US20110272120A1 - Compact modular liquid cooling systems for electronics - Google Patents
Compact modular liquid cooling systems for electronics Download PDFInfo
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- US20110272120A1 US20110272120A1 US13/041,345 US201113041345A US2011272120A1 US 20110272120 A1 US20110272120 A1 US 20110272120A1 US 201113041345 A US201113041345 A US 201113041345A US 2011272120 A1 US2011272120 A1 US 2011272120A1
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- Prior art keywords
- cold plate
- heat exchanger
- fluid
- cooling
- cooling system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
- F28D1/0426—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids with units having particular arrangement relative to the large body of fluid, e.g. with interleaved units or with adjacent heat exchange units in common air flow or with units extending at an angle to each other or with units arranged around a central element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
- F28D1/0478—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag the conduits having a non-circular cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/0266—Particular core assemblies, e.g. having different orientations or having different geometric features
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/0273—Cores having special shape, e.g. curved, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A cooling system for a microchip or other component is described, including, in one embodiment: (1) a cold plate assembly positioned adjacent (e.g., in contact with) the component to be cooled; (2) at least one heat exchanger; (3) a fan for directing gas adjacent (e.g., through) a portion of the heat exchanger; and (4) a pump for circulating cooling fluid through a closed circuit including the cold plate and heat exchanger. The cold plate may include guide fins that define macrochannels and microchannels that serve as conduits for the cooling fluid. The fins and channels in one embodiment are shaped to substantially match the heat map profile of the chip or component to be cooled. The heat exchanger in one embodiment includes a reservoir in its base which may cooperate with a recess or channel in a support plate to form an additional cooling fluid flow passage.
Description
- This application claims the benefit of U.S. Provisional Application No. 61/310,384, entitled Integrated, Modular, Multi-Scale Liquid Cooling System for Electronics Thermal Management, filed Mar. 4, 2010, which is hereby incorporated herein by reference in its entirety.
- Electronic components including microchips and microprocessors generate large amounts of heat relative to their size during normal operation. As processor speed increases, a related increase in heat energy represents a serious challenge to progress, especially as devices get smaller and components get more densely packed together. The ability to dissipate heat energy is becoming a critical design constraint for all types of electronic devices. Existing systems fail to provide satisfactory cooling performance and represent a serious limiting factor on the overall speed and performance of electronic devices.
- A cooling system for electronic components (or other objects), according to various embodiments, comprises: (1) a cold plate assembly defining at least one cold plate fluid flow passage, the cold plate defining an upper and a lower surface; (2) at least one heat exchanger disposed adjacent the upper surface of the cold plate assembly, each of the at least one heat exchangers comprising at least one heat exchanger fluid flow passage; (3) a fan that is positioned for causing gas to flow adjacent the heat exchanger; (4) one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through the cold plate fluid flow passage and the at least one heat exchanger fluid flow passage; and (5) a pump that is positioned and configured to cause the cooling fluid to flow through the substantially closed circuit. In particular embodiments: (1) the cold plate assembly comprises: (A) a cold plate; and (B) a support plate disposed immediately adjacent the upper surface of the cold plate; (2) a perimeter of the support plate is longer than a perimeter of the cold plate; and (3) the cooling system is adapted to be positioned adjacent an electronic component and to cool the electronic component.
- A cooling system for electronic components (or other items) according to further embodiments comprises: (1) a cold plate assembly defining at least one cold plate fluid flow passage, the cold plate assembly defining an upper and a lower surface; (2) at least one heat exchanger defining at least one heat exchanger fluid flow passage; (3) a fan positioned to cause gas to flow adjacent the heat exchanger; (4) one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through the cold plate fluid flow passage and the at least one heat exchanger fluid flow passage; and (5) a pump that is positioned and configured to cause the cooling fluid to flow through the at least substantially closed circuit. In particular embodiments, (1) the cooling system is adapted to be positioned so that the cold plate assembly engages an electronic component to thereby cool the electronic component; (2) a lower portion of the heat exchanger and a particular portion of the upper surface of the cold plate assembly cooperate to form a fluid reservoir; and (3) the cooling system is adapted so that, as cooling fluid flows through the at least substantially closed liquid circuit: (A) at least a portion of the cooling fluid flows through the fluid reservoir; and (B) as a volume of the cooling fluid flows through the fluid reservoir, the volume of the cooling fluid engages both an interior surface of the lower portion of the heat exchanger and the particular portion of the upper surface of the cold plate assembly.
- A method of cooling an electronic component, according to various embodiments, comprises: (1) providing a cold plate assembly that defines at least one cold plate fluid flow passage and that includes a plurality of fins that are disposed within the fluid flow passage; (2) providing at least one heat exchanger that defines at least one heat exchanger fluid flow passage; (3) providing a fan that is positioned to cause gas to flow adjacent the at least one heat exchanger; (4) providing a pump that is adapted for circulating a cooling fluid first through the at least one heat exchanger fluid flow passage and then through the at least one cold plate fluid flow passage; (5) using the pump to repeatedly recirculate the cooling fluid first through the at least one heat exchanger fluid flow passage and then through the at least one cold plate fluid flow passage; (6) while executing Step (5) above, using the fan to cause gas to flow adjacent the at least one heat exchanger; and (7) using the cold plate assembly to cool the electronic component.
- Having thus described various embodiments in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:
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FIG. 1 is a perspective view of a cooling system according to a particular embodiment. -
FIG. 2 is a plan view of the cooling system ofFIG. 1 . -
FIG. 3 is a perspective view of a cooling system according to a further embodiment. -
FIG. 4 is a perspective view of a cooling system according to another embodiment. -
FIG. 5 is a plan view of the cooling system ofFIG. 4 . -
FIG. 6 is a perspective view of a cooling system according to a further embodiment. -
FIG. 7 is a perspective top view of a cooling system according to another embodiment. -
FIG. 8 is a plan view of a cooling system according to a further embodiment. -
FIG. 9 is a perspective view of a cold plate according to a particular embodiment. -
FIG. 10 is a perspective view of a cold plate according to a further embodiment. -
FIG. 11 is a perspective view of a cold plate according to yet another embodiment. -
FIG. 12 is a perspective view of a cold plate according to a further embodiment. -
FIG. 13A is a perspective top side view of a heat exchanger according to a particular embodiments. -
FIG. 13B is a perspective bottom side view of the heat exchanger ofFIG. 13A . -
FIG. 14 is a top perspective view of the cold plate assembly of that includes the cold plate ofFIG. 12 and multiple heat exchangers of the type shown inFIGS. 13A and 13B . -
FIG. 15A is a perspective view of a cooling system according to a particular embodiment. -
FIG. 15B is a perspective view of a cooling system according to a further embodiment. -
FIG. 15C is a plan view of the cooling system ofFIG. 15B . -
FIG. 15D is a side view of the cooling system ofFIG. 15B . -
FIG. 15E is a perspective bottom view of the cooling system ofFIG. 15B . -
FIG. 16 is a top perspective view of a cold plate assembly according to particular embodiments. -
FIG. 17A is a perspective view of a heat exchanger in a cooling system according a particular embodiment. -
FIG. 17B is a side perspective view of the heat exchanger ofFIG. 17A . -
FIG. 17C is a perspective view of a cooling system that includes the cold plate assembly ofFIG. 16 and the heat exchanger ofFIG. 17A . -
FIG. 17D is a perspective view of the cooling system ofFIG. 17C . - Various embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
- Various embodiments of the invention are directed toward systems and methods of cooling small heat-producing devices, including electronic components such as microchips. Removing or dissipating the heat energy away from electronic components may facilitate better speed and performance and reduce the number and severity of failure events. Although several embodiments are discussed with reference to cooling a microchip, the invention may be applied to any of a variety of other heat-producing devices that may benefit from cooling.
- In one embodiment, a cooling system may include a volume of cooling fluid and a cold plate positioned near a microchip or other object to be cooled, a pump for circulating the cooling fluid through conduits in the system, one or more heat exchangers to cool the fluid, a fan to circulate gas (such as air or an inert gas) adjacent the heat exchangers, and a support plate for supporting the system's various components. Liquid water, with or without additives, or any other suitable cooling fluid, may be used as a cooling fluid within the context of the cooling system. Any of a variety of types of heat exchangers may be used, separately or in combination, in series or parallel, and using any type of flow arrangement. Examples of these components are described below in various implementations.
- As shown in
FIGS. 1 and 2 , acooling system 10 according to a particular embodiment comprises: (1) acold plate 100; (2) asupport plate 200 that is attached adjacent (e.g., to) an upper surface of saidcold plate 100; (3) afan 500A that is attached adjacent (e.g., to) an upper surface of saidsupport plate 200; (4) apump 300 that is attached adjacent (e.g., to) an upper surface of saidsupport plate 200; and (5) a series ofheat exchanges cooling system 10 further includestubing 600 that is adapted to direct the flow of a cooling fluid through a circuit (e.g., a substantially closed circuit) that extends through thecold plate 100, the series of heat exchangers 400A, 400B, 400C, and thepump 300. In particular embodiments, the pump is adapted to cause the cooling fluid to flow, in a recirculating manner, through the closed loop. - As noted above, in particular embodiments, the
cooling system 10 includes acold plate 100 for cooling objects that are positioned adjacent (e.g., so that they are engaging) thecold plate 100. In particular embodiments, thecold plate 100 is in the form of a substantially planar, rectangular parallelogram and defines acold plate inlet 110, acold plate outlet 115, and a substantially fluid-tight cold plate fluid flow passage 120 that extends from the cold platecold plate inlet 110 to thecold plate outlet 115. In particular embodiments, thecold plate 100 includes a lid that is adapted to maintain the substantially fluid-tight nature of the fluid flow passage 120. - In particular embodiments, the cold plate is made of a highly thermally conductive metal, such as copper. However, in other embodiments, the
cold plate 100 may be made of any other suitable material. - An exemplary
cold plate 100 is shown inFIG. 9 . In this embodiment, the fluid flow passage 120 includes anentry portion 130 adjacent thecold plate inlet 110, anexit portion 165 adjacent thecold plate outlet 115, and acentral portion 145 that extends between theentry portion 130 and theexit portion 165. Theentry portion 130 is substantially triangular and includes a set of radially extendingfins 135 that extend outwardly from a position that is adjacent thecold plate inlet 110. Thesefins 135 cooperate to form a plurality ofmacrochannels 175 that expand in width from their inlet end to their outlet end. Thecentral portion 145 is substantially rectangular and includes a set of substantiallyparallel guide fins 150 that are positioned to define a series ofmicrochannels 160 between theguide fins 150. Theexit portion 165 is substantially triangular and includes plurality of radially extendingfins 170 that extend outwardly from a position that is adjacent thecold plate inlet 110. Thesefins 170 cooperate to form a plurality ofmacrochannels 175 that decrease in width from their inlet end to their outlet end. - In the above configuration, the
cold plate 100 is adapted to direct a cooling fluid from the cold plate'sinlet 110, through the fluid flow passage'sentry portion 130, through themicrochannels 160 defined by the substantially parallel set ofguide fins 150, through the fluid flow passage'sexit portion 165 and out of the cold plate'soutlet 115. As discussed in greater detail below, during this process, the cooling fluid engages thevarious guide fins cold plate 100 to absorb heat from objects that are adjacent and/or in contact with, thecold plate 100. - As may be understood from
FIGS. 10 and 11 , an alternative embodiment of thecold plate 100 may include many different configurations of fins for absorbing heat from liquid passing through thecold plate 100. For example, as shown inFIG. 10 , in an alternative embodiment, a plurality of substantially uniformly spacedpin fins 150 is provided in the cold plate's fluid flow passage 120. In this embodiment, thepin fins 150 cooperate to define a plurality of circuitous passages through which the cooling fluid flows as it passes through the cold plate's fluid flow passage 120. During this process, the cooling fluid contacts thepin fins 150 and thereby absorbs heat from thepin fins 150, which serves to cool the cold plate's exterior. - As shown in
FIG. 10 , in particular embodiments, the plurality ofpin fins 150 may be distributed over at least about 40%, at least about 50%, at least about 60%, at least about 70%, or at least about 80% of the surface area of the bottom of the cold plate's fluid flow passage 120. - As may be understood from
FIG. 11 , thecold plate 100 may include fins of a variety of different shapes and sizes. For example, the fins may be straight or curved, parallel or angled, arrayed or random, full depth or partial, smooth or textured, continuous or interrupted, any combination, or any other size or shape that facilitates a desired flow pattern and a desired heat transfer. - In various embodiments, the guide fins are configured and spaced according to the needs indicated by a heat map of an object (e.g., a computer chip or other electrical component) to be cooled by the
cold plate 100. For example, a tighter cluster of pin fins may be provided adjacent a portion of the object that has been determined, through heat mapping techniques, to be particularly hot. - As discussed above, the
cooling system 10 may include asupport plate 200, that is attached adjacent (e.g., to) a surface (e.g., an upper surface) of thecold plate 100, and that is adapted for supporting one or more of the cooling system's other components. As shown inFIG. 2 and described here, thecold plate 100 may be attached adjacent (e.g., to) the center of the support plate's bottom surface. - In various embodiments, the support plate 200: (1) is made of a highly thermally conductive material (e.g., a highly thermally conductive metal such as copper, or other suitable material); (2) is substantially planar; (3) is relatively thin; (4) and has a footprint that is larger than a footprint of the cold plate 100 (e.g., the perimeter of the
support plate 200 may be at least about 40%, at least about 50%, or at least about 60% larger than the perimeter of the cold plate 100). This may allow thesupport plate 200 to serve the duel functions of supporting certain cooling system components and dissipating heat from the cold plate. - The support plate 200 (as well as the other components) may be sized and shaped to fit within any of a variety of spaces. For example, the
support plate 200 in one embodiment may be substantially square in shape and measure 75 millimeters along one side. - As shown in
FIGS. 1 and 2 , thecooling system 10 may include a plurality of heat exchangers (in this example threeradiators heat exchanger heat exchanger inlet 405, aheat exchanger outlet 410, a heat exchanger fluid flow passage 415 (e.g., a winding tube), and a plurality of fins that serve to dissipate heat from a cooling liquid as the cooling liquid flows through thefluid flow passage 415. - Although plate and frame heat exchangers are shown and described in various embodiments, any suitable type or number of heat exchangers may be used, in series or parallel, using any suitable type of flow arrangement. Although various heat exchangers are described herein as using single-phase liquid water, either single-phase or phase-change heat exchangers may be appropriate for certain applications.
- As noted above, the
cooling system 10 shown inFIGS. 1 and 2 comprises afan 500A positioned on theupper surface 205 of thesupport plate 200 and in a central location relative to the cooling system's other components. Thefan 500A (or other type of air mover) is positioned to produce a current of gas (or other fluid) adjacent theheat exchangers heat exchangers heat exchangers - Although the
fan 500A shown inFIGS. 1 and 2 includes as a series offan blades 505 mounted on a central rotating shaft, in other embodiments, the fan may be any type of device capable of producing a flow (e.g., a steady flow) of gas. Size, geometry of nearby components, and optimization of heat transfer are some of the constraints that may influence the selection of a fan for a particular embodiment. - As shown in
FIGS. 1 and 2 , apump 300 may be mounted adjacent (e.g., to) thesupport plate 200. In various embodiments, thispump 300 is positioned and configured to cause a cooling fluid to flow through a substantially closed circuit (or alternatively another type of circuit) that extends through the cold plate's fluid flow passage 120 and through the heat exchangers' respectivefluid flow passages 415. Thepump 300 may be any of a variety of suitable types of pumps, such as a rotary pump, piston pump, displacement pump, centrifugal pump, and the like. As shown inFIG. 5 , apump 300 may include aninlet 305 and anoutlet 310. In one aspect, thepump 300 and piping ortubing 600 may be sized in relation to one another for the efficient and cooperative generation of a fluid flow through thecooling system 10. - As shown in
FIG. 2 , the cooling system may providetubing 600 or any other suitable materials for providing a conduit for cooling liquid as the cooling liquid travels between the cooling system's various components. In this embodiment, the tubing 600 (together with the system's components) provides a substantially closed circuit for the cooling fluid. Thetubing 600 may be copper or any other suitable material and may be insulated or bare along particular sections, depending on the desired heat transfer for that section oftubing 600. - When the cooling system embodiment described above is in operation, the component to be cooled (e.g., a computer chip or other electric component) is positioned adjacent the
cold plate 100 so that, for example, the component is in physical contact with thecold plate 100. While the component is positioned adjacent thecold plate 100, thepump 300 repeatedly circulates a cooling fluid through an at least substantially closed circuit that extends through the cold plate's fluid flow passage 120 and the heat exchangers' respectivefluid flow passages 415. This serves to cool the component. - More particularly, after the cooling fluid passes through the cold plate's fluid flow passage 120 and absorbs heat from the
computer chip 50 or other component as described above, the cooling fluid exits thecold plate 100 through the cold plate'soutlet 115 as shown inFIG. 2 . The cooling fluid then: (1) flows, via asuitable conduit 600, to theinlet 405A of afirst heat exchanger 400A; (2) passes through thefirst heat exchanger 400A; and (3) exits thefirst heat exchanger 400A through the first heat exchanger'soutlet 410A. The cooling fluid then repeats this process for the system'sother heat exchangers heat exchangers heat exchangers heat exchangers heat exchangers - After being cooled by the cooling system's
heat exchangers pump 300 toward the cold plate'sinlet 110 and into thecold plate 100, as shown inFIG. 2 . The cooled fluid may then flow, as described above, through the cold plate's fluid flow passage 120 until it reaches the cold plate'soutlet 115, where the circulation described in this example begins again. This process may repeat over an extended period of time. - The fan may be located and positioned in any way that facilitates a beneficial flow of gas around the heat exchangers, pump, fan housing, and/or other components of the system, as well as nearby components or structures in the vicinity.
FIGS. 1-2 depict acooling system 10 comprising a series of heat exchangers 400A, 400B, 400C disposed near three sides of asupport plate 200 and partially surrounding afan 500A.FIG. 3 depicts asimilar cooling system 10 comprising afan 500B centrally located but positioned higher above thesupport plate 200 than thefan 500A depicted inFIG. 1 . - Similarly,
FIGS. 4-5 depict acooling system 10 comprising aheat exchanger 400D partially surrounding afan 500C.FIG. 6 depicts asimilar cooling system 10 comprising afan 500D centrally located but positioned higher above thesupport plate 200 than thefan 500C depicted inFIG. 4 . Theheat exchanger 400D depicted inFIGS. 4-5 is substantially semi-circular in overall shape, having a series of plates andfins 460D in the embodiment shown. For designs having a more compact footprint, thesupport plate 200 may be shaped more like thesemi-circular heat exchanger 400D. Alternatively, depending on the particular application and the desired heat transfer properties, thesupport plate 200 may be shaped as shown, exposing more surface area to the ambient surrounding and promoting radiant heat transfer. -
FIGS. 7-8 depict acooling system 10 comprising at least twoheat exchangers fan 500E. Theheat exchangers fins 460E in the embodiment shown. In these figures, thefan 500E as shown may be centrally positioned on an axis substantially parallel to theupper surface 205 of thesupport plate 200. In this configuration, thefan 500E can produce a flow that draws gas through one heat exchanger and pushes gas through the other. In another aspect, as shown inFIG. 8 , the substantially central position of thefan 500E may assist in cooling theupper surface 205 of thesupport plate 200 as well as thecold plate assembly 100 beneath. Thepipes 600 also may benefit from a flow of gas produced by thefan 500E. - A
cold plate assembly 100 according to various embodiments is depicted, in plan view, inFIGS. 2 , 5, and 8. In one aspect of these embodiments, thecentral portion 106 of the cold plate's bottom surface may be located and sized to generally match the size and location of thechip 50 to be cooled. In use, thecooling system 10 may be located such that thecentral portion 106 of the cold plate's bottom surface is at least in partial contact with thechip 50 to be cooled. - As depicted in
FIGS. 9-11 , thecentral portion 145 of the cold plate fluid flow passage may include one ormore guide fins FIG. 9 depicts guidefins FIG. 11 depicts guide fins of various shapes, including elongated guide fins of varyingheight FIG. 10 depicts no guide fins in theentry portion 130 or theexit portion 165 of the cold plate's fluid flow passage. In this and other embodiments, thecold plate assembly 100 may include one or more inlets near theentry portion 130 and one or more outlets near theexit portion 165 of the cold plate fluid flow passage. The second set ofguide fins 150 inFIG. 10 comprises an array of pin-shaped cylinders sometimes called pin fins. In one aspect, the configuration of acold plate 100 and its guide fins for a particular application depends on a variety of design constraints and thermal performance needs. For example, a steady or laminar flow of cooling fluid may be desired for certain applications, while a rapid or turbulent flow may perform better for other applications. Different configurations of flow speeds, inlets and outlets, passage shapes, guide fins, channel shapes, wall textures, and other features may come to mind to those skilled in the art who have the benefit of the teachings presented herein and the embodiments disclosed. - A cooling system according to a second embodiment may include at least one heat exchanger that is adapted to facilitate the flow of cooling fluid over a portion of the cold plate's upper surface. An example of such a
heat exchanger 400G is shown inFIGS. 13A-13B . As may be understood from these figures, theheat exchanger 400G comprises a thin, elongated heat exchangerfluid flow passage 415. As shown, theheat exchanger 400G includes a plurality of fins positioned partially between sections of theflow passage 415. Theheat exchanger 400G also includes a base 440 that forms both a structural footing for the heat exchanger and a space beneath for afluid reservoir 420. In this embodiment, thefluid flow passage 415 conveys cooling fluid first into aheat exchanger outlet 405G, then makes several passes back and forth through the main body of the heat exchanger 440G, then through an opening at afirst end 445 of thebase 440, into and through thefluid reservoir 420, then up through an outlet at asecond end 450, and then out through theheat exchanger outlet 410G. -
FIG. 12 depicts acold plate 100 that is particularly suitable for this type of implementation. In this embodiment, the cold plateupper surface 102 comprises a plurality of substantially rectangular recesses sized and shaped for receiving thebase 440 of a heat exchanger 440G like the one depicted inFIGS. 13A-13B . InFIG. 12 , the recesses are at least partially surrounded, respectively, by a heat exchanger O-ring central portion 190 of thecold plate 100 includes alid 185 as shown inFIG. 12 . -
FIG. 14 shows an embodiment in which the respective bases of a plurality of heat exchangers 400G, 400H, 400I, 400J are positioned adjacent the recesses in thecold plate 100. When in place, the recesses in the cold plateupper surface 102 cooperate with thefluid reservoirs 420 to form a chamber inside the base of each heat exchanger. This chamber forms part of the heat exchanger'sfluid flow path 415. Referring again toFIGS. 13A-13B , thebase 440 ofheat exchanger 400G may be positioned adjacent or mounted on its corresponding O-ring 430G (FIG. 12 ). When in place, thefluid reservoir 420 in thebase 440 cooperates with the substantially rectangular recess in theupper surface 102 to form a chamber underneath theheat exchanger 400G; that chamber forms part of the heatexchanger flow path 415. In this aspect, the heat exchanger 440G in this embodiment facilitates the flow of cooling fluid across theupper surface 102 of thecold plate 100, which may, in various embodiment, help to cool thecold plate 100. -
FIG. 14 depicts, within the context of a cooling system according to a second embodiment, only thecold plate assembly 100 and the general arrangement ofheat exchangers 400G-J without other system components such as a fan, a pump, or tubing. -
FIG. 15A depicts a cooling system according to the second embodiment, which includes similar aspects to those described above with reference toFIGS. 12-14 . InFIG. 15A , the cooling system includes afan 500F, apump 300, andtubing 600 connecting the system's various components, including theheat exchangers upper surface 102 of the cold plate depicted inFIG. 12 , the upper surface of the cold plate depicted inFIG. 15A includes at least one substantially rectangular recess. Like thebase 440 andfluid reservoir 420 of theheat exchanger 400G depicted inFIG. 13B , at least one of the heat exchangers depicted inFIG. 15A includes a fluid reservoir in its base. In this aspect, the cooling system depicted inFIG. 15A is adapted to facilitate the flow of cooling fluid through a heat exchanger fluid flow passage and through a cold plate fluid flow passage. - In the cooling system depicted in
FIG. 15A , at least one of the heat exchangers includes a space beneath its base, creating a fluid reservoir 420 (shown inFIG. 13B ). The upper surface of the cold plate assembly depicted inFIG. 15A comprises at least one substantially rectangular recess that is sized and shaped for receiving the base of a heat exchanger. The substantially rectangular recess in the upper surface forms part of a cold plate fluid flow passage. When the base of the heat exchanger is placed or mounted adjacent the rectangular recess, thefluid reservoir 420 cooperates with the rectangular recess in theupper surface 102, forming a chamber inside the base of each heat exchanger. In this aspect, the chamber becomes part of the heat exchanger flow path 415 (FIG. 13A ) as described above. -
FIG. 15B depicts the cooling system ofFIG. 15A , with an additionalupper heat exchanger 400X mounted in a plan substantially parallel to the cold plate assembly.FIG. 15C is a top view depicting a cooling system that includes theupper heat exchanger 400X.FIG. 15D is a side view depicting the arrangement of apump 300, tubing, other heat exchangers, and theupper heat exchanger 400X. -
FIG. 15E depicts cooling system that includes theupper heat exchanger 400X. As shown,cold plate assembly 100 in this embodiment includes a bottom surface. In this configuration, thecold plate assembly 100 may be configured and positioned so that at least part of the bottom surface'scentral portion 106 is in contact with a microchip or other heat-producing component. - As in the first embodiment, the flow of cooling liquid through the
cold plate assembly 100 absorbs heat from thechip 50 or other component. Referring toFIG. 15A , the cooling fluid may be driven by apump 300 along a flow path inside the pipes ortubing 600, toward and throughheat exchangers cold plate assembly 100. This interaction with thecold plate assembly 100 may improve the cooling of thecold plate assembly 100. - The flow of gas produced by natural convection and by the
fan 500F around the heat exchangers promotes heat transfer, further cooling the fluid. Heat transfer may be aided by a heat exchanger made of copper or other conducting material, or a heat exchanger with fins or other shapes and features to promote radiant heat transfer. - After being cooled through one or more heat exchangers, the fluid may be driven by a
pump 300 toward a central portion 190 (FIG. 12 ) of thecold plate assembly 100. The cooled fluid may flow across and through the interior of acentral portion 190 of thecold plate 100 and then return to thepump 300, where the circulation described in this example may begin again. Thecentral portion 190 of the cold plate may be positioned underneath the main body or platform of thecold plate assembly 100, as depicted inFIG. 15E . Like the cold plates shown inFIGS. 9-11 , thecold plate assembly 100 shown inFIG. 15E may include a cold plate fluid flow passage having an entry portion, a central portion, and an exit portion. As depicted inFIGS. 9-11 , thecentral portion 145 of the cold plate fluid flow passage may include one or more guide fins, macro-channels, and micro-channels. In one embodiment, thiscentral portion 145 inside thecold plate assembly 100 may substantially coincide in size and shape with thebottom surface 106 of the cold plate assembly as shown inFIG. 15E . When in place, thecooling system 10 may be positioned such that at least a portion of thebottom surface 106 of thecold plate assembly 100 is in contact with thechip 50 or other heat-producing component. The flow of cooling fluid across and through thecold plate assembly 100 helps cool thebottom surface 106 and thereby helps absorb heat energy from thechip 50. - A cooling system according to a third embodiment may include at least one heat exchanger that is adapted to facilitate the flow of cooling fluid over a portion of the cold plate's upper surface. An example of such a
heat exchanger 400R and thecold plate assembly 100 with which it cooperates, is depicted in FIGS. 16 and 17A-D. As may be understood fromFIG. 17A , theheat exchanger 400R comprises abase 440, acentral portion 455, and an elongated heat exchangerfluid flow passage 435 that has a substantially semi-circular overall shape. Thecentral portion 455 may coincide in size and shape, in one embodiment, with thecentral portion 190 of thecold plate assembly 100 shown inFIG. 16 . As depicted inFIG. 17B , theheat exchanger base 440 acts as a structural footing for the heat exchanger and creates a space beneath thebase 440 for a fluid reservoir. As shown inFIG. 17B , this fluid reservoir is part of the heat exchangerfluid flow passage 435 by way of aninlet 405 andoutlet 410 in thebase 440. In this aspect, the heat exchanger 440R in this embodiment facilitates the flow of cooling fluid across theupper surface 102 of thecold plate 100. -
