US20110162828A1 - Thermal plug for use with a heat sink and method of assembling same - Google Patents
Thermal plug for use with a heat sink and method of assembling same Download PDFInfo
- Publication number
- US20110162828A1 US20110162828A1 US12/652,916 US65291610A US2011162828A1 US 20110162828 A1 US20110162828 A1 US 20110162828A1 US 65291610 A US65291610 A US 65291610A US 2011162828 A1 US2011162828 A1 US 2011162828A1
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- US
- United States
- Prior art keywords
- plug member
- plug
- heat sink
- thermal
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 230000000295 complement effect Effects 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 6
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the subject matter described herein relates generally to cooling an object and, more specifically, to cooling an electronic component using a thermal plug and a heat sink.
- At least some known heat sinks absorb and/or dissipate heat from an object. Moreover, at least some known heat sinks are used in a variety of applications including refrigeration, heat engines, and cooling electronic devices. With recent technological developments in electronic devices, considerable efforts have been made to develop heat sinks that are reliable and efficient.
- Some known heat sinks include a thermal plug that facilitates transferring heat from an electronic device to the heat sink.
- a surface of the plug is positioned parallel to a surface of the electronic device.
- such known plugs contact only a highest point of the electronic device, which results in an increase in thermal resistance and, in at least some instances, an overheating of the electronic device.
- a plug for use with a heat sink body and an electronic device.
- the plug includes a first plug member and a second plug member.
- the first plug member defines a socket therein.
- the second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
- a heat sink assembly for use with a printed circuit board coupled to an electronic device.
- the heat sink assembly includes a heat sink body and a thermal plug.
- the heat sink body defines a heat sink cavity therein.
- the thermal plug is positioned within the heat sink cavity.
- the thermal plug includes a first plug member and a second plug member.
- the first plug member defines a socket therein, and the second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
- FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly including a thermal plug that includes a first plug member and a second plug member;
- FIG. 2 is a schematic top view of the first plug member shown in FIG. 1 ;
- FIG. 4 is a schematic top view of the second plug member shown in FIG. 1 ;
- FIG. 5 is a schematic cross-sectional side view of the second plug member shown in FIG. 1 ;
- FIG. 6 is a perspective view of an exemplary mask that may be used with the thermal plug shown in FIG. 1 ;
- FIG. 7 is a flow chart illustrating an exemplary method for assembling the heat sink assembly shown in FIG. 1 .
- the methods and apparatus described herein relate to cooling an electronic component using a thermal plug having a bottom surface that is substantially flat.
- the thermal plug is positioned on the electronic component such that a surface of the electronic component is in contact with the bottom surface of the thermal plug.
- the thermal plug is configured to facilitate positioning the bottom surface of the thermal plug to be substantially parallel to the surface of the electronic component.
- FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly 100 including a ball grid array (BGA) package 102 , a printed circuit board (PCB) 104 , a heat sink body 106 , and a thermal plug 108 .
- BGA ball grid array
- PCB printed circuit board
- BGA package 102 includes at least one substrate 110 having a top surface 112 and a bottom surface 114 .
- an electronic device 116 is attached to substrate top surface 112 , and a plurality of solder balls 118 are disposed on substrate bottom surface 114 .
- the term “electronic device” refers to an object to be cooled using a thermal plug such as described herein. Examples of electronic devices include, without limitation, a semiconductor chip, a microprocessor, a digital signal processor, a graphics processing unit, an integrated circuit, and/or any other suitable heat-generating device.
- electronic device 116 has a top surface 120 that is substantially flat.
- heat sink body 106 has a first surface 132 and a sidewall 134 that at least partially defines a cavity 136 .
- heat sink body 106 is fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment, heat sink body 106 is fabricated from aluminum, copper, aluminum alloy, aluminum composite, copper alloy, copper composite, and/or graphite.
- thermal plug 108 facilitates transferring heat from electronic device 116 to heat sink body 106 .
- thermal plug 108 includes a female body or, more broadly, a first plug member 138 and a male heat spreader or, more broadly, a second plug member 140 .
- first plug member 138 and second plug member 140 are fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment, first plug member 138 and second plug member 140 is fabricated from aluminum, copper, and/or silver.
- first plug member 138 and/or at least a portion of second plug member 140 is plated using an electroless process for environmental protection of the base metal. More specifically, in the exemplary embodiment, at least a portion of first plug member and/or at least a portion of second plug member 140 has an electroless nickel plate finish. In an alternate embodiment, at least a portion of first plug member 138 and/or at least a portion of second plug member 140 is plated with Indium to reduce a contact resistance of first plug member 138 and second plug member 140 .
- FIG. 2 is a schematic top view of first plug member 138
- FIG. 3 is a schematic cross-sectional side view of first plug member 138
- first plug member 138 is substantially cylindrical and has a top surface 142 , a bottom surface 144 , and a sidewall 146 .
- top surface 142 and sidewall 146 are configured to substantially align with heat sink body 106 (shown in FIG. 1 ). More specifically, lop surface 140 and sidewall 146 substantially align with surface 132 and sidewall 134 (both shown in FIG. 1 ), respectively, to facilitate maintaining robust thermal contact between first plug member 138 and heat sink body 106 .
- at least a portion of top surface 142 and sidewall 146 is substantially complementary to surface 132 and sidewall 134 , respectively.
- first plug member 138 is configured to have a tolerance for a manufacturing inconsistency of heat sink body 106 .
- top surface 142 defines a cavity 148 configured to receive a biasing member therein (not shown in FIGS. 2 and 3 ), described in further detail below.
- cavity 148 is substantially centered on top surface 142 , and has a diameter of approximately 15.0 millimeters (mm) and a depth of approximately 0.50 mm.
- bottom surface 144 defines a socket 150 configured to receive second plug member 140 therein (shown in FIG. 1 ).
- socket 150 extends across at least a portion of bottom surface 144 .
- the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter of less than approximately 50.0 mm. More particularly, in the exemplary embodiment, the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter between approximately 10.0 mm and approximately 35.0 mm. Even more particularly, in the exemplary embodiment, the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter of approximately 20.0 mm to 25.0 mm.
- Biasing member 160 facilitates reducing a thermal resistance between electronic device 116 , thermal plug 150 , and/or heat sink body 106 .
- biasing member 160 facilitates positioning thermal plug 108 in robust thermal contact with electronic device 116 and/or heat sink body 106 . More specifically, biasing member 160 applies a force on thermal plug 108 to facilitate reducing a gap between thermal plug 108 and electronic device 116 to reduce a thermal resistance between electronic device 116 , thermal plug 150 , and/or heat sink body 106 .
- biasing member 160 enables thermal plug 108 to apply a substantially even pressure across top surface 120 of electronic device 116 .
- biasing member 160 maintains a constant force on thermal plug 108 through normal use, under vibration and shock, and during thermal cycling.
- biasing member 160 is a spring.
- biasing member 160 may be an elastomeric rubber material and/or a silicone material.
- biasing member 160 facilitates supporting pressures of up to approximately 50.0 pounds per square inch (psi). More particularly, in the exemplary embodiment, biasing member 160 facilitates supporting pressures of up to approximately 40.0 psi. Even more particularly, in the exemplary embodiment, biasing member 160 facilitates supporting pressures of up to approximately 30.0 psi. In the exemplary embodiment, biasing member 160 enables heat sink assembly 100 to tolerate various pressures exerted between heat sink body 106 , biasing member 160 , first plug member 138 , second plug member 140 , and/or electronic device 116 , thereby reducing a probability of exerting an uneven force across surface 120 of electronic device 116 .
- first plug member sidewall 146 has a screw thread (not shown) that extends around a periphery of first plug member 138 .
- heat sink body sidewall 134 has a corresponding screw thread (not shown) that is configured to engage the screw thread of first plug member 138 .
- a thermal interface material TIM may be applied to the screw threads to increase a contact area and, thus, reduce a thermal resistance.
- first plug member 138 is screwed into heat sink body 106 using a torque driver (not shown).
- the material surfaces include any combination of heat sink body first surface 132 , heat sink body sidewall 134 , first plug member top surface 142 , first plug member bottom surface 144 , first plug member sidewall 146 , second plug member top surface 152 , second plug member bottom surface 154 , and electronic device top surface 120 .
- TIM 162 is in a film, sheet, and/or foil form or a grease form that is spreadable.
- TIM 162 includes a filler material such as Boron Nitride and/or Aluminum Nitride.
- a TIM is the HeatSpringTM material developed by Indium Corporation.
- a layer (not shown) of an adhesive material is provided to facilitate positioning TIM 162 between the two material surfaces. More specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on at least one of heat sink body 106 , biasing member 160 , first plug member 138 , second plug member 140 , and electronic device 116 . Even more specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on any combination of heat sink body first surface 132 , heat sink body sidewall 134 , first plug member top surface 142 , first plug member bottom surface 144 , first plug member sidewall 146 , second plug member top surface 152 , second plug member bottom surface 154 , and electronic device top surface 120 . In the exemplary embodiment, the adhesive material is applied using an aerosol adhesive spray. One known embodiment of the aerosol adhesive spray is the Scotch-WeldTM product developed by 3M Corporation.
- FIG. 6 is a perspective view of an exemplary mask 164 that may be used with heat sink assembly 100 .
- mask 164 facilitates applying the adhesive material in a pattern 166 .
- mask 164 includes a plurality of openings 168 defined therethrough in an array pattern or a grid pattern 166 .
- each opening 168 has a diameter of approximately 1.0 mm.
- mask 164 shields at least a portion of the material surface to facilitate maintaining contact, and thus thermal conductivity, between two material surfaces. More specifically, in the exemplary embodiment, mask 164 is positioned such that the adhesive material is selectively applied through at least one opening 168 onto at least one of heat sink body first surface 132 , heat sink body sidewall 134 , first plug member top surface 142 , first plug member bottom surface 144 , first plug member sidewall 146 , second plug member top surface 152 , second plug member bottom surface 154 , and electronic device top surface 120 .
- thermal plug 108 and/or heat sink body 106 dissipates the heat generated by electronic device 116 . More specifically, electronic device 116 generates thermal energy, and thermal plug 108 transfers the thermal energy to heat sink body 106 .
- TIM 162 may be provided between any combination of electronic device 116 , first plug member 138 , second plug member 140 , biasing member 160 , and/or heat sink body 106 to further reduce a thermal resistance of heat sink assembly 100 .
- FIG. 7 is a flowchart 200 that illustrates an exemplary method for assembling heat sink assembly 100 (shown in FIG. 1 ).
- biasing member 160 and at least a portion of thermal plug 108 are positioned within cavity 136 .
- biasing member 160 is positioned 202 with respect to heat sink surface 132
- TIM 162 is applied to heat sink body first surface 132 and/or sidewall 134 .
- first plug member 138 is positioned 204 in direct contact with, such as coupled to, biasing member 160 such that first plug member 138 receives a portion of biasing member 160 within first plug member cavity 148 .
- first plug member 138 is oriented such that first plug member top surface 142 faces heat sink body surface 132 .
- TIM 162 is applied to first plug member bottom surface 144 . More specifically, in the exemplary embodiment, TIM 162 is provided in a ball shape (not shown) having a diameter of approximately 6.0 mm and placed at approximately the center of bottom surface 144 .
- TIM 162 is applied to BGA package 102 and, more specifically, applied to electronic device top surface 120 .
- BOA package 102 is positioned 208 with respect to second plug member 140 .
- electronic device 120 is positioned in direct contact with second plug member 140 such that electronic device top surface 120 faces second plug member bottom surface 154 .
- TIM 162 is provided 210 between any combination of heat sink body 106 , biasing member 160 , first plug member 138 , second plug member 140 , and electronic device 116 to reduce a thermal resistance of heat sink assembly 100 .
- a thin layer of the adhesive material is applied on at least one surface in a predetermined pattern to selectively position TIM 162 between any combination of heat sink body 106 , biasing member 160 , first plug member 138 , second plug member 140 , and electronic device 116 .
- mask 164 is used to apply the adhesive material in pattern 166 on at least one of heat sink body 106 , biasing member 160 , first plug member 138 , second plug member 140 , and electronic device 116 .
- the adhesive material is applied in pattern 166 on at least second plug member bottom surface 154 and electronic device top surface 120 .
- mask 164 is removed from heat sink assembly 100 .
- heat sink body 106 is securely coupled 212 to PCB 104 to increase a thermal conductivity between heat sink body 106 , thermal plug 108 , and electronic device 116 .
- a securing mechanism (not shown) is used to enable heat sink body 106 to apply 214 a constant pressure onto PCB 104 suitable to increase a thermal conductivity between thermal plug 108 and electronic device 116 without crushing electronic device 116 .
- the securing mechanism may include, without limitation, at least one clip, screw, spring, and/or clamp.
- thermal plug 108 is configured to substantially align second plug member bottom surface 154 with electronic device top surface 120 .
- second plug member 140 moves 216 , such as rotates, such that the pressure extends across electronic device top surface 120 substantially evenly.
- second plug member bottom surface 154 is forcibly aligned to be substantially parallel with electronic device top surface 120 , thereby maintaining robust thermal contact between thermal plug 108 and electronic device 116 .
- the methods and systems described herein relate to cooling an electronic component using a thermal plug and a heat sink that has a surface that at least partially defines a cavity.
- the thermal plug includes a first plug member having a bottom surface and a second plug member having a top surface that is substantially complementary to the bottom surface of the top plug member.
- the first plug member is positioned within the cavity, and the second plug member is positioned with respect to the first plug member such that the bottom surface of the first plug member is in contact with the top surface of the second plug member.
- the electronic component is positioned with respect to the second plug member such that a surface of the electronic component is in contact with a bottom surface of the second plug member.
- the thermal plug is configured to facilitate positioning the bottom surface of the second plug member to be substantially parallel to the surface of the electronic component.
- the exemplary embodiments described herein reduce a thermal resistance between the electronic component, the thermal plug, and/or the heat sink. Moreover, the exemplary embodiments described herein accommodate a manufacturing variability of at least one component. Further, the exemplary embodiments described herein apply an even pressure across a surface of the electronic component.
- Exemplary embodiments of cooling an electronic component are described above in detail.
- the methods and systems are not limited to the specific embodiments described herein, but rather, operations of the methods and components of the systems may be utilized independently and separately from other operations and/or components described herein.
- the methods and apparatus described herein may have other industrial and/or consumer applications and are not limited to practice with electronic components as described herein. Rather, one or more embodiments may be implemented and utilized in connection with other industries.
Abstract
A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
Description
- The subject matter described herein relates generally to cooling an object and, more specifically, to cooling an electronic component using a thermal plug and a heat sink.
- At least some known heat sinks absorb and/or dissipate heat from an object. Moreover, at least some known heat sinks are used in a variety of applications including refrigeration, heat engines, and cooling electronic devices. With recent technological developments in electronic devices, considerable efforts have been made to develop heat sinks that are reliable and efficient.
- Some known heat sinks include a thermal plug that facilitates transferring heat from an electronic device to the heat sink. To reduce a thermal resistance of some known plugs, a surface of the plug is positioned parallel to a surface of the electronic device. When a surface of at least some known plugs are positioned in a non-parallel arrangement to the surface of the electronic device, such known plugs contact only a highest point of the electronic device, which results in an increase in thermal resistance and, in at least some instances, an overheating of the electronic device.
- In one aspect, a method is provided for assembling a heat sink assembly. A heat sink body that defines a heat sink cavity therein is provided. At least a portion of a thermal plug is positioned within the heat sink cavity. The thermal plug includes a first plug member and a second plug member. The first plug member defines a socket therein, and the second plug member is movable within the socket. A printed circuit board is positioned with respect to the thermal plug. The printed circuit board includes an electronic device. The second plug member is movable such that a surface of the thermal plug is substantially parallel to a surface of the electronic device.
- In another aspect, a plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
- In yet another aspect, a heat sink assembly is provided for use with a printed circuit board coupled to an electronic device. The heat sink assembly includes a heat sink body and a thermal plug. The heat sink body defines a heat sink cavity therein. The thermal plug is positioned within the heat sink cavity. The thermal plug includes a first plug member and a second plug member. The first plug member defines a socket therein, and the second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
-
FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly including a thermal plug that includes a first plug member and a second plug member; -
FIG. 2 is a schematic top view of the first plug member shown inFIG. 1 ; -
FIG. 3 is a schematic cross-sectional side view of the first plug member shown inFIG. 1 ; -
FIG. 4 is a schematic top view of the second plug member shown inFIG. 1 ; -
FIG. 5 is a schematic cross-sectional side view of the second plug member shown inFIG. 1 ; -
FIG. 6 is a perspective view of an exemplary mask that may be used with the thermal plug shown inFIG. 1 ; and -
FIG. 7 is a flow chart illustrating an exemplary method for assembling the heat sink assembly shown inFIG. 1 . - The methods and apparatus described herein relate to cooling an electronic component using a thermal plug having a bottom surface that is substantially flat. The thermal plug is positioned on the electronic component such that a surface of the electronic component is in contact with the bottom surface of the thermal plug. The thermal plug is configured to facilitate positioning the bottom surface of the thermal plug to be substantially parallel to the surface of the electronic component.
-
FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly 100 including a ball grid array (BGA)package 102, a printed circuit board (PCB) 104, aheat sink body 106, and athermal plug 108. - In the exemplary embodiment, BGA
package 102 includes at least onesubstrate 110 having atop surface 112 and abottom surface 114. In the exemplary embodiment, anelectronic device 116 is attached tosubstrate top surface 112, and a plurality ofsolder balls 118 are disposed onsubstrate bottom surface 114. As used herein, the term “electronic device” refers to an object to be cooled using a thermal plug such as described herein. Examples of electronic devices include, without limitation, a semiconductor chip, a microprocessor, a digital signal processor, a graphics processing unit, an integrated circuit, and/or any other suitable heat-generating device. In the exemplary embodimentelectronic device 116 has atop surface 120 that is substantially flat. - In the exemplary embodiment, PCB 104 includes a
layer 122 having atop surface 124 and abottom surface 126. In the exemplary embodiment,layer 122 is fabricated from a dielectric material. More specifically, in the exemplary embodiment,layer 122 is fabricated from polyimide. It should be appreciated thatlayer 122 may be fabricated from any suitable material including, without limitation, a thermally conductive plastic material. In one embodiment, a copper plate is coupled to, and is coincident with,layer bottom surface 126. - Additionally, in the exemplary embodiment, PCB 104 includes a plurality of
contact pads 130 coupled to layertop surface 124. In the exemplary embodiment, the number ofcontact pads 130 corresponds to the number ofsolder balls 118. In the exemplary embodiment,solder balls 118 are attached tocontact pads 130. More specifically, eachsolder ball 118 attaches to acorresponding contact pad 130, thereby couplingBGA package 102 to PCB 104. - In the exemplary embodiment,
heat sink body 106 has afirst surface 132 and asidewall 134 that at least partially defines acavity 136. In the exemplary embodiment,heat sink body 106 is fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment,heat sink body 106 is fabricated from aluminum, copper, aluminum alloy, aluminum composite, copper alloy, copper composite, and/or graphite. - In the exemplary embodiment,
thermal plug 108 facilitates transferring heat fromelectronic device 116 toheat sink body 106. In the exemplary embodiment,thermal plug 108 includes a female body or, more broadly, afirst plug member 138 and a male heat spreader or, more broadly, asecond plug member 140. In the exemplary embodiment,first plug member 138 andsecond plug member 140 are fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment,first plug member 138 andsecond plug member 140 is fabricated from aluminum, copper, and/or silver. - In the exemplary embodiment, at least a portion of
first plug member 138 and/or at least a portion ofsecond plug member 140 is plated using an electroless process for environmental protection of the base metal. More specifically, in the exemplary embodiment, at least a portion of first plug member and/or at least a portion ofsecond plug member 140 has an electroless nickel plate finish. In an alternate embodiment, at least a portion offirst plug member 138 and/or at least a portion ofsecond plug member 140 is plated with Indium to reduce a contact resistance offirst plug member 138 andsecond plug member 140. -
FIG. 2 is a schematic top view offirst plug member 138, andFIG. 3 is a schematic cross-sectional side view offirst plug member 138. In the exemplary embodiment,first plug member 138 is substantially cylindrical and has atop surface 142, abottom surface 144, and asidewall 146. - In the exemplary embodiment,
top surface 142 andsidewall 146 are configured to substantially align with heat sink body 106 (shown inFIG. 1 ). More specifically,lop surface 140 andsidewall 146 substantially align withsurface 132 and sidewall 134 (both shown inFIG. 1 ), respectively, to facilitate maintaining robust thermal contact betweenfirst plug member 138 andheat sink body 106. In the exemplary embodiment, at least a portion oftop surface 142 andsidewall 146 is substantially complementary tosurface 132 andsidewall 134, respectively. Moreover, in the exemplary embodiment,first plug member 138 is configured to have a tolerance for a manufacturing inconsistency ofheat sink body 106. - In the exemplary embodiment,
top surface 142 defines acavity 148 configured to receive a biasing member therein (not shown inFIGS. 2 and 3 ), described in further detail below. In the exemplary embodiment,cavity 148 is substantially centered ontop surface 142, and has a diameter of approximately 15.0 millimeters (mm) and a depth of approximately 0.50 mm. Moreover, in the exemplary embodiment,bottom surface 144 defines asocket 150 configured to receivesecond plug member 140 therein (shown inFIG. 1 ). In the exemplary embodiment,socket 150 extends across at least a portion ofbottom surface 144. -
FIG. 4 is a schematic top view ofsecond plug member 140, andFIG. 5 is a schematic cross-sectional side view ofsecond plug member 140. In the exemplary embodiment,second plug member 140 is substantially cylindrical and has atop surface 152 and abottom surface 154. - In the exemplary embodiment, second plug
member top surface 152 is configured to substantially align with first plug member 138 (shown inFIG. 1 ). More specifically,top surface 152 substantially aligns with bottom surface 144 (shown inFIG. 1 ) to facilitate maintaining robust thermal contact betweensecond plug member 140 andfirst plug member 138. In the exemplary embodiment, at least a portion ofbottom surface 144 is substantially complementary totop surface 152. More specifically, in the exemplary embodiment,bottom surface 144 is a substantially concave surface andtop surface 152 is a substantially convex surface. Alternatively,bottom surface 144 may be a substantially convex surface andtop surface 152 may be a substantially concave surface. - In the exemplary embodiment, the concave shape of
bottom surface 144 and the convex shape oftop surface 152 each has a diameter of less than approximately 50.0 mm. More particularly, in the exemplary embodiment, the concave shape ofbottom surface 144 and the convex shape oftop surface 152 each has a diameter between approximately 10.0 mm and approximately 35.0 mm. Even more particularly, in the exemplary embodiment, the concave shape ofbottom surface 144 and the convex shape oftop surface 152 each has a diameter of approximately 20.0 mm to 25.0 mm. - As shown in
FIGS. 2-5 ,first plug member 138 has afirst diameter 156, andsecond plug member 158 has asecond diameter 158. Particularly, in the exemplary embodiment, first andsecond diameters second diameters second diameters second diameter 158 may be greater thanfirst diameter 156 to increase a relative heat spreading ability ofsecond plug member 140. - Referring back to
FIG. 1 , electronic devicetop surface 120 is configured to substantially align withsecond plug member 140. More specifically,top surface 120 is substantially aligned withbottom surface 154 to facilitate maintaining robust thermal contact betweenelectronic device 116 andsecond plug member 140. In the exemplary embodiment, at least a portion oftop surface 120 is substantially complementary tobottom surface 154. More specifically, in the exemplary embodiment,top surface 120 andbottom surface 154 are substantially flat. Moreover, in the exemplary embodiment,second plug member 140 is configured to tolerate any manufacturing imperfection ofelectronic device 116. - Referring to
FIGS. 1-5 , and in the exemplary embodiment,second plug member 140 is movable withinsocket 150. More specifically, in the exemplary embodiment, second plugmember top surface 152 is rotatable withinsocket 150 in a plurality of directions along first plugmember bottom surface 144, thereby enabling second plugmember bottom surface 154 to substantially align with electronic devicetop surface 120. - In the exemplary embodiment, a biasing
member 160 is positioned betweenthermal plug 150 andheat sink body 106. More specifically, in the exemplary embodiment, biasingmember 160 is positioned withincavity 148 defined by first plugmember top surface 142. -
Biasing member 160 facilitates reducing a thermal resistance betweenelectronic device 116,thermal plug 150, and/orheat sink body 106. In the exemplary embodiment, biasingmember 160 facilitates positioningthermal plug 108 in robust thermal contact withelectronic device 116 and/orheat sink body 106. More specifically, biasingmember 160 applies a force onthermal plug 108 to facilitate reducing a gap betweenthermal plug 108 andelectronic device 116 to reduce a thermal resistance betweenelectronic device 116,thermal plug 150, and/orheat sink body 106. Moreover, in the exemplary embodiment, biasingmember 160 enablesthermal plug 108 to apply a substantially even pressure acrosstop surface 120 ofelectronic device 116. In the exemplary embodiment, biasingmember 160 maintains a constant force onthermal plug 108 through normal use, under vibration and shock, and during thermal cycling. In the exemplary embodiment, biasingmember 160 is a spring. Alternatively, biasingmember 160 may be an elastomeric rubber material and/or a silicone material. - In the exemplary embodiment, biasing
member 160 facilitates supporting pressures of up to approximately 50.0 pounds per square inch (psi). More particularly, in the exemplary embodiment, biasingmember 160 facilitates supporting pressures of up to approximately 40.0 psi. Even more particularly, in the exemplary embodiment, biasingmember 160 facilitates supporting pressures of up to approximately 30.0 psi. In the exemplary embodiment, biasingmember 160 enables heat sink assembly 100 to tolerate various pressures exerted betweenheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, and/orelectronic device 116, thereby reducing a probability of exerting an uneven force acrosssurface 120 ofelectronic device 116. - In an alternate embodiment, first
plug member sidewall 146 has a screw thread (not shown) that extends around a periphery offirst plug member 138. Moreover, in the alternate embodiment, heatsink body sidewall 134 has a corresponding screw thread (not shown) that is configured to engage the screw thread offirst plug member 138. In the alternate embodiment, a thermal interface material (TIM) may be applied to the screw threads to increase a contact area and, thus, reduce a thermal resistance. In the alternate embodiment,first plug member 138 is screwed intoheat sink body 106 using a torque driver (not shown). - In the exemplary embodiment, a thermal interface material (TIM) 162 is provided between two material surfaces to facilitate reducing a thermal resistance between the two material surfaces. More specifically, in the exemplary embodiment,
TIM 162 is applied between two material surfaces to decrease a gap between the two material surfaces and reduce a thermal resistance between the two material surfaces. In the exemplary embodiment, the material surfaces include any combination ofheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, andelectronic device 116. More specifically, in the exemplary embodiment, the material surfaces include any combination of heat sink bodyfirst surface 132, heatsink body sidewall 134, first plugmember top surface 142, first plugmember bottom surface 144, firstplug member sidewall 146, second plugmember top surface 152, second plugmember bottom surface 154, and electronic devicetop surface 120. - In the exemplary embodiment,
TIM 162 is in a film, sheet, and/or foil form or a grease form that is spreadable. In the exemplary embodiment,TIM 162 includes a filler material such as Boron Nitride and/or Aluminum Nitride. One known embodiment of a TIM is the HeatSpring™ material developed by Indium Corporation. - In the exemplary embodiment, a layer (not shown) of an adhesive material is provided to facilitate
positioning TIM 162 between the two material surfaces. More specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on at least one ofheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, andelectronic device 116. Even more specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on any combination of heat sink bodyfirst surface 132, heatsink body sidewall 134, first plugmember top surface 142, first plugmember bottom surface 144, firstplug member sidewall 146, second plugmember top surface 152, second plugmember bottom surface 154, and electronic devicetop surface 120. In the exemplary embodiment, the adhesive material is applied using an aerosol adhesive spray. One known embodiment of the aerosol adhesive spray is the Scotch-Weld™ product developed by 3M Corporation. -
FIG. 6 is a perspective view of anexemplary mask 164 that may be used with heat sink assembly 100. In the exemplary embodiment,mask 164 facilitates applying the adhesive material in apattern 166. More specifically, in the exemplary embodiment,mask 164 includes a plurality ofopenings 168 defined therethrough in an array pattern or agrid pattern 166. In the exemplary embodiment, eachopening 168 has a diameter of approximately 1.0 mm. - In the exemplary embodiment,
mask 164 shields at least a portion of the material surface to facilitate maintaining contact, and thus thermal conductivity, between two material surfaces. More specifically, in the exemplary embodiment,mask 164 is positioned such that the adhesive material is selectively applied through at least oneopening 168 onto at least one of heat sink bodyfirst surface 132, heatsink body sidewall 134, first plugmember top surface 142, first plugmember bottom surface 144, firstplug member sidewall 146, second plugmember top surface 152, second plugmember bottom surface 154, and electronic devicetop surface 120. - During operation,
electronic device 116 generates heat, andthermal plug 108 and/orheat sink body 106 dissipates the heat generated byelectronic device 116. More specifically,electronic device 116 generates thermal energy, andthermal plug 108 transfers the thermal energy toheat sink body 106.TIM 162 may be provided between any combination ofelectronic device 116,first plug member 138,second plug member 140, biasingmember 160, and/orheat sink body 106 to further reduce a thermal resistance of heat sink assembly 100. -
FIG. 7 is aflowchart 200 that illustrates an exemplary method for assembling heat sink assembly 100 (shown inFIG. 1 ). Referring toFIGS. 1-6 , and in the exemplary embodiment, biasingmember 160 and at least a portion ofthermal plug 108 are positioned withincavity 136. More specifically, in the exemplary embodiment, biasingmember 160 is positioned 202 with respect toheat sink surface 132, andTIM 162 is applied to heat sink bodyfirst surface 132 and/orsidewall 134. In the exemplary embodiment,first plug member 138 is positioned 204 in direct contact with, such as coupled to, biasingmember 160 such thatfirst plug member 138 receives a portion of biasingmember 160 within firstplug member cavity 148. In the exemplary embodiment,first plug member 138 is oriented such that first plugmember top surface 142 faces heatsink body surface 132. In the exemplary embodiment,TIM 162 is applied to first plugmember bottom surface 144. More specifically, in the exemplary embodiment,TIM 162 is provided in a ball shape (not shown) having a diameter of approximately 6.0 mm and placed at approximately the center ofbottom surface 144. - In the exemplary embodiment,
second plug member 140 is positioned 206 with respect tofirst plug member 138. More specifically, in the exemplary embodiment, a portion ofsecond plug member 140 is positioned in direct contact withfirst plug member 138 such thatfirst plug member 138 receives a portion ofsecond plug member 140 withinsocket 150. In the exemplary embodiment,second plug member 140 is oriented such that second plugmember top surface 152 faces first plugmember bottom surface 144. In the exemplary embodiment,second plug member 140 is placed on the ball ofTIM 162 and applies pressure to the ball ofTIM 162 such thatTIM 162 suitably expands about at least a portion of first plugmember bottom surface 144. - In the exemplary embodiment,
TIM 162 is applied toBGA package 102 and, more specifically, applied to electronic devicetop surface 120. In the exemplary embodiment,BOA package 102 is positioned 208 with respect tosecond plug member 140. More specifically, in the exemplary embodiment,electronic device 120 is positioned in direct contact withsecond plug member 140 such that electronic devicetop surface 120 faces second plugmember bottom surface 154. - Moreover, in the exemplary embodiment,
TIM 162 is provided 210 between any combination ofheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, andelectronic device 116 to reduce a thermal resistance of heat sink assembly 100. In the exemplary embodiment, a thin layer of the adhesive material is applied on at least one surface in a predetermined pattern to selectively positionTIM 162 between any combination ofheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, andelectronic device 116. Additionally, to facilitatepositioning TIM 162 in the exemplary embodiment,mask 164 is used to apply the adhesive material inpattern 166 on at least one ofheat sink body 106, biasingmember 160,first plug member 138,second plug member 140, andelectronic device 116. Particularly, in the exemplary embodiment, the adhesive material is applied inpattern 166 on at least second plugmember bottom surface 154 and electronic devicetop surface 120. Upon application of the adhesive material,mask 164 is removed from heat sink assembly 100. - In the exemplary embodiment,
heat sink body 106 is securely coupled 212 toPCB 104 to increase a thermal conductivity betweenheat sink body 106,thermal plug 108, andelectronic device 116. In one embodiment, a securing mechanism (not shown) is used to enableheat sink body 106 to apply 214 a constant pressure ontoPCB 104 suitable to increase a thermal conductivity betweenthermal plug 108 andelectronic device 116 without crushingelectronic device 116. For example, the securing mechanism may include, without limitation, at least one clip, screw, spring, and/or clamp. - In the exemplary embodiment,
thermal plug 108 is configured to substantially align second plugmember bottom surface 154 with electronic devicetop surface 120. In the exemplary embodiment, as a pressure betweenthermal plug 108 andelectronic device 116 increases,second plug member 140 moves 216, such as rotates, such that the pressure extends across electronic devicetop surface 120 substantially evenly. In the exemplary embodiment, second plugmember bottom surface 154 is forcibly aligned to be substantially parallel with electronic devicetop surface 120, thereby maintaining robust thermal contact betweenthermal plug 108 andelectronic device 116. - The methods and systems described herein relate to cooling an electronic component using a thermal plug and a heat sink that has a surface that at least partially defines a cavity. The thermal plug includes a first plug member having a bottom surface and a second plug member having a top surface that is substantially complementary to the bottom surface of the top plug member. The first plug member is positioned within the cavity, and the second plug member is positioned with respect to the first plug member such that the bottom surface of the first plug member is in contact with the top surface of the second plug member. The electronic component is positioned with respect to the second plug member such that a surface of the electronic component is in contact with a bottom surface of the second plug member. The thermal plug is configured to facilitate positioning the bottom surface of the second plug member to be substantially parallel to the surface of the electronic component. The exemplary embodiments described herein reduce a thermal resistance between the electronic component, the thermal plug, and/or the heat sink. Moreover, the exemplary embodiments described herein accommodate a manufacturing variability of at least one component. Further, the exemplary embodiments described herein apply an even pressure across a surface of the electronic component.
- Exemplary embodiments of cooling an electronic component are described above in detail. The methods and systems are not limited to the specific embodiments described herein, but rather, operations of the methods and components of the systems may be utilized independently and separately from other operations and/or components described herein. For example, the methods and apparatus described herein may have other industrial and/or consumer applications and are not limited to practice with electronic components as described herein. Rather, one or more embodiments may be implemented and utilized in connection with other industries.
- As used herein, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural said elements or steps, unless such exclusion is explicitly stated. Further, references to “one embodiment” are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising,” “including,” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property.
- This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
Claims (20)
1. A method for assembling a heat sink assembly, said method comprising:
providing a heat sink body that defines a heat sink cavity therein;
positioning at least a portion of a thermal plug within the heat sink cavity, the thermal plug including a first plug member and a second plug member, wherein the first plug member defines a socket therein, the second plug member being movable within the socket;
positioning a printed circuit board with respect to the thermal plug, the printed circuit board including an electronic device, wherein the second plug member is movable such that a surface of the thermal plug is substantially parallel to a surface of the electronic device.
2. A method in accordance with claim 1 , wherein positioning at least a portion of a thermal plug further comprises orienting the first and second plug members such that a surface of the first plug member is adjacent to a surface of the second plug member, wherein the surface of the first plug member is substantially concave, and the surface of the second plug member is substantially convex.
3. A method in accordance with claim 1 , further comprising providing a biasing member between the thermal plug and the heat sink body.
4. A method in accordance with claim 1 , further comprising providing a thermal interface material between at least two of the heat sink body, the first plug member, the second plug member, and the electronic device.
5. A method in accordance with claim 4 , further comprising coupling an adhesive material to at least one of the heat sink body, the first plug member, the second plug member, and the electronic device, wherein the adhesive material facilitates positioning the thermal interface material.
6. A method in accordance with claim 5 , wherein coupling an adhesive material further comprises applying the adhesive material in a grid pattern.
7. A plug for use with a heat sink body and an electronic device, said plug comprising:
a first plug member defining a socket therein; and
a second plug member movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
8. A plug in accordance with claim 7 , wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said plug member.
9. A plug in accordance with claim 8 , wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex.
10. A plug in accordance with claim 7 , wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter.
11. A plug in accordance with claim 7 , further comprising a biasing member provided between the heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member.
12. A plug in accordance with claim 7 , further comprising an adhesive material coupled to at least one of said first plug member and said second plug member, wherein said adhesive material is applied in a grid pattern.
13. A heat sink assembly for use with a printed circuit board coupled to an electronic device, said heat sink assembly comprising:
a heat sink body that defines a heat sink cavity therein; and
a thermal plug positioned within the heat sink cavity, said thermal plug comprising a first plug member and a second plug member, wherein said first plug member defines a socket therein and said second plug member is movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.
14. A heat sink assembly in accordance with claim 13 , wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said second plug member.
15. A heat sink assembly in accordance with claim 14 , wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex.
16. A heat sink assembly in accordance with claim 13 , wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter.
17. A heat sink assembly in accordance with claim 13 , further comprising a biasing member provided between said heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member.
18. A heat sink assembly in accordance with claim 13 , further comprising a thermal interface material provided between at least two of said heat sink body, said first plug member, said second plug member; and the electronic device.
19. A heat sink assembly in accordance with claim 18 , further comprising an adhesive material coupled to at least one of said heat sink body, said first plug member, said second plug member, and the electronic device, wherein said adhesive material facilitates positioning said thermal interface material.
20. A heat sink assembly in accordance with claim 19 , wherein said adhesive material is applied in a grid pattern.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/652,916 US20110162828A1 (en) | 2010-01-06 | 2010-01-06 | Thermal plug for use with a heat sink and method of assembling same |
KR1020127020527A KR20120117850A (en) | 2010-01-06 | 2010-12-22 | Thermal plug for use with a heat sink and method of assembling same |
EP10803088A EP2522029A1 (en) | 2010-01-06 | 2010-12-22 | Thermal plug for use with a heat sink and method of assembling same |
PCT/EP2010/070594 WO2011083052A1 (en) | 2010-01-06 | 2010-12-22 | Thermal plug for use with a heat sink and method of assembling same |
CN2010800652414A CN102812549A (en) | 2010-01-06 | 2010-12-22 | Thermal Plug For Use With A Heat Sink And Method Of Assembling Same |
JP2012547482A JP2013516776A (en) | 2010-01-06 | 2010-12-22 | Thermal plug used in heat sink and its assembly method |
TW100100408A TW201145472A (en) | 2010-01-06 | 2011-01-05 | Thermal plug for use with a heat sink and method of assembling same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/652,916 US20110162828A1 (en) | 2010-01-06 | 2010-01-06 | Thermal plug for use with a heat sink and method of assembling same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110162828A1 true US20110162828A1 (en) | 2011-07-07 |
Family
ID=43877307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/652,916 Abandoned US20110162828A1 (en) | 2010-01-06 | 2010-01-06 | Thermal plug for use with a heat sink and method of assembling same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110162828A1 (en) |
EP (1) | EP2522029A1 (en) |
JP (1) | JP2013516776A (en) |
KR (1) | KR20120117850A (en) |
CN (1) | CN102812549A (en) |
TW (1) | TW201145472A (en) |
WO (1) | WO2011083052A1 (en) |
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KR20170003598A (en) * | 2014-06-26 | 2017-01-09 | 애플 인크. | Thermal solutions for system-in-package assemblies in portable electronic devices |
US9820373B2 (en) * | 2014-06-26 | 2017-11-14 | Apple Inc. | Thermal solutions for system-in-package assemblies in portable electronic devices |
KR101976912B1 (en) * | 2014-06-26 | 2019-05-09 | 애플 인크. | Thermal solutions for system-in-package assemblies in portable electronic devices |
Also Published As
Publication number | Publication date |
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KR20120117850A (en) | 2012-10-24 |
CN102812549A (en) | 2012-12-05 |
EP2522029A1 (en) | 2012-11-14 |
WO2011083052A1 (en) | 2011-07-14 |
TW201145472A (en) | 2011-12-16 |
JP2013516776A (en) | 2013-05-13 |
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