US20050168908A1 - Electrostatic chuck - Google Patents
Electrostatic chuck Download PDFInfo
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- US20050168908A1 US20050168908A1 US11/052,229 US5222905A US2005168908A1 US 20050168908 A1 US20050168908 A1 US 20050168908A1 US 5222905 A US5222905 A US 5222905A US 2005168908 A1 US2005168908 A1 US 2005168908A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H1/00—Details of emergency protective circuit arrangements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
Definitions
- This invention relates to an electrostatic chuck for attracting and holding a workpiece by electrostatic attraction forces and more particularly, to an electrostatic chuck as a support table for holding workpieces such as semiconductor wafers or glass substrates in the processes of manufacturing semiconductor devices and liquid crystal substrates.
- an electrostatic chuck is often used for holding the semiconductor wafer.
- One typical electrostatic chuck includes an electrode disposed between an insulating substrate and a dielectric layer for electrostatic attraction, the upper surface of the dielectric layer serving as an attracting surface. While a workpiece, typically a semiconductor wafer is rested on the attracting surface, a voltage is applied between the electrode and the semiconductor wafer to develop Coulomb forces or Johnson-Rahbek forces due to inductive polarization, for attracting and holding the wafer. Also known in the art is a dipole type electrostatic chuck comprising a plurality of electrodes formed between an insulating substrate and a dielectric layer for electrostatic attraction wherein a voltage is applied between the electrodes for attracting and holding a wafer resting on the attracting surface.
- the dielectric layer used in these electrostatic chucks must meet minimized sliding wear upon mounting and dismounting of wafers, and resistance to corrosion by corrosive gases used in various treatments.
- the materials employed in the art as satisfying such requirements include insulating ceramics having high wear resistance and corrosion resistance such as alumina and aluminum nitride.
- alumina can be crazed and distorted when sprayed thick, giving rise to delamination and other problems.
- pores in the sprayed coating must be sealed. Through the sealing treatment, organic fills are introduced into pores which in turn, become susceptible to etching, generating unwanted particles.
- An object of the invention is to provide an electrostatic chuck using a high dielectric strength member bearing a sprayed coating which has both halogen plasma resistance and improved dielectric strength properties.
- a member having a sprayed coating of an oxide of an atomic number 64 to 71 rare earth element formed on a substrate exhibits a high dielectric strength without a need for sealing treatment on the sprayed coating and possesses halogen plasma resistance.
- the invention provides an electrostatic chuck comprising a substrate, a lower oxide coating on the substrate, an electrode on the lower oxide coating, and an upper oxide coating on the electrode.
- the lower oxide coating is formed by spraying an oxide containing a rare earth element having atomic number 64 to 71 and has a dielectric strength of 15 to 50 kV/mm.
- dielectric strength is improved when a dielectric layer for an electrostatic chuck is formed using a heavy rare earth oxide having a high specific gravity preferably by an atmospheric plasma spraying. This allows a certain attractive force to be produced without increasing the coating thickness and restrains a lowering by thermal expansion of the adhesive strength between sprayed coating and substrate.
- the reduced thickness of coating improves the uniformity of temperature distribution within a wafer attracted thereto, thereby restraining any variation of processing on the wafer surface.
- FIG. 1 is a schematic cross-sectional view of an electrostatic chuck in one embodiment of the invention.
- the electrostatic chuck of the invention uses a high dielectric strength member comprising a substrate 1 and a high dielectric strength coating 2 formed thereon in the form of a sprayed coating of an oxide containing a rare earth element having atomic number 64 to 71.
- An electrode 3 and a dielectric layer 4 are formed on the member.
- the high dielectric strength coating 2 and dielectric layer 4 are also referred to as lower and upper oxide coatings, respectively.
- the high dielectric strength member of the invention is arrived at by forming on a substrate a sprayed coating of an oxide containing a rare earth element having atomic number 64 to 71.
- the sprayed coating has a high dielectric strength even without a need for sealing treatment.
- the substrate may be selected from among ceramics, metals and composites thereof depending on a particular application, though not critical.
- Exemplary ceramic materials include shaped bodies composed mainly of quartz, alumina, magnesia and yttria, and complex oxides thereof, shaped bodies composed mainly of silicon nitride, aluminum nitride and boron nitride, and shaped bodies composed mainly of silicon carbide and boron carbide.
- Exemplary carbon materials include carbon fibers and sintered carbon bodies.
- Exemplary metal materials include those based on iron, aluminum, magnesium, copper, silicon and nickel, alloys thereof, for example, stainless alloys, aluminum alloys, anodized aluminum alloys, magnesium alloys and copper alloys, and single crystal silicon. Also included in the composite category are metal materials covered with ceramic coatings and aluminum alloys subjected to anodizing treatment or surface treatment, typically plating.
- the sprayed coating contains an oxide of a rare earth element having atomic number 64 to 71, i.e., Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. It is most preferred that the sprayed coating consist solely of the rare earth oxide or oxides although the advantages of the invention are achievable with a sprayed coating containing at least 45% by weight, especially at least 50% by weight of the rare earth oxide.
- the oxides other than the rare earth oxide in the sprayed coating include Al 2 O 3 , Y 2 O 3 and oxides of other rare earth elements.
- Useful spraying techniques include flame spraying, high velocity oxy-fuel (HVOF) spraying, detonation spraying, plasma spraying, water stabilized plasma spraying, induction (RF) plasma spraying, electromagnetic acceleration plasma spraying, cold spraying, and laser spraying.
- HVOF high velocity oxy-fuel
- RF induction
- the spraying technique is not particularly limited although the plasma spraying featuring a high spray output is preferred.
- the spraying is divided into atmospheric spraying and low pressure or vacuum spraying wherein spraying is effected in a chamber kept at a low pressure or vacuum. Since it is advantageous to reduce internal pores in order to form a more densified coating, the low pressure spraying is recommended.
- the low pressure or vacuum spraying technique requires a low pressure or vacuum chamber in order to perform a spraying operation. This imposes spatial or time limits to the spraying operation. Then the present invention favors the atmospheric spraying technique which can be practiced without a need for a special pressure vessel.
- the plasma spraying system generally includes a water-cooled plasma gun, a power supply, a powder feeder, and a gas controller.
- the plasma output is determined by the power supplied to the plasma gun and the feed rates of argon gas, nitrogen gas, hydrogen gas, helium gas or the like.
- the feed rate of powder is controlled by the powder feeder.
- a coating is formed by operating a plasma gun to create a plasma, feeding a powder into the plasma for melting particles, and instantaneously impinging molten particles against a substrate.
- spraying particles be melted fully and moved at a high flight velocity.
- the residence time of particles within the plasma should be longer, which is equivalent to a lower velocity as long as a limited space is concerned, and is thus contradictory to the high velocity requirement.
- Increasing the input to the gun leads to increases in both the temperature and flow velocity of a plasma jet.
- the melting of particles is determined by the latent heat of fusion, particle size, specific gravity of material and gas temperature, and the flight velocity is determined by the particle size, specific gravity and jet velocity. It is then believed that the input power must be optimized for each type of powder material.
- a material having a higher specific gravity as the coating. Namely, by forming a sprayed coating of an oxide having a higher specific gravity than alumina which has traditionally been used in dielectric strength sprayed members, a sprayed member having higher dielectric strength than the alumina-sprayed member is obtainable.
- compounds of elements of greater atomic numbers often have a higher specific gravity.
- rare earth compounds are known to have halogen plasma resistance.
- it is unknown that such rare earth compounds have high dielectric strength.
- the inventor has discovered that sprayed coatings of oxides of elements having atomic number 64 to 71 have high dielectric strength as well.
- the thickness of a sprayed coating is not critical, the preferred thickness is from 100 ⁇ m to less than 500 ⁇ m, more preferably from 100 ⁇ m to 450 ⁇ m, even more preferably from 100 ⁇ m to 400 ⁇ m. Too thin a coating may undergo breakdown due to the low dielectric strength at that thickness. Too thick a coating is liable to craze and separate from the substrate.
- the dielectric strength (kV/mm) of the sprayed coating is at least 15 kV/mm, more preferably at least 17 kV/mm as the lower limit and up to 50 kV/mm as the upper limit.
- the dielectric strength can be measured according to JIS C2110, for example, using a specimen in which oxide is plasma sprayed on a metal substrate.
- the sprayed coating on the specimen may have a thickness of about 100 to 500 ⁇ m.
- an aluminum substrate of 100 mm ⁇ 100 mm ⁇ 5 mm is used, one surface is blasted prior to spraying, and an oxide containing an element having atomic number 64 to 71 is plasma sprayed to form a sprayed coating of about 200 ⁇ m thick.
- the coated substrate is sandwiched between electrodes according to JIS C2110, and voltage is applied thereacross and increased at a rate of 200 V/sec. The voltage at which dielectric breakdown occurs is the breakdown voltage of the coating.
- the voltage which is lower by 0.5 kV than the breakdown voltage is a preset voltage. If no dielectric breakdown occurs when the voltage is increased at a rate of 200 V/sec up to the preset voltage and maintained at the preset voltage for 20 seconds, that voltage is the dielectric strength (kV) of the entire sprayed coating.
- the thus measured dielectric strength (kV) of the entire sprayed coating is normalized as a voltage per the sprayed coating thickness of 1 mm.
- the normalized value is the dielectric strength (kV/mm).
- an electrode is formed on the surface of the member.
- metallic materials and electroconductive ceramic materials for example, Pd, W, Ag, Mo and Ti.
- the electrode may be made by forming a film of such material by any of depositing techniques including sputtering, CVD, ion plating, electroplating, spraying, sintering and screen printing.
- the film may have a thickness of 1 ⁇ m to 100 ⁇ m, preferably 5 ⁇ m to 80 ⁇ m.
- a power supply terminal is connected to the electrode for applying a voltage for producing an electrostatic attraction force.
- a dielectric material must be deposited on the electrode surface to form an upper coating.
- an upper coating is formed by any of depositing techniques including sputtering, CVD, spraying, and sintering.
- depositing techniques including sputtering, CVD, spraying, and sintering.
- CVD chemical vapor deposition
- spraying and sintering.
- the upper coating preferably has a thickness of 10 ⁇ m to less than 500 ⁇ m, more preferably 100 ⁇ m to less than 500 ⁇ m.
- a substrate for example, a semiconductor wafer (e.g., silicon wafer) or glass substrate is rested on the chuck.
- a voltage is applied across the electrode to develop an electrostatic attraction force between the electrode and the substrate whereby the substrate is attracted to the chuck.
- Sprayed coatings of 200 ⁇ m thick were formed on aluminum substrates of 100 mm ⁇ 100 mm ⁇ 5 mm by spraying powders of oxides of atomic number 64 to 71 rare earth elements under spraying conditions: a plasma power of 35 kW, an argon gas flow rate of 40 l/min, a hydrogen gas flow rate of 5 l/min, and a powder feed rate of 20 g/min. Without sealing treatment, the sprayed coatings were subjected to a dielectric strength test.
- the dielectric strength test was performed according to JIS C2110. While the voltage was increased at a rate of 200 V/sec, the voltage at which dielectric breakdown occurred was first measured. The voltage which was lower by 0.5 kV than the breakdown voltage was then assumed to be a preset voltage. If no dielectric breakdown occurred when the voltage was increased at a rate of 200 V/sec up to the preset voltage and maintained at the preset voltage for 20 seconds, that voltage was the dielectric strength (kV) of the entire sprayed coating. The thus measured dielectric strength (kV) of the entire sprayed coating was divided by the thickness (200 ⁇ m) of the sprayed coating, obtaining a dielectric strength (kV/mm). The results are shown in Table 1.
- Example 2 As in Example 1, Y 2 O 3 powder having an average particle size of 35 ⁇ m was sprayed, and a dielectric strength test performed.
- Example 2 Al 2 O 3 powder having an average particle size of 30 ⁇ m was sprayed, and a dielectric strength test performed.
- Example 1 Dielectric Atomic Specific strength number Oxide gravity (kV/mm) Example 1 64 Gd 2 O 3 7.62 19 Example 2 65 Tb 2 O 3 7.81 22 Example 3 66 Dy 2 O 3 7.41 26 Example 4 67 Ho 2 O 3 8.36 19 Example 5 68 Er 2 O 3 8.65 26 Example 6 70 Yb 2 O 3 9.17 28 Example 7 71 Lu 2 O 3 9.84 25 Comparative 39 Y 2 O 3 5.03 12 Example 1 Comparative 13 Al 2 O 3 3.99 10 Example 2
- Sprayed coatings of 200 ⁇ m thick were formed on aluminum substrates of 100 mm ⁇ 100 mm ⁇ 5 mm by spraying powders of oxides of atomic number 64 to 71 rare earth elements as shown in Table 2 under atmospheric plasma spraying conditions: a plasma power of 35 kW, an argon gas flow rate of 40 l/min, a hydrogen gas flow rate of 5 l/min, and a substrate-plasma gun distance of 80 mm to 150 mm, while adjusting a powder feed rate to 5 cc/min. Tungsten powder was then sprayed thereon to form an electrode for electrostatic attraction having a diameter of 95 mm and a thickness of 50 ⁇ m.
- An upper oxide coating was further formed on the electrode under the same conditions and to the same thickness (shown in Table 2) as in the previous spraying step. It is noted that the thickness of oxide coating shown in Table 2 is determined from the results in Table 1 as the thickness at which no dielectric breakdown occurs upon application of 3 kV.
- the electrostatic chucks thus constructed were tested at room temperature (25° C.). A silicon wafer having a diameter of 4 inches was rested on the attracting surface. By applying a voltage of 300 V between the electrode and the wafer, the wafer was attracted to and held by the attracting surface. The force needed to detach the wafer from the chuck in this state was measured as an attractive force, with the results shown in Table 2.
- each oxide was deposited on an aluminum disk having a diameter of 25 mm and a thickness of 5 mm under the above-described spraying conditions and to the thickness shown in Table 2. Thermal cycles of heating at 150° C. for 2 hours were repeated 20 times, following which bond strength was measured. Specifically, the coated disk was joined to an aluminum rod having a diameter of 25 mm and a length of 100 mm with an epoxy adhesive. Bond strength was measured using a tensile tester. The results are shown in Table 2.
Abstract
Description
- This application is a continuation-in-part of copending application Ser. No. 10/737,785 filed on Dec. 18, 2003, the entire contents of which are hereby incorporated by reference.
- 1. Field of the Invention
- This invention relates to an electrostatic chuck for attracting and holding a workpiece by electrostatic attraction forces and more particularly, to an electrostatic chuck as a support table for holding workpieces such as semiconductor wafers or glass substrates in the processes of manufacturing semiconductor devices and liquid crystal substrates.
- 2. Background Art
- In the conventional semiconductor manufacture process including such steps as etching of a semiconductor wafer, deposition of a thin film on a semiconductor wafer and imagewise exposure of photoresist, an electrostatic chuck is often used for holding the semiconductor wafer.
- One typical electrostatic chuck includes an electrode disposed between an insulating substrate and a dielectric layer for electrostatic attraction, the upper surface of the dielectric layer serving as an attracting surface. While a workpiece, typically a semiconductor wafer is rested on the attracting surface, a voltage is applied between the electrode and the semiconductor wafer to develop Coulomb forces or Johnson-Rahbek forces due to inductive polarization, for attracting and holding the wafer. Also known in the art is a dipole type electrostatic chuck comprising a plurality of electrodes formed between an insulating substrate and a dielectric layer for electrostatic attraction wherein a voltage is applied between the electrodes for attracting and holding a wafer resting on the attracting surface.
- The dielectric layer used in these electrostatic chucks must meet minimized sliding wear upon mounting and dismounting of wafers, and resistance to corrosion by corrosive gases used in various treatments. The materials employed in the art as satisfying such requirements include insulating ceramics having high wear resistance and corrosion resistance such as alumina and aluminum nitride. However, alumina can be crazed and distorted when sprayed thick, giving rise to delamination and other problems. To enhance the dielectric strength of sprayed alumina coatings, pores in the sprayed coating must be sealed. Through the sealing treatment, organic fills are introduced into pores which in turn, become susceptible to etching, generating unwanted particles. Due to low dielectric strength, ceramics must be deposited to a greater thickness, which leads to a lower attractive force, which in turn, requires to increase a voltage in order to produce a certain attractive force, inviting a vicious circle. The increased thickness also gives rise to the problem that the adhesive strength of sprayed coating is reduced by the stresses associated with thermal expansion.
- An object of the invention is to provide an electrostatic chuck using a high dielectric strength member bearing a sprayed coating which has both halogen plasma resistance and improved dielectric strength properties.
- It has been found that a member having a sprayed coating of an oxide of an atomic number 64 to 71 rare earth element formed on a substrate exhibits a high dielectric strength without a need for sealing treatment on the sprayed coating and possesses halogen plasma resistance.
- The invention provides an electrostatic chuck comprising a substrate, a lower oxide coating on the substrate, an electrode on the lower oxide coating, and an upper oxide coating on the electrode. The lower oxide coating is formed by spraying an oxide containing a rare earth element having atomic number 64 to 71 and has a dielectric strength of 15 to 50 kV/mm.
- According to the present invention, dielectric strength is improved when a dielectric layer for an electrostatic chuck is formed using a heavy rare earth oxide having a high specific gravity preferably by an atmospheric plasma spraying. This allows a certain attractive force to be produced without increasing the coating thickness and restrains a lowering by thermal expansion of the adhesive strength between sprayed coating and substrate. The reduced thickness of coating improves the uniformity of temperature distribution within a wafer attracted thereto, thereby restraining any variation of processing on the wafer surface.
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FIG. 1 is a schematic cross-sectional view of an electrostatic chuck in one embodiment of the invention. - Referring to
FIG. 1 , the electrostatic chuck of the invention uses a high dielectric strength member comprising asubstrate 1 and a highdielectric strength coating 2 formed thereon in the form of a sprayed coating of an oxide containing a rare earth element having atomic number 64 to 71. Anelectrode 3 and adielectric layer 4 are formed on the member. The highdielectric strength coating 2 anddielectric layer 4 are also referred to as lower and upper oxide coatings, respectively. - The high dielectric strength member of the invention is arrived at by forming on a substrate a sprayed coating of an oxide containing a rare earth element having atomic number 64 to 71. The sprayed coating has a high dielectric strength even without a need for sealing treatment.
- The substrate may be selected from among ceramics, metals and composites thereof depending on a particular application, though not critical. Exemplary ceramic materials include shaped bodies composed mainly of quartz, alumina, magnesia and yttria, and complex oxides thereof, shaped bodies composed mainly of silicon nitride, aluminum nitride and boron nitride, and shaped bodies composed mainly of silicon carbide and boron carbide. Exemplary carbon materials include carbon fibers and sintered carbon bodies. Exemplary metal materials include those based on iron, aluminum, magnesium, copper, silicon and nickel, alloys thereof, for example, stainless alloys, aluminum alloys, anodized aluminum alloys, magnesium alloys and copper alloys, and single crystal silicon. Also included in the composite category are metal materials covered with ceramic coatings and aluminum alloys subjected to anodizing treatment or surface treatment, typically plating.
- The sprayed coating contains an oxide of a rare earth element having atomic number 64 to 71, i.e., Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. It is most preferred that the sprayed coating consist solely of the rare earth oxide or oxides although the advantages of the invention are achievable with a sprayed coating containing at least 45% by weight, especially at least 50% by weight of the rare earth oxide. The oxides other than the rare earth oxide in the sprayed coating include Al2O3, Y2O3 and oxides of other rare earth elements.
- Useful spraying techniques include flame spraying, high velocity oxy-fuel (HVOF) spraying, detonation spraying, plasma spraying, water stabilized plasma spraying, induction (RF) plasma spraying, electromagnetic acceleration plasma spraying, cold spraying, and laser spraying. The spraying technique is not particularly limited although the plasma spraying featuring a high spray output is preferred.
- Depending on the operating atmosphere, the spraying is divided into atmospheric spraying and low pressure or vacuum spraying wherein spraying is effected in a chamber kept at a low pressure or vacuum. Since it is advantageous to reduce internal pores in order to form a more densified coating, the low pressure spraying is recommended. However, the low pressure or vacuum spraying technique requires a low pressure or vacuum chamber in order to perform a spraying operation. This imposes spatial or time limits to the spraying operation. Then the present invention favors the atmospheric spraying technique which can be practiced without a need for a special pressure vessel.
- The plasma spraying system generally includes a water-cooled plasma gun, a power supply, a powder feeder, and a gas controller. The plasma output is determined by the power supplied to the plasma gun and the feed rates of argon gas, nitrogen gas, hydrogen gas, helium gas or the like. The feed rate of powder is controlled by the powder feeder.
- In the plasma spraying technique, a coating is formed by operating a plasma gun to create a plasma, feeding a powder into the plasma for melting particles, and instantaneously impinging molten particles against a substrate. In order to obtain a satisfactory coating, it is requisite that spraying particles be melted fully and moved at a high flight velocity. In order that particles be melted, the residence time of particles within the plasma should be longer, which is equivalent to a lower velocity as long as a limited space is concerned, and is thus contradictory to the high velocity requirement. Increasing the input to the gun leads to increases in both the temperature and flow velocity of a plasma jet. However, the melting of particles is determined by the latent heat of fusion, particle size, specific gravity of material and gas temperature, and the flight velocity is determined by the particle size, specific gravity and jet velocity. It is then believed that the input power must be optimized for each type of powder material.
- For the manufacture of a sprayed member having higher dielectric strength, with the above-described spraying conditions taken into account, it is important to use a material having a higher specific gravity as the coating. Namely, by forming a sprayed coating of an oxide having a higher specific gravity than alumina which has traditionally been used in dielectric strength sprayed members, a sprayed member having higher dielectric strength than the alumina-sprayed member is obtainable. In general, compounds of elements of greater atomic numbers often have a higher specific gravity. Of these, rare earth compounds are known to have halogen plasma resistance. However, it is unknown that such rare earth compounds have high dielectric strength. The inventor has discovered that sprayed coatings of oxides of elements having atomic number 64 to 71 have high dielectric strength as well.
- Although the thickness of a sprayed coating is not critical, the preferred thickness is from 100 μm to less than 500 μm, more preferably from 100 μm to 450 μm, even more preferably from 100 μm to 400 μm. Too thin a coating may undergo breakdown due to the low dielectric strength at that thickness. Too thick a coating is liable to craze and separate from the substrate.
- No particular limits are imposed to the dielectric strength (kV/mm) of the sprayed coating. The preferred dielectric strength is at least 15 kV/mm, more preferably at least 17 kV/mm as the lower limit and up to 50 kV/mm as the upper limit.
- Herein, the dielectric strength can be measured according to JIS C2110, for example, using a specimen in which oxide is plasma sprayed on a metal substrate. The sprayed coating on the specimen may have a thickness of about 100 to 500 μm. Specifically, an aluminum substrate of 100 mm×100 mm×5 mm is used, one surface is blasted prior to spraying, and an oxide containing an element having atomic number 64 to 71 is plasma sprayed to form a sprayed coating of about 200 μm thick. The coated substrate is sandwiched between electrodes according to JIS C2110, and voltage is applied thereacross and increased at a rate of 200 V/sec. The voltage at which dielectric breakdown occurs is the breakdown voltage of the coating.
- The voltage which is lower by 0.5 kV than the breakdown voltage is a preset voltage. If no dielectric breakdown occurs when the voltage is increased at a rate of 200 V/sec up to the preset voltage and maintained at the preset voltage for 20 seconds, that voltage is the dielectric strength (kV) of the entire sprayed coating. The thus measured dielectric strength (kV) of the entire sprayed coating is normalized as a voltage per the sprayed coating thickness of 1 mm. The normalized value is the dielectric strength (kV/mm).
- In order to construct an electrostatic chuck using the high dielectric strength member, an electrode is formed on the surface of the member. Typically used for the electrode are metallic materials and electroconductive ceramic materials, for example, Pd, W, Ag, Mo and Ti. The electrode may be made by forming a film of such material by any of depositing techniques including sputtering, CVD, ion plating, electroplating, spraying, sintering and screen printing. The film may have a thickness of 1 μm to 100 μm, preferably 5 μm to 80 μm. A power supply terminal is connected to the electrode for applying a voltage for producing an electrostatic attraction force.
- Further a dielectric material must be deposited on the electrode surface to form an upper coating. Using any of ceramic materials such as alumina, zirconia, yttria and rare earth oxides, an upper coating is formed by any of depositing techniques including sputtering, CVD, spraying, and sintering. In the intended application wherein a substrate which is rested on and attracted by an electrostatic chuck is processed such as by etching, it is preferred to form a coating of the same heavy rare earth oxide as in the dielectric strength member by spraying. The upper coating preferably has a thickness of 10 μm to less than 500 μm, more preferably 100 μm to less than 500 μm.
- On use of the thus constructed electrostatic chuck, a substrate, for example, a semiconductor wafer (e.g., silicon wafer) or glass substrate is rested on the chuck. A voltage is applied across the electrode to develop an electrostatic attraction force between the electrode and the substrate whereby the substrate is attracted to the chuck.
- Examples of the invention are given below by way of illustration and not by way of limitation.
- Sprayed coatings of 200 μm thick were formed on aluminum substrates of 100 mm×100 mm×5 mm by spraying powders of oxides of atomic number 64 to 71 rare earth elements under spraying conditions: a plasma power of 35 kW, an argon gas flow rate of 40 l/min, a hydrogen gas flow rate of 5 l/min, and a powder feed rate of 20 g/min. Without sealing treatment, the sprayed coatings were subjected to a dielectric strength test.
- The dielectric strength test was performed according to JIS C2110. While the voltage was increased at a rate of 200 V/sec, the voltage at which dielectric breakdown occurred was first measured. The voltage which was lower by 0.5 kV than the breakdown voltage was then assumed to be a preset voltage. If no dielectric breakdown occurred when the voltage was increased at a rate of 200 V/sec up to the preset voltage and maintained at the preset voltage for 20 seconds, that voltage was the dielectric strength (kV) of the entire sprayed coating. The thus measured dielectric strength (kV) of the entire sprayed coating was divided by the thickness (200 μm) of the sprayed coating, obtaining a dielectric strength (kV/mm). The results are shown in Table 1.
- As in Example 1, Y2O3 powder having an average particle size of 35 μm was sprayed, and a dielectric strength test performed.
- As in Example 1, Al2O3 powder having an average particle size of 30 μm was sprayed, and a dielectric strength test performed.
- The results are shown in Table 1.
TABLE 1 Dielectric Atomic Specific strength number Oxide gravity (kV/mm) Example 1 64 Gd2O3 7.62 19 Example 2 65 Tb2O3 7.81 22 Example 3 66 Dy2O3 7.41 26 Example 4 67 Ho2O3 8.36 19 Example 5 68 Er2O3 8.65 26 Example 6 70 Yb2O3 9.17 28 Example 7 71 Lu2O3 9.84 25 Comparative 39 Y2O3 5.03 12 Example 1 Comparative 13 Al2O3 3.99 10 Example 2 - Sprayed coatings of 200 μm thick were formed on aluminum substrates of 100 mm×100 mm×5 mm by spraying powders of oxides of atomic number 64 to 71 rare earth elements as shown in Table 2 under atmospheric plasma spraying conditions: a plasma power of 35 kW, an argon gas flow rate of 40 l/min, a hydrogen gas flow rate of 5 l/min, and a substrate-plasma gun distance of 80 mm to 150 mm, while adjusting a powder feed rate to 5 cc/min. Tungsten powder was then sprayed thereon to form an electrode for electrostatic attraction having a diameter of 95 mm and a thickness of 50 μm. An upper oxide coating was further formed on the electrode under the same conditions and to the same thickness (shown in Table 2) as in the previous spraying step. It is noted that the thickness of oxide coating shown in Table 2 is determined from the results in Table 1 as the thickness at which no dielectric breakdown occurs upon application of 3 kV.
- The electrostatic chucks thus constructed were tested at room temperature (25° C.). A silicon wafer having a diameter of 4 inches was rested on the attracting surface. By applying a voltage of 300 V between the electrode and the wafer, the wafer was attracted to and held by the attracting surface. The force needed to detach the wafer from the chuck in this state was measured as an attractive force, with the results shown in Table 2.
- In another experiment, each oxide was deposited on an aluminum disk having a diameter of 25 mm and a thickness of 5 mm under the above-described spraying conditions and to the thickness shown in Table 2. Thermal cycles of heating at 150° C. for 2 hours were repeated 20 times, following which bond strength was measured. Specifically, the coated disk was joined to an aluminum rod having a diameter of 25 mm and a length of 100 mm with an epoxy adhesive. Bond strength was measured using a tensile tester. The results are shown in Table 2.
TABLE 2 Substrate- plasma gun Coating Attractive Bond Atomic Specific distance thickness force strength number Oxide gravity (mm) (μm) (kPa) (MPa) Example 8 64 Gd2O3 7.62 80 200 2 32 Example 9 65 Tb2O3 7.81 90 180 3 28 Example 10 66 Dy2O3 7.41 100 150 4 28 Example 11 67 Ho2O3 8.36 110 200 2 25 Example 12 68 Er2O3 8.65 120 150 4 22 Example 13 70 Yb2O3 9.17 130 130 5 20 Example 14 71 Lu2O3 9.84 150 150 4 15 Comparative 39 Y2O3 5.03 120 300 1 9 Example 3 Comparative 13 Al2O3 3.99 100 350 0.5 10 Example 4 - Japanese Patent Application No. 2002-379389 is incorporated herein by reference.
- Reasonable modifications and variations are possible from the foregoing disclosure without departing from either the spirit or scope of the present invention as defined by the claims.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/052,229 US7280341B2 (en) | 2002-12-27 | 2005-02-08 | Electrostatic chuck |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002379389A JP3829935B2 (en) | 2002-12-27 | 2002-12-27 | High voltage resistance member |
JP2002-379389 | 2002-12-27 | ||
US10/737,785 US20040126625A1 (en) | 2002-12-27 | 2003-12-18 | High dielectric strength member |
US11/052,229 US7280341B2 (en) | 2002-12-27 | 2005-02-08 | Electrostatic chuck |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/737,785 Continuation-In-Part US20040126625A1 (en) | 2002-12-27 | 2003-12-18 | High dielectric strength member |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050168908A1 true US20050168908A1 (en) | 2005-08-04 |
US7280341B2 US7280341B2 (en) | 2007-10-09 |
Family
ID=32652744
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/737,785 Abandoned US20040126625A1 (en) | 2002-12-27 | 2003-12-18 | High dielectric strength member |
US11/052,229 Expired - Fee Related US7280341B2 (en) | 2002-12-27 | 2005-02-08 | Electrostatic chuck |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/737,785 Abandoned US20040126625A1 (en) | 2002-12-27 | 2003-12-18 | High dielectric strength member |
Country Status (4)
Country | Link |
---|---|
US (2) | US20040126625A1 (en) |
JP (1) | JP3829935B2 (en) |
KR (1) | KR101121364B1 (en) |
TW (1) | TW200428416A (en) |
Cited By (5)
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US20050148160A1 (en) * | 2002-03-06 | 2005-07-07 | Farnworth Warren M. | Encapsulated semiconductor components and methods of fabrication |
CN100370592C (en) * | 2005-12-08 | 2008-02-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Electrostatic chuck |
US20080106842A1 (en) * | 2006-11-06 | 2008-05-08 | Tokyo Electron Limited | Mounting device, plasma processing apparatus and plasma processing method |
US20110126406A1 (en) * | 2005-12-21 | 2011-06-02 | Asml Netherlands B.V. | Lithographic Apparatus and Method of Manufacturing an Electrostatic Clamp for a Lithographic Apparatus |
US10287212B2 (en) | 2014-06-26 | 2019-05-14 | Toto Ltd. | Plasma-resistant member |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5393271B2 (en) * | 2009-06-09 | 2014-01-22 | 信越化学工業株式会社 | Oxides and magneto-optical devices |
WO2013099890A1 (en) | 2011-12-28 | 2013-07-04 | 株式会社 フジミインコーポレーテッド | Yttrium oxide coating film |
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CN100370592C (en) * | 2005-12-08 | 2008-02-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Electrostatic chuck |
US20110126406A1 (en) * | 2005-12-21 | 2011-06-02 | Asml Netherlands B.V. | Lithographic Apparatus and Method of Manufacturing an Electrostatic Clamp for a Lithographic Apparatus |
US8476167B2 (en) * | 2005-12-21 | 2013-07-02 | Asml Netherlands B.V. | Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus |
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US10287212B2 (en) | 2014-06-26 | 2019-05-14 | Toto Ltd. | Plasma-resistant member |
Also Published As
Publication number | Publication date |
---|---|
KR101121364B1 (en) | 2012-03-09 |
US20040126625A1 (en) | 2004-07-01 |
TW200428416A (en) | 2004-12-16 |
JP2004211122A (en) | 2004-07-29 |
TWI295327B (en) | 2008-04-01 |
KR20040060757A (en) | 2004-07-06 |
JP3829935B2 (en) | 2006-10-04 |
US7280341B2 (en) | 2007-10-09 |
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