US20050173098A1 - Three dimensional vapor chamber - Google Patents
Three dimensional vapor chamber Download PDFInfo
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- US20050173098A1 US20050173098A1 US11/079,852 US7985205A US2005173098A1 US 20050173098 A1 US20050173098 A1 US 20050173098A1 US 7985205 A US7985205 A US 7985205A US 2005173098 A1 US2005173098 A1 US 2005173098A1
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- vapor chamber
- heat exchange
- condenser
- evaporator
- cavities
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the invention relates to the management of thermal energy generated by electronic systems, and more particularly to an improved thermal vapor chamber for efficiently and cost-effectively routing and controlling the thermal energy generated by various components of an electronic system.
- thermal budget that is available for the design of the cooling devices/systems needed to manage the heat fluxes generated by the various electronic devices in the system.
- delta-T thermal resistances
- Successful cooling technologies must deal with thermal issues at the device, device cluster, printed wiring board, subassembly, and cabinet or rack levels, all of which are within the original equipment manufacturer's (OEM's) products. Many times, the problem is further complicated by the fact that the thermal solution is many times an “after thought” for the OEM.
- a new equipment design may utilize the latest software or implement the fastest new semiconductor technology, but the thermal management architecture is generally relegated to the “later phases” of the new product design.
- the thermal management issues associated with a given electronic system are often solved by the expedient of a secondary cooling or refrigeration system that is arranged in tandem with the electronics system.
- thermal management architecture that satisfactorily accumulates and transfers variable amounts of thermal energy, generated by a wide variety of electronic components arranged together in an enclosed space, while avoiding or minimizing the use of non-passive, tandem cooling or refrigeration systems for cooling.
- a vapor chamber comprising a vapor chamber portion and a heat pipe portion.
- Each portion can have a length measured in a first direction, a width measured in a second direction, and a height measured in a third direction.
- Each portion further can comprise an inner cavity having a wick structure disposed on a surface of the cavity, the inner cavities being in fluid communication with each other.
- the heat pipe portion can be disposed on the vapor chamber portion such that the width of the heat pipe portion is substantially smaller than the width of the vapor chamber portion and the length of the heat pipe portion is substantially equal to the length of the vapor chamber portion.
- a three-dimensional vapor chamber comprising a vapor chamber portion and a heat pipe portion.
- the portions each can have a respective major surface comprising a substantially rectangular shape.
- the portions further each can have an inner cavity comprising a wick, and the inner cavities can be in fluid communication with each other.
- the heat pipe portion can be connected to the vapor chamber portion such that the major surfaces are oriented substantially perpendicular to each other. Further, the lengths of the respective portions can be substantially equal as measured in a first direction, and the heights of the respective portions can be substantially different when measured in a second direction substantially orthogonal to the first direction.
- a three dimensional vapor chamber comprising first and second heat exchange chambers having inner cavities with wick structures disposed on respective inner surfaces thereof.
- the chambers can be connected together so that the inner cavities are in fluid communication with each other.
- the first heat exchange chamber can have a length, a width and a height as measured in first, second and third mutually orthogonal directions, respectively.
- the second heat exchange chamber can have a length, a width and a height as measured in the first, second and third directions.
- the lengths of the first and second heat exchange chambers can be substantially equal, and the widths of the first and second heat exchange chambers can be substantially unequal.
- FIG. 1 is a perspective view of the inventive vapor chamber assembly
- FIG. 2 is a side view of the vapor chamber assembly of FIG. 1 ;
- FIG. 3 is a cross-sectional view of a portion of the vapor chamber assembly of FIG. 1 , taken along line 3 - 3 ;
- FIG. 4 is an end view of an alternative embodiment of the vapor chamber of FIG. 1 , incorporating multiple vertical condenser portions with cooling fins mounted thereto.
- the present invention comprises a three-dimensional vapor chamber 1 that is sized and shaped to transfer thermal heat energy generated by at least one thermal energy source, e.g., a semiconductor device that is thermally engaged with a bottom surface of the vapor chamber 1 .
