US20110188203A1 - Plug in led array - Google Patents

Plug in led array Download PDF

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Publication number
US20110188203A1
US20110188203A1 US12/995,107 US99510709A US2011188203A1 US 20110188203 A1 US20110188203 A1 US 20110188203A1 US 99510709 A US99510709 A US 99510709A US 2011188203 A1 US2011188203 A1 US 2011188203A1
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Prior art keywords
heat sink
led
manifold
circuit board
heat
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Abandoned
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US12/995,107
Inventor
Jason Smith
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Integration Technology Ltd
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Integration Technology Ltd
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Publication of US20110188203A1 publication Critical patent/US20110188203A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • This invention relates to an LED device, and to an arrangement in which a plurality of individual LED devices are used in an array to form a lamp.
  • LEDs are in increasingly common usage in applications in which a light source is required.
  • One such application is in the curing of inks and the like.
  • a number of LEDs are arranged in an array, the LEDs being controllable, individually, to permit irradiation of an entire irradiable area (by operation of all of the LEDs) or irradiation of just selected regions of the entire area (by operation of just some of the LEDs).
  • the LEDs used in the light source are of the type designed to emit light in the UV wavelengths. UV LEDs typically produce significant heat levels, and require cooling, in use.
  • One known LED arrangement for use in this type of application comprises an array of individually controllable UV LEDs, each of which is bonded to a common heat sink, for example of water cooled or air cooled form.
  • the LEDs used in this type of application are expensive, and are often fairly unreliable, sometimes having a life span of as low of 500 hours.
  • the applications in which the LEDs are used require all of the LEDs of the array to be in working order. If just one of the LEDs has failed, then the entire array is rendered unusable and must be replaced. Obviously, replacement of an entire array is inefficient if only one or very few of the LEDs thereof have failed. Replacement of individual LEDs of an array is a complex, time consuming operation as the LEDs need to be removed from the heat sink and, in-addition, need removal from the associated control circuit.
  • an LED device comprising an LED mounted upon a circuit board, an electrical connector carried by the circuit board, and a heat sink carried by the circuit board and arranged to conduct heat away from the LED.
  • the LED may comprise a miniature array of LEDs.
  • the LED is arranged to emit light in the UV wavelengths.
  • the heat sink is preferably of tapering form, for example of generally conical form.
  • the heat sink may be of, for example, aluminium construction but it will be appreciated that a range of other materials of good thermal conductivity, for example copper, could be used.
  • the heat sink may be of hollow form.
  • the heat sink is preferably provided with a retaining recess within which a seal device is located to permit sealing of the heat sink to a manifold.
  • the sealing device may comprise an O-ring.
  • the manifold may be arranged to be supplied with water or another liquid coolant which can flow over and around the heat sink to assist in cooling.
  • the manifold may be of sealed form including a recess into which heat sink is receivable, heat transferring from the heat sink to the manifold and from there to the coolant, in use.
  • the manifold is preferably designed to accommodate the heat sinks of a plurality of such LED devices.
  • LED device can be removed from the manifold and replaced. Replacement of the LED device is a relatively simple process. The remaining LED devices can be left in position. Consequently, there is no need to replace all of the LED devices, including those which are still operational, thus efficiency savings can be made.
  • a light collector device may be associated with the LED device.
  • the invention further relates to an LED arrangement comprising a manifold having a plurality of openings formed therein, and a plurality of LED devices of the type defined hereinbefore, the heat sink of each LED device extending through or into a respective one of the openings, and the electrical connectors of the LED devices being releasably connected to a control circuit mounted upon or associated with the manifold.
  • the openings formed in the manifold are conveniently shaped to seal with seal devices, for example in the form of O-rings, associated with the LED devices.
  • FIG. 1 is a perspective view of an LED device in accordance with one embodiment of the invention.
  • FIG. 2 is a perspective view illustrating an LED arrangement incorporating a plurality of LED devices of the type illustrated in FIG. 1 ;
  • FIG. 3 is another view of the LED arrangement, with parts omitted for clarity.
  • FIGS. 4 to 6 illustrate some alternative embodiments.
  • an LED device in accordance with one embodiment of the invention comprises a circuit board 10 which has tracks 12 formed thereon, the tracks 12 being electrically connected to connecting pins 14 . At least some of the tracks 12 are further electrically connected to a miniature array 16 of miniature light emitting diodes 18 .
  • the LED arrangement 24 comprises a manifold 26 of generally cuboid form.
  • the manifold 26 is designed to have a liquid coolant supplied thereto, and so includes inlet and outlet flow passages 28 .
  • a wide range of materials may be used in the construction of the manifold 26 and, in the arrangement illustrated it is of a translucent acrylic material.
  • the material used is preferably of relatively poor thermal conductivity in order to minimise heat transfer from the liquid coolant.
  • the manifold 26 is arranged to carry an array of LED devices of the type illustrated in FIG. 1 .
  • one face of the manifold 26 is provided with a series of openings of size and position such as to allow the heat sinks 20 of the LED devices to pass into the interior of the manifold 26 .
  • a number of types of seal device or sealing techniques may be used to achieve this.
  • the seal device takes the form of an O-ring (not shown) located in the recess 22 of each heat sink 20 , the O-rings bearing against corresponding formations provided in the manifold 26 around each opening thereof to seal the heat sinks 20 to the manifold 26 .
  • Circuit boards 30 carrying at least part of a control circuit for controlling the operation of the LED devices are mounted upon the manifold 26 , the circuit boards 30 including connectors 32 arranged to cooperate with the connecting pins 14 of the LED devices.
  • each LED device In use, whilst all of the LED devices are operating correctly, the operation of each LED device is controlled by the control circuit, control signals being transmitted to the LED devices via the connectors 32 and connecting pins 14 . It will be appreciated that, depending upon the desired mode of operation, all of the LED devices may be illuminated or, alternatively, only some of the LED devices may be illuminated at any given time. Heat from the junctions of the LED devices is conducted via the heat sinks 20 to the liquid coolant within the manifold 26 .
  • the generally frustoconical form of the heat sinks 20 results in a relatively large surface area thereof being available for heat transfer to the liquid coolant, thus assisting in heat transfer.
  • the miniature array 16 thereof is no longer operational or is no longer able to emit light at a required intensity
  • that one of the LED devices is removed from the manifold 26 and replaced with a new LED device.
  • the connecting pins 14 are disconnected from the associated connector 32 and the heat sink 20 is removed from the manifold 26 .
  • the replacement operation requires the heat sink 20 of the replacement LED device to be introduced into the appropriate opening in the manifold 26 , the connecting pins 14 to be located in cooperation with the corresponding connector 32 , and in the LED device being pushed home so that the O-ring associated with the replacement LED device forms a seal with the manifold 26 .
  • the LED arrangement is then, once again, ready for use.
  • the arrangement of the invention is advantageous in that, in the event of a failure, only the failed one or ones of the LED devices needs to be replaced, those that are still operational being kept in use. As a result, cost and efficiency saving can be made. Further, replacement can be achieved swiftly as there is no need to de-bond the LED device from a heat sink or to separate and remake a complex electrical connection with the control circuit board.
  • the heat sink 20 may simply be received within a recess formed in the manifold 26 , the manifold 26 having coolant flowing therein.
  • Such an arrangement may require the manifold to be of a material of better thermal conductivity, but does have the benefit that coolant will not be able to escape during replacement of the LED devices.
  • each heat sink 20 could be of other shapes, for example they could be cylindrical. Further, ribs or grooves, for example of straight or helical form, could be provided thereon if desired.
  • FIGS. 5 and 6 illustrate alternative designs in which the heat sink 20 is of hollow form, including a recess 20 a into which coolant fluid can be directed.
  • an inlet pipe 26 a which could be a separate component (as shown) or could be integral with the manifold 26 directs coolant into the recess 20 a to cool the heat sink 20 , the coolant flowing through an annular path between the heat sink 20 and the pipe 26 a to an outlet passage 26 b.
  • the fluid flow direction may be reversed if desired.
  • the inlet pipe 26 a and outlet passage 26 b may be arranged concentrically if desired.
  • the heat sink 20 is shown, in this embodiment, as being of generally cylindrical form but it will be appreciated that other forms, for example conical forms, are also possible. Further, the recess 20 a is shown as being of cylindrical form but could be, for example, conical, and may be provided with ribs or grooves or the like if desired.
  • FIG. 5 illustrates a modification in which coolant flows both within the recess 20 a and around the exterior of the heat sink 20 , enhancing cooling thereof.
  • a deflector 34 attached to or formed integrally with the inlet pipe 26 a and operable to deflect coolant fluid around the exterior of the heat sink 20 after having flowed along the annular passage defined between the heat sink 20 and the inlet pipe 26 a.
  • the internal and external shape of the heat sink 20 may be modified, and ribs, grooves or other formations may be provided if desired. Further, the coolant flow direction may be reversed if desired.
  • each heat sink 20 can be provided with its own flow of coolant, thus the formation of temperature gradients across the arrangement can be reduced, all of the LED devices being exposed to substantially the same level of cooling.
  • a light collector 36 is provided over the array 16 to reduce internal reflection and so enhance transmission of light from the array. It will be appreciated that similar light collectors could be used in the other described embodiments.

Abstract

An LED device comprises an LED (16) mounted upon a circuit board (10), an electrical connector (14) carried by the circuit board (10), and a heat sink (20) carried by the circuit board (10) and arranged to conduct heat away from the LED (16). An arrangement incorporating a plurality of such LED devices is also described.

Description

  • This invention relates to an LED device, and to an arrangement in which a plurality of individual LED devices are used in an array to form a lamp.
  • LEDs are in increasingly common usage in applications in which a light source is required. One such application is in the curing of inks and the like. In this application, a number of LEDs are arranged in an array, the LEDs being controllable, individually, to permit irradiation of an entire irradiable area (by operation of all of the LEDs) or irradiation of just selected regions of the entire area (by operation of just some of the LEDs). The LEDs used in the light source are of the type designed to emit light in the UV wavelengths. UV LEDs typically produce significant heat levels, and require cooling, in use.
  • One known LED arrangement for use in this type of application comprises an array of individually controllable UV LEDs, each of which is bonded to a common heat sink, for example of water cooled or air cooled form. The LEDs used in this type of application are expensive, and are often fairly unreliable, sometimes having a life span of as low of 500 hours. The applications in which the LEDs are used require all of the LEDs of the array to be in working order. If just one of the LEDs has failed, then the entire array is rendered unusable and must be replaced. Obviously, replacement of an entire array is inefficient if only one or very few of the LEDs thereof have failed. Replacement of individual LEDs of an array is a complex, time consuming operation as the LEDs need to be removed from the heat sink and, in-addition, need removal from the associated control circuit.
  • It is an object of the invention to provide an LED arrangement in which the disadvantages set out hereinbefore are overcome or of reduced effect.
  • According to the present invention there is provided an LED device comprising an LED mounted upon a circuit board, an electrical connector carried by the circuit board, and a heat sink carried by the circuit board and arranged to conduct heat away from the LED.
  • The LED may comprise a miniature array of LEDs.
  • Preferably, the LED is arranged to emit light in the UV wavelengths.
  • The heat sink is preferably of tapering form, for example of generally conical form. The heat sink may be of, for example, aluminium construction but it will be appreciated that a range of other materials of good thermal conductivity, for example copper, could be used.
  • The heat sink may be of hollow form.
  • The heat sink is preferably provided with a retaining recess within which a seal device is located to permit sealing of the heat sink to a manifold. The sealing device may comprise an O-ring. The manifold may be arranged to be supplied with water or another liquid coolant which can flow over and around the heat sink to assist in cooling.
  • Alternatively, the manifold may be of sealed form including a recess into which heat sink is receivable, heat transferring from the heat sink to the manifold and from there to the coolant, in use. The manifold is preferably designed to accommodate the heat sinks of a plurality of such LED devices.
  • It will be appreciated that, with such an arrangement, if one of the LED devices fails, that LED device can be removed from the manifold and replaced. Replacement of the LED device is a relatively simple process. The remaining LED devices can be left in position. Consequently, there is no need to replace all of the LED devices, including those which are still operational, thus efficiency savings can be made.
  • A light collector device may be associated with the LED device.
  • The invention further relates to an LED arrangement comprising a manifold having a plurality of openings formed therein, and a plurality of LED devices of the type defined hereinbefore, the heat sink of each LED device extending through or into a respective one of the openings, and the electrical connectors of the LED devices being releasably connected to a control circuit mounted upon or associated with the manifold.
  • The openings formed in the manifold are conveniently shaped to seal with seal devices, for example in the form of O-rings, associated with the LED devices.
  • The invention will further be described, by way of example, with reference to the accompanying drawings, in which:
  • FIG. 1 is a perspective view of an LED device in accordance with one embodiment of the invention;
  • FIG. 2 is a perspective view illustrating an LED arrangement incorporating a plurality of LED devices of the type illustrated in FIG. 1;
  • FIG. 3 is another view of the LED arrangement, with parts omitted for clarity; and
  • FIGS. 4 to 6 illustrate some alternative embodiments.
    •
  • Referring to FIGS. 1 to 3 of the accompanying drawings, an LED device in accordance with one embodiment of the invention comprises a circuit board 10 which has tracks 12 formed thereon, the tracks 12 being electrically connected to connecting pins 14. At least some of the tracks 12 are further electrically connected to a miniature array 16 of miniature light emitting diodes 18.
  • Bonded to the rear of the miniature array 16, and carried by the circuit board 10, is a heat sink 20. The heat sink 20 is of generally frustoconical form and defines, at a point close to its connection to the circuit board 10, a recess 22 of annular form. The heat sink 20 is of a material of good thermal conductivity, for example aluminium or copper. As shown in FIGS. 2 and 3, the LED arrangement 24 comprises a manifold 26 of generally cuboid form. The manifold 26 is designed to have a liquid coolant supplied thereto, and so includes inlet and outlet flow passages 28. A wide range of materials may be used in the construction of the manifold 26 and, in the arrangement illustrated it is of a translucent acrylic material. The material used is preferably of relatively poor thermal conductivity in order to minimise heat transfer from the liquid coolant. Although an acrylic material is used in the arrangement illustrated, it will be appreciated that the invention is not restricted to this material, or even to materials having the same or similar thermal properties thereto.
  • The manifold 26 is arranged to carry an array of LED devices of the type illustrated in FIG. 1. To this end, one face of the manifold 26 is provided with a series of openings of size and position such as to allow the heat sinks 20 of the LED devices to pass into the interior of the manifold 26. As the manifold 26 is fluid filled, in use, it is desirable to form a seal between each LED device and the manifold 26. A number of types of seal device or sealing techniques may be used to achieve this. In the arrangement illustrated the seal device takes the form of an O-ring (not shown) located in the recess 22 of each heat sink 20, the O-rings bearing against corresponding formations provided in the manifold 26 around each opening thereof to seal the heat sinks 20 to the manifold 26. It will be appreciated, however, that the invention is not restricted in this regard. Circuit boards 30 carrying at least part of a control circuit for controlling the operation of the LED devices are mounted upon the manifold 26, the circuit boards 30 including connectors 32 arranged to cooperate with the connecting pins 14 of the LED devices.
  • In use, whilst all of the LED devices are operating correctly, the operation of each LED device is controlled by the control circuit, control signals being transmitted to the LED devices via the connectors 32 and connecting pins 14. It will be appreciated that, depending upon the desired mode of operation, all of the LED devices may be illuminated or, alternatively, only some of the LED devices may be illuminated at any given time. Heat from the junctions of the LED devices is conducted via the heat sinks 20 to the liquid coolant within the manifold 26. The generally frustoconical form of the heat sinks 20 results in a relatively large surface area thereof being available for heat transfer to the liquid coolant, thus assisting in heat transfer.
  • If it is determined that one of the LED devices has developed a fault, for example the miniature array 16 thereof is no longer operational or is no longer able to emit light at a required intensity, that one of the LED devices is removed from the manifold 26 and replaced with a new LED device. During the removal operation, the connecting pins 14 are disconnected from the associated connector 32 and the heat sink 20 is removed from the manifold 26. The replacement operation requires the heat sink 20 of the replacement LED device to be introduced into the appropriate opening in the manifold 26, the connecting pins 14 to be located in cooperation with the corresponding connector 32, and in the LED device being pushed home so that the O-ring associated with the replacement LED device forms a seal with the manifold 26. The LED arrangement is then, once again, ready for use.
  • It will be appreciated that, during the removal and replacement operation the opening in the manifold 26 is not sealed and so care needs to be taken to ensure that the manifold 26 is orientated to avoid the escape of liquid coolant.
  • The arrangement of the invention is advantageous in that, in the event of a failure, only the failed one or ones of the LED devices needs to be replaced, those that are still operational being kept in use. As a result, cost and efficiency saving can be made. Further, replacement can be achieved swiftly as there is no need to de-bond the LED device from a heat sink or to separate and remake a complex electrical connection with the control circuit board.
  • Although the arrangement described hereinbefore is of a liquid cooled form, it will be appreciated that the invention is also applicable to air or gas cooled arrangements, and appropriate modifications can be made to the arrangement described herein to permit such use without departing from the scope of the invention.
  • Rather than have the coolant flow over and around the heat sink 20, the heat sink 20 may simply be received within a recess formed in the manifold 26, the manifold 26 having coolant flowing therein. Such an arrangement may require the manifold to be of a material of better thermal conductivity, but does have the benefit that coolant will not be able to escape during replacement of the LED devices.
  • Referring to FIG. 4, an LED arrangement similar to that of FIGS. 1 to 3 is shown, and it will be appreciated that in this arrangement coolant flows to each heat sink 20 in sequence. Although shown as being of generally conical form, the heat sinks 20 could be of other shapes, for example they could be cylindrical. Further, ribs or grooves, for example of straight or helical form, could be provided thereon if desired.
  • FIGS. 5 and 6 illustrate alternative designs in which the heat sink 20 is of hollow form, including a recess 20 a into which coolant fluid can be directed. As shown in FIG. 5, an inlet pipe 26 a, which could be a separate component (as shown) or could be integral with the manifold 26 directs coolant into the recess 20 a to cool the heat sink 20, the coolant flowing through an annular path between the heat sink 20 and the pipe 26 a to an outlet passage 26 b. Of course, the fluid flow direction may be reversed if desired. Further, the inlet pipe 26 a and outlet passage 26 b may be arranged concentrically if desired.
  • The heat sink 20 is shown, in this embodiment, as being of generally cylindrical form but it will be appreciated that other forms, for example conical forms, are also possible. Further, the recess 20 a is shown as being of cylindrical form but could be, for example, conical, and may be provided with ribs or grooves or the like if desired.
  • In the arrangement of FIG. 5 the coolant flows, primarily, within the recess 20 a. This need not always be the case and FIG. 6 illustrates a modification in which coolant flows both within the recess 20 a and around the exterior of the heat sink 20, enhancing cooling thereof. This is achieved by the use of a deflector 34 attached to or formed integrally with the inlet pipe 26 a and operable to deflect coolant fluid around the exterior of the heat sink 20 after having flowed along the annular passage defined between the heat sink 20 and the inlet pipe 26 a.
  • As with the other embodiments, the internal and external shape of the heat sink 20 may be modified, and ribs, grooves or other formations may be provided if desired. Further, the coolant flow direction may be reversed if desired.
  • It will be appreciated that in the arrangements of FIGS. 5 and 6 each heat sink 20 can be provided with its own flow of coolant, thus the formation of temperature gradients across the arrangement can be reduced, all of the LED devices being exposed to substantially the same level of cooling.
  • In the arrangement of FIG. 6 a light collector 36 is provided over the array 16 to reduce internal reflection and so enhance transmission of light from the array. It will be appreciated that similar light collectors could be used in the other described embodiments.
  • A number of other modifications and alterations may be made to the arrangements described herein without departing from the scope of the invention. For example, many other types of seal arrangement could be used. One possibility is the use of bonded seals, but it will be appreciated that the invention is not restricted in this regard. Further, the direction and manner in which coolant flows through the manifold and/or over the heat sinks may vary from the arrangements outlined hereinbefore, and the heat sinks may be of a wide range of shapes and sizes without departing from the scope of the invention.

Claims (13)

1. An LED device comprising an LED mounted upon a circuit board, an electrical connector carried by the circuit board, and a heat sink carried by the circuit board and arranged to conduct heat away from the LED.
2. A device according to claim 1, wherein the LED comprises a miniature array of LEDs.
3. A device according to claim 1, wherein the LED is arranged to emit light in the UV wavelengths.
4. A device according to claim 1, wherein the heat sink is of tapering form.
5. A device according to claim 4, wherein the heat sink is of generally conical form.
6. A device according to claim 1, wherein the heat sink is of hollow form.
7. A device according to claim 1, wherein the heat sink is provided with a retaining recess within which a seal device is located to permit sealing of the heat sink to a manifold.
8. A device according to claim 7, wherein the sealing device comprises an O-ring.
9. A device according to claim 7, wherein the manifold is arranged to be supplied with water or another liquid coolant which can flow over, around and/or within the heat sink to assist in cooling.
10. A device according to claim 9 further comprising means for directing cooling into the hollow interior of the heat sink.
11. A device according to claim 10 further comprising a deflector for directing coolant around the heat sink.
12. A device according to claim 7, wherein the manifold is designed to accommodate the heat sinks of a plurality of such LED devices.
13. An LED arrangement comprising a manifold having a plurality of openings formed therein, and a plurality of LED devices as claimed in claim 1, the heat sink of each LED device extending through a respective one of the openings, and the electrical connectors of the LED devices being releasably connected to a control circuit mounted upon or associated with the manifold.
US12/995,107 2008-05-29 2009-05-26 Plug in led array Abandoned US20110188203A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0809650.5 2008-05-29
GBGB0809650.5A GB0809650D0 (en) 2008-05-29 2008-05-29 LED Device and arrangement
PCT/GB2009/001317 WO2009144449A1 (en) 2008-05-29 2009-05-26 Led device and arrangement

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US20110188203A1 true US20110188203A1 (en) 2011-08-04

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US (1) US20110188203A1 (en)
EP (1) EP2279377B1 (en)
JP (1) JP2011522410A (en)
ES (1) ES2535611T3 (en)
GB (2) GB0809650D0 (en)
WO (1) WO2009144449A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103957621A (en) * 2014-05-05 2014-07-30 朱威 Potentiometer waterproof plug assembly of adjustable LED driving power supply and power supply
US20140319386A1 (en) * 2010-01-27 2014-10-30 Heraeus Noblelight Fusion Uv Inc. Micro-channel-cooled high heat load light emitting device
US8963734B2 (en) 2013-02-15 2015-02-24 Mohammad Karaki Remote controlled pricing information
US20150146404A1 (en) * 2012-06-01 2015-05-28 Sumolight Gmbh Lighting device and headlight
US20160254212A1 (en) * 2013-10-21 2016-09-01 Toyota Jidosha Kabushiki Kaisha Onboard electronic device
WO2017009099A1 (en) * 2015-07-15 2017-01-19 Heraeus Noblelight Gmbh Module-type led lamp unit and use thereof
TWI569477B (en) * 2012-08-20 2017-02-01 賀利氏諾伯燈具輻深紫外線公司 Micro-channel-cooled high heat load light emitting device
US9622380B1 (en) * 2015-09-30 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013064718A1 (en) * 2011-11-04 2013-05-10 Naplit Show Oy A lamp cooling arrangement, a lamp element and a method for cooling a lamp
CZ305612B6 (en) * 2014-11-06 2016-01-06 Varroc Lighting Systems, s.r.o. Light source
US9664371B2 (en) 2015-01-15 2017-05-30 Heraeus Noblelight America Llc Lamp head assemblies and methods of assembling the same
JP6519268B2 (en) * 2015-03-27 2019-05-29 東芝ライテック株式会社 Lighting device
CN109945144B (en) * 2019-04-17 2021-02-26 陕西科技大学 Heat absorption, pressure reduction, heat conduction and heat insulation structure for liquid quantum dot LED lamp

Citations (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729076A (en) * 1984-11-15 1988-03-01 Tsuzawa Masami Signal light unit having heat dissipating function
US5615086A (en) * 1994-05-17 1997-03-25 Tandem Computers Incorporated Apparatus for cooling a plurality of electrical components mounted on a printed circuit board
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6641284B2 (en) * 2002-02-21 2003-11-04 Whelen Engineering Company, Inc. LED light assembly
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US20040213016A1 (en) * 2003-04-25 2004-10-28 Guide Corporation Automotive lighting assembly cooling system
US20050047140A1 (en) * 2003-08-25 2005-03-03 Jung-Chien Chang Lighting device composed of a thin light emitting diode module
US20050128752A1 (en) * 2002-04-20 2005-06-16 Ewington Christopher D. Lighting module
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture
US20050168990A1 (en) * 2004-01-13 2005-08-04 Seiko Epson Corporation Light source apparatus and projection display apparatus
US20050207165A1 (en) * 2001-08-09 2005-09-22 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
US20050222295A1 (en) * 2003-01-09 2005-10-06 Con-Trol-Cure, Inc. UV Curing System and Process with Increased Light Intensity
US20050280683A1 (en) * 2005-09-20 2005-12-22 Custer Eric J Ultraviolet light-emitting diode device
US20060141851A1 (en) * 2003-02-07 2006-06-29 Nobuyuki Matsui Socket for led light source and lighting system using the socket
US20060181878A1 (en) * 2005-02-17 2006-08-17 Federal-Mogul World Wide, Inc. LED light module assembly
US20070184141A1 (en) * 2005-09-20 2007-08-09 Summit Business Products, Inc. Ultraviolet light-emitting diode device
US20070230184A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US20070268669A1 (en) * 2006-05-16 2007-11-22 Hardcore Computer, Inc. Circuit board assembly for a liquid submersion cooled electronic device
US20080043479A1 (en) * 2006-08-17 2008-02-21 Pei-Choa Wang Assembling structure for led road lamp and heat dissipating module
US20080055908A1 (en) * 2006-08-30 2008-03-06 Chung Wu Assembled structure of large-sized led lamp
US20080080189A1 (en) * 2006-09-29 2008-04-03 Pei-Choa Wang LED Illumination Apparatus
US20080089071A1 (en) * 2006-10-12 2008-04-17 Chin-Wen Wang Lamp structure with adjustable projection angle
US7374316B2 (en) * 2005-05-25 2008-05-20 Coretronic Corporation Backlight module
US20080117637A1 (en) * 2006-11-17 2008-05-22 Foxconn Technology Co., Ltd. Led lamp cooling apparatus with pulsating heat pipe
US7387406B2 (en) * 2001-06-29 2008-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US20080151029A1 (en) * 2006-12-26 2008-06-26 Konica Minolta Medical & Graphic, Inc. Inkjet recording apparatus
US20080165547A1 (en) * 2005-03-08 2008-07-10 Grant Harold Amor Led Lighting Apparatus in a Plastic Housing
US20080170367A1 (en) * 2007-01-12 2008-07-17 Tai-Sol Electronics Co., Ltd. Combination assembly of LED and liquid-vapor thermally dissipating device
US20080175008A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
US20080219007A1 (en) * 2006-12-22 2008-09-11 Nuventix, Inc. Thermal management system for LED array
US20080291631A1 (en) * 2007-05-23 2008-11-27 Leopold Hellinger Illumination unit
US20090040759A1 (en) * 2007-08-10 2009-02-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly
US20090040760A1 (en) * 2007-08-10 2009-02-12 Kuo-Hsin Chen Illumination device having unidirectional heat-dissipating route
US20090059604A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for light emitting diode module
US20090086488A1 (en) * 2003-10-09 2009-04-02 Permlight Products, Inc. LED luminaire
US20090120612A1 (en) * 2007-11-08 2009-05-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for light emitting diode module
US20090129075A1 (en) * 2007-11-16 2009-05-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat dissipation device
US20090147522A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly
US20090154171A1 (en) * 2007-12-18 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Lamp assembly having a junction box
US20090168429A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Light source module with a thermoelectric cooler
US20090244900A1 (en) * 2008-03-28 2009-10-01 Delta Electronics Inc. Illuminating device and heat-dissipating structure thereof
US20090244895A1 (en) * 2006-05-30 2009-10-01 Neobulb Technologies, Inc. Light-Emitting Diode Illuminating Equipment with High Power and High Heat Dissipation Efficiency
US7686470B2 (en) * 2007-12-31 2010-03-30 Valens Company Limited Ceiling light fixture adaptable to various lamp assemblies
US20100112683A2 (en) * 1990-11-29 2010-05-06 Applied Biosystems, Llc Thermal Cycler for Automatic Performance of the Polymerase Chain Reaction with Close Temperature Control
US20100117534A1 (en) * 2007-04-27 2010-05-13 Jen-Shyan Chen Light-Emitting Diode Illumination Apparatus
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
US7810950B2 (en) * 2008-04-23 2010-10-12 Fu Zhun Precision Industry (Shen Zhen)., Ltd. LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp
US20110026251A1 (en) * 2009-07-28 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led illuminating device
US8033706B1 (en) * 2004-09-09 2011-10-11 Fusion Optix, Inc. Lightguide comprising a low refractive index region
US8262263B2 (en) * 2007-11-16 2012-09-11 Khanh Dinh High reliability cooling system for LED lamps using dual mode heat transfer loops

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1393374B1 (en) * 2001-05-26 2016-08-24 GE Lighting Solutions, LLC High power led lamp for spot illumination
DE10251955A1 (en) * 2002-11-08 2004-05-19 Hella Kg Hueck & Co. High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure
JP4934954B2 (en) * 2003-10-15 2012-05-23 日亜化学工業株式会社 Heat sink and semiconductor device provided with heat sink
DE20317373U1 (en) * 2003-11-11 2004-01-08 Aqua Signal Aktiengesellschaft Spezialleuchtenfabrik Flight-safety warning-light e.g. for wind power plant, has heat-sink positioned transversely to plane of light radiation
JP4598422B2 (en) * 2004-03-19 2010-12-15 浜松ホトニクス株式会社 Laser array module and cooling manifold
AU2005100101A4 (en) * 2005-02-03 2005-03-03 Ian James Maitland A lighting unit
DE102005054955A1 (en) * 2005-08-31 2007-04-26 Osram Opto Semiconductors Gmbh Light-emitting module, in particular for use in a projection optical device and optical projection device
EP1977456A4 (en) * 2005-12-29 2014-03-05 Lam Chiang Lim High power led housing removably fixed to a heat sink
JP2007227422A (en) * 2006-02-21 2007-09-06 Nichia Chem Ind Ltd Semiconductor device, and optical unit employing it
WO2007135579A1 (en) * 2006-05-23 2007-11-29 Philips Intellectual Property & Standards Gmbh Automotive lamp module and lighting unit with led lighting element
US7815342B2 (en) * 2006-12-14 2010-10-19 Medinis David M Surgical headlamp
US7540761B2 (en) * 2007-05-01 2009-06-02 Tyco Electronics Corporation LED connector assembly with heat sink
JP2009038255A (en) * 2007-08-02 2009-02-19 San Ei Giken Inc Light source
JP4407764B2 (en) * 2007-08-10 2010-02-03 パナソニック電工株式会社 Heat sink and semiconductor device provided with heat sink
EP2096685A1 (en) * 2008-02-28 2009-09-02 Robert Bosch Gmbh LED module with cooling bodies containing mounting elements
CN101545614B (en) * 2008-03-26 2012-05-23 富准精密工业(深圳)有限公司 LED fixture
JP5129653B2 (en) * 2008-05-28 2013-01-30 浜松ホトニクス株式会社 Ultraviolet irradiation device and ultraviolet irradiation unit
DE202008009910U1 (en) * 2008-07-24 2008-09-25 Lee, Han-Ming Radiator-driven semiconductor lamp

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729076A (en) * 1984-11-15 1988-03-01 Tsuzawa Masami Signal light unit having heat dissipating function
US20100112683A2 (en) * 1990-11-29 2010-05-06 Applied Biosystems, Llc Thermal Cycler for Automatic Performance of the Polymerase Chain Reaction with Close Temperature Control
US5615086A (en) * 1994-05-17 1997-03-25 Tandem Computers Incorporated Apparatus for cooling a plurality of electrical components mounted on a printed circuit board
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US7387406B2 (en) * 2001-06-29 2008-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US20050207165A1 (en) * 2001-08-09 2005-09-22 Matsushita Electric Industrial Co., Ltd. LED illumination apparatus and card-type LED illumination source
US6641284B2 (en) * 2002-02-21 2003-11-04 Whelen Engineering Company, Inc. LED light assembly
US20050128752A1 (en) * 2002-04-20 2005-06-16 Ewington Christopher D. Lighting module
US20050152146A1 (en) * 2002-05-08 2005-07-14 Owen Mark D. High efficiency solid-state light source and methods of use and manufacture
US20040120152A1 (en) * 2002-12-11 2004-06-24 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
US20050222295A1 (en) * 2003-01-09 2005-10-06 Con-Trol-Cure, Inc. UV Curing System and Process with Increased Light Intensity
US20060141851A1 (en) * 2003-02-07 2006-06-29 Nobuyuki Matsui Socket for led light source and lighting system using the socket
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US20040213016A1 (en) * 2003-04-25 2004-10-28 Guide Corporation Automotive lighting assembly cooling system
US20050047140A1 (en) * 2003-08-25 2005-03-03 Jung-Chien Chang Lighting device composed of a thin light emitting diode module
US20090086488A1 (en) * 2003-10-09 2009-04-02 Permlight Products, Inc. LED luminaire
US20050168990A1 (en) * 2004-01-13 2005-08-04 Seiko Epson Corporation Light source apparatus and projection display apparatus
US8033706B1 (en) * 2004-09-09 2011-10-11 Fusion Optix, Inc. Lightguide comprising a low refractive index region
US20060181878A1 (en) * 2005-02-17 2006-08-17 Federal-Mogul World Wide, Inc. LED light module assembly
US20080165547A1 (en) * 2005-03-08 2008-07-10 Grant Harold Amor Led Lighting Apparatus in a Plastic Housing
US7374316B2 (en) * 2005-05-25 2008-05-20 Coretronic Corporation Backlight module
US20070184141A1 (en) * 2005-09-20 2007-08-09 Summit Business Products, Inc. Ultraviolet light-emitting diode device
US20050280683A1 (en) * 2005-09-20 2005-12-22 Custer Eric J Ultraviolet light-emitting diode device
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
US20090015125A1 (en) * 2006-03-31 2009-01-15 Geoffrey Wen-Tai Shuy Heat Exchange Enhancement
US20070230184A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US20070268669A1 (en) * 2006-05-16 2007-11-22 Hardcore Computer, Inc. Circuit board assembly for a liquid submersion cooled electronic device
US20090244895A1 (en) * 2006-05-30 2009-10-01 Neobulb Technologies, Inc. Light-Emitting Diode Illuminating Equipment with High Power and High Heat Dissipation Efficiency
US20080043479A1 (en) * 2006-08-17 2008-02-21 Pei-Choa Wang Assembling structure for led road lamp and heat dissipating module
US20080055908A1 (en) * 2006-08-30 2008-03-06 Chung Wu Assembled structure of large-sized led lamp
US20080080189A1 (en) * 2006-09-29 2008-04-03 Pei-Choa Wang LED Illumination Apparatus
US20080089071A1 (en) * 2006-10-12 2008-04-17 Chin-Wen Wang Lamp structure with adjustable projection angle
US20080117637A1 (en) * 2006-11-17 2008-05-22 Foxconn Technology Co., Ltd. Led lamp cooling apparatus with pulsating heat pipe
US20080219007A1 (en) * 2006-12-22 2008-09-11 Nuventix, Inc. Thermal management system for LED array
US20080151029A1 (en) * 2006-12-26 2008-06-26 Konica Minolta Medical & Graphic, Inc. Inkjet recording apparatus
US20080170367A1 (en) * 2007-01-12 2008-07-17 Tai-Sol Electronics Co., Ltd. Combination assembly of LED and liquid-vapor thermally dissipating device
US20080175008A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
US20100117534A1 (en) * 2007-04-27 2010-05-13 Jen-Shyan Chen Light-Emitting Diode Illumination Apparatus
US20080291631A1 (en) * 2007-05-23 2008-11-27 Leopold Hellinger Illumination unit
US20090040760A1 (en) * 2007-08-10 2009-02-12 Kuo-Hsin Chen Illumination device having unidirectional heat-dissipating route
US20090040759A1 (en) * 2007-08-10 2009-02-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly
US20090059604A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for light emitting diode module
US20090120612A1 (en) * 2007-11-08 2009-05-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for light emitting diode module
US20090129075A1 (en) * 2007-11-16 2009-05-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat dissipation device
US8262263B2 (en) * 2007-11-16 2012-09-11 Khanh Dinh High reliability cooling system for LED lamps using dual mode heat transfer loops
US20090147522A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink assembly
US20090154171A1 (en) * 2007-12-18 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Lamp assembly having a junction box
US20090168429A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Light source module with a thermoelectric cooler
US7686470B2 (en) * 2007-12-31 2010-03-30 Valens Company Limited Ceiling light fixture adaptable to various lamp assemblies
US20090244900A1 (en) * 2008-03-28 2009-10-01 Delta Electronics Inc. Illuminating device and heat-dissipating structure thereof
US7810950B2 (en) * 2008-04-23 2010-10-12 Fu Zhun Precision Industry (Shen Zhen)., Ltd. LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp
US20110026251A1 (en) * 2009-07-28 2011-02-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led illuminating device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9632294B2 (en) * 2010-01-27 2017-04-25 Heraeus Noblelight America Llc Micro-channel-cooled high heat load light emitting device
US20140319386A1 (en) * 2010-01-27 2014-10-30 Heraeus Noblelight Fusion Uv Inc. Micro-channel-cooled high heat load light emitting device
US10865972B2 (en) * 2012-06-01 2020-12-15 Sumolight Gmbh Photographic lighting device
US20150146404A1 (en) * 2012-06-01 2015-05-28 Sumolight Gmbh Lighting device and headlight
US10767847B2 (en) 2012-06-01 2020-09-08 DoPchoice GmbH Photographic lighting device
TWI569477B (en) * 2012-08-20 2017-02-01 賀利氏諾伯燈具輻深紫外線公司 Micro-channel-cooled high heat load light emitting device
US8963734B2 (en) 2013-02-15 2015-02-24 Mohammad Karaki Remote controlled pricing information
US9728488B2 (en) * 2013-10-21 2017-08-08 Toyota Jidosha Kabushiki Kaisha Onboard electronic device
US20160254212A1 (en) * 2013-10-21 2016-09-01 Toyota Jidosha Kabushiki Kaisha Onboard electronic device
CN103957621A (en) * 2014-05-05 2014-07-30 朱威 Potentiometer waterproof plug assembly of adjustable LED driving power supply and power supply
WO2017009099A1 (en) * 2015-07-15 2017-01-19 Heraeus Noblelight Gmbh Module-type led lamp unit and use thereof
JP2018532252A (en) * 2015-07-15 2018-11-01 ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテル ハフツングＨｅｒａｅｕｓ Ｎｏｂｌｅｌｉｇｈｔ ＧｍｂＨ Modularly configured LED emitter unit and use of the LED emitter unit
US9622380B1 (en) * 2015-09-30 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same

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