US20050183763A1 - Thermoelectric generation system utilizing a printed-circuit thermopile - Google Patents
Thermoelectric generation system utilizing a printed-circuit thermopile Download PDFInfo
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- US20050183763A1 US20050183763A1 US10/786,412 US78641204A US2005183763A1 US 20050183763 A1 US20050183763 A1 US 20050183763A1 US 78641204 A US78641204 A US 78641204A US 2005183763 A1 US2005183763 A1 US 2005183763A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
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Abstract
A thermoelectric generation system (26) is presented. A plurality of PC thermopiles (24), each consisting of a substrate having a plurality of thermocouples (TC), are coupled together by a backplane (42) to form a thermoarray (TA) capable of producing a desired voltage (ETA) at a desired current (ITA). Each thermocouple (TC) is formed of a first trace (28) formed of a first conductor (20) upon a first surface (32) of the substrate (30) and a second trace (34) formed of a second conductor (22) upon a second surface (36) of the substrate (30). A first junction (J1) formed between the first and second traces (28,34) is maintained at substantially a first temperature (T1), and a second junction (J2) formed between the first and second traces (28,34) is maintained at substantially a second temperature (T2), so that each thermocouple (TC) generates a voltage (ETC) and a current (ITC) These voltages (ETC) and currents (ITC) are concatenated to achieve the desired voltage (ETA) and current (ITA)
Description
- The present invention relates to the field of electrical generation. More specifically, the present invention relates to the field of electrical generation utilizing the Seebeck effect.
- A majority of electrical generation systems conventionally use mechanical energy to drive a magnetic generator and produce the desired electrical energy. This mechanical energy may be natural or produced, but in all case requires conversion prior to use. This conversion of energy results in a marked loss of efficiency in such a system.
- In thermo-mechanical generation systems, thermal energy is used to produce steam. The steam in turn drives a turbine to produce rotary mechanical energy. The rotary mechanical energy is then used to drive a conventional magnetic generator to produce the electricity. Since each step in this process has losses, the resultant electrical energy represents only a fraction of the applied thermal energy. The thermal energy required of a thermo-mechanical generation system may be produced by the burning of a fossil or nuclear fuel, obtained from the concentration of solar energy, or obtained directly from geothermal activity. The source of the thermal energy for a thermo-mechanical generation system is irrelevant to the generation process.
- In “natural” mechanical generation systems, a substantially linear or reciprocation mechanical energy is applied to a turbine to produce the requisite rotary mechanical energy to drive the conventional magnetic generator. Examples of “natural” mechanical generation systems are hydrodynamic, wind, and tidal systems.
- A problem with all such mechanical generation systems is that they are mechanical and complex. That is, they contain moving parts and often require a sophisticated infrastructure for operation. With a conventional fossil-fuel generation system, the generation system comprises a sophisticated concatenation of mechanical systems is required. In addition, a highly complex infrastructure for the acquisition and shipment of the fossil fuel, and of the disposal of the resultant “ash,” is required above and beyond the generation system itself.
- Solar photovoltaic generation systems have no moving parts and therefore present a viable alternative source of electrical energy. Unfortunately, solar systems of all types are subject to diurnal, climatological, and meteorological limitations. Because of this, solar system typically have electrochemical storage devices (e.g., batteries) to compensate for the day-night cycle, the changing of the seasons, and adverse weather. These devices, while not having the complex moving parts of the mechanical systems, have their own limitations and problems.
- Ideally, an electrical generation system should be simple in structure, have no moving parts, and be immune to diurnal, climatological, and meteorological effects.
- Accordingly, it is an advantage of the present invention that a thermoelectric generation system utilizing a printed-circuit thermopile is provided.
- It is another advantage of the present invention that a thermoelectric generation system is provided that is immune to diurnal, climatological, and meteorological effects.
- It is another advantage of the present invention that a thermoelectric generation system is provided that has no moving parts.
- It is another advantage of the present invention that a thermoelectric generation system is provided that is readily adaptable to variant energy needs.
- The above and other advantages of the present invention are carried out in one form by a printed-circuit thermopile formed of a printed-circuit substrate having a first surface and a second surface, and having a first thermal portion and a second thermal portion, a plurality of first traces, wherein each of the first traces is formed of a first metal and extends between the first and second thermal portions upon the first surface, a plurality of second traces, wherein each of the second traces is formed of a second metal and extends between the first and second thermal portions upon the second surface, a plurality of first junctions, wherein each of the first junctions couples one of the first traces with one of the second traces in the first thermal portion, and a plurality of second junctions, wherein each of the second junctions couples one of the first traces with one of the second traces in the second thermal portion, and wherein each of the second junctions is in series with one of the first junctions.
- The above and other advantages of the present invention are carried out in one form by a thermoelectric generation system configured to provide electrical energy at a predetermined voltage and current, and incorporating a plurality of printed-circuit thermopiles and a backplane coupled to and configured to electrically connect the thermopiles to provide the electrical energy.
- A more complete understanding of the present invention may be derived by referring to the detailed description and claims when considered in connection with the Figures, wherein like reference numbers refer to similar items throughout the Figures, and:
-
FIG. 1 shows a schematic view of a closed-loop type-T thermocouple; -
FIG. 2 shows a chart depicting a temperature versus output curve for a type-T thermocouple; -
FIG. 3 shows a schematic view of a static model of the closed-loop thermocouple ofFIG. 1 ; -
FIG. 4 shows a schematic view of an open-loop type-T thermocouple; -
FIG. 5 shows a schematic view of a static model of a the open-loop thermocouple ofFIG. 3 under load; -
FIG. 6 shows a schematic view of a series thermopile in accordance with a preferred embodiment of the present invention; -
FIG. 7 shows a schematic view of a parallel thermopile in accordance with a preferred embodiment of the present invention; -
FIG. 8 shows a schematic view depicting a composite thermopile in accordance with a preferred embodiment of the present invention; -
FIG. 9 shows a schematic view of an exemplary thermopile in accordance with a preferred embodiment of the present invention; -
FIG. 10 shows a front view of a printed-circuit thermopile in accordance with a preferred embodiment of the present invention; -
FIG. 11 shows an end view of a plurality of printed-circuit thermopiles arranged as a thermoelectric generation system in accordance with a preferred embodiment of the present invention; -
FIG. 12 shows a cross-sectional view of the printed-circuit thermopile ofFIG. 10 taken at line 12-12 and demonstrating an overlap junction in accordance with a first preferred embodiment of the present invention; -
FIG. 13 shows a cross-sectional view of the printed-circuit thermopile ofFIG. 10 taken at line 12-12 and demonstrating a filled junction in accordance with a second preferred embodiment of the present invention; -
FIG. 14 shows a cross-sectional view of the printed-circuit thermopile ofFIG. 10 taken at line 12-12 and demonstrating a pin junction in accordance with a third preferred embodiment of the present invention; and -
FIG. 15 shows a cross-sectional view of the printed-circuit thermopile ofFIG. 10 taken at line 12-12 and demonstrating a heat-sink junction in accordance with a fourth preferred embodiment of the present invention. -
FIG. 1 shows a schematic view of a type-T closed-loop thermocouple TC[C]. In its simplest form, a thermocouple TC is made up of afirst conductor 20 formed of a first metal and asecond conductor 22 formed of a second, dissimilar metal. First andsecond conductors - In the preferred embodiment of
FIG. 1 , thermocouple TC is a type-T or copper-constantan thermocouple. That is,first conductor 20 is formed of copper (Cu), andsecond conductor 22 is formed of the copper-nickel alloy constantan (Cu/Ni). Those skilled in the art will appreciate, however, that a copper-constantan thermocouple is not a requirement of the present invention, and that other materials may be used for either first orsecond conductor - When first junction J1 is at a first temperature T1 and second junction J2 is at a second temperature T2, then a voltage ETC is generated between first and second junctions J1 and J2. This generation of voltage ETC is known as the Seebeck effect. The value of voltage ETC is a function of:
T TC =|T 1 −T 2|, and (1)
E TC =S×T TC, (2)
where: -
- ETC is the differential temperature across thermocouple TC; and
- S is the Seebeck coefficient for thermocouple TC.
-
FIG. 2 shows a chart depicting a temperature versus output curve for thermocouple TC. The following discussion refers toFIGS. 1 and 2 . - Seebeek coefficient S for a given thermocouple type changes with temperature. However, for a given thermocouple TC, coefficient S may be approximately linear for a given differential temperature TTC.
- In
FIG. 2 it may be seen that, when first junction J1 is at a first temperature T1 of 0° C. and second junction J2 is at a second temperature T2 of 100° C., a type-T thermocouple TC has a differential temperature TTC of 100° C. and produces a voltage ETC of 4.279 mV. Over this range, therefore, coefficient S is ≈42.79 μV/° C. - In the preferred embodiment, thermocouple TC is a type-T copper-constantan thermocouple. A type-T thermocouple is formed of copper and constantan. Copper is an elemental metal having a low electrical resistivity. Constantan (a.k.a. 55/45 constantan, ferry, hecnum, and telconstan) is an alloy of 53.8% copper, 44.2% nickel, 1.5% manganese, and 0.5% iron, having a high electrical resistance and a low temperature coefficient. Copper and constantan have the relevant characteristics depicted in table 1:
TABLE 1 Characteristics of Copper and Constantan Property @ 20° C. Copper Constantan Units Temperature Coefficient +0.0043 ±0.00002 K−1 Electrical Resistivity 1.69 52.0 μΩ cm 10.164 312.75 Ω/CMF Density 8.96 8.9 g cm−3 Coefficient of Thermal Expansion 17.0 14.9 ×10−6 K−1 Thermal Conductivity 401 19.5 W m−1 K−1 - With the understanding that other type of thermocouples and/or other temperatures may be used, this discussion will hereinafter assume for the sake of simplicity that thermocouple TC is a type-T copper-constantan thermocouple, that
first conductor 20 is formed of copper, thatsecond conductor 22 is formed of constantan, that first junction J1 is at a first temperature T1 of 0° C., that second junction J2 is at a second temperature T2 of 100° C., that differential (thermocouple temperature TTC is 100° C., and that thermocouple voltage ETC is 4.279 mV. -
FIG. 3 shows a schematic view of a static model of closed-loop thermocouple TC[C]. The following discussion refers toFIGS. 1 and 3 . - Since thermocouple TC[C] is a closed loop with voltage ETC expressed between junctions J1 and J2, thermocouple TC[C] represents a closed circuit. Voltage ETC causes a current ITC to flow through this closed circuit, i.e., through thermocouple TC[C]. By Ohm's law:
where: -
- RTC is the resistance of thermocouple TC[C];
- RCu is the resistance of
copper conductor 20, and - RCu/Ni is the resistance of
constantan conductor 22.
- As discussed hereinbefore, copper has a resistivity of 1.69 μΩ cm (i.e., 1.69×10−6 ohms for a conductor having a cross-section area of 1 square centimeter and a length of 1 centimeter). This equates to 10.164 Ω/CMF (i.e., 10.164 ohms for a conductor having a cross-sectional area of 1 circular mil and a length of 1 foot). Similarly, constantan has a resistivity of 52.0 μΩ cm or 312.75 Ω/CMF. This means that constantan has approximately 30.8 times the resistivity of copper.
-
FIG. 4 shows a schematic view of an open-loop type-T thermocouple TC[0], andFIG. 5 shows a schematic view of a static model of an open-loop thermocouple TC[0] under load. The following discussion refers toFIGS. 1, 2 , 4, and 5. - A closed-loop thermocouple TC[C] serves no purpose (other than an instructional purpose) because both voltage ETC and current ITC are isolated from the real world. However, if either of first or
second conductors - Open-loop thermocouple TC[0] represents an open circuit. There is, therefore, no current ITC flowing through open-loop thermocouple TC[0] (as depicted in
FIG. 4 ). Since there is no current ITC, voltage ETC is present at the ends of the opened conductor. A theoretical infinite-resistance voltage-measuring device (not shown) could be coupled to the opened ends and measure voltage ETC. Having an infinite resistance, the voltage-measuring device does not close the circuit through thermocouple TC[0] and current ITC remains at zero. The voltage-measuring device could then determine voltage ETC with great accuracy. The Seebeck effect for specific thermocouples is well known. Therefore, differential thermocouple temperature TTC may also be determined with great accuracy. If one of the junction temperatures T1 or T2 is known, then the other may be determined. For example, if temperature T1 of junction J1 is known to be 0° C. and thermocouple voltage ETC is measured to be 4.279 mV, then temperature T2 of junction J2 must be 100° C. Indeed, use as a temperature-measuring device is the most common conventional use of thermocouple TC. - Those skilled in the art will appreciate that an infinite-resistance voltage measuring device does not exist, and that, in practice, the voltage measuring device must have some resistance. Since it is desirable that the measuring device measure voltage ETC as accurately as possible, it is desirable that the resistance of the measuring device, a load resistance RL in
FIG. 5 , be as high as possible. A current IL through a loaded thermocouple TC[L] would then be a function of thermocouple resistance RTC in series with load resistance RL: - If load resistance RL is very much (e.g., several orders of magnitude) higher than thermocouple resistance RTC, then thermocouple resistance RTC is negligible and current IL becomes substantially a function of load resistance RL:
- Voltage ETC is proportionately expressed across thermocouple resistance RTC and load resistance RL in series. By Kirchhoff's law, we know:
E TC =E TR +E L, (6)
where: -
- ETR is the voltage expressed across thermocouple resistance RTC, and
- EL is the voltage expressed across load resistance RL.
- Since load resistance RL is very much greater than thermocouple resistance RTC, then thermocouple resistance RTC is negligible:
E TC =E TR +E L ≅E L, (7) - In the case of use as a measuring device, therefore, it is desirable to have current IL through loaded thermocouple TC[L] as low as possible. When thermocouple TC is to be used as an electrical generation device, however, it is desirable that the energy generated be as high as possible. This necessitates that, for a give voltage ETC, current ITC be as high as possible.
- For a given loaded thermocouple TC[L], current IL has a maximum value when load resistance RL is zero, i.e., when thermocouple TC is a closed-loop thermocouple TC[C]. It is therefore desirable that load resistance RL be very much (e.g., several orders of magnitude) lower than thermocouple resistance RTC. In this case, load resistance RL becomes negligible and current IL becomes substantially a function of thermocouple resistance RTC:
- For the sake of simplicity, the remainder of this discussion presumes that all thermocouples TC are type-T thermocouples having substantially identical resistances RTC, that all temperatures T1 are substantially identical, that all differential thermocouple temperatures TTC are substantially identical, that all thermocouple voltages ETC are substantially identical, and that all thermocouple zero-load currents ITC are substantially identical. Furthermore, it is assumed that all load resistances RL for any thermocouple TC or any combination of thermocouples TC is substantially zero. Those skilled in the art will appreciate that these conventions are exemplary only, and have no bearing in reality.
-
FIGS. 6, 7 , and 8 show schematic views of thermopiles in accordance with a preferred embodiment of the present invention, whereFIG. 6 depicts a series thermopile TP[S],FIG. 7 depicts a parallel thermopile TP[P], andFIG. 8 depicts a composite thermopile (thermoarray) TA. The following discussion refers toFIGS. 4 through 8 . - Thermocouples TC may be concatenated to form a thermopile TP.
FIG. 6 depicts N thermocouples TC(n) connected in series to form a series thermopile TP[S]. Since thermocouples TC(1) through TC(N) are connected in series, their voltages ETC(1) through ETC(N) are summed and their currents ITC(1) through ITC(N) are not:
E TP[S] =E TC(1) +E TC(2) + . . . +E TC(N), (9)
ITP[S] =I TC(1) =I TC(2) = . . . =I TC(N), (10)
where: -
- N is an integer greater than 1,
- n is an integer between 1 and N, inclusively,
- ETC(n) is the voltage of thermocouple TC(n),
- ITC(n) is the current of thermocouple TC(n),
- ETP[S] is the voltage of series thermopile TP[S], and
- ITP[S] is the current of series thermopile TP[S].
- This means that for a given series thermopile TP[S] having N thermocouples TC(n), thermopile voltage ETP[S] is:
E TP[S] =N×E TC(n), (11)
but the thermopile current ITP[S] is limited to the current ITC(n) of any one thermocouple TC(n). - Similarly,
FIG. 7 depicts M thermocouples TC(m) connected in parallel to form a parallel thermopile TP[P]. Since thermocouples TC(1) through TC(M) are connected in parallel, their currents ITC(1) through ITC(M) are summed and their voltages ETC(1) through ETC(M) are not:
E TP[P] =E TC(1) =E TC(2) = . . . =E TC(M), (12)
I TP[P] =I TC(1) +I TC(2) + . . . +I TC(M), (13)
where: -
- M is an integer greater than 1,
- m is an integer between 1 and M, inclusively,
- ETC(m) is the voltage of thermocouple TC(m),
- ITC(m) is the current of thermocouple TC(m),
- ETP[P] is the voltage of parallel thermopile TP[P], and
- ITP[P] is the current of parallel thermopile TP[P].
- This means that for a given parallel thermopile TP[P] having M thermocouples TC(m), thermopile current ITP[P] is:
E TP[P] =M×E TC(m), (14)
but the thermopile voltage ETP[P] is limited to the voltage ETC(m) of any one thermocouple TC(m). -
FIG. 8 depicts a composite thermopile (i.e., a thermoarray) TA of M thermopiles TP(m) connected in parallel, where each thermopile TP(m) contains N thermocouples TC(n,m) connected in series. In this arrangement, a voltage ETA of thermoarray TA is substantially equal to voltages ETP(m) of each thermopile TP(m), where voltage ETP(m) of each thermopile TP(m) is substantially equal to a sum of voltages ETC(n,m) of each thermocouple TC(n,m) in thermopile TP(m). Similarly, current ITA of thermoarray TA is substantially equal to a sum of currents ITP(m) of each thermopile TP(m), where current ITP(m) of each thermopile TP(m) is substantially equal to current ITC(n,m) of each thermocouple TC(n,m) in thermopile TP(m). This may be expressed as:
E TA =E TP(1) =E TC(2) = . . . =E TC(M), (15)
E TP(m) =E TC(1,m) +E TC(2,m) + . . . +E TC(N,m), (16)
I TA =I TP(1) +I TP(2) + . . . +I TP(M), and (17)
I TP(m) =I TC(1,m) =I TC(2,m) = . . . =I TC(N,m). (18) - This means that for a given thermoarray TA containing M thermopiles TP(m) in parallel, with each thermopile TP(m) containing N thermocouples TC(n) in series, voltage ETA and current ITA of thermoarray TA are:
E TA =N×E TC(n,m), (19)
I TA =M×I TC(n,m). (20) - By creating a large enough thermoarray, any desired voltage ETA and current ITA may be supplied. In the preferred embodiment, for example, it is desirable that ≈165 Vdc at ≈21 A (i.e., ≈3.5 kW) be generated. To produce ≈165 V requires 38,560 thermocouples TC connected in series. Assuming, for the sake of discussion, that each thermocouple TC has a resistance of 10 mΩ, then each thermocouple is capable of producing 427.9 mA. To produce ≈21 A requires 49 thermocouples TC in parallel. To produce ≈165 V at ≈21 A therefore requires that thermoarray TA be an array of 1,889,440 (38,560×49) thermocouples TC. In practice, these numbers would most likely be rounded up to 2,000,000 (40,000×50) thermocouples TC.
-
FIG. 9 shows a schematic view of an exemplary thermopile TP.FIG. 10 shows a front view of a printed-circuit (PC)thermopile 24, andFIG. 11 shows an end view of a plurality ofPC thermopiles 24 arranged as a portion of athermoelectric generation system 26 in accordance with a preferred embodiment of the present invention. The following discussion refers toFIGS. 4 and 8 through 11. - In order to make practical such a large thermoarray TA, it is desirable that thermopiles TP of very high density be realized. In the preferred embodiment, this is achieved through the use of a multiplicity of
PC thermopiles 24. - Each
PC thermopile 24 is desirably configured to have a high-density serial thermopile TP[S] arranged upon asubstrate 30. Desirably,PC thermopile 24 would havetraces 28 offirst conductor 20 upon afirst surface 32 ofsubstrate 30, andsecond traces 34 ofsecond conductor 22 upon a second surface 36 ofsubstrate 30, with through-substrate “pads” forming the requisite junctions J1 and J2 for each thermocouple. This approach is demonstrated schematically inFIG. 9 , which is essentially an X-ray view of the traces. InFIG. 9 , all solid lines represent first traces 28 onfirst surface 32, all dotted lines represent second traces 34 on second surface 36, and all solid dots represent couplings 38 (discussed in more detail hereinafter) which pass throughsubstrate 30 and form junctions J1 and J2. -
FIG. 10 depictsfirst surface 32 of anexemplary PC thermopile 24. When first traces 28 onfirst surface 32 are coupled withsecond traces 34 on second surface 36 (not shown inFIG. 10 ) throughcouplings 38, 96 serially-connected thermocouples TC will be formed as perFIG. 9 . Aboard connector 40 at one edge ofPC thermopile 24 provides a way to connectPC thermopiles 24 together. - Those skilled in the art will appreciate that
FIG. 9 is highly simplified for clarity. In practice, it would be well within the current sate of the art to producePC thermopile 24 with 1000 thermocouples TC. To producePC thermopile 24 with any given number of thermocouples TC does not depart from the spirit of the present invention. -
FIG. 11 depicts a plurality ofPC thermopiles 24 coupled to abackplane 42 to form an exemplary portion ofgeneration system 26. In the preferred embodiment ofFIG. 11 , backplane is made up of a printedcircuit board 44 having a plurality ofbackplane connectors 46. In use,board connector 40 of onePC thermopile 24 is connected to eachbackplane connector 46.Backplane 42 contains traces (not shown) interconnectingPC thermopiles 24. - Those skilled in the art will appreciate that
FIG. 11 is also highly simplified for clarity. In practice,backplane 42 may be one of a plurality ofbackplanes 42 interconnected to provide the desired thermoarray TA. For example, to produce the previously discussed array of 40,000×50 thermocouples TC when eachPC thermopile 24 contains 1000 thermocouples TC, 50backplanes 42 may be connected in parallel, where eachbackplane 42 has 40backplane connectors 46 connected in series. This would allow eachbackplane connector 46 to be connected to one of 2000PC thermopile 24, and would produce the desired array of 2,000,000 series/parallel thermocouples TC. - Those skilled in the art will appreciate that arrangements of thermocouples TC and
PC thermopiles 24 other than those exemplified hereinbefore for the preferred embodiments may be realized without departing from the spirit of the present invention. - In
FIGS. 10 and 11 ,connectors -
FIGS. 12 through 15 show cross-sectional views ofPC thermopile 24 taken at line 12-12 ofFIG. 10 in accordance with alternative embodiments of the present invention. The following discussion refers toFIGS. 10 through 15 . -
FIG. 12 demonstrates the use of a plated-through hole and an overlap to form a physical junction 48 (i.e., either junction J1 or J2). In this embodiment, ahole 50 is made throughsubstrate 30 at the desired location of each physical junction 48 (i.e., at the location of each junction J1 and J2). Eachhole 50 is then plated with copper, thereby making each hole 50 a copper plated-throughhole 52 that extends fromfirst surface 32 to second surface 36. Copper traces 28, includingcopper pads 54, are then etched or deposited uponfirst surface 32 ofsubstrate 30, while onlycopper pads 54 are etched or deposited upon second surface 36. Opposingcopper pads 54 conductively combine with plated-throughholes 52 to formcouplings 38.Couplings 38 extend copper traces 28 fromfirst surface 32 to second surface 36 ofsubstrate 30. Constantan traces 34 are then deposited upon second surface 36 ofsubstrate 30.Physical junctions 48 are formed atcouplings 38 wherever constantan traces 34 come into contact withcopper pads 54 upon second surface 36. -
FIG. 13 demonstrates the use of a filled plated-through hole to formphysical junction 48. In this embodiment,hole 50 is again made throughsubstrate 30 and plated with copper to form a copper plated-throughhole 52 extending fromfirst surface 32 to second surface 36 at the desired location of eachphysical junction 48. Copper traces 28, includingcopper pads 54, are etched or deposited only uponfirst surface 32 ofsubstrate 30. Constantan traces 34, includingconstantan pads 56, are etched or deposited upon second surface 36.Copper pads 54, plated-throughholes 52, andconstantan pads 56 together formcouplings 38.Physical junctions 48 are formed withincouplings 38 whereverconstantan pads 56 come into contact with copper plated-throughholes 52 at second surface 36. -
Copper pads 54 onfirst surface 32 conductively combine with plated throughholes 52. This is not necessarily the case withconstantan pads 56, which may form weak electrical bonds with copper plated-through holes 52. This problem may be eliminated by filling plated-through holes with a connection conductor 58 (typically solder), which does form a strong electrical bond with both copper and constantan. -
FIG. 14 demonstrates the use of a pin to form physical junction. In this embodiment,hole 50 is made throughsubstrate 30, but not plated. Copper traces 28, includingcopper pads 54, are etched or deposited uponfirst surface 32 ofsubstrate 30, and constantan traces 34, includingconstantan pads 56, are etched or deposited upon second surface 36. Apin 60 is passed through eachhole 50 and electromechanically affixed tocopper pads 54 uponfirst surface 32 andconstantan pads 56 upon second surface 36 (typically by soldering).Pins 60 are formed of a pin conductor 62 (typically copper).Copper pads 54, pins 60, andconstantan pads 56 together formcouplings 38.Physical junctions 48 are formed wherever pins 60 come into contact withconstantan pads 56. -
FIG. 15 demonstrates the use of a pin incorporating a heat sink to form physical junction. This embodiment is substantially identical to the embodiment ofFIG. 14 (discussed hereinbefore) save thatpin 60 is extended and flared upon on side to form aheat sink 64.Heat sink 64 serves to better maintain the temperature ofphysical junction 48 at the temperature of the surrounding medium (discussed hereinafter). Those skilled in the art will appreciate that the shape ofheat sink 64 is irrelevant to this discussion. The use of any given shape does not depart from the spirit of the present invention. - The following discussion refers to
FIGS. 4, 8 , 10 and 11. - In order for
PC thermopile 24 to produce electricity, the junctions J1 and J2 of each thermocouple TC must be at different temperatures. OnPC thermopile 24, junctions J1 and J2 are realized asphysical junctions 48 located substantially atcouplings 38.Physical junctions 48 are divided into afirst junction group 66 containing all junctions J1 and asecond junction group 68 containing all junctions J2.First junction group 66 is located on a firstthermal portion 70 ofsubstrate 30. Similarly,second junction group 68 is located on a secondthermal portion 72 ofsubstrate 30. - During operation, first thermal portion 70 (i.e., all junctions J1) is maintained at temperature T1 (e.g., 0° C.), and second thermal portion 72 (i.e., all junctions J2) is maintained at temperature T2 (e.g., 100° C.). In this manner, each thermocouple TC produces voltage ETC at current ITC, which together produce voltage ETP at current ITP as an output of
PC thermopile 24. - In the preferred embodiment, all junctions J1 in first
thermal portion 70 are maintained at temperature T1 by surrounding firstthermal portion 70 of eachPC thermopile 24 with agas bath 74. The arrangement ofPC thermopiles 24 ingeneration system 26 is desirably such thatgas bath 74 may be a flow of nonconductive gas (e.g., air).gas bath 74 would therefore be able to cool (i.e., remove heat from) junctions J1 and maintain a stable temperature T1 thereat. The use of pins 60 (FIGS. 14 and 15 ) at junctions J1 increases the mass of junctions J1, thereby improving thermal stability. The use ofheat sinks 64 on pins 60 (FIG. 15 ) further increases mass and significantly improves heat transfer. - Similarly, in the preferred embodiment, all junctions J2 in second
thermal portion 72 are maintained at temperature T2 by surrounding secondthermal portion 72 of eachPC thermopile 24 with aliquid bath 76. The arrangement ofPC thermopiles 24 ingeneration system 26 is desirably such thatliquid bath 76 may be a flow of heated nonconductive liquid (e.g., oil).Liquid bath 76 would therefore be able to heat (i.e., pass heat into) junctions J2 and maintain a stable temperature T2 thereat. Again, the use ofpins 60 at junctions J2 increases the mass of junctions J2 and improves thermal stability. The use ofheat sinks 64 onpins 60 further increases mass and significantly improves heat transfer. - Those skilled in the art will appreciate that while the preferred embodiment uses
gas bath 74 andliquid bath 76, this is not a requirement of the present invention. For example, twogas baths 74 at dissimilar temperatures may be used without departing from the spirit of the present invention. -
Gas bath 74 andliquid bath 76 are separated by aninsulator 78.Insulator 78 is desirably designed to surround eachPC thermopile 24 and thermally isolate first andsecond portions - In the preferred embodiment,
liquid bath 76 is hotter thangas bath 74. This is not a requirement of the present invention, and gas andliquid baths - Since the entirety of
thermoelectric generation system 26 has no moving parts, functional life expectancy becomes essentially the life expectancy of the material used. With proper material selection, this could be decades. - Throughout this discussion it was assumed that the materials used for thermocouples TC were copper and constantan. These materials were desirable for their stability, resistance to progressive corrosion, and low cost. It will be appreciated that other materials may be desirable when other factors are considered. For example, if the requisite heat is available only in a corrosive environment, then platinum and platinum/rubidium may be desirable for thermocouples TC.
- Also throughout this discussion, temperatures T1 and T2 were assumed to be 0° C. and 100° C., respectively (i.e., the freezing and boiling points of water). This assumption was made for convenience only, and any two dissimilar temperatures may be used. It will be appreciated that the greater the difference between temperatures T1 and T2, the more
efficient generation system 26 will become. Also, it will be appreciated that the “cold” temperature T1 need not be cold in the literal sense, but only colder than temperature T2. For example,generation system 26 would operate quite well were temperature T1 to be 100° C. and temperature T2 to be 350° C. Naturally, proper selection of all materials (e.g., the composition of substrate 30) for the intended temperatures T1 and T2 would be required. - In summary, the present invention teaches a
thermoelectric generation system 26 utilizingPC thermopiles 24. Though the use ofPC thermopiles 24, otherwise-wasted heat derived from a natural or artificial process may be used to generate significant amounts of electrical energy. The result is a non-polluting energy source that is immune to diurnal, climatological, and meteorological effects, has no moving parts, and is readily adaptable to variant energy needs. - Although the preferred embodiments of the invention have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications may be made therein without departing from the spirit of the invention or from the scope of the appended claims.
Claims (20)
1. A printed-circuit (PC) thermopile comprising:
a substrate having a first surface and a second surface, and having a first thermal portion and a second thermal portion;
a plurality of first traces, wherein each of said first traces is formed of a first metal and extends between said first thermal portion and said second thermal portion upon said first surface;
a plurality of second traces, wherein each of said second traces is formed of a second metal and extends between said first thermal portion and said second thermal portion upon said second surface;
a plurality of first junctions, wherein each of said first junctions couples one of said first traces with one of said second traces in said first thermal portion; and
a plurality of second junctions, wherein each of said second junctions couples one of said first traces with one of said second traces in said second thermal portion, and wherein each of said second junctions is in series with one of said first junctions.
2. A PC thermopile as claimed in claim 1 wherein, when said PC thermopile is in operation:
said first thermal portion is maintained at a first temperature; and
said second thermal portion is maintained at a second temperature different from said first temperature.
3. A PC thermopile as claimed in claim 2 wherein:
said first thermal portion is surrounded by a first medium at said first temperature; and
said second thermal portion is surrounded by a second medium at said second temperature.
4. A PC thermopile as claimed in claim 2 wherein:
each of said first junctions is maintained at substantially said first temperature; and
each of said second junctions is maintained at substantially said second temperature.
5. A PC thermopile as claimed in claim 1 additionally comprising a plurality of third traces, wherein each of said third traces:
passes through said substrate from said first side to said second side;
couples one of said first traces with one of said second traces; and
forms one of said first and second junctions upon one of said first and second sides.
6. A PC thermopile as claimed in claim 5 wherein:
said third metal is substantially identical to said first metal; and
said one junction is formed upon said second side.
7. A PC thermopile as claimed in claim 1 wherein:
said first metal is copper; and
said second metal is constantan.
8. A PC thermopile as claimed in claim 1 additionally comprising a plurality of conductive pins coupling one of said first traces with one of said second traces to form one of said first and second junctions.
9. A PC thermopile as claimed in claim 8 wherein said conductive pin is formed of one of said first and second metals.
10. A PC thermopile as claimed in claim 8 wherein each of said conductive pins extends into a medium surrounding said one junction.
11. A thermoelectric generation system configured to provide a predetermined voltage at a predetermined current, said system comprising:
a plurality of printed-circuit (PC) thermopiles; and
a backplane coupled to each of said PC thermopiles and configured to electrically connect said PC thermopile to provide said predetermine voltage at said predetermined current.
12. A thermoelectric generation system as claimed in claim 11 wherein each of said PC thermopiles comprises:
a substrate having a first surface and a second surface;
a plurality of first traces, wherein each of said first traces is formed of a first metal upon said first surface;
a plurality of second traces, wherein each of said second traces is formed of a second metal upon said second surface;
a plurality of first junctions, wherein each of said first junctions couples one of said first traces with one of said second traces; and
a plurality of second junctions, wherein each of said second junctions couples one of said first traces with one of said second traces, and wherein each of said second junctions is coupled in series with one of said first junctions.
13. A thermoelectric generation system as claimed in claim 12 wherein, when said system is in operation:
each of said first junctions is maintained at substantially a first temperature; and
each of said second junctions is maintained at substantially second temperature different from said first temperature.
14. A thermoelectric generation system as claimed in claim 12 wherein:
said first metal is copper; and
said second metal is constantan.
15. A thermoelectric generation system as claimed in claim 12 wherein each of said PC thermopiles additionally comprises a plurality of third traces, wherein each of said third traces couples one of said first traces with one of said second traces to form one of said first and second junctions.
16. A thermoelectric generation system as claimed in claim 15 wherein each of said third traces is formed of said first metal.
17. A thermoelectric generation system as claimed in claim 12 wherein each of said PC thermopiles additionally comprises a plurality of conductive pins, wherein each of said conductive pins couples one of said first traces with one of said second traces to form one of said first and second junctions.
18. A thermoelectric generation system as claimed in claim 11 wherein:
said predetermined voltage is a first predetermined voltage;
said predetermined current is a first predetermined current;
each of said PC thermopiles is configured to provide a second determined voltage at a second predetermined current;
said backplane is configured to electrically connect said plurality of PC thermopiles so that said second predetermined voltage from each of said PC thermopiles together produce said first predetermined voltage; and
said backplane is configured to electrically connect said plurality of PC thermopiles so that said second predetermined current from each of said PC thermopiles together produce said first predetermined current.
19. A thermoelectric generation system as claimed in claim 18 wherein:
each of said PC thermopiles comprises a plurality of thermocouples;
each of said thermocouples is configured to provide a third predetermined voltage at a third predetermined current;
each of said PC thermopiles is configured to electrically connect said plurality of thermocouples so that said third predetermined voltage from each of said thermocouples together produce said second predetermined voltage; and
each of said PC thermopiles is configured to electrically connect said plurality of thermocouples so that said third predetermined current from each of said thermocouples together produce said second predetermined current.
20. A thermoelectric generation system comprising:
a plurality of printed-circuit (PC) thermopiles, wherein each of said PC thermopiles comprises:
a substrate having a first surface and a second surface; and
a plurality of thermocouples, wherein each of said thermocouples comprises:
a first trace formed of a first metal upon said first surface of said substrate;
a second trace formed of a second metal upon said second surface of said substrate;
a first junction formed between said first and second traces and maintained at substantially a first predetermined temperature; and
a second junction formed between said first and second traces and maintained at substantially a second predetermined temperature different from said first predetermined temperature; and
a backplane coupled to each of said PC thermopiles, wherein:
each of said thermocouples is configured to provide substantially a predetermined thermocouple voltage at substantially a predetermined thermocouple current;
each of said PC thermopiles is configured to electrically connect said plurality of thermocouples so that said predetermined thermocouple voltage and current from each of said thermocouples together produce substantially a predetermined thermopile voltage at substantially a predetermined thermopile current; and
said backplane is configured to electrically connect said plurality of PC thermopiles so that said predetermined thermopile voltage and current from each of said PC thermopiles together produce a predetermined system voltage at a predetermined system current.
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US10/786,412 US20050183763A1 (en) | 2004-02-24 | 2004-02-24 | Thermoelectric generation system utilizing a printed-circuit thermopile |
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US10/786,412 US20050183763A1 (en) | 2004-02-24 | 2004-02-24 | Thermoelectric generation system utilizing a printed-circuit thermopile |
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CN113299818A (en) * | 2021-04-14 | 2021-08-24 | 江西理工大学 | W-shaped foldable thin film flexible thermoelectric power generation device |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
US11240883B2 (en) | 2014-02-14 | 2022-02-01 | Gentherm Incorporated | Conductive convective climate controlled seat |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
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