US20060246646A1 - MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact - Google Patents
MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact Download PDFInfo
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- US20060246646A1 US20060246646A1 US11/479,369 US47936906A US2006246646A1 US 20060246646 A1 US20060246646 A1 US 20060246646A1 US 47936906 A US47936906 A US 47936906A US 2006246646 A1 US2006246646 A1 US 2006246646A1
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 44
- 229920005591 polysilicon Polymers 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000002161 passivation Methods 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000009413 insulation Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 55
- 229910021332 silicide Inorganic materials 0.000 description 9
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000002411 adverse Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
Definitions
- the present invention relates to a MOS device and to a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact.
- simultaneous fabrication in a same integrated device of dual-layer polysilicon memory cells and transistors requires removal of the polysilicon layer overlying the dielectric and of the intermediate dielectric layer in the circuitry area, where the transistors or the electrical connection are made, or forming an electrical connection between the first and the second polysilicon layers for the individual transistors.
- U.S. Pat. No. 4,719,184 filed in the name of the present applicant, describes a process, referred to as the double-poly-short-circuited (DPCC) process, which enables short-circuiting between the first and second polysilicon layers.
- DPCC double-poly-short-circuited
- part of the interpoly-dielectric layer is removed in the circuitry area, using a purposely designed mask referred to as “matrix mask”.
- matrix mask enables removal of all of the interpoly dielectric on top of the active area of the transistors, or in preset portions, on top of or outside the active area. In this way, when the second polysilicon layer is deposited, it directly contacts the first polysilicon layer where the interpoly dielectric has been removed.
- connection region the production of which requires two masking and etching steps.
- FIGS. 1 and 2 illustrate, respectively, a top view and a cross-section of a MOS transistor obtained using the process described.
- a body 1 of semiconductor material, has an insulation region 2 surrounding an active area 3 ( FIG. 1 ).
- a stack 4 extends on top of the body 1 and comprises ( FIG. 2 ): a gate-oxide region 5 ; a poly1 region 6 ; an interpoly-dielectric region 7 ; a poly2 region 8 ; and a silicide region 9 .
- Spacing regions 10 are formed at the sides of the stack 4 , and a passivation layer 11 extends on top of the body 1 .
- a plug 12 extends through the passivation layer 11 as far as the stack 4 .
- FIG. 1 moreover illustrates the shape of the mask that enables forming the first hole, which has an opening 15 that allows the removal of a portion of the silicide region 9 , the poly2 region 8 , and the interpoly region 7 .
- these regions have a width smaller than the poly1 region 6 , as may be seen in the cross-section of FIG. 2 .
- FIG. 1 moreover illustrates the shape of the mask that enables forming the first hole, which has an opening 15 that allows the removal of a portion of the silicide region 9 , the poly2 region 8 , and the interpoly region 7 .
- these regions have a width smaller than the poly1 region 6 , as may be seen in the cross-section of FIG. 2 .
- FIG. 1 moreover illustrates a subsequent mask having, i.e., an opening 12 a for the plug 12 , which is staggered with respect to the opening 15 , and in particular is set on top of both of the remaining portions of the silicide region 9 and the poly2 region 8 and on top of the portion of the poly1 region 6 not overlaid by the silicide region 9 and the poly2 region 8 to ensure the polysilicon regions 6 , 8 to be electrically connected by the plug 12 .
- the plug 12 thus has a step at the silicide layer 9 and, in its bottom part, alongside the regions 7 to 9 , has a cross-sectional area much smaller than the top part (on top of the stack 4 ).
- One aim of the present invention is to provide a manufacturing process which does not require specially designed masks for contacting the two polysilicon layers in the circuitry transistors built using a dual polysilicon-layer technology.
- MOS device and a process for manufacturing MOS devices, as defined in claims 1 , 6 13 and 18 respectively.
- FIG. 1 illustrates the layout of a MOS transistor made with a dedicated mask for connecting the two polysilicon layers
- FIG. 2 is a cross-sectional view of the transistor of FIG. 1 ;
- FIG. 3 illustrates the layout of a first embodiment of the transistor according to the invention
- FIG. 4 illustrates the layout of a second embodiment of the transistor according to the invention
- FIG. 5 illustrates the layout of a third embodiment of the transistor according to the invention.
- FIGS. 6 to 9 illustrate cross-sectional views, taken along line IX-IX of FIG. 3 , but valid also for the embodiments of FIGS. 4 and 5 , in successive manufacturing steps of the transistor according to the invention.
- just one mask is used, and precisely the mask already used for opening the contacts, and the contact is made using a conductive region or plug extending through the dielectric layer which coats the substrate laterally with respect to the polysilicon layers, according to what is illustrated in FIGS. 3 to 9 .
- FIGS. 3 to 5 illustrate, hatchings, an active area 32 , accommodating source and drain regions 41 (illustrated only schematically), contacted using plugs 22 .
- a stack 40 extends transversely to the active area 32 and includes two polysilicon regions electrically connected to one another by two electrical connection regions 24 , as described in greater detail hereinafter with reference to FIGS. 6-9 . Both the stack 40 and the electrical connection regions 24 have a rectangular shape, with the electrical connection regions 24 partially overlapping the ends of the stack 40 .
- FIG. 3 illustrates a solution wherein the electrical connection regions 24 have a length equal to the width of the stack 40 , i.e., they have the same size in the Y direction, and are aligned to the stack 40 .
- FIG. 4 illustrates a solution wherein the electrical connection regions 24 have a length equal or similar to the width of the stack 40 , but are staggered laterally with respect to the latter.
- FIG. 5 illustrates a solution wherein the electrical connection regions 24 are rotated with respect to FIGS. 3 and 4 and have a width (in the Y direction) smaller than the width of the stack 40 .
- the process initially comprises standard fabrication steps, which include: defining the active areas 32 , forming field insulation regions, for example using a shallow-trench technique; depositing a gate-oxide layer; depositing a first polycrystalline-silicon layer (poly1 layer); depositing an interpoly-dielectric layer; depositing a second polysilicon layer (poly2 layer); depositing a silicide layer; defining the gate stack 40 using a stack-definition mask; and selectively removing portions of the silicide layer, poly2 layer, interpoly dielectric layer, poly1 layer, and gate oxide layer.
- an LDD implant is performed, and spacers are formed on the sides of the gate stack.
- the source and drain regions 41 are implanted, and then, a passivation layer is deposited.
- the structure thus obtained is illustrated in FIG. 6 and comprises: a semiconductor body 30 having a surface 30 a ; a field insulation region 31 , which delimits, inside the semiconductor body 30 , an active area 32 ; and a stack 40 , extending on top of the surface 30 a of the semiconductor body 30 .
- the stack 40 comprises a gate oxide region 33 ; a poly1 region 34 , arranged on top of the gate oxide region 33 ; an interpoly dielectric region 35 , arranged on top of the poly1 region 34 and formed by a triple ONO (oxide-nitride-oxide) layer; a poly2 region 36 , arranged on top of the interpoly-dielectric region 35 ; and a silicide region 37 , for example of tungsten silicide, arranged on top of the poly2 region 36 .
- ONO oxide-nitride-oxide
- Spacing regions 38 are formed at the sides of the stack 40 and a passivation layer 45 , of dielectric material, for example oxide, is present on top of the semiconductor body 30 and surrounds the stack 40 .
- the stack 40 has an elongated rectangular shape extending transversely to the active area 32 ; in particular, the stack 40 has a central portion extending on top of the active area 32 and end portions extending on top of the field insulation region 31 .
- the source and drain regions 41 arranged on the sides of the stack 40 , inside the active area 32 , are not visible in FIG. 6 .
- the contact mask is made, and the contacts are opened.
- a photoresist layer is deposited and defined, so as to have openings where the contacts are to be formed, as illustrated in FIGS. 3-5 and 7 , showing the resist mask 47 and the contact openings 48 .
- the openings for connecting the poly1 region 34 and the poly2 region 36 are designated by 48 a .
- the openings 48 a are formed on top of the field insulation region 31 , outside the active area 32 . The position of the openings 48 a varies according to whether the aim is to obtain the geometry of FIG. 3 , FIG. 4 or FIG. 5 .
- FIG. 7 illustrates the minimum dimension D of the width (in the X direction) of each opening 48 a , and hence of the electrical-connection regions 24 that are still to be formed.
- the sizes of the openings 48 a are greater than those of the openings 48 designed to form the vias towards the regions in the active area (for example, towards the source and drain regions 41 and towards gate regions of the memory cells, not illustrated).
- the vias extending toward the semiconductor body 30 are formed partially on top of the stack 40 and enable a better cleaning of the walls of the stack 40 , as indicated below.
- the passivation layer 45 and the spacers 38 are etched, forming vias 50 , which extend from the surface of the passivation layer 45 as far as the surface 30 a of the semiconductor body 30 .
- the structure of FIG. 8 is thus obtained.
- Etching of the passivation layer 45 thus cause formation of both the vias necessary for contacting the conductive regions of the device (in particular the source and drain regions), and the vias exposing the side walls of the ends of the stack 40 at least partially (according to the position of the openings 48 a , illustrated in FIGS. 3 to 5 ).
- the conservation of the correct morphology of the stack 40 is ensured by the good selectivity of the chemical agents used for etching the oxide of the passivation layer 45 and the spacers 38 with respect to the materials of the regions that form the stack 40 , and hence with respect to the silicide and to the polysilicon.
- the underlying insulation region 31 will be etched slightly on account of a slight over-etching.
- the extremely small size of the resulting over-etching does not adversely affect the functionality of the device considering the vertical dimensions of the insulation region 31 .
- a barrier layer 51 for example of Ti/TiN
- a metal layer 52 for example tungsten
- the metal layer 52 filling the vias 50 to form, together with the barrier layer 51 , the plug 22 contacting the various regions of the transistor as well as electrical connection regions 24 in the vias 50 .
- the metal layer 52 is then removed from the surface of the passivation layer 45 .
- metal layer is deposited to obtain metal connection regions (metal 1 ); if desired, connections are made at more than one level of metallization, and the usual final manufacturing operations are carried out.
- the electrical connection regions 24 have a first width (in the X direction) equal to that of the openings 48 a in the top area, on top of the stack 40 , and a second width (also in the X direction) smaller than the first width, in the bottom area, where they extend on the sides of the poly1 region 34 and poly2 region 36 and electrically connect these two latter regions.
- the poly1 region 34 and poly2 region 36 have approximately the same size in the X direction (according to the verticality of the gate etch), and the electrical connection regions 24 form a step where they encounter the stack 40 .
- the larger size of the vias 50 as compared to those of the vias leading to the other regions of the device enables, during contact etching, cleaning of the walls of the stack 40 from any possible oxidation that might form on the stack 40 and that could adversely affect the operation of the transistor, and thus ensures electrical continuity between the poly1 region 34 and the poly2 region 36 .
- the larger dimensions may compensate any possible misalignment and any possible process variations, as explained above. In this way, the contact is ensured between the poly1 region 34 and the poly2 region 36 , and consequently the process offers good reliability.
- Etching of the passivation layer 45 requires just one etching mask, and just one etching chemistry is sufficient; consequently, the manufacturing process is considerably less costly than the processes currently used.
- a possible partial removal of the insulation region 31 does not, on the other hand, adversely affect the functionality of the device, since the electrical connection regions 24 are made at a distance from the active area 32 and, thanks to the good selectivity of the etching process, the insulation region 31 is not etched to an important extent. It follows that the process is reliable and does not present any particular critical aspects.
- the number of electrical connection regions 24 may vary, and electrical connection regions 24 may be provided on both sides of the active area 32 .
- the same solution may be used for the electrical connection of two polysilicon layers in other types of devices integrated together with dual-polysilicon layer memory cells.
- the via 50 may be made also on the edge of the stack 40 , instead of inside the stack 40 .
Abstract
A process for manufacturing a MOS device is described. The process comprising: providing a body of semiconductor material having a surface; forming a stack on the surface of the body, the stack including a first polysilicon region, an intermediate dielectric region arranged on top of the first polysilicon region, and a second polysilicon region arranged on top of the intermediate dielectric region; depositing a passivation layer on top of and laterally to the stack; and forming at least one electrical connection region in direct electrical contact with the first and second polysilicon regions, wherein the electrical connection region is formed laterally with respect to both the first and second polysilicon regions.
Description
- 1. Field of the Invention
- The present invention relates to a MOS device and to a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact.
- 2. Description of the Related Art
- As is known, simultaneous fabrication in a same integrated device of dual-layer polysilicon memory cells and transistors requires removal of the polysilicon layer overlying the dielectric and of the intermediate dielectric layer in the circuitry area, where the transistors or the electrical connection are made, or forming an electrical connection between the first and the second polysilicon layers for the individual transistors.
- In particular, U.S. Pat. No. 4,719,184, filed in the name of the present applicant, describes a process, referred to as the double-poly-short-circuited (DPCC) process, which enables short-circuiting between the first and second polysilicon layers. According to the aforesaid process, after deposition of the first polysilicon layer and of an interpoly-dielectric layer, part of the interpoly-dielectric layer is removed in the circuitry area, using a purposely designed mask referred to as “matrix mask”. This mask enables removal of all of the interpoly dielectric on top of the active area of the transistors, or in preset portions, on top of or outside the active area. In this way, when the second polysilicon layer is deposited, it directly contacts the first polysilicon layer where the interpoly dielectric has been removed.
- According to a further possibility, the electrical connection between the first and second polysilicon layers is obtained using a connection region, the production of which requires two masking and etching steps. In fact, first it is necessary to remove part of the second polysilicon layer and of the interpoly-dielectric layer so as to expose part of the first polysilicon layer, and then to open the vias through the passivation layer, for forming the connection region.
- The above solution is represented in
FIGS. 1 and 2 , which illustrate, respectively, a top view and a cross-section of a MOS transistor obtained using the process described. InFIGS. 1 and 2 , abody 1, of semiconductor material, has aninsulation region 2 surrounding an active area 3 (FIG. 1 ). Astack 4 extends on top of thebody 1 and comprises (FIG. 2 ): a gate-oxide region 5; apoly1 region 6; an interpoly-dielectric region 7; a poly2 region 8; and a silicide region 9.Spacing regions 10 are formed at the sides of thestack 4, and apassivation layer 11 extends on top of thebody 1. Aplug 12 extends through thepassivation layer 11 as far as thestack 4. -
FIG. 1 moreover illustrates the shape of the mask that enables forming the first hole, which has anopening 15 that allows the removal of a portion of the silicide region 9, the poly2 region 8, and theinterpoly region 7. Thus, these regions have a width smaller than thepoly1 region 6, as may be seen in the cross-section ofFIG. 2 .FIG. 1 moreover illustrates a subsequent mask having, i.e., anopening 12 a for theplug 12, which is staggered with respect to the opening 15, and in particular is set on top of both of the remaining portions of the silicide region 9 and the poly2 region 8 and on top of the portion of thepoly1 region 6 not overlaid by the silicide region 9 and the poly2 region 8 to ensure thepolysilicon regions 6, 8 to be electrically connected by theplug 12. Theplug 12 thus has a step at the silicide layer 9 and, in its bottom part, alongside theregions 7 to 9, has a cross-sectional area much smaller than the top part (on top of the stack 4). - Both for the solution just described and for the solution described in the U.S. Pat. No. 4,719,184, it is disadvantageous that two masks are necessary for electrically connecting poly1 and poly2, and hence the costs of fabrication are high.
- One aim of the present invention is to provide a manufacturing process which does not require specially designed masks for contacting the two polysilicon layers in the circuitry transistors built using a dual polysilicon-layer technology.
- According to the present invention, there are provided a MOS device and a process for manufacturing MOS devices, as defined in
claims - For a better understanding of the invention, the embodiments thereof are now described, purely by way of non-limiting example, with reference to the attached drawings, wherein:
-
FIG. 1 illustrates the layout of a MOS transistor made with a dedicated mask for connecting the two polysilicon layers; -
FIG. 2 is a cross-sectional view of the transistor ofFIG. 1 ; -
FIG. 3 illustrates the layout of a first embodiment of the transistor according to the invention; -
FIG. 4 illustrates the layout of a second embodiment of the transistor according to the invention; -
FIG. 5 illustrates the layout of a third embodiment of the transistor according to the invention; and - FIGS. 6 to 9 illustrate cross-sectional views, taken along line IX-IX of
FIG. 3 , but valid also for the embodiments ofFIGS. 4 and 5 , in successive manufacturing steps of the transistor according to the invention. - According to one aspect of the invention, for electrically connecting polysilicon layers, just one mask is used, and precisely the mask already used for opening the contacts, and the contact is made using a conductive region or plug extending through the dielectric layer which coats the substrate laterally with respect to the polysilicon layers, according to what is illustrated in FIGS. 3 to 9.
- In particular, FIGS. 3 to 5 illustrate, hatchings, an
active area 32, accommodating source and drain regions 41 (illustrated only schematically), contacted usingplugs 22. Astack 40 extends transversely to theactive area 32 and includes two polysilicon regions electrically connected to one another by twoelectrical connection regions 24, as described in greater detail hereinafter with reference toFIGS. 6-9 . Both thestack 40 and theelectrical connection regions 24 have a rectangular shape, with theelectrical connection regions 24 partially overlapping the ends of thestack 40. -
FIG. 3 illustrates a solution wherein theelectrical connection regions 24 have a length equal to the width of thestack 40, i.e., they have the same size in the Y direction, and are aligned to thestack 40.FIG. 4 illustrates a solution wherein theelectrical connection regions 24 have a length equal or similar to the width of thestack 40, but are staggered laterally with respect to the latter.FIG. 5 illustrates a solution wherein theelectrical connection regions 24 are rotated with respect toFIGS. 3 and 4 and have a width (in the Y direction) smaller than the width of thestack 40. - Next, with reference to FIGS. 5 to 9, a manufacturing process, of self-aligned type, is described. The process initially comprises standard fabrication steps, which include: defining the
active areas 32, forming field insulation regions, for example using a shallow-trench technique; depositing a gate-oxide layer; depositing a first polycrystalline-silicon layer (poly1 layer); depositing an interpoly-dielectric layer; depositing a second polysilicon layer (poly2 layer); depositing a silicide layer; defining thegate stack 40 using a stack-definition mask; and selectively removing portions of the silicide layer, poly2 layer, interpoly dielectric layer, poly1 layer, and gate oxide layer. In the process described, an LDD implant is performed, and spacers are formed on the sides of the gate stack. Next, the source anddrain regions 41 are implanted, and then, a passivation layer is deposited. - The structure thus obtained is illustrated in
FIG. 6 and comprises: asemiconductor body 30 having asurface 30 a; afield insulation region 31, which delimits, inside thesemiconductor body 30, anactive area 32; and astack 40, extending on top of thesurface 30 a of thesemiconductor body 30. - The
stack 40 comprises agate oxide region 33; apoly1 region 34, arranged on top of thegate oxide region 33; an interpolydielectric region 35, arranged on top of thepoly1 region 34 and formed by a triple ONO (oxide-nitride-oxide) layer; apoly2 region 36, arranged on top of the interpoly-dielectric region 35; and asilicide region 37, for example of tungsten silicide, arranged on top of thepoly2 region 36.Spacing regions 38, for example of oxide and/or nitride, are formed at the sides of thestack 40 and apassivation layer 45, of dielectric material, for example oxide, is present on top of thesemiconductor body 30 and surrounds thestack 40. - As is evident from FIGS. 3 to 5, the
stack 40 has an elongated rectangular shape extending transversely to theactive area 32; in particular, thestack 40 has a central portion extending on top of theactive area 32 and end portions extending on top of thefield insulation region 31. - The source and
drain regions 41, arranged on the sides of thestack 40, inside theactive area 32, are not visible inFIG. 6 . - Next, the contact mask is made, and the contacts are opened. To this end, a photoresist layer is deposited and defined, so as to have openings where the contacts are to be formed, as illustrated in
FIGS. 3-5 and 7, showing theresist mask 47 and thecontact openings 48. In particular, the openings for connecting thepoly1 region 34 and thepoly2 region 36 are designated by 48 a. As may be noted, theopenings 48 a are formed on top of thefield insulation region 31, outside theactive area 32. The position of theopenings 48 a varies according to whether the aim is to obtain the geometry ofFIG. 3 ,FIG. 4 orFIG. 5 . - The position and the size of the
openings 48 a must be studied also taking into account the possible misalignment between the stack-definition mask and thecontact mask 47; moreover, also the process tolerances regarding the two masks must be considered.FIG. 7 illustrates the minimum dimension D of the width (in the X direction) of eachopening 48 a, and hence of the electrical-connection regions 24 that are still to be formed. - In detail, we have:
D≧Dis+T1+T2,
where Dis is the possible misalignment between the stack definition mask and thecontact mask 47, T1 is the dimensional tolerance linked to the process for the stack-definition mask, and T2 is the dimensional tolerance linked to the process for thecontact mask 47. - As may be noted from the layouts of FIGS. 3 to 5, the sizes of the
openings 48 a are greater than those of theopenings 48 designed to form the vias towards the regions in the active area (for example, towards the source anddrain regions 41 and towards gate regions of the memory cells, not illustrated). However, the vias extending toward thesemiconductor body 30 are formed partially on top of thestack 40 and enable a better cleaning of the walls of thestack 40, as indicated below. - Using the resist
mask 47, thepassivation layer 45 and thespacers 38 are etched, formingvias 50, which extend from the surface of thepassivation layer 45 as far as thesurface 30 a of thesemiconductor body 30. The structure ofFIG. 8 is thus obtained. - Etching of the
passivation layer 45 thus cause formation of both the vias necessary for contacting the conductive regions of the device (in particular the source and drain regions), and the vias exposing the side walls of the ends of thestack 40 at least partially (according to the position of theopenings 48 a, illustrated in FIGS. 3 to 5). - In this latter step, the conservation of the correct morphology of the
stack 40 is ensured by the good selectivity of the chemical agents used for etching the oxide of thepassivation layer 45 and thespacers 38 with respect to the materials of the regions that form thestack 40, and hence with respect to the silicide and to the polysilicon. After the etching of the passivation layer, it is possible that theunderlying insulation region 31 will be etched slightly on account of a slight over-etching. However, the extremely small size of the resulting over-etching does not adversely affect the functionality of the device considering the vertical dimensions of theinsulation region 31. - Next (
FIG. 9 ), abarrier layer 51, for example of Ti/TiN, and ametal layer 52, for example tungsten, are deposited in succession; themetal layer 52 filling thevias 50 to form, together with thebarrier layer 51, theplug 22 contacting the various regions of the transistor as well aselectrical connection regions 24 in thevias 50. Themetal layer 52 is then removed from the surface of thepassivation layer 45. - Finally, in a known way, a metal layer is deposited to obtain metal connection regions (metal 1); if desired, connections are made at more than one level of metallization, and the usual final manufacturing operations are carried out.
- As may be seen from
FIG. 9 , theelectrical connection regions 24 have a first width (in the X direction) equal to that of theopenings 48 a in the top area, on top of thestack 40, and a second width (also in the X direction) smaller than the first width, in the bottom area, where they extend on the sides of thepoly1 region 34 andpoly2 region 36 and electrically connect these two latter regions. In practice, thepoly1 region 34 andpoly2 region 36 have approximately the same size in the X direction (according to the verticality of the gate etch), and theelectrical connection regions 24 form a step where they encounter thestack 40. - The device and the process described herein have the advantages outlined hereinafter.
- The larger size of the vias 50 as compared to those of the vias leading to the other regions of the device enables, during contact etching, cleaning of the walls of the
stack 40 from any possible oxidation that might form on thestack 40 and that could adversely affect the operation of the transistor, and thus ensures electrical continuity between thepoly1 region 34 and thepoly2 region 36. - The larger dimensions may compensate any possible misalignment and any possible process variations, as explained above. In this way, the contact is ensured between the
poly1 region 34 and thepoly2 region 36, and consequently the process offers good reliability. - Etching of the
passivation layer 45 requires just one etching mask, and just one etching chemistry is sufficient; consequently, the manufacturing process is considerably less costly than the processes currently used. - A possible partial removal of the
insulation region 31 does not, on the other hand, adversely affect the functionality of the device, since theelectrical connection regions 24 are made at a distance from theactive area 32 and, thanks to the good selectivity of the etching process, theinsulation region 31 is not etched to an important extent. It follows that the process is reliable and does not present any particular critical aspects. - All of the above U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in the Application Data Sheet, are incorporated herein by reference, in their entirety.
- Finally, it is evident that modifications and variations may be made to the transistor and to the process described herein, without thereby departing from the scope of the present invention. For example, the number of
electrical connection regions 24 may vary, andelectrical connection regions 24 may be provided on both sides of theactive area 32. Furthermore, the same solution may be used for the electrical connection of two polysilicon layers in other types of devices integrated together with dual-polysilicon layer memory cells. In addition, the via 50 may be made also on the edge of thestack 40, instead of inside thestack 40.
Claims (14)
1. A process for manufacturing a MOS device comprising:
providing a body of semiconductor material having a surface;
forming a stack on said surface of said body, said stack including a first polysilicon region, an intermediate dielectric region arranged on top of said first polysilicon region, and a second polysilicon region arranged on top of said intermediate dielectric region;
depositing a passivation layer on top of and laterally to said stack; and
forming at least one electrical connection region in direct electrical contact with said first and second polysilicon regions, wherein said electrical connection region is formed laterally with respect to both said first and second polysilicon regions.
2. The process according to claim 1 wherein said electrical connection region extends substantially as far as said surface of said body.
3. The process according to claim 1 wherein said step of forming at least one electrical connection region comprises the steps of:
forming a contact mask;
forming, using said contact mask, at least one via extending in said passivation layer laterally with respect to said first and second polysilicon regions and with respect to said intermediate dielectric region; and
filling said via with conductive material.
4. The process according to claim 3 wherein said step of filling comprises depositing a barrier layer on walls and on the bottom of said via and filling said via with metal material.
5. The process according to claim 1 wherein said step of forming a stack comprises forming a gate region of a MOS transistor.
6. The process according to claim 5 , further comprising, prior to said step of forming a stack, forming, in said body, a field insulation region delimiting an active area, wherein said step of forming a gate region comprises forming an elongated structure having a central portion extending on top of said active area and end portions extending on top of said field insulation region, and wherein said electrical connection region is formed on top of said field insulation region.
7. The process according to claim 6 wherein said step of forming at least one electrical connection region comprises the steps of:
forming a contact mask;
forming, using said contact mask, a plurality of vias extending in said passivation layer, said plurality of vias including at least one first via extending laterally with respect to said first and second polysilicon regions and to said intermediate dielectric region, and second vias extending as far as conductive regions inside said active area; and
filling said plurality of vias with conductive material.
8. A process comprising:
providing a body of semiconductor material having a surface;
forming a stack on top of said body, said stack having a top surface, a bottom surface, first, second, third and forth side, said bottom surface being in contact with said surface of said semiconductor material, said stack comprising a first polysilicon region, an intermediate dielectric region being arranged on top of said first polysilicon region, and a second polysilicon region being arranged on top of said intermediate dielectric region;
depositing a passivation layer on top of and laterally to said stack and said semiconductor body; and
forming at least one electrical connection region in direct electrical contact with said first and second polysilicon regions and said electrical connection region extending through said passivation layer and further extending substantially as far as said surface of said semiconductor body.
9. The process according to claim 8 wherein the electrical connection region is in contact with first and second polysilicon region by contacting said first side of the stack.
10. The process according to claim 8 wherein at least part of the electrical connection region terminates on the top surface of said stack and present a step.
11. A process for manufacturing a MOS device comprising:
forming a field insulation region and an active area in a semiconductor substrate;
forming a stack overlying the semiconductor substrate, the stack having a top surface and lateral sides, a central portion of the stack extending on top of the active area and an end portion of the stack extending on top of the field insulation region, the stack including a first polysilicon region, an intermediate dielectric region and a second polysilicon;
covering the top surface and lateral sides of the stack with a passivation layer;
forming a contact mask on top of the passivation layer, the contact mask defining an opening;
etching a via defined by the opening to extend through an entire height of the passivation layer and laterally with respect to the stack; and
forming a electrical connection region in the via, the electrical connection region being in electrical contact with the first polysilicon region and the second polysilicon region.
12. The process of claim 11 wherein the electrical connection region extends substantially to the field insulation region of the semiconductor substrate.
13. The process of claim 11 further comprising forming a barrier layer in the via.
14. The process of claim 11 wherein a portion of the electrical connection region terminates on the top surface of the stack.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/479,369 US20060246646A1 (en) | 2002-12-24 | 2006-06-29 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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IT001118A ITTO20021118A1 (en) | 2002-12-24 | 2002-12-24 | MOS DEVICE AND MANUFACTURING PROCEDURE OF |
ITTO2002A001118 | 2002-12-24 | ||
US10/745,297 US7091570B2 (en) | 2002-12-24 | 2003-12-23 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
US11/479,369 US20060246646A1 (en) | 2002-12-24 | 2006-06-29 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
Related Parent Applications (1)
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US10/745,297 Division US7091570B2 (en) | 2002-12-24 | 2003-12-23 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
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US20060246646A1 true US20060246646A1 (en) | 2006-11-02 |
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US10/745,297 Expired - Lifetime US7091570B2 (en) | 2002-12-24 | 2003-12-23 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
US11/479,369 Abandoned US20060246646A1 (en) | 2002-12-24 | 2006-06-29 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
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US10/745,297 Expired - Lifetime US7091570B2 (en) | 2002-12-24 | 2003-12-23 | MOS device and a process for manufacturing MOS devices using a dual-polysilicon layer technology with side contact |
Country Status (3)
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US (2) | US7091570B2 (en) |
EP (1) | EP1434258B1 (en) |
IT (1) | ITTO20021118A1 (en) |
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ITTO20021118A1 (en) * | 2002-12-24 | 2004-06-25 | St Microelectronics Srl | MOS DEVICE AND MANUFACTURING PROCEDURE OF |
US8836035B2 (en) * | 2010-03-10 | 2014-09-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for reducing gate resistance |
US8723268B2 (en) | 2012-06-13 | 2014-05-13 | Synopsys, Inc. | N-channel and P-channel end-to-end finFET cell architecture with relaxed gate pitch |
US9515125B2 (en) * | 2015-04-24 | 2016-12-06 | Sony Corporation | Socket structure for three-dimensional memory |
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Also Published As
Publication number | Publication date |
---|---|
US20050116288A1 (en) | 2005-06-02 |
EP1434258A2 (en) | 2004-06-30 |
US7091570B2 (en) | 2006-08-15 |
ITTO20021118A1 (en) | 2004-06-25 |
EP1434258B1 (en) | 2011-07-20 |
EP1434258A3 (en) | 2004-12-15 |
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