US20100209599A1 - Electrically Conductive Composition - Google Patents
Electrically Conductive Composition Download PDFInfo
- Publication number
- US20100209599A1 US20100209599A1 US12/722,891 US72289110A US2010209599A1 US 20100209599 A1 US20100209599 A1 US 20100209599A1 US 72289110 A US72289110 A US 72289110A US 2010209599 A1 US2010209599 A1 US 2010209599A1
- Authority
- US
- United States
- Prior art keywords
- conductive composition
- composition
- silver
- polyvinyl
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
Definitions
- This invention relates to an electrically conductive composition containing silver-plated filler particles.
- Silver is utilized as an electrically conductive filler in many commercially available electrically conductive coatings, and encapsulants because its oxide is electrically conductive, and therefore, silver filled systems encounter little or no loss of conductivity during high temperature curing, aging, or other conditions under which the silver may be oxidized.
- a disadvantage of the use of silver is its high cost and the risk of silver migration within the system.
- Copper is another conductive material that may be utilized because it is capable of being processed in forms similar to those in which silver is available, i.e., in powder, dendritic and flake form.
- the main disadvantage of copper is that its oxide is not conductive, and any surface copper oxide formed during drying or curing limits the conductivity of the system even if close interparticle contact is created.
- many other materials that provide electrical conductivity oxidize under the conditions necessary for formation of a conductive coating.
- the present invention provides an electrically conductive composition
- an electrically conductive composition comprising a binder, filler particles, in which at least a portion of the filler particles are silver-plated, and optionally, solvent.
- the sheet resistivity of the composition is lower than 0.100 Ohm/square/25 micron.
- Another embodiment provides electronic devices manufactured using the electrically conductive composition of the invention.
- Still another embodiment is directed to a process of making or forming an electronic device using the electrically conductive composition of the invention.
- the process comprises dispensing, for example, by stencil, screen, rotogravure or flexo printing, the electrically conductive composition of the invention onto a substrate to form conductive tracts or electronic circuitry, and then curing and/or drying the composition to obtain conductivity.
- Exemplary electronic devices that might use these electrically conductive compositions encompass computers and computer equipment, such as printers, fax machines, scanners, keyboards and the like; household appliances; medical sensors; automotive sensors and the like; and personal electronic devices, such as telephones, mobile phones, calculators, remote controls, cameras, CD-players, DVD-players, cassette tape recorders and the like.
- the binder component of the electrically conductive coating or encapsulant will comprise a thermoplastic system, a thermoset system or a mixture of thermoset and thermoplastic systems.
- thermoplastic system of the binder component is either a functional or a non-functional thermoplastic polymer.
- suitable thermoplastic polymers include, but are not limited to, polyurethane elastomers, polyesters, phenolic resins, acrylic polymers, acrylic block copolymers, acrylic polymers having tertiary-alkyl amide functionality, polysiloxane polymers, polystyrene copolymers, polyvinyl polymers, divinylbenzene copolymers, polyetheramides, polyvinyl acetals, polyvinyl butyrals, polyvinyl acetols, polyvinyl alcohols, polyvinyl acetates, polyvinyl chlorides, methylene polyvinyl ethers, cellulose acetates, styrene acrylonitriles, amorphous polyolefins, thermoplastic urethanes, polyacrylonitriles, ethylene vinyl acetate copolymers, ethylene vinyl acetate
- binder that may be utilized is ESTANE 5703P, which is a polyester-type thermoplastic polyurethane available from Noveon, Ohio, USA; PKHC, which is a phenoxy resin available from Inchem, South Carolina, USA; and UCAR VAGH, which is a copolymer of polyvinylalcohol, polyvinylacetate and polyvinylchloride commercially available from the Dow Chemical Company.
- thermoset system of the binder component is either a functional or a non-functional thermoset polymer.
- Suitable thermoset polymers include, but are not limited to, phenolics, urethanes, phenoxy resins, polyesters, epoxies, melamines and mixtures thereof.
- One commercially available binder that may be utilized is Bakelite Hartz 9132KP, which is a phenolic resin commercially available from Bakelite.
- the total binder content is typically in the range of about 2 to about 50 weight percent of the composition and preferably in the range of about 2 to about 40 weight percent of the composition.
- the core of the silver-plated fillers can be electrically conductive or electrically non-conductive.
- a combination of silver-plated fillers, with electrically conductive core and with electrically non-conductive core, may be used.
- Exemplary cores include, but are not limited to, copper, nickel, palladium, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, glass, polymers, antimony doped tin oxide, silica, alumina, fiber, clay, and mixtures thereof.
- the core of the silver-plated filler particle is copper.
- the silver content of the silver-plated filler must be sufficient to provide adequate electrical conductivity and is typically in the range of about 0.2 to about 25 weight percent of the silver-plated filler.
- the one or more silver-plated filler particles comprise in the range of about 1 to about 99 weight percent of the composition and preferably in the range of about 20 to about 70 weight percent of the composition.
- one or more electrically conductive filler materials are utilized in the composition in addition to the silver-plated fillers particles.
- Exemplary conductive filler materials include, but are not limited to, silver, copper, gold, palladium, platinum, nickel, gold or silver-coated nickel, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, silver coated copper, silver coated aluminum, metallic coated glass spheres, metallic coated filler, metallic coated polymers, silver coated fiber, silver coated spheres, antimony doped tin oxide, conductive nanospheres, nano silver, nano aluminum, nano copper, nano nickel, carbon nanotubes and mixtures thereof.
- the electrically conductive filler material may be the same as or different than the core of any silver-plated filler particle utilized in the composition.
- the one or more electrically conductive filler materials comprise in the range of about 0 to about 99 weight percent of the composition and preferably in the range of up to about 40 weight percent of the composition.
- the viscosity of the composition can be adjusted with solvents. It is generally preferred that the composition have a low viscosity to enable efficient dispensing, stencil or screen printing of the composition.
- the composition has a viscosity in the range of about 50 to about 150,000 mPas, and in another embodiment is in the range of about 500 to about 50,000 mPas.
- the lower range of viscosity from about 500 to about 4,000 mPas, is preferred for rotogravure or flexo printing of the composition.
- Higher range of viscosity, from about 3,000 to 50,000 mPas, is preferred for dispensing, stencil or screen printing the composition.
- Exemplary solvents that may be utilized, either separately or in combination, are glycidyl ethers, for example 1,4-butanediol diglycidyl ether; p-tert-butyl-phenyl glycidyl ether, allyl glycidyl ether, glycerol diglycidyl ether, butyldiglycol, 2-(2-butoxyethoxy)-ethylester, butylglycolacetate, acetic acid, 2-butoxyethylester, butylglycol, 2-butoxyethanol, isophorone, 3,3,5 trimethyl-2-cyclohexene-1-one, dimethylsuccinate, dimethylglutarate, dimethyladipate, water, acetic acid, dipropylene glycol (mono)methyl ether, propylacetate, glycidyl ether of alkyl phenol (commercially available from Cardolite Corporation as Cardolite NC513), although other solvents may be utilized
- Additional ingredients may be included in the formulation to provide desired properties.
- Various additives that may be included are surface active agents, surfactants, wetting agents, antioxidants, thixotropes, reinforcement materials, silane functional perfluoroether, phosphate functional perfluoroether, Canes, titanates, wax, phenol formaldehyde, air release agents, flow additives, adhesion promoters, rheology modifiers, surfactants, spacer beads and mixtures thereof.
- the ingredients are specifically chosen to obtain the desired balance of properties for the use of the resins utilized in the particular composition.
- the additional ingredient comprises up to about 20 weight percent of the composition and preferably up to about 10 weight percent of the composition.
- compositions are combined and then applied by dispensing, stencil, screen, rotogravure or flexo printing onto a substrate to form conductive tracts or electronic circuitry, followed by curing and/or drying to produce conductivity.
- the composition is cured and/or dried at 120° C. for about 10 minutes.
- the composition may be cured and/or dried at higher temperatures for less time. In general, these compositions provide sheet resistivity of less than 0.100 Ohm/square/25 ⁇ m.
- a comparative Sample 1 and Samples A-G were prepared by dissolving the binder in a heated solvent (40° C.) with stirring until a homogenous mixture was formed, The samples were cooled to room temperature, filler was added, and the mixture stirred for an additional 30 minutes. As needed, a 3-roll mill (Buhler) was used to mil the compositions. Each composition was applied as a track of 100 ⁇ 2 mm with a thickness of about 5-8 ⁇ m on a polyester sheet. The composition was cured and/or dried at 120° C. for 10 minutes, after which the sheet resistance was measured using a Keithley 2000 Multimeter. Sheet resistivity (SR) was calculated by the formula:
- compositions and sheet resistivity are reported in Table 1: Compositions and Sheet Resistivity.
- Comparative Sample 1 with silver flake filler had a sheet resistivity of 0.010 Ohms/square/25 ⁇ m.
- Samples made with mixtures of silver flakes and silver plated coppers (Samples A-C) had comparable sheet resistivity to the Comparative Sample 1 and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron.
- Samples made with only silver plated copper, without any silver flakes also resulted in comparable sheet resistivity values to Comparative Sample 1, and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron.
- Samples D-G demonstrated that various binder systems may be used to result in comparable sheet resistivity values as Comparative Sample 1, and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron.
Abstract
An electrically conductive composition comprising a binder and filler particles in which at least a portion of the particles are silver-plated. In one embodiment the composition comprises a binder such as a polyurethane, electrically conductive filler particles, silver-plated filler particles and solvent.
Description
- This application is a continuation of International Application No. PCT/US2007/078334 filed Sep. 13, 2007, the contents of which is incorporated herein by reference.
- This invention relates to an electrically conductive composition containing silver-plated filler particles.
- Silver is utilized as an electrically conductive filler in many commercially available electrically conductive coatings, and encapsulants because its oxide is electrically conductive, and therefore, silver filled systems encounter little or no loss of conductivity during high temperature curing, aging, or other conditions under which the silver may be oxidized. A disadvantage of the use of silver is its high cost and the risk of silver migration within the system.
- The high level of conductivity and low resistance provided by entirely silver-filler based products are not necessary for all conductive material applications. Some applications do not require such high levels of conductivity and low resistance. Copper is another conductive material that may be utilized because it is capable of being processed in forms similar to those in which silver is available, i.e., in powder, dendritic and flake form. The main disadvantage of copper is that its oxide is not conductive, and any surface copper oxide formed during drying or curing limits the conductivity of the system even if close interparticle contact is created. Likewise, many other materials that provide electrical conductivity oxidize under the conditions necessary for formation of a conductive coating.
- There continues to be a need in the art for a more economical electrically conductive composition. The present invention addresses this need.
- The present invention provides an electrically conductive composition comprising a binder, filler particles, in which at least a portion of the filler particles are silver-plated, and optionally, solvent. With the use of silver-plated fillers, the sheet resistivity of the composition is lower than 0.100 Ohm/square/25 micron.
- Another embodiment provides electronic devices manufactured using the electrically conductive composition of the invention.
- Still another embodiment is directed to a process of making or forming an electronic device using the electrically conductive composition of the invention. The process comprises dispensing, for example, by stencil, screen, rotogravure or flexo printing, the electrically conductive composition of the invention onto a substrate to form conductive tracts or electronic circuitry, and then curing and/or drying the composition to obtain conductivity. Exemplary electronic devices that might use these electrically conductive compositions encompass computers and computer equipment, such as printers, fax machines, scanners, keyboards and the like; household appliances; medical sensors; automotive sensors and the like; and personal electronic devices, such as telephones, mobile phones, calculators, remote controls, cameras, CD-players, DVD-players, cassette tape recorders and the like.
- The binder component of the electrically conductive coating or encapsulant will comprise a thermoplastic system, a thermoset system or a mixture of thermoset and thermoplastic systems.
- The thermoplastic system of the binder component is either a functional or a non-functional thermoplastic polymer. Suitable thermoplastic polymers include, but are not limited to, polyurethane elastomers, polyesters, phenolic resins, acrylic polymers, acrylic block copolymers, acrylic polymers having tertiary-alkyl amide functionality, polysiloxane polymers, polystyrene copolymers, polyvinyl polymers, divinylbenzene copolymers, polyetheramides, polyvinyl acetals, polyvinyl butyrals, polyvinyl acetols, polyvinyl alcohols, polyvinyl acetates, polyvinyl chlorides, methylene polyvinyl ethers, cellulose acetates, styrene acrylonitriles, amorphous polyolefins, thermoplastic urethanes, polyacrylonitriles, ethylene vinyl acetate copolymers, ethylene vinyl acetate terpolymers, functional ethylene vinyl acetates, ethylene acrylate copolymers, ethylene acrylate terpolymers, ethylene butadiene copolymers and/or block copolymers, styrene butadiene block copolymers, and mixtures thereof. Commercially available binder that may be utilized is ESTANE 5703P, which is a polyester-type thermoplastic polyurethane available from Noveon, Ohio, USA; PKHC, which is a phenoxy resin available from Inchem, South Carolina, USA; and UCAR VAGH, which is a copolymer of polyvinylalcohol, polyvinylacetate and polyvinylchloride commercially available from the Dow Chemical Company.
- The thermoset system of the binder component is either a functional or a non-functional thermoset polymer. Suitable thermoset polymers include, but are not limited to, phenolics, urethanes, phenoxy resins, polyesters, epoxies, melamines and mixtures thereof. One commercially available binder that may be utilized is Bakelite Hartz 9132KP, which is a phenolic resin commercially available from Bakelite.
- The total binder content is typically in the range of about 2 to about 50 weight percent of the composition and preferably in the range of about 2 to about 40 weight percent of the composition.
- One or more silver-plated fillers are utilized in the composition. The core of the silver-plated fillers can be electrically conductive or electrically non-conductive. A combination of silver-plated fillers, with electrically conductive core and with electrically non-conductive core, may be used. Exemplary cores include, but are not limited to, copper, nickel, palladium, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, glass, polymers, antimony doped tin oxide, silica, alumina, fiber, clay, and mixtures thereof.
- In one embodiment the core of the silver-plated filler particle is copper. The silver content of the silver-plated filler must be sufficient to provide adequate electrical conductivity and is typically in the range of about 0.2 to about 25 weight percent of the silver-plated filler.
- The one or more silver-plated filler particles comprise in the range of about 1 to about 99 weight percent of the composition and preferably in the range of about 20 to about 70 weight percent of the composition.
- Optionally, one or more electrically conductive filler materials are utilized in the composition in addition to the silver-plated fillers particles. Exemplary conductive filler materials include, but are not limited to, silver, copper, gold, palladium, platinum, nickel, gold or silver-coated nickel, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, silver coated copper, silver coated aluminum, metallic coated glass spheres, metallic coated filler, metallic coated polymers, silver coated fiber, silver coated spheres, antimony doped tin oxide, conductive nanospheres, nano silver, nano aluminum, nano copper, nano nickel, carbon nanotubes and mixtures thereof. The electrically conductive filler material may be the same as or different than the core of any silver-plated filler particle utilized in the composition. The one or more electrically conductive filler materials comprise in the range of about 0 to about 99 weight percent of the composition and preferably in the range of up to about 40 weight percent of the composition.
- The viscosity of the composition can be adjusted with solvents. It is generally preferred that the composition have a low viscosity to enable efficient dispensing, stencil or screen printing of the composition. In one embodiment the composition has a viscosity in the range of about 50 to about 150,000 mPas, and in another embodiment is in the range of about 500 to about 50,000 mPas. The lower range of viscosity, from about 500 to about 4,000 mPas, is preferred for rotogravure or flexo printing of the composition. Higher range of viscosity, from about 3,000 to 50,000 mPas, is preferred for dispensing, stencil or screen printing the composition.
- Exemplary solvents that may be utilized, either separately or in combination, are glycidyl ethers, for example 1,4-butanediol diglycidyl ether; p-tert-butyl-phenyl glycidyl ether, allyl glycidyl ether, glycerol diglycidyl ether, butyldiglycol, 2-(2-butoxyethoxy)-ethylester, butylglycolacetate, acetic acid, 2-butoxyethylester, butylglycol, 2-butoxyethanol, isophorone, 3,3,5 trimethyl-2-cyclohexene-1-one, dimethylsuccinate, dimethylglutarate, dimethyladipate, water, acetic acid, dipropylene glycol (mono)methyl ether, propylacetate, glycidyl ether of alkyl phenol (commercially available from Cardolite Corporation as Cardolite NC513), although other solvents may be utilized.
- Additional ingredients, such as organic additives, may be included in the formulation to provide desired properties. Various additives that may be included are surface active agents, surfactants, wetting agents, antioxidants, thixotropes, reinforcement materials, silane functional perfluoroether, phosphate functional perfluoroether, Canes, titanates, wax, phenol formaldehyde, air release agents, flow additives, adhesion promoters, rheology modifiers, surfactants, spacer beads and mixtures thereof. The ingredients are specifically chosen to obtain the desired balance of properties for the use of the resins utilized in the particular composition. The additional ingredient comprises up to about 20 weight percent of the composition and preferably up to about 10 weight percent of the composition.
- The composition is combined and then applied by dispensing, stencil, screen, rotogravure or flexo printing onto a substrate to form conductive tracts or electronic circuitry, followed by curing and/or drying to produce conductivity. Typically, the composition is cured and/or dried at 120° C. for about 10 minutes. The composition may be cured and/or dried at higher temperatures for less time. In general, these compositions provide sheet resistivity of less than 0.100 Ohm/square/25 μm.
- The invention is further illustrated by the following non-limiting example.
- A comparative Sample 1 and Samples A-G were prepared by dissolving the binder in a heated solvent (40° C.) with stirring until a homogenous mixture was formed, The samples were cooled to room temperature, filler was added, and the mixture stirred for an additional 30 minutes. As needed, a 3-roll mill (Buhler) was used to mil the compositions. Each composition was applied as a track of 100×2 mm with a thickness of about 5-8 μm on a polyester sheet. The composition was cured and/or dried at 120° C. for 10 minutes, after which the sheet resistance was measured using a Keithley 2000 Multimeter. Sheet resistivity (SR) was calculated by the formula:
-
- where
- R(tr)=Resistance track (in Ohm)
- W(tr)=Width of the track (in mm)
- H(tr)=Thickness of the track (in gm)
- L(tr)=Length of the track (in mm)
- The formulations of the compositions and the sheet resistivity for each are reported in Table 1: Compositions and Sheet Resistivity.
-
TABLE 1 1 (g) A (g) B (g) C (g) D (g) E (g) F (g) G (g) Formulation Components Binder - ESTANE 5703P1 5.2 5.2 5.2 5.2 5.4 Binder - UCAR VAGH2 4.0 4.0 4.0 4.0 4.2 6.5 Binder - PKHC3 9.1 Binder - Bakelite Hartz 16.0 9132KP4 Solvent - Dibasicesters5 40.8 40.8 40.8 40.8 34.3 Solvent - Butylglycolacetate6 27.3 Solvent - Propylacetate7 28.5 Solvent - Arcosolv DPM8 12.6 Filler - Silver flake9 50.0 30.0 35.0 25.0 Filler - Silver plated copper 20.0 15.0 25.0 ZS-71010 Filler - Silver plated copper 52.3 63.6 65.0 65.5 NZS 61011 Organic Additive - BYK 35412 0.65 Organic Additive - Glycerol13 5.81 Sheet Resistivity 0.010 0.032 0.024 0.040 0.050 0.032 0.019 0.084 (Ohm/square/25 μm) 1Polyester-type thermoplastic polyurethane available from Noveon, Ohio, USA 2Vinylchloride vinylalcohol vinylacetate copolymer available from Dow Chemical, Belgium 3Phenoxy resin available from Inchem, South Carolina, USA 4Phenolicresin available from Bakelite, Germany 5Mixture of dimethylsuccinate, dimethyladipate and dimethyglutarate available from Keyser & McKay, Netherlands 62(2-butoxy-ethoxy) ethanol available from Chemproha, Netherland 7n-propylacetate available from Chemproha, Netherland 8Dipropylene Glycol (Mono)Methyl Ether available from Arco, Missouri, USA 9Silver flake available from Ferro, Ohio, USA 10Silver plated copper available from Ames Goldsmith, New York, USA 11Silver plated copper available from Ames Goldsmith, New York, USA 12Polyacrylate in solution available from BYK, Germany 131,2,3 propanetriol available from Chemproha, Netherland - Comparative Sample 1 with silver flake filler had a sheet resistivity of 0.010 Ohms/square/25 μm. Samples made with mixtures of silver flakes and silver plated coppers (Samples A-C) had comparable sheet resistivity to the Comparative Sample 1 and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron. Samples made with only silver plated copper, without any silver flakes (Samples D-G), also resulted in comparable sheet resistivity values to Comparative Sample 1, and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron. Samples D-G demonstrated that various binder systems may be used to result in comparable sheet resistivity values as Comparative Sample 1, and acceptable sheet resistivity, lower than 0.100 Ohm/square/25 micron.
- Many modifications and variations of this invention can be made without departing from its spirit and scope, as will be apparent to those skilled in the art. The specific embodiments described herein are offered by way of example only, and the invention is to be limited only by the terms of the appended claims, along with the full scope of equivalents to which such claims are entitled.
Claims (16)
1. An electrically conductive composition comprising a binder, and filler particles having a core plated with silver, wherein said composition has a sheet resistivity of less than about 0.100 Ohm/square/25 micron.
2. The conductive composition of claim 1 , wherein the core is selected from the group consisting of copper, nickel, palladium, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, glass, polymers, antimony doped tin oxide, silica, alumina, fiber, clay, and mixtures thereof.
3. The conductive composition of claim 2 , wherein the core is copper.
4. The conductive composition of claim 1 , wherein the binder is selected from the group consisting of polyurethane elastomers, polyesters, phenolic resins, acrylic polymers, acrylic block copolymers, acrylic polymers having tertiary-alkyl amide functionality, polysiloxane polymers, polystyrene copolymers, polyvinyl polymers, divinylbenzene copolymers, polyetheramides, polyvinyl acetals, polyvinyl butyrals, polyvinyl acetols, polyvinyl alcohols, polyvinyl acetates, polyvinyl chlorides, methylene polyvinyl ethers, cellulose acetates, styrene acrylonitriles, amorphous polyolefins, thermoplastic urethanes, polyacrylonitriles, ethylene vinyl acetate copolymers, ethylene vinyl acetate terpolymers, functional ethylene vinyl acetates, ethylene acrylate copolymers, ethylene acrylate terpolymers, ethylene butadiene copolymers and/or block copolymers, styrene butadiene block copolymers, and mixtures thereof.
5. The conductive composition of claim 4 , wherein the binder is selected from the group consisting of polyurethane elastomers, polyesters, phenolic resins, copoloymer of polyvinylalcohol, polyvinylacetate and polyvinylchloride, and mixtures thereof.
6. The conductive composition of claim 1 , wherein the binder is selected from the group consisting of phenolics, urethanes, phenoxy resins, polyesters, epoxies, melamines and mixtures thereof.
7. The conductive composition of claim 6 , wherein the binder is phenolic resins.
8. The conductive composition of claim 1 , wherein the composition further comprising electrically conductive filler material selected from the group consisting of silver, copper, gold, palladium, platinum, nickel, gold or silver-coated nickel, carbon black, carbon fiber, graphite, aluminum, indium tin oxide, silver coated copper, silver coated aluminum, metallic coated glass spheres, metallic coated filler, metallic coated polymers, silver coated fiber, silver coated spheres, antimony doped tin oxide, conductive nanospheres, nano silver, nano aluminum, nano copper, nano nickel, carbon nanotubes or mixtures thereof.
9. The conductive composition of claim 1 , wherein the composition further comprising surface active agents, surfactants, wetting agents, antioxidants, thixotropes, reinforcement materials, silane functional perfluoroether, phosphate functional perfluoroether, silanes, titanates, wax, phenol formaldehyde, air release agents, flow additives, adhesion promoters, rheology modifiers, surfactants, spacer beads or mixtures thereof.
10. The conductive composition of claim 1 , wherein the filler particles comprise in the range of about 20 to about 70 weight percent of the composition.
11. The conductive composition of claim 1 , wherein the binder comprises in the range of about 2 to about 40 weight percent of the composition.
12. The conductive composition of claim 8 , wherein the electrically conductive filler material comprise in the range of up to about 40 weight percent of the composition.
13. An electrically conductive composition comprising a polyurethane elastomer, one or more silver plated copper particles and at least one solvent.
14. An electronic device comprising the electrically conductive composition of claim 1 .
15. A process for making or forming an electronic device with the conductive composition of claim 1 comprising applying the conductive composition by dispensing, stencil, screen rotogravure or flexo printing onto a substrate to form conductive tracts or electronic circuitry, and curing and/or drying said conductive composition at about 120° C. for about 10 minutes.
16. A process for making or forming an electronic device with the conductive composition of claim 13 comprising applying the conductive composition by dispensing, stencil, screen rotogravure or flexo printing onto a substrate to form conductive tracts or electronic circuitry, and curing and/or drying said conductive composition at about 120° C. for about 10 minutes.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/722,891 US20100209599A1 (en) | 2007-09-13 | 2010-03-12 | Electrically Conductive Composition |
US14/711,003 US10388423B2 (en) | 2007-09-13 | 2015-05-13 | Electrically conductive composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2007/078334 WO2009035453A1 (en) | 2007-09-13 | 2007-09-13 | Electrically conductive composition |
US12/722,891 US20100209599A1 (en) | 2007-09-13 | 2010-03-12 | Electrically Conductive Composition |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/078334 Continuation WO2009035453A1 (en) | 2007-09-13 | 2007-09-13 | Electrically conductive composition |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/711,003 Continuation US10388423B2 (en) | 2007-09-13 | 2015-05-13 | Electrically conductive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100209599A1 true US20100209599A1 (en) | 2010-08-19 |
Family
ID=40452284
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/722,891 Abandoned US20100209599A1 (en) | 2007-09-13 | 2010-03-12 | Electrically Conductive Composition |
US14/711,003 Active 2027-11-30 US10388423B2 (en) | 2007-09-13 | 2015-05-13 | Electrically conductive composition |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/711,003 Active 2027-11-30 US10388423B2 (en) | 2007-09-13 | 2015-05-13 | Electrically conductive composition |
Country Status (8)
Country | Link |
---|---|
US (2) | US20100209599A1 (en) |
EP (1) | EP2191482B1 (en) |
JP (1) | JP5350384B2 (en) |
KR (1) | KR101399920B1 (en) |
CN (1) | CN101919005A (en) |
PL (1) | PL2191482T3 (en) |
TW (1) | TWI424448B (en) |
WO (1) | WO2009035453A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130189501A1 (en) * | 2012-01-25 | 2013-07-25 | ExxonMobil Chemical Company Inc. - Law Technology | Coated Films |
US8608984B1 (en) * | 2010-02-23 | 2013-12-17 | Cleveland Medical Polymers, Inc. | Polymer nano-composites as dry sensor material for biosignal sensing |
CN104371454A (en) * | 2014-11-13 | 2015-02-25 | 无锡信大气象传感网科技有限公司 | High-performance conductive chip |
US20150353779A1 (en) * | 2013-01-10 | 2015-12-10 | E. I. Du Pont De Nemours And Commpany | Electrically conductive adhesives comprising fluoroelastomers |
US20150357497A1 (en) * | 2013-01-10 | 2015-12-10 | E. I. Du Pont De Nemours And Company | Electrically conductive adhesives comprising blend elastomers |
US20170194073A1 (en) * | 2014-07-31 | 2017-07-06 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive composition and conductive sheet containing the same |
CN110522077A (en) * | 2018-05-24 | 2019-12-03 | 中国科学院理化技术研究所 | A kind of conduction pipe tobacco and its preparation method and application |
CN110522081A (en) * | 2018-05-24 | 2019-12-03 | 中国科学院理化技术研究所 | A kind of thermally conductive pipe tobacco and its preparation method and application |
WO2021045307A1 (en) * | 2019-09-06 | 2021-03-11 | (주)바이오니아 | Conductive paste composition comprising silver-coated copper nanowire with core-shell structure and conductive film comprising same |
US11069455B2 (en) * | 2017-11-29 | 2021-07-20 | Inoviscoat Gmbh | Composition for producing an electrically conductive layer, in particular for an electroluminescence device |
CN114656724A (en) * | 2022-03-30 | 2022-06-24 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding enhanced polyamide composition and application thereof |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470041B (en) | 2008-06-09 | 2015-01-21 | Basf Se | Dispersion for the application of a metal layer |
TWI496168B (en) * | 2008-07-03 | 2015-08-11 | Henkel IP & Holding GmbH | Thixotropic conductive composition |
US8299159B2 (en) | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
KR101130235B1 (en) * | 2009-12-21 | 2012-03-26 | (주)켐스 | Transparent Conductors and Method of Preparing Same |
KR101266296B1 (en) | 2009-12-30 | 2013-05-24 | 제일모직주식회사 | Polyester resin composition and molded product using the same |
KR101141442B1 (en) * | 2009-12-30 | 2012-05-03 | 삼성전기주식회사 | Conductive paste compositon for inner electrode and method of manufactuaring multilayer ceramic capacitor using thesame |
JP5570353B2 (en) * | 2010-09-03 | 2014-08-13 | バイエル マテリアルサイエンス株式会社 | Conductive member having elastic wiring |
JP5780147B2 (en) * | 2011-01-06 | 2015-09-16 | スリーボンドファインケミカル株式会社 | Conductive paint |
WO2012099877A1 (en) * | 2011-01-18 | 2012-07-26 | Heraeus Precious Metals North America Conshohocken Llc | Electroconductive paste compositions and solar cell electrodes and contacts made therefrom |
CN103563011B (en) * | 2011-07-21 | 2016-11-09 | 日立化成株式会社 | Conductive material |
CN102443365B (en) * | 2011-10-16 | 2013-11-06 | 上海晶华粘胶制品发展有限公司 | Adhesive for conductive adhesive tapes, and conductive adhesive tape |
KR101349465B1 (en) | 2011-11-29 | 2014-01-10 | 롯데케미칼 주식회사 | Resin compositions for encapsulant of photovoltaic modules including metal material increasing long term stability |
CN102643605B (en) * | 2012-05-15 | 2014-04-23 | 北京中宇科博环保工程有限公司 | Anti-flaming static electricity conducting organic silicon nano ceramic coating used for coal-mine gas drainage pipeline |
CN103013226B (en) * | 2012-12-26 | 2014-10-15 | 赵婕 | Conductive ink composition and preparation method thereof |
CN103031058B (en) * | 2012-12-31 | 2015-06-03 | 武汉今福科技有限公司 | Room temperature vulcanized silicone rubber electromagnetic shielding paint and preparation method thereof |
CN103045012B (en) * | 2013-01-18 | 2014-09-10 | 广东佳景科技有限公司 | Anti-static water-based ink and preparation method thereof |
WO2014113937A1 (en) | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Flexible conductive ink |
JP6107195B2 (en) | 2013-02-12 | 2017-04-05 | 日本軽金属株式会社 | Method for manufacturing aluminum conductive member |
WO2014192869A1 (en) | 2013-05-29 | 2014-12-04 | 日本軽金属株式会社 | Conducting member |
WO2015140943A1 (en) * | 2014-03-18 | 2015-09-24 | 日立金属株式会社 | Electroconductive resin composition and pressure sensor |
RU2566247C1 (en) * | 2014-04-17 | 2015-10-20 | Виктор Дмитриевич Ерошенко | Electrical product made from current-conducting composite material and method of making same |
RU2573594C1 (en) * | 2014-08-07 | 2016-01-20 | Общество с ограниченной ответственностью "Инжиниринговая компания "Теплофон" | Resistive carbon composite material |
US10306755B2 (en) | 2014-12-08 | 2019-05-28 | Fujikura Ltd. | Stretchable board |
ITUB20151080A1 (en) * | 2015-05-27 | 2016-11-27 | Barzaghi S R L | ELECTROTHERMIC COMPOSITION OF WATER BASED CARBON COMPOUNDS AND APPLICATION METHODS |
KR102633369B1 (en) * | 2015-08-03 | 2024-02-06 | 헨켈 아게 운트 코. 카게아아 | Achievement of electromagnetic interference shielding protection by deposition of highly conductive compositions |
US10081735B1 (en) | 2016-09-02 | 2018-09-25 | Teikoku Printing Inks Mfg. Co. Ltd. | Conductive liquid composition |
DE102017113750A1 (en) * | 2017-06-21 | 2018-12-27 | Schreiner Group Gmbh & Co. Kg | Foil construction with electrical functionality and external contacting |
CN107459674A (en) * | 2017-08-17 | 2017-12-12 | 合肥路政通反光材料有限公司 | A kind of method of modifying of reflective membrane glass microballoon |
WO2019065089A1 (en) * | 2017-09-29 | 2019-04-04 | 古河電気工業株式会社 | Anisotropically conductive sheet and anisotropically conductive sheet manufacturing method |
JP6915204B2 (en) * | 2018-02-13 | 2021-08-04 | 日進化成株式会社 | Method of forming a conductive protective film |
WO2019188023A1 (en) * | 2018-03-27 | 2019-10-03 | 日本ゼオン株式会社 | Conductive sheet, method for producing same, and conductive composition |
DE102018119964A1 (en) * | 2018-08-16 | 2020-02-20 | Universität Kassel | Plastic composite material with at least one filler introduced into a plastic matrix |
CN109852145A (en) * | 2018-12-28 | 2019-06-07 | 西安理工大学 | Biology base electrically conductive ink and its preparation method and application |
US11261341B2 (en) * | 2019-05-07 | 2022-03-01 | Xerox Corporation | Conductive ink composition and article of manufacture made therefrom |
KR102119059B1 (en) * | 2019-08-02 | 2020-06-04 | 김지협 | Method for producing fabric of bag with carbon fiber |
CN111087939A (en) * | 2019-12-05 | 2020-05-01 | 江苏晶华新材料科技有限公司 | Conductive adhesive tape |
RU2746270C1 (en) * | 2020-10-06 | 2021-04-12 | Общество с ограниченной ответственностью «Научное предприятие Монокристалл Пасты» | Polymer conductive paste for solar cells with heterojunctions |
RU2762374C1 (en) * | 2021-04-29 | 2021-12-20 | Общество с ограниченной ответственностью «Научное предприятие Монокристалл Пасты» | Method for forming a current-collecting contact on the surface of solar cells with a heterojunction |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
JPH09180542A (en) * | 1995-12-25 | 1997-07-11 | Hitachi Chem Co Ltd | Conductive paste |
US5744285A (en) * | 1996-07-18 | 1998-04-28 | E. I. Du Pont De Nemours And Company | Composition and process for filling vias |
US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
US6096413A (en) * | 1993-09-10 | 2000-08-01 | Chomerics, Inc. | Form-in-place EMI gaskets |
US6241914B1 (en) * | 1997-04-11 | 2001-06-05 | Potters Industries, Inc. | Electroconductive composition composite suitable for making same and methods for producing such composition and composite |
US20050224764A1 (en) * | 2002-06-14 | 2005-10-13 | Hyperion Catalysis International, Inc. | Electroconductive carbon fibril-based inks snd coatings |
US20060043346A1 (en) * | 2001-10-05 | 2006-03-02 | Kodas Toivo T | Precursor compositions for the deposition of electrically conductive features |
WO2006093398A1 (en) * | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Conductive inks and manufacturing method thereof |
WO2006129487A1 (en) * | 2005-05-30 | 2006-12-07 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using same |
US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
US20070164260A1 (en) * | 2003-09-26 | 2007-07-19 | Hideji Kuwajima | Mixed conductive power and use thereof |
US20080261049A1 (en) * | 2004-08-03 | 2008-10-23 | Hiroki Hayashi | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts |
US8071888B2 (en) * | 2005-03-11 | 2011-12-06 | Toyo Ink. Mfg. Co., Ltd. | Electrically conductive ink, electrically conductive circuit, and non-contact-type medium |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3983075A (en) | 1974-06-21 | 1976-09-28 | Kennecott Copper Corporation | Copper filled conductive epoxy |
US4382981A (en) | 1979-07-26 | 1983-05-10 | Acheson Industries, Inc. | Method for shielding electronic equipment by coating with copper containing composition |
US4305847A (en) | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
JPS56103260A (en) | 1980-01-22 | 1981-08-18 | Asahi Kagaku Kenkyusho:Kk | Conductive paint containing copper powder |
US4387115A (en) | 1980-08-08 | 1983-06-07 | Mitsui Toatsu Chemicals, Inc. | Composition for conductive cured product |
EP0144849B1 (en) | 1983-11-30 | 1987-09-09 | Nissan Chemical Industries Ltd. | Electrically conductive composition |
US4747966A (en) | 1984-03-30 | 1988-05-31 | Lion Corporation | Electrically conductive thermoplastic resin and coating compositions |
EP0170063B1 (en) | 1984-07-31 | 1988-08-24 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
JPS6167702A (en) | 1984-09-07 | 1986-04-07 | Mitsui Mining & Smelting Co Ltd | Electrically conductive powder and electrically conductive composition using said powder |
US4818438A (en) | 1985-07-19 | 1989-04-04 | Acheson Industries, Inc. | Conductive coating for elongated conductors |
US4818437A (en) | 1985-07-19 | 1989-04-04 | Acheson Industries, Inc. | Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability |
CA1261481A (en) | 1986-03-13 | 1989-09-26 | Kazumasa Eguchi | Printed circuit board capable of preventing electromagnetic interference |
JPS62225573A (en) | 1986-03-28 | 1987-10-03 | Fukuda Metal Foil & Powder Co Ltd | Copper powder for electrically conductive paste |
EP0239901B1 (en) | 1986-03-31 | 1992-11-11 | Tatsuta Electric Wire & Cable Co., Ltd | Conductive copper paste composition |
JPS63165457A (en) | 1986-12-27 | 1988-07-08 | Lion Corp | Electrically conductive resin composition |
US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
JP2611347B2 (en) | 1987-07-24 | 1997-05-21 | 三菱化学株式会社 | Copper-based conductive coating composition |
JPH0615680B2 (en) | 1987-10-20 | 1994-03-02 | 三井金属鉱業株式会社 | Copper powder for conductive paint and its manufacturing method |
US5068150A (en) | 1988-02-01 | 1991-11-26 | Mitsui Kinzoku Kogyo Kabushiki Kaisha | Copper powder for electroconductive paints and electroconductive paint compositions |
JPH0253869A (en) | 1988-08-18 | 1990-02-22 | Asahi Chem Ind Co Ltd | Electron beam curing type electrically conductive coating |
GB8913512D0 (en) | 1989-06-13 | 1989-08-02 | Cookson Group Plc | Coated particulate metallic materials |
JP2619289B2 (en) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | Copper conductive composition |
US5175024A (en) | 1989-10-03 | 1992-12-29 | Akzo N.V. | Processes for preparation of oxidation resistant metal powders |
JP2702796B2 (en) | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | Silver alloy conductive paste |
JP2660937B2 (en) | 1990-07-16 | 1997-10-08 | 三井金属鉱業株式会社 | Copper conductive composition |
JPH07116389B2 (en) | 1991-05-31 | 1995-12-13 | タツタ電線株式会社 | Conductive paint |
US5372749A (en) | 1992-02-19 | 1994-12-13 | Beijing Technology Of Printing Research Institute Chinese | Method for surface treating conductive copper powder with a treating agent and coupler |
US5736070A (en) | 1992-10-13 | 1998-04-07 | Tatsuta Electric Wire And Cable Co., Ltd. | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
JPH06336563A (en) | 1993-04-02 | 1994-12-06 | Showa Denko Kk | Conductive coating material |
JPH08161929A (en) * | 1994-12-05 | 1996-06-21 | Hitachi Chem Co Ltd | Conductive material and conductive paste using it |
JPH10134636A (en) * | 1996-10-30 | 1998-05-22 | Hitachi Chem Co Ltd | Conductive powder, conductive paste, and electric circuit using conductive paste |
US6620344B2 (en) | 1999-05-28 | 2003-09-16 | Dowa Mining Co., Ltd. | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste |
US6515237B2 (en) * | 2000-11-24 | 2003-02-04 | Hitachi Chemical Company, Ltd. | Through-hole wiring board |
JP3646259B2 (en) | 2001-04-27 | 2005-05-11 | 同和鉱業株式会社 | Copper powder for conductive paste with excellent oxidation resistance and method for producing the same |
JP3890205B2 (en) | 2001-05-10 | 2007-03-07 | 三井金属鉱業株式会社 | Surface-treated copper powder for copper paste, method for producing the surface-treated copper powder, copper paste using the surface-treated copper powder, and printed wiring board using the copper paste |
EP1284278B1 (en) * | 2001-08-14 | 2013-01-23 | Benecke-Kaliko AG | Aqueous coating composition for the preparation of electrically conductive coatings on textiles |
JP4146119B2 (en) | 2001-12-04 | 2008-09-03 | Jfeミネラル株式会社 | Copper alloy powder for conductive paste |
JP4389148B2 (en) | 2002-05-17 | 2009-12-24 | 日立化成工業株式会社 | Conductive paste |
JP2004056148A (en) | 2002-07-17 | 2004-02-19 | Ngk Spark Plug Co Ltd | Copper paste and wiring substrate using same |
JP4544837B2 (en) | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | Copper paste for ceramic wiring board, ceramic wiring board, and method for manufacturing ceramic wiring board |
US8999200B2 (en) | 2002-07-23 | 2015-04-07 | Sabic Global Technologies B.V. | Conductive thermoplastic composites and methods of making |
JP4178374B2 (en) | 2002-08-08 | 2008-11-12 | 三井金属鉱業株式会社 | Silver coated flake copper powder, method for producing the silver coated flake copper powder, and conductive paste using the silver coated flake copper powder |
JP4182234B2 (en) | 2002-09-20 | 2008-11-19 | Dowaエレクトロニクス株式会社 | Copper powder for conductive paste and method for producing the same |
JP4128424B2 (en) | 2002-10-28 | 2008-07-30 | Dowaエレクトロニクス株式会社 | Method for producing copper powder for conductive pastes with excellent oxidation resistance and sinterability |
JP4144695B2 (en) | 2002-11-01 | 2008-09-03 | 三井金属鉱業株式会社 | Two-layer coated copper powder, method for producing the two-layer coated copper powder, and conductive paste using the two-layer coated copper powder |
JP4144694B2 (en) | 2002-11-01 | 2008-09-03 | 三井金属鉱業株式会社 | Tin-coated copper powder, method for producing the tin-coated copper powder, and conductive paste using the tin-coated copper powder |
JP4204849B2 (en) | 2002-11-12 | 2009-01-07 | Dowaエレクトロニクス株式会社 | Production method of fine copper powder |
JP4145127B2 (en) | 2002-11-22 | 2008-09-03 | 三井金属鉱業株式会社 | Flake copper powder, method for producing the flake copper powder, and conductive paste using the flake copper powder |
JP2004183060A (en) | 2002-12-04 | 2004-07-02 | Mitsui Mining & Smelting Co Ltd | Polyaniline-based resin coated copper powder, its manufacturing method, and conductive paste obtained by using the powder |
JP4448962B2 (en) | 2003-01-14 | 2010-04-14 | Dowaエレクトロニクス株式会社 | Manufacturing method of nickel-coated fine copper powder |
US7108806B2 (en) | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
CN1788323A (en) | 2003-03-18 | 2006-06-14 | 陶氏康宁公司 | A conductive composition and method of using the same |
US7037447B1 (en) * | 2003-07-23 | 2006-05-02 | Henkel Corporation | Conductive ink compositions |
US7828994B2 (en) * | 2004-10-26 | 2010-11-09 | Ortec, Inc. | Conductive paint compositions for forming conductive coatings on substrates |
CN101000810B (en) | 2007-01-05 | 2010-06-23 | 华南理工大学 | Conduction composite |
DE102007042253A1 (en) | 2007-09-06 | 2009-03-12 | Carl Freudenberg Kg | Printable and conductive paste and method for coating a material with the paste |
-
2007
- 2007-09-13 KR KR1020107006979A patent/KR101399920B1/en active IP Right Grant
- 2007-09-13 JP JP2010524825A patent/JP5350384B2/en not_active Expired - Fee Related
- 2007-09-13 CN CN2007801009092A patent/CN101919005A/en active Pending
- 2007-09-13 PL PL07814826T patent/PL2191482T3/en unknown
- 2007-09-13 WO PCT/US2007/078334 patent/WO2009035453A1/en active Application Filing
- 2007-09-13 EP EP07814826.9A patent/EP2191482B1/en active Active
-
2008
- 2008-05-16 TW TW097117991A patent/TWI424448B/en active
-
2010
- 2010-03-12 US US12/722,891 patent/US20100209599A1/en not_active Abandoned
-
2015
- 2015-05-13 US US14/711,003 patent/US10388423B2/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
US6096413A (en) * | 1993-09-10 | 2000-08-01 | Chomerics, Inc. | Form-in-place EMI gaskets |
JPH09180542A (en) * | 1995-12-25 | 1997-07-11 | Hitachi Chem Co Ltd | Conductive paste |
US5744285A (en) * | 1996-07-18 | 1998-04-28 | E. I. Du Pont De Nemours And Company | Composition and process for filling vias |
US6241914B1 (en) * | 1997-04-11 | 2001-06-05 | Potters Industries, Inc. | Electroconductive composition composite suitable for making same and methods for producing such composition and composite |
US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
US20060043346A1 (en) * | 2001-10-05 | 2006-03-02 | Kodas Toivo T | Precursor compositions for the deposition of electrically conductive features |
US20050224764A1 (en) * | 2002-06-14 | 2005-10-13 | Hyperion Catalysis International, Inc. | Electroconductive carbon fibril-based inks snd coatings |
US20070164260A1 (en) * | 2003-09-26 | 2007-07-19 | Hideji Kuwajima | Mixed conductive power and use thereof |
US20080261049A1 (en) * | 2004-08-03 | 2008-10-23 | Hiroki Hayashi | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts |
WO2006093398A1 (en) * | 2005-03-04 | 2006-09-08 | Inktec Co., Ltd. | Conductive inks and manufacturing method thereof |
US20080206488A1 (en) * | 2005-03-04 | 2008-08-28 | Inktec Co., Ltd. | Conductive Inks and Manufacturing Method Thereof |
US8071888B2 (en) * | 2005-03-11 | 2011-12-06 | Toyo Ink. Mfg. Co., Ltd. | Electrically conductive ink, electrically conductive circuit, and non-contact-type medium |
WO2006129487A1 (en) * | 2005-05-30 | 2006-12-07 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using same |
US20090220738A1 (en) * | 2005-05-30 | 2009-09-03 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using the same |
US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8608984B1 (en) * | 2010-02-23 | 2013-12-17 | Cleveland Medical Polymers, Inc. | Polymer nano-composites as dry sensor material for biosignal sensing |
US9591979B2 (en) | 2010-02-23 | 2017-03-14 | Cleveland Medical Polymers, Inc | Polymer nano-composites as dry sensor material for biosignal sensing |
CN104080844A (en) * | 2012-01-25 | 2014-10-01 | 金达胶片美国有限责任公司 | Coated films |
US8877325B2 (en) * | 2012-01-25 | 2014-11-04 | Jindal Films Americas, Llc | Coated films |
US20130189501A1 (en) * | 2012-01-25 | 2013-07-25 | ExxonMobil Chemical Company Inc. - Law Technology | Coated Films |
US9089871B2 (en) | 2012-01-25 | 2015-07-28 | Jindal Films Americas Llc | Methods for making coated films |
US10032945B2 (en) * | 2013-01-10 | 2018-07-24 | E I Du Pont De Nemours And Company | Electrically conductive adhesives comprising blend elastomers |
US20150353779A1 (en) * | 2013-01-10 | 2015-12-10 | E. I. Du Pont De Nemours And Commpany | Electrically conductive adhesives comprising fluoroelastomers |
US20150357497A1 (en) * | 2013-01-10 | 2015-12-10 | E. I. Du Pont De Nemours And Company | Electrically conductive adhesives comprising blend elastomers |
US10030176B2 (en) * | 2013-01-10 | 2018-07-24 | E I Du Pont De Nemours And Company | Electrically conductive adhesives comprising fluoroelastomers |
US20170194073A1 (en) * | 2014-07-31 | 2017-07-06 | Tatsuta Electric Wire & Cable Co., Ltd. | Conductive composition and conductive sheet containing the same |
CN104371454A (en) * | 2014-11-13 | 2015-02-25 | 无锡信大气象传感网科技有限公司 | High-performance conductive chip |
US11069455B2 (en) * | 2017-11-29 | 2021-07-20 | Inoviscoat Gmbh | Composition for producing an electrically conductive layer, in particular for an electroluminescence device |
CN110522077A (en) * | 2018-05-24 | 2019-12-03 | 中国科学院理化技术研究所 | A kind of conduction pipe tobacco and its preparation method and application |
CN110522081A (en) * | 2018-05-24 | 2019-12-03 | 中国科学院理化技术研究所 | A kind of thermally conductive pipe tobacco and its preparation method and application |
WO2021045307A1 (en) * | 2019-09-06 | 2021-03-11 | (주)바이오니아 | Conductive paste composition comprising silver-coated copper nanowire with core-shell structure and conductive film comprising same |
CN114656724A (en) * | 2022-03-30 | 2022-06-24 | 金发科技股份有限公司 | Conductive master batch, electromagnetic shielding enhanced polyamide composition and application thereof |
Also Published As
Publication number | Publication date |
---|---|
KR101399920B1 (en) | 2014-05-28 |
PL2191482T3 (en) | 2017-08-31 |
EP2191482A1 (en) | 2010-06-02 |
WO2009035453A1 (en) | 2009-03-19 |
TW200912961A (en) | 2009-03-16 |
CN101919005A (en) | 2010-12-15 |
EP2191482B1 (en) | 2017-03-08 |
JP5350384B2 (en) | 2013-11-27 |
US20150248946A1 (en) | 2015-09-03 |
TWI424448B (en) | 2014-01-21 |
JP2010539650A (en) | 2010-12-16 |
EP2191482A4 (en) | 2012-11-28 |
KR20100074165A (en) | 2010-07-01 |
US10388423B2 (en) | 2019-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10388423B2 (en) | Electrically conductive composition | |
US10995232B2 (en) | Flexible conductive ink | |
US7722786B2 (en) | Conductive materials | |
US20090169724A1 (en) | Conductive paste for use in membrane touch switch applications | |
CN102119427A (en) | Conductive adhesive and LED substrate using the same | |
CN105264614A (en) | Photonic sintering of polymer thick film copper conductor compositions | |
CN101645318A (en) | Conductive silver paste special for circuit of laptop keyboard and preparation method thereof | |
CN104272400A (en) | Electroconductive composition | |
JP4507750B2 (en) | Conductive paste | |
CN108305704A (en) | A kind of graphene-based High-conductivity carbon slurry and preparation method thereof | |
CN103646686A (en) | Conductive composition | |
KR101340554B1 (en) | Electrode paste composition and Electrode comprising the same | |
JP2010059409A (en) | Conductive ink | |
CN102820072A (en) | Conductive paste | |
KR100750331B1 (en) | Thermosetting carbon resistance paste composition | |
JP2001273816A (en) | Conductive paste | |
KR20080055238A (en) | Composition for emi shield paint | |
JP2008184599A (en) | Electroconductive ink, electroconductive circuit and noncontact type media | |
KR20120135545A (en) | Dispersed liquid manufacturing process for flake conversion of ag-cu powder and electrode paste manufacturing process | |
CN104934101A (en) | Carbon nanotube containing printed circuit board silver paste and preparation method thereof | |
CN104934099A (en) | Printed circuit board silver paste with low silver content and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HENKEL AG & CO. KGAA, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VAN VEEN, PETER ADRIANUS;PRENT, CORINA;SIGNING DATES FROM 20100405 TO 20100408;REEL/FRAME:035628/0424 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |