US20040150954A1 - Power module for multi-chip printed circuit boards - Google Patents
Power module for multi-chip printed circuit boards Download PDFInfo
- Publication number
- US20040150954A1 US20040150954A1 US10/355,707 US35570703A US2004150954A1 US 20040150954 A1 US20040150954 A1 US 20040150954A1 US 35570703 A US35570703 A US 35570703A US 2004150954 A1 US2004150954 A1 US 2004150954A1
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- United States
- Prior art keywords
- power module
- circuit board
- printed circuit
- distribution plate
- fields
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
Definitions
- This invention relates generally to power modules for multi-chip printed circuit boards.
- a heat distribution plate having first and second fields of receptacles integrally formed therein.
- the receptacles are populated with first and second fields of thermally-conductive pins capable of moving independently in a direction orthogonal to the plate.
- a power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes.
- a multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips.
- the supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins.
- Z-axis compliance provided by the pin/receptacle assemblies enhances thermal conductivity even when the supplied chips have differing heights relative to the top of the multi-chip printed circuit board. Space on the multi-chip printed circuit board is conserved because the power module is not part of the multi-chip printed circuit board, but rather is mounted on a separate printed circuit board disposed over the top of the multi-chip printed circuit board.
- FIG. 1 is an exploded bottom oblique view of a printed circuit board stack that includes a power module assembly according to a preferred embodiment of the invention.
- FIG. 2 is an exploded top oblique view of the printed circuit board stack of FIG. 1.
- FIG. 3 is a sectional view of the printed circuit board stack of FIG. 1.
- FIGS. 4 and 5 are assembled bottom and top oblique views, respectively, of the printed circuit board stack of FIG. 1.
- FIGS. 1 - 5 illustrate a printed circuit board stack 100 that includes a power module according to a preferred embodiment of the invention.
- Stack 100 also includes cooling apparatus that is claimed in U.S. patent application Ser. No. ______, filed Jan. ______, 2003 , titled “Cooling Apparatus for Stacked Components” (HP Attorney Docket Number 200209132-1).
- Power module assembly 102 includes a heat distribution plate 104 and a power module printed circuit board 106 .
- Heat distribution plate 104 includes fields 108 of receptacles 300 populated with thermally-conductive pins 302 .
- the pins 302 are capable of independent movement in the direction 110 orthogonal to plate 104 .
- Power module printed circuit board 106 includes clearance holes 112 adapted to clear pin fields 108 .
- Board 106 is preferably mounted to the underside of heat distribution plate 104 by means of fasteners such as screws.
- pin fields 108 protrude through clearance holes 112 on the underside of power module printed circuit board 106 so that the pins may make contact with the top surfaces of heat-generating integrated circuit chips 200 mounted on a multi-chip printed circuit board 116 .
- This contact provides thermal management for chips 200 by conducting heat from the chips into heat distribution plate 104 .
- An active or a passive heat sink device 114 may optionally be mounted over plate 104 to enhance the removal of heat therefrom.
- pin fields 108 may be disposed on raised bosses 118 integrally formed on plate 104 .
- the bosses themselves may protrude through clearance holes 112 to shorten the lengths of pins 302 necessary for adequate contact with chips 200 . Because of the forces applied against chips 200 by pins 302 , bowing of multi-chip printed circuit board 116 may occur. If so, it may be desirable to mount a bolster plate 122 to the underside of board 116 to prevent or reduce the bowing.
- a bolster plate 122 may optionally include raised bosses 124 to provide direct support against board 116 under one of more of the chips 200 .
- an insulator may be interposed between bosses 124 and circuit board 116 .
- Bolster plate 122 may be fastened to any suitably rigid member, such as heat distribution plate 104 or an intermediate frame 126 .
- a power connector component 120 may be mounted to the underside of power module printed circuit board 106 .
- a corresponding power connector component 202 may be mounted to the top side of multi-chip printed circuit board 106 .
- power connector components 120 , 202 mate by virtue of their proximity and alignment.
- Such connectors may be used to efficiently transfer power between power module printed circuit board 106 and multi-chip printed circuit board 116 .
- blade-style power connector components were used for this purpose (as illustrated).
- alternative power connectors may be used.
- heat distribution plate 104 and intermediate frame 126 any suitably rigid heat conducting material may be used to make heat distribution plate 104 and intermediate frame 126 , in one embodiment aluminum was used for this purposed because of the combination of its strength, ease of machining, and thermal conductivity.
- Bolster plate 122 may also be made using any suitably rigid material. In an embodiment, bolster plate 122 was made of steel for strength.
- Pin fields 108 may be constructed according to any suitable technique, including for example those disclosed in U.S. patent application Ser. No. 10/074,642, filed Feb. 12, 2002, titled “Thermal Transfer Interface System and Methods,” which by this reference is hereby incorporated entirely as if fully set forth in this application.
- Printed circuit board 116 may include heat-generating components mounted on its top side as well as its bottom side.
- heat-generating components 128 may be mounted on one side of board 116
- heat generating components 204 may be mounted on the other side of board 116 as shown in FIGS. 1 - 3 .
- a cross-member 206 may be integrally formed on frame 126 and disposed over components 204 .
- a thermally-conductive strap 130 is provided having first and second legs 132 , 134 . In an embodiment, strap 130 was made of copper because of the desirable thermal conductivity of that material. In other embodiments, other thermally-conductive materials may be used.
- cross-member 206 is thermally coupled to components 204
- leg 132 of strap 130 is thermally coupled to components 128 .
- the thermal couplings may be achieved by direct contact between the cross-member or strap and the corresponding components, or optionally a compliant thermally-conductive material may be interposed between the strap or cross-member and the corresponding components.
- die-cut wafers 136 of thermally-conductive material were interposed as shown in FIGS. 1 - 3 .
- a material suitable to use for this purpose would be “TPUTTY-502,” manufactured and sold by THERMAGON. Another example would be thermal grease.
- Leg 134 of strap 130 is thermally coupled to one end of frame 126 and to one end of heat distribution plate 104 .
- the latter thermal coupling may also be accomplished by direct contact between strap 130 and the frame and plate, or optionally a compliant thermally-conductive material such as those just mentioned may be interposed between the strap and the frame or plate.
- An active or passive heat sink assembly 114 may optionally be thermally-coupled to heat distribution plate 104 to enhance removal of heat from components 128 , 204 .
- the cooling apparatus just described may be beneficially employed regardless of whether or not heat distribution plate 104 includes pin-fields 108 , and pin fields 108 may be beneficially employed regardless of whether the just-described cooling apparatus is included in the assembly.
- circuit board 106 need not be a power module such as the one described herein above in order for the just-described cooling apparatus to be effectively applied.
- the portion of leg 132 adjacent components 128 is a substantially planar surface extending over the top surface of components 128 as shown.
- Leg 132 may also include one or more walls 138 extending between the planar surface of the leg and an electrically conductive trace on circuit board 116 . If so, then strap 130 functions not only as a heat removal device, but also helps to contain electromagnetic energy radiating from components 128 . (For such an application, strap 130 should not only be thermally conductive but electrically conductive as well. Copper, of course, exhibits both behaviors.)
- Walls 138 may be sectioned or may be formed as one continuous wall.
- wall sections 138 form three sides of a rectangle around components 128 , and the transverse dimension of leg 134 forms a fourth side of the rectangle, thus completing at least a partial electromagnetic enclosure around components 128 .
- a compliant electrically conductive material 142 may optionally be interposed between the edge of wall 138 and circuit board 116 .
- a material suitable for this purpose would be a liquid-dispensed material having part number 5537 manufactured and sold by CHOMERICS.
- legs 132 , 134 of strap 130 may be joined at an elastic elbow 140 . If so, then legs 132 , 134 may be moved slightly relative to one another during assembly of stack 100 .
- An elastic elbow 140 may be created, for example, by manufacturing strap 130 from one unitary piece of metal and causing the juncture between legs 132 , 134 to be thinner than either of the two legs.
- braided metal may be used to provide an elastic elbow junction between legs 132 , 134 .
Abstract
Description
- This invention relates generally to power modules for multi-chip printed circuit boards.
- Many modern integrated circuit chips, such as microprocessors for example, require relatively high supply current delivered at a very tightly controlled voltage. It is common, therefore, to employ a special-purpose module including voltage converters, voltage regulators and the like to supply power to such a chip. And it is known that disposing the power module physically close to the supplied chip helps to reduce negative effects associated with the delivery of power via cables.
- Recently it has become popular to deploy two or more high-power chips on a single multi-chip printed circuit board. Among the problems presented by this approach is how to dispose the power module sufficiently close to the supplied chips while at the same time providing adequate thermal management for the supplied chips and conserving space on the printed circuit board.
- It is an object of the present invention to provide a power module for a multi-chip printed circuit board such that: (1) the power module is disposed physically close to the chips on the printed circuit board, (2) thermal management is provided for the supplied chips, and (3) space is conserved on the printed circuit board.
- In a power module assembly according to a preferred embodiment of the invention, a heat distribution plate is provided having first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins capable of moving independently in a direction orthogonal to the plate. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. In this manner, the supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Z-axis compliance provided by the pin/receptacle assemblies enhances thermal conductivity even when the supplied chips have differing heights relative to the top of the multi-chip printed circuit board. Space on the multi-chip printed circuit board is conserved because the power module is not part of the multi-chip printed circuit board, but rather is mounted on a separate printed circuit board disposed over the top of the multi-chip printed circuit board.
- FIG. 1 is an exploded bottom oblique view of a printed circuit board stack that includes a power module assembly according to a preferred embodiment of the invention.
- FIG. 2 is an exploded top oblique view of the printed circuit board stack of FIG. 1.
- FIG. 3 is a sectional view of the printed circuit board stack of FIG. 1.
- FIGS. 4 and 5 are assembled bottom and top oblique views, respectively, of the printed circuit board stack of FIG. 1.
- FIGS.1-5 illustrate a printed
circuit board stack 100 that includes a power module according to a preferred embodiment of the invention. Stack 100 also includes cooling apparatus that is claimed in U.S. patent application Ser. No. ______, filed Jan. ______, 2003, titled “Cooling Apparatus for Stacked Components” (HP Attorney Docket Number 200209132-1). - Power Module.
Power module assembly 102 includes aheat distribution plate 104 and a power module printedcircuit board 106.Heat distribution plate 104 includesfields 108 ofreceptacles 300 populated with thermally-conductive pins 302. Thepins 302 are capable of independent movement in thedirection 110 orthogonal toplate 104. Power module printedcircuit board 106 includesclearance holes 112 adapted toclear pin fields 108.Board 106 is preferably mounted to the underside ofheat distribution plate 104 by means of fasteners such as screws. When this is done,pin fields 108 protrude throughclearance holes 112 on the underside of power module printedcircuit board 106 so that the pins may make contact with the top surfaces of heat-generating integratedcircuit chips 200 mounted on a multi-chip printedcircuit board 116. This contact provides thermal management forchips 200 by conducting heat from the chips intoheat distribution plate 104. An active or a passiveheat sink device 114 may optionally be mounted overplate 104 to enhance the removal of heat therefrom. - One or more of
pin fields 108 may be disposed on raisedbosses 118 integrally formed onplate 104. In such an embodiment, the bosses themselves may protrude throughclearance holes 112 to shorten the lengths ofpins 302 necessary for adequate contact withchips 200. Because of the forces applied againstchips 200 bypins 302, bowing of multi-chip printedcircuit board 116 may occur. If so, it may be desirable to mount abolster plate 122 to the underside ofboard 116 to prevent or reduce the bowing. Such abolster plate 122 may optionally include raisedbosses 124 to provide direct support againstboard 116 under one of more of thechips 200. Optionally, an insulator may be interposed betweenbosses 124 andcircuit board 116.Bolster plate 122 may be fastened to any suitably rigid member, such asheat distribution plate 104 or anintermediate frame 126. - A
power connector component 120 may be mounted to the underside of power module printedcircuit board 106. And a correspondingpower connector component 202 may be mounted to the top side of multi-chip printedcircuit board 106. When printedcircuit board stack 100 is assembled,power connector components circuit board 106 and multi-chip printedcircuit board 116. In one embodiment, blade-style power connector components were used for this purpose (as illustrated). In other embodiments, alternative power connectors may be used. Whenpower connector components - Although any suitably rigid heat conducting material may be used to make
heat distribution plate 104 andintermediate frame 126, in one embodiment aluminum was used for this purposed because of the combination of its strength, ease of machining, and thermal conductivity.Bolster plate 122 may also be made using any suitably rigid material. In an embodiment,bolster plate 122 was made of steel for strength.Pin fields 108 may be constructed according to any suitable technique, including for example those disclosed in U.S. patent application Ser. No. 10/074,642, filed Feb. 12, 2002, titled “Thermal Transfer Interface System and Methods,” which by this reference is hereby incorporated entirely as if fully set forth in this application. - Cooling Apparatus. Printed
circuit board 116 may include heat-generating components mounted on its top side as well as its bottom side. For example, heat-generating components 128 may be mounted on one side ofboard 116, andheat generating components 204 may be mounted on the other side ofboard 116 as shown in FIGS. 1-3. Across-member 206 may be integrally formed onframe 126 and disposed overcomponents 204. A thermally-conductive strap 130 is provided having first andsecond legs strap 130 was made of copper because of the desirable thermal conductivity of that material. In other embodiments, other thermally-conductive materials may be used. - When
circuit boards cross-member 206 is thermally coupled tocomponents 204, andleg 132 ofstrap 130 is thermally coupled tocomponents 128. The thermal couplings may be achieved by direct contact between the cross-member or strap and the corresponding components, or optionally a compliant thermally-conductive material may be interposed between the strap or cross-member and the corresponding components. For example, in one embodiment, die-cut wafers 136 of thermally-conductive material were interposed as shown in FIGS. 1-3. One example of a material suitable to use for this purpose would be “TPUTTY-502,” manufactured and sold by THERMAGON. Another example would be thermal grease.Leg 134 ofstrap 130 is thermally coupled to one end offrame 126 and to one end ofheat distribution plate 104. The latter thermal coupling may also be accomplished by direct contact betweenstrap 130 and the frame and plate, or optionally a compliant thermally-conductive material such as those just mentioned may be interposed between the strap and the frame or plate. - An active or passive
heat sink assembly 114 may optionally be thermally-coupled to heatdistribution plate 104 to enhance removal of heat fromcomponents distribution plate 104 includes pin-fields 108, and pinfields 108 may be beneficially employed regardless of whether the just-described cooling apparatus is included in the assembly. Similarly,circuit board 106 need not be a power module such as the one described herein above in order for the just-described cooling apparatus to be effectively applied. - Preferably, the portion of
leg 132adjacent components 128 is a substantially planar surface extending over the top surface ofcomponents 128 as shown.Leg 132 may also include one ormore walls 138 extending between the planar surface of the leg and an electrically conductive trace oncircuit board 116. If so, then strap 130 functions not only as a heat removal device, but also helps to contain electromagnetic energy radiating fromcomponents 128. (For such an application,strap 130 should not only be thermally conductive but electrically conductive as well. Copper, of course, exhibits both behaviors.)Walls 138 may be sectioned or may be formed as one continuous wall. In the arrangement shown,wall sections 138 form three sides of a rectangle aroundcomponents 128, and the transverse dimension ofleg 134 forms a fourth side of the rectangle, thus completing at least a partial electromagnetic enclosure aroundcomponents 128. To further enhance electrical contact betweenwalls 138 andcircuit board 116, a compliant electricallyconductive material 142 may optionally be interposed between the edge ofwall 138 andcircuit board 116. One example of a material suitable for this purpose would be a liquid-dispensed material having part number 5537 manufactured and sold by CHOMERICS. - In any printed circuit board stack such as
stack 100, mechanical tolerances are additive. To accommodate such a tolerance build-up,legs strap 130 may be joined at anelastic elbow 140. If so, thenlegs stack 100. Anelastic elbow 140 may be created, for example, by manufacturingstrap 130 from one unitary piece of metal and causing the juncture betweenlegs legs legs strap 130 to frame 126 andplate 104. The over-sized holes help to accommodate varying tolerances instack 100. - While the invention has been described in detail in relation to a preferred embodiment thereof, the described embodiment has been presented by way of example and not by way of limitation. It will be understood by those skilled in the art that various changes may be made in the form and details of the described embodiment without deviating from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
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US10/355,707 US6771507B1 (en) | 2003-01-31 | 2003-01-31 | Power module for multi-chip printed circuit boards |
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US10/355,707 US6771507B1 (en) | 2003-01-31 | 2003-01-31 | Power module for multi-chip printed circuit boards |
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US20040150954A1 true US20040150954A1 (en) | 2004-08-05 |
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US20070041220A1 (en) * | 2005-05-13 | 2007-02-22 | Manuel Lynch | LED-based luminaire |
US7918591B2 (en) * | 2005-05-13 | 2011-04-05 | Permlight Products, Inc. | LED-based luminaire |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
US8926145B2 (en) | 2008-12-05 | 2015-01-06 | Permlight Products, Inc. | LED-based light engine having thermally insulated zones |
US20110205710A1 (en) * | 2010-02-24 | 2011-08-25 | Naoto Kondo | Electronic device |
US20130077250A1 (en) * | 2011-09-28 | 2013-03-28 | Texas Instruments Incorporated | DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink |
US8760872B2 (en) * | 2011-09-28 | 2014-06-24 | Texas Instruments Incorporated | DC-DC converter vertically integrated with load inductor structured as heat sink |
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