US20100246132A1 - Fastener and heat sink assembly having the same - Google Patents
Fastener and heat sink assembly having the same Download PDFInfo
- Publication number
- US20100246132A1 US20100246132A1 US12/492,149 US49214909A US2010246132A1 US 20100246132 A1 US20100246132 A1 US 20100246132A1 US 49214909 A US49214909 A US 49214909A US 2010246132 A1 US2010246132 A1 US 2010246132A1
- Authority
- US
- United States
- Prior art keywords
- post
- heat sink
- engaging member
- locking arms
- knob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The disclosure generally relates to fasteners and, more particularly, to a fastener capable of conveniently assembling and disassembling a heat sink on and from a printed circuit board, and a heat sink assembly including such a fastener.
- 2. Description of Related Art
- Electronic components, such as central processing units (CPUs) comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the CPUs in order to maintain safe operating conditions and assure that the CPUs function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a finned metal heat sink is attached to an outer surface of the CPU to remove the heat therefrom. The heat absorbed by the heat sink is then dissipated to ambient air. The related finned metal heat sink is made of highly heat-conductive metal, such as copper or aluminum, and generally comprises a base contacting the CPU to absorb the heat therefrom and a plurality of fins formed on the base for dissipating the heat.
- Conventionally, a linear-type clip is used to secure the heat sink to the heat generating electronic device by fastening the heat sink to a printed circuit board on which the heat generating device is mounted. The linear-type clip, which is integrally made from a resilient metal wire, generally includes an elongated pressing portion and a pair of locking arms extending from opposite ends of the elongated pressing portion in opposite directions. When assembled, the elongated pressing portion of the clip abuts against the base of the heat sink toward the heat generating device, and the locking arms are resiliently engaged with clasps provided on the printed circuit board to thereby secure the heat sink to the heat generating electronic device.
- In order to ensure a reliable securement between the heat sink and the heat generating device, the clip has to be deformed largely to produce a large pressure on the heat sink, which requires a user to manipulate the clip with a large force during assembling. However, due to having the resilient linear-type structure, the clip can only provide a very limited contacting area to be handled. It is very inconvenient for the user to apply such a large force on the very limited contacting area of the clip. Accordingly, the assembly efficiency thereof is low.
- What is needed, therefore, is a fastener capable of overcoming the above-described problems.
- Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat sink assembly with a printed circuit board in accordance with an embodiment of the disclosure. -
FIG. 2 is an exploded view of the heat sink assembly with the printed circuit board ofFIG. 1 . -
FIG. 3 is an exploded view of a fastener of the heat sink assembly ofFIG. 1 . -
FIG. 4 is an inverted view ofFIG. 3 . -
FIG. 5 is a partially enlarged view of the heat sink assembly with the printed circuit board ofFIG. 1 , wherein the fastener of the heat sink assembly is pre-assembled. -
FIG. 6 is a partially enlarged view of the heat sink assembly with the printed circuit board ofFIG. 1 , wherein the fastener is unlocked. -
FIG. 7 is a partially enlarged view of the heat sink assembly with the printed circuit board ofFIG. 1 , wherein the fastener is locked. - Referring to
FIGS. 1-2 , a heat sink assembly in accordance with an embodiment of the disclosure is mounted on a printedcircuit board 30 to dissipate heat generated by anelectronic component 40 on the printedcircuit board 30. The heat sink assembly comprises aheat sink 10 and fourfasteners 20 fixing theheat sink 10 to the printedcircuit board 30. The printedcircuit board 30 defines four throughholes 50 near two pairs of diagonally opposite corners of theelectronic component 40. - The
heat sink 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. Theheat sink 10 comprises arectangular base 12, a plurality offins 14 extending upwardly from a top face of thebase 12 and a plurality ofheat pipes 16 connecting thefins 14 to thebase 12. Thefins 14 are spaced from and parallel to each other. A passage is defined between every twoadjacent fins 14 to allow an airflow therethrough. Two pairs ofears 18 extend from two pairs of diagonally opposite corners of thebase 12, respectively. Eachear 18 defines amounting hole 180 adjacent to a distal end thereof. Themounting holes 180 of theears 18 are located corresponding to the throughholes 50 of the printedcircuit board 30. Theheat pipes 16 are juxtaposed to each other. Each of theheat pipes 16 has a U-shaped configuration and comprises two parallel heat-conducting sections and an arced connecting section interconnecting the two heat-conducting sections. One of the two heat-conducting sections of eachheat pipe 16 is sandwiched between thebase 12 and thefins 14. Another one of the two heat-conducting sections of eachheat pipe 16 extends perpendicularly through and thermally connects thefins 14. - Also referring to
FIGS. 3-4 , eachfastener 20 comprises a cap-shaped head 22, apost 24 extending downwardly from a bottom of thehead 22, anelastic member 26 such as a spring positioned around thepost 24 and anengaging member 28 engaging with a bottom of thepost 24. Acrisscross groove 220 is defined in a top face of thehead 22 adapted for facilitating a tool to operate thefastener 20. Thepost 24 has a cylindrical configuration. A diameter of thepost 24 is less than that of thehead 22. A bottom of thepost 24 symmetrically splits up to two opposite parts, whereby a pair of lockingarms 240 are formed. The two lockingarms 240 define agap 244 therebetween. A bottom face of eachlocking arm 240 is concaved upwardly to form a tapered guiding face. The two tapered guiding faces of the two lockingarms 240 cooperatively define a guidingportion 241 in an inverted funnel-shape (seeFIG. 4 ). Twoelongated baffle ribs 242 project inwardly and horizontally from inner faces of the two lockingarms 240, respectively. The twobaffle ribs 242 are oriented towards each other and positioned above the guidingportion 241. A part of thegap 244 which is positioned above thebaffle ribs 242 is expanded, thereby forming a receivingportion 243 having a width greater than other parts of thegap 244. Thepost 24 defines anannular groove 245 along a circumference thereof. Thegroove 245 is located at a middle of the lockingarms 240 and higher than thereceiving portion 243. Thefastener 20 is further provided with a fasteningcollar 100 received in thegroove 245 and hooping the two lockingarms 240. Theengaging member 28 is fixed to aback plate 60 which is positioned at a bottom side of the printedcircuit board 30 opposite to theelectronic component 40. Theengaging member 28 extends through a corresponding throughhole 50 of the printedcircuit board 30 for engaging with the two lockingarms 240 of thepost 24. Theengaging member 28 comprises acircular plate 280, a cylindricalmain body 282 extending upwardly from a top face of theplate 280, aknob 284 and a vertical supportingportion 286 extending from a top face of themain body 282 and supporting theknob 284. Theplate 280 of theengaging member 28 is mounted in theback plate 60. A circumference of theplate 280 has a toothed structure for tightly engaging with theback plate 60, thereby preventing theengaging member 28 from rotation when assembling theheat sink 10 to theback plate 60. Theknob 284 is inserted into the receivingportion 243 through the guidingportion 241 of thepost 24. A circumference of a top end of theknob 284 is chamfered for fitting with the guidingportion 241 of thepost 24, thereby facilitating locking of the engagingmember 28 to thepost 24. Theplate 280 is coaxial with themain body 282 and theknob 284. The supportingportion 286 is a vertically-extended, flat plate, having a rectangular shape. The supportingportion 286 is perpendicular to themain body 282 and theknob 284. Two opposite outer faces of the supportingportion 286 are continuous with an outer circumference of theknob 284. A distance between the two opposite outer faces of the supportingportion 286, i.e., the thickness of the supportingportion 286, is less than or equal to a distance between the twobaffle ribs 242. A distance between another two opposite outer faces of the supportingportion 286, i.e., the width of the supportingportion 286, is less than that a diameter of theknob 284 and larger than the distance between the twobaffle ribs 242. A bottom of theknob 284 forms two steps symmetrically located at two opposite lateral sides of the supportingportion 286 respectively. - Also referring to
FIGS. 5 through 7 , in assembly of the present heat sink assembly, theheat sink 10 is disposed on theelectronic component 40 mounted on the printedcircuit board 30. The engagingmembers 28 of thefastener 20 are fixed to theback plate 60 and correspondingly extend through the throughholes 50 of the printedcircuit board 30. Thepost 24 of eachfastener 20 extends through the corresponding mountinghole 180 of thebase 12 of theheat sink 10. Theelastic member 26 is compressed between thehead 22 of thefastener 20 and anannular gasket 200 hooping thepost 24 of thefastener 20 and sitting on theear 18 of thebase 12. Thefastening collar 100 is placed below theear 18 to snap thepost 24 at thegroove 245. Thus, thefastener 20 is preassembled to theheat sink 10 and theback plate 60 as shown inFIG. 5 . At this position, the engagingmember 28 is released from thepost 24 with theknob 284 of the engagingmember 28 readily fitting in the guidingportion 241 of thepost 24. Then thepost 24 is pressed downwardly by the tool, wherein the twoarms 240 split outwardly by insertion of theknob 284 of the engagingmember 28 into the receivingportion 243 of thepost 24. As theknob 284 substantially entering the receivingportion 243 of thepost 24, the tool is released from thehead 22 to facilitate locking of thefastener 20. Two different situations may appear in the locking of thefastener 20 depending upon relative positions between the engagingmember 28 and the post 24: if the supportingportion 286 of the engagingmember 28 is not parallel to thegap 244 between the twoarms 240 as shown inFIG. 6 , due to the supportingportion 286 expanding thegap 244 between the twobaffle ribs 242, a torsion force would be produced to force thepost 24 to rotate with respect to the supportingportion 286 of the engagingmember 28. Until thepost 24 is rotated to a position where thegap 244 between the twoarms 240 is parallel to the supportingportion 286 of the engagingmember 28, thegap 244 would return its original width where the supportingportion 286 could be fittingly received between the twobaffle ribs 242, whereby thepost 24 is locked with the engagingmember 28. If the supportingportion 286 of the engagingmember 28 is parallel to thegap 244, thepost 24 would be directly locked with the engagingmember 28 without rotation. At the fixed position shown inFIG. 7 , theknob 284 of the engagingmember 28 is sandwiched between two lockingarms 240 of thepost 24 and received in the receivingportion 243, the twobaffle ribs 242 press on the bottom face of theknob 284 and are positioned oppositely relative to the supportingportion 286 of the engagingmember 28. The compressedelastic member 26 generates a resilient force on theheat sink 10 and thehead 22. Thehead 22 together with thepost 24 is pushed upwardly by the resilient force, and theknob 284 of the engagingmember 28 clasped by the two lockingarms 240 of thepost 24 is pulled upwardly by thepost 24, thereby driving theback plate 60 engaging with the engagingmembers 28 to abut against the printedcircuit board 30 upwardly. On the other hand, theheat sink 10 is urged downwardly towards the printedcircuit board 30 by the resilient force. Thus, theheat sink 10 is firmly attached to theelectronic component 40 mounted on the printedcircuit board 30 by thefasteners 20. - Referring to
FIGS. 1 through 7 again, in disassembly of the present heat sink assembly, thehead 22, together with thepost 24, is rotated along clockwise or anti-clockwise direction relative to an axis thereof towards a released position where the supportingportion 286 of the engagingmember 28 is perpendicular to thegap 244 between the twoarms 240, the twobaffle ribs 242 of the two lockingarms 240 are rotated relative to the supportingportion 286 of the engagingmember 28, and the two lockingarms 240 are splayed gradually by the supportingportion 286. When the released position is reached where thebaffle ribs 242 no longer abut against the bottom face of theknob 284, the lockingarms 240 are pushed to move upwardly by the force generated by theelastic member 26 and finally escape from the engagingmember 28. - Due to automatic-locking structure of the
fastener 20, theheat sink 10 can be conveniently assembled to or disassembled from the printedcircuit board 30 just by rotation of thehead 22 of thefastener 20; thus, the assembling and disassembling efficiency of the heat sink assembly is improved. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN200910301136 | 2009-03-25 | ||
CN200910301136.5 | 2009-03-25 | ||
CN200910301136.5A CN101848623B (en) | 2009-03-25 | 2009-03-25 | Heat abstractor |
Publications (2)
Publication Number | Publication Date |
---|---|
US7796390B1 US7796390B1 (en) | 2010-09-14 |
US20100246132A1 true US20100246132A1 (en) | 2010-09-30 |
Family
ID=42710987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/492,149 Expired - Fee Related US7796390B1 (en) | 2009-03-25 | 2009-06-26 | Fastener and heat sink assembly having the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US7796390B1 (en) |
CN (1) | CN101848623B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110299253A1 (en) * | 2010-06-02 | 2011-12-08 | Vincotech Holdings S.A.R.L. | Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink |
US20130048820A1 (en) * | 2011-08-22 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device supporting apparatus |
US20130077251A1 (en) * | 2011-09-27 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
US20150000868A1 (en) * | 2013-06-28 | 2015-01-01 | International Business Machines Corporation | Method and system for thermomechanically decoupling heatsink |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101621908A (en) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | Heat sink and method for mounting heat sink |
CN102146944A (en) * | 2010-02-05 | 2011-08-10 | 鸿富锦精密工业(深圳)有限公司 | Fixing device and heat radiation module using same |
CN102378529A (en) * | 2010-08-09 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Guiding device |
CN102480889A (en) * | 2010-11-25 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | Fixing device |
CN102543914A (en) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator |
CN102654785A (en) * | 2011-03-02 | 2012-09-05 | 鸿富锦精密工业(深圳)有限公司 | Memory fixing device |
TW201313110A (en) * | 2011-09-05 | 2013-03-16 | Foxconn Tech Co Ltd | Heat dissipation device |
CN102983110B (en) * | 2011-09-07 | 2015-11-18 | 富瑞精密组件(昆山)有限公司 | Heat abstractor |
TW201333412A (en) * | 2012-02-09 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | Heat sink assembly |
TW201334678A (en) * | 2012-02-15 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | Heat dissipating assembly |
CN202841813U (en) * | 2012-09-20 | 2013-03-27 | 中兴通讯股份有限公司 | Radiator fixing device |
US9310859B2 (en) | 2013-11-12 | 2016-04-12 | International Business Machines Corporation | Liquid cooling of multiple components on a circuit board |
CN104936415A (en) * | 2014-03-19 | 2015-09-23 | 奇鋐科技股份有限公司 | Radiator fastener and heat radiation module device |
TWI589220B (en) * | 2015-12-04 | 2017-06-21 | 英業達股份有限公司 | Heat dissipation module |
CN106848717B (en) * | 2016-12-20 | 2020-06-30 | 富士康(昆山)电脑接插件有限公司 | Electrical connector assembly |
CN107577285B (en) * | 2017-07-05 | 2022-01-14 | 超聚变数字技术有限公司 | Processor fixing structure, assembly and computer equipment |
US10764990B1 (en) * | 2019-04-23 | 2020-09-01 | Adlink Technology Inc. | Heat-dissipating module having an elastic mounting structure |
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CN2395502Y (en) * | 1999-06-25 | 2000-09-06 | 富准精密工业(深圳)有限公司 | Radiator fastener |
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CN1848035A (en) * | 2005-04-14 | 2006-10-18 | 富准精密工业(深圳)有限公司 | Locking module |
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2009
- 2009-03-25 CN CN200910301136.5A patent/CN101848623B/en not_active Expired - Fee Related
- 2009-06-26 US US12/492,149 patent/US7796390B1/en not_active Expired - Fee Related
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US6307748B1 (en) * | 2000-04-20 | 2001-10-23 | Foxconn Precision Components Co., Ltd. | Heat sink clip assembly |
US7042727B2 (en) * | 2003-09-26 | 2006-05-09 | Intel Corporation | Heat sink mounting and interface mechanism and method of assembling same |
US7126823B2 (en) * | 2003-12-19 | 2006-10-24 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
US7180743B2 (en) * | 2003-12-26 | 2007-02-20 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Fastener for heat sink |
US7342796B2 (en) * | 2005-06-03 | 2008-03-11 | Southco, Inc. | Captive shoulder nut assembly |
US7359200B2 (en) * | 2005-08-26 | 2008-04-15 | Illinois Tool Works Inc. | Fastener with snap-on feature, heat dissipation assembly for central processing unit and method of using the same |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110299253A1 (en) * | 2010-06-02 | 2011-12-08 | Vincotech Holdings S.A.R.L. | Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink |
US20130048820A1 (en) * | 2011-08-22 | 2013-02-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device supporting apparatus |
US8967586B2 (en) * | 2011-08-22 | 2015-03-03 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Heat dissipating device supporting apparatus |
US20130077251A1 (en) * | 2011-09-27 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat sink mounting device |
US8773857B2 (en) * | 2011-09-27 | 2014-07-08 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink mounting device |
US20150000868A1 (en) * | 2013-06-28 | 2015-01-01 | International Business Machines Corporation | Method and system for thermomechanically decoupling heatsink |
US9550258B2 (en) * | 2013-06-28 | 2017-01-24 | Globalfoundries Inc. | Method and system for thermomechanically decoupling heatsink |
Also Published As
Publication number | Publication date |
---|---|
CN101848623A (en) | 2010-09-29 |
CN101848623B (en) | 2013-06-05 |
US7796390B1 (en) | 2010-09-14 |
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