US20080087178A1 - Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same - Google Patents
Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same Download PDFInfo
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- US20080087178A1 US20080087178A1 US11/708,791 US70879107A US2008087178A1 US 20080087178 A1 US20080087178 A1 US 20080087178A1 US 70879107 A US70879107 A US 70879107A US 2008087178 A1 US2008087178 A1 US 2008087178A1
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- movable plate
- pcb
- edge
- pcb substrate
- stopper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5138—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to machine work part to fit cooperating work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
- This application claims the benefit of Korean Patent Application No. 10-2006-0100013, filed on Oct. 13, 2006, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
- 1. Field of the Invention
- The present invention relates generally to printed circuit boards (PCBs). More particularly, the present invention relates to an apparatus for supporting a PCB substrate while a printing apparatus applies solder paste on a surface of the substrate, and a method of forming the PCB using the apparatus.
- 2. Description of the Related Art
- Various electronic components are mounted on a surface of a printed circuit board (PCB). Conventionally, PCBs are mass-produced by automated equipment through various processes including a screen printing process, a component mounting process, a reflow process, etc.
- In the screen printing process of PCB mass production, solder paste in a melted state is applied in a predetermined pattern on a substrate surface so that various electronic components of various shapes may be surface-mounted on the PCB to be in communication with each other. The solder paste is applied using an apparatus called a screen printer. The screen printer presses the solder paste supplied on a mask or a screen having a predetermined pattern with a squeegee and applies the pressed solder paste on the PCB.
- When the solder paste is applied on the substrate, a PCB supporting apparatus operates to fix (i.e., hold stationary, clamp or secure) the PCB so that the PCB does not move. The PCB supporting apparatus includes an air cylinder pressing a side surface of the PCB to fix the PCB in order to minimize a movement of the PCB during a printing process.
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FIG. 1 is a plan view illustrating a conventional PCB supporting apparatus andFIG. 2 is a side view illustrating the PCB supporting apparatus ofFIG. 1 . - The conventional PCB supporting apparatus presses side surfaces or edges of a
PCB 10 to fix thePCB 10. The conventional PCB supporting apparatus includes astationary plate 11 supporting one edge of the PCB 10 and amovable plate 12 pressing the other edge of the PCB 10. Themovable plate 12 is operated by anair cylinder 13 to press the other edge of thePCB 10. When the PCB 10 is pressed and fixed between thestationary plate 11 and themovable plate 12, a printing operation of applying solder paste on thePCB 10 is then performed. - In the printing operation of applying solder paste on the
PCB 10, the solder paste that is supplied on a mask or screen is pressed on thePCB 10 by a squeegee. Therefore, a pressure is applied to thePCB 10 in a printing direction, that is, a direction towards where the squeegee presses the solder paste on thePCB 10. - A squeezing pressure ranges from 3 to 20 kg/cm2. On the other hand, the pressure applied to the
movable plate 12 by theair cylinder 13 is at the most approximately 2 kg/cm2. Therefore, when the printing operation of applying solder paste on thePCB 10 is performed and a high squeezing pressure is applied while theair cylinder 13 presses and supports thePCB 10 with low pressure, thePCB 10 may move when, for example, the printing direction is from thestationary plate 11 toward themovable plate 12. - If the
PCB 10 moves in the printing direction when printing for minute components (e.g., having dimensions of approximately 0.3-0.6 mm) is performed on thePCB 10, a small movement of thePCB 10 in the printing direction greatly affects the printing operation, and thus degrades the printing quality. - The pressure applied to the
PCB 10 by theair cylinder 13 may be increased in order to prevent thePCB 10 from moving, but thePCB 10 may be bent, bowed or damaged due to the applied high pressure. - According to an aspect of the present invention, there is provided an apparatus that supports a substrate during a printing operation for printed circuit board (PCB) formation. An example apparatus includes: a first fixing unit including a first movable plate that engages the first edge of the PCB substrate, a first actuator that moves the first movable plate in a first inward direction toward the first edge and a first outward direction away from the first edge, and a first stopper that limits movement of the first movable plate in the first outward direction; and a second fixing unit including a second fixing unit generally parallel with and spaced apart from the first fixing unit, the second fixing unit including a second movable plate that engages the second edge of the PCB substrate, a second actuator that moves the second movable plate in a second inward direction toward the second edge and a second outward direction away from the second edge, and a second stopper that limits movement of the second movable plate in the second outward direction. When solder paste is printed on the PCB substrate from the first edge to the second edge, the apparatus operates such that the second actuator moves the second movable plate in the second outward direction to contact the second stopper, and the first actuator moves the first movable plate in the first inward direction to press the PCB substrate toward the second movable plate. Similarly, when solder paste is printed on the PCB substrate from the second edge to the first edge, the apparatus operates such that the first actuator moves the first movable plate in the first outward direction to contact the first stopper, and the second actuator moves the second movable plate in the second inward direction to press the PCB substrate toward the first movable plate.
- The apparatus may further include a PCB conveying apparatus that delivers the PCB between the first and second fixing units.
- The apparatus may further include a lower support unit that supports a bottom surface of the PCB and which adjusts the height of the PCB to correspond substantially with the height of the first and second movable plates of the first and second fixing units.
- The apparatus may further include a vacuum nozzle that applies a vacuum pressure to the bottom surface of the PCB.
- The first and second fixing units may be movable relative to each other such that a distance between the first and second fixing units is adjusted to correspond to the width of the PCB.
- According to another aspect of the present invention, there is provided a method of forming of a printed circuit board (PCB) using the apparatus for supporting a PCB, the apparatus including first and second fixing units, the method including: loading a PCB in a predetermined region of the apparatus between the first and second fixing units; determining whether a printing direction of a printing apparatus is a first direction proceeding from a first side of the PCB to a second side of the PCB or a second direction from the second side of the PCB to the first side of the PCB; when the printing direction of the printing apparatus is the second direction, fixing a first fixing unit to support the first side of the PCB, and pressing the PCB toward the first fixing unit with the second fixing unit; when the printing direction is the first direction, fixing the second fixing unit to support the second side of the PCB, and pressing the PCB toward the second fixing unit with the first fixing unit; and performing a printing operation by applying solder paste on the PCB with the printing apparatus.
- The loading of the PCB may include conveying the PCB between the first and second fixing units by a PCB conveying apparatus.
- The performing of the printing operation may include aligning the PCB before applying the solder paste on the PCB.
- The performing of the printing operation may further include supporting the PCB by applying a vacuum to a bottom pressure surface of the PCB after the aligning of the PCB.
- In the method, the first fixing unit may include a first movable plate that engages the first edge of the PCB substrate, a first actuator that moves the first movable plate in a first inward direction toward the first edge and a first outward direction away from the first edge, and a first stopper that limits movement of the first movable plate in the first outward direction, and the second fixing unit may include a second movable plate that engages the second edge of the PCB substrate, a second actuator that moves the second movable plate in a second inward direction toward the second edge and a second outward direction away from the second edge, and a second stopper that limits movement of the second movable plate in the second outward direction, and the fixing of the first fixing unit and the second fixing unit may be performed using a driving force applied from the first and second actuators
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FIG. 1 is a plan view illustrating a conventional printed circuit board (PCB) supporting apparatus; -
FIG. 2 is a side view illustrating the conventional PCB supporting apparatus ofFIG. 1 ; -
FIG. 3 is a perspective view illustrating an example printing apparatus including a PCB supporting apparatus according to an embodiment of the present invention; -
FIG. 4 is a partial perspective view illustrating the PCB supporting apparatus illustrated inFIG. 3 ; -
FIG. 5 is an enlarged perspective view illustrating part “A” of the PCB supporting apparatus illustratedFIG. 4 ; -
FIG. 6 is a side elevation view illustrating the PCB supporting apparatus with a PCB conveyed illustrated inFIG. 3 ; -
FIG. 7 is a side elevation view illustrating the PCB supporting apparatus inFIG. 3 performing a printing operation from front to back invention; -
FIG. 8 is a plan view schematically illustrating an operation state of the PCB supporting apparatus illustrated inFIG. 7 ; -
FIG. 9 is a side elevation view illustrating the PCB supporting apparatus inFIG. 3 performing a printing operation from back to front; -
FIG. 10 is a plan view schematically illustrating an operation state of the PCB supporting apparatus illustrated inFIG. 9 ; and -
FIG. 11 is a flowchart illustrating an example method of forming a PCB using the PCB supporting apparatus. - The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.
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FIG. 3 is a perspective view illustrating a printing apparatus including an example printed circuit board (PCB) supporting apparatus according to an aspect of the present invention,FIG. 4 is a perspective view illustrating the PCB supporting apparatus illustrated inFIG. 3 ,FIG. 5 is an enlarged perspective view illustrating part “A” of the PCB supporting apparatus illustratedFIG. 4 , andFIG. 6 is a side elevation view illustrating the PCB supporting apparatus with a PCB conveyed illustrated inFIG. 3 . For sake of convenience, the terms substrate and PCB will be used somewhat interchangeably herein since it should be appreciated that the present apparatus receives substrates for the purpose of facilitating the printing of circuit traces thereon and, thereby, forming PCBs. - Referring to
FIGS. 3 through 6 , the PCB supporting apparatus includes afirst fixing unit 110 and asecond fixing unit 120. The PCB supporting apparatus fixes (i.e., holds stationary, clamps, retains, secures) thePCB 90 between the first andsecond fixing units PCB 90. Therefore, the first andsecond fixing units FIG. 3 ) and the second edge 92 (back edge according to arrow labelled “BACK” inFIG. 3 ) of thePCB 90, respectively. - The
first fixing unit 110 of the PCB supporting apparatus supports thefirst edge 91 of the PCB 90 and includes a firstmovable plate 112, afirst actuator 113 and afirst stopper 114. The firstmovable plate 112 of thefirst fixing unit 110 is movably mounted, coupled or otherwise configured on afirst guide unit 111 for horizontal movement in the y-axis direction. As shown inFIG. 4 , thefirst guide unit 111 is mounted on abase 100. The firstmovable plate 112 of thefirst fixing unit 110 may move along the y-axis in an inward (i.e., backward) direction towards thefirst edge 91 of thePCB 90, and an outward (i.e., frontward) direction away from thefirst edge 91 of thePCB 90. As best illustrated inFIGS. 3 and 4 , the firstmovable plate 112 extends in the x-axis direction along a substantial length of theguide unit 111. - Various means or devices may be employed to move the first
movable plate 112 of thefirst fixing unit 110 in the y-axis direction on thefirst guide unit 111 but in the illustrated embodiment, alinear movement guide 115 and guide block 116 are used to facilitate movement of the firstmovable plate 112 in an inward and outward direction on thefirst guide unit 111. Thelinear movement guide 115 is mounted on thefirst guide unit 111, and aslidable guide block 116 is coupled to thelinear movement guide 115 and is mounted on the firstmovable plate 112. Therefore, the firstmovable plate 112 may move in an inward and outward direction along with thelinear movement guide 115. - The
first actuator 113 of thefirst fixing unit 110 is mounted on thefirst guide unit 111 and is connected to the firstmovable plate 112 to supply a driving force to the firstmovable plate 112. In an embodiment, thefirst actuator 113 of thefirst fixing unit 110 comprises an air (i.e., pneumatic) cylinder, and acylinder rod 117 of the air cylinder is connected to the firstmovable plate 112 through a connectingblock 118. Therefore, when thecylinder rod 117 of the air cylinder extends or retracts by an operation of thefirst actuator 113, a driving force is transferred to the firstmovable plate 112, and thereby moving the firstmovable plate 112 on thefirst guide unit 111. In other embodiments, thefirst actuator 113 may be other suitable devices such as electric actuators, hydraulic actuators, etc. - The
first stopper 114 of thefirst fixing unit 110 is mounted on an outer portion of thelinear movement guide 115. Thefirst stopper 114 limits an outward movement of the firstmovable plate 112 away from thefirst edge 91 of thePCB 90. When the firstmovable plate 112 moves outward away from thefirst edge 91 of thePCB 90 due to thefirst actuator 113 and reaches thefirst stopper 114, the firstmovable plate 112 is stopped. Therefore the firstmovable plate 112 cannot move outward away from thefirst edge 91 of thePCB 90 anymore due to thefirst stopper 114. In such a stopped state, the firstmovable plate 112 is configured to best support thefirst edge 91 of thePCB 90. - The
second fixing unit 120 of the PCB supporting apparatus is configured generally parallel to, and spaced apart from thefirst fixing unit 110 to support thesecond edge 92 of thePCB 90. Thesecond fixing unit 120 includes a secondmovable plate 122, asecond actuator 123 and a second stopper 124 (refer toFIGS. 7 and 9 ). As can be appreciated, thesecond fixing unit 120 of the PCB supporting apparatus is substantially similar to or a substantial mirror-image of thefirst fixing unit 110. - The second
movable plate 122 of thesecond fixing unit 120 is mounted on asecond guide unit 121 mounted on thebase 100 and can horizontally move along the y-axis direction. The secondmovable plate 122 may move in an inward (i.e., frontward) direction towards thesecond edge 92 of thePCB 90, and an outward (i.e., backward) direction away from thesecond edge 92 of thePCB 90. As best illustrated inFIGS. 3 and 4 , the secondmovable plate 122 extends in the x-axis direction along a substantial length of thesecond guide unit 121. - The second
movable plate 122 is moved by thesecond actuator 123, and is coupled to a linear movement guide (not shown) mounted in thesecond guide unit 121 to move in an inward or outward direction towards and away from thesecond edge 92 of thePCB 90. Thesecond stopper 124 is mounted on the linear movement guide to limit an outward movement of the secondmovable plate 122 away from thesecond edge 92 of thePCB 90. - In an embodiment, the first and second fixing
units 110 120 may be movable relative to each other on the base 100 such that a distance between the first andsecond guide units FIGS. 3 and 4 , in one embodiment, thesecond guide unit 121 may move by sliding along aguide 191 of thebase 100, and may be driven by amotor 192 to move toward or away from thefirst guide unit 111. - A
PCB conveying apparatus 130 may be mounted between the first and second fixingunits PCB conveying apparatus 130 may include afirst conveyor belt 131 mounted on thefirst guide unit 111 and asecond conveyor belt 132 mounted on the second guide unit 121 (refer toFIG. 6 ). Thefirst conveyor belt 131 supports a bottom surface of one side of thePCB 90 proximate to edge 91, and thesecond conveyor belt 132 supports a bottom surface of the other side of thePCB 90 proximate to edge 92. Therefore, when the first andsecond conveyor belts PCB 90 is conveyed, oriented, configured or otherwise delivered between the first and second fixingunits - The PCB supporting apparatus may further include a lower support unit 140 (refer to
FIG. 6 ) that is configured to support a bottom surface of thePCB 90. Thelower support unit 140 supports the bottom surface of thePCB 90 by moving in an upward direction under thePCB 90, and thus may adjust the height of thePCB 90 to generally correspond to the height of the first and secondmovable plates PCB 90 is, for example, substantially coplanar with theplates PCB 90 is conveyed between the first and second fixingunits lower support unit 140 rises to support thePCB 90 and adjust the height of thePCB 90. - The
lower support unit 140 includes a verticalmovable plate 141 that moves in upward and downward directions from thebase 100. Thelower support unit 140 further includessupport wings 142 and support pins 143 that extend in an upward direction from the verticalmovable plate 141. Thesupport wings 142 support both sides of the bottom surface of thePCB 90, and the support pins 143 support a center portion of the bottom surface of thePCB 90. - The PCB supporting apparatus may further include a
vacuum nozzle 150 that vertically fixes thePCB 90 by applying a vacuum to the bottom surface of thePCB 90. Thevacuum nozzle 150 can move in upward or downward directions together with thelower support unit 140, such that thevacuum nozzle 150 fixes thePCB 90 by applying vacuum pressure to the bottom surface of thePCB 90 after thesupport wings 142 and the support pins 143 contact the bottom surface of thePCB 90. - An operation of the apparatus for supporting the PCB having the above-mentioned structure will now be described.
- The
PCB 90 is loaded on thePCB conveying apparatus 130 of the PCB supporting apparatus, and conveyed between the first and second fixingunits PCB 90, a distance between the first andsecond guide units edges 91 and 92) by moving, for example, in one embodiment, thesecond guide unit 121 toward or away from thefirst guide unit 111. - Front and back ends of the bottom surface of the
PCB 90 are supported by the first andsecond conveyor belts PCB conveying apparatus 130. Therefore, when the first andsecond conveyor belts PCB conveying apparatus 130 rotate, thePCB 90 is conveyed between the first and second fixingunits - The first and
second conveyor belts PCB conveying apparatus 130 are configured to be lower than the first andsecond fixing plates PCB 90 does not interfere with other parts such as the first andsecond fixing plates second conveyor belts lower support unit 140 adjusts the height of the conveyedPCB 90 to be substantially coplanar with theplates units lower support unit 140 moves in an upward direction under thePCB 90, thePCB 90 is supported by thesupport wings 142 and the support pins 143 that extend upward from the verticalmovable plate 141. Thelower support unit 140 rises until the first and second sides of thePCB 90 are substantially coplanar with the first and secondmovable plates -
FIG. 7 is a side elevation view illustrating the PCB supporting apparatus inFIG. 3 performing a printing operation in a front to back printing direction, andFIG. 8 is a plan view schematically illustrating an operation state of the PCB supporting apparatus illustrated inFIG. 7 . - When the
PCB 90 is substantially coplanar with the first and secondmovable plates PCB 90 is supported therebetween according to a printing direction. In a printing operation, solder paste is applied on a surface of thePCB 90. When solder paste is pressed on thePCB 90 by a squeegee, the printing direction of the solder paste may be from front to back of thePCB 90 or from back to front of thePCB 90. A pressure is applied to thePCB 90 in the printing direction due to the squeegee, which causes thePCB 90 to move in the printing direction. To prevent movement of thePCB 90, the moving direction of thePCB 90 is determined according to the printing direction, and the first and second fixingunits PCB 90. - When the printing direction is from the
first edge 91 of thePCB 90 to thesecond edge 92 of thePCB 90, that is, from front to back, thePCB 90 tends to move backward due to pressure from the printing apparatus. In this case, the secondmovable plate 122 supporting thesecond edge 92 of thePCB 90 and thesecond stopper 124 operate such that thePCB 90 does not move in the printing direction. - In this case, the
second actuator 123 operates to move the secondmovable plate 122 in an outward direction such that a rear surface of the secondmovable plate 122 contacts thesecond stopper 124. When the rear surface of the secondmovable plate 122 contacts thesecond stopper 124, the secondmovable plate 122 cannot move anymore in an outward direction since the second stopper limits the outward movement of the secondmovable plate 122. - When the second
movable plate 122 and thesecond actuator 123 has stopped operating, thefirst actuator 113 operates to move the firstmovable plate 112 in an inward direction, and thereby pressing or clamping thePCB 90 between theplates FIGS. 7 and 8 , thePCB 90 is supported by thesupport wings 142 and the support pins 143 of thelower support unit 140, but is not fixed. Accordingly, when the firstmovable plate 112 presses thefirst edge 91 of thePCB 90, thePCB 90 moves toward the secondmovable plate 122 and thus thesecond edge 92 contacts the secondmovable plate 122. - In this state, since the
second edge 92 of thePCB 90 contacts the secondmovable plate 122 and thePCB 90 does not move further in a backward direction. Accordingly, the PCB supporting apparatus can stably support thePCB 90 during the printing operation. -
FIG. 9 is a side elevation view illustrating the PCB supporting apparatus inFIG.3 performing a printing operation in a back to front printing direction, andFIG. 10 is a plan view schematically illustrating an operation state of the PCB supporting apparatus illustrated inFIG. 9 . - When the printing direction is from the
second edge 92 to thefirst edge 91 of thePCB 90, that is, from back to front, thePCB 90 tends to move in the printing direction (frontwardly) due to pressure applied by the printing apparatus. In this case, the firstmovable plate 112 supporting thefirst edge 91 of thePBC 90 and thefirst stopper 114 operate such that thePCB 90 does not move frontwardly. - In this case, the
PCB 90 is fixed in an opposite manner to the PCB as shown inFIGS. 7 and 8 . That is, thefirst actuator 113 operates to move the firstmovable plate 112 in an outward direction such that a rear surface of the firstmovable plate 112 contacts thefirst stopper 114. When the rear surface of the firstmovable plate 112 contacts thefirst stopper 114, the firstmovable plate 112 is fixed and thus cannot move further in an outward direction since thefirst stopper 114 limits the outward movement of the firstmovable plate 112. - When the first
movable plate 112 is fixed and thus thefirst actuator 113 has stopped operating, thesecond actuator 123 operates to move the secondmovable plate 122 in an inward direction, thereby pressing or clamping thePCB 90 against the firstmovable plate 112. As illustrated inFIGS. 9 and 10 , thePCB 90 is supported by thesupport wings 142 and the support pins 143 of thelower support unit 140, but is not fixed. Accordingly, when the secondmovable plate 122 presses thesecond edge 92, thePCB 90 moves toward the firstmovable plate 112 and thus thefirst edge 91 contacts the firstmovable plate 112. - In this state, since the
first edge 91 of thePCB 90 contacts the firstmovable plate 112 and thePCB 90 does not move anymore in a forward direction. Accordingly, the PCB supporting apparatus can stably support thePCB 90 during the printing operation. - When the
PCB 90 is supported between the first and second fixingunits vacuum nozzle 150 operates to support thePCB 90 such that a vertical orientation thereof is maintained by applying a vacuum pressure to the bottom surface of thePCB 90. - When the supporting of the
PCB 90 is established, thePCB 90 may be aligned for a printing operation. In an embodiment, thePCB 90 is aligned for the printing operation with an aligningapparatus 160 that is configured under the base 100 (refer toFIG. 3 ). The aligningapparatus 160 moves the base 100 in x-axis and y-axis directions or rotates the base 100 to adjust an angle of thebase 100, and thereby adjusting a position of thePCB 90 for the printing operation. - When the aligning of the
PCB 90 is completed, the printing operation is performed to apply solder paste in a predetermined pattern on a surface of thePCB 90. When the printing operation of thePCB 90 is completed, thePCB 90 is conveyed through thePCB conveying apparatus 130 and discharged from the printing apparatus. Next, another PCB is conveyed through thePCB conveying apparatus 130, and the above-described operations are repeated. -
FIG. 11 is a flowchart illustrating an example method of forming a PCB according to another aspect of the present invention. - The example method of forming the PCB according to an embodiment of the present invention includes: loading the PCB into a printing apparatus that includes the forgoing-described supporting apparatus with first and second fixing units (S100), determining a printing direction (S200); relative to the determining step, either first fixing of the PCB (S300) or second fixing of the PCB (S400); aligning the PCB (S500) and printing (S600).
- In operation S100, the
PCB 90 for a printing operation is loaded on a predetermined region of the printing apparatus that includes the forgoing-described supporting apparatus with first and second fixing units, in between the first and second fixing units. ThePCB 90, which is supplied to a PCB supporting apparatus, may be, for example, conveyed between thefirst fixing unit 110 and thesecond fixing unit 120 by thePCB conveying apparatus 130. Next, thePCB 90 may be moved in an upward direction by thelower support unit 140 so that the height of thePCB 90 is adjusted to generally correspond to the height of the first and secondmovable plates units - In operation S200, the direction of the printing operation of applying solder paste on a surface of the
PCB 90 is determined. The printing direction may be a first direction that proceeds from thefirst edge 91 of thePCB 90 to thesecond edge 92 of thePCB 90, or a second direction that proceeds from thesecond edge 92 of thePCB 90 to thefirst edge 91 of thePCB 90. - Since pressure is applied to the
PCB 90 in the printing direction, an appropriate fixing operation for the PCB is performed depending on the printing direction that is determined in operation S200. - When the printing direction is the second direction, the first fixing operation S300 is performed. That is, the first
movable plate 112 of thefirst fixing unit 110 is fixed to support thefirst edge 91 of thePCB 90, and thesecond fixing unit 120 presses thePCB 90 towards thefirst fixing unit 110. - When the printing direction is the first direction, the second fixing operation S400 is performed. That is, the second
movable plate 122 of thesecond fixing unit 120 is fixed to support thesecond edge 92 of thePCB 90, and thefirst fixing unit 110 presses thePCB 90 towards thesecond fixing unit 120. - When the
PCB 90 is fixed between theplates PCB 90 to have a predetermined pattern. The operation S600 may include or be proceeded by an aligning operation S500. In operation S500, a position of thePCB 90 is adjusted before applying the solder paste. The operation S600 may further include a vacuum applying operation (not shown). In the vacuum applying operation, thevacuum nozzle 150 applies a vacuum to the bottom surface of thePCB 90 to prevent thePCB 90 from moving vertically, for example, after the aligning operation S500. - As described above, according to an apparatus for supporting a PCB and the method of forming the PCB, the PCB can be better supported during a printing operation since the PCB supporting is changed depending on a printing direction.
- While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims.
Claims (20)
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KR10-2006-0100013 | 2006-10-13 | ||
KR1020060100013A KR101164593B1 (en) | 2006-10-13 | 2006-10-13 | Fixing apparatus for printed circuit board and printing method of PCB |
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US20080087178A1 true US20080087178A1 (en) | 2008-04-17 |
US7617587B2 US7617587B2 (en) | 2009-11-17 |
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US11/708,791 Active 2028-02-16 US7617587B2 (en) | 2006-10-13 | 2007-02-20 | Apparatus for supports a printer circuit board substrate |
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US (1) | US7617587B2 (en) |
KR (1) | KR101164593B1 (en) |
CN (1) | CN101163376B (en) |
Cited By (4)
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US20160118362A1 (en) * | 2014-10-23 | 2016-04-28 | Samsung Electronics Co., Ltd. | Bonding apparatus and substrate manufacturing equipment including the same |
US20170311453A1 (en) * | 2014-10-09 | 2017-10-26 | Senju Metal Industry Co., Ltd. | Soldering Device |
JP2018079613A (en) * | 2016-11-16 | 2018-05-24 | 株式会社Fuji | Screen printer |
JPWO2017168755A1 (en) * | 2016-04-01 | 2019-02-07 | 株式会社Fuji | Solder printing machine |
Families Citing this family (3)
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KR200445714Y1 (en) * | 2007-12-21 | 2009-08-27 | 주식회사 휘닉스 디지탈테크 | Apparatus for introducing printed circuit boards in a screen printer |
CN103137522B (en) * | 2011-12-01 | 2015-08-19 | 仁宝资讯工业(昆山)有限公司 | Plant ball tool |
CN105235366B (en) * | 2015-11-09 | 2017-12-22 | 惠州Tcl移动通信有限公司 | The pcb board fixing device of stencil printer |
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US6453548B1 (en) * | 1998-07-03 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
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KR0131466Y1 (en) * | 1994-03-16 | 1999-04-15 | 김광호 | Pcb's position fixing device |
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JP4037097B2 (en) * | 2001-12-10 | 2008-01-23 | 松下電器産業株式会社 | Substrate support device |
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2006
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- 2007-04-29 CN CN2007101011249A patent/CN101163376B/en active Active
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US6568069B1 (en) * | 1997-02-24 | 2003-05-27 | Siemens Aktiengesellschaft | Apparatus for manufacture of electrical assemblies |
US6453548B1 (en) * | 1998-07-03 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
US6324752B1 (en) * | 1999-11-05 | 2001-12-04 | U.S. Philips Corporation | Component placement machine |
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US20170311453A1 (en) * | 2014-10-09 | 2017-10-26 | Senju Metal Industry Co., Ltd. | Soldering Device |
US10076041B2 (en) * | 2014-10-09 | 2018-09-11 | Senju Metal Industry Co., Ltd. | Soldering device |
US20160118362A1 (en) * | 2014-10-23 | 2016-04-28 | Samsung Electronics Co., Ltd. | Bonding apparatus and substrate manufacturing equipment including the same |
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JP2018079613A (en) * | 2016-11-16 | 2018-05-24 | 株式会社Fuji | Screen printer |
Also Published As
Publication number | Publication date |
---|---|
US7617587B2 (en) | 2009-11-17 |
KR101164593B1 (en) | 2012-07-11 |
KR20080034067A (en) | 2008-04-18 |
CN101163376A (en) | 2008-04-16 |
CN101163376B (en) | 2012-07-04 |
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