US20050193537A1 - Modular semiconductor workpiece processing tool - Google Patents
Modular semiconductor workpiece processing tool Download PDFInfo
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- US20050193537A1 US20050193537A1 US11/101,834 US10183405A US2005193537A1 US 20050193537 A1 US20050193537 A1 US 20050193537A1 US 10183405 A US10183405 A US 10183405A US 2005193537 A1 US2005193537 A1 US 2005193537A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/40—Umbrella-frame making
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Robotics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Description
- The present invention relates to tools for performing liquid and gaseous processing of semiconductor workpieces, and more particularly to tools which process semiconductor workpieces requiring low contaminant levels.
- Semiconductor workpieces, such as wafers and the like, are the subject of extensive processing to produce integrated circuits, data disks and similar articles. During such processing it is often necessary to treat a particular workpiece or workpiece surface with either gaseous or liquid chemicals. Such treatment allows for films or layers of material to be deposited or grown on a workpiece surface. One method of accomplishing this is to expose the particular workpiece to desired processing environments in which desired chemicals are present to form or grow such films or layers. Some processing regimes involve moving the workpiece within the processing environment to effectuate film or layer coverage.
- It has been increasingly desirable to minimize the size of features in integrated circuits during such processing to provide circuits having reduced size and increased integration and capacity. However, the reduction in feature size of such circuits is limited by contaminants such as particles, crystals, metals and organics which can cause defects and render the circuit inoperational. These limitations in feature size caused by contaminants have prevented utilization of full resolution capability of known processing techniques.
- It is therefore highly desirable to conduct such semiconductor workpiece processing within a regulated environment which preferably involves some type of automated or computer controlled processing. The regulated environment has minimal human contact to provide a low contaminant environment. Providing a regulated environment reduces the chances of an inadvertent contamination which could render the workpiece useless.
- Therefore, an increased need exists for providing a processing environment which adequately performs semiconductor workpiece processing steps in the presence of minimal contaminants.
- Preferred embodiments of the invention are described below with reference to the accompanying drawings, which are briefly described below.
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FIG. 1 is an isometric view of the semiconductor workpiece processing tool in accordance with the present invention. -
FIG. 2 is a cross-sectional view taken along line 2-2 of the semiconductor workpiece processing tool shown inFIG. 1 . -
FIGS. 3-8 are a diagrammatic representation of a workpiece cassette turnstile and elevator of a preferred interface module of the semiconductor workpiece processing tool according to the present invention operating to exchange workpiece cassettes between a hold position and an extraction position. -
FIG. 9 is an isometric view of a preferred workpiece cassette tray engageable with the turnstile of an interface module of the semiconductor workpiece processing tool. -
FIG. 10 is an isometric view of an embodiment of a semiconductor workpiece conveyor of the semiconductor workpiece processing tool in accordance with the present invention. -
FIG. 11 is a cross-sectional view taken along line 11-11 of the semiconductor workpiece conveyor shown inFIG. 10 . -
FIG. 12 is a first isometric view of an embodiment of a semiconductor workpiece transport unit of the semiconductor workpiece conveyor shown inFIG. 10 . -
FIG. 13 is a second isometric view of the semiconductor workpiece transport unit shown inFIG. 12 with the cover thereof removed. -
FIG. 14 is a functional block diagram of an embodiment of a control system of the semiconductor workpiece processing tool in accordance with the present invention. -
FIG. 15 is a functional block diagram of a master/slave control configuration of an interface module control subsystem for controlling a workpiece cassette interface module of the processing tool. -
FIG. 16 is a functional block diagram of an interface module control subsystem coupled with components of a workpiece cassette interface module of the processing tool. -
FIG. 17 is a functional block diagram of a workpiece conveyor control subsystem coupled with components of a workpiece conveyor of the processing tool. -
FIG. 18 is a functional block diagram of a workpiece processing module control subsystem coupled with components of a workpiece processing module of the processing tool. -
FIG. 19 is a functional block diagram of a stave processor of the interface module control subsystem shown inFIG. 16 coupled with components of a workpiece interface module of the processing tool. -
FIG. 20 is a functional block diagram of a slave processor of the workpiece conveyor control subsystem shown inFIG. 17 coupled with components of a workpiece conveyor of the processing tool. -
FIG. 21 is a functional block diagram of a slave processor of the workpiece processing module control subsystem shown inFIG. 18 coupled with components of a workpiece processing module of the processing tool. -
FIG. 22 is an environmental view of the semiconductor processing head of the present invention showing two processing heads in a processing station, one in a deployed, “closed” or “processing” position, and one in an “open” or “receive wafer” position. -
FIG. 23 is an isometric view of the semiconductor processing head of the present invention. -
FIG. 24 is a side elevation view of the processing head of the present invention showing the head in a “receive wafer” position. -
FIG. 25 is a side elevation view of the processing head ofFIG. 5 showing the head in a rotated position ready to lower the wafer into the process station. -
FIG. 26 is a side elevation view of the processing head ofFIG. 5 showing the head operator pivoted to deploy the processing head and wafer into the bowl of the process station. -
FIG. 27 is a schematic front elevation view of the processing head indicating the portions detailed inFIGS. 28 and 29 . -
FIG. 28 is a front elevation sectional view of the left half of the processing head of the apparatus of the present invention also showing a first embodiment of the wafer holding fingers. -
FIG. 29 is a front elevation sectional view of the left half of the processing head of the apparatus of the present invention also showing a first embodiment of the wafer holding fingers. -
FIG. 30 is an isometric view of the operator base and operator arm of the apparatus of the present invention with the protective cover removed. -
FIG. 31 is a right side elevation view of the operator arm of the present invention showing the processing head pivot drive mechanism. -
FIG. 32 is a left side elevation view of the operator arm of the present invention showing the operator arm drive mechanism. -
FIG. 33 is schematic plan view of the operator arm indicating the portions detailed inFIGS. 34 and 35 . -
FIG. 34 is a partial sectional plan view of the right side of the operator arm showing the processing head drive mechanism. -
FIG. 35 is a partial sectional plan view of the left side of the operator arm showing the operator arm drive mechanism. -
FIG. 36 is a side elevational view of a semiconductor workpiece holder constructed according to a preferred aspect of the invention. -
FIG. 37 is a front sectional view of theFIG. 1 semiconductor workpiece holder. -
FIG. 38 is a top plan view of a rotor which is constructed in accordance with a preferred aspect of this invention, and which is taken along line 3-3 inFIG. 37 . -
FIG. 39 is an isolated side sectional view of a finger assembly constructed in accordance with a preferred aspect of the invention and which is configured for mounting upon theFIG. 38 rotor. -
FIG. 40 is a side elevational view of the finger assembly ofFIG. 39 . -
FIG. 41 is a fragmentary cross-sectional enlarged view of a finger assembly and associated rotor structure. -
FIG. 42 is a view taken along line 7-7 inFIG. 4 and shows a portion of the preferred finger assembly moving between an engaged and disengaged position. -
FIG. 43 is a view of a finger tip of the preferred finger assembly and shows an electrode tip in a retracted or disengaged position (solid lines) and an engaged position (phantom lines) against a semiconductor workpiece. -
FIG. 44 is an isometric view of the apparatus of the present invention showing a five station plating module. -
FIG. 45 is an isometric view of one embodiment of the apparatus of the system ofFIG. 44 showing the internal components of the five unit plating module. -
FIG. 46 is an isometric view showing the plating tank and the process bowls of the system ofFIG. 44 . -
FIG. 47 is an isometric detail of a plating chamber of the apparatus of the present invention. -
FIG. 48 is front elevation sectional view of the present invention showing the plating tank, the plating chambers, and the associated plumbing. -
FIG. 49 is side elevation sectional view of the present invention showing the plating tank and a plating chamber. -
FIG. 50 is a side sectional view of the apparatus of the present invention showing a workpiece support positioned over an electroplating process bowl. -
FIG. 51 is a side sectional view of the apparatus of the present invention showing a workpiece support supporting a workpiece for processing within an electroplating process bowl. - This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (
Article 1, Section 8).TABLE 1 Listing of Subsections of Detailed Description and Pertinent Items with Reference Numerals and Page Numbers Processing Tool Generally 12 semiconductor workpiece processing 12 tool 10 interface section 12 13 processing section 14 13 workpiece cassettes 16 13 first port 32 13 second port 33 13 powered doors 35, 36 13 plating module 20 14 pre-wet module 22 14 resist strip module 24 14 rear closure surface 18 15 air supply 26 15 exhaust ducts 58, 59 15 frame 65 15 workpiece transport unit guide 66 15 workpiece transport units 62, 64 16 user interface 30 17 window 34 17 vents 37 17 two interface modules 38, 39 18 workpiece cassette turnstile 40, 41 18 workpiece cassette elevator 42, 43 18 workpiece cassette support 47, 48 18 semiconductor workpiece conveyor 60 19 workpiece holder 810 19 workpiece support 401 20 finger assemblies 409 20 Interface Module 22 saddles 45, 46 23 turnstile shaft 49 24 powered shaft 44 25 Workpiece Cassette Tray 26 workpiece cassette tray 50 26 base 51 26 upright portion 54 26 lateral supports 52 26 groove 53 26 Semiconductor Workpiece Conveyor 27 paths of movement 68, 70 28 guide rails 63, 64 28 Extensions 69, 75 28 drive operators 71, 74 28 electromagnet 79 29 Cable guards 72, 73 29 linear bearing 76 29 horizontal roller 77 29 Semiconductor Workpiece Transport Units 30 train 84 30 workpiece transfer arm assembly 86 30 workpiece transfer arm elevator 90 30 cover 85 30 first arm extension 87 30 shaft 83 30 second arm extension 88 31 axis 82 31 wafer support 89 31 light or other beam emitter 81 32 CCD array 91 32 Control System Generally 32 control system 100 32 grand master controller 101 33 interface module control 110 33 conveyor control 113 33 processing module controls 114, 115 33 additional grand master controllers 102 33 additional processing module control 34 119 memory mapped devices 160, 161, 162 34 master controllers 130, 131, 132 34 Master/Slave Configuration 35 data link 126, 127, 129 as shown in FIG. 36 16- FIG. 18 slave controllers 140, 141, 142 36 turnstile motor 185 38 incremental turnstile encoder 190 38 saddle motor 186 38 saddle encoder 191 38 Conveyor Control Subsystem 39 slave processor 171 40 servo controller 176 40 linear encoder 196 40 transfer arm motor 194 40 transfer arm rotation encoder 197 40 transfer arm elevation motor 195 41 transfer arm elevation encoder 198 41 Absolute encoders 199 41 Processing Module Control 41 slave controller 145, 146 42 process components 184 42 servo controller 177 42 interface controller 180 42 slave processor 172 43 servo controller 177 43 operator arm 407 43 lift drive shaft 456 43 lift motion encoder 455 43 lift arm 407 43 rotate motor 428 43 processing head 406 43 shafts 429, 430 43 Incremental rotate encoder 435 43 Spin motor 480 43 workpiece holder 478 43 spin encoder 498 43 fingertips 414 43 pneumatic valve actuator 201 43 pneumatic piston 502 43 relay 202 44 pump 605 44 Interface Module Control 45 Slave processor 170 45 servo controller 175 46 elevator lift motor 187 46 elevator rotation motor 188 46 ift encoder 192 47 rotation encoder 193 47 Absolute encoders 199 47 Methods 47 Workpiece Support 49 semiconductor processing machine 400 49 workpiece supports 401 49 Workpiece support 402 49 Workpiece support 403 50 semiconductor manufacturing chamber 50 404 beam emitter 81 50 operator base 405 50 processing head 406 50 operator arm 407 50 wafer holder 408 50 fingers 409 50 Workpiece holder 408 50 workpiece spin axis 410 50 process pivot axis 411 50 operator pivot axis 412 50 workpiece W 51 fingertips 414 51 51 processing bowl 417 51 left and rigbt forks 418 and 419 52 Operator Base 52 operator base back portion 420 52 operator base left yoke arm 421 53 operator base right yoke arm 422 53 yoke arm fasteners 423 53 operator arm bearings 424 53 operator arm 425 53 Operator Arm 53 process arm rear cavity 426 54 lift motor 452 54 rotate motor 428 54 processing head left pivot shaft 429 54 processing head right pivot shaft 430 54 Operator Arm-Processing Head Rotate Mechanism 54 Processing head rotate mechanism 431 54 rotate shaft 432 54 securing collar 433 55 rotate motor support 434 55 rotate encoder 435 55 rotate pulley inboard bearing 436 56 rotate belt 437 56 processing head pulley 438 56 rotate belt tensioner 439 56 tensioner hub 468 57 processing head shaft bearing 440 57 processing head rotate bearing 469 57 processing head shaft bearing 441 57 cable brackets 442 and 443 57 rotate overtravel protect 444 58 rotate flag 447 58 Rotate optical switches 445 and 446 59 Operator Arm-Lift Mechanism 59 operator arm lift mechanism 448 59 lift motor shaft 454 59 lift gear drive 453 60 lift drive shaft 456 60 lift bushing 449 60 anchor plate 458 60 anchor fasteners 457 60 60 Lift bearing 450 60 lift bearing support 460 60 operator arm frame 461 60 lift anchor 451 61 lift overtravel protect 462 61 lift optical switch low 463 61 lift optical switch high 464 61 lift flag 465 62 lift motor encoder 455 62 lift motor 452 62 slotted lift flag mounting slots 467 62 lift flag fasteners 466 62 Processing Head 62 processing head housing 470 63 circumferential grooves 471 63 rotate shaft openings 474 and 475 63 left and right processing head mounts 63 472 processing head door 476 63 processing head void 477 63 Processing Head Spin Motor 64 workpiece holder 478 64 spin axis 479 64 spin motor 480 64 top motor housing 481 65 spin motor shaft 483 65 workpiece holder rotor 484 65 65 rotor hub 485 65 rotor hub recess 486 65 workpiece shaft snap-ring 488 65 rotor recess-groove 489 65 spin encoder 498 66 optical tachometer 499 66 Processing Head Finger Actuators 68 Pneumatic piston 502 69 actuator spring 505 69 cavity end cap 507 69 retaining ring 508 69 pneumatic inlet 503 69 pneumatic supply line 504 69 actuator plate 509 69 actuator plate connect screw 510 69 Wave springs 529 69 bushing 512 69 pneumatic piston recess 511 69 finger actuator contacts 513 70 Processing Head Workpiece Holder 70 finger actuator lever 514 70 finger stem 515 70 finger diaphragm 519 70 workpiece holder rotor 484 71 finger opening 521 71 rotor diaphragm lip 523 71 finger spring 520 71 finger actuator tab 522 71 finger collar or nut 517 71 518 71 finger actuator mechanism 500 71 cavity 501 72 Semiconductor Workpiece Holder — Electroplating Embodiment 72 semiconductor workpiece holder 810 72 bottom half or bowl 811 73 Processing Head and Processing Head Operator 73 workpiece support 812 73 spin head assembly 814 73 lift/rotate assembly 816 73 motor 818 74 rotor 820 74 rotor spin axis 822 74 finger assembly 824 74 actuator 825 75 rotor center piece 826 75 spokes 828 75 rotor perimeter piece 830 75 Finger Assembly 76 finger assembly frame 832 77 angled slot 832a 77 finger assembly frame outer flange 834 77 inner drive plate portion 836 77 Finger Assembly Drive System 77 bearing 838 77 collet 840 77 bearing receptacle 839 77 spring 842 78 spring seat 844 78 Finger Assembly Electrical System 78 pin connector 846 79 finger 848 79 nut 850 79 anti-rotation pin 852 79 finger tip 854 79 electrode contact 858 80 Finger Assembly Drive System Interface 80 finger actuator 862 80 863 80 first movement path axis 864 81 secondary linkage 865 81 link arm 867 81 actuator torque ring 869 81 pneumatic operator 871 81 Engaged and Disengaged Positions 82 arrow A 82 workpiece standoff 865 83 bend 866 83 Finger Assembly Seal 84 868 84 rim portion 870 84 Methods and Operation 85 Methods Re Presenting Workpiece 88 Electroplating Processing Station 91 electroplating module 20 91 workpiece support 401 92 processing head 406 92 operator arm 407 92 operator base 405 92 fingers 409 92 beam emitter 81 93 plating chamber assemblies 603 93 process fluid reservoir 604 93 immersible pump 605 93 module frame or chassis 606 93 pump discharge filter 607 93 outer reservoir wall 608 93 inner reservoir wall 609 93 reservoir safety volume 611 94 inner vessel 612 94 reservoir overflow opening 610 94 heat exchanger 613 94 exchanger inlet 614 94 exchanger outlet 615 94 Bowl Assembly 94 reservoir top 618 95 process bowl or plating chamber 616 95 bowl side 617 95 bowl bottom 619 95 cup assembly 620 95 fluid cup 621 95 cup side 622 95 cup bottom 623 95 fluid inlet line 625 95 bowl bottom opening 627 95 cup fluid inlet opening 624 95 inlet line end point 631 95 Fluid outlet openings 628 95 inlet plenum 629 95 cup filter 630 95 metallic anode 634 96 annular gap or space 635 96 outer cup wall 636 96 first annular space or process fluid 96 overflow space 632 cup upper edge 633 96 bowl upper edge 637 96 crossbars 626 97 bowl bottom center plate 639 97 fluid return openings 638 97 process module deck plate 666 99 levelers 640 99 compliant bowl seal 665 100 cup height adjuster 641 100 cup height adjustment jack 643 100 cup lock nut 642 100 height adjustment jack 641 100 adjustment tool access holes 667 100 anode height adjuster 646 101 threaded anode post 664 101 threaded anode adjustment sleeve 663 101 sleeve openings 668 101 fluid outlet chamber 662 101 Fluid Transfer Equipment 102 pump suction 647 102 pump body 653 102 pump discharge 648 102 Electric pump motor 650 102 removable filter top 649 103 supply manifold 652 103 fluid return line 654 103 optional end point 655 103 back pressure regulator 656 103 Control Devices 104 flow sensors 657 104 flow signal line 659 104 flow restrictors 658 104 flow control signal line 660 104 Plating Methods 105
Processing Tool Generally - Referring to
FIG. 1 , a present preferred embodiment of the semiconductorworkpiece processing tool 10 is shown. Theprocessing tool 10 may comprise aninterface section 12 andprocessing section 14.Semiconductor workpiece cassettes 16 containing a plurality of semiconductor workpieces, generally designated W, may be loaded into theprocessing tool 10 or unloaded therefrom via theinterface section 12. In particular, theworkpiece cassettes 16 are preferably loaded or unloaded through at least one port such asfirst port 32 within a front outwardly facing wall of theprocessing tool 10. An additionalsecond port 33 may be provided within theinterface section 12 of theprocessing tool 10 to improve access andport 32 may be utilized as an input andport 33 may be utilized as an output. - Respective
powered doors access ports processing tool 10 from the clean room. Eachdoor processing tool 10 to openports -
Workpiece cassettes 16 are typically utilized to transport a plurality of semiconductor workpieces. The workpiece cassettes 16 are preferably oriented to provide the semiconductor workpieces therein in an upright or vertical position for stability during transportation of the semiconductor workpieces into or out of theprocessing tool 10. - The front outwardly facing surface of the
processing tool 10 may advantageously join a clean room to minimize the number of harmful contaminants which may be introduced into theprocessing tool 10 during insertion and removal ofworkpiece cassettes 16. In addition, a plurality ofworkpiece cassettes 16 may be introduced intoprocessing tool 10 or removed therefrom at one time to minimize the opening ofports processing tool 10 to the clean room environment. - The
interface section 12 joins aprocessing section 14 of theprocessing tool 10. Theprocessing section 14 may include a plurality of semiconductor workpiece processing modules for performing various semiconductor process steps. In particular, the embodiment of theprocessing tool 10 shown inFIG. 1 includes aplating module 20 defining a first lateral surface of theprocessing section 14. Theprocessing section 14 of thetool 10 may advantageously include additional modules, such aspre-wet module 22 and resiststrip module 24, opposite theplating module 20. - Alternatively, other modules for performing additional processing functions may also be provided within the
processing tool 10 in accordance with the present invention.Pre-wet module 22 and resiststrip module 24 define a second lateral surface of theprocessing tool 10. The specific processing performed by processing modules of theprocessing tool 10 may be different or of similar nature. Various liquid and gaseous processing steps can be used in various sequences. Theprocessing tool 10 is particularly advantageous in allowing a series of complex processes to be run serially in different processing modules set up for different processing solutions. All the processing can be advantageously accomplished without human handling and in a highly controlled workingspace 11, thus reducing human operator handling time and the chance of contaminating the semiconductor workpieces. - The processing modules of the
process tool 10 in accordance with the present invention are preferably modular, interchangeable, stand-alone units. The processing functions performed by theprocessing tool 10 may be changed after installation of theprocessing tool 10 increasing flexibility and allowing for changes in processing methods. Additional workpiece processing modules may be added to theprocessing tool 10 or replace existingprocessing modules 19. - The
processing tool 10 of the present invention preferably includes arear closure surface 18 joined with the lateral sides of theprocessing tool 10. As shown inFIG. 1 , anair supply 26 may be advantageously provided intermediate opposing processing modules of theprocessing section 14. Theinterface section 12, lateral sides of theprocessing section 14,closure surface 18, andair supply 26 preferably provide anenclosed work space 11 within theprocessing tool 10. Theair supply 26 may comprise a duct coupled with a filtered air source (not shown) for providing clean air into theprocessing tool 10 of the present invention. More specifically, theair supply 26 may include a plurality of vents intermediate theprocessing modules 19 for introducing clean air intowork space 11. - Referring to
FIG. 10 ,exhaust ducts frame 65 of a workpiece transport unit guide 66 to remove the circulated clean air and the contaminants therein.Exhaust ducts processing modules 19 for drawing supplied clean air therethrough. In particular, clean air is supplied to theworkspace 11 of theprocessing tool 10 viaair supply 26. The air may be drawn adjacent theworkpiece transport units processing modules 19 via a plurality ofvents 57 formed within a shelf or process deck thereof by an exhaust fan (not shown) coupled with the output ofexhaust ducts processing module 19 within theprocessing tool 10 may be directly coupled withducts ducts processing tool 10 through therear closant surface 18 or through a bottom of surface of theprocessing tool 10. Providing an enclosed work space and controlling the environment within the work space greatly reduces the presence of contaminants with theprocessing tool 10. - Each of the
processing modules processing tool 10. The lateral sides of theprocessing tool 10 may be adjacent a gray room environment. Gray rooms have fewer precautions against contamination compared with the clean rooms. Utilizing this configuration reduces plant costs while allowing access to the processing components and electronics of eachworkpiece module 19 of theprocessing tool 10 which require routine maintenance. - A
user interface 30 may be provided at the outwardly facing front surface of the processing tool as shown inFIG. 1 . Theuser interface 30 may advantageously be a touch screen cathode ray tube control display allowing finger contact to the display screen to effect various control functions within theprocessing tool 10. Anadditional user interface 30 may also be provided at the rear of theprocessing tool 10 or withinindividual processing modules tool 10 operation can be effected from alternate locations about theprocessing tool 10. Further, aportable user interface 30 may be provided to permit an operator to move about theprocessing tool 10 and view the operation of the processing components therein. Theuser interface 30 may be utilized to teach specified functions and operations to theprocessing modules 19 and semiconductorworkpiece transport units - Each
module processing tool 10 preferably includes awindow 34 allowing visual inspection ofprocessing tool 10 operation from the gray room. Further, vents 37 may be advantageously provided within a top surface of eachprocessing module vents 37 allowing circulating air to dissipate heat generated by such electronics. - The
work space 11 within theinterface section 12 andprocessing section 14 of an embodiment of theprocessing tool 10 is shown in detail inFIG. 2 . - The
interface section 12 includes twointerface modules workpiece cassettes 16 within theprocessing tool 10. Theinterface modules workpiece cassettes 16 through theaccess ports workpiece cassettes 16 for subsequent processing of the semiconductor workpieces therein. In addition, theinterface modules processing tool 10 upon completion of the processing a of the semiconductor workpieces within therespective workpiece cassette 16. - Each
interface module workpiece cassette turnstile workpiece cassette elevator workpiece cassette turnstiles workpiece cassettes 16 from a stable vertical orientation to a horizontal orientation where access to the semiconductor workpieces is improved. Eachworkpiece cassette elevator workpiece cassette support workpiece cassettes 16. Eachworkpiece cassette elevator workpiece cassette 16 resting thereon in either a transfer position and extraction position. The operation of theworkpiece interface modules - In a preferred embodiment of the present invention, the first
workpiece interface module 38 may function as an input workpiece cassette interface for receiving unprocessed semiconductor workpieces into theprocessing tool 10. The secondworkpiece interface module 39 may function as an output workpiece cassette interface for holding processed semiconductor workpieces for removal from theprocessing tool 10.Workpiece transport units processing tool 10 may accessworkpiece cassettes 16 held by eitherworkpiece interface module processing tool 10. - A
semiconductor workpiece conveyor 60 is shownintermediate processing modules interface modules FIG. 2 . Theworkpiece conveyor 60 includesworkpiece transport units workpiece interface modules workpiece processing modules 19. - Workpiece conveyor. 60 advantageously includes a
transport unit guide 66, such as an elongated rail, which defines a plurality ofpaths workpiece transport units processing tool 10. Aworkpiece transport unit 62 on afirst path 68 may pass aworkpiece transport unit 64 positioned on asecond path 70 during movement of thetransport units transport guide 66. Theprocessing tool 10 may include additional workpiece transport units to facilitate the transfer of semiconductor workpieces W between theworkpiece processing modules workpiece interface modules - Each
processing module workpiece holder 810 located generally adjacent theworkpiece conveyor 60. In particular, each of theworkpiece transport units semiconductor workpiece support 401 of the appropriatesemiconductor processing module workpiece transport unit 64 is shown accessing ansemiconductor workpiece support 401 ofprocessing module 20. The workpiece transport units may either deposit or retrieve workpieces on or from the workpiece supports 401. - More specifically, the
second arm extension 88 may support a semiconductor workpiece W viavacuum support 89. The appropriateworkpiece transport unit workpiece support 401 by moving alongtransport unit guide 66. After reaching a proper location alongguide 66, thefirst extension 87 andsecond extension 88 may rotate to approach theworkpiece support 401. Thesecond extension 88 is positioned above theworkpiece support 401 and subsequently lowered towardengagement finger assemblies 409 on theworkpiece support 401. The vacuum is removed fromvacuum support 89 andfinger assemblies 409 grasp the semiconductor workpiece W positioned therein.Second extension 88 may be lowered and removed from beneath the semiconductor workpiece held by the workpiece engagement fingers. - Following completion of processing of the semiconductor workpiece within the
appropriate processing module workpiece transport unit processing module workpiece cassette 16 for storage or removal from theprocessing tool 10. - Each of the
workpiece transport units workpiece cassette 16 adjacent theconveyor 60 for retrieving a semiconductor workpiece from theworkpiece cassette 16 or depositing a semiconductor workpiece therein. In particular,workpiece transport unit 62 is shown withdrawing a semiconductor workpiece W fromworkpiece cassette 16 uponelevator 42 inFIG. 2 . - More specifically, the
second extension 88 andvacuum support 89 connected therewith may be inserted into aworkpiece cassette 16 positioned in the extraction position.Second extension 88 andvacuum support 89 enter below the lower surface of the bottom semiconductor workpiece W held byworkpiece cassette 16. A vacuum may be applied viavacuum support 89 oncesupport 89 is positioned below the center of the semiconductor workpiece W being removed. Thesecond extension 88,vacuum support 89 and semiconductor workpiece W attached thereto may be slightly raised viatransfer arm elevator 90. Finally,first extension 87 andsecond extension 88 may be rotated to remove the semiconductor workpiece W from theworkpiece cassette 16. Theworkpiece transport unit workpiece processing module 19 for processing. - Thereafter,
workpiece transport unit 62 may travel alongpath 68 to a position adjacent anappropriate processing module workpiece processing support 401 for processing of the semiconductor workpiece. - Interface Module
- Referring to
FIG. 3 -FIG. 8 , the operation of theinterface module 38 is shown in detail. The following discussion is limited toworkpiece interface module 38 but is also applicable toworkpiece interface module 39 inasmuch as eachinterface module - Preferably, the first
workpiece interface module 38 and the secondworkpiece interface module 39 may function as a respectivesemiconductor workpiece cassette 16 input module and output module of theprocessing tool 10. Alternately, both modules can function as both input and output. More specifically,workpiece cassettes 16 holding unprocessed semiconductors workpieces may be brought into theprocessing tool 10 viaport 32 and temporarily stored within the firstworkpiece interface module 38 until the semiconductor workpieces are to be removed from theworkpiece cassette 16 for processing. Processed semiconductor workpieces may be delivered to aworkpiece cassette 16 within the secondworkpiece interface module 39 viaworkpiece transport units processing tool 10. - The
workpiece interface modules workpiece transport units processing tool 10 for transferring semiconductor workpieces therebetween. Providing a plurality of workpiececassette interface modules workpiece transport unit processing tool 10 according to the present invention. - Each
workpiece interface module workpiece cassette turnstile 40 and aworkpiece cassette elevator 42 adjacent thereto. Theaccess ports workpiece cassette turnstiles Workpiece cassettes 16 may be brought into theprocessing tool 10 or removed therefrom viaports -
Workpiece cassettes 16 are preferably placed in a vertical position onto cassette Frays 50 prior to delivery into theprocessing tool 10.Cassette trays 50 are shown in detail inFIG. 9 . The vertical position ofworkpiece cassettes 16 and the semiconductor workpieces therein provides a secure orientation to maintain the semiconductor workpieces within theworkpiece cassette 16 for transportation. - Each
workpiece cassette turnstile saddles workpiece cassette 16. Providing two saddles 45, 46 enables twoworkpiece cassettes 16 to be placed into theprocessing tool 10 or removed therefrom during a single opening of arespective access door workspace 11 within theprocessing tool 10 to the clean room environment. - Each
saddle cassette tray 50.Saddles cassette turnstile shaft 49 to position theworkpiece cassette 16 in a horizontal or vertical orientation. The workpiece cassettes 16 and semiconductor workpieces therein are preferably vertically oriented for passage through theaccess ports workpiece transport units - The
workpiece cassette 16 held byworkpiece cassette turnstile 40 inFIG. 3 , also referred to asworkpiece cassette 15, is in a hold position (also referred to herein as a load position). The semiconductor workpieces within aworkpiece cassette 16 in the hold position may be stored for subsequent processing. Alternatively, the semiconductor workpieces within aworkpiece cassette 16 in the hold position may be stored for subsequent removal from theprocessing tool 10 through anaccess port - Referring to
FIG. 3 , theworkpiece cassette 16 supported by theworkpiece cassette elevator 42, also referred to asworkpiece cassette 17, is in an extraction or exchange position. Semiconductor workpieces may either be removed from or placed into aworkpiece cassette 16 positioned in the extraction position via aworkpiece transport unit - The
workpiece cassette turnstile 41 andworkpiece cassette elevator 42 may exchangeworkpiece cassettes workpiece cassette 17 having processed semiconductor workpieces therein from the extraction position to the hold position for removal from theprocessing tool 10. Additionally, such an exchange may transfer aworkpiece cassette 15 having unprocessed semiconductor workpieces therein from the hold position to the extraction position providingworkpiece transport units - The exchange of
workpiece cassettes FIG. 4 -FIG. 8 . Specifically, saddle 46 is positioned below apowered shaft 44 ofworkpiece cassette elevator 42.Shaft 44 is coupled with a poweredworkpiece cassette support 47 for holding aworkpiece cassette 16.Shaft 44 andworkpiece cassette support 47 attached thereto are lowered as shown inFIG. 4 andshaft 44 passes between the forks ofsaddle 46. - Referring to
FIG. 5 , a motor withinshaft 44 rotatesworkpiece cassette support 47 about an axis throughshaft 44 providing theworkpiece cassette 17 thereon in an opposing relation to theworkpiece cassette 15 held byworkpiece cassette turnstile 40. Both saddles 45, 46 ofworkpiece cassette turnstile 40 are subsequently tilted into a horizontal orientation as shown inFIG. 6 . Theshaft 44 ofworkpiece cassette elevator 42 is next lowered andworkpiece cassette 17 is brought into engagement withsaddle 46 as depicted inFIG. 7 . Theshaft 44 andworkpiece cassette support 47 are lowered an additional amount to clear rotation ofworkpiece cassettes 16. Referring toFIG. 8 ,workpiece cassette turnstile 40 rotates 180 degrees to transposeworkpiece cassettes -
Workpiece cassette 17 having processed semiconductor workpieces therein is now accessible viaport 32 for removal from theprocessing tool 10.Workpiece cassette 15 having unprocessed semiconductors therein is now positioned for engagement withworkpiece cassette support 47. The transfer process steps shown inFIG. 3 -FIG. 8 may be reversed to elevate theworkpiece cassette 15 into the extraction position providing access of the semiconductor workpieces to workpiecetransport units - Workpiece Cassette Tray
- A
workpiece cassette tray 50 for holding aworkpiece cassette 16 is shown in detail inFIG. 9 . Eachcassette tray 50 may include abase 51 and anupright portion 54 preferably perpendicular to thebase 51. Twolateral supports 52 may be formed on opposing sides of thebase 51 and extend upward therefrom. Lateral supports 52 assist with maintainingworkpiece cassettes 16 thereon in a fixed position during the movement, rotation and exchange ofworkpiece cassettes 16. Eachlateral support 52 contains agroove 53 preferably extending the length thereof configured to engage with the forks ofsaddles - The
workpiece cassette trays 50 are preferably utilized during the handling ofworkpiece cassettes 16 within the workpiececassette interface modules workpiece cassettes 16 are transferred from a load position to an extraction position providing access of the semiconductor workpieces W to workpiecetransport units conveyor 60. - Semiconductor Workpiece Conveyor
- The
processing tool 10 in accordance with the present invention advantageously provides asemiconductor workpiece conveyor 60 for transporting semiconductor workpieces throughout theprocessing tool 10. Preferably,semiconductor workpiece conveyor 60 may access each workpiececassette interface module workpiece processing module 19 withinprocessing tool 10 for transferring semiconductor workpieces therebetween. This includes processing modules from either side. - One embodiment of the
workpiece conveyor 60 is depicted inFIG. 10 . Theworkpiece conveyor 60 generally includes a workpiece transport unit guide 66 which preferably comprises an elongated spine or rail mounted to frame 65. Alternatively,transport unit guide 66 may be formed as a track or any other configuration for guiding theworkpiece transport units workpiece conveyor 60 may be varied and is configured to permit access of theworkpiece transport units interface module processing modules - Workpiece
transport unit guide 66 defines the paths ofmovement workpiece transport units FIG. 11 , a spine oftransport unit guide 66 includesguide rails workpiece transport unit respective guide rail more transport units Extensions guide 66 for providing stability of thetransport units guide 66 from wear. Eachworkpiece transport unit roller 77 configured to ride along arespective extension guide 66. - It is to be understood that
workpiece conveyor 60 may be formed in alternate configurations dependent upon the arrangement ofinterface modules processing modules processing tool 10.Ducts workpiece processing module 19 and an exhaust fan for removing circulated air from theworkspace 11 of theprocessing tool 10. - Each
workpiece transport unit respective path operators workpiece transport units transport unit guide 66. - The
drive operators workpiece transport units guide 66. In particular, driveoperators preferred driver operators respective electromagnet 79 mounted on theworkpiece transport units transport unit guide 66. - Cable guards 72, 73 may be connected to respective
workpiece transport units frame 65 for protecting communication and power cables therein. Cable guards 72, 73 may comprise a plurality of interconnected segments to permit a full range of motion ofworkpiece transport units transport unit guide 66. - As shown in
FIG. 11 , a firstworkpiece transport unit 62 is coupled with a first side of the spine ofguide 66. Eachworkpiece transport unit linear bearing 76 for engagement withlinear guide rails workpiece transport units horizontal roller 77 for engaging aextension 69 formed upon the spine of theguide 66 and providing stability. -
FIG. 11 additionally shows anelectromagnet 79 of the firstworkpiece transport unit 62 mounted in a position to magnetically interact withdrive actuator 71.Drive actuator 71 andelectromagnet 79 provide axial movement and directional control of theworkpiece transport units transport unit guide 66. - Semiconductor Workpiece Transport Units
- Preferred embodiments of the semiconductor
workpiece transport units workpiece conveyor 60 are described with reference toFIG. 12 andFIG. 13 . - In general, each
workpiece transport unit tram 84 coupled to a respective side of thetransport unit guide 66, a workpiecetransfer arm assembly 86 movably connected to thetram 84 for supporting a semiconductor workpiece W, and a workpiecetransfer arm elevator 90 for adjusting the elevation of thetransfer arm assembly 86 relative totram 84. - Referring to
FIG. 12 , acover 85 surrounds the portion oftram 84 facing away from thetransport unit guide 66.Tram 84 includeslinear bearings 76 for engagement Withrespective guide rails unit guide 66.Linear bearings 76 maintain thetram 84 in a fixed relation with thetransport unit guide 66 and permit axial movement of thetram 84 therealong. Aroller 77 engages arespective extension 69 for preventing rotation oftram 84 aboutguide rail workpiece transport unit 62. Theelectromagnet 79 is also shown connected with thetram 84 in such a position to magnetically interact with arespective transport unit drive actuator - A workpiece
transfer arm assembly 86 extends above the top oftram 84. The workpiecetransfer arm assembly 86 may include afirst arm extension 87 coupled at a first end thereof with ashaft 83. Asecond arm extension 88 may be advantageously coupled with a second end of thefirst extension 87. Thefirst arm extension 87 may rotate 360 degrees aboutshaft 83 andsecond arm extension 88 may rotate 360 degrees aboutaxis 82 passing through a shaft connecting first andsecond arm extensions -
Second extension 88 preferably includes awafer support 89 at a distal end thereof for supporting a semiconductor workpiece W during the transporting thereof alongworkpiece conveyor 60. Thetransfer arm assembly 86 preferably includes a chamber coupled with theworkpiece support 89 for applying a vacuum thereto and holding a semiconductor workpiece W thereon. - Providing adjustable elevation of
transfer arm assembly 86, rotation offirst arm extension 87 about the axis ofshaft 83, and rotation ofsecond extension 88 aboutaxis 82 allows thetransfer arm 86 to access eachsemiconductor workpiece holder 810 of all processingmodules 19 and each of thewafer cassettes 16 held byinterface modules processing tool 10. Such access permits the semiconductorworkpiece transport units - The
cover 85 has been removed from theworkpiece transport unit FIG. 13 to reveal a workpiecetransfer arm elevator 90 coupled withtram 84 andtransfer arm assembly 86.Transfer arm elevator 90 adjusts the vertical position of thetransfer arm assembly 86 relative to thetram 84 during the steps of transferring a semiconductor workpiece between theworkpiece support 89 and one of aworkpiece holder 810 and theworkpiece cassette 16. - The path position of the
tram 84 of eachworkpiece transport unit transport unit guide 66 is precisely controlled using a positional indicating array, such as aCCD array 91 ofFIG. 13 . In one embodiment of theprocessing tool 10, eachsemiconductor workpiece holder 810 within aprocessing module 19 has a corresponding light orother beam emitter 81 mounted on a surface of theprocessing module 19 as shown inFIG. 2 for directing a beam of light toward thetransport unit guide 66. Thelight emitter 81 may present a continuous beam or alternatively may be configured to generate the beam as aworkpiece transport unit respective workpiece holder 810. - The
transfer arm assembly 86 includes anCCD array 91 positioned to receive the laser beam generated bylight emitter 81. Aposition indicating array 91 onshaft 83 detects the presence of the light beam to determine the location oftram 84 alongtransport unit guide 66. The positional accuracy of the workpiece transport unit position indicator is preferably in the range less than 0.003 inch (approximately less than 0.1 millimeter). - Control System Generally
- Referring to
FIG. 14 , a presently preferred embodiment of thecontrol system 100 of the semiconductorworkpiece processing tool 10 in accordance with the present invention generally includes at least onegrand master controller 101 for controlling and/or monitoring the overall function of theprocessing tool 10. - The
control system 100 is preferably arranged in a hierarchial configuration. Thegrand master controller 101 includes a processor electrically coupled with a plurality of subsystem control units as shown inFIG. 14 . The control subsystems preferably control and monitor the operation of components of the corresponding apparatus (i.e.,workpiece conveyor 60,processing modules interface modules grand master control control subsystems 110, 113-119 preferably provide process and status information to respectivegrand master controllers - More specifically, the
grand master control 101 is coupled with aninterface module control 110 which may control each of the semiconductorworkpiece interface modules grand master control 101 is coupled with aconveyor control 113 for controlling operations of theworkpiece conveyor 60 and a plurality of processing module controls 114, 115 corresponding to semiconductorworkpiece processing modules processing tool 10. - The
control system 100 of theprocessing tool 10 according to the present invention may include additionalgrand master controllers 102 as shown inFIG. 14 for monitoring or operating additional subsystems, such as additional workpiece processing modules via additionalprocessing module control 119. Four control subsystems may be preferably coupled with eachgrand master controller grand master controllers - Each
grand master controller control system 100, a bidirectional memory mapped device is provided intermediate the grand master controller and each modular subsystem connected thereto. In particular, memory mappeddevices grand master controller 101 andmaster controllers interface module control 110,workpiece conveyor control 113 andprocessing module control 114. - Each memory mapped
device 150, 160-162 within thecontrol system 100 is preferably a dual port RAM provided by Cypress for asynchronouosly storing data. In particular,grand master controller 101 may write data to a memory location corresponding tomaster controller 130 andmaster controller 130 may simultaneously read the data. Alternatively,grand master controller 101 may read data from mapped memory device being written by themaster controller 130. Utilizing memory mapped devices 160-161 provides data transfer at processor speeds. Memory mappeddevice 150 is preferably providedintermediate interface 30 and thegrand master controllers - A
user interface 30 is preferably coupled with each of thegrand master controllers user interface 30 may be advantageously mounted on the exterior of theprocessing tool 10 or at a remote location to provide an operator with processing and status information of theprocessing tool 10. Additionally, an operator may input control sequences and processing directives for theprocessing tool 10 viauser interface 30. Theuser interface 30 is preferably supported by a general purpose computer within theprocessing tool 10. The general purpose computer preferably includes a 486 100 MHz processor, but other processors may be utilized. - Master/Slave Configuration
- Each modular control subsystem, including
interface module control 110,workpiece conveyor control 113 and each processing module control 114-119, is preferably configured in a master/slave arrangement. Themodular control subsystems 110, 113-119 are preferably housed within the respective module such asworkpiece interface module workpiece conveyor 60, or each of theprocessing modules grand master controller 101 andcorresponding master controllers user interface 30. Eachgrand master controller master controller 130 and slave controller withincontrol system 100 preferably includes a 80251 processor provided by Intel. - Each
master controller data link FIG. 16 -FIG. 18 . Each data link 126, 127, 129 preferably comprises a optical data medium such as Optilink provided by Hewlett Packard. However,data links - Referring to
FIG. 15 , the master/slave control subsystem for theinterface module control 110 is illustrated. Each master and related slave configuration preferably corresponds to a single module (i.e., interface, conveyor, processing) within theprocessing tool 10. However, one master may control or monitor a plurality of modules. The master/slave configuration depicted inFIG. 15 and corresponding to theinterface module control 110 may additionally apply to the othermodular control subsystems - The
grand master controller 101 is connected via memory mappeddevice 160 to amaster controller 130 within the correspondinginterface module control 110. Themaster controller 130 is coupled with a plurality ofslave controllers - The
control system 100 of theprocessing tool 10 preferably utilizes flash memory. More specifically, the operation instructions or program code for operating each master controller 130-132 and slave controller 140-147 within thecontrol system 100 may be advantageously stored within the memory of the correspondinggrand master controller grand master controller grand master controller - Each slave controller may be configured to control and monitor a single motor or a plurality of motors within a corresponding
processing module 19,interface module workpiece conveyor 60. In addition, each slave controller 140-147 may be configured to monitor andcontrol process components 184 within arespective module 19. Any one slave controller, such asslave controller 145 shown inFIG. 21 , may be configured to control and/or monitor servo motors andprocess components 184. - Each slave controller includes a slave processor which is coupled with a plurality of port interfaces. Each port interface may be utilized for control and/or monitoring of servo motors and
process components 184. For example, a port may be coupled with aservo controller card 176 which is configured to operate aworkpiece transfer unit slave processor 171 may operate theworkpiece transfer unit servo controller 176. More specifically, theslave processor 171 may operate servo motors within theworkpiece transfer unit servo controller 176. - Alternatively,
different slave controllers interface module 38. More specifically, theinterface module control 110 and components of theinterface module 38 are depicted inFIG. 16 .Slave controller 140 may operateturnstile motor 185 and monitor the position of theturnstile 40 viaincremental turnstile encoder 190.Slave controller 140 is preferably coupled with theturnstile motor 185 andturnstile encoder 190 via a servo control card (shown inFIG. 19 ).Slave controller 141 may operate and monitorsaddle 45 of theturnstile 40 by controllingsaddle motor 186 andmonitoring saddle encoder 191 via a servo control card. - A port of a slave processor may be coupled with an
interface controller card 180 for controlling and monitoring process components within arespective processing module 19. For example, aflow sensor 657 may provide flow information of the delivery of processing fluid to a processing bowl within the module. Theinterface controller 180 is configured to translate the data provided by theflow sensors 657 or other process components into a form which may be analyzed by thecorresponding slave processor 172. Further, theinterface controller 180 may operate a process component, such as aflow controller 658, responsive to commands from thecorresponding slave processor 172. - One slave controller 140-147 may contain one or more servo controller and one or more interface controller coupled with respective ports of the slave processor 170-172 for permitting control and monitor capabilities of various component motors and processing components from a single slave controller.
- Alternatively, a servo controller and interface controller may each contain an onboard processor for improving the speed of processing and operation. Data provided by an encoder or process component to the servo controller or interface controller may be immediately processed by the on board processor which may also control a respective servo motor or processing component responsive to the data. In such a configuration, the slave processor may transfer the data from the interface processor or servo controller processor to the respective master controller and grand master controller.
- Conveyor Control Subsystem
- The
conveyor control subsystem 113 for controlling and monitoring the operation of theworkpiece conveyor 60 and theworkpiece transport units FIG. 17 . In general, aslave controller 143 ofconveyor control 113 is coupled withdrive actuator 71 for controllably moving and monitoring aworkpiece transport unit 62 along theguide 66. Further,slave controller 143 may operatetransfer arm assembly 86 of theworkpiece transport unit 62 and the transferring of semiconductor workpieces thereby. Similarly,slave controller 144 may be configured to operateworkpiece transport unit 64 and driveactuator 74. - The interfacing of
slave controller 143 andlight detector 91,drive actuator 71,linear encoder 196 andworkpiece transport unit 62 is shown in detail inFIG. 20 . Theslave processor 171 ofslave controller 143 is preferably coupled with aservo controller 176.Slave processor 171 may control the linear position ofworkpiece transport unit 62 by operatingdrive actuator 71 viaservo controller 176.Light detector 91 may provide linear position information of theworkpiece transport unit 62 alongguide 66. Additionally, alinear encoder 196 may also be utilized for precisely monitoring the position ofworkpiece transport unit 62 alongguide 66. - The
conveyor slave processor 171 may also control and monitor the operation of thetransfer arm assembly 86 of the correspondingworkpiece transport unit 62. Specifically, theconveyor processor 171 may be coupled with atransfer arm motor 194 withinshaft 83 for controllably rotating the first andsecond arm extensions arm rotation encoder 197 may be provided within theshaft 83 of eachworkpiece transport unit 62 for monitoring the rotation oftransfer arm assembly 86 and providing rotation data thereof toservo controller 176 andslave processor 171. -
Slave controller 143 may be advantageously coupled with transferarm elevation motor 195 withinelevator 90 for controlling the elevational position of thetransfer arm assembly 86. An incremental transferarm elevation encoder 198 may be provided within the transferarm elevator assembly 90 for monitoring the elevation of thetransfer arm assembly 86. - In addition,
conveyor slave controller 143 may be coupled with an air supply control valve actuator (not shown) via an interface controller for controlling a vacuum withinwafer support 89 for selectively supporting a semiconductor workpiece thereon. -
Absolute encoders 199 may be provided within theworkpiece conveyor 60,interface modules processing modules 19 to detect extreme conditions of operation and protect servo motors therein. For example,absolute encoder 199 may detect a condition where thetransfer arm assembly 86 has reached a maximum height andabsolute encoder 199 may turn offelevator 90 to protect transferarm elevator motor 195. - Processing Module Control
- The
control system 100 preferably includes a processing module control subsystem 114-116 corresponding to eachworkpiece processing module processing tool 10 according to the present invention. Thecontrol system 100 may also include additional processingmodule control subsystem 119 for controlling and/or monitoring additionalworkpiece processing modules 19. - Respective processing module controls 114, 115, 116 may control and monitor the transferring of semiconductor workpieces W between a
corresponding workpiece holder 810 andworkpiece transport unit processing module - Referring to
FIG. 18 , asingle slave controller 147 may operate a plurality ofworkpiece holders 401 c-401 e within aprocessing module 20. Alternatively, asingle slave controller respective workpiece holder 401 a, 401 b. Anadditional slave controller 148 may be utilized to operate and monitor all process components 184 (i.e., flow sensors, valve actuators, heaters, temperature sensors) within asingle processing module 19. Further, as shown inFIG. 21 , asingle slave controller 145 may operate and monitor aworkpiece holder 410 andprocess components 184. - In addition, a single slave controller 145-148 may be configured to operate and monitor one or
more workpiece holder 401 andprocessing components 184. The interfacing of aslave controller 145 to both aworkpiece holder 401 and process components is shown in the control system embodiment inFIG. 21 . In particular, aservo controller 177 andinterface controller 180 may be coupled with respective ports connected toslave processor 172 ofslave controller 145. -
Slave processor 172 may operate and monitor a plurality of workpiece holder components viaservo controller 177. In particular,slave processor 172 may operatelift motor 427 for raisingoperator arm 407 aboutlift drive shaft 456. An incrementallift motion encoder 455 may be provided within aworkpiece holder 401 to provide rotational information oflift arm 407 to therespective slave processor 172 or a processor withinservo controller 177.Slave processor 172 may also control a rotatemotor 428 withinworkpiece holder 401 for rotating aprocessing head 406 aboutshafts encoder 435 may provide rotational information regarding theprocessing head 406 to thecorresponding slave processor 172. -
Spin motor 480 may also be controlled by a processor withinservo controller 177 orslave processor 172 for rotating theworkpiece holder 478 during processing of a semiconductor workpiece W held thereby. Anincremental spin encoder 498 is preferably provided to monitor the rate of revolutions of theworkpiece holder 478 and supply the rate information to theslave processor 172. -
Plating module control 114 advantageously operates thefingertips 414 of theworkpiece holder 478 for grasping or releasing a semiconductor workpiece. In particular,slave processor 172 may operate a valve viapneumatic valve actuator 201 for supplying air topneumatic piston 502 for actuatingfingertips 414 for grasping a semiconductor workpiece. Theslave controller 145 within theplating module control 114 may thereafter operate thevalve actuator 201 to remove the air supply thereby disengaging thefingertips 414 from the semiconductor workpiece.Slave processor 172 may also control the application of electrical current through thefinger assembly 824 during the processing of a semiconductor workpiece by operatingrelay 202. - The processing module controls 114, 115, 116 preferably operate and monitor the processing of semiconductor workpieces within the corresponding
workpiece processing modules process components 184. - Referring to
FIG. 21 , the control operation for theplating processing module 20 is described. Generally,slave processor 172 monitors and/orcontrols process components 184 viainterface controller 180.Slave processor 172 within theplating module control 114 operatespump 605 to draw processing solution from theprocess fluid reservoir 604 to thepump discharge filter 607. The processing fluid passes through the filter, intosupply manifold 652 and is delivered via bowl supply lines to a plurality of processing plating bowls wherein the semiconductor workpieces are processed. Each bowl supply line preferably includes aflow sensor 657 coupled with the platingprocessing module control 114 for providing flow information of the processing fluid thereto. Responsive to the flow information, theslave processor 172 may operate an actuator offlow controller 658 within each bowl supply line to control the flow of processing fluid therethrough.Slave processor 172 may also monitor and control aback pressure regulator 656 for maintaining a predetermined pressure level within thesupply manifold 652. Thepressure regulator 656 may provide pressure information to theslave processor 172 within the platingprocessing control module 114. - Similarly, processing
module control subsystems corresponding prewet module 22 and resistmodule 24. - Interface Module Control
- Each interface
module control subsystem 110 preferably controls and monitors the operation ofworkpiece interface modules interface module control 110 controls and monitors the operation of theworkpiece cassette turnstiles elevators workpiece interface modules workpiece cassettes 16. -
Slave processor 170 withinslave controller 140 ofinterface module control 110 may operate and monitor the function of theinterface modules slave processor 170 may operatedoors processing tool 10 viaports master control 100 may operatedoors - Referring to
FIG. 19 , an embodiment of the interface module control portion for controllingworkpiece interface module 38 is discussed. In particular, theslave processor 170 is coupled withservo controller 175. Eitherslave processor 170 or a processor onboard servo controller 175 may operate the components ofinterface module 38. In particular,slave processor 170 may controlturnstile motor 185 for operating rotate functions ofturnstile 40 movingworkpiece cassettes 16 between a load position and a transfer position.Incremental turnstile encoder 190 monitors the position ofturnstile 40 and provides position data toslave processor 170. Alternatively,servo controller 175 may include a processor for reading information fromturnstile encoder 190 and controllingturnstile motor 185 in response thereto.Servo controller 175 may alertslave processor 170 onceturnstile 40 has reaches a desired position. - Each
workpiece cassette turnstile 40 includes a motor for controlling the positioning ofsaddles slave processor 170 may control the position ofsaddles appropriate saddle motor 186 to orientworkpiece cassettes 16 attached thereto in one of a vertical and horizontal orientation.Incremental saddle encoders 191 are preferably provided within eachworkpiece cassette turnstile 40 for providing position information of thesaddles respective slave processor 170. - Either
slave processor 170 orservo controller 175 may be configured to control the operation of theworkpiece cassette elevator 42 for transferring aworkpiece cassette 16 between either the exchange position and the extraction position. Theslave processor 170 may be coupled with anelevator lift motor 187 andelevator rotation motor 188 for controlling the elevation and rotation ofelevator 42 andelevator support 47.Incremental lift encoder 192 andincremental rotation encoder 193 may supply elevation and rotation information of theelevator 42 andsupport 47 toslave processor 170. -
Absolute encoders 199 may be utilized to notify slave processor of extreme conditions such as whenelevator support 47 reaches a maximum height.Elevator lift motor 187 may be shut down in response to the presence of an extreme condition byabsolute encoder 199. - Methods
- Additional aspects of this invention include novel methods of handling semiconductor workpieces W within a semiconductor
workpiece processing tool 10. The method of handling semiconductor workpieces within aprocessing tool 10 having at least oneworkpiece processing module 19 and aworkpiece conveyor 60 includes a step of receiving aworkpiece cassette 16 having a plurality of semiconductor workpieces W therein into theworkpiece processing tool 10. The method additionally includes steps of simultaneously moving a first and secondworkpiece transport unit workpiece conveyor 60 to simultaneously transport individual semiconductor workpieces W between theworkpiece cassettes 16 andprocessing modules 19. - The
workpiece cassette 16 may be preferably translated or otherwise reoriented between an approximately vertical orientation and an approximately horizontal orientation within theworkpiece processing tool 10. Specifically, eachworkpiece cassette 16 and the semiconductor workpieces W therein are preferably oriented in a vertical position during the step of loading theworkpiece cassette 16 into theprocessing tool 10 or removing aworkpiece cassette 16 therefrom. The workpiece cassettes 16 and semiconductor workpieces therein are preferably oriented in a horizontal position during the step of extracting semiconductor workpieces W from theworkpiece cassette 16. Further, a plurality ofworkpiece cassettes 16 may be stored within theprocessing tool 10 to limit the exposure of theworkspace 11 of theprocessing tool 10 to the surrounding clean room environment. - The methods can also preferably provide for introducing unprocessed semiconductor workpieces into a
first interface module 38 for storage.Workpiece transport units workpiece cassette 16 held by thefirst interface module 38. Processed semiconductor workpieces are preferably placed intoworkpiece cassettes 16 held within theoutput processing module 39 for removal from theprocessing tool 10. - The present invention additionally provides for a method of handling semiconductor workpieces W within a
processing tool 10 having a plurality ofworkpiece processing modules 19 adjacent opposing sides of aworkpiece conveyor 60. The processing modules are preferably along both sides and are accessible by transport units from either side ofconveyor 60. In particular, the method comprises the steps of receiving aworkpiece cassette 16 into theprocessing tool 10 and storing theworkpiece cassette 16 therein. The semiconductor workpieces may be individually transferred via theworkpiece conveyor 60 to selectedworkpiece processing modules 19. - The method may include a translation step where the
semiconductor workpiece cassettes 16 are advantageously positioned in a vertical orientation for stability during the receiving step and in a horizontal orientation during an extraction step to facilitate access to the semiconductor workpieces within arespective workpiece cassette 16. Theworkpiece transport units workpiece processing module 19 adjacent opposing sides of theworkpiece conveyor 60 to transfer the semiconductor workpieces therebetween. Preferably, eachworkpiece transport unit workpiece conveyor 60. - The method preferably provides for introducing unprocessed semiconductor workpieces into a
first interface module 38 for storage and placing processed semiconductor workpieces intoworkpiece cassettes 16 held within theoutput processing module 39 for temporary storage and removal from theprocessing tool 10. - Workpiece Support
- Turning now to
FIG. 22 , asemiconductor processing machine 400 having two workpiece supports 401 is shown.Workpiece support 402 is shown in a “open” or “receive wafer” position in order to receive a workpiece or semiconductor wafer for further processing.Workpiece support 403 is shown in a “closed” or “deployed” position wherein the semiconductor wafer has been received by the workpiece support and is being exposed to the semiconductor manufacturing process in thesemiconductor manufacturing chamber 404.FIG. 1 also shows anoptional beam emitter 81 for emitting a laser beam detected by robotic wafer conveyors to indicate position of the unit. - Turning now to
FIG. 23 , an enlarged view of theworkpiece support 401 is shown.Workpiece support 401 advantageously includesoperator base 405, aprocessing head 406, and anoperator arm 407.Processing head 406 preferably includes workpiece holder orwafer holder 408 and which further includesfingers 409 for securely holding the workpiece during further process and manufacturing steps.Workpiece holder 408 more preferably spins aboutworkpiece spin axis 410. - The processing head is advantageously rotatable about processing head pivot axis or, more briefly termed,
process pivot axis 411. In this manner, a workpiece (not shown) may be disposed between and grasped by thefingers 409, at which point the processing head is preferably rotated about processhead pivot axis 411 to place the workpiece in a position to be exposed to the manufacturing process. - In the preferred embodiment,
operator arm 407 may be pivoted aboutoperator pivot axis 412. In this manner, the workpiece is advantageously lowered into the process bowl (not shown) to accomplish a step in the manufacture of the semiconductor wafer. - Turning now to
FIGS. 24-26 , the sequence of placing a workpiece on the workpiece support and exposing the workpiece to the semiconductor manufacturing process is shown. InFIG. 24 , a workpiece W is shown as being held in place byfingertips 414 offingers 409. Workpiece W is grasped byfingertips 414 after being placed in position by robot or other means. - Once the workpiece W has been securely engaged by
fingertips 414,processing head 406 can be rotated about processhead pivot axis 411 as shown inFIG. 25 .Process head 406 is preferably rotated aboutaxis 411 until workpiece W is at a desired angle, such as approximately horizontal. Theoperator arm 407 is pivoted about operatorarm pivot axis 412 in a manner so as to coordinate the angular position ofprocessing head 406. In the closed position, the processing head is placed against the rim ofbowl 416 and the workpiece W is essentially in a horizontal plane. Once the workpiece W has been secured in this position, any of a series of various semiconductor manufacturing process steps may be applied to the workpiece as it is exposed in theprocessing bowl 417. - Since the
processing head 406 is engaged by theoperator arm 407 on the left and right side by the preferablyhorizontal axis 411 connecting the pivot points ofprocessing head 406, a high degree of stability about the horizontal plane is obtained. Further, since theoperator arm 407 is likewise connected to theoperator base 405 at left and right sides along the essentiallyhorizontal line 412 connecting the pivot points of the operator arm, the workpiece support forms a structure having high rigidity in the horizontal plane parallel to and defined byaxes operator base 405 is securely attached to thesemiconductor process machine 400, rigidity about thespin axis 410 is also achieved. - Similarly, since processing
head 406 is nested within the fork or yoke shapedoperator arm 407 having left andright forks FIG. 23 , motion due to cantilevering of the processing head is reduced as a result of the reduced moment arm defined by the line connectingpivot axes - In a typical semiconductor manufacturing process, the
workpiece holder 408 will rotate the workpiece, having theprocess head 406 secured at two points, that is, at the left andright forks workpiece holder 408 will be significantly reduced along theaxis 411. - A more complete description of the components of the present invention and their operation and interrelation follows.
- Operator Base
- Turning now to
FIG. 30 ,operator base 405 is shown. The present invention advantageously includes anoperator base 405 which forms an essentially yoke-shaped base having an operator base backportion 420, an operator base leftyoke arm 421, and an operator baseright yoke arm 422.Yoke arms yoke 420. In the preferred embodiment, the yoke arms are secured to the yoke base by theyoke arm fasteners 423. The yoke arm base in turn is advantageously connected to thesemiconductor process machine 400 as shown inFIG. 22 . - The upper portions of the yoke arm advantageously include receptacles for housing the
operator arm bearings 424 which are used to support the pivot shafts of theoperator arm 425, described more fully below. - Operator Arm
- Still viewing
FIG. 30 , the present invention advantageously includes anoperator arm 407. As described previously,operator arm 407 preferably pivots about the operatorarm pivot axis 412 which connects the center line defined by the centers of operatorarm pivot bearings 424. - Operator arm or
pivot arm 407 is advantageously constructed in such a manner to reduce mass cantilevered about operatorarm pivot axis 412. This allows for quicker and more accurate positioning of the pivot arm as it is moved aboutpivot arm axis 412. - The left fork of the
pivot arm 418, shown more clearly inFIG. 32 , houses the mechanism for causing the pivot arm to lift or rotate about pivotarm pivot axis 412. Pivot armright fork 419, shown more clearly inFIG. 31 , houses the mechanism for causing the processing head 406 (not shown) to rotate about the processhead pivot axis 411. - The process arm
rear cavity 426, shown inFIG. 30 , houses thelift motor 452 for causing theoperator arm 407 to rotate aboutpivot arm axis 412. Process armrear cavity 426 also houses rotatemotor 428 which is used to cause theprocessing head 406 to rotate about the processinghead pivot axis 411. The rotatemotor 428 may more generally be described as a processing head pivot or rotate drive.Processing head 406 is mounted tooperator arm 407 at processing head leftpivot shaft 429 and processing headright pivot shaft 430. -
Operator arm 407 is securely attached to leftyoke arm 421 andright yoke arm 422 by operatorarm pivot shafts 425 and operatorarm pivot bearings 424, the right of which such bearing shaft and bearings are shown inFIG. 30 . - Operator Arm-Processing Head Rotate Mechanism
- Turning now to
FIG. 34 , a sectional plan view of the right rear corner ofoperator arm 407 is shown. The right rear section ofoperator arm 407 advantageously contains the rotate mechanism which is used to rotateprocessing head 406 about processinghead pivot shafts mechanism 431 preferably consists of rotatemotor 428 which drives rotateshaft 432, more generally described as a processing head drive shaft. Rotateshaft 432 is inserted within rotatepulley 425 which also functions as the operator arm pivot shaft. As described previously, the operator arm pivot shaft/lift pulley is supported in operatorarm pivot bearings 424, which are themselves supported in operatorbase yoke arm 422. Rotateshaft 432 is secured within leftpulley 424 by securingcollar 433. Securingcollar 433 secures rotatepulley 425 to rotateshaft 432 in a secure manner so as to assure a positive connection between rotatemotor 428 and rotatepulley 425. Aninner cover 584 is also provided. - Rotate
motor 428 is disposed within process armrear cavity 426 and is supported by rotatemotor support 434. Rotatemotor 428 preferably is a servo allowing for accurate control of speed and acceleration of the motor.Servo motor 428 is advantageously connected to rotateencoder 435 which is positioned on one end of rotatemotor 428. Rotateencoder 435, more generally described as processing head encoder, allows for accurate measurement of the number of rotations of rotatemotor 428, as well as the position, speed, and acceleration of the rotateshaft 432. The information from the rotate encoder may be used in a rotate circuit which may then be used to control the rotate motor when the rotate motor is a servo. This information is useful in obtaining the position and rate of travel of the processing head, as well as controlling the final end point positions of the processing head as it is rotated about process head rotateaxis 411. - The relationship between the rotate motor rotations, as measured by rotate
encoder 435, may easily be determined once the diameters of the rotatepulley 425 and theprocessing head pulley 438 are known. These diameters can be used to determine the ratio of rotate motor relations to processing head rotations. This may be accomplished by a microprocessor, as well as other means. - Rotate
pulley 425 is further supported withinoperator arm 407 by rotate pulley inboard bearing 436 which is disposed about an extended flange on the rotatepulley 425. Rotate pulley inboard bearing 436 is secured by the body of theoperator arm 407, as shown inFIG. 34 . - Rotate
pulley 425 advantageously drives rotatebelt 437, more generally described as a flexible power transmission coupling. Referring now toFIG. 31 , rotatebelt 437 is shown in the side view of theright arm 419 of theoperator arm 407. Rotatebelt 437 is preferably a toothed timing belt to ensure positive engagement with the processing head drive wheel, more particularly described herein as theprocessing head pulley 438, (not shown in this view). In order to accommodate thetoothed timing belt 437, both the rotatepulley 425 and theprocessing head pulley 438 are advantageously provided with gear teeth to match the tooth pattern of the timing belt to assure positive engagement of the pulleys with the rotate belt. - Rotate
mechanism 431 is preferably provided with rotatebelt tensioner 439, useful for adjusting the belt to take up slack as the belt may stretch during use, and to allow for adjustment of the belt to assure positive engagement with both the rotate pulley and the processing head pulley. Rotatebelt tensioner 439 adjusts the tension of rotatebelt 437 by increasing the length of the belt path between rotatepulley 425 andprocessing head pulley 438, thereby accommodating any excess lengths in the belt. Inversely, the length of the belt path may also be shortened by adjusting rotatebelt tensioner 439 so as to create a more linear path in the upper portion of rotatebelt 437. Thetensioner 439 is adjusted by rotating it abouttensioner hub 468 and securing it in a new position. - Turning now to
FIG. 34 ,processing head pulley 438 is mounted to processing head rotateshaft 430 in a secured manner so that rotation ofprocessing head pulley 438 will cause processing head rotateshaft 430 to rotate.Processing head shaft 430 is mounted to operator armright fork 419 by processing head shaft bearing 440, which in turn is secured in the frame of theright fork 419 by processing head rotate bearing 469. In a like manner,processing head shaft 429 is mounted in operator armleft fork 418 by processing head shaft bearing 441, as shown inFIG. 30 . - Processing
head pivot shafts head pivot shafts cable brackets Cable brackets cable brackets processing head 406 as it rotates about processinghead pivot shafts processing head 406 has the consequence that the service cables are twisted within the pivot shafts as a result of the rotation, thereby imparting forces to the cables. These forces are preferably isolated to a particular area so as to minimize the effects of the forces on the cables. Thecable brackets - The process head rotate
mechanism 431, shown inFIG. 34 , is also advantageously provided with a rotate overtravel protect 444, which functions as a rotate switch. Rotate overtravel protect 444 preferably acts as a secondary system to the rotateencoder 435 should the control system fail for some reason to stopservo 428 in accordance with a predetermined position, as would be established by rotateencoder 435. Turning toFIG. 34 , the rotate overtravel protect 444 is shown in plan view. The rotate overtravel protect preferably consists of rotateoptical switches 445 and 446, which are configured to correspond to the extreme (beginning and end point) portions of the processing head, as well as the primary switch component which preferably is a rotateflag 447. Rotateflag 447 is securely attached to processinghead pulley 438 such that when processing head shaft 430 (and consequently processing head 406) are rotated by virtue of drive forces imparted to theprocessing head pulley 425 by the rotatebelt 437, the rotateflag 447 will rotate thereby tracking the rotate motion ofprocessing head 406. Rotateoptical switches 445 and 446 are positioned such that rotateflag 447 may pass within the optical path generated by each optical switch, thereby generating a switch signal. The switch signal is used to control an event such as stopping rotatemotor 428. Rotate optical switch 445 will guard against overtravel ofprocessing head 406 in one direction, while rotateoptical switch 446 will provide against overtravel of theprocessing head 406 in the opposite direction. - Operator Arm-Lift Mechanism
-
Operator arm 407 is also advantageously provided with an operatorarm lift mechanism 448 which is useful for causing the operator arm to lift, that is, to pivot or rotate about operatorarm pivot axis 412. Turning toFIG. 35 , the operatorarm lift mechanism 448 is shown in the sectional plan view of the right rear corner ofoperator arm 407. - Operator
arm lift mechanism 448 is advantageously driven bylift motor 452.Lift motor 452 may be more generally described as an operator arm drive or operator arm pivot drive.Lift motor 452 is preferably a servo motor and is more preferably provided with an operator encoder, more specifically described aslift motor encoder 456. Whenlift motor 452 is a servo motor coupled withlift encoder 456, information regarding the speed and absolute rotational position of thelift motor shaft 454 may be known from the lift encoder signal. Additionally, by virtue of being a servo mechanism, the angular speed and acceleration oflift motor 452 may be easily controlled by use of the lift signal by an electrical circuit. Such a lift circuit may be configured to generate desired lift characteristics (speed, angle, acceleration, etc.).FIG. 14 shows that the lift operator may also include abrake 455 which is used to safely stop the arm if power fails. -
Lift motor 452 drives liftmotor shaft 454 which in turn drives liftgear drive 453. Lift gear drive 453 is a gear reduction drive to produce a reduced number of revolutions atlift drive shaft 456 as the function of input revolutions fromlift motor shaft 454. - Lift
drive gear shaft 456 is secured to liftanchor 451 which is more clearly shown inFIG. 32 .Lift anchor 451 is preferably shaped to have at least one flat side for positively engaginglift bushing 449.Lift anchor 451 is secured to liftdrive shaft 456 byanchor plate 458 andanchor fasteners 457. In this manner, whenlift drive shaft 456 is rotated, it will positively engagelift bushing 449. Returning toFIG. 35 , it is seen thatlift bushing 449 is mounted in operator leftyoke arm 421, and is thus fixed with respect tooperator base 405. Lift bearing 450 is disposed about the lift bushing shank and is supported inoperator arm 407 bylift bearing support 460 which is a bushing configured to receive lift bearing 450 on a first end and to support lift gear drive 453 on a second end. Lift bearingsupport 460 is further supported withinoperator arm 407 byoperator arm frame 461. The lift arm is thus free to pivot aboutlift bushing 449 by virtue oflift bearing 450. - In operation, as
lift motor 452 causes lift gear drive 453 to produce rotations atgear drive shaft 456,lift anchor 451 is forced againstlift bushing 449 which is securely positioned within rightoperator yoke arm 421. The reactive force against thelift anchor 451 will causelift bearing support 460 to rotate relative to liftbushing 449. Sincelift bushing 449 is fixed inoperator base 405, and sinceoperator base 405 is fixed to processingmachine 400, rotation oflift bearing support 460 will causelift arm 407 to pivot about operatorarm pivot axis 412, thereby moving theprocessing head 406. It is advantageous to consider the gear drive shaft (or “operator arm shaft”) as being fixed with respect tooperator base 405 when envisioning the operation of the lift mechanism. -
Operator lift mechanism 448 is also advantageously provided with a lift overtravel protect 462 or lift switch. The lift rotate protect operates in a manner similar to that described for the rotate overtravel protect 444 described above. Turning now toFIG. 32 , a left side view of theoperator arm 407 is shown which shows the lift overtravel protect in detail. - The lift overtravel protect preferably includes a lift optical switch low 463 and a lift optical switch high 464. Other types of limit switches can also be used. The switch high 464 and switch low 463 correspond to beginning and endpoint travel of
lift arm 407. The primary lift switch component islift flag 465, which is firmly attached to left operatorbase yoke arm 421. The lift optical switches are preferably mounted to themovable operator arm 407. Asoperator arm 407 travels in an upward direction in pivoting about operatorarm pivot axis 412, lift optical switch high 464 will approach thelift flag 465. Should thelift motor encoder 455 fail to stop thelift motor 454 as desired, thelift flag 465 will break the optical path of the lift optical switch high 464 thus producing a signal which can be used to stop the lift motor. In like manner, when theoperator arm 407 is being lowered by rotating it in a clockwise direction about the operatorarm pivot axis 412, as shown inFIG. 32 , overtravel ofoperator arm 407 will cause lift optical switch low 463 to have its optical path interrupted bylift flag 465, thus producing a signal which may be used to stoplift motor 452. As is shown inFIG. 32 ,lift flag 465 is mounted to left operatorbase yoke arm 421 with slotted liftflag mounting slots 467 and removablelift flag fasteners 466. Such an arrangement allows for the lift flag to be adjusted so that the lift overtravel protect system only becomes active after thelift arm 407 has traveled beyond a preferred point. - Processing Head
- Turning now to
FIG. 27 , a front elevation schematic view of theprocessing head 406 is shown.Processing head 406 is described in more detail inFIGS. 28 and 29 . Turning now toFIG. 28 , a sectional view of the left front side ofprocessing head 406 is shown.Processing head 406 advantageously includes aprocessing head housing 470 andframe 582.Processing head 406 is preferably round in shape in plan view allowing it to easily pivot about processhead pivot axis 411 with no interference fromoperator arm 407, as demonstrated inFIGS. 24-26 . Returning toFIG. 28 ,processing head housing 470 more preferably hascircumferential grooves 471 which are formed into the side ofprocess head housing 470.Circumferential grooves 471 have a functional benefit of increasing heat dissipation from processinghead 406. - The sides of
processing head housing 470 are advantageously provided with rotateshaft openings head pivot shafts head pivot shafts processing head 406 by respective left and right processing head mounts 472 and 473. Processing head mounts 472 and 473 are affirmative connected toprocessing head frame 582 which also supports processinghead door 476 which is itself securely fastened toprocessing head housing 470. Consequently, processinghead pivot shafts processing head 407 and may therefore rotate or pivot with respect tooperator arm 407. The details of how processinghead pivot shafts operator arm 407 were discussed supra. -
Processing head housing 470 forms aprocessing head void 477 which is used to house additional processing head components such as the spin motor, the pneumatic finger actuators, and service lines, all discussed more fully below. - The processing head also advantageously includes a workpiece holder and fingers for holding a workpiece, as is also more fully described below.
- Processing Head Spin Motor
- In a large number of semiconductor manufacturing processes, is desirable to spin the semiconductor wafer or workpiece during the process, for example to assure even distribution of applied process fluids across the face of the semiconductor wafer, or to aid drying of the wafer after a wet chemistry process. It is therefore desirable to be able to rotate the semiconductor workpiece while it is held by the processing head.
- The semiconductor workpiece is held during the process by
workpiece holder 478 described more fully below. In order to spinworkpiece holder 478 relative toprocessing head 406 aboutspin axis 479, an electric, pneumatic, or other type of spin motor or workpiece spin drive is advantageously provided. - Turning to
FIG. 29 ,spin motor 480 hasarmatures 526 which drivespin motor shaft 483 in rotational movement to spinworkpiece holder 478.Spin motor 480 is supported by bottom motor bearing 492 inbottom motor housing 482.Bottom motor housing 482 is secured toprocessing head 406 bydoor 476.Spin motor 480 is thus free to rotate relative toprocessing head housing 470 anddoor 476.Spin motor 480 is preferably additionally held in place bytop motor housing 481 which rests on processinghead door 476.Spin motor 480 is rotationally isolated fromtop motor housing 481 by top motor bearing 493, which is disposed between thespin motor shaft 483 andtop motor housing 481. - The spin motor is preferably an electric motor which is provided with an electrical supply source through
pivot shaft 429 and/or 430.Spin motor 480 will drivespin motor shaft 483 aboutspin axis 479. - To secure
workpiece holder rotor 484 to spinmotor shaft 483,workpiece holder rotor 484 is preferably provided with arotor hub 485.Rotor hub 485 defines arotor hub recess 486 which receives a flared end ofworkpiece holder shaft 491. The flaredend 487 ofworkpiece holder shaft 491 is secured within therotor hub recess 486 by workpiece shaft snap-ring 488 which fits withinrotor recess groove 489 above the flaredportion 487 ofworkpiece holder shaft 491. - The
workpiece holder shaft 491 is fitted inside ofspin motor shaft 483 and protrudes from the top of the spin motor shaft. The top ofworkpiece holder shaft 491 is threaded to receive thin nut 527 (seeFIG. 28 ).Thin nut 527 is tightened against optical tachometer 499 (describe more fully below).Optical tachometer 499 is securely attached to spinmotor shaft 483 such that as thespin motor 480 rotationally drives thespin motor shaft 483, theworkpiece holder shaft 491 is also driven. - Workpiece holders may be easily changed out to accommodate various configurations which may be required for the various processes encountered in manufacturing of the semiconductors. This is accomplished by removing spin encoder 498 (described below), and then
thin nut 527. Once the thin nut has been removed theworkpiece holder 478 will drop away from theprocessing head 406. - The processing head is also advantageously provided with a
spin encoder 498, more generally described as a workpiece holder encoder, and anoptical tachometer 499. As shown inFIG. 28 ,spin encoder 498 is mounted totop motor housing 481 byencoder support 528 so as to remain stationary with respect to theprocessing head 406.Optical tachometer 499 is mounted onspin motor shaft 483 so as to rotate with themotor 480. When operated in conjunction, thespin encoder 498 andoptical tachometer 499 allow the speed, acceleration, and precise rotational position of the spin motor shaft (and therefore the workpiece holder 478) to be known. In this manner, and whenspin motor 480 is provided as a servo motor, a high degree of control over the spin rate, acceleration, and rotational angular position of the workpiece with respect to theprocess head 407 may be obtained. - In one application of the present invention the workpiece support is used to support a semiconductor workpiece in an electroplating process. To accomplish the electroplating an electric current is provided to the workpiece through an alternate embodiment of the fingers (described more fully below). To provide electric current to the finger, conductive wires are run from the tops of the fingers inside of the
workpiece holder 478 through the electrode wire holes 525 in the flared lower part ofworkpiece holder shaft 491. The electrode wires are provided electric current from electrical lines run through processingpivot shaft 429 and/or 430. - The electrical line run through
pivot shaft 430/429 will by nature be stationary with respect toprocessing head housing 470. However, since the workpiece holder rotor is intended to be capable of rotation during the electroplating process, the wires passing intoworkpiece support shaft 491 through electrode wire holes 525 may rotate with respect toprocessing head housing 470. Since the rotating electrode wires withinworkpiece shaft 491 and the stationary electrical supply lines run throughpivot shaft 430/429 must be in electrical communication, the rotational/stationary problem must be overcome. In the preferred embodiment, this is accomplished by use ofelectrical slip ring 494. -
Electrical slip ring 494, shown inFIG. 28 , has alower wire junction 529 for receiving the conductive ends of the electrical wires passing intoworkpiece holder shaft 491 by electrode wire holes 525.Lower wire junction 529 is held in place withinworkpiece holder shaft 491 by insulatingcylindrical collar 497 and thus rotates withspin motor shaft 483. The electrode wires terminate in a singleelectrical contact 531 at the top of thelower wire junction 529.Electrical slip ring 494 further has acontact pad 530 which is suspended within the top ofworkpiece holder shaft 491.Contact pad 530 is mechanically fastened to spinencoder 498, which, as described previously, remains stationary with respect toprocessing head housing 470. The stationary to rotational transition is made at the tip ofcontact pad 530, which is in contact with the rotatingelectrical contact 531.Contact pad 530 is electrically conductive and is in electrical communication withelectrical contact 531. In the preferred embodiment,contact pad 530 is made of copper-beryllium. Awire 585 carries current to finger assemblies when current supply is needed, such as on the alternative embodiment described below. - Processing Head Finger Actuators
-
Workpiece holder 478, described more fully below, advantageously includes fingers for holding the workpiece W in the workpiece holder, as shown inFIGS. 28 and 29 . Since theworkpiece holder 478 may be removed as described above, it is possible to replace one style of workpiece holder with another. Since a variety of workpiece holders with a variety of fingers for holding the workpiece is possible, it is desirable to have a finger actuator mechanism disposed withinprocessing head 407 which is compatible with any given finger arrangement. The invention is therefore advantageously provided with a finger actuator mechanism. - Turning to
FIG. 28 , afinger actuator mechanism 500 is shown.Finger actuator mechanism 500 is preferably a pneumatically operated mechanism. A pneumatic cylinder is formed by acavity 501 withintop motor housing 481.Pneumatic piston 502 is disposed withincavity 501.Pneumatic piston 502 is biased in an upward position withincavity 501 byactuator spring 505.Actuator spring 505 is confined withincavity 501 bycavity end cap 507, which is itself constrained by retainingring 508. Pneumatic fluid is provided to the top ofpneumatic piston 502 viapneumatic inlet 503. Pneumatic fluid is provided topneumatic inlet 503 bypneumatic supply line 504 which is routed through processinghead pivot shaft 429 and hence through theleft fork 418 of theoperator arm 407. Turning toFIG. 29 , it can be seen that a second pneumatic cylinder which is identical to the pneumatic cylinder just described is also provided. -
Pneumatic piston 502 is attached toactuator plate 509 by actuator plate connectscrew 510. Wave springs 529 provide flexibility to the connecting atscrews 510.Actuator plate 509 is preferably an annular plate concentric with the spin motor 580 and disposed about thebottom motor housing 482, and is symmetrical aboutspin axis 479.Actuator plate 509 is secured againstpneumatic piston 502 by bushing 512 which is disposed inpneumatic piston recess 511 aboutpneumatic piston 502. Bushing 512 acts as a support for wave springs 529 to allow a slight tilting of theactuator plate 509. Such an arrangement is beneficial for providing equal action against thefinger actuator contracts 513 about the entire actuator plate orring 509. - When pneumatic fluid is provided to the space above the
pneumatic piston 502, thepneumatic piston 502 travels in a downward direction compressingactuator spring 505. Aspneumatic piston 502 travels downward,actuator plate 509 is likewise pushed downward byflexible bushing 512.Actuator plate 509 will contactfinger actuator contacts 513 causing the fingers to operate as more fully described below. - Actuator seals 506 are provided to prevent pneumatic gas from bypassing the top of the
pneumatic piston 502 and entering the area occupied byactuator spring 505. - Processing Head Workpiece Holder
-
Workpiece holder 478 is used to hold the workpiece W, which is typically a semiconductor wafer, in position during the semiconductor manufacturing process. - Turning now to
FIG. 29 , afinger 409 is shown in cross section.Finger 409 advantageously includes afinger actuator contact 513 which is contacted byactuator plate 509, as described above.Finger actuator contact 513 is connected to finger actuator lever 514 (more generally, “finger extension”) which is cantilevered from and connected to thefinger stem 515.Finger stem 515 is inserted intofinger actuator lever 514. Disposed about the portion of the finger actuator lever which encompasses and securesfinger stem 515 isfinger diaphragm 519.Finger diaphragm 519 is preferably made of a flexible material such as Tetrafluoroethylene, also known as Teflon® (registered trademark of E.I. DuPont de Nemours Company).Finger 409 is mounted toworkpiece holder rotor 484 usingfinger diaphragm 519.Finger diaphragm 519 is inserted into thefinger opening 521 inrotor 484. Thefinger diaphragm 519 is inserted into the rotor from the side opposite that to which the workpiece will be presented.Finger diaphragm 519 is secured torotor 484 againstrotor diaphragm lip 523. Forces are intentionally imparted as a result of contact between theactuator plate 509 and thefinger actuator contact 513 when thefinger actuator mechanism 500 is actuated. -
Finger actuator lever 514 is advantageously biased in a horizontal position byfinger spring 520 which acts onfinger actuator tab 522 which in turn is connected to fingeractuator lever 514.Finger spring 520 is preferably a torsion spring secured to theworkpiece holder rotor 484. -
Finger stem 515 is also preferably provided with finger collar ornut 517 which holds thefinger stem 515 againstshoulder 518.Finger collar 517 threads or otherwise securely fits over the lower end offinger actuator lever 514. Below thefinger collar 517, finger stem 515 extends for a short distance and terminates infingertip 414.Fingertip 414 contains a slight groove or notch which is beneficially shaped to receive the edge of the workpiece W. - In actuation,
finger actuator plate 509 is pushed downward byfinger actuator mechanism 500.Finger actuator plate 509 continues its downward travel contactingfinger actuator contacts 513. Asactuator plate 509 continues its downward travel, finger actuator contacts are pushed in a downward direction. As a result of the downward direction, the finger actuator levers 514 are caused to pivot. - In the preferred embodiment, a plurality of fingers are used to hold the workpiece. In one example, six fingers were used. Once the
actuator plate 509 has traveled its full extent, the finger stems 515 will be tilted away from thespin axis 479. The circumference described by the fingertips in this spread-apart position should be greater than the circumference of the workpiece W. Once a workpiece W has been positioned proximate to the fingertips, the pneumatic pressure is relieved on the finger actuator and theactuator spring 505 causes thepneumatic piston 502 to return to the top of thecavity 501. In so doing, theactuator plate 509 is retracted and the finger actuator levers are returned to their initial position by virtue of finger springs 520. - Semiconductor Workpiece Holder—Electroplating Embodiment
-
FIG. 36 is a side elevational view of asemiconductor workpiece holder 810 constructed according to a preferred aspect of the invention. -
Workpiece holder 810 is used for processing a semiconductor workpiece such as a semiconductor wafer shown in phantom at W. One preferred type of processing undertaken withworkpiece holder 810 is a workpiece electroplating process in which a semiconductor workpiece is held byworkpiece holder 810 and an electrical potential is applied to the workpiece to enable plating material to be plated thereon. Such can be, and preferably is accomplished utilizing a processing enclosure or chamber which includes a bottom half orbowl 811 shown in phantom lines inFIG. 1 .Bottom half 811 together withworkpiece holder 810 forms a sealed, protected chamber for semiconductor workpiece processing. Accordingly, preferred reactants can be introduced into the chamber for further processing. Another preferred aspect ofworkpiece holder 810 is that such moves, rotates or otherwise spins the held workpiece during processing as will be described in more detail below. - Processing Head and Processing Head Operator
- Turning now to
FIG. 36 ,semiconductor workpiece holder 810 includes aworkpiece support 812.Workpiece support 812 advantageously supports a workpiece during processing.Workpiece support 812 includes a processing head or spinhead assembly 814.Workpiece support 812 also includes a head operator or lift/rotateassembly 816.Spin head assembly 814 is operatively coupled with lift/rotateassembly 816.Spin head assembly 814 advantageously enables a held workpiece to be spun or moved about a defined axis during processing. Such enhances conformal coverage of the preferred plating material over the held workpiece. Lift/rotateassembly 816 advantageously lifts spinhead assembly 814 out of engagement with thebottom half 811 of the enclosure in which the preferred processing takes place. Such lifting is preferably about an axis x1. Once so lifted, lift/rotateassembly 816 also rotates the spin head and held workpiece about an axis x2 so that the workpiece can be presented face-up and easily removed fromworkpiece support 812. In the illustrated and preferred embodiment, such rotation is about 180° from the disposition shown inFIG. 36 . Advantageously, a new workpiece can be fixed or otherwise attached to the workpiece holder for further processing as described in detail below. - The workpiece can be removed from or fixed to
workpiece holder 810 automatically by means of a robotically controlled arm. Alternatively, the workpiece can be manually removed from or fixed toworkpiece holder 810. Additionally, more than one workpiece holder can be provided to support processing of multiple semiconductor workpieces. Other means of removing and fixing a semiconductor workpiece are possible. -
FIG. 37 is a front sectional view of theFIG. 36 semiconductor workpiece holder. As shown,workpiece support 812 includes amotor 818 which is operatively coupled with arotor 820.Rotor 820 is advantageously mounted for rotation about arotor spin axis 822 and serves as a staging platform upon which at least onefinger assembly 824 is mounted. Preferably, more than one finger assembly is mounted onrotor 820, and even more preferably, four or more such finger assemblies are mounted thereon and described in detail below although only two are shown inFIG. 37 . The preferred finger assemblies are instrumental in fixing or otherwise holding a semiconductor workpiece onsemiconductor workpiece holder 810. Each finger assembly is advantageously operatively connected or associated with aactuator 825. The actuator is preferably a pneumatic linkage which serves to assist in moving the finger assemblies between a disengaged position in which a workpiece may be removed from or added to the workpiece holding, and an engaged position in which the workpiece is fixed upon the workpiece holder for processing. Such is described in more detail below. -
FIG. 38 is a top or plan view ofrotor 820 which is effectively taken along line 3-3 inFIG. 37 .FIG. 37 shows the preferred fourfinger assemblies 824. As shown,rotor 820 is generally circular and resembles from the top a spoked wheel with a nearly continuous bottom surface.Rotor 820 includes arotor center piece 826 at the center of which liesrotor axis 822. A plurality of struts orspokes 828 are joined or connected torotor center 826 and extend outwardly to join with and support arotor perimeter piece 830. Advantageously, four ofspokes 828 support respectivepreferred finger assemblies 824.Finger assemblies 824 are advantageously positioned to engage a semiconductor workpiece, such as a wafer W which is shown in phantom lines in the position such would occupy during processing. When a workpiece is so engaged, it is fixedly held in place relative to the rotor so that processing can be effected. Such processing can include exposing the workpiece to processing conditions which are effective to form a layer of material on one or more surfaces or potions of a wafer or other workpiece. Such processing can also include moving the workpiece within a processing environment to enhance or improve conformal coverage of a layering material. Such processing can, and preferably does include exposing the workpiece to processing conditions which are effective to form an electroplated layer on or over the workpiece. - Finger Assembly
- Referring now to
FIGS. 39-41 , various views of a preferred finger assembly are shown. The preferred individual finger assemblies are constructed in accordance with the description below.FIG. 39 is an isolated side sectional view of a finger assembly constructed in accordance with a preferred aspect of the invention.FIG. 40 is a side elevational view of the finger assembly turned 90° from the view ofFIG. 39 .FIG. 41 is a fragmentary cross-sectional enlarged view of a finger assembly and associated rotor structure. The finger assembly as set forth inFIGS. 39 and 40 is shown in the relative position such as it would occupy when processing head or spin head assembly 814 (FIGS. 36 and 37 ) is moved or rotated by head operator or lift/rotateassembly 816 into a position for receiving a semiconductor workpiece. The finger assembly is shown inFIGS. 39 and 41 in an orientation of about 180° from the position shown inFIG. 41 . This typically varies becausespin head assembly 814 is rotated 180° from the position shown inFIGS. 36 and 37 in order to receive a semiconductor workpiece. Accordingly,finger assemblies 824 would be so rotated. Lesser degrees of rotation are possible. -
Finger assembly 824 includes afinger assembly frame 832. Preferably,finger assembly frame 832 is provided in the form of a sealed contact sleeve which includes an angled slot 832 a, only a portion of which is shown inFIG. 40 . Angled slot 832 a advantageously enables the finger assembly to be moved, preferably pneumatically, both longitudinally and rotationally as will be explained below. Such preferred movement enables a semiconductor workpiece to be engaged, electrically contacted, and processed in accordance with the invention. -
Finger assembly frame 832 includes a finger assembly frameouter flange 834 which, as shown inFIG. 41 , engages an innerdrive plate portion 836 ofrotor 820. Such engagement advantageously fixes or seatsfinger assembly frame 832 relative torotor 820. Such, in turn, enables the finger assembly, or a portion thereof, to be moved relative to the rotor for engaging the semiconductor workpiece. - Finger Assembly Drive System
- Referring to
FIGS. 37 and 39 -41, the finger assembly includes a finger assembly drive system which is utilized to move the finger assembly between engaged and disengaged positions. The finger assembly drive system includes abearing 838 and acollet 840 operatively adjacent the bearing. Bearing 838 includes a bearingreceptacle 839 for receiving a pneumatically driven source, a fragmented portion of which is shown directly above the receptacle inFIG. 41 . The pneumatically driven source serves to longitudinally reciprocate and rotatecollet 840, and hence a preferred portion offinger assembly 824. A preferred pneumatically driven source is described below in more detail in connection with the preferred longitudinal and rotational movement effectuated thereby. Such longitudinal reciprocation is affected by a biasing mechanism in the form of aspring 842 which is operatively mounted betweenfinger assembly frame 832 and aspring seat 844. The construction develop a bias betweenfinger assembly frame 832 andspring seat 844 to bias the finger into engagement against a wafer. Advantageously, the cooperation between the above mentioned pneumatically driven source as affected by the biasing mechanism of the finger assembly drive system, enablecollet 840 to be longitudinally reciprocated in both extending and retracting modes of movement. As such,finger assembly 824 includes a biased portion which is biased toward a first position and which is movable to a second position away from the first position. Other manners of longitudinally reciprocating the finger assembly are possible. - Finger Assembly Electrical System
- Referring to
FIGS. 37 and 40 , the finger assembly preferably includes a finger assembly electrical system which is utilized to effectuate an electrical bias to a held workpiece and supply electrical current relative thereto. The finger assembly electrical system includes apin connector 846 and afinger 848.Pin connector 846 advantageously provides an electrical connection to a power source (not shown) viawire 585 and associate slip ring mechanism, described above in connection withFIG. 28 and other Figs. This is for delivering an electrical bias and current to an electrode which is described below.Pin connector 846 also rides within angled slot 832 a thereby mechanically defining the limits to which the finger assembly may be both longitudinally and rotationally moved. -
Finger 848 is advantageously fixed or secured to or withincollet 840 by anut 850 which threadably engages a distal end portion ofcollet 840 as shown best inFIG. 39 . Ananti-rotation pin 852 advantageously securesfinger 848 withincollet 840 and prevents relative rotation therebetween. Electrical current is conducted fromconnector 846 throughcollet 840 tofinger 860, all of which are conductive, such as from stainless steel. The finger and collet cain be coated with a suitabledielectric coating 856, such as TEFLON or others. Thecollet 840 andfinger member 860 are in one form of the invention made hollow and tubular to conduct a purge gas therethrough. -
Finger assembly 824 may also optionally include a distal tip orfinger tip 854.Tip 854 may also have a purge gas passage formed therethrough.Finger tip 854 advantageously engages against a semiconductor workpiece (seeFIG. 41 ) and assists in holding or fixing the position of the workpiece relative toworkpiece holder 810.Finger tip 854 also assists in providing an operative electrical connection between the finger assembly and a workpiece to which an electrical biased is to be applied and through which current can move.Finger tip 85 can include anelectrode contact 858 for electrically contacting a surface of a semiconductor workpiece once such workpiece is secured as describe below. - Finger Assembly Drive System Interface
- A finger assembly drive system interface is operatively coupled with the finger assembly drive system to effectuate movement of the finger assembly between the engaged and disengaged positions. A preferred finger assembly drive system interface is described with reference to
FIGS. 37 and 41 . One component of the finger assembly drive system interface is afinger actuator 862.Finger actuator 862 is advantageously provided for moving the finger assembly between the engaged and disengaged position.Finger actuator 862 acts by engagingbearing receptacle 839 and movingfinger assembly 824 between an engaged position and a disengaged position. In the engaged position,finger tip 854 is engaged against a semiconductor workpiece. In the disengagedposition finger tip 854 is moved away from the workpiece. - The finger assembly drive system interface includes pneumatic actuator 825 (
FIG. 37 ).Pneumatic actuators 825 are operatively connected to anactuation ring 863 and operates thereupon causing the drive plate to move reciprocally in the vertical direction as viewed inFIG. 37 .Finger actuator 862 is operatively connected toactuation ring 863 in a manner which, upon pneumatic actuation, moves the finger actuator into engagement with bearingreceptacle 839 along the dashed line inFIG. 41 . Such allows or enables the finger assembly to be moved longitudinally along a firstmovement path axis 864. -
Pneumatic actuator linkage 825 also includes asecondary linkage 865.Secondary linkage 865 is pneumatic as well and includes alink arm 867.Link arm 867 is connected or joined to anactuator torque ring 869. Preferably,torque ring 869 is concentric with rotor 820 (FIG. 38 ) and circuitously links each of the finger actuators together. Apneumatic operator 871 is advantageously linked with thesecondary linkage 865 for applying force and operating the linkage by angularly displacingtorque ring 869. This in turn rotates the finger assemblies into and away from the engaged position. - Preferably finger
actuator engagement bits 862, under the influence ofpneumatic linkage 825, moves the finger assembly, and more specifically collet 840 andfinger 848 along a first axial movement path alongaxis 864. The fingeractuator engagement bits 862, then under as the influence ofpneumatic operator 871 are turned about the axes of each bit like a screwdriver. This movescollet 840 andfinger 848 in a second angular movement. Such second movement turns the fingers sufficiently to produce the angular displacement shown inFIG. 42 . According to a preferred aspect of this invention, such movement of the finger assemblies between the engaged and disengaged positions takes place whenspin head assembly 814 has been moved 1800 from itsFIG. 36 disposition into a face-up condition. - The
engagement bits 862 can be provided with a purge gas passage therethrough. Gas is supplied viatube 893 and is passed through the finger assemblies. - Engaged and Disengaged Positions
-
FIG. 42 is a view of a portion of a finger assembly, taken along line 7-7 inFIG. 39 . Such shows in more detail the above-described engaged and disengaged positions and movement therebetween relative to a workpiece W. In the disengaged position,finger 848 is positioned adjacent the semiconductor workpiece and the finger tip and electrode contact do not overlap with workpiece W. In the engaged position, the finger tip overlaps with the workpiece and the electrode is brought to bear against the workpiece. From the disengaged position,finger assembly 824, upon the preferred actuation, is moved in a first direction away from the disengaged position. Preferably, such first direction is longitudinal and along firstmovement path axis 864. Such longitudinal movement is linear and in the direction of arrow A as shown inFIGS. 39 and 40 . The movement moves the finger assembly to the position shown in dashed lines inFIG. 39 . Such movement is effectuated bypneumatic operator 825 which operates upon actuation ring 863 (FIG. 37 ). This in turn, causesfinger actuator 862 to engage withfinger assembly 824. Such linear movement is limited by angled slot 832 a. Thereafter, the finger assembly is preferably moved in a second direction which is different from the first direction and preferably rotational about the firstmovement path axis 864. Such is illustrated inFIG. 42 where the second direction defines a generally arcuate path between the engaged and disengaged positions. Such rotational movement is effectuated bysecondary linkage 865 which pneumatically engages the finger actuator to effect rotation thereof. As so moved, the finger assembly swings into a ready position in which a semiconductor workpiece is ready to be engaged and held for processing. Once the finger assembly is moved or swung into place overlapping a workpiece, the preferred finger actuator is spring biased and released to bear against the workpiece. An engaged workpiece is shown inFIG. 41 after the workpiece has been engaged byfinger tip 854 against aworkpiece standoff 865, and spinhead assembly 814 has been rotated back into the position shown inFIG.36 . Such preferred pneumatically assisted engagement takes place preferably alongmovement path axis 864 and in a direction which is into the plane of the page upon whichFIG. 42 appears. - As shown in
FIG. 39 ,finger 848 extends away fromcollet 840 and preferably includes abend 866 betweencollet 840 andfinger tip 854. The preferred bend is a reverse bend of around 180° which serves to pointfinger tip 854 toward workpiece W when the finger assembly is moved toward or into the engaged position (FIG. 42 ). Advantageously, thecollet 840 and hence finger 848 are longitudinally reciprocally movable into and out of the engaged position. - Finger Assembly Seal
- The finger assembly preferably includes a
finger assembly seal 868 which is effectuated betweenfinger 848 and a desired workpiece when the finger assembly is moved into the engaged position. Preferably,adjacent finger tip 854.Seal 868 is mountedadjacent electrode contact 858 and effectively seals the electrode contact therewithin whenfinger assembly 824 is moved to engage a workpiece. The seal can be made of a suitable flexible, preferably elastomeric material, such as VITON. - More specifically, and referring to
FIG. 43 ,seal 868 can include arim portion 870 which engages workpiece surface W and forms a sealing contact therebetween when the finger assembly is moved to the engaged position. Such seal advantageously isolatesfinger electrode 860 from the processing environment and materials which may plate out or otherwise be encountered therein.Seal 868 can be provided with an optional bellows wall structure 894 (FIG. 43 ), that allows more axial flexibility of the seal. -
FIG. 43 shows, in solid lines,seal 868 in a disengaged position in which rimportion 870 is not engaged with workpiece W.FIG. 43 also shows, in phantom lines, an engaged position in which rimportion 870 is engaged with and forms a seal relative to workpiece W. Preferably and advantageously,electrode contact 858 is maintained in a generally retracted position withinseal 868 when the finger assembly is in the disengaged position. However, when the finger assembly is moved into the engaged position, seal 868 andrim portion 870 thereof splay outwardly or otherwise yieldably deform to effectively enable the electrode and henceelectrode contact 858 to move into the engaged position against the workpiece. One factor which assists in forming the preferred seal between the rim portion and the workpiece is the force which is developed byspring 842 which advantageously urgescollet 840 and hencefinger 860 andfinger tip 858 in the direction of and against the captured workpiece. Such developed force assists in maintaining the integrity of the seal which is developed in the engaged position. Another factor which assists in forming the preferred seal is the yieldability or deformability of the finger tip when it is brought into contact with the workpiece. Such factors effectively create a continuous seal about the periphery ofelectrode contact 858 thereby protecting it from any materials, such as the preferred plating materials which are used during electroplate processing. - Methods and Operation
- In accordance with a preferred processing aspect of the present invention, and in connection with the above-described semiconductor workpiece holder, a sheathed electrode, such as
electrode 856, is positioned against a semiconductor workpiece surface in a manner which permits the electrode to impart a voltage bias and current flow to the workpiece to effectuate preferred electroplating processing of the workpiece. Such positioning not only allows a desired electrical bias to be imparted to a held workpiece, but also allows the workpiece itself to be mechanically held or fixed relative to the workpiece holder. That is,finger assembly 824 provides an electrical/mechanical connection between a workpiece and the workpiece holder as is discussed in more detail below. -
Sheathed electrode 856 includes a sheathed electrode tip orelectrode contact 858 which engages the workpiece surface. A seal is thus formed about the periphery of the electrode tip or contact 858 so that a desired electrical bias may be imparted to the workpiece to enable plating material to be plated thereon. According to a preferred aspect of the processing method, the sheathed electrode is moved in a first direction, preferably longitudinally along a movement axis, away from a disengaged position in which the workpiece surface is not engaged by the sheathed electrode tip or contact 858. Subsequently, the sheathed electrode is rotated about the same movement axis and toward an engaged position in which the electrode tip may engage, so as to fix, and thereafter bias the workpiece surface. Such preferred movement is effectuated bypneumatic linkage 825 andpneumatic operator 871 as described above. - According to a preferred aspect of the invention, the seal which is effectuated between the sheath tip and the workpiece is formed by utilizing a yieldable, deformable sheath tip or
terminal end 868 which includes a sheathtip rim portion 870. The sheathtip rim portion 870 advantageously splays outwardly upon contacting the workpiece surface to form a continuous seal about the periphery of the electrode tip as shown inFIG. 8 . The preferred electrode tip is brought into engagement with the workpiece surface by advancing the electrode tip from a retracted position within the sheath tip to an unretracted position in which the workpiece surface is engaged thereby. Such movement of the electrode tip between the retracted and unretracted positions is advantageously accommodated by the yieldable features of the sheath tip orterminal end 868. - In addition to providing the preferred electrical contact between the workpiece and the electrode tip, the finger assembly also forms a mechanical contact or connection between the assembly and the workpiece which effectively fixes the workpiece relative to the workpiece holder. Such is advantageous because one aspect of the preferred processing method includes rotating the workpiece about
rotor axis 822 while the workpiece is exposed to the preferred plating material. Such not only ensures that the electrical connection and hence the electrical bias relative to the workpiece is maintained during processing, but that the mechanical fixation of the workpiece on the workpiece holder is maintained as well. - The above described pneumatically effectuated movement of the preferred finger assemblies between the engaged and disengaged positions is but one manner of effectuating such movement. Other manners of effectuating such movement are possible.
- Methods Re Presenting Workpiece
- The invention also includes novel methods for presenting a workpiece to a semiconductor process. In such methods, a workpiece is first secured to a workpiece holder. The methods work equally well for workpiece holders known in the art and for the novel workpiece holders disclosed herein.
- In the next step in the sequence, the workpiece holder is rotated about a horizontal axis from an initial or first position where the workpiece holder was provided with the workpiece to a second position. The second position will be at an angle to the horizontal. The angle of the workpiece holder to the horizontal is defined by the angle between the plane of the workpiece and the horizontal. In the method, the workpiece holder is advantageously suspended about a second horizontal axis which is parallel to the first horizontal axis of the workpiece holder. At this point in the method, the angle between the first and second horizontal axes and a horizontal plane corresponds to the angle between the workpiece holder and the horizontal. The workpiece holder is then pivoted about the second horizontal axis to move the workpiece and the workpiece holder from its initial location to a final location in a horizontal plane. Advantageously, when the workpiece holder is pivoted about the second horizontal axis, the first horizontal axis also pivots about the second horizontal axis.
- Preferably, during the step of rotating the workpiece holder about the first horizontal axis, the angle of the workpiece holder with respect to some known point, which is fixed with respect to the workpiece holder during the rotation process, is continually monitored. Monitoring allows for precise positioning of the workpiece holder with respect to the horizontal surface.
- Likewise, during pivoting of the workpiece holder about the second horizontal axis, it is preferable that the angle defined by the line connecting the first and second horizontal axes and the horizontal plane be continually monitored. In this manner, the absolute position of the workpiece holder (and hence the workpiece itself) will be known with respect to the horizontal plane. This is important since the horizontal plane typically will contain the process to which the workpiece will be exposed.
- It should be noted that in the above and following description, while the workpiece is described as being presented to a horizontal plane, it is possible that the workpiece may also be presented to a vertical plane or a plane at any angle between the vertical and the horizontal. Typically, the processing plane will be a horizontal plane due to the desire to avoid gravitational effects on process fluids to which the workpiece is exposed. In one embodiment after the workpiece has been presented to the processing plane, the workpiece holder is rotated about a spin axis to cause the workpiece to spin in the horizontal plane. Although not required in all semiconductor manufacturing processes, this is a common step which may be added in the appropriate circumstance.
- The next advantageous step in the method consists of pivoting the workpiece holder about the second horizontal axis back along the path that the workpiece holder was initially pivoted along when presenting the workpiece to the horizontal process plane. There is no requirement that the workpiece holder be pivoted back to the same position whence it began, although doing so may have certain advantages as more fully described below.
- The method advantageously further consists of the step of rotating the workpiece holder about the first horizontal axis to return the workpiece to the position when it was initially presented to and engaged by the workpiece holder. It is advantageous to rotate the workpiece holder about the first axis in a direction opposite from the initial rotation of the workpiece holder.
- The advantage of having the workpiece holder terminate at an end position which corresponds to the initial position when the workpiece was loaded into the workpiece holder is efficiency. That is, additional machine movements are not required to position the workpiece holder to receive a new workpiece.
- The method more preferably includes the step of rotating the workpiece holder about the first horizontal axis at at least two support points along the first horizontal axis. This beneficially provides support and stability to the workpiece holder during the rotation process and subsequent movement of the apparatus.
- The method also more preferably includes the step of pivoting the workpiece holder along with the first horizontal axis about the second horizontal axis at at least two support points along the second horizontal axis. This beneficially provides additional support for the workpiece holder while allowing the workpiece holder to be moved in a vertical or “Z-axis” direction.
- Importantly, the only motion described in the above method is rotational motion about several axes. In the method described, there is no translational motion of the workpiece holder in a X-, Y-, or Z-axis without corresponding movement in another axis as a result of rotating through an arc.
- Electroplating Processing Station
- The workpiece process tool may comprise several different modules for performing a variety of manufacturing process steps on the workpiece or semiconductor wafer. The workpiece processing tool may advantageously contain
electroplating module 20, alternately known more generally as a workpiece processing station. - The
plating module 20 ofFIG. 44 is shown as a 5 bay plating module. This allows for up to 5 workpieces to be processed simultaneously. Each of the 5 electroplating bays may alternately be known as a workpiece processing station. Each workpiece processing station is advantageously provided with aworkpiece support 401. Each workpiece support is further advantageously provided with aprocessing head 406, anoperator arm 407, and anoperator base 405. The details of theworkpiece support 401 are described below. Theoperator base 405 of theworkpiece support 401 is mounted to the workpiece processing station by securing it to the chassis or shelf of the workpiece module. -
Workpiece support 601 is shown in a “open” or “receive wafer” position whereby a robotic arm or other means will provide a workpiece to the workpiece support. The workpiece support will positively engage the workpiece (described more fully below) by fingers 409 (or more precisely, by finger tips of finger assemblies, which are also described more fully below). Theprocessing head 406 will then rotate about theoperator arm 407 to place the workpiece in an essentially downward facing position.Operator arm 407 will then pivot aboutoperator base 405 to place the workpiece in the processing bowl as shown at 602 ofFIG. 2 . The manufacturing step or process will then be performed upon the workpiece. Following the manufacturing step, the workpiece will be returned to the open position shown byworkpiece support 601 at which time the workpiece will be removed fromfingers 409. - Although the invention is described for an electroplating process, it is to be noted that the general arrangements and configurations of the workpiece processing stations and their combination into a multi-workpiece processing station unit may be applied to a variety of processes used in manufacturing.
-
FIG. 44 also shows anoptional beam emitter 81 for emitting a laser beam detected by robotic wafer conveyors (not shown) to indicate position of the unit. - Turning to
FIG. 45 , an isometric view of theelectroplating module 20 with the front panel cut away reveals that the module is advantageously provided with a series of process bowl assemblies orplating chamber assemblies 603, aprocess fluid reservoir 604, and animmersible pump 605. Eachprocess bowl assembly 603 is connected to theimmersible pump 605 by fluid transfer lines which preferably are provided with instrumentation and control features described more fully below. - The details of the bowl assemblies and their arrangement and configuration with the other components of the invention described herein are described more fully below.
- The
process fluid reservoir 604 is mounted within theprocessing module 20 by attaching it to the module frame orchassis 606. Turning toFIG. 4 , thefluid reservoir 604 is shown in isolation withprocess bowl assembly 603,immersible pump 605, and pumpdischarge filter 607. - Turning briefly to
FIG. 49 , a side sectional view of thefluid reservoir 604 is shown. As can be seen inFIG. 49 ,process fluid reservoir 604 is advantageously a double-walled vessel having anouter reservoir wall 608 and aninner reservoir wall 609 defining areservoir safety volume 611 therebetween.Fluid reservoir 604 is preferably a double-walled vessel in the event that theinner wall 609 should leak. A double-walled vessel construction design would allow the leak to be contained within thereservoir safety volume 611 between theouter wall 608 and theinner wall 609. Should the reservoir safety volume become filled with fluid leaking from theinner vessel 612, the fluid would overflow throughreservoir overflow opening 610.Reservoir opening 610 is preferably provided with guttering or the like to channel overflow fluid to a safe collection point (not shown). Further, the reservoir safety volume may be provided with liquid detection sensors (not shown) to alert operators in the event that the inner wall ofreservoir 604 should become breached and fluid enter thereservoir safety volume 611. - The process module may also be provided with a
heat exchanger 613. Turning toFIG. 48 , theheat exchanger 613 is shown in front elevation view of theprocess fluid reservoir 604. The heat exchanger shown inFIG. 48 is a double helix-type having anexchanger inlet 614 and anexchanger outlet 615. Theexchanger 613 may be used for either cooling or heating the process fluid by circulating respectively either a cooler or warmer fluid through the exchanger than is present in the reservoir. Alternate designs of heat exchangers may also effectively be used in the apparatus of the present invention. - Bowl Assembly
- Returning to
FIG. 46 , a plurality ofbowl assembly 603 are shown mounted inreservoir top 618. The indicatedprocess chamber 603 is shown in isometric detail inFIG. 47 . - Turning to
FIG. 47 , it is seen that thebowl assembly 603 is secured withinreservoir top 618. The process bowl assembly consists of a process bowl orplating chamber 616 having abowl side 617 and abowl bottom 619. The process bowl is preferably circular in a horizontal cross section and generally cylindrical in shape although the process bowl may be tapered as well. - The invention further advantageously includes a
cup assembly 620 which is disposed withinprocess bowl 616.Cup assembly 620 includes afluid cup 621 having acup side 622 and acup bottom 623. As with the process bowl, thefluid cup 621 is preferably circular in horizontal cross section and cylindrical in shape, although a tapered cup may be used with a tapered process bowl. - Process fluid is provided to the
process bowl 616 throughfluid inlet line 625. Fluid inlet line rises through bowlbottom opening 627 and through cupfluid inlet opening 624 and terminates at inletline end point 631.Fluid outlet openings 628 are disposed within thefluid inlet line 625 in the region between the cupfluid inlet opening 624 and fluidline end point 631. In this way, fluid may flow from thefluid inlet line 625 into thecup 621 by way of theinlet plenum 629. - The
cup assembly 620 preferably includes acup filter 630 which is disposed above the fluid inlet openings and securely fits between theinner cup wall 622 and thefluid inlet line 625 so that fluid must pass through the filter before entering the upper portion ofcup 621. - In an electroplating process, the
cup assembly 620 is advantageously provided with ametallic anode 634.Anode 634 is secured within the cup assembly by attaching it to theend point 631 of the fluid inlet line.Anode 634 is thus disposed above thecup filter 630 as well as abovefluid inlet opening 628.Anode 634 is preferably circular in shape and of a smaller diameter than the inside diameter ofcup 621.Anode 634 is secured to theend point 631 offluid inlet line 625 so as to center theanode 634 withincup 621 creating an annular gap orspace 635 between theinner cup wall 622 and the edge ofanode 634.Anode 634 should be so placed such as to cause the anodeannular opening 635 to be of a constant width throughout its circumference. - The
outer cup wall 636 is advantageously of a smaller diameter than the inside diameter ofbowl 616.Cup assembly 620 is preferably positioned withinbowl 616 such that a first annular space or processfluid overflow space 632 is formed betweenbowl side 617 and cupouter wall 636. The cup assembly is more preferably positioned such that the annularfluid overflow space 632 is of a constant width throughout its circumference. -
Cup assembly 620 is further advantageously positioned withinbowl 616 such that cupupper edge 633 is below bowlupper edge 637.Cup 621 is preferably height-adjustable with respect to bowlupper edge 637, as more fully described below. -
Bowl bottom 619 is preferably configured so as to have a large open area allowing the free transfer of fluid therethrough. In the preferred embodiment, this is achieved by the structure shown inFIG. 47 wherein theprocess bowl bottom 619 is composed ofcrossbars 626 which intersect at bowlbottom center plate 639 creatingfluid return openings 638. Bowlbottom center plate 639 is provided with bowl bottom opening 627 to allowfluid inlet line 625 to pass therethrough. In the preferred embodiment, the bowl sides 617 below thereservoir top 618 are also similarly constructed so that bowl sides belowreservoir top 618 are essentially composed of 4 rectangular sections which then turn inward towards bowlbottom center plate 639 intersecting thereat. Such a configuration allows for a high degree of fluid flow to pass through the bowl lower portion which is disposed withinreservoir 604. - Thus, operation, process fluid is provided through process
fluid inlet line 625 and discharges throughfluid outlet openings 628 within the lower part of thecup assembly 620. By virtue ofcup filter 620, fluid entering thefluid inlet plenum 629 is distributed across the plenum and then flows upward throughfilter 630 to the bottom ofanode 634. - From the top side of
filter 630, the process fluid continues to flow in an upward direction by virtue of continuing feed of process fluid throughprocess inlet line 625. The process fluid flows around theannular gap 635 between theanode 634 and theinner cup wall 622. As the process fluid continues to well up withincup 621, it will eventually reachupper cup edge 633 and will overflow into the overflowannular gap 632 between theouter cup wall 636 and the inner wall ofbowl 616. - The overflowing fluid will flow from the
overflow gap 632 downward through the gap and back intoreservoir 604 where it will be collected for reuse, recycling, or disposal. In this manner, no process fluid return line is required and no elaborate fluid collection system is necessary to collect surplus fluid from the process. - As a further advantage, the location of the
cup filter 630 andanode 634 within thecup 621 provides an even distribution of fluid inlet into the cup. The even distribution beneficially assists in providing a quiescent fluid surface at the top ofcup 621. In like manner, maintaining a constant distance between the outer wall ofcup 636 and the inner wall ofbowl 616 in providing theoverflow gap 632 will assist in providing an even flow of fluid out ofcup 621 and into thereservoir 604. This further beneficially assists in providing the desired quiescence state of the process fluid at the top ofcup 621. - The material selection for
cup filter 620 will be dictated by the process and other operating needs. Typically, the filter will have the capability of filtering particles as small as 0.1 microns. Likewise, the choice of materials foranode 634 will be dictated by the desired metal to be electroplated onto the workpiece. - While the above bowl assembly has been described particularly for an electroplating process, it can be seen that for a process where a flow of fluid is required but no anode is required removing the
anode 634 from thecup assembly 603 will provide a quiescent pool of liquid for the process. In such an arrangement, theend point 631 of thefluid inlet line 625 would be capped or plugged by a cap or plug rather than by theanode 634. - To assist in ensuring that process fluid overflows into the
annular gap 632 evenly, it is necessary to ensure that the cupupper edge 633 is level such that fluid does not flow off of one side ofcup 621 faster than on another side. To accomplish this objective, levelers are preferably provided with theprocess bowl assembly 603. - Turning now to
FIG. 50 , the process bowl assembly ofFIG. 47 is shown in cross section along with theworkpiece support 401. Theprocess bowl assembly 603 is shown mounted to the processmodule deck plate 666. Platingchamber assembly 603 is preferably provided with levelers 640 (only one of which is shown in this view) which allow the plating chamber assembly to be leveled relative to the top ofreservoir 618. The levelers may consist of jack screws threaded within the edge ofmodule deck plate 666 and in contact with theprocess module frame 606 so as to elevate theprocess bowl assembly 603 relative to theprocess module 20. Theprocess bowl assembly 603 is preferably provided with three such bowl levelers distributed about the bowl periphery. This allows for leveling in both an X and Y axis or what may be generically described as “left and right leveling and front and rear leveling.” - Since
process bowl assembly 603 is free to move with respect tofluid reservoir 604, whenprocess bowl assembly 603 is fit closely withinfluid reservoir 604 as shown inFIG. 50 , the process bowl/fluid reservoir junction preferably has acompliant bowl seal 665 disposed therebetween to allow movement of theprocess bowl 616 with respect to reservoirinner wall 609.Compliant seal 665 further prevents process fluid from passing through the opening between the process bowl and the reservoir wall. -
Cup assembly 620 is preferably provided withcup height adjuster 641. The cup height adjuster shown and described herein consists of a cupheight adjustment jack 643 which is positioned about an externally portion ofinlet line 625.Cup 621 is secured to cupheight adjustment jack 643 withcup lock nut 642.Cup lock nut 642 is used to securecup 621 in its height position following adjustment. The upper end of cupheight adjustment jack 641 is provided with adjustment tool access holes 667 to allow for adjusting of the height of the cup from the top of the bowl rather than the underside. Thecup height adjuster 641 may additionally be provided with a fluid seal such as an o-ring (not shown) disposed within the annular space formed between theadjsutment jack 643 and thecup bottom 623. - The
process bowl assembly 603 is more preferably provided with an additional height adjuster for theanode 634. Since it is desirable to be able to adjust the distance between theanode 634 and the workpiece based upon the particular electroplating process being used, anode height adjuster 646 is beneficially provided. Anode height adjuster 646 is formed by mounting theanode 634 on the threadedanode post 664. A threadedanode adjustment sleeve 663 is used to connect the threaded upper end ofinlet line 625.Anode adjustment sleeve 663 is provided withsleeve openings 668 to allow fluid to pass fromfluid outlet openings 628 into theinlet plenum 629. The space between the bottom ofanode post 664 and the upper end offluid inlet line 625, and bounded by theanode adjustment sleeve 663, defines afluid outlet chamber 662. Fluid outlet chamber is of variable volume as theanode post 664 moves upward and downward with height adjustment of theanode 634. - On the
bowl leveler 640 and theheight adjusters 641 and 646 described above, it is additionally desirable to provide them with locking mechanisms so that once the desired positioning of the device (i.e., the bowl, the cup, or the anode) is achieved, the position may be maintained by securing the adjusters so that they do not move out of adjustment as a result of vibration or other physical events. - Allowing independent height adjustment of the cup and anode each with respect to the bowl provides a large degree of flexability in adjusting the
process bowl assembly 603 to accomodate a wide selection of processes. - Fluid Transfer Equipment
- To provide process fluid to the process bowl assembly in the electroplating module of the present invention, the module is advantageously provided with fluid transfer equipment. The fluid transfer equipment is provided to draw process fluid from a reservoir, supply it to the process bowl assemblies, and return it to a common collection point.
- Turning now to
FIG. 48 , a cross section of the reservoir and process bowl assemblies and additional equipment shown inFIG. 46 is shown.FIG. 48 shows aimmersible pump 605 which is mounted to thereservoir top 618. The plating module is advantageously provided with such a pump which further consists of a fluid suction orpump suction 647 which draws process fluid from thereservoir 604. The immersible pump pumps fluid from thepump suction 640 into thepump body 653 and out through the fluid discharge or pumpdischarge 648.Immersible pump 605 is preferably driven by anelectric pump motor 650. - In alternate embodiments of the present invention, a submersible pump may be deployed. However, the immersible pump has the advantage that it may be easily removed for servicing and the like. In yet another embodiment, individual pumps for each of the process bowl assemblies may be deployed or, process bowls assemblies may share a set of common pumps. Each such pump would have a process fluid inlet suction and a process fluid discharge.
- Returning to the preferred embodiment of
FIG. 48 , the plating module preferably has apump discharge filter 607 which is connected in line withpump discharge 648.Pump discharge filter 607 is preferably provided with aremovable filter top 649 so that filter cartridges within the filter may be replaced. The filter type, size and screen size will be dictated by the needs of the particular process being deployed at the time. - From the
pump discharge filter 607, the process fluid exits through filter outlet 651 and intosupply manifold 652. The supply manifold supplies all of theprocess bowl assemblies 603 with process fluid. Branching off from thesupply manifold 652 are the individual fluid inlet lines 625. Thefluid inlet lines 625 are preferably provided with flow control devices which are more fully described below. - At the down stream end of the
supply manifold 652 after the finalprocessing bowl assembly 661, the manifold is routed tofluid return line 654. Although the supply manifold could be terminated at an open ended point atoptional end point 655, in the preferred embodiment, thesupply manifold 652 is additionally provided with aback pressure regulator 656, which is described more fully below. Since it is advantageous to have the back pressure regulator outside of the fluid reservoir for ease of access, thefluid return line 654 is provided when theback pressure regulator 656 is employed. - Control Devices
- In the preferred embodiment, the work station processing module of the present invention further includes devices for controlling the flow and distribution of the process fluid to the process bowl assemblies.
- With reference to
FIG. 48 , the apparatus of the present invention is beneficially provided withflow sensors 657 which are disposed within thefluid inlet line 625 for each individualprocess bowl assembly 603. Theflow sensors 657 will measure the amount of process fluid flowing through each fluid inlet line and will generate a signal which will be transmitted byflow signal line 659. A signal will typically be an electrical signal but may also be a pneumatic or other type of signal. - The
processing modules 603 are also preferrably provided withflow restrictors 658 which are disposed influid inlet lines 625 after theflow sensor 657 but before the fluid outlet opening 628 within cup 621 (shown inFIG. 47 ). The flow restrictor may alternately be known as a variable orifice or a control valve. The flow restrictor 658 may either be manually adjustable, or may be responsive to a signal provided by flowcontrol signal line 660. The flow control signal line may be a pneumatic, electrical or other type of signal. The objective of the flow controller is to control the quantity of process fluid being provided to thefluid cup 621 during the processing step of manufacturing the semiconductor. When the flow restrictor is responsive to a control signal, the information provided from theflow signal line 659 may be used to modify or generate the flow control signal which is then provided to theflow controller 658. This control may be provided by a micro processor or by other control devices which are commercially available. - More preferably, the semiconductor processing module is provided with
back pressure regulator 656. Aspump discharge filter 607 becomes restricted due to captured filtrate, the pressure withinsupply manifold 652 will drop, reducing flow of process fluid to the fluid cups 621.Back pressure regulator 656 is used to maintain a preselected pressure in thesupply manifold 652 to ensure that sufficient pressure is available to provide the required flow of process fluid to the fluid cups.Back pressure regulator 656 further comprises an internal pressure sensor and preferably includes a signal generator for generating a control signal to open or close the back pressure regulator to increase or decrease the pressure in the supply manifold. The back pressure regulator may be controlled by an external controller such as a micro processor or it may have a local set point and be controlled by an internal local control mechanism. - In an alternate embodiment, where a dedicated process pump is used for each process bowl assembly, a back pressure regulator would typically not be required.
- Plating Methods
- The present invention also includes a novel method for processing a semiconductor workpiece during manufacturing.
- In the preferred embodiments of the method, a semiconductor workpiece or wafer is presented to the semiconductor manufacturing process. This may be accomplished by use of the
workpiece support 401 shown inFIG. 50 and described more fully herein.FIG. 51 shows the workpiece W being presented to the process. At the time that the workpiece is presented to the process, the process fluid, which in an electroplating process is an electrolytic solution, is cause to flow within a processing chamber (herein the cup 621) to the workpiece. This assures that a sufficient quantity of fluid is available for the required process step. - The workpiece W is preferably presented to the process in a precisely located position so that all surfaces of the workpiece are exposed to the solution. In an electroplating process, it is advantageous to expose only the downward facing or working surface of the wafer to the electrolytic solution and not the backside of the wafer. This requires accurate positioning of the wafer with respect to the fluid surface. In an electroplating process, the method also requires the step of accurately positioning the workpiece with respect to the
anode 634 so that the anode and workpiece are separated by an equal distance at all points. - Once the workpiece has been positioned as the process may specifically require, the next step in the method is performing the actual processing step itself. For example, in an electroplating application, the processing step would include applying an electric current to the workpiece so as to generate the current through the electrolytic solution thereby plating out a layer of a desired metallic substance on the wafer. Typically a current will be applied to the anode as well, with a negative current being applied to the workpiece. The processing step is applied for the length of time which is dictated by the process itself.
- The process further includes the step of continuing a flow of the process fluid such that the process fluid overflows the processing chamber and falls under gravitational forces into a process fluid reservoir. Preferrably the process fluid reservoir is the same reservoir which provides the process fluid or solution to the process.
- As an additional step in the method of processing the semiconductor wafer in the electroplating process, the method includes the further step of spinning or rotating the workpiece about a vertical axis while it is exposed to the electrolytic solution. The rate of rotation varies between about 5 and 30 rpm and is more preferably approximately 10 rpm. The rotation step provides the beneficial result of additional assurance of even distribution of the electrolytic solution across the face of the workpiece during the electroplating process.
- After the processing has been performed on the semiconductor wafer, the method advantageously includes the step of removing the workpiece from the process and returning it to a position where it may be removed for further processing or removal from the semiconductor workpiece process tool.
- The method preferably includes the step of performing the above-described steps at a series of process bowls having a common fluid reservoir such that the overflowing fluid gravity drains into a common fluid reservoir.
- In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
Claims (7)
1-4. (canceled)
5. A head assembly for holding a microelectronic workpiece in electrochemical processing, comprising:
a motor having a rotor axis;
a support coupled to the motor to rotate about the rotor axis, the support being configured to carry a microelectronic workpiece facedown in a workpiece processing plane generally normal to the rotor axis; and
a plurality of electrical contacts carried by the support, the electrical contacts having first sections outside of a workpiece zone where a workpiece is positioned relative to the support and second sections projecting from the first sections into a perimeter area of the workpiece zone, wherein individual second sections of the electrical contacts have (a) an inclined portion extending at an inclined angle relative to the workpiece processing plane and (b) a conductive contact region configured to press against a surface of the workpiece upon which electrochemical processing is to occur.
6. The head assembly of claim 5 wherein the first sections of the electrical contacts project from the support member to a level beyond the workpiece processing plane and the second sections project from the first sections toward the workpiece processing plane.
7. The head assembly of claim 5 wherein the inclined portions of the second sections of the electrical contacts are sloped toward the workpiece processing plane.
8. A tool for electrochemical processing of microelectronic workpieces, comprising:
a chamber;
a head assembly aligned with the chamber, the head assembly including a motor having a rotor axis, a support coupled to the motor to rotate about the rotor axis, and a plurality of electrical contacts carried by the support, wherein
the support is configured to carry a microelectronic workpiece facedown in a workpiece processing plane generally normal to the rotor axis, and
the contacts have first sections outside of a workpiece zone where a workpiece is positioned relative to the support and second sections projecting from the first sections, and wherein individual second sections of individual electrical contacts have (a) an inclined portion extending at an inclined angle relative to the workpiece processing plane and (b) a conductive contact region configured to press against a surface of the workpiece upon which electrochemical processing is to occur.
9. The tool of claim 8 wherein the first sections of the electrical contacts project from the support member to a level beyond the workpiece processing plane and the second sections project from the first sections toward the workpiece processing plane.
10. The tool of claim 8 wherein the inclined portions of the second sections are sloped toward the workpiece processing plane.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/101,834 US20050193537A1 (en) | 1996-07-15 | 2005-04-07 | Modular semiconductor workpiece processing tool |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/680,068 US6203582B1 (en) | 1996-07-15 | 1996-07-15 | Modular semiconductor workpiece processing tool |
US09/810,192 US6440178B2 (en) | 1996-07-15 | 2001-03-16 | Modular semiconductor workpiece processing tool |
US10/157,762 US7074246B2 (en) | 1996-07-15 | 2002-05-28 | Modular semiconductor workpiece processing tool |
US11/101,834 US20050193537A1 (en) | 1996-07-15 | 2005-04-07 | Modular semiconductor workpiece processing tool |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/157,762 Continuation US7074246B2 (en) | 1996-07-15 | 2002-05-28 | Modular semiconductor workpiece processing tool |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050193537A1 true US20050193537A1 (en) | 2005-09-08 |
Family
ID=24729520
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/680,068 Expired - Lifetime US6203582B1 (en) | 1996-07-15 | 1996-07-15 | Modular semiconductor workpiece processing tool |
US09/810,192 Expired - Lifetime US6440178B2 (en) | 1996-07-15 | 2001-03-16 | Modular semiconductor workpiece processing tool |
US10/157,762 Expired - Fee Related US7074246B2 (en) | 1996-07-15 | 2002-05-28 | Modular semiconductor workpiece processing tool |
US11/101,834 Abandoned US20050193537A1 (en) | 1996-07-15 | 2005-04-07 | Modular semiconductor workpiece processing tool |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/680,068 Expired - Lifetime US6203582B1 (en) | 1996-07-15 | 1996-07-15 | Modular semiconductor workpiece processing tool |
US09/810,192 Expired - Lifetime US6440178B2 (en) | 1996-07-15 | 2001-03-16 | Modular semiconductor workpiece processing tool |
US10/157,762 Expired - Fee Related US7074246B2 (en) | 1996-07-15 | 2002-05-28 | Modular semiconductor workpiece processing tool |
Country Status (4)
Country | Link |
---|---|
US (4) | US6203582B1 (en) |
EP (1) | EP0912994A1 (en) |
JP (1) | JP2000515319A (en) |
WO (1) | WO1998002911A1 (en) |
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US8160731B2 (en) * | 2009-08-18 | 2012-04-17 | Empire Technology Development Llc | Stabilized platform system |
US20110302800A1 (en) * | 2010-06-15 | 2011-12-15 | Tsan-Hsiung Cheng | Air inlet and outlet passage module for desiccation |
US8359768B2 (en) * | 2010-06-15 | 2013-01-29 | Tsan-Hsiung Cheng | Air inlet and outlet passage module for desiccation |
US20120117787A1 (en) * | 2010-11-12 | 2012-05-17 | Industrial Technology Research Institute | Manufacturing method for machine tool |
US8763230B2 (en) * | 2010-11-12 | 2014-07-01 | Industrial Technology Research Institute | Manufacturing method for machine tool |
Also Published As
Publication number | Publication date |
---|---|
US20010030101A1 (en) | 2001-10-18 |
JP2000515319A (en) | 2000-11-14 |
WO1998002911A1 (en) | 1998-01-22 |
US6203582B1 (en) | 2001-03-20 |
US20020194716A1 (en) | 2002-12-26 |
US6440178B2 (en) | 2002-08-27 |
EP0912994A1 (en) | 1999-05-06 |
US7074246B2 (en) | 2006-07-11 |
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