US20050265077A1 - Circuit layout and structure for a non-volatile memory - Google Patents
Circuit layout and structure for a non-volatile memory Download PDFInfo
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- US20050265077A1 US20050265077A1 US11/196,037 US19603705A US2005265077A1 US 20050265077 A1 US20050265077 A1 US 20050265077A1 US 19603705 A US19603705 A US 19603705A US 2005265077 A1 US2005265077 A1 US 2005265077A1
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- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0491—Virtual ground arrays
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- G—PHYSICS
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- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
- G11C16/0475—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] comprising two or more independent storage sites which store independent data
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42328—Gate electrodes for transistors with a floating gate with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/4234—Gate electrodes for transistors with charge trapping gate insulator
- H01L29/42344—Gate electrodes for transistors with charge trapping gate insulator with at least one additional gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7887—Programmable transistors with more than two possible different levels of programmation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7923—Programmable transistors with more than two possible different levels of programmation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Definitions
- the present invention relates to semiconductor non-volatile memory. More particularly, the present invention relates to a non-volatile memory with selection gate.
- Flash memory device allows multiple-time erase and program operation inside system.
- flash memory is suitable to many of advance hand-held digital apparatuses, such as solid state disks, cellar phones, digital cameras, digital movie cameras, digital voice recorders, and personal digital assistant (PDA), that are demanding a low-cost, high-density, low-power-consumption, highly reliable file memory.
- PDA personal digital assistant
- data flash memory has two typical cell structures.
- One is double poly NAND type memory cell with polyl as floating gate to store charges; and the other one is single poly SONOS cell with SiN as storage node.
- a conventional NAND flash includes numerous strings of series connected N-channel transistor.
- Device operation of NAND flash utilizes channel Fowler-Nordheim (FN) mechanism for programming and erasing, and cell size for the NAND type flash memory cell is around 4-5F 2 , here F represents a critical dimension used in semiconductor fabrication as a dimension reference for describing cell size.
- FN Fowler-Nordheim
- FIG. 1 is a cross-sectional view, schematically illustrating a conventional SONOS flash memory. Device operation of SONOS cell is adopted channel hot carriers for programming and B-B hot holes for erase.
- FIG. 2 is top view, schematically illustrating the layout of the memory cell with respect to FIG. 1 .
- the N-well 102 and the P-well 104 are formed in the substrate 100 , such as a P-type substrate. Since the whole flash memory includes memory region and the logic region, the various wells are formed to have the CMOS device.
- the memory cells are formed in the T(triple)P-well 104 as can be understood by the ordinary skilled artisans.
- bit lines BL 0 , BL 1 , . . . , BLm 106 are formed in the substrate with strip doped regions.
- This kind of design for the bit lines is also called the buried bit line design.
- FIG. 2 only shows the layout for the bit lines 106 and the word lines 110 .
- the charge storage is achieved by the oxide 108 a /nitride 108 b /oxide 108 c (O/N/O) structure layer 108 .
- the word line 110 also serves as the necessary gate.
- the operation mechanisms for above cell design in programming, reading and erasing operations are shown in FIG. 3 .
- the word line (WL) is also the gate electrode.
- the adjacent two bit lines serve as the source/drain (S/D) region in the substrate.
- the oxide/nitride/oxide (O/N/O) structured layer is between the gate electrode and the substrate, in which the nitride layer is used to store the charges. Due to the charges in the nitride layer basically not moving, the injected charges can be localized in the nitride layer. Therefore, according to the voltages applied on the bit lines, for example for the programming operation at the top two drawings.
- the conventional SONOS flash memory has the disadvantages. As shown in FIG. 3 , charges in nitride layer may laterally diffuse between twin bits in SONOS cell. This is because the straight nitride layer still has insufficient power to localize the store charges. When some of the stored charges drift to the other side, at which no charge is expected, the bit error would occur. In addition, the hot carriers for programming consumes a larger current that can't support page mode programming.
- the invention provides non-volatile memory device, which has split gate design with capability to effectively prevent the bit error from occurring. Also and, the charges can be well localized at the desired location, the operation current can be reduced.
- a structure of non-volatile memory contains a substrate, having a doped well.
- a plurality of bit lines are formed in the substrate along a first direction, wherein each of the bit lines also serve as a source/drain (S/D) region.
- a first dielectric layer is disposed on the substrate.
- a plurality of selection gate (SG) lines are formed on the first dielectric layer between the bit lines.
- a second dielectric layer (Cap SiN or Cap oxide) is formed over SG lines to isolate SG line and word lines.
- a plurality of charge-storage structure layers are formed over the substrate between the bit lines and the SG lines.
- a third dielectric layer is formed over Bit lines to isolate Bit lines and word lines.
- a plurality of word lines are formed over the substrate along a second direction, which is crossing the first direction for the bit lines.
- the invention provides a structure of a non-volatile memory unit with two-bit memory capacity, which comprises a substrate and two doped lines, located in the substrate.
- a selection gate structure line is disposed on the substrate between the two doped lines.
- a charged storage structure layer is located each side of the selection gate structure line between the doped lines and the selection gate line.
- a second dielectric and third dielectric layer are disposed on the selection gate structure line and the doped lines.
- a gate electrode layer is disposed crossing over the doped lines and the selection gate structure line.
- a circuit layout for a non-volatile memory device comprises a plurality of MOS memory cells, arranged into rows and columns, wherein each of the MOS memory cells has two charge storage nodes commonly coupled with one selection gate (SG) line corresponding to the columns.
- a plurality of buried bit lines are coupled between adjacent two of the memory cells, to also serve as S/D electrodes of the memory cells.
- a plurality of word lines are coupled to the memory cells with respect to the rows and also act as gate electrode of memory cells.
- the foregoing at least two SG voltage feeding lines includes two or three SG voltage lines
- FIG. 1 is a cross-sectional view, schematically illustrating a conventional SONOS flash memory.
- FIG. 2 is a top view, schematically illustrating the layout for the bit lines and word lines with respect to FIG. 1 .
- FIG. 3 is a drawing, schematically illustrating the operation mechanism for the conventional non-volatile memory in FIG. 1 .
- FIG. 4 is a cross-sectional view, schematically illustrating a novel non-volatile memory, such as flash memory, according to an embodiment of the invention.
- FIG. 5 is a top view, schematically illustrating the layout for the bit lines and word lines with respect to FIG. 4 , wherein an equivalent circuit is shown.
- FIG. 6A-6B are circuit diagrams, schematically illustrating the equivalent circuit of non-volatile memory with respect to FIG. 4 , according to an embodiment of the invention.
- FIGS. 7A-7F are cross-sectional views, schematically illustrating the operation mechanism for the structure in FIG. 4 , according to an embodiment of the invention.
- FIGS. 8A-8J are circuit diagrams, schematically illustrating the operation of non-volatile memory based on FIG. 4 , according to various embodiments of the invention.
- FIGS. 9A-9B are cross-sectional view, schematically illustrating the leakage current improvement of another embodiment that are described in FIGS. 81 and 8 J.
- FIG. 10 is cross-sectional view, schematically illustrating novel non-volatile memory devices, according to another embodiments of the invention.
- FIGS. 11 and 12 A- 12 F are cross-sectional views, schematically illustrating an example of fabrication process to form the structure of non-volatile memory, according to an embodiments of the invention.
- selection gate (SG) lines are for example in the middle of a memory cell with separated two charge storage films over the substrate between the bit line and SG line, and preferably also on the sidewall of the SG line.
- the selection gate lines is applied a voltage, the substrate at the corresponding region become an inversion region, which can serve as a S/D region.
- the storage charges can be well localized to the desired region in the charge storage layer, such as the nitride layer.
- FIG. 4 is a cross-sectional view, schematically illustrating a novel non-volatile memory, according to an embodiment of the invention.
- FIG. 5 is a top view, schematically illustrating the layout for the bit lines and word lines with respect to FIG. 4 .
- FIG. 4 for a P-type substrate 400 as an example, several different-type wells 402 , 404 are formed in the substrate 400 .
- the memory device having the memory region and the logic region is formed by the CMOS design.
- the N-type memory cell is illustrated.
- the different semiconductor conductive type can also be applied.
- bit lines 406 (BL 0 , BL 1 , . . . BL 4 , . . . ) are formed in the substrate 400 within the P-type well 404 .
- the bit lines 406 are the doped regions formed in the substrate 400 , also called the buried bit lines.
- the bit lines 406 are extending along one direction perpendicular to the drawing sheet. Wherein, for the actual operation, the bit lines can be alternatively arranged to serves as two S/D regions for one memory cell in operation. Here, for one memory cell, it has two-bit memory capacity.
- a dielectric layer 410 such as gate oxide layer, is formed on the substrate 400 .
- Multiple selection gate (SG) lines 412 are formed on the dielectric layer 410 between the bit lines 406 .
- the SG lines 412 in consideration of applying voltages with respect to voltage source VS in operation, are for example arranged to have first-group SG lines (SG 1 ) and second-group SG lines (SG 2 ). However, this is not the only option. Since the a word line 416 is to be formed later, a cap layer 414 is preferably formed on SG 412 to improve the isolation from the word line 416 .
- the oxide/nitride/oxide (O/N/O) structure layer 408 is used as the example for descriptions.
- a dielectric layer such as the oxide layer 408 c is formed over the substrate 400 and covers over the sidewall and the top portion of the SG layer 412 and cap layer 414 .
- the charge-trapping dielectric layer 408 b is formed over the dielectric layer 408 c .
- the charge-trapping dielectric layer 408 b at the region above the bit line 406 can be continuous or discontinuous according to the actual fabrication processes. Here, the discontinuous situation is shown in FIG. 4 .
- the charge-trapping dielectric layer 408 b usually is a nitride layer, such as silicon nitride.
- a nitride layer such as silicon nitride.
- any dielectric layer with capability to trap charges can also be used, such as tantalum oxide, aluminum oxide, or nano-crystal silicon.
- Another dielectric layer 408 a such as oxide layer, is formed over the substrate on the charge-trapping dielectric layer 408 b . Then, the dielectric layer 408 a , 408 b and 408 c are called the dielectric layer 408 .
- the similar situation also occurs at the region above the bit line 406 and dielectric cap layer 414 , and are called dielectric layer 408 ′ and 408 ′′ respectively. From the structure point of view, the structure of dielectric layers may be different according to the actual fabrication processes.
- the dielectric layers 408 ′ and 408 can have other option.
- the discontinuous design for the charge-trapping dielectric layer 408 b is helpful to further improve the localization for the stored charges, as also to be described later about the operation mechanism in FIGS. 7A-7F .
- FIG. 5 shows a part of the top view with the circuit equivalent.
- the word line 416 also serves the gate in memory cell between two bit lines, one common gate with two bits is shown.
- the region 420 in the substrate is corresponding to SG line to be turned on/off. In other words, the region 420 is virtually existing in the substrate, and is to be created when a proper voltage is applied to create the inversion region in semiconductor properties.
- an inversion region (not shown) is created in the substrate 400 under the SG line 412 .
- This inversion region serves as another S/D region. In other words, the S/D region does not appear until the selected SG line is applied with the working voltage.
- Two charge storage regions, as two bits, are located at side regions of the SG line 412 with the same cell gate electrode between adjacent two bit lines 406 (contributed form the word line 416 ).
- the size of charge storage region is about 0.5 F, while the width of the SG line is about 1F. Therefore, there two bit in one memory cell is formed between two adjacent bit lines, in which the SG line is commonly used by the two memory bits, as equivalently shown in FIG. 5 .
- FIG. 6 is a circuit diagram, schematically illustrating the equivalent circuit of nonvolatile memory with respect to FIG. 4 , according to an embodiment of the invention.
- the bit line can also coupled with a bank-selection transistor (SGD).
- SGD bank-selection transistor
- the bank-selection transistor When the bank-selection transistor is turned on, the bit line voltage can be passed to the memory cells coupled to the bit line.
- the memory structure unit has a SG line and charge storage nodes.
- the SG line is applied with a voltage, the desired S/D region is created in the substrate as previously described in FIG. 4 . This S/D region is usually called the source region.
- a source voltage Vs is applied to the created source region, which is represented by a rectangular.
- the SG lines are the voltage-feeding lines to feed desired voltage to the SD lines.
- FIGS. 7A-7F are cross-sectional views, schematically illustrating the operation mechanism for the structure in FIG. 4 , according to an embodiment of the invention.
- the program operation can be performed by applying a voltage greater than a threshold voltage V T on the selected SG line (SG 1 ) but the source voltage Vs is floating.
- one bit line serving as a drain electrode VD is applied with a working voltage VPP, and the other bit lines are applied with a ground voltage.
- carrier charges such as electrons
- the drain electrode VD is driven to the drain electrode VD as indicated by the straight arrow.
- some electrons are trapped into the nitride layer 408 b at the horizontal portion as indicate by the curved arrow.
- the carrier electrons are not easy to move up. Therefore, the charges do not affect the opposite cell at the other sidewall of the SG line. Therefore, the trapped charges are well localized at the desired portion of the nitride layer 408 b.
- the programming operation can also be operated as shown in FIG. 7B .
- the source voltage is applied to the created S/D region under the SG line. Then the electrons drift from the created S/D region 800 with the about the same effect.
- FIGS. 7C-7D the erasing operation are shown.
- FIG. 7C shows the mechanism by band-to-band (B-B) holes, which are injected into the nitride layer to neutralize the trapped electrons. In this situation, the bit lines are applied a relative high positive voltage, while the word line is applied by a relative negative voltage.
- FIG. 7D shows the FN erasing operation by driving holes from the substrate to the nitride layer by applying a relative high voltage VPP on the substrate.
- the reading operation is, for example, achieved by two ways.
- FIG. 7E shows the reading operation by setting the source voltage Vs to be floating. In this situation, electrons are driven from the grounded bit line to the adjacent bit line with a voltage of VBI. Due to the trapped charges in the nitride layer, the threshold voltage for the memory cell is changed. This causes the sensing current to be different in reading operation. Then, the binary data can be read.
- FIG. 7F shows another way to read the cell. IN this operation, the created S/D region 800 is also grounded. Then, the electrons are driven from the created S/D region 800 .
- the programming, reading and erasing operations illustrated above are just the example.
- the actual operations can be changed by applying other proper set of voltages on the electrode terminals.
- the invention introduces the SG line, which can create the addition S/D region to the bit lines. As a result, the operations can be achieved in various ways with fast operation.
- the SG line is proposed.
- the source voltage can be applied in various designs in different circuit.
- FIGS. 8A-8J are circuit diagrams, schematically illustrating the operation of non-volatile memory based on FIG. 4 , according to various embodiments of the invention.
- the bit line BL 1 is applied a voltage VD.
- the SG line SG 2 is applied with a voltage, such as a voltage greater than the threshold voltage VT with respect to the select gate.
- an inversion region under the select gate in the substrate is created to serve as the S/D region, which also behaves like a channel region to pass the external applied voltage.
- Two transistors 900 are included for control the voltage to the created S/D region.
- Table 1 is an example for the sets of voltage with respect to various operation including programming, reading, and erasing.
- Erase-1 Erase-2 Program-1 Program-2 Read-1 Read-2 BL0 VD FG GND GND GND GND GND GND BL1 GND FG VD VD VR VR BL2 VD FG GND GND GND GND BL3 GND FG VD VD VR VR SGD (Bank select) VPP1 FG VPP1 VPP1 VCC VCC WL1 ⁇ VNG GND VPP1 VPP1 VCC VCC SG1 FG/GND FG >VT >VT VCC VCC SG2 FG/GND FG GND GND GND GND GND GND GND GND GND GND GND GND VS GND FG GND FG FG FG GND Unselected SGD GND FG GND GND GND GND GND GND GND GND GND GND GND GND GND TP-WELL GND VPP
- FIGS. 8C-8D another circuit design is provided as the example.
- the source voltage keeps floating.
- the memory cell is programmed as indicated by the dashed line.
- the programmed memory cell is read following the path indicated the dashed line.
- FIGS. 8E-8F another circuit design is provided as the example.
- several source voltage terminals VS 0 , VS 1 , VS 2 , . . . are included.
- Each source voltage terminal is coupled with two adjacent virtual S/D regions, which are in the substrate under the SG lines, which are applied voltages by two voltage feeding lines SG 1 and SG 2 .
- FIG. 8E the programming operation is illustrated.
- the source voltages are floating.
- FIG. 8F the source voltage VS is applied with a read working voltage VR, then the read path is formed.
- FIGS. 8G-8H another circuit design is provided as the example.
- several source voltage terminals VS 0 , VS 1 , . . . are included.
- one voltage terminal is coupled with four virtual S/D regions.
- FIG. 8G the programming operation is shown, in which the source voltage is at floating state.
- FIG. 8H the reading operation is shown.
- the source voltage terminal VS are set to the read working voltage VR. Due to the difference between the read operation and the programming operation, the voltages applied to the bit lines are accordingly different.
- FIGS. 8I-8J three voltage-feeding lines SG 1 , SG 2 , and SG 3 are used. This arrangement can reduce the potential leakage as to be described in FIGS. 9A-9B .
- the programming operation can be performed to have the path as indicated by dashed line.
- the reading process can also achieved by applying another set of the read working voltage on the related bit lines, such as BL 0 , BL 1 , and BL 2 as a memory controlled unit.
- FIGS. 8I-8J with three SG voltage-feeding lines have at least some advantages as shown in FIGS. 9A-9B . If it is necessary, the SG voltage-feeding lines can be more than three.
- a program leakage current may occur as indicated with circle when two select gate lines are used. Basically, the program leakage should be reduced by applying GND voltage at the gate of non-selected select transistor to turn off leakage current. However, the leakage will increase when channel length of select gate transistor is decreasing. On the other hand, read leakage current also exists when channel length of select gate transistor is decreasing.
- FIGS. 8I-8J the three-gate arrangement in FIGS. 8I-8J is proposed. The operation mechanism is shown in FIG. 9B . In FIG.
- the phenomenon of device having punch through to adjacent cells is reduced by using the three-SG design.
- the source voltages for the SG 1 can be properly set while the other two lines of SG 2 and SG 3 are set to ground voltage GND and unselected adjacent bit lines are set to floating, that will turn off the leakage current.
- FIG. 10 is cross-sectional view, schematically illustrating novel non-volatile memory devices, according to another embodiments of the invention.
- the stack-gate design can be used with the SG.
- the floating gate 902 is used to store the charges while the SG 412 and the cap layer 414 are also used with the similar function described above.
- the word line 416 is formed over the substrate 400 and is insulated by the dielectric layer 408 , which for example is an O/N/O structure.
- a dielectric cap layer 904 can also be formed on the bit line 406 .
- the dielectric cap layer 414 and the dielectric cap layer 904 can be the same material formed at the same time.
- FIG. 11 it is similar to FIG. 4 .
- the word line 416 can be formed by polysilicon layer or usually called poly 2 .
- the main charge storage region on the nitride layer is indicated by circle.
- the nitride layer can also be only the horizontal part without the sidewall part at the sidewall of the SG.
- FIG. 11 is only an example and can be formed by the steps in FIGS. 12A-12F .
- FIG. 12A-12F are cross-sectional views, schematically illustrating an example of fabrication process to form the structure in FIG. 11 , according to an embodiment of the invention. In FIG.
- a dielectric layer 1200 , a conductive layer 412 , and a second dielectric layer 414 are sequentially formed on the substrate, which is, for example, a P-substrate. Then, the patterning process with the photoresist layer 1202 is performed to form the selection gate lines, which in general includes the conductive layer 412 and the dielectric layer 414 .
- the conductive layer 412 can be, for example, the polysilicon layer to serve the selection gate and the dielectric cap layer 414 can be, for example, silicon oxide or silicon nitride. Since the O/N/O structure is to be formed in this example, the oxide layer 408 c and the nitride layer 408 b are formed over the substrate, as shown in FIG.
- FIG. 12B a dielectric layer is deposited and an etching back process is performed, so as to form a spacer at the sidewall of the SG structure.
- the etching back process can expose the cap layer 414 .
- an implantation process is performed to form the doped region 406 in the substrate, in which an annealing process can be also included to diffuse the dopants in doped region 406 .
- the doped region 406 is the buried bit line and also serves as the S/D region.
- the spacer is removed.
- FIG. 12E a dielectric layer 408 a and third dielectric layer is formed over the substrate.
- the discontinuous of the charge-trapping layer 408 b has the better capability to localize the stored charges.
- the word line 416 is formed over the substrate.
- the present invention includes the features of the selection gates formed between the two buried bit lines.
- the selection gates are properly controlled to apply the operation voltage, so as to create an inversion region.
- the inversion region can also serve as the additional S/D region in operation of MOS transistor.
- the SG structure with the sidewall charge storage film can further improve the charge localization.
- the storage charges can be well localized at the expected region without causing charge-drifting error to the adjacent bit.
Abstract
A structure of non-volatile memory contains a substrate. A plurality of bit lines are formed in the substrate along a first direction, wherein each of the bit lines also serve as a source/drain (S/D) region. A first dielectric layer is disposed over the substrate. A plurality of selection gate (SG) lines are formed over the first dielectric layer between the bit lines. A plurality of charge-storage structure layer are formed over the substrate between the bit lines and the SG lines. A second dielectric layer is formed over the SG lines and a third dielectric layer is formed over the bit lines. A plurality of word lines are formed over the substrate along a second direction, which is crossing the first direction for the bit lines. Wherein, when a selected one of the SG lines is applied a voltage, another S/D region is created in the substrate under the selected one of the SG lines.
Description
- This application claims the priority benefits of U.S. provisional application titled “VIRTUAL GROUND FLASH MEMORY WITH SPLIT GATE STRUCTURE” filed on Feb. 3, 2004. All disclosure of this application is incorporated herein by reference.
- 1. Field of Invention
- The present invention relates to semiconductor non-volatile memory. More particularly, the present invention relates to a non-volatile memory with selection gate.
- 2. Description of Related Art
- Flash memory device allows multiple-time erase and program operation inside system. As a result, flash memory is suitable to many of advance hand-held digital apparatuses, such as solid state disks, cellar phones, digital cameras, digital movie cameras, digital voice recorders, and personal digital assistant (PDA), that are demanding a low-cost, high-density, low-power-consumption, highly reliable file memory.
- Basically, data flash memory has two typical cell structures. One is double poly NAND type memory cell with polyl as floating gate to store charges; and the other one is single poly SONOS cell with SiN as storage node. A conventional NAND flash includes numerous strings of series connected N-channel transistor. Device operation of NAND flash utilizes channel Fowler-Nordheim (FN) mechanism for programming and erasing, and cell size for the NAND type flash memory cell is around 4-5F2, here F represents a critical dimension used in semiconductor fabrication as a dimension reference for describing cell size.
- On the other hand, conventional SONOS technology is a NOR type flash memory with buried N+ structure.
FIG. 1 is a cross-sectional view, schematically illustrating a conventional SONOS flash memory. Device operation of SONOS cell is adopted channel hot carriers for programming and B-B hot holes for erase.FIG. 2 is top view, schematically illustrating the layout of the memory cell with respect toFIG. 1 . InFIG. 1 andFIG. 2 , the N-well 102 and the P-well 104 are formed in thesubstrate 100, such as a P-type substrate. Since the whole flash memory includes memory region and the logic region, the various wells are formed to have the CMOS device. The memory cells are formed in the T(triple)P-well 104 as can be understood by the ordinary skilled artisans. For this kind of flash memory, the bit lines BL0, BL1, . . . ,BLm 106 are formed in the substrate with strip doped regions. This kind of design for the bit lines is also called the buried bit line design.FIG. 2 only shows the layout for thebit lines 106 and theword lines 110. The charge storage is achieved by theoxide 108 a/nitride 108 b/oxide 108 c (O/N/O)structure layer 108. Theword line 110 also serves as the necessary gate. - The operation mechanisms for above cell design in programming, reading and erasing operations are shown in
FIG. 3 . The word line (WL) is also the gate electrode. The adjacent two bit lines serve as the source/drain (S/D) region in the substrate. The oxide/nitride/oxide (O/N/O) structured layer is between the gate electrode and the substrate, in which the nitride layer is used to store the charges. Due to the charges in the nitride layer basically not moving, the injected charges can be localized in the nitride layer. Therefore, according to the voltages applied on the bit lines, for example for the programming operation at the top two drawings. For the operation shown in left drawing, due to the hot electrons, desired charges are stored in the nitride layer, in which the charges are localized at the one side. However, for the reversed direction shown the right drawing, the charges are stored in the nitride at the left side. Then, for the reading operation, according to the reading direction, the two sides can be separated read. The stored charges change the threshold voltage, so that the stored binary data can be sensed. The erasing operation is to inject the band-to-band (B-B) holes to the nitride layer to neutralize the electrons, so as to erase. Basically, The programming operation is to change the threshold voltage from low to high, and the erasing operation is to change the threshold voltage from high back to low. The operation should be well known by the skilled artisans and the detailed description is skipped. - However, the conventional SONOS flash memory has the disadvantages. As shown in
FIG. 3 , charges in nitride layer may laterally diffuse between twin bits in SONOS cell. This is because the straight nitride layer still has insufficient power to localize the store charges. When some of the stored charges drift to the other side, at which no charge is expected, the bit error would occur. In addition, the hot carriers for programming consumes a larger current that can't support page mode programming. - The invention provides non-volatile memory device, which has split gate design with capability to effectively prevent the bit error from occurring. Also and, the charges can be well localized at the desired location, the operation current can be reduced.
- A structure of non-volatile memory contains a substrate, having a doped well. A plurality of bit lines are formed in the substrate along a first direction, wherein each of the bit lines also serve as a source/drain (S/D) region. A first dielectric layer is disposed on the substrate. A plurality of selection gate (SG) lines are formed on the first dielectric layer between the bit lines. A second dielectric layer (Cap SiN or Cap oxide) is formed over SG lines to isolate SG line and word lines. A plurality of charge-storage structure layers are formed over the substrate between the bit lines and the SG lines. A third dielectric layer is formed over Bit lines to isolate Bit lines and word lines. A plurality of word lines are formed over the substrate along a second direction, which is crossing the first direction for the bit lines.
- In another aspect, the invention provides a structure of a non-volatile memory unit with two-bit memory capacity, which comprises a substrate and two doped lines, located in the substrate. A selection gate structure line is disposed on the substrate between the two doped lines. A charged storage structure layer is located each side of the selection gate structure line between the doped lines and the selection gate line. A second dielectric and third dielectric layer are disposed on the selection gate structure line and the doped lines. Also and, a gate electrode layer is disposed crossing over the doped lines and the selection gate structure line.
- For another aspect, a circuit layout for a non-volatile memory device comprises a plurality of MOS memory cells, arranged into rows and columns, wherein each of the MOS memory cells has two charge storage nodes commonly coupled with one selection gate (SG) line corresponding to the columns. A plurality of buried bit lines are coupled between adjacent two of the memory cells, to also serve as S/D electrodes of the memory cells. A plurality of word lines are coupled to the memory cells with respect to the rows and also act as gate electrode of memory cells. At least two SG voltage feeding lines, wherein the SG lines are alternatively coupled to the SG voltage feeding lines. Wherein, when the SG voltage feeding lines are applied a activating voltage, a created S/D region occurs between the two charge storage nodes, so that a proper source voltage or in floating can be applied to the created S/D region to operate with the S/D electrode from the bit lines.
- For another aspect, the foregoing at least two SG voltage feeding lines includes two or three SG voltage lines
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1 is a cross-sectional view, schematically illustrating a conventional SONOS flash memory. -
FIG. 2 is a top view, schematically illustrating the layout for the bit lines and word lines with respect toFIG. 1 . -
FIG. 3 is a drawing, schematically illustrating the operation mechanism for the conventional non-volatile memory inFIG. 1 . -
FIG. 4 is a cross-sectional view, schematically illustrating a novel non-volatile memory, such as flash memory, according to an embodiment of the invention. -
FIG. 5 is a top view, schematically illustrating the layout for the bit lines and word lines with respect toFIG. 4 , wherein an equivalent circuit is shown. -
FIG. 6A-6B are circuit diagrams, schematically illustrating the equivalent circuit of non-volatile memory with respect toFIG. 4 , according to an embodiment of the invention. -
FIGS. 7A-7F are cross-sectional views, schematically illustrating the operation mechanism for the structure inFIG. 4 , according to an embodiment of the invention. -
FIGS. 8A-8J are circuit diagrams, schematically illustrating the operation of non-volatile memory based onFIG. 4 , according to various embodiments of the invention. -
FIGS. 9A-9B are cross-sectional view, schematically illustrating the leakage current improvement of another embodiment that are described inFIGS. 81 and 8 J. -
FIG. 10 is cross-sectional view, schematically illustrating novel non-volatile memory devices, according to another embodiments of the invention. -
FIGS. 11 and 12 A-12F are cross-sectional views, schematically illustrating an example of fabrication process to form the structure of non-volatile memory, according to an embodiments of the invention. - In the invention, a novel structure of non-volatile memory is proposed. In the invention, selection gate (SG) lines are for example in the middle of a memory cell with separated two charge storage films over the substrate between the bit line and SG line, and preferably also on the sidewall of the SG line. When the selection gate lines is applied a voltage, the substrate at the corresponding region become an inversion region, which can serve as a S/D region. In this design, the storage charges can be well localized to the desired region in the charge storage layer, such as the nitride layer.
-
FIG. 4 is a cross-sectional view, schematically illustrating a novel non-volatile memory, according to an embodiment of the invention.FIG. 5 is a top view, schematically illustrating the layout for the bit lines and word lines with respect toFIG. 4 . InFIG. 4 , for a P-type substrate 400 as an example, several different-type wells substrate 400. In general, the memory device having the memory region and the logic region is formed by the CMOS design. In the embodiment, the N-type memory cell is illustrated. However, with the same design principle introduced by the invention, the different semiconductor conductive type can also be applied. - Several bit lines 406 (BL0, BL1, . . . BL4, . . . ) are formed in the
substrate 400 within the P-type well 404. The bit lines 406 are the doped regions formed in thesubstrate 400, also called the buried bit lines. The bit lines 406 are extending along one direction perpendicular to the drawing sheet. Wherein, for the actual operation, the bit lines can be alternatively arranged to serves as two S/D regions for one memory cell in operation. Here, for one memory cell, it has two-bit memory capacity. Adielectric layer 410, such as gate oxide layer, is formed on thesubstrate 400. Multiple selection gate (SG)lines 412 are formed on thedielectric layer 410 between the bit lines 406. The SG lines 412, in consideration of applying voltages with respect to voltage source VS in operation, are for example arranged to have first-group SG lines (SG1) and second-group SG lines (SG2). However, this is not the only option. Since the aword line 416 is to be formed later, acap layer 414 is preferably formed onSG 412 to improve the isolation from theword line 416. - In order to have the function to store the charges, several structure can be adapted. Here, the oxide/nitride/oxide (O/N/O)
structure layer 408 is used as the example for descriptions. For the O/N/O design, a dielectric layer such as theoxide layer 408 c is formed over thesubstrate 400 and covers over the sidewall and the top portion of theSG layer 412 andcap layer 414. Then, the charge-trappingdielectric layer 408 b is formed over thedielectric layer 408 c. The charge-trappingdielectric layer 408 b at the region above thebit line 406 can be continuous or discontinuous according to the actual fabrication processes. Here, the discontinuous situation is shown inFIG. 4 . The charge-trappingdielectric layer 408 b usually is a nitride layer, such as silicon nitride. However, any dielectric layer with capability to trap charges can also be used, such as tantalum oxide, aluminum oxide, or nano-crystal silicon. - Another
dielectric layer 408 a, such as oxide layer, is formed over the substrate on the charge-trappingdielectric layer 408 b. Then, thedielectric layer dielectric layer 408. The similar situation also occurs at the region above thebit line 406 anddielectric cap layer 414, and are calleddielectric layer 408′ and 408″ respectively. From the structure point of view, the structure of dielectric layers may be different according to the actual fabrication processes. Thedielectric layers 408′ and 408 can have other option. The discontinuous design for the charge-trappingdielectric layer 408 b is helpful to further improve the localization for the stored charges, as also to be described later about the operation mechanism inFIGS. 7A-7F . -
FIG. 5 shows a part of the top view with the circuit equivalent. Here, since theword line 416 also serves the gate in memory cell between two bit lines, one common gate with two bits is shown. Theregion 420 in the substrate is corresponding to SG line to be turned on/off. In other words, theregion 420 is virtually existing in the substrate, and is to be created when a proper voltage is applied to create the inversion region in semiconductor properties. - In this design, when the
SG line 412 is applied a voltage, an inversion region (not shown) is created in thesubstrate 400 under theSG line 412. This inversion region serves as another S/D region. In other words, the S/D region does not appear until the selected SG line is applied with the working voltage. Two charge storage regions, as two bits, are located at side regions of theSG line 412 with the same cell gate electrode between adjacent two bit lines 406 (contributed form the word line 416). The size of charge storage region is about 0.5 F, while the width of the SG line is about 1F. Therefore, there two bit in one memory cell is formed between two adjacent bit lines, in which the SG line is commonly used by the two memory bits, as equivalently shown inFIG. 5 . -
FIG. 6 is a circuit diagram, schematically illustrating the equivalent circuit of nonvolatile memory with respect toFIG. 4 , according to an embodiment of the invention. InFIG. 6 , the bit line can also coupled with a bank-selection transistor (SGD). When the bank-selection transistor is turned on, the bit line voltage can be passed to the memory cells coupled to the bit line. Then, the memory structure unit has a SG line and charge storage nodes. When the SG line is applied with a voltage, the desired S/D region is created in the substrate as previously described inFIG. 4 . This S/D region is usually called the source region. Then, a source voltage Vs is applied to the created source region, which is represented by a rectangular. In this embodiment, the SG lines are the voltage-feeding lines to feed desired voltage to the SD lines. - The SG lines SG1 and SG2 can be applied with the proper voltage to turn on/off the S/D region, so as to select the desired memory cell.
FIGS. 7A-7F are cross-sectional views, schematically illustrating the operation mechanism for the structure inFIG. 4 , according to an embodiment of the invention. - In
FIG. 7A , the program operation can be performed by applying a voltage greater than a threshold voltage VT on the selected SG line (SG1) but the source voltage Vs is floating. In this situation, one bit line serving as a drain electrode VD is applied with a working voltage VPP, and the other bit lines are applied with a ground voltage. In this situation, carrier charges, such as electrons, are driven to the drain electrode VD as indicated by the straight arrow. However, some electrons are trapped into thenitride layer 408 b at the horizontal portion as indicate by the curved arrow. Here, since the portion of thenitride layer 408 b at the sidewall of the SG line is in perpendicular to the horizontal portion, the carrier electrons are not easy to move up. Therefore, the charges do not affect the opposite cell at the other sidewall of the SG line. Therefore, the trapped charges are well localized at the desired portion of thenitride layer 408 b. - The programming operation can also be operated as shown in
FIG. 7B . Here, the source voltage is applied to the created S/D region under the SG line. Then the electrons drift from the created S/D region 800 with the about the same effect. - In
FIGS. 7C-7D , the erasing operation are shown.FIG. 7C shows the mechanism by band-to-band (B-B) holes, which are injected into the nitride layer to neutralize the trapped electrons. In this situation, the bit lines are applied a relative high positive voltage, while the word line is applied by a relative negative voltage. Alternatively,FIG. 7D shows the FN erasing operation by driving holes from the substrate to the nitride layer by applying a relative high voltage VPP on the substrate. - In
FIGS. 7E-7F , the reading operation is, for example, achieved by two ways.FIG. 7E shows the reading operation by setting the source voltage Vs to be floating. In this situation, electrons are driven from the grounded bit line to the adjacent bit line with a voltage of VBI. Due to the trapped charges in the nitride layer, the threshold voltage for the memory cell is changed. This causes the sensing current to be different in reading operation. Then, the binary data can be read.FIG. 7F shows another way to read the cell. IN this operation, the created S/D region 800 is also grounded. Then, the electrons are driven from the created S/D region 800. - The programming, reading and erasing operations illustrated above are just the example. The actual operations can be changed by applying other proper set of voltages on the electrode terminals. The invention introduces the SG line, which can create the addition S/D region to the bit lines. As a result, the operations can be achieved in various ways with fast operation. In the invention, the SG line is proposed. However, for the actual operation to select the desired memory cell, the source voltage can be applied in various designs in different circuit.
-
FIGS. 8A-8J are circuit diagrams, schematically illustrating the operation of non-volatile memory based onFIG. 4 , according to various embodiments of the invention. InFIG. 8A , if the memory cell indicated by the dashed circle is to be programmed, then the bit line BL1 is applied a voltage VD. The SG line SG2 is applied with a voltage, such as a voltage greater than the threshold voltage VT with respect to the select gate. Then, an inversion region under the select gate in the substrate is created to serve as the S/D region, which also behaves like a channel region to pass the external applied voltage. Twotransistors 900 are included for control the voltage to the created S/D region. In the example, since SG2 has the voltage while SG1 is grounded, which are also connected to the gate electrode of thetransistors 900, one transistor is turned on. Then, if the source voltage is set to be floating state, then the electrons are injected into the memory cells as by the path indicated by dashed arrow. InFIG. 8B , a read operation on the same programmed cell is performed. In this situation, after applying the proper set of operation voltages, the read path is formed as indicated by the dashed arrow. The operation voltages shown inFIG. 8B are just the example. It is not necessary to be restricted to the voltage setting inFIGS. 8A-8B . - Table 1 is an example for the sets of voltage with respect to various operation including programming, reading, and erasing.
TABLE 1 Erase-1 Erase-2 Program-1 Program-2 Read-1 Read-2 BL0 VD FG GND GND GND GND BL1 GND FG VD VD VR VR BL2 VD FG GND GND GND GND BL3 GND FG VD VD VR VR SGD (Bank select) VPP1 FG VPP1 VPP1 VCC VCC WL1 −VNG GND VPP1 VPP1 VCC VCC SG1 FG/GND FG >VT >VT VCC VCC SG2 FG/GND FG GND GND GND GND VS GND FG GND FG FG GND Unselected SGD GND FG GND GND GND GND Un-selected WL GND GND GND GND GND GND TP-WELL GND VPP GND GND GND GND
In Table 1, for example, VPP value is from 8 to 20 V; VD value is from 3V to 7 V; −VNG is from −2V to −10V; VPP1 is from 4V to 12V; and VR is from 0.6V to 2V. It should be understood that this table 1 is just an example for operation but not the only choice. - In
FIGS. 8C-8D , another circuit design is provided as the example. In this example, the source voltage keeps floating. InFIG. 8C , the memory cell is programmed as indicated by the dashed line. InFIG. 8D , the programmed memory cell is read following the path indicated the dashed line. - In
FIGS. 8E-8F , another circuit design is provided as the example. In this example, several source voltage terminals VS0, VS1, VS2, . . . are included. Each source voltage terminal is coupled with two adjacent virtual S/D regions, which are in the substrate under the SG lines, which are applied voltages by two voltage feeding lines SG1 and SG2. InFIG. 8E , the programming operation is illustrated. The source voltages are floating. InFIG. 8F , the source voltage VS is applied with a read working voltage VR, then the read path is formed. - In
FIGS. 8G-8H , another circuit design is provided as the example. In this example, several source voltage terminals VS0, VS1, . . . are included. However, one voltage terminal is coupled with four virtual S/D regions. InFIG. 8G , the programming operation is shown, in which the source voltage is at floating state. InFIG. 8H , the reading operation is shown. The source voltage terminal VS are set to the read working voltage VR. Due to the difference between the read operation and the programming operation, the voltages applied to the bit lines are accordingly different. - Again in
FIGS. 8I-8J , three voltage-feeding lines SG1, SG2, and SG3 are used. This arrangement can reduce the potential leakage as to be described inFIGS. 9A-9B . InFIG. 81 , the programming operation can be performed to have the path as indicated by dashed line. InFIG. 8J , the reading process can also achieved by applying another set of the read working voltage on the related bit lines, such as BL0, BL1, and BL2 as a memory controlled unit. - The designs in
FIGS. 8I-8J with three SG voltage-feeding lines have at least some advantages as shown inFIGS. 9A-9B . If it is necessary, the SG voltage-feeding lines can be more than three. InFIG. 9A , a program leakage current may occur as indicated with circle when two select gate lines are used. Basically, the program leakage should be reduced by applying GND voltage at the gate of non-selected select transistor to turn off leakage current. However, the leakage will increase when channel length of select gate transistor is decreasing. On the other hand, read leakage current also exists when channel length of select gate transistor is decreasing. In order to reduce the forgoing issues, the three-gate arrangement inFIGS. 8I-8J is proposed. The operation mechanism is shown inFIG. 9B . InFIG. 9B , the phenomenon of device having punch through to adjacent cells is reduced by using the three-SG design. By way of the operation inFIGS. 8I-8J , the source voltages for the SG1 can be properly set while the other two lines of SG2 and SG3 are set to ground voltage GND and unselected adjacent bit lines are set to floating, that will turn off the leakage current. - The structure in
FIG. 4 is just an example for descriptions. With the same design principle of the invention, the charge storage structure can be changed into other types. For example,FIG. 10 is cross-sectional view, schematically illustrating novel non-volatile memory devices, according to another embodiments of the invention. InFIG. 10 , the stack-gate design can be used with the SG. The floatinggate 902 is used to store the charges while theSG 412 and thecap layer 414 are also used with the similar function described above. Theword line 416 is formed over thesubstrate 400 and is insulated by thedielectric layer 408, which for example is an O/N/O structure. Also and, adielectric cap layer 904 can also be formed on thebit line 406. Thedielectric cap layer 414 and thedielectric cap layer 904 can be the same material formed at the same time. - In
FIG. 11 , it is similar toFIG. 4 . Theword line 416 can be formed by polysilicon layer or usually calledpoly 2. InFIG. 11 , the main charge storage region on the nitride layer is indicated by circle. In other words, from the structure point of view, the nitride layer can also be only the horizontal part without the sidewall part at the sidewall of the SG. However,FIG. 11 is only an example and can be formed by the steps inFIGS. 12A-12F .FIG. 12A-12F are cross-sectional views, schematically illustrating an example of fabrication process to form the structure inFIG. 11 , according to an embodiment of the invention. InFIG. 12A , adielectric layer 1200, aconductive layer 412, and asecond dielectric layer 414 are sequentially formed on the substrate, which is, for example, a P-substrate. Then, the patterning process with thephotoresist layer 1202 is performed to form the selection gate lines, which in general includes theconductive layer 412 and thedielectric layer 414. Theconductive layer 412 can be, for example, the polysilicon layer to serve the selection gate and thedielectric cap layer 414 can be, for example, silicon oxide or silicon nitride. Since the O/N/O structure is to be formed in this example, theoxide layer 408 c and thenitride layer 408 b are formed over the substrate, as shown inFIG. 12B . InFIG. 12C , a dielectric layer is deposited and an etching back process is performed, so as to form a spacer at the sidewall of the SG structure. The etching back process can expose thecap layer 414. Then, an implantation process is performed to form the dopedregion 406 in the substrate, in which an annealing process can be also included to diffuse the dopants in dopedregion 406. The dopedregion 406 is the buried bit line and also serves as the S/D region. InFIG. 12D , the spacer is removed. InFIG. 12E , adielectric layer 408 a and third dielectric layer is formed over the substrate. However, the discontinuous of the charge-trapping layer 408 b has the better capability to localize the stored charges. InFIG. 12F , theword line 416 is formed over the substrate. - The present invention includes the features of the selection gates formed between the two buried bit lines. The selection gates are properly controlled to apply the operation voltage, so as to create an inversion region. The inversion region can also serve as the additional S/D region in operation of MOS transistor. Also and the SG structure with the sidewall charge storage film can further improve the charge localization. The storage charges can be well localized at the expected region without causing charge-drifting error to the adjacent bit.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention covers modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (12)
1-11. (canceled)
12. A circuit layout for a non-volatile memory device, comprising:
a plurality of MOS memory cells, arranged into rows and columns, wherein each of the MOS memory cells has two charge storage nodes commonly coupled with one selection gate (SG) line corresponding to the columns;
a plurality of buried bit lines coupled between adjacent two of the memory cells, to also serve as S/D electrodes of the memory cells;
a plurality of word lines, coupled to the memory cells with respect to the rows, also serve as gate electrodes of memory cells; and
a first and a second SG voltage feeding lines, wherein the SG lines are alternatively coupled to the first and the second SG voltage feeding lines,
wherein when the first SG voltage feeding line or the second SG voltage feeding line is applied with a activating voltage, a created S/D region occurs between the two charge storage nodes, so that a proper source voltage can be applied to the created S/D region to operate with the S/D electrode from the bit lines.
13. The circuit layout of claim 12 , wherein bank-select transistors are coupled between the bit lines and bit line voltage sources.
14. The circuit layout of claim 12 , wherein when a memory cell is selected, the SG line related to the selected memory cell is applied with the activating voltage while the adjacent SG line for the adjacent cells are set to a ground voltage.
15. The circuit layout of claim 14 , wherein all of the created S/D regions are coupled to a source voltage.
16. The circuit layout of claim 14 , wherein each of the first and the second SG voltage feeding lines is coupled to a gate electrode of a MOS transistor, and the MOS transistor has a first S/D electrode coupled to a source voltage, and a second S/D electrode coupled to all of the created S/D regions.
17. The circuit layout of claim 14 , wherein all of the created S/D regions are floating.
18. The circuit layout of claim 14 , wherein every two adjacent created S/D regions are grouped as one and coupled to a source voltage.
19. The circuit layout of claim 14 , wherein every four adjacent created S/D regions are grouped as one and coupled to a source voltage.
20. A circuit layout for a non-volatile memory device, comprising:
a plurality of MOS memory cells, arranged into rows and columns, wherein each of the MOS memory cells has two charge storage nodes commonly coupled with one selection gate (SG) line corresponding to the columns;
a plurality of buried bit lines coupled between adjacent two of the memory cells, to also serve as S/D electrodes of the memory cells;
a plurality of word lines, coupled to the memory cells with respect to the rows, also serve as gate electrodes of memory cells; and
at least three SG voltage feeding lines, wherein the SG lines are alternatively coupled to the SG voltage feeding lines,
wherein three adjacent SG lines controlled by the SG voltage feeding lines are operated together to prevent a leakage to the adjacent memory cell, and when one of the SG voltage feeding lines is applied with a activating voltage, a created S/D region occurs between the two charge storage nodes.
21. The circuit layout of claim 20 , wherein the at least three SG voltage feeding lines is three SG voltage feeding lines, and one of the SG voltage feeding lines corresponding to the selected one of the memory cells is at the activating voltage while the other two are at ground voltage.
22. The circuit layout of claim 21 , wherein the unselected adjacent bit lines are set to a floating state.
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US10/823,488 Active 2024-04-21 US6987298B2 (en) | 2004-02-03 | 2004-04-12 | Circuit layout and structure for a non-volatile memory |
US11/196,037 Abandoned US20050265077A1 (en) | 2004-02-03 | 2005-08-02 | Circuit layout and structure for a non-volatile memory |
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Cited By (2)
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US20070126053A1 (en) * | 2005-12-05 | 2007-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-volatile memory array structure |
US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
Families Citing this family (9)
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DE10345237B4 (en) * | 2003-09-29 | 2005-11-10 | Infineon Technologies Ag | Method of making charge trapping memory devices |
US7020018B2 (en) * | 2004-04-22 | 2006-03-28 | Solid State System Co., Ltd. | Nonvolatile memory device and method for fabricating the same |
TWI266389B (en) * | 2005-11-11 | 2006-11-11 | Powerchip Semiconductor Corp | Non-volatile memory and manufacturing method and operating method thereof |
US7622349B2 (en) * | 2005-12-14 | 2009-11-24 | Freescale Semiconductor, Inc. | Floating gate non-volatile memory and method thereof |
US7368347B2 (en) * | 2006-10-03 | 2008-05-06 | Spansion Llc | Dual bit flash memory devices and methods for fabricating the same |
JP2010251371A (en) * | 2009-04-10 | 2010-11-04 | Sharp Corp | Nonvolatile memory cell and method of manufacturing the same |
US8072803B2 (en) * | 2009-05-26 | 2011-12-06 | Macronix International Co., Ltd. | Memory device and methods for fabricating and operating the same |
CN101807548B (en) * | 2010-02-05 | 2014-10-22 | 上海华虹宏力半导体制造有限公司 | Process for manufacturing nano-crystal split gate type flash memory |
US9449707B2 (en) * | 2014-12-19 | 2016-09-20 | Freescale Semiconductor, Inc. | Systems and methods to mitigate program gate disturb in split-gate flash cell arrays |
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US6721205B2 (en) * | 2000-09-12 | 2004-04-13 | Sony Corporation | Nonvolatile semiconductor memory device and methods for operating and producing the same |
US6809373B2 (en) * | 2002-08-01 | 2004-10-26 | Nec Electronics Corporation | Non-volatile semiconductor memory device, method for manufacturing same and method for controlling same |
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DE10038877A1 (en) * | 2000-08-09 | 2002-02-28 | Infineon Technologies Ag | Memory cell and manufacturing process |
JP3871049B2 (en) * | 2002-12-10 | 2007-01-24 | セイコーエプソン株式会社 | Nonvolatile semiconductor memory device |
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- 2004-04-12 US US10/823,488 patent/US6987298B2/en active Active
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Patent Citations (2)
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US6721205B2 (en) * | 2000-09-12 | 2004-04-13 | Sony Corporation | Nonvolatile semiconductor memory device and methods for operating and producing the same |
US6809373B2 (en) * | 2002-08-01 | 2004-10-26 | Nec Electronics Corporation | Non-volatile semiconductor memory device, method for manufacturing same and method for controlling same |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070126053A1 (en) * | 2005-12-05 | 2007-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-volatile memory array structure |
US7538384B2 (en) * | 2005-12-05 | 2009-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-volatile memory array structure |
US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
US9030877B2 (en) | 2007-08-30 | 2015-05-12 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
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US6987298B2 (en) | 2006-01-17 |
US20050224865A1 (en) | 2005-10-13 |
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