US20070289530A1 - Method and apparatus for coating resin - Google Patents
Method and apparatus for coating resin Download PDFInfo
- Publication number
- US20070289530A1 US20070289530A1 US11/752,337 US75233707A US2007289530A1 US 20070289530 A1 US20070289530 A1 US 20070289530A1 US 75233707 A US75233707 A US 75233707A US 2007289530 A1 US2007289530 A1 US 2007289530A1
- Authority
- US
- United States
- Prior art keywords
- inkjet
- substrate plate
- resin
- nozzle holes
- feed means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Definitions
- This invention relates to method and apparatus for coating a resin, and more particularly to method and apparatus for coating a surface of a substrate plate with a thin film of a curable resin or plastic suitable for use in imprinting a pattern of infinitesimally minute dents and projections.
- a rectilinear or circular pattern of infinitesimally minute dents and projections is transferred to a surface of a substrate plate of an arbitrary shape by a hot embossing, molding or stamping process.
- a curable resin film is coated on a surface of a substrate plate in a preparatory stage.
- a stamping process a photo-setting synthetic resin is coated on a substrate plate, followed by impression of a mold against the coated resin film to transfer a pattern of minute dents and projections to the coated plastic film from a transfer surface of the mold. While the mold is in an impressed state, the resin film is irradiated with light rays for setting the resin.
- the substrate plate which comes out upon separation from the mold has a pattern of minute dents and projections transferred on its surface.
- a resist liquid is applied by high speed spin coating in Japanese Laid-Open Patent Application H6-333807.
- a resist liquid is spread with the aid of centrifugal force.
- there is a difference in circumferential speed between inner and outer peripheral areas so that the resist liquid is subjected to greater centrifugal force in outer peripheral portions than in inner peripheral portions, and as a result a coated resist film has different thicknesses in inner and outer peripheral portions of the substrate plate.
- there is a limit to reduction of film thickness in the case of the high speed spin coating as in Japanese Laid-Open Patent Application H6-333807 mentioned above.
- the method of Japanese Laid-Open Patent Application H6-333807 can be suitably applied to a process for coating a resist film on a master of an optical disc, but cannot be applied to a process for coating an extremely thin resin film uniformly on a work surface.
- a resin coating apparatus for coating a surface of a substrate plate with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold, characterized in that said apparatus comprises: an inkjet feed means having a plural number of inkjet nozzle holes in an array on a nozzle assembly to feed droplets of a resin liquid onto a surface of the substrate plate, each one of said inkjet nozzle holes being associated with an actuator to propel a droplet of said resin liquid intermittently in a controlled timing; and a linear or rotational drive means adapted to move said inkjet feed means and the substrate plate relatively at least in a direction perpendicular to the array of the inkjet nozzle holes or in a rotational direction.
- the substrate plate is not limited to a particular shape.
- it may be in a circular shape like semiconductor wafers and optical parts, may be in an annular shape like magnetic or optical discs, or may be in square or other arbitrary shapes.
- the resin to be coated on a substrate plate is a curable resin which can be set by irradiation of light rays including ultraviolet rays or by heating or cooling.
- the inkjet feed means has a plural number of inkjet nozzle holes arrayed in a predetermined direction on a nozzle assembly, in association with actuators like piezoelectric elements thereby propelling droplets of a resin liquid out of the respective inkjet nozzle holes intermittently in controlled timings for deposition on the substrate plate surface.
- At least one of the inkjet feed means or the substrate plate is moved relative to the other one by means of a linear or rotational drive means.
- a linear drive it is adapted to move either the inkjet feed means or a substrate plate in a direction perpendicular to the array of the inkjet nozzle holes on the nozzle assembly.
- the inkjet nozzle holes are arrayed in a row or rows in a radial direction of a substrate plate. Pico-order droplets are propelled from the respective inkjet nozzle holes.
- the thickness of the resin film can be controlled by way of the size of droplets of resin liquid and the number of droplets to be fed per unit area of a substrate plate.
- the inkjet resin feed means has inkjet nozzle holes arrayed in a row or rows on a nozzle assembly, which is long enough for covering at least the diameter or radius of the substrate plate.
- the inkjet nozzle assembly or the substrate plate is put in rotation by the drive means.
- the rotational speed should be controlled to a low level at which droplets of resin liquid can be deposited free of influences of centrifugal force.
- the inkjet nozzle holes which are arrayed in the radial direction of the substrate plate are so controlled that droplets of resin liquid are fed at longer time intervals in the inner peripheral side of the substrate plate than in the outer peripheral side. Namely, in consideration of differences in circumferential length, the timing of drop feed is shortened from the inner to outer periphery of the substrate plate. Thus, droplets of resin liquid are deposited and coated uniformly on the entire surface of a substrate plate from the inner to outer periphery.
- a method for coating a surface of a work with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold characterized in that the method comprises the steps of: providing an inkjet feed means having a plural number of inkjet nozzle holes in a nozzle assembly; positioning the nozzle assembly face to face with a coating surface of the work; and propelling droplets of a resin liquid toward the work from the respective inkjet nozzle holes while moving the work relative to the inkjet feed means or vice versa.
- FIG. 1 is a schematic illustration explanatory of steps of a nano-imprinting process
- FIG. 2 is a schematic view of a pattern of nano-order dents and projections imprinted on a surface of a substrate plate;
- FIG. 3 is a schematic front view of a resin coating apparatus
- FIG. 4 is a schematic plan view of the resin coating apparatus shown in FIG. 3 ;
- FIG. 5 is a schematic sectional view showing construction of an inkjet nozzle on an inkjet means.
- FIG. 1 schematically shows steps of a nano-imprinting process for imprinting a photo-setting resin or plastic.
- an ultraviolet-setting resin R is coated on a surface of a glass substrate plate S of the sort which is generally used for a data recording medium.
- the resin R is in the form of a liquid, and, as shown in FIG. 1 ( b ), a master pattern of dents and projections on a transfer surface of a mold M is transferred to the resin R by impressing the mold M under pressure.
- the resin R is cured by irradiation of ultraviolet rays UV. Thereafter, upon separating the mold M as shown in FIG. 1 ( c ), there comes out a substrate plate S which has minute projections P transferred and imprinted on its surface. In this state, however, a base layer B still remains on the substrate surface. Therefore, the substrate plate S is immersed in a predetermined solution to remove the base layer B as shown in FIG. 1 ( d ).
- the resin R should be coated on a substrate plate S in a thickness of approximately 100 nm to 120 nm.
- a resin liquid is fed onto the surface of a substrate plate S by drop-feeding, using an inkjet resin feed means as shown in FIGS. 3 and 4 .
- a substrate plate S is rotatably set on a spindle 1 , face to face with an inkjet resin feed means 10 .
- the inkjet resin feed means 10 is provided with a bar-like manifold nozzle assembly 12 at the lower end of a vertical pendant shaft 11 . A multitude of nozzle holes are bored in the nozzle assembly 12 at very small intervals in the longitudinal direction of the nozzle assembly 12 .
- the pendant shaft 11 is located vertically in alignment with the center of rotation of the spindle 1 , and arranged to support the bar-like nozzle assembly 12 in a horizontal position in such a way as to fully cover the whole diameter of the substrate plate S on the spindle 1 .
- the nozzle holes 13 are bored in two rows in the longitudinal direction of the nozzle assembly 12 .
- the pendant shaft 11 of the inkjet means 10 is at least movable up and down in the vertical direction. If necessary, arrangements may be made to move the inkjet resin feed means 10 in a direction perpendicular to the vertical pendant shaft 11 .
- the respective nozzle holes 13 on the nozzle assembly 12 are communicated with a resin liquid supply passage 14 , which in turn is connected to a resin liquid reservoir tank (not shown) through the pendant shaft 11 .
- the nozzle assembly 12 is provided with a flexible membrane 15 in association with piezoelectric elements 16 (indicated in FIGS. 3 and 4 as piezoelectric assembly units 16 U mounted in association with the inkjet nozzle holes 13 on the opposite sides of the pendant shaft 11 ) which function as actuators for controlling the resin liquid drop-feed rate from the respective ink jet nozzles 13 .
- the flexible membrane 15 are pushed to apply a pressure to a resin liquid in the resin liquid supply passage 14 , propelling a droplet of resin liquid out of that inkjet nozzle hole 13 .
- the drop feed of resin liquid from the respective nozzle holes 13 can be controlled separately and independently of each other.
- the inkjet resin feed means 10 is provided with a control circuit 17 thereby to drive the respective piezoelectric elements 16 in controlled timings.
- each time a droplet of resin liquid of several to ten and several picoliters is propelled out of each inkjet nozzle hole 13 toward the surface of the substrate plate S.
- the resin liquid is supplied from the nozzle assembly 12 which is located in small gap relation with the substrate plate S, more specifically, at a space of 1 to 3 mm from the surface of the substrate plate S, while controlling the voltage to be applied to the respective piezoelectric elements 16 .
- the inkjet resin feed means 10 By the use of the inkjet resin feed means 10 as described above, an extremely thin resin film is coated uniformly on the entire surface of a substrate plate S. More specifically, a substrate plate S is set on the spindle 1 , and the inkjet resin feed means 10 is positioned face to face with the substrate plate S. While the substrate plate S is put in rotation by the spindle 1 , droplets of resin liquid are propelled out of the respective nozzle holes 13 on the nozzle assembly 12 and deposited on the surface of the substrate plate S.
- a droplet of resin liquid is fed at longer time intervals from inkjet nozzle holes 13 facing inner peripheral portions of the substrate plate S, that is to say, droplets of resin liquid are fed from the inkjet nozzle holes 13 at shorter time intervals in outer peripheral portions of the substrate plate S where a drop feed circumferential length becomes greater. That is to say, a droplet of resin liquid is propelled at the shortest time intervals from inkjet nozzle holes 13 radially in the outermost position.
- the inkjet nozzle holes 13 are driven separately and independently by piezoelectric elements 16 which are provided in the respective inkjet nozzle hole 13 . Drop feed timings of the respective inkjet nozzle holes 13 are controlled and varied by the afore-mentioned control circuit 17 , shortening the drop feed time intervals from the inner to outer periphery of the substrate plate S as mentioned above.
- a thin film of a resin R can be coated uniformly over the entire surface of a substrate plate S by feeding droplets of resin liquid by the use of the inkjet feed means 10 .
- Accurate nano-imprinting is feasible simply by impressing a master pattern on a transfer surface of a mold against the coated resin R.
Abstract
Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.
Description
- 1. Field of the Art
- This invention relates to method and apparatus for coating a resin, and more particularly to method and apparatus for coating a surface of a substrate plate with a thin film of a curable resin or plastic suitable for use in imprinting a pattern of infinitesimally minute dents and projections.
- 2. Prior Art
- In the so-called nano-imprinting, a rectilinear or circular pattern of infinitesimally minute dents and projections is transferred to a surface of a substrate plate of an arbitrary shape by a hot embossing, molding or stamping process. In any case, a curable resin film is coated on a surface of a substrate plate in a preparatory stage. In the case of a stamping process, a photo-setting synthetic resin is coated on a substrate plate, followed by impression of a mold against the coated resin film to transfer a pattern of minute dents and projections to the coated plastic film from a transfer surface of the mold. While the mold is in an impressed state, the resin film is irradiated with light rays for setting the resin. The substrate plate which comes out upon separation from the mold has a pattern of minute dents and projections transferred on its surface.
- With a substrate plate of a circular or annular shape, it has been the general practice to coat the substrate plate with a resist film by the use of a high speed spin machine as described in Japanese Laid-Open Patent Application H6-333807, for example. Namely, in this case, a work in the form of a circular glass plate is put on a turn table, and, while the turn table is rotated at high speed, a resist liquid is dripped on a work surface from a resist liquid feed nozzle which is moved radially from the center to the outer periphery of the turn table. Since the work is rotated along with the turn table, the resist liquid is fed onto the work surface in a spiral shape and urged to flow in radially outward directions under the influence of centrifugal force to form a resist film over the entire surface of the work.
- As described above, a resist liquid is applied by high speed spin coating in Japanese Laid-Open Patent Application H6-333807. In the case of the high speed spin coating, a resist liquid is spread with the aid of centrifugal force. In that case, however, there is a difference in circumferential speed between inner and outer peripheral areas, so that the resist liquid is subjected to greater centrifugal force in outer peripheral portions than in inner peripheral portions, and as a result a coated resist film has different thicknesses in inner and outer peripheral portions of the substrate plate. Besides, in the case of the high speed spin coating as in Japanese Laid-Open Patent Application H6-333807 mentioned above, there is a limit to reduction of film thickness. That is to say, the method of Japanese Laid-Open Patent Application H6-333807 can be suitably applied to a process for coating a resist film on a master of an optical disc, but cannot be applied to a process for coating an extremely thin resin film uniformly on a work surface.
- For example, to cope with the trends toward larger storage capacities and higher densities of semiconductor integrated circuits, magnetic discs and optical discs, there have been developed and put in use nano-structure devices having a pattern of infinitesimally minute dents and projections on a surface of a substrate plate. As described in Japanese Laid-Open Patent Application H6-333807 mentioned above, the hot embossing technology which is generally applied in the production of an optical disc master has a limit in the size of minute dents and projections to be formed on a substrate plate. Beside the hot embossing, neither the molding process nor the stamping process cannot be applied to nano-imprinting in case of a pattern involving dents and projections smaller than several tens nanometers. This is because, in the case of nano-imprinting, it is required to coat an extremely thin resin film uniformly on a surface of a substrate plate and with extremely high accuracy. At least from the standpoint of mass production, the high sped spin coating is unsuitable for application to a process for manufacturing resin-coated substrate plates which are strictly controlled in thickness of resin film.
- In view of the above-discussed problem, it is an object of the present invention to make it possible to coat a surface of a substrate plate efficiently uniformly with an extremely thin resin film, which is particularly suitable for use in imprinting a nano-pattern by impressing a master pattern on a transfer surface of a mold against the resin film.
- In accordance with the present invention, in order to achieve the above-stated objective, there is provided a resin coating apparatus for coating a surface of a substrate plate with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold, characterized in that said apparatus comprises: an inkjet feed means having a plural number of inkjet nozzle holes in an array on a nozzle assembly to feed droplets of a resin liquid onto a surface of the substrate plate, each one of said inkjet nozzle holes being associated with an actuator to propel a droplet of said resin liquid intermittently in a controlled timing; and a linear or rotational drive means adapted to move said inkjet feed means and the substrate plate relatively at least in a direction perpendicular to the array of the inkjet nozzle holes or in a rotational direction.
- In this instance, the substrate plate is not limited to a particular shape. For example, it may be in a circular shape like semiconductor wafers and optical parts, may be in an annular shape like magnetic or optical discs, or may be in square or other arbitrary shapes. The resin to be coated on a substrate plate is a curable resin which can be set by irradiation of light rays including ultraviolet rays or by heating or cooling.
- The inkjet feed means has a plural number of inkjet nozzle holes arrayed in a predetermined direction on a nozzle assembly, in association with actuators like piezoelectric elements thereby propelling droplets of a resin liquid out of the respective inkjet nozzle holes intermittently in controlled timings for deposition on the substrate plate surface. At least one of the inkjet feed means or the substrate plate is moved relative to the other one by means of a linear or rotational drive means. In case of a linear drive, it is adapted to move either the inkjet feed means or a substrate plate in a direction perpendicular to the array of the inkjet nozzle holes on the nozzle assembly. In case of a rotational drive, the inkjet nozzle holes are arrayed in a row or rows in a radial direction of a substrate plate. Pico-order droplets are propelled from the respective inkjet nozzle holes. The thickness of the resin film can be controlled by way of the size of droplets of resin liquid and the number of droplets to be fed per unit area of a substrate plate.
- In a case where a resin liquid is fed onto a surface of an annular substrate plate, the inkjet resin feed means has inkjet nozzle holes arrayed in a row or rows on a nozzle assembly, which is long enough for covering at least the diameter or radius of the substrate plate. In this case, either the inkjet nozzle assembly or the substrate plate is put in rotation by the drive means. In a case where the substrate plate is put in rotation, the rotational speed should be controlled to a low level at which droplets of resin liquid can be deposited free of influences of centrifugal force. The inkjet nozzle holes which are arrayed in the radial direction of the substrate plate are so controlled that droplets of resin liquid are fed at longer time intervals in the inner peripheral side of the substrate plate than in the outer peripheral side. Namely, in consideration of differences in circumferential length, the timing of drop feed is shortened from the inner to outer periphery of the substrate plate. Thus, droplets of resin liquid are deposited and coated uniformly on the entire surface of a substrate plate from the inner to outer periphery.
- Further, according to the present invention, there is also provided a method for coating a surface of a work with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold, characterized in that the method comprises the steps of: providing an inkjet feed means having a plural number of inkjet nozzle holes in a nozzle assembly; positioning the nozzle assembly face to face with a coating surface of the work; and propelling droplets of a resin liquid toward the work from the respective inkjet nozzle holes while moving the work relative to the inkjet feed means or vice versa.
- The above and other objects, features and advantages of the present invention will become apparent from the following particular description of the invention, taken in conjunction with the accompanying drawings which show by way of example preferred embodiments of the invention. Needless to say, the present invention should not be construed as being limited to particular forms shown in the drawings.
- In the accompanying drawings:
-
FIG. 1 is a schematic illustration explanatory of steps of a nano-imprinting process; -
FIG. 2 is a schematic view of a pattern of nano-order dents and projections imprinted on a surface of a substrate plate; -
FIG. 3 is a schematic front view of a resin coating apparatus; -
FIG. 4 is a schematic plan view of the resin coating apparatus shown inFIG. 3 ; and -
FIG. 5 is a schematic sectional view showing construction of an inkjet nozzle on an inkjet means. - Hereafter, with reference to the accompanying drawings, the present invention is described more particularly by way of its preferred embodiments. Reference is first had to
FIG. 1 which schematically shows steps of a nano-imprinting process for imprinting a photo-setting resin or plastic. As shown at (a) of that figure, an ultraviolet-setting resin R is coated on a surface of a glass substrate plate S of the sort which is generally used for a data recording medium. In this instance, the resin R is in the form of a liquid, and, as shown inFIG. 1 (b), a master pattern of dents and projections on a transfer surface of a mold M is transferred to the resin R by impressing the mold M under pressure. While the mold M is in a pressed state, the resin R is cured by irradiation of ultraviolet rays UV. Thereafter, upon separating the mold M as shown inFIG. 1 (c), there comes out a substrate plate S which has minute projections P transferred and imprinted on its surface. In this state, however, a base layer B still remains on the substrate surface. Therefore, the substrate plate S is immersed in a predetermined solution to remove the base layer B as shown inFIG. 1 (d). - In a nano-imprinting process as described above, it is an imperative requisite for the resin R to be coated in uniform thickness. If a coated resin film has variations in thickness, it becomes difficult to transfer minute dents and projections of nano order accurately by impression of a mold M. Besides, in consideration of the necessity of exfoliation of a base layer B, a resin M should not be coated in a redundantly large thickness. Through the steps shown in
FIG. 1 , a multitude of minute projections in a concentric pattern are formed on the surface of the substrate plate S as shown inFIG. 2 . In this instance, for use as a data recording medium, the respective projections P should be infinitesimally minute in dimensions and yet should be uniform in shape. For instance, in order to imprint projections P which are 100 nm in height and 30 nm in diameter and spaced from each other by an interval of 100 nm, along with a base layer of a thickness of 5 nm±2 nm, the resin R should be coated on a substrate plate S in a thickness of approximately 100 nm to 120 nm. - In order to coat a resin R in the form of such an extremely thin film, a resin liquid is fed onto the surface of a substrate plate S by drop-feeding, using an inkjet resin feed means as shown in
FIGS. 3 and 4 . As shown in these figures, a substrate plate S is rotatably set on aspindle 1, face to face with an inkjet resin feed means 10. The inkjet resin feed means 10 is provided with a bar-likemanifold nozzle assembly 12 at the lower end of avertical pendant shaft 11. A multitude of nozzle holes are bored in thenozzle assembly 12 at very small intervals in the longitudinal direction of thenozzle assembly 12. Thependant shaft 11 is located vertically in alignment with the center of rotation of thespindle 1, and arranged to support the bar-like nozzle assembly 12 in a horizontal position in such a way as to fully cover the whole diameter of the substrate plate S on thespindle 1. In the case of the particular inkjet resin feed means 10 shown in the drawing, the nozzle holes 13 are bored in two rows in the longitudinal direction of thenozzle assembly 12. Thependant shaft 11 of the inkjet means 10 is at least movable up and down in the vertical direction. If necessary, arrangements may be made to move the inkjet resin feed means 10 in a direction perpendicular to thevertical pendant shaft 11. - As shown in
FIG. 5 , the respective nozzle holes 13 on thenozzle assembly 12 are communicated with a resinliquid supply passage 14, which in turn is connected to a resin liquid reservoir tank (not shown) through thependant shaft 11. On the side away from the side in which the inkjet nozzle holes 13 are opened, thenozzle assembly 12 is provided with aflexible membrane 15 in association with piezoelectric elements 16 (indicated inFIGS. 3 and 4 aspiezoelectric assembly units 16U mounted in association with the inkjet nozzle holes 13 on the opposite sides of the pendant shaft 11) which function as actuators for controlling the resin liquid drop-feed rate from the respectiveink jet nozzles 13. Thus, each time apiezoelectric element 16 of aninkjet nozzle hole 13 is driven, theflexible membrane 15 are pushed to apply a pressure to a resin liquid in the resinliquid supply passage 14, propelling a droplet of resin liquid out of thatinkjet nozzle hole 13. In this manner, the drop feed of resin liquid from the respective nozzle holes 13 can be controlled separately and independently of each other. For this purpose, the inkjet resin feed means 10 is provided with acontrol circuit 17 thereby to drive the respectivepiezoelectric elements 16 in controlled timings. - In this instance, each time, a droplet of resin liquid of several to ten and several picoliters is propelled out of each
inkjet nozzle hole 13 toward the surface of the substrate plate S. In order to prevent droplets of resin liquid from splashing off the surface of the substrate plate S, the resin liquid is supplied from thenozzle assembly 12 which is located in small gap relation with the substrate plate S, more specifically, at a space of 1 to 3 mm from the surface of the substrate plate S, while controlling the voltage to be applied to the respectivepiezoelectric elements 16. - By the use of the inkjet resin feed means 10 as described above, an extremely thin resin film is coated uniformly on the entire surface of a substrate plate S. More specifically, a substrate plate S is set on the
spindle 1, and the inkjet resin feed means 10 is positioned face to face with the substrate plate S. While the substrate plate S is put in rotation by thespindle 1, droplets of resin liquid are propelled out of the respective nozzle holes 13 on thenozzle assembly 12 and deposited on the surface of the substrate plate S. At this time, a droplet of resin liquid is fed at longer time intervals from inkjet nozzle holes 13 facing inner peripheral portions of the substrate plate S, that is to say, droplets of resin liquid are fed from the inkjet nozzle holes 13 at shorter time intervals in outer peripheral portions of the substrate plate S where a drop feed circumferential length becomes greater. That is to say, a droplet of resin liquid is propelled at the shortest time intervals from inkjet nozzle holes 13 radially in the outermost position. The inkjet nozzle holes 13 are driven separately and independently bypiezoelectric elements 16 which are provided in the respectiveinkjet nozzle hole 13. Drop feed timings of the respective inkjet nozzle holes 13 are controlled and varied by the afore-mentionedcontrol circuit 17, shortening the drop feed time intervals from the inner to outer periphery of the substrate plate S as mentioned above. - Thus, as described above, a thin film of a resin R, approximately 100 nm in thickness, can be coated uniformly over the entire surface of a substrate plate S by feeding droplets of resin liquid by the use of the inkjet feed means 10. Accurate nano-imprinting is feasible simply by impressing a master pattern on a transfer surface of a mold against the coated resin R.
Claims (4)
1. A resin coating apparatus for coating a surface of a substrate plate with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold, characterized in that said apparatus comprises:
an inkjet feed means having a plural number of inkjet nozzle holes in an array on a nozzle assembly to feed droplets of a resin liquid onto a surface of said substrate plate, each one of said inkjet nozzle holes having an actuator to propel a droplet of said resin liquid intermittently in a controlled timing; and
a linear or rotational drive means adapted to move said inkjet feed means and said substrate plate relatively at least in a direction perpendicular to said array of said inkjet nozzle holes or in a rotational direction.
2. A resin coating apparatus as set forth in claim 1 , wherein said substrate plate is in the form of an annular disc, said inkjet nozzle holes on said nozzle assembly are arrayed in a row or in rows extending over a length sufficient to fully cover whole diameter of said substrate plate, and said drive means is adapted to put either said substrate plate or said nozzle assembly in rotation;
said inkjet feed means further comprising a control circuit adapted to control drop feed timings from said inkjet nozzle holes in such a way that droplets of said resin liquid are fed onto said substrate plate at shorter time intervals in outer peripheral side than in inner peripheral side of said substrate plate.
3. A resin coating apparatus as set forth in claim 2 , wherein said nozzle assembly is located at a space of 1 to 2 mm from a coating surface of said substrate plate.
4. A method for coating a surface of a work with a thin resin film suitable for use in imprinting a pattern by impressing thereon a master pattern on a transfer surface of a mold, characterized in that said method comprises the steps of:
providing an inkjet feed means having a plural number of inkjet nozzle holes in a nozzle assembly;
positioning said nozzle assembly face to face with a coating surface of said work; and
propelling droplets of a resin liquid toward said work from the respective inkjet nozzle holes while moving said work relative to said inkjet feed means or vice versa.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/640,676 US8158209B2 (en) | 2006-05-26 | 2009-12-17 | Method and apparatus for coating resin |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-146179 | 2006-05-26 | ||
JP2006146179A JP2007313439A (en) | 2006-05-26 | 2006-05-26 | Resin coating apparatus and resin coating method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/640,676 Division US8158209B2 (en) | 2006-05-26 | 2009-12-17 | Method and apparatus for coating resin |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070289530A1 true US20070289530A1 (en) | 2007-12-20 |
Family
ID=38847783
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/752,337 Abandoned US20070289530A1 (en) | 2006-05-26 | 2007-05-23 | Method and apparatus for coating resin |
US12/640,676 Expired - Fee Related US8158209B2 (en) | 2006-05-26 | 2009-12-17 | Method and apparatus for coating resin |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/640,676 Expired - Fee Related US8158209B2 (en) | 2006-05-26 | 2009-12-17 | Method and apparatus for coating resin |
Country Status (2)
Country | Link |
---|---|
US (2) | US20070289530A1 (en) |
JP (1) | JP2007313439A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110049761A1 (en) * | 2009-08-31 | 2011-03-03 | Fujifilm Corporation | Pattern transfer apparatus and pattern forming method |
US20110070462A1 (en) * | 2008-05-16 | 2011-03-24 | Showa Denko K.K. | Pattern forming method |
US20110151124A1 (en) * | 2009-12-21 | 2011-06-23 | Canon Kabushiki Kaisha | Imprint apparatus, imprint method, and article manufacturing method |
US20120210935A1 (en) * | 2009-10-30 | 2012-08-23 | Lucien Johannes Nelen | Application and inspection system |
EP2553712A1 (en) * | 2010-03-30 | 2013-02-06 | FUJIFILM Corporation | Nanoimprinting method, method for producing a droplet arrangement pattern, and method for fabricating substrates |
US20130089664A1 (en) * | 2011-10-05 | 2013-04-11 | Yukihiko Inagaki | Coating method and coating apparatus |
US8679357B2 (en) | 2010-09-24 | 2014-03-25 | Fujifilm Corporation | Nanoimprinting method and method for producing substrates utilizing the nanoimprinting method |
TWI508138B (en) * | 2013-03-29 | 2015-11-11 | Shibaura Mechatronics Corp | A substrate processing apparatus and a substrate processing method |
US20160257069A1 (en) * | 2015-03-05 | 2016-09-08 | Fuji Xerox Co., Ltd. | Shaping apparatus |
US10946411B2 (en) * | 2018-01-15 | 2021-03-16 | Tokyo Electron Limited | System and method for fluid dispense and coverage control |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5324480B2 (en) * | 2008-02-06 | 2013-10-23 | パナソニック株式会社 | Information recording medium manufacturing method |
WO2010070747A1 (en) * | 2008-12-17 | 2010-06-24 | パイオニア株式会社 | Transfer apparatus and transfer method |
US8591785B2 (en) * | 2011-01-10 | 2013-11-26 | Xerox Corporation | Digitally prepared stamp masters and methods of making the same |
JP6083178B2 (en) * | 2012-09-28 | 2017-02-22 | 大日本印刷株式会社 | Resist substrate manufacturing method, replica template manufacturing method, and nanoimprint lithography method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3683396A (en) * | 1970-08-05 | 1972-08-08 | Dick Co Ab | Method and apparatus for control of ink drop formation |
US6213591B1 (en) * | 1996-06-17 | 2001-04-10 | Nec Corporation | Injet recording apparatus |
US6518056B2 (en) * | 1999-04-27 | 2003-02-11 | Agilent Technologies Inc. | Apparatus, systems and method for assaying biological materials using an annular format |
US20040238008A1 (en) * | 2003-03-12 | 2004-12-02 | Savas Stephen E. | Systems and methods for cleaning semiconductor substrates using a reduced volume of liquid |
US20040252174A1 (en) * | 2001-06-27 | 2004-12-16 | Baxter William Ronald Stuart | Printing apparatus and method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02167729A (en) * | 1988-09-29 | 1990-06-28 | Hoya Corp | Preparation of substrate with guide groove for data recording |
JPH07108616A (en) * | 1993-10-15 | 1995-04-25 | Fuji Electric Co Ltd | Method and apparatus for impregnating power transmitting frictional plate with resin |
JP3284814B2 (en) * | 1995-03-08 | 2002-05-20 | 松下電器産業株式会社 | Thin film forming apparatus and thin film forming method |
JP4259812B2 (en) * | 2002-05-13 | 2009-04-30 | 富士フイルム株式会社 | Inkjet recording method and inkjet recording apparatus |
JP2004280863A (en) * | 2003-03-12 | 2004-10-07 | Hitachi Maxell Ltd | Method and device for manufacturing recording medium |
JP3794403B2 (en) * | 2003-10-09 | 2006-07-05 | セイコーエプソン株式会社 | Semiconductor device |
US7432316B2 (en) * | 2003-11-03 | 2008-10-07 | Gem Gravure Company, Inc. | Inkjet inks, methods for applying inkjet ink, and articles printed with inkjet ink |
JP2005296854A (en) * | 2004-04-13 | 2005-10-27 | Sharp Corp | Membrane formation apparatus and membrane formation method |
JPWO2006106735A1 (en) * | 2005-04-01 | 2008-09-11 | 松下電器産業株式会社 | Multilayer information recording medium, manufacturing apparatus thereof, and manufacturing method thereof |
JP4258663B2 (en) * | 2005-04-15 | 2009-04-30 | セイコーエプソン株式会社 | Coating apparatus and film forming apparatus |
-
2006
- 2006-05-26 JP JP2006146179A patent/JP2007313439A/en active Pending
-
2007
- 2007-05-23 US US11/752,337 patent/US20070289530A1/en not_active Abandoned
-
2009
- 2009-12-17 US US12/640,676 patent/US8158209B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3683396A (en) * | 1970-08-05 | 1972-08-08 | Dick Co Ab | Method and apparatus for control of ink drop formation |
US6213591B1 (en) * | 1996-06-17 | 2001-04-10 | Nec Corporation | Injet recording apparatus |
US6518056B2 (en) * | 1999-04-27 | 2003-02-11 | Agilent Technologies Inc. | Apparatus, systems and method for assaying biological materials using an annular format |
US20040252174A1 (en) * | 2001-06-27 | 2004-12-16 | Baxter William Ronald Stuart | Printing apparatus and method |
US20040238008A1 (en) * | 2003-03-12 | 2004-12-02 | Savas Stephen E. | Systems and methods for cleaning semiconductor substrates using a reduced volume of liquid |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110070462A1 (en) * | 2008-05-16 | 2011-03-24 | Showa Denko K.K. | Pattern forming method |
US20110049761A1 (en) * | 2009-08-31 | 2011-03-03 | Fujifilm Corporation | Pattern transfer apparatus and pattern forming method |
US8609006B2 (en) | 2009-08-31 | 2013-12-17 | Fujifilm Corporation | Pattern transfer apparatus and pattern forming method |
US20120210935A1 (en) * | 2009-10-30 | 2012-08-23 | Lucien Johannes Nelen | Application and inspection system |
US20110151124A1 (en) * | 2009-12-21 | 2011-06-23 | Canon Kabushiki Kaisha | Imprint apparatus, imprint method, and article manufacturing method |
US9760000B2 (en) * | 2009-12-21 | 2017-09-12 | Canon Kabushiki Kaisha | Imprint apparatus, imprint method, and article manufacturing method |
EP2553712A4 (en) * | 2010-03-30 | 2013-12-04 | Fujifilm Corp | Nanoimprinting method, method for producing a droplet arrangement pattern, and method for fabricating substrates |
EP2553712A1 (en) * | 2010-03-30 | 2013-02-06 | FUJIFILM Corporation | Nanoimprinting method, method for producing a droplet arrangement pattern, and method for fabricating substrates |
US10180623B2 (en) | 2010-03-30 | 2019-01-15 | Fujifilm Corporation | Nanoimprinting method, and method for producing a droplet arrangement pattern |
US8679357B2 (en) | 2010-09-24 | 2014-03-25 | Fujifilm Corporation | Nanoimprinting method and method for producing substrates utilizing the nanoimprinting method |
US20130089664A1 (en) * | 2011-10-05 | 2013-04-11 | Yukihiko Inagaki | Coating method and coating apparatus |
US9553007B2 (en) * | 2011-10-05 | 2017-01-24 | Screen Semiconductor Solutions Co., Ltd. | Coating method and coating apparatus |
TWI508138B (en) * | 2013-03-29 | 2015-11-11 | Shibaura Mechatronics Corp | A substrate processing apparatus and a substrate processing method |
US20160257069A1 (en) * | 2015-03-05 | 2016-09-08 | Fuji Xerox Co., Ltd. | Shaping apparatus |
US10946411B2 (en) * | 2018-01-15 | 2021-03-16 | Tokyo Electron Limited | System and method for fluid dispense and coverage control |
Also Published As
Publication number | Publication date |
---|---|
US20100092684A1 (en) | 2010-04-15 |
JP2007313439A (en) | 2007-12-06 |
US8158209B2 (en) | 2012-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8158209B2 (en) | Method and apparatus for coating resin | |
US8192637B2 (en) | Method and apparatus for imprinting microstructure and stamper therefor | |
US8609006B2 (en) | Pattern transfer apparatus and pattern forming method | |
CN101377618B (en) | Dual-side imprinting lithography system | |
US7632087B2 (en) | Composite stamper for imprint lithography | |
JP4596981B2 (en) | Imprint apparatus and fine structure transfer method | |
CN1987645B (en) | Imprint lithography | |
JP5232077B2 (en) | Microstructure transfer device | |
JP4679585B2 (en) | Method for forming nanodisks used in imprint lithography | |
KR20180115336A (en) | Pad structures and fabrication methods | |
JP2008221552A (en) | Microstructure transfer device, stamper and manufacturing method of microstructure | |
JP5457866B2 (en) | Spin coating method and spin coater | |
US8441758B2 (en) | Self-assembly structures used for fabricating patterned magnetic media | |
US7833458B2 (en) | Imprinting method and stamper | |
US20100072667A1 (en) | Imprinting method | |
JP2009006619A (en) | Mold for nanoimprinting and recording medium | |
US8277717B2 (en) | Nano imprinting method and apparatus | |
JP2011018717A (en) | Apparatus and method for resist application | |
JP5752889B2 (en) | Transfer method | |
WO2010070747A1 (en) | Transfer apparatus and transfer method | |
JP2009285806A (en) | Polishing method of stamper and manufacturing method of stamper | |
JPH05155029A (en) | Manufacture of ink jet head |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HITACHI HIGH-TECHNOLOGIES CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KATAHO, HIDEAKI;OKADA, HIROSHI;WADE, KENYA;AND OTHERS;REEL/FRAME:019768/0890;SIGNING DATES FROM 20070618 TO 20070823 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |