US20090321130A1 - Enclosure With Integrated Heat Wick - Google Patents
Enclosure With Integrated Heat Wick Download PDFInfo
- Publication number
- US20090321130A1 US20090321130A1 US12/163,271 US16327108A US2009321130A1 US 20090321130 A1 US20090321130 A1 US 20090321130A1 US 16327108 A US16327108 A US 16327108A US 2009321130 A1 US2009321130 A1 US 2009321130A1
- Authority
- US
- United States
- Prior art keywords
- heat
- layer
- electrical
- ventless
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/025—Constructional details relating to cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
Definitions
- This invention is directed generally to electrical systems, and, more particularly, to a ventless enclosure for dissipating heat from an electrical system.
- Electrical systems in residential, commercial, and industrial applications often include electrical equipment having at least one heat-generating component, e.g., an electrical generator or an electrical transformer.
- the electrical equipment is located within an electrical enclosure, which serves numerous functions.
- the electrical enclosure can reduce the likelihood of contact with high-voltage wiring (e.g., reduces risk of electrocution), can improve electrical performance in challenging (e.g., dirty or dusty) environments by reducing contact between contaminants and the electrical equipment, can protect the electrical equipment from physical damage, etc.
- the electrical enclosure To adequately perform its functions, it is generally desired for the electrical enclosure to be a ventless (or non-vented) enclosure, e.g., an enclosure that does not have any vents or openings.
- the presence of vents can create many problems, such as increasing the risk of electrocution and decreasing electrical performance, e.g., by allowing ingress of liquids, humidity, dust, dirt, corrosives, etc.
- ventless enclosures are often required by environmental and/or governmental regulations in many electrical applications.
- ventless enclosures One problem associated with ventless enclosures is that heat can build-up inside the enclosure without having an efficient heat path for transfer outside the enclosure.
- the inherent lack of physical openings in the ventless enclosure effectively traps the generated heat inside the enclosure.
- the heat build-up can have adverse consequences for the electrical equipment located inside the ventless enclosure (e.g., can cause malfunctions, increase risk of fire hazards, etc.).
- an electrical enclosure system with heat generating components is housed within a ventless enclosure that incorporates an enclosure (or housing).
- the ventless enclosure includes a support structure integrated with a heat-wicking or heat conducting matrix (possibly polymer based) that transfers heat out of the system while protecting the electrical system components from environmental contaminants.
- the ventless housing fully encloses the electrical device and includes a base layer (i.e., the support structure) forming an impact-resistant portion of the ventless housing.
- the base layer includes one or more open areas in close proximity to the heat-generating part.
- the ventless housing further includes an integrated thermally conductive layer (i.e., the heat-wicking matrix) that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment.
- the integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer fill in the open areas of the base layer.
- an electrical enclosure system for efficient heat dissipation includes an electrical heat-generating device having at least one hot portion, the hot portion generating more heat than at least one other portion of the heat-generating device.
- the electrical system further includes a ventless housing for enclosing the electrical heat-generating device.
- the ventless housing includes a first layer forming a structural portion of the ventless housing, the first layer including at least one gap near the hot portion of the electrical heat-generating device.
- the ventless housing further includes a second layer forming a heat-flow path of the ventless housing, the second layer filling-in the gap of the first layer and being adapted to conduct more heat than the first layer from the hot portion to an environment exterior of the ventless housing.
- FIG. 1 is a cross-sectional side view illustration of a ventless electrical enclosure having an integrated heat wick, according to one embodiment.
- FIG. 2 is a cross-sectional perspective view illustration of a polymer-based ventless electrical enclosure having a molded thermally conductive layer, according to another embodiment.
- FIG. 3 is a cross-sectional perspective view illustration of a metal-based ventless electrical enclosure having a higher thermally conductive component, according to yet another embodiment.
- a ventless housing 100 encloses (fully or in part) an electrical heat-generating device 102 , which may be optionally located on a supporting structure 104 .
- the ventless housing 100 can efficiently dissipate heat build-up from inside the ventless housing 100 to an exterior environment by using a heat wick 106 .
- the heat wick 106 has an internal member 108 , located near the heat-generating device 102 , and an external member 110 .
- the ventless housing 100 can be used in various electrical applications in which electrical equipment is required, such as a communication hub, an electric generator, an electric meter, an electric monitor, a transformer, etc.
- the shape of the ventless housing 100 can vary, for example, having a rectangular, circular, or other shapes.
- the method of fabrication for the ventless housing 100 can also vary, for example, including a molding method, a fabricated method, and an extruded method.
- the material of the ventless housing 100 can vary, for example, including a polymer material and a sheet metal material.
- one or more electrical heat-generating devices 102 cause heat to build up inside the ventless housing 100 .
- the ventless housing 100 by definition, lacks any physical vents or openings, the heat remains generally trapped inside the ventless housing 100 , without having any adequate paths for being transferred outside the ventless housing 100 .
- the heat build-up presents many problems, e.g., increasing the risk of fire hazard, decreasing longevity of any internal components (including the heat-generating device 102 ), and interfering with the proper functioning of the internal components.
- the heat wick 106 is provided to create a heat-flow path to transfer heat from inside the ventless housing 100 to an exterior environment.
- the heat wick 106 is designed to provide a higher thermal conductivity than the rest of the ventless housing 100 .
- the heat wick 106 can be made from a material that has a higher thermal conductivity than a base material of the ventless housing 100 .
- the generated heat is channeled through the internal member 108 of the heat wick 106 and conducted outside the ventless housing 100 , exiting through an external member 110 (e.g., a plurality of fins).
- a ventless housing 200 encloses an electric generator 202 that is supported on a stand 204 .
- the ventless housing 200 is positioned on a bottom structure 205 .
- the ventless housing 200 includes a base layer 206 that forms an impact-resistant portion, a first integrated thermally conductive layer 208 , and a second integrated thermally conductive layer 214 , each of which forming a heat-flow path for conducting heat away from the electric generator 202 .
- the first conductive layer 208 and the second conductive layer 214 can be a single continuous conductive layer.
- the base layer 206 includes a top surface 206 a , a left side surface 206 b , a right side surface 206 c , and a bottom surface 206 d . In alternative embodiments, only one of the bottom surface 206 d or the bottom structure 205 is present.
- the base layer 206 is made from a polymer-based material and is the main material of the ventless housing 200 . Additionally, each of the left side surface 206 b and the right side surface 206 c include a gap filled by the respective conductive layers 208 , 214 .
- the first conductive layer 208 is molded around the base layer 206 through a process commonly referred to as “overmolding” or “insert molding,” where one material is molded around the other while leaving desired portions of each exposed. Specifically, the conductive layer 208 is molded such that it fills in any open areas in the base layer 206 .
- the second conductive layer 214 can be similar, if not identical, to the first conductive layer 208 .
- the molding of the base layer 206 around the conductive layers 204 , 214 results in a “water-tight” union of the layers that provides an impact resistant enclosure with an integrated thermally conductive feature that serves as the heat flow path from the hot part (or parts) inside the enclosure to the external ambient air.
- the first conductive layer 208 includes a first internal surface 210 and a first external surface 212 .
- the second conductive layer 214 includes a second internal surface 216 and a second external surface 218 .
- Each of the first and second internal surfaces 210 , 216 is in direct contact with the electric generator 202 to conduct generated heat away from the electric generator 202 towards the corresponding external surfaces 212 , 218 .
- the internal surfaces 210 , 216 are not in direct contact with the electric generator 202 . Instead they are separated by a gap, and are located in close proximity to the electric generator 202 .
- a heat transfer aid 220 can be used to further enhance the transfer of heat subsequently to the external ambient air.
- Some examples of heat transfer aids 220 include pastes, adhesives, etc.
- a ventless housing 300 encloses an electrical component 302 , which is optionally supported by a stand 304 .
- the ventless housing 300 is optionally positioned on a bottom structure 305 .
- the ventless housing 300 includes a sheet metal-based outer enclosure 306 that has a top side 306 a , a left side 306 b , a right side 306 c , and a bottom side 306 d .
- the top side 306 a has an opening 307 that is generally centrally located and rectangular in shape.
- the opening 307 can be located anywhere and have any shape.
- the outer enclosure 306 can be fabricated, for example, by stamping, laser cutting, forming, welding, or piercing methods, or it can be extruded.
- the ventless housing 300 further includes localized heat dissipation components, which may be independently fabricated as internal or external “liners.”
- the localized heat dissipation components can be a top plate 308 , a left plate 318 , and a right plate 328 .
- These localized heat dissipation components act to efficiently dissipate the trapped heat inside the ventless housing 300 by increasing surface area of the heat dissipation components. Any combination of such components can be used.
- the top plate 308 includes a base plate 310 , a plurality of external fins 312 , and a plurality of screws 314 (which are generally inserted through corresponding screw holes).
- the top plate 308 is designed to have a higher thermal conductivity than the outer enclosure 306 .
- the base plate 310 is much thinner than the top side 306 a , and, additionally, the external fins 312 enhance the heat transfer through the top plate 308 .
- the top plate 308 is positioned such that, when assembled, it covers the opening 307 .
- screws 314 are inserted through enclosure holes 316 to fix the top plate 308 externally to the top side 306 a of the outer enclosure 306 .
- the left plate 318 having a plurality of external fins 320 , is generally located (when assembled) on the left side 306 b of the outer enclosure 306 .
- the left plate 318 is external to the outer enclosure 306 and is designed to cover a plurality of holes 321 (which can form a particular perforation pattern) of the left side 306 b . Any type of holes, slots, or perforation patterns can be used in addition to or instead of the holes 321 (or of the opening 307 ).
- the left plate 318 is inserted into receiving slots 322 , 324 until it rests against a stop 326 .
- the left plate 318 can have, for example, a smaller thickness than the left side 306 b , and can be made from a material that has a greater coefficient of thermal conductivity than the material of the outer enclosure 306 .
- one or more of the left plate 318 and the top plate 308 can be fixed to the outer enclosure 306 as internal components.
- the right plate 328 is attached internally to the outer enclosure 306 , on the right side 306 c .
- a plurality of fins 330 which are internally located, help to conduct heat generated by the electrical component 302 outside of the outer enclosure 306 , to ambient air.
- the right plate 328 is integrated to the outer enclosure 306 using an adhesive. Alternatively, the right plate 328 can be fixed to the outer enclosure 306 as an external component.
- any type of adhesives or fasteners can be used to provide integrated retention features for fixing any of the top plate 308 , the left plate 318 , or the right plate 328 to the outer enclosure 306 .
- any combination of fins and smooth surfaces can be included in any of the top plate 308 , the left plate 318 , or the right plate 328 to further enhance the heat conductivity towards the external environment.
- any other type of surface can be used to increase heat absorption, e.g., bumps.
Abstract
Description
- This invention is directed generally to electrical systems, and, more particularly, to a ventless enclosure for dissipating heat from an electrical system.
- Electrical systems in residential, commercial, and industrial applications often include electrical equipment having at least one heat-generating component, e.g., an electrical generator or an electrical transformer. Often, for various reasons, the electrical equipment is located within an electrical enclosure, which serves numerous functions. For example, the electrical enclosure can reduce the likelihood of contact with high-voltage wiring (e.g., reduces risk of electrocution), can improve electrical performance in challenging (e.g., dirty or dusty) environments by reducing contact between contaminants and the electrical equipment, can protect the electrical equipment from physical damage, etc.
- To adequately perform its functions, it is generally desired for the electrical enclosure to be a ventless (or non-vented) enclosure, e.g., an enclosure that does not have any vents or openings. The presence of vents can create many problems, such as increasing the risk of electrocution and decreasing electrical performance, e.g., by allowing ingress of liquids, humidity, dust, dirt, corrosives, etc. In fact, ventless enclosures are often required by environmental and/or governmental regulations in many electrical applications.
- One problem associated with ventless enclosures is that heat can build-up inside the enclosure without having an efficient heat path for transfer outside the enclosure. The inherent lack of physical openings in the ventless enclosure effectively traps the generated heat inside the enclosure. The heat build-up can have adverse consequences for the electrical equipment located inside the ventless enclosure (e.g., can cause malfunctions, increase risk of fire hazards, etc.).
- What is needed, therefore, is a ventless enclosure for an electrical system that addresses the above-stated and other problems.
- In an implementation of the present invention, an electrical enclosure system with heat generating components is housed within a ventless enclosure that incorporates an enclosure (or housing). The ventless enclosure includes a support structure integrated with a heat-wicking or heat conducting matrix (possibly polymer based) that transfers heat out of the system while protecting the electrical system components from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer (i.e., the support structure) forming an impact-resistant portion of the ventless housing. The base layer includes one or more open areas in close proximity to the heat-generating part. The ventless housing further includes an integrated thermally conductive layer (i.e., the heat-wicking matrix) that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment. The integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer fill in the open areas of the base layer.
- In an alternative implementation of the present invention, an electrical enclosure system includes an electrical device having a heat-generating component and a ventless housing. The ventless housing fully encloses the electrical device and the heat-generating component, and protects the heat-generating component from contaminants. The ventless housing includes an outer enclosure layer having a plurality of openings near the heat-generating component, and an internal enclosure layer having a higher thermal conductivity than the outer enclosure layer. The internal component is coupled to the outer enclosure layer and is positioned to cover the plurality of openings such that heat is conducted through the internal component from the heat-generating component to an exterior environment relative to the ventless housing.
- In another alternative implementation of the present invention, an electrical enclosure system for efficient heat dissipation includes an electrical heat-generating device having at least one hot portion, the hot portion generating more heat than at least one other portion of the heat-generating device. The electrical system further includes a ventless housing for enclosing the electrical heat-generating device. The ventless housing includes a first layer forming a structural portion of the ventless housing, the first layer including at least one gap near the hot portion of the electrical heat-generating device. The ventless housing further includes a second layer forming a heat-flow path of the ventless housing, the second layer filling-in the gap of the first layer and being adapted to conduct more heat than the first layer from the hot portion to an environment exterior of the ventless housing.
- Additional aspects of the invention will be apparent to those of ordinary skill in the art in view of the detailed description of various embodiments, which is made with reference to the drawings, a brief description of which is provided below.
- The invention may best be understood by reference to the following description taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a cross-sectional side view illustration of a ventless electrical enclosure having an integrated heat wick, according to one embodiment. -
FIG. 2 is a cross-sectional perspective view illustration of a polymer-based ventless electrical enclosure having a molded thermally conductive layer, according to another embodiment. -
FIG. 3 is a cross-sectional perspective view illustration of a metal-based ventless electrical enclosure having a higher thermally conductive component, according to yet another embodiment. - Although the invention will be described in connection with certain preferred embodiments, it will be understood that the invention is not limited to those particular embodiments. On the contrary, the invention is intended to include all alternatives, modifications and equivalent arrangements as may be included within the spirit and scope of the invention as defined by the appended claims.
- Referring to
FIG. 1 , aventless housing 100 encloses (fully or in part) an electrical heat-generatingdevice 102, which may be optionally located on a supportingstructure 104. Theventless housing 100 can efficiently dissipate heat build-up from inside theventless housing 100 to an exterior environment by using aheat wick 106. Theheat wick 106 has aninternal member 108, located near the heat-generatingdevice 102, and anexternal member 110. - The
ventless housing 100 can be used in various electrical applications in which electrical equipment is required, such as a communication hub, an electric generator, an electric meter, an electric monitor, a transformer, etc. The shape of theventless housing 100 can vary, for example, having a rectangular, circular, or other shapes. The method of fabrication for theventless housing 100 can also vary, for example, including a molding method, a fabricated method, and an extruded method. The material of theventless housing 100 can vary, for example, including a polymer material and a sheet metal material. - In general, one or more electrical heat-generating devices 102 (e.g., an electric generator) cause heat to build up inside the
ventless housing 100. Because theventless housing 100, by definition, lacks any physical vents or openings, the heat remains generally trapped inside theventless housing 100, without having any adequate paths for being transferred outside theventless housing 100. The heat build-up presents many problems, e.g., increasing the risk of fire hazard, decreasing longevity of any internal components (including the heat-generating device 102), and interfering with the proper functioning of the internal components. - As such, the
heat wick 106 is provided to create a heat-flow path to transfer heat from inside theventless housing 100 to an exterior environment. Theheat wick 106 is designed to provide a higher thermal conductivity than the rest of theventless housing 100. For example, theheat wick 106 can be made from a material that has a higher thermal conductivity than a base material of theventless housing 100. The generated heat is channeled through theinternal member 108 of theheat wick 106 and conducted outside theventless housing 100, exiting through an external member 110 (e.g., a plurality of fins). - Referring to
FIG. 2 , aventless housing 200 encloses anelectric generator 202 that is supported on astand 204. Theventless housing 200 is positioned on abottom structure 205. Theventless housing 200 includes abase layer 206 that forms an impact-resistant portion, a first integrated thermallyconductive layer 208, and a second integrated thermallyconductive layer 214, each of which forming a heat-flow path for conducting heat away from theelectric generator 202. Optionally, the firstconductive layer 208 and the secondconductive layer 214 can be a single continuous conductive layer. - The
base layer 206 includes a top surface 206 a, aleft side surface 206 b, aright side surface 206 c, and abottom surface 206 d. In alternative embodiments, only one of thebottom surface 206 d or thebottom structure 205 is present. Thebase layer 206 is made from a polymer-based material and is the main material of theventless housing 200. Additionally, each of theleft side surface 206 b and theright side surface 206 c include a gap filled by the respectiveconductive layers - The first
conductive layer 208 is molded around thebase layer 206 through a process commonly referred to as “overmolding” or “insert molding,” where one material is molded around the other while leaving desired portions of each exposed. Specifically, theconductive layer 208 is molded such that it fills in any open areas in thebase layer 206. The secondconductive layer 214 can be similar, if not identical, to the firstconductive layer 208. The molding of thebase layer 206 around theconductive layers - The first
conductive layer 208 includes a firstinternal surface 210 and a firstexternal surface 212. Similarly, the secondconductive layer 214 includes a secondinternal surface 216 and a secondexternal surface 218. Each of the first and secondinternal surfaces electric generator 202 to conduct generated heat away from theelectric generator 202 towards the correspondingexternal surfaces internal surfaces electric generator 202. Instead they are separated by a gap, and are located in close proximity to theelectric generator 202. - Optionally, in alternative embodiments, a
heat transfer aid 220 can be used to further enhance the transfer of heat subsequently to the external ambient air. Some examples of heat transfer aids 220 include pastes, adhesives, etc. - Referring to
FIG. 3 , aventless housing 300 encloses anelectrical component 302, which is optionally supported by astand 304. Theventless housing 300 is optionally positioned on abottom structure 305. According to this embodiment, theventless housing 300 includes a sheet metal-basedouter enclosure 306 that has atop side 306 a, aleft side 306 b, aright side 306 c, and abottom side 306 d. Thetop side 306 a has anopening 307 that is generally centrally located and rectangular in shape. Optionally, theopening 307 can be located anywhere and have any shape. Theouter enclosure 306 can be fabricated, for example, by stamping, laser cutting, forming, welding, or piercing methods, or it can be extruded. - To create an efficient heat-flow path, the
ventless housing 300 further includes localized heat dissipation components, which may be independently fabricated as internal or external “liners.” For example, the localized heat dissipation components can be atop plate 308, aleft plate 318, and aright plate 328. These localized heat dissipation components act to efficiently dissipate the trapped heat inside theventless housing 300 by increasing surface area of the heat dissipation components. Any combination of such components can be used. - The
top plate 308 includes abase plate 310, a plurality ofexternal fins 312, and a plurality of screws 314 (which are generally inserted through corresponding screw holes). Thetop plate 308 is designed to have a higher thermal conductivity than theouter enclosure 306. In this example, thebase plate 310 is much thinner than thetop side 306 a, and, additionally, theexternal fins 312 enhance the heat transfer through thetop plate 308. Thetop plate 308 is positioned such that, when assembled, it covers theopening 307. Specifically, screws 314 are inserted throughenclosure holes 316 to fix thetop plate 308 externally to thetop side 306 a of theouter enclosure 306. - The
left plate 318, having a plurality ofexternal fins 320, is generally located (when assembled) on theleft side 306 b of theouter enclosure 306. Theleft plate 318 is external to theouter enclosure 306 and is designed to cover a plurality of holes 321 (which can form a particular perforation pattern) of theleft side 306 b. Any type of holes, slots, or perforation patterns can be used in addition to or instead of the holes 321 (or of the opening 307). - To fix the
left plate 318 to theouter enclosure 306, theleft plate 318 is inserted into receivingslots stop 326. Similar to thetop plate 308, theleft plate 318 can have, for example, a smaller thickness than theleft side 306 b, and can be made from a material that has a greater coefficient of thermal conductivity than the material of theouter enclosure 306. Alternatively, one or more of theleft plate 318 and thetop plate 308 can be fixed to theouter enclosure 306 as internal components. - The
right plate 328 is attached internally to theouter enclosure 306, on theright side 306 c. A plurality offins 330, which are internally located, help to conduct heat generated by theelectrical component 302 outside of theouter enclosure 306, to ambient air. Theright plate 328 is integrated to theouter enclosure 306 using an adhesive. Alternatively, theright plate 328 can be fixed to theouter enclosure 306 as an external component. - According to alternative embodiments, any type of adhesives or fasteners can be used to provide integrated retention features for fixing any of the
top plate 308, theleft plate 318, or theright plate 328 to theouter enclosure 306. According to other alternative embodiments, any combination of fins and smooth surfaces can be included in any of thetop plate 308, theleft plate 318, or theright plate 328 to further enhance the heat conductivity towards the external environment. Furthermore, in addition to fins, any other type of surface can be used to increase heat absorption, e.g., bumps. - While particular embodiments, aspects, and applications of the present invention have been illustrated and described, it is to be understood that the invention is not limited to the precise construction and compositions disclosed herein and that various modifications, changes, and variations may be apparent from the foregoing descriptions without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (21)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/163,271 US7817428B2 (en) | 2008-06-27 | 2008-06-27 | Enclosure with integrated heat wick |
PCT/US2009/047729 WO2009158259A1 (en) | 2008-06-27 | 2009-06-18 | Enclosure with integrated heat wick |
EP09770793.9A EP2301314B1 (en) | 2008-06-27 | 2009-06-18 | Enclosure with integrated heat wick |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/163,271 US7817428B2 (en) | 2008-06-27 | 2008-06-27 | Enclosure with integrated heat wick |
Publications (2)
Publication Number | Publication Date |
---|---|
US20090321130A1 true US20090321130A1 (en) | 2009-12-31 |
US7817428B2 US7817428B2 (en) | 2010-10-19 |
Family
ID=41021039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/163,271 Expired - Fee Related US7817428B2 (en) | 2008-06-27 | 2008-06-27 | Enclosure with integrated heat wick |
Country Status (3)
Country | Link |
---|---|
US (1) | US7817428B2 (en) |
EP (1) | EP2301314B1 (en) |
WO (1) | WO2009158259A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100046172A1 (en) * | 2008-08-20 | 2010-02-25 | H-Tech, Llc | Electronics package including heat sink in the housing and related methods |
DE102010008074A1 (en) * | 2010-02-15 | 2011-08-18 | Continental Automotive GmbH, 30165 | Housing for use as control housing in motor car, has cooling body connected with electrical component in indirect or direct manner and extending over housing to derive heat to environment of housing |
US20120075802A1 (en) * | 2010-09-24 | 2012-03-29 | Pace Plc | Means for heat dissipation for electrical and/or electronic apparatus |
CN107270042A (en) * | 2017-06-20 | 2017-10-20 | 安徽新兴翼凌机电发展有限公司 | A kind of novel electromechanical heat-insulating, fire-preventing protection device |
CN110446416A (en) * | 2019-09-10 | 2019-11-12 | 山东省产品质量检验研究院 | A kind of electromagnetic compatibility case |
WO2021204372A1 (en) * | 2020-04-08 | 2021-10-14 | HELLA GmbH & Co. KGaA | Electronic control device with improved cooling of components |
US20210343493A1 (en) * | 2018-10-10 | 2021-11-04 | Omron Corporation | Electromagnetic relay |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006058341A2 (en) * | 2004-11-29 | 2006-06-01 | Sanmina-Sci Corporation | System and method for base station heat dissipation using chimneys |
KR20100017414A (en) * | 2007-04-26 | 2010-02-16 | 세람텍 아게 | Cooling box for components or circuits |
US8681501B2 (en) * | 2010-12-17 | 2014-03-25 | Aruba Networks, Inc. | Heat dissipation unit for a wireless network device |
US8177569B1 (en) | 2010-12-21 | 2012-05-15 | Schneider Electric USA, Inc. | Heat sink for a thermally efficient busway joint pack |
US9354748B2 (en) | 2012-02-13 | 2016-05-31 | Microsoft Technology Licensing, Llc | Optical stylus interaction |
US9870066B2 (en) | 2012-03-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US9360893B2 (en) | 2012-03-02 | 2016-06-07 | Microsoft Technology Licensing, Llc | Input device writing surface |
USRE48963E1 (en) | 2012-03-02 | 2022-03-08 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
US9064654B2 (en) | 2012-03-02 | 2015-06-23 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US8873227B2 (en) | 2012-03-02 | 2014-10-28 | Microsoft Corporation | Flexible hinge support layer |
US9134807B2 (en) | 2012-03-02 | 2015-09-15 | Microsoft Technology Licensing, Llc | Pressure sensitive key normalization |
US8935774B2 (en) | 2012-03-02 | 2015-01-13 | Microsoft Corporation | Accessory device authentication |
US9426905B2 (en) | 2012-03-02 | 2016-08-23 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
US9075566B2 (en) | 2012-03-02 | 2015-07-07 | Microsoft Technoogy Licensing, LLC | Flexible hinge spine |
US9459160B2 (en) | 2012-06-13 | 2016-10-04 | Microsoft Technology Licensing, Llc | Input device sensor configuration |
US9073123B2 (en) * | 2012-06-13 | 2015-07-07 | Microsoft Technology Licensing, Llc | Housing vents |
US9684382B2 (en) | 2012-06-13 | 2017-06-20 | Microsoft Technology Licensing, Llc | Input device configuration having capacitive and pressure sensors |
US9063693B2 (en) | 2012-06-13 | 2015-06-23 | Microsoft Technology Licensing, Llc | Peripheral device storage |
US8964379B2 (en) | 2012-08-20 | 2015-02-24 | Microsoft Corporation | Switchable magnetic lock |
US8654030B1 (en) | 2012-10-16 | 2014-02-18 | Microsoft Corporation | Antenna placement |
EP2908970B1 (en) | 2012-10-17 | 2018-01-03 | Microsoft Technology Licensing, LLC | Metal alloy injection molding protrusions |
WO2014059625A1 (en) | 2012-10-17 | 2014-04-24 | Microsoft Corporation | Metal alloy injection molding overflows |
WO2014059618A1 (en) | 2012-10-17 | 2014-04-24 | Microsoft Corporation | Graphic formation via material ablation |
US10578499B2 (en) | 2013-02-17 | 2020-03-03 | Microsoft Technology Licensing, Llc | Piezo-actuated virtual buttons for touch surfaces |
US9448631B2 (en) | 2013-12-31 | 2016-09-20 | Microsoft Technology Licensing, Llc | Input device haptics and pressure sensing |
US10120420B2 (en) | 2014-03-21 | 2018-11-06 | Microsoft Technology Licensing, Llc | Lockable display and techniques enabling use of lockable displays |
US10324733B2 (en) | 2014-07-30 | 2019-06-18 | Microsoft Technology Licensing, Llc | Shutdown notifications |
US9424048B2 (en) | 2014-09-15 | 2016-08-23 | Microsoft Technology Licensing, Llc | Inductive peripheral retention device |
US9804644B2 (en) | 2015-01-01 | 2017-10-31 | David Lane Smith | Thermally conductive and vibration damping electronic device enclosure and mounting |
US10416799B2 (en) | 2015-06-03 | 2019-09-17 | Microsoft Technology Licensing, Llc | Force sensing and inadvertent input control of an input device |
US10222889B2 (en) | 2015-06-03 | 2019-03-05 | Microsoft Technology Licensing, Llc | Force inputs and cursor control |
US10061385B2 (en) | 2016-01-22 | 2018-08-28 | Microsoft Technology Licensing, Llc | Haptic feedback for a touch input device |
FR3075171A1 (en) * | 2017-12-18 | 2019-06-21 | Airbus Operations (S.A.S.) | RECEPTION PLATFORM FOR RECEIVING A PORTABLE ELECTRONIC DEVICE IN AN AIRCRAFT |
US11147189B2 (en) * | 2020-01-19 | 2021-10-12 | Ixi Technology Holdings, Inc. | Heat sink for hand held equipment |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4621304A (en) * | 1983-03-25 | 1986-11-04 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly |
US5012386A (en) * | 1989-10-27 | 1991-04-30 | Motorola, Inc. | High performance overmolded electronic package |
US5387815A (en) * | 1991-07-12 | 1995-02-07 | Sumitomo Electric Industries, Ltd. | Semiconductor chip module |
US5525835A (en) * | 1991-08-08 | 1996-06-11 | Sumitomo Electric Industries, Ltd. | Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element |
US6028355A (en) * | 1998-06-16 | 2000-02-22 | At&T Corp. | Method and apparatus for dissipating heat from an enclosed printed wiring board |
US6317322B1 (en) * | 2000-08-15 | 2001-11-13 | The Furukawa Electric Co., Ltd. | Plate type heat pipe and a cooling system using same |
US20050036292A1 (en) * | 2003-08-12 | 2005-02-17 | Chengalva Suresh K. | Thermally enhanced electronic module with self-aligning heat sink |
US20060064709A1 (en) * | 2004-08-20 | 2006-03-23 | Digital Site Management, Llc | Storage medium protection system |
US20060114655A1 (en) * | 2004-11-29 | 2006-06-01 | Patrick Wallace | Device with an external heat sink arrangement |
US7525798B2 (en) * | 2006-09-29 | 2009-04-28 | Rockwell Automation Technologies, Inc. | Thermal cooling of industrial electronic module by conductive structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4224720A1 (en) | 1992-07-27 | 1994-02-03 | Duerrwaechter E Dr Doduco | Circuit housing for motor vehicle ignition circuitry - has water-tight lid, moulded electrical connector and heat sink for power semiconductor devices moulded into wall of housing |
TWI247574B (en) * | 2004-11-30 | 2006-01-11 | Silicon Integrated Sys Corp | Heat dissipation mechanism for electronic device |
-
2008
- 2008-06-27 US US12/163,271 patent/US7817428B2/en not_active Expired - Fee Related
-
2009
- 2009-06-18 EP EP09770793.9A patent/EP2301314B1/en not_active Not-in-force
- 2009-06-18 WO PCT/US2009/047729 patent/WO2009158259A1/en active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4621304A (en) * | 1983-03-25 | 1986-11-04 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly |
US5012386A (en) * | 1989-10-27 | 1991-04-30 | Motorola, Inc. | High performance overmolded electronic package |
US5387815A (en) * | 1991-07-12 | 1995-02-07 | Sumitomo Electric Industries, Ltd. | Semiconductor chip module |
US5525835A (en) * | 1991-08-08 | 1996-06-11 | Sumitomo Electric Industries, Ltd. | Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element |
US6028355A (en) * | 1998-06-16 | 2000-02-22 | At&T Corp. | Method and apparatus for dissipating heat from an enclosed printed wiring board |
US6317322B1 (en) * | 2000-08-15 | 2001-11-13 | The Furukawa Electric Co., Ltd. | Plate type heat pipe and a cooling system using same |
US20050036292A1 (en) * | 2003-08-12 | 2005-02-17 | Chengalva Suresh K. | Thermally enhanced electronic module with self-aligning heat sink |
US20060064709A1 (en) * | 2004-08-20 | 2006-03-23 | Digital Site Management, Llc | Storage medium protection system |
US20060114655A1 (en) * | 2004-11-29 | 2006-06-01 | Patrick Wallace | Device with an external heat sink arrangement |
US7525798B2 (en) * | 2006-09-29 | 2009-04-28 | Rockwell Automation Technologies, Inc. | Thermal cooling of industrial electronic module by conductive structure |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100046172A1 (en) * | 2008-08-20 | 2010-02-25 | H-Tech, Llc | Electronics package including heat sink in the housing and related methods |
US8081467B2 (en) * | 2008-08-20 | 2011-12-20 | Sri Hermetics Inc. | Electronics package including heat sink in the housing and related methods |
DE102010008074A1 (en) * | 2010-02-15 | 2011-08-18 | Continental Automotive GmbH, 30165 | Housing for use as control housing in motor car, has cooling body connected with electrical component in indirect or direct manner and extending over housing to derive heat to environment of housing |
US20120075802A1 (en) * | 2010-09-24 | 2012-03-29 | Pace Plc | Means for heat dissipation for electrical and/or electronic apparatus |
US8773858B2 (en) * | 2010-09-24 | 2014-07-08 | Pace Plc | Means for heat dissipation for electrical and/or electronic apparatus |
CN107270042A (en) * | 2017-06-20 | 2017-10-20 | 安徽新兴翼凌机电发展有限公司 | A kind of novel electromechanical heat-insulating, fire-preventing protection device |
US20210343493A1 (en) * | 2018-10-10 | 2021-11-04 | Omron Corporation | Electromagnetic relay |
US11476068B2 (en) * | 2018-10-10 | 2022-10-18 | Omron Corporation | Electromagnetic relay with heat dissipation structure |
CN110446416A (en) * | 2019-09-10 | 2019-11-12 | 山东省产品质量检验研究院 | A kind of electromagnetic compatibility case |
WO2021204372A1 (en) * | 2020-04-08 | 2021-10-14 | HELLA GmbH & Co. KGaA | Electronic control device with improved cooling of components |
Also Published As
Publication number | Publication date |
---|---|
US7817428B2 (en) | 2010-10-19 |
EP2301314A1 (en) | 2011-03-30 |
EP2301314B1 (en) | 2015-01-21 |
WO2009158259A1 (en) | 2009-12-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7817428B2 (en) | Enclosure with integrated heat wick | |
US7289320B2 (en) | Electronic device with waterproof and heat-dissipating structure | |
US8472194B2 (en) | Solid state switching device with integral heatsink | |
KR101472721B1 (en) | Electronic device enclosures and heatsink structures with thermal management features | |
JP6122616B2 (en) | Heat release device for printed circuit board for junction box | |
US10820406B2 (en) | Circuit structure and electrical junction box | |
EP1701604A1 (en) | Electronic device with a waterproof heat-dissipating structure | |
US20080212285A1 (en) | Electronic equipment and heat dissipating device in the electronic equipment | |
US10398019B2 (en) | Circuit structure and electrical junction box | |
US20140118954A1 (en) | Electronic device with heat-dissipating structure | |
JP6905136B2 (en) | Heat dissipation structure | |
TWI507116B (en) | Radiation element and potable electronic device using same | |
US20080212292A1 (en) | Electronic device with waterproof structure and fabrication method thereof | |
SE524893C2 (en) | Heat-conducting casing with diagonal-shaped flanged profiles | |
WO2015051100A1 (en) | Media device enclosure system | |
JP5611116B2 (en) | Power supply | |
US7111674B2 (en) | Heat dissipating housing with interlocking chamfers and ESD resistance | |
JP4628810B2 (en) | Fixed camera device | |
JP6349803B2 (en) | Electronic equipment and power supply | |
JP2010173645A (en) | Installation structure of on-vehicle circuit unit and electric connection box incorporated with on-vehicle circuit unit | |
JP2004072881A (en) | Electrical junction box | |
JP2015173526A (en) | Connection box for solar power generation | |
TWI822408B (en) | Wireless charging assembly | |
JP3582638B2 (en) | Electronic circuit board device, method of manufacturing the same, and electric equipment using the same | |
JP6878041B2 (en) | Heat dissipation structure of heat generating parts |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SQUARE D COMPANY, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GREER, DAVID RANDALL, JR.;FARAGO, JEFFREY J.;REEL/FRAME:021163/0234;SIGNING DATES FROM 20080625 TO 20080627 Owner name: SQUARE D COMPANY, ILLINOIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GREER, DAVID RANDALL, JR.;FARAGO, JEFFREY J.;SIGNING DATES FROM 20080625 TO 20080627;REEL/FRAME:021163/0234 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.) |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20181019 |