US20070001859A1 - Method of manufacturing a contactless chip card with enhanced evenness - Google Patents
Method of manufacturing a contactless chip card with enhanced evenness Download PDFInfo
- Publication number
- US20070001859A1 US20070001859A1 US11/516,753 US51675306A US2007001859A1 US 20070001859 A1 US20070001859 A1 US 20070001859A1 US 51675306 A US51675306 A US 51675306A US 2007001859 A1 US2007001859 A1 US 2007001859A1
- Authority
- US
- United States
- Prior art keywords
- manufacturing
- chip
- antenna
- antenna support
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Abstract
Method of manufacturing a contactless chip card including an antenna support (40) on which the antenna is screenprinted and an electronic module or a chip (50) connected to the two antenna terminals and at least two card bodies on either side of antenna support, the antenna bodies being thermoplastic sheets (62, 64, 66, and 68) applied by hot pressure lamination, the sheet of thermoplastic (62) which is applied onto the face of the antenna support (40) receiving electronic module or chip (50) is perforated with a through-cavity (56) and its thickness is greater than the thickness of electronic module or chip (50), said cavity (56) being situated such that said electronic module or chip (50) is inside the cavity when said sheet (62) is placed on said support (40) before lamination step and such that electronic module or chip (50) is not subjected to any pressure during the lamination step.
Description
- The present invention relates to the methods of manufacturing contactless chip cards, and in particular to a method of manufacturing a contactless chip card with enhanced evenness.
- The contactless chip card is a system used increasingly in various sectors. Thus, in the transport sector, it has been developed as a means of payment. This is also the case of electronic purses. Many companies have also developed means for identifying their personnel using contactless chip cards.
- The exchange of information between a contactless card and the associated reading device is achieved by distance electromagnetic coupling between an antenna housed in the contactless card and a second antenna located in the reader or directly by contact with the reader. To develop, store and process the information, the card is equipped with an electronic module which is linked to the antenna. The antenna is located on a support situated between two card bodies, the outer faces of which are printed with the graphics relating to the subsequent use of the card. The antenna support is a plastic dielectric support or a support made of fibrous material such as paper. The method of manufacturing a contactless card further includes the following steps:
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- production of the antenna on a plastic support by chemically etching copper or aluminium or on a paper support by screen-printing,
- heat lamination under pressure of the lower and upper plastic layers of the card body, the outer faces of which are preprinted on the antenna support.
- In the case of the manufacturing method using an antenna support made of fibrous material and an antenna screen-printed on the antenna support, the card bodies are made up of two or three plastic layers, the two main layers of which have a different Vicat point (temperature at which PVC passes from a rigid state to a rubbery state). Indeed, the outer rigid PVC layer has a higher Vicat point than that of the inner layer. The inner layer, with a lower Vicat point than that of the outer layer, is in contact with the antenna support.
- The lamination step consists in stacking the different PVC layers making up the card bodies and the antenna support. This sandwich is then placed in a laminating press. The sandwich is then subjected to heat treatment at a temperature of approximately 150° C. At the same time, the sandwich is subjected to pressing so as to fuse the different layers. Under the combined action of the heat and the pressure, the outer PVC layer softens, while the inner layer made of a PVC with a lower Vicat point fluidises. The thus fluidised PVC of the inner layer of the card body which comes into contact with the antenna traps the screen-printed ink of the antenna in the mass and the fluidised PVC of the two inner layers of both card bodies come back into contact via cavity cut-outs made previously in the antenna support.
- Unfortunately, this manufacturing method has the disadvantage of subjecting the chip to stresses caused by the pressure exerted at the lamination step.
- In addition, this method also has an aesthetic disadvantage on the final appearance of the card. Indeed, during the fluidisation of the inner layer of the card bodies, the outer layer softens and conforms, by deforming to a lesser extent than the deformation undergone by the inner layer of PVC, to the shape of the reliefs of the antenna support resulting from the thickness of the antenna and the cavity cut-outs.
- Thus, the card obtained after lamination is not perfectly even and comprises reliefs. Naturally, these micron reliefs are not visible to the naked eye but they come out when the outer face of the outer layer of the card body is printed as tone changes in the colour of the printed graphics. Indeed, in the case of printed card bodies, during the lamination step of the card bodies onto the antenna support, the excessive thickness due to the antenna causes the impression points to be spaced apart resulting in brightening of the colour, and the cut-outs of the antenna support, into which the PVC of the inner layers of the card bodies flows, causes the impression points to be drawn closer together resulting in darkening of the colour. The exterior appearance of the card is gradated.
- This disadvantage also exists in the method of manufacturing contactless cards using a plastic antenna support onto which the antenna is produced by chemical etching. Indeed, in such a method, after lamination, the imprint of the copper tracks is visible on the printed card bodies, and the unevenness of the card, even on a micron scale, can be seen by the user's eye as deformations of the graphics.
- Without affecting the good operation of the card, this flaw in the final card appearance can be put forward by users who are extremely sensitive to aesthetic criteria.
- The aim of the invention is to provide a method for manufacturing contactless chip cards that prevents the chip from being subjected to stresses that may damage it.
- The invention therefore relates to a method of manufacturing a contactless chip card comprising an antenna support, two card bodies on either side of the antenna support and an electronic module or a chip linked to the antenna. This method is characterised in that it further includes:
- a first lamination step consisting in fusing onto each side of the antenna support two homogeneous sheets of thermoplastic by pressing at a temperature sufficient for the material of which the sheets are made to soften and flow wholly so as to eliminate any differences in thickness from the antenna support and to form a plasticised antenna support having even faces, and
- a second lamination step carried out after a period of time corresponding to the period of time necessary for the sheets of thermoplastic to be solidified, the second step consisting in fusing by hot pressing two plastic layers making up the card bodies onto the plasticised and even faces of the uniformly thick antenna support plasticised by the sheets of thermoplastic.
- The aims, objects and characteristics will become more apparent upon reading the following description with reference to the appended drawings in which:
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FIG. 1 shows the antenna support of a contactless chip card, -
FIG. 2 shows a section of the antenna support shown inFIG. 1 , along the axis B-B ofFIG. 1 , -
FIG. 3 shows a section of the plasticised antenna support of a contactless chip card, -
FIG. 4 shows a section of the contactless chip card according to the invention. - According to a preferred embodiment of the invention illustrated in
FIG. 1 , the antenna support is made of fibrous material such as paper and has a thickness of approximately 90 μm. The manufacture of the chip card according to the invention consists firstly in producing the antenna on itssupport 40. The antenna is made up of twoloops loop 42 being linked topad 36 and loop 44 topad 38. The loops are interlinked by an electric bridge more commonly known as a cross-over (not shown in the figure). Aninsulating strip 20 of dielectric ink is screen-printed between the cross-over and loop 42. In contrast to contact/contactless hybrid chips cards, contactless chip cards do not have an electronic module, a face of which is visible at the surface of the card, but an electronic module or achip 50 imbedded in the card. Electronic module orchip 50 is fixed ontoantenna support 40 and is directly connected tobonding pads support 40 not shown in the figure. The ohmic connection can be achieved with a conductive adhesive or without adhesive by simple contact.Antenna support 40 can also comprise tworecesses chip 50. - Thus,
antenna support 40 has cut-outs and/or cavities and reliefs due to the antenna being made up of screen-printed ink loops. As a result, both faces ofantenna support 40 are not even and more particularly the face onto which the antenna is screen-printed. Furthermore, antenna support 40 of a contactless only chip card comprises a notable relief due to electronic module orchip 50 as illustrated inFIG. 2 which shows a section ofantenna support 40 of a contactless chip card along axis B-B ofFIG. 1 . - The steps of the method according to the invention applied to a contactless chip card are similar to the steps of the method applied to a contact/contactless hybrid chip card. However, a variant of the method according to the invention applies to the case of contactless chip cards equipped with an electronic module or a
chip 50 and advantageously applies to acontactless chip card 50 equipped with achip 50 connected directly to the antenna and is illustrated in detail inFIGS. 2, 3 and 4. - A section of antenna support 40 of a contactless chip card is shown in
FIG. 2 . The first step of the method according to the invention consists in laminating two layers or sheets of thermoplastic onantenna support 40. This step is the first lamination phase of the various constituent layers of the card and is illustrated in section inFIG. 2 . This first lamination step consists in fusing by hot pressing two homogeneous sheets ofthermoplastic antenna support 40. The temperature and pressure reached are approximately 180° C. and 250 bars respectively. Sheet of thermoplastic 62 which is applied onto the face of the antenna support receiving electronic module orchip 50 is perforated with a through-cavity 56 and its thickness is greater than the thickness of electronic module orchip 50.Cavity 56 is situated on sheet of thermoplastic 62 such that electronic module orchip 50 is inside whensheet 62 is placed onsupport 40 before lamination and such that electronic module orchip 50 is not in contact withsheet 62.Cavity 56 is preferably circular. In the case of achip 50 with a thickness of 180 μm and a surface of 1.5 mm2 directly connected to the antenna, the thickness of layer ofthermoplastic 62 is equal to 200 μm and the diameter ofcavity 56 is equal to 3 mm. - Thus, during the first lamination step, the pressure is applied on sheet of thermoplastic 62 or 64 and not on
chip 50, such that it is not subjected to any stress which could damage it. The temperature must be sufficient for the material of whichsheets recesses support 40 and tocavity 56 and to trap the reliefs of the antenna support such as those due toloops - Thus, the reliefs of
antenna support 40 are trapped in the mass of the thermoplastic, thus forming aplasticised antenna support 60 with a thickness equal to approximately 400 μm. The possible cut-outs made previously on the antenna support further allow better fusion of both sheets ofthermoplastic antenna support 60 eliminates any differences in thickness fromoriginal antenna support 40. - The second lamination phase of the various constituent layers of the card consists in laminating two card bodies on each side of
plasticised antenna support 60 with reference toFIG. 4 . This second step, carried out after a certain period of time corresponding to the period of time necessary for sheets ofthermoplastic layers support 60. Bothcard bodies antenna support 60 has a uniform thickness, this step is more similar to adhesive bonding than fusing. As a result, the pressure and the temperature required in this phase are much lower than those used in a traditional method. The temperature and pressure required for this lamination step are only approximately 120° C. and 150 bars respectively. Furthermore, the duration of the pressurisation and heating cycles is also reduced. This step is the last manufacturing step of the contactless chip card. - According to a variant of the method of the invention applied to a contactless chip card, sheet of thermoplastic 64 which is applied onto the face of the antenna support opposite that receiving electronic module or
chip 50 can also be perforated with acavity 58.Cavity 58 is situated on sheet of thermoplastic 64 such that it is superposed at the location of electronic module orchip 50. In this case, during the first lamination step, the chip is completely protected from any stress due to the pressure applied on sheets ofthermoplastic - A second variant of the method according to the invention can be applied to a contactless chip card in the case where
cavity 56 is too large to be filled by the material of sheet of thermoplastic 62 during the first lamination step. In this case,antenna support 60 obtained after the first lamination step comprises a hollow due tocavity 56 and therefore is not even.Support 60 can therefore receive, at the location ofcavity 56, an epoxy-type resin to protect electronic module orchip 50 and makeplasticised antenna support 60 perfectly even. - The thermoplastic used for the constituent layers of the card bodies is most preferably polyvinyl chloride (PVC), but can also be polyester (PET, PETG), polypropylene (PP), polycarbonate (PC) or acrylonitrile-butadiene-styrene (ABS).
- It is important to specify that an antenna made up of metal loops on a plastic support such as polyester or polyamide or on an epoxy glass support is also in relief in relation to its support. The invention applies therefore to any type of antenna support and any type of antenna, and in particular to supports, the antenna of which appears in relief. The antenna support must be made up of a material, the dimensions of which remain stable irrespective of the temperature and notably of a material withstanding temperatures of approximately 180° C. without deforming or altering.
Claims (16)
1. A method of manufacturing a contactless chip card including an antenna support on which the antenna is screenprinted and an electronic module or a chip connected to the two antenna terminals and at least two card bodies on either side of said antenna support, the card bodies being thermoplastic sheets applied by hot pressure lamination
wherein the sheet of thermoplastic which is applied onto the face of the antenna support receiving electronic module or chip is perforated with a through-cavity and its thickness is greater than the thickness of electronic module or chip, said through-cavity being situated such that said electronic module or chip is inside the through-cavity when said sheet is placed on said support before the lamination step and such that said electronic module or chip is not subjected to any pressure during the lamination step.
2. A method of manufacturing a contactless chip card according to claim 1 , in which each of said card bodies comprises two sheets of thermoplastic applied onto said antenna support according to the following steps:
a first lamination step consisting in fusing a first homogeneous sheet of thermoplastic on each side of said antenna support by pressing at a temperature sufficient for the material of which the sheets are made to soften and to flow wholly so as to eliminate any differences in thickness from the antenna support and to form a plasticised antenna support having even faces, and
a second lamination step carried out after a period of time corresponding to the period of time necessary for said sheets of thermoplastic to be solidified, said second step consisting in fusing by hot pressing another sheet of thermoplastic onto each of the even faces of said plasticised antenna support.
3. The method of manufacturing a chip card according to claim 1 , in which said sheet of thermoplastic which is applied onto the face of the antenna support opposite that receiving the chip is perforated with a cavity, the cavity being situated on said sheet of thermoplastic such that it is superposed at the location of said electronic module or chip.
4. The method of manufacturing a chip card according to claim 1 , in which said support receives, at the location of cavity, an epoxy-type resin to protect said electronic module or chip and make said plasticised antenna support perfectly even.
5. The method of manufacturing a chip card according to claim 1 , in which said antenna support is made up of a material, the dimensions of which remain stable irrespective of the temperature.
6. The method of manufacturing a chip card according to claim 5 , in which said antenna support is made of plastic.
7. The method of manufacturing a chip card according to claim 5 , in which said antenna support is made of epoxy glass.
8. The method of manufacturing a chip card according to claim 5 , in which said antenna support is made of fibrous material.
9. The method of manufacturing a chip card according to claim 8 , in which the step of manufacturing the antenna comprises screen-printing loops of conductive polymer ink on said fibrous material support and in subjecting said support to heat treatment so as to cure said ink.
10. The method of manufacturing a chip card according to claim 9 in which, during the antenna manufacturing step, cavity cut-outs are made in said antenna support further allowing the fusion of both layers of thermoplastic together during the first lamination step.
11. The method of manufacturing a chip card according to claim 1 , in which said card bodies laminated on each side of said plasticised antenna support are preprinted with personalised card graphics.
12. The method of manufacturing a chip card according to claim 1 , in which, during the lamination step of the card bodies on said plasticised antenna support, a third plastic sheet or a layer of varnish is added onto each card body, acting as covering.
13. The method of manufacturing a chip card according to claim 1 , wherein the thermoplastic making up the card bodies is selected from the group consisting of polyvinyl chloride (PVC), polyester (PET, PETG), polypropylene (PP), polycarbonate (PC) and acrylonitrile-butadiene-styrene (ABS).
14. The method of manufacturing a chip card according to claim 5 , wherein said material can withstand temperatures of approximately 180° C. without deforming or altering.
15. The method of manufacturing a chip card according to claim 6 , wherein said plastic is polyester or polyamide.
16. The method of manufacturing a chip card according to claim 8 , wherein said fibrous material is paper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/516,753 US20070001859A1 (en) | 2002-09-13 | 2006-09-07 | Method of manufacturing a contactless chip card with enhanced evenness |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0211387A FR2844621A1 (en) | 2002-09-13 | 2002-09-13 | Method for manufacturing without contact or hybrid integrated circuit card, comprises application of two thermoplastic layers under temperature and pressure followed by two hot pressed plastic layers |
FR02/11387 | 2002-09-13 | ||
FR03/02258 | 2003-02-25 | ||
FR0302258A FR2844620B1 (en) | 2002-09-13 | 2003-02-25 | METHOD FOR MANUFACTURING CONTACTLESS CONTACTLESS CONTACT OR CONTACT HYBRID CARD WITH REINFORCED PLANE |
US10/498,914 US7116231B2 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
PCT/FR2003/002701 WO2004025553A1 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
US11/516,753 US20070001859A1 (en) | 2002-09-13 | 2006-09-07 | Method of manufacturing a contactless chip card with enhanced evenness |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2003/002701 Continuation WO2004025553A1 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
US10/498,914 Continuation US7116231B2 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
Publications (1)
Publication Number | Publication Date |
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US20070001859A1 true US20070001859A1 (en) | 2007-01-04 |
Family
ID=31947975
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/498,914 Expired - Fee Related US7116231B2 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
US11/516,753 Abandoned US20070001859A1 (en) | 2002-09-13 | 2006-09-07 | Method of manufacturing a contactless chip card with enhanced evenness |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/498,914 Expired - Fee Related US7116231B2 (en) | 2002-09-13 | 2003-09-12 | Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness |
Country Status (18)
Country | Link |
---|---|
US (2) | US7116231B2 (en) |
EP (1) | EP1442424B1 (en) |
JP (1) | JP2005538463A (en) |
KR (1) | KR100998605B1 (en) |
CN (1) | CN1596419A (en) |
AT (1) | ATE424008T1 (en) |
AU (1) | AU2003276333B2 (en) |
BR (1) | BRPI0306304B1 (en) |
CA (1) | CA2466898A1 (en) |
DE (1) | DE60326317D1 (en) |
ES (1) | ES2323695T3 (en) |
FR (2) | FR2844621A1 (en) |
IL (2) | IL161707A0 (en) |
MX (1) | MXPA04006195A (en) |
RU (2) | RU2415027C2 (en) |
TW (2) | TWI340919B (en) |
WO (1) | WO2004025553A1 (en) |
ZA (1) | ZA200403503B (en) |
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FR2844621A1 (en) * | 2002-09-13 | 2004-03-19 | A S K | Method for manufacturing without contact or hybrid integrated circuit card, comprises application of two thermoplastic layers under temperature and pressure followed by two hot pressed plastic layers |
EP1603757B1 (en) * | 2003-03-12 | 2014-12-10 | Bundesdruckerei GmbH | Method for the production of a book cover insert and book-type security document and book cover insert and book-type security document |
US7209039B2 (en) * | 2003-05-08 | 2007-04-24 | Illinois Tool Works Inc. | Decorative surface covering with embedded RF antenna and RF shield and method for making the same |
AU2005208313A1 (en) * | 2004-01-22 | 2005-08-11 | Mikoh Corporation | A modular radio frequency identification tagging method |
FR2877462B1 (en) * | 2004-10-29 | 2007-01-26 | Arjowiggins Security Soc Par A | STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT. |
JP2006244317A (en) * | 2005-03-04 | 2006-09-14 | Nippon Sheet Glass Co Ltd | Intermediate film for panel, panel, and electronic tag |
US7571862B2 (en) * | 2005-06-02 | 2009-08-11 | Avery Dennison Corporation | RFID tag that provides a flat print area and a pinch roller that enables the same |
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Also Published As
Publication number | Publication date |
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CN1596419A (en) | 2005-03-16 |
MXPA04006195A (en) | 2004-12-06 |
DE60326317D1 (en) | 2009-04-09 |
ATE424008T1 (en) | 2009-03-15 |
WO2004025553A1 (en) | 2004-03-25 |
BR0306304A (en) | 2004-09-28 |
CA2466898A1 (en) | 2004-03-25 |
TW200404261A (en) | 2004-03-16 |
FR2844620A1 (en) | 2004-03-19 |
RU2006132772A (en) | 2008-03-20 |
ZA200403503B (en) | 2005-06-29 |
RU2324976C2 (en) | 2008-05-20 |
AU2003276333B2 (en) | 2010-01-21 |
TW200705282A (en) | 2007-02-01 |
FR2844621A1 (en) | 2004-03-19 |
FR2844620B1 (en) | 2005-01-07 |
EP1442424A1 (en) | 2004-08-04 |
US20050066513A1 (en) | 2005-03-31 |
TWI351645B (en) | 2011-11-01 |
IL161707A0 (en) | 2004-09-27 |
RU2415027C2 (en) | 2011-03-27 |
TWI340919B (en) | 2011-04-21 |
ES2323695T3 (en) | 2009-07-23 |
BRPI0306304B1 (en) | 2015-10-27 |
KR20050039713A (en) | 2005-04-29 |
JP2005538463A (en) | 2005-12-15 |
US7116231B2 (en) | 2006-10-03 |
AU2003276333A1 (en) | 2004-04-30 |
KR100998605B1 (en) | 2010-12-07 |
IL161707A (en) | 2008-12-29 |
RU2004123973A (en) | 2006-01-20 |
EP1442424B1 (en) | 2009-02-25 |
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