US20110244131A1 - Method and apparatus for template surface treatment, and pattern forming method - Google Patents
Method and apparatus for template surface treatment, and pattern forming method Download PDFInfo
- Publication number
- US20110244131A1 US20110244131A1 US13/043,911 US201113043911A US2011244131A1 US 20110244131 A1 US20110244131 A1 US 20110244131A1 US 201113043911 A US201113043911 A US 201113043911A US 2011244131 A1 US2011244131 A1 US 2011244131A1
- Authority
- US
- United States
- Prior art keywords
- template
- surface treatment
- chamber
- unit
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Definitions
- Embodiments described herein relate generally to a template surface treatment method, a template surface treatment apparatus, and a pattern forming method.
- an imprint template formed with an uneven pattern is brought into contact with a resist coated onto a substrate to be processed to cure the resist, and the template is then released from the resist to form a resist pattern.
- the release layer is conventionally formed, e.g., by immersing the template into a mold release agent solution, maintaining the solution adhering onto the surface at high temperature and at high humidity, and performing rinsing and drying.
- FIG. 1 is a schematic block diagram of a template surface treatment apparatus according to a first embodiment of the present invention
- FIG. 2 is a flowchart of assistance in explaining a template surface treatment method according to the first embodiment
- FIGS. 3A , 3 B, 3 C, and 3 D are schematic diagrams of steps of template surface treatment according to the first embodiment
- FIG. 4 is a schematic block diagram of a template surface treatment apparatus according to a second embodiment of the present invention.
- FIG. 5 is a schematic diagram of particle removal
- FIGS. 6A and 6B are schematic diagrams of steps of template surface treatment according to the second embodiment
- FIG. 7 is a schematic block diagram of a template surface treatment apparatus according to a third embodiment of the present invention.
- FIG. 8 is a diagram showing an example of the configuration of a first chamber of the surface treatment apparatus according to the third embodiment.
- FIG. 9 is a diagram showing an example of the configuration of a second chamber of the surface treatment apparatus according to the third embodiment.
- FIG. 10 is a diagram showing an example of the configuration of a storing unit of the surface treatment apparatus according to the third embodiment.
- FIG. 11 is a flowchart of assistance in explaining a template surface treatment method according to the third embodiment.
- a template surface treatment method includes hydroxylating the surface of a template having an uneven pattern surface or absorbing water onto the surface to distribute OH radicals on the surface, and coupling a coupling agent onto the template surface on which the OH radicals are distributed.
- FIG. 1 shows the schematic configuration of a template surface treatment apparatus according to a first embodiment of the present invention.
- a surface treatment apparatus 100 has a first chamber 110 , a second chamber 120 , a conveying arm 131 which conveys a template along a conveying path 130 , a loader unit 140 which sets the unprocessed template, and an unloader unit 150 which unloads the processed template.
- Partition walls are provided between the loader unit 140 and the first chamber 110 , between the first chamber 110 and the second chamber 120 , and between the second chamber 120 and the unloader unit 150 , respectively.
- Openable/closable shutters can be provided on the side surfaces of each of the first chamber 110 and the second chamber 120 .
- the conveying arm 131 is located below the chamber. However, actually, the conveying arm 131 is provided at substantially the same height as the chamber, and can convey the template into the chamber or can convey the template out of the chamber via the shutters.
- a first filter 160 and a second filter 170 are provided in the upper portion of the surface treatment apparatus 100 .
- the first filter 160 is a HEPA filter which removes particles.
- the second filter 170 is a chemical filter which removes amines such as ammonia. The first filter 160 and the second filter 170 bring the interior of the surface treatment apparatus 100 into an environment in which there are very few particles and amines. For instance, amines are controlled to be in a several ppb level.
- the first chamber 110 is a chamber which reacts OH radicals onto the surface of the template, and has a holding unit 111 , a first gas supplying unit 112 , and a light emitting unit 113 .
- the holding unit 111 holds a template 101 set by the loader unit 140 and conveyed by the conveying arm 131 .
- the template 101 is, for instance, formed with an uneven pattern by plasma etching on a totally transparent quartz substrate used for a typical photomask.
- the first gas supplying unit 112 supplies the mixed gas of H 2 O/O 2 /N 2 into the first chamber 110 .
- the first gas supplying unit 112 can adjust the humidity in the first chamber 110 by controlling the mixing ratio and the flow rate of the mixed gas.
- the light emitting unit 113 emits a light onto the uneven pattern surface of the template 101 .
- the light emitting unit 113 has an Xe excimer lamp as a light source, and emits a light having a wavelength of 172 nm.
- the light emitting unit 113 may emit the light onto the entire surface of the template 101 or may emit the light onto a portion of the template 101 .
- the light emitting unit 113 or the holding unit 111 is provided so as to be drivable in the plane direction or in the vertical direction so that the template 101 is movable relative to the light emitting unit 113 .
- the light emission angle with respect to the surface of the template 101 may be adjustable.
- the gas interposed between the light emitting unit 113 and the surface of the template 101 attenuates the light emitted from the light emitting unit 113 . Therefore, the humidity and the oxygen concentration in the first chamber 113 , the intensity of the light emitted from the light emitting unit 113 , and the distance between the light emitting unit 113 and the surface of the template 101 are adjusted so that the light emitted from the light emitting unit 113 can reach the surface of the template 101 .
- the light emitting unit 113 is covered with quartz Qz. Thereby, contamination from the light emitting unit 113 onto the template 101 can be prevented.
- the second chamber 120 is a chamber which supplies a coupling agent while heating the template, thereby causing coupling reaction, and has a holding unit 121 , a heating unit 122 , a second gas supplying unit 123 , and a cooling unit (not shown).
- the holding unit 121 holds the template 101 conveyed by the conveying arm 131 from the first chamber 110 .
- the heating unit 122 is, e.g., a heater, and heats the template 101 held by the holding unit 121 .
- the heating unit 122 can adjust the surface temperature of the template 101 .
- the second gas supplying unit 123 supplies the mixed gas of a silane coupling agent and N 2 into the second chamber 120 .
- the cooling unit cools the template 101 .
- the cooling unit for instance, holds the template 101 close to a cool plate to cool the template 101 .
- the second gas supplying unit 123 may supply low-temperature dry air to cool the template.
- FIG. 2 is a flowchart of assistance in explaining a surface treatment method.
- FIGS. 3A , 3 B, 3 C, and 3 D are schematic diagrams of steps of the template surface treatment.
- Step S 101 The template 101 having an uneven pattern surface is set to the loader unit 140 of the surface treatment apparatus 100 . Since an atmosphere which has passed through the filters 160 and 170 is supplied into the surface treatment apparatus 100 , amines are controlled to be in a several ppb level and there are very few particles.
- the conveying arm 131 conveys the template 101 from the loader unit 140 into the first chamber 110 .
- the conveyed template 101 is held by the holding unit 111 .
- Step S 102 The first gas supplying unit 112 supplies the mixed gas of H 2 O/O 2 /N 2 into the first chamber 110 . Thereby, the interior of the first chamber 110 is brought into a high-humidity atmosphere.
- Step S 103 The light emitting unit 113 emits the light having a wavelength of 172 nm onto the surface of the template 101 .
- the surface of the template 101 acts on oxygen in the atmosphere to generate ozone, and then, oxygen radicals having strong oxidizability are formed.
- organic substances are removed.
- siloxane bond (Si—O—Si) on the surface of the quartz template 101 cleaned by light emission is hydroxylated by the OH radicals, and as shown in FIG. 3B , silanol groups (Si—OH) are distributed uniformly and densely. At this time, moisture is excessively absorbed onto the silanol groups.
- Step S 104 The light emitting unit 113 stops light emission, and the first gas supplying unit 112 stops the supply of the mixed gas. Then, the template 101 is moved into the second chamber 120 by the conveying arm 131 . The template 101 moved into the second chamber 120 is held by the holding unit 121 .
- Step S 105 The heating unit 122 heats the template 101 at a temperature of 180° C. Thereby, moisture excessively absorbed onto the OH sites on the surface of the template 101 is removed.
- the heating is performed within the range between 100 and 200° C., in which the excessively absorbed water is removed and the OH radicals distributed on the surface of the template 101 are not desorbed.
- a suction and pressure-reduction mechanism may be provided in the second chamber 120 to reduce the pressure in the second chamber 120 with heating.
- the interior of the second chamber 120 is reduced to 10 ⁇ 5 Pa or less.
- Step S 106 The heating unit 122 continues heating. Moisture in the atmosphere in the second chamber 120 is measured by a sensor, not shown, and after the moisture is reduced to a ppb order, the second gas supplying unit 123 supplies the mixed gas of the silane coupling agent and the dry N 2 into the second chamber 120 . As shown in FIG. 3C , the hydrolyzable groups (e.g., methoxy groups) of the silane coupling agent has a hydrolyzable reaction with a very small amount of moisture remaining in the atmosphere to form silanol groups, followed by the dehydration condensation reaction with the silanol groups on the surface of the quartz template 101 to cause coupling reaction.
- the hydrolyzable groups e.g., methoxy groups
- Step S 107 The heating unit 122 stops heating, and the cooling unit cools the template 101 .
- Step S 108 The template is unloaded from the unloader unit 150 .
- the surface of the template 101 hydroxylated in step S 103 easily absorbs ammonia and amines.
- ammonia, amines, moisture, and alcohol are by-products resulting from the coupling reaction, these substances are present in the reaction site to prevent the coupling reaction.
- the chemical filter 170 provides a processing environment in which the amine concentration is reduced to a very low level.
- reaction products unnecessary for the coupling reaction can be removed. Thereby, the coupling reaction can be effectively advanced.
- the coupling reaction when excessive moisture is present in the atmosphere at the time of the coupling reaction, the coupling reaction is caused in the atmosphere, resulting in coupling agent aggregation, thereby causing particles. For this reason, the reactive species are reduced, and the by-products such as amines and particles caused in the reaction adhere onto the surface of the template 101 as the reaction site to prevent the coupling reaction.
- the interior of the second chamber 120 since dry nitrogen is supplied and heating is performed, the interior of the second chamber 120 can be held at very low humidity. Further, the concentration of the by-products such as amines caused during the coupling reaction may be reduced to low concentration.
- the reaction atmosphere is circulated between the second chamber 120 and the second gas supplying unit 123 during the coupling reaction to remove the reaction by-products.
- the chemical filter is provided in the circulation path.
- the coupling reaction since heating is performed while the coupling reaction is performed, the by-product amines caused by the coupling reaction can be immediately removed from the reaction site, the coupling reaction can be performed uniformly and densely on the surface of the template 100 , and as shown in FIG. 3D , a uniform and strong release layer 10 can be formed on the surface of the template 101 .
- the template 101 formed with the release layer by such processing is used for pattern forming by the following imprint method.
- an imprint material is applied onto a substrate to be processed.
- the template 101 subjected to the above surface treatment is brought into contact with the imprint material.
- the imprint material is cured.
- the template is released from the imprint material to form a pattern on the substrate to be processed.
- the defect density of the pattern formed using the template 101 subjected to the surface treatment according to the present embodiment is reduced to 0.1 piece/cm 2 or less. In addition, the life of the template 101 can be longer.
- the template 101 subjected to the surface treatment according to the present embodiment is used so that the imprint quality can be improved. Accordingly, the productivity of storage devices and LEDs manufactured using the imprint can be enhanced.
- the vaporized silane coupling agent is used when the coupling reaction is caused (in Step S 106 ).
- the surface of the template 101 may be spin coated, spray coated, or roll coated with a liquid coupling agent (a liquid in which a coupling agent is dissolved into a solvent) .
- a liquid coupling agent a liquid in which a coupling agent is dissolved into a solvent
- a film of the silane coupling agent may be formed on the surface of the template 101 .
- the silane coupling agent into which a catalyst such as a silanol catalyst is mixed may be supplied onto the surface of the template 101 .
- the silane coupling agent When the silane coupling agent is supplied in liquid form, the silane coupling agent can be circulated between the second chamber 120 and a silane coupling agent supplying unit (not shown) during the coupling reaction to remove the reaction by-products.
- a filter which removes the by-products is provided in the circulation path.
- the surface of the template reacts with the OH radicals.
- the light emitting unit 113 emits a light having a wavelength of 252 nm to make the surface of the template 101 hydrophilic.
- ozone may act on the surface of the template 101 .
- the first gas supplying unit 112 supplies the mixed gas of H 2 O/O 2 /N 2 into the first chamber 110 to allow the high-humidity atmosphere to act on the surface of the template 101 . Thereby, water is absorbed onto the surface of the template 101 .
- the template 101 is moved into the second chamber 120 , and is heated at about 180° C. by the heating unit 122 under reduced pressure. Thereby, moisture excessively absorbed onto the surface of the template 101 is removed, and an absorbed water mono-layer on the surface of the template 101 is formed.
- the second gas supplying unit 123 supplies the mixed gas of the silane coupling agent and the dry N 2 to allow the silane coupling agent to act on the absorbed water layer to cause the coupling reaction. Since the excessively absorbed water is removed by heating, the coupling reaction can be effectively advanced.
- the uniform and strong release layer 10 can be formed on the surface of the template 101 .
- FIG. 4 shows the schematic configuration of a template surface treatment apparatus according to a second embodiment of the present invention.
- a surface treatment apparatus 200 further includes chambers 210 to 240 between the loader unit 140 and the first chamber 110 of the surface treatment apparatus 100 according to the first embodiment shown in FIG. 1 .
- the conveying arm 131 moves the template 101 between the chambers. Since the first filter 160 and the second filter 170 are provided in the upper portion of the surface treatment apparatus 200 , the interior of the apparatus is held in an environment in which there are very few particles and amines.
- FIG. 4 the same parts as the first embodiment shown in FIG. 1 are indicated by the same reference numerals and the description for such parts will not be repeated.
- the chamber 210 removes inorganic substance particles, such as metal and Si, which adhere onto the surface of the template 101 .
- FIG. 5 shows a schematic diagram of the chamber 210 .
- the chamber 210 has a pressing roll 211 , reels 212 and 213 , an adhesive sheet 214 , and a conveying stage 215 .
- the adhesive sheet 214 is a sheet in which an acrylic adhesive layer is formed on a polyvinyl chloride (PVC) substrate.
- PVC polyvinyl chloride
- the reel 212 is rotated in the direction for rewinding the roll-like adhesive sheet 214 (in the clockwise direction in the drawing) to rewind the adhesive sheet 214 .
- the reel 213 is rotated in the direction for winding the adhesive sheet 214 (in the clockwise direction in the drawing) to wind the adhesive sheet 214 in roll form.
- the conveying stage 215 conveys the template 101 (in the right-hand direction in the drawing) so as to pass below the pressing roll 211 .
- the pressing roll 211 presses or separates the adhesive sheet 214 onto or from the surface of the template 101 conveyed by the conveying stage 215 . Thereby, inorganic substance particles are removed from the surface of the template 101 .
- FIG. 4 shows a holding unit 216 which holds the template 101 onto the chamber 210 .
- the holding unit 216 may not be necessarily used.
- the chamber 230 shown in FIG. 4 is a chamber which removes water and amine molecules absorbed onto the surface of the template 101 , and has a holding unit 231 , a heating unit 232 , and a suction port 233 .
- the holding unit 231 holds the template 101 from which inorganic substance particles are removed in the chamber 210 .
- the heating unit 232 is, e.g., a heater, and heats the template 101 held by the holding unit 231 .
- the heating unit 232 preferably heats the template 101 at a temperature of about 150° C. to 200° C.
- the suction port 233 is coupled to a suction mechanism, not shown, and the gas in the chamber 230 is discharged via the suction port 233 to reduce the pressure in the chamber.
- absorbed molecules are removed from the surface of the template 101 .
- Organic substances remaining on the surface of the template 101 are removed by emitting a light having the wavelength of 172 nm, as shown in FIG. 6B (which is the same drawing as FIG. 3A ), in the first chamber 110 .
- the interior of the chamber 230 is in the pressure reduction state, and is in an environment (inner pressure) different from that of the chamber 210 and the first chamber 110 whose processes are performed before and after the process in the chamber 230 .
- the chambers (load lock chambers) 220 and 240 constituting load lock chambers are provided between the chambers 210 and 230 and between the chamber 230 and the first chamber 110 , respectively.
- the load lock chamber 220 has a holding unit 221 , a gas supply port 222 , and a suction port 223 .
- the holding unit 221 holds the template 101 subjected to the process in the chamber 210 .
- the suction port 223 is coupled to a suction mechanism, not shown, and the pressure in the chamber can be reduced.
- Nitrogen gas (inert gas) is supplied from a gas supplying unit, not shown, via the gas supply port 222 into the load lock chamber 220 so that the interior of the chamber can be brought into a nitrogen gas atmosphere.
- the load lock chamber 240 has a holding unit 241 , a gas supply port 242 , and a suction port 243 .
- the holding unit 241 holds the template 101 subjected to the process in the chamber 230 .
- the suction port 243 is coupled to a suction mechanism, not shown, and the pressure in the chamber can be reduced.
- Nitrogen gas (inert gas) is supplied from a gas supplying unit, not shown, via the gas supply port 242 into the load lock chamber 240 so that the interior of the chamber can be brought into a nitrogen gas atmosphere.
- the load lock chambers 220 and 240 and the chamber 230 are partitioned by gate valves 252 and 253 , respectively. For instance, when the template 101 is conveyed from the load lock chamber 220 into the chamber 230 , the pressure in the load lock chamber 220 is reduced before opening the gate valve 252 . In addition, for instance, when the template 101 is conveyed from the chamber 230 into the load lock chamber 240 , the pressure in the load lock chamber 240 is reduced before opening the gate valve 253 .
- a partition wall 251 is provided between the chamber 210 and the load lock chamber 220 , and a partition wall 254 is provided between the load lock chamber 240 and the first chamber 110 .
- each of the chamber 210 and the load lock chambers 220 and 240 can have shutters (not shown) which can convey the template 101 with the conveying path 130 , like the first chamber 110 and the second chamber 120 . Further, conveying mechanisms, not shown, may be additionally provided between the load lock chamber 220 and the chamber 230 , and between the chamber 230 and the load lock chamber 240 , respectively.
- the uniform and strong release layer can be formed on the surface of the template.
- the uniform release layer can be formed again followed by once removing the partially defected release layer.
- FIG. 7 shows the schematic configuration of a template surface treatment apparatus according to a third embodiment of the present invention.
- a surface treatment apparatus 300 has a first chamber 310 , a second chamber 320 , a conveying arm 331 which conveys a template along a conveying path 330 , a loader unit 340 which sets the unprocessed template, a storing unit 380 which stores the processed template, and an unloader unit 350 which unloads the template stored in the storing unit 380 .
- Partition walls are provided between the loader unit 340 and the first chamber 310 , between the first chamber 310 and the second chamber 320 , between the second chamber 320 and the storing unit 380 , and between the storing unit 380 and the unloader unit 350 , respectively.
- Openable/closable shutters can be provided on the side surfaces of each of the first chamber 310 , the second chamber 320 , and the storing unit 380 .
- the conveying arm 331 is located below the chamber. However, actually, the conveying arm 331 is provided at substantially the same height as the chamber, and can convey the template into or out of the chamber via the shutters.
- a first filter 360 and a second filter 370 are provided in the upper portion of the surface treatment apparatus 300 .
- the first filter 360 is a HEPA filter which removes particles.
- the second filter 370 is a chemical filter which removes amines such as ammonia. The first filter 360 and the second filter 370 bring the interior of the surface treatment apparatus 300 into an environment in which there are very few particles and amines. For instance, amines are controlled to be in a several ppb level.
- the first chamber 310 is a chamber which removes organic substances such as resist residuals remaining on the surface of the template, and ashes and removes the organic substances by plasma ashing.
- FIG. 8 shows an example of the configuration of the first chamber 310 .
- the second chamber 320 is a chamber which supplies a chemical solution onto the surface of the template and removes inorganic substance particles remaining on the surface of the template.
- coupling reaction is caused in the second chamber 320 to form the release layer on the surface of the template.
- the uniform release layer is formed without drying the surface of the template. Defects such as drying traces (water marks) are caused by drying the surface of the template, and further, imprint defects can be caused. Therefore, the coupling reaction is executed without drying the surface of the template during the cleaning of the template, so that contamination on the surface of the template before the release layer is formed can be prevented, the uniform and strong release layer can be formed, and defects at the time of imprint can be reduced.
- the second chamber 320 has a holding and rotating unit 400 which holds and rotates a template 301 , and a chemical solution supplying unit 410 .
- the holding and rotating unit 400 has a spin cup 401 , a rotational shaft 402 , a spin base 403 , and a chuck pin 404 .
- the rotational shaft 402 is extended in the substantially vertical direction, and the disc-like spin base 403 is attached to the upper end of the rotational shaft 402 .
- the rotational shaft 402 and the spin base 403 can be rotated by a motor, which is not shown.
- the chuck pin 404 is provided at the circumferential edge of the spin base 403 .
- the chuck pin 404 grips the template 301 , so that the holding and rotating unit 400 can substantially horizontally hold and rotate the template 301 .
- the chemical solution When the chemical solution is supplied from the chemical solution supplying unit 410 to near the rotation center on the surface of the template 301 , the chemical solution spreads in the outer circumferential direction of the template 301 .
- the holding and rotating unit 400 can perform spin drying of the template 301 .
- the excessive chemical solution splashed in the outer circumferential direction of the template 301 is trapped by the spin cup 401 , and is discharged via a solution discharge pipe 405 .
- the chemical solution supplying unit 410 can supply a cleaning solution, alcohol, thinner, and a silane coupling agent onto the surface of the template 301 .
- the cleaning solution is supplied via a supply line 411 , and is discharged from a nozzle 412 .
- As the cleaning solution for instance, sulfuric acid, hydrofluoric acid, hydrochloric acid, and hydrogen peroxide can be used.
- the alcohol is supplied via a supply line 413 , and is discharged from a nozzle 414 .
- the alcohol for instance, isopropyl alcohol and ethanol can be used.
- Thinner is supplied via a supply line 415 , and is discharged from a nozzle 416 .
- the thinner for instance, hexane, PGME, PGMEA, and y-butyrolactone can be used.
- the silane coupling agent is supplied via a supply line 417 , and is discharged from a nozzle 418 .
- the storing unit 380 stores the template 301 in which the release layer is formed in the second chamber 320 .
- a HEPA filter 381 which removes particles and a chemical filter 382 which removes amines such as ammonia are provided in the upper portion of the storing unit 380 .
- the interior of the storing unit 380 is in an environment in which there are fewer particles and amines than the first chamber 310 and the second chamber 320 , and the amine concentration and the number of particles are controlled to be in a predetermined value or less.
- a nitrogen gas ininert gas
- the template 301 is stored in such storing unit 380 until the time immediately before the resist pattern forming, so that the release layer can be prevented from being contaminated during the storing.
- the template 301 is formed with, for example, an uneven pattern by plasma etching on a totally transparent quartz substrate used for a typical photomask.
- Step S 301 The template 301 having an uneven pattern surface is set to the loader unit 340 of the surface treatment apparatus 300 . Since an atmosphere which has passed through the filters 360 and 370 is supplied into the surface treatment apparatus 300 , amines are controlled to be in a several ppb level and there are very few particles.
- the conveying arm 331 conveys the template 301 from the loader unit 340 into the first chamber 310 .
- Step S 302 Plasma ashing is performed in the first chamber 310 to remove organic substances such as resist residuals remaining on the surface of the template 301 .
- Step S 303 The conveying arm 331 conveys the template 301 from the first chamber 310 into the second chamber 320 .
- the conveyed template 301 is gripped by the chuck pin 404 shown in FIG. 9 .
- Step S 304 The template 301 is rotated at a predetermined rotational speed to supply the cleaning solution from the chemical solution supplying unit 410 to near the rotation center of the surface of the template 301 .
- the cleaning solution spreads over the entire region on the surface of the template 301 due to centrifugal force generated by the rotation of the template 301 to perform the cleaning process of the template 301 . Thereby, inorganic substance particles remaining on the surface of the template 301 are removed.
- Step S 305 The alcohol is supplied from the chemical solution supplying unit 410 to near the rotation center of the surface of the template 301 .
- the alcohol is spread over the entire region on the surface of the template 301 due to centrifugal force generated by the rotation of the template 301 . Thereby, the cleaning solution remaining on the surface of the template 301 is substituted with the alcohol.
- Step S 306 The thinner is supplied from the chemical solution supplying unit 410 to near the rotation center of the surface of the template 301 .
- the thinner is spread over the entire region on the surface of the template 301 due to centrifugal force generated by the rotation of the template 301 . Thereby, the alcohol remaining on the surface of the template 301 is substituted with the thinner.
- Step S 307 The silane coupling agent is supplied from the chemical solution supplying unit 410 to near the rotation center of the surface of the template 301 .
- the silane coupling agent is spread over the entire region on the surface of the template 301 due to centrifugal force generated by the rotation of the template 301 .
- the hydrolyzable groups (e.g., methoxy groups) of the silane coupling agent have a hydrolyzable reaction with a very small amount of moisture remaining in the atmosphere or on the template 301 to form silanol groups, followed by the dehydration condensation reaction with the silanol groups on the surface of the template 301 to cause coupling reaction. Thereby, the uniform release layer is formed on the surface of the template 301 .
- Step S 308 The thinner is supplied from the chemical solution supplying unit 410 to near the rotation center of the surface of the template 301 .
- the thinner is spread over the entire region on the surface of the template 301 due to centrifugal force generated by the rotation of the template 301 . Thereby, the silane coupling agent remaining on the surface of the template 301 is substituted with the thinner.
- Step S 309 The drying process of the template 301 is performed.
- the spin dry process which shakes off the thinner remaining on the surface of the template 301 for drying by increasing the rotational speed of the template 301 to the predetermined spin dry rotational speed, is performed.
- Step S 310 The template 301 is conveyed out of the second chamber 320 , and is conveyed into the storing unit 380 .
- the template 301 is stored in the storing unit 380 until the time immediately before the resist pattern forming.
- the template 301 in the second chamber 320 , is not dried and is wet during the period between the wet cleaning process in step S 304 and the forming of the release layer in step S 307 .
- the template 301 is not exposed into the atmosphere, and organic substances can be prevented from adhering onto the surface of the template 301 , so that the uniform and strong release layer can be formed.
- the template 301 subjected to the surface treatment according to this embodiment is used so that the imprint quality can be improved, and the productivity of storage devices and LEDs manufactured using the imprint can be enhanced.
- organic substances on the template 301 are removed by plasma ashing.
- the organic substances may be decomposed and removed by emitting an ultraviolet light, or the organic substances may be oxidatively decomposed and removed using an oxidative liquid such as fuming nitric acid, ozone water, or high-concentration ozone water.
- the organic substances may be removed using an organic solvent.
- the storing unit 380 of the surface treatment apparatus 300 may be provided in the surface treatment apparatuses 100 and 200 .
Abstract
According to an embodiment, a template surface treatment method includes hydroxylating the surface of a template having an uneven pattern surface or absorbing water onto the surface to distribute OH radicals on the surface, and coupling a coupling agent onto the template surface on which the OH radicals are distributed. These processes are performed in an environment in which amines are controlled to be in a predetermined concentration or less.
Description
- This application is based upon and claims the benefit of priority from the prior Japanese Patent Applications No. 2010-81019, filed on Mar. 31, 2010, and No. 2010-280514, filed on Dec. 16, 2010, the entire contents of which are incorporated herein by reference.
- Embodiments described herein relate generally to a template surface treatment method, a template surface treatment apparatus, and a pattern forming method.
- In recent years, as a fine pattern forming method, attention has been focused on a nanoimprinting method. In the nanoimprinting method, an imprint template formed with an uneven pattern is brought into contact with a resist coated onto a substrate to be processed to cure the resist, and the template is then released from the resist to form a resist pattern.
- To easily release the template from the resist, a method for forming a release layer on the surface of the template is proposed (for instance, see T. Zhang et al, “Vapor Deposited Release Layers for Nanoimprint Lithography”, Proc. Of SPIE, Vol. 6151, 117, 2006). The release layer is conventionally formed, e.g., by immersing the template into a mold release agent solution, maintaining the solution adhering onto the surface at high temperature and at high humidity, and performing rinsing and drying.
- However, in such processing, amines, moisture, organic substances, particles, and the like present on the surface of the unprocessed template, in the processing atmosphere, and in the mold release agent solution adhere onto the surface of the template. Accordingly, the uniformity of the formed release layer is deteriorated. When the template having the release layer with such deteriorated uniformity is used to form the resist pattern, defects are caused in the resist pattern.
-
FIG. 1 is a schematic block diagram of a template surface treatment apparatus according to a first embodiment of the present invention; -
FIG. 2 is a flowchart of assistance in explaining a template surface treatment method according to the first embodiment; -
FIGS. 3A , 3B, 3C, and 3D are schematic diagrams of steps of template surface treatment according to the first embodiment; -
FIG. 4 is a schematic block diagram of a template surface treatment apparatus according to a second embodiment of the present invention; -
FIG. 5 is a schematic diagram of particle removal; -
FIGS. 6A and 6B are schematic diagrams of steps of template surface treatment according to the second embodiment; -
FIG. 7 is a schematic block diagram of a template surface treatment apparatus according to a third embodiment of the present invention; -
FIG. 8 is a diagram showing an example of the configuration of a first chamber of the surface treatment apparatus according to the third embodiment; -
FIG. 9 is a diagram showing an example of the configuration of a second chamber of the surface treatment apparatus according to the third embodiment; -
FIG. 10 is a diagram showing an example of the configuration of a storing unit of the surface treatment apparatus according to the third embodiment; and -
FIG. 11 is a flowchart of assistance in explaining a template surface treatment method according to the third embodiment. - According to an embodiment, a template surface treatment method includes hydroxylating the surface of a template having an uneven pattern surface or absorbing water onto the surface to distribute OH radicals on the surface, and coupling a coupling agent onto the template surface on which the OH radicals are distributed. These processes are performed in an environment in which amines are controlled to be in a predetermined concentration or less. Hereinafter, embodiments of the present invention will be described with reference to the drawings.
-
FIG. 1 shows the schematic configuration of a template surface treatment apparatus according to a first embodiment of the present invention. Asurface treatment apparatus 100 has afirst chamber 110, asecond chamber 120, aconveying arm 131 which conveys a template along aconveying path 130, aloader unit 140 which sets the unprocessed template, and anunloader unit 150 which unloads the processed template. Partition walls are provided between theloader unit 140 and thefirst chamber 110, between thefirst chamber 110 and thesecond chamber 120, and between thesecond chamber 120 and theunloader unit 150, respectively. - Openable/closable shutters (not shown) can be provided on the side surfaces of each of the
first chamber 110 and thesecond chamber 120. InFIG. 1 , for convenience, theconveying arm 131 is located below the chamber. However, actually, theconveying arm 131 is provided at substantially the same height as the chamber, and can convey the template into the chamber or can convey the template out of the chamber via the shutters. - In addition, a
first filter 160 and asecond filter 170 are provided in the upper portion of thesurface treatment apparatus 100. Thefirst filter 160 is a HEPA filter which removes particles. Thesecond filter 170 is a chemical filter which removes amines such as ammonia. Thefirst filter 160 and thesecond filter 170 bring the interior of thesurface treatment apparatus 100 into an environment in which there are very few particles and amines. For instance, amines are controlled to be in a several ppb level. - The
first chamber 110 is a chamber which reacts OH radicals onto the surface of the template, and has aholding unit 111, a firstgas supplying unit 112, and alight emitting unit 113. - The
holding unit 111 holds atemplate 101 set by theloader unit 140 and conveyed by theconveying arm 131. Thetemplate 101 is, for instance, formed with an uneven pattern by plasma etching on a totally transparent quartz substrate used for a typical photomask. - The first
gas supplying unit 112 supplies the mixed gas of H2O/O2/N2 into thefirst chamber 110. The firstgas supplying unit 112 can adjust the humidity in thefirst chamber 110 by controlling the mixing ratio and the flow rate of the mixed gas. - The
light emitting unit 113 emits a light onto the uneven pattern surface of thetemplate 101. Thelight emitting unit 113 has an Xe excimer lamp as a light source, and emits a light having a wavelength of 172 nm. - The
light emitting unit 113 may emit the light onto the entire surface of thetemplate 101 or may emit the light onto a portion of thetemplate 101. Preferably, thelight emitting unit 113 or theholding unit 111 is provided so as to be drivable in the plane direction or in the vertical direction so that thetemplate 101 is movable relative to thelight emitting unit 113. In addition, the light emission angle with respect to the surface of thetemplate 101 may be adjustable. - The gas interposed between the
light emitting unit 113 and the surface of thetemplate 101 attenuates the light emitted from thelight emitting unit 113. Therefore, the humidity and the oxygen concentration in thefirst chamber 113, the intensity of the light emitted from thelight emitting unit 113, and the distance between thelight emitting unit 113 and the surface of thetemplate 101 are adjusted so that the light emitted from thelight emitting unit 113 can reach the surface of thetemplate 101. - In addition, the
light emitting unit 113 is covered with quartz Qz. Thereby, contamination from thelight emitting unit 113 onto thetemplate 101 can be prevented. - The
second chamber 120 is a chamber which supplies a coupling agent while heating the template, thereby causing coupling reaction, and has aholding unit 121, aheating unit 122, a secondgas supplying unit 123, and a cooling unit (not shown). - The
holding unit 121 holds thetemplate 101 conveyed by the conveyingarm 131 from thefirst chamber 110. - The
heating unit 122 is, e.g., a heater, and heats thetemplate 101 held by theholding unit 121. Theheating unit 122 can adjust the surface temperature of thetemplate 101. - The second
gas supplying unit 123 supplies the mixed gas of a silane coupling agent and N2 into thesecond chamber 120. For instance, the silane coupling agent contains Si and is hydrocarbon or fluorocarbon, with an alkoxy group (RO—) or an NHx (x=1, 2) group at an end. - The cooling unit cools the
template 101. The cooling unit, for instance, holds thetemplate 101 close to a cool plate to cool thetemplate 101. In addition, the secondgas supplying unit 123 may supply low-temperature dry air to cool the template. - Next, a method for performing template surface treatment using such
surface treatment apparatus 100 will be described with reference toFIGS. 1 to 3D .FIG. 2 is a flowchart of assistance in explaining a surface treatment method.FIGS. 3A , 3B, 3C, and 3D are schematic diagrams of steps of the template surface treatment. - (Step S101) The
template 101 having an uneven pattern surface is set to theloader unit 140 of thesurface treatment apparatus 100. Since an atmosphere which has passed through thefilters surface treatment apparatus 100, amines are controlled to be in a several ppb level and there are very few particles. The conveyingarm 131 conveys thetemplate 101 from theloader unit 140 into thefirst chamber 110. The conveyedtemplate 101 is held by the holdingunit 111. - (Step S102) The first
gas supplying unit 112 supplies the mixed gas of H2O/O2/N2 into thefirst chamber 110. Thereby, the interior of thefirst chamber 110 is brought into a high-humidity atmosphere. - (Step S103) The
light emitting unit 113 emits the light having a wavelength of 172 nm onto the surface of thetemplate 101. Thereby, the surface of thetemplate 101 acts on oxygen in the atmosphere to generate ozone, and then, oxygen radicals having strong oxidizability are formed. As a result, as shown inFIG. 3A , organic substances are removed. - In addition, the siloxane bond (Si—O—Si) on the surface of the
quartz template 101 cleaned by light emission is hydroxylated by the OH radicals, and as shown inFIG. 3B , silanol groups (Si—OH) are distributed uniformly and densely. At this time, moisture is excessively absorbed onto the silanol groups. - (Step S104) The
light emitting unit 113 stops light emission, and the firstgas supplying unit 112 stops the supply of the mixed gas. Then, thetemplate 101 is moved into thesecond chamber 120 by the conveyingarm 131. Thetemplate 101 moved into thesecond chamber 120 is held by the holdingunit 121. - (Step S105) The
heating unit 122 heats thetemplate 101 at a temperature of 180° C. Thereby, moisture excessively absorbed onto the OH sites on the surface of thetemplate 101 is removed. Preferably, the heating is performed within the range between 100 and 200° C., in which the excessively absorbed water is removed and the OH radicals distributed on the surface of thetemplate 101 are not desorbed. - A suction and pressure-reduction mechanism may be provided in the
second chamber 120 to reduce the pressure in thesecond chamber 120 with heating. For instance, preferably, the interior of thesecond chamber 120 is reduced to 10−5 Pa or less. - (Step S106) The
heating unit 122 continues heating. Moisture in the atmosphere in thesecond chamber 120 is measured by a sensor, not shown, and after the moisture is reduced to a ppb order, the secondgas supplying unit 123 supplies the mixed gas of the silane coupling agent and the dry N2 into thesecond chamber 120. As shown inFIG. 3C , the hydrolyzable groups (e.g., methoxy groups) of the silane coupling agent has a hydrolyzable reaction with a very small amount of moisture remaining in the atmosphere to form silanol groups, followed by the dehydration condensation reaction with the silanol groups on the surface of thequartz template 101 to cause coupling reaction. - (Step S107) The
heating unit 122 stops heating, and the cooling unit cools thetemplate 101. - (Step S108) The template is unloaded from the
unloader unit 150. - The surface of the
template 101 hydroxylated in step S103 easily absorbs ammonia and amines. In addition, since ammonia, amines, moisture, and alcohol are by-products resulting from the coupling reaction, these substances are present in the reaction site to prevent the coupling reaction. However, in the present embodiment, thechemical filter 170 provides a processing environment in which the amine concentration is reduced to a very low level. In addition, by pressure reduction and heating, reaction products unnecessary for the coupling reaction can be removed. Thereby, the coupling reaction can be effectively advanced. - In addition, when excessive moisture is present in the atmosphere at the time of the coupling reaction, the coupling reaction is caused in the atmosphere, resulting in coupling agent aggregation, thereby causing particles. For this reason, the reactive species are reduced, and the by-products such as amines and particles caused in the reaction adhere onto the surface of the
template 101 as the reaction site to prevent the coupling reaction. However, in the present embodiment, since dry nitrogen is supplied and heating is performed, the interior of thesecond chamber 120 can be held at very low humidity. Further, the concentration of the by-products such as amines caused during the coupling reaction may be reduced to low concentration. For instance, when the silane coupling agent is supplied in vapor form, the reaction atmosphere is circulated between thesecond chamber 120 and the secondgas supplying unit 123 during the coupling reaction to remove the reaction by-products. In this case, desirably, the chemical filter is provided in the circulation path. - Further, in the present embodiment, since heating is performed while the coupling reaction is performed, the by-product amines caused by the coupling reaction can be immediately removed from the reaction site, the coupling reaction can be performed uniformly and densely on the surface of the
template 100, and as shown inFIG. 3D , a uniform andstrong release layer 10 can be formed on the surface of thetemplate 101. - The
template 101 formed with the release layer by such processing is used for pattern forming by the following imprint method. First, an imprint material is applied onto a substrate to be processed. Thereafter, thetemplate 101 subjected to the above surface treatment is brought into contact with the imprint material. In this state, the imprint material is cured. Then, the template is released from the imprint material to form a pattern on the substrate to be processed. The defect density of the pattern formed using thetemplate 101 subjected to the surface treatment according to the present embodiment is reduced to 0.1 piece/cm2 or less. In addition, the life of thetemplate 101 can be longer. - In this way, the
template 101 subjected to the surface treatment according to the present embodiment is used so that the imprint quality can be improved. Accordingly, the productivity of storage devices and LEDs manufactured using the imprint can be enhanced. - In the first embodiment, the vaporized silane coupling agent is used when the coupling reaction is caused (in Step S106). However, the surface of the
template 101 may be spin coated, spray coated, or roll coated with a liquid coupling agent (a liquid in which a coupling agent is dissolved into a solvent) . In addition, using chemical vapor deposition, physical vapor deposition, a crystal growth method, or a vapor deposition method, a film of the silane coupling agent may be formed on the surface of thetemplate 101. Further, the silane coupling agent into which a catalyst such as a silanol catalyst is mixed may be supplied onto the surface of thetemplate 101. When the silane coupling agent is supplied in liquid form, the silane coupling agent can be circulated between thesecond chamber 120 and a silane coupling agent supplying unit (not shown) during the coupling reaction to remove the reaction by-products. In this case, desirably, a filter which removes the by-products is provided in the circulation path. - In the first embodiment, the surface of the template reacts with the OH radicals. However, there is a method in which the surface of the template does not directly react with the OH radicals. First, in the
first chamber 110, thelight emitting unit 113 emits a light having a wavelength of 252 nm to make the surface of thetemplate 101 hydrophilic. In this step, ozone may act on the surface of thetemplate 101. - Subsequently, the first
gas supplying unit 112 supplies the mixed gas of H2O/O2/N2 into thefirst chamber 110 to allow the high-humidity atmosphere to act on the surface of thetemplate 101. Thereby, water is absorbed onto the surface of thetemplate 101. - The
template 101 is moved into thesecond chamber 120, and is heated at about 180° C. by theheating unit 122 under reduced pressure. Thereby, moisture excessively absorbed onto the surface of thetemplate 101 is removed, and an absorbed water mono-layer on the surface of thetemplate 101 is formed. - Then, the second
gas supplying unit 123 supplies the mixed gas of the silane coupling agent and the dry N2 to allow the silane coupling agent to act on the absorbed water layer to cause the coupling reaction. Since the excessively absorbed water is removed by heating, the coupling reaction can be effectively advanced. - By such method, as in the first embodiment, as shown in
FIG. 3D , the uniform andstrong release layer 10 can be formed on the surface of thetemplate 101. -
FIG. 4 shows the schematic configuration of a template surface treatment apparatus according to a second embodiment of the present invention. A surface treatment apparatus 200 further includeschambers 210 to 240 between theloader unit 140 and thefirst chamber 110 of thesurface treatment apparatus 100 according to the first embodiment shown inFIG. 1 . - The conveying
arm 131 moves thetemplate 101 between the chambers. Since thefirst filter 160 and thesecond filter 170 are provided in the upper portion of the surface treatment apparatus 200, the interior of the apparatus is held in an environment in which there are very few particles and amines. - In
FIG. 4 , the same parts as the first embodiment shown inFIG. 1 are indicated by the same reference numerals and the description for such parts will not be repeated. - The
chamber 210 removes inorganic substance particles, such as metal and Si, which adhere onto the surface of thetemplate 101.FIG. 5 shows a schematic diagram of thechamber 210. Thechamber 210 has apressing roll 211,reels adhesive sheet 214, and a conveyingstage 215. - The
adhesive sheet 214 is a sheet in which an acrylic adhesive layer is formed on a polyvinyl chloride (PVC) substrate. - The
reel 212 is rotated in the direction for rewinding the roll-like adhesive sheet 214 (in the clockwise direction in the drawing) to rewind theadhesive sheet 214. - The
reel 213 is rotated in the direction for winding the adhesive sheet 214 (in the clockwise direction in the drawing) to wind theadhesive sheet 214 in roll form. - The conveying
stage 215 conveys the template 101 (in the right-hand direction in the drawing) so as to pass below thepressing roll 211. - While being rotated in the direction for feeding the adhesive sheet 214 (in the counterclockwise direction in the drawing), the
pressing roll 211 presses or separates theadhesive sheet 214 onto or from the surface of thetemplate 101 conveyed by the conveyingstage 215. Thereby, inorganic substance particles are removed from the surface of thetemplate 101. -
FIG. 4 shows a holdingunit 216 which holds thetemplate 101 onto thechamber 210. However, when the conveyingstage 215 directly conveys thetemplate 101 into and out of thechamber 210 between the conveyingstage 215 and the conveyingarm 131, the holdingunit 216 may not be necessarily used. - The
chamber 230 shown inFIG. 4 is a chamber which removes water and amine molecules absorbed onto the surface of thetemplate 101, and has a holdingunit 231, aheating unit 232, and asuction port 233. - The holding
unit 231 holds thetemplate 101 from which inorganic substance particles are removed in thechamber 210. - The
heating unit 232 is, e.g., a heater, and heats thetemplate 101 held by the holdingunit 231. Theheating unit 232 preferably heats thetemplate 101 at a temperature of about 150° C. to 200° C. - The
suction port 233 is coupled to a suction mechanism, not shown, and the gas in thechamber 230 is discharged via thesuction port 233 to reduce the pressure in the chamber. - By heating and pressure reduction, as shown in
FIG. 6A , absorbed molecules are removed from the surface of thetemplate 101. Organic substances remaining on the surface of thetemplate 101 are removed by emitting a light having the wavelength of 172 nm, as shown inFIG. 6B (which is the same drawing asFIG. 3A ), in thefirst chamber 110. - The interior of the
chamber 230 is in the pressure reduction state, and is in an environment (inner pressure) different from that of thechamber 210 and thefirst chamber 110 whose processes are performed before and after the process in thechamber 230. For this reason, the chambers (load lock chambers) 220 and 240 constituting load lock chambers are provided between thechambers chamber 230 and thefirst chamber 110, respectively. - The
load lock chamber 220 has a holdingunit 221, agas supply port 222, and asuction port 223. The holdingunit 221 holds thetemplate 101 subjected to the process in thechamber 210. Thesuction port 223 is coupled to a suction mechanism, not shown, and the pressure in the chamber can be reduced. Nitrogen gas (inert gas) is supplied from a gas supplying unit, not shown, via thegas supply port 222 into theload lock chamber 220 so that the interior of the chamber can be brought into a nitrogen gas atmosphere. - The
load lock chamber 240 has a holdingunit 241, agas supply port 242, and asuction port 243. The holdingunit 241 holds thetemplate 101 subjected to the process in thechamber 230. Thesuction port 243 is coupled to a suction mechanism, not shown, and the pressure in the chamber can be reduced. Nitrogen gas (inert gas) is supplied from a gas supplying unit, not shown, via thegas supply port 242 into theload lock chamber 240 so that the interior of the chamber can be brought into a nitrogen gas atmosphere. - The
load lock chambers chamber 230 are partitioned bygate valves template 101 is conveyed from theload lock chamber 220 into thechamber 230, the pressure in theload lock chamber 220 is reduced before opening thegate valve 252. In addition, for instance, when thetemplate 101 is conveyed from thechamber 230 into theload lock chamber 240, the pressure in theload lock chamber 240 is reduced before opening thegate valve 253. - A
partition wall 251 is provided between thechamber 210 and theload lock chamber 220, and apartition wall 254 is provided between theload lock chamber 240 and thefirst chamber 110. - The side surfaces of each of the
chamber 210 and theload lock chambers template 101 with the conveyingpath 130, like thefirst chamber 110 and thesecond chamber 120. Further, conveying mechanisms, not shown, may be additionally provided between theload lock chamber 220 and thechamber 230, and between thechamber 230 and theload lock chamber 240, respectively. - Since such surface treatment apparatus 200 removes inorganic substance particles and absorbed molecules on the surface of the template before the template surface treatment according to the first embodiment is performed, the uniform and strong release layer can be formed on the surface of the template. In addition, since the surface of the template is cleaned in the
chambers -
FIG. 7 shows the schematic configuration of a template surface treatment apparatus according to a third embodiment of the present invention. Asurface treatment apparatus 300 has afirst chamber 310, asecond chamber 320, a conveyingarm 331 which conveys a template along a conveyingpath 330, aloader unit 340 which sets the unprocessed template, astoring unit 380 which stores the processed template, and anunloader unit 350 which unloads the template stored in thestoring unit 380. - Partition walls are provided between the
loader unit 340 and thefirst chamber 310, between thefirst chamber 310 and thesecond chamber 320, between thesecond chamber 320 and thestoring unit 380, and between the storingunit 380 and theunloader unit 350, respectively. - Openable/closable shutters (not shown) can be provided on the side surfaces of each of the
first chamber 310, thesecond chamber 320, and thestoring unit 380. InFIG. 7 , for convenience, the conveyingarm 331 is located below the chamber. However, actually, the conveyingarm 331 is provided at substantially the same height as the chamber, and can convey the template into or out of the chamber via the shutters. - In addition, a
first filter 360 and asecond filter 370 are provided in the upper portion of thesurface treatment apparatus 300. Thefirst filter 360 is a HEPA filter which removes particles. Thesecond filter 370 is a chemical filter which removes amines such as ammonia. Thefirst filter 360 and thesecond filter 370 bring the interior of thesurface treatment apparatus 300 into an environment in which there are very few particles and amines. For instance, amines are controlled to be in a several ppb level. - The
first chamber 310 is a chamber which removes organic substances such as resist residuals remaining on the surface of the template, and ashes and removes the organic substances by plasma ashing.FIG. 8 shows an example of the configuration of thefirst chamber 310. - The
second chamber 320 is a chamber which supplies a chemical solution onto the surface of the template and removes inorganic substance particles remaining on the surface of the template. In addition, coupling reaction is caused in thesecond chamber 320 to form the release layer on the surface of the template. In thesecond chamber 320, the uniform release layer is formed without drying the surface of the template. Defects such as drying traces (water marks) are caused by drying the surface of the template, and further, imprint defects can be caused. Therefore, the coupling reaction is executed without drying the surface of the template during the cleaning of the template, so that contamination on the surface of the template before the release layer is formed can be prevented, the uniform and strong release layer can be formed, and defects at the time of imprint can be reduced. - Specifically, as shown in
FIG. 9 , thesecond chamber 320 has a holding androtating unit 400 which holds and rotates atemplate 301, and a chemicalsolution supplying unit 410. - The holding and
rotating unit 400 has aspin cup 401, arotational shaft 402, aspin base 403, and achuck pin 404. Therotational shaft 402 is extended in the substantially vertical direction, and the disc-like spin base 403 is attached to the upper end of therotational shaft 402. Therotational shaft 402 and thespin base 403 can be rotated by a motor, which is not shown. - The
chuck pin 404 is provided at the circumferential edge of thespin base 403. Thechuck pin 404 grips thetemplate 301, so that the holding androtating unit 400 can substantially horizontally hold and rotate thetemplate 301. - When the chemical solution is supplied from the chemical
solution supplying unit 410 to near the rotation center on the surface of thetemplate 301, the chemical solution spreads in the outer circumferential direction of thetemplate 301. In addition, the holding androtating unit 400 can perform spin drying of thetemplate 301. The excessive chemical solution splashed in the outer circumferential direction of thetemplate 301 is trapped by thespin cup 401, and is discharged via asolution discharge pipe 405. - The chemical
solution supplying unit 410 can supply a cleaning solution, alcohol, thinner, and a silane coupling agent onto the surface of thetemplate 301. The cleaning solution is supplied via asupply line 411, and is discharged from anozzle 412. As the cleaning solution, for instance, sulfuric acid, hydrofluoric acid, hydrochloric acid, and hydrogen peroxide can be used. - Likewise, the alcohol is supplied via a
supply line 413, and is discharged from anozzle 414. As the alcohol, for instance, isopropyl alcohol and ethanol can be used. - Thinner is supplied via a
supply line 415, and is discharged from anozzle 416. As the thinner, for instance, hexane, PGME, PGMEA, and y-butyrolactone can be used. - The silane coupling agent is supplied via a
supply line 417, and is discharged from anozzle 418. For instance, the silane coupling agent contains Si and is hydrocarbon or fluorocarbon, with an alkoxy group (RO—) or an NHx (x=1, 2) group at an end. - Next, the storing
unit 380 will be described with reference toFIG. 10 . The storingunit 380 stores thetemplate 301 in which the release layer is formed in thesecond chamber 320. - As shown in
FIG. 10 , aHEPA filter 381 which removes particles and achemical filter 382 which removes amines such as ammonia are provided in the upper portion of thestoring unit 380. For this reason, the interior of thestoring unit 380 is in an environment in which there are fewer particles and amines than thefirst chamber 310 and thesecond chamber 320, and the amine concentration and the number of particles are controlled to be in a predetermined value or less. In addition, a nitrogen gas (inert gas) is supplied into thestoring unit 380 so that the interior of thestoring unit 380 is brought into a nitrogen gas atmosphere. - The
template 301 is stored insuch storing unit 380 until the time immediately before the resist pattern forming, so that the release layer can be prevented from being contaminated during the storing. - Next, a method for performing the surface treatment of the
template 301 using suchsurface treatment apparatus 300 will be described with reference to the flowchart shown inFIG. 11 . Here, thetemplate 301 is formed with, for example, an uneven pattern by plasma etching on a totally transparent quartz substrate used for a typical photomask. - (Step S301) The
template 301 having an uneven pattern surface is set to theloader unit 340 of thesurface treatment apparatus 300. Since an atmosphere which has passed through thefilters surface treatment apparatus 300, amines are controlled to be in a several ppb level and there are very few particles. The conveyingarm 331 conveys thetemplate 301 from theloader unit 340 into thefirst chamber 310. - (Step S302) Plasma ashing is performed in the
first chamber 310 to remove organic substances such as resist residuals remaining on the surface of thetemplate 301. - (Step S303) The conveying
arm 331 conveys thetemplate 301 from thefirst chamber 310 into thesecond chamber 320. The conveyedtemplate 301 is gripped by thechuck pin 404 shown inFIG. 9 . - (Step S304) The
template 301 is rotated at a predetermined rotational speed to supply the cleaning solution from the chemicalsolution supplying unit 410 to near the rotation center of the surface of thetemplate 301. The cleaning solution spreads over the entire region on the surface of thetemplate 301 due to centrifugal force generated by the rotation of thetemplate 301 to perform the cleaning process of thetemplate 301. Thereby, inorganic substance particles remaining on the surface of thetemplate 301 are removed. - (Step S305) The alcohol is supplied from the chemical
solution supplying unit 410 to near the rotation center of the surface of thetemplate 301. The alcohol is spread over the entire region on the surface of thetemplate 301 due to centrifugal force generated by the rotation of thetemplate 301. Thereby, the cleaning solution remaining on the surface of thetemplate 301 is substituted with the alcohol. - (Step S306) The thinner is supplied from the chemical
solution supplying unit 410 to near the rotation center of the surface of thetemplate 301. The thinner is spread over the entire region on the surface of thetemplate 301 due to centrifugal force generated by the rotation of thetemplate 301. Thereby, the alcohol remaining on the surface of thetemplate 301 is substituted with the thinner. - (Step S307) The silane coupling agent is supplied from the chemical
solution supplying unit 410 to near the rotation center of the surface of thetemplate 301. The silane coupling agent is spread over the entire region on the surface of thetemplate 301 due to centrifugal force generated by the rotation of thetemplate 301. The hydrolyzable groups (e.g., methoxy groups) of the silane coupling agent have a hydrolyzable reaction with a very small amount of moisture remaining in the atmosphere or on thetemplate 301 to form silanol groups, followed by the dehydration condensation reaction with the silanol groups on the surface of thetemplate 301 to cause coupling reaction. Thereby, the uniform release layer is formed on the surface of thetemplate 301. - (Step S308) The thinner is supplied from the chemical
solution supplying unit 410 to near the rotation center of the surface of thetemplate 301. The thinner is spread over the entire region on the surface of thetemplate 301 due to centrifugal force generated by the rotation of thetemplate 301. Thereby, the silane coupling agent remaining on the surface of thetemplate 301 is substituted with the thinner. - (Step S309) The drying process of the
template 301 is performed. For instance, the spin dry process, which shakes off the thinner remaining on the surface of thetemplate 301 for drying by increasing the rotational speed of thetemplate 301 to the predetermined spin dry rotational speed, is performed. - (Step S310) The
template 301 is conveyed out of thesecond chamber 320, and is conveyed into thestoring unit 380. Thetemplate 301 is stored in thestoring unit 380 until the time immediately before the resist pattern forming. - In the present embodiment, in the
second chamber 320, thetemplate 301 is not dried and is wet during the period between the wet cleaning process in step S304 and the forming of the release layer in step S307. Thetemplate 301 is not exposed into the atmosphere, and organic substances can be prevented from adhering onto the surface of thetemplate 301, so that the uniform and strong release layer can be formed. - In addition, the
template 301 subjected to the surface treatment according to this embodiment is used so that the imprint quality can be improved, and the productivity of storage devices and LEDs manufactured using the imprint can be enhanced. - In the third embodiment, organic substances on the
template 301 are removed by plasma ashing. However, the organic substances may be decomposed and removed by emitting an ultraviolet light, or the organic substances may be oxidatively decomposed and removed using an oxidative liquid such as fuming nitric acid, ozone water, or high-concentration ozone water. In addition, the organic substances may be removed using an organic solvent. - Further, the storing
unit 380 of thesurface treatment apparatus 300 may be provided in thesurface treatment apparatuses 100 and 200. - While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (20)
1. A surface treatment method which processes the surface of a template including an uneven pattern surface in an environment in which amines are controlled to be in a predetermined concentration or less, comprising:
hydroxylating the surface of the template or absorbing water onto the surface to distribute OH radicals on the surface; and
coupling a coupling agent onto the surface of the template on which the OH radicals are distributed.
2. The template surface treatment method according to claim 1 , further comprising removing a part of moisture on the surface of the template between the distribution of the OH radicals on the surface and the coupling of the coupling agent onto the surface of the template.
3. The template surface treatment method according to claim 2 , wherein the surface of the template is heated at a temperature between 100° C. and 200° C. to remove a part of the moisture on the surface of the template.
4. The template surface treatment method according to claim 1 , wherein in the coupling of the coupling agent, reaction by-products are removed during coupling reaction.
5. The template surface treatment method according to claim 4 , wherein the coupling agent is supplied in vapor form, and a reaction atmosphere is circulated during the coupling reaction to remove the reaction by-products.
6. The template surface treatment method according to claim 1 , further comprising removing inorganic substance particles and organic substances from the surface before the distribution of the OH radicals on the surface of the template.
7. The template surface treatment method according to claim 6 , wherein organic substances are removed from the surface by plasma ashing.
8. The template surface treatment method according to claim 6 , comprising:
supplying a cleaning solution onto the surface of the template to remove inorganic substance particles;
substituting the cleaning solution on the surface of the template with alcohol;
substituting the alcohol on the surface of the template with thinner;
substituting the thinner on the surface of the template with the coupling agent to couple the coupling agent onto the surface of the template; and
after the coupling of the coupling agent, drying the surface of the template.
9. The template surface treatment method according to claim 1 , further comprising controlling the template so that amines have a predetermined concentration or less and the number of particles has a predetermined value or less after the coupling agent is coupled onto the surface of the template to store the template in a storing unit which is brought into an inert gas atmosphere.
10. The template surface treatment method according to claim 1 , wherein the coupling agent contains silicon and is hydrocarbon or fluorocarbon, with an alkoxy group (RO—) or an NHx (x=1, 2) group at an end.
11. A pattern forming method comprising:
applying an imprint material onto a substrate to be processed;
bringing the pattern surface of a template of which surface is processed by the template surface treatment method according to claim 1 into contact with the imprint material;
curing the imprint material in the state where the template is contacted with the imprint material; and
releasing the template from the imprint material.
12. A template surface treatment apparatus comprising:
a first chamber which has a light emitting unit which emits a light onto a surface of a template having an uneven pattern surface and a first supplying unit which supplies a mixed gas of H2O/O2/N2;
a second chamber which has a heating unit which heats the template and a second supplying unit which supplies a coupling agent onto the surface of the template; and
a filter which removes amines and holds the amine concentration of a gas in the apparatus to a predetermined value or less.
13. The template surface treatment apparatus according to claim 12 , wherein the second supplying unit supplies a mixed gas of nitrogen and a silane coupling agent.
14. The template surface treatment apparatus according to claim 12 , further comprising a third chamber having a removing unit which absorbs and removes inorganic substance particles from the surface of the template.
15. The template surface treatment apparatus according to claim 14 , wherein the removing unit presses or separates an adhesive sheet onto or from the surface of the template by a pressing roll to absorb and remove the inorganic substance particles.
16. A template surface treatment apparatus comprising:
a first chamber which has a removing unit which removes organic substances from a surface of a template having an uneven pattern surface;
a second chamber which has a chemical solution supplying unit which supplies a cleaning solution, alcohol, thinner, and a coupling agent in sequence onto the surface of the template; and
a filter which removes amines and holds the amine concentration of a gas in the apparatus to a predetermined value or less.
17. The template surface treatment apparatus according to claim 16 , wherein the second chamber has a drying process unit which can dry the template.
18. The template surface treatment apparatus according to claim 17 ,
wherein the chemical solution supplying unit supplies the coupling agent onto the surface of the template to supply the thinner,
wherein the drying process unit dries the template whose surface is wet with the thinner by a spin dry process.
19. The template surface treatment apparatus according to claim 16 , wherein the removing unit performs plasma ashing.
20. The template surface treatment apparatus according to claim 16 , further comprising a storing unit which stores the template conveyed out of the second chamber,
wherein the storing unit controls amines to be in a predetermined concentration or less and the number of particles to be a predetermined value or less, and is brought into an inert gas atmosphere.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-81019 | 2010-03-31 | ||
JP2010081019 | 2010-03-31 | ||
JP2010-280514 | 2010-12-16 | ||
JP2010280514A JP5693941B2 (en) | 2010-03-31 | 2010-12-16 | Template surface treatment method and apparatus, and pattern formation method |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110244131A1 true US20110244131A1 (en) | 2011-10-06 |
Family
ID=44697105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/043,911 Abandoned US20110244131A1 (en) | 2010-03-31 | 2011-03-09 | Method and apparatus for template surface treatment, and pattern forming method |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110244131A1 (en) |
JP (1) | JP5693941B2 (en) |
KR (1) | KR101226289B1 (en) |
CN (1) | CN102208335B (en) |
TW (1) | TWI500071B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130072029A1 (en) * | 2011-03-24 | 2013-03-21 | Tokyo Electron Limited | Surface treating method and film depositing method |
US20140305904A1 (en) * | 2012-09-29 | 2014-10-16 | Qingdao Bona Optoelectronics Equipment Co., Ltd. | Large-area nanopatterning apparatus and method |
US10359697B2 (en) | 2015-08-04 | 2019-07-23 | Toshiba Memory Corporation | Imprinting template substrate, method for manufacturing the same, imprinting template substrate manufacturing apparatus, and method for manufacturing semiconductor apparatus |
US10668496B2 (en) | 2015-03-31 | 2020-06-02 | Shibaura Mechatronics Corporation | Imprint template treatment apparatus |
US10773425B2 (en) | 2015-07-14 | 2020-09-15 | Shibaura Mechatronics Corporation | Imprint template manufacturing apparatus and imprint template manufacturing method |
US10828855B2 (en) * | 2016-08-26 | 2020-11-10 | Molecular Imprints, Inc. | Monolithic high refractive index photonic devices |
US11413591B2 (en) | 2017-11-02 | 2022-08-16 | Magic Leap, Inc. | Preparing and dispensing polymer materials and producing polymer articles therefrom |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5898549B2 (en) * | 2012-03-29 | 2016-04-06 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
JP2015149390A (en) * | 2014-02-06 | 2015-08-20 | キヤノン株式会社 | Imprint device, die, and method of manufacturing article |
JP6532419B2 (en) * | 2015-03-31 | 2019-06-19 | 芝浦メカトロニクス株式会社 | Template manufacturing device for imprint |
WO2016159310A1 (en) * | 2015-03-31 | 2016-10-06 | 芝浦メカトロニクス株式会社 | Imprinting template production device |
WO2016159312A1 (en) * | 2015-03-31 | 2016-10-06 | 芝浦メカトロニクス株式会社 | Imprinting template production device |
JP6698489B2 (en) * | 2016-09-26 | 2020-05-27 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
JP2019220647A (en) * | 2018-06-22 | 2019-12-26 | 株式会社アルバック | Surface treatment method, printed wiring board manufacturing method, and surface treatment device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5626820A (en) * | 1988-12-12 | 1997-05-06 | Kinkead; Devon A. | Clean room air filtering |
US5690749A (en) * | 1996-03-18 | 1997-11-25 | Motorola, Inc. | Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material |
US7585686B2 (en) * | 2001-08-31 | 2009-09-08 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100341712C (en) | 2002-06-20 | 2007-10-10 | 奥博杜卡特股份公司 | Mold tool method of manufacturing a mold tool and storage medium formed by use of the mold tool |
KR100877270B1 (en) * | 2004-10-13 | 2009-01-07 | 샌트랄 글래스 컴퍼니 리미티드 | Fluorine-containing polymerizable monomer and polymer compound using same |
KR100815372B1 (en) * | 2005-03-31 | 2008-03-19 | 삼성전기주식회사 | Mold-release treating method of imprint mold for printed circuit board |
KR100815081B1 (en) * | 2006-09-05 | 2008-03-20 | 삼성전기주식회사 | Method for release treatment of stamper |
KR100763349B1 (en) | 2006-09-14 | 2007-10-04 | 삼성전기주식회사 | Method for manufacturing metal stamp |
US20100009290A1 (en) * | 2006-12-03 | 2010-01-14 | Central Glass Co., Ltd. | Photosensitive Polybenzoxazines and Methods of Making the Same |
JP4999069B2 (en) * | 2007-01-23 | 2012-08-15 | 株式会社日立製作所 | Nanoimprint stamper, method for producing nanoimprint stamper, and surface treatment agent for nanoimprint stamper |
TWI432546B (en) * | 2008-02-07 | 2014-04-01 | Sumitomo Bakelite Co | A semiconductor thin film, a semiconductor device manufacturing method, and a semiconductor device |
JP4695679B2 (en) * | 2008-08-21 | 2011-06-08 | 株式会社東芝 | Template cleaning method and pattern forming method |
-
2010
- 2010-12-16 JP JP2010280514A patent/JP5693941B2/en not_active Expired - Fee Related
-
2011
- 2011-02-10 TW TW100104479A patent/TWI500071B/en not_active IP Right Cessation
- 2011-03-03 KR KR1020110018954A patent/KR101226289B1/en not_active IP Right Cessation
- 2011-03-04 CN CN201110052481.7A patent/CN102208335B/en not_active Expired - Fee Related
- 2011-03-09 US US13/043,911 patent/US20110244131A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5626820A (en) * | 1988-12-12 | 1997-05-06 | Kinkead; Devon A. | Clean room air filtering |
US5690749A (en) * | 1996-03-18 | 1997-11-25 | Motorola, Inc. | Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material |
US7585686B2 (en) * | 2001-08-31 | 2009-09-08 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130072029A1 (en) * | 2011-03-24 | 2013-03-21 | Tokyo Electron Limited | Surface treating method and film depositing method |
US8575039B2 (en) * | 2011-03-24 | 2013-11-05 | Tokyo Electron Limited | Surface treating method and film depositing method |
US20140305904A1 (en) * | 2012-09-29 | 2014-10-16 | Qingdao Bona Optoelectronics Equipment Co., Ltd. | Large-area nanopatterning apparatus and method |
US9563119B2 (en) * | 2012-09-29 | 2017-02-07 | Qingdao Bona Optoelectronics Equipment Co., Ltd. | Large-area nanopatterning apparatus and method |
US10668496B2 (en) | 2015-03-31 | 2020-06-02 | Shibaura Mechatronics Corporation | Imprint template treatment apparatus |
US10773425B2 (en) | 2015-07-14 | 2020-09-15 | Shibaura Mechatronics Corporation | Imprint template manufacturing apparatus and imprint template manufacturing method |
US10359697B2 (en) | 2015-08-04 | 2019-07-23 | Toshiba Memory Corporation | Imprinting template substrate, method for manufacturing the same, imprinting template substrate manufacturing apparatus, and method for manufacturing semiconductor apparatus |
US10828855B2 (en) * | 2016-08-26 | 2020-11-10 | Molecular Imprints, Inc. | Monolithic high refractive index photonic devices |
US11413591B2 (en) | 2017-11-02 | 2022-08-16 | Magic Leap, Inc. | Preparing and dispensing polymer materials and producing polymer articles therefrom |
Also Published As
Publication number | Publication date |
---|---|
JP5693941B2 (en) | 2015-04-01 |
KR20110109845A (en) | 2011-10-06 |
JP2011224965A (en) | 2011-11-10 |
KR101226289B1 (en) | 2013-01-24 |
TW201140653A (en) | 2011-11-16 |
TWI500071B (en) | 2015-09-11 |
CN102208335B (en) | 2013-09-18 |
CN102208335A (en) | 2011-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110244131A1 (en) | Method and apparatus for template surface treatment, and pattern forming method | |
US9741559B2 (en) | Film forming method, computer storage medium, and film forming system | |
TWI608871B (en) | Substrate processing method, substrate processing apparatus, substrate processing system, and memory medium | |
KR100320585B1 (en) | A resist processing apparatus | |
JP6277952B2 (en) | Substrate processing method, storage medium, and heating apparatus | |
JP5917459B2 (en) | Ultraviolet irradiation apparatus and substrate processing method | |
US20220308454A1 (en) | Bake strategies to enhance lithographic performance of metal-containing resist | |
TW201202841A (en) | Light processing apparatus and light processing method | |
TWI483829B (en) | Method for reproducing template and reproducing apparatus | |
JP6093446B2 (en) | Process gas generation to clean substrates | |
TW202215570A (en) | Dry backside and bevel edge clean of photoresist | |
WO2011145610A1 (en) | Imprinting system, imprinting method, and computer storage medium | |
KR20220122745A (en) | Integrated dry process for patterning radiation photoresist patterning | |
JP2001077011A (en) | Semiconductor manufacturing device, its cleaning method and light source unit | |
JP6507061B2 (en) | Substrate processing method | |
JP2010182893A (en) | Method and device for processing substrate | |
WO2022259399A1 (en) | Method for producing semiconductor and apparatus for producing semiconductor | |
JP6673432B2 (en) | Substrate processing method, substrate processing apparatus, substrate processing system, and storage medium | |
JP6149139B2 (en) | Film forming method, program, computer storage medium, and film forming system | |
US20230064333A1 (en) | Method of cleaning substrate for blank mask, substrate for blank mask, and blank mask including the same | |
JP2023162949A (en) | Foreign matter removal method, forming method, manufacturing method for an article, foreign matter removal device, and system | |
TW201918583A (en) | Thin film forming method and thin film forming apparatus for forming a thin film which contains indium oxide and is provided with excellent electrical characteristics | |
JP2004235220A (en) | Substrate processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KAWAMURA, YOSHIHISA;KOBAYASHI, KATSUTOSHI;ITO, SHINICHI;AND OTHERS;SIGNING DATES FROM 20110223 TO 20110225;REEL/FRAME:025934/0699 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |