US20110223552A1 - Vertical heat treatment apparatus and method for cooling the apparatus - Google Patents

Vertical heat treatment apparatus and method for cooling the apparatus Download PDF

Info

Publication number
US20110223552A1
US20110223552A1 US13/040,720 US201113040720A US2011223552A1 US 20110223552 A1 US20110223552 A1 US 20110223552A1 US 201113040720 A US201113040720 A US 201113040720A US 2011223552 A1 US2011223552 A1 US 2011223552A1
Authority
US
United States
Prior art keywords
air
space
air supply
pressure
furnace body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US13/040,720
Other versions
US9099507B2 (en
Inventor
Makoto Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, MAKOTO
Publication of US20110223552A1 publication Critical patent/US20110223552A1/en
Application granted granted Critical
Publication of US9099507B2 publication Critical patent/US9099507B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463Cooling of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection

Definitions

  • the present invention relates to a vertical heat treatment apparatus and a method for cooling the apparatus, and more particularly to a vertical heat treatment apparatus and a method for cooling the apparatus, which can cool the space between a furnace body and a treatment container with high precision.
  • a common vertical heat treatment apparatus comprises a heat treatment furnace including a treatment container for housing and heat treating a semiconductor wafer, and a furnace body, disposed such that it surrounds the treatment container, for heating the wafer in the treatment container.
  • the furnace body includes a cylindrical heat insulator, and a heat generating resistor provided in the inner circumferential surface of the heat insulator via a support.
  • a spiral heater element also called heater wire or heat generating resistor
  • a cylindrical heat insulator may be used as the above-described heat generating resistor.
  • Such a heater element can heat the interior of a furnace at a high temperature, e.g. about 500 to 1000° C.
  • a cylindrical ceramic insulator obtained by firing a heat insulating material such as ceramic fibers, can be used as the above-described heat insulator.
  • Such a heat insulator can reduce the amount of heat that may be lost through heat radiation or conduction, thus enhancing the efficiency of heating.
  • the above-described support may be made of a ceramic material, and may support the heater element at a given pitch in such a manner as to allow thermal expansion and contraction of the heater element.
  • the present invention has been made in view of the above situation. It is therefore an object of the present invention to provide a vertical heat treatment apparatus and a method for cooling the apparatus, which can rapidly cool the space between a furnace body and a treatment container while controlling the pressure in the space at a slightly negative pressure with high precision.
  • the present invention provides a vertical heat treatment apparatus comprising: a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body; a plurality of air outlets provided in an air outlet formation area of the furnace body; an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets; an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space; a blower provided in at least one of the air supply line and the air exhaust line; an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively; a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space
  • the slightly negative pressure in the space may be in the range of 0 Pa to ⁇ 85 Pa.
  • the slightly negative pressure in the space is preferably in the range of ⁇ 20 Pa to ⁇ 30 Pa.
  • the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
  • the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
  • control section based on a detection signal from the pressure detection system, may control the rotational speed of the blower to keep the space at a slightly negative pressure.
  • control section based on a detection signal from the pressure detection system, may adjust the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
  • the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
  • the present invention also provides a method for cooling a vertical heat treatment apparatus comprising: a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body; a plurality of air outlets provided in an air outlet formation area of the furnace body; an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets; an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space; a blower provided in at least one of the air supply line and the air exhaust line; an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively; a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space
  • the space may be kept at a slightly negative pressure in the range of 0 Pa to ⁇ 85 Pa.
  • the space is kept at a slightly negative pressure in the range of ⁇ 20 Pa to ⁇ 30 Pa.
  • the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
  • the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
  • control section based on a detection signal from the pressure detection system, may control the rotating speed of the blower to keep the space at a slightly negative pressure.
  • control section based on a detection signal from the pressure detection system, may adjust the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
  • the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
  • the space between the furnace body and the treatment container can be directly detected with the pressure detection system. This makes it possible to forcibly cool the space while accurately keeping the space at a slightly negative pressure.
  • the pressure in the space can thus be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body. Further, the pressure in the space can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body.
  • FIG. 1 is a vertical sectional view schematically showing a vertical heat treatment apparatus according to the present invention
  • FIG. 2 is a diagram showing an exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus
  • FIG. 3 is a diagram showing another exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus.
  • FIG. 4 is a diagram illustrating a method for cooling the vertical heat treatment apparatus.
  • FIG. 1 is a vertical sectional view schematically showing a vertical heat treatment apparatus according to the present invention
  • FIG. 2 is a diagram showing an exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus
  • FIG. 3 is a diagram showing another exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus.
  • the vertical heat treatment apparatus 1 includes a vertical heat treatment furnace 2 which is capable of housing a large number of processing objects, e.g. semiconductor wafers W, and performing heat treatment such as oxidation, diffusion, low-pressure CVD, etc.
  • the heat treatment furnace 2 includes a furnace body 5 having, in its inner circumferential surface, a heat generating resistor (heating section), and a treatment container 3 for housing and heat treating the wafers W and which is disposed in the furnace body 5 and defines a space 33 between it and the furnace body 5 .
  • the furnace body 5 is supported on a base plate 6 which has an opening 7 for inserting the treatment container 3 from below.
  • the opening 7 is provided with a not-shown heat insulator to cover the gap between the base plate 6 and the treatment container 3 .
  • the treatment container 3 is made of quartz and has a vertically long cylindrical shape with the upper end closed and the lower end open as a furnace opening 3 a .
  • An outwardly extending flange 3 b is formed at the lower end of the treatment container 3 .
  • the flange 3 b is supported on the base plate 6 via a not-shown flange presser.
  • the treatment vessel 3 has in its lower side portion an introduction port 8 for introducing e.g. a treatment gas or an inert gas into the treatment container 3 , and a not-shown exhaust port for exhausting a gas from the treatment container 3 .
  • the introduction port 8 is connected to a gas supply source (not shown), and the exhaust port is connected to a vacuum system (not shown) including a vacuum pump capable of controllably depressurizing the treatment container 3 e.g. to about 133 ⁇ 10 Pa to 133 ⁇ 10 ⁇ 8 Pa.
  • a lid 10 for closing the furnace opening 3 a of the treatment container 3 and which can be moved vertically by means of a not-shown lifting mechanism.
  • a heat-retaining cylinder 11 as a heat-retaining means for the furnace opening is placed on the upper surface of the lid 10
  • a quartz boat 12 as a retainer for holding a large number, e.g. about 100 to 150, of 300-mm semiconductor wafers W at a predetermined spacing in the vertical direction, is placed on the upper surface of the heat-retaining cylinder 11 .
  • the lid 10 is provided with a rotating mechanism 13 for rotating the boat 12 on its axis.
  • the boat 12 is carried (unloaded) from the treatment container 3 downward into a loading area 15 by the downward movement of the lid 10 and, after replacement of wafers W, carried (loaded) into the treatment container 3 by the upward movement of the lid 10 .
  • the furnace body 5 includes a cylindrical heat insulator 16 , groove-like shelf portions 17 formed in the inner circumferential surface of the heat insulator 16 and arranged in multiple stages in the axial direction (vertical direction in FIG. 1 ), and heater elements (heater wires, heat generating resistors) 18 disposed along each shelf portion 17 .
  • the heat insulator 16 is composed of inorganic fibers, such as silica, alumina or alumina silicate.
  • the heat insulator 16 is longitudinally halved to facilitate installation of the heater elements and assembly of the heater.
  • the heater element 18 has a corrugated shape obtained by shaping (bending) of a strip-shaped heat generating resistor.
  • the corrugated heater element 18 is composed of, for example, an alloy (Kanthal alloy) consisting of iron (Fe), chromium (Cr) and aluminum (Al).
  • the heater element 18 has, for example, a thickness of about 1 to 2 mm, a width of about 14 to 18 mm, a corrugation amplitude of about 11 to 15 mm and a corrugation pitch P of about 28 to 32 mm.
  • the apex angle 8 of each apex portion (top portion or peak portion) 18 a of the corrugated heater element 18 be made about 90 degrees and that the apex portions have been subjected to R-bending.
  • the heat insulator 16 is provided with pin members 20 for holding the heater elements 18 at predetermined intervals in such a manner as to allow radial movement of the heater elements 18 and to prevent fall or escape of the heater elements 18 from the shelf portions 17 .
  • annular grooves 21 concentric with the heat insulator 16 , are formed in multiple stages at a predetermined pitch in the axial direction, with the circumferentially-continuous annular shelf portion 17 being formed between adjacent upper and lower grooves 21 .
  • a gap sufficient to permit thermal expansion/contraction and radial movement of the heater element 18 is provided over and under the heater element 18 in the groove portion 21 and between the bottom wall of the groove portion 21 and the heater element 18 . Upon forced air cooling of the heat treatment apparatus, such gaps allow cooling air to enter the space behind the heater element 18 , enabling effective cooling of the heater element 18 .
  • the heater elements 18 are connected by a connecting plate, and the heater elements 18 positioned on the terminal side are connected to an external power source via terminal plates 22 a , 22 b that penetrate radially through the heat insulator 16 .
  • the outer circumferential surface of the heat insulator 16 of the furnace body 5 is covered with an outer shell 28 made of a metal, such as stainless steel, in order to retain the shape of the heat insulator 16 and, in addition, to reinforce the heat insulator 16 .
  • the outer circumferential surface of the outer shell 28 is covered with a water-cooling jacket 30 in order to reduce the thermal influence of the furnace body 5 on the external environment.
  • An upper heat insulator 31 which covers the top (upper end) of the heat insulator 16 is provided on the top of the heat insulator 16
  • a stainless steel top board 32 which covers the top (upper end) of the outer shell 28 is provided on the upper surface of the upper insulator 31 .
  • the furnace body 5 in order to rapidly lower the temperature of a wafer after heat treatment so as to speed up the process and increase the throughput, the furnace body 5 is provided with a heat exhaust system 35 for discharging the atmosphere in the space 33 between the furnace body 5 and the treatment container 3 to the outside, and a forced air cooling means 36 for introducing air at room temperature (20-30° C.) into the space 33 to forcibly cool the space 33 .
  • the heat exhaust system 35 is comprised of an exhaust port 37 provided e.g. at the top of the furnace body 5 , and to the exhaust port 37 is connected an air exhaust line 62 for exhausting air from the space 33 .
  • the forced air cooling means 36 includes a plurality of annular flow passages 38 formed between the heat insulator 16 and the outer shell 28 and arranged in the height direction of the furnace body 5 , and a plurality of forced cooling air outlets 40 , provided in the heat insulator 16 , for ejecting air from the respective annular flow passages 38 in a direction oblique to the radial direction of the heat insulator 16 to create a swirling flow in the circumferential direction of the space 33 .
  • the annular flow passages 38 are formed by attaching band-like or annular heat insulators 41 to the outer circumferential surface of the heat insulator 16 , or by annularly grinding the outer circumferential surface of the heat insulator 16 .
  • Each forced cooling air outlet 40 is formed in the shelf portion 17 , lying between adjacent upper and lower heater elements 18 in the heat insulator 16 , such that it penetrates through the shelf portion 17 .
  • a corrugated heater element obtained by bending of a strip-shaped heat generating resistor, is used as the heater element 18 , and the corrugated heater element 18 is housed in each shelf portion 17 , it is possible to use other types of heater elements having various structures.
  • air is ejected from the forced cooling air outlets 40 in such a manner as to create a swirling flow, the creation of a swirling air flow is not always necessary.
  • the outer shell 28 has communication holes for communication between the supply duct 49 and the annular flow passages 38 .
  • the forced cooling air outlets 40 are each formed in a shelf portion 17 , lying between adjacent upper and lower heater elements 18 in the heat insulator 16 , such that it penetrates through the shelf portion 17 , as described above, air can be easily ejected from the outlets 40 without being impeded by the heater elements 18 .
  • the heat insulator 16 is longitudinally halved, and accordingly the heater elements 18 are also longitudinally halved. This can facilitate installation of the heater elements 18 in the heat insulator 16 , enabling easy assembly of the heater.
  • the furnace body 5 is provided with a pressure detection system 50 penetrating through the heat insulator 16 , the outer shell 28 and the cooling jacket 30 of the furnace body 5 .
  • the pressure detection system 50 includes a pressure detector tube 50 a penetrating and extending through the heat insulator 16 , the outer shell 28 and the cooling jacket 30 , and a pressure sensor 50 b provided at the outlet of the pressure detector tube 50 a , and detects the pressure in the space 33 between the furnace body 5 and the treatment container 3 .
  • the detection signal from the pressure sensor 50 b is sent to a control section 51 .
  • a temperature sensor 51 A for detecting the temperature of the space 33 between the furnace body 5 and the treatment container 3 is disposed in the space 33 . Based on a detection signal from the temperature sensor 51 A, control of heat treatment in the vertical heat treatment apparatus is performed by the control section 51 .
  • the air supply line 52 and the air exhaust line 62 are independent of each other, constitute an open air supply/exhaust line system.
  • the air supply line 52 of the system is provided with an air supply blower 53 having an inverter drive unit 53 a.
  • a damper 56 is provided on the inlet side of the air supply blower 53 , and a hole valve 54 and a butterfly valve 55 are disposed on the outlet side of the air supply blower 53 .
  • the opening/closing is adjustable.
  • the damper 56 , the hole valve 54 and the butterfly valve 55 constitute an air supply line valve mechanism 54 A.
  • the air exhaust line 62 is provided with an air exhaust blower 63 having an inverter drive unit 63 a.
  • a butterfly valve 66 and a hole valve 67 are provided on the inlet side of the air exhaust blower 63 , and a hole valve 64 and a butterfly valve 65 are disposed on the outlet side of the air exhaust blower 63 .
  • the opening/closing is adjustable.
  • the butterfly valve 66 and the hole valve 67 on the inlet side of the air exhaust blower 63 , and the hole valve 64 and the butterfly valve 65 on the outlet side of the air exhaust blower 63 constitute an air exhaust line valve mechanism 64 A.
  • the above-described forced cooling air outlets 40 are formed over the entire length of the supply duct 49 , ranging from the upper end to the lower end of the supply duct 49 .
  • the area 40 A in which the air outlets 40 are formed coincides with the entire length of the supply duct 49 .
  • the pressure detection system 50 is provided in a space area 33 A corresponding to the air outlet formation area 40 A. This enables direct detection of the pressure in the space area 33 A which is affected by air ejected from the air outlets 40 .
  • wafers W are loaded into the boat 12 , and the boat 12 loaded with the wafers W is placed on the heat-retaining cylinder 11 on the lid 10 . Thereafter, the boat 12 is carried into the treatment container 3 by the upward movement of the lid 10 .
  • control section 51 actuates the heater elements 18 though control of the power source to heat the space 33 between the furnace body 5 and the treatment container 3 and carry out heat treatment of the wafers W in the boat 12 in the treatment container 3 .
  • control section 51 controls the treatment temperature based on a detection signal from the temperature sensor 51 A so that the heat treatment of the wafers W can be performed with high precision at an appropriate temperature.
  • the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in order to streamline the heat treatment operation.
  • the air supply blower 53 and the air exhaust blower 63 are actuated by the control section 51 .
  • Cooing air (20-30° C.) in the clean room is introduced into the air supply line 52 , and the cooling air is fed from the air supply blower 53 to the supply duct 49 .
  • the cooling air in the supply duct 49 then enters the annular flow passages 38 formed on the outer circumferential surface of the heat insulator 16 of the furnace body 5 , and the cooling air in the annular flow passages 38 is then ejected from the air outlets 40 , penetrating through the heat insulator 16 , into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 (first cooling step).
  • Heated air in the space 33 is fed through the air exhaust line 62 to a heat converter 69 where the air is cooled, and the cooled air is discharged by the air exhaust blower 63 to the outside.
  • control section 51 drives and controls the inverter drive unit 53 a of the air supply blower 53 and the inverter drive unit 63 a of the air exhaust blower 63 and, in addition, drives and controls the air supply line valve mechanism 54 A and the air exhaust line valve mechanism 64 A so as to maintain the pressure in the space 33 in a slightly negative pressure range A [0 Pa to ⁇ 85 Pa, preferably ⁇ 20 Pa to ⁇ 30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5 ] (see FIG. 4 ).
  • the pressure in the space 33 can be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body 5 . Further, the pressure in the space 33 can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body 5 and making the temperature distribution in the interior of the treatment container 3 non-uniform.
  • the temperature of the space 33 decreases and the pressure in the space 33 becomes lower than that in the first cooling step.
  • the pressure in the space 33 is directly and continually detected with the pressure detection system 50 .
  • the control section 51 based on a detection signal from the pressure detection system 50 which indicates the pressure decrease, sets a higher pressure than the pressure set for the first cooling step, and drives and controls the inverter drive unit 53 a of the air supply blower 53 and the inverter drive unit 63 a of the air exhaust blower 63 and, in addition, drives and controls the air supply line valve mechanism 54 A and the air exhaust line valve mechanism 64 A.
  • a larger amount of cooling air than that in the first cooling step is supplied from the air supply line 52 to the space 33 , so that the pressure in the space 33 can be returned to that in the first cooling step (second cooling step). If the second cooling step is not carried out, the pressure will continue to decrease as shown by the broken line in FIG. 4 . By carrying out the second cooling step, the pressure in the space 33 can be returned to the pressure level in the first cooling step, as shown by the solid line in FIG. 4 .
  • the second cooling step can prevent the external air from entering the furnace body 5 due to decrease in the pressure in the space 33 . Furthermore, a larger amount of air can be supplied to the space 33 as compared to the first cooling step, making it possible to forcibly cool the space 33 rapidly and securely.
  • cooling air in the annular flow passages 38 is ejected from the air outlets 40 , penetrating through the heat insulator 16 , into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 .
  • the cooling air ejected into the space 33 while cooling the heater elements 18 of the furnace body 5 and the treatment container 3 , rapidly expands and increases its volume and pressure (see FIG. 4 ).
  • the pressure detection system 50 is provided in the space 33 between the furnace body 5 and the treatment container 3 , and the pressure in the space 33 is directly detected by the pressure detection system 50 .
  • the pressure detection system 50 can quickly and accurately detect the increase in the pressure in the space 33 without being affected by an external disturbance. Based on a detection signal from the pressure detection system 50 , the control section 51 performs control in an appropriate manner so that the space 33 is kept at the above-described slightly negative pressure.
  • a pressure sensor provided in the air supply line 52 or the air discharge line 62 it may be possible to detect the pressure in the space 33 with a pressure sensor provided in the air supply line 52 or the air discharge line 62 .
  • a pressure applied to cooling air must be taken into consideration as an external disturbance.
  • a suction pressure applied to cooling air must be taken into consideration as an external disturbance.
  • the pressure detection system 50 in the space 33 between the furnace body 5 and the treatment container 3 , the pressure increase in the space 33 can be detected directly, quickly and accurately without being affected by an external disturbance.
  • This enables the control section 51 to perform control in an appropriate manner to keep the space at a slightly negative pressure.
  • the temperature of the space 33 decreases and the pressure in the space 33 also decreases (second cooling step) as shown in FIG. 4 .
  • the pressure in the space 33 is directly and continually detected with the pressure detection system 50 also after the first cooling step, and the decrease in the pressure in the space 33 can be detected quickly and accurately.
  • the control section 51 controls the apparatus in such a manner as to supply a larger amount of cooling air than that in the first cooling step from the air supply line 52 to the space 33 , whereby the pressure in the space 33 can be returned to the pressure in the first cooling step.
  • control section 51 based on a detection signal from the pressure detection system 50 , drives and controls the inverter drive unit 53 a of the air supply blower 53 , the inverter drive unit 63 a of the air exhaust blower 63 , the air supply line valve mechanism 54 A and the air exhaust line valve mechanism 64 A, it is also possible for the control section 51 to drive and control either one or a combination of the inverter drive unit 53 a of the air supply blower 53 , the inverter drive unit 63 a of the air exhaust blower 63 , the air supply line valve mechanism 54 A and the air exhaust line valve mechanism 64 A. Further, the control section 51 may drive and control only one of the members 54 , 55 and 56 of the air supply line valve mechanism 54 A, or drive and control only one of the members 64 , 65 , 66 and 67 of the air exhaust line valve mechanism 64 A.
  • FIGS. 1 and 3 A second embodiment of the present invention will now be described with reference to FIGS. 1 and 3 .
  • the air supply line 52 and the air discharge line 62 are connected to each other, constituting a closed air supply/exhaust line system.
  • a blower 73 for air supply and air exhaust having an inverter drive unit 73 a , is provided at the connection between the air supply line 52 and the air discharge line 62 .
  • a butterfly valve 76 and a hole valve 77 are provided on the inlet side of the blower 73 , and a hole valve 74 and a butterfly valve 75 are disposed on the outlet side of the blower 73 .
  • the opening/closing is adjustable.
  • the hole valve 74 and the butterfly valve 75 on the air supply line 52 side constitute an air supply line valve mechanism 74 A.
  • the butterfly valve 76 and the hole valve 77 on the air exhaust line 62 side constitute an air exhaust line valve mechanism 76 A.
  • wafers W are loaded into the boat 12 , and the boat 12 loaded with the wafers W is placed on the heat-retaining cylinder 11 on the lid 10 . Thereafter, the boat 12 is carried into the treatment container 3 by the upward movement of the lid 10 .
  • control section 51 actuates the heater elements 18 though control of the power source to heat the space 33 between the furnace body 5 and the treatment container 3 and carry out heat treatment of the wafers W in the boat 12 in the treatment container 3 .
  • control section 51 controls the treatment temperature based on a detection signal from the temperature sensor 51 A so that the heat treatment of the wafers W can be performed with high precision at an appropriate temperature.
  • the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in order to streamline the heat treatment operation.
  • the air supply/air exhaust blower 73 is actuated by the control section 51 , whereby cooing air in the air supply line 52 is fed to the supply duct 49 .
  • the cooling air in the supply duct 49 then enters the annular flow passages 38 formed on the outer circumferential surface of the heat insulator 16 of the furnace body 5 , and the cooling air in the annular flow passages 38 is then ejected from the air outlets 40 , penetrating through the heat insulator 16 , into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 (first cooling step).
  • Heated air in the space 33 is fed through the air exhaust line 62 to a heat exchanger 79 where the air is cooled, and the cooled air is returned to the blower 73 .
  • control section 51 drives and controls the inverter drive unit 73 a of the blower 73 and, in addition, drives and controls the air supply line valve mechanism 74 A and the air exhaust line valve mechanism 76 A so as to maintain the pressure in the space 33 in a slightly negative pressure range A [0 Pa to ⁇ 85 Pa, preferably ⁇ 20 Pa to ⁇ 30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5 ] (see FIG. 4 ).
  • the pressure in the space 33 can be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body 5 . Further, the pressure in the space 33 can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body 5 and making the temperature distribution in the interior of the treatment container 3 non-uniform.
  • the temperature of the space 33 decreases and the pressure in the space 33 becomes lower than that during the first cooling step.
  • the pressure in the space 33 is directly and continually detected with the pressure detection system 50 .
  • the control section 51 based on a detection signal from the pressure detection system 50 which indicates the pressure decrease, sets a higher pressure than the pressure set for the first cooling step, and drives and controls the inverter drive unit 73 a of the blower 73 and, in addition, drives and controls the air supply line valve mechanism 74 A and the air exhaust line valve mechanism 76 A.
  • a larger amount of cooling air than that in the first cooling step is supplied from the air supply line 52 to the space 33 , so that the pressure in the space 33 can be returned to that during the first cooling step (second cooling step).
  • the pressure in the space 33 can be returned to the pressure level in the first cooling step, as shown by the solid line in FIG. 4 .
  • the second cooling step can prevent the external air from entering the furnace body 5 due to decrease in the pressure in the space 33 . Furthermore, a larger amount of air can be supplied to the space 33 as compared to the first cooling step, making it possible to forcibly cool the space 33 rapidly and securely.
  • cooling air in the annular flow passages 38 is ejected from the air outlets 40 , penetrating through the heat insulator 16 , into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 .
  • the cooling air ejected into the space 33 while cooling the heater elements 18 of the furnace body 5 and the treatment container 3 , rapidly expands and increases its volume and pressure (see FIG. 4 ).
  • the pressure detection system 50 is provided in the space 33 between the furnace body 5 and the treatment container 3 , and the pressure in the space is directly detected by the pressure detection system 50 .
  • the pressure detection system 50 can quickly and accurately detect the increase in the pressure in the space 33 without being affected by an external disturbance. Based on a detection signal from the pressure detection system 50 , the control section 51 performs control in an appropriate manner so that the space 33 is kept at the above-described slightly negative pressure.
  • a pressure sensor provided in the air supply line 52 or the air discharge line 62 it is possible to detect the pressure in the space 33 with a pressure sensor provided in the air supply line 52 or the air discharge line 62 .
  • a pressure applied to cooling air must be taken into consideration as an external disturbance.
  • a suction pressure applied to cooling air must be taken into consideration as an external disturbance.
  • the pressure detection system 50 in the space 33 between the furnace body 5 and the treatment container 3 , the pressure increase in the space 33 can be detected directly, quickly and accurately without being affected by an external disturbance.
  • This enables the control section 51 to perform control in an appropriate manner to keep the space at a slightly negative pressure.
  • the temperature of the space 33 decreases and the pressure in the space 33 also decreases (second cooling step) as shown in FIG. 4 .
  • the pressure in the space 33 is directly and continually detected with the pressure detection system 50 also after the first cooling step, and the decrease in the pressure in the space 33 can be detected quickly and accurately.
  • the control section 51 controls the apparatus in such a manner as to supply a larger amount of cooling air than that in the first cooling step from the air supply line 52 to the space 33 , whereby the pressure in the space 33 can be returned to the pressure in the first cooling step.
  • control section 51 based on a detection signal from the pressure detection system 50 , drives and controls the inverter drive unit 73 a of the air supply/air exhaust blower 73 , the air supply line valve mechanism 74 A and the air exhaust line valve mechanism 76 A, it is also possible for the control section 51 to drive and control either one or a combination of the inverter drive unit 73 a of the air supply/air exhaust, blower 73 , the air supply line valve mechanism 74 A and the air exhaust line valve mechanism 76 A. Further, the control section 51 may drive and control only one of the members 74 and 75 of the air supply line valve mechanism 74 A, or drive and control only one of the members 76 and 77 of the air exhaust line valve mechanism 76 A.

Abstract

A vertical heat treatment apparatus including a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects W to be treated. An air supply line is connected to the furnace body, and an air exhaust line is connected to the furnace body. An air supply blower and an air supply line valve mechanism, and an air exhaust blower and an air exhaust line valve mechanism are provided in the air supply line and the air exhaust line, respectively. A pressure detection system is provided for detecting the pressure in the space. A control section controls, based on a detection signal from the pressure detection system the blowers, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space at a slightly negative pressure.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims priority to Japanese Patent Application No. 2010-053154, filed on Mar. 10, 2010, and Japanese Patent Application No. 2010-281622, filed on Dec. 17, 2010, the disclosures of which are incorporated herein by reference in their entirety.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a vertical heat treatment apparatus and a method for cooling the apparatus, and more particularly to a vertical heat treatment apparatus and a method for cooling the apparatus, which can cool the space between a furnace body and a treatment container with high precision.
  • 2. Description of the Related Art
  • In the manufacturing of a semiconductor device, various types of vertical heat treatment apparatuses are used to perform various treatments, such as oxidation, diffusion, CVD (chemical vapor deposition), etc., of a semiconductor wafer as a processing object. A common vertical heat treatment apparatus comprises a heat treatment furnace including a treatment container for housing and heat treating a semiconductor wafer, and a furnace body, disposed such that it surrounds the treatment container, for heating the wafer in the treatment container. The furnace body includes a cylindrical heat insulator, and a heat generating resistor provided in the inner circumferential surface of the heat insulator via a support.
  • In the case of a heat treatment apparatus capable of batch-wise treatment, for example, a spiral heater element (also called heater wire or heat generating resistor) disposed along the inner wall surface of a cylindrical heat insulator may be used as the above-described heat generating resistor. Such a heater element can heat the interior of a furnace at a high temperature, e.g. about 500 to 1000° C. A cylindrical ceramic insulator, obtained by firing a heat insulating material such as ceramic fibers, can be used as the above-described heat insulator. Such a heat insulator can reduce the amount of heat that may be lost through heat radiation or conduction, thus enhancing the efficiency of heating. The above-described support may be made of a ceramic material, and may support the heater element at a given pitch in such a manner as to allow thermal expansion and contraction of the heater element.
  • For the above-described vertical heat treatment apparatus, a method has been developed in which after heating a wafer at a high temperature, the space between the furnace body and the treatment container is rapidly cooled in order to streamline a heat treatment operation while maintaining the accuracy of heat treatment for the wafer.
  • In carrying out the rapid cooling method in the vertical heat treatment apparatus, when the pressure in the space between the furnace body and the treatment container is a positive pressure, hot air will blow out of the furnace body, which can cause breakage of the furnace body itself or its peripheral devices. When the pressure in the space between the furnace body and the treatment container is a highly negative pressure, on the other hand, the heat insulator of the furnace body can break. Further, the external air will enter the furnace body, which may result in a non-uniform temperature distribution in the interior of the treatment container and, in addition, can cause local breakage of the heat generating resistor.
  • It is, therefore, necessary to keep the space between the furnace body and the treatment container at a slightly negative pressure in carrying out the rapid cooling method in the vertical heat treatment apparatus. However, no method has yet been developed which can keep the space between the furnace body and the treatment container at a slightly negative pressure securely with high precision.
  • PATENT DOCUMENTS
    • Patent document 1: Japanese Patent Laid-Open Publication No. 2002-305189
    • Patent document 2: Japanese Patent Laid-Open Publication No. 2008-205426
    • Patent document 3: Japanese Patent Laid-Open Publication No. 2009-81415
    SUMMARY OF THE INVENTION
  • The present invention has been made in view of the above situation. It is therefore an object of the present invention to provide a vertical heat treatment apparatus and a method for cooling the apparatus, which can rapidly cool the space between a furnace body and a treatment container while controlling the pressure in the space at a slightly negative pressure with high precision.
  • In order to achieve the object, the present invention provides a vertical heat treatment apparatus comprising: a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body; a plurality of air outlets provided in an air outlet formation area of the furnace body; an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets; an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space; a blower provided in at least one of the air supply line and the air exhaust line; an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively; a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space at a slightly negative pressure, wherein the pressure detection system is provided in a space area, corresponding to the air outlet formation area, of the space between the furnace body and the treatment container.
  • In the heat treatment apparatus, the slightly negative pressure in the space may be in the range of 0 Pa to −85 Pa.
  • In the heat treatment apparatus, the slightly negative pressure in the space is preferably in the range of −20 Pa to −30 Pa.
  • In the heat treatment apparatus, the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
  • In the heat treatment apparatus, the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
  • In the heat treatment apparatus, the control section, based on a detection signal from the pressure detection system, may control the rotational speed of the blower to keep the space at a slightly negative pressure.
  • In the heat treatment apparatus, the control section, based on a detection signal from the pressure detection system, may adjust the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
  • In the heat treatment apparatus, the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
  • The present invention also provides a method for cooling a vertical heat treatment apparatus comprising: a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body; a plurality of air outlets provided in an air outlet formation area of the furnace body; an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets; an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space; a blower provided in at least one of the air supply line and the air exhaust line; an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively; a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space at a slightly negative pressure, wherein the pressure detection system is provided in a space area, corresponding to the air outlet formation area, of the space between the furnace body and the treatment container, said method comprising: a first cooling step of supplying cooling air to the space between the furnace body and the treatment container through the air supply line and exhausting the cooling air from the space through the air exhaust line by actuating the blower with the control section; and a second cooling step of controlling, based on a detection signal from the pressure detection system which indicates a decrease in the pressure in the space from that in the first cooling step due to decrease in the temperature of the space, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism with the control section to supply a larger amount of cooling air than that in the first cooling step to the space.
  • In the method, the space may be kept at a slightly negative pressure in the range of 0 Pa to −85 Pa.
  • In the method, the space is kept at a slightly negative pressure in the range of −20 Pa to −30 Pa.
  • In the method, the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
  • In the method, the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
  • In the method, the control section, based on a detection signal from the pressure detection system, may control the rotating speed of the blower to keep the space at a slightly negative pressure.
  • In the method, the control section, based on a detection signal from the pressure detection system, may adjust the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
  • In the method, the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
  • According to the present invention, the space between the furnace body and the treatment container can be directly detected with the pressure detection system. This makes it possible to forcibly cool the space while accurately keeping the space at a slightly negative pressure. The pressure in the space can thus be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body. Further, the pressure in the space can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a vertical sectional view schematically showing a vertical heat treatment apparatus according to the present invention;
  • FIG. 2 is a diagram showing an exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus;
  • FIG. 3 is a diagram showing another exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus; and
  • FIG. 4 is a diagram illustrating a method for cooling the vertical heat treatment apparatus.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment
  • A first embodiment of the present invention will now be described with reference to the drawings. FIG. 1 is a vertical sectional view schematically showing a vertical heat treatment apparatus according to the present invention, FIG. 2 is a diagram showing an exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus, and FIG. 3 is a diagram showing another exemplary air supply line/air exhaust line system of the vertical heat treatment apparatus.
  • Referring to FIG. 1, the vertical heat treatment apparatus 1 includes a vertical heat treatment furnace 2 which is capable of housing a large number of processing objects, e.g. semiconductor wafers W, and performing heat treatment such as oxidation, diffusion, low-pressure CVD, etc. The heat treatment furnace 2 includes a furnace body 5 having, in its inner circumferential surface, a heat generating resistor (heating section), and a treatment container 3 for housing and heat treating the wafers W and which is disposed in the furnace body 5 and defines a space 33 between it and the furnace body 5.
  • The furnace body 5 is supported on a base plate 6 which has an opening 7 for inserting the treatment container 3 from below. The opening 7 is provided with a not-shown heat insulator to cover the gap between the base plate 6 and the treatment container 3.
  • The treatment container 3 is made of quartz and has a vertically long cylindrical shape with the upper end closed and the lower end open as a furnace opening 3 a. An outwardly extending flange 3 b is formed at the lower end of the treatment container 3. The flange 3 b is supported on the base plate 6 via a not-shown flange presser. The treatment vessel 3 has in its lower side portion an introduction port 8 for introducing e.g. a treatment gas or an inert gas into the treatment container 3, and a not-shown exhaust port for exhausting a gas from the treatment container 3. The introduction port 8 is connected to a gas supply source (not shown), and the exhaust port is connected to a vacuum system (not shown) including a vacuum pump capable of controllably depressurizing the treatment container 3 e.g. to about 133×10 Pa to 133×10−8 Pa.
  • Below the treatment container 3 is provided a lid 10 for closing the furnace opening 3 a of the treatment container 3 and which can be moved vertically by means of a not-shown lifting mechanism. A heat-retaining cylinder 11 as a heat-retaining means for the furnace opening is placed on the upper surface of the lid 10, and a quartz boat 12 as a retainer for holding a large number, e.g. about 100 to 150, of 300-mm semiconductor wafers W at a predetermined spacing in the vertical direction, is placed on the upper surface of the heat-retaining cylinder 11. The lid 10 is provided with a rotating mechanism 13 for rotating the boat 12 on its axis. The boat 12 is carried (unloaded) from the treatment container 3 downward into a loading area 15 by the downward movement of the lid 10 and, after replacement of wafers W, carried (loaded) into the treatment container 3 by the upward movement of the lid 10.
  • The furnace body 5 includes a cylindrical heat insulator 16, groove-like shelf portions 17 formed in the inner circumferential surface of the heat insulator 16 and arranged in multiple stages in the axial direction (vertical direction in FIG. 1), and heater elements (heater wires, heat generating resistors) 18 disposed along each shelf portion 17. The heat insulator 16 is composed of inorganic fibers, such as silica, alumina or alumina silicate. The heat insulator 16 is longitudinally halved to facilitate installation of the heater elements and assembly of the heater.
  • The heater element 18 has a corrugated shape obtained by shaping (bending) of a strip-shaped heat generating resistor. The corrugated heater element 18 is composed of, for example, an alloy (Kanthal alloy) consisting of iron (Fe), chromium (Cr) and aluminum (Al). The heater element 18 has, for example, a thickness of about 1 to 2 mm, a width of about 14 to 18 mm, a corrugation amplitude of about 11 to 15 mm and a corrugation pitch P of about 28 to 32 mm. In order to allow some degree of circumferential movement of the heater element 18 on each shelf portion 17 of the heat insulator 16 and to enhance the strength of the bent portions of the heater element 18, it is preferred that the apex angle 8 of each apex portion (top portion or peak portion) 18 a of the corrugated heater element 18 be made about 90 degrees and that the apex portions have been subjected to R-bending.
  • The heat insulator 16 is provided with pin members 20 for holding the heater elements 18 at predetermined intervals in such a manner as to allow radial movement of the heater elements 18 and to prevent fall or escape of the heater elements 18 from the shelf portions 17. In the inner circumferential surface of the cylindrical heat insulator 16, annular grooves 21, concentric with the heat insulator 16, are formed in multiple stages at a predetermined pitch in the axial direction, with the circumferentially-continuous annular shelf portion 17 being formed between adjacent upper and lower grooves 21. A gap sufficient to permit thermal expansion/contraction and radial movement of the heater element 18 is provided over and under the heater element 18 in the groove portion 21 and between the bottom wall of the groove portion 21 and the heater element 18. Upon forced air cooling of the heat treatment apparatus, such gaps allow cooling air to enter the space behind the heater element 18, enabling effective cooling of the heater element 18.
  • The heater elements 18 are connected by a connecting plate, and the heater elements 18 positioned on the terminal side are connected to an external power source via terminal plates 22 a, 22 b that penetrate radially through the heat insulator 16.
  • As shown in FIG. 1, the outer circumferential surface of the heat insulator 16 of the furnace body 5 is covered with an outer shell 28 made of a metal, such as stainless steel, in order to retain the shape of the heat insulator 16 and, in addition, to reinforce the heat insulator 16. The outer circumferential surface of the outer shell 28 is covered with a water-cooling jacket 30 in order to reduce the thermal influence of the furnace body 5 on the external environment. An upper heat insulator 31 which covers the top (upper end) of the heat insulator 16 is provided on the top of the heat insulator 16, and a stainless steel top board 32 which covers the top (upper end) of the outer shell 28 is provided on the upper surface of the upper insulator 31.
  • As shown in FIGS. 1 and 2, in order to rapidly lower the temperature of a wafer after heat treatment so as to speed up the process and increase the throughput, the furnace body 5 is provided with a heat exhaust system 35 for discharging the atmosphere in the space 33 between the furnace body 5 and the treatment container 3 to the outside, and a forced air cooling means 36 for introducing air at room temperature (20-30° C.) into the space 33 to forcibly cool the space 33. The heat exhaust system 35 is comprised of an exhaust port 37 provided e.g. at the top of the furnace body 5, and to the exhaust port 37 is connected an air exhaust line 62 for exhausting air from the space 33.
  • The forced air cooling means 36 includes a plurality of annular flow passages 38 formed between the heat insulator 16 and the outer shell 28 and arranged in the height direction of the furnace body 5, and a plurality of forced cooling air outlets 40, provided in the heat insulator 16, for ejecting air from the respective annular flow passages 38 in a direction oblique to the radial direction of the heat insulator 16 to create a swirling flow in the circumferential direction of the space 33. The annular flow passages 38 are formed by attaching band-like or annular heat insulators 41 to the outer circumferential surface of the heat insulator 16, or by annularly grinding the outer circumferential surface of the heat insulator 16. Each forced cooling air outlet 40 is formed in the shelf portion 17, lying between adjacent upper and lower heater elements 18 in the heat insulator 16, such that it penetrates through the shelf portion 17. By thus providing the forced cooling air outlets 40 in the shelf portions 17, air can be ejected into the space 33 without being impeded by the heater elements 18.
  • Though in this embodiment a corrugated heater element, obtained by bending of a strip-shaped heat generating resistor, is used as the heater element 18, and the corrugated heater element 18 is housed in each shelf portion 17, it is possible to use other types of heater elements having various structures. Though in this embodiment air is ejected from the forced cooling air outlets 40 in such a manner as to create a swirling flow, the creation of a swirling air flow is not always necessary.
  • A common supply duct 49 for distributing and supplying cooling air to the annular flow passages 38 and which extends in the height direction of the furnace body 5, is provided on the outer circumferential surface of the outer shell 28. The outer shell 28 has communication holes for communication between the supply duct 49 and the annular flow passages 38. To the supply duct 49 is connected an air supply line 52 for sucking in air in a clean room as cooling air (20-30° C.) and supplying the cooling air.
  • Because the forced cooling air outlets 40 are each formed in a shelf portion 17, lying between adjacent upper and lower heater elements 18 in the heat insulator 16, such that it penetrates through the shelf portion 17, as described above, air can be easily ejected from the outlets 40 without being impeded by the heater elements 18. The heat insulator 16 is longitudinally halved, and accordingly the heater elements 18 are also longitudinally halved. This can facilitate installation of the heater elements 18 in the heat insulator 16, enabling easy assembly of the heater.
  • As shown in FIGS. 1 and 2, the furnace body 5 is provided with a pressure detection system 50 penetrating through the heat insulator 16, the outer shell 28 and the cooling jacket 30 of the furnace body 5. The pressure detection system 50 includes a pressure detector tube 50 a penetrating and extending through the heat insulator 16, the outer shell 28 and the cooling jacket 30, and a pressure sensor 50 b provided at the outlet of the pressure detector tube 50 a, and detects the pressure in the space 33 between the furnace body 5 and the treatment container 3.
  • When the pressure in the space 33 between the furnace body 5 and the treatment container 3 is detected by the pressure sensor 50 b of the pressure detection system 50, the detection signal from the pressure sensor 50 b is sent to a control section 51.
  • Further, a temperature sensor 51A for detecting the temperature of the space 33 between the furnace body 5 and the treatment container 3 is disposed in the space 33. Based on a detection signal from the temperature sensor 51A, control of heat treatment in the vertical heat treatment apparatus is performed by the control section 51.
  • As shown in FIG. 2, the air supply line 52 and the air exhaust line 62, independent of each other, constitute an open air supply/exhaust line system. The air supply line 52 of the system is provided with an air supply blower 53 having an inverter drive unit 53 a.
  • A damper 56 is provided on the inlet side of the air supply blower 53, and a hole valve 54 and a butterfly valve 55 are disposed on the outlet side of the air supply blower 53. For each of the damper 56 on the inlet side of the air supply blower 53, and the hole valve 54 and the butterfly valve 55 on the outlet side of the air supply blower 53, the opening/closing is adjustable. The damper 56, the hole valve 54 and the butterfly valve 55 constitute an air supply line valve mechanism 54A.
  • On the other hand, the air exhaust line 62 is provided with an air exhaust blower 63 having an inverter drive unit 63 a.
  • A butterfly valve 66 and a hole valve 67 are provided on the inlet side of the air exhaust blower 63, and a hole valve 64 and a butterfly valve 65 are disposed on the outlet side of the air exhaust blower 63. For each of the butterfly valve 66 and the hole valve 67 on the inlet side of the air exhaust blower 63, and the hole valve 64 and the butterfly valve 65 on the outlet side of the air exhaust blower 63, the opening/closing is adjustable. The butterfly valve 66 and the hole valve 67 on the inlet side of the air exhaust blower 63, and the hole valve 64 and the butterfly valve 65 on the outlet side of the air exhaust blower 63 constitute an air exhaust line valve mechanism 64A.
  • The above-described forced cooling air outlets 40 are formed over the entire length of the supply duct 49, ranging from the upper end to the lower end of the supply duct 49.
  • Thus, the area 40A in which the air outlets 40 are formed coincides with the entire length of the supply duct 49.
  • The pressure detection system 50 is provided in a space area 33A corresponding to the air outlet formation area 40A. This enables direct detection of the pressure in the space area 33A which is affected by air ejected from the air outlets 40.
  • The operation of the vertical heat treatment apparatus having the above construction will now be described.
  • First, wafers W are loaded into the boat 12, and the boat 12 loaded with the wafers W is placed on the heat-retaining cylinder 11 on the lid 10. Thereafter, the boat 12 is carried into the treatment container 3 by the upward movement of the lid 10.
  • Next, the control section 51 actuates the heater elements 18 though control of the power source to heat the space 33 between the furnace body 5 and the treatment container 3 and carry out heat treatment of the wafers W in the boat 12 in the treatment container 3.
  • During the heat treatment, the control section 51 controls the treatment temperature based on a detection signal from the temperature sensor 51A so that the heat treatment of the wafers W can be performed with high precision at an appropriate temperature.
  • After completion of the heat treatment, the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in order to streamline the heat treatment operation.
  • A method for forcibly cooling the space 33 will now be described.
  • First, the air supply blower 53 and the air exhaust blower 63 are actuated by the control section 51. Cooing air (20-30° C.) in the clean room is introduced into the air supply line 52, and the cooling air is fed from the air supply blower 53 to the supply duct 49.
  • The cooling air in the supply duct 49 then enters the annular flow passages 38 formed on the outer circumferential surface of the heat insulator 16 of the furnace body 5, and the cooling air in the annular flow passages 38 is then ejected from the air outlets 40, penetrating through the heat insulator 16, into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 (first cooling step).
  • Heated air in the space 33 is fed through the air exhaust line 62 to a heat converter 69 where the air is cooled, and the cooled air is discharged by the air exhaust blower 63 to the outside.
  • During the above operation, the control section 51 drives and controls the inverter drive unit 53 a of the air supply blower 53 and the inverter drive unit 63 a of the air exhaust blower 63 and, in addition, drives and controls the air supply line valve mechanism 54A and the air exhaust line valve mechanism 64A so as to maintain the pressure in the space 33 in a slightly negative pressure range A [0 Pa to −85 Pa, preferably −20 Pa to −30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5] (see FIG. 4).
  • By maintaining the pressure in the space 33 in the slightly negative pressure range A, i.e. 0 Pa to −85 Pa, preferably −20 Pa to −30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5, the pressure in the space 33 can be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body 5. Further, the pressure in the space 33 can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body 5 and making the temperature distribution in the interior of the treatment container 3 non-uniform.
  • After the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in the first cooling step, the temperature of the space 33 decreases and the pressure in the space 33 becomes lower than that in the first cooling step.
  • The pressure in the space 33 is directly and continually detected with the pressure detection system 50. When the pressure in the space 33 has become significantly lower than that in the first cooling step, the control section 51, based on a detection signal from the pressure detection system 50 which indicates the pressure decrease, sets a higher pressure than the pressure set for the first cooling step, and drives and controls the inverter drive unit 53 a of the air supply blower 53 and the inverter drive unit 63 a of the air exhaust blower 63 and, in addition, drives and controls the air supply line valve mechanism 54A and the air exhaust line valve mechanism 64A. In this case, a larger amount of cooling air than that in the first cooling step is supplied from the air supply line 52 to the space 33, so that the pressure in the space 33 can be returned to that in the first cooling step (second cooling step). If the second cooling step is not carried out, the pressure will continue to decrease as shown by the broken line in FIG. 4. By carrying out the second cooling step, the pressure in the space 33 can be returned to the pressure level in the first cooling step, as shown by the solid line in FIG. 4.
  • The second cooling step can prevent the external air from entering the furnace body 5 due to decrease in the pressure in the space 33. Furthermore, a larger amount of air can be supplied to the space 33 as compared to the first cooling step, making it possible to forcibly cool the space 33 rapidly and securely.
  • The operation of the vertical heat treatment apparatus in the first cooling step and the second cooling step will now be described in more detail.
  • As described above, in the first cooling step, cooling air in the annular flow passages 38 is ejected from the air outlets 40, penetrating through the heat insulator 16, into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33. The cooling air ejected into the space 33, while cooling the heater elements 18 of the furnace body 5 and the treatment container 3, rapidly expands and increases its volume and pressure (see FIG. 4). As described above, the pressure detection system 50 is provided in the space 33 between the furnace body 5 and the treatment container 3, and the pressure in the space 33 is directly detected by the pressure detection system 50. Compared to the case where a pressure sensor is provided at a distance from the space 33, for example, in the air supply line 52 or the air discharge line 62, the pressure detection system 50 can quickly and accurately detect the increase in the pressure in the space 33 without being affected by an external disturbance. Based on a detection signal from the pressure detection system 50, the control section 51 performs control in an appropriate manner so that the space 33 is kept at the above-described slightly negative pressure.
  • In this regard, it may be possible to detect the pressure in the space 33 with a pressure sensor provided in the air supply line 52 or the air discharge line 62. In the case of a sensor provided in the air supply line 52, however, a pressure applied to cooling air must be taken into consideration as an external disturbance. In the case of a sensor provided in the air exhaust line 62, a suction pressure applied to cooling air must be taken into consideration as an external disturbance.
  • According to the present invention, on the other hand, because of the provision of the pressure detection system 50 in the space 33 between the furnace body 5 and the treatment container 3, the pressure increase in the space 33 can be detected directly, quickly and accurately without being affected by an external disturbance. This enables the control section 51 to perform control in an appropriate manner to keep the space at a slightly negative pressure.
  • After the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in the first cooling step, the temperature of the space 33 decreases and the pressure in the space 33 also decreases (second cooling step) as shown in FIG. 4.
  • The pressure in the space 33 is directly and continually detected with the pressure detection system 50 also after the first cooling step, and the decrease in the pressure in the space 33 can be detected quickly and accurately. Based on a detection signal from the pressure detection system 50 which indicates the decrease in the pressure, the control section 51 controls the apparatus in such a manner as to supply a larger amount of cooling air than that in the first cooling step from the air supply line 52 to the space 33, whereby the pressure in the space 33 can be returned to the pressure in the first cooling step.
  • By thus supplying in the second cooling step a larger amount of cooling air than that in the first cooling step and thereby raising the pressure in the space 33, an excessive lowering of the cooling rate can be avoided in the second cooling step.
  • Though in this embodiment the control section 51, based on a detection signal from the pressure detection system 50, drives and controls the inverter drive unit 53 a of the air supply blower 53, the inverter drive unit 63 a of the air exhaust blower 63, the air supply line valve mechanism 54A and the air exhaust line valve mechanism 64A, it is also possible for the control section 51 to drive and control either one or a combination of the inverter drive unit 53 a of the air supply blower 53, the inverter drive unit 63 a of the air exhaust blower 63, the air supply line valve mechanism 54A and the air exhaust line valve mechanism 64A. Further, the control section 51 may drive and control only one of the members 54, 55 and 56 of the air supply line valve mechanism 54A, or drive and control only one of the members 64, 65, 66 and 67 of the air exhaust line valve mechanism 64A.
  • Second Embodiment
  • A second embodiment of the present invention will now be described with reference to FIGS. 1 and 3.
  • As shown in FIGS. 1 and 3, the air supply line 52 and the air discharge line 62 are connected to each other, constituting a closed air supply/exhaust line system. A blower 73 for air supply and air exhaust, having an inverter drive unit 73 a, is provided at the connection between the air supply line 52 and the air discharge line 62.
  • A butterfly valve 76 and a hole valve 77 are provided on the inlet side of the blower 73, and a hole valve 74 and a butterfly valve 75 are disposed on the outlet side of the blower 73. For each of the butterfly valve 76 and the hole valve 77 on the inlet side of the blower 73, and the hole valve 74 and the butterfly valve 75 on the outlet side of the blower 73, the opening/closing is adjustable. The hole valve 74 and the butterfly valve 75 on the air supply line 52 side constitute an air supply line valve mechanism 74A.
  • On the other hand, the butterfly valve 76 and the hole valve 77 on the air exhaust line 62 side constitute an air exhaust line valve mechanism 76A.
  • The operation of the vertical heat treatment apparatus having the above construction will now be described.
  • First, wafers W are loaded into the boat 12, and the boat 12 loaded with the wafers W is placed on the heat-retaining cylinder 11 on the lid 10. Thereafter, the boat 12 is carried into the treatment container 3 by the upward movement of the lid 10.
  • Next, the control section 51 actuates the heater elements 18 though control of the power source to heat the space 33 between the furnace body 5 and the treatment container 3 and carry out heat treatment of the wafers W in the boat 12 in the treatment container 3.
  • During the heat treatment, the control section 51 controls the treatment temperature based on a detection signal from the temperature sensor 51A so that the heat treatment of the wafers W can be performed with high precision at an appropriate temperature.
  • After completion of the heat treatment, the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in order to streamline the heat treatment operation.
  • A method for forcibly cooling the space 33 will now be described.
  • First, the air supply/air exhaust blower 73 is actuated by the control section 51, whereby cooing air in the air supply line 52 is fed to the supply duct 49.
  • The cooling air in the supply duct 49 then enters the annular flow passages 38 formed on the outer circumferential surface of the heat insulator 16 of the furnace body 5, and the cooling air in the annular flow passages 38 is then ejected from the air outlets 40, penetrating through the heat insulator 16, into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33 (first cooling step).
  • Heated air in the space 33 is fed through the air exhaust line 62 to a heat exchanger 79 where the air is cooled, and the cooled air is returned to the blower 73.
  • During the above operation, the control section 51 drives and controls the inverter drive unit 73 a of the blower 73 and, in addition, drives and controls the air supply line valve mechanism 74A and the air exhaust line valve mechanism 76A so as to maintain the pressure in the space 33 in a slightly negative pressure range A [0 Pa to −85 Pa, preferably −20 Pa to −30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5] (see FIG. 4).
  • By maintaining the pressure in the space 33 in the slightly negative pressure range A, i.e. 0 Pa to −85 Pa, preferably −20 Pa to −30 Pa relative to the external environment (atmospheric pressure) of the furnace body 5, the pressure in the space 33 can be prevented from becoming a positive pressure, whereby hot air can be prevented from blowing out of the furnace body 5. Further, the pressure in the space 33 can be prevented from becoming a highly negative pressure. This can prevent the external air from entering the furnace body 5 and making the temperature distribution in the interior of the treatment container 3 non-uniform.
  • After the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in the first cooling step, the temperature of the space 33 decreases and the pressure in the space 33 becomes lower than that during the first cooling step.
  • The pressure in the space 33 is directly and continually detected with the pressure detection system 50. When the pressure in the space 33 has become significantly lower than that during the first cooling step, the control section 51, based on a detection signal from the pressure detection system 50 which indicates the pressure decrease, sets a higher pressure than the pressure set for the first cooling step, and drives and controls the inverter drive unit 73 a of the blower 73 and, in addition, drives and controls the air supply line valve mechanism 74A and the air exhaust line valve mechanism 76A. In this case, a larger amount of cooling air than that in the first cooling step is supplied from the air supply line 52 to the space 33, so that the pressure in the space 33 can be returned to that during the first cooling step (second cooling step). If the second cooling step is not carried out, the pressure will continue to decrease as shown by the broken line in FIG. 4. By carrying out the second cooling step, the pressure in the space 33 can be returned to the pressure level in the first cooling step, as shown by the solid line in FIG. 4.
  • The second cooling step can prevent the external air from entering the furnace body 5 due to decrease in the pressure in the space 33. Furthermore, a larger amount of air can be supplied to the space 33 as compared to the first cooling step, making it possible to forcibly cool the space 33 rapidly and securely.
  • The operation of the vertical heat treatment apparatus in the first cooling step and the second cooling step will now be described in more detail.
  • As described above, in the first cooling step, cooling air in the annular flow passages 38 is ejected from the air outlets 40, penetrating through the heat insulator 16, into the space 33 between the furnace body 5 and the treatment container 3 to forcibly cool the space 33. The cooling air ejected into the space 33, while cooling the heater elements 18 of the furnace body 5 and the treatment container 3, rapidly expands and increases its volume and pressure (see FIG. 4). As described above, the pressure detection system 50 is provided in the space 33 between the furnace body 5 and the treatment container 3, and the pressure in the space is directly detected by the pressure detection system 50. Compared to the case where a pressure sensor is provided at a distance from the space 33, for example, in the air supply line 52 or the air discharge line 62, the pressure detection system 50 can quickly and accurately detect the increase in the pressure in the space 33 without being affected by an external disturbance. Based on a detection signal from the pressure detection system 50, the control section 51 performs control in an appropriate manner so that the space 33 is kept at the above-described slightly negative pressure.
  • In this regard, it is possible to detect the pressure in the space 33 with a pressure sensor provided in the air supply line 52 or the air discharge line 62. In the case of a sensor provided in the air supply line 52, a pressure applied to cooling air must be taken into consideration as an external disturbance. In the case of a sensor provided in the air exhaust line 62, a suction pressure applied to cooling air must be taken into consideration as an external disturbance.
  • According to the present invention, on the other hand, because of the provision of the pressure detection system 50 in the space 33 between the furnace body 5 and the treatment container 3, the pressure increase in the space 33 can be detected directly, quickly and accurately without being affected by an external disturbance. This enables the control section 51 to perform control in an appropriate manner to keep the space at a slightly negative pressure.
  • After the space 33 between the furnace body 5 and the treatment container 3 is forcibly cooled in the first cooling step, the temperature of the space 33 decreases and the pressure in the space 33 also decreases (second cooling step) as shown in FIG. 4.
  • The pressure in the space 33 is directly and continually detected with the pressure detection system 50 also after the first cooling step, and the decrease in the pressure in the space 33 can be detected quickly and accurately. Based on a detection signal from the pressure detection system 50 which indicates the decrease in the pressure, the control section 51 controls the apparatus in such a manner as to supply a larger amount of cooling air than that in the first cooling step from the air supply line 52 to the space 33, whereby the pressure in the space 33 can be returned to the pressure in the first cooling step.
  • By thus supplying in the second cooling step a larger amount of cooling air than that in the first cooling step and thereby raising the pressure in the space 33, an excessive lowering of the cooling rate can be avoided in the second cooling step.
  • Though in this embodiment the control section 51, based on a detection signal from the pressure detection system 50, drives and controls the inverter drive unit 73 a of the air supply/air exhaust blower 73, the air supply line valve mechanism 74A and the air exhaust line valve mechanism 76A, it is also possible for the control section 51 to drive and control either one or a combination of the inverter drive unit 73 a of the air supply/air exhaust, blower 73, the air supply line valve mechanism 74A and the air exhaust line valve mechanism 76A. Further, the control section 51 may drive and control only one of the members 74 and 75 of the air supply line valve mechanism 74A, or drive and control only one of the members 76 and 77 of the air exhaust line valve mechanism 76A.
  • While the present invention has been described with reference to preferred embodiments, it is understood that the present invention is not limited to the embodiments described above, but is capable of various changes and modifications within the scope of the inventive concept as expressed herein. For example, it is possible to use a treatment container with a cylindrical manifold, made of a heat-resistant metal such as stainless steel and including an introduction pipe portion and an exhaust pipe portion, coupled to the lower end, or to use a treatment container having a double-pipe structure.

Claims (16)

1. A vertical heat treatment apparatus comprising:
a furnace body having a heating section in the inner circumferential surface;
a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body;
a plurality of air outlets provided in an air outlet formation area of the furnace body;
an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets;
an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space;
a blower provided in at least one of the air supply line and the air exhaust line;
an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively;
a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and
a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space at a slightly negative pressure, wherein the pressure detection system is provided in a space area, corresponding to the air outlet formation area, of the space between the furnace body and the treatment container.
2. The vertical heat treatment apparatus according to claim 1, wherein the slightly negative pressure in the space is in the range of 0 Pa to −85 Pa.
3. The vertical heat treatment apparatus according to claim 2, wherein the slightly negative pressure in the space is in the range of −20 Pa to −30 Pa.
4. The vertical heat treatment apparatus according to claim 1, wherein the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
5. The vertical heat treatment apparatus according to claim 1, wherein the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
6. The vertical heat treatment apparatus according to claim 1, wherein the control section, based on a detection signal from the pressure detection system, controls the rotational speed of the blower to keep the space at a slightly-negative pressure.
7. The vertical heat treatment apparatus according to claim 1, wherein the control section, based on a detection signal from the pressure detection system, adjusts the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
8. The vertical heat treatment apparatus according to claim 1, wherein the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
9. A method for cooling a vertical heat treatment apparatus comprising: a furnace body having a heating section in the inner circumferential surface; a treatment container for housing a plurality of objects to be treated and which is disposed in the furnace body and defines a space between it and the furnace body; a plurality of air outlets provided in an air outlet formation area of the furnace body; an air supply line, connected to the furnace body, for supplying cooling air to the space via the plurality of air outlets; an air exhaust line, connected to the furnace body, for exhausting the cooling air from the space; a blower provided in at least one of the air supply line and the air exhaust line; an air supply line valve mechanism and an air exhaust line valve mechanism provided in the air supply line and the air exhaust line, respectively; a pressure detection system for detecting the pressure in the space between the furnace body and the treatment container; and a control section for controlling, based on a detection signal from the pressure detection system, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism to keep the space at a slightly negative pressure, wherein the pressure detection system is provided in a space area, corresponding to the air outlet formation area, of the space between the furnace body and the treatment container, said method comprising:
a first cooling step of supplying cooling air to the space between the furnace body and the treatment container through the air supply line and exhausting the cooling air from the space through the air exhaust line by actuating the blower with the control section; and
a second cooling step of controlling, based on a detection signal from the pressure detection system which indicates a decrease in the pressure in the space from that in the first cooling step due to decrease in the temperature of the space, at least one of the blower, the air supply line valve mechanism and the air exhaust line valve mechanism with the control section to supply a larger amount of cooling air than that in the first cooling step to the space.
10. The method according to claim 9, wherein the space is kept at a slightly negative pressure in the range of 0 Pa to −85 Pa.
11. The method according to claim 9, wherein the space is kept at a slightly negative pressure in the range of −20 Pa to −30 Pa.
12. The method according to claim 9, wherein the air supply line and the air exhaust line are connected to each other and constitute a closed air supply/air exhaust line system, and the blower is provided for air supply and air exhaust in the closed air supply/air exhaust line system.
13. The method according to claim 9, wherein the air supply line and the air exhaust line are provided independently of each other and constitute an open air supply/air exhaust line system, and the blower includes an air supply blower provided in the air supply line and an air exhaust blower provided in the air exhaust line.
14. The method according to claim 9, wherein the control section, based on a detection signal from the pressure detection system, controls the rotational speed of the blower to keep the space at a slightly negative pressure.
15. The method according to claim 9, wherein the control section, based on a detection signal from the pressure detection system, adjusts the valve opening degree of the air supply line valve mechanism or the air exhaust line valve mechanism to keep the space at a slightly negative pressure.
16. The method according to claim 9, wherein the pressure detection system includes a pressure detector tube that penetrates through the furnace body, and a pressure sensor provided at the outlet of the pressure detector tube.
US13/040,720 2010-03-10 2011-03-04 Vertical heat treatment apparatus and method for cooling the apparatus Active 2033-11-19 US9099507B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-053154 2010-03-10
JP2010053154 2010-03-10

Publications (2)

Publication Number Publication Date
US20110223552A1 true US20110223552A1 (en) 2011-09-15
US9099507B2 US9099507B2 (en) 2015-08-04

Family

ID=44560331

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/040,720 Active 2033-11-19 US9099507B2 (en) 2010-03-10 2011-03-04 Vertical heat treatment apparatus and method for cooling the apparatus

Country Status (5)

Country Link
US (1) US9099507B2 (en)
JP (1) JP5394360B2 (en)
KR (1) KR101360069B1 (en)
CN (1) CN102191473B (en)
TW (1) TWI497023B (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110220089A1 (en) * 2010-03-12 2011-09-15 Tokyo Electron Limited Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor
US20140186785A1 (en) * 2012-12-28 2014-07-03 The Mellen Company Inc. Furnace system with active cooling system and method
US20160208373A1 (en) * 2015-01-20 2016-07-21 Kennametal Inc. Imc evaporator boat assembly
US20160208374A1 (en) * 2015-01-20 2016-07-21 Kennametal Inc. Imc evaporator boat-thermal insulation cartridge assembly
US20170207078A1 (en) * 2016-01-15 2017-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Atomic layer deposition apparatus and semiconductor process
US20180105933A1 (en) * 2015-04-21 2018-04-19 Eugene Technology Co., Ltd. Substrate processing apparatus and method for cleaning chamber
CN109234704A (en) * 2018-11-27 2019-01-18 湖南顶立科技有限公司 A kind of vapor deposition apparatus
CN110749203A (en) * 2019-09-29 2020-02-04 彩虹显示器件股份有限公司 Furnace body cooling system of substrate glass kiln and operation method thereof
CN112646987A (en) * 2020-12-01 2021-04-13 攀钢集团研究院有限公司 Preparation method of industrial smelting vanadium-aluminum alloy
US11114319B2 (en) * 2018-11-27 2021-09-07 Tokyo Electron Limited Heat treatment apparatus and heat treatment method
US11821062B2 (en) 2019-04-29 2023-11-21 Kennametal Inc. Cemented carbide compositions and applications thereof

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9608119B2 (en) 2010-03-02 2017-03-28 Micron Technology, Inc. Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures
CN102517562B (en) * 2011-12-15 2014-01-01 常州星海电子有限公司 Device for manufacturing thin-film battery in way of vertical gradient condensation
CN104576463A (en) * 2015-01-22 2015-04-29 北京七星华创电子股份有限公司 Rapid cooling and heat treatment system
JP6804309B2 (en) * 2017-01-12 2020-12-23 東京エレクトロン株式会社 Heat treatment equipment and temperature control method
JP6964737B2 (en) * 2017-01-12 2021-11-10 東京エレクトロン株式会社 Heat treatment equipment and temperature control method
CN107815530A (en) * 2017-11-30 2018-03-20 中国石油天然气第七建设有限公司 Pin-connected panel heat-treatment furnace
WO2019148918A1 (en) * 2018-02-01 2019-08-08 福建省长汀金龙稀土有限公司 Device and method for continuously performing grain boundary diffusion and heat treatment
CN110106334B (en) * 2018-02-01 2021-06-22 福建省长汀金龙稀土有限公司 Device and method for continuously performing grain boundary diffusion and heat treatment
CN108489278A (en) * 2018-03-20 2018-09-04 佛山市阳光陶瓷有限公司 A kind of ventilation heat radiating type kiln
CN110527989A (en) * 2018-06-08 2019-12-03 北京北方华创微电子装备有限公司 Cooling device and Equipment for Heating Processing for Equipment for Heating Processing
JP7055075B2 (en) * 2018-07-20 2022-04-15 東京エレクトロン株式会社 Heat treatment equipment and heat treatment method
KR102412459B1 (en) * 2018-07-26 2022-06-23 주식회사 원익아이피에스 Vertical reactor for wafer processing
RU2705186C1 (en) * 2019-01-14 2019-11-05 Общество с ограниченной ответственностью "Катод" Method of workpiece cooling in vacuum heating chamber of vacuum furnace and vacuum furnace
KR102552458B1 (en) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
CN110634775B (en) * 2019-09-16 2022-11-08 西安奕斯伟材料科技有限公司 Airflow control device and wafer processing device
CN111023841B (en) * 2019-12-26 2023-09-08 北京北方华创微电子装备有限公司 Furnace body cooling device and semiconductor processing equipment
CN112662970A (en) * 2020-12-03 2021-04-16 上海航天精密机械研究所 Environment-friendly magnesium alloy part heat treatment method and device

Citations (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2440052A (en) * 1945-09-24 1948-04-20 Ruth Sharp Lingen Averaging controller
US3794459A (en) * 1972-11-29 1974-02-26 Meenan Corp Furnace exhaust treatment system
US4697530A (en) * 1986-12-23 1987-10-06 Dumont Holding Company Underfed stoker boiler for burning bituminous coal and other solid fuel particles
US5360336A (en) * 1991-06-14 1994-11-01 Tokyo Electron Sagami Kabushiki Kaisha Forced cooling apparatus for heat treatment apparatus
US5447294A (en) * 1993-01-21 1995-09-05 Tokyo Electron Limited Vertical type heat treatment system
US5529657A (en) * 1993-10-04 1996-06-25 Tokyo Electron Limited Plasma processing apparatus
US5562383A (en) * 1993-04-13 1996-10-08 Tokyo Electron Kabushiki Kaisha Treatment apparatus
US5616264A (en) * 1993-06-15 1997-04-01 Tokyo Electron Limited Method and apparatus for controlling temperature in rapid heat treatment system
US5928390A (en) * 1996-01-26 1999-07-27 Tokyo Electron Limited Vertical processing apparatus
US6059567A (en) * 1998-02-10 2000-05-09 Silicon Valley Group, Inc. Semiconductor thermal processor with recirculating heater exhaust cooling system
US6191394B1 (en) * 1999-05-19 2001-02-20 Tokyo Electron Ltd. Heat treating apparatus
US6394796B1 (en) * 1999-11-04 2002-05-28 Alan D. Smith Curing oven combining methods of heating
US6409503B1 (en) * 1999-07-21 2002-06-25 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
US20020132480A1 (en) * 2000-12-28 2002-09-19 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US20050271988A1 (en) * 2000-10-02 2005-12-08 Tetsuo Komai Combustion type waste gas treatment system
US20060280670A1 (en) * 2005-06-10 2006-12-14 Teeter Gerald A Method and apparatus for producing charcoal
US20070282554A1 (en) * 2006-05-31 2007-12-06 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
US20080090389A1 (en) * 2006-09-28 2008-04-17 Hitachi Kokusai Electric Inc. Manufacturing method of semiconductor device and substrate processing apparatus
US20080134977A1 (en) * 2004-11-01 2008-06-12 Hitachi Kokusai Electric Inc. Substrate Treating Apparatus and Semiconductor Device Manufacturing Method
US20080173238A1 (en) * 2006-12-12 2008-07-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel
US20080182345A1 (en) * 2007-01-26 2008-07-31 Hitachi Kokusai Electric Inc. Substrate processing method and semiconductor manufacturing apparatus
US20080318442A1 (en) * 2007-06-15 2008-12-25 Hitachi Kokusai Electric Inc. Semiconductor device manufacturing method and substrate processing apparatus
US20090029486A1 (en) * 2006-03-07 2009-01-29 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Substrate Processing Method
US20090064765A1 (en) * 2006-03-28 2009-03-12 Hitachi Kokusai Electric Inc. Method of Manufacturing Semiconductor Device
US20090095422A1 (en) * 2007-09-06 2009-04-16 Hitachi Kokusai Electric Inc. Semiconductor manufacturing apparatus and substrate processing method
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
US20090205783A1 (en) * 2008-02-20 2009-08-20 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20090209095A1 (en) * 2005-06-22 2009-08-20 Sadayoshi Horii Manufacturing Method for Semiconductor Devices and Substrate Processing Apparatus
US20090233429A1 (en) * 2006-05-17 2009-09-17 Dai Ishikawa Semiconductor device manufacturing method and substrate processing apparatus
US20090263971A1 (en) * 2008-04-16 2009-10-22 Hitachi-Kokusai Electric Inc. Method of manufacturing semiconductor device and substrate processing apparatus
US20090269713A1 (en) * 2007-02-28 2009-10-29 Byung Gil Choi Heat treatment equipment
US20090291566A1 (en) * 2005-08-05 2009-11-26 Masaaki Ueno Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
US20090308332A1 (en) * 2007-10-01 2009-12-17 Tanbour Emadeddin Y Water heater with forced draft air inlet
US20100154711A1 (en) * 2008-12-24 2010-06-24 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20100218724A1 (en) * 2009-02-27 2010-09-02 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20110220089A1 (en) * 2010-03-12 2011-09-15 Tokyo Electron Limited Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor
US20120052203A1 (en) * 2010-08-27 2012-03-01 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method of processing substrate
US20120086107A1 (en) * 2010-10-07 2012-04-12 Hitachi Kokusai Electric Inc. Semiconductor device manufacturing method, substrate processing apparatus and semiconductor device
US20120100722A1 (en) * 2010-10-26 2012-04-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
US20120119337A1 (en) * 2010-11-11 2012-05-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device and semiconductor device
US20120126355A1 (en) * 2010-11-24 2012-05-24 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatus
US20120270169A1 (en) * 2011-04-25 2012-10-25 Tokyo Electron Limited Temperature-measuring substrate and heat treatment apparatus
US20130042803A1 (en) * 2010-07-22 2013-02-21 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
US20130065189A1 (en) * 2011-09-13 2013-03-14 Tokyo Electron Limited Thermal treatment apparatus, temperature control system, thermal treatment method, temperature control method, and non-transitory computer readable medium embodied with program for executing the thermal treatment method or the temperature control method
US20140206204A1 (en) * 2011-09-26 2014-07-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
US20140256160A1 (en) * 2011-11-21 2014-09-11 Hitachi Kokusai Electric Inc. Apparatus for Manufacturing Semiconductor Device, Method of Manufacturing Semiconductor Device, and Recording Medium
US20140287375A1 (en) * 2013-03-25 2014-09-25 Hitachi Kokusai Electric Inc. Insulation structure and method of manufacturing semiconductor device
US20140295648A1 (en) * 2013-03-28 2014-10-02 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111395B2 (en) * 1993-06-15 2000-11-20 東京エレクトロン株式会社 Heat treatment equipment
JPH0982720A (en) * 1995-09-14 1997-03-28 Tokyo Electron Ltd Vertical heat treatment apparatus
JPH09190982A (en) * 1996-01-11 1997-07-22 Toshiba Corp Production equipment for semiconductor
JP4610771B2 (en) * 2001-04-05 2011-01-12 東京エレクトロン株式会社 Vertical heat treatment apparatus and forced air cooling method thereof
JP4669465B2 (en) * 2006-11-08 2011-04-13 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, heating apparatus, and heat insulating material
JP5312765B2 (en) 2007-01-26 2013-10-09 株式会社日立国際電気 Substrate processing method and semiconductor manufacturing apparatus
JP5510991B2 (en) 2007-09-06 2014-06-04 株式会社日立国際電気 Semiconductor manufacturing apparatus and substrate processing method

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2440052A (en) * 1945-09-24 1948-04-20 Ruth Sharp Lingen Averaging controller
US3794459A (en) * 1972-11-29 1974-02-26 Meenan Corp Furnace exhaust treatment system
US4697530A (en) * 1986-12-23 1987-10-06 Dumont Holding Company Underfed stoker boiler for burning bituminous coal and other solid fuel particles
US5360336A (en) * 1991-06-14 1994-11-01 Tokyo Electron Sagami Kabushiki Kaisha Forced cooling apparatus for heat treatment apparatus
US5447294A (en) * 1993-01-21 1995-09-05 Tokyo Electron Limited Vertical type heat treatment system
US5562383A (en) * 1993-04-13 1996-10-08 Tokyo Electron Kabushiki Kaisha Treatment apparatus
US5829939A (en) * 1993-04-13 1998-11-03 Tokyo Electron Kabushiki Kaisha Treatment apparatus
US5616264A (en) * 1993-06-15 1997-04-01 Tokyo Electron Limited Method and apparatus for controlling temperature in rapid heat treatment system
US5529657A (en) * 1993-10-04 1996-06-25 Tokyo Electron Limited Plasma processing apparatus
US5928390A (en) * 1996-01-26 1999-07-27 Tokyo Electron Limited Vertical processing apparatus
US6059567A (en) * 1998-02-10 2000-05-09 Silicon Valley Group, Inc. Semiconductor thermal processor with recirculating heater exhaust cooling system
US6191394B1 (en) * 1999-05-19 2001-02-20 Tokyo Electron Ltd. Heat treating apparatus
US20020110769A1 (en) * 1999-07-21 2002-08-15 Seiichi Yoshida Heat treatment method and heat treatment apparatus
US6409503B1 (en) * 1999-07-21 2002-06-25 Tokyo Electron Limited Heat treatment method and heat treatment apparatus
US6394796B1 (en) * 1999-11-04 2002-05-28 Alan D. Smith Curing oven combining methods of heating
US20050271988A1 (en) * 2000-10-02 2005-12-08 Tetsuo Komai Combustion type waste gas treatment system
US20020132480A1 (en) * 2000-12-28 2002-09-19 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US20080134977A1 (en) * 2004-11-01 2008-06-12 Hitachi Kokusai Electric Inc. Substrate Treating Apparatus and Semiconductor Device Manufacturing Method
US20060280670A1 (en) * 2005-06-10 2006-12-14 Teeter Gerald A Method and apparatus for producing charcoal
US20090209095A1 (en) * 2005-06-22 2009-08-20 Sadayoshi Horii Manufacturing Method for Semiconductor Devices and Substrate Processing Apparatus
US20090291566A1 (en) * 2005-08-05 2009-11-26 Masaaki Ueno Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
US20090029486A1 (en) * 2006-03-07 2009-01-29 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Substrate Processing Method
US20090197352A1 (en) * 2006-03-07 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing method and film forming method
US20090064765A1 (en) * 2006-03-28 2009-03-12 Hitachi Kokusai Electric Inc. Method of Manufacturing Semiconductor Device
US20090233429A1 (en) * 2006-05-17 2009-09-17 Dai Ishikawa Semiconductor device manufacturing method and substrate processing apparatus
US20110035165A1 (en) * 2006-05-31 2011-02-10 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
US20070282554A1 (en) * 2006-05-31 2007-12-06 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
US20080090389A1 (en) * 2006-09-28 2008-04-17 Hitachi Kokusai Electric Inc. Manufacturing method of semiconductor device and substrate processing apparatus
US20090191718A1 (en) * 2006-12-12 2009-07-30 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel
US20080173238A1 (en) * 2006-12-12 2008-07-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel
US20080182345A1 (en) * 2007-01-26 2008-07-31 Hitachi Kokusai Electric Inc. Substrate processing method and semiconductor manufacturing apparatus
US7727780B2 (en) * 2007-01-26 2010-06-01 Hitachi Kokusai Electric Inc. Substrate processing method and semiconductor manufacturing apparatus
US20090269713A1 (en) * 2007-02-28 2009-10-29 Byung Gil Choi Heat treatment equipment
US20080318442A1 (en) * 2007-06-15 2008-12-25 Hitachi Kokusai Electric Inc. Semiconductor device manufacturing method and substrate processing apparatus
US20090095422A1 (en) * 2007-09-06 2009-04-16 Hitachi Kokusai Electric Inc. Semiconductor manufacturing apparatus and substrate processing method
US20090308332A1 (en) * 2007-10-01 2009-12-17 Tanbour Emadeddin Y Water heater with forced draft air inlet
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
US20090205783A1 (en) * 2008-02-20 2009-08-20 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20090263971A1 (en) * 2008-04-16 2009-10-22 Hitachi-Kokusai Electric Inc. Method of manufacturing semiconductor device and substrate processing apparatus
US20100154711A1 (en) * 2008-12-24 2010-06-24 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20100218724A1 (en) * 2009-02-27 2010-09-02 Hitachi-Kokusai Electric Inc. Substrate processing apparatus
US20110220089A1 (en) * 2010-03-12 2011-09-15 Tokyo Electron Limited Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor
US20130042803A1 (en) * 2010-07-22 2013-02-21 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
US20120052203A1 (en) * 2010-08-27 2012-03-01 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method of processing substrate
US20120086107A1 (en) * 2010-10-07 2012-04-12 Hitachi Kokusai Electric Inc. Semiconductor device manufacturing method, substrate processing apparatus and semiconductor device
US20120100722A1 (en) * 2010-10-26 2012-04-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
US20120119337A1 (en) * 2010-11-11 2012-05-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device and semiconductor device
US20120126355A1 (en) * 2010-11-24 2012-05-24 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatus
US20120270169A1 (en) * 2011-04-25 2012-10-25 Tokyo Electron Limited Temperature-measuring substrate and heat treatment apparatus
US20130065189A1 (en) * 2011-09-13 2013-03-14 Tokyo Electron Limited Thermal treatment apparatus, temperature control system, thermal treatment method, temperature control method, and non-transitory computer readable medium embodied with program for executing the thermal treatment method or the temperature control method
US20140206204A1 (en) * 2011-09-26 2014-07-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
US20140256160A1 (en) * 2011-11-21 2014-09-11 Hitachi Kokusai Electric Inc. Apparatus for Manufacturing Semiconductor Device, Method of Manufacturing Semiconductor Device, and Recording Medium
US20140287375A1 (en) * 2013-03-25 2014-09-25 Hitachi Kokusai Electric Inc. Insulation structure and method of manufacturing semiconductor device
US20140295648A1 (en) * 2013-03-28 2014-10-02 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110220089A1 (en) * 2010-03-12 2011-09-15 Tokyo Electron Limited Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor
US20140186785A1 (en) * 2012-12-28 2014-07-03 The Mellen Company Inc. Furnace system with active cooling system and method
US9638466B2 (en) * 2012-12-28 2017-05-02 Jonathan Y. MELLEN Furnace system with active cooling system and method
US20160208373A1 (en) * 2015-01-20 2016-07-21 Kennametal Inc. Imc evaporator boat assembly
US20160208374A1 (en) * 2015-01-20 2016-07-21 Kennametal Inc. Imc evaporator boat-thermal insulation cartridge assembly
US10184168B2 (en) * 2015-01-20 2019-01-22 Kennametal Inc. IMC evaporator boat-thermal insulation cartridge assembly
US20180105933A1 (en) * 2015-04-21 2018-04-19 Eugene Technology Co., Ltd. Substrate processing apparatus and method for cleaning chamber
US20170207078A1 (en) * 2016-01-15 2017-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Atomic layer deposition apparatus and semiconductor process
CN109234704A (en) * 2018-11-27 2019-01-18 湖南顶立科技有限公司 A kind of vapor deposition apparatus
US11114319B2 (en) * 2018-11-27 2021-09-07 Tokyo Electron Limited Heat treatment apparatus and heat treatment method
TWI759650B (en) * 2018-11-27 2022-04-01 日商東京威力科創股份有限公司 Heat treatment device and heat treatment method
US11821062B2 (en) 2019-04-29 2023-11-21 Kennametal Inc. Cemented carbide compositions and applications thereof
CN110749203A (en) * 2019-09-29 2020-02-04 彩虹显示器件股份有限公司 Furnace body cooling system of substrate glass kiln and operation method thereof
CN112646987A (en) * 2020-12-01 2021-04-13 攀钢集团研究院有限公司 Preparation method of industrial smelting vanadium-aluminum alloy

Also Published As

Publication number Publication date
TW201200831A (en) 2012-01-01
JP5394360B2 (en) 2014-01-22
KR20110102168A (en) 2011-09-16
TWI497023B (en) 2015-08-21
KR101360069B1 (en) 2014-02-07
US9099507B2 (en) 2015-08-04
JP2011211163A (en) 2011-10-20
CN102191473B (en) 2014-11-19
CN102191473A (en) 2011-09-21

Similar Documents

Publication Publication Date Title
US9099507B2 (en) Vertical heat treatment apparatus and method for cooling the apparatus
US20110220089A1 (en) Vertical heat treatment apparatus and assembly of pressure detection system and temperature sensor
KR101148728B1 (en) Heat treatment furnace and vertical heat treatment apparatus
US8253075B2 (en) Heat treatment apparatus, heater, and method for manufacturing the heater
KR101117016B1 (en) Heat treatment furnace and vertical heat treatment apparatus
US8835811B2 (en) Thermal processing apparatus and method of controlling the same
KR101569557B1 (en) Heat treatment furnace and heat treatment apparatus
US8957352B2 (en) Heat treatment furnace and heat treatment apparatus
JP2012080080A (en) Vertical heat treatment apparatus and control method therefor
EP1895575B1 (en) Heat treatment apparatus
KR20120025434A (en) Vertical heat processing apparatus and control method of the same
JP2005183823A (en) Substrate processing equipment
US9105672B2 (en) Heat treatment apparatus
JP5743788B2 (en) Heat treatment equipment

Legal Events

Date Code Title Description
AS Assignment

Owner name: TOKYO ELECTRON LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KOBAYASHI, MAKOTO;REEL/FRAME:025903/0010

Effective date: 20110221

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8