US20100154790A1 - Process for manufacturing an integrated membrane of nozzles in mems technology for a spray device and spray device using such membrane - Google Patents

Process for manufacturing an integrated membrane of nozzles in mems technology for a spray device and spray device using such membrane Download PDF

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Publication number
US20100154790A1
US20100154790A1 US12/645,380 US64538009A US2010154790A1 US 20100154790 A1 US20100154790 A1 US 20100154790A1 US 64538009 A US64538009 A US 64538009A US 2010154790 A1 US2010154790 A1 US 2010154790A1
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United States
Prior art keywords
substrate
membrane
nozzles
layer
membrane layer
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Abandoned
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US12/645,380
Inventor
Angelo Antonio Merassi
Angelo Pesci
Benedetto Vigna
Ernestino Galeazzi
Marco Mantovani
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STMicroelectronics SRL
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STMicroelectronics SRL
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Assigned to STMICROELECTRONICS S.R.L. reassignment STMICROELECTRONICS S.R.L. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PESCI, ANGELO, VIGNA, BENEDETTO, GALEAZZI, ERNESTINO, MANTOVANI, MARCO, MERASSI, ANGELO ANTONIO
Publication of US20100154790A1 publication Critical patent/US20100154790A1/en
Priority to US13/754,510 priority Critical patent/US8721910B2/en
Priority to US14/225,285 priority patent/US9486593B2/en
Abandoned legal-status Critical Current

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61MDEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M15/00Inhalators
    • A61M15/009Inhalators using medicine packages with incorporated spraying means, e.g. aerosol cans
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00087Holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/05Microfluidics
    • B81B2201/058Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49401Fluid pattern dispersing device making, e.g., ink jet

Definitions

  • the present disclosure relates to a process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device, and to the spray device that uses such membrane, in particular a spray or aerosol device of an inhaler used for administration of pharmaceutical products, parapharmaceutical products, or perfumes.
  • inhalers of a known type are generally used for administering medicaments in controlled doses or for a wide range of aerosol-based therapies.
  • An inhaler supplies the medicament, which is in liquid form, as a nebulized dispersion of drops.
  • an inhaler is of contained dimensions and generally operated with a battery so that the patient is able to carry it with him and use it in a discrete way.
  • Inhalers of a known type for example, of the type described in U.S. Pat. No. 6,196,219, generally comprise a membrane provided with nozzles (or pores) and set facing a reservoir containing the liquid to be nebulized.
  • An actuation element for example, a piezoelectric actuation element, can be used for deforming the reservoir and causing exit of the liquid through the nozzles of the membrane.
  • the effectiveness of a medical treatment depends upon the activity of the active principle, and said effectiveness depends in turn upon the amount of each dose of medicament nebulized and upon the point of impact of the spray. Consequently, the amount of nebulized liquid and the directionality of each spray should be as constant as possible for different sprays, so as to maximize the effectiveness of the medical therapy.
  • One embodiment is a process for manufacturing an integrated membrane of nozzles obtained with MEMS technology for a spray device, and the spray device that uses said membrane that is free from the drawbacks of the known art.
  • the process includes providing a substrate; forming a membrane layer on the substrate; forming a plurality of nozzles in the membrane layer; and forming a plurality of supply channels in the substrate.
  • Each supply channel is substantially aligned in a vertical direction with a respective nozzle of said plurality of nozzles and is in direct communication with the respective nozzle
  • FIGS. 1-4 show a cross-sectional view of a membrane of nozzles according to one embodiment of the present disclosure
  • FIGS. 5-8 show a cross-sectional view of a membrane of nozzles according to another embodiment of the present disclosure
  • FIGS. 9-12 show a cross-sectional view of a membrane of nozzles according to a further embodiment of the present disclosure.
  • FIGS. 13-16 show a cross-sectional view of a membrane of nozzles according to another embodiment of the present disclosure
  • FIG. 17 shows a spray device that incorporates a membrane of nozzles according to any of the embodiments of the present disclosure.
  • FIG. 18 shows an inhaler that incorporates the spray device of FIG. 17 .
  • a wafer 10 comprising a substrate 11 made, for example, of silicon of an N type having a thickness of between 400 ⁇ m and 725 ⁇ m, preferably 400 ⁇ m.
  • a sacrificial layer 12 is then laid, made, for example, of silicon oxide, which has a thickness of between 0.6 ⁇ m and 1.5 ⁇ m, preferably 0.8 ⁇ m.
  • a membrane layer 13 grown on the wafer 10 is a membrane layer 13 , preferably made of non-doped polysilicon.
  • the membrane layer 13 may be made of deposited material, compatible with silicon processing technology (e.g., deposited polysilicon).
  • silicon processing technology e.g., deposited polysilicon.
  • Providing a membrane layer 13 made of grown or deposited material has the advantage that the choice of the material to be used may be tuned according to the particular application of the membrane layer 13 .
  • the properties of the membrane layer 13 are varied (e.g., its elasticity, compatibility with biological materials, etc.).
  • the membrane layer 13 is then planarized until a final thickness is reached of between 1.5 ⁇ m and 10 ⁇ m, preferably 5 ⁇ m, and defined, for example, by means of dry etching so as to form a plurality of nozzles 14 (just two nozzles 14 are shown in the figure).
  • Each nozzle 14 has preferably, in top plan view, a circular shape with a diameter of between 1 ⁇ m and 5 ⁇ m, according to the liquid that is to be used, and extends in depth throughout the thickness of the membrane layer 13 .
  • a step of grinding of the back of the substrate 11 enables reduction of the thickness of the substrate down to approximately 400 ⁇ m. This step is not necessary in the case where the starting substrate 11 already has a thickness of 400 ⁇ m or less.
  • supply channels 15 formed in the substrate 11 , preferably by means of a dry etch, are supply channels 15 , each in a position corresponding, and substantially aligned vertically, to a respective nozzle 14 .
  • the supply channels 15 preferably have, in top plan view, a circular shape with a diameter of between 10 ⁇ m and 100 ⁇ m, preferably 40 ⁇ m, and extend in depth throughout the thickness of the substrate 11 .
  • the sacrificial layer 12 is partially removed, for example, by means of a wet etching of the buffered-oxide-etching (BOE) type so as to set in direct communication each nozzle 14 with the respective underlying supply channel 15 .
  • BOE buffered-oxide-etching
  • a membrane of nozzles 16 is thus obtained, provided with a plurality of nozzles 14 (for example, 3200 nozzles uniformly distributed on a membrane having an area of approximately 25 mm 2 ) that can be used in a spray device.
  • the step of removal of the sacrificial layer 12 is important on account of a possible lateral overetching of the portions of sacrificial layer 12 , which could cause an excessive weakening of portions of the membrane of nozzles 16 comprised between contiguous nozzles and consequent yielding of the membrane of nozzles 16 itself.
  • the sacrificial layer 12 after being deposited, is defined so as to form portions isolated from one another of sacrificial layer 12 in positions corresponding to the areas in which it is envisaged to form the nozzles 14 .
  • the sacrificial layer 12 after being deposited on the substrate 11 , is defined so as to form sacrificial isles 20 separated from one another by means of trenches 21 . Then ( FIG. 6 ), in a way similar to what has been described with reference to FIG.
  • the membrane layer 13 is grown and is defined, thus providing a nozzle 14 in an area corresponding to each sacrificial isle 20 .
  • the membrane layer 13 is formed also inside the trenches 21 , thus providing membrane anchorages 22 for anchoring the membrane layer 13 directly to the substrate 11 .
  • the back of the substrate 11 is etched to form the supply channels 15 .
  • the sacrificial isles 20 are removed by means of a wet etch, for example, with BOE, thus setting in direct contact each nozzle 14 with the respective supply channel 15 to form a membrane of nozzles 25 .
  • a possible overetching of the oxide that forms the sacrificial isles 20 does not jeopardize the mechanical stability of the membrane 25 in so far as the membrane anchorages 22 are not damaged by the steps of the process described.
  • FIGS. 9-12 show the steps of the process of formation of a membrane of nozzles, according to a further embodiment.
  • a wafer 10 is provided having a substrate 11 on which a sacrificial layer 12 is deposited and a membrane layer 13 is grown, in which nozzles 14 are obtained, for example, by means of dry etching.
  • the wafer 10 is protected by means of a protective layer 30 , of a thickness of between 0.5 ⁇ m and 2 ⁇ m, preferably 1 ⁇ m, for example, made of thermally grown silicon oxide.
  • the protective layer 30 also coats the internal walls and the bottom of the nozzles 14 .
  • the protective layer 30 is removed from the back of the substrate 11 so as to create a window of a quadrangular shape underneath the plurality of nozzles 14 .
  • a subsequent etching step for example, wet etching with the use of tetramethylammonium hydroxide (TMAH) enables selective removal of the substrate 11 where this is not protected by the protection layer 30 so as to provide a chamber 31 , having a depth of between 100 ⁇ m and 400 ⁇ m.
  • TMAH tetramethylammonium hydroxide
  • the protective layer 30 performs the dual function of mask for definition of the shape of the chamber 31 and of protection for preventing an undesirable etching of the membrane layer 13 .
  • each supply channel 15 is formed underneath each nozzle 14 , by digging the substrate 11 , for example, by means of a dry etch, until portions of the sacrificial layer 12 are exposed.
  • Each supply channel 15 has a depth of between 50 ⁇ m and 300 ⁇ m.
  • each supply channel 15 will have a depth of 100 ⁇ m.
  • the protective layer 30 and the portions of sacrificial layer 12 exposed are removed, for example, by means of wet etching of a BOE type, simultaneously providing a membrane of nozzles 35 comprising a portion of a reservoir (the chamber 31 ).
  • membranes of nozzles provided with elements for guiding jets that, in use, come out of each nozzle 14 so as to increase the directionality of the jet itself eliminating portions thereof having an angle of exit from the nozzle 14 greater than a certain maximum exit angle (assuming that each jet has a substantially conical shape).
  • Membranes of nozzles of this type also prove to be more rigid.
  • a guide channel provided in a form integrated with the membrane of nozzles, set on each nozzle 14 , according to a further embodiment.
  • a wafer 10 comprising a substrate 11 , on which a sacrificial layer 12 is deposited and defined and a membrane layer 13 is grown, anchored to the substrate 11 by means of membrane anchorages 22 .
  • the nozzles 14 are then formed by selectively removing portions of the membrane layer 13 .
  • a shaping layer 40 is deposited, having a sacrificial function, so as to fill the nozzles 14 and form a layer on the membrane layer 13 .
  • the shaping layer 40 may be made, for example, of silicon oxide, having a thickness of between 0.2 ⁇ m and 1 ⁇ m, preferably 0.5 ⁇ m.
  • the shaping layer 40 is defined so as to remove portions of the shaping layer 40 laterally staggered with respect to each nozzle 14 , and kept in portions substantially aligned vertically to each nozzle 14 .
  • a guide-channel layer 41 is formed on the wafer 10 , for example, by epitaxial growth of silicon having a thickness of between 2 ⁇ m and 6 ⁇ m, preferably 5 ⁇ m.
  • the guide-channel layer 41 is defined so as to form a guide channel 42 on top of, and substantially aligned vertically to, each nozzle 14 , having a preferably circular shape, a diameter of 5 ⁇ m, and a depth equal to the thickness of the guide-channel layer 41 .
  • the guide-channel layer 41 is selectively removed, for example, by means of dry etching, until the portions of the second sacrificial layer 40 arranged on the nozzles 14 are at least partially exposed.
  • the substrate 11 is dug from the back to form a supply channel 15 for each nozzle 14 , in a way similar to what has been described with reference to the other embodiments illustrated.
  • a step of wet etching for example, of the BOE type, enables removal of the portions of sacrificial layer 12 and of shaping layer 40 exposed in order to set in direct communication each supply channel 15 with the respective nozzle 14 and each guide channel 42 with the respective nozzle 14 . In this way, the supply channel 15 and the guide channel 42 are in communication via the nozzle 14 .
  • a membrane of nozzles 45 is thus provided.
  • FIG. 17 shows a spray device 50 comprising a membrane of nozzles 16 , 25 , 35 , or 45 , provided according to any of the embodiments of the present disclosure.
  • the spray device 50 further comprises a reservoir 51 , set underneath the membrane of nozzles 16 , 25 , 35 , or 45 and designed to contain in an internal housing 52 of its own a liquid substance 55 (for example, a medicament), which, in use, comes out of the nozzles 14 through the supply channels 15 .
  • Actuation of the spray device 50 can be obtained in various ways, for example, by means of an actuator 53 of a piezoelectric type, fixed with respect to a bottom face of the reservoir 51 opposite to the membrane of nozzles 16 , 25 , 35 or 45 .
  • said actuator 53 When activated by means of an appropriate control electronics (not shown), said actuator 53 induces a vibration that is transmitted through the reservoir 51 to the liquid contained in the housing 52 , causing exit thereof through the nozzles 14 .
  • an inlet mouth 54 can be provided for recharging the reservoir 51 with further liquid substance 55 , when the liquid substance 55 , following upon use of the spray device 50 , runs out.
  • the spray device 50 can be incorporated in an inhaler 100 , for controlled release of medicaments or anaesthetics.
  • the inhaler 100 can comprise an electronic controller 110 , in turn comprising a control board, for controlling release of a precise amount of liquid medicament to be emitted.
  • the controller 110 may comprise a frequency oscillator (not shown), for controlling the frequency of oscillation of the actuator 53 , in the case where the latter is of a piezoelectric type.
  • the controller 110 is supplied by a battery 104 integrated in the inhaler 100 .
  • the inhaler 100 can be activated by pressing a pushbutton 105 , which activates the controller 110 for generating emission of the liquid medicament.
  • the inhaler 100 can moreover comprise a fluidic module 107 , constituted by a plurality of channels and/or containers 108 , connected to the inlet mouth 54 of the spray device 50 and designed to contain a certain amount of medicament for enabling a recharging of the spray device 50 when, following upon use, the medicament runs out.
  • the channels and/or containers 108 can be recharged with medicament by the user, when necessary.
  • the inhaler 100 may optionally comprise a flowmeter (not shown), set inside or outside the spray device 50 , for evaluating the amount of liquid released, and/or a pressure sensor (not shown), for evaluating the level of liquid remaining within the reservoir 51 of the spray device 50 .
  • the process of fabrication described presents a reduced cost, in so far as the process does not require more than a limited number of process masks, and the membrane of nozzles is produced monolithically starting from a wafer of a standard type, without any need to use processes of a silicon-on-insulator (SOI) type or wafer-to-wafer-bonding processes.
  • SOI silicon-on-insulator
  • the nozzles 14 can be formed at a time different from the one described, for example, after formation of the supply channels 15 .

Abstract

A process for manufacturing a membrane of nozzles of a spray device, comprising the steps of laying a substrate, forming a membrane layer on the substrate, forming a plurality of nozzles in the membrane layer, forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction to a respective nozzle of the plurality of nozzles and in direct communication with the respective nozzle.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device, and to the spray device that uses such membrane, in particular a spray or aerosol device of an inhaler used for administration of pharmaceutical products, parapharmaceutical products, or perfumes.
  • 2. Description of the Related Art
  • For example, in applications in the medical field, inhalers of a known type are generally used for administering medicaments in controlled doses or for a wide range of aerosol-based therapies.
  • An inhaler supplies the medicament, which is in liquid form, as a nebulized dispersion of drops. Preferably, an inhaler is of contained dimensions and generally operated with a battery so that the patient is able to carry it with him and use it in a discrete way.
  • Inhalers of a known type, for example, of the type described in U.S. Pat. No. 6,196,219, generally comprise a membrane provided with nozzles (or pores) and set facing a reservoir containing the liquid to be nebulized. An actuation element, for example, a piezoelectric actuation element, can be used for deforming the reservoir and causing exit of the liquid through the nozzles of the membrane.
  • As is known, the effectiveness of a medical treatment depends upon the activity of the active principle, and said effectiveness depends in turn upon the amount of each dose of medicament nebulized and upon the point of impact of the spray. Consequently, the amount of nebulized liquid and the directionality of each spray should be as constant as possible for different sprays, so as to maximize the effectiveness of the medical therapy.
  • It is clear that the type of membrane of nozzles and the size and shape of the nozzles, as well as the uniformity of the size and shape of the nozzles, are parameters that are particularly important to define the size and directionality of the drops generated and their reproducibility.
  • Various membranes of nozzles for inhalers have been proposed; however, some of these require a particularly complex manufacturing process, whilst others do not enable a high reproducibility of the nozzles.
  • BRIEF SUMMARY
  • One embodiment is a process for manufacturing an integrated membrane of nozzles obtained with MEMS technology for a spray device, and the spray device that uses said membrane that is free from the drawbacks of the known art.
  • Provided according to the present disclosure are a process for manufacturing an integrated membrane of nozzles obtained with MEMS technology for a spray device and the spray device that uses said membrane. In one embodiment, the process includes providing a substrate; forming a membrane layer on the substrate; forming a plurality of nozzles in the membrane layer; and forming a plurality of supply channels in the substrate. Each supply channel is substantially aligned in a vertical direction with a respective nozzle of said plurality of nozzles and is in direct communication with the respective nozzle
  • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
  • For a better understanding of the present disclosure preferred embodiments thereof are now described, purely by way of non-limiting example, with reference to the attached drawings, wherein:
  • FIGS. 1-4 show a cross-sectional view of a membrane of nozzles according to one embodiment of the present disclosure;
  • FIGS. 5-8 show a cross-sectional view of a membrane of nozzles according to another embodiment of the present disclosure;
  • FIGS. 9-12 show a cross-sectional view of a membrane of nozzles according to a further embodiment of the present disclosure;
  • FIGS. 13-16 show a cross-sectional view of a membrane of nozzles according to another embodiment of the present disclosure;
  • FIG. 17 shows a spray device that incorporates a membrane of nozzles according to any of the embodiments of the present disclosure; and
  • FIG. 18 shows an inhaler that incorporates the spray device of FIG. 17.
  • DETAILED DESCRIPTION
  • As is shown in FIG. 1, according to one embodiment of the present disclosure, a wafer 10 is provided, comprising a substrate 11 made, for example, of silicon of an N type having a thickness of between 400 μm and 725 μm, preferably 400 μm. A sacrificial layer 12 is then laid, made, for example, of silicon oxide, which has a thickness of between 0.6 μm and 1.5 μm, preferably 0.8 μm.
  • Next (FIG. 2), grown on the wafer 10 is a membrane layer 13, preferably made of non-doped polysilicon. Alternatively, the membrane layer 13 may be made of deposited material, compatible with silicon processing technology (e.g., deposited polysilicon). Providing a membrane layer 13 made of grown or deposited material (thus differing from the substrate in either material and/or crystalline structure) has the advantage that the choice of the material to be used may be tuned according to the particular application of the membrane layer 13. In fact, by varying the material of the membrane layer 13, the properties of the membrane layer 13 are varied (e.g., its elasticity, compatibility with biological materials, etc.).
  • The membrane layer 13 is then planarized until a final thickness is reached of between 1.5 μm and 10 μm, preferably 5 μm, and defined, for example, by means of dry etching so as to form a plurality of nozzles 14 (just two nozzles 14 are shown in the figure). Each nozzle 14 has preferably, in top plan view, a circular shape with a diameter of between 1 μm and 5 μm, according to the liquid that is to be used, and extends in depth throughout the thickness of the membrane layer 13.
  • Then (FIG. 3), a step of grinding of the back of the substrate 11 enables reduction of the thickness of the substrate down to approximately 400 μm. This step is not necessary in the case where the starting substrate 11 already has a thickness of 400 μm or less.
  • Next, formed in the substrate 11, preferably by means of a dry etch, are supply channels 15, each in a position corresponding, and substantially aligned vertically, to a respective nozzle 14. The supply channels 15 preferably have, in top plan view, a circular shape with a diameter of between 10 μm and 100 μm, preferably 40 μm, and extend in depth throughout the thickness of the substrate 11.
  • Finally (FIG. 4), the sacrificial layer 12 is partially removed, for example, by means of a wet etching of the buffered-oxide-etching (BOE) type so as to set in direct communication each nozzle 14 with the respective underlying supply channel 15.
  • A membrane of nozzles 16 is thus obtained, provided with a plurality of nozzles 14 (for example, 3200 nozzles uniformly distributed on a membrane having an area of approximately 25 mm2) that can be used in a spray device.
  • The process described with reference to FIGS. 1-4 enables formation of nozzles 14 and supply channels 15 all having respective uniform dimensions, hence guaranteeing high reproducibility, ease of production process, and extremely contained production costs.
  • The step of removal of the sacrificial layer 12, in particular if performed by means of wet etching, is important on account of a possible lateral overetching of the portions of sacrificial layer 12, which could cause an excessive weakening of portions of the membrane of nozzles 16 comprised between contiguous nozzles and consequent yielding of the membrane of nozzles 16 itself.
  • In order to overcome said drawback, according to a further embodiment of the present disclosure, the sacrificial layer 12, after being deposited, is defined so as to form portions isolated from one another of sacrificial layer 12 in positions corresponding to the areas in which it is envisaged to form the nozzles 14. In greater detail, as shown in FIG. 5, the sacrificial layer 12, after being deposited on the substrate 11, is defined so as to form sacrificial isles 20 separated from one another by means of trenches 21. Then (FIG. 6), in a way similar to what has been described with reference to FIG. 2, the membrane layer 13 is grown and is defined, thus providing a nozzle 14 in an area corresponding to each sacrificial isle 20. In particular, in this case, the membrane layer 13 is formed also inside the trenches 21, thus providing membrane anchorages 22 for anchoring the membrane layer 13 directly to the substrate 11.
  • After an optional step of grinding of the back of the substrate 11 to reduce the thickness thereof down to approximately 400 μm, the back of the substrate 11 is etched to form the supply channels 15.
  • Finally (FIG. 8), the sacrificial isles 20 are removed by means of a wet etch, for example, with BOE, thus setting in direct contact each nozzle 14 with the respective supply channel 15 to form a membrane of nozzles 25.
  • According to this embodiment, a possible overetching of the oxide that forms the sacrificial isles 20 does not jeopardize the mechanical stability of the membrane 25 in so far as the membrane anchorages 22 are not damaged by the steps of the process described.
  • In order to reduce the overall dimensions of the spray device in which the membrane of nozzles is used, it may prove convenient to reduce the thickness of the substrate 11 and the depth of the supply channels 15 so that they can be coupled to other types of piezoelectrics. FIGS. 9-12 show the steps of the process of formation of a membrane of nozzles, according to a further embodiment.
  • In a way similar to what has been described previously, with reference to FIGS. 1 and 2, a wafer 10 is provided having a substrate 11 on which a sacrificial layer 12 is deposited and a membrane layer 13 is grown, in which nozzles 14 are obtained, for example, by means of dry etching.
  • After formation of the nozzles 14 (FIG. 9), the wafer 10 is protected by means of a protective layer 30, of a thickness of between 0.5 μm and 2 μm, preferably 1 μm, for example, made of thermally grown silicon oxide. In particular, the protective layer 30 also coats the internal walls and the bottom of the nozzles 14.
  • Then (FIG. 10), the protective layer 30 is removed from the back of the substrate 11 so as to create a window of a quadrangular shape underneath the plurality of nozzles 14. A subsequent etching step, for example, wet etching with the use of tetramethylammonium hydroxide (TMAH) enables selective removal of the substrate 11 where this is not protected by the protection layer 30 so as to provide a chamber 31, having a depth of between 100 μm and 400 μm. For example, in the case where the substrate 11 has a thickness of 400 μm, it is preferable to form a chamber 31 with a depth of 300 μm. During this etching step, the protective layer 30 performs the dual function of mask for definition of the shape of the chamber 31 and of protection for preventing an undesirable etching of the membrane layer 13.
  • Next (FIG. 11), a supply channel 15 is formed underneath each nozzle 14, by digging the substrate 11, for example, by means of a dry etch, until portions of the sacrificial layer 12 are exposed. Each supply channel 15 has a depth of between 50 μm and 300 μm. For example, in the case where the substrate 11 has a thickness of 400 μm and the chamber 31 a depth of 300 μm, each supply channel 15 will have a depth of 100 μm.
  • Finally (FIG. 12), the protective layer 30 and the portions of sacrificial layer 12 exposed are removed, for example, by means of wet etching of a BOE type, simultaneously providing a membrane of nozzles 35 comprising a portion of a reservoir (the chamber 31).
  • In some cases it may be preferable to envisage membranes of nozzles provided with elements for guiding jets that, in use, come out of each nozzle 14 so as to increase the directionality of the jet itself eliminating portions thereof having an angle of exit from the nozzle 14 greater than a certain maximum exit angle (assuming that each jet has a substantially conical shape). Membranes of nozzles of this type also prove to be more rigid.
  • For the above purpose, there may be envisaged formation of a guide channel, provided in a form integrated with the membrane of nozzles, set on each nozzle 14, according to a further embodiment.
  • Said further embodiment is described in what follows with reference to FIGS. 13-16.
  • In a way similar to what has been described with reference to the embodiment of FIGS. 5 and 6, a wafer 10 is provided, comprising a substrate 11, on which a sacrificial layer 12 is deposited and defined and a membrane layer 13 is grown, anchored to the substrate 11 by means of membrane anchorages 22. The nozzles 14 are then formed by selectively removing portions of the membrane layer 13.
  • Next (FIG. 13), a shaping layer 40 is deposited, having a sacrificial function, so as to fill the nozzles 14 and form a layer on the membrane layer 13. The shaping layer 40 may be made, for example, of silicon oxide, having a thickness of between 0.2 μm and 1 μm, preferably 0.5 μm. The shaping layer 40 is defined so as to remove portions of the shaping layer 40 laterally staggered with respect to each nozzle 14, and kept in portions substantially aligned vertically to each nozzle 14.
  • Then (FIG. 14), a guide-channel layer 41 is formed on the wafer 10, for example, by epitaxial growth of silicon having a thickness of between 2 μm and 6 μm, preferably 5 μm.
  • Next (FIG. 15), the guide-channel layer 41 is defined so as to form a guide channel 42 on top of, and substantially aligned vertically to, each nozzle 14, having a preferably circular shape, a diameter of 5 μm, and a depth equal to the thickness of the guide-channel layer 41. In particular, the guide-channel layer 41 is selectively removed, for example, by means of dry etching, until the portions of the second sacrificial layer 40 arranged on the nozzles 14 are at least partially exposed.
  • Then (FIG. 16), the substrate 11 is dug from the back to form a supply channel 15 for each nozzle 14, in a way similar to what has been described with reference to the other embodiments illustrated.
  • A step of wet etching, for example, of the BOE type, enables removal of the portions of sacrificial layer 12 and of shaping layer 40 exposed in order to set in direct communication each supply channel 15 with the respective nozzle 14 and each guide channel 42 with the respective nozzle 14. In this way, the supply channel 15 and the guide channel 42 are in communication via the nozzle 14. A membrane of nozzles 45 is thus provided.
  • It is clear that, as the size and the depth of the guide channel 42 vary, the solid angle of the jet coming out of the guide channel 42 will vary accordingly. It is thus possible to provide membranes of nozzles equipped with guide channels 42 having different dimensions according to the desired directionality and amplitude of the jet, depending upon the use to which they will be put.
  • Furthermore, for simplicity, said embodiment has been described with preferred reference to the embodiment of FIGS. 5-8, in which the membrane is anchored to the substrate by means of the membrane anchorages 22. However, the process described for formation of the guide channels 42 may be applied, with obvious modifications, also to the other embodiments.
  • FIG. 17 shows a spray device 50 comprising a membrane of nozzles 16, 25, 35, or 45, provided according to any of the embodiments of the present disclosure.
  • The spray device 50 further comprises a reservoir 51, set underneath the membrane of nozzles 16, 25, 35, or 45 and designed to contain in an internal housing 52 of its own a liquid substance 55 (for example, a medicament), which, in use, comes out of the nozzles 14 through the supply channels 15. Actuation of the spray device 50 can be obtained in various ways, for example, by means of an actuator 53 of a piezoelectric type, fixed with respect to a bottom face of the reservoir 51 opposite to the membrane of nozzles 16, 25, 35 or 45. When activated by means of an appropriate control electronics (not shown), said actuator 53 induces a vibration that is transmitted through the reservoir 51 to the liquid contained in the housing 52, causing exit thereof through the nozzles 14.
  • Advantageously, an inlet mouth 54 can be provided for recharging the reservoir 51 with further liquid substance 55, when the liquid substance 55, following upon use of the spray device 50, runs out.
  • The spray device 50 can be incorporated in an inhaler 100, for controlled release of medicaments or anaesthetics.
  • The inhaler 100 can comprise an electronic controller 110, in turn comprising a control board, for controlling release of a precise amount of liquid medicament to be emitted. The controller 110 may comprise a frequency oscillator (not shown), for controlling the frequency of oscillation of the actuator 53, in the case where the latter is of a piezoelectric type.
  • Advantageously, the controller 110 is supplied by a battery 104 integrated in the inhaler 100.
  • The inhaler 100 can be activated by pressing a pushbutton 105, which activates the controller 110 for generating emission of the liquid medicament. The inhaler 100 can moreover comprise a fluidic module 107, constituted by a plurality of channels and/or containers 108, connected to the inlet mouth 54 of the spray device 50 and designed to contain a certain amount of medicament for enabling a recharging of the spray device 50 when, following upon use, the medicament runs out. In turn, the channels and/or containers 108 can be recharged with medicament by the user, when necessary.
  • Finally, the inhaler 100 may optionally comprise a flowmeter (not shown), set inside or outside the spray device 50, for evaluating the amount of liquid released, and/or a pressure sensor (not shown), for evaluating the level of liquid remaining within the reservoir 51 of the spray device 50.
  • From an examination of the characteristics of the process of fabrication according to the present disclosure, the advantages that it enables are evident.
  • In particular the process of fabrication described, according to any one of the embodiments, presents a reduced cost, in so far as the process does not require more than a limited number of process masks, and the membrane of nozzles is produced monolithically starting from a wafer of a standard type, without any need to use processes of a silicon-on-insulator (SOI) type or wafer-to-wafer-bonding processes.
  • Finally, it is clear that modifications and variations may be made to the process described and illustrated herein, without thereby departing from the sphere of protection of the present disclosure.
  • For example, the nozzles 14 can be formed at a time different from the one described, for example, after formation of the supply channels 15.
  • The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the disclosure.

Claims (25)

1. A process, comprising:
manufacturing a nozzle membrane, the manufacturing including:
providing a substrate of a first material;
forming a membrane layer of a second material on the substrate;
forming a plurality of nozzles in the membrane layer; and
forming a plurality of supply channels in the substrate, each supply channel being substantially aligned in a vertical direction with a respective nozzle of said plurality of nozzles and in direct communication with the respective nozzle.
2. The process according to claim 1, wherein forming the membrane layer comprises forming the membrane layer distinct from said substrate.
3. The process according to claim 1, wherein forming the membrane layer comprises growing or depositing said second material.
4. The process according to claim 3, wherein said second material is polysilicon.
5. The process according to claim 1, wherein said first material of the substrate is different from said second material of the membrane layer or the first and second material are a same material in different crystalline states.
6. The process according to claim 1, further comprising forming a sacrificial layer between the substrate and the membrane layer, selectively removing said first sacrificial layer, and directly connecting each supply channel with the respective nozzle.
7. The process according to claim 6, wherein forming the sacrificial layer is performed before forming the membrane layer, the process further comprising, before forming the membrane layer, forming trenches in the sacrificial layer by removing selective portions of said sacrificial layer, said forming the membrane layer forming membrane anchorages anchored to the substrate through said trenches.
8. The process according to claim 1, further comprising, before forming the supply channels, digging a back of the substrate and forming a reservoir in said substrate underneath said plurality of nozzles.
9. The process according to claim 1, further comprising forming a plurality of guide channels, each guide channel extending on a respective nozzle of said plurality of nozzles.
10. The process according to claim 9 wherein forming the plurality of guide channels comprises:
after the step of forming the plurality of nozzles, depositing a sacrificial layer on the membrane layer;
selectively removing the sacrificial layer in areas laterally offset with respect to the nozzles;
growing a guide-channel layer on the sacrificial layer;
removing selective portions of the guide-channel layer; and
removing the sacrificial layer and directly connecting each guide channel with the respective nozzle.
11. A spray device comprising:
a reservoir having an inner chamber configured so as to contain a liquid substance;
an emission structure coupled to the reservoir for emission of the liquid substance, said emission structure including a nozzle membrane that includes:
a substrate of a first material;
a membrane layer of a second material formed on the substrate;
a plurality of nozzles formed through the membrane layer; and
a plurality of source channels formed in the substrate and extending through said substrate, the source channels corresponding respectively to the nozzles and being in direct communication with the nozzles, respectively.
12. The spray device of claim 11, wherein said membrane layer is distinct from said substrate.
13. The spray device of claim 11, wherein said first material of the substrate is different from the second material of the membrane layer or the first and second material are a same material in different crystalline states.
14. The spray device according to claim 11, wherein said second material is polysilicon.
15. The spray device of claim 11, further comprising;
an inlet mouth coupled to the inner chamber to enable filling the reservoir; and
an actuator coupled to the reservoir and configured so as to cause ejection of the liquid substance from the reservoir.
16. The spray device of claim 15, wherein the actuator is a piezoelectric actuator.
17. The spray device of claim 11, wherein the source channels extend lengthwise in a direction that is substantially perpendicular to a face of the substrate one which the membrane layer is positioned.
18. The spray device of claim 11, wherein at least a portion of the membrane layer is directly coupled to the substrate via anchorages.
19. An inhaler, comprising:
a controller configured to control a release of a liquid; and
a spray device that includes:
a fluid reservoir configured to store a fluid; and
a nozzle membrane coupled to the fluid reservoir and configured to allow ejection of the fluid, the nozzle membrane including:
a substrate;
a membrane layer formed on the substrate;
a plurality of nozzles formed through the membrane layer; and
a plurality of source channels formed in the substrate and extending through said substrate, the source channels corresponding respectively to the nozzles and being in direct communication with the nozzles, respectively.
20. The inhaler of claim 19, wherein the nozzle membrane also includes guide channels formed on the membrane layer to guide the ejection of the fluid.
21. The inhaler of claim 19, further comprising:
a battery to provide energy to the controller; and
a pushbutton to activate control electronics of the controller;
a fluidic module to store a supply of the fluid, the fluidic module being coupled to the fluid reservoir to re-supply the fluid reservoir with the fluid.
22. The inhaler of claim 21, wherein the pushbutton is configured to expose the nozzle membrane when depressed and keep the membrane of nozzles covered when not depressed.
23. A nozzle membrane for a spray device, the nozzle membrane comprising:
a substrate;
a membrane layer formed on the substrate;
a plurality of nozzles formed through the membrane layer; and
a plurality of source channels formed in the substrate and extending through said substrate, the source channels corresponding respectively to the nozzles and being in direct communication with the nozzles, respectively.
24. The nozzle membrane of claim 23, wherein the source channels extend lengthwise in a direction that is substantially perpendicular to a face of the substrate one which the membrane layer is positioned.
25. The nozzle membrane of claim 23, wherein at least a portion of the membrane layer is directly coupled to the substrate via anchorages.
US12/645,380 2008-12-23 2009-12-22 Process for manufacturing an integrated membrane of nozzles in mems technology for a spray device and spray device using such membrane Abandoned US20100154790A1 (en)

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US8721910B2 (en) 2014-05-13
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