US20080172862A1 - Head Design With Low Coefficient of Thermal Expansion Insert Layer - Google Patents
Head Design With Low Coefficient of Thermal Expansion Insert Layer Download PDFInfo
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- US20080172862A1 US20080172862A1 US12/058,584 US5858408A US2008172862A1 US 20080172862 A1 US20080172862 A1 US 20080172862A1 US 5858408 A US5858408 A US 5858408A US 2008172862 A1 US2008172862 A1 US 2008172862A1
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- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 24
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052681 coesite Inorganic materials 0.000 claims 1
- 229910052906 cristobalite Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052682 stishovite Inorganic materials 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052905 tridymite Inorganic materials 0.000 claims 1
- 229910001374 Invar Inorganic materials 0.000 abstract description 20
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 81
- 239000000463 material Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
- G11B5/3136—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49041—Fabricating head structure or component thereof including measuring or testing with significant slider/housing shaping or treating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
- Y10T29/49044—Plural magnetic deposition layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
- Y10T29/49046—Depositing magnetic layer or coating with etching or machining of magnetic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
- Y10T29/49052—Machining magnetic material [e.g., grinding, etching, polishing] by etching
Definitions
- the present invention relates to magnetic read/write heads, and in particular to magnetic read/write heads with reduced thermal pole-tip protrusion.
- Magnetic read/write heads such as those used in hard disk drives, include a magnetic transducer with a write element and a read element disposed on a substrate.
- the write element is an inductive transducer, which includes electrically conductive coil windings that are encircled by a magnetic core.
- the magnetic core includes a first and second pole tips with a non-magnetic gap disposed between the tips. When electrical current flows through the coil a magnetic field is induced across the non-magnetic gap at the pole tips to write on the magnetic media, i.e., the hard disk, which is near the pole tips.
- the read element is typically formed between the write element and the substrate and typically includes first and second shield layers with a magnetoresistive (MR) sensor formed therebetween.
- MR magnetoresistive
- Magnetic flux from the surface of the magnetic media causes the rotation of a magnetization vector in the MR sensor, which causes a change in resistivity.
- the presence of magnetic flux at the surface of the magnetic media may be detected by measuring the change in resistivity of the MR sensor.
- the read/write elements are located at the trailing end of the substrate along the air bearing surface.
- the head flies above the spinning magnetic disk so that the read/write elements are positioned in close proximity to the magnetic recording media.
- the read/write elements are close enough to the magnetic media to produce a large data density, however, the distance should be great enough that contact between the read/write elements and the magnetic media does not occur.
- the read/write elements are fabricated from materials different from that of the substrate, the read/write elements and the substrate typically have differing coefficients of thermal expansion (CTE).
- CTE coefficients of thermal expansion
- the read/write elements include metallic layers causing the read/write elements to have a greater CTE than the substrate.
- the read/write head is subjected to increased temperatures.
- the increased temperatures and the greater CTE of the read/write elements causes the read/write elements to protrude closer to the magnetic media than the substrate, which is known as thermal pole tip protrusion (T-PTR).
- T-PTR requires an increase in the fly height of the read/write head in order to avoid contact between the read/write elements and the magnetic media during high operating temperatures.
- a magnetic read/write head in accordance with an embodiment of the present invention, is produced with an insert layer that has a lower CTE than the substrate and that is positioned between the substrate and the magnetic transducer. With the magnetic transducer deposited over the low CTE insert layer, the expansion of the magnetic transducer is restricted during operation thereby decreasing the T-PTR of the head.
- the insert layer is produced by plating and annealing, e.g., an Invar NiFe layer over the substrate prior to fabricating the magnetic transducer.
- a magnetic read/write head in one aspect of the present invention, includes a substrate and a magnetic transducer that is coupled to the substrate.
- the magnetic transducer has a coefficient of thermal expansion that is greater than the coefficient of thermal expansion of the substrate.
- the head also includes a conductive layer that is coupled between the substrate and the magnetic transducer.
- the conductive layer has a coefficient of thermal expansion that is less than the coefficient of thermal expansion of the substrate.
- the head includes a non-magnetic layer that is coupled between the conductive layer and the magnetic transducer.
- a method of forming a magnetic read/write head includes providing a substrate and plating a NiFe layer over the substrate.
- the NiFe layer is annealed and a non-magnetic layer is deposited over the NiFe layer.
- a magnetic transducer is then formed over the non-magnetic layer.
- a method of forming a magnetic read/write head includes providing a substrate, plating a conductive layer over the substrate, and annealing the conductive layer, wherein the annealed conductive layer has a coefficient of thermal expansion that is less than the coefficient of thermal expansion of the substrate.
- the method further includes depositing a non-magnetic layer over the conductive layer and fabricating a magnetic transducer over the non-magnetic layer, wherein the magnetic transducer has a coefficient of thermal expansion that is greater than the coefficient of thermal expansion of the substrate.
- FIG. 1 is a cross-sectional view, perpendicular to the air bearing surface, of a portion of a magnetic read/write head, in accordance with an embodiment of the present invention.
- FIGS. 2A and 2B illustrate the effect of T-PTR on a magnet head, in accordance with an embodiment of the present invention, where FIG. 2A illustrates the head prior to heating and FIG. 2B illustrates the head after heating.
- FIGS. 3A and 3B illustrate the effect of T-PTR on a conventional head, where FIG. 3A illustrates the head prior to heating and FIG. 3B illustrates the head after heating.
- FIG. 4 illustrates a graph modeling the T-PTR for two conventional heads and a head, in accordance with an embodiment of the present invention.
- FIG. 5 is a flow chart of the process of fabricating a magnetic read/write head in accordance with an embodiment of the present invention.
- FIGS. 6A-6E schematically illustrates the fabrication process for a magnetic read/write head in accordance with an embodiment of the present invention.
- FIG. 1 is a cross-sectional view, perpendicular to the air bearing surface (ABS), of a portion of a magnetic read/write head 100 in accordance with an embodiment of the present invention.
- the magnetic head 100 includes an insert layer 110 that has a lower coefficient of thermal expansion (CTE) than that of the substrate, which advantageously reduces temperature induced pole tip recession during operation of the head.
- CTE coefficient of thermal expansion
- the head 100 includes a slider substrate 102 , which is manufactured from materials, such as AlTiC, TiC, Si, SiC Al 2 O 3 or other similar materials or composites formed from combinations of these materials.
- An undercoat layer 104 e.g., of alumina, is deposited over the substrate 102 . Over the undercoat layer 104 is deposited the insert layer 110 .
- the insert layer 110 is an alloy of nickel (Ni) and iron (Fe), which is sometimes referred to Invar, which advantageously has a low CTE.
- a non-magnetic spacer 112 is deposited over the insert layer 110 . The non-magnetic spacer 112 is used to break the magnetic coupling of the insert layer 110 from the magnetic transducer 120 .
- a magnetic transducer 120 is fabricated over the non-magnetic spacer 112 in any desired fashion. Magnetic transducers and their fabrication are well known, and accordingly, magnetic transducer 120 is shown merely for illustrative purposes. The present invention is not limited to any particular type of magnetic transducer. Thus, any desired magnetic transducer may be fabricated over the non-magnetic spacer layer 112 .
- the magnetic transducer 120 may include, e.g., a read portion 130 with a first shield layer 132 , an insulator layer 134 in which is disposed a sensor element (not shown) and a second shield layer 136 .
- the write portion 140 of the magnetic transducer 120 may include a first pole piece 142 and a second pole piece 144 that are separated at the ABS by a write gap layer 150 and a third pole piece 146 .
- the third pole piece 146 connects the first pole piece 142 and the second pole piece 144 at the back gap (BG).
- the third pole piece 146 is formed on either side at the write gap layer 150 at the ABS.
- the write portion 140 also includes two coil layers 152 and 154 , which surround the write gap layer 150 and which are covered with resist 153 and 155 . It should be understood that the write coil may be in a single layer if desired.
- the magnetic read/write head 100 has a reduced amount of T-PTR, relative to conventional heads, because the insert layer 110 has a lower CTE than the substrate 102 and the insert layer 110 is disposed between the substrate 102 and the magnetic transducer 120 .
- the insert layer 110 will expand less than the substrate 102 . Because the magnetic transducer 120 is formed on the insert layer 110 , as opposed to the substrate 102 , the insert layer 110 will restrict the expansion of the magnetic transducer 120 .
- FIGS. 2A and 2B illustrate the effect of T-PTR on a magnet head 100 , where an insert layer 110 is disposed between the substrate 102 and the magnetic transducer 120 .
- FIG. 2A illustrates the head 100 prior to heating and FIG. 2B illustrates the head 100 after heating, with the expansion of the substrate 102 and the magnetic transducer 120 greatly exaggerated.
- the insert layer 110 which expands less than the substrate 102 , resists the expansion of the magnetic transducer 120 .
- the insert layer 110 limits the expansion of the magnetic transducer 120 to an amount that is closer to the expansion of the substrate 102 . Accordingly, the magnetic transducer 120 has little protrusion, illustrated as T-PTR 100 , beyond the substrate 102 , resulting in a reduced amount of T-PTR relative to conventional heads.
- FIGS. 3A and 3B illustrate the effect of T-PTR on a conventional head 200 , where a magnetic transducer 204 is coupled to the substrate 202 without an intervening Invar insert layer.
- FIG. 3A illustrates the head 200 prior to heating
- FIG. 3B illustrates the head 200 after heating with the expansion of the substrate 202 and the magnetic transducer 204 greatly exaggerated.
- the magnetic transducer 204 expands more than the substrate 202 when heated, but the expansion of the magnetic transducer 204 is limited by the substrate 202 . Accordingly, the magnetic transducer 204 protrudes closer to the underlying magnetic media (not shown) than the substrate 202 , resulting in a large amount of T-PTR.
- FIG. 4 illustrates a graph illustrating the modeling results of the T-PTR (in nm at 30° C.) as a function of distance from the undercoat, i.e., layer 104 in FIG. 1 , for two conventional heads and a head with an Invar insert, in accordance with the present invention.
- the head with the Invar insert has a substantial reduction in the T-PTR compared to conventional heads.
- the maximum T-PTR for a head in accordance with the present invention is 0.55 nm compared to 1.1 nm for the head labeled Conv2.
- FIG. 5 is a flow chart of the process of fabricating a magnetic read/write head in accordance with an embodiment of the present invention.
- FIGS. 6A-6E schematically illustrates the fabrication process. It should be understood that FIG. 5 and FIGS. 6A-6E , describe the fabrication of a single head for the sake of simplicity and that the fabrication is performed at the wafer level, where multiple heads are fabricated simultaneously and then separated.
- a substrate with an undercoating is provided (block 302 ).
- the substrate may be, e.g., a manufactured from AlTiC, TiC, Si, SiC Al 2 O 3 or other similar materials or composites formed from combinations of these materials.
- a AlTiC substrate with a CTE of approximately 6 ⁇ 10 ⁇ 6 /° C. may be used.
- the undercoating may be, e.g., 0.7 ⁇ m to 1.0 ⁇ m of alumina.
- a seed layer is then deposited over the undercoating (block 304 ).
- the seed layer may be, e.g., 32/68 or 45/55 of nickel and iron, and may be, e.g., sputter deposited to a thickness of, e.g., 300-2000 ⁇ .
- Other seed layers, including non-magnetic but conductive seed layers, may be used if desired, such as V or NiCr.
- the Invar insert layer is then frame plated over the seed layer (block 306 ).
- the Invar insert layer is produced with 34 to 38 percent Ni and 62 to 66 percent Fe to a thickness of between approximately 1.0 ⁇ m to 5.0 ⁇ m.
- Invar insert layer is Ni 36 Fe 64 and is approximately 4.0 ⁇ m.
- the insert may be produced with plated CoNiFe, where Co is 0.1 to 5.0 percent, Ni is 35 to 36 percent, and Fe is 62 to 64 percent.
- FIG. 6A shows an illustrative cross section of the frame plated Invar insert layer 410 deposited over the seed layer 406 , undercoating 404 and the substrate 402 .
- the plating mask for the Invar insert layer may have approximately the same size and/or shape, or larger, as the first shield in the magnetic transducer. If desired, alignment marks may be produced with the frame plating at this step to be used in later fabrication of the magnetic transducer.
- the plating field and the seed layer underlying the plating field are then removed by, e.g., wet etching, (block 308 ), resulting in the structure shown in FIG. 6B .
- the Invar insert layer and gaps are covered with an overcoat layer (block 310 ).
- the overcoat layer may be the same material as used for the undercoating, i.e. alumina.
- FIG. 6C illustrates the resulting structure with the overcoat layer 412 deposited over the Invar insert layer 410 .
- the overcoat layer 412 should be deposited to a thickness that is greater than the Invar insert layer 410 , e.g., 4.0 ⁇ m to 5.0 ⁇ m, so that the structure may be planarized later.
- the structure is annealed at a temperature greater than 450° C., e.g., between approximately 450° C. and 800° C., e.g., at 490° C., for between approximately 1 and 10 hours, e.g., for 2 hours, with a slow temperature ramp (block 312 ).
- the annealing of the Invar insert layer 410 advantageously produces a phase transition in the material that reduces the CTE to, e.g., 4.5 ⁇ 10 ⁇ 6 /° C.
- the structure is then planarized, e.g., by chemical mechanical polishing, to the desired final thickness of the Invar insert layer, e.g., 4 ⁇ m (block 314 ).
- FIG. 6D illustrates the structure after planarizing.
- a non-magnetic spacer layer is deposited over the Invar insert layer (block 316 ).
- the non-magnetic spacer layer may be, e.g., a layer of Ta, that is sputter deposited to a thickness of approximately 0.1 ⁇ m to 1.0 ⁇ m, e.g., 0.25 ⁇ m.
- other non-magnetic low expansion materials such as AlO 2
- FIG. 6E illustrates the structure with the non-magnetic spacer layer 414 over the Invar insert layer 410 and the remaining overcoating layer 412 .
- the deposition of the non-magnetic spacer layer may be followed with any desired conventional magnetic transducer fabrication process (block 318 ).
Abstract
Description
- This application is a divisional of U.S. patent application Ser. No. 11/095,830, filed Mar. 30, 2005, entitled “Head Design with Low Coefficient of Thermal Expansion Insert Layer,” which is incorporated herein by reference in its entirety.
- The present invention relates to magnetic read/write heads, and in particular to magnetic read/write heads with reduced thermal pole-tip protrusion.
- Magnetic read/write heads, such as those used in hard disk drives, include a magnetic transducer with a write element and a read element disposed on a substrate. The write element is an inductive transducer, which includes electrically conductive coil windings that are encircled by a magnetic core. The magnetic core includes a first and second pole tips with a non-magnetic gap disposed between the tips. When electrical current flows through the coil a magnetic field is induced across the non-magnetic gap at the pole tips to write on the magnetic media, i.e., the hard disk, which is near the pole tips.
- The read element is typically formed between the write element and the substrate and typically includes first and second shield layers with a magnetoresistive (MR) sensor formed therebetween. Magnetic flux from the surface of the magnetic media causes the rotation of a magnetization vector in the MR sensor, which causes a change in resistivity. Thus, the presence of magnetic flux at the surface of the magnetic media may be detected by measuring the change in resistivity of the MR sensor.
- The read/write elements are located at the trailing end of the substrate along the air bearing surface. In operation, the head flies above the spinning magnetic disk so that the read/write elements are positioned in close proximity to the magnetic recording media. Ideally, the read/write elements are close enough to the magnetic media to produce a large data density, however, the distance should be great enough that contact between the read/write elements and the magnetic media does not occur.
- Because the read/write elements are fabricated from materials different from that of the substrate, the read/write elements and the substrate typically have differing coefficients of thermal expansion (CTE). Generally, the read/write elements include metallic layers causing the read/write elements to have a greater CTE than the substrate. During operation, as the read/write head flies above the spinning magnetic media, the read/write head is subjected to increased temperatures. The increased temperatures and the greater CTE of the read/write elements causes the read/write elements to protrude closer to the magnetic media than the substrate, which is known as thermal pole tip protrusion (T-PTR). Thus, T-PTR requires an increase in the fly height of the read/write head in order to avoid contact between the read/write elements and the magnetic media during high operating temperatures.
- Accordingly, it is desirable to reduce the amount of T-PTR in a read/write head so as to reduce variation in the distance between the read/write elements and the magnetic media during operation, which permits a decrease in the required fly height of the head.
- A magnetic read/write head, in accordance with an embodiment of the present invention, is produced with an insert layer that has a lower CTE than the substrate and that is positioned between the substrate and the magnetic transducer. With the magnetic transducer deposited over the low CTE insert layer, the expansion of the magnetic transducer is restricted during operation thereby decreasing the T-PTR of the head. The insert layer is produced by plating and annealing, e.g., an Invar NiFe layer over the substrate prior to fabricating the magnetic transducer.
- In one aspect of the present invention, a magnetic read/write head includes a substrate and a magnetic transducer that is coupled to the substrate. The magnetic transducer has a coefficient of thermal expansion that is greater than the coefficient of thermal expansion of the substrate. The head also includes a conductive layer that is coupled between the substrate and the magnetic transducer. The conductive layer has a coefficient of thermal expansion that is less than the coefficient of thermal expansion of the substrate. In addition, the head includes a non-magnetic layer that is coupled between the conductive layer and the magnetic transducer.
- In another aspect of the present invention, a method of forming a magnetic read/write head includes providing a substrate and plating a NiFe layer over the substrate. The NiFe layer is annealed and a non-magnetic layer is deposited over the NiFe layer. A magnetic transducer is then formed over the non-magnetic layer.
- In yet another aspect of the present invention, a method of forming a magnetic read/write head includes providing a substrate, plating a conductive layer over the substrate, and annealing the conductive layer, wherein the annealed conductive layer has a coefficient of thermal expansion that is less than the coefficient of thermal expansion of the substrate. The method further includes depositing a non-magnetic layer over the conductive layer and fabricating a magnetic transducer over the non-magnetic layer, wherein the magnetic transducer has a coefficient of thermal expansion that is greater than the coefficient of thermal expansion of the substrate.
-
FIG. 1 is a cross-sectional view, perpendicular to the air bearing surface, of a portion of a magnetic read/write head, in accordance with an embodiment of the present invention. -
FIGS. 2A and 2B illustrate the effect of T-PTR on a magnet head, in accordance with an embodiment of the present invention, whereFIG. 2A illustrates the head prior to heating andFIG. 2B illustrates the head after heating. -
FIGS. 3A and 3B illustrate the effect of T-PTR on a conventional head, whereFIG. 3A illustrates the head prior to heating andFIG. 3B illustrates the head after heating. -
FIG. 4 illustrates a graph modeling the T-PTR for two conventional heads and a head, in accordance with an embodiment of the present invention. -
FIG. 5 is a flow chart of the process of fabricating a magnetic read/write head in accordance with an embodiment of the present invention. -
FIGS. 6A-6E schematically illustrates the fabrication process for a magnetic read/write head in accordance with an embodiment of the present invention. -
FIG. 1 is a cross-sectional view, perpendicular to the air bearing surface (ABS), of a portion of a magnetic read/writehead 100 in accordance with an embodiment of the present invention. Themagnetic head 100 includes aninsert layer 110 that has a lower coefficient of thermal expansion (CTE) than that of the substrate, which advantageously reduces temperature induced pole tip recession during operation of the head. - As illustrated in
FIG. 1 , thehead 100 includes aslider substrate 102, which is manufactured from materials, such as AlTiC, TiC, Si, SiC Al2O3 or other similar materials or composites formed from combinations of these materials. Anundercoat layer 104, e.g., of alumina, is deposited over thesubstrate 102. Over theundercoat layer 104 is deposited theinsert layer 110. Theinsert layer 110 is an alloy of nickel (Ni) and iron (Fe), which is sometimes referred to Invar, which advantageously has a low CTE. Anon-magnetic spacer 112 is deposited over theinsert layer 110. Thenon-magnetic spacer 112 is used to break the magnetic coupling of theinsert layer 110 from themagnetic transducer 120. - A
magnetic transducer 120 is fabricated over thenon-magnetic spacer 112 in any desired fashion. Magnetic transducers and their fabrication are well known, and accordingly,magnetic transducer 120 is shown merely for illustrative purposes. The present invention is not limited to any particular type of magnetic transducer. Thus, any desired magnetic transducer may be fabricated over thenon-magnetic spacer layer 112. - As illustrated in
FIG. 1 , themagnetic transducer 120 may include, e.g., aread portion 130 with afirst shield layer 132, aninsulator layer 134 in which is disposed a sensor element (not shown) and asecond shield layer 136. - The
write portion 140 of themagnetic transducer 120 may include afirst pole piece 142 and asecond pole piece 144 that are separated at the ABS by awrite gap layer 150 and athird pole piece 146. Thethird pole piece 146 connects thefirst pole piece 142 and thesecond pole piece 144 at the back gap (BG). Thethird pole piece 146 is formed on either side at thewrite gap layer 150 at the ABS. Thewrite portion 140 also includes twocoil layers write gap layer 150 and which are covered with resist 153 and 155. It should be understood that the write coil may be in a single layer if desired. - The magnetic read/
write head 100 has a reduced amount of T-PTR, relative to conventional heads, because theinsert layer 110 has a lower CTE than thesubstrate 102 and theinsert layer 110 is disposed between thesubstrate 102 and themagnetic transducer 120. During operation, theinsert layer 110 will expand less than thesubstrate 102. Because themagnetic transducer 120 is formed on theinsert layer 110, as opposed to thesubstrate 102, theinsert layer 110 will restrict the expansion of themagnetic transducer 120. -
FIGS. 2A and 2B illustrate the effect of T-PTR on amagnet head 100, where aninsert layer 110 is disposed between thesubstrate 102 and themagnetic transducer 120. -
FIG. 2A illustrates thehead 100 prior to heating andFIG. 2B illustrates thehead 100 after heating, with the expansion of thesubstrate 102 and themagnetic transducer 120 greatly exaggerated. As can be seen inFIG. 2B , theinsert layer 110, which expands less than thesubstrate 102, resists the expansion of themagnetic transducer 120. Theinsert layer 110 limits the expansion of themagnetic transducer 120 to an amount that is closer to the expansion of thesubstrate 102. Accordingly, themagnetic transducer 120 has little protrusion, illustrated as T-PTR100, beyond thesubstrate 102, resulting in a reduced amount of T-PTR relative to conventional heads. -
FIGS. 3A and 3B illustrate the effect of T-PTR on aconventional head 200, where amagnetic transducer 204 is coupled to thesubstrate 202 without an intervening Invar insert layer.FIG. 3A illustrates thehead 200 prior to heating andFIG. 3B illustrates thehead 200 after heating with the expansion of thesubstrate 202 and themagnetic transducer 204 greatly exaggerated. As can be seen inFIG. 3B , in theconventional head 200, themagnetic transducer 204 expands more than thesubstrate 202 when heated, but the expansion of themagnetic transducer 204 is limited by thesubstrate 202. Accordingly, themagnetic transducer 204 protrudes closer to the underlying magnetic media (not shown) than thesubstrate 202, resulting in a large amount of T-PTR. -
FIG. 4 illustrates a graph illustrating the modeling results of the T-PTR (in nm at 30° C.) as a function of distance from the undercoat, i.e.,layer 104 inFIG. 1 , for two conventional heads and a head with an Invar insert, in accordance with the present invention. As can be seen, the head with the Invar insert has a substantial reduction in the T-PTR compared to conventional heads. In fact, the maximum T-PTR for a head in accordance with the present invention is 0.55 nm compared to 1.1 nm for the head labeled Conv2. -
FIG. 5 is a flow chart of the process of fabricating a magnetic read/write head in accordance with an embodiment of the present invention.FIGS. 6A-6E schematically illustrates the fabrication process. It should be understood thatFIG. 5 andFIGS. 6A-6E , describe the fabrication of a single head for the sake of simplicity and that the fabrication is performed at the wafer level, where multiple heads are fabricated simultaneously and then separated. - As described in
FIG. 5 , first a substrate with an undercoating is provided (block 302). The substrate may be, e.g., a manufactured from AlTiC, TiC, Si, SiC Al2O3 or other similar materials or composites formed from combinations of these materials. By way of example, a AlTiC substrate with a CTE of approximately 6×10−6/° C. may be used. The undercoating may be, e.g., 0.7 μm to 1.0 μm of alumina. A seed layer is then deposited over the undercoating (block 304). The seed layer may be, e.g., 32/68 or 45/55 of nickel and iron, and may be, e.g., sputter deposited to a thickness of, e.g., 300-2000 Å. Other seed layers, including non-magnetic but conductive seed layers, may be used if desired, such as V or NiCr. - The Invar insert layer is then frame plated over the seed layer (block 306). The Invar insert layer is produced with 34 to 38 percent Ni and 62 to 66 percent Fe to a thickness of between approximately 1.0 μm to 5.0 μm. In one embodiment, Invar insert layer is Ni36Fe64 and is approximately 4.0 μm. In another embodiment, the insert may be produced with plated CoNiFe, where Co is 0.1 to 5.0 percent, Ni is 35 to 36 percent, and Fe is 62 to 64 percent.
FIG. 6A shows an illustrative cross section of the frame platedInvar insert layer 410 deposited over theseed layer 406, undercoating 404 and thesubstrate 402. The plating mask for the Invar insert layer may have approximately the same size and/or shape, or larger, as the first shield in the magnetic transducer. If desired, alignment marks may be produced with the frame plating at this step to be used in later fabrication of the magnetic transducer. - The plating field and the seed layer underlying the plating field are then removed by, e.g., wet etching, (block 308), resulting in the structure shown in
FIG. 6B . After the plating field and seed layer removal, the Invar insert layer and gaps are covered with an overcoat layer (block 310). The overcoat layer may be the same material as used for the undercoating, i.e. alumina.FIG. 6C illustrates the resulting structure with theovercoat layer 412 deposited over theInvar insert layer 410. Theovercoat layer 412 should be deposited to a thickness that is greater than theInvar insert layer 410, e.g., 4.0 μm to 5.0 μm, so that the structure may be planarized later. - With the
Invar insert layer 410 covered with theovercoat layer 412, the structure is annealed at a temperature greater than 450° C., e.g., between approximately 450° C. and 800° C., e.g., at 490° C., for between approximately 1 and 10 hours, e.g., for 2 hours, with a slow temperature ramp (block 312). The annealing of theInvar insert layer 410 advantageously produces a phase transition in the material that reduces the CTE to, e.g., 4.5×10−6/° C. - The structure is then planarized, e.g., by chemical mechanical polishing, to the desired final thickness of the Invar insert layer, e.g., 4 μm (block 314).
FIG. 6D illustrates the structure after planarizing. - A non-magnetic spacer layer is deposited over the Invar insert layer (block 316). The non-magnetic spacer layer may be, e.g., a layer of Ta, that is sputter deposited to a thickness of approximately 0.1 μm to 1.0 μm, e.g., 0.25 μm. If desired, other non-magnetic low expansion materials, such as AlO2, may be used, however, the use of Ta is desirable as it provides good heat dissipation.
FIG. 6E illustrates the structure with thenon-magnetic spacer layer 414 over theInvar insert layer 410 and the remainingovercoating layer 412. The deposition of the non-magnetic spacer layer may be followed with any desired conventional magnetic transducer fabrication process (block 318). - Although the present invention is illustrated in connection with specific embodiments for instructional purposes, the present invention is not limited thereto. Various adaptations and modifications may be made without departing from the scope of the invention. For example, additional layers, such as adhesion layers, may be used with the present invention. Moreover, the present invention is not limited to any particular magnetic transducer. Therefore, the spirit and scope of the appended claims should not be limited to the foregoing description.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/058,584 US7770285B2 (en) | 2005-03-30 | 2008-03-28 | Method of forming a magnetic read/write head |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/095,830 US20060221498A1 (en) | 2005-03-30 | 2005-03-30 | Head design with low coefficient of thermal expansion insert layer |
US12/058,584 US7770285B2 (en) | 2005-03-30 | 2008-03-28 | Method of forming a magnetic read/write head |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/095,830 Division US20060221498A1 (en) | 2005-03-30 | 2005-03-30 | Head design with low coefficient of thermal expansion insert layer |
Publications (2)
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US20080172862A1 true US20080172862A1 (en) | 2008-07-24 |
US7770285B2 US7770285B2 (en) | 2010-08-10 |
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US11/095,830 Abandoned US20060221498A1 (en) | 2005-03-30 | 2005-03-30 | Head design with low coefficient of thermal expansion insert layer |
US12/058,584 Expired - Fee Related US7770285B2 (en) | 2005-03-30 | 2008-03-28 | Method of forming a magnetic read/write head |
Family Applications Before (1)
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US11/095,830 Abandoned US20060221498A1 (en) | 2005-03-30 | 2005-03-30 | Head design with low coefficient of thermal expansion insert layer |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009099219A (en) * | 2007-10-17 | 2009-05-07 | Fujitsu Ltd | Magnetic head |
US20090268335A1 (en) * | 2008-04-25 | 2009-10-29 | Fu-Ying Huang | Neutralizing flying height sensitivity of thermal pole-tip protrusion of magnetic slider |
US8565049B1 (en) | 2012-06-26 | 2013-10-22 | Western Digital (Fremont), Llc | Method and system for reducing thermal protrusion of an NFT |
US9099116B2 (en) | 2013-08-28 | 2015-08-04 | HGST Netherlands, B.V. | Stiff discrete insert array for thermal PTR management with desired induced stress state that reduces tendency for write pole erasure |
US8971160B1 (en) | 2013-12-19 | 2015-03-03 | Western Digital (Fremont), Llc | Near field transducer with high refractive index pin for heat assisted magnetic recording |
US9153265B1 (en) * | 2014-08-22 | 2015-10-06 | Seagate Technology Llc | Head slider with adjusted thermal profile |
US9208811B1 (en) | 2014-12-09 | 2015-12-08 | Seagate Technology Llc | Apparatus and method for measuring pole tip protrusion ratio for a slider |
US9558766B1 (en) * | 2015-09-25 | 2017-01-31 | Seagate Technology Llc | Controlling spacing between a read transducer and a recording medium using a write coil |
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US20060221498A1 (en) | 2006-10-05 |
US7770285B2 (en) | 2010-08-10 |
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