US20080064310A1 - Polishing pad having hollow fibers and the method for making the same - Google Patents

Polishing pad having hollow fibers and the method for making the same Download PDF

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Publication number
US20080064310A1
US20080064310A1 US11/517,255 US51725506A US2008064310A1 US 20080064310 A1 US20080064310 A1 US 20080064310A1 US 51725506 A US51725506 A US 51725506A US 2008064310 A1 US2008064310 A1 US 2008064310A1
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Prior art keywords
hollow fibers
polishing
polishing pad
hollow
making
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Abandoned
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US11/517,255
Inventor
Chung-Chih Feng
I-Peng Yao
Chao-Yuan Tsai
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San Fang Chemical Industry Co Ltd
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San Fang Chemical Industry Co Ltd
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Priority to US11/517,255 priority Critical patent/US20080064310A1/en
Assigned to SAN FANG CHEMICAL INDUSTRY CO., LTD. reassignment SAN FANG CHEMICAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, CHUNG-CHIH, TSAI, CHAO-YUAN, YAO, I-PENG
Publication of US20080064310A1 publication Critical patent/US20080064310A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics

Definitions

  • the present invention relates to a polishing pad for use in a chemical mechanical polishing (CMP) process and the method for making the same, and more particularly, to a polishing pad having hollow fibers and the method for making the same.
  • CMP chemical mechanical polishing
  • FIG. 1 it is a schematic top view of a conventional polishing pad having a surface pattern.
  • the surface pattern of the polishing pad 1 comprises a plurality of linear grooves 11 arranged in a “#” shape, wherein the depth, width, and space of the linear grooves 11 are designed depending upon actual requirements.
  • the linear grooves 11 have preferred uniformity with respect to the polishing pad 1 , and may provide preferred flowability of the polishing slurry.
  • the area occupied by the grooves 11 takes up a large percentage of the whole grinding area, thereby causing the loss of a large amount of polishing slurry.
  • FIG. 2 is a schematic top view of a second conventional polishing pad having a surface pattern.
  • the surface pattern of the polishing pad 2 comprises a plurality of concentric circular grooves 21 , wherein the depth and the width of the circular grooves 21 are designed depending upon actual requirements.
  • the defect of the polishing pad 2 lies in that the difference between polishing areas of local regions is excessively large, thus it is hard to achieve the uniformity of the groove area ratio.
  • the impurities generated during the polishing process cannot be easily removed from the polishing pad 2 , thereby influencing the polishing precision and the lifetime of the polishing pad 2 .
  • An objective of the present invention is to provide a polishing pad having hollow fibers.
  • the polishing pad comprises a body and a plurality of hollow fibers.
  • the body has a polishing surface.
  • the hollow fibers are located within the body and have an opening on the polishing surface, wherein the hollow area of the section of each hollow fiber is larger than the sectional area of the polishing particles in a polishing slurry. Therefore, the polishing slurry and the polishing particles achieve a thorough circulation on the polishing pad via the hollow fibers, unlike the transmission of polishing slurry in the conventional polishing pad, which is limited by the polishing area ratio occupied by the grooves.
  • FIG. 4 is diagram of an SEM photo of the hollow fibers used in the present invention.
  • FIG. 4 it is a diagram of an SEM photo of the hollow fibers used in the present invention.
  • the hollow fibers used in the present invention are conventional hollow fibers.
  • the hollow fiber 32 is located within the body 31 and has an opening on the polishing surface 33 , and the openings of the hollow fibers 32 are distributed uniformly.
  • the material of the hollow fibers 32 is selected from a group consisting of PP, PET, and Nylon.
  • the ratio of the hollow area of the section of each of the hollow fibers 32 to the total area of the section thereof (hollowed ratio) is 10-30%.

Abstract

The invention relates to a polishing pad having hollow fibers and a method for making the same. The polishing pad comprises a body and a plurality of hollow fibers. The body has a polishing surface. The hollow fibers are located within the body and have an opening on the polishing surface, wherein the hollow area of the section of each hollow fiber is larger than the sectional area of polishing particles in a polishing slurry. Therefore, the polishing slurry and polishing particles achieve a thorough circulation on the polishing pad via the hollow fibers.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a polishing pad for use in a chemical mechanical polishing (CMP) process and the method for making the same, and more particularly, to a polishing pad having hollow fibers and the method for making the same.
  • 2. Description of the Related Art
  • Generally speaking, grinding refers to the abrasion loss control for the originally rough surface in the chemical mechanical polishing (CMP) process, wherein the polishing slurry containing polishing particles is uniformly dispersed on a top surface of a polishing pad, and meanwhile, a workpiece to be ground is pressed against the polishing pad and then is rubbed repeatedly and regularly. The workpiece to be ground is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass or a photoelectrical panel. In order to maintain the distribution and the flow of the polishing slurry, and to maintain the flattening and the polishing efficiency after the CMP process, a plurality of grooves is opened on the top surface of the polishing pad or a surface pattern is always formed thereon. Therefore, the grinding effect of the polishing pad on the object to be ground is easily influenced by the grooves or the surface pattern.
  • Referring to FIG. 1, it is a schematic top view of a conventional polishing pad having a surface pattern. The surface pattern of the polishing pad 1 comprises a plurality of linear grooves 11 arranged in a “#” shape, wherein the depth, width, and space of the linear grooves 11 are designed depending upon actual requirements. The linear grooves 11 have preferred uniformity with respect to the polishing pad 1, and may provide preferred flowability of the polishing slurry. However, since there are many channels communicating with the periphery 12 of the polishing pad 1, the area occupied by the grooves 11 takes up a large percentage of the whole grinding area, thereby causing the loss of a large amount of polishing slurry.
  • FIG. 2 is a schematic top view of a second conventional polishing pad having a surface pattern. The surface pattern of the polishing pad 2 comprises a plurality of concentric circular grooves 21, wherein the depth and the width of the circular grooves 21 are designed depending upon actual requirements. The defect of the polishing pad 2 lies in that the difference between polishing areas of local regions is excessively large, thus it is hard to achieve the uniformity of the groove area ratio. Moreover, the impurities generated during the polishing process cannot be easily removed from the polishing pad 2, thereby influencing the polishing precision and the lifetime of the polishing pad 2.
  • Consequently, there is an existing need for a polishing pad having hollow fibers and the method for making the same to solve the above-mentioned problems.
    • SUMMARY OF THE INVENTION
  • An objective of the present invention is to provide a polishing pad having hollow fibers. The polishing pad comprises a body and a plurality of hollow fibers. The body has a polishing surface. The hollow fibers are located within the body and have an opening on the polishing surface, wherein the hollow area of the section of each hollow fiber is larger than the sectional area of the polishing particles in a polishing slurry. Therefore, the polishing slurry and the polishing particles achieve a thorough circulation on the polishing pad via the hollow fibers, unlike the transmission of polishing slurry in the conventional polishing pad, which is limited by the polishing area ratio occupied by the grooves. Moreover, in the present invention, since the flowability of the polishing slurry and polishing particles is superior, the processing time for the workpiece to be ground is quite uniform and can be estimated and controlled, unlike the processing time for the polishing slurry to be applied to the workpiece to be ground in the conventional polishing pad, which cannot be estimated and controlled.
  • Another objective of the present invention is to provide a method for making a polishing pad having hollow fibers. The method comprises: (a) providing a plurality of hollow fibers; (b) vertically arranging the hollow fibers on a substrate; (c) forming a body to cover the hollow fibers; and (d) removing the substrate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic top view of a first conventional polishing pad having a surface pattern on the surface;
  • FIG. 2 is a schematic top view of a second conventional polishing pad having a surface pattern on the surface;
  • FIG. 3 is a schematic cross-sectional view of a polishing pad having hollow fibers according to the present invention;
  • FIG. 4 is diagram of an SEM photo of the hollow fibers used in the present invention;
  • FIG. 5 is a schematic cross-sectional view of a polishing pad having hollow fibers according to another embodiment of the present invention; and
  • FIGS. 6-7 are schematic views of a flow for fabricating the polishing pad having hollow fibers according to the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The present invention provides a polishing pad having hollow fibers, which is applied in a chemical mechanical polishing (CMP) process to polish or grind a workpiece to be ground. The workpiece to be ground may be, but is not limited to, a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat panel glass, an optical glass or a photoelectric panel.
  • Referring to FIG. 3, it is a schematic cross-sectional view of a polishing pad having hollow fibers according to the present invention. The polishing pad 3 comprises a body 31 and a plurality of hollow fibers 32. The body 31 has a polishing surface 33. In this embodiment, the material of the body 31 is high solid PU, and the body 31 has a plurality of continuous or discontinuous holes 34 therein. However, the material of the body 31 also can be acryl resin or another resin.
  • FIG. 4, it is a diagram of an SEM photo of the hollow fibers used in the present invention. The hollow fibers used in the present invention are conventional hollow fibers. Referring to FIG. 3, the hollow fiber 32 is located within the body 31 and has an opening on the polishing surface 33, and the openings of the hollow fibers 32 are distributed uniformly. In this embodiment, the material of the hollow fibers 32 is selected from a group consisting of PP, PET, and Nylon. The ratio of the hollow area of the section of each of the hollow fibers 32 to the total area of the section thereof (hollowed ratio) is 10-30%.
  • In the present invention, the hollow area of the section of each hollow fiber 32 is larger than the sectional area of the polishing particles (not shown) in a polishing slurry, which allows the polishing slurry and polishing particles to flow within the hollow fibers 32. The polishing slurry and polishing particles thereby achieve a thorough circulation on the polishing pad 3 via the hollow fibers 32, unlike the transmission of the polishing slurry in the conventional polishing pad 1, 2 (FIG. 1 and FIG. 2), which is limited by the polishing area ratio occupied by the grooves. Moreover, in the present invention, since the flowability of the polishing slurry and polishing particles is superior, the processing time for the workpiece to be ground is uniform and can be estimated and controlled, unlike the processing time for the polishing slurry to be applied to the workpiece to be ground in the conventional polishing pad 1, 2 (FIG. 1 and FIG. 2), which cannot be estimated and controlled.
  • In this embodiment, the openings of the hollow fibers 32 are uniformly distributed, that is, the hollow fibers 32 are uniformly distributed on the polishing surface 33, and the hollow fibers 32 are vertical to the polishing surface 33. However, the openings of the hollow fibers 32 also can be arranged in a particular pattern, for example, arranged in a plurality of concentric circles, or arranged in a “#” shape.
  • Preferably, in other embodiment, the hollow fibers 32 further protrude from the polishing surface 33, as shown in FIG. 5. The effect of removing the residuals after the grinding process can be achieved in this embodiment by utilizing the toughness characteristic of the hollow fibers 32 themselves.
  • Preferably, the polishing pad 3 further comprises a plurality of grooves (not shown) located on the polishing surface 33. As seen from the top, the grooves can be a plurality of linear grooves arranged in “#” shape, or a plurality of concentric circular grooves.
  • The present invention further comprises a method for making the polishing pad 3, which comprises the following steps. First, a plurality of hollow fibers 32 as shown in FIG. 4 is provided. Then, referring to FIG. 6, the hollow fibers 32 are vertically arranged on a substrate 40. In this embodiment, the hollow fibers 32 are arranged on the substrate 40 by using electrostatic adsorption method. In this embodiment, the hollow fibers 32 are vertically distributed on the substrate 40 uniformly. However, the hollow fibers 32 can also be arranged into a particular pattern, for example, into a plurality of concentric circles, or into a “#” shape.
  • Next, referring to FIG. 7, a body 31 is formed to cover the hollow fibers 32. In this embodiment, the material of the body 31 is a High Solid PU, and the body 31 has a plurality of continuous or discontinuous holes 34 therein. However, the material of the body 31 also can be acryl resin or another resin.
  • Finally, the substrate 40 is removed, and the polishing pad 3 as shown in FIG. 3 is formed after overturning for 180 degrees.
  • While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.

Claims (6)

1-10. (canceled)
11. A method for making a polishing pad having hollow fibers, the method comprising the steps of:
(a) providing a plurality of hollow fibers;
(b) vertically arranging the hollow fibers on a substrate;
(c) forming a body to cover the hollow fibers; and
(d) removing the substrate to form a polishing pad, wherein the polishing pad has the body and the hollow fibers and a height of the body is greater than a height of the hollow fibers.
12. The method as claimed in claim 11, wherein in step (b), the hollow fibers are vertically distributed on the substrate uniformly.
13. The method as claimed in claim 11, wherein in step (b), the hollow fibers are arranged in a plurality of concentric circles.
14. The method as claimed in claim 11, wherein in step (b), the hollow fibers are arranged in a “#” shape.
15. The method as claimed in claim 11, wherein in step (b), the hollow fibers are arranged on the substrate by using an electrostatic adsorption method.
US11/517,255 2006-09-08 2006-09-08 Polishing pad having hollow fibers and the method for making the same Abandoned US20080064310A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150050866A1 (en) * 2013-08-16 2015-02-19 San Fang Chemical Industry Co., Ltd. Polishing pad, polishing apparatus and method for manufacturing polishing pad

Citations (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US636036A (en) * 1899-05-15 1899-10-31 Edward G Goodell Locking attachment for photographic apparatus.
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
US3617702A (en) * 1969-06-10 1971-11-02 Du Pont Apparatus and method for perforating sheet material
US3650880A (en) * 1968-11-20 1972-03-21 Hooker Chemical Corp Porous polyurethanes and method of manufacture
US3860399A (en) * 1972-12-07 1975-01-14 Gen Electric Liquid blocking technique for working a member to precise optical tolerances
US4017656A (en) * 1975-09-18 1977-04-12 Pandel-Bradford, Inc. Imitation leather material and method of preparing such material
US4115683A (en) * 1974-12-16 1978-09-19 International Business Machines Corporation Laser piercing of materials by induced shock waves
US4132037A (en) * 1977-02-28 1979-01-02 Siltec Corporation Apparatus for polishing semiconductor wafers
US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
US4276341A (en) * 1979-05-02 1981-06-30 Kabushiki Kaisha Asahi Gomu Wet suit material and wet suit made thereof
US4306573A (en) * 1978-01-09 1981-12-22 Hauni-Werke K/rber & Co. KG Method and apparatus for producing rod-like tobacco fillers
US4328410A (en) * 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers
US4851061A (en) * 1987-03-16 1989-07-25 Sorkoram Paul O Method and apparatus for patterned cut of thermoplastics
US4850093A (en) * 1987-02-09 1989-07-25 Grumman Aerospace Corporation Method of making an acoustic attenuating liner
US5058413A (en) * 1989-11-07 1991-10-22 Robert Muddiman Rupture disc
US5109638A (en) * 1989-03-13 1992-05-05 Microsurface Finishing Products, Inc. Abrasive sheet material with non-slip backing
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5336554A (en) * 1993-05-14 1994-08-09 David Knight Stretchable tear resistant porous elastomeric film elements and processes
US5424813A (en) * 1994-05-23 1995-06-13 Xerox Corporation Apparatus and method for improved blotter roller permeability
US5497699A (en) * 1994-11-29 1996-03-12 Mather; Clifford L. Method of silk screen printing on a rough surface such as a football
US5539182A (en) * 1993-05-20 1996-07-23 Ludw. Lindgens Gmbh & Co. Kg Process for increasing moisture permeability of leather, especially for seating in the automobile industry
US5584146A (en) * 1995-04-10 1996-12-17 Applied Materials, Inc. Method of fabricating chemical-mechanical polishing pad providing polishing uniformity
US5632914A (en) * 1995-05-24 1997-05-27 Davidson Textron Inc. Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes
US5707385A (en) * 1994-11-16 1998-01-13 Advanced Cardiovascular Systems, Inc. Drug loaded elastic membrane and method for delivery
US5776290A (en) * 1993-04-15 1998-07-07 Minnesota Mining And Manufacturing Company Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing
US5830806A (en) * 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US5871393A (en) * 1996-03-25 1999-02-16 Chiyoda Co., Ltd. Mounting member for polishing
US5906887A (en) * 1992-08-19 1999-05-25 P.C.I.Paper Conversions, Inc. Composite elastomeric article for adhesive cushioning and mounting means
US5935683A (en) * 1996-04-24 1999-08-10 Mitsui Chemicals, Inc. Waterproof material and method for applying it
US5975999A (en) * 1997-01-06 1999-11-02 3M Innovative Properties Company Hand tool having a cushioned laminate attachment surface
US5989470A (en) * 1996-09-30 1999-11-23 Micron Technology, Inc. Method for making polishing pad with elongated microcolumns
US5993293A (en) * 1998-06-17 1999-11-30 Speedram Corporation Method and apparatus for improved semiconductor wafer polishing
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US6089965A (en) * 1998-07-15 2000-07-18 Nippon Pillar Packing Co., Ltd. Polishing pad
US6095900A (en) * 1998-03-23 2000-08-01 Speedfam-Ipec Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers
US6117776A (en) * 1997-05-30 2000-09-12 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Wafer holder and method of producing a semiconductor wafer
US6155910A (en) * 1997-01-03 2000-12-05 3M Innovative Properties Company Method and article for the production of optical quality surfaces on glass
US6172330B1 (en) * 1997-02-28 2001-01-09 Murata Manufacturing Co., Ltd. Method and apparatus for forming a through hole in a ceramic green sheet
US6217434B1 (en) * 1997-04-04 2001-04-17 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6238745B1 (en) * 1998-12-22 2001-05-29 Dow Corning Toray Silicone Co. Ltd. Water repellent for treating solids
US6367529B1 (en) * 1998-05-01 2002-04-09 Fujikoshi Kikai Kogyo Kabushiki Kaisha Method of adhering wafers and wafer adhering device
US6454633B1 (en) * 1997-04-04 2002-09-24 Rodel Holdings Inc. Polishing pads of flocked hollow fibers and methods relating thereto
US20030068967A1 (en) * 2001-10-09 2003-04-10 Eiji Nakamura Cleaning sheet
US6566426B1 (en) * 2001-11-22 2003-05-20 Nippon Shokubai Co., Ltd. Aqueous resin composition
US6575821B2 (en) * 2000-08-01 2003-06-10 Joest Peter Abrasive belt for a belt grinding machine
US6657158B1 (en) * 2002-06-03 2003-12-02 Visteon Global Technologies, Inc. Method of processing a laser scored instrument panel with an invisible seam airbag opening
US6739040B1 (en) * 1999-10-28 2004-05-25 Ajinomoto Co., Inc. Method of manufacturing multilayered printed wiring board using adhesive film
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US20060116059A1 (en) * 2000-06-23 2006-06-01 International Business Machines Corporation Fiber embedded polishing pad
US7241408B2 (en) * 2002-11-19 2007-07-10 I.V. Technologies Co., Ltd. Method of fabricating polishing pad having detection window thereon
US7295425B2 (en) * 2002-06-27 2007-11-13 Dainippon Ink And Chemicals, Inc. Molding for electrolytic capacitor anode element, molding with substratum, production methods therefor, and production method for electrolytic capacitor anode element
US20080003933A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Sheet for mounting polishing workpiece and method for making the same
US20080003927A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Sheet for mounting polishing workpiece and method for making the same
US7384061B2 (en) * 2005-07-14 2008-06-10 International Automotive Components Group North America, Inc. Trim panel and a method of manufacture

Patent Citations (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US636036A (en) * 1899-05-15 1899-10-31 Edward G Goodell Locking attachment for photographic apparatus.
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements
US3650880A (en) * 1968-11-20 1972-03-21 Hooker Chemical Corp Porous polyurethanes and method of manufacture
US3617702A (en) * 1969-06-10 1971-11-02 Du Pont Apparatus and method for perforating sheet material
US3860399A (en) * 1972-12-07 1975-01-14 Gen Electric Liquid blocking technique for working a member to precise optical tolerances
US4115683A (en) * 1974-12-16 1978-09-19 International Business Machines Corporation Laser piercing of materials by induced shock waves
US4017656A (en) * 1975-09-18 1977-04-12 Pandel-Bradford, Inc. Imitation leather material and method of preparing such material
US4132037A (en) * 1977-02-28 1979-01-02 Siltec Corporation Apparatus for polishing semiconductor wafers
US4306573A (en) * 1978-01-09 1981-12-22 Hauni-Werke K/rber & Co. KG Method and apparatus for producing rod-like tobacco fillers
US4328410A (en) * 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
US4276341A (en) * 1979-05-02 1981-06-30 Kabushiki Kaisha Asahi Gomu Wet suit material and wet suit made thereof
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers
US4850093A (en) * 1987-02-09 1989-07-25 Grumman Aerospace Corporation Method of making an acoustic attenuating liner
US4851061A (en) * 1987-03-16 1989-07-25 Sorkoram Paul O Method and apparatus for patterned cut of thermoplastics
US5109638A (en) * 1989-03-13 1992-05-05 Microsurface Finishing Products, Inc. Abrasive sheet material with non-slip backing
US5058413A (en) * 1989-11-07 1991-10-22 Robert Muddiman Rupture disc
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5906887A (en) * 1992-08-19 1999-05-25 P.C.I.Paper Conversions, Inc. Composite elastomeric article for adhesive cushioning and mounting means
US5776290A (en) * 1993-04-15 1998-07-07 Minnesota Mining And Manufacturing Company Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing
US5336554A (en) * 1993-05-14 1994-08-09 David Knight Stretchable tear resistant porous elastomeric film elements and processes
US5539182A (en) * 1993-05-20 1996-07-23 Ludw. Lindgens Gmbh & Co. Kg Process for increasing moisture permeability of leather, especially for seating in the automobile industry
US5424813A (en) * 1994-05-23 1995-06-13 Xerox Corporation Apparatus and method for improved blotter roller permeability
US5707385A (en) * 1994-11-16 1998-01-13 Advanced Cardiovascular Systems, Inc. Drug loaded elastic membrane and method for delivery
US5497699A (en) * 1994-11-29 1996-03-12 Mather; Clifford L. Method of silk screen printing on a rough surface such as a football
US5584146A (en) * 1995-04-10 1996-12-17 Applied Materials, Inc. Method of fabricating chemical-mechanical polishing pad providing polishing uniformity
US5632914A (en) * 1995-05-24 1997-05-27 Davidson Textron Inc. Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes
US5871393A (en) * 1996-03-25 1999-02-16 Chiyoda Co., Ltd. Mounting member for polishing
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US5935683A (en) * 1996-04-24 1999-08-10 Mitsui Chemicals, Inc. Waterproof material and method for applying it
US5989470A (en) * 1996-09-30 1999-11-23 Micron Technology, Inc. Method for making polishing pad with elongated microcolumns
US5830806A (en) * 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US6155910A (en) * 1997-01-03 2000-12-05 3M Innovative Properties Company Method and article for the production of optical quality surfaces on glass
US5975999A (en) * 1997-01-06 1999-11-02 3M Innovative Properties Company Hand tool having a cushioned laminate attachment surface
US6172330B1 (en) * 1997-02-28 2001-01-09 Murata Manufacturing Co., Ltd. Method and apparatus for forming a through hole in a ceramic green sheet
US6454633B1 (en) * 1997-04-04 2002-09-24 Rodel Holdings Inc. Polishing pads of flocked hollow fibers and methods relating thereto
US6217434B1 (en) * 1997-04-04 2001-04-17 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6117776A (en) * 1997-05-30 2000-09-12 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Wafer holder and method of producing a semiconductor wafer
US6095900A (en) * 1998-03-23 2000-08-01 Speedfam-Ipec Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers
US6367529B1 (en) * 1998-05-01 2002-04-09 Fujikoshi Kikai Kogyo Kabushiki Kaisha Method of adhering wafers and wafer adhering device
US5993293A (en) * 1998-06-17 1999-11-30 Speedram Corporation Method and apparatus for improved semiconductor wafer polishing
US6089965A (en) * 1998-07-15 2000-07-18 Nippon Pillar Packing Co., Ltd. Polishing pad
US6238745B1 (en) * 1998-12-22 2001-05-29 Dow Corning Toray Silicone Co. Ltd. Water repellent for treating solids
US6855043B1 (en) * 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6739040B1 (en) * 1999-10-28 2004-05-25 Ajinomoto Co., Inc. Method of manufacturing multilayered printed wiring board using adhesive film
US20060116059A1 (en) * 2000-06-23 2006-06-01 International Business Machines Corporation Fiber embedded polishing pad
US6575821B2 (en) * 2000-08-01 2003-06-10 Joest Peter Abrasive belt for a belt grinding machine
US6726541B2 (en) * 2001-10-09 2004-04-27 Nihon Microcoating Co., Ltd. Cleaning sheet
US20030068967A1 (en) * 2001-10-09 2003-04-10 Eiji Nakamura Cleaning sheet
US6566426B1 (en) * 2001-11-22 2003-05-20 Nippon Shokubai Co., Ltd. Aqueous resin composition
US6657158B1 (en) * 2002-06-03 2003-12-02 Visteon Global Technologies, Inc. Method of processing a laser scored instrument panel with an invisible seam airbag opening
US7295425B2 (en) * 2002-06-27 2007-11-13 Dainippon Ink And Chemicals, Inc. Molding for electrolytic capacitor anode element, molding with substratum, production methods therefor, and production method for electrolytic capacitor anode element
US7241408B2 (en) * 2002-11-19 2007-07-10 I.V. Technologies Co., Ltd. Method of fabricating polishing pad having detection window thereon
US7384061B2 (en) * 2005-07-14 2008-06-10 International Automotive Components Group North America, Inc. Trim panel and a method of manufacture
US20080003933A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Sheet for mounting polishing workpiece and method for making the same
US20080003927A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Sheet for mounting polishing workpiece and method for making the same
US20080003934A1 (en) * 2006-07-03 2008-01-03 Chung-Chih Feng Sheet for mounting polishing workpiece and method for making the same
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150050866A1 (en) * 2013-08-16 2015-02-19 San Fang Chemical Industry Co., Ltd. Polishing pad, polishing apparatus and method for manufacturing polishing pad

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