US20080204061A1 - Spring loaded probe pin assembly - Google Patents
Spring loaded probe pin assembly Download PDFInfo
- Publication number
- US20080204061A1 US20080204061A1 US11/712,797 US71279707A US2008204061A1 US 20080204061 A1 US20080204061 A1 US 20080204061A1 US 71279707 A US71279707 A US 71279707A US 2008204061 A1 US2008204061 A1 US 2008204061A1
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- US
- United States
- Prior art keywords
- probe pin
- aperture
- probe
- substrate
- socket enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- the present invention relates to an approach for creating a spring-loaded probe pin assembly.
- each probe of the probe card is electroformed (e.g., as part of a group of probes), singulated, and then mechanically bonded (e.g., one at a time) onto the probe card.
- This process is time and resource intensive. Further, often it is necessary to perform additional work to realign any misaligned probes on the probe card before the probe card may be satisfactorily used in testing. Such rework may interfere with the bonds holding the probes to the probe card.
- FIG. 1 is a side, sectional view of an assembly according to an embodiment of the invention
- FIG. 2 is an overhead plan view of FIG. 1 according to an embodiment of the invention
- FIG. 3 is an enlarged view of the circled area of FIG. 2 according to an embodiment of the invention.
- FIG. 4 is an enlarged side, sectional view of line A-A of FIG. 3 according to an embodiment of the invention.
- FIG. 5 is a further enlarged view of FIG. 4 further illustrating initial contact of a tip portion of a probe pin with a wafer according to an embodiment of the invention
- FIG. 6 is the structure of FIG. 5 in contact with the wafer at overdrive according to an embodiment of the invention.
- FIG. 7 is a flowchart illustrating a process of assembling a probe card assembly in accordance with an embodiment of the invention.
- a socket with precisely formed apertures 400 is adapted to retain respective probe pin 102 /compressible member 402 assemblies in precise alignment at desired lean angle(s) 120 .
- the guidance provided to the probe pin 102 /compressible member 402 assemblies by respective apertures 400 substantially reduces or eliminates the alignment problems associated with the convention probe cards regarding reworking.
- Assembly of exemplary probe card assembly 500 is also simplified as, in essence, probe pins 102 and compressible members 402 may just be dropped into respective apertures 400 of socket enclosure 100 and then space transformer/structure/substrate 110 may be attached to socket enclosure 100 to retain them therein.
- the space transformer/structure/substrate 110 is removably attached to socket enclosure 100 so that individual probe pins 102 and/or compressible members 402 may be replaced as needed to permit repair of the probe card assembly 500 while keeping the same multi-layer ceramic (MLC) structure.
- compressible member 402 may be a resiliently compressible member (such as a spring or the like) that compresses in response to a force asserted against a probe pin in contact the resiliently compressible member.
- FIG. 1 is a side, sectional view of an assembly in accordance with an embodiment of the invention.
- socket enclosure 100 may have a plurality of conductors 114 slidingly within respective apertures 400 (as shown in FIG. 4 ) and may be affixed to structure 110 mechanically and/or by using attachment compound 112 (as depicted in FIG. 1 ).
- Non-limiting, illustrative approaches for mechanically affixing conductors 114 to structure 110 include the use of pins, bolts, screws, or the like.
- Structure 110 may be any type of structure, such as a space transformer (as depicted) or any type of substrate such as a printed circuit board (PCB), a multi-layered organic (MLO) substrate, or a multi-layered ceramic (MLC) substrate (see, for example, FIGS. 5 and 6 ).
- a space transformer as depicted
- PCB printed circuit board
- MLO multi-layered organic
- MLC multi-layered ceramic
- structure 110 may be removably attached to socket enclosure 100 .
- structure 110 may be permanently attached to socket enclosure 100 . It is noted that if structure 110 is not permanently attached to socket enclosure 100 , structure 110 and socket enclosure 100 may be separated so that individual conductors 114 (or individual pins 102 or compressible members 402 ) may be relatively easily be replaced or repaired to repair probe card assembly 500 .
- the upper end 104 of probe pins 102 ends in tip portion 106 .
- the upper end 104 of probe pins 102 may extend from apertures 400 (depicted in FIG.4 ) at a specified lean angle 120 (as shown in FIG. 5 ) relative to socket enclosure 100 and substrate 110 .
- lean angle 120 may be from about between 0° to 45°.
- lean angle 120 may be between about 5° to 30°, and in other embodiments, lean angle 120 is between about 10° to 15°.
- Lean angle 120 may be selected in consideration of ensuring a sufficient or desired scrubbing action of tip portions 106 of probe pins 102 against upper circuit member contacts 504 (see FIG. 5 ).
- the pattern of apertures and conductors 114 may be designed to mirror or match the pattern of upper circuit member contacts 504 with which probe card assembly 500 may be employed.
- Socket enclosure 100 may be comprised of a non-conductive material such as a ceramic, e.g., zirconia alumina.
- socket enclosure 100 may be comprised of a material so as to permit at least as little as a 150 micron spacing between adjacent apertures 400 . It is noted that socket enclosure 100 may permit a pitch, i.e., socket enclosure 100 may allow adjacent apertures as close as, for example, of about 100 microns or closer.
- Probe pins 102 may be comprised of an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd) or alloys thereof and may further be coated with a conductive material, such as gold (Au).
- an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd) or alloys thereof and may further be coated with a conductive material, such as gold (Au).
- attachment compound 112 may be comprised of an adhesive compound such as, a glue-type material or epoxy. Whether attachment compound 112 (as illustrated in FIG. 1 ) is used and/or mechanical attachments are used to attach socket enclosure 100 to structure 110 , such compounds or attachments may also be employed proximate the center of socket enclosure 100 , which may account for the tendency of the socket enclosure 100 to separate from structure 110 , especially at the center, due to the cumulative action and force of the compressible members 402 against structure 110 and contacts 432 (see FIG. 4 ).
- an adhesive compound such as, a glue-type material or epoxy.
- FIG. 2 depicts an overhead plan view of FIG. 1 according to an embodiment of the invention.
- probe pins 102 may be disposed in an array within socket enclosure 100 . While one hundred twenty ( 120 ) probe pins 102 are illustrated in FIG. 2 , fewer or more probe pins 102 may be so disposed within socket enclosure 100 as desired. For example, in one exemplary embodiment of the present invention up to three thousand plus (3000+) compressible member (spring) loaded probe pins 102 may be employed in an array.
- FIG. 3 depicts an enlarged view of FIG. 2 at circle “3” according to an embodiment of the invention.
- each and every upper portion 104 of respective probe pins 102 may be disposed in an essentially identical fashion within apertures 400 and have essentially identical lean angles 120 (see FIG. 5 for example).
- certain probe pins 102 may be disposed in different orientations from one another.
- FIG. 4 depicts a sectional view of FIG. 3 along line A-A according to an embodiment of the invention.
- each conductor 114 may be slidingly received within aperture 400 .
- Each conductor 114 may comprise an upper electrically conductive probe pin 102 and a lower electrically conductive compressible member 402 .
- Probe pin 102 may include upper portion 104 , and lower portion 408 having a greater diameter to define a shoulder 410 .
- Probe pin 102 may be a unitary structure.
- Upper end 430 of compressible member 402 may contact lower portion 408 of probe pin 102 .
- Lower portion 408 of probe pin 102 may simply rest on top of upper end 430 of compressive member 402 so that compressive member 402 may bias probe pin shoulder 410 against aperture shoulder 420 and maintain contact between probe pin 102 and compressive member 402 .
- lower portion 408 of probe pin 102 may be affixed to upper end 430 of compressive member 402 using, for example, an electrically conductive glue or adhesive.
- lower portion 408 of probe pin 102 may include a narrowed portion (not shown), at least a portion of which is adapted for receipt within upper end 430 of compressive member 402 .
- probe pin 102 and compressible member 402 may be a single, unitary structure.
- upper portions 104 of probe pins 102 may include shaped upper portion 105 terminating in tip portion 106 .
- Tip portion 106 may be designed so as to facilitate electrical contact with upper circuit member contacts 504 (see FIG. 5 for example) and may facilitate a scrubbing motion against such upper circuit member contacts 504 (see FIGS. 5 and 6 for example) to remove or penetrate any layer overlying contacts 504 such as an oxide coating, for example.
- Shaped upper portion 105 may comprise a pyramidal shape as shown in FIG. 3 or FIG. 4 with a flat tip portion 106 designed to maximize scrubbing.
- tip portion 106 may be rounded. It is noted that probe pins 102 may be provided as a pre-existing item (for example from third parties) and may then be further processed to form pyramidal-shaped upper portion 105 .
- compressible member 402 may comprise a spring, such as a torsion spring as illustrated in FIG. 4 or a number of other springs or the like.
- compressible member 402 may comprise a series of interlaced conductive wires forming a lattice-like compressible member such as that disclosed in U.S. patent application Ser. No. 10/736,280, filed Dec. 15, 2003, which claims priority of U.S. provisional applications No. 60/457,076, filed Mar. 24, 2003, No. 60/457,258, filed Mar. 25, 2003, and No. 60/462,143, filed Apr. 8, 2003, each incorporated by reference in its entirety herein.
- the present invention is not limited, however, to depicted compressible member 402 .
- Alternative self-supporting configurations may be employed, by other embodiments of the invention, such as a substantially cylindrical tube formed from a conductive mesh.
- Compressible member 402 may be comprised of an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd), or alloys thereof, and may further be coated with a conductive material, such as gold (Au).
- an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd), or alloys thereof, and may further be coated with a conductive material, such as gold (Au).
- aperture 400 may be cylindrical with a lower portion 403 having a first diameter and an upper cylindrical portion 401 having a second diameter less than the lower portion's first diameter so as to define shoulder 420 and to receive upper portions 104 of respective probe pins 102 . It is noted that aperture 400 may be sized to slidingly receive probe pin 102 and specifically, for example, first and second diameters of the aperture may be sized so as to slidingly receive respective lower portion 408 and upper portion 104 of probe pin 102 such that a gap may be maintained between aperture 400 and probe pin 102 except when probe pin shoulder 410 contacts aperture shoulder 420 .
- Lower end 432 of compressible member 402 may engage contact 404 on substrate 110 so as to bias probe pin 102 upwardly and specifically so as to maintain contact between probe pin shoulder 410 and aperture shoulder 420 absent a downward force against probe pin 102 sufficient to compress compressible member 402 , and hence probe pin 102 , downwardly. While the sizing of aperture 400 may be designed to maintain coaxial alignment of probe pin 102 and/or compressible member 402 within aperture 400 , the spring tension also may also assist in maintaining such coaxial alignment.
- FIG. 7 is a flowchart illustrating a process of assembling a probe card assembly in accordance with an embodiment of the invention.
- FIG. 7 depicts an exemplary process. For example, certain of the steps in FIG. 7 may be eliminated or replaced by alternative steps. Likewise, the order of the steps may be rearranged in certain configurations of the invention.
- socket enclosure 100 may be inverted as compared to FIG. 1 . Thereafter, probe pins 102 may be inserted into the respective socket enclosure apertures 400 so that probe pin shoulder 410 may contact aperture shoulder 420 and upper ends 104 of probe pins 102 may protrude from apertures 400 .
- single compressible members 402 may then be inserted into respective apertures 400 so that upper ends 430 of compressible members 402 may contact lower portions 408 of respective probe pins 102 .
- step 704 structure 110 may be aligned over inverted socket enclosure 100 so that complimentary substrate contacts 404 may be aligned with respective apertures 400 and/or compressible members 402 .
- Structure 110 may be mounted to the socket enclosure so that lower ends 432 of compressible members 402 may contact the respective substrate contacts 404 .
- the spring tension caused by the engagement between compressible member 402 and probe pin 102 and substrate contact 404 (1) may be used to assist in maintaining coaxial alignment of probe pin 102 and/or compressible member 402 with aperture 400 ; and (2) may be used to bias probe pin 102 against shoulder 420 of aperture 400 .
- structure 110 may be affixed to inverted socket enclosure 100 such as by attachment compound 112 , fasteners, etc.
- structure 110 may not be permanently attached to socket enclosure 100 to facilitate repair of individual conductors 114 and/or individual probe pins 102 and /or individual compressible members 402 .
- structure 110 may be permanently attached to socket enclosure 100 .
- FIGS. 5 and 6 illustrate the scrubbing motion achieved by conductor 114 when conductors 114 engage contacts 504 of upper circuit member 502 according to an embodiment.
- Upper circuit member 502 may be wafer 502 under test or a device under test (DUT).
- probe card assembly 500 may be positioned proximate upper circuit member 502 so that tip ends 106 of conductors 114 may just touch or contact respective upper circuit member contacts 504 . Shoulder 410 of probe pin 102 may remain in contact with shoulder 420 of aperture 400 .
- probe card assembly 500 and upper circuit member 502 may be urged together so that upper circuit member contact 504 forces probe pin 102 downwardly (towards or to a maximum designed limit at the overdrive (“O.D.”) position), compressing compressible member 402 to cause retraction of probe pin 102 within aperture 400 .
- This angled “Z Travel” (over travel or overdrive) 606 of probe pin 102 may cause tip end 106 to horizontally scrub (leftwards as illustrated in FIGS. 5 and 6 , for example) against upper circuit member contact 504 by “Scrubbing Motion” 608 to remove or penetrate any contaminate layer over contact 504 , such as an oxide layer (not shown), to facilitate electrical contact between conductor 114 and contact 504 .
- Scrubbing Motion any contaminate layer over contact 504 , such as an oxide layer (not shown)
- the angle of Z Travel 606 may be from about greater than 0.0 (zero) to upwards of 10.0/1000 inches.
- a large maximum Z Travel or overdrive 606 may help to ensure contact between probe pins 102 and respective contacts 504 , but may also lead to a more rapid wear out of probe card assembly 500 .
- a maximum Z Travel 606 may be from about 3.5/1000 to 5.0/1000 inches. Further, in certain embodiments of the invention, Z Travel 606 may be from about 0.0 (zero) to 2.0/1000 inches.
- Assembly in accordance with an exemplary embodiment of the present invention reduces to a few relatively simple process steps using well-know technologies, such as (1) EDM (electrical discharge machining) and the use of a shaped electrode with a high voltage discharge to remove material and achieve a desired shape without any mechanical touching and/or forming of the material to form probe pins 102 , or (2) Auto-CNC (housing machining process, or an automated, sophisticated machining process) where a two-dimensional (2D) electronic drawing is inputted into a precise multi-axis grinding machine which converts the 2D drawing into a three-dimensional shaped structure from a template material, for example, metal or ceramic) to form socket enclosure 100 with spaced apertures 400 and/or probe pins 102 , for example, with a high rate of accuracy and repeatability as compared to certain current assembly processes to form probes/probe card assemblies for wafer testing which are more involved, complex and time consuming
- EDM electric discharge machining
- Auto-CNC housing machining process, or an automated, sophisticated machining process
- a socket enclosure may be employed which would enable not only exceptional probe tip alignment, with exceptional coplanarity of the respective probe tips throughout the entire array by providing directional guidance to the probe pin itself, but also substantially uniform scrubbing motion at most every touchdown, or contact, between the probe pin tip and the respective contact on the device under test (DUT). As noted above, this may also permit a lower maximum Z Travel and/or overdrive 606 .
- the exemplary embodiments of the present invention may enable a new generation of flip-chip wafer probe cards to support pad pitches, or space between adjacent pads, as low as at least, for example, about 150 microns.
- the spring-loaded probe pins may be provided orthogonal (or substantially orthogonal) to the surface of the underlying substrate (i.e., the substrate through which the spring-loaded probe pins are supported).
Abstract
Description
- The present invention relates to an approach for creating a spring-loaded probe pin assembly.
- The approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.
- In the manufacture of certain probe cards and the like, each probe of the probe card is electroformed (e.g., as part of a group of probes), singulated, and then mechanically bonded (e.g., one at a time) onto the probe card. This process is time and resource intensive. Further, often it is necessary to perform additional work to realign any misaligned probes on the probe card before the probe card may be satisfactorily used in testing. Such rework may interfere with the bonds holding the probes to the probe card.
- The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
-
FIG. 1 is a side, sectional view of an assembly according to an embodiment of the invention; -
FIG. 2 is an overhead plan view ofFIG. 1 according to an embodiment of the invention; -
FIG. 3 is an enlarged view of the circled area ofFIG. 2 according to an embodiment of the invention; -
FIG. 4 is an enlarged side, sectional view of line A-A ofFIG. 3 according to an embodiment of the invention; -
FIG. 5 is a further enlarged view ofFIG. 4 further illustrating initial contact of a tip portion of a probe pin with a wafer according to an embodiment of the invention; -
FIG. 6 is the structure ofFIG. 5 in contact with the wafer at overdrive according to an embodiment of the invention; and -
FIG. 7 is a flowchart illustrating a process of assembling a probe card assembly in accordance with an embodiment of the invention. - In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the present invention.
- In an exemplary embodiment of the present invention, a socket with precisely formed
apertures 400 is adapted to retainrespective probe pin 102/compressible member 402 assemblies in precise alignment at desired lean angle(s) 120. The guidance provided to theprobe pin 102/compressible member 402 assemblies byrespective apertures 400 substantially reduces or eliminates the alignment problems associated with the convention probe cards regarding reworking. Assembly of exemplaryprobe card assembly 500 is also simplified as, in essence,probe pins 102 andcompressible members 402 may just be dropped intorespective apertures 400 ofsocket enclosure 100 and then space transformer/structure/substrate 110 may be attached tosocket enclosure 100 to retain them therein. Further, in an exemplary embodiment, the space transformer/structure/substrate 110 is removably attached tosocket enclosure 100 so thatindividual probe pins 102 and/orcompressible members 402 may be replaced as needed to permit repair of theprobe card assembly 500 while keeping the same multi-layer ceramic (MLC) structure. In an embodiment,compressible member 402 may be a resiliently compressible member (such as a spring or the like) that compresses in response to a force asserted against a probe pin in contact the resiliently compressible member. -
FIG. 1 is a side, sectional view of an assembly in accordance with an embodiment of the invention. As illustrated inFIG. 1 ,socket enclosure 100 may have a plurality ofconductors 114 slidingly within respective apertures 400 (as shown inFIG. 4 ) and may be affixed to structure 110 mechanically and/or by using attachment compound 112 (as depicted inFIG. 1 ). Non-limiting, illustrative approaches for mechanically affixingconductors 114 tostructure 110 include the use of pins, bolts, screws, or the like.Structure 110 may be any type of structure, such as a space transformer (as depicted) or any type of substrate such as a printed circuit board (PCB), a multi-layered organic (MLO) substrate, or a multi-layered ceramic (MLC) substrate (see, for example,FIGS. 5 and 6 ). - In one embodiment,
structure 110 may be removably attached tosocket enclosure 100. In another exemplary embodiment,structure 110 may be permanently attached tosocket enclosure 100. It is noted that ifstructure 110 is not permanently attached tosocket enclosure 100,structure 110 andsocket enclosure 100 may be separated so that individual conductors 114 (orindividual pins 102 or compressible members 402) may be relatively easily be replaced or repaired to repairprobe card assembly 500. - As shown in
FIG. 1 , theupper end 104 ofprobe pins 102 ends intip portion 106. Theupper end 104 ofprobe pins 102 may extend from apertures 400 (depicted inFIG.4 ) at a specified lean angle 120 (as shown inFIG. 5 ) relative tosocket enclosure 100 andsubstrate 110. In an embodiment,lean angle 120 may be from about between 0° to 45°. According to certain embodiments of the invention,lean angle 120 may be between about 5° to 30°, and in other embodiments,lean angle 120 is between about 10° to 15°.Lean angle 120 may be selected in consideration of ensuring a sufficient or desired scrubbing action oftip portions 106 ofprobe pins 102 against upper circuit member contacts 504 (seeFIG. 5 ). - The pattern of apertures and
conductors 114 may be designed to mirror or match the pattern of uppercircuit member contacts 504 with whichprobe card assembly 500 may be employed. -
Socket enclosure 100 may be comprised of a non-conductive material such as a ceramic, e.g., zirconia alumina. For example,socket enclosure 100 may be comprised of a material so as to permit at least as little as a 150 micron spacing betweenadjacent apertures 400. It is noted thatsocket enclosure 100 may permit a pitch, i.e.,socket enclosure 100 may allow adjacent apertures as close as, for example, of about 100 microns or closer. -
Probe pins 102 may be comprised of an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd) or alloys thereof and may further be coated with a conductive material, such as gold (Au). - In an embodiment of the invention that employs
attachment compound 112,attachment compound 112 may be comprised of an adhesive compound such as, a glue-type material or epoxy. Whether attachment compound 112 (as illustrated inFIG. 1 ) is used and/or mechanical attachments are used to attachsocket enclosure 100 tostructure 110, such compounds or attachments may also be employed proximate the center ofsocket enclosure 100, which may account for the tendency of thesocket enclosure 100 to separate fromstructure 110, especially at the center, due to the cumulative action and force of thecompressible members 402 againststructure 110 and contacts 432 (seeFIG. 4 ). -
FIG. 2 depicts an overhead plan view ofFIG. 1 according to an embodiment of the invention. As shown inFIG. 2 ,probe pins 102 may be disposed in an array withinsocket enclosure 100. While one hundred twenty (120)probe pins 102 are illustrated inFIG. 2 , fewer ormore probe pins 102 may be so disposed withinsocket enclosure 100 as desired. For example, in one exemplary embodiment of the present invention up to three thousand plus (3000+) compressible member (spring) loadedprobe pins 102 may be employed in an array. -
FIG. 3 depicts an enlarged view ofFIG. 2 at circle “3” according to an embodiment of the invention. As shown inFIG. 3 , each and everyupper portion 104 ofrespective probe pins 102 may be disposed in an essentially identical fashion withinapertures 400 and have essentially identical lean angles 120 (seeFIG. 5 for example). Alternatively,certain probe pins 102 may be disposed in different orientations from one another. -
FIG. 4 depicts a sectional view ofFIG. 3 along line A-A according to an embodiment of the invention. As shown inFIG. 4 , eachconductor 114 may be slidingly received withinaperture 400. Eachconductor 114 may comprise an upper electricallyconductive probe pin 102 and a lower electrically conductivecompressible member 402.Probe pin 102 may includeupper portion 104, andlower portion 408 having a greater diameter to define ashoulder 410.Probe pin 102 may be a unitary structure.Upper end 430 ofcompressible member 402 may contactlower portion 408 ofprobe pin 102.Lower portion 408 ofprobe pin 102 may simply rest on top ofupper end 430 ofcompressive member 402 so thatcompressive member 402 may biasprobe pin shoulder 410 againstaperture shoulder 420 and maintain contact betweenprobe pin 102 andcompressive member 402. Alternatively,lower portion 408 ofprobe pin 102 may be affixed toupper end 430 ofcompressive member 402 using, for example, an electrically conductive glue or adhesive. Also, in addition to, or instead of, the use of an electrically conductive glue or adhesive,lower portion 408 ofprobe pin 102 may include a narrowed portion (not shown), at least a portion of which is adapted for receipt withinupper end 430 ofcompressive member 402. In yet another exemplary embodiment,probe pin 102 andcompressible member 402 may be a single, unitary structure. - As illustrated in
FIGS. 2 , 3 and 4,upper portions 104 of probe pins 102 may include shapedupper portion 105 terminating intip portion 106.Tip portion 106 may be designed so as to facilitate electrical contact with upper circuit member contacts 504 (seeFIG. 5 for example) and may facilitate a scrubbing motion against such upper circuit member contacts 504 (seeFIGS. 5 and 6 for example) to remove or penetrate anylayer overlying contacts 504 such as an oxide coating, for example. Shapedupper portion 105 may comprise a pyramidal shape as shown inFIG. 3 orFIG. 4 with aflat tip portion 106 designed to maximize scrubbing. Such a pyramidal shape has been discovered by the inventors to achieve a sharpenough tip portion 106 to maximize scrubbing while at the same time minimizing wear ofprobe pin 102. In another exemplary embodiment,tip portion 106 may be rounded. It is noted that probe pins 102 may be provided as a pre-existing item (for example from third parties) and may then be further processed to form pyramidal-shapedupper portion 105. - In an embodiment,
compressible member 402 may comprise a spring, such as a torsion spring as illustrated inFIG. 4 or a number of other springs or the like. In another embodiment,compressible member 402 may comprise a series of interlaced conductive wires forming a lattice-like compressible member such as that disclosed in U.S. patent application Ser. No. 10/736,280, filed Dec. 15, 2003, which claims priority of U.S. provisional applications No. 60/457,076, filed Mar. 24, 2003, No. 60/457,258, filed Mar. 25, 2003, and No. 60/462,143, filed Apr. 8, 2003, each incorporated by reference in its entirety herein. As noted, the present invention is not limited, however, to depictedcompressible member 402. Alternative self-supporting configurations may be employed, by other embodiments of the invention, such as a substantially cylindrical tube formed from a conductive mesh. -
Compressible member 402 may be comprised of an electrically conductive material such as nickel, stainless steel, copper manganese (CuMn), palladium (Pd), or alloys thereof, and may further be coated with a conductive material, such as gold (Au). - As illustrated in
FIG. 4 ,aperture 400 may be cylindrical with alower portion 403 having a first diameter and an uppercylindrical portion 401 having a second diameter less than the lower portion's first diameter so as to defineshoulder 420 and to receiveupper portions 104 of respective probe pins 102. It is noted thataperture 400 may be sized to slidingly receiveprobe pin 102 and specifically, for example, first and second diameters of the aperture may be sized so as to slidingly receive respectivelower portion 408 andupper portion 104 ofprobe pin 102 such that a gap may be maintained betweenaperture 400 andprobe pin 102 except whenprobe pin shoulder 410contacts aperture shoulder 420. -
Lower end 432 ofcompressible member 402 may engage contact 404 onsubstrate 110 so as to biasprobe pin 102 upwardly and specifically so as to maintain contact betweenprobe pin shoulder 410 andaperture shoulder 420 absent a downward force againstprobe pin 102 sufficient to compresscompressible member 402, and hence probepin 102, downwardly. While the sizing ofaperture 400 may be designed to maintain coaxial alignment ofprobe pin 102 and/orcompressible member 402 withinaperture 400, the spring tension also may also assist in maintaining such coaxial alignment. -
FIG. 7 is a flowchart illustrating a process of assembling a probe card assembly in accordance with an embodiment of the invention.FIG. 7 depicts an exemplary process. For example, certain of the steps inFIG. 7 may be eliminated or replaced by alternative steps. Likewise, the order of the steps may be rearranged in certain configurations of the invention. - In
step 700,socket enclosure 100 may be inverted as compared toFIG. 1 . Thereafter, probe pins 102 may be inserted into the respectivesocket enclosure apertures 400 so thatprobe pin shoulder 410 may contactaperture shoulder 420 andupper ends 104 of probe pins 102 may protrude fromapertures 400. - In
step 702, singlecompressible members 402 may then be inserted intorespective apertures 400 so that upper ends 430 ofcompressible members 402 may contactlower portions 408 of respective probe pins 102. - In
step 704,structure 110 may be aligned overinverted socket enclosure 100 so thatcomplimentary substrate contacts 404 may be aligned withrespective apertures 400 and/orcompressible members 402.Structure 110 may be mounted to the socket enclosure so that lower ends 432 ofcompressible members 402 may contact therespective substrate contacts 404. - As discussed above, it is noted that the spring tension caused by the engagement between
compressible member 402 andprobe pin 102 and substrate contact 404: (1) may be used to assist in maintaining coaxial alignment ofprobe pin 102 and/orcompressible member 402 withaperture 400; and (2) may be used tobias probe pin 102 againstshoulder 420 ofaperture 400. - In
step 706,structure 110 may be affixed toinverted socket enclosure 100 such as byattachment compound 112, fasteners, etc. In an embodiment,structure 110 may not be permanently attached tosocket enclosure 100 to facilitate repair ofindividual conductors 114 and/or individual probe pins 102 and /or individualcompressible members 402. In another embodiment,structure 110 may be permanently attached tosocket enclosure 100. -
FIGS. 5 and 6 illustrate the scrubbing motion achieved byconductor 114 whenconductors 114 engagecontacts 504 ofupper circuit member 502 according to an embodiment.Upper circuit member 502 may bewafer 502 under test or a device under test (DUT). - As illustrated in
FIG. 5 , at Initial Contact,probe card assembly 500 may be positioned proximateupper circuit member 502 so that tip ends 106 ofconductors 114 may just touch or contact respective uppercircuit member contacts 504.Shoulder 410 ofprobe pin 102 may remain in contact withshoulder 420 ofaperture 400. - As illustrated in
FIG. 6 , for example,probe card assembly 500 andupper circuit member 502 may be urged together so that uppercircuit member contact 504forces probe pin 102 downwardly (towards or to a maximum designed limit at the overdrive (“O.D.”) position), compressingcompressible member 402 to cause retraction ofprobe pin 102 withinaperture 400. This angled “Z Travel” (over travel or overdrive) 606 ofprobe pin 102 may causetip end 106 to horizontally scrub (leftwards as illustrated inFIGS. 5 and 6 , for example) against uppercircuit member contact 504 by “Scrubbing Motion” 608 to remove or penetrate any contaminate layer overcontact 504, such as an oxide layer (not shown), to facilitate electrical contact betweenconductor 114 and contact 504. It is noted that in the exemplary embodiment illustrated inFIGS. 5-6 ,lean angle 120 remains substantially constant duringZ Travel 606. - In an embodiment, the angle of
Z Travel 606 may be from about greater than 0.0 (zero) to upwards of 10.0/1000 inches. A large maximum Z Travel oroverdrive 606 may help to ensure contact between probe pins 102 andrespective contacts 504, but may also lead to a more rapid wear out ofprobe card assembly 500. In certain embodiments of the invention, amaximum Z Travel 606 may be from about 3.5/1000 to 5.0/1000 inches. Further, in certain embodiments of the invention,Z Travel 606 may be from about 0.0 (zero) to 2.0/1000 inches. It is noted that with the improved planarity/co-planarity of probe pin tip ends 106 that is accomplished with the teachings of the present invention, smaller and smaller (maximum) Z Travel and/oroverdrive 606 may be achieved while still permitting contact between probe pins 102 andrespective contacts 504. While embodiments of the invention have been described with reference to a single touchdown, or contact, betweenconductors 114 and uppercircuit member contacts 504, in practice multiple touchdowns may be employed during the testing of a singleupper circuit member 504, such as a memory wafer. - By employing the present invention, a considerable amount of manufacturing process steps currently used to build a probe card assembly may be eliminated. Assembly in accordance with an exemplary embodiment of the present invention reduces to a few relatively simple process steps using well-know technologies, such as (1) EDM (electrical discharge machining) and the use of a shaped electrode with a high voltage discharge to remove material and achieve a desired shape without any mechanical touching and/or forming of the material to form probe pins 102, or (2) Auto-CNC (housing machining process, or an automated, sophisticated machining process) where a two-dimensional (2D) electronic drawing is inputted into a precise multi-axis grinding machine which converts the 2D drawing into a three-dimensional shaped structure from a template material, for example, metal or ceramic) to form
socket enclosure 100 with spacedapertures 400 and/or probe pins 102, for example, with a high rate of accuracy and repeatability as compared to certain current assembly processes to form probes/probe card assemblies for wafer testing which are more involved, complex and time consuming. Thus, compared to certain conventional processes, cost, development time, and production cycle times may be reduced. Of course, these processes are exemplary in nature, and the present invention is not limited thereto. - In an embodiment of the invention, a socket enclosure may be employed which would enable not only exceptional probe tip alignment, with exceptional coplanarity of the respective probe tips throughout the entire array by providing directional guidance to the probe pin itself, but also substantially uniform scrubbing motion at most every touchdown, or contact, between the probe pin tip and the respective contact on the device under test (DUT). As noted above, this may also permit a lower maximum Z Travel and/or
overdrive 606. - The exemplary embodiments of the present invention may enable a new generation of flip-chip wafer probe cards to support pad pitches, or space between adjacent pads, as low as at least, for example, about 150 microns.
- While the present invention is described primarily with respect to spring-loaded probe pins configured at a lean angle, it is not limited thereto. For example, according to certain exemplary embodiments of the present invention, the spring-loaded probe pins may be provided orthogonal (or substantially orthogonal) to the surface of the underlying substrate (i.e., the substrate through which the spring-loaded probe pins are supported).
- While the present invention has been described primarily with respect to probe cards for wafer testing of semiconductor devices, it is not limited thereto. Certain of the teachings may be applied to other technologies, for example, package testing of semiconductor devices.
- In the foregoing specification, embodiments of the invention have been described with reference to numerous specific details that may vary from implementation to implementation. Thus, the sole and exclusive indicator of what is the invention, and is intended by the applicants to be the invention, is the set of claims that issue from this application, in the specific form in which such claims issue, including any subsequent correction. Any definitions expressly set forth herein for terms contained in such claims shall govern the meaning of such terms as used in the claims. Hence, no limitation, element, property, feature, advantage or attribute that is not expressly recited in a claim should limit the scope of such claim in any way. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (17)
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US11/712,797 US7479794B2 (en) | 2007-02-28 | 2007-02-28 | Spring loaded probe pin assembly |
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Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3274534A (en) * | 1963-12-02 | 1966-09-20 | Gen Dynamics Corp | Electrical connector |
US4686465A (en) * | 1984-06-12 | 1987-08-11 | Feinmetall Gmbh | Probe assembly for circuit-board tester |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4899104A (en) * | 1986-11-18 | 1990-02-06 | Erich Luther | Adapter for a printed circuit board testing device |
US4968589A (en) * | 1988-10-26 | 1990-11-06 | General Signal Corporation | Probe card for integrated circuit chip and method of making probe card |
US5244396A (en) * | 1991-12-20 | 1993-09-14 | Yamaichi Electronics Co., Ltd. | Connector for electric part |
US5324205A (en) * | 1993-03-22 | 1994-06-28 | International Business Machines Corporation | Array of pinless connectors and a carrier therefor |
US6407565B1 (en) * | 1996-10-29 | 2002-06-18 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US20020113611A1 (en) * | 1997-08-21 | 2002-08-22 | Yoshihiro Goto | Checker head |
US6469531B1 (en) * | 1996-10-29 | 2002-10-22 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US20030049974A1 (en) * | 2001-09-04 | 2003-03-13 | Monika Bauer | Electrical pressure contact |
US6642728B1 (en) * | 1998-07-30 | 2003-11-04 | Nhk Spring Co., Ltd | Holder of electroconductive contactor, and method for producing the same |
US6677772B1 (en) * | 2002-08-21 | 2004-01-13 | Micron Technology, Inc. | Contactor with isolated spring tips |
US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
US20040046581A1 (en) * | 1999-10-18 | 2004-03-11 | Mitsubishi Denki Kabushiki Kaisha | Socket for testing a semiconductor device and a connecting sheet used for the same |
US20040100295A1 (en) * | 2002-11-25 | 2004-05-27 | Chaeyoon Lee | Air interface apparatus for use in high-frequency probe device |
US6844749B2 (en) * | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
US6937045B2 (en) * | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
US6992496B2 (en) * | 2002-03-05 | 2006-01-31 | Rika Electronics International, Inc. | Apparatus for interfacing electronic packages and test equipment |
US7040902B2 (en) * | 2003-03-24 | 2006-05-09 | Che-Yu Li & Company, Llc | Electrical contact |
US7202677B2 (en) * | 1995-05-26 | 2007-04-10 | Formfactor, Inc. | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
-
2007
- 2007-02-28 US US11/712,797 patent/US7479794B2/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3274534A (en) * | 1963-12-02 | 1966-09-20 | Gen Dynamics Corp | Electrical connector |
US4686465A (en) * | 1984-06-12 | 1987-08-11 | Feinmetall Gmbh | Probe assembly for circuit-board tester |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4899104A (en) * | 1986-11-18 | 1990-02-06 | Erich Luther | Adapter for a printed circuit board testing device |
US4968589A (en) * | 1988-10-26 | 1990-11-06 | General Signal Corporation | Probe card for integrated circuit chip and method of making probe card |
US5244396A (en) * | 1991-12-20 | 1993-09-14 | Yamaichi Electronics Co., Ltd. | Connector for electric part |
US5324205A (en) * | 1993-03-22 | 1994-06-28 | International Business Machines Corporation | Array of pinless connectors and a carrier therefor |
US7202677B2 (en) * | 1995-05-26 | 2007-04-10 | Formfactor, Inc. | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
US6407565B1 (en) * | 1996-10-29 | 2002-06-18 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US6469531B1 (en) * | 1996-10-29 | 2002-10-22 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US20020113611A1 (en) * | 1997-08-21 | 2002-08-22 | Yoshihiro Goto | Checker head |
US6642728B1 (en) * | 1998-07-30 | 2003-11-04 | Nhk Spring Co., Ltd | Holder of electroconductive contactor, and method for producing the same |
US20040046581A1 (en) * | 1999-10-18 | 2004-03-11 | Mitsubishi Denki Kabushiki Kaisha | Socket for testing a semiconductor device and a connecting sheet used for the same |
US20030049974A1 (en) * | 2001-09-04 | 2003-03-13 | Monika Bauer | Electrical pressure contact |
US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
US6992496B2 (en) * | 2002-03-05 | 2006-01-31 | Rika Electronics International, Inc. | Apparatus for interfacing electronic packages and test equipment |
US6844749B2 (en) * | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
US6937045B2 (en) * | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
US6677772B1 (en) * | 2002-08-21 | 2004-01-13 | Micron Technology, Inc. | Contactor with isolated spring tips |
US20040100295A1 (en) * | 2002-11-25 | 2004-05-27 | Chaeyoon Lee | Air interface apparatus for use in high-frequency probe device |
US7040902B2 (en) * | 2003-03-24 | 2006-05-09 | Che-Yu Li & Company, Llc | Electrical contact |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110102009A1 (en) * | 2008-06-20 | 2011-05-05 | Lee Jae Hak | Test socket electrical connector, and method for manufacturing the test socket |
US20100244875A1 (en) * | 2009-03-27 | 2010-09-30 | Scott Chabineau-Lovgren | Scrub inducing compliant electrical contact |
CN102422170A (en) * | 2009-03-27 | 2012-04-18 | 特拉华资本构造公司 | Scrub inducing compliant electrical contact |
US8324919B2 (en) * | 2009-03-27 | 2012-12-04 | Delaware Capital Formation, Inc. | Scrub inducing compliant electrical contact |
TWI411784B (en) * | 2009-03-27 | 2013-10-11 | Capital Formation Inc | Scrub inducing compliant electrical contact |
KR101409821B1 (en) * | 2009-03-27 | 2014-06-19 | 델라웨어 캐피탈 포메이션, 인코포레이티드 | Compliant contact assembly and method of scrubbing a test site by a compliant contact member |
US20130033282A1 (en) * | 2010-04-15 | 2013-02-07 | Tokyo Electron Limited | Contact structure and method of manufacturing contact structure |
US20170097376A1 (en) * | 2015-10-02 | 2017-04-06 | Mpi Corporation | Spring probe having outer sleeve and probe device having the same |
US11262384B2 (en) * | 2016-12-23 | 2022-03-01 | Intel Corporation | Fine pitch probe card methods and systems |
US11131691B2 (en) | 2017-03-30 | 2021-09-28 | Nhk Spring Co., Ltd. | Probe holder and probe unit |
WO2018181216A1 (en) * | 2017-03-30 | 2018-10-04 | 日本発條株式会社 | Probe holder and probe unit |
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US11268983B2 (en) | 2017-06-30 | 2022-03-08 | Intel Corporation | Chevron interconnect for very fine pitch probing |
US11674980B2 (en) | 2017-09-29 | 2023-06-13 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
US11774489B2 (en) | 2017-12-05 | 2023-10-03 | Intel Corporation | Multi-member test probe structure |
US11061068B2 (en) | 2017-12-05 | 2021-07-13 | Intel Corporation | Multi-member test probe structure |
US11204555B2 (en) | 2017-12-28 | 2021-12-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US11822249B2 (en) | 2017-12-28 | 2023-11-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US11073538B2 (en) | 2018-01-03 | 2021-07-27 | Intel Corporation | Electrical testing apparatus with lateral movement of a probe support substrate |
US10877068B2 (en) | 2018-01-05 | 2020-12-29 | Intel Corporation | High density and fine pitch interconnect structures in an electric test apparatus |
US11249113B2 (en) | 2018-01-05 | 2022-02-15 | Intel Corporation | High density and fine pitch interconnect structures in an electric test apparatus |
US10866264B2 (en) | 2018-01-05 | 2020-12-15 | Intel Corporation | Interconnect structure with varying modulus of elasticity |
US11543454B2 (en) | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
US10935573B2 (en) | 2018-09-28 | 2021-03-02 | Intel Corporation | Slip-plane MEMS probe for high-density and fine pitch interconnects |
US11372023B2 (en) | 2018-09-28 | 2022-06-28 | Intel Corporation | Slip-plane MEMs probe for high-density and fine pitch interconnects |
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