US20100039739A1 - Voltage fault detection and protection - Google Patents
Voltage fault detection and protection Download PDFInfo
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- US20100039739A1 US20100039739A1 US12/606,788 US60678809A US2010039739A1 US 20100039739 A1 US20100039739 A1 US 20100039739A1 US 60678809 A US60678809 A US 60678809A US 2010039739 A1 US2010039739 A1 US 2010039739A1
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- 239000000523 sample Substances 0.000 claims abstract description 101
- 239000003990 capacitor Substances 0.000 claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 37
- 238000012544 monitoring process Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims 16
- 238000004146 energy storage Methods 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001934 delay Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Abstract
A fault detection and protection circuit can include a comparing circuit (e.g., a comparator or a detector) that can be connected to a power line supplying power to an electronic device being tested. The comparing circuit can be configured to detect a fault in which the power line is shorted to ground. For example, the electronic device being tested may have a fault in which its power terminals are shorted to ground. Upon detection of such a fault, the comparing circuit activates one or more switches that shunt capacitors or other energy storage devices on the power line to ground. The comparing circuit may alternatively or in addition activate one or more switches that disconnect the power supply supplying power to the electronic device under test from probes contacting the electronic device.
Description
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FIG. 1A illustrates a simplified diagram of anexemplary test system 100 for testing anelectronic device 110.Tester 102 generates test data, which is written throughcommunications link 106 tointerface apparatus 108, which provides connections (not shown) toprobes 112 that, as shown inFIG. 1A ,contact terminals 114 of theelectronic device 110 under test. Response data generated by theelectronic device 110 returns to thetester 102 throughprobes 112,interface apparatus 108, andcommunication link 106. Thecommunications link 106,interface apparatus 108, andprobes 112 thus provide a plurality of communications channels between thetester 102 and theelectronic device 110 under test. Of course, other devices may be included in thesystem 100. For example, devices for processing and/or routing test data and response data may be placed between thecommunications link 106 and theinterface apparatus 108. - The
interface apparatus 108 can be a probe card apparatus, for contacting anelectronic device 110 under test. Typically, power must be supplied to theelectronic device 110. As shown inFIG. 1A , thepower supply 104 is part of thetester 102, and power from thepower supply 104 is supplied through one of the communications channels formed by thecommunications link 106,interface apparatus 108, andpower probe 116 to thepower terminal 118 of theelectronic device 110. -
FIG. 1B illustrates a schematic diagram of asingle power line 120 from thepower supply 104 to thepower terminal 118 of theelectronic device 110 being tested.Power line 120 represents one communications channel from thetester 102 to the electronic device being tested 110 and thus comprises a portion of thecommunications link 106, theinterface apparatus 108, and thepower probe 116. As shown inFIG. 1B , a by-pass capacitor 122 is often connected between thepower line 120 andground 124 to filter noise on thepower line 120. - At times, the
electronic device 110 being tested has a fault in which power is shorted to ground in theelectronic device 110. Such a condition typically causes a large current surge from thepower supply 104. Even ifpower supply 104 can include over-current protection that automatically shutspower supply 104 off upon detection of such a fault, the over-current protection circuitry (not shown) in thepower supply 104 may be unable to turn thepower supply 104 off due to both the delay and inductance of thepower line 120 before a current surge travels downpower line 120. If sufficiently large, such a current surge can damage theinterface apparatus 108 or apower probe 116. In fact,probe 116 may be particularly susceptible to such damage. Moreover, even if the over-current protection circuitry (not shown) inpower supply 104 is able to shut thepower supply 104 off in time to prevent a current surge, by-pass capacitor 122 is likely to discharge rapidly, and the resulting current throughpower probe 116 may damage theprobe 116. - In exemplary embodiments, a comparing circuit (e.g., a comparator or a detector) can be connected to the power line supplying power to an electronic device being tested. The comparing circuit can be configured to detect a fault in which the power line can be shorted to ground. For example, the electronic device being tested may have a fault in which its power terminals are shorted to ground. Upon detection of such a fault, the comparing circuit can activate one or more switches that shunt to ground or disconnect capacitors or other energy storage devices from probes contacting the electronic device being tested. The comparing circuit may alternatively or in addition activate one or more switches that disconnect the power supply supplying power to the electronic device from probes contacting the electronic device.
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FIG. 1A illustrates a simplified diagram of an exemplary prior art test system. -
FIG. 1B is a schematic diagram of a power line and by-pass capacitor in the system ofFIG. 1A . -
FIG. 2 illustrates a schematic diagram of a power line and by-pass capacitor that can include an exemplary fault detection and protection circuit according to some embodiments of the invention. -
FIG. 3 shows a schematic diagram of the power line and by-pass capacitor ofFIG. 2 that can include another exemplary fault detection and protection circuit according to some embodiments of the invention. -
FIG. 4 illustrates a schematic diagram of the power line and by-pass capacitor ofFIG. 2 with yet another exemplary fault detection and protection circuit according to some embodiments of the invention. -
FIG. 5 illustrates a schematic diagram of the power line and by-pass capacitor ofFIG. 2 with still another exemplary fault detection and protection circuit according to some embodiments of the invention. -
FIG. 6 illustrates an exemplary semiconductor wafer probing system according to some embodiments of the invention. -
FIG. 7 illustrates an exemplary probe card assembly according to some embodiments of the invention. -
FIG. 8 illustrates yet another exemplary fault detection and protection circuit according to some embodiments of the invention. -
FIG. 9 illustrates an exemplary configuration of the detector ofFIG. 8 according to some embodiments of the invention. - This specification describes exemplary embodiments and applications of the invention. The invention, however, is not limited to these exemplary embodiments and applications or to the manner in which the exemplary embodiments and applications operate or are described herein.
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FIG. 2 illustrates a schematic diagram of apower line 120 and by-pass capacitor 122 that can include an exemplary fault detection and protection circuit according to some embodiments of the invention. As described above,power line 120 can be a power line from thepower supply 104 of atester 102 to apower terminal 118 of an electronic device 110 (shown in partial view only) being tested. As also described above, by-pass capacitor 122 can be connected betweenpower line 120 andground 124 and may function as a noise filter forpower line 120. - The exemplary fault detection and isolation circuit shown in
FIG. 2 can include acomparator 210 and threeswitches electronic device 110,switch 252 can be closed, andpower line 120 consequently can be connected and provide power to frompower supply 104 topower terminal 118 of theelectronic device 110 being tested. Switch 256 can be closed, connecting by-pass capacitor 122 topower line 120.Switch 254 can be left open. -
Comparator 210 can include twoinputs input 206 can be connected to thepower line 120, preferably close to the probe 116 (which can be at the end of the power line 120) as shown inFIG. 2 . Theother input 208 can be connected to a reference voltage (not shown). If a fault on theelectronic device 110shorts power terminal 118 to ground, the voltage on thepower line 120 will drop towards ground because of the fault. The reference voltage applied toinput 208 can be set to correspond to a low voltage that represents such a fault in whichpower terminal 118 is shorted to ground. The reference voltage applied toinput 208 can be selected in a variety of ways. For example,electronic device 110 may be designed to operate with a supplied power that is within a specified voltage range. The reference voltage applied toinput 208 can be selected to be below the minimum specified operating voltage (i.e., the lower end of the specified power supply voltage) ofelectronic device 110. For example, anelectronic device 110 may be designed to operate with a supplied power in the range of approximately 3.5-5.0 volts. Assuming that such an electronic device is supplied with a ground of zero volts, reference voltage applied toinput 208 can be selected to be below 3.5 volts, for example, 3.0 volts. Higher or lower voltages can alternatively be selected as the reference voltage applied toinput 208 ofcomparator 210. - The foregoing numerical examples are not limiting, and the reference voltage applied to input 208 can depend on the particular operating parameters of
electronic device 110. The reference voltage applied to input 208 can thus be selected to be any voltage that, given the particular operating parameters ofelectronic device 110, indicates a fault at a power terminal ofelectronic device 110. Generally speaking, the closer the reference voltage is to the operating range of theelectronic device 110, thefaster comparator 210 can detect a fault. - If the voltage from
power line 120 atinput 206 of thecomparator 210 drops to the reference voltage applied to input 208, thecomparator 210 indicates such and theoutput 212 ofcomparator 210 can be used to openswitches Opening switch 252 disconnects probe 116 frompower supply 104, protectingprobe 116 from a power surge frompower supply 104 downpower line 120 caused by the fault atpower terminal 118.Opening switch 256 disconnects probe 116 from by-pass capacitor 122, protectingprobe 116 from a sudden discharge from by-pass capacitor 122 caused by the fault.Closing switch 254 creates a path toground 124. Thus, should a power surge frompower supply 104 propagatepast switch 252 beforeswitch 252 can be opened, the closing ofswitch 254 provides a path to ground 124 for the power surge. The power surge can thus flow throughswitch 254 toground 124, protectingprobe 116. A power surge frompower supply 104 can propagatepast switch 252 if, for example, the sum of the propagation delay alongpower line 120 fromprobe 116 topower supply 104 plus the propagation delay frompower supply 104 to switch 252 is less than the sum of the following delays: any propagation delay alonginput 206 betweenpower line 120 andcomparator 210, the processing delay ofcomparator 210, any propagation delay alongoutput 212 betweencomparator 210 and switch 252, and the switching delay ofswitch 252. - The closing of
switch 254 similarly creates a path to ground 124 for a discharge from by-pass capacitor 122 that propagatespast switch 256 beforeswitch 256 is opened. The discharge will thus flow throughswitch 254 to ground rather than throughprobe 116. - The
comparator 210 and switches 252, 254, 256 can thus form and function as a fault detection and protection circuit that protects probe 116 from a power surge frompower supply 104 and/or a current discharge from by-pass capacitor 122 such as may occur due to a fault in whichpower terminal 118 is shorted to ground. According to other embodiments, the fault detection and protection circuit shown inFIG. 2 need not include each ofswitches FIG. 2 can include only one ofswitches FIG. 3 shows one non-limiting example in which the fault detection and protection circuit can include switch 254 but not switches 252, 256. - In
FIG. 3 , the fault detection and protection circuit can includecomparator 210 andswitch 254. As discussed above, while testing theelectronic device 110, switch 254 can be open (i.e., in position 316). As also discussed above, if thecomparator 210 detects a voltage onpower line 120 indicating a fault in whichpower terminal 118 is shorted to ground as compared to a chosen voltage reference applied to input 208,comparator 210 can activateswitch 254, causingswitch 254 to move toclosed position 319, which creates a path throughswitch 254 toground 124. This creates a path to ground betweenpower supply 104 and probe 116 and between by-pass capacitor 122 andprobe 116. A power surge frompower supply 104 and a discharge from by-pass capacitor 122 can thus flow throughswitch 254 toground 124, protectingprobe 116. - As shown in
FIGS. 2 and 3 ,connection 230 may be provided between thetester 102 and thecomparator 210.Such connection 230 may allow the tester to set and reset thecomparator 210. Various data (e.g., status data and/or handshaking data) may also be exchanged between thecomparator 210 and thetester 102 overconnection 230. For example, thecomparator 210 may send information regarding a detected fault totester 102 throughconnection 230. Such information provided fromcomparator 210 throughconnection 230 totester 102 can include a signal or signals that causetester 102 to turnpower supply 104 off. For example, upon detecting a fault,comparator 210 can (in addition to generatingoutput signal 212 that opensswitches 256, opensswitch 252, and/or closes switch 254) generate a control signal or signals that are sent totester 102 viaconnection 230 indicating detection of the fault and causingtester 102 to turnpower supply 104 off. -
FIG. 4 illustrates yet another configuration of a fault detection and protection circuit according to some embodiments of the invention.FIG. 4 includes a schematic diagram ofpower line 120 with a fault detection and protection circuit that can includecomparator 210, which can be connected to switch 214. Inposition 216, which can be the normal operating position of switch 214 during testing of theelectronic device 110, power frompower supply 104 can be connected to thepower probe 116. Inposition 219, which can be the position of switch 214 upon detection of a fault, theprobe 116 can be connected toground 124 and disconnected from the by-pass capacitor 122. Accordingly, the charge from by-pass capacitor is generally prevented from discharging intoprobe 116. Theprobe 116 can be also disconnected from thepower supply 104. Thecomparator 210 and switch 214 can thus form a fault detection and protection circuit that protects probe 116 from a current discharge from by-pass capacitor 122 such as may occur due to a fault in whichpower terminal 118 is shorted to ground. Theprobe 116 can be also disconnected (and thus protected) from thepower supply 104. -
FIG. 5 illustrates still another configuration of a fault detection and protection circuit according to some embodiments of the invention.FIG. 5 includes a schematic diagram ofpower line 120 with a fault detection and protection circuit that can includecomparator 210, which can be connected to switch 414. While testing theelectronic device 110, switch 414 can be inposition 416 and forms part ofpower line 120. When activated byoutput 212 of comparator 210 (as described above),switch 414 moves to position 419, which interruptspower line 120 and disconnects probe 116 from thepower supply 104. As can be seen inFIG. 5 , while inposition 419, switch 414 also disconnects by-pass capacitor 122 fromprobe 116, preventing by-pass capacitor 122 from discharging throughprobe 116. - In any of the foregoing embodiments, the
comparator 210 can be a high speed voltage comparator (e.g., generating an output within about 100 to 1000 picoseconds or even less than 100 picoseconds of a change at its inputs), such as are known in the art. Thecomparator 210 may alternatively be a programmed microcontroller or other logic hardware and/or software (including without limitation firmware or microcode). Various types of monitoring and reporting may thus be programmed intocomparator 210. Theswitches switch Switches Comparator 210 and/orswitches -
FIG. 6 illustrates an exemplary probingsystem 600 for testing one or moreelectronic devices 610, which may be, for example, one or more dies of a semiconductor wafer, one or more singulated semiconductor dies of an array of dies, or any other electronic device or devices. As will be seen, the exemplary fault detection and protection circuits ofFIGS. 2-5 may be implemented on theprobe card assembly 608 of the probingsystem 600. - As shown, the probing
system 600 can include atester 602, which may be generally similar totester 102 ofFIG. 1A , and aprober 609 with amoveable stage 626 for supporting electronic device ordevices 610 under test and for moving the electronic device ordevices 610 into contact withprobes 612 of theprobe card assembly 608. A communications link 606,test head 650,connectors 652, and probe card assembly 608 (which can include probes 612) can provide a plurality of communications channels (not shown) between thetester 602 and the semiconductor electronic device ordevices 610 under test. One or more of those communications channels (not shown) may provide power frompower supply 604 to the dies (not shown) of the electronic device ordevices 610 under test. - The communications link 606 can provide a plurality of separate communications connections (not shown) between the
tester 602 and thetest head 650. Communications link 606 may be any means for communicating data and/power. (In some embodiments, power may be supplied through electrical connections other than communications link 606.) Non-limiting examples include a cable, optical data links, wireless data links, etc. Thetest head 650 can route the communications connections oflink 606 to theconnectors 652, which in turn can provide electrically conductive paths between thetest head 650 and theprobe card assembly 608.Connectors 652 may be any means for providing electrically conductive paths between thetest head 650 and theprobe card assembly 608. Non-limiting examples include pogo pins, cables or wires with zero-insertion-force connectors, etc. Theprobe card assembly 608 provides electrical paths (not shown inFIG. 6 ) between theconnectors 652 and theprobes 612. -
Probe card assembly 608 can be any type of apparatus having probes for contacting dies (not shown) of a semiconductor electronic device ordevices 610.FIG. 7 shows a simplified block and schematic diagram of one exemplaryprobe card assembly 608. - The
probe card assembly 608 ofFIG. 7 can include three substrates: a printedcircuit board 502, aninterposer 504, and aprobe head 506.Terminals 508 electrically connect toconnectors 652 ofFIG. 6 .Terminals 508 may be pads for receiving pogo pins (ifconnectors 652 are pogo pins), zero-insertion-force connectors, or any other connection device suitable for receivingconnectors 652 ofFIG. 6 . - Electrical connections 510 (e.g., conductive vias and/or traces) through the printed
circuit board 502,spring contacts 512 electrically connecting printedcircuit board 502 andinterposer 504, electrical connections 514 (e.g., conductive vias and/or traces) throughinterposer 504,spring contacts 516 electrically connectinginterposer 504 andprobe head 506, and electrical connections 518 (e.g., conductive vias and/or traces) throughprobe head 506 can electrically connectconnectors 508 toprobes 612.Probes 612 can be configured to contact terminals on the semiconductor dies (not shown) of electronic device ordevices 610.Connectors 508,connections 510,spring contacts 512,connections 514,spring contacts 516,connections 518, and probes 612 can thus form the electrical paths betweenconnectors 652 ofFIG. 6 and theprobes 612 of theprobe card assembly 608 that contact the electronic device ordevices 610 under test. - The
probe head 506 andinterposer 504 may be secured to the printedcircuit board 502 using any suitable means (not shown), including without limitation bolts, screws, clamps, brackets, spring devices, etc. U.S. Pat. No. 5,974,622, U.S. Pat. No. 6,509,751, and U.S. patent application serial no. 11/165,833 (filed Jun. 24, 2005) describe exemplary probe card apparatuses, and various features of the probe card apparatuses described in those patents may be implemented inprobe card assembly 608. - The communications link 606,
test head 650,connectors 652, electrical paths (e.g., 510, 512, 514, 516, 518) through theprobe card assembly 608, and probes 612 can form the plurality of communications channels mentioned above between thetester 602 and the dies (not shown) of the electronic device ordevices 610. As also mentioned above, one or more of these communications channels may be used to supply power from thepower supply 604 to the dies (not shown) of the electronic device ordevices 610 during testing of the dies. Thepower line 120 inFIGS. 2-5 may represent one such communications channel used to supply power. (Power supply 104 inFIGS. 2-5 would thus representpower supply 604 inFIG. 6 , and terminal 118 inFIGS. 2-5 would represent a power input terminal to one of the dies (not shown) of the electronic device ordevices 610 inFIG. 6 .) The by-pass capacitor 122 ofFIGS. 2-5 may be placed on any or all of thesubstrates probe card assembly 608 ofFIG. 7 . Thecomparator 210 and switches 214, 252, 254, 256, 314, 414 ofFIGS. 2-5 may likewise be placed on any or all of thesubstrates probes 612 and therefore may be placed onprobe head 506. As is known, in some cases, the closer a by-pass capacitor (e.g., like by-pass capacitor 122) is to a power input (e.g., power terminal 118) of an electronic device (e.g., electronic device 110), the more effective the capacitor can be in filtering noise on the power line out of the power signal provided to the power input. By-pass capacitors (like 122) may be placed on either side of theprobe head 506, including theside 524 to which theprobes 612 are attached. Thecomparator 210 and switches 214, 252, 254, 256, 314, 414 ofFIGS. 2-5 may likewise by placed on the probe head 506 (on either side, including side 524). Input 206 of thecomparator 210 may be connected toconnections 518 embedded within 526 theprobe head 506. Thecomparator 210 and switches 214, 252, 254, 256, 314, 414 may also be placed on one or more of the printedcircuit board 502 and/orinterposer 504. -
FIG. 8 illustrates yet another configuration of a fault detection and protection circuit according to some embodiments of the invention. As shown, like the configuration ofFIG. 2 , the fault detection and protection circuit ofFIG. 8 can include apower line 120 for supplying power from apower supply 104. A by-pass capacitor 122 can be connected toground 124. The fault detection and protection circuit ofFIG. 8 can also includeswitches FIG. 2 . Unlike the fault detection and protection circuit ofFIG. 2 , however, the fault detection and protection circuit ofFIG. 8 includes apower plane 1204 that distributes power frompower line 120 through a plurality ofprobes 116 to a plurality ofpower terminals 118 of a plurality ofelectronic devices 110 being tested. The configuration ofFIG. 8 can also includedetector 1206. - As shown in
FIG. 8 , theinputs 1208 ofdetector 1206 can be electrically connected to different points on thepower plane 1204. (Although fiveinputs 1208 can be shown inFIG. 8 , more or fewer may be used.)Detector 1206 can be configured to activateoutput 1202 if a sufficiently large voltage difference is detected between two or more of theinputs 1208, which can be an indication that one or more ofprobes 116 is shorted to ground due to a short-to-ground fault at one or more ofpower terminals 118. As discussed above,electronic devices 110 are typically designed to operate with a supply of power within a specified voltage range. A fault in which apower terminal 118 is shorted to ground can short theprobe 116 contacting thepower plane 1204 to ground, which can cause a drop in the voltage on thepower plane 1204 in the general vicinity where the shortedprobe 116 is connected to thepower plane 1204. The amount of the voltage drop can depend on the operating parameters of theelectronic device 110 and the test system used to test theelectronic device 110. Thus, thevoltage difference detector 1206 is configured to detect can depend on the operating parameters of theelectronic device 110 and test system. - Upon detecting such a difference (i.e., representing a fault at one of the power terminals 118),
detector 1206 can activateoutput 1202, which closesswitch 254 and opensswitches FIG. 2 . (Also as discussed above with respect toFIG. 2 , the normal operating positions ofswitches electronic devices 110 can be as follows: switch 252 can be closed,switch 254 can be open, and switch 256 can be closed.) As discussed above with respect toFIG. 2 , closingswitch 254 can provide a path to ground 124 for a current surge frompower supply 104 and/or for a discharge from by-pass capacitor 122, diverting such a current surge frompower supply 104 and a discharge from by-pass capacitor 122 away fromprobes 116.Opening switch 252disconnects probes 116 frompower supply 104, andopening switch 256disconnects probes 116 from by-pass capacitor 122. As also discussed above with respect toFIG. 2 , various configurations of the fault detection and protection circuit ofFIG. 8 may be implemented with only one of or only two ofswitches -
FIG. 9 , which shows a top view ofpower plane 1204, illustrates an exemplary configuration of a detector, such asdetector 1206, according to some embodiments of the invention. As shown,detector 1206 can comprise fourdifferential amplifiers circuit 1328 configured to detect a positive or negative output on one or more ofdifferential amplifier outputs output 1202 in response thereto. As also shown,detector 1206 can include five inputs, each tapped from fivelocations power plane 1204. One of thetaps differential amplifiers other taps differential amplifiers differential amplifier tap 1306 to the voltage (or current) at another oftaps FIG. 9 , a tap (e.g., tap 1306) that is generally centrally located with respect to others of the taps (e.g., 1302, 1304, 1308, 1310) may be selected as providing a voltage to which voltages from the other taps can be compared. Alternatively, any oftaps - The voltage (or drawn current) should be generally the same across
plane 1204 unless, for example, there is a fault at one of power terminals 118 (seeFIG. 8 ) as discussed above. Eachdifferential amplifier output terminals 118. As generally discussed above, the threshold can depend on the operating parameters ofelectronic device 110 and the test system used to testelectronic device 110. Theoutputs differential amplifiers circuit 1328 so thatoutput 1202 ofdetector 1206 is activated if any of theoutputs differential amplifiers - For example, if a
probe 116 connected topower plane 1204 in the vicinity of one or more oftaps terminal 118 of anelectronic device 110 with a short-to-ground fault, the voltage onpower plane 1204 at the one or more oftaps tap 1306, and one or more ofdifferential amplifiers outputs probe 116 connected topower plane 1204 in the vicinity oftap 1306 contacts aterminal 118 of anelectronic device 110 with a short-to-ground fault, the voltage onpower plane 1204 attap 1306 can fall below the voltage onpower plane 1204 attaps differential amplifiers outputs taps differential amplifiers OR gate 1328 are shown inFIG. 9 , more or fewer taps, differential amplifiers, and/or OR gates may be used. Moreover,multiple detectors 1206 configured as shown inFIG. 9 can be connected topower plane 1204. - The exemplary fault detection and protection circuit shown in
FIGS. 8 and 9 may be implemented on a probe card assembly likeprobe card assembly 608 ofFIG. 7 . For example,power plane 1204 may be embedded inprobe substrate 506, and probes 116 may be implemented likeprobes 612 ofFIG. 7 . Any one or more ofswitches differential amplifiers circuit board 502,interposer 504, and/orprobe substrate 506. - In any of the foregoing embodiments, the
comparator 210 anddifferential amplifiers Comparator 210 ordifferential amplifiers comparator 210 and/or any ofdifferential amplifiers switches switch Switches Comparator 210,differential amplifiers switches - As generally discussed above with respect to
FIG. 2 , in any of the embodiments described herein,tester 102 can provide control signals throughconnection 230 tocomparator 210 or detector 1206 (e.g., setting parameters ofcomparator 210 ordetector 1206, resettingcomparator 210 ordetector 1206, etc.) and can receive status and/or other signals fromcomparator 210 ordetector 1206. Moreover,comparator 210 ordetector 1206 can provide information totester 102 regarding a detected fault, and such information can include a signal or signals that causetester 102 to turnpower supply 104 off. For example, upon detecting a fault,comparator 210 ordetector 1206 can (in addition to generatingoutput signal switches tester 102 viaconnection 230 indicating detection of the fault and causingtester 102 to turnpower supply 104 off. - Various exemplary embodiments and applications of the invention have been presented and described. Many variations and modifications and alternative embodiments and applications are possible. For example, the
comparator 210 and switches 214, 252, 254, 256, 314, 414 may be configured to shunt to ground or to disconnect frompower line 120 energy storage devices other thancapacitors 122. As another example, the fault detection and protection circuit (comprising thecomparator 210 and switches 214, 252, 254, 256, 314, 414) may be implemented in a system other than thesemiconductor probing system 600 shown inFIG. 6 . For example, the fault detection and protection circuit ofFIG. 2-5 may be implemented in another type or configuration of a probing system, or the fault detection and protection circuit may be implemented in another type of testing system, such as the more generalized test system shown inFIG. 1A . As yet another example, thepower supply 104 ofFIG. 1A or 604 ofFIG. 6 need not be located in thetester
Claims (16)
1. A method of detecting and responding to a fault in a semiconductor device under test, the method comprising:
monitoring at least one electrical characteristic of a power line electrically connected to the semiconductor device under test for indications of the fault;
determining from the at least one electrical characteristic whether a fault condition exists; and
in response to determining the fault condition exists, diverting power from a probe in electrical connection with a terminal of the semiconductor device under test affected by the fault, wherein the diverting occurs in close proximity to the probe in relation to a power supply supplying power to the power line.
2. The method of claim 1 further comprising providing a capacitor electrically connected to the power line.
3. The method of claim 2 , wherein the diverting comprises at least one of disconnecting the probe from the capacitor, disconnecting the probe from the power supply, or connecting the probe to ground.
4. The method of claim 3 , wherein the diverting comprises disconnecting the probe from the capacitor.
5. The method of claim 3 , wherein the diverting comprises disconnecting the probe from the power supply.
6. The method of claim 3 , wherein the diverting comprises disconnecting the probe from the capacitor and disconnecting the probe from the power supply.
7. The method of claim 3 , wherein the diverting comprises connecting the probe to ground.
8. The method of claim 3 , wherein:
the probe is one of a plurality of probes of a probe card assembly configured to contact a plurality of terminals of the semiconductor device, and
the monitoring comprises monitoring a portion of the power line disposed on the probe card assembly.
9. The method of claim 8 , wherein the determining comprises comparing a voltage on the power line to a reference voltage.
10. The method of claim 9 , wherein the fault is a short to ground.
11. The method of claim 1 further comprising testing the electronic device.
12. The method of claim 1 , wherein the monitoring comprising monitoring a voltage on the power line.
13. The method of claim 1 , wherein the power supply is connected to a first end of the power line and the probe is connected to a second end of the power line, and the monitoring comprises monitoring a voltage on the power line at a location on the power line that is in close proximity to the probe relative to the power supply.
14. The method of claim 1 , wherein the monitoring comprises monitoring the at least one electrical characteristic at a plurality of locations on a power plane, wherein the power plane is electrically connected through the power line to a power supply, and a plurality of probes are electrically connected to the power plane and disposed to contact a plurality of terminals of a plurality of electronic devices.
15. The method of claim 14 , wherein the monitoring further comprises determining whether a difference in voltages between at least one pair of locations on the power plane exceeds a predetermined threshold.
16-44. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/606,788 US20100039739A1 (en) | 2005-03-22 | 2009-10-27 | Voltage fault detection and protection |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59424805P | 2005-03-22 | 2005-03-22 | |
US11/306,186 US7609080B2 (en) | 2005-03-22 | 2005-12-19 | Voltage fault detection and protection |
US12/606,788 US20100039739A1 (en) | 2005-03-22 | 2009-10-27 | Voltage fault detection and protection |
Related Parent Applications (1)
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US11/306,186 Division US7609080B2 (en) | 2005-03-22 | 2005-12-19 | Voltage fault detection and protection |
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US12/606,788 Abandoned US20100039739A1 (en) | 2005-03-22 | 2009-10-27 | Voltage fault detection and protection |
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US11/306,186 Expired - Fee Related US7609080B2 (en) | 2005-03-22 | 2005-12-19 | Voltage fault detection and protection |
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US (2) | US7609080B2 (en) |
EP (1) | EP1869479A4 (en) |
JP (1) | JP2008545949A (en) |
KR (1) | KR101238529B1 (en) |
TW (1) | TWI438451B (en) |
WO (1) | WO2006102006A2 (en) |
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Also Published As
Publication number | Publication date |
---|---|
TWI438451B (en) | 2014-05-21 |
US7609080B2 (en) | 2009-10-27 |
KR101238529B1 (en) | 2013-02-28 |
WO2006102006A3 (en) | 2009-04-09 |
KR20070121010A (en) | 2007-12-26 |
TW200641375A (en) | 2006-12-01 |
WO2006102006A2 (en) | 2006-09-28 |
US20060217906A1 (en) | 2006-09-28 |
EP1869479A2 (en) | 2007-12-26 |
EP1869479A4 (en) | 2012-06-27 |
JP2008545949A (en) | 2008-12-18 |
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