US20050156613A1 - Probe card - Google Patents
Probe card Download PDFInfo
- Publication number
- US20050156613A1 US20050156613A1 US11/031,152 US3115205A US2005156613A1 US 20050156613 A1 US20050156613 A1 US 20050156613A1 US 3115205 A US3115205 A US 3115205A US 2005156613 A1 US2005156613 A1 US 2005156613A1
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- US
- United States
- Prior art keywords
- probe card
- contactor
- printed wiring
- wiring board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Definitions
- the present invention relates to a probe card used to test the electrical characteristics of an object to be tested such as a semiconductor element (to be described as a “device” hereinafter) formed on a wafer. More particularly, the present invention relates to a probe card capable of performing highly reliable testing even after it has become thermally deformed.
- a probe card is used in, e.g., a prober shown in FIG. 4 .
- the prober has a loader chamber 1 and a prober chamber 2 .
- a wafer W is transported from the loader chamber 1 .
- the electrical characteristics of a device or the like formed on the wafer W transported from the loader chamber 1 are tested.
- the wafer W is prealigned in the loader chamber 1 , and transported into the prober chamber 2 .
- the prober chamber 2 can include a main table 3 , X-Y table 4 , probe card 5 , and alignment mechanism 6 .
- the prealigned wafer W is placed on the main table 3 .
- the main table 3 can adjust the temperature of the wafer W.
- the X-Y table 4 moves the main table 3 in the X and Y directions.
- the probe card 5 is arranged above the main table 3 .
- the alignment mechanism 6 accurately aligns a plurality of probes 5 A of the probe card 5 and the plurality of electrodes of the wafer W on the main table 3 . As shown in, e.g., FIG.
- the probe card 5 can have the plurality of probes 5 A, a printed wiring board 5 B, reinforcing member 5 D, and connecting members 5 C.
- the probes 5 A are connected to the printed wiring board 5 B.
- the reinforcing member 5 D is made of a metal such as stainless steel.
- the connecting members 5 C connect the printed wiring board 5 B and reinforcing member 5 D to each other.
- the main table 3 incorporates an elevating mechanism. The elevating mechanism vertically moves the wafer W, to bring the probes 5 A and electrodes on the wafer W into electrical contact with each other and electrically disconnect them from each other.
- a test head T connected to a tester is turnably disposed on a head plate 7 of the prober chamber 2 .
- the test head T and probe card 5 are electrically connected to each other through a performance board (not shown).
- the wafer W placed on the main table 3 can be heated or cooled within a temperature range of, e.g., ⁇ 20° C. to +150° C.
- a test signal from the tester is transmitted to the probes 5 A through the test head T and performance board.
- the test signal is applied to the electrodes of the wafer W from the probes 5 A, and is utilized to test the electrical characteristics of a plurality of devices formed on the wafer W.
- a temperature adjusting mechanism in the main table 3 heats or cools the wafer to a predetermined temperature.
- the object to be tested When the electrical characteristics of the object to be tested are to be tested, the object to be tested generates heat. Due to this heat, the printed wiring board 5 B of the probe card 5 is thermally deformed. During high-temperature testing, the main table 3 is heated. Due to heat generated by the object to be tested or heating of the main table 3 , the printed wiring board 5 B is thermally deformed.
- the reinforcing member 5 D reinforces the printed wiring board 5 B to suppress thermal deformation of the probe card 5 .
- Jpn. Pat. Applin. KOKAI Publication No. 2000-67953 proposes a technique for bringing the distal ends of probes into contact with the electrodes of a device without changing the position of a probe card.
- the metal reinforcing member 5 D prevents thermal deformation of the printed wiring board 5 B.
- the reinforcing member 5 D cannot suppress stress generated by thermal deformation completely.
- the probe card 5 warps downward as a result of thermal deformation and is bent. Consequently, the positions of the distal ends of the probes 5 A are shifted to make the connection between the probes 5 A and the object to be tested defective.
- the probe card 5 is preheated. Preheating, however, requires a long time, and decreases throughput.
- a probe card that can decrease adverse effects of heat to electrically connect a contactor and an object to be tested more reliably.
- a probe card that shortens the preheat time to accordingly increase the throughput.
- a probe card which tests the electrical characteristics of an object to be tested.
- the probe card comprises:
- the probe card preferably comprises any one of the following (a) to (i) and, furthermore, some of the following (a) to (i) in combination.
- the intermediate member has a board and a plurality of elastically deformable contacts arranged at least on a circuit board side of the board.
- the connecting member integrates the contactor, circuit board, and reinforcing member.
- the intermediate member is attached to the elastic member arranged between the contactor and circuit board.
- the intermediate member is made of conductive rubber.
- the contactor has a ceramic board and a plurality of probes formed on an object-to-be-tested side of the ceramic board.
- FIGS. 1A to 1 C are views schematically showing a probe card according to an embodiment of the present invention, in which FIG. 1A is a sectional view of the same, FIG. 1B is an enlarged sectional view of an intermediate member, and FIG. 1C is a plan view of a reinforcing member;
- FIG. 2 is a view showing how the probe card shown in FIG. 1A is thermally deformed
- FIG. 3 is a view showing a probe card according to another embodiment of the present invention.
- FIG. 4 is a partially cutaway front view of an example of a prober.
- FIGS. 5A and 5B are views showing a conventional probe card, in which FIG. 5A is a side view showing a probe card at room temperature, and FIG. 5B is a side view showing the probe card that has been thermally deformed.
- a probe card 10 according to the first embodiment shown in FIGS. 1A to 1 C can have a contactor 11 , intermediate member 15 , circuit board 12 , connecting member 13 , and reinforcing member 14 .
- the intermediate member 15 can also be referred to as an “interposer”.
- the circuit board (to be also referred to as a “printed wiring board” hereinafter) 12 is electrically connected to the contactor 11 .
- the connecting member 13 connects the contactor 11 and printed wiring board 12 to integrate them.
- the reinforcing member 14 reinforces the printed wiring board 12 integrated by the connecting member 13 .
- the contactor 11 can have a ceramic board 11 A, a plurality of probes 11 B, terminal electrodes 11 C, and connecting wirings 11 D.
- the ceramic board 11 A is made of, e.g., a ceramic material.
- the probes 11 B are formed on the lower surface of the ceramic board 11 A.
- the terminal electrodes 11 C are formed on the upper surface of the ceramic board 11 A.
- the connecting wirings 11 D are formed in the ceramic board 11 A to connect the terminal electrodes 11 C and probes 11 B to each other.
- the plurality of probes 11 B are arranged such that their distal ends correspond to the layout of a plurality of electrodes (not shown) of at least one object to be tested (e.g., at least one device formed on the wafer).
- the contactor 11 can be formed by a microprocessing technique such as a micromachine technique.
- the plurality of terminal electrodes 11 C on the ceramic board 11 A can be electrically connected to a plurality of terminal electrodes 12 A on the printed wiring board 12 through the interposer 15 .
- the reinforcing member 14 can be formed of a metal having a low coefficient of linear expansion (e.g., a low-expansion alloy such as Invar), so that it will not expand much when it is heated during testing.
- the coefficient of linear expansion of Invar is approximately 2 ppm/° C. to 4 ppm/° C., which is much lower than that of a printed wiring board 12 made of a resin.
- FIG. 1C shows an example of the planar shape of the reinforcing member 14 .
- the reinforcing member 14 can include, e.g., a ring 14 a , disk 14 b , and connectors 14 c .
- the ring 14 a is formed along the peripheral edge of the printed wiring board 12 .
- the disk 14 b is formed at the center of the ring 14 a .
- the connectors 14 c connect the ring 14 a and disk 14 b to each other.
- As the printed wiring board 12 a conventional resin printed wiring board can be used
- the interposer 15 can be provided between the contactor 11 and printed wiring board 12 to bring them into contact with each other flexibly and electrically.
- the interposer 15 absorbs thermal deformation of the printed wiring board 12 , as will be described later.
- the interposer 15 shortens the preheat time of the probe card 10 .
- the interposer 15 has a board 15 A, a plurality of elastically deformable contacts 15 B, a plurality of elastically deformable contacts 15 C, and via hole conductors 15 D.
- the board 15 A is made of a ceramic material.
- the contacts 15 B are formed on the upper surface of the board 15 A.
- the contacts 15 C are formed on the lower surface of the board 15 A.
- the via hole conductors 15 D electrically connect the contacts 15 B and 15 C to each other.
- the plurality of contacts 15 B are arranged such that their distal ends correspond to the respective positions of the plurality of terminal electrodes 12 A of the printed wiring board 12 .
- the plurality of contacts 15 C formed on the lower surface of the board 15 A are arranged such that their distal ends correspond to the positions of the terminal electrodes 11 C.
- the interposer 15 is fixed to the connecting member 13 through an elastic member 17 (to be described later).
- the plurality of contacts 15 B on the upper surface of the board 15 A are arranged obliquely upward from the via hole conductors 15 D. Terminals 15 E at the distal ends of the respective contacts 15 B come into electrical contact with the corresponding terminal electrodes 12 A of the printed wiring board 12 .
- the plurality of contacts 15 C formed on the lower surface of the board 15 A are arranged obliquely downward from the via hole conductors 15 D. Terminals 15 E′ at the distal ends of the respective contacts 15 C come into electrical contact with the terminal electrodes 11 C on the upper surface of the ceramic board 11 A.
- the contacts 15 B and 15 C can be made of an elastic metal (e.g., tungsten) to be elastically deformable.
- the contacts 15 B and 15 C electrically connect the contactor 11 and printed wiring board 12 to each other, and absorb thermal deformation of the printed wiring board 12 .
- the upper and lower contacts 15 B and 15 C reliably come into contact with the terminal electrodes 12 A and 11 C when the probe card 10 is thermally stable (state during testing).
- the terminal electrodes 12 A of the printed wiring board 12 and the terminal electrodes 11 C of the contactor 11 can be formed with such sizes that they can reliably come into contact with the terminals 15 E and 15 E′ of the contacts 15 B and 15 C of the interposer 15 even when the printed wiring board 12 has been thermally deformed to the maximum extant possible.
- An elastic member 16 and the elastic member 17 made of rubber or the like can be mounted on and under the printed wiring board 12 .
- the elastic member 16 can be arranged between the printed wiring board 12 and reinforcing member 14 .
- the elastic member 17 can be arranged between the contactor 11 and printed wiring board 12 .
- the elastic members 16 and 17 absorb thermal deformation of the printed wiring board 12 and stabilize the positions of the distal ends of the probes 11 B.
- a main chuck is preheated prior to the testing, to thermally stabilize the probe card 10 or the like.
- a temperature adjusting mechanism incorporated in the main chuck (not shown) heats the main chuck to a predetermined temperature. During or after the heating, the main chuck is moved close to the probe card 10 to preheat it.
- the printed wiring board 12 having a higher coefficient of linear expansion than other members thermally expands much more than the other members. During the thermal expansion, the printed wiring board 12 is bound from around by the connecting member 13 .
- heat stress of the printed wiring board 12 has no means of escape.
- the printed wiring board 12 expands, it gradually bends downward, as shown in FIG. 2 .
- the coefficients of linear expansion of the contactor 11 and reinforcing member 14 are much lower than that of the printed wiring board 12 .
- the contactor 11 and reinforcing member 14 are thermally deformed only slightly and thus maintain their flatness.
- the probe card 10 As described above, of the probe card 10 , only the printed wiring board 12 bends downward.
- the upper contacts 15 B of the interposer 15 absorb the bending of the printed wiring board 12 .
- the elastic members 16 and 17 absorb the thermal deformation of the printed wiring board 12 .
- the thermal stress applied by the printed wiring board 12 to the contactor 11 decreases, and the flatness of the contactor 11 is maintained.
- the printed wiring board 12 is thermally deformed, and the upper contacts 15 B of the interposer 15 are pushed downward.
- the contacts 15 B are located within the surfaces of the terminal electrodes 12 A of the printed wiring board 12 , and the electrical contact of the contactor 11 and printed wiring board 12 can be maintained.
- the contactor 11 , printed wiring board 12 , interposer 15 , connecting member 13 , and reinforcing member 14 are provided.
- the interposer 15 is provided between the contactor 11 and printed wiring board 12 to bring them into contact with each other flexibly and electrically.
- the connecting member 13 integrates the contactor 11 , printed wiring board 12 , and interposer 15 .
- the reinforcing member 14 reinforces the printed wiring board 12 integrated through the connecting member 13 .
- the printed wiring board 12 is thermally deformed to bend downward, thus applying a stress to the contactor 11 .
- the elasticity of the interposer 15 can decrease the stress, and prevent the probes 11 B of the contactor 11 from shifting from the corresponding electrode pads of the object to be tested.
- the probe card 10 is preheated to a test temperature, and the printed wiring board 12 is gradually thermally deformed.
- the interposer 15 brings the contactor 11 and printed wiring board 12 into electrical contact with each other reliably.
- the necessity of preheating the printed wiring board 12 until it stabilizes thermally is low. Consequently, the preheat time can be shortened in comparison with a conventional case, and the throughput can be increased.
