|Numéro de publication||US20070131877 A9|
|Type de publication||Demande|
|Numéro de demande||US 10/062,666|
|Date de publication||14 juin 2007|
|Date de dépôt||5 févr. 2002|
|Date de priorité||29 nov. 1999|
|Autre référence de publication||US7049587, US20030062487, US20030063792|
|Numéro de publication||062666, 10062666, US 2007/0131877 A9, US 2007/131877 A9, US 20070131877 A9, US 20070131877A9, US 2007131877 A9, US 2007131877A9, US-A9-20070131877, US-A9-2007131877, US2007/0131877A9, US2007/131877A9, US20070131877 A9, US20070131877A9, US2007131877 A9, US2007131877A9|
|Inventeurs||Takashi Hiroi, Masahiro Watanabe, Asahiro Kuni, Maki Tanaka, Munenori Fukunishi, Hiroshi Miyai, Yasuhiko Nara, Mitsunobu Isobe|
|Cessionnaire d'origine||Takashi Hiroi, Masahiro Watanabe, Asahiro Kuni, Maki Tanaka, Munenori Fukunishi, Hiroshi Miyai, Yasuhiko Nara, Mitsunobu Isobe|
|Exporter la citation||BiBTeX, EndNote, RefMan|
|Référencé par (6), Classifications (24), Événements juridiques (1)|
|Liens externes: USPTO, Cession USPTO, Espacenet|
1. Field of the Invention
The present invention is related to a manufacturing system for a substrate having a circuit pattern, such as a semiconductor device or liquid crystal display, and more particularly to the technology for inspecting a substrate pattern during fabrication.
2. Description of the Related Art
Conventional optical or electron beam pattern inspection systems are described in Japanese Patent Laid-open No. H5-258703 and Japanese Patent Laid-open No. H11-160247.
As an example,
In case of the both inspection systems, to confirm the results of the inspection, the inspected data was outputted to a review system. Thereafter, the wafer was transferred to and set on a table of the review system to review defects detected by the inspection system. In the review system, the defect to be reviewed was placed in a viewing field of the review system by using the inspected data outputted from the inspection system. Then visually observing the image to judging whether or not it was an actual defect or to infer what could have caused it. In these reviewing method, a vast amounts of image data acquired by the inspection were not effectively used.
The present invention is constituted such that an image of a defect portion, which is similar to an image of a defect portion specified on the basis of inspection results outputted by an inspection system and the defect portion image data thereof, is retrieved, and the conditions for the occurrence of a specific mode defect, which occurred in the past, can be grasped by displaying the retrieval results so as to enable identification.
A first constitution according to the present invention will be explained. A constitution that uses an electron beam will be shown here, but it is substantially identical to a constitution, which utilizes another charged particle.
Electron beam 2 from electron beam source 1 is irradiated onto target substrate 5 via object lens 4, and generated secondary electron 7 is detected by detector 8. Electron beam 1 is deflected by deflector 3, image data is formed by using stage 6 for scanning target substrate 5, [this image data] is converted from analog to digital by A/D converter 9, and a digital image is formed. Image processing circuit 110 compares this digital image with a digital image which is expected to be substantially identical, and detects a difference between the two images as a pattern defect 11. Defect data 200, comprising the defect location and image data of detected pattern defect 11, is stored in defect data storing means 201, and stored defect data 202 is outputted by data outputting means 203 as necessary to information transferring means 204 of either a network or a storage medium.
Defect data 202 of a plurality of wafers, which is outputted from outputting means 203, is inputted by inputting means 205 and is stored in a storing means 206, and the defect location data of the inputted defect data is displayed in defect map 207. When a specific defect on the defect map is selected by selecting means 208, an image of the selected specific defect is displayed on image displaying means 209. When a command is issued by search command means 210, a defect image similar to the displayed image is retrieved from among the stored defect data stored in the storing means 206 by image retrieving means 211, and the retrieval results are reflected in defect map 207. Retrieval results can be checked as needed by issuing a command via selecting means 208. The frequency at which similar defects occur can be checked by displaying in the time-series format shown in
These and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings.
The embodiments of the present invention will be explained hereinbelow using specific figures. The overall system will be explained first, and then the respective parts of the system will be explained.
The constitution of the first embodiment is shown in
That is, a target substrate 5 is loaded, and either a pattern inspection or an extraneous material inspection is carried out, or pattern dimensions are measured by inspection system A 152 and inspection system B 153. Measurement results 160, together with image data 161 of defective parts and measured portions are stored when inspection and measurement are performed, and measurement results 160 and image data 161 are outputted over network 150. These data are stored in server 151 one time.
Information of the measurement results 160 and image data 161 of a plurality of target substrate 5 stored in server 151 is transmitted to defect review system 154, and measurement results 160 are displayed on defect confirmation system 155. Based on the displayed results, image data 161 of a defective portion, which is similar to the image of a specific defect, is retrieved using a method, which will be explained hereinbelow, and the retrieval results are reflected on a display.
A first variation of this embodiment will be explained. That is, instead of executing a search via a defect checking system 155, a search can be executed via either inspection system A 152, or inspection system B 153, or server 151, or review system 154. Or, instead of the checking system 155, a search server 156 which is connected to the network 150 is provided, and a search is executed by the search server 156 and only the results are displayed via a system other than defect checking system 155 or search server 156. Further, a search can be executed by an arbitrary system without the need to provide search server 156 independently.
The constitution of a SEM-type pattern inspection system is shown in
The operation of the inspection system will be explained. When an inspection is started by a command from a user, stage 6 moves and the region to-be-inspected of the wafer 31 mounted on the stage 6 is to the scanning start position. A wafer-specific offset measured beforehand is added and set in offset 112, Z sensor 113 is made operative, stage 6 scans in the Y direction along scanning line 33 shown in
An inspection of all required regions is done by repeating the scan of the stage 6. When the detection is carried out in the location A 35 (Refer to
Outputted defect data 202 is inputted via inputting means 205 of results confirmation system 155 either via a network or from a storage medium, and defect location data from among the inputted defect data is displayed on defect map 207. When a specific item on the defect map is selected by selecting means 208, image data of the defect data is displayed in image format on image displaying means 209. When a command is issued by search command means 210, a defect image similar to the display image is retrieved by image retrieving means 211 from among the defect data group, and retrieval results are reflected on defect map 207. Retrieval results can be checked as needed by issuing a command via selecting means 208. The frequency at which similar defects occur can be checked by displaying in the time-series format shown in
An example of a display screen of results confirmation system 155 is shown in
Further, an image of a defect specified from among the defects displayed on the map display portion is displayed on image display portion 56, which corresponds to image displaying means 209 of
Further, when the zooming mode 146 is selected with the mouse operation command button 140, a display on map display portion 55 of the distribution of defects on a substrate can be either enlarged or reduced.
According to the present invention, an image of a defect portion, which is similar to an image of a defect portion specified on the basis of inspection results outputted by an inspection system and the defect portion image data thereof, is retrieved, and the conditions for the occurrence of a specific mode defect, which occurred in the past, can be grasped by displaying the retrieval results so as to enable identification. Further, [the present invention] is characterized in that it enables the provision of functions for sounding an alarm in response to a future specific mode-generated defect by setting retrieval conditions in the inspection system.
The invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiment is therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
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|US7932485 *||21 juil. 2008||26 avr. 2011||Sick Ag||Method and apparatus for the dynamic generation and transmission of geometrical data|
|US8859962 *||17 mars 2014||14 oct. 2014||Hitachi High-Technologies Corporation||Charged-particle microscope|
|US20140197313 *||17 mars 2014||17 juil. 2014||Hitachi High-Technologies Corporation||Charged-particle microscope|
|Classification aux États-Unis||250/492.2|
|Classification internationale||G01N23/00, G01B15/00, G01B15/04, G01N21/956, H01L21/027, G01N23/04, G06K9/64, G01N23/225, G01N23/22, G06T7/00, H01L21/66, G01N23/20, G01B15/08|
|Classification coopérative||G06K2209/19, G06K9/6211, G06T2207/30148, G06T7/001, G01N23/22, G06K9/033|
|Classification européenne||G06K9/62A1A3, G01N23/22, G06T7/00B1R, G06K9/03A|
|5 févr. 2002||AS||Assignment|
Owner name: HITACHI, LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HIROI, TAKASHI;WATANABE, MASAHIRO;KUNI, ASAHIRO;AND OTHERS;REEL/FRAME:012561/0106;SIGNING DATES FROM 20020107 TO 20020110
Owner name: HITACHI, LTD., JAPAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HIROI, TAKASHI;WATANABE, MASAHIRO;KUNI, ASAHIRO;AND OTHERS;SIGNING DATES FROM 20020107 TO 20020110;REEL/FRAME:012561/0106