US20050269240A1

US20050269240A1 - Semiconductor inspection apparatus and tray for inspection parts used thereof

Info

Publication number: US20050269240A1
Application number: US10/908,489
Authority: US
Inventors: Takeshi Ikeda; Hiroshi Miyagi
Original assignee: Nigata Semitsu Co Ltd
Current assignee: NSC Co Ltd
Priority date: 2004-06-03
Filing date: 2005-05-13
Publication date: 2005-12-08
Also published as: JP2005345262A; KR20060048049A; TW200620518A; CN1705095A

Abstract

A tray of parts for inspection has a simple structure having only a tray holder that has a plurality of groove sections that store a plurality of parts for inspection on the surface, and contact sections, comprised in each groove, which have the conductor to electrically connect the electrodes of the stored parts for inspection in each groove section extends to the back surface. Under conditions where the plurality of parts for inspection are stored in the tray of parts for inspection, such tray is held by the tray holder, and the plurality of probe needles are placed on the plurality of contact sections equipped by the tray of parts for inspection all at once. Through this, electrical examination of a plurality of parts for inspection can be simultaneously performed.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a semiconductor inspection apparatus and a tray for inspection parts used thereof. In particular, such invention is suitable for use for an apparatus that performs electrical inspection through the placement of probe needles on semiconductor parts as targets of inspection.
2. Description of Related Art
Conventionally, electrical inspections of semiconductor chips (ICs) have been performed through placing the probe needles of a tester on the electrodes of an IC for inspection. Specifically, the IC for inspection is picked up by vacuum contact using a vacuum nozzle, and is transported to an examining table. The probe needles are then placed on the electrodes of the IC for inspection on such examining table and the electrical properties are measured. When one electrical inspection of an IC is finished, the next IC for inspection is transported to the examining table via the vacuum nozzle, and the electrical properties thereof are measured.
As stated above, conventionally, the ICs for inspection are transported to the examining table one-by-one and examination of electrical properties is performed. However, this method is problematic in that it requires an extremely long period of time when there exist many ICs for inspection. So as to shorten the inspection time when there exists a plurality of ICs for inspection, it is desirable that a plurality of ICs can be inspected simultaneously. Conventionally, an apparatus that enables a plurality of semiconductor elements to be simultaneously inspected has been proposed, for example, Japanese Patent Laid-Open No. 2000-258493.

SUMMARY OF THE INVENTION

The inspection apparatus described in JP 2000-258493 is composed of tray boards that have a plurality of grooves into which a plurality of semiconductor chips are inserted, contactor boards that have a plurality of probes, suppress boards that are in contact with the electrodes of semiconductor chips and probes, and wiring boards that fix each board. The electrodes of semiconductor chips that are inserted into the tray boards are electrically connected with external sockets via the probes on the contactor boards, electrode wiring from the probes to the connecting pad, the connecting pin on the wiring board that is connected with connecting pad and solid wiring that is formed in a three-dimensional manner inside the wiring boards from the connecting pin to the external socket. Problems have occurred in that the structure of such inspection apparatus is complicated and in that high manufacturing costs are required.
The purpose of this invention is to solve such problems, and to allow for the simultaneous inspection of a plurality of parts for inspection through using a simply structured tray of parts for inspection.
In order to solve the problems mentioned above, a semiconductor inspection apparatus of the present invention comprises a tray holder that holds a tray for inspection parts, the tray is equipped with a plurality of grooves that store a plurality of parts for inspection on the surface and contact sections comprised in each groove, the contact sections have the conductor used to electrically connect the electrodes of the parts for inspection stored in the each groove extends to the back surface of the tray; a probe with a plurality of needles that come into contact with the plurality of contact sections that extend to the back surface of the tray for inspection parts held by the tray holder all at once; and a controller that controls movements of the probe so that the needles of the probe will come into contact with the contact sections.
In another aspect of the invention, the tray holder holds the tray for inspection parts so that the surface of the tray for inspection parts faces upward; and the needles of the probe are formed so as to come into contact with the contact sections of the back surface of the tray for inspection parts from the lower portion of the tray for inspection parts held by the tray holder.
In another aspect of the invention, the tray holder holds the tray for inspection parts so that the surface of the tray for inspection parts faces downward; and he needles of the probe are formed to come into contact with the contact sections of the back surface of the tray for inspection parts from the upper portion of the tray for inspection parts held by the tray holder.
Additionally, the tray for inspection parts of the invention comprises a plurality of grooves that store a plurality of parts for inspection on the surface; and contact sections comprised in each groove, the contact sections have the conductor that electrically connects the electrodes of the parts for inspection stored in the each groove extends to the back surface.
In another aspect of the invention, a side wall of the each groove has a slope, the area of the bottom surface is formed to so be smaller that of an open end of the each groove, longitudinal and transversal dimensions of the open end of each the groove are slightly larger than those of the parts for inspection, and longitudinal and transversal dimensions of the bottom surface of the each groove are almost equivalent to those of the part for inspection.
In another aspect of the invention, the tray for inspection parts further comprises a press member that presses and fixes the parts for inspection so that the parts for inspection stored in each groove will not move.
According to the present invention structured as described above, under a condition where the plurality of parts for inspection are stored in the plurality of grooves equipped by the tray for inspection parts, the tray is held in the tray holder, and the plurality of probe needles are placed on the plurality of contact sections equipped by the tray for inspection parts all at once. And electrical inspection of such plurality of parts for inspection can be simultaneously performed. Through this, inspection time can be shortened. Also, the tray for inspection parts is remarkably simply structured so that only the plurality of grooves and the contact sections that connect from the bottom surface of the grooves to the back surface of the tray for inspection parts are formed. Thus, manufacturing costs can be lowered.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing an example of the structure of the tray for inspection parts according to the first embodiment.
FIG. 2 is an enlarged sectional view that shows one of the groove sections formed in the tray for inspection parts according to the first embodiment.
FIG. 3 is a diagram showing the back surface of the tray for inspection parts.
FIG. 4 is a diagram showing an example of the structure of a substantial section of the semiconductor inspection apparatus according to the first embodiment.
FIG. 5 is a diagram showing an example of the structure of the tray for inspection parts according to the second embodiment.
FIG. 6 is an enlarged sectional view that shows one of the groove sections and convex sections formed in the tray for inspection parts according to the second embodiment.
FIG. 7 is a diagram showing an example of the structure of a substantial section of the semiconductor inspection apparatus according to the second embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

First Embodiment

Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram that shows an example of the structure of tray for inspection parts (the tray of parts for inspection) 10 according to the first embodiment. Additionally, FIG. 2 is an enlarged sectional view that shows one of the groove sections 1 formed in the tray of parts for inspection 10. Also, FIG. 3 is a diagram that shows the back surface of the tray of parts for inspection 10.
As shown in FIG. 1, the tray of parts for inspection 10 of the present embodiment has a plurality of groove sections 1 that store semiconductor chip(s) 100 as part(s) for inspection, on the surface.
As shown in FIG. 2, a side wall 1 a of the groove section 1 is formed to have a slope to some extent, and the area of the bottom surface is smaller than that of an open end of the groove section 1. Here, the longitudinal and transversal dimensions of the open end of the groove section 1 are formed so as to be slightly larger than those of the semiconductor chip 100 as the part for inspection. The longitudinal and transversal dimensions of the bottom surface of the groove section 1 are formed in an almost equivalent manner to those of the semiconductor chip 100 as the part for inspection. Due to the aforementioned structure of the groove section 1, it is possible for the semiconductor chip 100 to be easily inserted into the groove section 1. At the same time, the side wall 1 a of the boron surface section enables easy and accurate positioning of the semiconductor chip 100.
Each groove section 1 has a contact section 2 where the conductor electrically connecting the electrodes of the stored semiconductor chip 100 extends to the back surface. The example of FIG. 2 shows a case where the electrodes of semiconductor chip 100 are established along the periphery of the chip. In such case, the plurality of contact sections 2 are established at a position that is appropriate given the position of each electrode, so as to be individually connected to the plurality of electrodes formed in the semiconductor chip 100. FIG. 3 shows a condition where the plurality of contact sections 2 are established at a position that is appropriate for each electrode of the stored semiconductor chip 100 in each groove section 1. The tray of parts for inspection 10 of the present embodiment is comprised of materials such that it is difficult for sections other than the contact sections 2 to become charged.
FIG. 4 is a diagram that shows an example of the structure of a substantial section of the semiconductor inspection apparatus 20 according to the first embodiment. As shown in FIG. 4, the semiconductor inspection apparatus 20 according to the first embodiment is structured to include a tray holder 22 that is established on the inspection stage 21, a probe 23, a transfer mechanism 24 that causes the probe 23 to be transferred, and a controller 25 that controls the movements of the transfer mechanism 24. The transfer mechanism 24 and controller 25 comprise the control section of the present invention.
The tray holder 22 holds the tray of parts for inspection 10 so that the surface of the tray of parts for inspection 10 faces upward. Due to this, the plurality of contact sections 2 that extend to the back surface of the tray of parts for inspection 10 can face downward. The probe 23 is comprised of a plurality of probe needles 23 a that connect with the plurality of contact sections 2 all at once equipped by the tray of parts for inspection 10 held in the tray holder 22. Such probe needles 23 a are formed so as to come into contact with the contact sections 2 from the lower portion of the tray of parts for inspection 10 held in the tray holder 22.
The transfer mechanism 24 transfers the probe 23 so that the plurality of probe needles 23 a can come into contact with the plurality of contact sections 2 according to the controls of the controller 25. Such transfer mechanism 24 is structured to have a move board 24 a, probe supporting section 24 b, a first guide rail 24 c, and a second guide rail 24 d.
The move board 24 a is structured to be movable in a horizontal direction (X direction) along the first guide rail 24 c, and can be activated by an electric motor for the X-axis that is not illustrated. The probe supporting section 24 b is established on such move board 24 a. The probe supporting section 24 b supports the probe 23 at the lower part. The probe supporting section 24 b moves in the X-direction along with the movement of the move board 24 a. Due to this, the probe 23 moves in the X-direction along with the movement of the probe supporting section 24 b.
Additionally, the probe supporting section 24 b is structured so as to be movable in a vertical direction (Y-direction) to the paper space and to be movable in an up-and-down direction (Z-direction) along the second guide rail 24 d. It can be activated by an electric motor for the Y-axis and an electric motor for the Z-axis that are not illustrated. Due to this, the probe 23 moves in the Y-direction and Z-direction accompanying the movement of the probe supporting section 24 b.
Based on the tray of parts for inspection 10 and the semiconductor inspection apparatus 20 according to the first embodiment structured as above, under a condition where the plurality of semiconductor chips 100 are stored in the plurality of groove sections 1 equipped by the tray of parts for inspection 10, the tray of parts for inspection 10 is held in the tray holder 22, and the plurality of probe needles 23 a are placed on the plurality of contact sections 2 equipped by the tray of parts for inspection 10 all at once. Through this, electrical examination of the plurality of semiconductor chips 100 can be simultaneously preformed and examination time can be shortened.
Also, the tray of parts for inspection 10 is remarkably simply structured so that the plurality of groove sections 1 and the linear contact sections 2 that connect from the bottom surface of the groove section 1 to the back surface of the tray of parts for inspection 10. Thus, manufacturing costs can be also lowered. Furthermore, while the tray of parts for inspection 10 of the present embodiment is simply structured, it is easy to perform the positioning through insertion of the semiconductor chips 100.

Second Embodiment

Next, the second embodiment of the present invention will be described based upon drawings. FIG. 5 is a diagram that shows an example of the structure of the tray of parts for inspection 30 according to the second embodiment. FIG. 6 is an enlarged sectional view that shows one of the groove sections 1 disposed in the tray of parts for inspection 30.
As shown in FIG. 5, the tray of parts for inspection 30 of the present embodiment is composed of the tray member 31 that has a plurality of groove sections 1 storing the semiconductor chips 100 as the parts for inspection on the surface, and the press member 32 that presses and fixes each such semiconductor chip 100 so that each semiconductor chip 100 that is stored in the groove section 1 will remain immobile.
The tray member 31 is the same as the tray of parts for inspection 10, explained in the first embodiment. The press member 32, as shown in FIG. 6, is comprised of convex sections 3 that press the semiconductor chip 100 that is stored in the groove section 1 on the bottom surface of such groove section 1, at an opposed position of each groove section 1. The longitudinal and transversal dimensions of the press member 32 are almost equivalent to those of the inner periphery surface of the exterior wall 4 of the tray member 31. Due to this, when the semiconductor chip 100 is pressed, the press member 32 fits perfectly inside the exterior wall 4 of the tray member 31, which will not easily come off to the extent of being turned upside down.
FIG. 7 is a diagram that shows an example of the structure of a substantial section of the semiconductor inspection apparatus 40 according to the second embodiment. As shown in FIG. 7, the semiconductor inspection apparatus 40 of the second embodiment is also composed of the tray holder 22 that is established on the inspection stage 21, the probe 23, the transfer mechanism 24 that transfers the probe 23, and the controller 25 that controls the movement of the transfer mechanism 24, in the same manner as with the semiconductor inspection apparatus 20 according to the first embodiment.
The difference between the semiconductor inspection apparatus 40 according to the second embodiment and the semiconductor inspection apparatus 20 according to the first embodiment is the supporting method of the trays of parts for inspection 10 and 30 through the tray holder 22, and the supporting structure of the probe 23 by the probe supporting section 24 b. That it to say, according to the second embodiment, the tray holder 22 holds the tray of parts for inspection 30 so that the surface of the tray of parts for inspection 30 faces downward. Due to this, a plurality of contact sections 2 formed up to the back surface of the tray of parts for inspection 30 face upward. Also, the probe supporting section 24 b supports the probe 23 based on a pattern where a plurality of probe needles 23 a come into contact with the contact sections 2 from the upper portion of the tray of parts for inspection 30 equipped by the tray holder 22.
According to the tray of parts for inspection 30 and the semiconductor inspection apparatus 40 of the second embodiment, which are structured as above, the tray of parts for inspection 30 is held in the tray holder 22 under a condition where the plurality of semiconductor chips 100 are stored in the plurality of groove sections 1 equipped by the tray of parts for inspection 30, and the plurality of probe needles 23 a are placed on the plurality of contact sections 2 equipped by the tray of parts for inspection 30 all at once. Due to this, the electrical examination of the plurality of semiconductor chips 100 can be simultaneously performed, and examination time can be shortened.
Moreover, the tray member 31 of the tray of parts for inspection 30 is simply structured to form the plurality of groove sections 1 and the linear contact sections 2 that are connected to the back surface of the tray member 31 from the bottom surface of the groove section 1. It is sufficient simply for the press member 32 to include convex section 3 and electrical wiring is not especially required at all. Thus, the manufacturing cost can be also lowered.
Furthermore, according to the tray of parts for inspection 30 of the present embodiment, although it is simply structured, it is easy to perform positioning through insertion of the semiconductor chips 100. Moreover, through using the press member 32, press force can be operated between the electrodes of semiconductor chips 100 and the contact sections 2. Due to this, the electrodes of semiconductor chips 100 and the contact sections 2 may be placed in secure contact and good electrical conducting may be obtained.
Note that, the embodiments explained above have shown only one example of the possible incarnations upon implementing the present invention. This should not cause the technical scope of the present invention to be restrictively interpreted. That is to say, the present invention can be implemented in various forms, without deviating from the spirit or the main characteristics thereof.

INDUSTRIAL APPLICABILITY

This present invention is useful for an apparatus that performs electrical examination through placing probe needles on semiconductor parts as the targets of examination.

Claims

1. A semiconductor inspection apparatus comprising:

a tray holder that holds a tray for inspection parts, said tray is equipped with a plurality of grooves that store a plurality of parts for inspection on the surface and contact sections comprised in each groove,

said contact sections have the conductor used to electrically connect the electrodes of said parts for inspection stored in said each groove extends to the back surface of said tray;

a probe with a plurality of needles that come into contact with said plurality of contact sections that extend to the back surface of said tray for inspection parts held by said tray holder all at once; and

a controller that controls movements of said probe so that the needles of said probe will come into contact with said contact sections.

2. The semiconductor inspection apparatus according to claim 1;

wherein said tray holder holds said tray for inspection parts so that the surface of said tray for inspection parts faces upward; and

the needles of said probe are formed so as to come into contact with said contact sections of the back surface of said tray for inspection parts from the lower portion of said tray for inspection parts held by said tray holder.

3. The semiconductor inspection apparatus according to claim 1;

wherein said tray holder holds said tray for inspection parts so that the surface of said tray for inspection parts faces downward; and

the needles of said probe are formed to come into contact with said contact sections of the back surface of said tray for inspection parts from the upper portion of said tray for inspection parts held by said tray holder.

4. A tray for inspection parts comprising:

a plurality of grooves that store a plurality of parts for inspection on the surface; and

contact sections comprised in each groove,

said contact sections have the conductor that electrically connects the electrodes of said parts for inspection stored in said each groove extends to the back surface.

5. The tray for inspection parts according to claim 4,

wherein a side wall of said each groove has a slope,

the area of the bottom surface is formed to so be smaller that of an open end of said each groove,

longitudinal and transversal dimensions of the open end of each said groove are slightly larger than those of said parts for inspection, and

longitudinal and transversal dimensions of the bottom surface of said each groove are almost equivalent to those of said part for inspection.

6. The tray for inspection parts according to claim 4 further comprising:

a press member that presses and fixes said parts for inspection so that said parts for inspection stored in said each groove will not move.