US20090294882A1 - Methods and systems for magnetic sensing - Google Patents
Methods and systems for magnetic sensing Download PDFInfo
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- US20090294882A1 US20090294882A1 US12/130,571 US13057108A US2009294882A1 US 20090294882 A1 US20090294882 A1 US 20090294882A1 US 13057108 A US13057108 A US 13057108A US 2009294882 A1 US2009294882 A1 US 2009294882A1
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- magnet body
- integrated circuit
- magnetic
- sensing element
- engagement surface
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
- G01R33/072—Constructional adaptation of the sensor to specific applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Definitions
- magnetic field sensors are used in a wide variety of applications to detect subtle (or drastic) changes in magnetic field.
- FIG. 1 shows a three-dimensional depiction of a Giant Magneto Resistive (GMR) sensor in accordance with one embodiment
- magnetic field lines 114 are perpendicularly guided through the sensing elements 104 , 106 . This is achieved by fashioning the magnetic flux guiding surface 112 to be substantially v-shaped.
- the illustrated magnetic flux guiding surface 112 comprises three planar surfaces on top of the integrated circuit 102 , note that “substantially v-shaped” may also include v-shaped surfaces with any number of planar surfaces, U-shaped surfaces, curved surfaces, and irregularly shaped surfaces, among others.
- the geometry of the magnet body 108 facilitates the sensing elements 104 , 106 switching between a magnetically saturated state (high or low resistance) and a magnetically unsaturated state (neutral resistance) depending on the proximity of an object to be detected and the amplitude of the biasing magnetic field.
- FIGS. 10-16 one can see another embodiment where the magnetic material is molded onto the lead frame, rather than molded onto an integrated circuit.
- the engagement surface 1102 is bent to correspond to a magnetic flux guiding surface desired for a magnet body.
- the engagement surface 1102 of the lead frame is bent into a substantially v-shaped configuration.
- the bendable member 1106 is bent to position the magnet body 1300 underneath the die area 1104 .
- the illustrated embodiment shows the magnet body 1300 being bent underneath the die area 1104 , in other embodiments the geometry of the magnet body could be inverted, and the magnet body 1300 could be bent over the die area.
Abstract
Description
- The present invention relates to methods and systems for magnetic field sensing.
- In many applications, it is useful to detect changes in magnetic field to track translational motion, rotational motion, proximity, speed and the like. Accordingly, magnetic field sensors are used in a wide variety of applications to detect subtle (or drastic) changes in magnetic field.
- Magnetic field sensors are often used in large scale industrial applications, such as in automobiles. For example, magnetic field sensors are often used to detect the angle of a crankshaft or camshaft, and can also be used to measure tire speed rotation and a host of other conditions. Magnetic field sensors are also used in small-scale devices, such as computers. For example, magneto resistive sensors are currently the leading technology used for read heads in computer hard disks. Due to the wide range of applications, improvements in magnetic field sensors are a valuable contribution to the marketplace.
- The following presents a simplified summary of the invention in order to provide a basic understanding of some aspects of the invention. This summary is not an extensive overview of the invention, and is neither intended to identify key or critical elements of the invention nor to delineate the scope of the invention. Rather, the purpose of the summary is to present some concepts of the invention in a simplified form as a prelude to the more detailed description that is presented later.
- One embodiment relates to a method of manufacturing a magnetic sensor. In the method, an engagement surface is provided. A magnet body is formed over the engagement surface by gradually building thickness of a magnetic material. The magnet body has a magnetic flux guiding surface that substantially corresponds to the engagement surface.
- The following description and annexed drawings set forth in detail certain illustrative aspects and implementations of the invention. These are indicative of but a few of the various ways in which the principles of the invention may be employed.
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FIG. 1 shows a three-dimensional depiction of a Giant Magneto Resistive (GMR) sensor in accordance with one embodiment; -
FIG. 2 depicts a cross-sectional view of FIG. 1's Giant Magneto Resistive sensor with magnetic field lines superimposed thereon; -
FIG. 3 shows a cross-sectional view of a magnetic sensor produced by attaching a pre-formed magnet to an integrated circuit package; -
FIG. 4 is a flowchart showing one embodiment of a method for manufacturing a magnetic sensor; -
FIG. 5 is a flowchart showing more detailed embodiment of a method for manufacturing a magnetic sensor; -
FIGS. 6-9 show three dimensional depictions of a magnetic sensor at various stages of manufacture consistent with FIG. 5's flowchart; -
FIG. 10 is a flowchart showing more detailed embodiment of a method for manufacturing a magnetic sensor; -
FIGS. 11-16 show three dimensional depictions of a magnetic sensor at various stages of manufacture consistent with FIG. 10's flowchart; -
FIG. 17 depicts a three-dimensional depiction of a Hall sensor in accordance with one embodiment; and -
FIG. 18 depicts a cross-sectional view of FIG. 17's Hall sensor. - The present invention will now be described with reference to the drawings wherein like reference numerals are used to refer to like elements throughout, and wherein the illustrated structures are not necessarily drawn to scale. Nothing in this detailed description (or drawings included herewith) is admitted as prior art. Several embodiments that relate to magnetic sensors are described herein. The sensors also include a magnet body that is adapted to guide magnetic field lines in a predetermined manner with respect to at least one sensing element. In some embodiments, these and other magnetic sensors are formed by manufacturing methods that provide improved tolerances and higher yields than previously achievable.
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FIGS. 1-2 show an embodiment of a magnetic sensor. In this illustrated embodiment, a magnetoresistive sensor 100 includes anintegrated circuit package 102 that includes a pair ofsensing elements sensing elements sensing elements - To back bias the sensing elements, a
magnet body 108 is formed over anengagement surface 110 of the integratedcircuit package 102. Themagnet body 108 has a magneticflux guiding surface 112 that substantially corresponds to theengagement surface 110. This substantial correspondence allows for accurate alignment of themagnet body 108 relative to thesensing elements flux guiding surface 112 formed directly on theengagement surface 110, in other embodiments one or more intermediate layers could also be formed between thesesurfaces - Due to the geometry of the
magnet body 108,magnetic field lines 114 are perpendicularly guided through thesensing elements flux guiding surface 112 to be substantially v-shaped. Although the illustrated magneticflux guiding surface 112 comprises three planar surfaces on top of the integratedcircuit 102, note that “substantially v-shaped” may also include v-shaped surfaces with any number of planar surfaces, U-shaped surfaces, curved surfaces, and irregularly shaped surfaces, among others. - Because the
sensing elements magnet body 108 facilitates thesensing elements - Although
FIGS. 1-2 show the magnetoresistive sensor 100 with a pair ofsensing elements resistive sensor 100 could include other numbers of sensing elements. For example, in one embodiment, only a single magneto resistive sensing element is included, thereby allowing the magnetoresistive sensor 100 to act as a switch. In another embodiment, the magnetoresistive sensor 100 could include three or more magneto resistive sensing elements, thereby allowing the magnetoresistive sensor 100 to detect translational motion of an object passing by. For example, by using an algorithm, the magnetoresistive sensor 100 could correlate information from the three magneto resistive sensing elements to determine whether the object was moving left-to-right or right-to-left relative to the magnetoresistive sensor 100. - Referring now to
FIG. 3 , one embodiment anothermagnetic sensor 300 and a method of manufacturing this magnetic sensor is discussed. In themagnetic sensor 300, a layer ofepoxy 306 adheres theintegrated circuit package 302 to apre-formed magnet 308. During assembly of themagnetic sensor 300, theintegrated circuit package 302 is first manufactured around the at least onesensing element 304. Next, theepoxy layer 306 is deposited. Finally, thepre-formed magnet 308, which is machined to have a desired geometry, is placed onto theepoxy layer 306. This method of manufacture is one straightforward way of assembling amagnetic sensor 300, and could be used in accordance with some aspects of the present disclosure. - To limit tolerance (or uncertainty Δx) due to mechanical precision or other causes, the
magnetic sensor 300 includes anengagement surface 310 that substantially corresponds to a magneticflux guidance surface 312. Therefore, these substantiallycorresponding surfaces flux guidance surface 312 relative to thesensing elements 304, thereby facilitating perpendicular or other predetermined guidance of magnetic field lines. - As the inventors have further appreciated, in attempting to machine a
pre-formed magnet 308 to a complex geometry, the manufacturer may end up fracturing the magnet, thereby resulting in reduced yields and wasted expenditures. To limit these and other shortcomings, the inventors have devised improved methods of manufacturing magnetic sensors. More specifically, the inventors have devised manufacturing methods where a magnet body is formed by gradually building up a magnetic material over an engagement surface. Thus,FIG. 4 illustrates a somewhat general method of forming amagnetic sensor 400, whileFIGS. 5-9 , andFIGS. 10-16 show moredetailed methods methods - Turning now to
FIG. 4 ,method 400 starts at 402 when a magnet body is formed by molding magnetic material over an engagement surface. In some embodiments, this engagement surface could be an exterior surface on an integrated circuit package (see e.g.,FIGS. 5-9 ) or could be an exterior surface of a lead frame (see e.g.,FIGS. 10-16 ). Next at 404, the magnet body is magnetized. In some embodiments, this magnetization can occur concurrently with the molding of the magnetic material, but in other embodiments can occur after the magnet body has been formed. For example, the magnetization can occur just prior to testing of the sensor. During magnetization, the magnetic field of the magnet body may be aligned to a sensitive axis of the magnetic sensor, so that proper back-biasing occurs when the magnetic sensor is used. After the magnetic sensor is processed according to themethod 400, the magnetic sensor can be tested and packed for shipment to customers. - Referring now to
FIGS. 5-9 , one can see a more detailed embodiment for forming a magneto resistive sensor. As can be seen,FIGS. 6-9 show one implementation of how FIG. 5's method can be implemented. - In
FIG. 6 (502), alead frame 600 is provided. In this example, the leadframe includes afirst terminal 602, asecond terminal 604, and athird terminal 606, as well as a substantiallyplanar die area 608. In other embodiments thelead frame 600 could include any number of terminals, depending on the functionality desired for the circuit. Aremovable tie bar 610, which ties adjacent lead frames together during sensor manufacturing, will be removed after processing so that individual magnetic sensors can be tested and packaged. - In
FIG. 7 (504, 506), adie 700 has been attached to thedie area 608 on thelead frame 600. Thedie 700 includes at least one magnetic sensing element (e.g., a magneto resistive sensing element or a Hall sensing element). In the illustrated example, thedie 700 includes first andsecond sensing elements die 700 could include other numbers of sensing elements. Bonding pads on the die have also been respectively wire bonded to the terminals on the leadframe. - In
FIG. 8 (508), anintegrated circuit package 800 is formed over the die. The package is formed with anengagement surface 802. Thus, in the illustrated embodiment, theengagement surface 802 is a substantially v-shaped surface that includes first and second rampedsurfaces third surface 808. The preferred angle of the v-shape is a product of the sensing element position within the package and the general physical dimensions of the magnet, which provides great incentive for incorporating the desired shape within the package itself. In many embodiments, the first and second rampedsurfaces - In
FIG. 9 (510), amagnet body 900 is formed by molding magnetic material over theengagement surface 802 of theintegrated circuit package 800. Thus, the magnet body is formed by gradually building thickness of the magnetic material, where gradual indicates that the thickness is built up over some (often short) time period. Because themagnet body 900 is molded, themethod 500 does not require machining magnets into complex shapes prior to assembly of the sensor. Thus, molding a magnetic material to theengagement surface 802 eases manufacture compared to other manufacturing methods where magnets are machined and then adhered (glued) to the integrated circuit package. In one embodiment, themagnet body 900 could be formed by injection molding, but other molding processes could also be used. In one embodiment, the magnetic material could include a nylon binder mix impregnated with samarium cobalt (SmCo). The molded magnets however can use any magnetic material or rare Earth element, neodymium (NdFeB) and ferrite are additional examples, and the binder material holding the magnet together can be a variety of thermoplastics like PBT or Nylon 6, 6/6, and 6/12. A thermoset material, like epoxy, could also be used as a binder and moulded to form the magnet package. - Referring now to
FIGS. 10-16 , one can see another embodiment where the magnetic material is molded onto the lead frame, rather than molded onto an integrated circuit. - In
FIG. 11 (1002), alead frame 1100 is again provided. In this embodiment, thelead frame 1100 comprises anengagement surface 1102 and adie area 1104, which are separated from one another by abendable member 1106. Although theillustrated lead frame 1100 includes first andsecond terminals - In
FIG. 12 (1004), theengagement surface 1102 is bent to correspond to a magnetic flux guiding surface desired for a magnet body. Thus, in the illustrated embodiment, theengagement surface 1102 of the lead frame is bent into a substantially v-shaped configuration. - In
FIG. 13 (1006), amagnet body 1300 is formed by gradually building a thickness of magnetic material to theengagement surface 1102. In one embodiment, this could be achieved by injection molding, but could also be accomplished by other processes. - In
FIG. 14 (1008), thebendable member 1106 is bent to position themagnet body 1300 underneath thedie area 1104. Although the illustrated embodiment shows themagnet body 1300 being bent underneath thedie area 1104, in other embodiments the geometry of the magnet body could be inverted, and themagnet body 1300 could be bent over the die area. - In
FIG. 15 (1010), adie 1500 is attached to thedie area 1104 and is electrically coupled to thelead frame 1110, for example by wire bonding. In other embodiments, thedie 1500 could be attached to the underside of the die area. - In
FIG. 16 , anintegrated circuit package 1600 is formed over the die and magnet body. In some embodiments, the integrated circuit package could comprise plastic or ceramic, but could also comprise other materials in other embodiments. - Although various embodiments for manufacturing a magnetic sensor have been discussed and illustrated above in the context of magneto resistive sensors, the manufacturing methods and other concepts are also applicable to other types of magnetic sensors.
FIG. 17-18 show another example of a magnetic sensor implemented as aHall sensor 1700. In this embodiment, theHall sensor 1700 includes anintegrated circuit package 1702 that includes a singleHall sensing element 1704. To back-bias theHall sensing element 1704, amagnet body 1706 is formed over anengagement surface 1708 of theintegrated circuit package 1702. Again, themagnet body 1706 has a magneticflux guiding surface 1710 that substantially corresponds to theengagement surface 1708 of theintegrated circuit package 1702. Although not shown, intermediate layers could also be formed between theseengagement surfaces - The
magnet body 1706 can be characterized by aconical recess 1712 that is positioned over theHall sensing element 1704. Thus, themagnet body 1706 includes tapered sidewalls 1714. These tapered sidewalls 1714 establish a larger width wL near theengagement surface 1710 and smaller width, wS, associated with a face opposite theengagement surface 1710. In the absence of an object to be detected, this geometry is designed to establish an approximately zero magnetic field condition in theHall sensing element 1704. Consequently, when an object to be detected comes in close proximity to theHall sensor 1700, the magnetic field extends through the area previously void of field and acts on or saturates theHall sensing element 1704. - As will be understood by a person of ordinary skill in the art, this
Hall sensor 1700 could also be manufactured by forming magnetic material on an engagement surface of an integrated circuit package or lead frame. In some embodiments, this manufacturing could be analogous to the previously discussed manufacturing methods. - Further, although some examples of integrated circuit packages are illustrated and discussed above, these examples are not limiting. The concept of forming a magnetic material on an integrated circuit package can also be applied to other types of integrated circuit package, including but not limited to: Ball Grid Arrays, Quad Flat Packs, Pin Grid Arrays, Ceramic Quad Flat Packs, Single Lead-Less Chip Carriers, Dual Lead-Less Chip Carriers, J-Leaded Chip Carriers, and Low-Profile, among others.
- In regard to the various functions performed by the above described components or structures (blocks, units, assemblies, devices, circuits, systems, etc.), the terms (including a reference to a “means”) used to describe such components are intended to correspond, unless otherwise indicated, to any component or structure which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the invention. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms “including”, “includes”, “having”, “has”, “with”, or variants thereof are used in either the detailed description and the claims, such terms are intended to be inclusive in a manner similar to the term “comprising”.
Claims (37)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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US12/130,571 US8058870B2 (en) | 2008-05-30 | 2008-05-30 | Methods and systems for magnetic sensing |
DE102009023106A DE102009023106B4 (en) | 2008-05-30 | 2009-05-28 | Method and system for magnetic detection |
US12/885,349 US8610430B2 (en) | 2008-05-30 | 2010-09-17 | Bias field generation for a magneto sensor |
US13/049,926 US20110187359A1 (en) | 2008-05-30 | 2011-03-17 | Bias field generation for a magneto sensor |
US14/093,567 US9297669B2 (en) | 2008-05-30 | 2013-12-02 | Bias field generation for a magneto sensor |
US15/056,284 US9678170B2 (en) | 2008-05-30 | 2016-02-29 | Bias field generation for a magneto sensor |
US15/595,136 US10310026B2 (en) | 2008-05-30 | 2017-05-15 | Bias field generation for a magneto sensor |
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US12/130,571 US8058870B2 (en) | 2008-05-30 | 2008-05-30 | Methods and systems for magnetic sensing |
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US12/885,349 Continuation-In-Part US8610430B2 (en) | 2008-05-30 | 2010-09-17 | Bias field generation for a magneto sensor |
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US8058870B2 US8058870B2 (en) | 2011-11-15 |
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Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4188605A (en) * | 1978-07-21 | 1980-02-12 | Stout Glenn M | Encapsulated Hall effect device |
US4496303A (en) * | 1982-05-27 | 1985-01-29 | Xolox Corporation | Method of fabricating a permanent magnet |
US4785242A (en) * | 1986-12-15 | 1988-11-15 | Sundstrand Corporation | Position detecting apparatus using multiple magnetic sensors for determining relative and absolute angular position |
US5210489A (en) * | 1990-06-26 | 1993-05-11 | U.S. Philips Corporation | Arrangement with field correcting structure producing a homogeneous magnetic field at a sensor zone for detecting movement of a ferromagnetic element |
US5260653A (en) * | 1992-06-03 | 1993-11-09 | Eastman Kodak Company | Thin film very high sensitivity magnetoresistive magnetometer having temperature compensation and simple domain stability |
US5781005A (en) * | 1995-06-07 | 1998-07-14 | Allegro Microsystems, Inc. | Hall-effect ferromagnetic-article-proximity sensor |
US5801529A (en) * | 1996-06-10 | 1998-09-01 | Mitsubishi Denki Kabushiki Kaisha | Magnetoresistance sensing device without hystersis influence |
US5888416A (en) * | 1992-05-12 | 1999-03-30 | Seiko Epson Corporation | Rare-earth bonded magnet composition, rare-earth bonded magnet and process for producing said rare-earth bonded magnet |
US5963028A (en) * | 1997-08-19 | 1999-10-05 | Allegro Microsystems, Inc. | Package for a magnetic field sensing device |
US6107793A (en) * | 1997-02-10 | 2000-08-22 | Mitsubishi Denki Kabushiki Kaisha | Magnetic sensing device unaffected by positioning error of magnetic field sensing elements |
US6169396B1 (en) * | 1997-02-19 | 2001-01-02 | Mitsubishi Denki Kabushiki Kaisha | Sensing device for detecting change in an applied magnetic field achieving high accuracy by improved configuration |
US6278270B1 (en) * | 1999-10-29 | 2001-08-21 | Xerox Corporation | Apparatus and method for detecting small distance changes between opposed surfaces using giant magneto resistance effect sensor |
US6400143B1 (en) * | 1997-09-26 | 2002-06-04 | The Torrington Company | Digital sensor of relative position |
US20030222642A1 (en) * | 2002-03-07 | 2003-12-04 | Stefan Butzmann | Arrangement for determining the position of a motion sensor element |
US20040174164A1 (en) * | 2003-03-03 | 2004-09-09 | Denso Corporation | Magnetic sensor and method for fabricating the same |
US6891368B2 (en) * | 2002-04-19 | 2005-05-10 | Mitsubishi Denki Kabushiki Kaisha | Magnetoresistive sensor device |
US20050146323A1 (en) * | 2003-12-19 | 2005-07-07 | Ti Automotive (Neuss) Gmbh | Sensor element |
US20050146052A1 (en) * | 2000-01-31 | 2005-07-07 | Sanyo Electric Co., Ltd., An Osaka, Japan Corporation | Semiconductor device and semiconductor module |
US6949386B2 (en) * | 2001-06-12 | 2005-09-27 | Asulab S.A. | Method for mass production of a plurality of magnetic sensors |
US20060164388A1 (en) * | 2005-01-26 | 2006-07-27 | Fujitsu Component Limited | Input device |
US7112955B2 (en) * | 2001-08-23 | 2006-09-26 | Koninklijke Philips Electronics N.V. | Magnetic sensing device including a magnetoresistive sensor and a supporting magnet |
US20060261801A1 (en) * | 2005-05-20 | 2006-11-23 | Honeywell International Inc. | Magnetoresistive sensor |
US20070001664A1 (en) * | 2004-03-06 | 2007-01-04 | Ronald Steinbrink | Movement sensor and method for producing a movement sensor |
US20070063693A1 (en) * | 2003-09-26 | 2007-03-22 | Siemens Aktiengesellschaft | Magnetic field sensor |
US20070075705A1 (en) * | 2005-09-30 | 2007-04-05 | Denso Corporation | Detector having sensor chip and biasing magnet |
US20070145972A1 (en) * | 2005-06-15 | 2007-06-28 | Albert Auburger | Integrated magnetic sensor component |
US20080116884A1 (en) * | 2004-03-11 | 2008-05-22 | Rasmus Rettig | Magnet Sensor Arrangement |
US7382122B2 (en) * | 2003-08-19 | 2008-06-03 | Kabushiki Kaisha Minerva | Magnetic sensor |
US7548060B2 (en) * | 2004-03-11 | 2009-06-16 | Robert Bosch Gmbh | Magnetic sensor system |
US20090243595A1 (en) * | 2008-03-27 | 2009-10-01 | Horst Theuss | Sensor module with mold encapsulation for applying a bias magnetic field |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60223095A (en) * | 1984-04-19 | 1985-11-07 | Hitachi Metals Ltd | Magnet for field system |
JPS6384176A (en) | 1986-09-29 | 1988-04-14 | Toshiba Corp | Magnetic focusing type hall element and manufacture thereof |
US4926122A (en) | 1988-08-08 | 1990-05-15 | General Motors Corporation | High sensitivity magnetic circuit |
US5936400A (en) | 1996-12-23 | 1999-08-10 | Federal Products Co. | Magnetoresistive displacement sensor and variable resistor using a moving domain wall |
JPH1187797A (en) | 1997-09-10 | 1999-03-30 | Hitachi Cable Ltd | Hall element |
JP4193278B2 (en) | 1999-04-01 | 2008-12-10 | 株式会社デンソー | Method for manufacturing magnetic detection device |
JP4465735B2 (en) | 1999-04-15 | 2010-05-19 | 株式会社デンソー | Method for manufacturing magnetic detection device |
DE10123513A1 (en) | 2001-05-15 | 2003-03-20 | Dieter Schoedlbauer | Magnetic control unit for a magneto-resistive rotation angle sensor, e.g. for use in motor vehicle sensor technology, has an improved method of manufacture that is economical while providing acceptable tolerances |
JP4131183B2 (en) | 2003-03-25 | 2008-08-13 | 株式会社デンソー | Method for manufacturing magnetic detection device |
EP1662520A4 (en) | 2003-09-05 | 2011-05-25 | Panasonic Corp | Magnetic bias film and magnetic sensor using the same |
EP1720027B1 (en) | 2004-02-19 | 2010-11-17 | Mitsubishi Electric Corporation | Magnetic field detector and current detection device, position detection device and rotation detection device using the magnetic field detector |
WO2005083457A1 (en) | 2004-02-27 | 2005-09-09 | Murata Manufacturing Co., Ltd. | Prolonged magnetic sensor |
DE102004063539A1 (en) | 2004-03-11 | 2005-09-29 | Robert Bosch Gmbh | Magnet sensor for use in gradiometer has two magnetic field sensors on plate bridging V-shaped groove in permanent magnet, arranged so that offset of sensor output is minimized |
-
2008
- 2008-05-30 US US12/130,571 patent/US8058870B2/en not_active Expired - Fee Related
-
2009
- 2009-05-28 DE DE102009023106A patent/DE102009023106B4/en not_active Expired - Fee Related
Patent Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4188605A (en) * | 1978-07-21 | 1980-02-12 | Stout Glenn M | Encapsulated Hall effect device |
US4496303A (en) * | 1982-05-27 | 1985-01-29 | Xolox Corporation | Method of fabricating a permanent magnet |
US4785242A (en) * | 1986-12-15 | 1988-11-15 | Sundstrand Corporation | Position detecting apparatus using multiple magnetic sensors for determining relative and absolute angular position |
US5210489A (en) * | 1990-06-26 | 1993-05-11 | U.S. Philips Corporation | Arrangement with field correcting structure producing a homogeneous magnetic field at a sensor zone for detecting movement of a ferromagnetic element |
US5888416A (en) * | 1992-05-12 | 1999-03-30 | Seiko Epson Corporation | Rare-earth bonded magnet composition, rare-earth bonded magnet and process for producing said rare-earth bonded magnet |
US5260653A (en) * | 1992-06-03 | 1993-11-09 | Eastman Kodak Company | Thin film very high sensitivity magnetoresistive magnetometer having temperature compensation and simple domain stability |
US5781005A (en) * | 1995-06-07 | 1998-07-14 | Allegro Microsystems, Inc. | Hall-effect ferromagnetic-article-proximity sensor |
US5801529A (en) * | 1996-06-10 | 1998-09-01 | Mitsubishi Denki Kabushiki Kaisha | Magnetoresistance sensing device without hystersis influence |
US6107793A (en) * | 1997-02-10 | 2000-08-22 | Mitsubishi Denki Kabushiki Kaisha | Magnetic sensing device unaffected by positioning error of magnetic field sensing elements |
US6169396B1 (en) * | 1997-02-19 | 2001-01-02 | Mitsubishi Denki Kabushiki Kaisha | Sensing device for detecting change in an applied magnetic field achieving high accuracy by improved configuration |
US5963028A (en) * | 1997-08-19 | 1999-10-05 | Allegro Microsystems, Inc. | Package for a magnetic field sensing device |
US6265865B1 (en) * | 1997-08-19 | 2001-07-24 | Allegro Microsystems, Inc. | Single unitary plastic package for a magnetic field sensing device |
US6400143B1 (en) * | 1997-09-26 | 2002-06-04 | The Torrington Company | Digital sensor of relative position |
US6278270B1 (en) * | 1999-10-29 | 2001-08-21 | Xerox Corporation | Apparatus and method for detecting small distance changes between opposed surfaces using giant magneto resistance effect sensor |
US20050146052A1 (en) * | 2000-01-31 | 2005-07-07 | Sanyo Electric Co., Ltd., An Osaka, Japan Corporation | Semiconductor device and semiconductor module |
US6949386B2 (en) * | 2001-06-12 | 2005-09-27 | Asulab S.A. | Method for mass production of a plurality of magnetic sensors |
US7112955B2 (en) * | 2001-08-23 | 2006-09-26 | Koninklijke Philips Electronics N.V. | Magnetic sensing device including a magnetoresistive sensor and a supporting magnet |
US20030222642A1 (en) * | 2002-03-07 | 2003-12-04 | Stefan Butzmann | Arrangement for determining the position of a motion sensor element |
US6891368B2 (en) * | 2002-04-19 | 2005-05-10 | Mitsubishi Denki Kabushiki Kaisha | Magnetoresistive sensor device |
US20070018642A1 (en) * | 2003-03-03 | 2007-01-25 | Denso Corporation | Magnetic sensor |
US20040174164A1 (en) * | 2003-03-03 | 2004-09-09 | Denso Corporation | Magnetic sensor and method for fabricating the same |
US7250760B2 (en) * | 2003-03-03 | 2007-07-31 | Denso Corporation | Magnetic sensor |
US7382122B2 (en) * | 2003-08-19 | 2008-06-03 | Kabushiki Kaisha Minerva | Magnetic sensor |
US20070063693A1 (en) * | 2003-09-26 | 2007-03-22 | Siemens Aktiengesellschaft | Magnetic field sensor |
US20050146323A1 (en) * | 2003-12-19 | 2005-07-07 | Ti Automotive (Neuss) Gmbh | Sensor element |
US20070001664A1 (en) * | 2004-03-06 | 2007-01-04 | Ronald Steinbrink | Movement sensor and method for producing a movement sensor |
US20080116884A1 (en) * | 2004-03-11 | 2008-05-22 | Rasmus Rettig | Magnet Sensor Arrangement |
US7548060B2 (en) * | 2004-03-11 | 2009-06-16 | Robert Bosch Gmbh | Magnetic sensor system |
US20060164388A1 (en) * | 2005-01-26 | 2006-07-27 | Fujitsu Component Limited | Input device |
US20060261801A1 (en) * | 2005-05-20 | 2006-11-23 | Honeywell International Inc. | Magnetoresistive sensor |
US20070145972A1 (en) * | 2005-06-15 | 2007-06-28 | Albert Auburger | Integrated magnetic sensor component |
US20070075705A1 (en) * | 2005-09-30 | 2007-04-05 | Denso Corporation | Detector having sensor chip and biasing magnet |
US20090243595A1 (en) * | 2008-03-27 | 2009-10-01 | Horst Theuss | Sensor module with mold encapsulation for applying a bias magnetic field |
Cited By (37)
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US9733279B2 (en) | 2008-12-18 | 2017-08-15 | Infineon Technologies Ag | Magnetic field current sensors |
US9222992B2 (en) | 2008-12-18 | 2015-12-29 | Infineon Technologies Ag | Magnetic field current sensors |
US9865802B2 (en) | 2010-02-24 | 2018-01-09 | Infineon Technologies Ag | Current sensors and methods |
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US8760149B2 (en) | 2010-04-08 | 2014-06-24 | Infineon Technologies Ag | Magnetic field current sensors |
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US8680843B2 (en) | 2010-06-10 | 2014-03-25 | Infineon Technologies Ag | Magnetic field current sensors |
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DE102009023106A1 (en) | 2009-12-17 |
US8058870B2 (en) | 2011-11-15 |
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