US20080128969A1 - Substrate Supporting/Transferring Tray - Google Patents
Substrate Supporting/Transferring Tray Download PDFInfo
- Publication number
- US20080128969A1 US20080128969A1 US11/665,446 US66544605A US2008128969A1 US 20080128969 A1 US20080128969 A1 US 20080128969A1 US 66544605 A US66544605 A US 66544605A US 2008128969 A1 US2008128969 A1 US 2008128969A1
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- Prior art keywords
- substrate supporting
- substrate
- transferring tray
- lateral wall
- tray
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Definitions
- the present invention relates to a substrate supporting/transferring tray that is provided so that it can be placed on a substrate supporting member arranged in a treatment chamber where the heat treatment occurs for a semiconductor substrate that is placed on the upper side of the substrate supporting member. More specifically, the present invention also relates to a substrate supporting/transferring tray that can be placed on a substrate supporting member incorporating a heating means therein for heating the substrate that is placed on the upper side of the substrate supporting member.
- the heat treatment may occur for the semiconductor substrate as it is placed on the substrate supporting/transferring tray having a substrate supporting part on its upper side, in order to ensure that the semiconductor substrate can be heated uniformly during the heating process or can be transferred to any subsequent process after the heat treatment is completed.
- a semiconductor substrate 1 may be placed on a substrate supporting/transferring tray 18 having a substrate supporting portion on its upper side, and the heat treatment may occur for the substrate 1 under the vacuum condition or atmospheric condition by placing the substrate supporting/transferring tray having the substrate placed thereon onto a substrate supporting member 2 that incorporates a heating means 4 therein for heating the semiconductor substrate.
- the substrate supporting/transferring tray 18 is only intended to heat the substrate 1 uniformly.
- the transfer robot or the like because there is no area on the substrate supporting/transferring tray 18 that can be supported by the transfer robot. The problem is, therefore, that when the heating process is completed for the substrate 1 , the substrate 1 cannot be transferred until its temperature is lowered.
- the substrate supporting/transferring tray 18 a has the form of a flat plate having a substrate supporting portion on its upper side, and has its outer peripheral edge 18 d diametrically larger than the outer peripheral edge 2 a of a substrate supporting member 2 incorporating a heating means for heating the substrate. This is disclosed in Japanese patent application as published under H2002-2695.
- the transfer robot or the like can be used because the outer peripheral edge 18 d is diametrically larger than the outer peripheral edge 2 a of the substrate supporting member 2 that incorporates the heating means 4 for heating the substrate, wherein the transfer robot or the like can be operated for causing a pair of forks bifurcated at the forward end thereof to support the underside (bottom side in FIG. 7 ( b )) of the outer peripheral edge 18 c of the substrate supporting/transferring tray 18 a.
- the substrate supporting/transferring tray 18 a can be removed from the upper side of the substrate supporting member 2 of the substrate supporting/transferring tray 18 a by operating the transfer robot to cause the forward ends of its pair of forks to support the underside (bottom side in FIG. 7 ( b )) of the outer peripheral edge 18 c of the substrate supporting/transferring tray 18 a .
- This can be accomplished without having to wait for the temperature of the substrate 1 to be lowered.
- another substrate supporting/transferring tray 18 a that follows the preceding substrate supporting/transferring tray and having a new substrate 1 placed on its substrate supporting portion 2 may be transferred onto the substrate supporting member 2 within the treatment chamber where the heating process may occur for the new substrate 1 , in the same manner as described above. This permits the heating process to occur efficiently for more than one substrate in sequence.
- One object of the present invention is to provide a substrate supporting/transferring tray having a substrate (semiconductor substrate) placed on its upper side and which may be placed on a substrate supporting member, particularly a substrate supporting member incorporating a heating means therein for heating the substrate that is arranged in the treatment chamber where the heating process occurs for the substrate under the vacuum condition or atmospheric condition, wherein the substrate supporting/transferring tray allows the substrate (semiconductor substrate) to be heated more uniformly during the heating process while at the same time the substrate supporting/transferring tray can easily be removed from the substrate supporting member when the heating process is completed for the substrate, without having to wait until the temperature of the substrate is lowered, and then can be transferred from the treatment chamber into any subsequent process.
- the heating process can occur efficiently for more than one substrate in sequence.
- an embodiment of the substrate supporting/transferring tray proposed by the present invention on the upper side of which a substrate (semiconductor substrate) may be placed, may be placed on the substrate supporting member that is arranged in the treatment chamber in which the heating process occurs for the substrate, wherein the substrate supporting/transferring tray includes a disc-shaped substrate supporting portion located on its upper side, a lateral wall portion that extends downwardly from the peripheral edge of the disc-shaped substrate supporting portion and optimally an annular portion that extends radially outwardly from the bottom end side of the cylindrical lateral wall portion.
- the substrate supporting/transferring tray having a substrate (semiconductor substrate) placed on its upper side and which may be placed on a substrate supporting member, particularly a substrate supporting member incorporating a heating means therein for heating the substrate and which is arranged in the treatment chamber where the heating process occurs for the substrate under the vacuum condition or atmospheric condition, wherein the substrate supporting/transferring tray allows the substrate (semiconductor substrate) to be heated more uniformly during the heating process while at the same time the substrate supporting/transferring tray can easily be removed from the substrate supporting member when the heating process is completed for the substrate, without having to wait until the temperature of the substrate is lowered, and then can be transferred from the treatment chamber into any subsequent process and wherein the heating process can occur efficiently for more than one substrate in sequence.
- FIG. 1 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a first embodiment of the present invention although some parts are not shown;
- FIG. 2 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a second embodiment of the present invention although some parts are not shown;
- FIG. 3 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a variation of the first embodiment of the present invention shown in FIG. 1 , although some parts are not shown;
- FIG. 4 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a variation of the second embodiment of the present invention shown in FIG. 2 , although some parts are not shown;
- FIGS. 5 ( a ), ( b ) and ( c ) represent a cross-sectional view illustrating the substrate supporting/transferring tray according to a third embodiment of the present invention, although some parts are not shown;
- FIG. 6 ( a ) represents a plan view illustrating how the substrate supporting/transferring tray having a substrate placed thereon can be operated in accordance with an embodiment of the present invention
- FIG. 6 ( b ) represents a front view illustrating how the substrate supporting/transferring tray having a substrate placed thereon can be operated in accordance with an embodiment of the present invention.
- FIGS. 7 ( a ) and ( b ) represent a cross-sectional view illustrating the substrate supporting/transferring tray according to the prior art, although some parts are not shown.
- FIG. 1 a first embodiment of the present invention is described.
- a substrate supporting member 2 is arranged inside a treatment chamber 11 in which heat treatment may be performed for a substrate 1 .
- the substrate supporting member 2 has a heater or heating means 4 incorporated therein for heating the substrate, such as a thermoelectron generator intended for heating by electron impact, an infrared lamp intended for heating by infrared rays and the like. In this way, the substrate 1 may be treated thermally inside the treatment chamber 11 .
- the treatment chamber 11 in which the heat treatment occurs for the substrate 1 may be placed internally under a specific vacuum condition or under atmospheric condition.
- the substrate supporting/transferring tray 8 may be placed on the substrate supporting member 2 , and a substrate (a semiconductor substrate such as Si substrate, SiC substrate and the like, for example) may be placed on the upper side of the substrate supporting member.
- a substrate a semiconductor substrate such as Si substrate, SiC substrate and the like, for example
- the substrate supporting/transferring tray 8 includes a disc-shaped substrate supporting portion 8 e ( FIG. 3 ( a )) on its upper side, and a cylindrical lateral wall portion 9 that extends from the peripheral edge of the disc-shaped substrate supporting portion 8 e toward its bottom side.
- the cylindrical lateral wall portion 9 may be formed like a cylindrical shape that extends vertically from the peripheral edge of the disc-shaped substrate supporting portion 8 c toward the bottom side (bottom end in FIG. 1 ) along the outer periphery of the cylindrically-shaped substrate supporting member 2 .
- the cylindrical lateral wall portion 9 may be formed like a reversed funnel shape that is becoming diametrically enlarged as it extends vertically from the peripheral edge of the disc-shaped substrate supporting portion 8 e toward the bottom side (bottom side in FIG. 1 ) along the outer periphery of the cylindrically-shaped substrate supporting member 2 .
- the cylindrical lateral wall portion 9 should preferably be formed like the cylindrical shape such that it can extend from the peripheral edge of the disc-shaped substrate supporting portion 8 e along the outer periphery of the substrate supporting member 8 , as shown in FIG. 1 .
- An annular portion 10 is provided such that it extends radially outwardly from the bottom side of the cylindrical lateral wall portion 9 .
- the substrate supporting/transferring tray 8 in which the substrate 1 is placed on the disc-shaped substrate supporting portion 8 e as shown in FIG. 1 may be lifted by operating a transfer robot or the like, which includes a pair of arms 23 , 24 at its forward end and a pair of forks 21 a , 21 b bifurcated from its base end 22 linked to the pair of arms 23 , 24 . Then, the substrate supporting/transferring tray 8 may be transferred by operating the transfer robot to cause its pair of forks 21 a , 21 b to support the bottom side of the annular portion 10 .
- the substrate supporting/transferring tray 8 on which that substrate 1 is placed may be removed from the substrate supporting member 2 by operating the transfer robot to cause its pair of forks 21 a , 21 b to support the underside of the annular portion 10 of the substrate supporting/transferring tray 8 , without having to wait for the temperature of the substrate 1 to be lowered.
- Another substrate supporting/transferring tray 8 that follows the preceding substrate supporting/transferring tray 8 and having another substrate 1 placed on the disc-shaped substrate supporting portion 8 e may be transferred onto the substrate supporting member 2 in the treatment chamber 11 where the heating process may begin for the new substrate 1 . In this way, the heating process can occur efficiently for more than one substrate in sequence.
- the substrate supporting/transferring tray 8 includes the cylindrical lateral wall portion 9 extending from the peripheral edge of the disc-shaped substrate supporting portion 8 e provided on its upper side toward the bottom side.
- the temperature difference that may occur between the substrate supporting member 2 and substrate supporting/transferring tray 8 when the substrate supporting/transferring tray is heated through the substrate supporting member 2 by the heating means 4 can be kept as small as possible, as compared against the prior art substrate supporting/transferring tray 18 , 18 a having the form shown in FIG. 7 ( a ), ( b ), respectively.
- the temperature distribution inside the surface of the substrate supporting/transferring tray 8 may also be kept as small as possible, as compared against the prior art substrate supporting/transferring tray 18 , 18 a having the form shown in FIG. 7 ( a ), ( b ), respectively.
- the heating can occur more uniformly inside the surface.
- the annular portion 10 is not provided, but only the cylindrical lateral wall portion 9 is provided.
- this embodiment may also provide the effects that are equivalent to those of the embodiments described above.
- the embodiment shown in FIG. 3 represents a variation of the embodiment shown in FIG. 1 in which no annular portion 10 is provided, but only the cylindrical lateral wall portion 9 is provided.
- the embodiment shown in FIG. 4 represents a variation of the embodiment shown in FIG. 2 in which no annular portion 10 is provided, but only the cylindrical lateral wall portion 9 is provided.
- the embodiments shown in FIGS. 3 and 4 would be more advantageous if the annular portion 10 is also provided as is the case for the embodiments shown in FIGS.
- a cap 5 is mounted on the substrate supporting/transferring tray 8 .
- This cap 5 may be provided for covering the substrate 1 (such as SiC substrate) placed on the substrate supporting/transferring tray 8 , so that it can cooperate with the substrate supporting/transferring tray 8 to seal the substrate 1 during the heating process.
- the cap 5 may be provided for sealing the space 3 in which the substrate 1 is placed during the heating process. More specifically, the substrate supporting/transferring tray 8 on which the substrate 1 is placed may be covered with the cap 5 , thereby sealing the space 3 in which the substrate 1 is placed during the heating process.
- the substrate 1 can be heated more efficiently because the space 3 in which the substrate 1 is placed can be sealed by the cap 5 as described above during the heating process and because of the radiant heat originating from the cap 5 .
- FIG. 5 ( b ) differs from the embodiment shown in FIG. 5 ( a ) in that the cap 5 has a hook step 6 on the bottom side of the lateral wall 5 c that is provided for engaging the outer periphery on the upper end of the substrate supporting/transferring tray 8 , with the inner diameter R 2 of the lateral wall of the cap 5 where the hook step 6 is located being larger than the outer diameter R 3 of the cylindrical lateral wall portion 9 of the substrate supporting/transferring tray 8 by at least the plus or positive (+) tolerance.
- the substrate supporting/transferring tray 8 shown in FIG. 5 ( b ) is combined with the cap 5 that may be placed on the substrate supporting portion on which the substrate 1 is placed so that it can seal the space 3 in which the substrate 1 is placed on the substrate supporting portion, wherein the cap 5 has the hook step 6 on it bottom end side that may engage the outer periphery on the upper end of the substrate supporting portion, with the inner diameter R 2 of the lateral wall of the cap 5 where the hook step 6 is located being larger than the outer diameter R 3 of the cylindrical lateral wall portion 9 of the substrate supporting/transferring tray 8 by at least the plus or positive (+) tolerance.
- the space 3 in which the substrate 1 is placed can be sealed more securely by allowing the cap 5 and substrate supporting/transferring tray 8 to expand thermally during the heating process.
- FIG. 5 ( c ) differs from the embodiment shown in FIG. 5 ( b ) in that the cap 5 has a coating layer 5 b formed on the surface of the cap body 5 a.
- the coating layer 5 b formed on the surface of the cap body 5 a serves to prevent gases from being emitted from the cap 5 or prevent materials from scattering from the cap 5 , thereby protecting the internal surface of the heat chamber 11 from being polluted with such gases or materials.
- the coating layer 5 b may be formed from any suitable materials that can prevent gases from being emitted from the cap body 5 a , for example, pyrolytic carbons such as Pyrolytic Graphite, Pyrolytic Carbon and the like.
- the coating layer 5 b should preferably be formed to have the thickness of between 10 ⁇ m and 50 ⁇ m.
Abstract
Description
- 1. Technical Field
- The present invention relates to a substrate supporting/transferring tray that is provided so that it can be placed on a substrate supporting member arranged in a treatment chamber where the heat treatment occurs for a semiconductor substrate that is placed on the upper side of the substrate supporting member. More specifically, the present invention also relates to a substrate supporting/transferring tray that can be placed on a substrate supporting member incorporating a heating means therein for heating the substrate that is placed on the upper side of the substrate supporting member.
- 2. Background
- In the semiconductor manufacturing apparatus where the heat treatment occurs for a semiconductor substrate under the vacuum condition or atmospheric condition within the treatment chamber, the heat treatment may occur for the semiconductor substrate as it is placed on the substrate supporting/transferring tray having a substrate supporting part on its upper side, in order to ensure that the semiconductor substrate can be heated uniformly during the heating process or can be transferred to any subsequent process after the heat treatment is completed.
- As shown in
FIG. 7 (a), for example, asemiconductor substrate 1 may be placed on a substrate supporting/transferringtray 18 having a substrate supporting portion on its upper side, and the heat treatment may occur for thesubstrate 1 under the vacuum condition or atmospheric condition by placing the substrate supporting/transferring tray having the substrate placed thereon onto asubstrate supporting member 2 that incorporates a heating means 4 therein for heating the semiconductor substrate. - In the embodiment shown in
FIG. 7 (a), the substrate supporting/transferringtray 18 is only intended to heat thesubstrate 1 uniformly. Thus, when onesubstrate 1 for which the heating process is completed is removed from the treatment chamber (not shown) and anothersubstrate 1 is then transferred into the treatment chamber in which it is subjected to the heating process, it is impossible to use the transfer robot or the like because there is no area on the substrate supporting/transferringtray 18 that can be supported by the transfer robot. The problem is, therefore, that when the heating process is completed for thesubstrate 1, thesubstrate 1 cannot be transferred until its temperature is lowered. - In the embodiment shown in
FIG. 7 (b), the substrate supporting/transferringtray 18 a has the form of a flat plate having a substrate supporting portion on its upper side, and has its outerperipheral edge 18 d diametrically larger than the outerperipheral edge 2 a of asubstrate supporting member 2 incorporating a heating means for heating the substrate. This is disclosed in Japanese patent application as published under H2002-2695. - For the substrate supporting/transferring
tray 18 a shown inFIG. 7 (b), the transfer robot or the like can be used because the outerperipheral edge 18 d is diametrically larger than the outerperipheral edge 2 a of thesubstrate supporting member 2 that incorporates the heating means 4 for heating the substrate, wherein the transfer robot or the like can be operated for causing a pair of forks bifurcated at the forward end thereof to support the underside (bottom side inFIG. 7 (b)) of the outerperipheral edge 18 c of the substrate supporting/transferringtray 18 a. - When the heating process is completed for the
substrate 1, the substrate supporting/transferringtray 18 a can be removed from the upper side of thesubstrate supporting member 2 of the substrate supporting/transferringtray 18 a by operating the transfer robot to cause the forward ends of its pair of forks to support the underside (bottom side inFIG. 7 (b)) of the outerperipheral edge 18 c of the substrate supporting/transferringtray 18 a. This can be accomplished without having to wait for the temperature of thesubstrate 1 to be lowered. Then, another substrate supporting/transferringtray 18 a that follows the preceding substrate supporting/transferring tray and having anew substrate 1 placed on itssubstrate supporting portion 2 may be transferred onto thesubstrate supporting member 2 within the treatment chamber where the heating process may occur for thenew substrate 1, in the same manner as described above. This permits the heating process to occur efficiently for more than one substrate in sequence. - In the embodiment shown in
FIG. 7 (b) in which the substrate supporting/transferringtray 18 a in the form of the flat plate having its outerperipheral edge 18 d diametrically larger than the outerperipheral edge 2 a of thesubstrate supporting member 2 is placed on thesubstrate supporting member 2 incorporating the heating means 4 for heating thesubstrate 1 and the heating process occurs for thesubstrate 1 being placed on the substrate supporting/transferringtray 18 a, however, it may be appreciated that heat is radiated from the outerperipheral edge side 18 c of the substrate supporting/transferringtray 18 a projecting beyond the outerperipheral edge 2 a of thesubstrate supporting member 2. Thus, the temperature difference or non-uniform temperature distribution may occur between the center portion side and outerperipheral edge side 18 c of the substrate supporting/transferringtray 18 a, causing thesubstrate 1 to be heated non-uniformly during the heating process. - One object of the present invention is to provide a substrate supporting/transferring tray having a substrate (semiconductor substrate) placed on its upper side and which may be placed on a substrate supporting member, particularly a substrate supporting member incorporating a heating means therein for heating the substrate that is arranged in the treatment chamber where the heating process occurs for the substrate under the vacuum condition or atmospheric condition, wherein the substrate supporting/transferring tray allows the substrate (semiconductor substrate) to be heated more uniformly during the heating process while at the same time the substrate supporting/transferring tray can easily be removed from the substrate supporting member when the heating process is completed for the substrate, without having to wait until the temperature of the substrate is lowered, and then can be transferred from the treatment chamber into any subsequent process. Thus, the heating process can occur efficiently for more than one substrate in sequence.
- In order to attain the above object and solve the problems described above in connection with the prior art, an embodiment of the substrate supporting/transferring tray proposed by the present invention, on the upper side of which a substrate (semiconductor substrate) may be placed, may be placed on the substrate supporting member that is arranged in the treatment chamber in which the heating process occurs for the substrate, wherein the substrate supporting/transferring tray includes a disc-shaped substrate supporting portion located on its upper side, a lateral wall portion that extends downwardly from the peripheral edge of the disc-shaped substrate supporting portion and optimally an annular portion that extends radially outwardly from the bottom end side of the cylindrical lateral wall portion.
- Several advantages may be provided by the substrate supporting/transferring tray having a substrate (semiconductor substrate) placed on its upper side and which may be placed on a substrate supporting member, particularly a substrate supporting member incorporating a heating means therein for heating the substrate and which is arranged in the treatment chamber where the heating process occurs for the substrate under the vacuum condition or atmospheric condition, wherein the substrate supporting/transferring tray allows the substrate (semiconductor substrate) to be heated more uniformly during the heating process while at the same time the substrate supporting/transferring tray can easily be removed from the substrate supporting member when the heating process is completed for the substrate, without having to wait until the temperature of the substrate is lowered, and then can be transferred from the treatment chamber into any subsequent process and wherein the heating process can occur efficiently for more than one substrate in sequence.
-
FIG. 1 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a first embodiment of the present invention although some parts are not shown; -
FIG. 2 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a second embodiment of the present invention although some parts are not shown; -
FIG. 3 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a variation of the first embodiment of the present invention shown inFIG. 1 , although some parts are not shown; -
FIG. 4 represents a cross-sectional view illustrating the substrate supporting/transferring tray according to a variation of the second embodiment of the present invention shown inFIG. 2 , although some parts are not shown; -
FIGS. 5 (a), (b) and (c) represent a cross-sectional view illustrating the substrate supporting/transferring tray according to a third embodiment of the present invention, although some parts are not shown; -
FIG. 6 (a) represents a plan view illustrating how the substrate supporting/transferring tray having a substrate placed thereon can be operated in accordance with an embodiment of the present invention; -
FIG. 6 (b) represents a front view illustrating how the substrate supporting/transferring tray having a substrate placed thereon can be operated in accordance with an embodiment of the present invention; and -
FIGS. 7 (a) and (b) represent a cross-sectional view illustrating the substrate supporting/transferring tray according to the prior art, although some parts are not shown. - The following describes several preferred embodiments of the present invention by referring to the accompanying drawings.
- By first referring to
FIG. 1 , a first embodiment of the present invention is described. - A
substrate supporting member 2 is arranged inside atreatment chamber 11 in which heat treatment may be performed for asubstrate 1. Thesubstrate supporting member 2 has a heater or heating means 4 incorporated therein for heating the substrate, such as a thermoelectron generator intended for heating by electron impact, an infrared lamp intended for heating by infrared rays and the like. In this way, thesubstrate 1 may be treated thermally inside thetreatment chamber 11. - The
treatment chamber 11 in which the heat treatment occurs for thesubstrate 1 may be placed internally under a specific vacuum condition or under atmospheric condition. - A substrate supporting/transferring
tray 8 is now described. The substrate supporting/transferringtray 8 may be placed on thesubstrate supporting member 2, and a substrate (a semiconductor substrate such as Si substrate, SiC substrate and the like, for example) may be placed on the upper side of the substrate supporting member. - The substrate supporting/transferring
tray 8 includes a disc-shapedsubstrate supporting portion 8 e (FIG. 3 (a)) on its upper side, and a cylindricallateral wall portion 9 that extends from the peripheral edge of the disc-shapedsubstrate supporting portion 8 e toward its bottom side. - As shown in
FIG. 1 , the cylindricallateral wall portion 9 may be formed like a cylindrical shape that extends vertically from the peripheral edge of the disc-shaped substrate supporting portion 8 c toward the bottom side (bottom end inFIG. 1 ) along the outer periphery of the cylindrically-shapedsubstrate supporting member 2. As an alternative form, as shown inFIG. 2 , the cylindricallateral wall portion 9 may be formed like a reversed funnel shape that is becoming diametrically enlarged as it extends vertically from the peripheral edge of the disc-shapedsubstrate supporting portion 8 e toward the bottom side (bottom side inFIG. 1 ) along the outer periphery of the cylindrically-shapedsubstrate supporting member 2. - It should be noted, however, that in order to ensure that the temperature difference that may occur between the
substrate supporting member 2 and substrate supporting/transferringtray 8 when the substrate supporting/transferringtray 8 is heated through thesubstrate supporting member 2 by the heating means 4 or the temperature distribution inside the surface of the substrate supporting/transferringtray 8 can be kept as small as possible, thereby allowing the substrate supporting/transferringtray 8 to be heated uniformly inside its surface, the cylindricallateral wall portion 9 should preferably be formed like the cylindrical shape such that it can extend from the peripheral edge of the disc-shapedsubstrate supporting portion 8 e along the outer periphery of thesubstrate supporting member 8, as shown inFIG. 1 . - An
annular portion 10 is provided such that it extends radially outwardly from the bottom side of the cylindricallateral wall portion 9. - The substrate supporting/transferring
tray 8 in which thesubstrate 1 is placed on the disc-shapedsubstrate supporting portion 8 e as shown inFIG. 1 may be lifted by operating a transfer robot or the like, which includes a pair ofarms forks base end 22 linked to the pair ofarms tray 8 may be transferred by operating the transfer robot to cause its pair offorks annular portion 10. - When the heating process is then completed for one
substrate 1, the substrate supporting/transferringtray 8 on which thatsubstrate 1 is placed may be removed from thesubstrate supporting member 2 by operating the transfer robot to cause its pair offorks annular portion 10 of the substrate supporting/transferringtray 8, without having to wait for the temperature of thesubstrate 1 to be lowered. Another substrate supporting/transferringtray 8 that follows the preceding substrate supporting/transferringtray 8 and having anothersubstrate 1 placed on the disc-shapedsubstrate supporting portion 8 e may be transferred onto thesubstrate supporting member 2 in thetreatment chamber 11 where the heating process may begin for thenew substrate 1. In this way, the heating process can occur efficiently for more than one substrate in sequence. - It may be seen from
FIGS. 1 and 2 that the substrate supporting/transferringtray 8 includes the cylindricallateral wall portion 9 extending from the peripheral edge of the disc-shapedsubstrate supporting portion 8 e provided on its upper side toward the bottom side. Thus, the temperature difference that may occur between thesubstrate supporting member 2 and substrate supporting/transferringtray 8 when the substrate supporting/transferring tray is heated through thesubstrate supporting member 2 by the heating means 4 can be kept as small as possible, as compared against the prior art substrate supporting/transferringtray FIG. 7 (a), (b), respectively. The temperature distribution inside the surface of the substrate supporting/transferringtray 8 may also be kept as small as possible, as compared against the prior art substrate supporting/transferringtray FIG. 7 (a), (b), respectively. For the substrate supporting/transferringtray 8 of the present invention, therefore, the heating can occur more uniformly inside the surface. - In the embodiments shown in
FIGS. 3 and 4 , theannular portion 10 is not provided, but only the cylindricallateral wall portion 9 is provided. However, this embodiment may also provide the effects that are equivalent to those of the embodiments described above. Specifically, the embodiment shown inFIG. 3 represents a variation of the embodiment shown inFIG. 1 in which noannular portion 10 is provided, but only the cylindricallateral wall portion 9 is provided. Similarly, the embodiment shown inFIG. 4 represents a variation of the embodiment shown inFIG. 2 in which noannular portion 10 is provided, but only the cylindricallateral wall portion 9 is provided. The embodiments shown inFIGS. 3 and 4 would be more advantageous if theannular portion 10 is also provided as is the case for the embodiments shown inFIGS. 1 and 2 , since the temperature difference that may occur between thesubstrate supporting member 2 having the heating means 4 incorporated therein and the substrate supporting/transferringtray 8 can be reduced further and the temperature distribution inside the substrate supporting/transferringtray 8 can also be reduced further, thereby permitting the heating process to occur more uniformly inside the substrate supporting/transferringtray 8. - As shown in
FIG. 5 (a), acap 5 is mounted on the substrate supporting/transferringtray 8. Thiscap 5 may be provided for covering the substrate 1 (such as SiC substrate) placed on the substrate supporting/transferringtray 8, so that it can cooperate with the substrate supporting/transferringtray 8 to seal thesubstrate 1 during the heating process. - Specifically, the
cap 5 may be provided for sealing thespace 3 in which thesubstrate 1 is placed during the heating process. More specifically, the substrate supporting/transferringtray 8 on which thesubstrate 1 is placed may be covered with thecap 5, thereby sealing thespace 3 in which thesubstrate 1 is placed during the heating process. - In this way, the
substrate 1 can be heated more efficiently because thespace 3 in which thesubstrate 1 is placed can be sealed by thecap 5 as described above during the heating process and because of the radiant heat originating from thecap 5. - The embodiment shown in
FIG. 5 (b) differs from the embodiment shown inFIG. 5 (a) in that thecap 5 has ahook step 6 on the bottom side of thelateral wall 5 c that is provided for engaging the outer periphery on the upper end of the substrate supporting/transferringtray 8, with the inner diameter R2 of the lateral wall of thecap 5 where thehook step 6 is located being larger than the outer diameter R3 of the cylindricallateral wall portion 9 of the substrate supporting/transferringtray 8 by at least the plus or positive (+) tolerance. - Specifically, the substrate supporting/transferring
tray 8 shown inFIG. 5 (b) is combined with thecap 5 that may be placed on the substrate supporting portion on which thesubstrate 1 is placed so that it can seal thespace 3 in which thesubstrate 1 is placed on the substrate supporting portion, wherein thecap 5 has thehook step 6 on it bottom end side that may engage the outer periphery on the upper end of the substrate supporting portion, with the inner diameter R2 of the lateral wall of thecap 5 where thehook step 6 is located being larger than the outer diameter R3 of the cylindricallateral wall portion 9 of the substrate supporting/transferringtray 8 by at least the plus or positive (+) tolerance. - Thus, the
space 3 in which thesubstrate 1 is placed can be sealed more securely by allowing thecap 5 and substrate supporting/transferringtray 8 to expand thermally during the heating process. - The embodiment shown in
FIG. 5 (c) differs from the embodiment shown inFIG. 5 (b) in that thecap 5 has acoating layer 5 b formed on the surface of thecap body 5 a. - The
coating layer 5 b formed on the surface of thecap body 5 a serves to prevent gases from being emitted from thecap 5 or prevent materials from scattering from thecap 5, thereby protecting the internal surface of theheat chamber 11 from being polluted with such gases or materials. - The
coating layer 5 b may be formed from any suitable materials that can prevent gases from being emitted from thecap body 5 a, for example, pyrolytic carbons such as Pyrolytic Graphite, Pyrolytic Carbon and the like. Thecoating layer 5 b should preferably be formed to have the thickness of between 10 μm and 50 μm. - Although the present invention has been described with reference to several preferred embodiments thereof by referring to the accompanying drawings, it should be understood that the present invention is not restricted to those embodiments, which may be modified in numerous ways without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (14)
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Also Published As
Publication number | Publication date |
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JP4453984B2 (en) | 2010-04-21 |
US7780440B2 (en) | 2010-08-24 |
US8147242B2 (en) | 2012-04-03 |
KR20070056154A (en) | 2007-05-31 |
EP1811559A4 (en) | 2010-04-21 |
WO2006043531A1 (en) | 2006-04-27 |
US20100084392A1 (en) | 2010-04-08 |
JPWO2006043531A1 (en) | 2008-05-22 |
EP1811559A1 (en) | 2007-07-25 |
CN101061578A (en) | 2007-10-24 |
CN101645394A (en) | 2010-02-10 |
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