- the interposer 15 has the elastically deformable contacts 15 B and 15 C
- the thermal deformation of the printed wiring board 12 can be absorbed by the contacts 15 B and 15 C.
- a probe card 10 of the second embodiment can have, as an intermediate member, a plurality of elastically deformable contacts 11 E arranged on the upper surface of a contactor 11 , as shown in, e.g., FIG. 3 , in place of the intermediate member 15 shown in FIGS. 1 and 2 .
- the contacts 11 E can be formed in the same manner as the contacts 15 C of the interposer 15 shown in FIG. 1B . As shown in FIG. 3 , the contacts 11 E can be directly fixed to terminal electrodes 11 C formed on the. upper surface of a ceramic board 11 A of the contactor 11 . The contactor 11 comes into electrical contact with terminal electrodes 12 A of a printed wiring board 12 through the plurality of contacts 11 E.
- the thermal deformation can be absorbed by the contacts 11 E of the contactor 11 .
- This embodiment can provide the same operation and effect as those of the first embodiment.
- the structure of the probe card 10 can be simplified more than in the case of the first embodiment.
- the present invention can be suitably utilized as a probe card for, e.g., a testing apparatus.
- a probe card that can decrease the adverse effect of heat and reliably bring the contactor and object to be tested into electrical contact with each other.
- a probe card that can shorten the preheat time and improve the throughput.
- a probe card having, between a circuit board and contactor that form the probe card, an intermediate member which can absorb thermal deformation of the circuit board is incorporated in the present invention.
- the same operation and effect as those of the above embodiments can be expected.
- the shape and material of the contacts are not particularly limited provided the contacts are elastically deformable and conductive.
Abstract
A probe card of this invention includes a contactor, printed wiring board, interposer, connecting member, and reinforcing member. The interposer is arranged between the contactor and printed wiring board to bring the contactor and printed wiring board into contact with each other flexibly and electrically. The connecting member integrates the contactor, printed wiring board, and interposer. The reinforcing member reinforces the printed wiring board integrated through the connecting member.
Description
- This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2004-012077, filed Jan. 20, 2004, the entire contents of which are incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to a probe card used to test the electrical characteristics of an object to be tested such as a semiconductor element (to be described as a “device” hereinafter) formed on a wafer. More particularly, the present invention relates to a probe card capable of performing highly reliable testing even after it has become thermally deformed.
- 2. Description of the Related Art
- A probe card is used in, e.g., a prober shown in
FIG. 4 . As shown inFIG. 4 , the prober has a loader chamber 1 and a prober chamber 2. A wafer W is transported from the loader chamber 1. In the prober chamber 2, the electrical characteristics of a device or the like formed on the wafer W transported from the loader chamber 1 are tested. The wafer W is prealigned in the loader chamber 1, and transported into the prober chamber 2. - As shown in
FIG. 4 , the prober chamber 2 can include a main table 3, X-Y table 4,probe card 5, andalignment mechanism 6. The prealigned wafer W is placed on the main table 3. The main table 3 can adjust the temperature of the wafer W. The X-Y table 4 moves the main table 3 in the X and Y directions. Theprobe card 5 is arranged above the main table 3. Thealignment mechanism 6 accurately aligns a plurality ofprobes 5A of theprobe card 5 and the plurality of electrodes of the wafer W on the main table 3. As shown in, e.g.,FIG. 5A , theprobe card 5 can have the plurality ofprobes 5A, a printedwiring board 5B, reinforcingmember 5D, and connectingmembers 5C. Theprobes 5A are connected to the printedwiring board 5B. The reinforcingmember 5D is made of a metal such as stainless steel. The connectingmembers 5C connect the printedwiring board 5B and reinforcingmember 5D to each other. The main table 3 incorporates an elevating mechanism. The elevating mechanism vertically moves the wafer W, to bring theprobes 5A and electrodes on the wafer W into electrical contact with each other and electrically disconnect them from each other. - As shown in
FIG. 4 , a test head T connected to a tester is turnably disposed on ahead plate 7 of the prober chamber 2. The test head T andprobe card 5 are electrically connected to each other through a performance board (not shown). - The wafer W placed on the main table 3 can be heated or cooled within a temperature range of, e.g., −20° C. to +150° C. A test signal from the tester is transmitted to the
probes 5A through the test head T and performance board. The test signal is applied to the electrodes of the wafer W from theprobes 5A, and is utilized to test the electrical characteristics of a plurality of devices formed on the wafer W. - When testing the electrical characteristics of an object to be tested at a high temperature, a temperature adjusting mechanism (heating mechanism) in the main table 3 heats or cools the wafer to a predetermined temperature.
- When the electrical characteristics of the object to be tested are to be tested, the object to be tested generates heat. Due to this heat, the printed
wiring board 5B of theprobe card 5 is thermally deformed. During high-temperature testing, the main table 3 is heated. Due to heat generated by the object to be tested or heating of the main table 3, the printedwiring board 5B is thermally deformed. - The reinforcing
member 5D reinforces the printedwiring board 5B to suppress thermal deformation of theprobe card 5. Jpn. Pat. Applin. KOKAI Publication No. 2000-67953 proposes a technique for bringing the distal ends of probes into contact with the electrodes of a device without changing the position of a probe card. - In the conventional probe card, the
metal reinforcing member 5D prevents thermal deformation of the printedwiring board 5B. However, the reinforcingmember 5D cannot suppress stress generated by thermal deformation completely. As is shown inFIG. 5B exaggeratedly, theprobe card 5 warps downward as a result of thermal deformation and is bent. Consequently, the positions of the distal ends of theprobes 5A are shifted to make the connection between theprobes 5A and the object to be tested defective. - To thermally stabilize the
probe card 5 before testing, theprobe card 5 is preheated. Preheating, however, requires a long time, and decreases throughput. - According to one aspect of the present invention, there is provided a probe card that can decrease adverse effects of heat to electrically connect a contactor and an object to be tested more reliably. According to another aspect of the present invention, there is also provided a probe card that shortens the preheat time to accordingly increase the throughput.
- According to the first aspect of the present invention, there is provided a probe card which tests the electrical characteristics of an object to be tested. The probe card comprises:
- a contactor;
- a circuit board;
- an intermediate member which is arranged between the contactor and circuit board and comes into contact with the contactor and circuit board flexibly and electrically; and
- a connecting member which integrates the contactor and circuit board.
- The probe card preferably comprises any one of the following (a) to (i) and, furthermore, some of the following (a) to (i) in combination.
- (a) the intermediate member has a board and a plurality of elastically deformable contacts arranged at least on a circuit board side of the board.
- (b) a reinforcing member which reinforces the circuit board.
- (c) the connecting member integrates the contactor, circuit board, and reinforcing member.
- (d) an elastic member arranged at least either between the contactor and circuit board or between the circuit board and reinforcing member.
- (e) the intermediate member is attached to the elastic member arranged between the contactor and circuit board.
- (f) the intermediate member is made of conductive rubber.
- (g) the contactor has a ceramic board and a plurality of probes formed on an object-to-be-tested side of the ceramic board.
- (h) as the intermediate member, a plurality of elastically deformable contacts which are provided on the contactor and come into electrical contact with the circuit board.
- (i) a reinforcing member which reinforces the circuit board.
- The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.
-
FIGS. 1A to 1C are views schematically showing a probe card according to an embodiment of the present invention, in whichFIG. 1A is a sectional view of the same,FIG. 1B is an enlarged sectional view of an intermediate member, andFIG. 1C is a plan view of a reinforcing member; -
FIG. 2 is a view showing how the probe card shown inFIG. 1A is thermally deformed; -
FIG. 3 is a view showing a probe card according to another embodiment of the present invention; -
FIG. 4 is a partially cutaway front view of an example of a prober; and -
FIGS. 5A and 5B are views showing a conventional probe card, in whichFIG. 5A is a side view showing a probe card at room temperature, andFIG. 5B is a side view showing the probe card that has been thermally deformed. - The present invention will be described based on the embodiments shown in
FIGS. 1A to 3. In the respective embodiments, the same or identical portions are denoted by the same reference numerals. - First Embodiment
- A
probe card 10 according to the first embodiment shown inFIGS. 1A to 1C can have acontactor 11,intermediate member 15,circuit board 12, connectingmember 13, and reinforcingmember 14. Theintermediate member 15 can also be referred to as an “interposer”. The circuit board (to be also referred to as a “printed wiring board” hereinafter) 12 is electrically connected to thecontactor 11. The connectingmember 13 connects thecontactor 11 and printedwiring board 12 to integrate them. The reinforcingmember 14 reinforces the printedwiring board 12 integrated by the connectingmember 13. - As shown in
FIGS. 1A and 1B , thecontactor 11 can have aceramic board 11A, a plurality ofprobes 11B,terminal electrodes 11C, and connectingwirings 11D. Theceramic board 11A is made of, e.g., a ceramic material. Theprobes 11B are formed on the lower surface of theceramic board 11A. Theterminal electrodes 11C are formed on the upper surface of theceramic board 11A. The connectingwirings 11D are formed in theceramic board 11A to connect theterminal electrodes 11C and probes 11B to each other. The plurality ofprobes 11B are arranged such that their distal ends correspond to the layout of a plurality of electrodes (not shown) of at least one object to be tested (e.g., at least one device formed on the wafer). - The
contactor 11 can be formed by a microprocessing technique such as a micromachine technique. The plurality ofterminal electrodes 11C on theceramic board 11A can be electrically connected to a plurality ofterminal electrodes 12A on the printedwiring board 12 through theinterposer 15. - The reinforcing
member 14 can be formed of a metal having a low coefficient of linear expansion (e.g., a low-expansion alloy such as Invar), so that it will not expand much when it is heated during testing. The coefficient of linear expansion of Invar is approximately 2 ppm/° C. to 4 ppm/° C., which is much lower than that of a printedwiring board 12 made of a resin.FIG. 1C shows an example of the planar shape of the reinforcingmember 14. The reinforcingmember 14 can include, e.g., aring 14 a,disk 14 b, andconnectors 14 c. Thering 14 a is formed along the peripheral edge of the printedwiring board 12. Thedisk 14 b is formed at the center of thering 14 a. Theconnectors 14 c connect thering 14 a anddisk 14 b to each other. As the printedwiring board 12, a conventional resin printed wiring board can be used. - The
interposer 15 can be provided between the contactor 11 and printedwiring board 12 to bring them into contact with each other flexibly and electrically. Theinterposer 15 absorbs thermal deformation of the printedwiring board 12, as will be described later. Theinterposer 15 shortens the preheat time of theprobe card 10. - As shown in
FIGS. 1A and 1B , theinterposer 15 has aboard 15A, a plurality of elasticallydeformable contacts 15B, a plurality of elasticallydeformable contacts 15C, and viahole conductors 15D. Theboard 15A is made of a ceramic material. Thecontacts 15B are formed on the upper surface of theboard 15A. Thecontacts 15C are formed on the lower surface of theboard 15A. The viahole conductors 15D electrically connect thecontacts contacts 15B are arranged such that their distal ends correspond to the respective positions of the plurality ofterminal electrodes 12A of the printedwiring board 12. The plurality ofcontacts 15C formed on the lower surface of theboard 15A are arranged such that their distal ends correspond to the positions of theterminal electrodes 11C. Theinterposer 15 is fixed to the connectingmember 13 through an elastic member 17 (to be described later). - The plurality of
contacts 15B on the upper surface of theboard 15A are arranged obliquely upward from the viahole conductors 15D.Terminals 15E at the distal ends of therespective contacts 15B come into electrical contact with the correspondingterminal electrodes 12A of the printedwiring board 12. The plurality ofcontacts 15C formed on the lower surface of theboard 15A are arranged obliquely downward from the viahole conductors 15D.Terminals 15E′ at the distal ends of therespective contacts 15C come into electrical contact with theterminal electrodes 11C on the upper surface of theceramic board 11A. Thecontacts contacts contactor 11 and printedwiring board 12 to each other, and absorb thermal deformation of the printedwiring board 12. - The upper and
lower contacts terminal electrodes probe card 10 is thermally stable (state during testing). In other words, theterminal electrodes 12A of the printedwiring board 12 and theterminal electrodes 11C of thecontactor 11 can be formed with such sizes that they can reliably come into contact with theterminals contacts interposer 15 even when the printedwiring board 12 has been thermally deformed to the maximum extant possible. - An
elastic member 16 and theelastic member 17 made of rubber or the like can be mounted on and under the printedwiring board 12. Theelastic member 16 can be arranged between the printedwiring board 12 and reinforcingmember 14. Theelastic member 17 can be arranged between the contactor 11 and printedwiring board 12. Theelastic members wiring board 12 and stabilize the positions of the distal ends of theprobes 11B. - The operation of the
probe card 10 will be described with reference toFIG. 2 . When performing high-temperature testing of an object to be tested by using theprobe card 10, a main chuck is preheated prior to the testing, to thermally stabilize theprobe card 10 or the like. A temperature adjusting mechanism incorporated in the main chuck (not shown) heats the main chuck to a predetermined temperature. During or after the heating, the main chuck is moved close to theprobe card 10 to preheat it. When the temperature of theprobe card 10 increases by preheating, of theprobe card 10, the printedwiring board 12 having a higher coefficient of linear expansion than other members thermally expands much more than the other members. During the thermal expansion, the printedwiring board 12 is bound from around by the connectingmember 13. Thus, heat stress of the printedwiring board 12 has no means of escape. As the printedwiring board 12 expands, it gradually bends downward, as shown inFIG. 2 . The coefficients of linear expansion of thecontactor 11 and reinforcingmember 14 are much lower than that of the printedwiring board 12. Thus, thecontactor 11 and reinforcingmember 14 are thermally deformed only slightly and thus maintain their flatness. - As described above, of the
probe card 10, only the printedwiring board 12 bends downward. Theupper contacts 15B of theinterposer 15 absorb the bending of the printedwiring board 12. Theelastic members wiring board 12. Hence, the thermal stress applied by the printedwiring board 12 to thecontactor 11 decreases, and the flatness of thecontactor 11 is maintained. The printedwiring board 12 is thermally deformed, and theupper contacts 15B of theinterposer 15 are pushed downward. However, thecontacts 15B are located within the surfaces of theterminal electrodes 12A of the printedwiring board 12, and the electrical contact of thecontactor 11 and printedwiring board 12 can be maintained. - As described above, according to this embodiment, the
contactor 11, printedwiring board 12,interposer 15, connectingmember 13, and reinforcingmember 14 are provided. Theinterposer 15 is provided between the contactor 11 and printedwiring board 12 to bring them into contact with each other flexibly and electrically. The connectingmember 13 integrates thecontactor 11, printedwiring board 12, andinterposer 15. The reinforcingmember 14 reinforces the printedwiring board 12 integrated through the connectingmember 13. Thus, according to this embodiment, the printedwiring board 12 is thermally deformed to bend downward, thus applying a stress to thecontactor 11. The elasticity of theinterposer 15, however, can decrease the stress, and prevent theprobes 11B of the contactor 11 from shifting from the corresponding electrode pads of the object to be tested. Theprobe card 10 is preheated to a test temperature, and the printedwiring board 12 is gradually thermally deformed. Theinterposer 15 brings thecontactor 11 and printedwiring board 12 into electrical contact with each other reliably. Thus, the necessity of preheating the printedwiring board 12 until it stabilizes thermally is low. Consequently, the preheat time can be shortened in comparison with a conventional case, and the throughput can be increased. - According to this embodiment, as the
interposer 15 has the elasticallydeformable contacts wiring board 12 can be absorbed by thecontacts - Second Embodiment
- A
probe card 10 of the second embodiment can have, as an intermediate member, a plurality of elasticallydeformable contacts 11E arranged on the upper surface of acontactor 11, as shown in, e.g.,FIG. 3 , in place of theintermediate member 15 shown inFIGS. 1 and 2 . - The
contacts 11E can be formed in the same manner as thecontacts 15C of theinterposer 15 shown inFIG. 1B . As shown inFIG. 3 , thecontacts 11E can be directly fixed toterminal electrodes 11C formed on the. upper surface of aceramic board 11A of thecontactor 11. Thecontactor 11 comes into electrical contact withterminal electrodes 12A of a printedwiring board 12 through the plurality ofcontacts 11E. - According to this embodiment, even when the printed
wiring board 12 is deformed by thermal expansion, the thermal deformation can be absorbed by thecontacts 11E of thecontactor 11. This embodiment can provide the same operation and effect as those of the first embodiment. According to this embodiment, the structure of theprobe card 10 can be simplified more than in the case of the first embodiment. - The present invention can be suitably utilized as a probe card for, e.g., a testing apparatus.
- According to one embodiment of the present invention, there can be provided a probe card that can decrease the adverse effect of heat and reliably bring the contactor and object to be tested into electrical contact with each other.
- According to another embodiment of the present invention, there can be provided a probe card that can shorten the preheat time and improve the throughput.
- The present invention is not limited to the above embodiments. A probe card having, between a circuit board and contactor that form the probe card, an intermediate member which can absorb thermal deformation of the circuit board is incorporated in the present invention.
- For example, when conductive rubber is used as the intermediate member, the same operation and effect as those of the above embodiments can be expected. The shape and material of the contacts are not particularly limited provided the contacts are elastically deformable and conductive.
Claims (10)
1. A probe card for testing electrical characteristics of an object to be tested, the probe card comprising:
a contactor;
a circuit board;
an intermediate member which is arranged between the contactor and circuit board and comes into contact with the contactor and circuit board flexibly and electrically; and
a connecting member which integrates the contactor and circuit board.
2. A probe card according to claim 1 , wherein the intermediate member has a board and a plurality of elastically deformable contacts arranged at least on a circuit board side of the board.
3. A probe card according to claim 2 , further comprising a reinforcing member which reinforces the circuit board.
4. A probe card according to claim 2 , wherein the connecting member integrates the contactor, circuit board, and reinforcing member.
5. A probe card according to claim 4 , further comprising an elastic member arranged at least either between the contactor and circuit board or between the circuit board and reinforcing member.
6. A probe card according to claim 5 , wherein the intermediate member is attached to the elastic member arranged between the contactor and circuit board.
7. A probe card according to claim 2 , wherein the intermediate member is made of conductive rubber.
8. A probe card according to claim 6 , wherein the contactor has a ceramic board and a plurality of probes formed on an object-to-be-tested side of the ceramic board.
9. A probe card according to claim 1 , comprising, as the intermediate member, a plurality of elastically deformable contacts which are provided on the contactor and come into electrical contact with the circuit board.
10. A probe card according to claim 9 , further comprising a reinforcing member which reinforces the circuit board.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-012077 | 2004-01-20 | ||
JP2004012077 | 2004-01-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050156613A1 true US20050156613A1 (en) | 2005-07-21 |
Family
ID=34747311
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/031,152 Abandoned US20050156613A1 (en) | 2004-01-20 | 2005-01-10 | Probe card |
US10/586,651 Expired - Fee Related US7663386B2 (en) | 2004-01-20 | 2005-01-20 | Probe card |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/586,651 Expired - Fee Related US7663386B2 (en) | 2004-01-20 | 2005-01-20 | Probe card |
Country Status (6)
Country | Link |
---|---|
US (2) | US20050156613A1 (en) |
JP (1) | JP4745060B2 (en) |
KR (2) | KR20050076599A (en) |
CN (2) | CN100422747C (en) |
TW (1) | TW200525675A (en) |
WO (1) | WO2005069019A1 (en) |
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US20090058440A1 (en) * | 2005-05-23 | 2009-03-05 | Kabushiki Kaisha Nihon Micronics | Probe assembly, method of producing it and electrical connecting apparatus |
US20100102837A1 (en) * | 2007-03-26 | 2010-04-29 | Advantest Corporation | Connection board, probe card, and electronic device test apparatus comprising same |
US20110050266A1 (en) * | 2005-08-31 | 2011-03-03 | Nhk Spring Co., Ltd. | Probe card |
US20110234251A1 (en) * | 2008-12-03 | 2011-09-29 | Tokyo Electron Limited | Probe card |
TWI394951B (en) * | 2008-11-13 | 2013-05-01 | ||
US20170370966A1 (en) * | 2016-06-22 | 2017-12-28 | Star Technologies, Inc. | Testing apparatus, holding assembly, and probe card carrier |
US10082536B2 (en) | 2015-07-07 | 2018-09-25 | Samsung Electronics Co., Ltd. | Probe card, thermal insulation cover assembly for probe card, and semiconductor device test apparatus including the same |
US20230065896A1 (en) * | 2021-08-31 | 2023-03-02 | Mpi Corporation | Probe card and wafer testing assembly thereof |
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Also Published As
Publication number | Publication date |
---|---|
TW200525675A (en) | 2005-08-01 |
KR20060127938A (en) | 2006-12-13 |
US7663386B2 (en) | 2010-02-16 |
JP4745060B2 (en) | 2011-08-10 |
KR20050076599A (en) | 2005-07-26 |
CN1910460A (en) | 2007-02-07 |
TWI338929B (en) | 2011-03-11 |
US20080258745A1 (en) | 2008-10-23 |
CN100422747C (en) | 2008-10-01 |
KR100828053B1 (en) | 2008-05-09 |
CN1645589A (en) | 2005-07-27 |
WO2005069019A1 (en) | 2005-07-28 |
JPWO2005069019A1 (en) | 2007-09-06 |
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Legal Events
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AS | Assignment |
Owner name: TOKYO ELECTRON LIMITED, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HOSAKA, HISATOMI;REEL/FRAME:016165/0252 Effective date: 20041227 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |