US20080055864A1 - Module for an automation device - Google Patents

Module for an automation device Download PDF

Info

Publication number
US20080055864A1
US20080055864A1 US11/897,375 US89737507A US2008055864A1 US 20080055864 A1 US20080055864 A1 US 20080055864A1 US 89737507 A US89737507 A US 89737507A US 2008055864 A1 US2008055864 A1 US 2008055864A1
Authority
US
United States
Prior art keywords
module
side wall
modules
automation device
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/897,375
Inventor
Michael Abert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ABERT, MICHAEL
Publication of US20080055864A1 publication Critical patent/US20080055864A1/en
Priority to US12/579,677 priority Critical patent/US8081471B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1468—Mechanical features of input/output (I/O) modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans

Definitions

  • the invention relates to a module for an automation device that consists of a plurality of adjacent modules, having a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components.
  • the invention relates further to an automation device having modules of said type.
  • a module is known from Siemens' Catalog “ST 70 News 2006”, Section 3: “SIMATIC S7”.
  • Located inside a housing capsule of the module is a printed circuit board fitted with electric and electronic components. Said components are cooled mainly through convection in a manner such that air flows through an opening on the underside of the housing capsule and across the components, then finally through an opening on the top side of the housing capsule, with the air that flows through the housing removing heat from the components.
  • Said openings in the housing capsule below and above the components are problematic especially if the modules or automation device are/is employed in areas exposed to explosion hazards or in applications requiring a tight seal.
  • adjacent modules in the automation device heat each other, a factor that has to be considered during project work on the automation device and which, owing to the modular automation device's wide-ranging combination potential, makes such work difficult.
  • An object of the present invention is to provide a module of the type cited in the introduction having improved heat dissipation. Further to be disclosed is an automation device having improved heat dissipation.
  • Said object is achieved in terms of the module by embodying one of the side walls as being thermally conductive and the other as being thermally insulated. Said object is achieved in terms of the automation device by means of the measures disclosed in the claims.
  • the side wall embodied as being thermally conductive is provided for dissipating heat from the module; the side wall embodied as being thermally insulated will prevent thermal coupling to an adjacent module of an assembled automation device. As thermal coupling of the modules is prevented, adjacent modules will not heat each other.
  • the thermally conductive side wall is embodied substantially as being u-shaped and/or as having the form of ribs, the effect of which is to enlarge the heat-releasing side-wall area.
  • the electric components of the module for example a printed circuit board fitted with electronic components, to be thermally coupled to the thermally conductive side wall.
  • the removal of heat from the module will be further improved thereby.
  • the respective thermally conductive side wall's rib height or, as the case may be, its width (chimney width) is matched to the respective module's heat loss.
  • the rib height or, as the case may be, chimney width of modules losing less heat is embodied as being smaller than that of modules losing more heat, as a result of which modules with a low heat loss will, when modules are of equal width, have more space for functional elements.
  • FIG. 1 shows a modular automation device
  • FIG. 2 shows cross-sections of thermally conductive side walls.
  • Identified by the numeral 1 in FIG. 1 is a modular automation device that includes four modules 2 , 3 , 4 , 5 of equal width. Further constituents of the automation device 1 , for example communication means via which the modules are interconnected, or suitable hooking devices for attaching the modules to a support rail (not shown here), are of no significance to the invention and will not be elucidated in the following.
  • the modules can of course be embodied as being of different width. It is, though, advantageous for visual or design reasons for the width of the modules to be made the same or having the same modularity (2 ⁇ , 3 ⁇ etc. width).
  • the modules 2 , 3 , 4 , 5 each have a thermally conductive u-shaped side wall 2 a , 3 a , 4 a , 5 a and each a thermally insulated side wall 2 b , 3 b , 4 b , 5 b , with in each case a thermally insulated side wall 2 b , 3 b , 4 b , 5 b of one module 2 , 3 , 4 , 5 being adjacent to in each case a thermally conductive side wall 2 a , 3 a , 4 a , 5 a of a further module 2 , 3 , 4 , 5 .
  • the module 4 has a greater heat loss during control operations than the modules 2 , 3 , 5 , meaning that more heat has to be removed from the module 4 than from the modules 2 , 3 , 5 .
  • the thermally conductive side wall 4 a of the module 4 is for that purpose embodied as being wider than the thermally conductive side walls 2 a , 3 a , 5 a of the modules 2 , 3 , 5 .
  • the width of the thermally insulated side walls 2 b , 3 b , 4 b , 5 b is the same for all the modules 2 , 3 , 4 , 5 , as a result of which the heat conditions on said walls are substantially identical.
  • Heat is removed from the modules 2 , 3 , 4 , 5 substantially through thermal convection.
  • air 6 flows through, for example, a “chimney” 7 formed by the thermally insulated side wall 3 b of the module 3 and by the thermally conductive side wall 4 a of the module 4 from a chimney inlet 8 to a chimney outlet 9 , with the air 6 removing heat from the thermally conductive side wall 4 a of the module 4 .
  • one side wall 10 ( FIG. 2 ) is embodied at least partially as being rib-shaped and a further side wall 11 as wave-shaped. Measures of such type will enlarge the heat-releasing side-wall area, as a result of which the removal of heat from a module will be improved.
  • the described arrangements and embodiments of the modules will also yield advantages in terms of heat removal when that is done not through natural convection but through forced ventilation, for example in a manner such that ventilating is provided by means of ventilators located beneath the modules.

Abstract

There is described a module for an automation device with a plurality of adjacent modules, having a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. There is also described an automation device having modules of said type. It is proposed that one of the side walls of the modules be embodied as being thermally conductive and that the other side wall be embodied as being thermally insulated. That will on the one hand result in improved heat dissipation for the modules and, on the other, will prevent the thermal coupling of adjacent modules of the automation device.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims priority of European application No. 06018133.6 EP filed Aug. 30, 2006, which is incorporated by reference herein in its entirety.
    • FIELD OF INVENTION
  • The invention relates to a module for an automation device that consists of a plurality of adjacent modules, having a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. The invention relates further to an automation device having modules of said type.
    • BACKGROUND OF INVENTION
  • An example of a module is known from Siemens' Catalog “ST 70 News 2006”, Section 3: “SIMATIC S7”. Located inside a housing capsule of the module is a printed circuit board fitted with electric and electronic components. Said components are cooled mainly through convection in a manner such that air flows through an opening on the underside of the housing capsule and across the components, then finally through an opening on the top side of the housing capsule, with the air that flows through the housing removing heat from the components. Said openings in the housing capsule below and above the components are problematic especially if the modules or automation device are/is employed in areas exposed to explosion hazards or in applications requiring a tight seal. Moreover, adjacent modules in the automation device heat each other, a factor that has to be considered during project work on the automation device and which, owing to the modular automation device's wide-ranging combination potential, makes such work difficult.
    • SUMMARY OF INVENTION
  • An object of the present invention is to provide a module of the type cited in the introduction having improved heat dissipation. Further to be disclosed is an automation device having improved heat dissipation.
  • Said object is achieved in terms of the module by embodying one of the side walls as being thermally conductive and the other as being thermally insulated. Said object is achieved in terms of the automation device by means of the measures disclosed in the claims.
  • It is advantageous that the openings in the housing capsule below the electric and electronic components can be dispensed with and a closed structural form facilitated thereby. The side wall embodied as being thermally conductive is provided for dissipating heat from the module; the side wall embodied as being thermally insulated will prevent thermal coupling to an adjacent module of an assembled automation device. As thermal coupling of the modules is prevented, adjacent modules will not heat each other.
  • In an embodiment of the invention the thermally conductive side wall is embodied substantially as being u-shaped and/or as having the form of ribs, the effect of which is to enlarge the heat-releasing side-wall area.
  • In a further embodiment of the invention it is provided for the electric components of the module, for example a printed circuit board fitted with electronic components, to be thermally coupled to the thermally conductive side wall. The removal of heat from the module will be further improved thereby.
  • In an automation device having modules of said type wherein one module's thermally conductive side wall is in each case adjacent to another module's thermally insulated side wall, the respective thermally conductive side wall's rib height or, as the case may be, its width (chimney width) is matched to the respective module's heat loss. The rib height or, as the case may be, chimney width of modules losing less heat is embodied as being smaller than that of modules losing more heat, as a result of which modules with a low heat loss will, when modules are of equal width, have more space for functional elements.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention and its embodiments and advantages are explained in more detail below with the aid of the drawing in which an exemplary embodiment of the invention is illustrated.
  • FIG. 1 shows a modular automation device and
  • FIG. 2 shows cross-sections of thermally conductive side walls.
    •  DETAILED DESCRIPTION OF INVENTION
  • Identified by the numeral 1 in FIG. 1 is a modular automation device that includes four modules 2, 3, 4, 5 of equal width. Further constituents of the automation device 1, for example communication means via which the modules are interconnected, or suitable hooking devices for attaching the modules to a support rail (not shown here), are of no significance to the invention and will not be elucidated in the following. The modules can of course be embodied as being of different width. It is, though, advantageous for visual or design reasons for the width of the modules to be made the same or having the same modularity (2×, 3× etc. width). The modules 2, 3, 4, 5 each have a thermally conductive u-shaped side wall 2 a, 3 a, 4 a, 5 a and each a thermally insulated side wall 2 b, 3 b, 4 b, 5 b, with in each case a thermally insulated side wall 2 b, 3 b, 4 b, 5 b of one module 2, 3, 4, 5 being adjacent to in each case a thermally conductive side wall 2 a, 3 a, 4 a, 5 a of a further module 2, 3, 4, 5.
  • It is assumed in the present example that the module 4 has a greater heat loss during control operations than the modules 2, 3, 5, meaning that more heat has to be removed from the module 4 than from the modules 2, 3, 5. The thermally conductive side wall 4 a of the module 4 is for that purpose embodied as being wider than the thermally conductive side walls 2 a, 3 a, 5 a of the modules 2, 3, 5. The width of the thermally insulated side walls 2 b, 3 b, 4 b, 5 b is the same for all the modules 2, 3, 4, 5, as a result of which the heat conditions on said walls are substantially identical. Heat is removed from the modules 2, 3, 4, 5 substantially through thermal convection. For that purpose air 6 flows through, for example, a “chimney” 7 formed by the thermally insulated side wall 3 b of the module 3 and by the thermally conductive side wall 4 a of the module 4 from a chimney inlet 8 to a chimney outlet 9, with the air 6 removing heat from the thermally conductive side wall 4 a of the module 4.
  • In order to enlarge the surface of a thermally conductive side wall, one side wall 10 (FIG. 2) is embodied at least partially as being rib-shaped and a further side wall 11 as wave-shaped. Measures of such type will enlarge the heat-releasing side-wall area, as a result of which the removal of heat from a module will be improved.
  • The described arrangements and embodiments of the modules will also yield advantages in terms of heat removal when that is done not through natural convection but through forced ventilation, for example in a manner such that ventilating is provided by means of ventilators located beneath the modules.

Claims (17)

1.-5. (canceled)
6. A module for an automation device, comprising:
a housing capsule with a rear wall a thermally conductive side wall and a thermally insulated side wall.
7. The module as claimed in claim 6, wherein the automation device comprises a plurality of adjacent modules.
8. The module as claimed in claim 7, wherein the housing capsule houses electric components.
9. The module as claimed in claim 6, wherein the thermally conductive side wall has a u-shape.
10. The module as claimed in claim 6, wherein the thermally conductive side wall has ribs.
11. The module as claimed in claim 9, wherein the thermally conductive side wall has ribs.
12. The module as claimed in claim 8, wherein the electric components are thermally coupled to the thermally conductive side wall.
13. The module as claimed in claim 9, wherein the electric components are thermally coupled to the thermally conductive side wall.
14. The module as claimed in claim 11, wherein the electric components are thermally coupled to the thermally conductive side wall.
15. An automation device, comprising:
a plurality of adjacent modules, wherein a module has a thermally conductive side wall and a thermally insulated side wall, wherein the thermally conductive side wall of a first module is adjacent to the thermally insulated side wall of a second module.
16. The automation device as claimed in claim 15, wherein the first module has a housing capsule with a rear wall and the second module has a housing capsule with a rear wall.
17. The automation device as claimed in claim 16, comprising a forced-ventilation.
18. The automation device as claimed in claim 17, wherein the forced-ventilation is based on a ventilator.
19. The automation device as claimed in claim 15, wherein the thermally conductive side wall has a chimney, wherein a width of the chimney of modules losing less heat is smaller than of modules losing more heat.
20. The automation device as claimed in claim 15, wherein the thermally conductive side wall has a ribs, wherein a rib height of modules losing less heat is smaller than of modules losing more heat.
21. The automation device as claimed in claim 15, wherein the thermally insulated side walls of different modules have a different width.
US11/897,375 2006-08-30 2007-08-30 Module for an automation device Abandoned US20080055864A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/579,677 US8081471B2 (en) 2006-08-30 2009-10-15 Module for an automation device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06018133A EP1895824B1 (en) 2006-08-30 2006-08-30 Assembly for an automation device
EP06018133.6 2006-08-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/579,677 Continuation US8081471B2 (en) 2006-08-30 2009-10-15 Module for an automation device

Publications (1)

Publication Number Publication Date
US20080055864A1 true US20080055864A1 (en) 2008-03-06

Family

ID=37665433

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/897,375 Abandoned US20080055864A1 (en) 2006-08-30 2007-08-30 Module for an automation device
US12/579,677 Expired - Fee Related US8081471B2 (en) 2006-08-30 2009-10-15 Module for an automation device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/579,677 Expired - Fee Related US8081471B2 (en) 2006-08-30 2009-10-15 Module for an automation device

Country Status (4)

Country Link
US (2) US20080055864A1 (en)
EP (1) EP1895824B1 (en)
CN (1) CN101137283B (en)
DE (1) DE502006003331D1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090036167A1 (en) * 2004-11-29 2009-02-05 Sanmina-Sci Corporation System and method for base station heat dissipation using chimneys

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2073618B1 (en) 2007-12-17 2011-01-26 Siemens Aktiengesellschaft Electronic device
JP4951094B2 (en) * 2010-02-16 2012-06-13 株式会社東芝 Electronic equipment cooling structure
JP5807220B2 (en) * 2010-12-30 2015-11-10 株式会社ザイキューブ Interposer and semiconductor module using the same
CN103249275A (en) * 2012-02-07 2013-08-14 鸿富锦精密工业（深圳）有限公司 Heat dissipation system
WO2016048391A1 (en) * 2014-09-25 2016-03-31 Evtron, Inc. Heat and flow management in a computing device
JP2019009389A (en) * 2017-06-28 2019-01-17 パナソニックＩｐマネジメント株式会社 Electric device and distribution board
GB2586094B (en) * 2020-06-22 2022-06-15 Zhong Qingchang Rackless thermal-efficient modular power electronic system
US11515802B2 (en) * 2020-12-15 2022-11-29 Caterpillar Inc. Modular configurable inverter and systems, components, and methods thereof

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401351A (en) * 1981-09-28 1983-08-30 Advant Corporation Expandable card cage
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
US5595240A (en) * 1990-03-02 1997-01-21 Hitachi, Ltd. Cooling apparatus of electronic devices
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
US6084771A (en) * 1997-06-19 2000-07-04 Alcatel Power electronic module and power electronic device including such modules
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US6116916A (en) * 1998-02-23 2000-09-12 Sumitomo Wiring Systems, Ltd. Electrical connection box
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US6201700B1 (en) * 2000-01-06 2001-03-13 Ford Motor Company Box design for maximum heat dissipation
US6393775B1 (en) * 1998-04-24 2002-05-28 Udo Ingmar Staschik Utilities container
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
US6754073B2 (en) * 2002-04-26 2004-06-22 International Business Machines Corporation Thermal load dissipation assembly
US6765793B2 (en) * 2002-08-30 2004-07-20 Themis Corporation Ruggedized electronics enclosure
US6796808B2 (en) * 2001-06-20 2004-09-28 Sumitomo Wiring Systems, Ltd. Electric junction box
US20050078448A1 (en) * 2002-02-04 2005-04-14 Digital-Logic Ag Housing for a passively cooled computer
US6979772B2 (en) * 2003-05-14 2005-12-27 Chaun-Choung Technology Corp. Integrated heat dissipating enclosure for electronic product
US7031156B2 (en) * 2003-07-25 2006-04-18 Rockwell Automation Technologies, Inc. Reduced package volume convectively cooled sealed electrical system and method
US7136286B2 (en) * 2005-01-10 2006-11-14 Aaeon Technology Inc. Industrial computer with aluminum case having fins as radiating device
US7180747B2 (en) * 2005-05-31 2007-02-20 Cheng-Ping Lee Heat dissipation device for a computer mother board
US20070076355A1 (en) * 2005-06-22 2007-04-05 Denso Corporation Module type multiphase inverter
US7272945B2 (en) * 2003-07-29 2007-09-25 Hewlett-Packard Development Company, L.P. Environmental condition measurement system
US7283363B2 (en) * 2006-01-20 2007-10-16 Stirring Enetrprise Co., Ltd. Computer casing
US20070297138A1 (en) * 2006-06-26 2007-12-27 Silver-Stone Technology Co., Ltd. Liquid-cooling heat dissipating device for dissipating heat by a casing
US20080043425A1 (en) * 2006-08-17 2008-02-21 Justin Richard Hebert Methods and systems for cooling a computing device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2015361B2 (en) * 1970-03-31 1979-06-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Cooling system for spaced circuit boards - has hollow board support rails with apertures directing air behind apertured plates which direct air onto specific components
US4646559A (en) * 1985-01-22 1987-03-03 Jack W. Hayden Apparatus and method to test a single connection between a pipe coupling and a single pipe end connected therewith
US5112119A (en) * 1989-10-27 1992-05-12 International Business Machines Corp. Support structure for devices in a computer apparatus
FR2719740B1 (en) * 1994-05-06 1996-06-21 Schneider Electric Sa Modular automation device.
CN2476917Y (en) * 2001-04-23 2002-02-13 陈信和 Case for assembling electrical equipment
US20040105036A1 (en) * 2002-08-06 2004-06-03 E Ink Corporation Protection of electro-optic displays against thermal effects
JP4120876B2 (en) * 2003-05-26 2008-07-16 株式会社デンソー Semiconductor device
US7126820B2 (en) * 2003-11-11 2006-10-24 Intel Corporation Modular platform system and apparatus

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401351A (en) * 1981-09-28 1983-08-30 Advant Corporation Expandable card cage
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
US4656559A (en) * 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
US5595240A (en) * 1990-03-02 1997-01-21 Hitachi, Ltd. Cooling apparatus of electronic devices
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US6084771A (en) * 1997-06-19 2000-07-04 Alcatel Power electronic module and power electronic device including such modules
US6116916A (en) * 1998-02-23 2000-09-12 Sumitomo Wiring Systems, Ltd. Electrical connection box
US6393775B1 (en) * 1998-04-24 2002-05-28 Udo Ingmar Staschik Utilities container
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US6201700B1 (en) * 2000-01-06 2001-03-13 Ford Motor Company Box design for maximum heat dissipation
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
US6796808B2 (en) * 2001-06-20 2004-09-28 Sumitomo Wiring Systems, Ltd. Electric junction box
US7095611B2 (en) * 2002-02-04 2006-08-22 Digital-Logic Ag Housing for a passively cooled computer
US20050078448A1 (en) * 2002-02-04 2005-04-14 Digital-Logic Ag Housing for a passively cooled computer
US6754073B2 (en) * 2002-04-26 2004-06-22 International Business Machines Corporation Thermal load dissipation assembly
US6765793B2 (en) * 2002-08-30 2004-07-20 Themis Corporation Ruggedized electronics enclosure
US6979772B2 (en) * 2003-05-14 2005-12-27 Chaun-Choung Technology Corp. Integrated heat dissipating enclosure for electronic product
US7031156B2 (en) * 2003-07-25 2006-04-18 Rockwell Automation Technologies, Inc. Reduced package volume convectively cooled sealed electrical system and method
US7272945B2 (en) * 2003-07-29 2007-09-25 Hewlett-Packard Development Company, L.P. Environmental condition measurement system
US7136286B2 (en) * 2005-01-10 2006-11-14 Aaeon Technology Inc. Industrial computer with aluminum case having fins as radiating device
US7180747B2 (en) * 2005-05-31 2007-02-20 Cheng-Ping Lee Heat dissipation device for a computer mother board
US20070076355A1 (en) * 2005-06-22 2007-04-05 Denso Corporation Module type multiphase inverter
US7283363B2 (en) * 2006-01-20 2007-10-16 Stirring Enetrprise Co., Ltd. Computer casing
US20070297138A1 (en) * 2006-06-26 2007-12-27 Silver-Stone Technology Co., Ltd. Liquid-cooling heat dissipating device for dissipating heat by a casing
US20080043425A1 (en) * 2006-08-17 2008-02-21 Justin Richard Hebert Methods and systems for cooling a computing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090036167A1 (en) * 2004-11-29 2009-02-05 Sanmina-Sci Corporation System and method for base station heat dissipation using chimneys

Also Published As

Publication number Publication date
CN101137283B (en) 2012-07-18
EP1895824A1 (en) 2008-03-05
CN101137283A (en) 2008-03-05
US20100027222A1 (en) 2010-02-04
EP1895824B1 (en) 2009-04-01
DE502006003331D1 (en) 2009-05-14
US8081471B2 (en) 2011-12-20

Similar Documents

Publication Publication Date Title
US8081471B2 (en) Module for an automation device
US7319594B2 (en) Assembly of devices
CN1074962C (en) Welding power supply casing
JP4113220B2 (en) Cooling system
US20070256957A1 (en) Sub-rack with housing for receiving plug-in modules
US8542485B2 (en) Electronic equipment housing cooled by natural and forced ventilation
US7895857B2 (en) Indoor unit of an air conditioner
US7150109B2 (en) Dry-wet thermal management system
AU739485B2 (en) A switchgear cabinet and associated ventilator assembly
JP5264432B2 (en) Inter-rack passage shielding structure
US20130070416A1 (en) Thermal Management System
CN102257711B (en) Electric power source device
US20140177170A1 (en) Electronic Control Cabinet with Cooling
US20110210652A1 (en) Distribution cabinet for communications and data technology
KR101367242B1 (en) Electronic device
JP2876583B2 (en) control panel
CN210155600U (en) Reinforced sealed case based on MTCA standard
JP2000013934A (en) Outdoor switch gear
JP2008106948A (en) Drip-proof structure in terminal board of outdoor unit
JP2004356130A (en) Power converter
JP2018189267A (en) Outdoor unit for air conditioner
JP2008159925A (en) Electronic apparatus
CN110632986A (en) Reinforced sealed case based on MTCA standard and assembling method thereof
JP2009017611A (en) Metal-enclosed switchgear
CN105992506A (en) Business board structure and distributed network device

Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ABERT, MICHAEL;REEL/FRAME:019815/0286

Effective date: 20070808

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE