink supply assembly 14 and printhead dies 40 via ink delivery system 50 .
- Substrate 32 has a top side 321 and a bottom side 322 which is opposite of top side 321 .
- electrical circuit 34 is disposed on bottom side 322 of substrate 32 and printhead dies 40 are mounted on top side 321 of substrate 32 .
- printhead dies 40 are electrically coupled to electrical circuit 34 .
- substrate 32 and electrical circuit 34 are positioned and configured to protect electrical circuit 34 from mechanical damage and/or ink contact.
- substrate 32 facilitates electrical coupling between electrical circuit 34 and printhead dies 40 .
- substrate 32 provides support for printhead dies 40 , provides fluid routing to printhead dies 40 , and provides protection of electrical circuit 34 from mechanical damage and/or ink contact.
- substrate 32 is formed of plastic, ceramic, silicon, stainless steel, or other suitable material or combination of materials.
- Substrate 32 is formed, for example, of a high performance plastic such as fiber reinforced noryl.
- substrate 32 has a high modulus or rigidity to provide proper support for printhead dies 40 , has a low coefficient of thermal expansion (CTE) to avoid expansion and ensure accurate alignment between printhead dies 40 , and is chemically compatible with liquid ink to provide fluid routing and protection.
- CTE coefficient of thermal expansion
- electrical circuit 34 For transferring electrical signals between electronic controller 20 and printhead dies 40 , electrical circuit 34 establishes a plurality of conductive paths 64 (shown, for example, in FIG. 8). Conductive paths 64 define transfer paths for power, ground, and data among and between printhead dies 40 and electronic controller 20 .
- electronic interface system 60 includes an electrical interconnect 66 and a plurality of electrical connectors 68 .
- Electrical interconnect 66 provides electrical coupling between electronic controller 20 and electrical circuit 34 while electrical connectors 68 provide electrical coupling between electrical circuit 34 and printhead dies 40 .
- electrical interconnect 66 is established, for example, by I/O contacts 62 electrically coupled to electrical circuit 34 .
- electrical interconnect 66 facilitates electrical coupling between electronic controller 20 and inkjet printhead assembly 12 .
- electrical circuit 34 includes a first interface 70 and a second interface 72 .
- First interface 70 and second interface 72 both include a plurality of electrical contacts 71 and 73 , respectively, which form bond pads for electrical circuit 34 .
- electrical contacts 71 and 73 provide a point for electrical connection to electrical circuit 34 via, for example, I/O contacts 62 , such as I/O pins, contact pads, spring fingers, and/or other suitable electrical connectors.
- Conductive paths 64 of electrical circuit 34 terminate at and provide electrical coupling between electrical contacts 71 of first interface 70 and electrical contacts 73 of second interface 72 .
- First interface 70 provides an input/output interface for communication with printhead dies 40 via electrical connectors 68 and second interface 72 provides an input/output interface for communication with electronic controller 20 via electrical interconnect 66 .
- Electrical interconnect 66 is electrically coupled to at least one electrical contact 73 of second interface 72 .
- printhead dies 40 include electrical contacts 41 which form I/O bond pads.
- electrical connectors 68 electrically couple electrical contacts 71 of first interface 70 with electrical contacts 41 of printhead dies 40 .
- substrate 32 has a plurality of openings 323 defined therein. Openings 323 are adjacent to opposite ends of printhead dies 40 along the substrate, and communicate with top side 321 and bottom side 322 of substrate 32 . As such, openings 323 reveal or provide access to electrical contacts 71 of first interface 70 . Electrical connectors 68 , therefore, pass through associated openings 323 in substrate 32 when electrically coupling printhead dies 40 with electrical circuit 34 . Thus, electrical connectors 68 provide electrical connection through substrate 32 .
- electrical connectors 68 establish electrical connection between bottom side 322 of substrate 32 and top side 321 of substrate 32 .
- electrical connectors 68 provide electrical connection between two discrete levels. More specifically, electrical connectors 68 establish electrical connection with electrical circuit 34 at a first level and electrical connection with printhead dies 40 at a second level which is above or offset from the first level. Electrical connectors 68 , therefore, provide electrical connection between two separate or noncoplanar planes.
- FIGS. 5 and 6 illustrate one embodiment of electrical connectors 68 .
- Electrical connectors 68 include a wire bond or wire lead 80 having a first end 81 and a second end 82 .
- wire lead 80 passes through an associated opening 323 in substrate 32 .
- first end 81 of wire lead 80 is electrically coupled to at least one electrical contact 71 of first interface 70 and second end 82 of wire lead 80 communicates with top side 321 of substrate 32 .
- second end 82 of wire lead 80 is electrically coupled to at least one electrical contact 41 of printhead dies 40 .
- wire lead 80 constitutes a deep wire bond in that first end 81 is generally disposed on bottom side 322 of substrate 32 and second end 82 is generally disposed on top side 321 of substrate 32 .
- encapsulation 89 surrounds wire lead 80 . More specifically, encapsulation 89 seals bond areas of wire lead 80 and electrical contacts 41 and 71 . Thus, an integrity of electrical connections between electrical contacts 71 of first interface 70 , wire lead 80 , and electrical contacts 41 of printheads 40 is maintained. Encapsulation 89 , for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections.
- electrical circuit 34 includes a printed circuit board 78 .
- Printed circuit board 78 has a top side 781 and a bottom side 782 opposed to top side 781 .
- Printed circuit board 78 is disposed on bottom side 322 of substrate 32 such that top side 781 of printed circuit board 78 is adjacent bottom side 322 of substrate 32 .
- first interface 70 including electrical contacts 71
- second interface 72 including electrical contacts 73
- printed circuit board 78 may be formed of multiple layers, as described below.
- electrical circuit 34 it is within the scope of the present invention for electrical circuit 34 to include a flexible circuit such as a soft flex circuit or a rigid flex circuit.
- printed circuit board 78 may be formed as a rigid circuit or a flexible circuit.
- electronic controller 20 includes integrated circuit (IC) 22 which is mounted on printed circuit board 78 . More specifically, IC 22 is mounted on bottom side 782 of printed circuit board 78 . IC 22 is electrically coupled to printed circuit board 78 and, therefore, electrical circuit 34 , via electrical contacts 73 of second interface 72 . IC 22 includes logic and drive circuitry for inkjet printhead assembly 12 and, more specifically, printhead dies 40 .
- substrate 32 and printed circuit board 78 both have a plurality of fluid (or ink) passages 324 and 784 , respectively, formed therein.
- Fluid passages 324 extend through substrate 32 and fluid passages 784 extend through printed circuit board 78 .
- Fluid passages 324 communicate with fluid passages 784 so as to define a plurality of fluid (or ink) paths 304 through carrier 30 for delivery of ink to printhead dies 40 from manifold 52 .
- Fluid paths 304 communicate at a first end 305 with manifold 52 of ink delivery system 50 and at a second end 306 with printhead dies 40 . More specifically, second end 306 of fluid paths 304 communicates with fluid feed slot 441 of substrate 44 (FIG. 4). As such, fluid paths 304 form a portion of ink delivery system 50 . Although only one fluid path 304 is shown for a given printhead die 40 , there may be additional fluid paths to the same printhead die to provide ink of respective differing colors.
- carrier 30 includes a cover 36 .
- Cover 36 has a top side 361 and a bottom side 362 opposed to top side 361 .
- Cover 36 is disposed on bottom side 322 of substrate 32 such that top side 361 of cover 36 is adjacent bottom side 322 of substrate 32 .
- electrical circuit 34 is interposed between substrate 32 and cover 36 .
- manifold 52 is disposed on bottom side 362 of cover 36 .
- cover 36 includes a plurality of supports 363 which protrude upward from top side 361 . Supports 363 contact electrical circuit 34 and support electrical circuit 34 relative to substrate 32 . In one embodiment, supports 363 are positioned to contact and support electrical circuit 34 in areas opposite of electrical contacts 71 of first interface 70 .
- cover 36 For transferring ink between ink supply assembly 14 and printhead dies 40 , cover 36 has a plurality of fluid (or ink) passages 364 formed therein. Fluid passages 364 extend through cover 36 such that fluid passages 364 of cover 36 communicate with fluid passages 784 and 324 of printed circuit board 78 and substrate 32 , respectively. Fluid passages 364 together with fluid passages 784 and 324 , therefore, further define fluid paths 304 of carrier 30 for delivery of ink to printhead dies 40 .
- substrate 32 together with cover 36 surround electrical circuit 34 so as to seal electrical circuit 34 from direct contact with ink passing through fluid paths 304 of carrier 30 .
- Printed circuit board 78 fits within cover 36 as illustrated in FIG. 5 or fits within substrate 32 as illustrated in FIG. 7. More specifically, a portion of cover 36 or substrate 32 which defines fluid passages 364 or 324 , respectively, penetrates fluid passages 784 of printed circuit board 78 . Ink, therefore, flows through printed circuit board 78 but does not contact printed circuit board 78 . Thus, ink from manifold 52 flows through cover 36 , electrical circuit 34 including, more specifically, printed circuit board 78 , and through substrate 32 to printhead dies 40 .
- electrical circuit 34 is formed of multiple planes or layers 74 including a plurality of conductive layers 75 and a plurality of non-conductive or insulative layers 76 .
- Conductive layers 75 are formed, for example, by patterned traces of conductive material on insulative layers 76 . As such, at least one insulative layer 76 is interposed between two conductive layers 75 .
- Conductive layers 75 include, for example, a power layer 751 , a data layer 752 , and a ground layer 753 .
- Power layer 751 conducts power for printhead dies 40
- data layer 752 carries data for printhead dies 40
- ground layer 753 provides grounding for printhead dies 40 .
- Power layer 751 , data layer 752 , and ground layer 753 individually form portions of conductive paths 64 of electrical circuit 34 .
- power layer 751 , data layer 752 , and ground layer 753 are each electrically coupled to first interface 70 and second interface 72 of electrical circuit 34 by, for example, conductive paths through insulative layers 76 .
- power, data, and ground are communicated between first interface 70 and second interface 72 .
- the number of conductive layers 75 and insulative layers 76 can vary depending on the number of printhead dies 40 to be mounted on carrier 30 as well as the power and data rate requirements of printhead dies 40 .
- FIGS. 9A and 9B illustrate another embodiment of electrical connectors 68 .
- Electrical connectors 168 electrically couple electrical circuit 34 and printhead dies 40 .
- Electrical connectors 168 include a lead frame 180 and a wire bond or wire lead 183 .
- Lead frame 180 has a first tab 181 and a second tab 182
- wire lead 183 has a first end 184 and a second end 185 .
- lead frame 180 passes through an associated opening 323 in substrate 32 .
- first tab 181 of lead frame 180 is electrically coupled to at least one electrical contact 71 of first interface 70 and second tab 182 of lead frame 180 communicates with top side 321 of substrate 32 .
- first end 184 of wire lead 183 is electrically coupled to second tab 182 of lead frame 180 and second end 185 of wire lead 183 is electrically coupled to at least one electrical contact 41 of printhead dies 40 .
- Electrical coupling between lead frame 180 and electrical contact 71 is formed, for example, by a solder joint.
- lead frame 180 is embedded in a plug 188 which is sized to fit within opening 323 of substrate 32 .
- First tab 181 of lead frame 180 and second tab 182 of lead fame 180 are provided at opposite ends of plug 188 and provide an area for electrical connection.
- lead frame 180 is sized and/or positioned within opening 323 such that second tab 182 of lead frame 180 communicates with top side 321 of substrate 32 .
- second tab 182 of lead frame 180 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40 .
- Wire lead 183 therefore, constitutes a shallow wire bond in that wire lead 183 , including first end 184 and second end 185 , are both generally disposed on top side 321 of substrate 32 .
- encapsulation 189 surrounds lead frame 180 and wire lead 183 . More specifically, encapsulation 189 seals bond areas of lead frame 180 , wire lead 183 , and electrical contacts 41 and 71 . Thus, an integrity of electrical connections between electrical contacts 71 of first interface 70 , lead frame 180 , wire lead 183 , and electrical contacts 41 of printhead dies 40 is maintained. Encapsulation 189 , for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections.
- FIGS. 10A and 10B illustrate another embodiment of electrical connectors 68 .
- Electrical connectors 268 electrically couple electrical circuit 34 and printhead dies 40 .
- Electrical connectors 268 include a lead pin 280 and a wire bond or wire lead 283 .
- Lead pin 280 has a first end 281 and a second end 282
- wire lead 283 has a first end 284 and a second end 285 .
- lead pin 280 passes through an associated opening 323 in substrate 32 .
- first end 281 of lead pin 280 is electrically coupled to at least one electrical contact 71 of first interface 70 and second end 282 of lead pin 280 communicates with top side 321 of substrate 32 .
- first end 284 of wire lead 283 is electrically coupled to second end 282 of lead pin 280 and second end 285 of wire lead 283 is electrically coupled to at least one electrical contact 41 of printhead dies 40 .
- Electrical coupling between lead pin 280 and electrical contact 71 is formed, for example, by a solder joint.
- lead pin 280 is embedded in a plug 288 which is sized to fit within opening 323 of substrate 32 .
- First end 281 of lead pin 280 and second end 282 of lead pin 280 are provided at opposite ends of plug 288 and provide a point for electrical connection.
- lead pin 280 is sized, and/or positioned within opening 323 such that second end 282 of lead pin 280 communicates with top side 321 of substrate 32 .
- second end 282 of lead pin 280 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40 .
- Wire lead 283 therefore, constitutes a shallow wire bond in that wire lead 283 , including first end 284 and second end 285 , are both generally disposed on top side 321 of substrate 32 .
- encapsulation 289 surrounds lead pin 280 and wire lead 283 . More specifically, encapsulation 289 seals bond areas of lead pin 280 , wire lead 283 , and electrical contacts 41 and 71 . Thus, an integrity of electrical connections between electrical contacts 71 of first interface 70 , lead pin 280 , wire lead 283 , and electrical contacts 41 of printheads 40 is maintained. Encapsulation 289 , for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections.
- FIGS. 11A and 11B illustrate another embodiment of electrical connectors 68 .
- Electrical connectors 368 electrically couple electrical circuit 34 and printhead dies 40 .
- Electrical connectors 368 include a lead pin 380 , a wire bond or wire lead 383 , and a pressure contact 386 .
- Lead pin 380 has a first end 381 and a second end 382
- wire lead 383 has a first end 384 and a second end 385 .
- lead pin 380 passes through an associated opening 323 in substrate 32 .
- first end 381 of lead pin 380 is electrically coupled to at least one electrical contact 71 of first interface 70 via pressure contact 386 and second end 382 of lead pin 380 communicates with top side 321 of substrate 32 .
- first end 384 of wire lead 383 is electrically coupled to second end 382 of lead pin 380 and second end 385 of wire lead 383 is electrically coupled to at least one electrical contact 41 of printhead dies 40 .
- lead pin 380 is embedded in a plug 388 which is sized to fit within opening 323 of substrate 32 .
- First end 381 of lead pin 380 and second end 382 of lead pin 380 are provided at opposite ends of plug 388 and provide a point for electrical connection.
- lead pin 380 is sized and/or positioned within opening 323 such that second end 382 of lead pin 380 communicates with top side 321 of substrate 32 .
- second end 382 of lead pin 380 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40 .
- Wire lead 383 therefore, constitutes a shallow wire bond in that wire lead 383 , including first end 384 and second end 385 , are both generally disposed on top side 321 of substrate 32 .
- encapsulation 389 surrounds wire lead 383 . More specifically, encapsulation 389 seals bond areas of lead pin 380 , wire lead 383 , and electrical contacts 41 . Thus, an integrity of electrical connections between lead pin 380 , wire lead 383 , and electrical contacts 41 of printheads 40 is maintained. Encapsulation 389 , for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections.
- lead frame 180 , lead pin 280 , and lead pin 380 are illustrated as being embedded within plugs 188 , 288 , and 388 , respectively, which fit within openings 323 of substrate 32 , it is within the scope of the present invention for lead frame 180 , lead pin 280 , and/or lead pin 380 to be formed in substrate 32 .
- Lead frame 180 , lead pin 280 , and/or lead pin 380 may be insert molded into substrate 32 or lead pin 280 and/or lead pin 380 , for example, may be press fit into substrate 32 .
- carrier 30 accommodates communication of ink between ink supply assembly 14 and printhead dies 40 , accommodates communication of electrical signals between electronic controller 20 and printhead dies 40 , and provides a stable support for printhead dies 40 .
- the functions of fluidic and electrical routing as well as printhead die support, therefore, are provided by a single carrier.
- electrical circuit 34 on bottom side 322 of substrate 32 and sealing electrical circuit 34 between substrate 32 and cover 36 , direct ink contact with electrical circuit 34 is prevented. Thus, electrical shorts caused by ink ingression at electrical interfaces are avoided.
- electrical conduits which are protected from direct ink contact are established for transferring power, ground, and data between electrical circuit 34 and printhead dies 40 .
- electrical circuit 34 By separating electrical circuit 34 from substrate 32 , more design freedom for both substrate 32 and electrical circuit 34 is available. For example, more freedom in material choice and design of substrate 32 as well as electrical routing of electrical circuit 34 is available.
- substrate 32 includes a frame 90 and a body 92 .
- Body 92 substantially surrounds and/or encapsulates frame 90 and forms first side 321 and second side 322 of substrate 32 .
- Frame 90 and body 92 together provide and/or accommodate mechanical, electrical, and fluidic functions of substrate 32 , as described below.
- frame 90 is formed of a substantially rigid material or combination of materials to provide substrate 32 with sufficient stability for printhead dies 40 .
- a rigidity of frame 90 is greater than a rigidity of body 92 .
- Frame 90 may be formed, for example, of a metal or metal alloy. More specifically, frame 90 may be formed of a low expansion Ni-Fe alloy such as Invar, Kovar, or other metal or metal alloy.
- the material or combination of materials of frame 90 have a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of substrate 44 (FIG. 4) of printhead dies 40 .
- expansion and/or contraction of frame 90 substantially matches expansion and/or contraction of substrate 44 .
- relative alignment and/or positioning between and/or among printhead dies 40 is substantially maintained during fabrication and/or operation of inkjet printhead assembly 12 as substrate 44 and/or substrate 32 , including frame 90 , expand and/or contract.
- substrate 44 of printhead dies 40 is formed of silicon.
- the material or combination of materials of frame 90 has a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of silicon.
- body 92 is formed of a material or combination, of materials which is inert to fluid (or ink) passing through substrate 32 .
- the material or combination of materials of body 92 facilitates mounting of printhead dies 40 on substrate 32 .
- Body 92 may be formed, for example, of a plastic material. More specifically, body 92 may be formed of glass or fiber-filled Polyphenylene Sulfide (PPS), fiber reinforced noryl, or other plastic material. As such, body 92 is compatible with ink and facilitates mounting of printhead dies 40 on substrate 32 with, for example, an adhesive.
- body 92 may be molded over frame 90 to substantially surround or encapsulate frame 90 .
- frame 90 has a plurality of openings 903 defined therein. Openings 903 are provided adjacent to opposite ends of printhead dies 40 and facilitate electrical coupling between printhead dies 40 and electrical circuit 34 (FIGS. 5 and 6). More specifically, openings 903 accommodate electrical connectors 68 (including electrical connectors 168 , 268 , and/or 368 , as described above) such that electrical connectors 68 pass through associated openings 903 of frame 90 when electrically coupling printhead dies 40 with electrical circuit 34 , as described above.
- electrical connectors 68 including electrical connectors 168 , 268 , and/or 368 , as described above
- the material of body 92 substantially fills openings 903 of frame 90 when electrical connectors 68 pass through openings 903 .
- body 92 surrounds or encapsulates electrical connectors 68 passing through associated openings 903 of frame 90 .
- body 92 has a plurality of openings 923 formed therein. Openings 923 are formed within openings 903 of frame 90 and accommodate electrical connectors 68 (including electrical connectors 168 , 268 , and/or 368 , as described above) such that electrical connectors 68 pass through associated openings 903 and 923 , respectively, of frame 90 and body 92 when electrically coupling printhead dies 40 with electrical circuit 34 . Thus, openings 923 of body 92 form openings 323 (FIG. 6) of substrate 32 , as described above.
- frame 90 and body 92 both have a plurality of fluid (or ink) passages 904 and 924 , respectively, formed therein.
- Fluid passages 904 of frame 90 are larger than fluid passages 924 of body 92 and are sealed by body 92 . More specifically, the material of body 92 is disposed within an inner perimeter of fluid passages 904 of frame 90 such that fluid passages 924 of body 92 are concentric with fluid passages 904 of frame 90 . As such, body 92 seals frame 90 from direct contact with fluid (or ink) passing through fluid passages 904 and 924 .
- fluid passages 924 of body 92 define or form fluid passages 324 (FIG. 6) of substrate 32 , as described above.
- substrate 32 includes a plurality of datums 94 .
- datums 94 establish reference points for positioning of substrate 32 and, therefore, inkjet printhead assembly 12 .
- inkjet printhead assembly 12 is mounted within mounting assembly 16 (FIG. 1), datums 94 contact corresponding and/or complimentary portions of mounting assembly 16 . Mounting of inkjet printhead assembly 12 in mounting assembly 16 is described, for example, in U.S. Pat. No.
- Datums 94 may also be used to position inkjet printhead assembly 12 during manufacture and/or assembly of inkjet printhead assembly 12 .
- datums 94 may be formed by machining or removing portions of body 92 and/or by molding of datums 94 with body 92 .
- datums 94 are formed as notches in body 92 of substrate 32 .
- datums 94 are formed as projections from body 92 of substrate 32 .
- frame 90 By forming frame 90 of a substantially rigid material, frame 90 contributes to the mechanical stability of substrate 32 . In addition, by surrounding and/or encapsulating frame 90 with body 92 and forming body 92 of a material inert to fluid (or ink) passing through substrate 32 , body 92 contributes to the fluidic routing of substrate 32 . In addition, by accommodating electrical connectors 68 , frame 90 and body 92 contribute to the electrical routing of substrate 32 . Thus, substrate 32 effectively combines the functions of fluidic and electrical routing as well as printhead die support for inkjet printhead assembly 12 .
Abstract
A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
Description
- This application is a Continuation-In-Part of U.S. patent application Ser. No. 10/001,180, entitled “Electrical Connection For Inkjet Printhead Assembly With Hybrid Carrier For Printhead Dies” filed on Nov. 1, 2001, which is a Continuation of U.S. patent application Ser. No. 09/648,120, entitled “Electrical Connection For Wide-Array Inkjet Printhead Assembly With Hybrid Carrier For Printhead Dies” filed on Aug. 25, 2000, now U.S. Pat. No. 6,341,845, both assigned to the assignee of the present invention, and incorporated herein by reference, and is a Continuation-In-Part of U.S. patent application Ser. No. 09/648,564, entitled “Inkjet Printhead Assembly With Hybrid Carrier for Printhead Dies” filed on Aug. 25, 2000, which is a Continuation-in-Part of U.S. patent application Ser. No. 09/216,606, entitled “Multilayered Platform for Multiple Printhead Dies” filed on Dec. 17, 1998, now U.S. Pat. No. 6,322,206, and a Continuation-in-Part of U.S. patent application Ser. No. 09/216,601, entitled “Inkjet Printing Apparatus with Ink Manifold” filed on Dec. 17, 1998, now U.S. Pat. No. 6,250,738, each assigned to the assignee of the present invention, and incorporated herein by reference.
- The present invention relates generally to fluid ejection devices, and more particularly to a substrate for a fluid ejection assembly.
- A conventional inkjet printing system, as one embodiment of a fluid ejection system, includes a printhead, an ink supply which supplies liquid ink to the printhead, and an electronic controller which controls the printhead. The printhead, as one embodiment of a fluid ejection device, ejects ink drops through a plurality of orifices or nozzles and toward a print medium, such as a sheet of paper, so as to print onto the print medium. Typically, the orifices are arranged in one or more arrays such that properly sequenced ejection of ink from the orifices causes characters or other images to be printed upon the print medium as the printhead and the print medium are moved relative to each other.
- In one arrangement, commonly referred to as a wide-array inkjet printing system, a plurality of individual printheads, also referred to as printhead dies, are mounted on a single substrate. As such, a number of nozzles and, therefore, an overall number of ink drops which can be ejected per second is increased. Since the overall number of drops which can be ejected per second is increased, printing speed can be increased with the wide-array inkjet printing system.
- When mounting a plurality of printhead dies on a single substrate, the single substrate performs several functions including fluid and electrical routing as well as printhead die support. More specifically, the single substrate accommodates communication of ink between the ink supply and each of the printhead dies, accommodates communication of electrical signals between the electronic controller and each of the printhead dies, and provides a stable support for each of the printhead dies. Unfortunately, effectively combining these functions in one unitary structure is difficult.
- Accordingly, it is desirable for a substrate which provides support for a plurality of printhead dies while accommodating fluidic and electrical routing to the printhead dies.
- One aspect of the present invention provides a fluid ejection assembly including a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
- FIG. 1 is a block diagram illustrating one embodiment of an ink-jet printing system according to the present invention.
- FIG. 2 is a top perspective view of one embodiment of an ink-jet printhead assembly including a plurality of printhead dies according to the present invention.
- FIG. 3 is a bottom perspective view of the inkjet printhead assembly of FIG. 2.
- FIG. 4 is a schematic cross-sectional view illustrating one embodiment of portions of a printhead die according to the present invention.
- FIG. 5 is a schematic cross-sectional view of an inkjet printhead assembly illustrating one embodiment of an electrical connector according to the present invention.
- FIG. 6 is an exploded view of the inkjet printhead assembly of FIG. 5.
- FIG. 7 is an exploded top perspective view of one embodiment of an inkjet printhead assembly according to the present invention.
- FIG. 8 is a schematic cross-sectional view of one embodiment of a portion of an electrical circuit of an inkjet printhead assembly according to the present invention.
- FIG. 9A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 9B is an exploded view of the inkjet printhead assembly of FIG. 9A.
- FIG. 10A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 10B is an exploded view of the inkjet printhead assembly of FIG. 10A.
- FIG. 11A is a schematic cross-sectional view of a portion of the ink-jet printhead assembly of FIG. 5 illustrating another embodiment of an electrical connector according to the present invention.
- FIG. 11B is an exploded view of the inkjet printhead assembly of FIG. 11A.
- FIG. 12 is a schematic cross-sectional view of one embodiment of a substrate of an inkjet printhead assembly according to the present invention.
- FIG. 13 is a cross-sectional top view of one embodiment of a frame of the substrate of FIG. 12 taken along line13-13 of FIG. 12.
- FIG. 14 is a schematic cross-sectional view of another embodiment of a substrate of an inkjet printhead assembly according to the present invention.
- In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” “leading,” “trailing,” etc., is used with reference to the orientation of the Figure(s) being described. Because components of the present invention can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
- FIG. 1 illustrates one embodiment of an
inkjet printing system 10 according to the present invention.Inkjet printing system 10 constitutes one embodiment of a fluid ejection system which includes a fluid ejection assembly, such as aninkjet printhead assembly 12, and a fluid supply assembly, such as anink supply assembly 14. In the illustrated embodiment,inkjet printing system 10 also includes amounting assembly 16, amedia transport assembly 18, and anelectronic controller 20. -
Inkjet printhead assembly 12, as one embodiment of a fluid ejection assembly, is formed according to an embodiment of the present invention, and includes one or more printheads or fluid ejection devices which eject drops of ink or fluid through a plurality of orifices ornozzles 13. In one embodiment, the drops are directed toward a medium, such asprint medium 19, so as to print ontoprint medium 19.Print medium 19 is any type of suitable sheet material, such as paper, card stock, transparencies, Mylar, and the like. Typically, nozzles 13 are arranged in one or more columns or arrays such that properly sequenced ejection of ink fromnozzles 13 causes, in one embodiment, characters, symbols, and/or other graphics or images to be printed uponprint medium 19 asinkjet printhead assembly 12 andprint medium 19 are moved relative to each other. -
Ink supply assembly 14, as one embodiment of a fluid supply assembly, supplies ink toprinthead assembly 12 and includes areservoir 15 for storing ink. As such, in one embodiment, ink flows fromreservoir 15 toinkjet printhead assembly 12. In one embodiment,inkjet printhead assembly 12 andink supply assembly 14 are housed together in an inkjet or fluidjet cartridge or pen. In another embodiment,ink supply assembly 14 is separate frominkjet printhead assembly 12 and supplies ink toinkjet printhead assembly 12 through an interface connection, such as a supply tube. - Mounting
assembly 16 positionsinkjet printhead assembly 12 relative tomedia transport assembly 18 andmedia transport assembly 18 positions print medium 19 relative toinkjet printhead assembly 12. Thus, aprint zone 17 is defined adjacent tonozzles 13 in an area betweeninkjet printhead assembly 12 andprint medium 19. In one embodiment,inkjet printhead assembly 12 is a scanning type printhead assembly and mountingassembly 16 includes a carriage for movinginkjet printhead assembly 12 relative tomedia transport assembly 18. In another embodiment,inkjet printhead assembly 12 is a non-scanning type printhead assembly and mountingassembly 16 fixes ink-jet printhead assembly 12 at a prescribed position relative tomedia transport assembly 18. -
Electronic controller 20 communicates withinkjet printhead assembly 12, mountingassembly 16, andmedia transport assembly 18.Electronic controller 20 receivesdata 21 from a host system, such as a computer, and includes memory for temporarily storingdata 21. Typically,data 21 is sent to ink-jet printing system 10 along an electronic, infrared, optical or other information transfer path.Data 21 represents, for example, a document and/or file to be printed. As such,data 21 forms a print job forinkjet printing system 10 and includes one or more print job commands and/or command parameters. - In one embodiment,
electronic controller 20 provides control of ink-jet printhead assembly 12 including timing control for ejection of ink drops fromnozzles 13. As such,electronic controller 20 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images onprint medium 19. Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters. In one embodiment, logic and drive circuitry forming a portion ofelectronic controller 20 is incorporated in an integrated circuit (IC) 22 located on inkjet printhead assembly 12 (shown in FIG. 5). In another embodiment, logic and drive circuitry is located offinkjet printhead assembly 12. - FIGS. 2 and 3 illustrate one embodiment of a portion of
inkjet printhead assembly 12.Inkjet printhead assembly 12 is a wide-array or multi-head printhead assembly and includes acarrier 30, a plurality of printhead dies 40, anink delivery system 50, and anelectronic interface system 60.Carrier 30 has an exposed surface orfirst face 301 and an exposed surface orsecond face 302 which is opposite of and oriented substantially parallel withfirst face 301.Carrier 30 serves to carry or provide mechanical support for printhead dies 40. In addition,carrier 30 accommodates fluidic communication between printhead dies 40 andink supply assembly 14 viaink delivery system 50 and accommodates electrical communication between printhead dies 40 andelectronic controller 20 viaelectronic interface system 60. - Printhead dies40 are mounted on
first face 301 ofcarrier 30 and aligned in one or more rows. In one embodiment, printhead dies 40 are spaced apart and staggered such that printhead dies 40 in one row overlap at least one printhead die 40 in another row. Thus,inkjet printhead assembly 12 may span a nominal page width or a width shorter or longer than nominal page width. In one embodiment, a plurality ofinkjet printhead assemblies 12 are mounted in an end-to-end manner.Carrier 30, therefore, has a staggered or stair-step profile. Thus, at least one printhead die 40 of oneinkjet printhead assembly 12 overlaps at least one printhead die 40 of an adjacentinkjet printhead assembly 12. While four printhead dies 40 are illustrated as being mounted oncarrier 30, the number of printhead dies 40 mounted oncarrier 30 may vary. -
Ink delivery system 50 fluidically couplesink supply assembly 14 with printhead dies 40. In one embodiment,ink delivery system 50 includes a manifold 52 and aport 54.Manifold 52 is mounted onsecond face 302 ofcarrier 30 and distributes ink throughcarrier 30 to each printhead die 40.Port 54 communicates withmanifold 52 and provides an inlet for ink supplied byink supply assembly 14. -
Electronic interface system 60 electrically coupleselectronic controller 20 with printhead dies 40. In one embodiment,electronic interface system 60 includes a plurality ofelectrical contacts 62 which form input/output (I/O) contacts forelectronic interface system 60. As such,electrical contacts 62 provide points for communicating electrical signals betweenelectronic controller 20 andinkjet printhead assembly 12. Examples ofelectrical contacts 62 include I/O pins which engage corresponding I/O receptacles electrically coupled toelectronic controller 20 and I/O contact pads or fingers which mechanically or inductively contact corresponding electrical nodes electrically coupled toelectronic controller 20. Althoughelectrical contacts 62 are illustrated as being provided onsecond face 302 ofcarrier 30, it is within the scope of the present invention forelectrical contacts 62 to be provided on other sides ofcarrier 30. - As illustrated in the embodiment of FIGS. 2 and 4, each printhead die40 includes an array of
drop ejecting elements 42. Drop ejectingelements 42 are formed on asubstrate 44 which has a fluid (or ink)feed slot 441 formed therein. As such,fluid feed slot 441 provides a supply of fluid (or ink) to drop ejectingelements 42.Substrate 44 is formed, for example, of silicon, glass, or a stable polymer. - In one embodiment, each drop ejecting
element 42 includes a thin-film structure 46 with a firingresistor 48 and anorifice layer 47. Thin-film structure 46 has a fluid (or ink)feed channel 461 formed therein which communicates withfluid feed slot 441 ofsubstrate 44.Orifice layer 47 has afront face 471 and anozzle opening 472 formed infront face 471.Orifice layer 47 also has anozzle chamber 473 formed therein which communicates withnozzle opening 472 andfluid feed channel 461 of thin-film structure 46. Firingresistor 48 is positioned withinnozzle chamber 473 and includesleads 481 which electricallycouple firing resistor 48 to a drive signal and ground. - Thin-
film structure 46 is formed, for example, by one or more passivation or insulation layers of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly-silicon glass, or other suitable material. In one embodiment, thin-film structure 46 also includes a conductive layer which defines firingresistor 48 and leads 481. The conductive layer is formed, for example, by aluminum, gold, tantalum, tantalum-aluminum, or other metal or metal alloy. - In one embodiment, during operation, fluid flows from
fluid feed slot 441 tonozzle chamber 473 viafluid feed channel 461.Nozzle opening 472 is operatively associated with firingresistor 48 such that droplets of fluid are ejected fromnozzle chamber 473 through nozzle opening 472 (e.g., normal to the plane of firing resistor 48) and toward a medium upon energization of firingresistor 48. - Example embodiments of printhead dies40 include a thermal printhead, as previously described, a piezoelectric printhead, a flex-tensional printhead, or any other type of fluidjet ejection device known in the art. In one embodiment, printhead dies 40 are fully integrated thermal inkjet printheads.
- Referring to the embodiment of FIGS.5-7,
carrier 30 includes asubstrate 32 and anelectrical circuit 34.Substrate 32 provides and accommodates mechanical, electrical, and fluidic functions ofinkjet printhead assembly 12 whileelectrical circuit 34 provides and accommodates electrical and fluidic functions ofinkjet printhead assembly 12. More specifically,substrate 32 supports printhead dies 40. In addition,substrate 32 andelectrical circuit 34 accommodate electrical interconnection between and among printhead dies 40 andelectronic controller 20 viaelectronic interface system 60. Furthermore,substrate 32 andelectrical circuit 34 accommodate fluidic communication betweenink supply assembly 14 and printhead dies 40 viaink delivery system 50. -
Substrate 32 has atop side 321 and abottom side 322 which is opposite oftop side 321. In one embodiment,electrical circuit 34 is disposed onbottom side 322 ofsubstrate 32 and printhead dies 40 are mounted ontop side 321 ofsubstrate 32. In addition, printhead dies 40 are electrically coupled toelectrical circuit 34. In one embodiment,substrate 32 andelectrical circuit 34 are positioned and configured to protectelectrical circuit 34 from mechanical damage and/or ink contact. In addition,substrate 32 facilitates electrical coupling betweenelectrical circuit 34 and printhead dies 40. Thus,substrate 32 provides support for printhead dies 40, provides fluid routing to printhead dies 40, and provides protection ofelectrical circuit 34 from mechanical damage and/or ink contact. - In one embodiment,
substrate 32 is formed of plastic, ceramic, silicon, stainless steel, or other suitable material or combination of materials.Substrate 32 is formed, for example, of a high performance plastic such as fiber reinforced noryl. Preferably,substrate 32 has a high modulus or rigidity to provide proper support for printhead dies 40, has a low coefficient of thermal expansion (CTE) to avoid expansion and ensure accurate alignment between printhead dies 40, and is chemically compatible with liquid ink to provide fluid routing and protection. - For transferring electrical signals between
electronic controller 20 and printhead dies 40,electrical circuit 34 establishes a plurality of conductive paths 64 (shown, for example, in FIG. 8).Conductive paths 64 define transfer paths for power, ground, and data among and between printhead dies 40 andelectronic controller 20. In addition,electronic interface system 60 includes anelectrical interconnect 66 and a plurality ofelectrical connectors 68. -
Electrical interconnect 66 provides electrical coupling betweenelectronic controller 20 andelectrical circuit 34 whileelectrical connectors 68 provide electrical coupling betweenelectrical circuit 34 and printhead dies 40. In one embodiment,electrical interconnect 66 is established, for example, by I/O contacts 62 electrically coupled toelectrical circuit 34. Thus,electrical interconnect 66 facilitates electrical coupling betweenelectronic controller 20 andinkjet printhead assembly 12. - In one embodiment,
electrical circuit 34 includes afirst interface 70 and asecond interface 72.First interface 70 andsecond interface 72 both include a plurality ofelectrical contacts electrical circuit 34. Thus,electrical contacts electrical circuit 34 via, for example, I/O contacts 62, such as I/O pins, contact pads, spring fingers, and/or other suitable electrical connectors.Conductive paths 64 ofelectrical circuit 34 terminate at and provide electrical coupling betweenelectrical contacts 71 offirst interface 70 andelectrical contacts 73 ofsecond interface 72. -
First interface 70 provides an input/output interface for communication with printhead dies 40 viaelectrical connectors 68 andsecond interface 72 provides an input/output interface for communication withelectronic controller 20 viaelectrical interconnect 66.Electrical interconnect 66, therefore, is electrically coupled to at least oneelectrical contact 73 ofsecond interface 72. In one embodiment, printhead dies 40 includeelectrical contacts 41 which form I/O bond pads. Thus,electrical connectors 68 electrically coupleelectrical contacts 71 offirst interface 70 withelectrical contacts 41 of printhead dies 40. - In one embodiment,
substrate 32 has a plurality ofopenings 323 defined therein.Openings 323 are adjacent to opposite ends of printhead dies 40 along the substrate, and communicate withtop side 321 andbottom side 322 ofsubstrate 32. As such,openings 323 reveal or provide access toelectrical contacts 71 offirst interface 70.Electrical connectors 68, therefore, pass through associatedopenings 323 insubstrate 32 when electrically coupling printhead dies 40 withelectrical circuit 34. Thus,electrical connectors 68 provide electrical connection throughsubstrate 32. - As
electrical circuit 34 is disposed onbottom side 322 ofsubstrate 32 and printhead dies 40 are mounted ontop side 321 ofsubstrate 32,electrical connectors 68 establish electrical connection betweenbottom side 322 ofsubstrate 32 andtop side 321 ofsubstrate 32. Thus,electrical connectors 68 provide electrical connection between two discrete levels. More specifically,electrical connectors 68 establish electrical connection withelectrical circuit 34 at a first level and electrical connection with printhead dies 40 at a second level which is above or offset from the first level.Electrical connectors 68, therefore, provide electrical connection between two separate or noncoplanar planes. - FIGS. 5 and 6 illustrate one embodiment of
electrical connectors 68.Electrical connectors 68 include a wire bond orwire lead 80 having afirst end 81 and asecond end 82. To electrically couple printhead dies 40 withelectrical circuit 34, wire lead 80 passes through an associatedopening 323 insubstrate 32. As such,first end 81 ofwire lead 80 is electrically coupled to at least oneelectrical contact 71 offirst interface 70 andsecond end 82 ofwire lead 80 communicates withtop side 321 ofsubstrate 32. Thus,second end 82 ofwire lead 80 is electrically coupled to at least oneelectrical contact 41 of printhead dies 40. - Electrical coupling between
wire lead 80 andelectrical contacts wire lead 80 constitutes a deep wire bond in thatfirst end 81 is generally disposed onbottom side 322 ofsubstrate 32 andsecond end 82 is generally disposed ontop side 321 ofsubstrate 32. - In one embodiment,
encapsulation 89 surroundswire lead 80. More specifically,encapsulation 89 seals bond areas ofwire lead 80 andelectrical contacts electrical contacts 71 offirst interface 70,wire lead 80, andelectrical contacts 41 ofprintheads 40 is maintained.Encapsulation 89, for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections. - In one embodiment,
electrical circuit 34 includes a printedcircuit board 78. Printedcircuit board 78 has atop side 781 and abottom side 782 opposed totop side 781. Printedcircuit board 78 is disposed onbottom side 322 ofsubstrate 32 such thattop side 781 of printedcircuit board 78 is adjacentbottom side 322 ofsubstrate 32. As such,first interface 70, includingelectrical contacts 71, is provided ontop side 781 of printedcircuit board 78 andsecond interface 72, includingelectrical contacts 73, is provided onbottom side 782 of printedcircuit board 78. It is understood that printedcircuit board 78 may be formed of multiple layers, as described below. In addition, it is within the scope of the present invention forelectrical circuit 34 to include a flexible circuit such as a soft flex circuit or a rigid flex circuit. Thus, printedcircuit board 78 may be formed as a rigid circuit or a flexible circuit. - In one embodiment,
electronic controller 20 includes integrated circuit (IC) 22 which is mounted on printedcircuit board 78. More specifically,IC 22 is mounted onbottom side 782 of printedcircuit board 78.IC 22 is electrically coupled to printedcircuit board 78 and, therefore,electrical circuit 34, viaelectrical contacts 73 ofsecond interface 72.IC 22 includes logic and drive circuitry forinkjet printhead assembly 12 and, more specifically, printhead dies 40. - For transferring ink between
ink supply assembly 14 and printhead dies 40,substrate 32 and printedcircuit board 78 both have a plurality of fluid (or ink)passages Fluid passages 324 extend throughsubstrate 32 andfluid passages 784 extend through printedcircuit board 78.Fluid passages 324 communicate withfluid passages 784 so as to define a plurality of fluid (or ink)paths 304 throughcarrier 30 for delivery of ink to printhead dies 40 frommanifold 52. -
Fluid paths 304 communicate at afirst end 305 withmanifold 52 ofink delivery system 50 and at asecond end 306 with printhead dies 40. More specifically,second end 306 offluid paths 304 communicates withfluid feed slot 441 of substrate 44 (FIG. 4). As such,fluid paths 304 form a portion ofink delivery system 50. Although only onefluid path 304 is shown for a given printhead die 40, there may be additional fluid paths to the same printhead die to provide ink of respective differing colors. - In one embodiment,
carrier 30 includes acover 36.Cover 36 has a top side 361 and abottom side 362 opposed to top side 361.Cover 36 is disposed onbottom side 322 ofsubstrate 32 such that top side 361 ofcover 36 is adjacentbottom side 322 ofsubstrate 32. Thus,electrical circuit 34 is interposed betweensubstrate 32 andcover 36. In addition,manifold 52 is disposed onbottom side 362 ofcover 36. - In one embodiment, cover36 includes a plurality of
supports 363 which protrude upward from top side 361.Supports 363 contactelectrical circuit 34 and supportelectrical circuit 34 relative tosubstrate 32. In one embodiment, supports 363 are positioned to contact and supportelectrical circuit 34 in areas opposite ofelectrical contacts 71 offirst interface 70. - For transferring ink between
ink supply assembly 14 and printhead dies 40, cover 36 has a plurality of fluid (or ink)passages 364 formed therein.Fluid passages 364 extend throughcover 36 such thatfluid passages 364 ofcover 36 communicate withfluid passages circuit board 78 andsubstrate 32, respectively.Fluid passages 364 together withfluid passages fluid paths 304 ofcarrier 30 for delivery of ink to printhead dies 40. - In one embodiment,
substrate 32 together withcover 36 surroundelectrical circuit 34 so as to sealelectrical circuit 34 from direct contact with ink passing throughfluid paths 304 ofcarrier 30. Printedcircuit board 78, for example, fits withincover 36 as illustrated in FIG. 5 or fits withinsubstrate 32 as illustrated in FIG. 7. More specifically, a portion ofcover 36 orsubstrate 32 which definesfluid passages fluid passages 784 of printedcircuit board 78. Ink, therefore, flows through printedcircuit board 78 but does not contact printedcircuit board 78. Thus, ink frommanifold 52 flows throughcover 36,electrical circuit 34 including, more specifically, printedcircuit board 78, and throughsubstrate 32 to printhead dies 40. - In one embodiment, as illustrated in FIG. 8,
electrical circuit 34 is formed of multiple planes orlayers 74 including a plurality ofconductive layers 75 and a plurality of non-conductive or insulative layers 76.Conductive layers 75 are formed, for example, by patterned traces of conductive material on insulative layers 76. As such, at least oneinsulative layer 76 is interposed between twoconductive layers 75.Conductive layers 75 include, for example, apower layer 751, adata layer 752, and aground layer 753.Power layer 751 conducts power for printhead dies 40,data layer 752 carries data for printhead dies 40, andground layer 753 provides grounding for printhead dies 40. -
Power layer 751,data layer 752, andground layer 753 individually form portions ofconductive paths 64 ofelectrical circuit 34. Thus,power layer 751,data layer 752, andground layer 753 are each electrically coupled tofirst interface 70 andsecond interface 72 ofelectrical circuit 34 by, for example, conductive paths through insulative layers 76. As such, power, data, and ground are communicated betweenfirst interface 70 andsecond interface 72. The number ofconductive layers 75 andinsulative layers 76 can vary depending on the number of printhead dies 40 to be mounted oncarrier 30 as well as the power and data rate requirements of printhead dies 40. - FIGS. 9A and 9B illustrate another embodiment of
electrical connectors 68.Electrical connectors 168 electrically coupleelectrical circuit 34 and printhead dies 40.Electrical connectors 168 include alead frame 180 and a wire bond orwire lead 183.Lead frame 180 has afirst tab 181 and asecond tab 182, andwire lead 183 has afirst end 184 and asecond end 185. - To electrically couple printhead dies40 with
electrical circuit 34,lead frame 180 passes through an associatedopening 323 insubstrate 32. As such,first tab 181 oflead frame 180 is electrically coupled to at least oneelectrical contact 71 offirst interface 70 andsecond tab 182 oflead frame 180 communicates withtop side 321 ofsubstrate 32. Thus,first end 184 ofwire lead 183 is electrically coupled tosecond tab 182 oflead frame 180 andsecond end 185 ofwire lead 183 is electrically coupled to at least oneelectrical contact 41 of printhead dies 40. Electrical coupling betweenlead frame 180 andelectrical contact 71 is formed, for example, by a solder joint. - In one embodiment,
lead frame 180 is embedded in aplug 188 which is sized to fit within opening 323 ofsubstrate 32.First tab 181 oflead frame 180 andsecond tab 182 oflead fame 180 are provided at opposite ends ofplug 188 and provide an area for electrical connection. In addition,lead frame 180 is sized and/or positioned within opening 323 such thatsecond tab 182 oflead frame 180 communicates withtop side 321 ofsubstrate 32. Thus,second tab 182 oflead frame 180 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40. As such, bonding ofwire lead 183 betweenlead frame 180 and printhead dies 40 is facilitated.Wire lead 183, therefore, constitutes a shallow wire bond in thatwire lead 183, includingfirst end 184 andsecond end 185, are both generally disposed ontop side 321 ofsubstrate 32. - In one embodiment,
encapsulation 189 surroundslead frame 180 andwire lead 183. More specifically,encapsulation 189 seals bond areas oflead frame 180,wire lead 183, andelectrical contacts electrical contacts 71 offirst interface 70,lead frame 180,wire lead 183, andelectrical contacts 41 of printhead dies 40 is maintained.Encapsulation 189, for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections. - FIGS. 10A and 10B illustrate another embodiment of
electrical connectors 68.Electrical connectors 268 electrically coupleelectrical circuit 34 and printhead dies 40.Electrical connectors 268 include alead pin 280 and a wire bond orwire lead 283.Lead pin 280 has afirst end 281 and asecond end 282, andwire lead 283 has afirst end 284 and asecond end 285. - To electrically couple printhead dies40 with
electrical circuit 34,lead pin 280 passes through an associatedopening 323 insubstrate 32. As such,first end 281 oflead pin 280 is electrically coupled to at least oneelectrical contact 71 offirst interface 70 andsecond end 282 oflead pin 280 communicates withtop side 321 ofsubstrate 32. Thus,first end 284 ofwire lead 283 is electrically coupled tosecond end 282 oflead pin 280 andsecond end 285 ofwire lead 283 is electrically coupled to at least oneelectrical contact 41 of printhead dies 40. Electrical coupling betweenlead pin 280 andelectrical contact 71 is formed, for example, by a solder joint. - In one embodiment,
lead pin 280 is embedded in aplug 288 which is sized to fit within opening 323 ofsubstrate 32.First end 281 oflead pin 280 andsecond end 282 oflead pin 280 are provided at opposite ends ofplug 288 and provide a point for electrical connection. In addition,lead pin 280 is sized, and/or positioned within opening 323 such thatsecond end 282 oflead pin 280 communicates withtop side 321 ofsubstrate 32. Thus,second end 282 oflead pin 280 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40. As such, bonding ofwire lead 283 betweenlead pin 280 and printhead dies 40 is facilitated.Wire lead 283, therefore, constitutes a shallow wire bond in thatwire lead 283, includingfirst end 284 andsecond end 285, are both generally disposed ontop side 321 ofsubstrate 32. - In one embodiment,
encapsulation 289 surroundslead pin 280 andwire lead 283. More specifically,encapsulation 289 seals bond areas oflead pin 280,wire lead 283, andelectrical contacts electrical contacts 71 offirst interface 70,lead pin 280,wire lead 283, andelectrical contacts 41 ofprintheads 40 is maintained.Encapsulation 289, for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections. - FIGS. 11A and 11B illustrate another embodiment of
electrical connectors 68.Electrical connectors 368 electrically coupleelectrical circuit 34 and printhead dies 40.Electrical connectors 368 include alead pin 380, a wire bond orwire lead 383, and apressure contact 386.Lead pin 380 has afirst end 381 and asecond end 382, andwire lead 383 has afirst end 384 and asecond end 385. - To electrically couple printhead dies40 with
electrical circuit 34,lead pin 380 passes through an associatedopening 323 insubstrate 32. As such,first end 381 oflead pin 380 is electrically coupled to at least oneelectrical contact 71 offirst interface 70 viapressure contact 386 andsecond end 382 oflead pin 380 communicates withtop side 321 ofsubstrate 32. Thus,first end 384 ofwire lead 383 is electrically coupled tosecond end 382 oflead pin 380 andsecond end 385 ofwire lead 383 is electrically coupled to at least oneelectrical contact 41 of printhead dies 40. - In one embodiment,
lead pin 380 is embedded in aplug 388 which is sized to fit within opening 323 ofsubstrate 32.First end 381 oflead pin 380 andsecond end 382 oflead pin 380 are provided at opposite ends ofplug 388 and provide a point for electrical connection. In addition,lead pin 380 is sized and/or positioned within opening 323 such thatsecond end 382 oflead pin 380 communicates withtop side 321 ofsubstrate 32. Thus,second end 382 oflead pin 380 provides a bonding site which is substantially planar with as well as adjacent to printhead dies 40. As such, bonding ofwire lead 383 betweenlead pin 380 and printhead dies 40 is facilitated.Wire lead 383, therefore, constitutes a shallow wire bond in thatwire lead 383, includingfirst end 384 andsecond end 385, are both generally disposed ontop side 321 ofsubstrate 32. - In one embodiment,
encapsulation 389 surroundswire lead 383. More specifically,encapsulation 389 seals bond areas oflead pin 380,wire lead 383, andelectrical contacts 41. Thus, an integrity of electrical connections betweenlead pin 380,wire lead 383, andelectrical contacts 41 ofprintheads 40 is maintained.Encapsulation 389, for example, protects against corrosion or electrical shorting caused by ink ingression at the electrical connections. - While
lead frame 180,lead pin 280, andlead pin 380 are illustrated as being embedded withinplugs openings 323 ofsubstrate 32, it is within the scope of the present invention forlead frame 180,lead pin 280, and/orlead pin 380 to be formed insubstrate 32.Lead frame 180,lead pin 280, and/orlead pin 380, for example, may be insert molded intosubstrate 32 orlead pin 280 and/orlead pin 380, for example, may be press fit intosubstrate 32. - By incorporating
substrate 32 andelectrical circuit 34 incarrier 30,carrier 30 accommodates communication of ink betweenink supply assembly 14 and printhead dies 40, accommodates communication of electrical signals betweenelectronic controller 20 and printhead dies 40, and provides a stable support for printhead dies 40. The functions of fluidic and electrical routing as well as printhead die support, therefore, are provided by a single carrier. In addition, by disposingelectrical circuit 34 onbottom side 322 ofsubstrate 32 and sealingelectrical circuit 34 betweensubstrate 32 andcover 36, direct ink contact withelectrical circuit 34 is prevented. Thus, electrical shorts caused by ink ingression at electrical interfaces are avoided. In addition, by passingelectrical connectors 68 throughopenings 323 insubstrate 32 and betweenbottom side 322 andtop side 321 ofsubstrate 32, electrical conduits which are protected from direct ink contact are established for transferring power, ground, and data betweenelectrical circuit 34 and printhead dies 40. Furthermore, by separatingelectrical circuit 34 fromsubstrate 32, more design freedom for bothsubstrate 32 andelectrical circuit 34 is available. For example, more freedom in material choice and design ofsubstrate 32 as well as electrical routing ofelectrical circuit 34 is available. - In one embodiment, as illustrated in FIGS. 12 and 13,
substrate 32 includes aframe 90 and abody 92.Body 92 substantially surrounds and/or encapsulatesframe 90 and formsfirst side 321 andsecond side 322 ofsubstrate 32.Frame 90 andbody 92 together provide and/or accommodate mechanical, electrical, and fluidic functions ofsubstrate 32, as described below. - In one embodiment,
frame 90 is formed of a substantially rigid material or combination of materials to providesubstrate 32 with sufficient stability for printhead dies 40. In addition, a rigidity offrame 90 is greater than a rigidity ofbody 92.Frame 90 may be formed, for example, of a metal or metal alloy. More specifically,frame 90 may be formed of a low expansion Ni-Fe alloy such as Invar, Kovar, or other metal or metal alloy. - In one embodiment, the material or combination of materials of
frame 90 have a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of substrate 44 (FIG. 4) of printhead dies 40. As such, expansion and/or contraction offrame 90 substantially matches expansion and/or contraction ofsubstrate 44. Thus, relative alignment and/or positioning between and/or among printhead dies 40 is substantially maintained during fabrication and/or operation ofinkjet printhead assembly 12 assubstrate 44 and/orsubstrate 32, includingframe 90, expand and/or contract. In one embodiment, as described above,substrate 44 of printhead dies 40 is formed of silicon. As such, the material or combination of materials offrame 90 has a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of silicon. - In one embodiment,
body 92 is formed of a material or combination, of materials which is inert to fluid (or ink) passing throughsubstrate 32. In addition, the material or combination of materials ofbody 92 facilitates mounting of printhead dies 40 onsubstrate 32.Body 92 may be formed, for example, of a plastic material. More specifically,body 92 may be formed of glass or fiber-filled Polyphenylene Sulfide (PPS), fiber reinforced noryl, or other plastic material. As such,body 92 is compatible with ink and facilitates mounting of printhead dies 40 onsubstrate 32 with, for example, an adhesive. In addition,body 92 may be molded overframe 90 to substantially surround or encapsulateframe 90. - In one embodiment,
frame 90 has a plurality ofopenings 903 defined therein.Openings 903 are provided adjacent to opposite ends of printhead dies 40 and facilitate electrical coupling between printhead dies 40 and electrical circuit 34 (FIGS. 5 and 6). More specifically,openings 903 accommodate electrical connectors 68 (includingelectrical connectors electrical connectors 68 pass through associatedopenings 903 offrame 90 when electrically coupling printhead dies 40 withelectrical circuit 34, as described above. - In one embodiment, as illustrated in FIG. 12, the material of
body 92 substantially fillsopenings 903 offrame 90 whenelectrical connectors 68 pass throughopenings 903. As such,body 92 surrounds or encapsulateselectrical connectors 68 passing through associatedopenings 903 offrame 90. - In another embodiment, as illustrated in FIG. 14,
body 92 has a plurality of openings 923 formed therein. Openings 923 are formed withinopenings 903 offrame 90 and accommodate electrical connectors 68 (includingelectrical connectors electrical connectors 68 pass through associatedopenings 903 and 923, respectively, offrame 90 andbody 92 when electrically coupling printhead dies 40 withelectrical circuit 34. Thus, openings 923 ofbody 92 form openings 323 (FIG. 6) ofsubstrate 32, as described above. - In one embodiment, as illustrated in FIGS.12-14,
frame 90 andbody 92 both have a plurality of fluid (or ink)passages 904 and 924, respectively, formed therein.Fluid passages 904 offrame 90 are larger than fluid passages 924 ofbody 92 and are sealed bybody 92. More specifically, the material ofbody 92 is disposed within an inner perimeter offluid passages 904 offrame 90 such that fluid passages 924 ofbody 92 are concentric withfluid passages 904 offrame 90. As such,body 92seals frame 90 from direct contact with fluid (or ink) passing throughfluid passages 904 and 924. Thus, fluid passages 924 ofbody 92 define or form fluid passages 324 (FIG. 6) ofsubstrate 32, as described above. - In one embodiment, as illustrated in FIGS. 12 and 14, to position ink-
jet printhead assembly 12 in x, y, and z dimensions,substrate 32 includes a plurality ofdatums 94. As such, datums 94 establish reference points for positioning ofsubstrate 32 and, therefore,inkjet printhead assembly 12. Thus, wheninkjet printhead assembly 12 is mounted within mounting assembly 16 (FIG. 1),datums 94 contact corresponding and/or complimentary portions of mountingassembly 16. Mounting ofinkjet printhead assembly 12 in mountingassembly 16 is described, for example, in U.S. Pat. No. 6,350,013, entitled “Carrier Positioning for Wide-Array Inkjet Printhead Assembly” assigned to the assignee of the present invention and incorporated herein by reference.Datums 94 may also be used to positioninkjet printhead assembly 12 during manufacture and/or assembly ofinkjet printhead assembly 12. - With
body 92 formed of a plastic material, as described above, datums 94 may be formed by machining or removing portions ofbody 92 and/or by molding ofdatums 94 withbody 92. In one embodiment, as illustrated in FIG. 12, datums 94 are formed as notches inbody 92 ofsubstrate 32. In another embodiment, as illustrated in FIG. 14, datums 94 are formed as projections frombody 92 ofsubstrate 32. - By forming
frame 90 of a substantially rigid material,frame 90 contributes to the mechanical stability ofsubstrate 32. In addition, by surrounding and/or encapsulatingframe 90 withbody 92 and formingbody 92 of a material inert to fluid (or ink) passing throughsubstrate 32,body 92 contributes to the fluidic routing ofsubstrate 32. In addition, by accommodatingelectrical connectors 68,frame 90 andbody 92 contribute to the electrical routing ofsubstrate 32. Thus,substrate 32 effectively combines the functions of fluidic and electrical routing as well as printhead die support forinkjet printhead assembly 12. - Although specific embodiments have been illustrated and described herein for purposes of description of the preferred embodiment, it will be appreciated by those of ordinary skill in the art that a wide variety of alternate and/or equivalent implementations calculated to achieve the same purposes may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. Those with skill in the chemical, mechanical, electromechanical, electrical, and computer arts will readily appreciate that the present invention may be implemented in a very wide variety of embodiments. This application is intended to cover any adaptations or variations of the preferred embodiments discussed herein. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof.
Claims (42)
1. A fluid ejection assembly, comprising:
a substrate including a frame formed of a first material and a body formed of a second material, wherein the body substantially surrounds the frame and forms a first side and a second side of the substrate; and
a plurality of fluid ejection devices each mounted on the first side of the substrate.
2. The fluid ejection assembly of claim 1 , wherein the first material includes at least one of metal and ceramic.
3. The fluid ejection assembly of claim 1 , wherein the second material includes plastic.
4. The fluid ejection assembly of claim 1 , wherein the first material includes at least one of metal and ceramic and the second material includes plastic.
5. The fluid ejection assembly of claim 1 , wherein a rigidity of the first material is greater than a rigidity of the second material.
6. The fluid ejection assembly of claim 1 , wherein each of the fluid ejection devices include a device substrate and an orifice layer having a plurality of openings defined therein, wherein the orifice layer is supported by the device substrate, and wherein a coefficient of thermal expansion of the first material of the frame of the substrate substantially matches a coefficient of thermal expansion of the device substrate.
7. The fluid ejection assembly of claim 6 , wherein the device substrate is formed of silicon.
8. The fluid ejection assembly of claim 1 , further comprising:
an electrical circuit disposed on the second side of the substrate, wherein each of the fluid ejection devices are electrically coupled to the electrical circuit.
9. The fluid ejection assembly of claim 8 , wherein the frame of the substrate has at least one opening defined therein, and further comprising:
at least one electrical connector electrically coupled to the electrical circuit and one of the fluid ejection devices, wherein the at least one electrical connector passes through the at least one opening of the frame of the substrate.
10. The fluid ejection assembly of claim 8 , wherein the electrical circuit includes a printed circuit board, and wherein the printed circuit board and the frame and the body of the substrate each have a plurality of fluid passages extending therethrough, at least one of the fluid passages communicating with the first side of the substrate and at least one of the fluid ejection devices.
11. The fluid ejection assembly of claim 1 , wherein the frame and the body of the substrate both have a plurality of fluid passages defined therein, at least one of the fluid passages communicating with the first side of the substrate and at least one of the fluid ejection devices.
12. A method of forming a fluid ejection assembly, the method comprising:
providing a substrate including a frame formed of a first material and a body formed of a second material, including substantially surrounding the frame with the body and forming a first side and a second side of the substrate with the body; and
mounting a plurality of fluid ejection devices on the first side of the substrate.
13. The method of claim 12 , wherein the first material includes at least one of metal and ceramic.
14. The method of claim 12 , wherein the second material includes plastic.
15. The method of claim 12 , wherein the first material includes at least one of metal and ceramic and the second material includes plastic.
16. The method of claim 12 , wherein a rigidity of the first material is greater than a rigidity of the second material.
17. The method of claim 12 , wherein each of the fluid ejection devices include a device substrate and an orifice layer having a plurality of openings defined therein, wherein the orifice layer is supported by the device substrate, and wherein a coefficient of thermal expansion of the first material of the frame of the substrate substantially matches a coefficient of thermal expansion of the device substrate.
18. The method of claim 17 , wherein the device substrate is formed of silicon.
19. The method of claim 12 , further comprising:
disposing an electrical circuit on the second side of the substrate, including electrically coupling the fluid ejection devices with the electrical circuit.
20. The method of claim 19 , wherein the frame of the substrate has at least one opening defined therein, and further comprising:
electrically coupling at least one electrical connector with the electrical circuit and one of the fluid ejection devices, including passing the at least one electrical connector through the at least one opening of the frame of the substrate.
21. The method of claim 19 , wherein the electrical circuit includes a printed circuit board, wherein the printed circuit board and the frame and the body of the substrate each have a plurality of fluid passages extending therethrough, wherein mounting the fluid ejection devices on the substrate includes communicating each of the fluid ejection devices with at least one of the fluid passages.
22. The method of claim 12 , wherein the frame and the body of the substrate both have a plurality of fluid passages defined therein, wherein mounting the fluid ejection devices on the substrate includes communicating each of the fluid ejection devices with at least one of the fluid passages.
23. A substrate adapted to support a plurality of fluid ejection devices, the substrate comprising:
a frame formed of a first material; and
a body formed of a second material, wherein the body substantially surrounds the frame and forms a first side and a second side of the substrate.
24. The substrate of claim 23 , wherein the first material includes at least one of metal and ceramic.
25. The substrate of claim 23 , wherein the second material includes plastic.
26. The substrate of claim 23 , wherein the first material includes at least one of metal and ceramic and the second material includes plastic.
27. The substrate of claim 23 , wherein a rigidity of the first material is greater than a rigidity of the second material.
28. The substrate of claim 23 , wherein each of the fluid ejection devices include a device substrate and an orifice layer having a plurality of openings defined therein, the orifice layer being supported by the device substrate, wherein a coefficient of thermal expansion of the first material of the frame of the substrate substantially matches a coefficient of thermal expansion of the device substrate.
29. The substrate of claim 23 , wherein a coefficient of thermal expansion of the first material substantially matches a coefficient of thermal expansion of silicon.
30. The substrate of claim 23 , wherein the substrate is adapted to support the fluid ejection devices on the first side thereof and an electrical circuit on the second side thereof, wherein the frame of the substrate has at least one opening defined therein, wherein the at least one opening is adapted to accommodate at least one electrical connector electrically coupling one of the fluid ejection devices and the electrical circuit.
31. The substrate of claim 23 , wherein the frame and the body of the substrate both have a plurality of fluid passages defined therein.
32. The substrate of claim 31 , wherein the substrate is adapted to support the fluid ejection devices on the first side thereof, and wherein at least one of the fluid passages is adapted to communicate with the first side of the substrate.
33. A method of forming a substrate adapted to support a plurality of fluid ejection devices, the method comprising:
forming a frame of a first material; and
substantially surrounding the frame with a body formed of a second material, including forming a first side and a second side of the substrate with the body.
34. The method of claim 33 , wherein the first material includes at least one of metal and ceramic.
35. The method of claim 33 , wherein the second material includes plastic.
36. The method of claim 33 , wherein the first material includes at least one of metal and ceramic and the second material includes plastic.
37. The method of claim 33 , wherein a rigidity of the first material is greater than a rigidity of the second material.
38. The method of claim 33 , wherein each of the fluid ejection devices include a device substrate and an orifice layer having a plurality of openings defined therein, the orifice layer being supported by the device substrate, wherein a coefficient of thermal expansion of the first material of the frame of the substrate substantially matches a coefficient of thermal expansion of the device substrate.
39. The method of claim 33 , wherein a coefficient of thermal expansion of the first material substantially matches a coefficient of thermal expansion of silicon.
40. The method of claim 33 , wherein the substrate is adapted to support the fluid ejection devices on the first side thereof and an electrical circuit on the second side thereof, wherein forming the frame includes defining at least one opening therein, wherein the at least one opening is adapted to accommodate at least one electrical connector electrically coupling one of the fluid ejection devices and the electrical circuit.
41. The method of claim 33 , wherein forming the frame and substantially surrounding the frame with the body includes defining a plurality of fluid passages in the frame and the body.
42. The method of claim 41 , wherein the substrate is adapted to support the fluid ejection devices on the first side thereof, wherein defining the fluid passages in the frame and the body includes communicating at least one of the fluid passages with the first side of the substrate.
Priority Applications (1)
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US10/681,547 US6997540B2 (en) | 1998-12-17 | 2003-10-08 | Substrate for fluid ejection devices |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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US09/216,601 US6250738B1 (en) | 1997-10-28 | 1998-12-17 | Inkjet printing apparatus with ink manifold |
US09/216,606 US6322206B1 (en) | 1997-10-28 | 1998-12-17 | Multilayered platform for multiple printhead dies |
US09/648,564 US6464333B1 (en) | 1998-12-17 | 2000-08-25 | Inkjet printhead assembly with hybrid carrier for printhead dies |
US09/648,120 US6341845B1 (en) | 2000-08-25 | 2000-08-25 | Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies |
US10/001,180 US6523940B2 (en) | 2000-08-25 | 2001-11-01 | Carrier for fluid ejection device |
US10/229,453 US6705705B2 (en) | 1998-12-17 | 2002-08-28 | Substrate for fluid ejection devices |
US10/681,547 US6997540B2 (en) | 1998-12-17 | 2003-10-08 | Substrate for fluid ejection devices |
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US10/229,453 Continuation US6705705B2 (en) | 1998-12-17 | 2002-08-28 | Substrate for fluid ejection devices |
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US10/681,547 Expired - Lifetime US6997540B2 (en) | 1998-12-17 | 2003-10-08 | Substrate for fluid ejection devices |
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JP7313884B2 (en) * | 2019-04-22 | 2023-07-25 | キヤノン株式会社 | LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF |
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US20050026019A1 (en) * | 2003-07-28 | 2005-02-03 | Herman Gregory S. | Doped substrate and method of fabrication |
US20110037808A1 (en) * | 2009-08-11 | 2011-02-17 | Ciminelli Mario J | Metalized printhead substrate overmolded with plastic |
US8496317B2 (en) | 2009-08-11 | 2013-07-30 | Eastman Kodak Company | Metalized printhead substrate overmolded with plastic |
WO2015163893A1 (en) * | 2014-04-24 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Overmolded ink delivery device |
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US10377142B2 (en) | 2014-04-24 | 2019-08-13 | Hewlett-Packard Development Company, L.P. | Overmolded ink delivery device |
US10780698B2 (en) | 2016-06-29 | 2020-09-22 | Hewlett-Packard Development Company, L.P. | Inverted TIJ |
Also Published As
Publication number | Publication date |
---|---|
US6997540B2 (en) | 2006-02-14 |
US20030007034A1 (en) | 2003-01-09 |
US6705705B2 (en) | 2004-03-16 |
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