US20060126039A9 - Multiple system vibration isolator - Google Patents
Multiple system vibration isolator Download PDFInfo
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- US20060126039A9 US20060126039A9 US10/186,876 US18687602A US2006126039A9 US 20060126039 A9 US20060126039 A9 US 20060126039A9 US 18687602 A US18687602 A US 18687602A US 2006126039 A9 US2006126039 A9 US 2006126039A9
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- vibration isolator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/023—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means
- F16F15/0232—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means with at least one gas spring
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F9/00—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
- F16F9/02—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium using gas only or vacuum
Definitions
- the present invention is directed to a vibration isolator. More specifically, the present invention is directed to a vibration isolator for an exposure apparatus and a method for making a vibration isolator for isolating vibration.
- Exposure apparatuses are commonly used to transfer images from a reticle onto a semiconductor wafer during semiconductor processing.
- a typical exposure apparatus includes a frame assembly, a measurement system, a control system, an illumination source, a projection optical assembly, a reticle stage for retaining a reticle, and a wafer stage for retaining a semiconductor wafer.
- the frame assembly typically supports the measurement system, the illumination source, the reticle stage, the projection optical assembly, and the wafer stage above the ground.
- the measurement system monitors the positions of the stages relative to a reference such as the projection optical assembly.
- the projection optical assembly projects and/or focuses the light that passes through the reticle.
- One or more movers precisely position the reticle stage relative to the projection optical assembly.
- one or more movers precisely position the wafer stage relative to the projection optical assembly.
- the size of the images and the features within the images transferred onto the wafer from the reticle are extremely small. Accordingly, the precise positioning of the wafer and the reticle relative to the optical assembly is critical to the manufacture of high density, semiconductor wafers.
- the vibrations and deformations in the frame assembly can move the stages and the projection optical assembly out of precise relative alignment. Further, the vibrations and deformations in the frame assembly can cause the measurement system to improperly measure the positions of the stages relative to the projection optical assembly. Additionally, vibration of the projection optical assembly can cause deformations of the optical elements within the projection optical assembly and degrade the optical imaging quality. As a result thereof, the accuracy of the exposure apparatus and the quality of the integrated circuits formed on the wafer can be compromised.
- One attempt to solve this problem involves the use of one or more air mounts to secure the frame assembly to the ground.
- the air mounts utilize a cushion of pressurized air to reduce the effect of vibration of the ground causing vibration to the frame assembly.
- one or more air mounts can be used to support the components of the exposure apparatus on the frame assembly.
- existing air mounts with adequate damping capacity have a relatively high natural frequency and are relatively stiff.
- the present invention is directed to a vibration isolator for isolating a first assembly from vibration from a second assembly.
- the vibration isolator includes a first system and a second system coupled to the first system.
- the first system supports the majority of the first assembly relative to the second assembly and the second system adjusts for a change in the location of the center of gravity of the first assembly, compensate for fluctuations in the atmospheric pressure near the vibration isolator, and/or a changing load.
- the first system functions differently from the second system.
- the first system includes a first cylinder and a first piston that moves within the first cylinder.
- the first piston cooperates with the first cylinder to define a first chamber that is maintained at a pressure that is less than the atmospheric pressure.
- the vacuum type first system is not very stiff and has a relatively low natural frequency.
- the first system can include a permanent magnet section, a magnetically permeable section that is attracted to the magnet section and a mover assembly that moves one of the sections relative to the other section to adjust the lift of the first system.
- the second system can include a second cylinder and a second piston that moves within the second cylinder.
- the second piston cooperates with the second cylinder to define a second chamber that is maintained at a pressure that is greater than the atmospheric pressure.
- the second system can include a mover such as a voice coil motor.
- the second system can include a mass controller that adds and/or removes mass to the first assembly.
- the vibration isolator can include a third system that is coupled to the other system.
- the third system for example, can include a third cylinder and a third piston that cooperate to define a third chamber that is maintained below atmospheric pressure.
- the third system increases the load capacity of the vibration isolator while reducing the footprint of the vibration isolator.
- the vibration isolator is particularly useful as part of an exposure apparatus.
- one or more vibration isolators can be used as part of a frame isolation system that secures a frame assembly of the exposure apparatus to a mounting base.
- the frame isolation system reduces the effect of vibration of the mounting base causing vibration on the frame assembly and the components that are secured to the frame assembly.
- one or more of the vibration isolators can be used to secure one or more other assemblies of the exposure apparatus to the frame assembly.
- one or more vibration isolators could be used as part of an isolation system to secure a stage assembly or an optical assembly to the frame assembly. With this design, the isolation system reduces the effect of vibration of the frame assembly causing vibration on the stage assembly or the optical assembly.
- the present invention is also directed to a device made with the exposure apparatus, a wafer made with the exposure apparatus, a method for making a vibration isolator, a method for making an isolation system, a method for making an exposure apparatus, a method for making a device, and a method for making a wafer.
- FIG. 1 is a side illustration of an exposure apparatus having features of the present invention
- FIG. 2A is a side view of a first embodiment of a vibration isolator having features of the present invention
- FIG. 2B is a cut-away perspective view of the vibration isolator of FIG. 2A ;
- FIG. 2C is a top, exploded perspective view of a portion of the vibration isolator of FIG. 2A ;
- FIG. 2D is a bottom, exploded perspective view of a portion of the vibration isolator of FIG. 2A ;
- FIG. 3A is a side view of another embodiment of a vibration isolator having features of the present invention.
- FIG. 3B is a cut-away perspective view of the vibration isolator of FIG. 3A ;
- FIG. 4A is a side view of still another embodiment of a vibration isolator having features of the present invention.
- FIG. 4B is a cut-away perspective view of the vibration isolator of FIG. 4A ;
- FIG. 5A is a cut-away view of yet another embodiment of a vibration isolator having features of the present invention.
- FIG. 5B is a cut-away of the embodiment of the vibration isolator of FIG. 5A illustrating lateral movement
- FIG. 5C is a perspective view of still another embodiment of a vibration isolator
- FIG. 5D is a top view of the vibration isolator of FIG. 5C ;
- FIG. 5E is a cut-away view taken on line 5 E- 5 E of FIG. 5D ;
- FIG. 5F is a cross-section view of yet another embodiment of a vibration isolator
- FIG. 6A is a side view of another embodiment of a vibration isolator having features of the present invention.
- FIG. 6B is a cut-away perspective view of the vibration isolator of FIG. 6A ;
- FIG. 7A is a side view of another embodiment of a vibration isolator having features of the present invention.
- FIG. 7B is a cut-away perspective view of the vibration isolator of FIG. 7A ;
- FIG. 7C is a cutaway perspective view of still another embodiment of a vibration isolator having features of the present invention.
- FIG. 8A is a flow chart that outlines a process for manufacturing a device in accordance with the present invention.
- FIG. 8B is a flow chart that outlines device processing in more detail.
- FIG. 1 illustrates an apparatus 10 that includes one or more isolation assemblies 12 that isolate the apparatus 10 or a portion of the apparatus 10 from vibration.
- the type of apparatus 10 can be varied.
- the apparatus 10 can be used to manufacture, measure and/or inspect a device 14 .
- the type of device 14 manufactured or inspected by the apparatus 10 can be varied.
- the device 14 can be a semiconductor wafer, and the isolation assemblies 12 can be used as part of an exposure apparatus 10 that precisely transfers an image of an integrated circuit from an object 16 such as a reticle onto the semiconductor wafer 14 .
- FIG. 1 Some of the Figures provided herein include a coordinate system that designates an X axis, a Y axis that is orthogonal to the X axis, and a Z axis that is orthogonal to the X axis and the Y axis.
- the coordinate system is merely for reference and can be varied.
- the Z axis can be switched with the Y axis or the X axis and/or the apparatus 10 can be rotated.
- the X axis, the Y axis, and the Z axis can be referred to as the first axis, the second axis, and the third axis.
- the term six degrees of freedom shall include movement along the X axis, along the Y axis, along the Z axis, about the X axis, about the Y axis and about the Z axis.
- the exposure apparatus 10 illustrated in FIG. 1 also includes a frame assembly 18 , an illumination system 20 (irradiation apparatus), a reticle stage assembly 22 , a projection optical assembly 24 , a wafer stage assembly 26 , and a control system 28 .
- the exposure apparatus 10 mounts to a mounting base 30 , e.g., the ground, a base, or floor or some other supporting structure.
- the exposure apparatus 10 can be used as scanning type photolithography system that exposes the pattern from the reticle 16 onto the wafer 14 with the reticle 16 and the wafer 14 moving synchronously.
- the reticle 16 is moved perpendicular to an optical axis of the projection optical assembly 24 by the reticle stage assembly 22 and the wafer 14 is moved perpendicular to the optical axis of the projection optical assembly 24 by the wafer stage assembly 26 . Scanning of the reticle 16 and the wafer 14 occurs while the reticle 16 and the wafer 14 are moving synchronously.
- the exposure apparatus 10 can be a step-and-repeat type photolithography system that exposes the reticle 16 while the reticle 16 and the wafer 14 are stationary.
- the wafer 14 is in a constant position relative to the reticle 16 and the projection optical assembly 24 during the exposure of an individual field.
- the wafer stage assembly 26 consecutively moves the wafer 14 perpendicular to the optical axis of the projection optical assembly 24 so that the next field of the wafer 14 is brought into position relative to the projection optical assembly 24 and the reticle 16 for exposure.
- the images on the reticle 16 are sequentially exposed onto the fields of the wafer 14 so that the next field of the wafer 14 is brought into position relative to the projection optical assembly 24 and the reticle 16 .
- the use of the exposure apparatus 10 and the isolation assemblies 12 is not limited to a photolithography system for semiconductor manufacturing.
- the apparatus 10 for example, can be used as an LCD photolithography system that exposes a liquid crystal display device pattern onto a rectangular glass plate or a photolithography system for manufacturing a thin film magnetic head.
- the present invention can also be applied to a proximity photolithography system that exposes a mask pattern by closely locating a mask and a substrate without the use of a projection optical assembly.
- the present invention provided herein can be used in other devices, including other semiconductor processing equipment.
- the frame assembly 18 is rigid and supports the components of the exposure apparatus 10 .
- the design of the frame assembly 18 can be varied to suit the design requirements for the rest of the exposure apparatus 10 .
- the frame assembly 18 illustrated in FIG. 1 supports the projection optical assembly 24 , the illumination system 20 , the reticle stage assembly 22 and the wafer stage assembly 26 above the mounting base 30 .
- the illumination system 20 includes an illumination source 32 and an illumination optical assembly 34 .
- the illumination source 32 emits the beam (irradiation) of light energy.
- the illumination source 32 can be g-line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), ArF excimer laser (193 nm) and F 2 laser (157 nm).
- the illumination source 32 can also use charged particle beams such as an x-ray and electron beam.
- charged particle beams such as an x-ray and electron beam.
- thermionic emission type lanthanum hexaboride (LaB 6 ) or tantalum (Ta) can be used as an electron gun.
- the structure could be such that either a mask is used or a pattern can be directly formed on a substrate without the use of a mask.
- the illumination optical assembly 34 guides the beam of light energy from the illumination source 32 to the reticle 16 .
- the beam illuminates selectively different portions of the reticle 16 and exposes the semiconductor wafer 14 .
- the illumination source 32 is illustrated as being supported above the reticle stage assembly 22 .
- the illumination source 32 is secured to one of the sides of the frame assembly 18 and the energy beam from the illumination source 32 is directed to above the reticle 16 with the illumination optical assembly 34 .
- the reticle stage assembly 22 holds and positions the reticle 16 relative to the optical assembly 24 and the wafer 14 .
- the design of the reticle stage assembly 22 can vary to suit the design requirements of the apparatus 10 .
- the reticle stage assembly 22 includes a reticle stage base 38 , a reticle stage 40 , and a reticle stage mover assembly 42 .
- the reticle stage base 38 supports the reticle stage 40 above the mounting base 30 .
- the reticle stage base 38 is generally rectangular shaped and includes a planar base top (sometimes referred to as a guide face), an opposed planar base bottom (not shown), and four base sides.
- the reticle stage 40 retains the reticle 16 .
- the reticle stage 40 can include a device holder such as a vacuum chuck, an electrostatic chuck, or some other type of clamp.
- the reticle stage 40 is somewhat rectangular shaped.
- a bearing (not shown) maintains the reticle stage 40 spaced apart along the Z axis relative to the reticle stage base 38 and allows for motion of the reticle stage 40 along the X axis, along the Y axis and about the Z axis relative to the reticle stage base 38 .
- the reticle stage mover assembly 42 controls and moves the reticle stage 40 relative to the reticle stage base 38 .
- the design of the reticle stage mover assembly 42 and the movement of the reticle stage 40 can be varied to suit the movement requirements of the apparatus 10 .
- the reticle stage 40 moves relative to the reticle stage base 38 along the X axis, along the Y axis and about the Z axis.
- the reticle stage mover assembly 42 includes a guide bar 46 , a first X stage mover 48 , a second X stage mover 50 , and a Y stage mover (not shown).
- the X stage movers 48 , 50 move the guide bar 46 , the reticle stage 40 and the reticle 16 along the X axis and about the Z axis (theta Z), and (ii) the Y stage mover moves the reticle stage 40 along the Y axis relative to the guide bar 46 .
- each mover 48 , 50 can be varied to suit the movement requirements of the apparatus 10 .
- each of the movers 48 , 50 can include one or more rotary motors, voice coil motors, linear motors, electromagnetic actuators, or some other force actuators.
- each of the movers 48 , 50 is a commutated, linear motor. Electrical current (not shown) is individually supplied to each mover 48 , 50 by the control system 28 to precisely position the reticle 16 .
- the reticle stage assembly 22 can include a reticle measurement system (not shown) that monitors the position of the reticle stage 40 relative to the projection optical assembly 24 or some other reference. With this information, the reticle stage mover assembly 42 can be used to precisely position the reticle stage 40 .
- the reticle measurement system can utilize laser interferometers, encoders, sensors, and/or other measuring devices.
- the projection optical assembly 24 projects, directs and/or focuses the beam of light energy passing through the projection optical assembly 24 .
- the design of the projection optical assembly 24 can be varied according to its design requirements.
- the projection optical assembly 24 can magnify or reduce the image to be illuminated onto the device 14 .
- the projection optical assembly 24 need not be limited to a magnification or a reduction system.
- the projection optical assembly 24 could also be a 1 ⁇ system.
- the projection optical assembly 24 when far ultra-violet rays such as the excimer laser is used, glass materials such as quartz and fluorite that transmit far ultra-violet rays is preferable to be used.
- the projection optical assembly 24 should preferably be either catadioptric or refractive (a reticle should also preferably be a reflective type), and when an electron beam is used, electron optics should preferably consist of electron lenses and deflectors. The optical path for the electron beams should be in a vacuum.
- the catadioptric type optical system can be considered.
- the catadioptric type of optical system include the disclosure Japan Patent Application Disclosure No.8-171054 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Pat. No. 5,668,672, as well as Japan Patent Application Disclosure No. 10-20195 and its counterpart U.S. Pat. No. 5,835,275.
- the reflecting optical device can be a catadioptric optical system incorporating a beam splitter and concave mirror.
- the wafer stage assembly 26 holds and positions the wafer 14 with respect to the adjusted projected image of the illuminated portions of the reticle 16 .
- the design of the wafer stage assembly 26 can vary to suit the design requirements of the apparatus 10 .
- the wafer stage assembly 26 includes a wafer stage base 52 , a wafer stage 54 , and a wafer stage mover assembly 56 .
- the wafer stage base 52 supports the wafer stage 54 above the mounting base 30 .
- the wafer stage base 52 is generally rectangular shaped and includes a planar base top (sometimes referred to as a guide face), an opposed planar base bottom (not shown), and four base sides.
- the wafer stage 54 retains the wafer 14 .
- the wafer stage 54 can include a device holder such as a vacuum chuck, an electrostatic chuck, or some other type of clamp.
- the wafer stage 54 is somewhat rectangular shaped.
- a bearing (not shown) maintains the wafer stage 54 spaced apart along the Z axis relative to the wafer stage base 52 and allows for motion of the wafer stage 54 along the X axis, along the Y axis and about the Z axis relative to the wafer stage base 52 .
- the wafer stage mover assembly 56 controls and moves the wafer stage 54 relative to the wafer stage base 52 .
- the design of the wafer stage mover assembly 56 and the movement of the wafer stage 54 can be varied to suit the movement requirements of the apparatus 10 .
- the wafer stage 54 moves relative to the wafer stage base 52 along the X axis, along the Y axis and about the Z axis.
- the wafer stage mover assembly 56 includes a guide bar 60 , a first X stage mover 62 , a second X stage mover 64 , and a Y stage mover (not shown).
- the X stage movers 62 , 64 move the guide bar 60 , the wafer stage 54 and the wafer 14 along the X axis and about the Z axis (theta Z), and (ii) the Y stage mover moves the wafer stage 54 along the Y axis relative to the guide bar 60 .
- each mover 62 , 64 can be varied to suit the movement requirements of the apparatus 10 .
- each of the movers 62 , 64 can include one or more rotary motors, voice coil motors, linear motors, electromagnetic actuators, or some other force actuators.
- each of the movers 62 , 64 is a commutated, linear motor. Electrical current (not shown) is individually supplied to each mover 62 , 64 by the control system 28 to precisely position the wafer 14 .
- the wafer stage assembly 26 can include a wafer measurement system (not shown) that monitors the position of the wafer stage 54 relative to the projection optical assembly 24 or some other reference. With this information, the wafer stage mover assembly 56 can be used to precisely position the wafer stage 54 .
- the wafer measurement system can utilize laser interferometers, encoders, sensors, and/or other measuring devices.
- linear motors see U.S. Pat. Nos. 5,623,853 or 5,528,118
- the linear motors can be either an air levitation type employing air bearings or a magnetic levitation type using Lorentz force or reactance force.
- the stage could move along a guide, or it could be a guideless type stage that uses no guide. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,623,853 and 5,528,118 are incorporated herein by reference.
- one of the stages could be driven by a planar motor, which drives the stage by an electromagnetic force generated by a magnet unit having two-dimensionally arranged magnets and an armature coil unit having two-dimensionally arranged coils in facing positions.
- a planar motor which drives the stage by an electromagnetic force generated by a magnet unit having two-dimensionally arranged magnets and an armature coil unit having two-dimensionally arranged coils in facing positions.
- either the magnet unit or the armature coil unit is connected to the stage and the other unit is mounted on the moving plane side of the stage.
- reaction forces generated by the wafer (substrate) stage motion can be mechanically released to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,528,118 and published Japanese Patent Application Disclosure No. 8-166475. Additionally, reaction forces generated by the reticle (mask) stage motion can be mechanically released to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,874,820 and published Japanese Patent Application Disclosure No. 8-330224. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,528,118 and 5,874,820 and Japanese Patent Application Disclosure No. 8-330224 are incorporated herein by reference.
- Each isolation assembly 12 inhibits vibration from a first assembly from being transferred to a second assembly. Further, each isolation assembly 12 can adjust the position of the first assembly relative to the second assembly with at least three degrees of freedom. Additionally, each isolation assembly 12 can adjust the position of the first assembly relative to the second assembly with six three degrees of freedom. Details of isolations assemblies can be found in U.S. Pat. No. 5,701,041, U.S. Pat. No. 6,226,075, U.S. Pat. No. 6,144,442, EP 0973067, WO 99/05573, and WO 99/22272, as far a permitted, the disclosures of which are incorporated herein by reference.
- the exposure apparatus 10 includes a frame isolation system 66 , a reticle stage isolation system 68 , a wafer stage isolation system 70 , and an optical isolation system 72 .
- the design of each isolation assembly 12 can be varied to suit the design requirements of the apparatus 10 .
- the frame isolation system 66 secures the frame assembly 18 to the mounting base 30 .
- the frame isolation system 66 reduces the effect of vibration of the mounting base 30 (the second assembly) causing vibration on the frame assembly 18 (the first assembly) and the components of the exposure apparatus 10 that are secured to the frame assembly 18 .
- the frame isolation system 66 includes a plurality of spaced apart vibration isolators 100 that support the weight of the frame assembly 18 , while remaining low in stiffness for good passive vibration isolation of the frame assembly 18 relative to the mounting base 30 .
- the number of vibration isolators 100 in the frame isolation system 66 can be varied.
- the frame isolation system 66 can include three spaced apart vibration isolators 100 .
- the frame isolation system 66 moves and positions the frame assembly 18 relative to the mounting base 30 base with six degrees of freedom. More specifically, the vibration isolators 100 adjust the position of the frame assembly 18 relative to the mounting base 30 along the Z axis, about the X axis and about the Y axis. Additionally, the frame isolation system 66 includes one or more movers for adjusting the position of the frame assembly 18 relative to the mounting base 30 along the X axis, along the Y axis and about the Z axis. In FIG.
- the frame isolation system 66 includes (i) two spaced apart X movers 101 X that move the frame assembly 18 relative to the mounting base 30 along the X axis and about the Z axis, and (ii) a Y mover 101 Y that moves the frame assembly 18 relative to the mounting base 30 along the Y axis.
- each mover 101 X, 101 Y can be varied to suit the movement requirements of the apparatus 10 .
- each of the movers 101 X, 101 Y can include one or more rotary motors, voice coil motors, linear motors, electromagnetic actuators, or some other force actuators.
- each of the movers 101 X, 101 Y is a voice coil motor. Electrical current (not shown) is individually supplied to each mover 101 X, 101 Y by the control system 28 to precisely position the frame assembly 18 .
- control system 28 actively controls the vibration isolators 100 to compensate for low frequency disturbances such as a shift in the center of gravity in one the stage assemblies 22 , 26 .
- the position and acceleration of the frame assembly 18 relative to the mounting base 30 can be monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, the control system 28 can control the frame isolation system 66 to adjust and control the position of the frame assembly 18 relative to the mounting base 30 .
- the reticle stage isolation system 68 secures and supports the reticle stage base 38 to the frame assembly 18 and reduces the effect of vibration of the frame assembly 18 causing vibration to the reticle stage base 38 .
- the reticle stage isolation system 68 includes a plurality of spaced apart vibration isolators 102 that support the weight of the reticle stage base 38 and adjust the position of the reticle stage base 38 with three degrees of freedom, while remaining low in stiffness for good passive vibration isolation of the reticle stage base 38 relative to the frame assembly 18 .
- the reticle stage isolation system 68 can be designed to move the reticle stage base 38 with six degrees of freedom.
- the control system 28 actively controls the vibration isolators 102 to compensate for low frequency disturbances, to adjust the static or low frequency position of the reticle stage base 38 , to improve vibration isolation by reducing the stiffness, and/or to compensate for a change or shift in the center of gravity of the reticle stage assembly 22 .
- the position and acceleration of the reticle stage base 38 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, the control system 28 can cooperate with the reticle stage isolation system 68 to adjust and control the position of the reticle stage base 38 .
- the wafer stage isolation system 70 secures and supports the wafer stage base 52 to the frame assembly 18 and reduces the effect of vibration of the frame assembly 18 causing vibration to the wafer stage base 52 .
- the wafer stage isolation system 70 includes a plurality of spaced apart vibration isolators 104 and the control system 28 actively controls the vibration isolators 104 to compensate for low frequency disturbances, to adjust the static or low frequency position of the wafer stage base 52 , to adjust the position of the wafer stage base 52 with three degrees of freedom and to improve vibration isolation by reducing the stiffness, and/or to compensate for a change or shift in the center of gravity of the wafer stage assembly 26 .
- the wafer stage isolation system 70 can be designed to move the wafer stage base 52 with six degrees of freedom.
- the position and acceleration of the wafer stage base 52 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, the control system 28 can cooperate with the wafer stage isolation system 70 to adjust and control the position of the wafer stage base 52 .
- the optical isolation system 72 secures and supports the projection optical assembly 24 relative to the frame assembly 18 and reduces the effect of vibration of the frame assembly 18 causing vibration to the projection optical assembly 24 .
- the optical isolation system 72 is similar to the other isolation systems discussed above.
- the optical isolation system 72 includes a plurality of vibration isolators 106 and the control system 28 actively controls vibration isolators 106 to position the optical assembly 24 , to compensate for low frequency disturbances, to adjust the static or low frequency position of the optical assembly 24 and to improve vibration isolation by reducing the stiffness.
- the control system 28 controls the actuators 106 to actively damp and control the position of the projection optical assembly 24 .
- the position and acceleration of the projection optical assembly 24 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, the control system 28 can cooperate with the optical isolation system 72 to adjust and control the position of the projection optical assembly 24 .
- FIG. 2A illustrates a side view of a first embodiment of a vibration isolator 200 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 200 includes a first system 202 and a second system 204 .
- the first system 202 supports at least a portion of a first assembly 206 relative to a second assembly 208 and the second system 204 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 206 .
- the first system 202 includes a vacuum source 210 and the second system 204 includes a fluid source 212 .
- the design of the components of the vibration isolator 200 can be varied to suit the intended use of the vibration isolator 200 .
- FIG. 2B illustrates a cross-sectional, perspective view of the vibration isolator 200 of FIG. 2A .
- the vibration isolator 200 includes a system connector 216 that couples the first system 202 to the second system 204 so that the forces from the systems 202 , 204 act in parallel.
- the first system 202 and second system 204 are aligned along the Z axis and the driving force and the supporting force for the first system 202 and second system 204 act along the Z axis.
- the first system 202 includes a first cylinder 218 , a first piston 220 , a first seal 222 , and the vacuum source 210 and (ii) the second system 204 includes a second cylinder 226 , a second piston 228 , a second seal 230 , and the fluid source 212 .
- the first piston 220 moves within the first cylinder 218 along a first axis 234 and the second piston 228 moves within the second cylinder 226 along a second axis 236 .
- the first system 202 is a vacuum type actuator and the second system 204 is a fluid type actuator.
- the first system 202 functions differently from the second system 204 .
- the second system 204 is stacked on top and positioned directly above the first system 202 , and the first axis 234 is substantially coaxial with the second axis 236 .
- the system connector 216 mechanically couples and connects the first piston 220 to the second piston 228 so that the pistons 220 , 228 move concurrently.
- the pistons 220 , 226 cooperate to dampen vibration and support the load. Stated another way, each of the pistons 220 , 228 is connected to the load.
- each of the cylinders 218 , 226 can be varied to suit the design requirements of the vibration isolator 200 .
- each of the cylinders 218 , 226 includes a tubular shaped wall.
- the first cylinder 218 includes a disk shaped top.
- the wall of each of the cylinders 218 , 226 is generally annular shaped. Alternately, for example, the wall could be square tube shaped. It should be noted that in this embodiment, the diameter of the first cylinder 218 is larger than the diameter of the second cylinder 226 .
- the first piston 220 is sized and shaped to fit within the first cylinder 218 and move within the first cylinder 218 .
- the second piston 228 is sized and shaped to fit within the second cylinder 226 and move within the second cylinder 226 .
- each of the pistons 220 , 228 is generally disk shaped and has a generally circular shaped cross section.
- the diameter of the first piston 220 is larger than the diameter of the second piston 228 . This allows the first system 202 to carry the majority of the load and the second system 204 to adjust for shifts in the center of gravity of the first assembly 206 , adjust to a changing load, and/or adjust for a change in atmospheric pressure.
- the ratio of the diameters is a function of the ratio of the areas.
- the ratio of areas is a function of the load ratio.
- the load ratio is a function of area and pressure.
- the vibration isolator 200 can be designed so that the first system 202 supports approximately 100% of the load at the highest expected barometric pressure and the second system 204 supports approximately 5% (barometric pressure change) plus approximately 2% (center of gravity shift) of the load.
- a fluid pressure in the second system 204 of approximately 60 psi, then the area ratio would need to be 100:7 and the diameter ratio would be 10:2.65.
- the fluid pressure in the second system 204 is 5 psi, then the area ratio would be 100:21 and the diameter ratio would be 10:4.58.
- Suitable ratios may be approximately 10:1 on area and approximately 10:3 on diameter.
- the first seal 222 seals the first piston 220 to the first cylinder 218 and allows for motion of the first piston 220 relative to the first cylinder 218 .
- the second seal 230 seals the second piston 228 to the second cylinder 226 and allows for motion of the second piston 228 relative to the second cylinder 226 .
- the design of each of the seals 222 , 230 can be varied. In FIG. 2B , each of the seals 222 , 230 , is a convoluted diaphragm made of a resilient material such as rubber.
- the bottom of the first piston 220 is secured to the top of the first seal 222 . Further, the top of the second piston 228 is secured to the bottom of the second seal 230 with a seal cap 232 .
- first seal 222 rolls up and down to allow the first piston 220 to move relative to the first cylinder 218 without deforming the rest of the first seal 222 .
- second seal 230 rolls up and down to allow the second piston 228 to move relative to the second cylinder 226 without deforming the rest of the second seal 230 .
- other types of seals can be utilized that allow for greater lateral flexibility.
- ferro fluidic seals and/or air/vacuum bearing seals can be utilized.
- a first clamp 238 secures and seals the first seal 222 to the first cylinder 218 .
- a second clamp 240 secures and seals the second seal 230 to the second cylinder 226 .
- the first clamp 238 includes an annular shaped ring and a disk shaped bottom and the (ii) the second clamp 240 is an annular shaped ring.
- the first clamp 238 is secured to the bottom of the first cylinder 218 with an outer perimeter of the first seal 222 positioned between the first clamp 238 and the first cylinder 218 .
- the first clamp 238 includes an aperture so that the pressure below the first piston 220 is equal to the atmospheric pressure.
- the second clamp 240 is secured to the top of the second cylinder 226 with an outer perimeter of the second seal 230 positioned between the second clamp 240 and the second cylinder 226 .
- the first piston 220 cooperates with the first cylinder 218 and the first seal 222 to define a first chamber 242 above the first piston 220 .
- the second piston 228 cooperates with the second cylinder 226 and the second seal 230 to define a second chamber 244 below the second piston 228 .
- the size and shape of each of the chambers 242 , 244 varies according to the design of the rest of the components of the vibration isolator 200 .
- the design of the vacuum source 210 and the fluid source 212 can be varied.
- the vacuum source 210 is in fluid communication with the first chamber 242 and the fluid source 212 is in fluid communication with the second chamber 244 .
- the vacuum source 210 can be a vacuum pump and the fluid source 212 can be a fluid pump or a compressor.
- the fluid supplied by the fluid source 212 is a compressible gas.
- the control system 28 (illustrated in FIG. 1 ) actively controls the vacuum source 210 to control the pressure in the first chamber 242 and the fluid source 212 to control the pressure in the second chamber 244 . More specifically, in this embodiment, the control system 28 controls the vacuum source 210 to remove fluid from the first chamber 242 so that a first chamber pressure above the first piston 220 is less than the atmospheric pressure below the first piston 220 .
- the amount of differential between the first chamber pressure and the atmospheric pressure can be varied. Typically, atmospheric pressure is approximately 14.7 psi. With this design, the pressure differential is less than approximately 14.7 psi and typically between approximately 14.65 psi and 14.68 psi.
- control system 28 actively controls the fluid source 212 to add fluid from the second chamber 244 so that a second chamber pressure in the second chamber 244 , below the second piston 228 is greater than the atmospheric pressure above the second piston 228 .
- the amount of differential between the second chamber pressure and the atmospheric pressure can be varied.
- the pressure differential is typically between approximately 0 psi and 60 psi.
- the control system 28 actively controls and adjusts the pressure in each of the chambers 242 , 244 .
- the control system 28 can easily adjust the force characteristics and the height of the vibration isolator 200 .
- the first system 202 can be designed to carry the majority of the load.
- the first system 202 can carry at least approximately 70% or at least approximately 80%, or at least approximately 95%, or at least approximately 100% of the load.
- the second system 204 can carry only approximately 30%, or approximately only 20%, or approximately only 5%, or approximately 0% of the load.
- the second system 204 is used to adjust for shifts in a center of gravity of the first assembly 206 or a change in atmospheric pressure.
- the first system 202 is much larger and carries significantly more of the load than the second system 204 .
- the first system 202 can be at least approximately 2.5 times less stiff, or at least approximately 50 times less stiff, or at least approximately 100 times less stiff, or at least approximately 200 times less stiff than the second system 204 .
- the resulting vibration isolator 200 has characteristics that are similar to the first system 202 .
- the system connector 216 mechanically and rigidly connects the first piston 220 to the second piston 228 .
- the first piston 220 and the second piston 228 move concurrently and are connected together to the load.
- the design of the system connector 216 can be varied to suit the design requirements of the vibration isolator 200 .
- the system connector 216 extends from the top of the first piston 220 to the bottom of the second piston 228 through the chambers 242 , 244 along the axes 234 , 236 .
- some of the components of the system connector 216 are formed as part of the pistons 220 , 228 . More specifically, referring to FIG.
- the system connector 216 includes (i) a rigid, connector shaft 246 that extends and cantilevers downward from the second piston 228 along the axes 234 , 236 to the first piston 220 , (ii) a shaft attacher 248 , e.g. a plurality of bolts, that secure the bottom of the connector shaft 246 to the first piston 220 , and (iii) a connector seal 250 that allows the shaft attacher 248 to extend through the chambers 242 , 244 while sealing the first chamber 242 from the second chamber 244 .
- a rigid, connector shaft 246 that extends and cantilevers downward from the second piston 228 along the axes 234 , 236 to the first piston 220
- a shaft attacher 248 e.g. a plurality of bolts
- the connector seal 250 can be a convoluted diaphram and can include an annular convolution that allows the pistons 220 , 228 and the connector shaft 246 to move without deforming the rest of the first connector seal 250 .
- a connector clamp 252 seals an outer perimeter of the connector seal 250 to the top of the first cylinder 218 and an inner perimeter of the connector seal 250 is sealed to the connector shaft 246 .
- FIGS. 2C and 2D each illustrate exploded perspective views of the vibration isolator 200 , including (i) the first system 202 having the first cylinder 218 , the first piston 220 , the first seal 222 , the first clamp 238 , and the first axis 234 , (ii) the second system 204 having the second cylinder 226 , the second piston 228 , the second seal 230 , the second clamp 240 , the seal cap 232 , and the second axis 236 , and (iii) the system connector 216 including the connector shaft 246 , the shaft attacher 248 , the connector seal 250 , and the connector clamp 252 .
- FIG. 3A illustrates a side view of another embodiment of a vibration isolator 300 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 300 includes a first system 302 and a second system 304 (illustrated in phantom).
- the first system 302 supports at least a portion of a first assembly 306 relative to a second assembly 308 and the second system 304 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 306 and/or a change in the atmospheric pressure near the isolator 300 .
- the first system 302 is a vacuum type actuator that includes a vacuum source 310 and the second system 304 includes a mover assembly 312 .
- the first system 302 functions differently from the second system 304 .
- the design of the components of the vibration isolator 300 can be varied to suit the intended use of the vibration isolator 300 .
- FIG. 3B illustrates a cross-sectional, perspective view of the vibration isolator 300 of FIG. 3A .
- the second system 304 is positioned below the first system 302 . Further, the second system 304 is directly coupled to the first system 302 so that the systems 302 , 304 act in parallel and move concurrently.
- the first system 302 and second system 304 are aligned along the Z axis and the driving force and the supporting force for the first system 302 and second system 304 act along the Z axis.
- the first system 302 includes a first cylinder 318 , a first piston 320 , a first seal 322 , a first clamp 338 and the vacuum source 310 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the second system 304 includes the mover assembly 312 that is coupled to the first piston 320 and moves the first piston 320 relative to the second assembly 308 along the Z axis.
- the design of the mover assembly 312 can be varied.
- the mover assembly 312 can include one or more rotary motors, voice coil motors, linear motors, electromagnetic actuators, or some other force actuators.
- the mover assembly 312 is a non-commutated, linear motor, commonly referred to as a voice coil motor.
- the mover includes (i) a first component 324 that is secured to the first piston 320 and (ii) an adjacent second component 326 that interacts with the first component 324 , the second component 326 is secured and coupled to the first cylinder 318 via the bottom of the first clamp 338 .
- one of the components 324 , 326 includes one or more magnets and the other component 324 , 326 includes one or more conductors.
- the first component 324 includes a conductor array
- the second component 326 includes a pair of spaced apart magnet arrays.
- the first component could include one or more magnet arrays while the second component could include one or more conductor arrays.
- Electrical current (not shown) is supplied to the conductor array by the control system 28 (illustrated in FIG. 1 ).
- the electrical current interacts with a magnetic field (not shown) generated by one or more of the magnets. This causes a force (Lorentz force) between the conductor and the magnets.
- the required stroke of the mover can vary. It is anticipated that the required stroke of the mover is between approximately 5 mm and 15 mm. However, larger or smaller strokes can be utilized.
- control system 28 actively controls the vacuum source 310 to remove fluid from a first chamber 342 so that the first chamber pressure is below the atmospheric pressure.
- the control system 28 can easily adjust the damping characteristics, the force characteristics, and the height of the vibration isolator 300 .
- the first system 302 is again designed to carry the majority of the load of the first assembly 306 .
- a fluid actuator similar to the second system 204 illustrated in FIGS. 2A-2D can be coupled to the isolator 300 illustrated in FIGS. 3A and 3B .
- FIG. 4A illustrates a side view of another embodiment of a vibration isolator 400 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 400 includes a first system 402 and a second system 404 (illustrated in phantom).
- the first system 402 supports a first assembly 406 relative to a second assembly 408 and the second system 404 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 406 and/or a change in the atmospheric pressure near the isolator 400 .
- the first system 402 is a vacuum actuator that includes a vacuum source 410 and the second system 404 includes a mass adjuster 412 .
- the first system 402 functions differently from the second system 404 .
- the design of the components of the vibration isolator 400 can be varied to suit the intended use of the vibration isolator 400 .
- FIG. 4B illustrates a cross-sectional, perspective view of the vibration isolator 400 of FIG. 4A .
- the second system 404 is positioned below the first system 402 . Further, the second system 404 is directly coupled to the first system 402 so that the systems 402 , 404 move concurrently.
- the first system 402 includes a first cylinder 418 , a first piston 420 , a first seal 422 , a first clamp 438 , and the vacuum source 410 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the mass adjuster 412 is designed to change, e.g. add or remove, the mass that is carried by the first system 402 .
- the design of the mass adjuster 412 can be varied.
- the mass adjuster 412 includes a reservoir 450 that is coupled and secured to the first piston 420 and a fluid source 452 .
- the reservoir 450 receives a fluid 454 .
- the fluid source 452 is in fluid communication with the reservoir 450 with a source tube 456 .
- the fluid source 452 adds or removes fluid 454 from the reservoir 450 to adjust the mass of that is coupled to the first piston 420 .
- the fluid source 452 for example, can include one or more pumps.
- the mass adjuster 412 can compensate for changes in the atmospheric pressure and/or a shift is the center of gravity of the first assembly 406 .
- Suitable fluids 454 include high-density fluids such as water or mercury.
- the control system 28 (illustrated in FIG. 1 ) actively controls the fluid source 452 to add fluid 454 to the reservoir 450 or remove fluid 454 from the reservoir 450 to adjust the mass that is coupled to the first piston 420 . Further, the control system 28 actively controls the vacuum source 410 to remove fluid from a first chamber 442 so that the first chamber pressure below the atmospheric pressure. With this design, the control system 28 can easily adjust the damping characteristics and the height of the vibration isolator 400 . It should be noted in this embodiment, the first system 402 is designed to carry the entire load of the first assembly 406 .
- a fluid actuator similar to the second system 204 illustrated in FIGS. 2A-2D and/or a mover assembly 312 as illustrated in FIGS. 3A and 3B can be coupled to the isolator 400 illustrated in FIGS. 4A and 4B .
- FIG. 5A illustrates a side cut-away view of another embodiment of a vibration isolator 500 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 500 includes a first system 502 and a second system 504 .
- the first system 502 supports at least a portion of a first assembly 506 relative to a second assembly 508 and the second system 504 adjusts for a change and/or shift in the load caused by, for example, a change in the location of a center of gravity of the first assembly 506 and/or a change in atmospheric pressure near the isolator 500 .
- the first system 502 is a vacuum type actuator that includes a vacuum source 510 and the second system 504 is a fluid type actuator that includes a fluid source 512 .
- the first system 502 functions differently from the second system 504 .
- the design of the components of the vibration isolator 500 can be varied to suit the intended use of the vibration isolator 500 .
- a vibration frame 514 secures an upper end of the first system 502 and the second system 504 to the second assembly 508 , and the first assembly 506 is secured to the lower end of the first system 502 and the second system 504 .
- the first system 502 includes a disk shaped attachment flange 516 A, a tubular sleeve 516 B, an annular shaped flange seal 516 C, a disk shaped first piston 516 D, and a first piston seal 516 E that cooperate to form a first chamber 516 F
- the second system 504 includes a disk shaped attachment flange 518 A, a tubular sleeve 518 B, an annular shaped flange seal 518 C, a disk shaped second piston 518 D, and a second piston seal 518 E that cooperate to form a second chamber 518 F.
- the vacuum source 510 maintains the first chamber 516 F below atmospheric pressure and the fluid source 512 maintains the pressure
- the first system 502 and the second system 504 act as a pendulum assembly that allows the vibration isolator 500 to have reduced lateral stiffness. More specifically, (i) for the first system 502 , the sleeve 516 B pivots relative to the flange seal 516 C, and (ii) for the second system 504 , the sleeve 518 B pivots relative to the flange seal 518 C. With this design, the vibration isolator 500 allows the first assembly 506 to move laterally relative to the second assembly 508 .
- the central axis of the seals 516 C, 518 C define an axis of motion 520 about which the sleeves 516 B, 518 B pivot. The axis of motion 520 is located approximately between the seals 516 C, 518 C.
- the seals 516 C, 518 C allow the sleeves 516 B, 518 B to pivot relative to the first assembly 506 .
- FIG. 5B is a simplified illustration of the vibration isolator 500 of FIG. 5A .
- FIG. 5B illustrates that the vibration isolator 500 allows the first assembly 506 to move laterally relative to the second assembly 508 . More specifically, the sleeves 516 B, 518 B pivot relative to the seals 516 C, 518 C.
- FIG. 5C illustrates a perspective view
- FIG. 5D illustrates a top view of how a pendulum type isolator can be implemented.
- the vibration isolator 500 C includes a first frame 501 C that is secured to the first assembly 506 C, a second frame 503 C that is secured to the second assembly 508 C, a vacuum source 510 C and a fluid source 512 C.
- the first frame 501 C is rigid and generally rectangular frame shaped and the second frame 503 C is rigid and generally rectangular frame shaped.
- FIG. 5E illustrates a cut-away view of the vibration isolator 500 C of FIGS. 5C and 5D .
- the vibration isolator 500 C includes four, vacuum type first systems 502 C, and two, fluid type second systems 504 C. More specifically, the vibration isolator 500 C includes the first frame 501 C, the second frame 503 C, a sleeve 514 C, an upper piston assembly 520 C, a lower piston assembly 522 C, an upper seal assembly 524 C, and a lower seal assembly 526 C.
- the sleeve 514 C pivots relative to the upper piston assembly 520 C and allows the first assembly 506 C to move laterally relative to the second assembly 508 C.
- a vibration isolator 500 C having a relatively small footprint will have a relatively large capacity. It should be noted that in this design, at least a portion of one of the systems 502 C, 504 C pivot relative to another systems 502 C, 504 C.
- first frame 501 C is rigid, extends between the first assembly 506 C and the lower piston assembly 522 C and couples the lower piston assembly 522 C to the first assembly 506 C.
- second frame 503 C is rigid, extends between the second assembly 508 C and the upper piston assembly 520 C, and couples the upper piston assembly 520 C to the second assembly 508 C.
- the sleeve 514 C is rigid, and includes a generally tubular shaped section 528 C and a plurality of annular shaped, spaced apart walls, such as (i) an annular disk shaped, first upper wall 530 C that is positioned near a top of the sleeve 514 C, (ii) an annular disk shaped, second upper wall 532 C that is positioned below the first upper wall 530 C, (iii) an annular disk shaped, third upper wall 534 C that is positioned below the second upper wall 532 C, (iv) an annular disk shaped, first lower wall 536 C that is positioned near a bottom of the sleeve 514 C, (v) an annular disk shaped, second lower wall 538 C that is positioned above the first lower wall 536 C, (vi) an annular disk shaped, third lower wall 540 C that is positioned above the second lower wall 538 C.
- the upper piston 520 C assembly is rigid and includes (i) a disk shaped, first upper piston 542 C that is positioned near the top of the upper piston assembly 520 C, (ii) a disk shaped, second upper piston 544 C that is positioned below the first upper piston 542 C, (iii) a cylindrical shaped, upper piston connector 546 C that connects the upper pistons 542 C, 544 C together, and (iv) a cylindrical shaped upper container 548 C that is secured to the bottom of the upper piston connector 546 C.
- the first upper piston 542 C is fixedly secured to a top beam of the second frame 503 C.
- the lower piston assembly 522 C is rigid and includes (i) a disk shaped, first lower piston 552 C that is positioned near the bottom of the lower piston assembly 522 C, (ii) a disk shaped, second lower piston 554 C that is positioned above the first lower piston 552 C, (iii) a cylindrical shaped, lower piston connector 556 C that connects the lower pistons together 552 C, 554 C, and (iv) a cylindrical shaped lower container 558 C that is secured to the top of the lower piston connector 556 C.
- the first lower piston 552 is fixedly secured to the bottom beam of the first frame 501 C.
- the upper seal assembly 524 C secures and seals the upper piston assembly 520 C to the sleeve 514 C and allows the sleeve 514 C and the lower piston assembly 522 C to pivot relative to the upper piston assembly 520 C and the second assembly 508 C.
- the upper seal assembly 524 C secures and seals the upper piston assembly 520 C to the sleeve 514 C and allows the sleeve 514 C and the lower piston assembly 522 C to pivot relative to the upper piston assembly 520 C and the second assembly 508 C.
- the upper seal assembly 524 C includes (i) a first upper seal 560 C that secures and seals the first upper piston 542 C to the sleeve 514 C, (ii) a first upper intermediate seal 562 C that secures and seals the first upper wall 530 C to the upper piston connector 546 C intermediate the upper pistons 542 C, 544 C, (iii) a second upper seal 564 C that secures and seals the second upper piston 544 C to the sleeve 514 C, (iv) a second upper intermediate seal 566 C that secures and seals the second upper wall 532 C to the upper piston connector 546 C below the second upper piston 544 C, and (v) a third upper seal 568 C that secures and seals the upper container 548 C to the upper third wall 534 C.
- the lower seal assembly 526 C secures and seals the lower piston assembly 522 C to the sleeve 514 C.
- the lower seal assembly 526 C includes (i) a first lower seal 570 C that secures and seals the first lower piston 552 C to the sleeve 514 C, (ii) a first lower intermediate seal 572 C that secures and seals the first lower wall 536 C to the lower piston connector 556 C intermediate the lower pistons 552 C, 554 C, (iii) a second lower seal 574 C that secures and seals the second lower piston 554 C to the sleeve 514 C, (iv) a second lower intermediate seal 576 C that secures and seals the second lower wall 538 C to the lower piston connector 556 C above the second lower piston 554 C, and (v) a third lower seal 578 C that secures and seals the lower container 558 C to the lower third wall 540 C.
- each seal is a convoluted diaphram seal that includes an annular convolution that allows the sleeve 514 C and the rest of the pendulum assembly to move with relatively moderate lateral resistance. Stated another way, this type of seal allows for lateral movement with minimal resistance. Alternately, other types of seals can be utilized that allow for greater lateral flexibility. For example, ferro fluidic seals and/or air/vacuum bearing seals can be utilized.
- the vibration isolator 500 C includes eleven separate chambers. More specifically, moving top to bottom, the vibration isolator 500 C includes (i) a first chamber 581 C located between the first upper piston 542 C and the first upper wall 530 C, (ii) a second chamber 582 C located between the first upper wall 530 C and the second upper piston 544 C, (iii) a third chamber 583 C located between the second upper piston 544 C and the second upper wall 532 C, (iv) a fourth chamber 584 C located between the second upper wall 532 C and the third upper wall 534 C, (v) a fifth chamber 585 C formed by the upper container 548 C, (vi) a sixth chamber 586 C located between the third upper wall 534 C and the third lower wall 540 C, (vii) a seventh chamber 587 C formed by the lower container 558 C, (viii) an eighth chamber 588 C located between the third lower wall 540 C and the second lower wall 538 C, (ix) a ninth chamber 589
- the eleven chambers are maintained below atmospheric pressure with the vacuum source 510 C, some of the chambers are at atmospheric pressure and/or some of chambers are above atmospheric pressure using the fluid source 512 C.
- the first chamber 581 C, the third chamber 583 C, the sixth chamber 586 C, the ninth chamber 589 C, and the eleventh chamber 591 C are in fluid communication with the vacuum source 510 C and are subjected to a vacuum.
- the second chamber 582 C and the tenth chamber 590 C are at atmospheric pressure.
- the fourth chamber 584 C, the fifth chamber 585 C, the seventh chamber 587 C and the eighth chamber 588 C are in fluid communication with the fluid source 512 C and are at pressure above atmospheric pressure.
- One or more of the first chamber 581 C, the third chamber 583 C, the sixth chamber 586 C, the ninth chamber 589 C, and the eleventh chamber 591 C can be in fluid communication with the same vacuum source 510 C. Alternately, one or more of these chambers can have a separate vacuum source. This design would allow for the individual control of the pressure in one or more of the first chamber 581 C, the third chamber 583 C, the sixth chamber 586 C, the ninth chamber 589 C, and the eleventh chamber 591 C.
- one or more of the fourth chamber 584 C, the fifth chamber 585 C, the seventh chamber 587 C and the eighth chamber 588 C can be in fluid communication with the same fluid source 512 C.
- FIG. 5E illustrates that the fourth chamber 584 C, the fifth chamber 585 C, the seventh chamber 587 C and the eighth chamber 588 C are all in fluid communication with each other.
- the fourth chamber 584 C and fifth chamber 585 C can have a separate fluid source and/or be at a different pressure than the seventh chamber 587 C and the eighth chamber 588 C. This design would allow for the individual control of the pressure in the fourth chamber 584 C and the eighth chamber.
- the control system 28 (illustrated in FIG. 1 ) actively controls (i) the vacuum source 510 C to control the pressure in the first chamber 581 C, the third chamber 583 C, the sixth chamber 586 C, the ninth chamber 589 C, and the eleventh chamber 591 C, and (ii) the fluid source 512 C to control the pressure in the fourth chamber 584 C, the fifth chamber 585 C, the seventh chamber 587 C and the eighth chamber 588 C.
- the control system 28 can easily adjust the force characteristics and the height of the vibration isolator 500 .
- the first systems 502 C can be designed to carry the majority of the load.
- the first systems 502 can carry at least approximately 70% or at least approximately 80%, or at least approximately 95%, or at least approximately 100% of the load.
- the second systems 504 C can carry only approximately 30%, or approximately only 20%, or approximately only 5%, or approximately 0% of the load.
- the second systems 504 C ARE used to adjust for changes in load caused by shifts in a center of gravity of the first assembly 506 C or a change in atmospheric pressure.
- the first systems 502 C and the second systems 504 C act as a pendulum assembly that allows the vibration isolator 500 C to have reduced lateral stiffness.
- the vibration isolator 502 C allows the first assembly 506 C to move laterally relative to the second assembly 508 C.
- the approximate center of the upper seal assembly 524 C defines an area of motion 595 C about which the pendulum assembly pivots.
- FIG. 5F is a perspective cut-away view of how an actual version of the vibration isolator of FIGS. 5C-5E may look.
- the vibration isolator 500 F of FIG. 5F illustrates includes four, vacuum type first systems 502 F, and two, fluid type second systems 504 F.
- the vibration isolator includes a fluid source 512 F, a vacuum source 510 F, a first frame 501 F (only partly shown), a second frame 503 F (only partly shown), a sleeve 514 F, an upper piston assembly 520 F, a lower piston assembly 522 F, an upper seal assembly 524 F, and a lower seal assembly 526 F that are similar to the corresponding components described above and illustrated in FIG. 5E .
- the sleeve 514 F pivots relative to the upper piston assembly 520 F and allows for lateral movement.
- the four, vacuum type first systems 502 F, and the two, fluid type second systems 504 F are stacked together.
- the components cooperate to so that the vibration isolator 500 F includes eleven separate chambers, namely (i) a first chamber 581 F, (ii) a second chamber 582 F, (iii) a third chamber 583 F, (iv) a fourth chamber 584 F, (v) a fifth chamber 585 F, (vi) a sixth chamber 586 F, (vii) a seventh chamber 587 F, (viii) an eighth chamber 588 F, (ix) a ninth chamber 589 F, (x) a tenth chamber 590 F, and (xi) an eleventh chamber 591 F.
- eleven separate chambers namely (i) a first chamber 581 F, (ii) a second chamber 582 F, (iii) a third chamber 583 F, (iv) a fourth chamber 584 F, (v) a fifth chamber 585 F, (vi) a sixth chamber 586 F, (vii) a seventh chamber 587 F, (viii) an eighth chamber 588 F, (ix)
- the first chamber 581 F, the third chamber 583 F, the sixth chamber 586 F, the ninth chamber 589 F, and the eleventh chamber 591 F are in fluid communication with the vacuum source 510 F and are subjected to a vacuum
- the second chamber 582 F and the tenth chamber 590 F are at atmospheric pressure
- the fourth chamber 584 F, the fifth chamber 585 F, the seventh chamber 587 F and the eighth chamber 588 F are in fluid communication with the fluid source 512 F and are at pressure above atmospheric pressure.
- the control system 28 (illustrated in FIG. 1 ) actively controls (i) the vacuum source 510 F to control the pressure in the first chamber 581 F, the third chamber 583 F, the sixth chamber 586 F, the ninth chamber 589 F, and the eleventh chamber 591 F, and (ii) the fluid source 512 F to control the pressure in the fourth chamber 584 F, the fifth chamber 585 F, the seventh chamber 587 F and the eighth chamber 588 F.
- the control system 28 can easily adjust the force characteristics and the height of the vibration isolator 500 F.
- the vibration isolator 500 F also includes a pendulum support assembly 592 F that assists in supporting the weight of the sleeve 514 F while allowing the lower piston assembly 522 F to move relative to the sleeve 514 F.
- the support assembly 592 F flexibly connects and couples the sleeve 514 F to the lower piston assembly 522 F so that the lower piston assembly 522 F can support at least a portion of the weight of the sleeve 514 F.
- the pendulum support assembly 592 F includes a lower support bridge 594 F, an upper connector bridge 596 F, a lower connector bridge 597 F and a flexible support 598 F.
- the lower support bridge 594 F is a rigid beam that extends across the bottom of the sleeve 514 F.
- the upper connector bridge 596 F is rigid and is fixedly secured to the lower support bridge 594 F.
- the upper connector bridge 596 F extends into the center of the lower piston assembly 522 F.
- the lower connector bridge 597 F is rigid and is fixedly secured to the lower piston assembly 522 F.
- the lower connector bridge 597 F also extends into the center of the lower piston assembly 522 F.
- the flexible support 598 F is flexible and is secured between the upper connector bridge 596 F and the lower connector bridge 597 F to flexibly connect the sleeve 514 F to the lower piston assembly 522 F.
- the flexible support 598 F can be made of a resilient material such as rubber.
- the sleeve 514 F acts as a pendulum assembly that allows the vibration isolator 500 F to have improved lateral stiffness. More specifically, the sleeve 514 F, the lower seal assembly 526 F and the lower piston assembly 522 F pivot relative to the upper seal assembly 524 F, and the upper piston assembly 520 F. With this design, the vibration isolator 500 F allows for lateral movement.
- the lower piston assembly 522 F is fixedly secured and coupled to the first frame 501 F with an annular shaped, first frame connector 551 F
- the upper piston assembly 520 F is fixedly secured and coupled to the second frame 503 F with an annular shaped, second frame connector 553 F
- the first frame 551 F includes a pair of apertures 555 F that allow the lower bridge support 594 F to be connected to the lower piston assembly 522 F.
- FIG. 6A illustrates a side view of another embodiment of a vibration isolator 600 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 600 includes a first system 602 , a second system 604 and a third system 605 .
- the first system 602 and the third system 605 cooperate to support at least a portion of a first assembly 606 relative to a second assembly 608 and the second system 604 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 606 and/or a change in atmospheric pressure.
- the first system 602 and the third system 605 are vacuum type actuators that each include a vacuum source 610 and the second system 604 that is a fluid type actuator that includes a fluid source 612 .
- the design of the components of the vibration isolator 600 can be varied to suit the intended use of the vibration isolator 600 .
- FIG. 6B illustrates a cross-sectional, perspective view of the vibration isolator 600 of FIG. 6A .
- the vibration isolator 600 includes a system connector 616 that directly couples the systems 602 , 605 to the second system 604 so that the systems 602 , 604 , 605 act in parallel and move concurrently.
- the first system 602 includes a first cylinder 618 , a first piston 620 , a first seal 622 , a first clamp 638 , and the vacuum source 610 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the third system 605 includes a third cylinder 658 , a third piston 660 , a third seal 662 , a third clamp 664 , and the vacuum source 610 that are similar to the corresponding component illustrated in FIGS. 2A-2D .
- the stacked vacuum actuators allow for a smaller footprint of the isolator 600 for the same lifting, supporting capacity.
- the second system 604 includes a second cylinder 626 , a second piston 628 , a second seal 630 , and the fluid source 612 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the second system 604 can also or alternately include (i) a mover assembly (not shown) similar to that illustrated in FIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated in FIG. 4B and described above, (iii) a repulsion type assembly (not shown) similar to that illustrated in FIGS.
- FIG. 7A and 7B that utilizes a first permanent magnet section and a spaced apart second permanent magnet section, and/or (iv) an attraction type system (not shown) similar to that illustrated in FIG. 7C that utilizes a magnet section and a spaced apart magnetically permeable section.
- the first piston 620 moves within the first cylinder 618 along a first axis 634
- the second piston 628 moves within the second cylinder 626 along a second axis 636
- the third piston 660 moves with the third cylinder 658 along a third axis 637 .
- the second system 604 is stacked on top and positioned directly above the systems 602 , 605 and the first axes 634 , 636 , 637 are substantially coaxial.
- the system connector 616 mechanically couples and connects the pistons 620 , 628 , 660 together so that the pistons 620 , 628 , 660 move concurrently.
- the pistons 620 , 626 , 660 cooperate to dampen vibration and support the load. Stated another way, each of the pistons 620 , 628 , 660 is connected to the load.
- the diameter of the first cylinder 618 and the third cylinder 658 is larger than the diameter of the second cylinder 626 . This allows the systems 602 , 605 to carry the majority of the load and the second system 604 to adjust for shifts in the center of gravity of the first assembly 606 and/or adjust for a change in atmospheric pressure. Further, the diameter of the first cylinder 618 and the third cylinder 658 are approximately the same. Alternately, for example, the diameter of the first cylinder 618 and the third cylinder 658 can be different.
- a first clamp 638 of the first system 602 includes an aperture or multiple apertures so that the pressure below each the first piston 620 is equal to the atmospheric pressure.
- a third clamp 664 of the third system 605 includes an aperture or multiple apertures so that the pressure below the third piston is equal to the atmospheric pressure.
- the first piston 620 cooperates with the first cylinder 618 and the first seal 622 to define a first chamber 642 above the first piston 620 .
- the second piston 628 cooperates with the second cylinder 626 and the second seal 630 to define a second chamber 644 below the second piston 628 .
- the third piston 660 cooperates with the third cylinder 658 and the third seal to define a third chamber 645 above the third piston 660 .
- the vacuum sources 610 are in fluid communication with the first chamber 642 and the third chamber 645 and the fluid source 612 is in fluid communication with the second chamber 644 .
- the control system 28 (illustrated in FIG. 1 ) actively controls the vacuum sources 610 to control the pressures in the chambers 642 , 645 and the fluid source 612 to control the pressure in the second chamber 644 . More specifically, in this embodiment, the control system 28 controls the vacuum source 610 of each system 602 , 605 to remove fluid from the chambers 642 , 645 so that a first chamber pressure above the first piston 620 and a third chamber pressure above the third piston 660 is less than the atmospheric pressure. The amount of differential between the pressures and the atmospheric pressure can be varied.
- FIG. 6B illustrates that the first system 602 and the third system 605 each includes a separate vacuum source 610 .
- the first chamber pressure in each chamber 642 , 645 can be the same or different.
- the control system can independently control the pressure each of the chambers 642 , 645 .
- a single vacuum source can be used for each system 602 , 605 and the chamber 642 , 645 can be in fluid communication.
- the pressure in the first chamber 642 is substantially equal to the pressure in the third chamber 645 .
- control system 28 actively controls the fluid source 612 to add fluid to the second chamber 644 so that the second chamber pressure in the second chamber 644 , below the second piston 628 is greater than the atmospheric pressure above the second piston 628 .
- the amount of differential between the second chamber pressure and the atmospheric pressure can be varied.
- the pressure differential is typically between approximately 0 psi and 60 psi.
- control system 28 actively controls and adjusts the pressure in each of the chambers 642 , 644 , 645 .
- the control system 28 can easily adjust the force characteristics and the height of the vibration isolator 600 .
- the systems 602 , 605 are designed to carry the majority of the load.
- the second system 604 is used to adjust for shifts in a center of gravity of the first assembly 606 or a change in atmospheric pressure.
- the system connector 616 mechanically and rigidly connects the pistons 620 , 628 , 660 together so that the pistons 620 , 628 , 660 move concurrently and are connected together to the load.
- the design of the system connector 616 can be varied to suit the design requirements of the vibration isolator 600 .
- some of the components of the system connector 616 are formed as part of the pistons 620 , 628 , 660 . More specifically, referring to FIG.
- the system connector 616 includes (i) a rigid, upper connector shaft 646 U that extends and cantilevers downward from the second piston 628 along the axes 634 , 636 to the first piston 620 , (ii) an upper shaft attacher 648 U, e.g.
- a plurality of bolts that secure the bottom of the lower connector shaft 646 L to the third piston 660
- a lower connector seal 650 L that allows the lower shaft attacher 648 L to extend through the chamber 645 while sealing the chambers 645 .
- An upper connector clamp 652 U seals an outer perimeter of the upper connector seal 650 U to the top of the first cylinder 618 and an inner perimeter of the upper connector seal 650 U is sealed to the upper connector shaft 646 U
- a lower connector clamp 652 L seals an outer perimeter of the lower connector seal 650 L to the top of the third cylinder 658 and an inner perimeter of the lower connector seal 650 L is sealed to the lower connector shaft 646 L.
- FIG. 7A illustrates a side view of another embodiment of a vibration isolator 700 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 700 includes a first system 702 (illustrated in phantom) and a second system 704 .
- the first system 702 supports at least a portion of a first assembly 706 relative to a second assembly 708 and the second system 704 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 706 .
- first system 702 is a repulsion type assembly and the second system 704 is a fluid type actuator that includes a fluid source 712 .
- the first system 702 function differently from the second system 704 .
- the design of the components of the vibration isolator 700 can be varied to suit the intended use of the vibration isolator 700 .
- FIG. 7B illustrates a cross-sectional, perspective view of the vibration isolator 700 of FIG. 7A .
- the vibration isolator 700 includes a system connector 716 that directly couples the first system 702 to the second system 704 so that the systems 702 , 704 act in parallel.
- the second system 704 includes a second cylinder 726 , a second piston 728 , a second seal 730 , and the fluid source 712 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the second system 704 can include (i) a mover assembly (not shown) similar to that illustrated in FIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated in FIG. 4B and described above, and/or (iii) an attraction type system (not shown) similar to that illustrated in FIG. 7C that utilizes a magnet section and a spaced apart magnetically permeable section.
- the first system 702 includes a first permanent magnet section 732 , and a spaced apart, second permanent magnet section 734 .
- the first magnet section 732 includes a single, generally right cylindrical shaped permanent magnet that is secured and coupled to the system connector 716 .
- the second magnet section 734 is generally tubular shaped and encircles a portion of the first magnet section 732 .
- the magnet sections 732 , 734 are oriented so that the poles are reversed. As a result thereof, the first magnet section 732 is repulsed by the second magnet section 734 .
- the magnet sections 732 , 734 are designed and tested to provide the desired amount of force.
- Each magnet section 732 , 734 includes one or more permanent magnets such as NdFeB.
- control system 28 actively controls the fluid source 712 to add or remove fluid from the cylinder 726 .
- the control system 28 can adjust the damping characteristics, adjust for changes in the center of gravity, and the height of the vibration isolator 700 .
- the first system 702 is again designed to carry the majority of the load of the first assembly 706 .
- a mover such as a voice coil motor can be added in series with the vibration isolator 700 to better control a high bandwith dynamic load.
- the system connector 716 mechanically and rigidly connects the second piston 728 to the first magnetic section 732 .
- the design of the system connector 716 can be varied to suit the design requirements of the vibration isolator 700 .
- the system connector 716 includes (i) a rigid, upper connector shaft 760 that extends and cantilevers downward from the second piston 728 (ii) a lower connector shaft 762 that extends up from the second magnetic section 732 , (iii) a shaft attacher 764 , e.g. a plurality of bolts, that secure the bottom of the shafts 760 , 762 together, (iv) a connector seal 766 , and (v) a connector clamp 768 .
- FIG. 7C illustrates a side cross-sectional view of yet another embodiment of a vibration isolator 770 that can be used in the isolation systems 66 , 68 , 70 , 72 of FIG. 1 .
- the vibration isolator 770 includes a first system 772 and a second system 774 that is coupled to the first system 772 .
- the first system 702 supports at least a portion of a first assembly 776 relative to a second assembly 778 and the second system 774 adjusts for a change and/or shift in the location of a center of gravity of the first assembly 776 .
- the first system 772 and the second system 774 are positioned on opposite sides of the first assembly 776 .
- first system 772 is an attraction type assembly and the second system 774 is a fluid type actuator that includes a fluid source 782 .
- the first system 772 functions differently from the second system 774 .
- the design of the components of the vibration isolator 770 can be varied to suit the intended use of the vibration isolator 770 .
- the second system 774 includes a cylinder 786 , a piston 788 , a seal 790 , and the fluid source 782 that are similar to the corresponding components described above and illustrated in FIGS. 2A-2D .
- the second system 774 can include (i) a mover assembly (not shown) similar to that illustrated in FIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated in FIG. 4B and described above, and/or (iii) a repulsion type assembly (not shown) similar to that illustrated in FIGS. 7A and 7B that utilizes a first permanent magnet section and a spaced apart second permanent magnet section.
- the first system 772 includes a magnet section 794 , and a spaced apart magnetically permeable section 796 .
- the magnet section 794 is generally right cylindrical shaped and is secured and coupled to the first assembly 776 .
- the magnet section 794 can include one or more permanent magnets such as NdFeB.
- the magnetically permeable section 796 is generally tubular shaped and encircles a portion of the magnet section 794 .
- the magnetically permeable section 796 is made from a material that is attracted to the magnet section 794 . Suitable materials include iron or steel. With this design, the permeable section 796 is attracted to the magnet section 794 .
- the magnet section 794 and the permeable section 796 are designed and tested to provide the desired amount of force.
- the control system 28 actively controls the fluid source 782 to add or remove fluid from the cylinder 786 .
- the control system 28 can adjust the damping characteristics, adjust for changes in the center of gravity, and the height of the vibration isolator 770 .
- the first system 772 is again designed to carry the majority of the load of the vibration isolator 770 .
- a mover such as a voice coil motor can be added in series with the vibration isolator 700 to better control a high bandwith dynamic load.
- the magnetically permeable section 796 could be replaced with a permanent magnet configured to provide a repulsive force with the magnetic section 794 .
- the magnetically permeable section 796 and the magnet section 794 could be reversed.
- the photolithography system (an exposure apparatus) and the vibration isolators illustrated in the Figures can be built by assembling various subsystems, including each element listed in the appended claims, in such a manner that prescribed mechanical accuracy, electrical accuracy, and optical accuracy are maintained.
- every optical system is adjusted to achieve its optical accuracy.
- every mechanical system and every electrical system are adjusted to achieve their respective mechanical and electrical accuracies.
- the process of assembling each subsystem into a photolithography system includes mechanical interfaces, electrical circuit wiring connections and air pressure plumbing connections between each subsystem. Needless to say, there is also a process where each subsystem is assembled prior to assembling a photolithography system from the various subsystems. Once a photolithography system is assembled using the various subsystems, a total adjustment is performed to make sure that accuracy is maintained in the complete photolithography system. Additionally, it is desirable to manufacture an exposure system in a clean room where the temperature and cleanliness are controlled.
- semiconductor devices can be fabricated using the above described systems, by the process shown generally in FIG. 8A .
- step 801 the device's function and performance characteristics are designed.
- step 802 a mask (reticle) having a pattern is designed according to the previous designing step, and in a parallel step 803 , a wafer is made from a silicon material.
- the mask pattern designed in step 802 is exposed onto the wafer from step 803 in step 804 by a hotolithography system described hereinabove in accordance with the present invention.
- the semiconductor device is assembled (including the dicing process, bonding process and packaging process), finally, the device is then inspected in step 806 .
- FIG. 8B illustrates a detailed flowchart example of the above-mentioned step 804 in the case of fabricating semiconductor devices.
- step 811 oxidation step
- step 812 CVD step
- step 813 electrode formation step
- step 814 ion implantation step
- ions are implanted in the wafer.
- steps 811 - 814 form the preprocessing steps for wafers during wafer processing, and selection is made at each step according to processing requirements.
- step 815 photoresist formation step
- step 816 exposure step
- step 817 developing step
- step 818 etching step
- steps other than residual photoresist exposed material surface
- step 819 photoresist removal step
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Abstract
Description
- The present invention is directed to a vibration isolator. More specifically, the present invention is directed to a vibration isolator for an exposure apparatus and a method for making a vibration isolator for isolating vibration.
- Exposure apparatuses are commonly used to transfer images from a reticle onto a semiconductor wafer during semiconductor processing. A typical exposure apparatus includes a frame assembly, a measurement system, a control system, an illumination source, a projection optical assembly, a reticle stage for retaining a reticle, and a wafer stage for retaining a semiconductor wafer.
- The frame assembly typically supports the measurement system, the illumination source, the reticle stage, the projection optical assembly, and the wafer stage above the ground. The measurement system monitors the positions of the stages relative to a reference such as the projection optical assembly. The projection optical assembly projects and/or focuses the light that passes through the reticle. One or more movers precisely position the reticle stage relative to the projection optical assembly. Similarly, one or more movers precisely position the wafer stage relative to the projection optical assembly.
- The size of the images and the features within the images transferred onto the wafer from the reticle are extremely small. Accordingly, the precise positioning of the wafer and the reticle relative to the optical assembly is critical to the manufacture of high density, semiconductor wafers.
- Unfortunately, mechanical vibrations and deformations in the frame assembly of the exposure apparatus can influence the accuracy of the exposure apparatus. For example, the movers utilized to move the stages generate reaction forces that vibrate and deform the frame assembly of the exposure apparatus. Further, the ground can transfer vibration to the frame assembly.
- The vibrations and deformations in the frame assembly can move the stages and the projection optical assembly out of precise relative alignment. Further, the vibrations and deformations in the frame assembly can cause the measurement system to improperly measure the positions of the stages relative to the projection optical assembly. Additionally, vibration of the projection optical assembly can cause deformations of the optical elements within the projection optical assembly and degrade the optical imaging quality. As a result thereof, the accuracy of the exposure apparatus and the quality of the integrated circuits formed on the wafer can be compromised.
- One attempt to solve this problem involves the use of one or more air mounts to secure the frame assembly to the ground. The air mounts utilize a cushion of pressurized air to reduce the effect of vibration of the ground causing vibration to the frame assembly. Similarly, one or more air mounts can be used to support the components of the exposure apparatus on the frame assembly. Unfortunately, existing air mounts with adequate damping capacity have a relatively high natural frequency and are relatively stiff.
- In light of the above, there is a need for an exposure apparatus with an improved isolation system. Additionally, there is a need for a vibration isolator with sufficient capacity that has a relatively low natural frequency and is not as stiff as air mounts with comparable capacity. Further, there is a need for an exposure apparatus capable of manufacturing precision devices, such as high density, semiconductor wafers.
- The present invention is directed to a vibration isolator for isolating a first assembly from vibration from a second assembly. The vibration isolator includes a first system and a second system coupled to the first system. In one embodiment, the first system supports the majority of the first assembly relative to the second assembly and the second system adjusts for a change in the location of the center of gravity of the first assembly, compensate for fluctuations in the atmospheric pressure near the vibration isolator, and/or a changing load.
- A number of embodiments of the vibration isolator are provided herein. In many of these embodiments, the first system functions differently from the second system. In a number of these embodiments, the first system includes a first cylinder and a first piston that moves within the first cylinder. The first piston cooperates with the first cylinder to define a first chamber that is maintained at a pressure that is less than the atmospheric pressure. The vacuum type first system is not very stiff and has a relatively low natural frequency. Alternately, for example, the first system can include a permanent magnet section, a magnetically permeable section that is attracted to the magnet section and a mover assembly that moves one of the sections relative to the other section to adjust the lift of the first system.
- In contrast, the second system can include a second cylinder and a second piston that moves within the second cylinder. The second piston cooperates with the second cylinder to define a second chamber that is maintained at a pressure that is greater than the atmospheric pressure. Alternately, the second system can include a mover such as a voice coil motor. Still alternately, the second system can include a mass controller that adds and/or removes mass to the first assembly.
- Additionally, the vibration isolator can include a third system that is coupled to the other system. The third system, for example, can include a third cylinder and a third piston that cooperate to define a third chamber that is maintained below atmospheric pressure. The third system increases the load capacity of the vibration isolator while reducing the footprint of the vibration isolator.
- The vibration isolator is particularly useful as part of an exposure apparatus. For example, one or more vibration isolators can be used as part of a frame isolation system that secures a frame assembly of the exposure apparatus to a mounting base. With this design, the frame isolation system reduces the effect of vibration of the mounting base causing vibration on the frame assembly and the components that are secured to the frame assembly.
- Further, one or more of the vibration isolators can be used to secure one or more other assemblies of the exposure apparatus to the frame assembly. For example, one or more vibration isolators could be used as part of an isolation system to secure a stage assembly or an optical assembly to the frame assembly. With this design, the isolation system reduces the effect of vibration of the frame assembly causing vibration on the stage assembly or the optical assembly.
- The present invention is also directed to a device made with the exposure apparatus, a wafer made with the exposure apparatus, a method for making a vibration isolator, a method for making an isolation system, a method for making an exposure apparatus, a method for making a device, and a method for making a wafer.
- The novel features of this invention, as well as the invention itself, both as to its structure and its operation, will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similar reference characters refer to similar parts, and in which:
-
FIG. 1 is a side illustration of an exposure apparatus having features of the present invention; -
FIG. 2A is a side view of a first embodiment of a vibration isolator having features of the present invention; -
FIG. 2B is a cut-away perspective view of the vibration isolator ofFIG. 2A ; -
FIG. 2C is a top, exploded perspective view of a portion of the vibration isolator ofFIG. 2A ; -
FIG. 2D is a bottom, exploded perspective view of a portion of the vibration isolator ofFIG. 2A ; -
FIG. 3A is a side view of another embodiment of a vibration isolator having features of the present invention; -
FIG. 3B is a cut-away perspective view of the vibration isolator ofFIG. 3A ; -
FIG. 4A is a side view of still another embodiment of a vibration isolator having features of the present invention; -
FIG. 4B is a cut-away perspective view of the vibration isolator ofFIG. 4A ; -
FIG. 5A is a cut-away view of yet another embodiment of a vibration isolator having features of the present invention; -
FIG. 5B is a cut-away of the embodiment of the vibration isolator ofFIG. 5A illustrating lateral movement; -
FIG. 5C is a perspective view of still another embodiment of a vibration isolator; -
FIG. 5D is a top view of the vibration isolator ofFIG. 5C ; -
FIG. 5E is a cut-away view taken online 5E-5E ofFIG. 5D ; -
FIG. 5F is a cross-section view of yet another embodiment of a vibration isolator; -
FIG. 6A is a side view of another embodiment of a vibration isolator having features of the present invention; -
FIG. 6B is a cut-away perspective view of the vibration isolator ofFIG. 6A ; -
FIG. 7A is a side view of another embodiment of a vibration isolator having features of the present invention; -
FIG. 7B is a cut-away perspective view of the vibration isolator ofFIG. 7A ; -
FIG. 7C is a cutaway perspective view of still another embodiment of a vibration isolator having features of the present invention; -
FIG. 8A is a flow chart that outlines a process for manufacturing a device in accordance with the present invention; and -
FIG. 8B is a flow chart that outlines device processing in more detail. -
FIG. 1 illustrates anapparatus 10 that includes one or more isolation assemblies 12 that isolate theapparatus 10 or a portion of theapparatus 10 from vibration. The type ofapparatus 10 can be varied. For example, theapparatus 10 can be used to manufacture, measure and/or inspect adevice 14. The type ofdevice 14 manufactured or inspected by theapparatus 10 can be varied. For example, thedevice 14 can be a semiconductor wafer, and the isolation assemblies 12 can be used as part of anexposure apparatus 10 that precisely transfers an image of an integrated circuit from anobject 16 such as a reticle onto thesemiconductor wafer 14. - Some of the Figures provided herein include a coordinate system that designates an X axis, a Y axis that is orthogonal to the X axis, and a Z axis that is orthogonal to the X axis and the Y axis. It should be understood that the coordinate system is merely for reference and can be varied. For example, the Z axis can be switched with the Y axis or the X axis and/or the
apparatus 10 can be rotated. Further, the X axis, the Y axis, and the Z axis can be referred to as the first axis, the second axis, and the third axis. As used herein, the term six degrees of freedom shall include movement along the X axis, along the Y axis, along the Z axis, about the X axis, about the Y axis and about the Z axis. - The
exposure apparatus 10 illustrated inFIG. 1 also includes aframe assembly 18, an illumination system 20 (irradiation apparatus), areticle stage assembly 22, a projectionoptical assembly 24, awafer stage assembly 26, and acontrol system 28. Theexposure apparatus 10 mounts to a mountingbase 30, e.g., the ground, a base, or floor or some other supporting structure. - There are a number of different types of
exposure apparatuses 10. For example, theexposure apparatus 10 can be used as scanning type photolithography system that exposes the pattern from thereticle 16 onto thewafer 14 with thereticle 16 and thewafer 14 moving synchronously. In a scanning type lithographic device, thereticle 16 is moved perpendicular to an optical axis of the projectionoptical assembly 24 by thereticle stage assembly 22 and thewafer 14 is moved perpendicular to the optical axis of the projectionoptical assembly 24 by thewafer stage assembly 26. Scanning of thereticle 16 and thewafer 14 occurs while thereticle 16 and thewafer 14 are moving synchronously. - Alternately, the
exposure apparatus 10 can be a step-and-repeat type photolithography system that exposes thereticle 16 while thereticle 16 and thewafer 14 are stationary. In the step and repeat process, thewafer 14 is in a constant position relative to thereticle 16 and the projectionoptical assembly 24 during the exposure of an individual field. Subsequently, between consecutive exposure steps, thewafer stage assembly 26 consecutively moves thewafer 14 perpendicular to the optical axis of the projectionoptical assembly 24 so that the next field of thewafer 14 is brought into position relative to the projectionoptical assembly 24 and thereticle 16 for exposure. Following this process, the images on thereticle 16 are sequentially exposed onto the fields of thewafer 14 so that the next field of thewafer 14 is brought into position relative to the projectionoptical assembly 24 and thereticle 16. - However, the use of the
exposure apparatus 10 and the isolation assemblies 12 is not limited to a photolithography system for semiconductor manufacturing. Theapparatus 10, for example, can be used as an LCD photolithography system that exposes a liquid crystal display device pattern onto a rectangular glass plate or a photolithography system for manufacturing a thin film magnetic head. Further, the present invention can also be applied to a proximity photolithography system that exposes a mask pattern by closely locating a mask and a substrate without the use of a projection optical assembly. Additionally, the present invention provided herein can be used in other devices, including other semiconductor processing equipment. - The
frame assembly 18 is rigid and supports the components of theexposure apparatus 10. The design of theframe assembly 18 can be varied to suit the design requirements for the rest of theexposure apparatus 10. Theframe assembly 18 illustrated inFIG. 1 supports the projectionoptical assembly 24, theillumination system 20, thereticle stage assembly 22 and thewafer stage assembly 26 above the mountingbase 30. - The
illumination system 20 includes anillumination source 32 and an illuminationoptical assembly 34. Theillumination source 32 emits the beam (irradiation) of light energy. Theillumination source 32 can be g-line (436 nm), i-line (365 nm), KrF excimer laser (248 nm), ArF excimer laser (193 nm) and F2 laser (157 nm). Alternately, theillumination source 32 can also use charged particle beams such as an x-ray and electron beam. For instance, in the case where an electron beam is used, thermionic emission type lanthanum hexaboride (LaB6) or tantalum (Ta) can be used as an electron gun. Furthermore, in the case where an electron beam is used, the structure could be such that either a mask is used or a pattern can be directly formed on a substrate without the use of a mask. - The illumination
optical assembly 34 guides the beam of light energy from theillumination source 32 to thereticle 16. The beam illuminates selectively different portions of thereticle 16 and exposes thesemiconductor wafer 14. InFIG. 1 , theillumination source 32 is illustrated as being supported above thereticle stage assembly 22. Typically, however, theillumination source 32 is secured to one of the sides of theframe assembly 18 and the energy beam from theillumination source 32 is directed to above thereticle 16 with the illuminationoptical assembly 34. - The
reticle stage assembly 22 holds and positions thereticle 16 relative to theoptical assembly 24 and thewafer 14. The design of thereticle stage assembly 22 can vary to suit the design requirements of theapparatus 10. In the embodiment illustrated inFIG. 1 , thereticle stage assembly 22 includes areticle stage base 38, areticle stage 40, and a reticlestage mover assembly 42. - The
reticle stage base 38 supports thereticle stage 40 above the mountingbase 30. In the embodiment illustrated inFIG. 1 , thereticle stage base 38 is generally rectangular shaped and includes a planar base top (sometimes referred to as a guide face), an opposed planar base bottom (not shown), and four base sides. - The
reticle stage 40 retains thereticle 16. Thereticle stage 40 can include a device holder such as a vacuum chuck, an electrostatic chuck, or some other type of clamp. Thereticle stage 40 is somewhat rectangular shaped. A bearing (not shown) maintains thereticle stage 40 spaced apart along the Z axis relative to thereticle stage base 38 and allows for motion of thereticle stage 40 along the X axis, along the Y axis and about the Z axis relative to thereticle stage base 38. - The reticle
stage mover assembly 42 controls and moves thereticle stage 40 relative to thereticle stage base 38. The design of the reticlestage mover assembly 42 and the movement of thereticle stage 40 can be varied to suit the movement requirements of theapparatus 10. In the embodiment illustrated inFIG. 1 , thereticle stage 40 moves relative to thereticle stage base 38 along the X axis, along the Y axis and about the Z axis. In this embodiment, the reticlestage mover assembly 42 includes aguide bar 46, a firstX stage mover 48, a secondX stage mover 50, and a Y stage mover (not shown). More specifically, in this embodiment, (i) theX stage movers guide bar 46, thereticle stage 40 and thereticle 16 along the X axis and about the Z axis (theta Z), and (ii) the Y stage mover moves thereticle stage 40 along the Y axis relative to theguide bar 46. - The design of each
mover apparatus 10. As provided herein, each of themovers FIG. 1 , each of themovers mover control system 28 to precisely position thereticle 16. - The
reticle stage assembly 22 can include a reticle measurement system (not shown) that monitors the position of thereticle stage 40 relative to the projectionoptical assembly 24 or some other reference. With this information, the reticlestage mover assembly 42 can be used to precisely position thereticle stage 40. For example, the reticle measurement system can utilize laser interferometers, encoders, sensors, and/or other measuring devices. - The projection
optical assembly 24 projects, directs and/or focuses the beam of light energy passing through the projectionoptical assembly 24. The design of the projectionoptical assembly 24 can be varied according to its design requirements. For example, the projectionoptical assembly 24 can magnify or reduce the image to be illuminated onto thedevice 14. The projectionoptical assembly 24 need not be limited to a magnification or a reduction system. The projectionoptical assembly 24 could also be a 1× system. - With respect to the projection
optical assembly 24, when far ultra-violet rays such as the excimer laser is used, glass materials such as quartz and fluorite that transmit far ultra-violet rays is preferable to be used. When the F2 type laser or x-ray is used, the projectionoptical assembly 24 should preferably be either catadioptric or refractive (a reticle should also preferably be a reflective type), and when an electron beam is used, electron optics should preferably consist of electron lenses and deflectors. The optical path for the electron beams should be in a vacuum. - Also, with an
exposure device 10 that employs vacuum ultra-violet radiation (VUV) ofwavelength 200 nm or lower, use of the catadioptric type optical system can be considered. Examples of the catadioptric type of optical system include the disclosure Japan Patent Application Disclosure No.8-171054 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Pat. No. 5,668,672, as well as Japan Patent Application Disclosure No. 10-20195 and its counterpart U.S. Pat. No. 5,835,275. In these cases, the reflecting optical device can be a catadioptric optical system incorporating a beam splitter and concave mirror. Japan Patent Application Disclosure No. 8-334695 published in the Official Gazette for Laid-Open Patent Applications and its counterpart U.S. Pat. No. 5,689,377 as well as Japan Patent Application Disclosure No. 10-3039 and its counterpart U.S. patent application Ser. No. 873,605 (Application Date: Jun. 12,1997) also use a reflecting-refracting type of optical system incorporating a concave mirror, etc., but without a beam splitter, and can also be employed with this invention. As far as is permitted, the disclosures in the above-mentioned U.S. patents, as well as the Japan patent applications published in the Official Gazette for Laid-Open Patent Applications are incorporated herein by reference. - The
wafer stage assembly 26 holds and positions thewafer 14 with respect to the adjusted projected image of the illuminated portions of thereticle 16. The design of thewafer stage assembly 26 can vary to suit the design requirements of theapparatus 10. In the embodiment illustrated inFIG. 1 , thewafer stage assembly 26 includes awafer stage base 52, awafer stage 54, and a waferstage mover assembly 56. - The
wafer stage base 52 supports thewafer stage 54 above the mountingbase 30. In the embodiment illustrated inFIG. 1 , thewafer stage base 52 is generally rectangular shaped and includes a planar base top (sometimes referred to as a guide face), an opposed planar base bottom (not shown), and four base sides. - The
wafer stage 54 retains thewafer 14. Thewafer stage 54 can include a device holder such as a vacuum chuck, an electrostatic chuck, or some other type of clamp. Thewafer stage 54 is somewhat rectangular shaped. A bearing (not shown) maintains thewafer stage 54 spaced apart along the Z axis relative to thewafer stage base 52 and allows for motion of thewafer stage 54 along the X axis, along the Y axis and about the Z axis relative to thewafer stage base 52. - The wafer
stage mover assembly 56 controls and moves thewafer stage 54 relative to thewafer stage base 52. The design of the waferstage mover assembly 56 and the movement of thewafer stage 54 can be varied to suit the movement requirements of theapparatus 10. In the embodiment illustrated inFIG. 1 , thewafer stage 54 moves relative to thewafer stage base 52 along the X axis, along the Y axis and about the Z axis. In this embodiment, the waferstage mover assembly 56 includes aguide bar 60, a firstX stage mover 62, a secondX stage mover 64, and a Y stage mover (not shown). More specifically, in this embodiment, (i) theX stage movers guide bar 60, thewafer stage 54 and thewafer 14 along the X axis and about the Z axis (theta Z), and (ii) the Y stage mover moves thewafer stage 54 along the Y axis relative to theguide bar 60. - The design of each
mover apparatus 10. As provided herein, each of themovers FIG. 1 , each of themovers mover control system 28 to precisely position thewafer 14. - The
wafer stage assembly 26 can include a wafer measurement system (not shown) that monitors the position of thewafer stage 54 relative to the projectionoptical assembly 24 or some other reference. With this information, the waferstage mover assembly 56 can be used to precisely position thewafer stage 54. For example, the wafer measurement system can utilize laser interferometers, encoders, sensors, and/or other measuring devices. - Further, in photolithography systems, when linear motors (see U.S. Pat. Nos. 5,623,853 or 5,528,118) are used in a wafer stage assembly or a reticle stage assembly, the linear motors can be either an air levitation type employing air bearings or a magnetic levitation type using Lorentz force or reactance force. Additionally, the stage could move along a guide, or it could be a guideless type stage that uses no guide. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,623,853 and 5,528,118 are incorporated herein by reference.
- Alternatively, one of the stages could be driven by a planar motor, which drives the stage by an electromagnetic force generated by a magnet unit having two-dimensionally arranged magnets and an armature coil unit having two-dimensionally arranged coils in facing positions. With this type of driving system, either the magnet unit or the armature coil unit is connected to the stage and the other unit is mounted on the moving plane side of the stage.
- Movement of the stages as described above generates reaction forces that can affect performance of the photolithography system. Reaction forces generated by the wafer (substrate) stage motion can be mechanically released to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,528,118 and published Japanese Patent Application Disclosure No. 8-166475. Additionally, reaction forces generated by the reticle (mask) stage motion can be mechanically released to the floor (ground) by use of a frame member as described in U.S. Pat. No. 5,874,820 and published Japanese Patent Application Disclosure No. 8-330224. As far as is permitted, the disclosures in U.S. Pat. Nos. 5,528,118 and 5,874,820 and Japanese Patent Application Disclosure No. 8-330224 are incorporated herein by reference.
- Each isolation assembly 12 inhibits vibration from a first assembly from being transferred to a second assembly. Further, each isolation assembly 12 can adjust the position of the first assembly relative to the second assembly with at least three degrees of freedom. Additionally, each isolation assembly 12 can adjust the position of the first assembly relative to the second assembly with six three degrees of freedom. Details of isolations assemblies can be found in U.S. Pat. No. 5,701,041, U.S. Pat. No. 6,226,075, U.S. Pat. No. 6,144,442, EP 0973067, WO 99/05573, and WO 99/22272, as far a permitted, the disclosures of which are incorporated herein by reference.
- In the embodiment illustrated in
FIG. 1 , theexposure apparatus 10 includes a frame isolation system 66, a reticle stage isolation system 68, a wafer stage isolation system 70, and an optical isolation system 72. The design of each isolation assembly 12 can be varied to suit the design requirements of theapparatus 10. - In
FIG. 1 , the frame isolation system 66 secures theframe assembly 18 to the mountingbase 30. With this design, the frame isolation system 66 reduces the effect of vibration of the mounting base 30 (the second assembly) causing vibration on the frame assembly 18 (the first assembly) and the components of theexposure apparatus 10 that are secured to theframe assembly 18. In this embodiment, the frame isolation system 66 includes a plurality of spaced apartvibration isolators 100 that support the weight of theframe assembly 18, while remaining low in stiffness for good passive vibration isolation of theframe assembly 18 relative to the mountingbase 30. The number ofvibration isolators 100 in the frame isolation system 66 can be varied. For example, the frame isolation system 66 can include three spaced apartvibration isolators 100. - Further, in this embodiment, the frame isolation system 66 moves and positions the
frame assembly 18 relative to the mountingbase 30 base with six degrees of freedom. More specifically, thevibration isolators 100 adjust the position of theframe assembly 18 relative to the mountingbase 30 along the Z axis, about the X axis and about the Y axis. Additionally, the frame isolation system 66 includes one or more movers for adjusting the position of theframe assembly 18 relative to the mountingbase 30 along the X axis, along the Y axis and about the Z axis. InFIG. 1 , the frame isolation system 66 includes (i) two spaced apartX movers 101X that move theframe assembly 18 relative to the mountingbase 30 along the X axis and about the Z axis, and (ii) aY mover 101Y that moves theframe assembly 18 relative to the mountingbase 30 along the Y axis. - The design of each
mover apparatus 10. As provided herein, each of themovers FIG. 1 , each of themovers mover control system 28 to precisely position theframe assembly 18. - In one embodiment, the
control system 28 actively controls thevibration isolators 100 to compensate for low frequency disturbances such as a shift in the center of gravity in one thestage assemblies - The position and acceleration of the
frame assembly 18 relative to the mountingbase 30 can be monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, thecontrol system 28 can control the frame isolation system 66 to adjust and control the position of theframe assembly 18 relative to the mountingbase 30. - The reticle stage isolation system 68 secures and supports the
reticle stage base 38 to theframe assembly 18 and reduces the effect of vibration of theframe assembly 18 causing vibration to thereticle stage base 38. In this embodiment, the reticle stage isolation system 68 includes a plurality of spaced apartvibration isolators 102 that support the weight of thereticle stage base 38 and adjust the position of thereticle stage base 38 with three degrees of freedom, while remaining low in stiffness for good passive vibration isolation of thereticle stage base 38 relative to theframe assembly 18. Alternately, the reticle stage isolation system 68 can be designed to move thereticle stage base 38 with six degrees of freedom. - In this embodiment, the
control system 28 actively controls thevibration isolators 102 to compensate for low frequency disturbances, to adjust the static or low frequency position of thereticle stage base 38, to improve vibration isolation by reducing the stiffness, and/or to compensate for a change or shift in the center of gravity of thereticle stage assembly 22. In one embodiment, the position and acceleration of thereticle stage base 38 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, thecontrol system 28 can cooperate with the reticle stage isolation system 68 to adjust and control the position of thereticle stage base 38. - The wafer stage isolation system 70 secures and supports the
wafer stage base 52 to theframe assembly 18 and reduces the effect of vibration of theframe assembly 18 causing vibration to thewafer stage base 52. In this embodiment, the wafer stage isolation system 70 includes a plurality of spaced apartvibration isolators 104 and thecontrol system 28 actively controls thevibration isolators 104 to compensate for low frequency disturbances, to adjust the static or low frequency position of thewafer stage base 52, to adjust the position of thewafer stage base 52 with three degrees of freedom and to improve vibration isolation by reducing the stiffness, and/or to compensate for a change or shift in the center of gravity of thewafer stage assembly 26. Alternately, the wafer stage isolation system 70 can be designed to move thewafer stage base 52 with six degrees of freedom. - In one embodiment, the position and acceleration of the
wafer stage base 52 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, thecontrol system 28 can cooperate with the wafer stage isolation system 70 to adjust and control the position of thewafer stage base 52. - The optical isolation system 72 secures and supports the projection
optical assembly 24 relative to theframe assembly 18 and reduces the effect of vibration of theframe assembly 18 causing vibration to the projectionoptical assembly 24. The optical isolation system 72 is similar to the other isolation systems discussed above. In this embodiment, the optical isolation system 72 includes a plurality ofvibration isolators 106 and thecontrol system 28 actively controlsvibration isolators 106 to position theoptical assembly 24, to compensate for low frequency disturbances, to adjust the static or low frequency position of theoptical assembly 24 and to improve vibration isolation by reducing the stiffness. Thecontrol system 28 controls theactuators 106 to actively damp and control the position of the projectionoptical assembly 24. In one embodiment, the position and acceleration of the projectionoptical assembly 24 is monitored with one or more position and/or acceleration sensors (not shown). With information from the sensors, thecontrol system 28 can cooperate with the optical isolation system 72 to adjust and control the position of the projectionoptical assembly 24. -
FIG. 2A illustrates a side view of a first embodiment of avibration isolator 200 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 200 includes afirst system 202 and asecond system 204. Thefirst system 202 supports at least a portion of afirst assembly 206 relative to asecond assembly 208 and thesecond system 204 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 206. In this embodiment, thefirst system 202 includes avacuum source 210 and thesecond system 204 includes afluid source 212. The design of the components of thevibration isolator 200 can be varied to suit the intended use of thevibration isolator 200. -
FIG. 2B illustrates a cross-sectional, perspective view of thevibration isolator 200 ofFIG. 2A . In this embodiment, thevibration isolator 200 includes asystem connector 216 that couples thefirst system 202 to thesecond system 204 so that the forces from thesystems FIG. 2B , thefirst system 202 andsecond system 204 are aligned along the Z axis and the driving force and the supporting force for thefirst system 202 andsecond system 204 act along the Z axis. - In this embodiment, (i) the
first system 202 includes afirst cylinder 218, afirst piston 220, afirst seal 222, and thevacuum source 210 and (ii) thesecond system 204 includes asecond cylinder 226, asecond piston 228, asecond seal 230, and thefluid source 212. Thefirst piston 220 moves within thefirst cylinder 218 along afirst axis 234 and thesecond piston 228 moves within thesecond cylinder 226 along asecond axis 236. Further, thefirst system 202 is a vacuum type actuator and thesecond system 204 is a fluid type actuator. Thus, thefirst system 202 functions differently from thesecond system 204. - The
second system 204 is stacked on top and positioned directly above thefirst system 202, and thefirst axis 234 is substantially coaxial with thesecond axis 236. Further, thesystem connector 216 mechanically couples and connects thefirst piston 220 to thesecond piston 228 so that thepistons pistons pistons - The size and shape of each of the
cylinders vibration isolator 200. In this embodiment, each of thecylinders first cylinder 218 includes a disk shaped top. The wall of each of thecylinders first cylinder 218 is larger than the diameter of thesecond cylinder 226. - The
first piston 220 is sized and shaped to fit within thefirst cylinder 218 and move within thefirst cylinder 218. Similarly, thesecond piston 228 is sized and shaped to fit within thesecond cylinder 226 and move within thesecond cylinder 226. In this embodiment, each of thepistons first piston 220 is larger than the diameter of thesecond piston 228. This allows thefirst system 202 to carry the majority of the load and thesecond system 204 to adjust for shifts in the center of gravity of thefirst assembly 206, adjust to a changing load, and/or adjust for a change in atmospheric pressure. - The ratio of the diameters is a function of the ratio of the areas. The ratio of areas is a function of the load ratio. The load ratio is a function of area and pressure. The
vibration isolator 200 can be designed so that thefirst system 202 supports approximately 100% of the load at the highest expected barometric pressure and thesecond system 204 supports approximately 5% (barometric pressure change) plus approximately 2% (center of gravity shift) of the load. For example, a fluid pressure in thesecond system 204 of approximately 60 psi, then the area ratio would need to be 100:7 and the diameter ratio would be 10:2.65. Alternately, if the fluid pressure in thesecond system 204 is 5 psi, then the area ratio would be 100:21 and the diameter ratio would be 10:4.58. Suitable ratios may be approximately 10:1 on area and approximately 10:3 on diameter. - The
first seal 222 seals thefirst piston 220 to thefirst cylinder 218 and allows for motion of thefirst piston 220 relative to thefirst cylinder 218. Similarly, thesecond seal 230 seals thesecond piston 228 to thesecond cylinder 226 and allows for motion of thesecond piston 228 relative to thesecond cylinder 226. The design of each of theseals FIG. 2B , each of theseals first piston 220 is secured to the top of thefirst seal 222. Further, the top of thesecond piston 228 is secured to the bottom of thesecond seal 230 with aseal cap 232. - The convolution in the
first seal 222 rolls up and down to allow thefirst piston 220 to move relative to thefirst cylinder 218 without deforming the rest of thefirst seal 222. Similarly, the convolution in thesecond seal 230 rolls up and down to allow thesecond piston 228 to move relative to thesecond cylinder 226 without deforming the rest of thesecond seal 230. Alternately, other types of seals can be utilized that allow for greater lateral flexibility. For example, ferro fluidic seals and/or air/vacuum bearing seals can be utilized. - A
first clamp 238 secures and seals thefirst seal 222 to thefirst cylinder 218. Similarly, asecond clamp 240 secures and seals thesecond seal 230 to thesecond cylinder 226. In this embodiment, (i) thefirst clamp 238 includes an annular shaped ring and a disk shaped bottom and the (ii) thesecond clamp 240 is an annular shaped ring. Thefirst clamp 238 is secured to the bottom of thefirst cylinder 218 with an outer perimeter of thefirst seal 222 positioned between thefirst clamp 238 and thefirst cylinder 218. Thefirst clamp 238 includes an aperture so that the pressure below thefirst piston 220 is equal to the atmospheric pressure. Somewhat similarly, thesecond clamp 240 is secured to the top of thesecond cylinder 226 with an outer perimeter of thesecond seal 230 positioned between thesecond clamp 240 and thesecond cylinder 226. - The
first piston 220 cooperates with thefirst cylinder 218 and thefirst seal 222 to define afirst chamber 242 above thefirst piston 220. Somewhat similarly, thesecond piston 228 cooperates with thesecond cylinder 226 and thesecond seal 230 to define asecond chamber 244 below thesecond piston 228. The size and shape of each of thechambers vibration isolator 200. - The design of the
vacuum source 210 and thefluid source 212 can be varied. Thevacuum source 210 is in fluid communication with thefirst chamber 242 and thefluid source 212 is in fluid communication with thesecond chamber 244. Thevacuum source 210 can be a vacuum pump and thefluid source 212 can be a fluid pump or a compressor. In one embodiment, the fluid supplied by thefluid source 212 is a compressible gas. - The control system 28 (illustrated in
FIG. 1 ) actively controls thevacuum source 210 to control the pressure in thefirst chamber 242 and thefluid source 212 to control the pressure in thesecond chamber 244. More specifically, in this embodiment, thecontrol system 28 controls thevacuum source 210 to remove fluid from thefirst chamber 242 so that a first chamber pressure above thefirst piston 220 is less than the atmospheric pressure below thefirst piston 220. The amount of differential between the first chamber pressure and the atmospheric pressure can be varied. Typically, atmospheric pressure is approximately 14.7 psi. With this design, the pressure differential is less than approximately 14.7 psi and typically between approximately 14.65 psi and 14.68 psi. - Somewhat similarly, the
control system 28 actively controls thefluid source 212 to add fluid from thesecond chamber 244 so that a second chamber pressure in thesecond chamber 244, below thesecond piston 228 is greater than the atmospheric pressure above thesecond piston 228. The amount of differential between the second chamber pressure and the atmospheric pressure can be varied. The pressure differential is typically between approximately 0 psi and 60 psi. - Stated another way, the
control system 28 actively controls and adjusts the pressure in each of thechambers control system 28 can easily adjust the force characteristics and the height of thevibration isolator 200. It should be noted that thefirst system 202 can be designed to carry the majority of the load. For example, thefirst system 202 can carry at least approximately 70% or at least approximately 80%, or at least approximately 95%, or at least approximately 100% of the load. Alternately, thesecond system 204 can carry only approximately 30%, or approximately only 20%, or approximately only 5%, or approximately 0% of the load. Further, thesecond system 204 is used to adjust for shifts in a center of gravity of thefirst assembly 206 or a change in atmospheric pressure. - Further, it should be noted that the vacuum type
first system 202 is not very stiff and has a relatively low natural frequency when compared to a typical air type actuator having a comparable load capabilities. Stiffness for a volume of gas can be determined using the equation K=G*P*A/Heff, where G is the ratio of specific heats (approximately 1.4 for air), P is the absolute pressure, A is the piston area, Heff is the effective height, and Heff=V/A, where V is the volume of chamber. For example, if P is equal to 60 psig (500e3 Pa abs), A is equal to 0.125 m2, Heff is equal to 0.150 m and Kair is equal to 583e3 N/m or 583 N/m, and the load is equal to (P−100e3)*A=50e3N. For a vacuum piston carrying the same load, A=0.5 m2, P=345 Pa (0.05 psi abs.), Heff=0.150 m and because K=GPa/Heff there is nearly zero pressure in the vacuum chamber, Kvac=1.6e3 N/m or 1.6 N/mm. Thus, a vacuum type isolator is approximately 360 times less stiff than the air type actuator. This difference can increase if the vacuum pressure decreases. For example, if a high vacuum pump is used, then P=0.3 Pa (0.00005 PSI) and the stiffness ratio would be 360,000:1. These comparisons do not include any stiffness from the seals, which can be anywhere between 4 and 12 N/m. If a seal stiffness of 12 N/m was included in the above example, then Kair=583+12=595 N/mm and Kvac=1.6+12=12.6 N/mm. Then the vacuum system would be approximately 47 times less stiff than the air system. The natural frequencies of the systems would be, f=1/2TN*(K/m)0.5 and fair=1.73 Hz and fvac=0.25Hz=1.73/(47)0.5. - For the embodiment illustrated in
FIGS. 2A-2D , thefirst system 202 is much larger and carries significantly more of the load than thesecond system 204. As provided herein, thefirst system 202 can be at least approximately 2.5 times less stiff, or at least approximately 50 times less stiff, or at least approximately 100 times less stiff, or at least approximately 200 times less stiff than thesecond system 204. Thus, the resultingvibration isolator 200 has characteristics that are similar to thefirst system 202. - The
system connector 216 mechanically and rigidly connects thefirst piston 220 to thesecond piston 228. As a result thereof, thefirst piston 220 and thesecond piston 228 move concurrently and are connected together to the load. The design of thesystem connector 216 can be varied to suit the design requirements of thevibration isolator 200. In this embodiment, thesystem connector 216 extends from the top of thefirst piston 220 to the bottom of thesecond piston 228 through thechambers axes system connector 216 are formed as part of thepistons FIG. 2B , thesystem connector 216 includes (i) a rigid,connector shaft 246 that extends and cantilevers downward from thesecond piston 228 along theaxes first piston 220, (ii) ashaft attacher 248, e.g. a plurality of bolts, that secure the bottom of theconnector shaft 246 to thefirst piston 220, and (iii) aconnector seal 250 that allows theshaft attacher 248 to extend through thechambers first chamber 242 from thesecond chamber 244. Theconnector seal 250 can be a convoluted diaphram and can include an annular convolution that allows thepistons connector shaft 246 to move without deforming the rest of thefirst connector seal 250. Aconnector clamp 252 seals an outer perimeter of theconnector seal 250 to the top of thefirst cylinder 218 and an inner perimeter of theconnector seal 250 is sealed to theconnector shaft 246. -
FIGS. 2C and 2D each illustrate exploded perspective views of thevibration isolator 200, including (i) thefirst system 202 having thefirst cylinder 218, thefirst piston 220, thefirst seal 222, thefirst clamp 238, and thefirst axis 234, (ii) thesecond system 204 having thesecond cylinder 226, thesecond piston 228, thesecond seal 230, thesecond clamp 240, theseal cap 232, and thesecond axis 236, and (iii) thesystem connector 216 including theconnector shaft 246, theshaft attacher 248, theconnector seal 250, and theconnector clamp 252. -
FIG. 3A illustrates a side view of another embodiment of avibration isolator 300 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 300 includes afirst system 302 and a second system 304 (illustrated in phantom). Thefirst system 302 supports at least a portion of afirst assembly 306 relative to asecond assembly 308 and thesecond system 304 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 306 and/or a change in the atmospheric pressure near theisolator 300. In this embodiment, thefirst system 302 is a vacuum type actuator that includes avacuum source 310 and thesecond system 304 includes amover assembly 312. Thus, thefirst system 302 functions differently from thesecond system 304. The design of the components of thevibration isolator 300 can be varied to suit the intended use of thevibration isolator 300. -
FIG. 3B illustrates a cross-sectional, perspective view of thevibration isolator 300 ofFIG. 3A . In this embodiment, thesecond system 304 is positioned below thefirst system 302. Further, thesecond system 304 is directly coupled to thefirst system 302 so that thesystems FIG. 3B , thefirst system 302 andsecond system 304 are aligned along the Z axis and the driving force and the supporting force for thefirst system 302 andsecond system 304 act along the Z axis. - In this embodiment, the
first system 302 includes afirst cylinder 318, afirst piston 320, afirst seal 322, afirst clamp 338 and thevacuum source 310 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . - In
FIG. 3B , thesecond system 304 includes themover assembly 312 that is coupled to thefirst piston 320 and moves thefirst piston 320 relative to thesecond assembly 308 along the Z axis. The design of themover assembly 312 can be varied. For example, themover assembly 312 can include one or more rotary motors, voice coil motors, linear motors, electromagnetic actuators, or some other force actuators. InFIG. 3B , themover assembly 312 is a non-commutated, linear motor, commonly referred to as a voice coil motor. The mover includes (i) afirst component 324 that is secured to thefirst piston 320 and (ii) an adjacentsecond component 326 that interacts with thefirst component 324, thesecond component 326 is secured and coupled to thefirst cylinder 318 via the bottom of thefirst clamp 338. - For the mover, one of the
components other component first component 324 includes a conductor array, while thesecond component 326 includes a pair of spaced apart magnet arrays. Alternately, for example, the first component could include one or more magnet arrays while the second component could include one or more conductor arrays. - Electrical current (not shown) is supplied to the conductor array by the control system 28 (illustrated in
FIG. 1 ). The electrical current interacts with a magnetic field (not shown) generated by one or more of the magnets. This causes a force (Lorentz force) between the conductor and the magnets. The required stroke of the mover can vary. It is anticipated that the required stroke of the mover is between approximately 5 mm and 15 mm. However, larger or smaller strokes can be utilized. - Further, the
control system 28 actively controls thevacuum source 310 to remove fluid from afirst chamber 342 so that the first chamber pressure is below the atmospheric pressure. With this design, thecontrol system 28 can easily adjust the damping characteristics, the force characteristics, and the height of thevibration isolator 300. It should be noted that thefirst system 302 is again designed to carry the majority of the load of thefirst assembly 306. - It should be noted that a fluid actuator similar to the
second system 204 illustrated inFIGS. 2A-2D can be coupled to theisolator 300 illustrated inFIGS. 3A and 3B . -
FIG. 4A illustrates a side view of another embodiment of avibration isolator 400 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 400 includes afirst system 402 and a second system 404 (illustrated in phantom). Thefirst system 402 supports afirst assembly 406 relative to asecond assembly 408 and thesecond system 404 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 406 and/or a change in the atmospheric pressure near theisolator 400. In this embodiment, thefirst system 402 is a vacuum actuator that includes avacuum source 410 and thesecond system 404 includes amass adjuster 412. Thus, thefirst system 402 functions differently from thesecond system 404. The design of the components of thevibration isolator 400 can be varied to suit the intended use of thevibration isolator 400. -
FIG. 4B illustrates a cross-sectional, perspective view of thevibration isolator 400 ofFIG. 4A . In this embodiment, thesecond system 404 is positioned below thefirst system 402. Further, thesecond system 404 is directly coupled to thefirst system 402 so that thesystems - In this embodiment, the
first system 402 includes afirst cylinder 418, afirst piston 420, afirst seal 422, afirst clamp 438, and thevacuum source 410 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . - The
mass adjuster 412 is designed to change, e.g. add or remove, the mass that is carried by thefirst system 402. The design of themass adjuster 412 can be varied. InFIG. 4B , themass adjuster 412 includes a reservoir 450 that is coupled and secured to thefirst piston 420 and afluid source 452. The reservoir 450 receives a fluid 454. Thefluid source 452 is in fluid communication with the reservoir 450 with asource tube 456. Thefluid source 452 adds or removes fluid 454 from the reservoir 450 to adjust the mass of that is coupled to thefirst piston 420. Thefluid source 452, for example, can include one or more pumps. With this design, themass adjuster 412 can compensate for changes in the atmospheric pressure and/or a shift is the center of gravity of thefirst assembly 406. Suitable fluids 454 include high-density fluids such as water or mercury. - The control system 28 (illustrated in
FIG. 1 ) actively controls thefluid source 452 to add fluid 454 to the reservoir 450 or remove fluid 454 from the reservoir 450 to adjust the mass that is coupled to thefirst piston 420. Further, thecontrol system 28 actively controls thevacuum source 410 to remove fluid from afirst chamber 442 so that the first chamber pressure below the atmospheric pressure. With this design, thecontrol system 28 can easily adjust the damping characteristics and the height of thevibration isolator 400. It should be noted in this embodiment, thefirst system 402 is designed to carry the entire load of thefirst assembly 406. - Further, a fluid actuator similar to the
second system 204 illustrated inFIGS. 2A-2D and/or amover assembly 312 as illustrated inFIGS. 3A and 3B can be coupled to theisolator 400 illustrated inFIGS. 4A and 4B . -
FIG. 5A illustrates a side cut-away view of another embodiment of avibration isolator 500 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 500 includes afirst system 502 and asecond system 504. Thefirst system 502 supports at least a portion of afirst assembly 506 relative to asecond assembly 508 and thesecond system 504 adjusts for a change and/or shift in the load caused by, for example, a change in the location of a center of gravity of thefirst assembly 506 and/or a change in atmospheric pressure near theisolator 500. In this embodiment, thefirst system 502 is a vacuum type actuator that includes avacuum source 510 and thesecond system 504 is a fluid type actuator that includes afluid source 512. Thus, thefirst system 502 functions differently from thesecond system 504. The design of the components of thevibration isolator 500 can be varied to suit the intended use of thevibration isolator 500. - In this embodiment, a
vibration frame 514 secures an upper end of thefirst system 502 and thesecond system 504 to thesecond assembly 508, and thefirst assembly 506 is secured to the lower end of thefirst system 502 and thesecond system 504. Moreover in this embodiment, (i) thefirst system 502 includes a disk shapedattachment flange 516A, atubular sleeve 516B, an annular shapedflange seal 516C, a disk shapedfirst piston 516D, and afirst piston seal 516E that cooperate to form afirst chamber 516F, and (ii) thesecond system 504 includes a disk shapedattachment flange 518A, atubular sleeve 518B, an annular shapedflange seal 518C, a disk shapedsecond piston 518D, and asecond piston seal 518E that cooperate to form asecond chamber 518F. Thevacuum source 510 maintains thefirst chamber 516F below atmospheric pressure and thefluid source 512 maintains the pressure in thesecond chamber 518F above the pressure in thefirst chamber 516F. - It should be noted in this embodiment, the
first system 502 and thesecond system 504 act as a pendulum assembly that allows thevibration isolator 500 to have reduced lateral stiffness. More specifically, (i) for thefirst system 502, thesleeve 516B pivots relative to theflange seal 516C, and (ii) for thesecond system 504, thesleeve 518B pivots relative to theflange seal 518C. With this design, thevibration isolator 500 allows thefirst assembly 506 to move laterally relative to thesecond assembly 508. In this embodiment, the central axis of theseals motion 520 about which thesleeves motion 520 is located approximately between theseals seals sleeves first assembly 506. -
FIG. 5B is a simplified illustration of thevibration isolator 500 ofFIG. 5A .FIG. 5B illustrates that thevibration isolator 500 allows thefirst assembly 506 to move laterally relative to thesecond assembly 508. More specifically, thesleeves seals -
FIG. 5C illustrates a perspective view andFIG. 5D illustrates a top view of how a pendulum type isolator can be implemented. In this embodiment, thevibration isolator 500C includes afirst frame 501C that is secured to thefirst assembly 506C, asecond frame 503C that is secured to thesecond assembly 508C, avacuum source 510C and afluid source 512C. In this embodiment, thefirst frame 501C is rigid and generally rectangular frame shaped and thesecond frame 503C is rigid and generally rectangular frame shaped. -
FIG. 5E illustrates a cut-away view of thevibration isolator 500C ofFIGS. 5C and 5D . In this embodiment, thevibration isolator 500C includes four, vacuum typefirst systems 502C, and two, fluid typesecond systems 504C. More specifically, thevibration isolator 500C includes thefirst frame 501C, thesecond frame 503C, a sleeve 514C, anupper piston assembly 520C, a lower piston assembly 522C, anupper seal assembly 524C, and alower seal assembly 526C. With this design, the sleeve 514C pivots relative to theupper piston assembly 520C and allows thefirst assembly 506C to move laterally relative to thesecond assembly 508C. With this design, avibration isolator 500C having a relatively small footprint will have a relatively large capacity. It should be noted that in this design, at least a portion of one of thesystems systems - In this embodiment, the
first frame 501C is rigid, extends between thefirst assembly 506C and the lower piston assembly 522C and couples the lower piston assembly 522C to thefirst assembly 506C. Somewhat similarly, thesecond frame 503C is rigid, extends between thesecond assembly 508C and theupper piston assembly 520C, and couples theupper piston assembly 520C to thesecond assembly 508C. - The sleeve 514C is rigid, and includes a generally tubular shaped
section 528C and a plurality of annular shaped, spaced apart walls, such as (i) an annular disk shaped, firstupper wall 530C that is positioned near a top of the sleeve 514C, (ii) an annular disk shaped, secondupper wall 532C that is positioned below the firstupper wall 530C, (iii) an annular disk shaped, thirdupper wall 534C that is positioned below the secondupper wall 532C, (iv) an annular disk shaped, firstlower wall 536C that is positioned near a bottom of the sleeve 514C, (v) an annular disk shaped, secondlower wall 538C that is positioned above the firstlower wall 536C, (vi) an annular disk shaped, thirdlower wall 540C that is positioned above the secondlower wall 538C. - The
upper piston 520C assembly is rigid and includes (i) a disk shaped, firstupper piston 542C that is positioned near the top of theupper piston assembly 520C, (ii) a disk shaped, secondupper piston 544C that is positioned below the firstupper piston 542C, (iii) a cylindrical shaped,upper piston connector 546C that connects theupper pistons upper container 548C that is secured to the bottom of theupper piston connector 546C. The firstupper piston 542C is fixedly secured to a top beam of thesecond frame 503C. - The lower piston assembly 522C is rigid and includes (i) a disk shaped, first
lower piston 552C that is positioned near the bottom of the lower piston assembly 522C, (ii) a disk shaped, secondlower piston 554C that is positioned above the firstlower piston 552C, (iii) a cylindrical shaped,lower piston connector 556C that connects the lower pistons together 552C, 554C, and (iv) a cylindrical shapedlower container 558C that is secured to the top of thelower piston connector 556C. The first lower piston 552 is fixedly secured to the bottom beam of thefirst frame 501C. - The
upper seal assembly 524C secures and seals theupper piston assembly 520C to the sleeve 514C and allows the sleeve 514C and the lower piston assembly 522C to pivot relative to theupper piston assembly 520C and thesecond assembly 508C. InFIG. 5E , theupper seal assembly 524C includes (i) a firstupper seal 560C that secures and seals the firstupper piston 542C to the sleeve 514C, (ii) a first upperintermediate seal 562C that secures and seals the firstupper wall 530C to theupper piston connector 546C intermediate theupper pistons upper seal 564C that secures and seals the secondupper piston 544C to the sleeve 514C, (iv) a second upperintermediate seal 566C that secures and seals the secondupper wall 532C to theupper piston connector 546C below the secondupper piston 544C, and (v) a thirdupper seal 568C that secures and seals theupper container 548C to the upperthird wall 534C. - Somewhat similarly, the
lower seal assembly 526C secures and seals the lower piston assembly 522C to the sleeve 514C. InFIG. 5E , thelower seal assembly 526C includes (i) a firstlower seal 570C that secures and seals the firstlower piston 552C to the sleeve 514C, (ii) a first lowerintermediate seal 572C that secures and seals the firstlower wall 536C to thelower piston connector 556C intermediate thelower pistons lower seal 574C that secures and seals the secondlower piston 554C to the sleeve 514C, (iv) a second lowerintermediate seal 576C that secures and seals the secondlower wall 538C to thelower piston connector 556C above the secondlower piston 554C, and (v) a thirdlower seal 578C that secures and seals thelower container 558C to the lowerthird wall 540C. - In
FIG. 5E , each seal is a convoluted diaphram seal that includes an annular convolution that allows the sleeve 514C and the rest of the pendulum assembly to move with relatively moderate lateral resistance. Stated another way, this type of seal allows for lateral movement with minimal resistance. Alternately, other types of seals can be utilized that allow for greater lateral flexibility. For example, ferro fluidic seals and/or air/vacuum bearing seals can be utilized. - The components cooperate so that the
vibration isolator 500C includes eleven separate chambers. More specifically, moving top to bottom, thevibration isolator 500C includes (i) afirst chamber 581C located between the firstupper piston 542C and the firstupper wall 530C, (ii) asecond chamber 582C located between the firstupper wall 530C and the secondupper piston 544C, (iii) athird chamber 583C located between the secondupper piston 544C and the secondupper wall 532C, (iv) afourth chamber 584C located between the secondupper wall 532C and the thirdupper wall 534C, (v) afifth chamber 585C formed by theupper container 548C, (vi) asixth chamber 586C located between the thirdupper wall 534C and the thirdlower wall 540C, (vii) aseventh chamber 587C formed by thelower container 558C, (viii) aneighth chamber 588C located between the thirdlower wall 540C and the secondlower wall 538C, (ix) aninth chamber 589C located between the secondlower wall 538C and the secondlower piston 554C, (x) atenth chamber 590C located between the secondlower piston 554C and the firstlower wall 536C, and (xi) aneleventh chamber 591C located between the firstlower wall 536C and the firstlower piston 552C. - Of the eleven chambers, some of the chambers are maintained below atmospheric pressure with the
vacuum source 510C, some of the chambers are at atmospheric pressure and/or some of chambers are above atmospheric pressure using thefluid source 512C. InFIG. 5E , thefirst chamber 581C, thethird chamber 583C, thesixth chamber 586C, theninth chamber 589C, and theeleventh chamber 591C are in fluid communication with thevacuum source 510C and are subjected to a vacuum. Further, thesecond chamber 582C and thetenth chamber 590C are at atmospheric pressure. Moreover, thefourth chamber 584C, thefifth chamber 585C, theseventh chamber 587C and theeighth chamber 588C are in fluid communication with thefluid source 512C and are at pressure above atmospheric pressure. - One or more of the
first chamber 581C, thethird chamber 583C, thesixth chamber 586C, theninth chamber 589C, and theeleventh chamber 591C can be in fluid communication with thesame vacuum source 510C. Alternately, one or more of these chambers can have a separate vacuum source. This design would allow for the individual control of the pressure in one or more of thefirst chamber 581C, thethird chamber 583C, thesixth chamber 586C, theninth chamber 589C, and theeleventh chamber 591C. - Somewhat similarly, one or more of the
fourth chamber 584C, thefifth chamber 585C, theseventh chamber 587C and theeighth chamber 588C can be in fluid communication with the samefluid source 512C. For example,FIG. 5E illustrates that thefourth chamber 584C, thefifth chamber 585C, theseventh chamber 587C and theeighth chamber 588C are all in fluid communication with each other. Alternately, (i) thefourth chamber 584C andfifth chamber 585C can have a separate fluid source and/or be at a different pressure than theseventh chamber 587C and theeighth chamber 588C. This design would allow for the individual control of the pressure in thefourth chamber 584C and the eighth chamber. - The control system 28 (illustrated in
FIG. 1 ) actively controls (i) thevacuum source 510C to control the pressure in thefirst chamber 581C, thethird chamber 583C, thesixth chamber 586C, theninth chamber 589C, and theeleventh chamber 591C, and (ii) thefluid source 512C to control the pressure in thefourth chamber 584C, thefifth chamber 585C, theseventh chamber 587C and theeighth chamber 588C. With this design, thecontrol system 28 can easily adjust the force characteristics and the height of thevibration isolator 500. It should be noted that thefirst systems 502C can be designed to carry the majority of the load. For example, thefirst systems 502 can carry at least approximately 70% or at least approximately 80%, or at least approximately 95%, or at least approximately 100% of the load. Alternately, thesecond systems 504C can carry only approximately 30%, or approximately only 20%, or approximately only 5%, or approximately 0% of the load. Further, thesecond systems 504C ARE used to adjust for changes in load caused by shifts in a center of gravity of thefirst assembly 506C or a change in atmospheric pressure. - It should be noted in this embodiment, the
first systems 502C and thesecond systems 504C act as a pendulum assembly that allows thevibration isolator 500C to have reduced lateral stiffness. With this design, thevibration isolator 502C allows thefirst assembly 506C to move laterally relative to thesecond assembly 508C. InFIG. 5E , the approximate center of theupper seal assembly 524C defines an area ofmotion 595C about which the pendulum assembly pivots. -
FIG. 5F is a perspective cut-away view of how an actual version of the vibration isolator ofFIGS. 5C-5E may look. In particular, thevibration isolator 500F ofFIG. 5F illustrates includes four, vacuum typefirst systems 502F, and two, fluid typesecond systems 504F. Further, the vibration isolator includes afluid source 512F, avacuum source 510F, afirst frame 501F (only partly shown), asecond frame 503F (only partly shown), asleeve 514F, anupper piston assembly 520F, alower piston assembly 522F, anupper seal assembly 524F, and a lower seal assembly 526F that are similar to the corresponding components described above and illustrated inFIG. 5E . Moreover, thesleeve 514F pivots relative to theupper piston assembly 520F and allows for lateral movement. Additionally, the four, vacuum typefirst systems 502F, and the two, fluid typesecond systems 504F are stacked together. - Again in this embodiment, the components cooperate to so that the
vibration isolator 500F includes eleven separate chambers, namely (i) afirst chamber 581F, (ii) asecond chamber 582F, (iii) athird chamber 583F, (iv) afourth chamber 584F, (v) afifth chamber 585F, (vi) asixth chamber 586F, (vii) aseventh chamber 587F, (viii) aneighth chamber 588F, (ix) aninth chamber 589F, (x) atenth chamber 590F, and (xi) aneleventh chamber 591F. Further, (i) thefirst chamber 581F, thethird chamber 583F, thesixth chamber 586F, theninth chamber 589F, and theeleventh chamber 591F are in fluid communication with thevacuum source 510F and are subjected to a vacuum, (ii) thesecond chamber 582F and thetenth chamber 590F are at atmospheric pressure, and (iii) thefourth chamber 584F, thefifth chamber 585F, theseventh chamber 587F and theeighth chamber 588F are in fluid communication with thefluid source 512F and are at pressure above atmospheric pressure. - The control system 28 (illustrated in
FIG. 1 ) actively controls (i) thevacuum source 510F to control the pressure in thefirst chamber 581F, thethird chamber 583F, thesixth chamber 586F, theninth chamber 589F, and theeleventh chamber 591F, and (ii) thefluid source 512F to control the pressure in thefourth chamber 584F, thefifth chamber 585F, theseventh chamber 587F and theeighth chamber 588F. With this design, thecontrol system 28 can easily adjust the force characteristics and the height of thevibration isolator 500F. - In
FIG. 5F , thevibration isolator 500F also includes apendulum support assembly 592F that assists in supporting the weight of thesleeve 514F while allowing thelower piston assembly 522F to move relative to thesleeve 514F. InFIG. 5F , thesupport assembly 592F flexibly connects and couples thesleeve 514F to thelower piston assembly 522F so that thelower piston assembly 522F can support at least a portion of the weight of thesleeve 514F. - In
FIG. 5F , thependulum support assembly 592F includes alower support bridge 594F, anupper connector bridge 596F, alower connector bridge 597F and aflexible support 598F. Thelower support bridge 594F is a rigid beam that extends across the bottom of thesleeve 514F. Theupper connector bridge 596F is rigid and is fixedly secured to thelower support bridge 594F. Theupper connector bridge 596F extends into the center of thelower piston assembly 522F. Thelower connector bridge 597F is rigid and is fixedly secured to thelower piston assembly 522F. Thelower connector bridge 597F also extends into the center of thelower piston assembly 522F. Theflexible support 598F is flexible and is secured between theupper connector bridge 596F and thelower connector bridge 597F to flexibly connect thesleeve 514F to thelower piston assembly 522F. Theflexible support 598F can be made of a resilient material such as rubber. - It should be noted in this embodiment that the
sleeve 514F acts as a pendulum assembly that allows thevibration isolator 500F to have improved lateral stiffness. More specifically, thesleeve 514F, the lower seal assembly 526F and thelower piston assembly 522F pivot relative to theupper seal assembly 524F, and theupper piston assembly 520F. With this design, thevibration isolator 500F allows for lateral movement. - Additionally, in
FIG. 5F , thelower piston assembly 522F is fixedly secured and coupled to thefirst frame 501F with an annular shaped,first frame connector 551F, and theupper piston assembly 520F is fixedly secured and coupled to thesecond frame 503F with an annular shaped,second frame connector 553F. Further, thefirst frame 551F includes a pair ofapertures 555F that allow thelower bridge support 594F to be connected to thelower piston assembly 522F. -
FIG. 6A illustrates a side view of another embodiment of avibration isolator 600 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 600 includes afirst system 602, asecond system 604 and athird system 605. Thefirst system 602 and thethird system 605 cooperate to support at least a portion of afirst assembly 606 relative to asecond assembly 608 and thesecond system 604 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 606 and/or a change in atmospheric pressure. In this embodiment, thefirst system 602 and thethird system 605 are vacuum type actuators that each include avacuum source 610 and thesecond system 604 that is a fluid type actuator that includes afluid source 612. The design of the components of thevibration isolator 600 can be varied to suit the intended use of thevibration isolator 600. -
FIG. 6B illustrates a cross-sectional, perspective view of thevibration isolator 600 ofFIG. 6A . In this embodiment, thevibration isolator 600 includes asystem connector 616 that directly couples thesystems second system 604 so that thesystems - In this embodiment, the
first system 602 includes afirst cylinder 618, afirst piston 620, afirst seal 622, afirst clamp 638, and thevacuum source 610 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . Similarly, thethird system 605 includes athird cylinder 658, athird piston 660, athird seal 662, athird clamp 664, and thevacuum source 610 that are similar to the corresponding component illustrated inFIGS. 2A-2D . The stacked vacuum actuators allow for a smaller footprint of theisolator 600 for the same lifting, supporting capacity. - In
FIG. 6B , thesecond system 604 includes asecond cylinder 626, asecond piston 628, asecond seal 630, and thefluid source 612 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . In this embodiment, thesecond system 604 can also or alternately include (i) a mover assembly (not shown) similar to that illustrated inFIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated inFIG. 4B and described above, (iii) a repulsion type assembly (not shown) similar to that illustrated inFIGS. 7A and 7B that utilizes a first permanent magnet section and a spaced apart second permanent magnet section, and/or (iv) an attraction type system (not shown) similar to that illustrated inFIG. 7C that utilizes a magnet section and a spaced apart magnetically permeable section. - The
first piston 620 moves within thefirst cylinder 618 along a first axis 634, thesecond piston 628 moves within thesecond cylinder 626 along a second axis 636, and thethird piston 660 moves with thethird cylinder 658 along a third axis 637. Thesecond system 604 is stacked on top and positioned directly above thesystems system connector 616 mechanically couples and connects thepistons pistons pistons pistons - It should be noted that in this embodiment, the diameter of the
first cylinder 618 and thethird cylinder 658 is larger than the diameter of thesecond cylinder 626. This allows thesystems second system 604 to adjust for shifts in the center of gravity of thefirst assembly 606 and/or adjust for a change in atmospheric pressure. Further, the diameter of thefirst cylinder 618 and thethird cylinder 658 are approximately the same. Alternately, for example, the diameter of thefirst cylinder 618 and thethird cylinder 658 can be different. - A
first clamp 638 of thefirst system 602 includes an aperture or multiple apertures so that the pressure below each thefirst piston 620 is equal to the atmospheric pressure. Further, athird clamp 664 of thethird system 605 includes an aperture or multiple apertures so that the pressure below the third piston is equal to the atmospheric pressure. For thefirst system 602, thefirst piston 620 cooperates with thefirst cylinder 618 and thefirst seal 622 to define afirst chamber 642 above thefirst piston 620. Somewhat similarly, thesecond piston 628 cooperates with thesecond cylinder 626 and thesecond seal 630 to define asecond chamber 644 below thesecond piston 628. Further, thethird piston 660 cooperates with thethird cylinder 658 and the third seal to define athird chamber 645 above thethird piston 660. - The vacuum sources 610 are in fluid communication with the
first chamber 642 and thethird chamber 645 and thefluid source 612 is in fluid communication with thesecond chamber 644. The control system 28 (illustrated inFIG. 1 ) actively controls thevacuum sources 610 to control the pressures in thechambers fluid source 612 to control the pressure in thesecond chamber 644. More specifically, in this embodiment, thecontrol system 28 controls thevacuum source 610 of eachsystem chambers first piston 620 and a third chamber pressure above thethird piston 660 is less than the atmospheric pressure. The amount of differential between the pressures and the atmospheric pressure can be varied. Typically, atmospheric pressure is approximately 14.7 psi. With this design, the pressure differential is less than approximately 14.7 psi and typically between approximately 14.65 psi and 14.68 psi.FIG. 6B illustrates that thefirst system 602 and thethird system 605 each includes aseparate vacuum source 610. With this design, the first chamber pressure in eachchamber chambers system chamber first chamber 642 is substantially equal to the pressure in thethird chamber 645. - Somewhat similarly, the
control system 28 actively controls thefluid source 612 to add fluid to thesecond chamber 644 so that the second chamber pressure in thesecond chamber 644, below thesecond piston 628 is greater than the atmospheric pressure above thesecond piston 628. The amount of differential between the second chamber pressure and the atmospheric pressure can be varied. The pressure differential is typically between approximately 0 psi and 60 psi. - Stated another way, the
control system 28 actively controls and adjusts the pressure in each of thechambers control system 28 can easily adjust the force characteristics and the height of thevibration isolator 600. It should be noted that thesystems second system 604 is used to adjust for shifts in a center of gravity of thefirst assembly 606 or a change in atmospheric pressure. - The
system connector 616 mechanically and rigidly connects thepistons pistons system connector 616 can be varied to suit the design requirements of thevibration isolator 600. In this embodiment, some of the components of thesystem connector 616 are formed as part of thepistons FIG. 6B , thesystem connector 616 includes (i) a rigid,upper connector shaft 646U that extends and cantilevers downward from thesecond piston 628 along the axes 634, 636 to thefirst piston 620, (ii) anupper shaft attacher 648U, e.g. a plurality of bolts, that secure the bottom of theupper connector shaft 646U to thefirst piston 620, and (iii) anupper connector seal 650U that allows the upper shaft attacher 648U to extend through thechambers first chamber 642 from thesecond chamber 644, (iv) a rigid, lower connector shaft 646L that extends and cantilevers downward from thefirst piston 620 along the axes 634, 637 to thethird piston 660, (ii) alower shaft attacher 648L, e.g. a plurality of bolts, that secure the bottom of the lower connector shaft 646L to thethird piston 660, and (iii) a lower connector seal 650L that allows thelower shaft attacher 648L to extend through thechamber 645 while sealing thechambers 645. Anupper connector clamp 652U seals an outer perimeter of theupper connector seal 650U to the top of thefirst cylinder 618 and an inner perimeter of theupper connector seal 650U is sealed to theupper connector shaft 646U, and alower connector clamp 652L seals an outer perimeter of the lower connector seal 650L to the top of thethird cylinder 658 and an inner perimeter of the lower connector seal 650L is sealed to the lower connector shaft 646L. -
FIG. 7A illustrates a side view of another embodiment of avibration isolator 700 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 700 includes a first system 702 (illustrated in phantom) and asecond system 704. Thefirst system 702 supports at least a portion of afirst assembly 706 relative to asecond assembly 708 and thesecond system 704 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 706. In this embodiment,first system 702 is a repulsion type assembly and thesecond system 704 is a fluid type actuator that includes afluid source 712. Thus, thefirst system 702 function differently from thesecond system 704. The design of the components of thevibration isolator 700 can be varied to suit the intended use of thevibration isolator 700. -
FIG. 7B illustrates a cross-sectional, perspective view of thevibration isolator 700 ofFIG. 7A . In this embodiment, thevibration isolator 700 includes asystem connector 716 that directly couples thefirst system 702 to thesecond system 704 so that thesystems - In
FIG. 7B , thesecond system 704 includes asecond cylinder 726, asecond piston 728, asecond seal 730, and thefluid source 712 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . Alternately, for example, thesecond system 704 can include (i) a mover assembly (not shown) similar to that illustrated inFIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated inFIG. 4B and described above, and/or (iii) an attraction type system (not shown) similar to that illustrated inFIG. 7C that utilizes a magnet section and a spaced apart magnetically permeable section. - The
first system 702 includes a firstpermanent magnet section 732, and a spaced apart, secondpermanent magnet section 734. In this embodiment, thefirst magnet section 732 includes a single, generally right cylindrical shaped permanent magnet that is secured and coupled to thesystem connector 716. In this embodiment, thesecond magnet section 734 is generally tubular shaped and encircles a portion of thefirst magnet section 732. Themagnet sections first magnet section 732 is repulsed by thesecond magnet section 734. In this design, themagnet sections magnet section - Further, the
control system 28 actively controls thefluid source 712 to add or remove fluid from thecylinder 726. With this design, thecontrol system 28 can adjust the damping characteristics, adjust for changes in the center of gravity, and the height of thevibration isolator 700. It should be noted that thefirst system 702 is again designed to carry the majority of the load of thefirst assembly 706. - Additionally, with this embodiment, a mover (not shown) such as a voice coil motor can be added in series with the
vibration isolator 700 to better control a high bandwith dynamic load. - The
system connector 716 mechanically and rigidly connects thesecond piston 728 to the firstmagnetic section 732. The design of thesystem connector 716 can be varied to suit the design requirements of thevibration isolator 700. InFIG. 7B , thesystem connector 716 includes (i) a rigid,upper connector shaft 760 that extends and cantilevers downward from the second piston 728 (ii) alower connector shaft 762 that extends up from the secondmagnetic section 732, (iii) ashaft attacher 764, e.g. a plurality of bolts, that secure the bottom of theshafts connector seal 766, and (v) aconnector clamp 768. -
FIG. 7C illustrates a side cross-sectional view of yet another embodiment of avibration isolator 770 that can be used in the isolation systems 66, 68, 70, 72 ofFIG. 1 . In this embodiment, thevibration isolator 770 includes afirst system 772 and asecond system 774 that is coupled to thefirst system 772. Thefirst system 702 supports at least a portion of afirst assembly 776 relative to asecond assembly 778 and thesecond system 774 adjusts for a change and/or shift in the location of a center of gravity of thefirst assembly 776. Additionally, thefirst system 772 and thesecond system 774 are positioned on opposite sides of thefirst assembly 776. In this embodiment,first system 772 is an attraction type assembly and thesecond system 774 is a fluid type actuator that includes afluid source 782. Thus, thefirst system 772 functions differently from thesecond system 774. The design of the components of thevibration isolator 770 can be varied to suit the intended use of thevibration isolator 770. - In
FIG. 7C , thesecond system 774 includes acylinder 786, apiston 788, aseal 790, and thefluid source 782 that are similar to the corresponding components described above and illustrated inFIGS. 2A-2D . Alternately, for example, thesecond system 774 can include (i) a mover assembly (not shown) similar to that illustrated inFIG. 3B and described above, (ii) a mass adjuster (not shown) similar to that illustrated inFIG. 4B and described above, and/or (iii) a repulsion type assembly (not shown) similar to that illustrated inFIGS. 7A and 7B that utilizes a first permanent magnet section and a spaced apart second permanent magnet section. - The
first system 772 includes amagnet section 794, and a spaced apart magneticallypermeable section 796. In this embodiment, themagnet section 794 is generally right cylindrical shaped and is secured and coupled to thefirst assembly 776. Themagnet section 794 can include one or more permanent magnets such as NdFeB. Also, in this embodiment, the magneticallypermeable section 796 is generally tubular shaped and encircles a portion of themagnet section 794. The magneticallypermeable section 796 is made from a material that is attracted to themagnet section 794. Suitable materials include iron or steel. With this design, thepermeable section 796 is attracted to themagnet section 794. - In this design, the
magnet section 794 and thepermeable section 796 are designed and tested to provide the desired amount of force. Further, thecontrol system 28 actively controls thefluid source 782 to add or remove fluid from thecylinder 786. With this design, thecontrol system 28 can adjust the damping characteristics, adjust for changes in the center of gravity, and the height of thevibration isolator 770. It should be noted that thefirst system 772 is again designed to carry the majority of the load of thevibration isolator 770. - Additionally, with this embodiment, a mover (not shown) such as a voice coil motor can be added in series with the
vibration isolator 700 to better control a high bandwith dynamic load. - Alternately, the magnetically
permeable section 796 could be replaced with a permanent magnet configured to provide a repulsive force with themagnetic section 794. Or, the magneticallypermeable section 796 and themagnet section 794 could be reversed. - The photolithography system (an exposure apparatus) and the vibration isolators illustrated in the Figures can be built by assembling various subsystems, including each element listed in the appended claims, in such a manner that prescribed mechanical accuracy, electrical accuracy, and optical accuracy are maintained. In order to maintain the various accuracies, prior to and following assembly, every optical system is adjusted to achieve its optical accuracy. Similarly, every mechanical system and every electrical system are adjusted to achieve their respective mechanical and electrical accuracies. The process of assembling each subsystem into a photolithography system includes mechanical interfaces, electrical circuit wiring connections and air pressure plumbing connections between each subsystem. Needless to say, there is also a process where each subsystem is assembled prior to assembling a photolithography system from the various subsystems. Once a photolithography system is assembled using the various subsystems, a total adjustment is performed to make sure that accuracy is maintained in the complete photolithography system. Additionally, it is desirable to manufacture an exposure system in a clean room where the temperature and cleanliness are controlled.
- Further, semiconductor devices can be fabricated using the above described systems, by the process shown generally in
FIG. 8A . Instep 801, the device's function and performance characteristics are designed. Next, instep 802, a mask (reticle) having a pattern is designed according to the previous designing step, and in aparallel step 803, a wafer is made from a silicon material. The mask pattern designed instep 802 is exposed onto the wafer fromstep 803 instep 804 by a hotolithography system described hereinabove in accordance with the present invention. Instep 805, the semiconductor device is assembled (including the dicing process, bonding process and packaging process), finally, the device is then inspected instep 806. -
FIG. 8B illustrates a detailed flowchart example of the above-mentionedstep 804 in the case of fabricating semiconductor devices. InFIG. 8B , in step 811 (oxidation step), the wafer surface is oxidized. In step 812 (CVD step), an insulation film is formed on the wafer surface. In step 813 (electrode formation step), electrodes are formed on the wafer by vapor deposition. In step 814 (ion implantation step), ions are implanted in the wafer. The above mentioned steps 811-814 form the preprocessing steps for wafers during wafer processing, and selection is made at each step according to processing requirements. - At each stage of wafer processing, when the above-mentioned preprocessing steps have been completed, the following post-processing steps are implemented. During post-processing, first, in step 815 (photoresist formation step), photoresist is applied to a wafer. Next, in step 816 (exposure step), the above-mentioned exposure device is used to transfer the circuit pattern of a mask (reticle) to a wafer. Then, in step 817 (developing step), the exposed wafer is developed, and in step 818 (etching step), parts other than residual photoresist (exposed material surface) are removed by etching. In step 819 (photoresist removal step), unnecessary photoresist remaining after etching is removed. Multiple circuit patterns are formed by repetition of these preprocessing and post-processing steps.
- While the particular vibration isolator and exposure apparatus as herein shown and disclosed in detail is fully capable of obtaining the objects and providing the advantages herein before stated, it is to be understood that it is merely illustrative of the presently preferred embodiments of the invention and that no limitations are intended to the details of construction or design herein shown other than as described in the appended claims.
Claims (109)
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US10/186,876 US7095482B2 (en) | 2001-03-27 | 2002-06-28 | Multiple system vibration isolator |
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US09/818,163 US6731372B2 (en) | 2001-03-27 | 2001-03-27 | Multiple chamber fluid mount |
US10/186,876 US7095482B2 (en) | 2001-03-27 | 2002-06-28 | Multiple system vibration isolator |
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US09/818,163 Continuation-In-Part US6731372B2 (en) | 2001-03-27 | 2001-03-27 | Multiple chamber fluid mount |
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US20060126039A9 true US20060126039A9 (en) | 2006-06-15 |
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US20040140415A1 (en) * | 2003-01-21 | 2004-07-22 | Nikon Corporation | Vibration-attenuation devices having low lateral stiffness, and apparatus comprising same |
TW200500813A (en) * | 2003-02-26 | 2005-01-01 | Nikon Corp | Exposure apparatus and method, and method of producing device |
US7125128B2 (en) * | 2004-01-26 | 2006-10-24 | Nikon Corporation | Adaptive-optics actuator arrays and methods for using such arrays |
IL161900A (en) * | 2004-05-09 | 2011-01-31 | Rami Ben Maimon | Vacuum pump vibration isolator |
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US7095482B2 (en) | 2006-08-22 |
US20040000215A1 (en) | 2004-01-01 |
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