US20060196639A1 - Heatsink assembly - Google Patents

Heatsink assembly Download PDF

Info

Publication number
US20060196639A1
US20060196639A1 US11/073,079 US7307905A US2006196639A1 US 20060196639 A1 US20060196639 A1 US 20060196639A1 US 7307905 A US7307905 A US 7307905A US 2006196639 A1 US2006196639 A1 US 2006196639A1
Authority
US
United States
Prior art keywords
heat
heatsink
pillar
buckle
thermal pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/073,079
Inventor
Chih-Kai Yang
Frank Wang
Yi-Lun Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Corp
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to US11/073,079 priority Critical patent/US20060196639A1/en
Assigned to INVENTEC CORPORATION reassignment INVENTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, YI-LUN, WANG, FRANK, YANG, CHIH-KAI
Publication of US20060196639A1 publication Critical patent/US20060196639A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heatsink assembly of electronic devices, applied to heat-dissipating which heat generated by chipset, particularly used in a computer.
  • FIG. 1 shows a perspective view of a conventional heatsink device, composed of a heat conduction module and a fan module.
  • the heat conduction module comprises a thermal pad 211 , a heat transfer member 23 and heatsink fins 24 .
  • the fan module 30 composed of a fan and a casing.
  • the heat conduction module thermally conducts heat from a heat-generating component such as CPU or video chipset, etc., via the thermal plate.
  • the heat generated from the heat conduction module thermally conducts the heat through the heat transfer member (heat pip), to the heatsink fins; wherein the heatsink fins are constructed with a plurality of parallel fins, and the radiate area can be increased.
  • the exchange of heat occurs between the heatsink fins and cooling wind generated by means of the fan module. The heat is expelled from the computer in order to achieve cooling objectives.
  • the heatsink device is positioned on CPU or on video chipset of mother board, via thermal pad of heatsink device closely attached to the surface of the CPU or video chipset in order to perform the thermally-conducting and heat-dissipating function; however, due to high request to the display function of interface card in portable notebook computer, interface cards is tending to upgrade to insert card as desk computer, resulted the conventional heatsink device is not suitable anymore.
  • the heatsink assembly not only can fix the interface card to avoid damage occurred during carry or movement the portable notebook computer, but also can dissipate the heat generated by a video chip or a graphic chip in a interface card when it is operating.
  • the present invention provides a heatsink assembly comprising a heat conduction member, a heat transfer member and heatsink fins, the heat conduction member comprising a thermal pad and a clip.
  • the thermal pad is a well thermal conductive metal plate, connected with heat source component of electric device.
  • the side engaged with heat source component having at least one buckle pillar and a screw pillar.
  • the clip of heat conduction member is constructed of a pair of spring plate and a pair of beam.
  • the spring plate corresponds to each of buckle pillar having a buckle and corresponds to each of screw pillar having a screwed hole.
  • the heat transfer member, one side engaged with thermal pad, the other side engaged with heatsink fins is used to transfer the heat generated from thermal pad to the heatsink fins.
  • the heatsink fins expel the heat from heat transfer member by the cooling wind from fan module.
  • the thermal pad supports clip by at least one of the buckle pillar and one of the screw pillar; the clip connected with the buckle pillar and the screw pillar, fixed the heat source component, to let the heat generated surface of the heat source component, connect with the thermal pad in heat conductive manner.
  • FIG. 1 shows an exploded perspective view of one embodiment of conventional heatsink device
  • FIG. 2 shows a perspective view of one embodiment of the present invention of the heatsink assembly
  • FIG. 3 shows a perspective view of one embodiment of the fan module and a heatsink supporter
  • FIG. 4 shows a perspective view of one embodiment of the present invention of heatsink assembly connected with a fan module and a heatsink supporter;
  • FIG. 5 shows an exploded perspective view of one embodiment of present invention of a heatsink assembly and an interface card
  • FIG. 6 shows a perspective view of a present invention of heatsink assembly connected with a interface card
  • FIG. 7 shows a sectional view A-A of one embodiment of the present invention of heatsink assembly connected with display card.
  • FIG. 2 shows a perspective view of one embodiment of the present invention of the heatsink assembly, utilized in an electronic device to dissipate heat from heat source component (video chipset or graphic chipset), comprised: a heat conduction member 21 , a heat transfer member 23 and heatsink fins 24 ; further to a heat conduction member 21 comprises a thermal pad 211 and a clip 216 .
  • heat source component video chipset or graphic chipset
  • a thermal pad 211 of heat conduction member 21 is a well thermally conductive plate, utilized to thermal conductive connection with a surface generated heat from heat source component 51 of electronic device, to dissipate heat during operation from heat source component 51 wherein has a video chipset or graphic chipset.
  • the thermal pad 211 is usually made of a copper or an aluminum, to have better thermal conductive effect.
  • one side of the thermal pad 211 connected with heat source component 51 has at least one buckle pillar 212 and one crew pillar 214 .
  • those pillars are pressed on the thermal pad 211 .
  • Near the top of a buckle pillar 212 has a horizontal ring curve 213
  • And on the top of a screw pillar 214 will has a screw hole 215 .
  • the clip 216 is constructed of a pair of spring plate 217 and a pair of beam 222 ; the beam 222 is applied to hold still the spring plate 217 ; the spring plate 217 , a cure plate, having a buckle 219 to connect with each buckle pillar 212 .
  • the buckle 219 is designed to have a buckle portion 220 and a extend portion 221 .
  • the heat transfer member 23 is to transfer the heat generated heat from thermal pad 211 to heatsink fins 24 ; one of the heat transfer member 23 is preferred to be a heat pipe.
  • the heatsink fins 24 connected with the other side of heat transfer member 23 , is composed of a plurality of parallel fins where are vertical connected with heat transfer member 23 .
  • Each fin is a thin slice shape.
  • FIG. 3 shows a perspective view of a fan module and a heatsink support
  • FIG. 4 shows a perspective view of one embodiment of the present invention of heatsink assembly connect with fan module and heatsink support; from above illustrations, the embodiment of present invention of heatsink assembly 20 , supported by heatsink support 40 , can hold stable with thermal pad 211 and heat source component 51 ; and via fan module 30 offered the cooling wind to dissipate the heat gathered by heatsink fins 24 , can be expelled efficiency.
  • FIG. 5 shows an exploded perspective view of one embodiment of the present invention of a heatsink assembly and an interface card
  • FIG. 6 shows a combined perspective view of embodiment of the present invention of heatsink assembly and an interface card
  • the an interface card 50 is suchlike a display interface card (VGA) or a graphic interface card (MXM) etc; a display chipset or graphic chipset of interface card 50 is down below interface card 50 .
  • the interface card 50 is via a slot 61 of mother board 60 to connect with mother board 60 .
  • the buckle pillar 212 and screw pillar 214 of thermal pad 211 can easy get through the hole 52 ; after that, buckle 219 of the clip 216 can connect with ring curve 213 of buckle pillar 212 ; and screwed hole 218 of the clip 216 , aim at the screw hole 215 of screw pillar 214 , can screw on the screw pillar 214 via the screw to tighten them.
  • the buckle 219 having a buckle potion 220 and a extend potion 221 , via extend potion 221 space, the buckle 219 can be more easy to aim at buckle pillar 212 .
  • Plus spring plate 217 of clip 216 is a curve plate; when clip 216 one side is connected with the buckle pillar 212 , the other side is screwed into the screw pillar 214 , the tension will be occurred when clip be pressured. Via wherein the tension, the interface card can be stably hold.
  • FIG. 7 shows a sectional combined perspective view in A-A line of embodiment of the present invention of the heatsink assembly and a display interface card; via practicing the present invention of heatsink assembly, the surface, heat generated from the heat source component 51 of interface card 50 , can closely attach to thermal pad 211 .

Abstract

This present invention related to a heatsink structure, used to dissipate heat from heat source component, comprises a heat conduction member, a heat transfer member and heatsink fins. Wherein the heat conduction member comprises a thermal pad and a clip; and the thermal pad, one of the sides connected with the heat source component, having at least one buckle pillar and one screw pillar. The heat transfer member, one side connected with the thermal pad in heat conductive manner. The heatsink fins connected with the other side of heat transfer member. The present invention uses the buckle pillar and screw pillar of the thermal pad to support the clip. The clip, connected with the buckle pillar and the screw pillar, can fix the heat source component and enable the surface heat generated from the heat source component connected with a thermal pad in heat conductive manner.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heatsink assembly of electronic devices, applied to heat-dissipating which heat generated by chipset, particularly used in a computer.
  • 2. Description of the Related Art
  • Accompany with the continuous upgrade in operation ability and speed of the Central Processing Unit (CPU) or video chipset of computer, the large quantity of those electronic component's operation results in a high temperature occurred. However, there is a temperature limit for each electronic component; the high temperature not only will reduce the working efficiency of the electronic component, but also may damage or even burnout the electronic component. Therefore, the heat-dissipating issue becomes one of important step in the product design of a computer. In order that the computer may work at a normal temperature, a heatsink assembly has been a necessary component in a notebook computer.
  • Referring to FIG. 1 shows a perspective view of a conventional heatsink device, composed of a heat conduction module and a fan module. The heat conduction module comprises a thermal pad 211, a heat transfer member 23 and heatsink fins 24. The fan module 30 composed of a fan and a casing.
  • The heat conduction module thermally conducts heat from a heat-generating component such as CPU or video chipset, etc., via the thermal plate.
  • The heat generated from the heat conduction module thermally conducts the heat through the heat transfer member (heat pip), to the heatsink fins; wherein the heatsink fins are constructed with a plurality of parallel fins, and the radiate area can be increased. The exchange of heat occurs between the heatsink fins and cooling wind generated by means of the fan module. The heat is expelled from the computer in order to achieve cooling objectives.
  • Usually, the heatsink device is positioned on CPU or on video chipset of mother board, via thermal pad of heatsink device closely attached to the surface of the CPU or video chipset in order to perform the thermally-conducting and heat-dissipating function; however, due to high request to the display function of interface card in portable notebook computer, interface cards is tending to upgrade to insert card as desk computer, resulted the conventional heatsink device is not suitable anymore.
    • SUMMARY OF THE INVENTION
  • It is an object to provide a heatsink assembly, used in a thermal module for an interface card. By this invention practices, the heatsink assembly not only can fix the interface card to avoid damage occurred during carry or movement the portable notebook computer, but also can dissipate the heat generated by a video chip or a graphic chip in a interface card when it is operating.
  • To reach above, the present invention provides a heatsink assembly comprising a heat conduction member, a heat transfer member and heatsink fins, the heat conduction member comprising a thermal pad and a clip. The thermal pad is a well thermal conductive metal plate, connected with heat source component of electric device. The side engaged with heat source component having at least one buckle pillar and a screw pillar. The clip of heat conduction member is constructed of a pair of spring plate and a pair of beam. The spring plate corresponds to each of buckle pillar having a buckle and corresponds to each of screw pillar having a screwed hole. The heat transfer member, one side engaged with thermal pad, the other side engaged with heatsink fins, is used to transfer the heat generated from thermal pad to the heatsink fins. The heatsink fins expel the heat from heat transfer member by the cooling wind from fan module. The thermal pad supports clip by at least one of the buckle pillar and one of the screw pillar; the clip connected with the buckle pillar and the screw pillar, fixed the heat source component, to let the heat generated surface of the heat source component, connect with the thermal pad in heat conductive manner.
  • Thus, the implementation of the present invention brings forth at least the following desirable results:
    • 1. The heat from interface card can be dissipated efficiently when it is operating.
    • 2. The heatsink assembly can stable combine together with interface card.
    • 3. The assembly process will be more simple and efficiency when the heatsink assembly connects with interface card.
    BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will become more fully understood from the detailed description given below for illustration only, and thus are not limitative of the present invention, and wherein:
  • FIG. 1 shows an exploded perspective view of one embodiment of conventional heatsink device;
  • FIG. 2 shows a perspective view of one embodiment of the present invention of the heatsink assembly;
  • FIG. 3 shows a perspective view of one embodiment of the fan module and a heatsink supporter;
  • FIG. 4 shows a perspective view of one embodiment of the present invention of heatsink assembly connected with a fan module and a heatsink supporter;
  • FIG. 5 shows an exploded perspective view of one embodiment of present invention of a heatsink assembly and an interface card;
  • FIG. 6 shows a perspective view of a present invention of heatsink assembly connected with a interface card; and
  • FIG. 7 shows a sectional view A-A of one embodiment of the present invention of heatsink assembly connected with display card.
    • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 2, shows a perspective view of one embodiment of the present invention of the heatsink assembly, utilized in an electronic device to dissipate heat from heat source component (video chipset or graphic chipset), comprised: a heat conduction member 21, a heat transfer member 23 and heatsink fins 24; further to a heat conduction member 21 comprises a thermal pad 211 and a clip 216.
  • A thermal pad 211 of heat conduction member 21 is a well thermally conductive plate, utilized to thermal conductive connection with a surface generated heat from heat source component 51 of electronic device, to dissipate heat during operation from heat source component 51 wherein has a video chipset or graphic chipset. Enable to achieve the heat conductive well, the thermal pad 211, is usually made of a copper or an aluminum, to have better thermal conductive effect.
  • Enable to close connected with heat source component 51, one side of the thermal pad 211 connected with heat source component 51, has at least one buckle pillar 212 and one crew pillar 214. To stable connect with thermal pad 211, those pillars are pressed on the thermal pad 211. Near the top of a buckle pillar 212 has a horizontal ring curve 213
    Figure US20060196639A1-20060907-P00900
    And on the top of a screw pillar 214 will has a screw hole 215.
  • The clip 216, is constructed of a pair of spring plate 217 and a pair of beam 222; the beam 222 is applied to hold still the spring plate 217; the spring plate 217, a cure plate, having a buckle 219 to connect with each buckle pillar 212. For each screw pillar 214, having a screwed hole 218 therein; Enable to simple connect with clip 216 and buckle pillar 212, the buckle 219 is designed to have a buckle portion 220 and a extend portion 221.
  • The heat transfer member 23, one side connected with thermal pad 211, is to transfer the heat generated heat from thermal pad 211 to heatsink fins 24; one of the heat transfer member 23 is preferred to be a heat pipe.
  • The heatsink fins 24, connected with the other side of heat transfer member 23, is composed of a plurality of parallel fins where are vertical connected with heat transfer member 23. Each fin is a thin slice shape.
  • Referring to FIG. 3 shows a perspective view of a fan module and a heatsink support; referring to FIG. 4 shows a perspective view of one embodiment of the present invention of heatsink assembly connect with fan module and heatsink support; from above illustrations, the embodiment of present invention of heatsink assembly 20, supported by heatsink support 40, can hold stable with thermal pad 211 and heat source component 51; and via fan module 30 offered the cooling wind to dissipate the heat gathered by heatsink fins 24, can be expelled efficiency.
  • Referring to FIG. 5 shows an exploded perspective view of one embodiment of the present invention of a heatsink assembly and an interface card; and referring to FIG. 6 shows a combined perspective view of embodiment of the present invention of heatsink assembly and an interface card; wherein the an interface card 50, is suchlike a display interface card (VGA) or a graphic interface card (MXM) etc; a display chipset or graphic chipset of interface card 50 is down below interface card 50. The interface card 50 is via a slot 61 of mother board 60 to connect with mother board 60. By use the hole 52 set on interface card 50, the buckle pillar 212 and screw pillar 214 of thermal pad 211 can easy get through the hole 52; after that, buckle 219 of the clip 216 can connect with ring curve 213 of buckle pillar 212; and screwed hole 218 of the clip 216, aim at the screw hole 215 of screw pillar 214, can screw on the screw pillar 214 via the screw to tighten them.
  • As the clip 216 is connected with ring curve 213 of buckle pillar 212. The buckle 219 having a buckle potion 220 and a extend potion 221, via extend potion 221 space, the buckle 219 can be more easy to aim at buckle pillar 212. Plus spring plate 217 of clip 216 is a curve plate; when clip 216 one side is connected with the buckle pillar 212, the other side is screwed into the screw pillar 214, the tension will be occurred when clip be pressured. Via wherein the tension, the interface card can be stably hold.
  • Referring to FIG. 7 shows a sectional combined perspective view in A-A line of embodiment of the present invention of the heatsink assembly and a display interface card; via practicing the present invention of heatsink assembly, the surface, heat generated from the heat source component 51 of interface card 50, can closely attach to thermal pad 211.
  • Those described above are only the preferred embodiments of the present invention, and it is no intended to limit the scope of the present invention. And equivalent variation and modification according to the appended claims of the present invention would not depart from the spirit of the present invention and is to be included within the scope of the present invention.

Claims (9)

1. A heatsink assembly, connected with a fan module, used to dissipating the heat produced by heat source component in an electronic device, comprising:
a heat conduction member, said heat conduction member further comprising:
a thermal pad, one of the side connected with said heat source component, having at least one buckle pillar and one screw pillar;
a clip having a pair of spring plate and a pair of beam, wherein said spring plate corresponding to each of said buckle pillar having a buckle and corresponding to each of said screw pillar having a screwed hole;
a heat transfer member, one side connects with said thermal pad; and
heatsink fins, wherein said heatsink fins connect with the other side of said heat transfer member, wherein said thermal pad supported said clip by said buckle pillar and screw pillar, and said clip, connected with said buckle pillar and said screw pillar, fixed said heat source component and enabled the surface, heat generated from said heat source component, connected with said thermal pad in heat conductive manner.
2. The heatsink assembly as claimed in claim 1, wherein said thermal pad is a plate.
3. The heatsink assembly as claimed in claim 1, wherein said thermal pad is made of copper or aluminum.
4. The heatsink assembly as claimed in claim 1, wherein said buckle pillar and screw pillar are connected with thermal pad.
5. The heatsink assembly as claimed in claim 1, wherein said spring plate is a curve spring plate.
6. The heatsink assembly as claimed in claim 1, wherein said heat transfer member is a heat pipe.
7. The heatsink assembly as claimed in claim 1, wherein said heatsink fins are constructed of a plurality of parallel fins, vertical with said heat transfer member.
8. The heatsink assembly as claimed in claim 7, wherein said heatsink fin is a sheet shape.
9. The heatsink assembly as claimed in claim 1, wherein said buckle includes a buckle potion and an extend potion:
US11/073,079 2005-03-04 2005-03-04 Heatsink assembly Abandoned US20060196639A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/073,079 US20060196639A1 (en) 2005-03-04 2005-03-04 Heatsink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/073,079 US20060196639A1 (en) 2005-03-04 2005-03-04 Heatsink assembly

Publications (1)

Publication Number Publication Date
US20060196639A1 true US20060196639A1 (en) 2006-09-07

Family

ID=36943015

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/073,079 Abandoned US20060196639A1 (en) 2005-03-04 2005-03-04 Heatsink assembly

Country Status (1)

Country Link
US (1) US20060196639A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060221569A1 (en) * 2005-03-31 2006-10-05 Inventec Corporation Heat dissipating structure of interface card
US20100123372A1 (en) * 2008-11-14 2010-05-20 Metal Industries Research & Development Centre Motor integrated to electronic device
US20130234566A1 (en) * 2008-11-14 2013-09-12 Metal Industries Research & Development Center Motor integrated to electronic device

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US6426874B2 (en) * 1999-12-10 2002-07-30 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor device mounting structure and feeding-side charger with heat radiating unit
US6442025B2 (en) * 2000-01-07 2002-08-27 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
US6438984B1 (en) * 2001-08-29 2002-08-27 Sun Microsystems, Inc. Refrigerant-cooled system and method for cooling electronic components
US20020149913A1 (en) * 2001-02-28 2002-10-17 Hiroshi Nakamura Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US6587343B2 (en) * 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
US6646881B1 (en) * 2002-06-06 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Mounting assembly for heat sink
US6650540B2 (en) * 2001-11-29 2003-11-18 Kabushiki Kaisha Toshiba Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit
US20040012927A1 (en) * 2002-07-18 2004-01-22 Hsieh-Kun Lee Heat sink assembly with adjustable clip
US6778396B2 (en) * 2002-07-26 2004-08-17 Hon Hai Precision Ind. Co., Ltd Retaining device for heat sink
US20050024832A1 (en) * 2002-09-09 2005-02-03 Lee Hsieh Kun Heat sink clip with pressing post
US7274572B2 (en) * 2005-04-26 2007-09-25 Inventec Corporation Supporting plate
US7277293B2 (en) * 2005-04-11 2007-10-02 Inventec Corporation Heat sink conduction apparatus

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US6426874B2 (en) * 1999-12-10 2002-07-30 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor device mounting structure and feeding-side charger with heat radiating unit
US6442025B2 (en) * 2000-01-07 2002-08-27 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US20020149913A1 (en) * 2001-02-28 2002-10-17 Hiroshi Nakamura Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit
US6587343B2 (en) * 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
US6438984B1 (en) * 2001-08-29 2002-08-27 Sun Microsystems, Inc. Refrigerant-cooled system and method for cooling electronic components
US6650540B2 (en) * 2001-11-29 2003-11-18 Kabushiki Kaisha Toshiba Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit
US6646881B1 (en) * 2002-06-06 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Mounting assembly for heat sink
US20040012927A1 (en) * 2002-07-18 2004-01-22 Hsieh-Kun Lee Heat sink assembly with adjustable clip
US6778396B2 (en) * 2002-07-26 2004-08-17 Hon Hai Precision Ind. Co., Ltd Retaining device for heat sink
US20050024832A1 (en) * 2002-09-09 2005-02-03 Lee Hsieh Kun Heat sink clip with pressing post
US7277293B2 (en) * 2005-04-11 2007-10-02 Inventec Corporation Heat sink conduction apparatus
US7274572B2 (en) * 2005-04-26 2007-09-25 Inventec Corporation Supporting plate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060221569A1 (en) * 2005-03-31 2006-10-05 Inventec Corporation Heat dissipating structure of interface card
US7272000B2 (en) * 2005-03-31 2007-09-18 Inventec Corporation Heat dissipating structure of interface card
US20100123372A1 (en) * 2008-11-14 2010-05-20 Metal Industries Research & Development Centre Motor integrated to electronic device
US20130234566A1 (en) * 2008-11-14 2013-09-12 Metal Industries Research & Development Center Motor integrated to electronic device
US9257876B2 (en) * 2008-11-14 2016-02-09 Metal Industries Research & Development Centre Motor integrated to electronic device

Similar Documents

Publication Publication Date Title
US7212404B2 (en) Integrated heat sink device
US6860321B2 (en) Heat-dissipating device
US7304846B2 (en) Heatsink device of video graphics array and chipset
TWI274985B (en) Extendable cooling apparatus
US7656665B2 (en) Integrated heat-dissipating device for portable electronic product
US7640968B2 (en) Heat dissipation device with a heat pipe
JP4562770B2 (en) Heat sink, circuit board, electronic equipment
US20060152904A1 (en) Industrial computer with aluminum case having fins as radiating device
US8520393B2 (en) Apparatuses and methods for dissipating heat from a computer component
US20080035311A1 (en) Cooler system
US20110075369A1 (en) Electronic device
US20080007914A1 (en) Heat dissipation device
US8120917B2 (en) Heat dissipation device
US20040216306A1 (en) Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink
US10401925B2 (en) Portable information apparatus
US7495923B2 (en) Heat dissipation device having fixing bracket
US7277293B2 (en) Heat sink conduction apparatus
US7382615B2 (en) Heat dissipation device
US20060196639A1 (en) Heatsink assembly
US20140353460A1 (en) Fixing assembly
US20120298329A1 (en) Heat sink device and air flow adjusting frame for the same
WO2003060677A1 (en) Heat sink in a personal computer
US7729120B2 (en) Heat sink apparatus
CN101196772A (en) Radiator rear panel module and circuit board and electronic device using the same
KR100313310B1 (en) Portable computer with the dissipating apparatus of electronic system

Legal Events

Date Code Title Description
AS Assignment

Owner name: INVENTEC CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, CHIH-KAI;WANG, FRANK;CHENG, YI-LUN;REEL/FRAME:016362/0753

Effective date: 20050222

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION