US20050213367A1 - Circuit for accessing a chalcogenide memory array - Google Patents
Circuit for accessing a chalcogenide memory array Download PDFInfo
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- US20050213367A1 US20050213367A1 US10/811,454 US81145404A US2005213367A1 US 20050213367 A1 US20050213367 A1 US 20050213367A1 US 81145404 A US81145404 A US 81145404A US 2005213367 A1 US2005213367 A1 US 2005213367A1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0033—Disturbance prevention or evaluation; Refreshing of disturbed memory data
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
Definitions
- the present invention was made under government contract SC-0244-00-0002.
- the present invention relates to memory circuits in general, and in particular to memory circuits having chalcogenide cells. Still more particularly, the present invention relates to a circuit for accessing a chalcogenide memory array.
- phase change materials for an electronic memory application.
- phase change materials can be electrically switched between a first structural state where the material is generally amorphous and a second structural state where the material is generally crystalline.
- the phase change material exhibits different electrical characteristics depending upon its state. For example, in its amorphous state, the phase change material exhibits a lower electrical conductivity than it does in its crystalline state.
- the phase change material may also be electrically switched between different detectable states of local order across the entire spectrum ranging from the completely amorphous state to the completely crystalline state.
- the state switching of the phase change materials is not limited to either completely amorphous or completely crystalline states but rather in incremental steps to provide a “gray scale” represented by a multiplicity of conditions of local order spanning the spectrum from the completely amorphous state to the completely crystalline state.
- phase change material memory cells are monolithic, homogeneous, and formed of chalcogenide material containing chemical elements selected from the group of Tellurium (Te), Selenium (Se), Antimony (Sb), Nickel (Ni), and Germanium (Ge).
- Chalcogenide memory cells can be switched between two different electrically detectable states within nanoseconds in response to an input of picojoules of energy.
- Chalcogenide memory cells are truly non-volatile and can maintain the stored information without the need for periodic refreshing. Furthermore, the stored information remains intact even when power is removed from the chalcogenide memory cells.
- the present disclosure describes a circuit for accessing a chalcogenide memory array.
- a random access memory includes a memory array having multiple subarrays with rows and columns formed by chalcogenide storage elements.
- the random access memory also includes discrete read and write circuits. Associated with a respective one of the subarrays, each of the write circuits includes an independent write 0 circuit and an independent write 1 circuit. Also associated with a respective one of the subarrays, each of the read circuits includes a sense amplifier circuit.
- a voltage level control module is coupled to the read and write circuits to ensure that voltages across the chalcogenide storage elements within the memory array do not exceed a predetermined value during read and write operations.
- FIG. 1 is a block diagram of a chalcogenide random access memory (CRAM), in accordance with a preferred embodiment of the present invention
- FIG. 2 is a block diagram of a column within one of the subarrays within the CRAM from FIG. 1 , in accordance with a preferred embodiment of the present invention
- FIG. 3 is a circuit diagram of a write 0 circuit and a write 1 circuit within the CRAM from FIG. 1 , in accordance with a preferred embodiment of the present invention
- FIG. 4 is a circuit diagram of a post-write discharge circuit within the CRAM from FIG. 1 , in accordance with a preferred embodiment of the present invention.
- FIG. 5 is a circuit diagram of a read voltage clamp circuit within the CRAM from FIG. 1 , in accordance with a preferred embodiment of the present invention.
- a CRAM 10 includes write circuits 15 a - 15 n , read circuits 16 a - 16 n , and memory subarrays 17 a - 17 n .
- Each of memory subarrays 17 a - 17 n is associated with a separate write circuit and a separate read circuit.
- memory subarray 17 a is associated with write circuit 15 a and read circuit 16 a
- memory subarray 17 b is associated with write circuit 15 b and read circuit 16 b
- memory subarray 17 n is associated with write circuit 15 n and read circuit 16 n
- Write circuits 15 a - 15 n and read circuits 16 a - 16 n are collectively controlled by a voltage level control module 11 .
- Voltage level control module 11 includes a post-write discharge circuit 12 , a read voltage clamp circuit 14 and a reference voltage circuit 13 .
- Reference voltage circuit 13 provides a constant reference voltage for post-write discharge circuit 12 and read voltage clamp circuit 14 .
- the reference voltage generated by reference voltage circuit 13 is preferably selected to optimize the clamping voltage generated by read voltage clamp circuit 14 in accordance with the processing technology for CRAM 10 .
- CRAM 10 also includes a column decoder 18 and a row decoder 19 .
- Column decoder 18 further contains a write logic circuit 91 , a read logic circuit 92 and a column address circuit 93 .
- write logic circuit 91 provides a column address to corresponding write circuits 15 a - 15 n such that data can be written to an appropriate column within one of subarrays 17 a - 17 n .
- read logic circuit 92 provides a column address to corresponding read circuits 16 a - 16 n such that data can be read from an appropriate column within one of subarrays 17 a - 17 n .
- row decoder 19 provides row addresses for the appropriate memory cell within subarrays 17 a - 17 n during read and write operations.
- CRAM 10 can be coupled to an electronic device (not shown) such as a processor, a memory controller, a chip set, etc.
- the electronic device is preferably coupled to column decoder 18 and row decoder 19 via respective address lines.
- the electronic device is also coupled to voltage level control module 11 via various control lines.
- the electronic device is coupled to an input/output circuit of CRAM 10 via corresponding input/output lines.
- Each of write circuits 15 a - 15 n includes a write 0 circuit and a write 1 circuit. As their names imply, a write 0 circuit is utilized to write a logical “0” to a memory cell within a corresponding one of subarrays 17 a - 17 n , and a write 1 circuit is utilized to write a logical “1” to a memory cell within a corresponding one of subarrays 17 a - 17 n .
- Each of read circuits 16 a - 16 n includes a sense amplifier circuit. Each of subarrays 17 a - 17 n are arranged in columns and rows.
- subarrays 17 a - 17 n are constructed to use a memory cell sensing scheme such that each column is to be used in reading data from a memory cell within a corresponding one of subarrays 17 a - 17 n.
- CRAM 10 is shown to have a single memory array having multiple subarrays, such as subarrays 17 a - 17 n .
- a CRAM may have multiple memory arrays and each of the memory arrays may include multiple subarrays.
- each memory array within a CRAM preferably includes one reference voltage circuit, such as reference voltage circuit 13 .
- each subarray is preferably associated with one write 0 circuit, one write 1 circuit and one read circuit.
- Each column within subarrays 17 a - 17 n includes multiple memory cells, and each memory cell is comprised of a storage element made of chalcogenide materials.
- Chalcogenide materials are chemical elements selected from the group of Tellurium (Te), Selenium (Se), Antimony (Sb) and Germanium (Ge).
- a chalcogenide storage element 26 is coupled to a column switch 25 and a row switch 27 .
- Row switch 25 and column switch 27 are part of a row multiplexor and a column multiplexor, respectively.
- chalcogenide storage element 26 is accessed by either a write 0 circuit 28 or a write 1 circuit 29 , and then by post-write discharge circuit 12 .
- chalcogenide storage element 26 is accessed by read circuit 16 a via read voltage clamp circuit 14 .
- the reference voltage for read voltage clamp circuit 14 is provided by reference voltage circuit 13 .
- read circuit 16 a includes a current mirror 21 and a current-voltage converter 22 .
- chalcogenide material in a binary mode memory cell requires separate write 0 and write 1 circuits, such as write 0 circuit 28 and write 1 circuit 29 , to provide different temperature (energy) profiles based on whether a logical “0” or “1” is to be stored.
- Each of write circuits 28 and 29 tailors a pulse width to account for the differences in programming time according to the data value needed to be stored in the memory cell.
- the amount of energy imparted to chalcogenide storage element 26 varies, depending on the desired polycrystalline or amorphous retention state.
- either write 0 circuit 28 or write 1 circuit 29 provides an appropriate amount of current flow to chalcogenide storage element 26 . Additional control can be provided through independent bias points that sufficiently modulate write circuits 28 and 29 from an external source.
- write circuit 15 a includes write 0 circuit 28 and write 1 circuit 29 .
- Write 0 circuit 28 includes p-channel transistors 51 - 52 and n-channel transistor 55 .
- Write 1 circuit 29 includes p-channel transistors 53 - 54 and n-channel transistor 56 .
- Transistors 51 and 55 are connected in series between power supply V DD and ground.
- transistors 53 and 56 are connected in series between power supply V DD and ground.
- Transistors 52 and 54 are separately connected between power supply V DD and chalcogenide memory element 26 .
- the gate of transistor 52 is connected to the node between transistors 51 and 55 .
- the gate of transistor 54 is connected to the node between transistors 53 and 56 .
- Inputs to write circuit 15 a include write enable input 65 , column decode input 66 and data input 67 .
- An NAND gate 57 combines a write enable signal at write enable input 65 , a column decode signal at column decode input 66 and a data signal at data input 67 to feed the gates of transistors 51 and 55 .
- an NAND gate 58 combines a write enable signal at write enable input 65 , a column decode signal at column decode input 66 and a data signal at data input 67 to feed the gates of transistors 53 and 56 .
- Transistor 54 is the write transistor for write 0 circuit 28
- transistor 52 is the write transistor for write 1 circuit 29
- the size of transistor 54 is preferably larger than the size of transistor 52 such that more current can be provided to chalcogenide memory element 26 for a write 0 operation.
- relatively less current is provided to chalcogenide memory element 26 by transistor 52 for a write 1 operation.
- transistor 54 within write 0 circuit 28 is turned on to allow a first predetermined amount of current to program chalcogenide memory element 26 to store a logical “0.”
- transistor 52 within write 1 circuit 29 is turned on to allow a second predetermined amount of current to program chalcogenide memory element 26 to store a logical “1.”
- Post-write discharge circuit 12 (from FIG. 1 ) is specifically designed to lower the voltage on a previously written column to prevent any reprogramming of a chalcogenide storage element within the same column on subsequent read operations.
- FIG. 4 there is illustrated a circuit diagram of post-write discharge circuit 12 , in accordance with a preferred embodiment of the present invention.
- post-write discharge circuit 12 includes an n-channel transistor 31 and an n-channel transistor 32 connected in series.
- the drain of transistor 31 is connected to chalcogenide memory element 26 .
- the source of transistor 31 is connected to the drain of transistor 32 .
- the drain of transistor 32 is also connected the gate of transistor 32 to form a diode.
- the source of transistor 32 is connected to the ground.
- a discharge signal at a discharge signal input 34 and a column decode signal at a column decode signal input 35 enable transistor 31 to be connected to chalcogenide memory element 26 and also enable transistor 31 to be in series with transistor 32 connected to ground.
- Read voltage clamp circuit 14 (from FIG. 1 ) establishes an acceptable voltage limit across chalcogenide memory element 26 to prevent the parasitic effects of stored charges on a column from influencing the information stored in chalcogenide memory element 26 . If the column discharges to ground (below the limit set by discharge circuit 12 ), read voltage clamp circuit 24 also restores the voltage of the column to the acceptable voltage.
- FIG. 5 there is depicted a circuit diagram of read voltage clamp circuit 14 , in accordance with a preferred embodiment of the present invention. As shown, read voltage clamp circuit 24 includes a p-channel transistor 41 and two n-channel transistors 42 - 43 connected in series. The drain of transistor 41 is connected to a power supply V DD .
- the source of transistor 43 is connected to chalcogenide memory element 26 .
- the gate of transistor 41 is connected to an NAND gate 44 having a negative clock signal input 47 and a column decode input 48 .
- the gate of transistor 42 is connected to a voltage limit signal input 45 .
- the gate of transistor 43 is connected to a read signal input 46 .
- a voltage limit signal from voltage limit signal input 45 modulates the acceptable voltage during the negative clock cycle.
- the present invention provides a circuit for accessing a chalcogenide memory array.
- chalcogenide storage element is utilized to illustrate the present invention, it is understood by those skilled in the art that two chalcogenide storage elements can be associated with a logical data bit by utilizing a double-ended or “differential” version of the above-described single-ended circuit.
- the doubled-end circuit is similar to the above-described single-ended circuit except that there is a complementary data input with its own read and write circuits to store the complement of each input data bit in a chalcogenide storage element, and a differential amplifier circuit is utilized to sense the complementary data bits stored.
- the differential design of the true-and-complement value of each logical data bit provides a higher noise margin and thus provides a greater reliability for each data bit stored in case of a defect exists in the input signals or the chalcogenide memory chip.
Abstract
Description
- The present invention was made under government contract SC-0244-00-0002.
- 1. Technical Field
- The present invention relates to memory circuits in general, and in particular to memory circuits having chalcogenide cells. Still more particularly, the present invention relates to a circuit for accessing a chalcogenide memory array.
- 2. Description of Related Art
- The use of electrically writable and erasable phase change materials for an electronic memory application is known in the art. Such phase change materials can be electrically switched between a first structural state where the material is generally amorphous and a second structural state where the material is generally crystalline. The phase change material exhibits different electrical characteristics depending upon its state. For example, in its amorphous state, the phase change material exhibits a lower electrical conductivity than it does in its crystalline state. The phase change material may also be electrically switched between different detectable states of local order across the entire spectrum ranging from the completely amorphous state to the completely crystalline state. In other words, the state switching of the phase change materials is not limited to either completely amorphous or completely crystalline states but rather in incremental steps to provide a “gray scale” represented by a multiplicity of conditions of local order spanning the spectrum from the completely amorphous state to the completely crystalline state.
- General speaking, phase change material memory cells are monolithic, homogeneous, and formed of chalcogenide material containing chemical elements selected from the group of Tellurium (Te), Selenium (Se), Antimony (Sb), Nickel (Ni), and Germanium (Ge). Chalcogenide memory cells can be switched between two different electrically detectable states within nanoseconds in response to an input of picojoules of energy. Chalcogenide memory cells are truly non-volatile and can maintain the stored information without the need for periodic refreshing. Furthermore, the stored information remains intact even when power is removed from the chalcogenide memory cells.
- The present disclosure describes a circuit for accessing a chalcogenide memory array.
- In accordance with a preferred embodiment of the present invention, a random access memory includes a memory array having multiple subarrays with rows and columns formed by chalcogenide storage elements. The random access memory also includes discrete read and write circuits. Associated with a respective one of the subarrays, each of the write circuits includes an
independent write 0 circuit and anindependent write 1 circuit. Also associated with a respective one of the subarrays, each of the read circuits includes a sense amplifier circuit. In addition, a voltage level control module is coupled to the read and write circuits to ensure that voltages across the chalcogenide storage elements within the memory array do not exceed a predetermined value during read and write operations. - All features and advantages of the present invention will become apparent in the following detailed written description.
- The invention itself, as well as a preferred mode of use, further objects, and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein:
-
FIG. 1 is a block diagram of a chalcogenide random access memory (CRAM), in accordance with a preferred embodiment of the present invention; -
FIG. 2 is a block diagram of a column within one of the subarrays within the CRAM fromFIG. 1 , in accordance with a preferred embodiment of the present invention; -
FIG. 3 is a circuit diagram of a write 0 circuit and a write 1 circuit within the CRAM fromFIG. 1 , in accordance with a preferred embodiment of the present invention; -
FIG. 4 is a circuit diagram of a post-write discharge circuit within the CRAM fromFIG. 1 , in accordance with a preferred embodiment of the present invention; and -
FIG. 5 is a circuit diagram of a read voltage clamp circuit within the CRAM fromFIG. 1 , in accordance with a preferred embodiment of the present invention. - Referring now to the drawings and in particular to
FIG. 1 , there is illustrated a block diagram of a chalcogenide random access memory (CRAM), in accordance with a preferred embodiment of the present invention. As shown, aCRAM 10 includes write circuits 15 a-15 n, read circuits 16 a-16 n, and memory subarrays 17 a-17 n. Each of memory subarrays 17 a-17 n is associated with a separate write circuit and a separate read circuit. For example,memory subarray 17 a is associated withwrite circuit 15 a and readcircuit 16 a,memory subarray 17 b is associated withwrite circuit 15 b and readcircuit 16 b,memory subarray 17 n is associated withwrite circuit 15 n and readcircuit 16 n, etc. Write circuits 15 a-15 n and read circuits 16 a-16 n are collectively controlled by a voltagelevel control module 11. - Voltage
level control module 11 includes apost-write discharge circuit 12, a readvoltage clamp circuit 14 and areference voltage circuit 13.Reference voltage circuit 13 provides a constant reference voltage forpost-write discharge circuit 12 and readvoltage clamp circuit 14. In addition, the reference voltage generated byreference voltage circuit 13 is preferably selected to optimize the clamping voltage generated by readvoltage clamp circuit 14 in accordance with the processing technology forCRAM 10. - CRAM 10 also includes a
column decoder 18 and arow decoder 19.Column decoder 18 further contains awrite logic circuit 91, aread logic circuit 92 and acolumn address circuit 93. During a write operation, writelogic circuit 91 provides a column address to corresponding write circuits 15 a-15 n such that data can be written to an appropriate column within one of subarrays 17 a-17 n. During a read operation, readlogic circuit 92 provides a column address to corresponding read circuits 16 a-16 n such that data can be read from an appropriate column within one of subarrays 17 a-17 n. In conjunction with the column addresses fromcolumn decoder 18,row decoder 19 provides row addresses for the appropriate memory cell within subarrays 17 a-17 n during read and write operations. - CRAM 10 can be coupled to an electronic device (not shown) such as a processor, a memory controller, a chip set, etc. The electronic device is preferably coupled to
column decoder 18 androw decoder 19 via respective address lines. The electronic device is also coupled to voltagelevel control module 11 via various control lines. In addition, the electronic device is coupled to an input/output circuit ofCRAM 10 via corresponding input/output lines. - Each of write circuits 15 a-15 n includes a write 0 circuit and a write 1 circuit. As their names imply, a
write 0 circuit is utilized to write a logical “0” to a memory cell within a corresponding one of subarrays 17 a-17 n, and a write 1 circuit is utilized to write a logical “1” to a memory cell within a corresponding one of subarrays 17 a-17 n. Each of read circuits 16 a-16 n includes a sense amplifier circuit. Each of subarrays 17 a-17 n are arranged in columns and rows. Along the sense amplifier circuits, subarrays 17 a-17 n are constructed to use a memory cell sensing scheme such that each column is to be used in reading data from a memory cell within a corresponding one of subarrays 17 a-17 n. - In
FIG. 1 ,CRAM 10 is shown to have a single memory array having multiple subarrays, such as subarrays 17 a-17 n. However, a CRAM may have multiple memory arrays and each of the memory arrays may include multiple subarrays. Although a CRAM only needs one row multiplexor and one column multiplexor, each memory array within a CRAM preferably includes one reference voltage circuit, such asreference voltage circuit 13. In addition, each subarray is preferably associated with one write 0 circuit, one write 1 circuit and one read circuit. - With reference now to
FIG. 2 , there is depicted a block diagram of a column within one of subarrays 17 a-17 n fromFIG. 1 , in accordance with a preferred embodiment of the present invention. Each column within subarrays 17 a-17 n includes multiple memory cells, and each memory cell is comprised of a storage element made of chalcogenide materials. Chalcogenide materials are chemical elements selected from the group of Tellurium (Te), Selenium (Se), Antimony (Sb) and Germanium (Ge). As shown, achalcogenide storage element 26 is coupled to acolumn switch 25 and arow switch 27.Row switch 25 andcolumn switch 27 are part of a row multiplexor and a column multiplexor, respectively. - During a write operation,
chalcogenide storage element 26 is accessed by either awrite 0circuit 28 or awrite 1circuit 29, and then bypost-write discharge circuit 12. During a read operation,chalcogenide storage element 26 is accessed by readcircuit 16 a via readvoltage clamp circuit 14. The reference voltage for readvoltage clamp circuit 14 is provided byreference voltage circuit 13. For the present embodiment, readcircuit 16 a includes acurrent mirror 21 and a current-voltage converter 22. - The use of chalcogenide material in a binary mode memory cell requires
separate write 0 and write 1 circuits, such aswrite 0circuit 28 and write 1circuit 29, to provide different temperature (energy) profiles based on whether a logical “0” or “1” is to be stored. Each ofwrite circuits chalcogenide storage element 26 varies, depending on the desired polycrystalline or amorphous retention state. Upon the receipt of input data, either write 0circuit 28 or write 1circuit 29 provides an appropriate amount of current flow tochalcogenide storage element 26. Additional control can be provided through independent bias points that sufficiently modulatewrite circuits - Referring now to
FIG. 3 , there is depicted a circuit diagram of a write circuit, in accordance with a preferred embodiment of the present invention. As shown, writecircuit 15 a includeswrite 0circuit 28 and write 1circuit 29.Write 0circuit 28 includes p-channel transistors 51-52 and n-channel transistor 55.Write 1circuit 29 includes p-channel transistors 53-54 and n-channel transistor 56.Transistors transistors Transistors 52 and 54 are separately connected between power supply VDD andchalcogenide memory element 26. The gate oftransistor 52 is connected to the node betweentransistors transistors - Inputs to write
circuit 15 a include write enableinput 65, column decodeinput 66 anddata input 67. AnNAND gate 57 combines a write enable signal at write enableinput 65, a column decode signal atcolumn decode input 66 and a data signal atdata input 67 to feed the gates oftransistors NAND gate 58 combines a write enable signal at write enableinput 65, a column decode signal atcolumn decode input 66 and a data signal atdata input 67 to feed the gates oftransistors - Transistor 54 is the write transistor for
write 0circuit 28, andtransistor 52 is the write transistor forwrite 1circuit 29. For the present embodiment, the size of transistor 54 is preferably larger than the size oftransistor 52 such that more current can be provided tochalcogenide memory element 26 for awrite 0 operation. Incidentally, relatively less current is provided tochalcogenide memory element 26 bytransistor 52 for awrite 1 operation. Specifically, when the data signal atdata input 67 is a logical “0” during a write operation, transistor 54 withinwrite 0circuit 28 is turned on to allow a first predetermined amount of current to programchalcogenide memory element 26 to store a logical “0.” When the data signal atdata input 67 is a logical “1” during a write operation,transistor 52 withinwrite 1circuit 29 is turned on to allow a second predetermined amount of current to programchalcogenide memory element 26 to store a logical “1.” - Post-write discharge circuit 12 (from
FIG. 1 ) is specifically designed to lower the voltage on a previously written column to prevent any reprogramming of a chalcogenide storage element within the same column on subsequent read operations. With reference now toFIG. 4 , there is illustrated a circuit diagram ofpost-write discharge circuit 12, in accordance with a preferred embodiment of the present invention. As shown,post-write discharge circuit 12 includes an n-channel transistor 31 and an n-channel transistor 32 connected in series. The drain oftransistor 31 is connected tochalcogenide memory element 26. The source oftransistor 31 is connected to the drain oftransistor 32. The drain oftransistor 32 is also connected the gate oftransistor 32 to form a diode. The source oftransistor 32 is connected to the ground. With the diode configuration oftransistor 32, voltage developed acrosschalcogenide memory element 26 is reduced to ground plus Vt as the write cycle terminates. Discharging the node betweentransistors chalcogenide memory element 26 on subsequent read operations. A discharge signal at adischarge signal input 34 and a column decode signal at a columndecode signal input 35 enabletransistor 31 to be connected tochalcogenide memory element 26 and also enabletransistor 31 to be in series withtransistor 32 connected to ground. - Read voltage clamp circuit 14 (from
FIG. 1 ) establishes an acceptable voltage limit acrosschalcogenide memory element 26 to prevent the parasitic effects of stored charges on a column from influencing the information stored inchalcogenide memory element 26. If the column discharges to ground (below the limit set by discharge circuit 12), read voltage clamp circuit 24 also restores the voltage of the column to the acceptable voltage. Referring now toFIG. 5 , there is depicted a circuit diagram of readvoltage clamp circuit 14, in accordance with a preferred embodiment of the present invention. As shown, read voltage clamp circuit 24 includes a p-channel transistor 41 and two n-channel transistors 42-43 connected in series. The drain of transistor 41 is connected to a power supply VDD. The source of transistor 43 is connected tochalcogenide memory element 26. The gate of transistor 41 is connected to anNAND gate 44 having a negativeclock signal input 47 and acolumn decode input 48. The gate oftransistor 42 is connected to a voltagelimit signal input 45. The gate of transistor 43 is connected to aread signal input 46. A voltage limit signal from voltagelimit signal input 45 modulates the acceptable voltage during the negative clock cycle. - As has been described, the present invention provides a circuit for accessing a chalcogenide memory array. Although only one chalcogenide storage element is utilized to illustrate the present invention, it is understood by those skilled in the art that two chalcogenide storage elements can be associated with a logical data bit by utilizing a double-ended or “differential” version of the above-described single-ended circuit. The doubled-end circuit is similar to the above-described single-ended circuit except that there is a complementary data input with its own read and write circuits to store the complement of each input data bit in a chalcogenide storage element, and a differential amplifier circuit is utilized to sense the complementary data bits stored. The differential design of the true-and-complement value of each logical data bit provides a higher noise margin and thus provides a greater reliability for each data bit stored in case of a defect exists in the input signals or the chalcogenide memory chip.
- While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
Priority Applications (5)
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US10/811,454 US6944041B1 (en) | 2004-03-26 | 2004-03-26 | Circuit for accessing a chalcogenide memory array |
EP05731546A EP1733398B1 (en) | 2004-03-26 | 2005-03-25 | Circuit for accessing a chalcogenide memory array |
DE602005022423T DE602005022423D1 (en) | 2004-03-26 | 2005-03-25 | CIRCUIT FOR ACCESSING A CHALCOGENID STORAGE ARRAY |
PCT/US2005/010189 WO2005098864A2 (en) | 2004-03-26 | 2005-03-25 | Circuit for accessing a chalcogenide memory array |
AT05731546T ATE475182T1 (en) | 2004-03-26 | 2005-03-25 | CIRCUIT FOR ACCESSING A CHALCOGENIDE STORAGE ARRAY |
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US10/811,454 US6944041B1 (en) | 2004-03-26 | 2004-03-26 | Circuit for accessing a chalcogenide memory array |
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EP1916665A2 (en) * | 2006-10-25 | 2008-04-30 | Qimonda North America Corp. | Combined read/write circuit for memory |
US20140376306A1 (en) * | 2009-12-31 | 2014-12-25 | Ferdinando Bedeschi | Methods for a phase-change memory array |
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US7570524B2 (en) | 2005-03-30 | 2009-08-04 | Ovonyx, Inc. | Circuitry for reading phase change memory cells having a clamping circuit |
WO2009070633A1 (en) * | 2007-11-30 | 2009-06-04 | Bae Systems Information And Electronic Systems Integration Inc. | Read reference circuit for a sense amplifier within a chalcogenide memory device |
US9406881B1 (en) | 2015-04-24 | 2016-08-02 | Micron Technology, Inc. | Memory cells having a heater electrode formed between a first storage material and a second storage material and methods of forming the same |
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- 2005-03-25 DE DE602005022423T patent/DE602005022423D1/en active Active
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US9851913B2 (en) | 2009-12-31 | 2017-12-26 | Micron Technology, Inc. | Methods for operating a memory array |
US10216438B2 (en) | 2009-12-31 | 2019-02-26 | Micron Technology, Inc. | Methods and related devices for operating a memory array |
US10416909B2 (en) | 2009-12-31 | 2019-09-17 | Micron Technology, Inc. | Methods for phase-change memory array |
US11003365B2 (en) | 2009-12-31 | 2021-05-11 | Micron Technology, Inc. | Methods and related devices for operating a memory array |
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DE602005022423D1 (en) | 2010-09-02 |
EP1733398A2 (en) | 2006-12-20 |
WO2005098864A3 (en) | 2006-06-08 |
US6944041B1 (en) | 2005-09-13 |
EP1733398B1 (en) | 2010-07-21 |
ATE475182T1 (en) | 2010-08-15 |
WO2005098864A2 (en) | 2005-10-20 |
EP1733398A4 (en) | 2007-06-20 |
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