US20090114349A1 - Chip mounter - Google Patents
Chip mounter Download PDFInfo
- Publication number
- US20090114349A1 US20090114349A1 US12/105,639 US10563908A US2009114349A1 US 20090114349 A1 US20090114349 A1 US 20090114349A1 US 10563908 A US10563908 A US 10563908A US 2009114349 A1 US2009114349 A1 US 2009114349A1
- Authority
- US
- United States
- Prior art keywords
- electronic component
- printed board
- manipulator
- chip
- chip mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Definitions
- This invention relates to a chip mounter for mounting electronic components or chips on a printed board.
- FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter.
- a conventional chip mounter 10 mounts electronic components or chips 12 on a print-circuit board (PCB) or printed board 18 horizontally located on a bed 16 comprising, for example, a conveyer.
- PCB print-circuit board
- the chips 12 are picked up, one at a time, from an electronic component feeding device or chip feeding device 14 in which chips are disposed at the leading end of tapes, transferred, and located in position above a printed board by a manipulator.
- the manipulator comprises a head 22 and a cable rack chain 24 for moving the head 22 horizontally and at the same time transferring electric power and signals.
- the head 22 having a moving range as shown by arrow A picks up the chip 12 at the position as shown by arrow 22 a , thereafter is moved horizontally, and mounts the chip 12 on the printed board 18 at the position as shown by arrow 22 b.
- the foreign materials 20 such as dust or the like emanated from working parts and power feeding portion of manipulator of chip mounter fall down and are accumulated on the upper surface of the printed board.
- a chip mounter which comprises a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and a bed located above said manipulator or located sidewise relative to said manipulator for mounting said printed board vertically or downwardly.
- FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention
- FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention
- FIG. 3 is a view for explaining about the second embodiment in more detail, FIG. 3 a is its front view and FIG. 3 b is its side view,
- FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter
- FIG. 5 is a view for explaining about occurrence of the defect in soldering in a conventional chip mounter.
- FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention.
- a bed 16 is disposed above a cable rack chain 24 of manipulator and a printed board 18 is mounted on the lower surface of bed 16 .
- Electronic components or chips 12 are picked up, one at a time, by the manipulator from a chip feeding device 14 in which chips 12 are disposed on tapes. Thereafter by the manipulator the chip is transferred and located in position below the lower surface of printed board 18 .
- a head 22 having a moving range shown by arrow A picks up the chip 12 at the position shown by arrow 22 a , thereafter moves horizontally, and applies the chip 12 on the lower surface of printed board 18 at the position shown by arrow 22 b.
- FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention.
- the printed board 18 is mounted on the bed 16 which is vertically disposed, or the bed 16 is disposed within a range of angle ⁇ of ⁇ 90 degree to +90 degree relative to horizontal axis and the printed board 18 is mounted downward on the bed 16 . Under these circumstances the printed board 18 is disposed vertically or downward. Since the dust or the like falls down, the dust or the like is not accumulated on the printed board 18 .
- ⁇ is equal to 0 degree
- the second embodiment corresponds to the first embodiment.
- FIG. 3 is a view for explaining about the second embodiment in more detail
- FIG. 3 a is its front view
- FIG. 3 b is its side view.
- the printed board 18 mounted on the bed 16 is installed so that its chip mounted surface is vertically or slightly downward.
- the working parts of the chip mounter or manipulator, that is, the head 22 and the cable rack chain 24 are located sidewise or downward relative to the printed board 18 , not located above the printed board. Since the working parts is not located above the printed board, the dust or the like is not accumulated on the printed board 18 .
- the chip 12 is located on the leading end of tape 12 a.
- the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive, force of which is strong to such a degree that it can hold the chip before hardening to prevent falling down of the chip is used.
- the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive is hardened or half hardened just before or just after mounting of the chip.
Abstract
A chip mounter has a manipulator and a bed. The manipulator picks up an electronic component from an electronic component feeding device, transfers the electronic component to the electronic component mounted surface of a printed board, and mounts the electronic component on the electronic component mounted surface. The bed is located above the manipulator or sidewise relative to the manipulator for mounting the printed board vertically or downwardly.
Description
- This invention relates to a chip mounter for mounting electronic components or chips on a printed board.
-
FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter. As shown inFIG. 4 a conventional chip mounter 10 mounts electronic components orchips 12 on a print-circuit board (PCB) or printedboard 18 horizontally located on abed 16 comprising, for example, a conveyer. - The
chips 12 are picked up, one at a time, from an electronic component feeding device orchip feeding device 14 in which chips are disposed at the leading end of tapes, transferred, and located in position above a printed board by a manipulator. The manipulator comprises ahead 22 and acable rack chain 24 for moving thehead 22 horizontally and at the same time transferring electric power and signals. At that time, thehead 22 having a moving range as shown by arrow A picks up thechip 12 at the position as shown byarrow 22 a, thereafter is moved horizontally, and mounts thechip 12 on the printedboard 18 at the position as shown byarrow 22 b. - Since these operations are carried out in a space above the printed board, the
foreign materials 20 such as dust or the like emanated from working parts and power feeding portion of manipulator of chip mounter fall down and are accumulated on the upper surface of the printed board. - Conventionally, since the electronic components were large in size, compared with the
foreign materials 20 such as dust or the like, there was no problem. However, recently, since the electronic components are miniaturized very much, interference by theforeign materials 20 has been caused. For example, as shown inFIG. 5 , when theforeign material 20 such as dust or the like which are large to a degree that interference may be caused are intervened between theelectrode 12 a of, for example, 0.1 mm in length of theelectronic component 12 of, for example, 0.4 mm in length and theelectrode 18 a of, for example, 0.1 mm in length of the printedboard 18, the defect in soldering would occur. - Therefore, it is an object of the present invention to provide a chip mounter which can inhibit accumulation of the foreign materials such as dust or the like to prevent the defect in soldering.
- To accomplish the object, there is provided a chip mounter which comprises a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and a bed located above said manipulator or located sidewise relative to said manipulator for mounting said printed board vertically or downwardly.
- Other objects, features, and advantages of the present invention will be explained in the following detailed description of the invention having reference to the appended drawings:
-
FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention, -
FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention, -
FIG. 3 is a view for explaining about the second embodiment in more detail,FIG. 3 a is its front view andFIG. 3 b is its side view, -
FIG. 4 is a diagrammatic view showing the construction and operation of a conventional chip mounter, and -
FIG. 5 is a view for explaining about occurrence of the defect in soldering in a conventional chip mounter. -
FIG. 1 is a view showing a first embodiment of chip mounter according to the present invention. As shown inFIG. 1 abed 16 is disposed above acable rack chain 24 of manipulator and a printedboard 18 is mounted on the lower surface ofbed 16. Electronic components orchips 12 are picked up, one at a time, by the manipulator from achip feeding device 14 in whichchips 12 are disposed on tapes. Thereafter by the manipulator the chip is transferred and located in position below the lower surface of printedboard 18. At that time, ahead 22 having a moving range shown by arrow A picks up thechip 12 at the position shown byarrow 22 a, thereafter moves horizontally, and applies thechip 12 on the lower surface of printedboard 18 at the position shown byarrow 22 b. -
Foreign materials 20 such as dust or the like falling down from the working parts of the chip mounter orforeign materials 20 such as dust or the like floating in the space above thebed 16 are not accumulated on the printedboard 18, and therefore the defect in soldering can be avoided. -
FIG. 2 is a view for explaining about a method in which chips are mounted on a printed board as a second embodiment of a chip mounter according to the present invention. As shown inFIG. 2 , the printedboard 18 is mounted on thebed 16 which is vertically disposed, or thebed 16 is disposed within a range of angle θ of −90 degree to +90 degree relative to horizontal axis and the printedboard 18 is mounted downward on thebed 16. Under these circumstances the printedboard 18 is disposed vertically or downward. Since the dust or the like falls down, the dust or the like is not accumulated on the printedboard 18. Furthermore, in case that θ is equal to 0 degree, the second embodiment corresponds to the first embodiment. -
FIG. 3 is a view for explaining about the second embodiment in more detail,FIG. 3 a is its front view andFIG. 3 b is its side view. As shown inFIG. 3 , the printedboard 18 mounted on thebed 16 is installed so that its chip mounted surface is vertically or slightly downward. The working parts of the chip mounter or manipulator, that is, thehead 22 and thecable rack chain 24 are located sidewise or downward relative to the printedboard 18, not located above the printed board. Since the working parts is not located above the printed board, the dust or the like is not accumulated on the printedboard 18. Furthermore, thechip 12 is located on the leading end oftape 12 a. - Since in the cases of these embodiments, the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive, force of which is strong to such a degree that it can hold the chip before hardening to prevent falling down of the chip is used.
- Since in the cases of these embodiments, the chip mounted surface of the printed board is vertical or downward, it is preferable that the adhesive is hardened or half hardened just before or just after mounting of the chip.
- It is understood that many modifications and variations may be devised given the above description of the principles of the invention. It is intended that all such modifications and variations be considered as within the spirit and scope of this invention, as it is defined in the following claims.
Claims (3)
1. A chip mounter which comprises
a manipulator for picking up an electronic component from an electronic component feeding device, transferring the electronic component to the electronic component mounted surface of a printed board, and mounting the electronic component on the electronic component mounted surface, and
a bed located above said manipulator or sidewise relative to said manipulator for mounting said printed board vertically or downwardly.
2. A chip mounter according to claim 1 in which the adhesive for electronic component has an adhesive force to such a degree that the electronic component does not fall down before hardening.
3. A chip mounter according to claim 1 in which the adhesive for electronic component is hardened or half hardened just before or just after mounting of the chip to prevent falling down of the electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/333,145 US8800139B2 (en) | 2007-11-01 | 2011-12-21 | Method of chip mounting onto downwardly-facing mounting surface of printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007284872A JP2009111312A (en) | 2007-11-01 | 2007-11-01 | Chip mounter |
JP2007-284872 | 2007-11-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/333,145 Division US8800139B2 (en) | 2007-11-01 | 2011-12-21 | Method of chip mounting onto downwardly-facing mounting surface of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090114349A1 true US20090114349A1 (en) | 2009-05-07 |
Family
ID=40299618
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/105,639 Abandoned US20090114349A1 (en) | 2007-11-01 | 2008-04-18 | Chip mounter |
US13/333,145 Active US8800139B2 (en) | 2007-11-01 | 2011-12-21 | Method of chip mounting onto downwardly-facing mounting surface of printed circuit board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/333,145 Active US8800139B2 (en) | 2007-11-01 | 2011-12-21 | Method of chip mounting onto downwardly-facing mounting surface of printed circuit board |
Country Status (5)
Country | Link |
---|---|
US (2) | US20090114349A1 (en) |
EP (1) | EP2056661B1 (en) |
JP (1) | JP2009111312A (en) |
KR (1) | KR101009534B1 (en) |
CN (1) | CN101426361B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10271437B2 (en) * | 2014-08-14 | 2019-04-23 | The United States Of America As Represented By The Secretary Of The Army | Motion-based reconfigurable microelectronics system |
CN108995866B (en) * | 2018-09-29 | 2020-07-24 | 歌尔股份有限公司 | Automatic film pasting equipment |
KR20240037755A (en) | 2022-09-15 | 2024-03-22 | 박은정 | A 3D Regulating Type of a Mounter for a Part |
KR20240037767A (en) | 2022-09-15 | 2024-03-22 | 박은정 | A Reel to Reel Type of a Mounter |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3711922A (en) * | 1971-03-02 | 1973-01-23 | Amp Inc | Assembling apparatus |
US4908092A (en) * | 1987-01-20 | 1990-03-13 | Ikegami Tsushinki Co., Ltd. | Apparatus for mounting chip device on printed circuit board |
US5135098A (en) * | 1987-01-20 | 1992-08-04 | Ikegami Tsushinki Co., Ltd. | Apparatus for mounting chip device on printed circuit board |
US5667129A (en) * | 1994-05-06 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | IC component mounting method and apparatus |
US20070039686A1 (en) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
Family Cites Families (19)
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US4915565A (en) * | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
JPS6142994A (en) * | 1984-08-07 | 1986-03-01 | 松下電器産業株式会社 | Method of mounting chip electronic part |
JPH03101141A (en) * | 1989-09-13 | 1991-04-25 | Sumitomo Bakelite Co Ltd | Manufacture of semiconductor device |
US5094381A (en) * | 1990-11-20 | 1992-03-10 | International Business Machines Corporation | System for automated mounting of electronic components to circuit boards |
US5249349A (en) * | 1991-01-24 | 1993-10-05 | Matsushita Electric Works, Ltd. | Parts mounting device |
JP3313224B2 (en) * | 1994-01-25 | 2002-08-12 | 松下電器産業株式会社 | Electronic component mounting equipment |
US5777886A (en) * | 1994-07-14 | 1998-07-07 | Semiconductor Technologies & Instruments, Inc. | Programmable lead conditioner |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
JP3333417B2 (en) * | 1997-02-04 | 2002-10-15 | 松下電器産業株式会社 | IC chip sealing method and device |
DE69832337T2 (en) * | 1997-07-28 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd., Kadoma | Component feeder and device for assembly |
JP3200401B2 (en) * | 1997-09-02 | 2001-08-20 | 富士通テン株式会社 | Connector mounting equipment |
TW460906B (en) * | 1999-03-05 | 2001-10-21 | Siemens Ag | Equipment to insert a substrate with flip-chips |
JP4480840B2 (en) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | Component mounting apparatus and component mounting method |
JP2001313493A (en) * | 2000-04-27 | 2001-11-09 | Sony Corp | System for mounting electronic component |
JP3939119B2 (en) * | 2001-10-03 | 2007-07-04 | 松下電器産業株式会社 | Component mounting device |
JP3739752B2 (en) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | Small-piece transfer device capable of random-cycle shifting |
JP4129837B2 (en) * | 2003-06-03 | 2008-08-06 | 松下電器産業株式会社 | Manufacturing method of mounting structure |
JP2005252118A (en) * | 2004-03-08 | 2005-09-15 | Juki Corp | Electronic component packaging apparatus |
JP4680704B2 (en) * | 2005-07-19 | 2011-05-11 | パナソニック株式会社 | Substrate cleaning device and substrate transfer device |
-
2007
- 2007-11-01 JP JP2007284872A patent/JP2009111312A/en active Pending
-
2008
- 2008-04-18 US US12/105,639 patent/US20090114349A1/en not_active Abandoned
- 2008-04-24 EP EP08007954.4A patent/EP2056661B1/en not_active Expired - Fee Related
- 2008-04-30 CN CN200810128767.7A patent/CN101426361B/en not_active Expired - Fee Related
- 2008-06-13 KR KR1020080055581A patent/KR101009534B1/en active IP Right Grant
-
2011
- 2011-12-21 US US13/333,145 patent/US8800139B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3711922A (en) * | 1971-03-02 | 1973-01-23 | Amp Inc | Assembling apparatus |
US4908092A (en) * | 1987-01-20 | 1990-03-13 | Ikegami Tsushinki Co., Ltd. | Apparatus for mounting chip device on printed circuit board |
US5135098A (en) * | 1987-01-20 | 1992-08-04 | Ikegami Tsushinki Co., Ltd. | Apparatus for mounting chip device on printed circuit board |
US5667129A (en) * | 1994-05-06 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | IC component mounting method and apparatus |
US20070039686A1 (en) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
Also Published As
Publication number | Publication date |
---|---|
EP2056661A2 (en) | 2009-05-06 |
EP2056661B1 (en) | 2014-03-26 |
KR101009534B1 (en) | 2011-01-19 |
US20120110840A1 (en) | 2012-05-10 |
KR20090044984A (en) | 2009-05-07 |
CN101426361A (en) | 2009-05-06 |
US8800139B2 (en) | 2014-08-12 |
EP2056661A3 (en) | 2010-08-04 |
JP2009111312A (en) | 2009-05-21 |
CN101426361B (en) | 2011-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |