US20070103144A1 - Calibration pattern and calibration jig - Google Patents
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- US20070103144A1 US20070103144A1 US11/615,173 US61517306A US2007103144A1 US 20070103144 A1 US20070103144 A1 US 20070103144A1 US 61517306 A US61517306 A US 61517306A US 2007103144 A1 US2007103144 A1 US 2007103144A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
- G01R35/007—Standards or reference devices, e.g. voltage or resistance standards, "golden references"
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an RF measurement method for a high frequency circuit, a calibration pattern, and a calibration jig and, in particular, relates to an RF measurement method for a high frequency circuit for use in a communication device adapted for a microwave band or a millimeter wave band that is used in mobile communication, optical communication, satellite communication, and the like, and further to a calibration pattern and a calibration jig.
- the RF measurement of the high frequency circuit is performed on-wafer.
- This on-wafer RF measurement normally uses two RF measurement probe heads, each having a signal terminal and a GND terminal, in such a manner as to confront each other. Therefore, an RF measurement probe head calibration pattern is required to have a calibration pattern that corresponds to the RF measurement probe heads to be used.
- the first one is of a type having three contacts including one signal terminal and GND terminals located on both sides of the signal terminal, respectively. This first one is called, for example, a GSG-type RF measurement probe head.
- the second one is of a type having two contacts including one signal terminal and one GND terminal wherein, as seeing the contacts from the side of a body of the RF measurement probe head, the signal terminal is arranged on the left side while the GND terminal is arranged on the right side.
- This second one is called, for example, an SG-type RF measurement probe head.
- the third one is of a type also having two contacts wherein, however, the signal terminal and the GND terminal in the second SG-type RF measurement probe head are interchanged in position, and therefore, as seeing the contacts from the side of a body of the RF measurement probe head, the GND terminal is arranged on the left side while the signal terminal is arranged on the right side.
- This third one is called, for example, a GS-type RF measurement probe head.
- the signal terminals confront each other and the GND terminals confront each other so that, by the use of a calibration pattern having one signal line with a predetermined characteristic impedance and two GND lines disposed along the signal line on one side thereof, the signal terminals can be brought into contact with the same signal line and simultaneously the GND terminals can be brought into contact with the same GND lines, and therefore, it is possible to calibrate the two RF measurement probe heads.
- the two second SG-type RF measurement probe heads or the two third GS-type RF measurement probe heads are used in the confronting manner, assuming that the signal terminals of the two RF measurement probe heads are brought into contact with a signal line of a calibration pattern, the GND terminals thereof are located on both sides of the signal line, respectively, so that it is necessary to provide GND lines on both sides of the signal line, respectively.
- the calibration pattern that is used for calibrating the first GSG-type RF measurement probe heads i.e. the calibration pattern having the two GND lines disposed along the signal line on both sides thereof, because the GND lines are separated from each other, the calibration cannot be implemented.
- the signal terminal of at least one of the RF measurement probe heads is disposed so as to lie across the GND line of the calibration pattern when performing the calibration.
- a pair of an input signal electrode and an output signal electrode and a pair of an input GND electrode and an output GND electrode are disposed on the surface of an IC chip, and these input GND electrode and output GND electrode are electrically connected to a backside electrode, provided on the back side of the IC chip, via conductors provided in through holes formed through the IC chip in a thickness direction thereof, respectively, so as to be electrically connected to each other via the backside electrode, thereby achieving common grounding (e.g. see JP-A-H05-152395, paragraphs [0005] to [0006] and FIGS. 1 and 2 ).
- the voltage amplitude becomes zero at a position of ⁇ /4 from an open-stub open end so that grounding is formed in a high-frequency manner (e.g. see JP-A-2000-101309, paragraph [0006] and FIG. 5 ).
- an RF signal affects a measurement value so that the measurement value is largely biased following an increase in signal frequency. For example, observing an input-side reflection property when measurement is performed for a through pattern having a characteristic impedance of 50 ⁇ , the impedance is largely biased from 50 ⁇ following an increase in frequency.
- the present invention has been made for solving the foregoing problem and has a first object to provide a property measurement method for a high frequency circuit that can prevent an RF signal from affecting a measurement value in measurement of the RF signal, a second object to provide a calibration pattern that can prevent an RF signal from affecting a measurement value in measurement of the RE signal, and a third object to provide a calibration jig which makes it possible to easily exchange a calibration pattern that can prevent an RF signal from affecting a measurement value in measurement of the RF signal.
- a high frequency circuit property measurement method comprising: preparing a calibration pattern comprising a substrate, a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate, a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line, a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line, and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner; and performing calibration prior to measurement of a to-be-measured circuit by using a first and a second property measurement probe head having the same arrangement of a signal terminal and a constant potential terminal, by bringing the signal terminal and the constant potential terminal of said first property measurement probe head into contact with said first end portion of the signal line and said one end portion of the first constant potential line of said calibration pattern, respectively, and by bringing the signal terminal and the
- neither of the signal terminals of the first and second property measurement probe heads is disposed so as to lie across the constant potential line of the calibration pattern.
- a calibration pattern comprising: a substrate; a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate; a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line; a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line; and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner.
- a calibration pattern according to the present invention is advantageous in a high frequency circuit property measurement as either of the signal terminals of the RF measurement probe heads does not lie across the GND line even when the SG-type RF measurement probe heads or the GS-type RF measurement probe heads are used so as to confront each other with their signal terminals being brought into contact with the signal line of the calibration pattern.
- the RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy.
- a calibration jig comprising: a calibration pattern comprising, a substrate, a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate, a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line, a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line, and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner; and a dielectric substrate having a recessed portion formed on the surface thereof for exchangeably mounting therein the calibration pattern.
- a calibration jig according to the present invention is advantageous in a high frequency circuit property measurement as the calibration Jig makes it possible to carry out calibration at predetermined required frequencies by the use of one jig.
- FIG. 1 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 2 is a sectional view of the RF measurement calibration pattern taken along a line II-II in FIG. 1 .
- FIG. 3 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Embodiment 1 of the present invention.
- FIG. 4 is a block diagram for explaining a measurement system for a high frequency circuit according to the present invention.
- FIGS. 5 and 6 are block diagrams for explaining a method of performing zero correction of the measurement system for the high frequency circuit according to the present invention.
- FIG. 7 is an exemplary diagram showing a measurement system when performing S-parameter measurement of a high frequency circuit, according to the present invention.
- FIGS. 8, 9 , 10 , and 11 are exemplary diagrams showing the calibration method when carrying out the S-parameter measurement of the high frequency circuit, according to the present invention.
- FIG. 12 is a sectional view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 13 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 14 is a sectional view of the RF measurement calibration pattern taken along a line XIV-XIV in FIG. 13 .
- FIG. 15 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 16 is a sectional view of the RF measurement calibration pattern taken along a line XVI-XVI in FIG. 15 .
- FIG. 17 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 18 is a sectional view of the RF measurement calibration pattern taken along a line XVIII-XVIII in FIG. 17 .
- FIG. 19 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 20 is a sectional view of the RF measurement calibration pattern taken along a line XX-XX in FIG. 19 .
- FIG. 21 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 22 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Modification 6 of the present invention.
- FIG. 23 , FIG. 24 , and FIG. 25 are plan views of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 26 is a sectional view of the RF measurement calibration pattern taken along a line XXVI-XXVI in FIG. 25 .
- FIG. 27 , FIG. 28 , FIG. 29 , FIG. 30 , FIG. 31 , FIG. 32 , FIG. 33 , FIG. 34 , FIG. 35 , FIG. 36 , and FIG. 37 are plan views of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 38 is a plan view of an RF measurement calibration jig according to one embodiment of the present invention.
- FIG. 39 is a sectional view of the RF measurement calibration jig taken along a line XXXIX-XXXIX in FIG. 38 .
- FIG. 1 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 2 is a sectional view of the RF measurement calibration pattern taken along a line II-II in FIG. 1 .
- the same symbols represent the same or corresponding components, respectively.
- FIGS. 1 and 2 there is shown an RF measurement calibration pattern 10 being one example of Embodiment 1.
- the RF measurement calibration pattern 10 comprises a dielectric substrate 12 serving as a substrate.
- a signal line 14 having a specific characteristic impedance of, for example, 50 ⁇ is disposed on the surface of the dielectric substrate 12 .
- the signal line 14 has a linear shape with both opposite ends and comprises a metal layer 141 and a gold-plating layer 142 disposed on the surface of the metal layer 141 .
- Those both opposite ends of the signal line 14 will be referred to as, for example, a first end portion 14 a and a second end portion 14 b , respectively.
- a first GND pad 16 serving as a first constant potential line is disposed with a predetermined interval defined between itself and the first end portion 14 a of the signal line 14 .
- the first GND pad 16 has a front end portion located on a prolongation of the signal line 14 in its longitudinal direction and is electrically separated from the signal line 14 .
- the other end portion of the first GND pad 16 is connected to a through-hole electrode 18 .
- the first GND pad 16 is connected to a backside metal layer 22 , disposed on the back side of the dielectric substrate 12 , via the through-hole electrode 18 and a via hole 20 formed by burying a conductor in a through hole formed through the dielectric substrate 12 in its thickness direction.
- the first GND pad 16 comprises a metal layer 161 and a gold-plating layer 162 disposed on the surface of the metal layer 161 .
- the through-hole electrode 18 connected to the first GND pad 16 is formed by the metal layer 161 part of which also forms the first GND pad 16 .
- a second GND pad 24 serving as a second constant potential line is disposed with the predetermined interval defined between itself and the second end portion 14 b of the signal line 14 .
- the second GND pad 24 has a front end portion located on a prolongation of the signal line 14 in its longitudinal direction and is electrically separated from the signal line 14 .
- the other end portion of the second GND pad 24 is connected to a through-hole electrode 18 .
- the second GND pad 24 is connected to the backside metal layer 22 , disposed on the back side of the dielectric substrate 12 , via the through-hole electrode 18 and a via hole 20 formed by burying a conductor in a through hole formed through the dielectric substrate 12 in its thickness direction.
- the second GND pad 24 comprises a metal layer 241 and a gold-plating layer 242 disposed on the surface of the metal layer 241 .
- the through-hole electrode 18 connected to the second GND pad 24 is formed by the metal layer 241 part of which also forms the second GND pad 24 .
- the first GND pad 16 and the second GND pad 24 are electrically connected together via the conductors, i.e. the through-hole electrodes 18 , the via holes 20 , and the backside metal layer 22 .
- the first GND pad 16 and the second GND pad 24 are grounded, but may not necessarily be grounded if electrically conducted via the through-hole electrodes 18 , the via holes 20 , and the backside metal layer 22 .
- FIG. 3 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Embodiment 1 of the present invention.
- an RF measurement probe head 30 and an RF measurement probe head 32 are disposed so as to confront each other like in an ordinary measurement state.
- the two RF measurement probe heads 30 and 32 are both, for example, SG-type RF measurement probe heads.
- a signal terminal 301 (indicated as S in FIG. 3 ) of the RF measurement probe head 30 is in contact with the signal line 14 while a GND terminal 302 (indicated as G in FIG. 3 ) thereof is in contact with the first GND pad 16 .
- a signal terminal 321 (indicated as S in FIG. 3 ) of the RF measurement probe head 32 is in contact with the signal line 14 while a GND terminal 322 (indicated as G in FIG. 3 ) thereof is in contact with the second GND pad 24 .
- FIG. 4 is a block diagram for explaining a measurement system for a high frequency circuit according to the present invention.
- FIGS. 5 and 6 are block diagrams for explaining a method of performing zero correction of the measurement system for the high frequency circuit according to the present invention. This zero correction method is carried out when, for example, performing noise measurement or input/output measurement of the high frequency circuit.
- the measurement system for the high frequency circuit is as follows.
- a signal from a signal source 36 is input into a to-be-measured circuit 40 via an input circuit 38 .
- the signal input is measured by a first power meter 37 disposed between the signal source 36 and the input circuit 38 .
- the signal input into the to-be-measured circuit 40 is performed via an SG-type RF measurement probe head 32 like that shown in FIG. 3 .
- An output from the to-be-measured-circuit 40 is delivered to an output circuit 46 via, for example, an SG-type RF measurement probe head 30 like that shown in FIG. 3 and the signal output is measured by a second power meter 48 .
- This correction value corresponds to a passing loss of the input-side circuit of the measurement system and, by carrying out this correction, a power value, obtained at the first power meter 37 , of an output portion of the signal source 36 and the power at the RF input-side end surface of the to-be-measured circuit 40 become equal to each other.
- the signal terminal 321 and the GND terminal 322 of the SG-type RF measurement probe head 32 serving as the RF input-side end surface of the to-be-measured circuit 40 are brought into contact with the signal line 14 and the second GND pad 24 of the RF measurement calibration pattern 10 , respectively, while the signal terminal 301 and the GND terminal 302 of the output-side RF measurement probe head 30 are brought into contact with the signal line 14 and the first GND pad 16 of the RF measurement calibration pattern 10 , respectively.
- This contact state is the same as that shown in FIG. 3 .
- a correction value is input into the second power meter 48 so that a value obtained at the second power meter 48 coincides with a value obtained at the first power meter 37 .
- This correction value corresponds to a passing loss of the output-side circuit of the measurement system.
- noise measurement and input/output measurement of the to-be-measured circuit are carried out.
- FIG. 7 is an exemplary diagram showing a measurement system when performing S-parameter measurement of a high frequency circuit, according to the present invention.
- FIGS. 8, 9 , 10 , and 11 are exemplary diagrams showing the calibration method when carrying out the S-parameter measurement of the high frequency circuit, according to the present invention.
- description will be given about a case where a SOLT method is used.
- an RF measurement probe head 30 and an RE measurement probe head 32 are connected to a network analyzer (NWA) 50 via, for example, coaxial cables 52 , respectively.
- NWA network analyzer
- the S-parameter measurement is carried out. In this event, it is necessary to derive a correction value for the coaxial cable 52 and the RF measurement probe head 30 and a correction value for the coaxial cable 52 and the RF measurement probe head 32 .
- the signal terminal 321 and the GND terminal 322 of the RF measurement probe head 32 are brought into contact with the signal line 14 and the second GND pad 24 of the RF measurement calibration pattern 10 , respectively, while the signal terminal 301 and the GND terminal 302 of the RF measurement probe head 30 are brought into contact with the signal line 14 and the first GND pad 16 of the RF measurement calibration pattern 10 , respectively.
- This contact state is the same as that shown in FIG. 3 . In this state, the measurement is carried out for the calibration of the network analyzer 50 .
- the characteristic impedance of the RF measurement calibration pattern 10 should be equal to that of the resistance pattern 54 .
- the S-parameter measurement of the to-be-measured circuit 40 is implemented using the coaxial cable 52 and the RF measurement probe head 30 in the calibrated state and the coaxial cable 52 and the RF measurement probe head 32 in the calibrated state.
- FIG. 12 is a sectional view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 12 A plan view of the RF measurement calibration pattern 58 shown in FIG. 12 is the same as FIG. 1 being the plan view of the RF measurement calibration pattern 10 of Embodiment 1. Further, the RF measurement calibration pattern 58 shown in FIG. 12 is sectioned along a line corresponding to the line II-II in FIG. 1 .
- the RF measurement calibration pattern 58 is formed by further disposing a dielectric layer 60 so as to cover the backside metal layer 22 of the RF measurement calibration pattern 10 .
- the backside metal layer 22 is set to a constant potential, for example, a ground potential, since the backside metal layer 22 is covered with the dielectric layer 60 , it is possible to stably carry out the calibration of the RF measurement probe head 30 and the RF measurement probe head 32 regardless of the state of a place where the RF measurement calibration pattern 58 is disposed.
- a constant potential for example, a ground potential
- FIG. 13 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 14 is a sectional view of the RF measurement calibration pattern taken along a line XIV-XIV in FIG. 13 .
- a backside metal layer 64 extends to the surface of a dielectric substrate 12 via side surfaces thereof so as to be electrically connected to end portions, each on the side remote from or not adjacent to a signal line 14 , of a first GND pad 16 and a second GND pad 24 , respectively. Therefore, the through-hole electrodes 18 and the via holes 20 , which are provided in Embodiment 1, are not provided.
- the end portions, each on the side not adjacent to the signal line 14 , of the first GND pad 16 and the second GND pad 24 are directly connected to each other so as to be electrically conducted.
- the RF measurement calibration pattern 62 thus structured, in addition to the effect of the RF measurement calibration pattern 10 , it is possible to increase areas of portions of the backside metal layer 64 disposed on the side surfaces of the dielectric substrate 12 , and therefore, it is possible to reduce parasitic inductance components that are generated when the first GND pad 16 and the second GND pad 24 are commonly grounded.
- FIG. 15 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 16 is a sectional view of the RF measurement calibration pattern taken along a line XVI-XVI in FIG. 15 .
- open stubs 68 serving as conductors are connected to end portions, each on the side not adjacent to a signal line 14 , of a first GND pad 16 and a second GND pad 24 , respectively.
- the first GND pad 16 and the second GND pad 24 are connected together via the open stubs 68 in a high-frequency manner. Therefore, in the RF measurement calibration pattern 66 , in addition to the effect of the RF measurement calibration pattern 10 of Embodiment 1, the via holes 20 and the backside metal layer 22 in the RF measurement calibration pattern 10 or the backside metal layer 64 extending to the surface of the dielectric substrate 12 via the side surfaces thereof in the RF measurement calibration pattern 62 of Modification 2 becomes unnecessary so that the production of the RF measurement calibration pattern is facilitated.
- FIG. 17 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 18 is a sectional view of the RF measurement calibration pattern taken along a line XVIII-XVIII in FIG. 17 .
- end portions, each on the side not adjacent to a first end portion 14 a or a second end portion 14 b of a signal line 14 , of a first GND pad 16 and a second GND pad 24 are connected together via an extended portion 72 of the GND pads to form an S-shape on the surface of a dielectric substrate 12 , while the signal line 14 crossing this extended portion 72 has an air bridge 14 c formed at a portion thereof and straddles the extended portion 72 at this air bridge 14 c.
- the via holes 20 and the backside metal layer 22 in the RF measurement calibration pattern 10 or the backside metal layer 64 extending to the surface of the dielectric substrate 12 via the side surfaces thereof in the RF measurement calibration pattern 62 of Modification 2 becomes unnecessary so that the production of the RF measurement calibration pattern is facilitated.
- the characteristic impedance of the air bridge 14 c of the signal line 14 differs from that of a portion other than the air bridge 14 c of the signal line 14 and, in this case, it may be necessary to determine a width of the air bridge 14 c so that the impedance of the air bridge 14 c matches that of the portion other than the air bridge 14 c.
- FIG. 19 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 20 is a sectional view of the RF measurement calibration pattern taken along a line XX-XX in FIG. 19 .
- end portions, each on the side not adjacent to a signal line 14 , of a first GND pad 16 and a second GND pad 24 are connected together via an extended portion 72 to form an S-shape on the surface of a dielectric substrate 12 , while this extended portion 72 has an air bridge 72 a formed at a portion thereof and straddles the signal line 14 at this air bridge 72 a.
- the RF measurement calibration pattern 74 thus structured exhibits an effect like that of the RF measurement calibration pattern 70 of Modification 4.
- the characteristic impedance of the air bridge 72 a , under which the signal line 14 is located, of the extended portion 72 does not match that of the other portion and, in this case, it may be necessary to change a width of the line in consideration thereof.
- FIG. 21 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- a first GND pad 16 is disposed with a predetermined interval defined between itself and a first end portion 14 a of a signal line 14 .
- the first GND pad 16 in this modification has a front end portion disposed along the signal line 14 so as to confront the signal line 14 .
- the first GND pad 16 is electrically separated from the signal line 14 .
- the other end portion of the first GND pad 16 extends in a direction away from the signal line 14 and is connected to a through-hole electrode 18 .
- a second GND pad 24 is disposed with the predetermined interval defined between itself and a second end portion 14 b of the signal line 14 .
- the second GND pad 24 also has a front end portion disposed along the signal line 14 so as to confront the signal line 14 and is electrically separated from the signal line 14 .
- the other end portion of the second GND pad 24 extends in a direction away from the signal line 14 and is connected to a through-hole electrode 18 .
- the first GND pad 16 and the second GND pad 24 are not located exactly face to face, but are disposed so as to confront each other via the signal line 14 interposed therebetween.
- the first GND pad 16 and the second GND pad 24 are electrically connected together via the through-hole electrodes 18 , via holes 20 , and a backside metal layer 22 .
- a sectional view, taken along a line XXI-XXI in FIG. 21 , of the RF measurement calibration pattern 76 corresponds to FIG. 2 .
- the RF measurement calibration pattern 76 may further have a dielectric layer 60 disposed to cover the backside metal layer 22 ,
- FIG. 22 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Modification 6 of the present invention.
- an RF measurement probe head 30 and an RF measurement probe head 32 are disposed so as to confront each other.
- These two RF measurement probe heads 30 and 32 are both, for example, SG-type RF measurement probe heads.
- the signal terminal 301 of the RF measurement probe head 30 and the signal terminal 321 of the RF measurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of the signal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy.
- FIG. 23 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 78 shown in FIG. 23 has basically the same structure as the RF measurement calibration pattern 62 of Modification 2 shown in FIGS. 13 and 14 . What differs from the RF measurement calibration pattern 62 resides in that while the first GND pad 16 and the second GND pad 24 of the REF measurement calibration pattern 62 each have a front end portion located on a prolongation of the signal line 14 in its longitudinal direction, a first GND pad 16 and a second GND pad 24 of the RF measurement calibration pattern 78 each have a front end portion disposed along a signal line 14 and a backside metal layer 64 is in contact with side surfaces of the first GND pad 16 and the second GND pad 24 , respectively.
- the other structure of the RF measurement calibration pattern 78 is the same as that of the RF measurement calibration pattern 62 .
- a sectional view, taken along a line XXIII-XXIII in FIG. 23 , of the RF measurement calibration pattern 78 corresponds to FIG. 14 .
- the crosstalk is reduced so that the calibration can be carried out with high accuracy.
- FIG. 24 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 80 shown in FIG. 24 has basically the same structure as the RF measurement calibration pattern 66 of Modification 3 shown in FIGS. 15 and 16 . What differs from the RF measurement calibration pattern 66 resides in that while the first GND pad 16 and the second GND pad 24 of the RF measurement calibration pattern 66 each have a front end portion located on a prolongation of the signal line 14 in its longitudinal direction, a first GND pad 16 and a second GND pad 24 of the RF measurement calibration pattern 80 each have a front end portion disposed along a signal line 14 .
- the other structure of the RF measurement calibration pattern 80 is the same as that of the RF measurement calibration pattern 66 .
- a sectional view, taken along a line XXIV-XXIV in FIG. 24 , of the RF measurement calibration pattern 80 corresponds to FIG. 16 .
- the crosstalk is reduced so that the calibration can be carried out with high accuracy.
- FIG. 25 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- FIG. 26 is a sectional view of the RF measurement calibration pattern taken along a line XXVI-XXVI in FIG. 25 .
- the RF measurement calibration pattern 82 shown in FIG. 25 has basically the same structure as the RF measurement calibration pattern 70 of Modification 4 shown in FIG. 17 . What differs from the RF measurement calibration pattern 70 resides in that while the first GND pad 16 and the second GND pad 24 of the RF measurement calibration pattern 70 each have a front end portion located on a prolongation of the signal line 14 in its longitudinal direction, a first GND pad 16 and a second GND pad 24 of the RF measurement calibration pattern 82 are disposed along a signal line 14 and each have a front end portion disposed side by side with a first end portion 14 a or a second end portion 14 b of the signal line 14 .
- the other structure of the RF measurement calibration pattern 82 is the same as that of the RF measurement calibration pattern 70 .
- the crosstalk is reduced so that the calibration can be carried out with high accuracy.
- FIG. 27 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 84 shown in FIG. 27 has basically the same structure as the RF measurement calibration pattern 74 of Modification 5 shown in FIGS. 19 and 20 . What differs from the RF measurement calibration pattern 74 resides in that while the first GND pad 16 and the second GND pad 24 of the RF measurement calibration pattern 74 each have a front end portion located on a prolongation of the signal line 14 in its longitudinal direction, a first GND pad 16 and a second GND pad 24 of the RF measurement calibration pattern 84 are disposed along a signal line 14 and each have a front end portion disposed side by side with a first end portion 14 a or a second end portion 14 b of the signal line 14 .
- the other structure of the RF measurement calibration pattern 84 is the same as that of the RF measurement calibration pattern 74 .
- a sectional view, taken along a line XXVII-XXVII in FIG. 27 , of the RF measurement calibration pattern 84 corresponds to FIG. 20 .
- the crosstalk is reduced so that the calibration can be carried out with high accuracy.
- the RF measurement calibration pattern according to Embodiment 1 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50 ⁇ and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting between the first GND pad and the second GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting between the first GND pad and the second GND pad, or the open stubs for connecting between the first GND pad and the second GND pad in a high-frequency manner.
- the high frequency circuit property measurement method for carrying out the calibration by the use of the RF measurement calibration pattern according to Embodiment 1 since the RF signal has no effect on either of the signal terminals of the first and second property measurement probe heads, the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
- the present invention is also applicable to a case where the GS-type RF measurement probe heads are used.
- FIG. 28 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 86 shown in FIG. 28 has basically the same structure as the RF measurement calibration pattern 76 of Modification 6 of Embodiment 1 shown in FIG. 21 . What differs from the RF measurement calibration pattern 76 resides in that there is further disposed a third GND pad 88 serving as a third constant potential line that confronts face to face the first GND pad 16 of the RF measurement calibration pattern 76 via the signal line 14 at the first end portion 14 a thereof and is electrically separated from the signal line 14 .
- the third GND pad 88 has a front end portion disposed along the signal line 14 and confronting face to face a front end portion of the first GND pad 16 via the signal line 14 .
- the other end portion of the third GND pad 88 extends in a direction away from the signal line 14 and is connected to a through-hole electrode 18 .
- the third GND pad 88 is electrically connected to the backside metal layer 22 via the through-hole electrode 18 and a via hole 20 . Therefore, the third GND pad 88 is electrically connected to the first GND pad 16 and the second GND pad 24 .
- the structure of the third GND pad 88 is the same as that of the first GND pad 16 , wherein a gold-plating layer is disposed on the surface of a metal layer.
- the through-hole electrode 18 connected to the third GND pad 88 is formed by the metal layer part of which also forms the third GND pad 88 .
- FIG. 28 A sectional view taken along a line XXVIII-XXVIII in FIG. 28 corresponds to FIG. 2 .
- an SG-type RE measurement probe head is put in contact at the second end portion 14 b of the signal line 14 while an SG-type, GS-type or GSG-type RF measurement probe head is contactable at the first end portion 14 a of the signal line 14 .
- FIG. 29 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 90 shown in FIG. 29 is a modification of Embodiment 2, but has basically the same structure as the RF measurement calibration pattern 78 of Modification 7 of Embodiment 1 shown in FIG. 23 . What differs from the RF measurement calibration pattern 78 resides in that there is further disposed a third GND pad 88 that confronts the first GND pad 16 of the RF measurement calibration pattern 78 via the signal line 14 and is electrically separated from the signal line 14 .
- the third GND pad 88 has a front end portion disposed along the signal line 14 and has a side surface contacting the backside metal layer 64 like the first GND pad 16 . Therefore, the first GND pad 16 , the second GND pad 24 , and the third GND pad 88 are electrically connected together.
- FIG. 29 A sectional view taken along a line XXIX-XXIX in FIG. 29 corresponds to FIG. 14 .
- the RF measurement calibration pattern 90 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein the second GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 7 of Embodiment 1.
- FIG. 30 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 92 shown in FIG. 30 is a modification of Embodiment 2, but has basically the same structure as the RF measurement calibration pattern 80 of Modification 8 of Embodiment 1 shown in FIG. 24 .
- What differs from the RF measurement calibration pattern 80 resides in that there is further disposed a third GND pad 88 that confronts the first GND pad 16 of the RF measurement calibration pattern 80 via the signal line 14 and is electrically separated from the signal line 14 .
- the third GND pad 88 has a front end portion disposed along the signal line 14 and an open stub 68 is connected to an end portion, on the side not adjacent to the signal line 14 , of the third GND pad 88 .
- the first GND pad 16 , the second GND pad 24 , and the third GND pad 88 are connected together via the open stubs 68 in a high-frequency manner.
- a sectional view taken along a line XXX-XXX in FIG. 30 corresponds to FIG. 16 .
- the RF measurement calibration pattern 92 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein the second GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 8 of Embodiment 1.
- FIG. 31 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 94 shown in FIG. 31 is a modification of Embodiment 2, but has basically the same structure as the RF measurement calibration pattern 82 of Modification 9 of Embodiment 1 shown in FIGS. 25 and 26 .
- What differs from the RF measurement calibration pattern 82 resides in that there is further disposed a third GND pad 88 that confronts the first GND pad 16 of the RF measurement calibration pattern 82 via the signal line 14 and is electrically separated from the signal line 14 .
- the third GND pad 88 is disposed along the signal line 14 and has a front end portion disposed side by side with the first end portion 14 a of the signal line 14 .
- the third GND pad 88 is connected to the first GND pad 16 and the second GND pad 24 via the extended portion 72 on the surface of the dielectric substrate.
- FIG. 31 A sectional view taken along a line XXXI-XXXI in FIG. 31 corresponds to FIG. 26 .
- the RF measurement calibration pattern 94 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein the second GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 9 of Embodiment 1.
- FIG. 32 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 96 shown in FIG. 32 is a modification of Embodiment 2, but has basically the same structure as the RF measurement calibration pattern 84 of Modification 10 of Embodiment 1 shown in FIG. 27 . What differs from the RF measurement calibration pattern 84 resides in that there is further disposed a third GND pad 88 that confronts the first GND pad 16 of the RF measurement calibration pattern 84 via the signal line 14 and is electrically separated from the signal line 14 .
- the third GND pad 88 is disposed along the signal line 14 and has a front end portion disposed side by side with the first end portion 14 a of the signal line 14 .
- the third GND pad 88 is connected to the first GND pad 16 and the second GND pad 24 via the extended portion 72 on the surface of the dielectric substrate.
- FIG. 32 A sectional view taken along a line XXXII-XXXII in FIG. 32 corresponds to FIG. 20 .
- the RF measurement calibration pattern 96 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein the second GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 10 of Embodiment 1.
- the RF measurement calibration pattern according to Embodiment 2 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50 ⁇ and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, the third GND pad confronting face to face the first GND pad via the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting together the first GND pad, the second GND pad, and the third GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting together the first GND pad, the second GND pad, and the third GND pad, or the open stubs for connecting together the first GND pad, the second GND pad, and the third GND pad in a high
- the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
- FIG. 33 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 98 shown in FIG. 33 is formed by further disposing, on the RF measurement calibration pattern 86 of Embodiment 2, a fourth GND pad 100 serving as a fourth constant potential line that confronts the second GND pad 24 via the signal line 14 and is electrically separated from the signal line 14 .
- the fourth GND pad 100 has a front end portion disposed along the signal line 14 at the second end portion 14 b thereof and confronting face to face a front end portion of the second GND pad 24 via the signal line 14 .
- the other end portion of the fourth GND pad 100 extends in a direction away from the signal line 14 and is connected to a through-hole electrode 18 .
- the fourth GND pad 100 is electrically connected to the backside metal layer 22 via the through-hole electrode 18 and a via hole 20 . Therefore, the fourth GND pad 100 is electrically connected to the first GND pad 16 , the second GND pad 24 , and the third GND pad 88 .
- the structure of the fourth GND pad 100 is the same as that of the first GND pad 16 , wherein a gold-plating layer is disposed on the surface of a metal layer.
- the through-hole electrode 18 connected to the fourth GND pad 100 is formed by the metal layer part of which also forms the fourth GND pad 100 .
- FIG. 33 A sectional view taken along a line XXXIII-XXXIII in FIG. 33 corresponds to FIG. 2 .
- the RF measurement probe head of any type i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of the first end portion 14 a and the second end portion 14 b of the signal line 14 .
- the calibration can be carried out using the RF measurement calibration pattern 100 .
- either of the signal terminals of the RF measurement probe heads of any type or types does not lie across the GND line of the RF measurement calibration pattern 100 as described in Embodiment 1. Therefore, an RF signal does not affect a measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy.
- FIG. 34 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 102 shown in FIG. 34 is a modification of Embodiment 3, but is formed by further disposing, on the RF measurement calibration pattern 90 of Modification 11 of Embodiment 2 shown in FIG. 29 , a fourth GND pad 100 that confronts the second GND pad 24 via the signal line 14 and is electrically separated from the signal line 14 .
- the fourth GND pad 100 has a front end portion disposed along the signal line 14 and has a side surface contacting the backside metal layer 64 like the first GND pad 16 . Therefore, the first GND pad 16 , the second GND pad 24 , the third GND pad 88 , and the fourth GND pad 100 are electrically connected together.
- FIG. 34 A sectional view taken along a line XXXIV-XXXIV in FIG. 34 corresponds to FIG. 14 .
- the RF measurement probe head of any type i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of the first end portion 14 a and the second end portion 14 b of the signal line 14 .
- the RF measurement calibration pattern 102 When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF measurement calibration pattern 102 enables the calibration of the RF measurement probe heads and exhibits an effect like that of Modification 11 of Embodiment 2.
- FIG. 35 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 104 shown in FIG. 35 is a modification of Embodiment 3, but is formed by further disposing, on the RF measurement calibration pattern 92 of Modification 12 of Embodiment 2 shown in FIG. 30 , a fourth GND pad 100 that confronts the second GND pad 24 via the signal line 14 and is electrically separated from the signal line 14 .
- the fourth GND pad 100 has a front end portion disposed along the signal line 14 and an open stub 68 is connected to an end portion, on the side not adjacent to the signal line 14 , of the fourth GND pad 100 . Therefore, the first GND pad 16 , the second GND pad 24 , the third &ND pad 88 , and the fourth GND pad 100 are connected together in a high-frequency manner.
- FIG. 35 A sectional view taken along a line XXXV-XXXV in FIG. 35 corresponds to FIG. 16 .
- the RF measurement probe head of any type i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of the first end portion 14 a and the second end portion 14 b of the signal line 14 .
- the RF measurement calibration pattern 104 When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF measurement calibration pattern 104 enables the calibration of the RF measurement probe heads and exhibits an effect like that of Modification 12 of Embodiment 2.
- FIG. 36 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 106 shown in FIG. 36 is a modification of Embodiment 3, but is formed by further disposing, on the RF measurement calibration pattern 94 of Modification 13 of Embodiment 2 shown in FIG. 31 , a fourth GND pad 100 that confronts the second GND pad 24 via the signal line 14 and is electrically separated from the signal line 14 .
- the fourth GND pad 100 is disposed along the signal line 14 and has a front end portion disposed side by side with the second end portion 14 b of the signal line 14 .
- the fourth GND pad 100 is connected to the first GND pad 16 , the second GND pad 24 , and the third GND pad 88 via the extended portion 72 of the GND pads on the surface of the dielectric substrate.
- FIG. 36 A sectional view taken along a line XXXVI-XXXVI in FIG. 36 corresponds to FIG. 26 .
- the RF measurement probe head of any type i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of the first end portion 14 a and the second end portion 14 b of the signal line 14 .
- the RF measurement calibration pattern 106 When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF measurement calibration pattern 106 enables the calibration of the RE measurement probe heads and exhibits an effect like that of Modification 13 of Embodiment 2.
- FIG. 37 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.
- the RF measurement calibration pattern 108 shown in FIG. 37 is a modification of Embodiment 3, but is formed by further disposing, on the RF measurement calibration pattern 96 of Modification 14 of Embodiment 2 shown in FIG. 32 , a fourth GND pad 100 that confronts the second GND pad 24 via the signal line 14 and is electrically separated from the signal line 14 .
- the fourth GND pad 100 is disposed along the signal line 14 and has a front end portion disposed side by side with the second end portion 14 b of the signal line 14 .
- the fourth GND pad 100 is connected to the first GND pad 16 , the second GND pad 24 , and the third GND pad 88 via the extended portion 72 of the GND pads on the surface of the dielectric substrate.
- FIG. 37 A sectional view taken along a line XXXVII-XXXVII in FIG. 37 corresponds to FIG. 20 .
- the RF measurement probe head of any type i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of the first end portion 14 a and the second end portion 14 b of the signal line 14 .
- the RF measurement calibration pattern 108 When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF measurement calibration pattern 108 enables the calibration of the RF measurement probe heads and exhibits an effect like that of Modification 14 of Embodiment 2.
- the RF measurement calibration pattern according to Embodiment 3 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50 ⁇ and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, the third GND pad confronting face to face the first GND pad via the signal line, the fourth GND pad confronting face to face the second GND pad via the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting together the first GND pad, the second GND pad, the third &ND pad, and the fourth GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting together the first GND pad, the second GND pad, the third GND pad, and the fourth GND pad
- the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
- FIG. 38 is a plan view of an RF measurement calibration jig according to one embodiment of the present invention.
- FIG. 39 is a sectional view of the RF measurement calibration jig taken along a line XXXIX-XXXIX in FIG. 38 .
- the RF measurement calibration jig 110 includes, as one example, the RF measurement calibration pattern 62 of Modification 2 of Embodiment 1 shown in FIGS. 13 and 14 . Note that use can be made of any of the foregoing RF measurement calibration patterns of Embodiment 1, Embodiment 2, and Embodiment 3.
- a dielectric substrate 112 of the RF measurement calibration jig 110 is formed with a recessed portion 112 a for mounting therein the RF measurement calibration pattern 62 .
- the recessed portion 112 a is formed so as to exchangeably receive therein RF measurement calibration patterns, one at a time, having different lengths. Therefore, it is possible to carry out calibration at predetermined required frequencies with one jig.
- the RF measurement calibration jig makes it possible to carry out calibration at predetermined required frequencies by the use of one jig. Consequently, selection of high frequency circuits can be accurately and easily performed to thereby improve the yield of high frequency circuit devices with the simple process.
- the high frequency circuit property measurement method according to the present invention is suitable for an RF measurement method for a high frequency circuit for use in a communication device adapted for a microwave band or a millimeter wave band that is used in mobile communication, optical communication, satellite communication, and the like.
Abstract
In a high frequency circuit property measurement method, prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe head are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GNU pad to the second GND pad.
Description
- 1. Field of the Invention
- The present invention relates to an RF measurement method for a high frequency circuit, a calibration pattern, and a calibration jig and, in particular, relates to an RF measurement method for a high frequency circuit for use in a communication device adapted for a microwave band or a millimeter wave band that is used in mobile communication, optical communication, satellite communication, and the like, and further to a calibration pattern and a calibration jig.
- 2. Description of the related Art
- In recent years, communication devices used in microwave bands or millimeter wave bands have been more and more miniaturized. Following it, high frequency circuit devices are also required to be further miniaturized, and accordingly, high frequency circuits used in those high frequency circuit devices are required to have proper qualities. In order to accurately evaluate the quality of the high frequency circuit, it is necessary to carry out RF measurement of the high frequency circuit by the use of a highly accurate measurement method, and therefore, there has been an increasing demand for a precise calibration method for setting a standard of the RF measurement.
- The RF measurement of the high frequency circuit is performed on-wafer. This on-wafer RF measurement normally uses two RF measurement probe heads, each having a signal terminal and a GND terminal, in such a manner as to confront each other. Therefore, an RF measurement probe head calibration pattern is required to have a calibration pattern that corresponds to the RF measurement probe heads to be used.
- Generally, there are available three kinds of probe heads as RF measurement probe heads. The first one is of a type having three contacts including one signal terminal and GND terminals located on both sides of the signal terminal, respectively. This first one is called, for example, a GSG-type RF measurement probe head.
- The second one is of a type having two contacts including one signal terminal and one GND terminal wherein, as seeing the contacts from the side of a body of the RF measurement probe head, the signal terminal is arranged on the left side while the GND terminal is arranged on the right side. This second one is called, for example, an SG-type RF measurement probe head.
- The third one is of a type also having two contacts wherein, however, the signal terminal and the GND terminal in the second SG-type RF measurement probe head are interchanged in position, and therefore, as seeing the contacts from the side of a body of the RF measurement probe head, the GND terminal is arranged on the left side while the signal terminal is arranged on the right side. This third one is called, for example, a GS-type RF measurement probe head.
- For the RF measurement of the high frequency circuit, two measurement probe heads are used in such a manner as to confront each other. Accordingly, a calibration pattern is required which corresponds to such two measurement probe heads.
- As a configuration pattern when using the two first GSG-type RF measurement probe heads in the confronting manner, it is possible to calibrate the two GSG-type RF measurement probe heads by the use of a calibration pattern having one signal line with a predetermined characteristic impedance and two GND lines disposed along the signal line on both sides thereof, respectively.
- On the other hand, when the second SG-type RF measurement probe head and the third GS-type RF measurement probe head are used in the confronting manner, the signal terminals confront each other and the GND terminals confront each other so that, by the use of a calibration pattern having one signal line with a predetermined characteristic impedance and two GND lines disposed along the signal line on one side thereof, the signal terminals can be brought into contact with the same signal line and simultaneously the GND terminals can be brought into contact with the same GND lines, and therefore, it is possible to calibrate the two RF measurement probe heads.
- However, when the two second SG-type RF measurement probe heads or the two third GS-type RF measurement probe heads are used in the confronting manner, assuming that the signal terminals of the two RF measurement probe heads are brought into contact with a signal line of a calibration pattern, the GND terminals thereof are located on both sides of the signal line, respectively, so that it is necessary to provide GND lines on both sides of the signal line, respectively.
- On the other hand, if use is simply made of the calibration pattern that is used for calibrating the first GSG-type RF measurement probe heads, i.e. the calibration pattern having the two GND lines disposed along the signal line on both sides thereof, because the GND lines are separated from each other, the calibration cannot be implemented. Then, in view of this, if use is made of, for example, a calibration pattern in which the two GND lines are connected together at each one end thereof to surround the signal line or a calibration pattern in which the two GND lines are connected together at both ends of each of them to fully surround the signal line, the signal terminal of at least one of the RF measurement probe heads is disposed so as to lie across the GND line of the calibration pattern when performing the calibration.
- As a known technique, there is a disclosure that, in order to suppress parasitic inductance in property examination of a semiconductor integrated circuit device to enable a high-frequency property examination, a pair of an input signal electrode and an output signal electrode and a pair of an input GND electrode and an output GND electrode are disposed on the surface of an IC chip, and these input GND electrode and output GND electrode are electrically connected to a backside electrode, provided on the back side of the IC chip, via conductors provided in through holes formed through the IC chip in a thickness direction thereof, respectively, so as to be electrically connected to each other via the backside electrode, thereby achieving common grounding (e.g. see JP-A-H05-152395, paragraphs [0005] to [0006] and
FIGS. 1 and 2 ). - As another known technique, there is a disclosure that, in a square open-stub structure in a high frequency circuit for microwaves or millimeter waves, the voltage amplitude becomes zero at a position of λ/4 from an open-stub open end so that grounding is formed in a high-frequency manner (e.g. see JP-A-2000-101309, paragraph [0006] and
FIG. 5 ). - When, as described above, the signal terminal of the RF measurement probe head is disposed so as to lie across the GND line of the calibration pattern, an RF signal affects a measurement value so that the measurement value is largely biased following an increase in signal frequency. For example, observing an input-side reflection property when measurement is performed for a through pattern having a characteristic impedance of 50Ω, the impedance is largely biased from 50Ω following an increase in frequency.
- Conventionally, use has been made of a high frequency circuit of which the RF measurement can be performed by the use of different kinds of the measurement probe heads, for example, by the use of the SG-type RF measurement probe head and the GS-type RF measurement probe head. However, in order to achieve miniaturization and higher functions, demanded in recent years, of high frequency circuits, it becomes necessary to increase the degree of freedom in circuit arrangement. Consequently, there arises a case where the RF measurement cannot be carried out with the circuit property measurement using the measurement probe heads of the kinds in which the contacts are arranged differently, and it becomes necessary to implement the RF measurement by the use of the second SG-type RF measurement probe heads or the third GS-type RF measurement probe heads.
- Accordingly, there arises a new problem that when use is made of the second SG-type RF measurement probe heads or the third GS-type RF measurement probe heads as described above, accurate calibration of the RF measurement probe heads cannot be implemented by the use of the conventional calibration pattern.
- The present invention has been made for solving the foregoing problem and has a first object to provide a property measurement method for a high frequency circuit that can prevent an RF signal from affecting a measurement value in measurement of the RF signal, a second object to provide a calibration pattern that can prevent an RF signal from affecting a measurement value in measurement of the RE signal, and a third object to provide a calibration jig which makes it possible to easily exchange a calibration pattern that can prevent an RF signal from affecting a measurement value in measurement of the RF signal.
- According to one aspect of the invention, there is provided a high frequency circuit property measurement method comprising: preparing a calibration pattern comprising a substrate, a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate, a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line, a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line, and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner; and performing calibration prior to measurement of a to-be-measured circuit by using a first and a second property measurement probe head having the same arrangement of a signal terminal and a constant potential terminal, by bringing the signal terminal and the constant potential terminal of said first property measurement probe head into contact with said first end portion of the signal line and said one end portion of the first constant potential line of said calibration pattern, respectively, and by bringing the signal terminal and the constant potential terminal of said second property measurement probe head into contact with said second end portion of the signal line and said one end portion of the second constant potential line of said calibration pattern, respectively.
- Accordingly, in a high frequency circuit property measurement method according to the present invention, neither of the signal terminals of the first and second property measurement probe heads is disposed so as to lie across the constant potential line of the calibration pattern.
- Therefore, since an RF signal does not affect either of the signal terminals of the first and second property measurement probe heads, accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
- According to another aspect of the invention, there is provided a calibration pattern comprising: a substrate; a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate; a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line; a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line; and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner.
- Accordingly, a calibration pattern according to the present invention is advantageous in a high frequency circuit property measurement as either of the signal terminals of the RF measurement probe heads does not lie across the GND line even when the SG-type RF measurement probe heads or the GS-type RF measurement probe heads are used so as to confront each other with their signal terminals being brought into contact with the signal line of the calibration pattern.
- Therefore, the RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy.
- According to still another aspect of the invention, there is provided a calibration jig comprising: a calibration pattern comprising, a substrate, a signal line having one characteristic impedance and extending to have a first and a second end portion on said substrate, a first constant potential line having one end portion disposed close to and with a predetermined interval from said first end portion of the signal line, a second constant potential line having one end portion disposed close to and with a predetermined interval from said second end portion of the signal line, and a conductor for connecting between said first constant potential line and said second constant potential line electrically or in a high-frequency manner; and a dielectric substrate having a recessed portion formed on the surface thereof for exchangeably mounting therein the calibration pattern.
- Accordingly, a calibration jig according to the present invention is advantageous in a high frequency circuit property measurement as the calibration Jig makes it possible to carry out calibration at predetermined required frequencies by the use of one jig.
- Consequently, selection of high frequency circuits can be accurately and easily performed to thereby improve the yield of high frequency circuit devices with the simple process.
- Other objects and advantages of the invention will become apparent from the detailed description given hereinafter. It should be understood, however, that the detailed description and specific embodiments are given by way of illustration only since various changes and modifications within the scope of the invention will become apparent to those skilled in the art from this detailed description.
-
FIG. 1 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 2 is a sectional view of the RF measurement calibration pattern taken along a line II-II inFIG. 1 . -
FIG. 3 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according toEmbodiment 1 of the present invention. -
FIG. 4 is a block diagram for explaining a measurement system for a high frequency circuit according to the present invention. -
FIGS. 5 and 6 are block diagrams for explaining a method of performing zero correction of the measurement system for the high frequency circuit according to the present invention. -
FIG. 7 is an exemplary diagram showing a measurement system when performing S-parameter measurement of a high frequency circuit, according to the present invention. -
FIGS. 8, 9 , 10, and 11 are exemplary diagrams showing the calibration method when carrying out the S-parameter measurement of the high frequency circuit, according to the present invention. -
FIG. 12 is a sectional view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 13 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 14 is a sectional view of the RF measurement calibration pattern taken along a line XIV-XIV inFIG. 13 . -
FIG. 15 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 16 is a sectional view of the RF measurement calibration pattern taken along a line XVI-XVI inFIG. 15 . -
FIG. 17 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 18 is a sectional view of the RF measurement calibration pattern taken along a line XVIII-XVIII inFIG. 17 . -
FIG. 19 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 20 is a sectional view of the RF measurement calibration pattern taken along a line XX-XX inFIG. 19 . -
FIG. 21 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 22 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Modification 6 of the present invention. -
FIG. 23 ,FIG. 24 , andFIG. 25 are plan views of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 26 is a sectional view of the RF measurement calibration pattern taken along a line XXVI-XXVI inFIG. 25 . -
FIG. 27 ,FIG. 28 ,FIG. 29 ,FIG. 30 ,FIG. 31 ,FIG. 32 ,FIG. 33 ,FIG. 34 ,FIG. 35 ,FIG. 36 , andFIG. 37 are plan views of an RF measurement calibration pattern according to one embodiment of the present invention. -
FIG. 38 is a plan view of an RF measurement calibration jig according to one embodiment of the present invention. -
FIG. 39 is a sectional view of the RF measurement calibration jig taken along a line XXXIX-XXXIX inFIG. 38 . - In all figures, the substantially same elements are given the same reference numbers.
-
FIG. 1 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 2 is a sectional view of the RF measurement calibration pattern taken along a line II-II inFIG. 1 . In the drawings to be referred, the same symbols represent the same or corresponding components, respectively. - In
FIGS. 1 and 2 , there is shown an RFmeasurement calibration pattern 10 being one example ofEmbodiment 1. - The RF
measurement calibration pattern 10 comprises adielectric substrate 12 serving as a substrate. Asignal line 14 having a specific characteristic impedance of, for example, 50Ω is disposed on the surface of thedielectric substrate 12. Thesignal line 14 has a linear shape with both opposite ends and comprises ametal layer 141 and a gold-plating layer 142 disposed on the surface of themetal layer 141. Those both opposite ends of thesignal line 14 will be referred to as, for example, afirst end portion 14 a and asecond end portion 14 b, respectively. - A
first GND pad 16 serving as a first constant potential line is disposed with a predetermined interval defined between itself and thefirst end portion 14 a of thesignal line 14. Thefirst GND pad 16 has a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction and is electrically separated from thesignal line 14. The other end portion of thefirst GND pad 16 is connected to a through-hole electrode 18. - The
first GND pad 16 is connected to abackside metal layer 22, disposed on the back side of thedielectric substrate 12, via the through-hole electrode 18 and a viahole 20 formed by burying a conductor in a through hole formed through thedielectric substrate 12 in its thickness direction. Thefirst GND pad 16 comprises ametal layer 161 and a gold-plating layer 162 disposed on the surface of themetal layer 161. In this embodiment, the through-hole electrode 18 connected to thefirst GND pad 16 is formed by themetal layer 161 part of which also forms thefirst GND pad 16. - Further, a
second GND pad 24 serving as a second constant potential line is disposed with the predetermined interval defined between itself and thesecond end portion 14 b of thesignal line 14. Thesecond GND pad 24 has a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction and is electrically separated from thesignal line 14. The other end portion of thesecond GND pad 24 is connected to a through-hole electrode 18. - The
second GND pad 24 is connected to thebackside metal layer 22, disposed on the back side of thedielectric substrate 12, via the through-hole electrode 18 and a viahole 20 formed by burying a conductor in a through hole formed through thedielectric substrate 12 in its thickness direction. Thesecond GND pad 24 comprises ametal layer 241 and a gold-plating layer 242 disposed on the surface of themetal layer 241. In this embodiment, the through-hole electrode 18 connected to thesecond GND pad 24 is formed by themetal layer 241 part of which also forms thesecond GND pad 24. - Accordingly, the
first GND pad 16 and thesecond GND pad 24 are electrically connected together via the conductors, i.e. the through-hole electrodes 18, the via holes 20, and thebackside metal layer 22. In this embodiment, thefirst GND pad 16 and thesecond GND pad 24 are grounded, but may not necessarily be grounded if electrically conducted via the through-hole electrodes 18, the via holes 20, and thebackside metal layer 22. -
FIG. 3 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according toEmbodiment 1 of the present invention. - In
FIG. 3 , an RFmeasurement probe head 30 and an RFmeasurement probe head 32 are disposed so as to confront each other like in an ordinary measurement state. In the description of this embodiment, the two RF measurement probe heads 30 and 32 are both, for example, SG-type RF measurement probe heads. - In calibration, a signal terminal 301 (indicated as S in
FIG. 3 ) of the RFmeasurement probe head 30 is in contact with thesignal line 14 while a GND terminal 302 (indicated as G inFIG. 3 ) thereof is in contact with thefirst GND pad 16. Further, a signal terminal 321 (indicated as S inFIG. 3 ) of the RFmeasurement probe head 32 is in contact with thesignal line 14 while a GND terminal 322 (indicated as G inFIG. 3 ) thereof is in contact with thesecond GND pad 24. - When the calibration is carried out using the RF
measurement calibration pattern 10, either of thesignal terminal 301 and thesignal terminal 321 does not lie across the GND line. Therefore, an RF signal does not affect a measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RFmeasurement probe head 30 and the RFmeasurement probe head 32 with high accuracy. - Now, description will be given about a calibration method for the RF measurement probe heads.
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FIG. 4 is a block diagram for explaining a measurement system for a high frequency circuit according to the present invention.FIGS. 5 and 6 are block diagrams for explaining a method of performing zero correction of the measurement system for the high frequency circuit according to the present invention. This zero correction method is carried out when, for example, performing noise measurement or input/output measurement of the high frequency circuit. - As shown in
FIG. 4 , the measurement system for the high frequency circuit is as follows. - A signal from a
signal source 36 is input into a to-be-measured circuit 40 via aninput circuit 38. The signal input is measured by afirst power meter 37 disposed between thesignal source 36 and theinput circuit 38. The signal input into the to-be-measured circuit 40 is performed via an SG-type RFmeasurement probe head 32 like that shown inFIG. 3 . - An output from the to-be-measured-
circuit 40 is delivered to anoutput circuit 46 via, for example, an SG-type RFmeasurement probe head 30 like that shown inFIG. 3 and the signal output is measured by asecond power meter 48. - Description will be given about the zero correction method for the high frequency circuit measurement system shown in
FIG. 4 . - (1) First, in
FIG. 5 , thesignal source 36 and theinput circuit 38 are connected together via thefirst power meter 37 and further thesecond power meter 48 is connected to an RF input-side end surface of the to-be-measured circuit 40. In this state, a correction value is input into thefirst power meter 37 so that the power at the RF input-side end surface of the to-be-measured circuit 40 coincides with the output power at an end surface of thesignal source 36. - This correction value corresponds to a passing loss of the input-side circuit of the measurement system and, by carrying out this correction, a power value, obtained at the
first power meter 37, of an output portion of thesignal source 36 and the power at the RF input-side end surface of the to-be-measured circuit 40 become equal to each other. - (2) Then, as shown in
FIG. 6 , the RFmeasurement calibration pattern 10 is introduced in place of the to-be-measured circuit 40 in the high frequency circuit measurement system shown inFIG. 4 and correction is carried out for a passing loss of the output-side circuit of the measurement system. - Specifically, in the measurement system shown in
FIG. 6 , thesignal terminal 321 and theGND terminal 322 of the SG-type RFmeasurement probe head 32 serving as the RF input-side end surface of the to-be-measured circuit 40 are brought into contact with thesignal line 14 and thesecond GND pad 24 of the RFmeasurement calibration pattern 10, respectively, while thesignal terminal 301 and theGND terminal 302 of the output-side RFmeasurement probe head 30 are brought into contact with thesignal line 14 and thefirst GND pad 16 of the RFmeasurement calibration pattern 10, respectively. This contact state is the same as that shown inFIG. 3 . - In this state, a correction value is input into the
second power meter 48 so that a value obtained at thesecond power meter 48 coincides with a value obtained at thefirst power meter 37. This correction value corresponds to a passing loss of the output-side circuit of the measurement system. - After implementing the correction for the passing loss of the input-side circuit and the passing loss of the output-side circuit as described above, noise measurement and input/output measurement of the to-be-measured circuit are carried out.
- Since the calibration is carried out using the RF
measurement calibration pattern 10, either of thesignal terminal 301 and thesignal terminal 321 does not lie across the GND line during the calibration. Therefore, an RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RFmeasurement probe head 30 and the RFmeasurement probe head 32 with high accuracy. - Now, description will be given about a calibration method when performing S-parameter measurement, as one example of calibration.
-
FIG. 7 is an exemplary diagram showing a measurement system when performing S-parameter measurement of a high frequency circuit, according to the present invention.FIGS. 8, 9 , 10, and 11 are exemplary diagrams showing the calibration method when carrying out the S-parameter measurement of the high frequency circuit, according to the present invention. Herein, as one example, description will be given about a case where a SOLT method is used. - In
FIG. 7 , an RFmeasurement probe head 30 and an REmeasurement probe head 32 are connected to a network analyzer (NWA) 50 via, for example,coaxial cables 52, respectively. By bringing the RFmeasurement probe head 30 and the RFmeasurement probe head 32 into contact with a high frequency circuit, i.e. a to-be-measured circuit 40, the S-parameter measurement is carried out. In this event, it is necessary to derive a correction value for thecoaxial cable 52 and the RFmeasurement probe head 30 and a correction value for thecoaxial cable 52 and the RFmeasurement probe head 32. - Next, description will be given about the calibration method when implementing the S-parameter measurement.
- (1) Referring to
FIG. 8 , the RFmeasurement probe head 30 and the RFmeasurement probe head 32 are each connected to aresistance pattern 54 having a circuit characteristic impedance of, for example, 50Ω to thereby carry out measurement for calibration of thenetwork analyzer 50. - (2) Referring to
FIG. 9 , the RFmeasurement probe head 30 and the RFmeasurement probe head 32 are each put in an open state to thereby carry out measurement for the calibration of thenetwork analyzer 50. - (3) Referring to
FIG. 10 , the RFmeasurement probe head 30 and the RFmeasurement probe head 32 are each connected to ashort pattern 56 to thereby carry out measurement for the calibration of thenetwork analyzer 50. - (4) Referring to
FIG. 11 , the RFmeasurement probe head 30 and the RFmeasurement probe head 32 are connected to the RFmeasurement calibration pattern 10 to thereby carry out measurement for the calibration of thenetwork analyzer 50. - Specifically, the
signal terminal 321 and theGND terminal 322 of the RFmeasurement probe head 32 are brought into contact with thesignal line 14 and thesecond GND pad 24 of the RFmeasurement calibration pattern 10, respectively, while thesignal terminal 301 and theGND terminal 302 of the RFmeasurement probe head 30 are brought into contact with thesignal line 14 and thefirst GND pad 16 of the RFmeasurement calibration pattern 10, respectively. This contact state is the same as that shown inFIG. 3 . In this state, the measurement is carried out for the calibration of thenetwork analyzer 50. - In this event, the characteristic impedance of the RF
measurement calibration pattern 10 should be equal to that of theresistance pattern 54. - Using results of the measurements (1) to (4), calculation is carried out for correcting respective S parameters.
- Thereafter, the S-parameter measurement of the to-
be-measured circuit 40 is implemented using thecoaxial cable 52 and the RFmeasurement probe head 30 in the calibrated state and thecoaxial cable 52 and the RFmeasurement probe head 32 in the calibrated state. - Also in this calibration, since the calibration is carried out using the RF
measurement calibration pattern 10, either of thesignal terminal 301 and thesignal terminal 321 does not lie across the GND line. Therefore, an RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RFmeasurement probe head 30, the RFmeasurement probe head 32, and thecoaxial cables 52 with high accuracy. -
Modification 1 -
FIG. 12 is a sectional view of an RF measurement calibration pattern according to one embodiment of the present invention. - A plan view of the RF
measurement calibration pattern 58 shown inFIG. 12 is the same asFIG. 1 being the plan view of the RFmeasurement calibration pattern 10 ofEmbodiment 1. Further, the RFmeasurement calibration pattern 58 shown inFIG. 12 is sectioned along a line corresponding to the line II-II inFIG. 1 . - The RF
measurement calibration pattern 58 is formed by further disposing adielectric layer 60 so as to cover thebackside metal layer 22 of the RFmeasurement calibration pattern 10. - When performing measurement using the RF
measurement probe head 30 and the RFmeasurement probe head 32 that are disposed in such a manner as to confront each other, if calibration is carried out using the RFmeasurement calibration pattern 58, either of thesignal terminal 301 and thesignal terminal 321 does not lie across the GND line like in case of the RFmeasurement calibration pattern 10. Therefore, an RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RFmeasurement probe head 30 and the RFmeasurement probe head 32 with high accuracy. Further, even when thebackside metal layer 22 is set to a constant potential, for example, a ground potential, since thebackside metal layer 22 is covered with thedielectric layer 60, it is possible to stably carry out the calibration of the RFmeasurement probe head 30 and the RFmeasurement probe head 32 regardless of the state of a place where the RFmeasurement calibration pattern 58 is disposed. - Modification 2
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FIG. 13 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 14 is a sectional view of the RF measurement calibration pattern taken along a line XIV-XIV inFIG. 13 . - In the RF
measurement calibration pattern 62 shown inFIGS. 13 and 14 , abackside metal layer 64 extends to the surface of adielectric substrate 12 via side surfaces thereof so as to be electrically connected to end portions, each on the side remote from or not adjacent to asignal line 14, of afirst GND pad 16 and asecond GND pad 24, respectively. Therefore, the through-hole electrodes 18 and the via holes 20, which are provided inEmbodiment 1, are not provided. - That is, the end portions, each on the side not adjacent to the
signal line 14, of thefirst GND pad 16 and thesecond GND pad 24 are directly connected to each other so as to be electrically conducted. - In the RF
measurement calibration pattern 62 thus structured, in addition to the effect of the RFmeasurement calibration pattern 10, it is possible to increase areas of portions of thebackside metal layer 64 disposed on the side surfaces of thedielectric substrate 12, and therefore, it is possible to reduce parasitic inductance components that are generated when thefirst GND pad 16 and thesecond GND pad 24 are commonly grounded. - Modification 3
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FIG. 15 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 16 is a sectional view of the RF measurement calibration pattern taken along a line XVI-XVI inFIG. 15 . - In the REF
measurement calibration pattern 66 shown inFIGS. 15 and 16 ,open stubs 68 serving as conductors are connected to end portions, each on the side not adjacent to asignal line 14, of afirst GND pad 16 and asecond GND pad 24, respectively. - By setting a size of the
open stub 68 to a quarter of a wavelength of frequency of a signal to be measured, thefirst GND pad 16 and thesecond GND pad 24 are connected together via theopen stubs 68 in a high-frequency manner. Therefore, in the RFmeasurement calibration pattern 66, in addition to the effect of the RFmeasurement calibration pattern 10 ofEmbodiment 1, the via holes 20 and thebackside metal layer 22 in the RFmeasurement calibration pattern 10 or thebackside metal layer 64 extending to the surface of thedielectric substrate 12 via the side surfaces thereof in the RFmeasurement calibration pattern 62 of Modification 2 becomes unnecessary so that the production of the RF measurement calibration pattern is facilitated. - Modification 4
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FIG. 17 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 18 is a sectional view of the RF measurement calibration pattern taken along a line XVIII-XVIII inFIG. 17 . - In the RF
measurement calibration pattern 70 shown inFIGS. 17 and 18 , end portions, each on the side not adjacent to afirst end portion 14 a or asecond end portion 14 b of asignal line 14, of afirst GND pad 16 and asecond GND pad 24 are connected together via anextended portion 72 of the GND pads to form an S-shape on the surface of adielectric substrate 12, while thesignal line 14 crossing thisextended portion 72 has anair bridge 14 c formed at a portion thereof and straddles the extendedportion 72 at thisair bridge 14 c. - In the RF
measurement calibration pattern 70, in addition to the effect of the RFmeasurement calibration pattern 10 ofEmbodiment 1, the via holes 20 and thebackside metal layer 22 in the RFmeasurement calibration pattern 10 or thebackside metal layer 64 extending to the surface of thedielectric substrate 12 via the side surfaces thereof in the RFmeasurement calibration pattern 62 of Modification 2 becomes unnecessary so that the production of the RF measurement calibration pattern is facilitated. There may be a case where the characteristic impedance of theair bridge 14 c of thesignal line 14 differs from that of a portion other than theair bridge 14 c of thesignal line 14 and, in this case, it may be necessary to determine a width of theair bridge 14 c so that the impedance of theair bridge 14 c matches that of the portion other than theair bridge 14 c. - Modification 5
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FIG. 19 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 20 is a sectional view of the RF measurement calibration pattern taken along a line XX-XX inFIG. 19 . - In the RF
measurement calibration pattern 74 shown inFIGS. 19 and 20 , end portions, each on the side not adjacent to asignal line 14, of afirst GND pad 16 and asecond GND pad 24 are connected together via anextended portion 72 to form an S-shape on the surface of adielectric substrate 12, while thisextended portion 72 has anair bridge 72 a formed at a portion thereof and straddles thesignal line 14 at thisair bridge 72 a. - The RF
measurement calibration pattern 74 thus structured exhibits an effect like that of the RFmeasurement calibration pattern 70 of Modification 4. - There may be a case where the characteristic impedance of the
air bridge 72 a, under which thesignal line 14 is located, of the extendedportion 72 does not match that of the other portion and, in this case, it may be necessary to change a width of the line in consideration thereof. - Modification 6
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FIG. 21 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - In the RF
measurement calibration pattern 76 shown inFIG. 21 , afirst GND pad 16 is disposed with a predetermined interval defined between itself and afirst end portion 14 a of asignal line 14. What differs from the RFmeasurement calibration pattern 10 resides in that thefirst GND pad 16 in this modification has a front end portion disposed along thesignal line 14 so as to confront thesignal line 14. Thefirst GND pad 16 is electrically separated from thesignal line 14. The other end portion of thefirst GND pad 16 extends in a direction away from thesignal line 14 and is connected to a through-hole electrode 18. - Further, a
second GND pad 24 is disposed with the predetermined interval defined between itself and asecond end portion 14 b of thesignal line 14. Thesecond GND pad 24 also has a front end portion disposed along thesignal line 14 so as to confront thesignal line 14 and is electrically separated from thesignal line 14. The other end portion of thesecond GND pad 24 extends in a direction away from thesignal line 14 and is connected to a through-hole electrode 18. - The
first GND pad 16 and thesecond GND pad 24 are not located exactly face to face, but are disposed so as to confront each other via thesignal line 14 interposed therebetween. - The
first GND pad 16 and thesecond GND pad 24 are electrically connected together via the through-hole electrodes 18, viaholes 20, and abackside metal layer 22. - A sectional view, taken along a line XXI-XXI in
FIG. 21 , of the RFmeasurement calibration pattern 76 corresponds toFIG. 2 . - Further, like the RF
measurement calibration pattern 58 ofModification 1, the RFmeasurement calibration pattern 76 may further have adielectric layer 60 disposed to cover thebackside metal layer 22, -
FIG. 22 is an exemplary diagram showing the state where RF measurement probe heads are in contact with the RF measurement calibration pattern according to Modification 6 of the present invention. - In
FIG. 22 , like in case of the RFmeasurement calibration pattern 10, an RFmeasurement probe head 30 and an RFmeasurement probe head 32 are disposed so as to confront each other. These two RF measurement probe heads 30 and 32 are both, for example, SG-type RF measurement probe heads. - When the calibration is carried out using the RF
measurement calibration pattern 76, either of asignal terminal 301 of the RFmeasurement probe head 30 and asignal terminal 321 of the RFmeasurement probe head 32 does not lie across the GND line. Therefore, an RF signal does not affect a measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RFmeasurement probe head 30 and the RFmeasurement probe head 32 with high accuracy. - Further, since the
signal terminal 301 of the RFmeasurement probe head 30 and thesignal terminal 321 of the RFmeasurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of thesignal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy. - Modification 7
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FIG. 23 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 78 shown inFIG. 23 has basically the same structure as the RFmeasurement calibration pattern 62 of Modification 2 shown inFIGS. 13 and 14 . What differs from the RFmeasurement calibration pattern 62 resides in that while thefirst GND pad 16 and thesecond GND pad 24 of the REFmeasurement calibration pattern 62 each have a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction, afirst GND pad 16 and asecond GND pad 24 of the RFmeasurement calibration pattern 78 each have a front end portion disposed along asignal line 14 and abackside metal layer 64 is in contact with side surfaces of thefirst GND pad 16 and thesecond GND pad 24, respectively. - The other structure of the RF
measurement calibration pattern 78 is the same as that of the RFmeasurement calibration pattern 62. A sectional view, taken along a line XXIII-XXIII inFIG. 23 , of the RFmeasurement calibration pattern 78 corresponds toFIG. 14 . - Therefore, in the RF
measurement calibration pattern 78, in addition to the effect of the RFmeasurement calibration pattern 62, since thesignal terminal 301 of the RFmeasurement probe head 30 and thesignal terminal 321 of the RFmeasurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of thesignal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy. - Modification 8
-
FIG. 24 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 80 shown inFIG. 24 has basically the same structure as the RFmeasurement calibration pattern 66 of Modification 3 shown inFIGS. 15 and 16 . What differs from the RFmeasurement calibration pattern 66 resides in that while thefirst GND pad 16 and thesecond GND pad 24 of the RFmeasurement calibration pattern 66 each have a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction, afirst GND pad 16 and asecond GND pad 24 of the RFmeasurement calibration pattern 80 each have a front end portion disposed along asignal line 14. - The other structure of the RF
measurement calibration pattern 80 is the same as that of the RFmeasurement calibration pattern 66. A sectional view, taken along a line XXIV-XXIV inFIG. 24 , of the RFmeasurement calibration pattern 80 corresponds toFIG. 16 . - Therefore, in the RF
measurement calibration pattern 80, in addition to the effect of the RFmeasurement calibration pattern 66, since thesignal terminal 301 of the RFmeasurement probe head 30 and thesignal terminal 321 of the RFmeasurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of thesignal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy. -
Modification 9 -
FIG. 25 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention.FIG. 26 is a sectional view of the RF measurement calibration pattern taken along a line XXVI-XXVI inFIG. 25 . - The RF
measurement calibration pattern 82 shown inFIG. 25 has basically the same structure as the RFmeasurement calibration pattern 70 of Modification 4 shown inFIG. 17 . What differs from the RFmeasurement calibration pattern 70 resides in that while thefirst GND pad 16 and thesecond GND pad 24 of the RFmeasurement calibration pattern 70 each have a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction, afirst GND pad 16 and asecond GND pad 24 of the RFmeasurement calibration pattern 82 are disposed along asignal line 14 and each have a front end portion disposed side by side with afirst end portion 14 a or asecond end portion 14 b of thesignal line 14. - The other structure of the RF
measurement calibration pattern 82 is the same as that of the RFmeasurement calibration pattern 70. - Therefore, in the RF
measurement calibration pattern 82, in addition to the effect of the REmeasurement calibration pattern 70, since thesignal terminal 301 of the RFmeasurement probe head 30 and thesignal terminal 321 of the RFmeasurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of thesignal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy. -
Modification 10 -
FIG. 27 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 84 shown inFIG. 27 has basically the same structure as the RFmeasurement calibration pattern 74 of Modification 5 shown inFIGS. 19 and 20 . What differs from the RFmeasurement calibration pattern 74 resides in that while thefirst GND pad 16 and thesecond GND pad 24 of the RFmeasurement calibration pattern 74 each have a front end portion located on a prolongation of thesignal line 14 in its longitudinal direction, afirst GND pad 16 and asecond GND pad 24 of the RFmeasurement calibration pattern 84 are disposed along asignal line 14 and each have a front end portion disposed side by side with afirst end portion 14 a or asecond end portion 14 b of thesignal line 14. - The other structure of the RF
measurement calibration pattern 84 is the same as that of the RFmeasurement calibration pattern 74. - A sectional view, taken along a line XXVII-XXVII in
FIG. 27 , of the RFmeasurement calibration pattern 84 corresponds toFIG. 20 . - Therefore, in the RF
measurement calibration pattern 84, in addition to the effect of the RFmeasurement calibration pattern 74, since thesignal terminal 301 of the RFmeasurement probe head 30 and thesignal terminal 321 of the RFmeasurement probe head 32 confront each other with a distance defined therebetween in a longitudinal direction of thesignal line 14 and are located close to each other in a lateral direction, the crosstalk is reduced so that the calibration can be carried out with high accuracy. - As described above, the RF measurement calibration pattern according to
Embodiment 1 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50Ω and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting between the first GND pad and the second GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting between the first GND pad and the second GND pad, or the open stubs for connecting between the first GND pad and the second GND pad in a high-frequency manner. With this structure, even when the SG-type RF measurement probe heads or the GS-type RF measurement probe heads are used so as to confront each other with their signal terminals being brought into contact with the signal line of the calibration pattern, either of the signal terminals of the RF measurement probe heads does not lie across the GND line. Therefore, the RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy. - Further, in the high frequency circuit property measurement method for carrying out the calibration by the use of the RF measurement calibration pattern according to
Embodiment 1, since the RF signal has no effect on either of the signal terminals of the first and second property measurement probe heads, the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices. - The foregoing description has been given about the case where the SG-type RF measurement probe heads are used. However, if the first GND pad and the second GND pad are arranged so as to be in a reflected image relation with respect to the center axis of the signal line, the present invention is also applicable to a case where the GS-type RF measurement probe heads are used.
-
FIG. 28 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 86 shown inFIG. 28 has basically the same structure as the RFmeasurement calibration pattern 76 of Modification 6 ofEmbodiment 1 shown inFIG. 21 . What differs from the RFmeasurement calibration pattern 76 resides in that there is further disposed athird GND pad 88 serving as a third constant potential line that confronts face to face thefirst GND pad 16 of the RFmeasurement calibration pattern 76 via thesignal line 14 at thefirst end portion 14 a thereof and is electrically separated from thesignal line 14. - The
third GND pad 88 has a front end portion disposed along thesignal line 14 and confronting face to face a front end portion of thefirst GND pad 16 via thesignal line 14. The other end portion of thethird GND pad 88 extends in a direction away from thesignal line 14 and is connected to a through-hole electrode 18. - The
third GND pad 88 is electrically connected to thebackside metal layer 22 via the through-hole electrode 18 and a viahole 20. Therefore, thethird GND pad 88 is electrically connected to thefirst GND pad 16 and thesecond GND pad 24. - The structure of the
third GND pad 88 is the same as that of thefirst GND pad 16, wherein a gold-plating layer is disposed on the surface of a metal layer. In this embodiment, the through-hole electrode 18 connected to thethird GND pad 88 is formed by the metal layer part of which also forms thethird GND pad 88. - A sectional view taken along a line XXVIII-XXVIII in
FIG. 28 corresponds toFIG. 2 . - In the RF
measurement calibration pattern 86 according to Embodiment 2, an SG-type RE measurement probe head is put in contact at thesecond end portion 14 b of thesignal line 14 while an SG-type, GS-type or GSG-type RF measurement probe head is contactable at thefirst end portion 14 a of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein the
second GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, if the calibration is carried out using the RFmeasurement calibration pattern 86, either of the signal terminals does not lie across the GND line as described inEmbodiment 1. Therefore, an RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy. - Modification 11
-
FIG. 29 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 90 shown inFIG. 29 is a modification of Embodiment 2, but has basically the same structure as the RFmeasurement calibration pattern 78 of Modification 7 ofEmbodiment 1 shown inFIG. 23 . What differs from the RFmeasurement calibration pattern 78 resides in that there is further disposed athird GND pad 88 that confronts thefirst GND pad 16 of the RFmeasurement calibration pattern 78 via thesignal line 14 and is electrically separated from thesignal line 14. Thethird GND pad 88 has a front end portion disposed along thesignal line 14 and has a side surface contacting thebackside metal layer 64 like thefirst GND pad 16. Therefore, thefirst GND pad 16, thesecond GND pad 24, and thethird GND pad 88 are electrically connected together. - A sectional view taken along a line XXIX-XXIX in
FIG. 29 corresponds toFIG. 14 . - Therefore, the RF
measurement calibration pattern 90 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein thesecond GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 7 ofEmbodiment 1. -
Modification 12 -
FIG. 30 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 92 shown inFIG. 30 is a modification of Embodiment 2, but has basically the same structure as the RFmeasurement calibration pattern 80 of Modification 8 ofEmbodiment 1 shown inFIG. 24 . What differs from the RFmeasurement calibration pattern 80 resides in that there is further disposed athird GND pad 88 that confronts thefirst GND pad 16 of the RFmeasurement calibration pattern 80 via thesignal line 14 and is electrically separated from thesignal line 14. Thethird GND pad 88 has a front end portion disposed along thesignal line 14 and anopen stub 68 is connected to an end portion, on the side not adjacent to thesignal line 14, of thethird GND pad 88. - By setting a size of the
open stub 68 to a quarter of a wavelength of frequency of a signal to be measured, thefirst GND pad 16, thesecond GND pad 24, and thethird GND pad 88 are connected together via theopen stubs 68 in a high-frequency manner. - A sectional view taken along a line XXX-XXX in
FIG. 30 corresponds toFIG. 16 . - Therefore, the RF
measurement calibration pattern 92 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein thesecond GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that of Modification 8 ofEmbodiment 1. - Modification 13
-
FIG. 31 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 94 shown inFIG. 31 is a modification of Embodiment 2, but has basically the same structure as the RFmeasurement calibration pattern 82 ofModification 9 ofEmbodiment 1 shown inFIGS. 25 and 26 . What differs from the RFmeasurement calibration pattern 82 resides in that there is further disposed athird GND pad 88 that confronts thefirst GND pad 16 of the RFmeasurement calibration pattern 82 via thesignal line 14 and is electrically separated from thesignal line 14. Thethird GND pad 88 is disposed along thesignal line 14 and has a front end portion disposed side by side with thefirst end portion 14 a of thesignal line 14. Thethird GND pad 88 is connected to thefirst GND pad 16 and thesecond GND pad 24 via the extendedportion 72 on the surface of the dielectric substrate. - A sectional view taken along a line XXXI-XXXI in
FIG. 31 corresponds toFIG. 26 . - Therefore, the RF
measurement calibration pattern 94 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein thesecond GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that ofModification 9 ofEmbodiment 1. -
Modification 14 -
FIG. 32 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 96 shown inFIG. 32 is a modification of Embodiment 2, but has basically the same structure as the RFmeasurement calibration pattern 84 ofModification 10 ofEmbodiment 1 shown inFIG. 27 . What differs from the RFmeasurement calibration pattern 84 resides in that there is further disposed athird GND pad 88 that confronts thefirst GND pad 16 of the RFmeasurement calibration pattern 84 via thesignal line 14 and is electrically separated from thesignal line 14. Thethird GND pad 88 is disposed along thesignal line 14 and has a front end portion disposed side by side with thefirst end portion 14 a of thesignal line 14. Thethird GND pad 88 is connected to thefirst GND pad 16 and thesecond GND pad 24 via the extendedportion 72 on the surface of the dielectric substrate. - A sectional view taken along a line XXXII-XXXII in
FIG. 32 corresponds toFIG. 20 . - Therefore, the RF
measurement calibration pattern 96 is applicable when performing calibration for property measurement of a high frequency circuit by the use of the SG-type RF measurement probe heads, by the use of the GS-type RF measurement probe heads wherein thesecond GND pad 24 is arranged so as to be in a reflected image relation with respect to the center axis of the signal line from the current state, or by the use of the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head confronting thereto, and exhibits an effect like that ofModification 10 ofEmbodiment 1. - As described above, the RF measurement calibration pattern according to Embodiment 2 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50Ω and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, the third GND pad confronting face to face the first GND pad via the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting together the first GND pad, the second GND pad, and the third GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting together the first GND pad, the second GND pad, and the third GND pad, or the open stubs for connecting together the first GND pad, the second GND pad, and the third GND pad in a high-frequency manner. With this structure, even when the SG-type RF measurement probe heads, the GS-type RF measurement probe heads, or the SG-type RF measurement probe head and the GS-type or GSG-type RF measurement probe head are used so as to confront each other with their signal terminals being brought into contact with the signal line of the calibration pattern, either of the signal terminals of the RF measurement probe heads does not lie across the GND line. Therefore, the RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy.
- Further, in the high frequency circuit property measurement method for carrying out the calibration by the use of the RF measurement calibration pattern according to Embodiment 2, since the RF signal has no effect on either of the signal terminals of the first and second property measurement probe heads, the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
-
FIG. 33 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 98 shown inFIG. 33 is formed by further disposing, on the RFmeasurement calibration pattern 86 of Embodiment 2, afourth GND pad 100 serving as a fourth constant potential line that confronts thesecond GND pad 24 via thesignal line 14 and is electrically separated from thesignal line 14. - The
fourth GND pad 100 has a front end portion disposed along thesignal line 14 at thesecond end portion 14 b thereof and confronting face to face a front end portion of thesecond GND pad 24 via thesignal line 14. The other end portion of thefourth GND pad 100 extends in a direction away from thesignal line 14 and is connected to a through-hole electrode 18. - The
fourth GND pad 100 is electrically connected to thebackside metal layer 22 via the through-hole electrode 18 and a viahole 20. Therefore, thefourth GND pad 100 is electrically connected to thefirst GND pad 16, thesecond GND pad 24, and thethird GND pad 88. - The structure of the
fourth GND pad 100 is the same as that of thefirst GND pad 16, wherein a gold-plating layer is disposed on the surface of a metal layer. In this embodiment, the through-hole electrode 18 connected to thefourth GND pad 100 is formed by the metal layer part of which also forms thefourth GND pad 100. - A sectional view taken along a line XXXIII-XXXIII in
FIG. 33 corresponds toFIG. 2 . - In the RF
measurement calibration pattern 98 according to Embodiment 3, the RF measurement probe head of any type, i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of thefirst end portion 14 a and thesecond end portion 14 b of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the calibration can be carried out using the RF
measurement calibration pattern 100. When the calibration is implemented using the RFmeasurement calibration pattern 100, either of the signal terminals of the RF measurement probe heads of any type or types does not lie across the GND line of the RFmeasurement calibration pattern 100 as described inEmbodiment 1. Therefore, an RF signal does not affect a measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy. - Modification 15
-
FIG. 34 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 102 shown inFIG. 34 is a modification of Embodiment 3, but is formed by further disposing, on the RFmeasurement calibration pattern 90 of Modification 11 of Embodiment 2 shown inFIG. 29 , afourth GND pad 100 that confronts thesecond GND pad 24 via thesignal line 14 and is electrically separated from thesignal line 14. Thefourth GND pad 100 has a front end portion disposed along thesignal line 14 and has a side surface contacting thebackside metal layer 64 like thefirst GND pad 16. Therefore, thefirst GND pad 16, thesecond GND pad 24, thethird GND pad 88, and thefourth GND pad 100 are electrically connected together. - A sectional view taken along a line XXXIV-XXXIV in
FIG. 34 corresponds toFIG. 14 . - In the RF
measurement calibration pattern 102 according to Modification 15, the RF measurement probe head of any type, i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of thefirst end portion 14 a and thesecond end portion 14 b of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF
measurement calibration pattern 102 enables the calibration of the RF measurement probe heads and exhibits an effect like that of Modification 11 of Embodiment 2. -
Modification 16 -
FIG. 35 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 104 shown inFIG. 35 is a modification of Embodiment 3, but is formed by further disposing, on the RFmeasurement calibration pattern 92 ofModification 12 of Embodiment 2 shown inFIG. 30 , afourth GND pad 100 that confronts thesecond GND pad 24 via thesignal line 14 and is electrically separated from thesignal line 14. Thefourth GND pad 100 has a front end portion disposed along thesignal line 14 and anopen stub 68 is connected to an end portion, on the side not adjacent to thesignal line 14, of thefourth GND pad 100. Therefore, thefirst GND pad 16, thesecond GND pad 24, thethird &ND pad 88, and thefourth GND pad 100 are connected together in a high-frequency manner. - A sectional view taken along a line XXXV-XXXV in
FIG. 35 corresponds toFIG. 16 . - In the RF
measurement calibration pattern 104 according toModification 16, the RF measurement probe head of any type, i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of thefirst end portion 14 a and thesecond end portion 14 b of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF
measurement calibration pattern 104 enables the calibration of the RF measurement probe heads and exhibits an effect like that ofModification 12 of Embodiment 2. - Modification 17
-
FIG. 36 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 106 shown inFIG. 36 is a modification of Embodiment 3, but is formed by further disposing, on the RFmeasurement calibration pattern 94 of Modification 13 of Embodiment 2 shown inFIG. 31 , afourth GND pad 100 that confronts thesecond GND pad 24 via thesignal line 14 and is electrically separated from thesignal line 14. Thefourth GND pad 100 is disposed along thesignal line 14 and has a front end portion disposed side by side with thesecond end portion 14 b of thesignal line 14. Thefourth GND pad 100 is connected to thefirst GND pad 16, thesecond GND pad 24, and thethird GND pad 88 via the extendedportion 72 of the GND pads on the surface of the dielectric substrate. - A sectional view taken along a line XXXVI-XXXVI in
FIG. 36 corresponds toFIG. 26 . - In the RF
measurement calibration pattern 106 according to Modification 17, the RF measurement probe head of any type, i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of thefirst end portion 14 a and thesecond end portion 14 b of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF
measurement calibration pattern 106 enables the calibration of the RE measurement probe heads and exhibits an effect like that of Modification 13 of Embodiment 2. -
Modification 18 -
FIG. 37 is a plan view of an RF measurement calibration pattern according to one embodiment of the present invention. - The RF
measurement calibration pattern 108 shown inFIG. 37 is a modification of Embodiment 3, but is formed by further disposing, on the RFmeasurement calibration pattern 96 ofModification 14 of Embodiment 2 shown inFIG. 32 , afourth GND pad 100 that confronts thesecond GND pad 24 via thesignal line 14 and is electrically separated from thesignal line 14. Thefourth GND pad 100 is disposed along thesignal line 14 and has a front end portion disposed side by side with thesecond end portion 14 b of thesignal line 14. Thefourth GND pad 100 is connected to thefirst GND pad 16, thesecond GND pad 24, and thethird GND pad 88 via the extendedportion 72 of the GND pads on the surface of the dielectric substrate. - A sectional view taken along a line XXXVII-XXXVII in
FIG. 37 corresponds toFIG. 20 . - In the RF
measurement calibration pattern 108 according toModification 18, the RF measurement probe head of any type, i.e. any of the SG-type RF measurement probe head, the GS-type RF measurement probe head, and the GSG-type RF measurement probe head, is usable or contactable at each of thefirst end portion 14 a and thesecond end portion 14 b of thesignal line 14. - When performing calibration for property measurement of a high frequency circuit by the use of any type or types of the RF measurement probe heads, the RF
measurement calibration pattern 108 enables the calibration of the RF measurement probe heads and exhibits an effect like that ofModification 14 of Embodiment 2. - As described above, the RF measurement calibration pattern according to Embodiment 3 comprises the dielectric substrate, the signal line having one characteristic impedance of, for example, 50Ω and extending to have the first and second end portions on the dielectric substrate, the first GND pad having one end portion disposed close to and with a predetermined interval from the first end portion of the signal line, the second GND pad having one end portion disposed close to and with a predetermined interval from the second end portion of the signal line, the third GND pad confronting face to face the first GND pad via the signal line, the fourth GND pad confronting face to face the second GND pad via the signal line, and the through-hole electrodes, the via holes, and the backside metal layer for electrically connecting together the first GND pad, the second GND pad, the third &ND pad, and the fourth GND pad, or the backside metal layer extending to the surface of the dielectric substrate via the side surfaces thereof for electrically connecting together the first GND pad, the second GND pad, the third GND pad, and the fourth GND pad, or the open stubs for connecting together the first GND pad, the second GND pad, the third GND pad, and the fourth GND pad in a high-frequency manner. With this structure, even when the RF measurement probe heads of any combination among the SG-type RF measurement probe head/heads, the GS-type RF measurement probe head/heads, and the GSG-type RF measurement probe head/heads are used so as to confront each other with their signal terminals being brought into contact with the signal line of the calibration pattern, either of the signal terminals of the RF measurement probe heads does not lie across the GND line. Therefore, the RF signal does not affect the measurement value so that there is no occurrence of the measurement value being largely biased following an increase in signal frequency. Consequently, it is possible to implement the calibration of the RF measurement probe heads with high accuracy.
- Further, in the high frequency circuit property measurement method for carrying out the calibration by the use of the RF measurement calibration pattern according to Embodiment 3, since the RF signal has no effect on either of the signal terminals of the first and second property measurement probe heads of any combination, the accurate calibration can be achieved so that the property measurement of the high frequency circuit is precisely carried out. Consequently, selection of high frequency circuits can be accurately performed to thereby improve the yield of high frequency circuit devices.
-
FIG. 38 is a plan view of an RF measurement calibration jig according to one embodiment of the present invention.FIG. 39 is a sectional view of the RF measurement calibration jig taken along a line XXXIX-XXXIX inFIG. 38 . - In
FIGS. 38 and 39 , the RFmeasurement calibration jig 110 includes, as one example, the RFmeasurement calibration pattern 62 of Modification 2 ofEmbodiment 1 shown inFIGS. 13 and 14 . Note that use can be made of any of the foregoing RF measurement calibration patterns ofEmbodiment 1, Embodiment 2, and Embodiment 3. - A
dielectric substrate 112 of the RFmeasurement calibration jig 110 is formed with a recessedportion 112 a for mounting therein the RFmeasurement calibration pattern 62. The recessedportion 112 a is formed so as to exchangeably receive therein RF measurement calibration patterns, one at a time, having different lengths. Therefore, it is possible to carry out calibration at predetermined required frequencies with one jig. - As described above, the RF measurement calibration jig according to this embodiment makes it possible to carry out calibration at predetermined required frequencies by the use of one jig. Consequently, selection of high frequency circuits can be accurately and easily performed to thereby improve the yield of high frequency circuit devices with the simple process.
- The foregoing description has been given about the RF measurement calibration pattern using the dielectric substrate. However, the effect can be similarly achieved even when a signal line and respective GND pads are formed on a wafer instead of the dielectric substrate.
- As described above, the high frequency circuit property measurement method according to the present invention is suitable for an RF measurement method for a high frequency circuit for use in a communication device adapted for a microwave band or a millimeter wave band that is used in mobile communication, optical communication, satellite communication, and the like.
- While the presently preferred embodiments of the present invention have been shown and described. It is to be understood these disclosures are for the purpose of illustration and that various changes and modifications may be made without departing from the scope of the invention as set forth in the appended claims.
Claims (7)
1. (canceled)
2. A calibration pattern comprising:
a substrate;
a signal line having characteristic impedance and extending to first and second on said substrate;
a first constant potential line having a first end disposed close to and at a predetermined interval from said first end of said signal line;
a second constant potential line having a first end disposed close to and at a predetermined interval from the second end of said signal line; and
a conductor electrically coupling said first constant potential line to said second constant potential line.
3. The calibration pattern according to claim 2 , wherein the first end of each of said first and second constant potential lines is disposed in a prolongation direction of said signal line.
4. The calibration pattern according to claim 2 , wherein the first ends of said first and second constant potential lines are disposed along side portions of said signal line, respectively, and confront each others with said signal line therebetween.
5. The calibration pattern according to claim 4 , further comprising a third constant potential line having a first end confronting face-to-face the first end of said first constant potential line with said signal line therebetween and having a second end electrically coupled to conductor to which seconds ends of said first and second constant potential lines are electrically coupled.
6. The calibration pattern according to claim 5 , further comprising a fourth constant potential line having a first end confronting face-to-face the first end of said second constant potential line with said signal line therebetween and having a second end electrically coupled to said conductor to which the second ends of said first and second constant potential lines are electrically coupled.
7. A calibration jig comprising:
a calibration pattern comprising,
a substrate,
a signal line having a characteristic impedance and extending to first and second ends on said substrates,
a first constant potential line having a first end disposed close to and at a predetermined interval from said first end of the signal line,
a second constant potential line having a first end disposed close to and at a predetermined interval from the second end of said signal line, and
a conductor electrically coupling said first constant potential line to said second constant potential line; and
a dielectric substrate having a recessed portions in a surface for exchangeably mounting said calibration pattern in the recess.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/615,173 US20070103144A1 (en) | 2004-05-18 | 2006-12-22 | Calibration pattern and calibration jig |
Applications Claiming Priority (4)
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JP2004-148309 | 2004-05-18 | ||
JP2004148309A JP2005331298A (en) | 2004-05-18 | 2004-05-18 | Method for measuring characteristics of high-frequency circuit, pattern for calibration, and fixture for calibration |
US11/055,698 US7173433B2 (en) | 2004-05-18 | 2005-02-11 | Circuit property measurement method |
US11/615,173 US20070103144A1 (en) | 2004-05-18 | 2006-12-22 | Calibration pattern and calibration jig |
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US11/055,698 Division US7173433B2 (en) | 2004-05-18 | 2005-02-11 | Circuit property measurement method |
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US11/615,173 Abandoned US20070103144A1 (en) | 2004-05-18 | 2006-12-22 | Calibration pattern and calibration jig |
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US9347980B2 (en) | 2013-09-09 | 2016-05-24 | Kabushiki Kaisha Toshiba | Radio frequency characteristics measurement jig device |
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DE10143173A1 (en) * | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafer probe has contact finger array with impedance matching network suitable for wide band |
US6815963B2 (en) * | 2002-05-23 | 2004-11-09 | Cascade Microtech, Inc. | Probe for testing a device under test |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
KR100960496B1 (en) * | 2003-10-31 | 2010-06-01 | 엘지디스플레이 주식회사 | Rubbing method of liquid crystal display device |
GB2425844B (en) | 2003-12-24 | 2007-07-11 | Cascade Microtech Inc | Active wafer probe |
US7420381B2 (en) * | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
JP2006258667A (en) * | 2005-03-17 | 2006-09-28 | Nec Electronics Corp | Rf impedance measuring device of package substrate |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
JP5068500B2 (en) * | 2006-09-19 | 2012-11-07 | 三菱電機株式会社 | Millimeter wave RF probe pad |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
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US4926234A (en) * | 1986-08-06 | 1990-05-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device operating in high frequency range |
US5194932A (en) * | 1990-05-30 | 1993-03-16 | Nec Corporation | Semiconductor integrated circuit device |
US5198755A (en) * | 1990-09-03 | 1993-03-30 | Tokyo Electron Limited | Probe apparatus |
US5594358A (en) * | 1993-09-02 | 1997-01-14 | Matsushita Electric Industrial Co., Ltd. | Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission line |
US6617864B2 (en) * | 2000-02-25 | 2003-09-09 | Mitsubishi Denki Kabushiki Kaisha | High frequency probe for examining electric characteristics of devices |
US6555907B2 (en) * | 2001-02-09 | 2003-04-29 | Mitsubishi Denki Kabushiki Kaisha | High-frequency integrated circuit and high-frequency circuit device using the same |
US7157926B1 (en) * | 2005-09-06 | 2007-01-02 | Seiko Epson Corporation | Universal padset concept for high-frequency probing |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9347980B2 (en) | 2013-09-09 | 2016-05-24 | Kabushiki Kaisha Toshiba | Radio frequency characteristics measurement jig device |
Also Published As
Publication number | Publication date |
---|---|
KR20060045936A (en) | 2006-05-17 |
KR100723595B1 (en) | 2007-06-04 |
JP2005331298A (en) | 2005-12-02 |
US7173433B2 (en) | 2007-02-06 |
TWI280629B (en) | 2007-05-01 |
DE102005021247A1 (en) | 2005-12-15 |
DE102005021247B4 (en) | 2007-09-27 |
US20050258819A1 (en) | 2005-11-24 |
TW200601481A (en) | 2006-01-01 |
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