- the vapor chamber 1 has a horizontal evaporator portion 2 and a vertical condenser portion 4 .
- the horizontal evaporator portion 2 comprises an inner cavity 3 defined between top and bottom walls 7 , 11 , and has a generally flat rectangular shape with a height “h,” a width “w,” and a length “I.”
- the vertical condenser portion 4 can comprise an inner cavity 5 defined between opposing side walls 9 , 13 , and has a generally flat rectangular shape with a height “h 1 ,” a width “w 1 ,” and a length “l 1 .”
- the horizontal evaporator portion 2 and the vertical condenser portion 4 are connected and hermetically sealed so that their respective inner cavities 3 , 5 form a single vapor space.
- the inner cavities 3 , 5 of the evaporator and condenser portions 2 , 4 can have inner surfaces 22 , 42 with a wick 50 disposed thereon.
- the wick 50 can be saturated with a working fluid, and the inner cavities 3 , 5 can be maintained at a partial vacuum.
- the working fluid which may be saturated in the wick 50
- the vapor rushes to fill the vacuum in the inner cavities 3 , 5 .
- the vapor comes into contact with a cooler wall surface 42 , it condenses, releasing its latent heat of vaporization.
- the condensed fluid then returns to the horizontal evaporator portion 2 via capillary action in the wick 50 .
- capillary action as a fluid return mechanism allows the vapor chamber 1 to be used in any physical orientation, without respect to gravity, since capillary action can act to drive or draw the working fluid “up hill.” Thus, the device will operate effectively even if the installed upside down. It is noted that providing a wick is not critical, and thus the interior surfaces 22 , 42 of the vapor chamber 1 may be provided without a wick 50 , particularly in gravity-aided embodiments of the invention.
- the three dimensional vapor chamber 1 provides a highly efficient means of spreading the heat from a concentrated source (through the bottom wall 11 of the evaporator portion 2 ) to a large surface (the interior surfaces 22 , 42 of the interior spaces 3 , 5 ). Furthermore, the thermal resistance associated with the aforementioned vapor spreading is negligible as compared to traditional heat sinks. Further, the present design will provide increased cooling performance as compared to typical vapor chamber designs which use multiple discrete cylindrical “tower-type” condenser portions. This is because the present design maximizes the cooling area (i.e. the wick-wall area), and also the volume, of the condenser portion by extending it all the way across the length l of the evaporator portion 2 .
- the “T-shape” of the present invention is also expected to perform better than vapor chambers incorporating multiple cylindrical “tower-type” condenser portions because the condenser portion 4 of the present design retains a substantial vertical dimension even if placed on its side.
- Vapor chambers utilizing multiple cylindrical “tower-type” condenser portions typically are of limited to use in the vertical orientation, and also are limited in the amount of wick-wall area available for cooling.
- the present design provides substantially more wick-wall area and vapor space than prior devices, thus providing increased device efficiency.
- the present invention is also expected to be less expensive and easier to manufacture than the prior designs, since the assembly process will require the attachment of a single condenser portion 4 (by welding, brazing or soldering) to the evaporator portion 2 , rather than having to attach a multiplicity of individual small towers.
- the top and bottom walls 7 , 11 of the horizontal evaporator portion 2 can comprise substantially uniform thickness sheets of a thermally conductive material, and can be spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to form the interior space 3 that defines the evaporator portion 2 .
- the top and bottom walls 7 , 11 preferably comprises substantially planar inner surfaces 22 , either or both of which can have an integrally formed wick 50 as previously noted.
- sintered copper powder or felt metal wick structure having an average thickness of about 0.5 mm to 2.0 mm is positioned over substantially all of the inner surface of bottom wall 11 so as to form wick 50 .
- other wick materials such as, aluminum-silicon-carbide or copper-silicon-carbide may also be used.
- a vertical condenser portion 4 is connected to the evaporator portion 2 . More particularly, the vertical condenser portion 4 comprises a flat rectangular structure similar to that of the evaporator portion 2 .
- first and second side walls 9 , 13 can comprise substantially uniform thickness sheets of a thermally conductive material, and are spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to form the inner space 5 that defines the condenser portion 4 .
- the side walls 9 , 13 preferably comprise substantially planar inner surfaces 42 , while the top wall 15 is also substantially planar.
- the condenser portion 4 is open at its bottom extremity 17 where it connects to a correspondingly sized opening 19 in the top wall 7 of the horizontal evaporator portion 2 .
- the walls of the evaporator and condenser portions 2 , 4 can be hermetically sealed at their respective joining interfaces to prevent leakage of the working fluid, and to maintain partial vacuum conditions where appropriate.
- the interior surfaces 42 of the top and side walls 9 , 13 , 15 can comprise an integrally formed wick 52 , similar to that described in relation to wick 50 of the evaporator portion 2 .
- the interior surfaces 42 of the condenser portion 4 can have no wick, or only portions of the interior surfaces may be provided with a wick 52 .
- the vapor chamber 1 is oriented such that the condenser portion 4 is located above the evaporator portion 2 , it may not be required to provide wick material to the inner surfaces of the condenser portion 4 because gravity may provide the necessary force to return condensed liquid to the evaporator portion 2 .
- the evaporator portion 2 is located at or above the level of the condenser portion 4 , it will likely be appropriate to provide wick material over at least a portion of the inner surfaces 42 of the condenser portion 4 .
- the orientation of the vapor chamber may be variable, such as in aircraft or spacecraft applications, it may be appropriate to provide wick material to most or all of the interior surfaces 42 of the condenser portion 4 . It should be noted that in the preferred embodiment of the present invention, no wick structure is present in the top wall 15 of the condenser portion 4 .
- wick is provided for both the evaporator and condenser portions 2 , 4 , it can be the same material, thickness, etc. for both portions. Alternatively, different wick designs and/or materials can be used for each of the condenser and evaporator portions (or for limited areas on each), depending on the use and installed orientation of the vapor chamber 1 .
- the wicks 50 , 52 may also comprise screens or grooves integral with any of the interior surfaces 22 , 52 of the evaporator portion 2 or condenser portion 4 .
- a plastic-bonded wick can be applied simultaneously and as a contiguous structure after the structural elements of the evaporator portion 2 and condenser portion 4 are connected together. This could provide a contiguous fluid conduit between the evaporator and condenser regions of the device, which may be advantageous when the evaporator is elevated.
- a brazed wick may be formed on any of the inner surfaces of evaporator or condenser portions 2 , 4 , as desired.
- other wick structures may also be appropriate. Examples of such structures include screen bonded to the input surface by spot-welding or brazing a monolayer of powder metal, grooves cut in the surface 22 , 42 of either portion 2 , 4 , or an array of posts, either of the all-powder variety or solid copper which is powder covered, or brazed to the wall, which in a preferred embodiment would be copper material.
- the working fluid may comprise any of the well known two-phase vaporizable liquids, e.g., water, alcohol, freon, methanol, acetone, fluorocarbons or other hydrocarbons, etc.
- the vapor chamber 1 is formed according to the invention by drawing a partial vacuum within the interior spaces 3 , 5 and then back-filling with a small quantity of working fluid, e.g., just enough to saturate wick 50 just prior to final sealing of the spaces 3 , 5 by pinching, brazing, welding or otherwise hermetically sealing, once the condenser portion 4 is mounted to the evaporator portion 2 such that their openings 17 , 19 align.
- the atmosphere inside the vapor chamber 1 is set by an equilibrium of liquid and vapor.
- a heat source (not shown) is mounted to the bottom wall 11 of the evaporator portion 2 . Heat from the heat source is conducted through the wall 11 causing the working fluid in wick 50 to evaporate. The vapor travels through the inner space 5 in the condenser portion 4 , where it contacts the wick 52 and/or inner surfaces 42 of walls 9 , 13 , 15 . The vapor condenses on the walls, giving up its latent heat through condensation. The condensate then returns to the evaporator portion 2 by gravity, or through capillary action of the condenser portion wick 52 (if provided) and/or the evaporator portion wick 50 .
- FIG. 4 An alternative embodiment of a vapor chamber 10 is shown in FIG. 4 , in which the vapor chamber 10 has an evaporator portion 20 and a pair of parallel-oriented condenser portions 40 .
- the condenser portions 40 can be configured similarly to the condenser portion 40 described in relation to the vapor chamber 1 of FIGS. 1-3 , including wick materials and arrangements, etc.
- a pair of folded fin assemblies 100 , 102 can be provided on opposite sides of the condenser portion 4 of vapor chamber 1 .
- the folded fin assemblies 100 , 102 each can comprise a plurality of substantially parallel, thin fin walls 112 separated from one another by alternating flat ridges 114 and troughs 120 .
- Each pair of thin fin walls 112 are spaced apart by a flat ridge 118 so as to form each trough 120 between them.
- folded fin assemblies 100 , 102 comprises a continuous sheet of thermally conductive material folded into alternating flat ridges 114 and troughs 120 defining spaced thin fin walls 112 having peripheral end edges 122 .
- a spacer 60 can be positioned between the top wall 7 of the evaporator portion 2 and the bottom-most fin wall 112 to support the folded fin assembly at each corner of the evaporator portion 2 .
- fin walls 112 have a thickness that is no more than about 0.020′′, and in a preferred embodiment have a thickness in the range from about 0.002 to 0.020 inches.
- the thermal impedance of fin walls 112 to the conduction of thermal energy is in a range of no more than about 2.5 ⁇ 10 ⁇ 3 ⁇ c/w/cm 2 to about 2.54 ⁇ 10 ⁇ 2 ⁇ c/w/cm 2 for aluminum material. Materials other than aluminum can also be used, such as metals, polymers, etc.
- the monolithic extended geometry of the condenser portion 4 makes the folded fin assemblies 100 , 102 efficient and easy to manufacture and assemble to the vapor chamber 1 , allowing the assemblies to cool the condenser portion all along the flat length of the condenser and evaporator portions 2 , 4 . Again, this is in contrast to prior designs having multiple cylindrical “tower-type” condenser portions, which are not configured for use with simple rectangular folded fin assemblies, or which if used with such assemblies would not allow contact along the entire outer surface of the condenser portion.
- an array of plate fins 130 can be mounted to the condenser portion 4 to convey the heat to the ambient environment, similar to the folded fin arrangement.
- a forced air system can also be provided to move air through the troughs of the folded fin assemblies.
- a fan could be mounted adjacent to one end of each of the folded fin assemblies to blow air through the troughs at a desired rate.
- Other similar forced cooling arrangements could also be provided.
Abstract
Description
- This application is a continuation-in-part of application Ser. No. 10/924,586, filed on Aug. 24, 2004, which is a continuation of application Ser. No. 10/458,168, filed Jun. 10, 2003, now issued as U.S. Pat. No. 6,793,009, the entire contents of which are hereby incorporated by reference in their entirety.
- The invention relates to the management of thermal energy generated by electronic systems, and more particularly to an improved thermal vapor chamber for efficiently and cost-effectively routing and controlling the thermal energy generated by various components of an electronic system.
- The electronics industry, following Moore's Law, has seemed to be able to defy the laws of economics by providing ever increasing computing power at less cost. However, the industry has not been able to suspend the laws of physics inasmuch as high computing performance has been accompanied by increased heat generation. Board level heat dissipation has advanced to a point that several years ago was only seen at the system level. The trend toward ever increasing heat dissipation in microprocessor and amplifier based systems, such as are housed in telecommunication and server port cabinets, is becoming increasingly critical to the electronics industry. In the foreseeable future, finding effective thermal solutions will become a major constraint for the reduction of system cost and time-to-market, two governing factors between success and failure in commercial electronics sales.
- The problems caused by the increasing heat dissipation are further compounded by the industry trend toward system miniaturization—one of the main methodologies of the electronics industry to satisfy the increasing market demand for faster, smaller, lighter and cheaper electronic devices. The result of this miniaturization is increasing heat fluxes. For example, metal oxide semiconductor-controlled thyristors may generate heat fluxes from 100 to 200 W/cm2, some high voltage power electronics for military applications may generate heat fluxes of 300 W/cm2, while some laser diode applications require removal of 500 W/cm2. Also, non-uniform heat flux distribution in electronics may result in peak heat fluxes in excess of five times the average heat flux over the entire semiconductor chip surface (˜30 W/cm2).
- Thus, as clock speeds for integrated circuits increase, package temperatures will be required to correspondingly decrease to achieve lower junction temperatures. However, increasing package temperatures will result from the increase in heat dissipation in the package from higher clock speed devices. This increase in temperature will cascade throughout the interior of the structure that encloses or houses such circuits, (e.g. a typical telecommunications or server port cabinets, or the like) as the number of high power semiconductor components positioned within the housing increases. The difference between these physical aspects (i.e., the difference between the interior cabinet temperature and the package temperature) of the electronic system defines a “thermal budget” that is available for the design of the cooling devices/systems needed to manage the heat fluxes generated by the various electronic devices in the system. As these two conflicting parameters converge, the available thermal budget shrinks. When the thermal budget approaches zero, refrigeration systems become necessary to provide the requisite cooling of the electronic system.
- It is well known to those skilled in the art that thermal resistances (often referred to as “delta-T”) for typical thermal systems at the semiconductor junction-to-package, package-to-sink and sink-to-air levels have been trending up over the past decade.
- Extensive efforts in the areas of heat sink optimization (including the use of heat pipes) and interface materials development in the past have resulted in the significant reduction of sink-to-air and package-to-sink thermal resistances. However, the reduction of these two thermal resistances has now begun to approach the physical and thermodynamic limitations of the materials. On the other hand, the junction-to-package thermal resistance (delta-T) has increased recently, due to the increasing magnitude and non-uniformity (localization) of the heat generation and dissipation from the semiconductor package.
- Successful cooling technologies must deal with thermal issues at the device, device cluster, printed wiring board, subassembly, and cabinet or rack levels, all of which are within the original equipment manufacturer's (OEM's) products. Many times, the problem is further complicated by the fact that the thermal solution is many times an “after thought” for the OEM. A new equipment design may utilize the latest software or implement the fastest new semiconductor technology, but the thermal management architecture is generally relegated to the “later phases” of the new product design. The thermal management issues associated with a given electronic system are often solved by the expedient of a secondary cooling or refrigeration system that is arranged in tandem with the electronics system.
- There are several negatives associated with the use of tandem cooling or refrigeration systems. The additional electrical power required by such systems not only increases the cost to operate the electronic equipment, but also causes an adverse environmental impact in the form of pollution (from power generation processes) and noise. Reliability issues are also of considerable concern with refrigeration systems.
- Thus, there is a compound challenge in the art to provide a thermal management architecture that satisfactorily accumulates and transfers variable amounts of thermal energy, generated by a wide variety of electronic components arranged together in an enclosed space, while avoiding or minimizing the use of non-passive, tandem cooling or refrigeration systems for cooling.
- A vapor chamber is disclosed, comprising a vapor chamber portion and a heat pipe portion. Each portion can have a length measured in a first direction, a width measured in a second direction, and a height measured in a third direction. Each portion further can comprise an inner cavity having a wick structure disposed on a surface of the cavity, the inner cavities being in fluid communication with each other. The heat pipe portion can be disposed on the vapor chamber portion such that the width of the heat pipe portion is substantially smaller than the width of the vapor chamber portion and the length of the heat pipe portion is substantially equal to the length of the vapor chamber portion.
- A three-dimensional vapor chamber comprising a vapor chamber portion and a heat pipe portion. The portions each can have a respective major surface comprising a substantially rectangular shape. The portions further each can have an inner cavity comprising a wick, and the inner cavities can be in fluid communication with each other. The heat pipe portion can be connected to the vapor chamber portion such that the major surfaces are oriented substantially perpendicular to each other. Further, the lengths of the respective portions can be substantially equal as measured in a first direction, and the heights of the respective portions can be substantially different when measured in a second direction substantially orthogonal to the first direction.
- A three dimensional vapor chamber is disclosed, comprising first and second heat exchange chambers having inner cavities with wick structures disposed on respective inner surfaces thereof. The chambers can be connected together so that the inner cavities are in fluid communication with each other. The first heat exchange chamber can have a length, a width and a height as measured in first, second and third mutually orthogonal directions, respectively. The second heat exchange chamber can have a length, a width and a height as measured in the first, second and third directions. The lengths of the first and second heat exchange chambers can be substantially equal, and the widths of the first and second heat exchange chambers can be substantially unequal.
- The accompanying drawings illustrate preferred embodiments of the invention so far devised for the practical application of the principles thereof, and in which:
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FIG. 1 is a perspective view of the inventive vapor chamber assembly; -
FIG. 2 is a side view of the vapor chamber assembly ofFIG. 1 ; -
FIG. 3 is a cross-sectional view of a portion of the vapor chamber assembly ofFIG. 1 , taken along line 3-3; -
FIG. 4 is an end view of an alternative embodiment of the vapor chamber ofFIG. 1 , incorporating multiple vertical condenser portions with cooling fins mounted thereto. - This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus “lateral” and the like are to be interpreted relative to one another or relative to an axis of elongation, or an axis or center of rotation, as appropriate. Terms concerning attachments, coupling and the like, such as “connected” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. The term “operatively connected” is such an attachment, coupling or connection that allows the pertinent structures to operate as intended by virtue of that relationship. In the claims, means-plus-function clauses are intended to cover the structures described, suggested, or rendered obvious by the written description or drawings for performing the recited function, including not only structural equivalents but also equivalent structures.
- Referring to
FIGS. 1-3 , the present invention comprises a three-dimensional vapor chamber 1 that is sized and shaped to transfer thermal heat energy generated by at least one thermal energy source, e.g., a semiconductor device that is thermally engaged with a bottom surface of the vapor chamber 1. The vapor chamber 1 has ahorizontal evaporator portion 2 and avertical condenser portion 4. Thehorizontal evaporator portion 2 comprises aninner cavity 3 defined between top andbottom walls vertical condenser portion 4 can comprise aninner cavity 5 defined between opposingside walls horizontal evaporator portion 2 and thevertical condenser portion 4 are connected and hermetically sealed so that their respectiveinner cavities - The
inner cavities condenser portions inner surfaces wick 50 disposed thereon. Thewick 50 can be saturated with a working fluid, and theinner cavities bottom wall 11 of theevaporator portion 2, the working fluid (which may be saturated in the wick 50) vaporizes, and the vapor rushes to fill the vacuum in theinner cavities cooler wall surface 42, it condenses, releasing its latent heat of vaporization. The condensed fluid then returns to thehorizontal evaporator portion 2 via capillary action in thewick 50. Advantageously, employing capillary action as a fluid return mechanism allows the vapor chamber 1 to be used in any physical orientation, without respect to gravity, since capillary action can act to drive or draw the working fluid “up hill.” Thus, the device will operate effectively even if the installed upside down. It is noted that providing a wick is not critical, and thus the interior surfaces 22, 42 of the vapor chamber 1 may be provided without awick 50, particularly in gravity-aided embodiments of the invention. - Thusly configured, the three dimensional vapor chamber 1 provides a highly efficient means of spreading the heat from a concentrated source (through the
bottom wall 11 of the evaporator portion 2) to a large surface (the interior surfaces 22, 42 of theinterior spaces 3, 5). Furthermore, the thermal resistance associated with the aforementioned vapor spreading is negligible as compared to traditional heat sinks. Further, the present design will provide increased cooling performance as compared to typical vapor chamber designs which use multiple discrete cylindrical “tower-type” condenser portions. This is because the present design maximizes the cooling area (i.e. the wick-wall area), and also the volume, of the condenser portion by extending it all the way across the length l of theevaporator portion 2. The “T-shape” of the present invention is also expected to perform better than vapor chambers incorporating multiple cylindrical “tower-type” condenser portions because thecondenser portion 4 of the present design retains a substantial vertical dimension even if placed on its side. Vapor chambers utilizing multiple cylindrical “tower-type” condenser portions typically are of limited to use in the vertical orientation, and also are limited in the amount of wick-wall area available for cooling. The present design provides substantially more wick-wall area and vapor space than prior devices, thus providing increased device efficiency. - The present invention is also expected to be less expensive and easier to manufacture than the prior designs, since the assembly process will require the attachment of a single condenser portion 4 (by welding, brazing or soldering) to the
evaporator portion 2, rather than having to attach a multiplicity of individual small towers. - The top and
bottom walls horizontal evaporator portion 2 can comprise substantially uniform thickness sheets of a thermally conductive material, and can be spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to form theinterior space 3 that defines theevaporator portion 2. The top andbottom walls inner surfaces 22, either or both of which can have an integrally formedwick 50 as previously noted. In one embodiment, sintered copper powder or felt metal wick structure, having an average thickness of about 0.5 mm to 2.0 mm is positioned over substantially all of the inner surface ofbottom wall 11 so as to formwick 50. Of course, other wick materials, such as, aluminum-silicon-carbide or copper-silicon-carbide may also be used. - As previously described, to increase the thermal performance of the
horizontal evaporator portion 2, avertical condenser portion 4 is connected to theevaporator portion 2. More particularly, thevertical condenser portion 4 comprises a flat rectangular structure similar to that of theevaporator portion 2. Specifically, first andsecond side walls inner space 5 that defines thecondenser portion 4. Theside walls inner surfaces 42, while thetop wall 15 is also substantially planar. Thecondenser portion 4 is open at itsbottom extremity 17 where it connects to a correspondinglysized opening 19 in thetop wall 7 of thehorizontal evaporator portion 2. - The walls of the evaporator and
condenser portions - The interior surfaces 42 of the top and
side walls wick 52, similar to that described in relation towick 50 of theevaporator portion 2. Alternatively, the interior surfaces 42 of thecondenser portion 4 can have no wick, or only portions of the interior surfaces may be provided with awick 52. For example, where the vapor chamber 1 is oriented such that thecondenser portion 4 is located above theevaporator portion 2, it may not be required to provide wick material to the inner surfaces of thecondenser portion 4 because gravity may provide the necessary force to return condensed liquid to theevaporator portion 2. On the other hand, if theevaporator portion 2 is located at or above the level of thecondenser portion 4, it will likely be appropriate to provide wick material over at least a portion of theinner surfaces 42 of thecondenser portion 4. For applications in which the orientation of the vapor chamber may be variable, such as in aircraft or spacecraft applications, it may be appropriate to provide wick material to most or all of the interior surfaces 42 of thecondenser portion 4. It should be noted that in the preferred embodiment of the present invention, no wick structure is present in thetop wall 15 of thecondenser portion 4. - Where a wick is provided for both the evaporator and
condenser portions - In addition to the wick materials and configurations previously discussed, the
wicks evaporator portion 2 orcondenser portion 4. Further, a plastic-bonded wick can be applied simultaneously and as a contiguous structure after the structural elements of theevaporator portion 2 andcondenser portion 4 are connected together. This could provide a contiguous fluid conduit between the evaporator and condenser regions of the device, which may be advantageous when the evaporator is elevated. - In a further embodiment, a brazed wick may be formed on any of the inner surfaces of evaporator or
condenser portions surface portion - The working fluid may comprise any of the well known two-phase vaporizable liquids, e.g., water, alcohol, freon, methanol, acetone, fluorocarbons or other hydrocarbons, etc.
- The vapor chamber 1 is formed according to the invention by drawing a partial vacuum within the
interior spaces wick 50 just prior to final sealing of thespaces condenser portion 4 is mounted to theevaporator portion 2 such that theiropenings - In practice, a heat source (not shown) is mounted to the
bottom wall 11 of theevaporator portion 2. Heat from the heat source is conducted through thewall 11 causing the working fluid inwick 50 to evaporate. The vapor travels through theinner space 5 in thecondenser portion 4, where it contacts thewick 52 and/orinner surfaces 42 ofwalls evaporator portion 2 by gravity, or through capillary action of the condenser portion wick 52 (if provided) and/or theevaporator portion wick 50. - An alternative embodiment of a
vapor chamber 10 is shown inFIG. 4 , in which thevapor chamber 10 has anevaporator portion 20 and a pair of parallel-orientedcondenser portions 40. Thecondenser portions 40 can be configured similarly to thecondenser portion 40 described in relation to the vapor chamber 1 ofFIGS. 1-3 , including wick materials and arrangements, etc. - Referring again to
FIG. 1 , a pair of foldedfin assemblies condenser portion 4 of vapor chamber 1. The foldedfin assemblies thin fin walls 112 separated from one another by alternating flat ridges 114 andtroughs 120. Each pair ofthin fin walls 112 are spaced apart by aflat ridge 118 so as to form eachtrough 120 between them. Thus foldedfin assemblies troughs 120 defining spacedthin fin walls 112 having peripheral end edges 122. Aspacer 60 can be positioned between thetop wall 7 of theevaporator portion 2 and thebottom-most fin wall 112 to support the folded fin assembly at each corner of theevaporator portion 2. Advantageously,fin walls 112 have a thickness that is no more than about 0.020″, and in a preferred embodiment have a thickness in the range from about 0.002 to 0.020 inches. In this way, the thermal impedance offin walls 112 to the conduction of thermal energy is in a range of no more than about 2.5×10−3 ÿc/w/cm2 to about 2.54×10−2 ÿc/w/cm2 for aluminum material. Materials other than aluminum can also be used, such as metals, polymers, etc. - The monolithic extended geometry of the
condenser portion 4 makes the foldedfin assemblies evaporator portions - Alternatively as shown in
FIG. 4 , an array ofplate fins 130 can be mounted to thecondenser portion 4 to convey the heat to the ambient environment, similar to the folded fin arrangement. - A forced air system can also be provided to move air through the troughs of the folded fin assemblies. For example, a fan could be mounted adjacent to one end of each of the folded fin assemblies to blow air through the troughs at a desired rate. Other similar forced cooling arrangements could also be provided.
- Accordingly, it should be understood that the embodiments disclosed herein are merely illustrative of the principles of the invention. Various other modifications may be made by those skilled in the art which will embody the principles of the invention and fall within the spirit and the scope thereof.
Claims (20)
Priority Applications (1)
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US11/079,852 US20050173098A1 (en) | 2003-06-10 | 2005-03-14 | Three dimensional vapor chamber |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US10/458,168 US6793009B1 (en) | 2003-06-10 | 2003-06-10 | CTE-matched heat pipe |
US10/924,586 US7048039B2 (en) | 2003-06-10 | 2004-08-24 | CTE-matched heat pipe |
US11/079,852 US20050173098A1 (en) | 2003-06-10 | 2005-03-14 | Three dimensional vapor chamber |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/924,586 Continuation-In-Part US7048039B2 (en) | 2003-06-10 | 2004-08-24 | CTE-matched heat pipe |
Publications (1)
Publication Number | Publication Date |
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US20050173098A1 true US20050173098A1 (en) | 2005-08-11 |
Family
ID=46304125
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US11/079,852 Abandoned US20050173098A1 (en) | 2003-06-10 | 2005-03-14 | Three dimensional vapor chamber |
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