US20110259570A1 - Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material - Google Patents

Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material Download PDF

Info

Publication number
US20110259570A1
US20110259570A1 US13/063,568 US200813063568A US2011259570A1 US 20110259570 A1 US20110259570 A1 US 20110259570A1 US 200813063568 A US200813063568 A US 200813063568A US 2011259570 A1 US2011259570 A1 US 2011259570A1
Authority
US
United States
Prior art keywords
graphite
aluminum
molding
metal complex
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/063,568
Inventor
Nobuyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Material Technologies Co Ltd
Applied Nanotech Inc
Original Assignee
Advanced Material Technologies Co Ltd
Applied Nanotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Material Technologies Co Ltd, Applied Nanotech Inc filed Critical Advanced Material Technologies Co Ltd
Assigned to ADVANCED MATERIAL TECHNOLOGIES CO., LTD., APPLIED NANOTECH, INC. reassignment ADVANCED MATERIAL TECHNOLOGIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUZUKI, NOBUYUKI
Publication of US20110259570A1 publication Critical patent/US20110259570A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C37/00—Cast-iron alloys
    • C22C37/04—Cast-iron alloys containing spheroidal graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Graphite-based metal complex materials are known wherein metal is dispersed in a graphite molding sintered from a molding by unidirectional pressure using a metal complex material, extruded molding, or cold isostatic pressure molding wherein a metal matrix and graphite particles or graphite fibers have been dispersed as a material in a graphite-metal complex incorporating a graphite material.
  • Japanese Patent Application H11-321828, Patent Application 2001135551 Japanese Patent Application H11-321828, Patent Application 2001135551
  • the bend strength is 30-40 Mpa
  • the elastic coefficient thereof is low at 12 Gpa
  • a mechanical strength of 1/10 or less is assumed.
  • the provision of an aluminum extruded material for heat sink is low in cost as it is mass produced, while graphite-metal complexes are comparatively high in cost.
  • FIG. 1 is a diagram of a graphite-metal complex and aluminum heat sink (flat board type).
  • FIG. 2 is a diagram of a graphite-metal complex and aluminum heat sink (column type).
  • FIG. 3 is a diagram of a graphite-metal complex aluminum heat sink (prism type).
  • FIG. 1 of FIG.- 1 is a flat board type metal complex ( 2 ) and aluminum heat sink ( 3 ).
  • FIG. 2 and FIG. 3 are respectively a column type and graphite-metal complex ( 2 ) and aluminum heat sink ( 3 ).
  • the invention relates to a heat radiator composed of a combination of a suitable graphite-iron complex and aluminum extruded material on an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and fails at high temperatures.
  • the purpose of the invention is to take into account the aforementioned problems and provide a heat radiator that, while maintaining the properties of good thermal diffusivity of graphite metal complexes, reinforces the weak mechanical properties that are a drawback thereof, and furthermore, is lower in cost.
  • the inventor reached an invention summarized as follows below that positively achieves the aforementioned purpose, by devising a combination of the material used.
  • a heat radiator wherein aluminum, copper or an alloy thereof is pressure-impregnated by squeeze casting into a molding incorporating a 50-92% combination of short fiber material of chopped graphite fibers and man-made graphite, and the obtained graphite-metal complex is cut and arrayed so that it properly conforms to the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.
  • the molding method of the molding graphite powder of chopped graphite fibers incorporating graphite powder is one of molding by unidirectional pressure, using an extruded molding or cold.
  • the invention enables the utilization of the good heat diffusivity of a graphite-metal complex, with the weakness in mechanical strength of a graphite-metal complex reinforced by bringing it into contact with an aluminum or aluminum alloy metal extruded material.
  • low cost is achieved by preparing everything with a graphite-metal complex.
  • an economically superior heat radiator wherein the heat generated by an LED package, high-load semiconductor, high-load capacitor or integrated circuit board is efficiently diffused by the graphic-metal complex, and the heat is radiated by a heat sink of strong aluminum alloy from fins having a large surface area.
  • the manufacturing method of the graphite-metal complex is pressure-impregnation by squeeze casting.
  • the graphite used during this may be one in which man-made graphite is extruded with tar, pitch or an organic resin, one made by cold isostatic molding or one molded by unidirectional pressure with a die, which is then ultimately heat-treated at 2500° C. or more, and consequentially close to 100% forms a graphite system.
  • chopped graphite fiber may be incorporated.
  • the obtained graphite-metal complex is superior for machining, and can be easily worked into board, column or prism shapes, etc.
  • various shapes of aluminum extruded materials are prepared. These consist of fins and parts that bundle these, and, as described by FIG. 1 below, 1 is a heat radiator, 2 is a graphite-metal complex, 3 is a heat sink of aluminum extruded material, and 2 is a board in contact with 3 .
  • the 2 graphite-metal complex is column-shaped, the outer surface thereof coming into contact with the inner surface of the 3 aluminum extruded material.
  • the 2 graphite-metal complex is prism-shaped, the four-sided surface thereof coming into contact with the inside surface of the 3 aluminum extruded material.
  • connection method of the graphite-metal complex and heat sink may be a shrink-fit method, as the thermal expansion rate of the graphite-metal complex is 7 ⁇ 10 ⁇ 6 1/K, and that of the aluminum is 23 ⁇ 10 ⁇ 6 1/K in FIG. 2 and FIG. 3 , for example.
  • a set screw with silicon grease between the graphite-metal complex and heat sink, or plating and soldering, on both sides, may be used with the embodiment in FIG. 1 .
  • the aluminum heat sink used in the invention is not limited to an extruded material, and a die-cast, casted or forged materials, etc. may be utilized.
  • the substance may be an aluminum alloy, but a JIS A 1000 or JIS A 6000 series alloy is more suitable as it is both workable and high in thermal conductivity.
  • the types of graphite used in the invention are natural graphite and man-made graphite, and commercially-available graphite blocks are acceptable.
  • a 50%-95% volume fraction may be used for the graphite in the graphite-metal complex. If it is 50% or less, the heat diffusivity rate is low, and so is not suitable for the heat radiator in the invention.
  • the metal used in the graphite-metal complex is aluminum, an aluminum alloy, copper or a copper alloy.
  • the aluminum alloy used may be of a JIS wrought material series or a JIS cast metal material series, etc. However, an alloy with a low melting point is preferred.
  • copper alloy a JIS C 1000 series-7000 series wrought copper materials, etc. may be used.
  • a heat radiator obtained as described above achieves a more efficient heat radiator, by using a graphite-metal complex superior in heat diffusivity at the position that makes contact with a heat source, and combining an aluminum heat sink of large heat radiating surface area at the position that makes contact with the graphite-metal complex.
  • the aforementioned heat radiator is capable of functioning as a structure by reinforcing the weak mechanical strength of the graphite-metal complex with an aluminum heat sink.
  • the size of an electrode graphite block remains at 150 mm ⁇ 200 mm ⁇ 250 mm at 700° C. in an argon atmosphere, while a JIS-AC3 A aluminum alloy melts at 700° C. These are introduced into a die for squeeze casting, and casting is completed at a pressure of 60 Mpa.
  • a graphite-metal complex was obtained from the casting, which was then cut into boards 2 mm thick in length and had sides 20 mm in size, and, after 4 W LED had been mounted on top of these, they were brought into contact with the 30 mm ⁇ 25 mm of an aluminum (JIS A 6063 extruded material) heat sink with 10 fins that are 10 mm in length, and when they were energized 333 mA with 12 V and the temperature was measured after one hour, the LED tops were 38° C. and the heat sink fins were 26° C. Furthermore, the room temperature was 22° C.
  • a JIS A 1050 board of the same size was used, in reverse, a heat sink was prepared of the same shape as the aluminum heat sink in Working Example 1 by processing a graphite-metal complex, and when the same test was performed, the LED tops were 98° C. and the heat sink fins were 54° C.
  • a 150 mm ⁇ 200 mm board 3 mm thick was prepared from the graphite-metal complex in the above example, and then screwed onto the 2 mm thickness of the flat board section of an aluminum heat sink with the same 150 mm ⁇ 200 mm size with 30 fins that are 30 mm tall.
  • a 120 W heat discharge integrated circuit board was disposed on a graphite-metal complex board, and when a temperature measurement was taken after two hours, the graphite-metal complex board was 45° C., and the fins of the aluminum heat sink were 35° C.
  • the heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material, etc. in the invention combines those that have superior heat diffusivity and those in which a low-cost aluminum heat sink have a large heat radiating surface area, and therefore is effective in radiating the heat of an LED package, high-load capacitor or an integrated circuit board composed of a combination thereof, and is useful in a wide range of industrial fields.

Abstract

To provide a heat radiator that is useful for an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and falls at high temperatures.
To constitute a heat radiator that is low in cost, superior in mechanical strength, and, furthermore, superior in heat radiating effect, by combining a graphite-metal complex that is good in heat diffusivity and an aluminum heat sink that is large in heat radiating surface area.

Description

    PRIORITY CLAIM AND CROSS REFERENCE TO RELATED APPLICATIONS
  • This application is a 35 U.S.C. 371 national stage application of International Application No. PCT/US2008/88461, filed Dec. 29, 2008, which claims priority from Japanese Patent Application No. 2008/233604, filed Sep. 11, 2008. The contents of both of these applications are incorporated by reference herein in their entirety.
    • BACKGROUND
  • Graphite-based metal complex materials are known wherein metal is dispersed in a graphite molding sintered from a molding by unidirectional pressure using a metal complex material, extruded molding, or cold isostatic pressure molding wherein a metal matrix and graphite particles or graphite fibers have been dispersed as a material in a graphite-metal complex incorporating a graphite material. (Japanese Patent Application H11-321828, Patent Application 2001135551)
  • On one hand it is known that with complexes that incorporate graphite, when the thermal diffusivity of material normally used as heat transfer media such as aluminum, copper or aluminum nitride that have a high thermal diffusivity of 1.5-3 cm2/sec is compared to 0 7-1.0 cm2/sec, the heat spreading performance thereof is superior.
  • On the other hand, with complexes that incorporate graphite, such as complexes with aluminum in which a graphite extruded material has been used, the bend strength is 30-40 Mpa, the elastic coefficient thereof is low at 12 Gpa, and, in comparison to regularly used metals such as aluminum, magnesium, titanium, copper, or iron, etc. a mechanical strength of 1/10 or less is assumed. In addition, the provision of an aluminum extruded material for heat sink is low in cost as it is mass produced, while graphite-metal complexes are comparatively high in cost.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a diagram of a graphite-metal complex and aluminum heat sink (flat board type).
  • FIG. 2 is a diagram of a graphite-metal complex and aluminum heat sink (column type).
  • FIG. 3 is a diagram of a graphite-metal complex aluminum heat sink (prism type).
    •
  • FIG. 1 of FIG.-1 is a flat board type metal complex (2) and aluminum heat sink (3). FIG. 2 and FIG. 3 are respectively a column type and graphite-metal complex (2) and aluminum heat sink (3).
    • DETAILED DESCRIPTION
  • The invention relates to a heat radiator composed of a combination of a suitable graphite-iron complex and aluminum extruded material on an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and fails at high temperatures.
  • The purpose of the invention is to take into account the aforementioned problems and provide a heat radiator that, while maintaining the properties of good thermal diffusivity of graphite metal complexes, reinforces the weak mechanical properties that are a drawback thereof, and furthermore, is lower in cost.
  • The inventor reached an invention summarized as follows below that positively achieves the aforementioned purpose, by devising a combination of the material used.
  • A heat radiator wherein a graphite-metal complex obtained by pressure-impregnating aluminum, copper or an alloy thereof into a graphite molding incorporating a 50-92 volume % of graphite powder by squeeze casting is cut into board shapes or column shapes, etc., which are aligned and arrayed into the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.
  • A heat radiator wherein aluminum, copper or an alloy thereof is pressure-impregnated by squeeze casting into a molding incorporating a 50-92% combination of short fiber material of chopped graphite fibers and man-made graphite, and the obtained graphite-metal complex is cut and arrayed so that it properly conforms to the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.
  • The molding method of the molding graphite powder of chopped graphite fibers incorporating graphite powder is one of molding by unidirectional pressure, using an extruded molding or cold.
  • The invention enables the utilization of the good heat diffusivity of a graphite-metal complex, with the weakness in mechanical strength of a graphite-metal complex reinforced by bringing it into contact with an aluminum or aluminum alloy metal extruded material. In addition, low cost is achieved by preparing everything with a graphite-metal complex.
  • Thus, an economically superior heat radiator is provided wherein the heat generated by an LED package, high-load semiconductor, high-load capacitor or integrated circuit board is efficiently diffused by the graphic-metal complex, and the heat is radiated by a heat sink of strong aluminum alloy from fins having a large surface area.
  • The manufacturing method of the graphite-metal complex is pressure-impregnation by squeeze casting. The graphite used during this may be one in which man-made graphite is extruded with tar, pitch or an organic resin, one made by cold isostatic molding or one molded by unidirectional pressure with a die, which is then ultimately heat-treated at 2500° C. or more, and consequentially close to 100% forms a graphite system.
  • In addition, during this, chopped graphite fiber may be incorporated.
  • As described above, the obtained graphite-metal complex is superior for machining, and can be easily worked into board, column or prism shapes, etc.
  • On one hand, various shapes of aluminum extruded materials are prepared. These consist of fins and parts that bundle these, and, as described by FIG. 1 below, 1 is a heat radiator, 2 is a graphite-metal complex, 3 is a heat sink of aluminum extruded material, and 2 is a board in contact with 3. In FIG. 2, the 2 graphite-metal complex is column-shaped, the outer surface thereof coming into contact with the inner surface of the 3 aluminum extruded material. In FIG. 3, the 2 graphite-metal complex is prism-shaped, the four-sided surface thereof coming into contact with the inside surface of the 3 aluminum extruded material.
  • The connection method of the graphite-metal complex and heat sink may be a shrink-fit method, as the thermal expansion rate of the graphite-metal complex is 7×10−6 1/K, and that of the aluminum is 23×10−6 1/K in FIG. 2 and FIG. 3, for example. A set screw with silicon grease between the graphite-metal complex and heat sink, or plating and soldering, on both sides, may be used with the embodiment in FIG. 1.
  • The aluminum heat sink used in the invention is not limited to an extruded material, and a die-cast, casted or forged materials, etc. may be utilized. Thus, the substance may be an aluminum alloy, but a JIS A 1000 or JIS A 6000 series alloy is more suitable as it is both workable and high in thermal conductivity.
  • The types of graphite used in the invention are natural graphite and man-made graphite, and commercially-available graphite blocks are acceptable.
  • A 50%-95% volume fraction may be used for the graphite in the graphite-metal complex. If it is 50% or less, the heat diffusivity rate is low, and so is not suitable for the heat radiator in the invention.
  • 65%-95% is more preferable.
  • The metal used in the graphite-metal complex is aluminum, an aluminum alloy, copper or a copper alloy. The aluminum alloy used may be of a JIS wrought material series or a JIS cast metal material series, etc. However, an alloy with a low melting point is preferred. As for copper alloy, a JIS C 1000 series-7000 series wrought copper materials, etc. may be used.
  • A heat radiator obtained as described above achieves a more efficient heat radiator, by using a graphite-metal complex superior in heat diffusivity at the position that makes contact with a heat source, and combining an aluminum heat sink of large heat radiating surface area at the position that makes contact with the graphite-metal complex.
  • In addition, the aforementioned heat radiator is capable of functioning as a structure by reinforcing the weak mechanical strength of the graphite-metal complex with an aluminum heat sink.
  • Below, we will describe an example in detail.
  • The size of an electrode graphite block (Tokai Carbon UHP) remains at 150 mm×200 mm×250 mm at 700° C. in an argon atmosphere, while a JIS-AC3 A aluminum alloy melts at 700° C. These are introduced into a die for squeeze casting, and casting is completed at a pressure of 60 Mpa.
  • A graphite-metal complex was obtained from the casting, which was then cut into boards 2 mm thick in length and had sides 20 mm in size, and, after 4 W LED had been mounted on top of these, they were brought into contact with the 30 mm×25 mm of an aluminum (JIS A 6063 extruded material) heat sink with 10 fins that are 10 mm in length, and when they were energized 333 mA with 12 V and the temperature was measured after one hour, the LED tops were 38° C. and the heat sink fins were 26° C. Furthermore, the room temperature was 22° C.
  • Instead of the graphite-metal complex 111 the aforementioned Working Example 1, a JIS A 1050 board of the same size was used, and when the same test was performed, the LED tops were 105° C. and the heat sink fins were 70° C.
  • Instead of the graphite-metal complex in the aforementioned Working Example 1, a JIS A 1050 board of the same size was used, in reverse, a heat sink was prepared of the same shape as the aluminum heat sink in Working Example 1 by processing a graphite-metal complex, and when the same test was performed, the LED tops were 98° C. and the heat sink fins were 54° C.
  • A 150 mm×200 mm board 3 mm thick was prepared from the graphite-metal complex in the above example, and then screwed onto the 2 mm thickness of the flat board section of an aluminum heat sink with the same 150 mm×200 mm size with 30 fins that are 30 mm tall. A 120 W heat discharge integrated circuit board was disposed on a graphite-metal complex board, and when a temperature measurement was taken after two hours, the graphite-metal complex board was 45° C., and the fins of the aluminum heat sink were 35° C.
  • When a temperature measurement was taken under the same conditions of the flat board section of an aluminum heat sink as in the example above with a thickness other than 5 mm, the temperature of the flat board section was 97° C. and the fins were 70° C.
  • The heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material, etc. in the invention combines those that have superior heat diffusivity and those in which a low-cost aluminum heat sink have a large heat radiating surface area, and therefore is effective in radiating the heat of an LED package, high-load capacitor or an integrated circuit board composed of a combination thereof, and is useful in a wide range of industrial fields.

Claims (6)

1. An article of manufacture comprising:
a heat radiator wherein aluminum, copper or an alloy thereof has been pressure-impregnated by squeeze casting into a graphite molding that incorporates a 50-92 volume % graphite powder, and the obtained graphite-metal complex is cut into board shapes and brought into contact with the part of the flat or curved sections of a heat sink composed of an extruded material of aluminum or aluminum alloy.
2. The article of manufacture as recited in claim 1, wherein the graphite used to produce the heat radiator is derived from a molding by unidirectional pressure, using an extruded molding, a cold isostatic pressure molding and a die.
3. An article of manufacture comprising:
a heat radiator wherein aluminum, copper or an alloy thereof has been pressure-impregnated by squeeze casting into a graphite molding that incorporates a 50-92 volume % of combined chopped fibers of graphite and man-made graphite, and the obtained graphite-metal complex is cut into board shapes and brought into contact with the part of the flat or curved sections of a heat sink composed of an extruded material of aluminum or aluminum alloy.
4. The article of manufacture as recited in claim 3, wherein the graphite used to produce the heat radiator is derived from a molding by unidirectional pressure, using an extruded molding, a cold isostatic pressure molding and a die.
5. An article of manufacture comprising:
a heat radiator wherein aluminum, copper or an alloy thereof has been pressure-impregnated by squeeze casting into a graphite molding that incorporates a 50-92 volume % graphite powder, and the obtained graphite-metal complex is cut into column shapes or prism shapes, which are disposed in the middle of a heat sink composed of an extruded material of aluminum or aluminum alloy, wherein fins of the heat sink have been radially arrayed, and the column or prism sides touch the heat sink
6. The article of manufacture as recited in claim 5, wherein the graphite used to produce the heat radiator is derived from a molding by unidirectional pressure, using an extruded molding, a cold isostatic pressure molding and a die.
US13/063,568 2008-09-11 2008-12-29 Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material Abandoned US20110259570A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-233604 2008-09-11
JP2008233604A JP5335339B2 (en) 2008-09-11 2008-09-11 A heat radiator composed of a combination of a graphite-metal composite and an aluminum extruded material.
PCT/US2008/088461 WO2010030307A1 (en) 2008-09-11 2008-12-29 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material

Publications (1)

Publication Number Publication Date
US20110259570A1 true US20110259570A1 (en) 2011-10-27

Family

ID=42005380

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/063,568 Abandoned US20110259570A1 (en) 2008-09-11 2008-12-29 Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material

Country Status (5)

Country Link
US (1) US20110259570A1 (en)
EP (1) EP2324074A4 (en)
JP (1) JP5335339B2 (en)
KR (1) KR20110085978A (en)
WO (1) WO2010030307A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100310447A1 (en) * 2009-06-05 2010-12-09 Applied Nanotech, Inc. Carbon-containing matrix with functionalized pores
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20110147647A1 (en) * 2009-06-05 2011-06-23 Applied Nanotech, Inc. Carbon-containing matrix with additive that is not a metal
US20130285529A1 (en) * 2011-01-19 2013-10-31 Graftech International Holdings Inc. Thermal Solution for LED Bulbs
US10670351B2 (en) 2013-05-15 2020-06-02 Osram Sylvania Inc. Two piece aluminum heat sink

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622465B2 (en) * 2010-07-22 2014-11-12 ローム株式会社 LED bulb and manufacturing method of LED bulb
CN102114495A (en) * 2010-11-25 2011-07-06 深圳市天电光电科技有限公司 Method for manufacturing LED radiator
DE102011081687A1 (en) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Semiconductor device with a heat sink
JP2014047127A (en) 2012-09-04 2014-03-17 Toyo Tanso Kk Metal-carbon composite material, manufacturing method of metal-carbon composite material, and sliding member
JP6164632B2 (en) * 2013-01-11 2017-07-19 株式会社アカネ Method for producing carbon-based metal composite material
KR101301624B1 (en) * 2013-07-05 2013-08-29 (주) 동양에이.케이코리아 Manufacturing method of including carbon aluminium or aluminium alloy extrusion and using included carbon aluminium or aluminium alloy extrusion
CN105916348A (en) * 2016-03-25 2016-08-31 华为技术有限公司 Electronic device middle frame fitting and manufacturing method thereof
CN106531874B (en) * 2016-11-30 2018-10-12 南京劲峰洋光电科技有限公司 A kind of heat sinking insulating composite material and preparation method thereof
CN107022690B (en) * 2017-05-03 2019-03-08 合肥工业大学 A method of aluminium/C-base composte material is prepared by Pressure Infiltration aluminium alloy
JP7165341B2 (en) * 2019-12-17 2022-11-04 Ｕｂｅ株式会社 Graphite-copper composite material, heat sink member using the same, and method for producing graphite-copper composite material
KR102298678B1 (en) * 2020-04-22 2021-09-07 부경대학교 산학협력단 Method for manufacturing cooling pipe for electric vehicle powertrain and cooling pipe manufactured thereby
JP7156586B1 (en) 2022-03-17 2022-10-19 三菱電機株式会社 Semiconductor device manufacturing method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520976A (en) * 1993-06-30 1996-05-28 Simmonds Precision Products Inc. Composite enclosure for electronic hardware
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
US20050238835A1 (en) * 2004-04-24 2005-10-27 Chien-Min Sung Graphite composite thermal sealants and associated methods
US20060091532A1 (en) * 2002-10-11 2006-05-04 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
US7311140B2 (en) * 2000-02-01 2007-12-25 Cool Options, Inc. Heat sink assembly with overmolded carbon matrix

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
EP1187199A2 (en) * 2000-08-28 2002-03-13 Alcan Technology & Management AG Heatsink for Semiconductor Device, Method of Mannufacturing the same, as well as Molding Die therefore
JP2002184922A (en) * 2000-12-12 2002-06-28 Ntt Advanced Technology Corp Composite heat dissipating member
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation
TWI275426B (en) * 2001-12-19 2007-03-11 Showa Denko Kk Extrusion tool, method for manufacturing shaped article with fins, and heat sink
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US6779593B1 (en) * 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
JP4344934B2 (en) * 2003-05-16 2009-10-14 日立金属株式会社 High thermal conductivity / low thermal expansion composite material, heat dissipation substrate and manufacturing method thereof
EP1477467B1 (en) * 2003-05-16 2012-05-23 Hitachi Metals, Ltd. Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate
JP4015146B2 (en) * 2004-10-12 2007-11-28 古河電気工業株式会社 Heat sink with fins and method for manufacturing the same
JP4940883B2 (en) * 2005-10-31 2012-05-30 豊田合成株式会社 Light emitting device
US20080073070A1 (en) * 2006-09-26 2008-03-27 Chin-Hu Kuo Highly efficient heat dissipating composite material and a heat dissipating device made of such material
US20080085403A1 (en) * 2006-10-08 2008-04-10 General Electric Company Heat transfer composite, associated device and method
US20080128067A1 (en) * 2006-10-08 2008-06-05 Momentive Performance Materials Inc. Heat transfer composite, associated device and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520976A (en) * 1993-06-30 1996-05-28 Simmonds Precision Products Inc. Composite enclosure for electronic hardware
US7311140B2 (en) * 2000-02-01 2007-12-25 Cool Options, Inc. Heat sink assembly with overmolded carbon matrix
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
US20060091532A1 (en) * 2002-10-11 2006-05-04 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
US20050238835A1 (en) * 2004-04-24 2005-10-27 Chien-Min Sung Graphite composite thermal sealants and associated methods

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20100310447A1 (en) * 2009-06-05 2010-12-09 Applied Nanotech, Inc. Carbon-containing matrix with functionalized pores
US20110147647A1 (en) * 2009-06-05 2011-06-23 Applied Nanotech, Inc. Carbon-containing matrix with additive that is not a metal
US20130285529A1 (en) * 2011-01-19 2013-10-31 Graftech International Holdings Inc. Thermal Solution for LED Bulbs
US9664368B2 (en) * 2011-01-19 2017-05-30 Advanced Energy Technologies Llc Thermal solution for LED bulbs
US10670351B2 (en) 2013-05-15 2020-06-02 Osram Sylvania Inc. Two piece aluminum heat sink
US10914539B2 (en) 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink

Also Published As

Publication number Publication date
EP2324074A4 (en) 2012-06-13
EP2324074A1 (en) 2011-05-25
JP5335339B2 (en) 2013-11-06
JP2010067842A (en) 2010-03-25
KR20110085978A (en) 2011-07-27
WO2010030307A1 (en) 2010-03-18

Similar Documents

Publication Publication Date Title
US20110259570A1 (en) Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material
EP1477467B1 (en) Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate
JP4344934B2 (en) High thermal conductivity / low thermal expansion composite material, heat dissipation substrate and manufacturing method thereof
TWI305131B (en) Heat dissipation device and composite material with high thermal conductivity
CN101168807B (en) High heat conductivity copper-base composite material and preparation method thereof
CN102612745B (en) Electronic equipment heating panel and manufacture method thereof
JP2006001232A (en) Composite having high heat conduction/low heat expansion and manufacturing process of the same
JP5061018B2 (en) Aluminum-graphite-silicon carbide composite and method for producing the same
CN101107707A (en) Member for semiconductor device and method for manufacture thereof
CN103882349B (en) A kind of preparation method of carbon nano fiber-carbon/carbon-copper composite material
JP5464301B2 (en) Method for manufacturing composite material for heat dissipation substrate
JP2008248324A (en) Diamond particle-dispersed metal matrix composite material, and method for producing the same
CN101177049B (en) Method for preparing Cu-TiNi composite material
US7197804B2 (en) Method of making copper and carbon nanotube thermal conductor
JP2006045596A (en) Composite body with high thermal conductivity and low thermal expansion, and its manufacturing method
JP2003309232A (en) Heat sink
JPH08186204A (en) Heat sink and its manufacture
Fan et al. Pressure infiltrated Cu/diamond composites for LED applications
JP3449683B2 (en) Ceramic circuit board and method of manufacturing the same
JP2005005528A (en) Module for mounting semiconductor element
CN105728695A (en) Preparation method of high-orientation heat conduction material of composite structure
JP2001288526A (en) Heat radiating material and its production method
CN101191050B (en) Nano-level ultra-high heat-conducting titanium-carbon composite material and preparation method thereof
JP2005136369A (en) Substrate
JP2003105470A (en) Al-Si BASED POWDER ALLOY MATERIAL, AND PRODUCTION METHOD THEREFOR

Legal Events

Date Code Title Description
AS Assignment

Owner name: ADVANCED MATERIAL TECHNOLOGIES CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SUZUKI, NOBUYUKI;REEL/FRAME:026461/0407

Effective date: 20110401

Owner name: APPLIED NANOTECH, INC., TEXAS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SUZUKI, NOBUYUKI;REEL/FRAME:026461/0407

Effective date: 20110401

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION