US20070205515A1

US20070205515A1 - Device having a redundant structure

Info

Publication number: US20070205515A1
Application number: US11/746,508
Authority: US
Inventors: Birendra Agarwala; Du Binh Nguyen; Hazara Rathore
Original assignee: International Business Machines Corp
Current assignee: Auriga Innovations Inc
Priority date: 2005-11-15
Filing date: 2007-05-09
Publication date: 2007-09-06
Also published as: CN1967804A; US7279411B2; US20070111497A1; CN100452347C

Abstract

Device with a damascene interconnect for integrated circuits with improved reliability and improved electromigration properties. The device including a dual damascene line having a metal line and a via, and a redundant liner arranged to divide the metal line.

Description

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a divisional of U.S. patent application Ser. No. 11/164,223 filed Nov. 15, 2005, the disclosure of which is expressly incorporated by reference herein in its entirety.

FIELD OF THE INVENTION

The present invention relates to an interconnect structure, e.g., a damascene interconnect, for integrated circuits with improved reliability and improved electromigration properties.

BACKGROUND DESCRIPTION

According to the known art, “fatwire” structure is a wiring layout laid out with a metal line having thicker height and wider width, e.g., thickness and pitch of 2×, 4×, 6×, etc. of a thin wire, minimum ground rules dimensions. However, with regard to electromigration effects, reliability of fatwire structures with a larger pitch becomes worse than in a thin wire structure. This inconsistent reliability is due to the fatwire structure. In this regard, fatwire failure generally occurs at the top of the metal line, i.e., near the surface of the stripe, and/or at the bottom of the interlevel via. In the known structure, the bottom of the via may not fully contact the sidewall liner. Moreover, even when the via contacts the sidewall liner, the liner is too thin to sustain all the current density of the fatwire.
A conventional process for forming a dual damascene line is shown in FIGS. 1-4. In particular, a trench 12 is formed in a substrate 11 into which a metal, e.g., copper or aluminum, is provided, e.g., via electroplating, in order to form metal line Mx and at least one via Vx. Substrate 11 may be, e.g., Si0₂, a low K organic material, a PCVD low dielectric material or other suitable material having a thickness of 400 to 2500 angstroms, metal line Mx may have a thickness in a range between 0.4-1.0 micron and a width of 0.2 to 1.0 micron, and via Vx may have a depth of 0.4 to 1.0 micron from the bottom of Mx and a diameter of 0.2 to 0.4 micron. Moreover, substrate 11 may optionally be covered by a hardmask layer 13, which can be, e.g., a PCVD oxide, SiCNH, SiC, Si₃N₄, or other suitable material. Moreover, the portion of hardmask 13 over trench 12 removed during the formation of trench 12 is filled with metal Mx. Further, metal line Mx is patterned by removing excess metal from the upper surface of substrate 11 or optional hardmask 13, e.g., through chemical mechanical polishing, to form a smooth upper surface.
In a next production step, a cap layer 14 is applied over the top of substrate 11/hardmask 13 and metal line Mx. Cap layer 14 can be, e.g., SiN_x, SiCNH, or other suitable cap layer material for metal line Mx, and have a thickness of 200-1000 angstroms. A substrate or interlevel layer 15 is deposited onto cap layer 14. Interlayer 15, like substrate 11, can be, e.g., Si0₂, a low K organic material, a PCVD low k-dielectric material or other suitable material having a thickness of 4000 (1×) to 24000 (6×). Optionally, a hardmask layer 16 can be deposited onto the surface of interlevel layer 15. Hardmask layer 16 can be, e.g., a PCVD oxide, SiCNH, or other suitable material with a thickness of 300-2000 angstroms.
In a next step in the conventional process, as shown in FIG. 2, a dual damascene trench 17 is formed in interlevel layer 15 and optional hardmask 16. Trench 17, which is formed by, e.g., lithography and etching, is composed of two portions: a first portion 18 extending to a depth of 0.6-2 micron from the surface of interlevel layer 15/hardmask 16 and a second portion 19 extending from first portion 18 down through cap layer 14 to contact metal line Mx.
As illustrated in FIG. 3, a liner 20 is deposited into trench 17 in order to form a barrier layer having a thickness of 50-500 angstroms. Liner 20 can be, e.g., Ta, TaN, W, Ti, TiN, or a combination of Ta, TaN, Ti, TiN, W or with other suitable material to act as a barrier layer for the metal to be deposited in liner 20. Moreover, liner 20 can be formed from one or more of the identified materials.
As noted above, and shown in FIG. 4, a metal, e.g., copper, is deposited in trench 17, and more particularly liner 20, in order to form metal line MQ in portion 18 of trench 17 and via VL in portion 19 of trench 17. Further, in accordance with the conventional process, wiring lines are patterned by removing excess metal from metal line MQ from the upper surface of substrate 15 or optional hardmask 16, e.g., through chemical mechanical polishing, to achieve a smooth upper surface with a metal stripe.

SUMMARY OF THE INVENTION

The present invention is directed to a method of fabricating a device. The method includes forming a trench in a metal stripe of a dual damascene line, depositing a barrier layer in the trench, and filling a remainder of the trench with metal.
Moreover, the present invention is directed to a device that includes a dual damascene line having a metal line and a via, and a redundant liner arranged to divide the metal line.
The instant invention is directed to a method for fabricating an interconnect structure. The method includes forming a trench in a substrate, depositing metal in the trench, forming a second trench in the metal, depositing a redundant liner in the second trench, and depositing metal in the second trench.
Still further, the invention is directed to a method of forming a redundant device that includes forming a redundant liner to divide a metal line of dual damascene line.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-4 illustrate a conventional formation of a dual damascene line (prior arts); and
FIGS. 5-10 illustrate the formation of a redundant fatwire from the conventional dual damascene line depicted in FIG. 4 in accordance with the features of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT INVENTION

The invention relates to a process for forming a wire from a conventional dual damascene line. According to the invention, the formed fatwire eliminates the line opens and improves reliability (electromigration) by providing a longer lifetime and tighter sigma than conventional fatwire structures.
According to the invention, the fatwire structure includes a thin redundant liner in the fatwire interconnect structure to isolate voids from underneath the via and to prevent such voids from propagating upward above the redundant liner. As a result, upward propagation of voids into the upper part of the metal layer is prevented.
The via opening is etched through the redundant liner, which increases the mechanical strength of the interconnect and essentially eliminates any thermal cycle and/or stress migration effects. Further, the depth of the via improves performance against the electromigration effects by increasing contact surface around the via.
The present invention increases the reliability of the conventional dual damascene line shown in FIG. 4 by using a redundant line. In particular, as illustrated in FIG. 5, a blanket reactive ion etch (RIE) or a blanket wet etch is performed on the metal stripe, e.g., copper, to remove a portion of the thickness of metal line MQ to form metal line MQ′. However, the portion of barrier layer 20 lying adjacent the removed thickness is not removed, such that a trench 21 is formed between facing portions of barrier layer 20 and between an upper surface of metal line MQ′ and the upper surface of interlevel layer 15/hardmask 16. Trench 21 can be up to one-half of the thickness of metal line MQ, may be at least 100 angstroms, and preferably, is between 10-30% of the thickness of metal line MQ.
After formation of trench 21, a barrier layer (redundant liner) 22, as shown in FIG. 6, is deposited onto the surface of interlevel layer 15/hardmask 16, as well as into and along the sides of trench 21. Barrier layer 22 can have a thickness of 50-500 angstroms, preferably 50-100 angstroms, and be formed of, e.g., Ta, TaN, W, Ti, TiN, or other suitable material to act as a diffusion barrier layer for the metal to be deposited in barrier layer 22. Moreover, layer 22 can be formed from one or more of the identified materials. Thereafter, a metal, e.g., copper, is deposited into trench 21, and more particularly into barrier layer 22, in order to form metal line MQ″.
As shown in FIG. 7, a wiring line is patterned by removing excess metal from metal line MQ′ and portions of barrier layer 22 from the upper surface of substrate 15 or optional hardmask 16, e.g., through chemical mechanical polishing, to achieve a smooth upper surface with a metal stripe. Thus, barrier layer 22 forms a redundant layer in the middle of the fatwire, i.e., between metal lines MQ′ and MQ″.
In a next production step, as illustrated in FIG. 8, a cap layer 24 is applied over the top of substrate 15/hardmask 16 and the metal stripe patterned from metal line MQ″. Cap layer 24 can be, e.g., SiNx, SiCNH, or other suitable cap layer material for metal line Mx, and have a thickness of 200-1000 angstroms. A substrate or interlevel layer 25 is deposited onto cap layer 24. Interlayer 25, like substrates 11 and 15, can be, e.g., Si0₂, a low K organic material, a PCVD low k-dielectric material or other suitable material having a thickness of 5000 to 24000 angstroms. Again, an optional hardmask layer (not shown) can be deposited onto the surface of interlevel layer 25 in the manner set forth above.
As illustrated in FIG. 9, a trench 27 is formed in interlevel layer 25, e.g., by lithography and etching, and is composed of two portions: a first portion 28 extending to a depth of 0.6-2 microns from the surface of interlevel layer 25 and a second portion 29 extending from first portion 28 down through at least barrier (redundant) layer 22 in order to create the desired redundance. Subsequently, a layer (liner) is deposited into trench 27, followed by deposition of metal into trench 27, or more specifically, into the liner within trench 27, in order to form metal line LN and via VQ, as shown in FIG. 10. Moreover, a portion of metal line LN can be etched so that a redundant liner can be placed within the etched portion, and then deposited with metal. The wiring line can be patterned by chemical mechanical polishing to provide a smooth surface and metal strip. This procedure can be repeated a number of time, e.g., 8-9 times, depending upon the particular interconnect design.
In this manner, via VQ is etched through cap layer 24, barrier layer 22, and into MQ′. Thus, via VQ can be, e.g., a depth deeper than one-half the thickness of the fatwire. Moreover, barrier layer 22 additionally forms a redundant layer between metal lines MQ′ and LN.
As a result of this construction, barrier layer 22 will prevent any voids from underneath via VQ from propagating upward to metal line MQ″. Further, the depth of via VQ will improve performance by increasing the contact surface around via V2, and improve reliability by having a longer lifetime and tighter sigma. This type of interconnect, in which the via VQ is deep into the fatwire will make the structure mechanically stronger, and, therefore, less prone to thermal cycle or stress migration failures due to the expansion or contraction of metal and the interlevel low k-dielectrics.
The circuit as described above is part of the design for an integrated circuit chip. The chip design is created in a graphical computer programming language, and stored in a computer storage medium (such as a disk, tape, physical hard drive, or virtual hard drive such as in a storage access network). If the designer does not fabricate chips or the photolithographic masks used to fabricate chips, the designer transmits the resulting design by physical means (e.g., by providing a copy of the storage medium storing the design) or electronically (e.g., through the Internet) to such entities, directly or indirectly. The stored design is then converted into the appropriate format (e.g., GDSII) for the fabrication of photolithographic masks, which typically include multiple copies of the chip design in question that are to be formed on a wafer. The photolithographic masks are utilized to define areas of the wafer (and/or the layers thereon) to be etched or otherwise processed.
Moreover, the above-described method is used in the fabrication of integrated circuit chips.
While the invention has been described in terms of exemplary embodiments, those skilled in the art will recognize that the invention can be practiced with modifications and in the spirit and scope of the appended claims.

Claims

1. A device comprising:

a dual damascene line comprising a metal line and a via; and

a redundant liner arranged to divide the metal line.

2. The device in accordance with claim 1, further comprising:

an interlevel layer formed over the dual damascene line; and

the interlevel layer comprising at least one second metal line and at least one second via, the at least one second via extending through the redundant liner.

3. The device in accordance with claim 2, wherein the at least one second via extends into the metal line arranged below the redundant liner.

4. The device in accordance with claim 2, further comprising a cap layer formed between the dual damascene line and the interlevel layer.

5. The device in accordance with claim 1, further comprising:

a plurality of interlevel layers formed over the dual damascene layer, wherein each interlevel layer includes at least one metal line divided by a redundant liner and at least via; and

each at least one via extends through a structurally lower redundant liner.

6. The device in accordance with claim 5, further comprising a plurality of cap layers formed between each of the plurality of interlevel layers.

7. The device in accordance with claim 1, further comprising at least one hardmask formed on at least one of the plurality of interlevel layers.

8. A device, comprising:

a redundant liner structured and arranged to divide a metal line of dual damascene line; and

a trench having at least a portion arranged to extend through the redundant liner.