US20060124281A1 - Heat transfer device and method of making same - Google Patents
Heat transfer device and method of making same Download PDFInfo
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- US20060124281A1 US20060124281A1 US11/344,857 US34485706A US2006124281A1 US 20060124281 A1 US20060124281 A1 US 20060124281A1 US 34485706 A US34485706 A US 34485706A US 2006124281 A1 US2006124281 A1 US 2006124281A1
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- particles
- wick
- heat pipe
- brazing compound
- metal particles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to heat transfer devices that rely upon capillary action as a transport mechanism and, more particularly, to wicking materials for such devices.
- thermodynamic engine that sucks entropy out of data, turns that entropy into heat, and dumps the heat into the environment.
- thermal management technology limits the density and clock speed of electronic systems.
- a typical characteristic of heat transfer devices for electronic systems is that the atmosphere is the final heat sink of choice. Air cooling gives manufacturers access to the broadest market of applications.
- Another typical characteristic of heat transfer devices for electronics today is that the semiconductor chip thermally contacts a passive spreader or active thermal transport device, which conducts the heat from the chip to one of several types of fins. These fins convect heat to the atmosphere with natural or forced convection.
- a heat pipe includes a sealed envelope that defines an internal chamber containing a capillary wick and a working fluid capable of having both a liquid phase and a vapor phase within a desired range of operating temperatures.
- a working fluid capable of having both a liquid phase and a vapor phase within a desired range of operating temperatures.
- the working fluid is vaporized in the evaporator section causing a slight pressure increase forcing the vapor to a relatively lower temperature section of the chamber, which functions as a condenser section.
- the vapor is condensed in the condenser section and returns through the capillary wick to the evaporator section by capillary pumping action.
- Sintered metal wicks generally comprise a mixture of metal particles that have been heated to a temperature sufficient to cause fusing or welding of adjacent particles at their respective points of contact. The sintered metal powder then forms a porous structure with capillary characteristics. Although sintered wicks have demonstrated adequate heat transfer characteristics in the prior art, the minute metal-to-metal fused interfaces between particles tend to constrict thermal energy conduction through the wick. This has limited the usefulness of sintered wicks in the art.
- the present invention provides a capillary structure for a heat transfer device that comprises a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles.
- One or more vapor-vents are defined through the capillary structure so as to provide enhanced vapor escaped passages through the capillary structure.
- the one or more vapor vents allow for a minimized pressure drop and therefore a minimized ⁇ T.
- a heat pipe having a hermetically sealed and partially evacuated enclosure.
- the enclosure comprises internal surfaces with a wick disposed on at least one of the internal surfaces.
- the wick comprises a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles wherein at least one vapor vent is defined through the capillary structure.
- a two-phase fluid is at least partially disposed within a portion of the wick to complete the heat pipe.
- a heat pipe including a sealed and partially evacuated enclosure having an internal surface.
- a sintered wick is disposed upon the internal surface, where the wick comprises a plurality of individual particles which together yield an average particle diameter.
- At least one vapor vent is defined through a portion of the wick having a particle layer at the bottom of the vapor-vent wherein the particle layer comprises at least one dimension that is no more than about six average particle diameters.
- a working fluid is disposed within the enclosure to complete the heat pipe.
- a method for making a heat pipe wick on an inside surface of a heat pipe container comprising the steps of providing a slurry of metal particles that are mixed with a brazing compound.
- the metal particles have a first melting temperature and the brazing compound has a second melting temperature that is lower than the first melting temperature.
- At least a portion of the inside surface of the container is coated with the slurry in such a manner as to form one or more vapor-vents within the slurry, which is then dried to form a green wick.
- the green wick is then heated to a temperature that is no less than the second melting temperature and below the first melting temperature so that the brazing compound is drawn by capillary action toward adjacent ones of the metal particles so as to form heat-distribution fillets between the adjacent metal particles thereby to yield a brazed wick.
- FIG. 1 is an exploded perspective view of a typical heat pipe enclosure of the type used in connection with the present invention
- FIG. 2 is a perspective view of the heat pipe enclosure shown in FIG. 1 ;
- FIG. 3 is a cross-sectional view of the heat pipe shown in FIG. 2 ;
- FIG. 4 is a significantly enlarged cross-sectional view of a portion of a brazed wick formed in accordance with one embodiment of the present invention
- FIG. 5 is a broken-way perspective view that has been highly enlarged to clearly represent metal particles and fillets that comprise one embodiment of the present invention
- FIG. 6 is a highly enlarged view, similar to FIG. 5 , of an alternative embodiment of brazed wick formed in accordance with the present invention.
- FIG. 7 is an exploded perspective view of a heat pipe enclosure having an alternative embodiment of brazed wick in accordance with the present invention.
- FIG. 8 is a cross-sectional view, as taken along lines 8 - 8 in FIG. 7 ;
- FIG. 9 is a further alternative embodiment of heat pipe enclosure formed in accordance with the present invention.
- FIG. 10 is a cross-sectional view of the tubular heat pipe enclosure shown in FIG. 9 , as taken along lines 10 - 10 in FIG. 9 ;
- FIG. 11 is a highly enlarged view of a portion of a brazed wick disposed on the wall of the heat pipe shown in FIG. 10 ;
- FIG. 12 is a perspective cross-sectional view of a tower heat pipe having a brazed wick formed in accordance with the present invention.
- FIG. 13 is a highly enlarged surface view of a brazed wick coating the anterior surfaces of the tower heat pipe shown in FIG. 12 ;
- FIG. 14 is an alternative embodiment of tower heat pipe having grooved base wick formed in accordance with the present invention.
- FIG. 15 is a highly enlarged surface view of a brazed wick formed in accordance with the present invention.
- FIG. 16 is a broken-way cross-sectional view of the groove-wick shown in FIGS. 7, 8 , and 13 ;
- FIG. 17 is a highly enlarged cross-sectional view of a portion of the groove brazed wick shown in FIGS. 7, 8 , 13 , and 15 ;
- FIG. 18 is an end view of a mandrel used in manufacturing a grooved brazed wick in accordance with the present invention.
- FIG. 19 is a further alternative embodiment of tower heat pipe having vapor vents formed in a wick structure in accordance with the present invention.
- FIGS. 20-30 comprise a group of top elevational views and perspective cross-sectional views of a variety of possible wick structures having vapor vents formed in accordance with the present invention
- FIG. 31 is an exploded perspective view of a heat pipe heat spreader including a wick structure having vapor vents formed in accordance with the present invention
- FIG. 32 is a perspective view of the heat pipe heat spreader shown in FIG. 31 , as assembled;
- FIGS. 33-35 are top elevational views of a further variety of patterns of vapor vents that may be employed with wick structures formed in accordance with the present invention.
- FIG. 36 is a broken-way, cross-sectional view of an alternative embodiment of wick structure comprising a graded, brazed wick formed in accordance with the present invention.
- FIG. 37 is a broken-way, cross-sectional perspective view similar to FIG. 36 , showing a graded sintered wick structure
- FIG. 38 is a broken-way, cross-sectional view of a alternatively graded wick structure
- FIG. 39 is a broken-way, cross-sectional perspective view of a wick structure comprising a plurality of cylindrical particles
- FIG. 40 is a broken-way, cross-sectional view of a further alternative embodiment of wick structure comprising a transversely graded wick structure;
- FIG. 41 is a broken-way, cross-sectional perspective view of a further alternative embodiment of graded wick structure
- FIGS. 42-43 are broken-way, cross-sectional views of a portion of a heat pipe heat spreader having a multiple layer graded wick structure.
- FIGS. 44-51 comprise a group of top elevational views and perspective cross-sectional views of a variety of possible wick structures having vapor vents formed in accordance with the present invention.
- the present invention comprises a wick structure for a heat pipe or heat spreader 2 , hereinafter referred to as simply a heat pipe.
- heat pipes 2 are often sized and shaped to transfer and/or spread the thermal energy generated by at least one thermal energy source, e.g., a semiconductor device (not shown), that is thermally engaged between a portion of the heat pipe and a heat sink (not shown).
- Heat pipes 2 generally comprise a hermetically sealed enclosure such as a flat, hollow plate-like structure ( FIG. 2 ) or a tubular structure ( FIGS. 9, 12 , 14 and 19 ).
- each enclosure structure defines an evaporator section 5 , a condenser section 7 , and an internal void space or vapor chamber 10 ( FIG. 3 ).
- vapor chamber 10 is defined between a bottom wall 12 and a top wall 14 .
- vapor chamber 10 extends longitudinally from one end of the tube to the other ( FIGS. 9, 12 , 14 , and 19 ).
- bottom wall 12 and a top wall 14 comprise substantially uniform thickness sheets of a thermally conductive material, e.g., copper, steel, aluminum, or any of their respective alloys, and are spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to form vapor chamber 10 within heat pipe 2 .
- Top wall 14 of heat pipe 2 is often substantially planar, and is complementary in shape to bottom wall 12 .
- Bottom wall 12 preferably comprises a substantially planer inner surface 18 and a peripheral edge wall 20 . Peripheral edge wall 20 projects outwardly from the peripheral edge of inner surface 18 so as to circumscribe inner surface 18 .
- Vapor chamber 10 is created within heat pipe 2 by the attachment of bottom wall 12 and a top wall 14 , along their common edges which are then hermetically sealed at their joining interface 24 .
- a vaporizable fluid e.g., water, ammonia or freon not shown
- heat pipe 2 may be made of copper or copper silicon carbide with water, ammonia, or freon generally chosen as the working fluid.
- Heat pipe 2 is completed by drawing a partial vacuum within the vapor chamber after injecting the working fluid just prior to final hermetic sealing of the common edges of bottom wall 12 and top wall 14 .
- a brazed wick 25 is located on inner surface 18 which defines the boundaries of vapor chamber 10 .
- Brazed wick 25 comprises a plurality of metal particles 27 combined with a filler metal or combination of metals that is often referred to as a “braze” or brazing compound 30 .
- brazing is the joining of metals through the use of heat and a filler metal, i.e., brazing compound 30 .
- Brazing compound 30 very often comprises a melting temperature that is above 450° C.-1000° C. but below the melting point of metal particles 27 that are being joined to form brazed wick 25 .
- brazed wick 25 In general, to form brazed wick 25 according to the present invention, a plurality of metal particles 27 and brazing compound 30 are heated together to a brazing temperature that melts brazing compound 30 , but does not melt plurality of metal particles 27 . Significantly, during brazing metal particles 27 are not fused together as with sintering, but instead are joined together by creating a metallurgical bond between brazing compound 30 and the surfaces of adjacent metal particles 27 through the creation of fillets of re-solidified brazing compound (identified by reference numeral 33 in FIGS. 5 and 6 ).
- the principle by which brazing compound 30 is drawn through the porous mixture of metal particles 27 to create fillets 33 is “capillary action”, i.e., the movement of a liquid within the spaces of a porous material due to the inherent attraction of molecules to each other on a liquid's surface.
- the molecules of molten brazing metals attract one another as the surface tension between the molten braze and the surfaces of individual metal particles 27 tends to draw the molten braze toward each location where adjacent metal particles 27 are in contact with one another.
- Fillets 33 are formed at each such location as the molten braze metals re-solidify.
- brazing compound 30 and fillets 33 create a higher thermal conductivity wick than, e.g., sintering or fusing techniques.
- This higher thermal conductivity wick directly improves the thermal conductance of the heat transfer device in which it is formed, e.g., heat pipe, loop heat pipe, etc.
- the conductance of brazed wick 25 has been found to increase between directly proportional to and the square root of the thermal conductivity increase.
- material components of brazing compound 30 must be selected so as not to introduce chemical incompatibility into the materials system comprising heat pipe 2 .
- Metal particles 27 may be selected from any of the materials having high thermal conductivity, that are suitable for fabrication into brazed porous structures, e.g., carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, and may comprise either substantially spherical, oblate or prolate spheroids, ellipsoid, or less preferably, arbitrary or regular polygonal, or filament-shaped particles of varying cross-sectional shape.
- the overall wick brazing temperature for heat pipe 2 will be about 1000° C.
- brazing compound 30 has been found to be about six percent (6)% by weight of a finely divided ( ⁇ 325 mesh), 65%/35% copper/gold brazing compound, that has been well mixed with the copper powder (metal particles 27 ). More or less braze is also possible, although too little braze reduces the thermal conductivity of brazed wick 25 , while too much braze will start to fill the wick pores with solidified braze metal.
- One optimal range has been found to be between about 2% and about 10% braze compound, depending upon the braze recipe used.
- metal particles 27 When employing copper powder as metal particles 27 , a preferred shape of particle is spherical or spheroidal. Metal particles 27 should often be coarser than about 200 mesh, but finer than about 20 mesh. Finer wick powder particles often require use of a finer braze powder particle. The braze powder of brazing compound 30 should often be several times smaller in size than metal particles 27 so as to create a uniformly brazed wick 25 with uniform properties.
- brazes can also be used for brazing copper wicks, including nickel-based Nicrobrazes, silver/copper brazes, tin/silver, lead/tin, and even polymers.
- the invention is also not limited to copper/water heat pipes.
- aluminum and magnesium porous brazed wicks can be produced by using a braze that is an aluminum/magnesium intermetallic alloy.
- Brazing compound 30 should often be well distributed over each metal particle surface. This distribution of brazing compound 30 may be accomplished by mixing brazing compound 30 with an organic liquid binder, e.g., ethyl cellulose, that creates an adhesive quality on the surface of each metal particle 27 (i.e., the surface of each sphere or spheroid of metal) for brazing compound 30 to adhere to.
- an organic liquid binder e.g., ethyl cellulose
- one and two tenths grams by weight of copper powder (metal particles 27 ) is mixed with two drops from an eye dropper of an organic liquid binder, e.g., ISOBUTYL METHACRYLATE LACQUER to create an adhesive quality on the surface of each metal particle 27 (i.e., the surface of each sphere or spheroid of metal) for braze compound 30 to adhere to.
- a finely divided (e.g., ⁇ 325 mesh) of braze compound 30 is mixed into the liquid binder coated copper powder particles 27 and allowed to thoroughly air dry.
- the foregoing mixture of metal particles 27 and brazing compound 30 are applied to the internal surfaces of heat pipe 2 , for example inner surface 18 of bottom wall 12 , and heated evenly so that brazing compound 30 is melted by heating metal particles 27 .
- Molten brazing compound 30 that is drawn by capillary action, forms fillets 33 as it solidifies within the mixture of metal particles 27 .
- vacuum brazing or hydrogen brazing at about 1020° C. for between two to eight minutes, and preferably about five minutes, has been found to provide adequate fillet formation within a brazed wick.
- a vacuum of at least 10 ⁇ 5 torr or lower has been found to be sufficient, and if hydrogen furnaces are to be used, the hydrogen furnace should use wet hydrogen.
- the assembly is vacuum fired at 1020° C., for 5 minutes, in a vacuum of about 5 ⁇ 10 ⁇ 5 torr or lower.
- grooved brazed wick structure 38 may also be advantageously formed from metal particles 27 combined with brazing compound 30 . More particularly, a mandrel 40 ( FIG. 18 ) is used to create grooved wick structure 38 that comprises a plurality of parallel lands 45 that are spaced apart by parallel grooves 47 . Lands 45 of mandrel 40 form grooves 50 of finished brazed grooved wick structure 38 , and grooves 47 of mandrel 40 form lands 52 finished brazed grooved wick structure 38 .
- Each land 52 is formed as an inverted, substantially “V”-shaped or pyramidal protrusion having sloped side walls 54 a, 54 b, and is spaced-apart from adjacent lands.
- Grooves 50 separate lands 52 and are arranged in substantially parallel, longitudinally (or transversely) oriented rows that extend at least through evaporator section 5 .
- the terminal portions of grooves 50 adjacent to, e.g., a peripheral edge wall 20 , may be unbounded by further porous structures.
- a relatively thin layer of brazed metal particles is deposited upon inner surface 18 of bottom wall 12 so as to form a groove-wick 55 at the bottom of each groove 50 and between spaced-apart lands 52 .
- brazed copper powder particles 27 are deposited between lands 52 such that groove-wick 55 comprises an average thickness of about one to six average copper particle diameters (approximately 0.005 millimeters to 0.5 millimeters, preferably, in the range from about 0.05 millimeters to about 0.25 millimeters) when deposited over substantially all of inner surface 18 of bottom wall 12 , and between sloped side walls 54 a, 54 b of lands 52 .
- metal particles 27 in groove-wick 55 are thermally and mechanically engaged with one another by a plurality of fillets 33 ( FIG. 17 ).
- inner surface 18 of bottom wall 12 (often a copper surface) is lightly coated with organic binder ISOBUTYL METHACRYLATE LACQUER and the surface is “sprinkle coated” with braze compound copper/gold in a ratio of 65%/35%, with the excess shaken off.
- organic binder ISOBUTYL METHACRYLATE LACQUER organic binder ISOBUTYL METHACRYLATE LACQUER
- braze coated copper powder 27 is then placed on the braze coated copper surface and mandrel 40 is placed on top to form a grooved brazed wick structure 38 .
- groove-wick 55 is formed so as to be thin enough that the conduction delta-T is small enough to prevent boiling from initiating at the interface between inner surface 18 of bottom wall 12 and the brazed powder forming the wick.
- the formation of fillets 33 further enhances the thermal conductance of groove-wick 55 .
- Groove-wick 55 is an extremely thin wick structure that is fed liquid by spaced lands 52 which provide the required cross-sectional area to maintain effective working fluid flow. In cross-section, groove-wick 55 comprises an optimum design when it comprises the largest possible (limited by capillary limitations) flat area between lands 52 . This area should have a thickness of, e.g., only one to six copper powder particles.
- the thinner groove-wick 55 is, the better performance within realistic fabrication constraints, as long as the surface area of inner surface 18 has at least one layer of copper particles that are thermally and mechanically joined together by a plurality of fillets 33 .
- This thin wick area takes advantage of the enhanced evaporative surface area of the groove-wick layer, by limiting the thickness of groove-wick 55 to no more than a few powder particles while at the same time having a significantly increased thermal conductance due to the presence of fillets 33 joining metal particle 27 .
- This structure has been found to circumvent the thermal conduction limitations associated with the prior art.
- groove-wick 55 may be replaced by a wick structure defining a plurality of vapor-vents 60 that are defined throughout the evaporator wick structure ( FIGS. 19-38 ).
- Vapor-vents 60 are defined through a wick structure 62 that comprises either a uniformly brazed wick having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles, Alternatively, a plurality of sintered particles may also be used to form wick structure 62 .
- vapor-vents 60 extend through wick structure 62 so as to expose a portion of the underlying base structure, e.g., inner surface 18 of bottom wall 12 , onto which the wick is brazed or sintered.
- Wick structure 62 may be employed in either a circular or elliptically shaped portion of a tower-type heat pipe ( FIG. 19 ) or a rectangularly or polygonally shaped heat spreader configuration ( FIG. 39 ). The actual shape will of course normally be determined by the shape of the heat source and the evaporator.
- the cross-sectional profile of vapor-vents 60 may vary significantly from device to device or within the same device ( FIGS. 20-38 ).
- the cross-sectional profile of vapor-vents 60 may include cylindrical, conical, frustoconical, triangular, pyramidal, rectangular, rhomboidal, pentagonal, hexagonal, octagonal, and other less commonly occurring polygonal or curved shapes.
- Each vapor vent 60 defines an opening 65 in the upper surface of wick structure 62 and a bore 67 that may extend downwardly toward, e.g., inner surface 18 of bottom wall 12 , or equivalent structures in a tower-type heat pipe.
- Openings 65 and bores 67 are sized, shaped, and positioned relative to an evaporator portion of heat pipe 2 dependent upon local heat flux, wick thickness, wick pore radius, and wick permeability, such that the pressure drop required to get the vapor out of the evaporator portion is minimized and therefore the ⁇ T may be minimized.
- wick structure 62 may be formed from powdered metal particles 27 that are spherical, spheroidal, polygonal, or even chopped pieces of fine wire.
- wick structure 62 may be formed from powdered metal particles 27 comprising a mixture of particles having two or more distinct diameters, i.e., a first species of particle 71 having a first diameter, and a second species of particle 73 having a second diameter, or even a third species of particle 76 having the same or different diameter as particles 71 and 73 .
- Each species of particle may be segregated from one another such that relatively larger diameter particles are located in lower heat flux regions of wick structure 62 , while smaller diameter particles are located in higher heat flux regions of wick structure 62 ( FIGS. 35, 38 , 40 , and 41 ). In this way, a variety of pore sizes may be created within each variety of wick structure 62 .
- the variation in particle or wire diameters may range from several microns to several millimeters. Proper adjustment of particle sizes, and thus the pore sizes, allows for vapor to vent through larger pores while liquid remains in smaller pores thus increasing the critical heat flux limit.
- a graded wick structure 90 may be employed in the present invention ( FIGS. 36, 37 , 42 , and 43 ).
- a graded wick 90 is formed by layering particles 71 , such that coarse (i.e., relatively large) particles are located in a first layer 92 near the surface of wick structure 90 , with fine particles 73 (i.e., relatively small) located in a second layer 94 deposited in underlying relation to first layer 92 .
- powder particles 27 may also be arranged in a transversely graded array such that one species of particle is arranged transversely adjacent to another species of particle.
- wick structure 62 may have a step-wise grading in which powder particles 27 are arranged at different thicknesses.
- powder particles 27 forming wick structures 62 or 90 may either be brazed or sintered to each other and the evaporator plate in accordance with the methods herein disclosed and according to the present invention. Sintering temperatures vary for each different metal powder as well as being a function of the size and distribution of powder particles 27 within wick structure 62 . In addition, when sintering, an appropriate protective atmosphere such as hydrogen, forming gas, vacuum or an inert gas such as helium, nitrogen or argon should be employed for adequate results.
- an appropriate protective atmosphere such as hydrogen, forming gas, vacuum or an inert gas such as helium, nitrogen or argon should be employed for adequate results.
- brazed or sintered metal particles 27 may be deposited upon inner surface 18 of bottom wall 12 so as to form a vent-wick 80 at the bottom of each vapor-vent 60 ( FIGS. 44-51 ).
- brazed or sintered copper powder particles 27 are deposited on inner surface 18 (not shown in FIGS. 44-51 , but identified in FIGS.
- vent-wick 80 comprises an average thickness in the range from about one to six average copper particle diameters (approximately 0.005 millimeters to 0.5 millimeters, preferably, in the range from about 0.05 millimeters to about 0.25 millimeters) when deposited over substantially all of inner surface 18 of bottom wall 12 .
- vent-wick 80 comprises an average thickness in the range from about one to three average copper particle diameters.
Abstract
Description
- This application is a continuation-in-part of application Ser. No. 10/607,337, filed Jun. 26, 2003.
- The present invention generally relates to heat transfer devices that rely upon capillary action as a transport mechanism and, more particularly, to wicking materials for such devices.
- It has been suggested that a computer is a thermodynamic engine that sucks entropy out of data, turns that entropy into heat, and dumps the heat into the environment. The ability of prior art thermal management technology to get that waste heat out of semiconductor circuits and into the environment, at a reasonable cost, limits the density and clock speed of electronic systems.
- A typical characteristic of heat transfer devices for electronic systems is that the atmosphere is the final heat sink of choice. Air cooling gives manufacturers access to the broadest market of applications. Another typical characteristic of heat transfer devices for electronics today is that the semiconductor chip thermally contacts a passive spreader or active thermal transport device, which conducts the heat from the chip to one of several types of fins. These fins convect heat to the atmosphere with natural or forced convection.
- As the power to be dissipated from semiconductor devices increases with time, a problem arises: over time the thermal conductivity of the available materials becomes too low to conduct the heat from the semiconductor device to the fins with an acceptably low temperature drop. The thermal power density emerging from the semiconductor devices will be so high that copper, silver, or even gold based spreader technology will not be adequate.
- One technology that has proven beneficial to this effort is the heat pipe. A heat pipe includes a sealed envelope that defines an internal chamber containing a capillary wick and a working fluid capable of having both a liquid phase and a vapor phase within a desired range of operating temperatures. When one portion of the chamber is exposed to relatively high temperature it functions as an evaporator section. The working fluid is vaporized in the evaporator section causing a slight pressure increase forcing the vapor to a relatively lower temperature section of the chamber, which functions as a condenser section. The vapor is condensed in the condenser section and returns through the capillary wick to the evaporator section by capillary pumping action. Because a heat pipe operates on the principle of phase changes rather than on the principles of conduction or convection, a heat pipe is theoretically capable of transferring heat at a much higher rate than conventional heat transfer systems. Consequently, heat pipes have been utilized to cool various types of high heat-producing apparatus, such as electronic equipment (See, e.g., U.S. Pat. Nos. 3,613,778; 4,046,190; 4,058,299; 4,109,709; 4,116,266; 4,118,756; 4,186,796; 4,231,423; 4,274,479; 4,366,526; 4,503,483; 4,697,205; 4,777,561; 4,880,052; 4,912,548; 4,921,041; 4,931,905; 4,982,274; 5,219,020; 5,253,702; 5,268,812; 5,283,729; 5,331,510; 5,333,470; 5,349,237; 5,409,055; 5,880,524; 5,884,693; 5,890,371; 6,055,297; 6,076,595; and 6,148,906).
- The flow of the vapor and the capillary flow of liquid within the system are both produced by pressure gradients that are created by the interaction between naturally-occurring pressure differentials within the heat pipe. These pressure gradients eliminate the need for external pumping of the system liquid. In addition, the existence of liquid and vapor in equilibrium, under vacuum conditions, results in higher thermal efficiencies. In order to increase the efficiency of heat pipes, various wicking structures have been developed in the prior art to promote liquid transfer between the condenser and evaporator sections as well as to enhance the thermal transfer performance between the wick and its surroundings. They have included longitudinally disposed parallel grooves and the random scoring of the internal pipe surface. In addition, the prior art also discloses the use of a wick structure which is fixedly attached to the internal pipe wall. The compositions and geometries of these wicks have included, a uniform fine wire mesh and sintered metals. Sintered metal wicks generally comprise a mixture of metal particles that have been heated to a temperature sufficient to cause fusing or welding of adjacent particles at their respective points of contact. The sintered metal powder then forms a porous structure with capillary characteristics. Although sintered wicks have demonstrated adequate heat transfer characteristics in the prior art, the minute metal-to-metal fused interfaces between particles tend to constrict thermal energy conduction through the wick. This has limited the usefulness of sintered wicks in the art.
- Prior art devices, while adequate for their intended purpose, suffer from the common deficiency, in that they do not fully realize the optimum inherent heat transfer potential available from a given heat pipe. To date, no one has devised a wick structure for a heat pipe, which is sufficiently simple to produce, and yet provides optimum heat transfer characteristics for the heat pipe in which it is utilized.
- The present invention provides a capillary structure for a heat transfer device that comprises a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. One or more vapor-vents are defined through the capillary structure so as to provide enhanced vapor escaped passages through the capillary structure. In this way, while a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, with the plurality of fillets provided to enhance thermal conduction properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device, the one or more vapor vents allow for a minimized pressure drop and therefore a minimized ΔT.
- In one embodiment, a heat pipe is provided having a hermetically sealed and partially evacuated enclosure. The enclosure comprises internal surfaces with a wick disposed on at least one of the internal surfaces. The wick comprises a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles wherein at least one vapor vent is defined through the capillary structure. A two-phase fluid is at least partially disposed within a portion of the wick to complete the heat pipe.
- In another embodiment, a heat pipe is provided including a sealed and partially evacuated enclosure having an internal surface. A sintered wick is disposed upon the internal surface, where the wick comprises a plurality of individual particles which together yield an average particle diameter. At least one vapor vent is defined through a portion of the wick having a particle layer at the bottom of the vapor-vent wherein the particle layer comprises at least one dimension that is no more than about six average particle diameters. A working fluid is disposed within the enclosure to complete the heat pipe.
- A method is also provided for making a heat pipe wick on an inside surface of a heat pipe container comprising the steps of providing a slurry of metal particles that are mixed with a brazing compound. The metal particles have a first melting temperature and the brazing compound has a second melting temperature that is lower than the first melting temperature. At least a portion of the inside surface of the container is coated with the slurry in such a manner as to form one or more vapor-vents within the slurry, which is then dried to form a green wick. The green wick is then heated to a temperature that is no less than the second melting temperature and below the first melting temperature so that the brazing compound is drawn by capillary action toward adjacent ones of the metal particles so as to form heat-distribution fillets between the adjacent metal particles thereby to yield a brazed wick.
- In an alternative embodiment of the method of the invention,
- These and other features and advantages of the present invention will be more fully disclosed in, or rendered obvious by, the following detailed description of the preferred embodiments of the invention, which are to be considered together with the accompanying drawings wherein like numbers refer to like parts and further wherein:
-
FIG. 1 is an exploded perspective view of a typical heat pipe enclosure of the type used in connection with the present invention; -
FIG. 2 is a perspective view of the heat pipe enclosure shown inFIG. 1 ; -
FIG. 3 is a cross-sectional view of the heat pipe shown inFIG. 2 ; -
FIG. 4 is a significantly enlarged cross-sectional view of a portion of a brazed wick formed in accordance with one embodiment of the present invention; -
FIG. 5 is a broken-way perspective view that has been highly enlarged to clearly represent metal particles and fillets that comprise one embodiment of the present invention; -
FIG. 6 is a highly enlarged view, similar toFIG. 5 , of an alternative embodiment of brazed wick formed in accordance with the present invention; -
FIG. 7 is an exploded perspective view of a heat pipe enclosure having an alternative embodiment of brazed wick in accordance with the present invention; -
FIG. 8 is a cross-sectional view, as taken along lines 8-8 inFIG. 7 ; -
FIG. 9 is a further alternative embodiment of heat pipe enclosure formed in accordance with the present invention; -
FIG. 10 is a cross-sectional view of the tubular heat pipe enclosure shown inFIG. 9 , as taken along lines 10-10 inFIG. 9 ; -
FIG. 11 is a highly enlarged view of a portion of a brazed wick disposed on the wall of the heat pipe shown inFIG. 10 ; -
FIG. 12 is a perspective cross-sectional view of a tower heat pipe having a brazed wick formed in accordance with the present invention; -
FIG. 13 is a highly enlarged surface view of a brazed wick coating the anterior surfaces of the tower heat pipe shown inFIG. 12 ; -
FIG. 14 is an alternative embodiment of tower heat pipe having grooved base wick formed in accordance with the present invention; -
FIG. 15 is a highly enlarged surface view of a brazed wick formed in accordance with the present invention; -
FIG. 16 is a broken-way cross-sectional view of the groove-wick shown inFIGS. 7, 8 , and 13; -
FIG. 17 is a highly enlarged cross-sectional view of a portion of the groove brazed wick shown inFIGS. 7, 8 , 13, and 15; -
FIG. 18 is an end view of a mandrel used in manufacturing a grooved brazed wick in accordance with the present invention. -
FIG. 19 is a further alternative embodiment of tower heat pipe having vapor vents formed in a wick structure in accordance with the present invention; -
FIGS. 20-30 comprise a group of top elevational views and perspective cross-sectional views of a variety of possible wick structures having vapor vents formed in accordance with the present invention; -
FIG. 31 is an exploded perspective view of a heat pipe heat spreader including a wick structure having vapor vents formed in accordance with the present invention; -
FIG. 32 is a perspective view of the heat pipe heat spreader shown inFIG. 31 , as assembled; -
FIGS. 33-35 are top elevational views of a further variety of patterns of vapor vents that may be employed with wick structures formed in accordance with the present invention; -
FIG. 36 is a broken-way, cross-sectional view of an alternative embodiment of wick structure comprising a graded, brazed wick formed in accordance with the present invention; -
FIG. 37 is a broken-way, cross-sectional perspective view similar toFIG. 36 , showing a graded sintered wick structure; -
FIG. 38 is a broken-way, cross-sectional view of a alternatively graded wick structure; -
FIG. 39 is a broken-way, cross-sectional perspective view of a wick structure comprising a plurality of cylindrical particles; -
FIG. 40 is a broken-way, cross-sectional view of a further alternative embodiment of wick structure comprising a transversely graded wick structure; -
FIG. 41 is a broken-way, cross-sectional perspective view of a further alternative embodiment of graded wick structure; -
FIGS. 42-43 are broken-way, cross-sectional views of a portion of a heat pipe heat spreader having a multiple layer graded wick structure; and -
FIGS. 44-51 comprise a group of top elevational views and perspective cross-sectional views of a variety of possible wick structures having vapor vents formed in accordance with the present invention. - This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus “lateral” and the like are to be interpreted relative to one another or relative to an axis of elongation, or an axis or center of rotation, as appropriate. Terms concerning attachments, coupling and the like, such as “connected” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. The term “operatively connected” is such an attachment, coupling or connection that allows the pertinent structures to operate as intended by virtue of that relationship. In the claims, means-plus-function clauses are intended to cover the structures described, suggested, or rendered obvious by the written description or drawings for performing the recited function, including not only structural equivalents but also equivalent structures.
- Referring to
FIGS. 1-6 , the present invention comprises a wick structure for a heat pipe orheat spreader 2, hereinafter referred to as simply a heat pipe.Such heat pipes 2 are often sized and shaped to transfer and/or spread the thermal energy generated by at least one thermal energy source, e.g., a semiconductor device (not shown), that is thermally engaged between a portion of the heat pipe and a heat sink (not shown).Heat pipes 2 generally comprise a hermetically sealed enclosure such as a flat, hollow plate-like structure (FIG. 2 ) or a tubular structure (FIGS. 9, 12 , 14 and 19). Regardless of outer profile, each enclosure structure defines anevaporator section 5, acondenser section 7, and an internal void space or vapor chamber 10 (FIG. 3 ). For example, in a planarrectangular heat pipe 2,vapor chamber 10 is defined between abottom wall 12 and atop wall 14. In a tubular ortower heat pipe 2,vapor chamber 10 extends longitudinally from one end of the tube to the other (FIGS. 9, 12 , 14, and 19). - In one preferred embodiment of a rectilinear enclosure,
bottom wall 12 and atop wall 14 comprise substantially uniform thickness sheets of a thermally conductive material, e.g., copper, steel, aluminum, or any of their respective alloys, and are spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to formvapor chamber 10 withinheat pipe 2.Top wall 14 ofheat pipe 2 is often substantially planar, and is complementary in shape tobottom wall 12.Bottom wall 12 preferably comprises a substantially planerinner surface 18 and aperipheral edge wall 20.Peripheral edge wall 20 projects outwardly from the peripheral edge ofinner surface 18 so as to circumscribeinner surface 18.Vapor chamber 10 is created withinheat pipe 2 by the attachment ofbottom wall 12 and atop wall 14, along their common edges which are then hermetically sealed at their joininginterface 24. A vaporizable fluid (e.g., water, ammonia or freon not shown) resides withinvapor chamber 10, and serves as the working fluid forheat pipe 2. For example,heat pipe 2 may be made of copper or copper silicon carbide with water, ammonia, or freon generally chosen as the working fluid.Heat pipe 2 is completed by drawing a partial vacuum within the vapor chamber after injecting the working fluid just prior to final hermetic sealing of the common edges ofbottom wall 12 andtop wall 14. - Referring to
FIGS. 3-6 , in order for heat pipe operation to be initiated within the enclosure ofheat pipe 2, a capillary must be present withinvapor chamber 10 that will pump condensed liquid fromcondenser section 7 back to evaporator sections, substantially unaided by gravity. In one embodiment of the present invention, a brazedwick 25 is located oninner surface 18 which defines the boundaries ofvapor chamber 10.Brazed wick 25 comprises a plurality ofmetal particles 27 combined with a filler metal or combination of metals that is often referred to as a “braze” or brazingcompound 30. It will be understood that “brazing” is the joining of metals through the use of heat and a filler metal, i.e., brazingcompound 30. Brazingcompound 30 very often comprises a melting temperature that is above 450° C.-1000° C. but below the melting point ofmetal particles 27 that are being joined to form brazedwick 25. - In general, to form brazed
wick 25 according to the present invention, a plurality ofmetal particles 27 andbrazing compound 30 are heated together to a brazing temperature that melts brazingcompound 30, but does not melt plurality ofmetal particles 27. Significantly, during brazingmetal particles 27 are not fused together as with sintering, but instead are joined together by creating a metallurgical bond between brazingcompound 30 and the surfaces ofadjacent metal particles 27 through the creation of fillets of re-solidified brazing compound (identified byreference numeral 33 inFIGS. 5 and 6 ). Advantageously, the principle by which brazingcompound 30 is drawn through the porous mixture ofmetal particles 27 to createfillets 33 is “capillary action”, i.e., the movement of a liquid within the spaces of a porous material due to the inherent attraction of molecules to each other on a liquid's surface. Thus, as brazingcompound 30 liquefies, the molecules of molten brazing metals attract one another as the surface tension between the molten braze and the surfaces ofindividual metal particles 27 tends to draw the molten braze toward each location whereadjacent metal particles 27 are in contact with one another.Fillets 33 are formed at each such location as the molten braze metals re-solidify. - In the present invention, brazing
compound 30 andfillets 33 create a higher thermal conductivity wick than, e.g., sintering or fusing techniques. This higher thermal conductivity wick directly improves the thermal conductance of the heat transfer device in which it is formed, e.g., heat pipe, loop heat pipe, etc. Depending upon the regime of heat flux thatevaporator 5 is subjected to, the conductance of brazedwick 25 has been found to increase between directly proportional to and the square root of the thermal conductivity increase. Importantly, material components of brazingcompound 30 must be selected so as not to introduce chemical incompatibility into the materials system comprisingheat pipe 2. -
Metal particles 27 may be selected from any of the materials having high thermal conductivity, that are suitable for fabrication into brazed porous structures, e.g., carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, and may comprise either substantially spherical, oblate or prolate spheroids, ellipsoid, or less preferably, arbitrary or regular polygonal, or filament-shaped particles of varying cross-sectional shape. For example, whenmetal particles 27 are formed from copper spheres (FIG. 5 ) or oblate spheroids (FIG. 6 ) whose melting point is about 1083° C., the overall wick brazing temperature forheat pipe 2 will be about 1000° C. By varying thepercentage brazing compound 30 within the mix ofmetal particles 27 or, by using a more “sluggish” alloy for brazingcompound 30, a wide range of heat-conduction characteristics may be provided betweenmetal particles 27 andfillets 33. - For example, in a copper/water heat pipe, any ratio of copper/gold braze could be used, although brazes with more gold are more expensive. A satisfactory combination for brazing
compound 30 has been found to be about six percent (6)% by weight of a finely divided (−325 mesh), 65%/35% copper/gold brazing compound, that has been well mixed with the copper powder (metal particles 27). More or less braze is also possible, although too little braze reduces the thermal conductivity of brazedwick 25, while too much braze will start to fill the wick pores with solidified braze metal. One optimal range has been found to be between about 2% and about 10% braze compound, depending upon the braze recipe used. When employing copper powder asmetal particles 27, a preferred shape of particle is spherical or spheroidal.Metal particles 27 should often be coarser than about 200 mesh, but finer than about 20 mesh. Finer wick powder particles often require use of a finer braze powder particle. The braze powder of brazingcompound 30 should often be several times smaller in size thanmetal particles 27 so as to create a uniformly brazedwick 25 with uniform properties. - Other brazes can also be used for brazing copper wicks, including nickel-based Nicrobrazes, silver/copper brazes, tin/silver, lead/tin, and even polymers. The invention is also not limited to copper/water heat pipes. For example, aluminum and magnesium porous brazed wicks can be produced by using a braze that is an aluminum/magnesium intermetallic alloy.
- Brazing
compound 30 should often be well distributed over each metal particle surface. This distribution ofbrazing compound 30 may be accomplished by mixingbrazing compound 30 with an organic liquid binder, e.g., ethyl cellulose, that creates an adhesive quality on the surface of each metal particle 27 (i.e., the surface of each sphere or spheroid of metal) for brazingcompound 30 to adhere to. In one embodiment of the invention, one and two tenths grams by weight of copper powder (metal particles 27) is mixed with two drops from an eye dropper of an organic liquid binder, e.g., ISOBUTYL METHACRYLATE LACQUER to create an adhesive quality on the surface of each metal particle 27 (i.e., the surface of each sphere or spheroid of metal) forbraze compound 30 to adhere to. A finely divided (e.g., −325 mesh) ofbraze compound 30 is mixed into the liquid binder coatedcopper powder particles 27 and allowed to thoroughly air dry. About 0.072 grams, about 6% by weight of copper/gold in a ratio of 65%/35% copper/gold brazing compound, has been found to provide adequate results. The foregoing mixture ofmetal particles 27 andbrazing compound 30 are applied to the internal surfaces ofheat pipe 2, for exampleinner surface 18 ofbottom wall 12, and heated evenly so that brazingcompound 30 is melted byheating metal particles 27.Molten brazing compound 30 that is drawn by capillary action, formsfillets 33 as it solidifies within the mixture ofmetal particles 27. For example, vacuum brazing or hydrogen brazing at about 1020° C. for between two to eight minutes, and preferably about five minutes, has been found to provide adequate fillet formation within a brazed wick. A vacuum of at least 10−5 torr or lower has been found to be sufficient, and if hydrogen furnaces are to be used, the hydrogen furnace should use wet hydrogen. In one embodiment, the assembly is vacuum fired at 1020° C., for 5 minutes, in a vacuum of about 5×10−5 torr or lower. - Referring to
FIGS. 7, 8 , 14, and 16-17, grooved brazedwick structure 38 may also be advantageously formed frommetal particles 27 combined withbrazing compound 30. More particularly, a mandrel 40 (FIG. 18 ) is used to create groovedwick structure 38 that comprises a plurality ofparallel lands 45 that are spaced apart byparallel grooves 47.Lands 45 ofmandrel 40form grooves 50 of finished brazed groovedwick structure 38, andgrooves 47 ofmandrel 40 form lands 52 finished brazed groovedwick structure 38. Eachland 52 is formed as an inverted, substantially “V”-shaped or pyramidal protrusion having slopedside walls Grooves 50separate lands 52 and are arranged in substantially parallel, longitudinally (or transversely) oriented rows that extend at least throughevaporator section 5. The terminal portions ofgrooves 50, adjacent to, e.g., aperipheral edge wall 20, may be unbounded by further porous structures. In one embodiment, a relatively thin layer of brazed metal particles is deposited uponinner surface 18 ofbottom wall 12 so as to form a groove-wick 55 at the bottom of eachgroove 50 and between spaced-apart lands 52. For example, brazedcopper powder particles 27 are deposited betweenlands 52 such that groove-wick 55 comprises an average thickness of about one to six average copper particle diameters (approximately 0.005 millimeters to 0.5 millimeters, preferably, in the range from about 0.05 millimeters to about 0.25 millimeters) when deposited over substantially all ofinner surface 18 ofbottom wall 12, and between slopedside walls lands 52. Advantageously,metal particles 27 in groove-wick 55 are thermally and mechanically engaged with one another by a plurality of fillets 33 (FIG. 17 ). When forming grooved brazedwick structure 38,inner surface 18 of bottom wall 12 (often a copper surface) is lightly coated with organic binder ISOBUTYL METHACRYLATE LACQUER and the surface is “sprinkle coated” with braze compound copper/gold in a ratio of 65%/35%, with the excess shaken off. Between 1.250 and 1.300 grams (often about 1.272 grams) of braze coatedcopper powder 27 is then placed on the braze coated copper surface andmandrel 40 is placed on top to form a grooved brazedwick structure 38. - Significantly groove-
wick 55 is formed so as to be thin enough that the conduction delta-T is small enough to prevent boiling from initiating at the interface betweeninner surface 18 ofbottom wall 12 and the brazed powder forming the wick. The formation offillets 33 further enhances the thermal conductance of groove-wick 55. Groove-wick 55 is an extremely thin wick structure that is fed liquid by spacedlands 52 which provide the required cross-sectional area to maintain effective working fluid flow. In cross-section, groove-wick 55 comprises an optimum design when it comprises the largest possible (limited by capillary limitations) flat area between lands 52. This area should have a thickness of, e.g., only one to six copper powder particles. The thinner groove-wick 55 is, the better performance within realistic fabrication constraints, as long as the surface area ofinner surface 18 has at least one layer of copper particles that are thermally and mechanically joined together by a plurality offillets 33. This thin wick area takes advantage of the enhanced evaporative surface area of the groove-wick layer, by limiting the thickness of groove-wick 55 to no more than a few powder particles while at the same time having a significantly increased thermal conductance due to the presence offillets 33 joiningmetal particle 27. This structure has been found to circumvent the thermal conduction limitations associated with the prior art. - In yet a further embodiment of the present invention, groove-
wick 55 may be replaced by a wick structure defining a plurality of vapor-vents 60 that are defined throughout the evaporator wick structure (FIGS. 19-38 ). Vapor-vents 60 are defined through awick structure 62 that comprises either a uniformly brazed wick having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles, Alternatively, a plurality of sintered particles may also be used to formwick structure 62. In one embodiment, vapor-vents 60 extend throughwick structure 62 so as to expose a portion of the underlying base structure, e.g.,inner surface 18 ofbottom wall 12, onto which the wick is brazed or sintered.Wick structure 62 may be employed in either a circular or elliptically shaped portion of a tower-type heat pipe (FIG. 19 ) or a rectangularly or polygonally shaped heat spreader configuration (FIG. 39 ). The actual shape will of course normally be determined by the shape of the heat source and the evaporator. - The cross-sectional profile of vapor-
vents 60, and their grouping and location inwick structure 62, may vary significantly from device to device or within the same device (FIGS. 20-38 ). The cross-sectional profile of vapor-vents 60 may include cylindrical, conical, frustoconical, triangular, pyramidal, rectangular, rhomboidal, pentagonal, hexagonal, octagonal, and other less commonly occurring polygonal or curved shapes. Each vapor vent 60 defines anopening 65 in the upper surface ofwick structure 62 and abore 67 that may extend downwardly toward, e.g.,inner surface 18 ofbottom wall 12, or equivalent structures in a tower-type heat pipe.Openings 65 and bores 67 are sized, shaped, and positioned relative to an evaporator portion ofheat pipe 2 dependent upon local heat flux, wick thickness, wick pore radius, and wick permeability, such that the pressure drop required to get the vapor out of the evaporator portion is minimized and therefore the ΔT may be minimized. - In addition to the various shapes, sizes and positions of vapor vents 60, the powdered material that forms
wick structure 62 may also vary in size and shape. For example,wick structure 62 may be formed frompowdered metal particles 27 that are spherical, spheroidal, polygonal, or even chopped pieces of fine wire. In addition,wick structure 62 may be formed frompowdered metal particles 27 comprising a mixture of particles having two or more distinct diameters, i.e., a first species ofparticle 71 having a first diameter, and a second species ofparticle 73 having a second diameter, or even a third species ofparticle 76 having the same or different diameter asparticles Multiple wire diameters 80 of varying lengths thus forming multiple species of particles. Each species of particle may be segregated from one another such that relatively larger diameter particles are located in lower heat flux regions ofwick structure 62, while smaller diameter particles are located in higher heat flux regions of wick structure 62 (FIGS. 35, 38 , 40, and 41). In this way, a variety of pore sizes may be created within each variety ofwick structure 62. Typically, the variation in particle or wire diameters may range from several microns to several millimeters. Proper adjustment of particle sizes, and thus the pore sizes, allows for vapor to vent through larger pores while liquid remains in smaller pores thus increasing the critical heat flux limit. - In addition to having a mixture of two or more powder particle sizes, a graded
wick structure 90 may be employed in the present invention (FIGS. 36, 37 , 42, and 43). In one embodiment of the invention, a gradedwick 90 is formed bylayering particles 71, such that coarse (i.e., relatively large) particles are located in afirst layer 92 near the surface ofwick structure 90, with fine particles 73 (i.e., relatively small) located in asecond layer 94 deposited in underlying relation tofirst layer 92. It will be understood that multiple layers of varying species of particle may be employed in the present invention as well, such that grading can be done with as many layers as is needed, with particle and pore sizes varying up to two orders of magnitude across wick structure 62 (FIGS. 42 and 43 ). - Referring to
FIGS. 38, 40 , and 41,powder particles 27 may also be arranged in a transversely graded array such that one species of particle is arranged transversely adjacent to another species of particle. Alternatively,wick structure 62 may have a step-wise grading in whichpowder particles 27 are arranged at different thicknesses. - As disclosed hereinabove,
powder particles 27 formingwick structures powder particles 27 withinwick structure 62. In addition, when sintering, an appropriate protective atmosphere such as hydrogen, forming gas, vacuum or an inert gas such as helium, nitrogen or argon should be employed for adequate results. - Alternatively, a relatively thin layer of either brazed or
sintered metal particles 27 may be deposited uponinner surface 18 ofbottom wall 12 so as to form a vent-wick 80 at the bottom of each vapor-vent 60 (FIGS. 44-51 ). For example, brazed or sinteredcopper powder particles 27 are deposited on inner surface 18 (not shown inFIGS. 44-51 , but identified inFIGS. 20-27 ) at the bottom of each vapor-vent 60 such that vent-wick 80 comprises an average thickness in the range from about one to six average copper particle diameters (approximately 0.005 millimeters to 0.5 millimeters, preferably, in the range from about 0.05 millimeters to about 0.25 millimeters) when deposited over substantially all ofinner surface 18 ofbottom wall 12. Often, vent-wick 80 comprises an average thickness in the range from about one to three average copper particle diameters. - It is to be understood that the present invention is by no means limited only to the particular constructions herein disclosed and shown in the drawings, but also comprises any modifications or equivalents within the scope of the claims.
Claims (45)
Priority Applications (3)
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US12/367,296 US20090139697A1 (en) | 2003-06-26 | 2009-02-06 | Heat transfer device and method of making same |
US13/416,866 US20120175086A1 (en) | 2003-06-26 | 2012-03-09 | Heat transfer device and method of making same |
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US10/607,337 US6994152B2 (en) | 2003-06-26 | 2003-06-26 | Brazed wick for a heat transfer device |
US10/765,660 US7028759B2 (en) | 2003-06-26 | 2004-01-27 | Heat transfer device and method of making same |
US11/344,857 US20060124281A1 (en) | 2003-06-26 | 2006-02-01 | Heat transfer device and method of making same |
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US11300362B2 (en) * | 2019-01-31 | 2022-04-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Hybrid evaporator-feeding wicks for uniform fluid delivery to multiple heat sources in a vapor chamber |
US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
EP4246077A1 (en) * | 2022-03-14 | 2023-09-20 | Abb Schweiz Ag | A vapor chamber |
JP7444704B2 (en) | 2020-06-04 | 2024-03-06 | 古河電気工業株式会社 | Heat transfer member and cooling device having heat transfer member |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2007221497B2 (en) * | 2006-03-03 | 2012-06-14 | Micro Delta T Ab | Porous layer |
Citations (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384154A (en) * | 1956-08-30 | 1968-05-21 | Union Carbide Corp | Heat exchange system |
US3537514A (en) * | 1969-03-12 | 1970-11-03 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3675711A (en) * | 1970-04-08 | 1972-07-11 | Singer Co | Thermal shield |
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3750745A (en) * | 1970-07-06 | 1973-08-07 | R Moore | High heat flux heat pipe |
US3762011A (en) * | 1971-12-16 | 1973-10-02 | Trw Inc | Method of fabricating a capillary heat pipe wick |
US3788388A (en) * | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
US3921710A (en) * | 1972-08-23 | 1975-11-25 | Tokico Ltd | Heat pipe and manufacturing method thereof |
US4042316A (en) * | 1975-01-21 | 1977-08-16 | Rowenta-Werke, Gmbh | Gas lighter burner |
US4046190A (en) * | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4058299A (en) * | 1975-08-07 | 1977-11-15 | Erik Allan Lindkvist | Apparatus for removing polluting matter arising in flame cutting and like operations |
US4064914A (en) * | 1974-05-08 | 1977-12-27 | Union Carbide Corporation | Porous metallic layer and formation |
US4101691A (en) * | 1976-09-09 | 1978-07-18 | Union Carbide Corporation | Enhanced heat transfer device manufacture |
US4109709A (en) * | 1973-09-12 | 1978-08-29 | Suzuki Metal Industrial Co, Ltd. | Heat pipes, process and apparatus for manufacturing same |
US4116266A (en) * | 1974-08-02 | 1978-09-26 | Agency Of Industrial Science & Technology | Apparatus for heat transfer |
US4118756A (en) * | 1975-03-17 | 1978-10-03 | Hughes Aircraft Company | Heat pipe thermal mounting plate for cooling electronic circuit cards |
US4177646A (en) * | 1976-11-19 | 1979-12-11 | S. T. Dupont | Liquefied gas apparatus |
US4186796A (en) * | 1977-05-17 | 1980-02-05 | Usui International Industry, Ltd. | Heat pipe element |
US4231423A (en) * | 1977-12-09 | 1980-11-04 | Grumman Aerospace Corporation | Heat pipe panel and method of fabrication |
US4274749A (en) * | 1979-10-01 | 1981-06-23 | Clow Corporation | Polymer dispersion device |
US4279479A (en) * | 1980-05-29 | 1981-07-21 | Melvin Schrier | Vision screening kit |
US4327752A (en) * | 1979-12-05 | 1982-05-04 | Braun, Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
US4374528A (en) * | 1980-09-30 | 1983-02-22 | Braun Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
US4382448A (en) * | 1981-07-10 | 1983-05-10 | Braun Aktiengesellschaft | Electrical ignition system for a catalytically heated curling device |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
US4616699A (en) * | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
US4641404A (en) * | 1981-10-05 | 1987-02-10 | Seydel Scott O | Porous warp sizing apparatus |
US4697205A (en) * | 1986-03-13 | 1987-09-29 | Thermacore, Inc. | Heat pipe |
US4748314A (en) * | 1986-03-03 | 1988-05-31 | A.R.M.I.N.E.S. | Device for the rapid vaporization of a liquid |
US4765396A (en) * | 1986-12-16 | 1988-08-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric heat pipe wick |
US4777561A (en) * | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
US4807697A (en) * | 1988-02-18 | 1989-02-28 | Thermacore, Inc. | External artery heat pipe |
US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4830097A (en) * | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
US4840224A (en) * | 1987-04-28 | 1989-06-20 | Sig Schweizerische Industrie-Gesellschaft | Device for transferring heat energy by capillary forces |
US4865729A (en) * | 1985-11-04 | 1989-09-12 | Sepragen Corporation | Radial thin layer chromatography |
US4880052A (en) * | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
US4912548A (en) * | 1987-01-28 | 1990-03-27 | National Semiconductor Corporation | Use of a heat pipe integrated with the IC package for improving thermal performance |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
US4938409A (en) * | 1988-02-29 | 1990-07-03 | Nuclear Metals, Inc. | Brazed porous coating and improved method of joining metal with silver material |
US4960202A (en) * | 1987-01-14 | 1990-10-02 | Ingersoll-Rand Company | Friction control for bearing surface of roller |
US4982274A (en) * | 1988-12-14 | 1991-01-01 | The Furukawa Electric Co., Ltd. | Heat pipe type cooling apparatus for semiconductor |
US5059496A (en) * | 1989-03-23 | 1991-10-22 | Globe-Union Inc. | Nickel-hydrogen battery with oxygen and electrolyte management features |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US5103897A (en) * | 1991-06-05 | 1992-04-14 | Martin Marietta Corporation | Flowrate controller for hybrid capillary/mechanical two-phase thermal loops |
US5148440A (en) * | 1983-11-25 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Wick for metal vapor laser |
US5160252A (en) * | 1990-06-07 | 1992-11-03 | Edwards Thomas C | Rotary vane machines with anti-friction positive bi-axial vane motion controls |
US5200248A (en) * | 1990-02-20 | 1993-04-06 | The Procter & Gamble Company | Open capillary channel structures, improved process for making capillary channel structures, and extrusion die for use therein |
US5219020A (en) * | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5242644A (en) * | 1990-02-20 | 1993-09-07 | The Procter & Gamble Company | Process for making capillary channel structures and extrusion die for use therein |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5283729A (en) * | 1991-08-30 | 1994-02-01 | Fisher-Rosemount Systems, Inc. | Tuning arrangement for turning the control parameters of a controller |
US5320866A (en) * | 1988-10-24 | 1994-06-14 | The United States Of America As Represented By The Secretary Of The Air Force | Method of wet coating a ceramic substrate with a liquid suspension of metallic particles and binder applying similar dry metallic particles onto the wet surface, then drying and heat treating the article |
US5331510A (en) * | 1991-08-30 | 1994-07-19 | Hitachi, Ltd. | Electronic equipment and computer with heat pipe |
US5333470A (en) * | 1991-05-09 | 1994-08-02 | Heat Pipe Technology, Inc. | Booster heat pipe for air-conditioning systems |
US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US5409055A (en) * | 1992-03-31 | 1995-04-25 | Furukawa Electric Co., Ltd. | Heat pipe type radiation for electronic apparatus |
US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
US5549394A (en) * | 1994-11-10 | 1996-08-27 | Hycomp, Inc. | Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein |
US5711816A (en) * | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US5883426A (en) * | 1996-04-18 | 1999-03-16 | Nec Corporation | Stack module |
US5884693A (en) * | 1997-12-31 | 1999-03-23 | Dsc Telecom L.P. | Integral heat pipe enclosure |
US5890371A (en) * | 1996-07-12 | 1999-04-06 | Thermotek, Inc. | Hybrid air conditioning system and a method therefor |
US5950710A (en) * | 1997-11-21 | 1999-09-14 | Continocean Tech Inc. | Overheat regulating system for vehicle passenger compartment |
US6041211A (en) * | 1996-06-06 | 2000-03-21 | W. L. Gore & Associates, Inc. | Cleaning assembly for critical image surfaces in printer devices and method of using same |
US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6055297A (en) * | 1996-08-02 | 2000-04-25 | Northern Telecom Limited | Reducing crosstalk between communications systems |
US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6154364A (en) * | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
US6169852B1 (en) * | 1999-04-20 | 2001-01-02 | The Hong Kong University Of Science & Technology | Rapid vapor generator |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6230407B1 (en) * | 1998-07-02 | 2001-05-15 | Showa Aluminum Corporation | Method of checking whether noncondensable gases remain in heat pipe and process for producing heat pipe |
US6239350B1 (en) * | 1998-09-28 | 2001-05-29 | Advanced Modular Power Systems | Internal self heat piping AMTEC cell |
US6256201B1 (en) * | 1998-10-21 | 2001-07-03 | Furukawa Electric Co., Ltd. | Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6303081B1 (en) * | 1998-03-30 | 2001-10-16 | Orasure Technologies, Inc. | Device for collection and assay of oral fluids |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US6397935B1 (en) * | 1995-12-21 | 2002-06-04 | The Furukawa Electric Co. Ltd. | Flat type heat pipe |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3828849A (en) * | 1971-03-16 | 1974-08-13 | Gen Electric | Heat transfer device |
US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
JPS5924538A (en) * | 1982-07-30 | 1984-02-08 | Japan Radio Co Ltd | Heat pipe and its manufacture |
-
2004
- 2004-06-04 EP EP04754527A patent/EP1639628A4/en not_active Withdrawn
- 2004-06-04 WO PCT/US2004/017937 patent/WO2005006395A2/en active Application Filing
-
2006
- 2006-02-01 US US11/344,857 patent/US20060124281A1/en not_active Abandoned
Patent Citations (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384154A (en) * | 1956-08-30 | 1968-05-21 | Union Carbide Corp | Heat exchange system |
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3537514A (en) * | 1969-03-12 | 1970-11-03 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3675711A (en) * | 1970-04-08 | 1972-07-11 | Singer Co | Thermal shield |
US3750745A (en) * | 1970-07-06 | 1973-08-07 | R Moore | High heat flux heat pipe |
US3788388A (en) * | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
US3762011A (en) * | 1971-12-16 | 1973-10-02 | Trw Inc | Method of fabricating a capillary heat pipe wick |
US3921710A (en) * | 1972-08-23 | 1975-11-25 | Tokico Ltd | Heat pipe and manufacturing method thereof |
US4109709A (en) * | 1973-09-12 | 1978-08-29 | Suzuki Metal Industrial Co, Ltd. | Heat pipes, process and apparatus for manufacturing same |
US4064914A (en) * | 1974-05-08 | 1977-12-27 | Union Carbide Corporation | Porous metallic layer and formation |
US4116266A (en) * | 1974-08-02 | 1978-09-26 | Agency Of Industrial Science & Technology | Apparatus for heat transfer |
US4042316A (en) * | 1975-01-21 | 1977-08-16 | Rowenta-Werke, Gmbh | Gas lighter burner |
US4118756A (en) * | 1975-03-17 | 1978-10-03 | Hughes Aircraft Company | Heat pipe thermal mounting plate for cooling electronic circuit cards |
US4046190A (en) * | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4058299A (en) * | 1975-08-07 | 1977-11-15 | Erik Allan Lindkvist | Apparatus for removing polluting matter arising in flame cutting and like operations |
US4101691A (en) * | 1976-09-09 | 1978-07-18 | Union Carbide Corporation | Enhanced heat transfer device manufacture |
US4177646A (en) * | 1976-11-19 | 1979-12-11 | S. T. Dupont | Liquefied gas apparatus |
US4186796A (en) * | 1977-05-17 | 1980-02-05 | Usui International Industry, Ltd. | Heat pipe element |
US4231423A (en) * | 1977-12-09 | 1980-11-04 | Grumman Aerospace Corporation | Heat pipe panel and method of fabrication |
US4274749A (en) * | 1979-10-01 | 1981-06-23 | Clow Corporation | Polymer dispersion device |
US4327752A (en) * | 1979-12-05 | 1982-05-04 | Braun, Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
US4354482A (en) * | 1979-12-05 | 1982-10-19 | The Gillette Company | Automatic temperature control system with manual off override for a catalytically heated curling device |
US4361133A (en) * | 1979-12-05 | 1982-11-30 | The Gillette Company | Catalytic support for a curling device |
US4279479A (en) * | 1980-05-29 | 1981-07-21 | Melvin Schrier | Vision screening kit |
US4374528A (en) * | 1980-09-30 | 1983-02-22 | Braun Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
US4382448A (en) * | 1981-07-10 | 1983-05-10 | Braun Aktiengesellschaft | Electrical ignition system for a catalytically heated curling device |
US4641404A (en) * | 1981-10-05 | 1987-02-10 | Seydel Scott O | Porous warp sizing apparatus |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
US5148440A (en) * | 1983-11-25 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Wick for metal vapor laser |
US4616699A (en) * | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
US4777561A (en) * | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
US4865729A (en) * | 1985-11-04 | 1989-09-12 | Sepragen Corporation | Radial thin layer chromatography |
US4748314A (en) * | 1986-03-03 | 1988-05-31 | A.R.M.I.N.E.S. | Device for the rapid vaporization of a liquid |
US4697205A (en) * | 1986-03-13 | 1987-09-29 | Thermacore, Inc. | Heat pipe |
US4765396A (en) * | 1986-12-16 | 1988-08-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric heat pipe wick |
US4960202A (en) * | 1987-01-14 | 1990-10-02 | Ingersoll-Rand Company | Friction control for bearing surface of roller |
US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4912548A (en) * | 1987-01-28 | 1990-03-27 | National Semiconductor Corporation | Use of a heat pipe integrated with the IC package for improving thermal performance |
US4840224A (en) * | 1987-04-28 | 1989-06-20 | Sig Schweizerische Industrie-Gesellschaft | Device for transferring heat energy by capillary forces |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US4830097A (en) * | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
US4807697A (en) * | 1988-02-18 | 1989-02-28 | Thermacore, Inc. | External artery heat pipe |
US4938409A (en) * | 1988-02-29 | 1990-07-03 | Nuclear Metals, Inc. | Brazed porous coating and improved method of joining metal with silver material |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
US5320866A (en) * | 1988-10-24 | 1994-06-14 | The United States Of America As Represented By The Secretary Of The Air Force | Method of wet coating a ceramic substrate with a liquid suspension of metallic particles and binder applying similar dry metallic particles onto the wet surface, then drying and heat treating the article |
US4982274A (en) * | 1988-12-14 | 1991-01-01 | The Furukawa Electric Co., Ltd. | Heat pipe type cooling apparatus for semiconductor |
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
US4880052A (en) * | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
US5059496A (en) * | 1989-03-23 | 1991-10-22 | Globe-Union Inc. | Nickel-hydrogen battery with oxygen and electrolyte management features |
US5200248A (en) * | 1990-02-20 | 1993-04-06 | The Procter & Gamble Company | Open capillary channel structures, improved process for making capillary channel structures, and extrusion die for use therein |
US5242644A (en) * | 1990-02-20 | 1993-09-07 | The Procter & Gamble Company | Process for making capillary channel structures and extrusion die for use therein |
US5200248B1 (en) * | 1990-02-20 | 1999-02-09 | Procter & Gamble | Open capillary channel structures improved process for making capillary channel structures and extrusion die for use therein |
US5160252A (en) * | 1990-06-07 | 1992-11-03 | Edwards Thomas C | Rotary vane machines with anti-friction positive bi-axial vane motion controls |
US5711816A (en) * | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
US5219020A (en) * | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5333470A (en) * | 1991-05-09 | 1994-08-02 | Heat Pipe Technology, Inc. | Booster heat pipe for air-conditioning systems |
US5103897A (en) * | 1991-06-05 | 1992-04-14 | Martin Marietta Corporation | Flowrate controller for hybrid capillary/mechanical two-phase thermal loops |
US5331510A (en) * | 1991-08-30 | 1994-07-19 | Hitachi, Ltd. | Electronic equipment and computer with heat pipe |
US5283729A (en) * | 1991-08-30 | 1994-02-01 | Fisher-Rosemount Systems, Inc. | Tuning arrangement for turning the control parameters of a controller |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
US5349237A (en) * | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
US5409055A (en) * | 1992-03-31 | 1995-04-25 | Furukawa Electric Co., Ltd. | Heat pipe type radiation for electronic apparatus |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
US5549394A (en) * | 1994-11-10 | 1996-08-27 | Hycomp, Inc. | Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein |
US5664890A (en) * | 1994-11-10 | 1997-09-09 | Hycomp, Inc. | Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein |
US6397935B1 (en) * | 1995-12-21 | 2002-06-04 | The Furukawa Electric Co. Ltd. | Flat type heat pipe |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US5947193A (en) * | 1996-01-29 | 1999-09-07 | Sandia Corporation | Heat pipe with embedded wick structure |
US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US5883426A (en) * | 1996-04-18 | 1999-03-16 | Nec Corporation | Stack module |
US6041211A (en) * | 1996-06-06 | 2000-03-21 | W. L. Gore & Associates, Inc. | Cleaning assembly for critical image surfaces in printer devices and method of using same |
US5890371A (en) * | 1996-07-12 | 1999-04-06 | Thermotek, Inc. | Hybrid air conditioning system and a method therefor |
US6055297A (en) * | 1996-08-02 | 2000-04-25 | Northern Telecom Limited | Reducing crosstalk between communications systems |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US5950710A (en) * | 1997-11-21 | 1999-09-14 | Continocean Tech Inc. | Overheat regulating system for vehicle passenger compartment |
US6076595A (en) * | 1997-12-31 | 2000-06-20 | Alcatel Usa Sourcing, L.P. | Integral heat pipe enclosure |
US5884693A (en) * | 1997-12-31 | 1999-03-23 | Dsc Telecom L.P. | Integral heat pipe enclosure |
US6303081B1 (en) * | 1998-03-30 | 2001-10-16 | Orasure Technologies, Inc. | Device for collection and assay of oral fluids |
US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
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US6256201B1 (en) * | 1998-10-21 | 2001-07-03 | Furukawa Electric Co., Ltd. | Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe |
US6154364A (en) * | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6169852B1 (en) * | 1999-04-20 | 2001-01-02 | The Hong Kong University Of Science & Technology | Rapid vapor generator |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
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Also Published As
Publication number | Publication date |
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WO2005006395A3 (en) | 2005-04-28 |
EP1639628A4 (en) | 2007-12-26 |
WO2005006395A2 (en) | 2005-01-20 |
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