FIG. 16 depicts acold plate assembly 100 that is particularly suitable for this semi-circular embodiment. In this embodiment, the cold plateupper surface 102 comprises asemi-continuous fin channel 195 that is substantially semi-circular in overall shape. Thefin channel 195 may be sized and shaped for receiving thebase 440 of a heat exchanger 440R like the one depicted inFIGS. 17A-B . In particular embodiments, the shape of the perimeter of thefin channel 195 at least generally corresponds to the shape of the perimeter of the heat exchanger's base 440R. Thefin channel 195 may also include passages separate from and not covered by the base of any heat exchanger. InFIG. 16 , the recesses are at least partially surrounded by a peripheral channel or seat for receiving a sealing member or cold plate O-ring 180. Thefin channel 195 forms part of a cold plate fluid flow passage which, in this embodiment, facilitates fluid flow across a portion of theupper surface 102 of thecold plate assembly 100. - Like the
central portion 145 of the cold plate fluid flow passage depicted inFIGS. 9-11 , thefin channel 195 in this embodiment may include any number and variety of guide fins or other features, creating macro-channels and micro-channels, or no features at all. Thefin channel 195 depicted inFIG. 16 includes a plurality of pin fins. In one aspect, the pin fins serve as a plurality of interrupted guide fins, creating a fluid flow around and between the pin fins. The pin fins may be made of copper or other conducting material which, in one aspect, may help facilitate heat transfer and aid cooling of thecold plate assembly 100, the other components, and the fluid. -
FIG. 17C depicts a cooling system according to the third embodiment. As shown, the cooling system comprises afan 500R, apump 300R, aheat exchanger 400R, and pipes or tubing connecting the various components. Like theupper surface 102 of the cold plate depicted inFIG. 16 , the upper surface of the cold plate depicted inFIG. 17C includes at least onefin channel 195. Like thebase 440 and fluid reservoir ofheat exchanger 400R depicted inFIG. 17B , theheat exchanger 400R depicted inFIG. 17C includes a fluid reservoir in itsbase 440. When thebase 440 of theheat exchanger 400R is placed or mounted adjacent thefin channel 195, the fluid reservoir cooperates with thefin channel 195 to form a chamber inside the base of each heat exchanger. In this aspect, the chamber becomes part of both the heatexchanger flow passage 435 and the cold plate fluid flow passage. In this way, the cooling system depicted inFIG. 17C is adapted to facilitate the flow of cooling fluid through a heat exchangerfluid flow passage 435 and through a cold plate fluid flow passage which, in this embodiment, comprises afin channel 195 on a portion of theupper surface 102 of thecold plate assembly 100. - In this third embodiment, the flow of cooling liquid across and through the
cold plate assembly 100 absorbs heat from thechip 50 or other component. Referring toFIG. 17C , the cooling fluid may be driven by apump 300R along a heat exchanger flow path 435 (FIG. 17A ) through theheat exchanger 400R. As described above the cooling fluid not only flows through the main fluid flow passage inside the body of theheat exchanger 400R, but it also flows through a chamber in thebase 440 of theheat exchanger 400R where the cooling fluid also comes in contact with theupper surface 102 of thecold plate assembly 100. This interaction with thecold plate assembly 100 may improve the cooling of the fluid, the cooling of thecold plate assembly 100, or both. The flow of gas produced by natural convection and by thefan 500R around theheat exchanger 400R promotes heat transfer, further cooling the fluid. Heat transfer may be aided by a heat exchanger made of copper or other conducting material, or a heat exchanger withfins 460R or other shapes and features to promote radiant heat transfer. - Referring to
FIG. 17C , the cooling fluid may be driven by apump 300R into the upper opening of theheat exchanger 400R. As shown, after passing through theheat exchanger 400R, the fluid may exit through the lower opening of theheat exchanger 400R and then pass downward through inlet 410 (shown inFIG. 17B ) and into thefin channel 195 of thecold plate assembly 100. The cooled fluid may flow across and through thefin channel 195, entering thecentral portion 190 of thecold plate assembly 100 and continuing the circuit to outlet 405 (shown inFIG. 17B ) and returning to thepump 300R, where the circulation described in this example may begin again. - In one embodiment, the cooling system may be positioned such that at least a portion of the bottom surface of the
central portion 190 of the cold plate assembly (which, in this example, is simply a cold plate) is contact with the microchip or other heat-producing component. The flow of cooling fluid through thefin channel 195, including thecentral portion 190, helps cool the corresponding bottom surface and thereby helps absorb heat energy from thechip 50. As shown inFIG. 17D , thecold plate assembly 100 in this embodiment includes a bottom surface. In one embodiment, the central portion 190 (shown inFIG. 16 ) may substantially coincide with the bottom surface's central portion 106 (shown inFIG. 17D ). In the configuration shown inFIG. 17D , thecold plate assembly 100 may be configured and positioned so that at least part of the bottom surface'scentral portion 106 is in contact with a microchip or other heat-producing component. - Many modifications and other embodiments of the invention will come to mind to one skilled in the art to which this invention pertains having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. For example, as will be understood by one skilled in the relevant field in light of this disclosure, the invention may take form in a variety of different mechanical and operational configurations. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for the purposes of limitation.
Claims (24)
1. A cooling system for electronic components comprising:
a cold plate assembly defining at least one cold plate fluid flow passage, said cold plate defining an upper and a lower surface;
at least one heat exchanger disposed adjacent said upper surface of said cold plate assembly, each of said at least one heat exchangers comprising at least one heat exchanger fluid flow passage;
a fan that is positioned for causing gas to flow adjacent said heat exchanger;
one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through said cold plate fluid flow passage and said at least one heat exchanger fluid flow passage; and
a pump that is positioned and configured to cause said cooling fluid to flow through said substantially closed circuit, wherein:
said cold plate assembly comprises: (A) a cold plate; and (B) a support plate disposed immediately adjacent said upper surface of said cold plate, wherein a perimeter of said support plate is longer than a perimeter of said cold plate; and
said cooling system is adapted to be positioned adjacent an electronic component and to cool said electronic component.
2. The cooling system of claim 1 , wherein said pump is positioned adjacent said upper surface of said cold plate assembly.
3. The cooling system of claim 1 , wherein said heat exchanger is at least substantially semi-annular.
4. The cooling system of claim 1 , wherein:
said cold plate comprises a plurality of fins that define a plurality of microchannels; and
said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit, at least a portion of said cooling fluid flows through said plurality of microchannels.
5. The cooling system of claim 1 , wherein:
said cold plate comprises a plurality of interrupted fins; and
said cooling system is adapted so that, as said cooling fluid flows through said closed liquid circuit, at least a portion of said cooling fluid flows through one or more passages defined by said plurality of interrupted fins.
6. The cooling system of claim 5 , wherein:
said plurality of interrupted fins comprises a plurality of pin fins.
7. The cooling system of claim 1 , wherein:
said heat exchanger is mounted adjacent said support plate;
a lower portion said heat exchanger and a particular portion of said upper surface of said support plate cooperate to form a fluid reservoir; and
said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit:
at least a portion of said cooling fluid flows through said fluid reservoir; and
as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid engages both an interior surface of said lower portion of said heat exchanger and said particular portion of said upper surface of said support plate.
8. The cooling system of claim 1 , wherein said fluid reservoir is at least substantially semi-annular.
9. A cooling system for electronic components comprising:
a cold plate assembly defining at least one cold plate fluid flow passage, said cold plate assembly defining an upper and a lower surface;
at least one heat exchanger defining at least one heat exchanger fluid flow passage;
a fan positioned to cause gas to flow adjacent said heat exchanger;
one or more liquid conduits for facilitating the flow of a cooling fluid through an at least substantially closed circuit that extends through said cold plate fluid flow passage and said at least one heat exchanger fluid flow passage; and
a pump that is positioned and configured to cause said cooling fluid to flow through said at least substantially closed circuit, wherein:
said cooling system is adapted to be positioned so that said cold plate assembly engages an electronic component to thereby cool said electronic component;
a lower portion of said heat exchanger and a particular portion of said upper surface of said cold plate assembly cooperate to form a fluid reservoir; and
said cooling system is adapted so that, as cooling fluid flows through said at least substantially closed liquid circuit:
at least a portion of said cooling fluid flows through said fluid reservoir; and
as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid engages both an interior surface of said lower portion of said heat exchanger and said particular portion of said upper surface of said cold plate assembly.
10. The cooling system of claim 9 , wherein said fluid reservoir is at least semi-annular.
11. The cooling system of claim 9 , wherein said lower portion of said heat exchanger defines an elongated opening that is disposed immediately adjacent said upper surface of said cold plate assembly.
12. The cooling system of claim 11 , wherein:
said cold plate assembly defines an elongated recess adjacent said elongated opening that comprises at least part of said fluid reservoir;
said cold plate assembly comprises a plurality of fins disposed within said elongated recess; and
said cooling system is adapted so that, as cooling fluid flows through said closed liquid circuit:
at least a portion of said cooling fluid flows through said fluid reservoir; and
as a volume of said cooling fluid flows through said fluid reservoir, said volume of said cooling fluid flows through a plurality of channels defined by said fins.
13. The cooling system of claim 12 , wherein said plurality of fins comprises a plurality of pin fins.
14. The cooling system of said claim 9 , wherein said elongated opening is substantially annular.
15. The cooling system of claim 9 , wherein said cold plate assembly comprises an electronic component engagement portion that is adapted for engaging said electronic component while said cooling system is being used to cool said electronic component; and
said electronic component engagement portion is disposed adjacent a central portion of a bottom surface of said cold plate assembly.
16. The cooling system of claim 15 , wherein said electronic component engagement portion is positioned beneath said fan.
17. A method of cooling an electronic component comprising:
(A) providing a cold plate assembly that defines at least one cold plate fluid flow passage and that includes a plurality of fins that are disposed within said fluid flow passage;
(B) providing at least one heat exchanger that defines at least one heat exchanger fluid flow passage;
(C) providing a fan that is positioned to cause gas to flow adjacent said at least one heat exchanger;
(D) providing a pump that is adapted for circulating a cooling fluid through: (1) said at least one heat exchanger fluid flow passage; and (2) said at least one cold plate fluid flow passage;
(E) using said pump to repeatedly recirculate said cooling fluid through: (1) said at least one heat exchanger fluid flow passage, and (2) said at least one cold plate fluid flow passage;
(F) while executing said Step (E), using said fan to cause gas to flow adjacent said at least one heat exchanger; and
(G) using said cold plate assembly to cool said electronic component.
18. The method of claim 17 , wherein said step of using said cold plate assembly to cool said electronic component comprises maintaining said electronic component in physical contact with at least a portion of said cold plate.
19. The method of claim 17 , wherein said step of using said pump to repeatedly recirculate said cooling fluid through: (A) said at least one heat exchanger fluid flow passage, and (B) said at least one cold plate fluid flow passage comprises using said pump to repeatedly recirculate said cooling fluid first through one or more channels defined by said plurality of fins.
20. The method of claim 19 , wherein said one or more channels are microchannels.
21. The method of claim 17 , wherein said plurality of fins are substantially uniformly spaced apart from each other within said cold plate fluid flow passage.
22. The method of claim 21 , wherein said plurality of fins comprises at least five fins.
23. The method of claim 17 , wherein said step of using said pump to repeatedly recirculate said cooling fluid first through said at least one heat exchanger fluid flow passage and then through said at least one cold plate fluid flow passage comprises using said pump to repeatedly recirculate said cooling fluid over an upper surface of said cold plate assembly.
24. The method of claim 23 , wherein said step of using said pump to repeatedly recirculate said cooling fluid over a portion of said upper surface of said cold plate assembly comprises using said pump to repeatedly recirculate said cooling fluid over said upper surface in at least a substantially semi-annular path.
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US13/041,345 US20110272120A1 (en) | 2010-03-04 | 2011-03-04 | Compact modular liquid cooling systems for electronics |
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US13/041,345 US20110272120A1 (en) | 2010-03-04 | 2011-03-04 | Compact modular liquid cooling systems for electronics |
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Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8981556B2 (en) | 2013-03-19 | 2015-03-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having non-uniform jet orifice sizes |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US9247679B2 (en) | 2013-05-24 | 2016-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement coolers and power electronics modules comprising the same |
US20160029516A1 (en) * | 2012-12-10 | 2016-01-28 | Sieva, Podjetje Za Razvoj In Trzenje V Avtomobilski Industriji, D.O.O. | Advanced heat exchanger with integrated coolant fluid flow deflector |
US9257365B2 (en) | 2013-07-05 | 2016-02-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies and power electronics modules having multiple-porosity structures |
EP2851641A4 (en) * | 2012-04-26 | 2016-03-23 | Mitsubishi Electric Corp | Heat exchanger, indoor unit, and refrigeration cycle device |
US20160165752A1 (en) * | 2014-11-04 | 2016-06-09 | Ge Aviation Systems Llc | Heat exchanger assembly |
US20160238262A1 (en) * | 2013-09-30 | 2016-08-18 | Arcelik Anonim Sirketi | Forced convection heat exchanger for a refrigeration appliance |
US9460985B2 (en) | 2013-01-04 | 2016-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses having a jet orifice surface with alternating vapor guide channels |
US9484283B2 (en) | 2013-01-04 | 2016-11-01 | Toyota Motor Engineering & Manufacturing North America Inc. | Modular jet impingement cooling apparatuses with exchangeable jet plates |
US9803938B2 (en) | 2013-07-05 | 2017-10-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies having porous three dimensional surfaces |
US9943016B2 (en) | 2014-11-04 | 2018-04-10 | Ge Aviation Systems Llc | Cooling structure |
US20180195804A1 (en) * | 2017-01-09 | 2018-07-12 | Blackbezt Lighting Technology Co., Ltd. | Integrated liquid cooling device and method thereof |
WO2020030386A1 (en) * | 2018-08-06 | 2020-02-13 | Webasto SE | Heat exchanger |
EP3675615A1 (en) * | 2018-12-26 | 2020-07-01 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
US20200275583A1 (en) * | 2019-02-26 | 2020-08-27 | Career Technology Mfg. Co., Ltd. | Circuit board module and heat-dissipating board structure thereof |
USD896190S1 (en) * | 2018-09-27 | 2020-09-15 | Auras Technology Co., Ltd. | Water cooling device |
US10851800B2 (en) | 2019-04-25 | 2020-12-01 | Dell Products, Lp | Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems |
US10874034B1 (en) * | 2019-11-05 | 2020-12-22 | Facebook, Inc. | Pump driven liquid cooling module with tower fins |
US11028857B2 (en) | 2019-09-18 | 2021-06-08 | Dell Products, Lp | Cooling module with blower system having opposite, blower and impeller outlets for information handling systems |
US11073338B2 (en) | 2019-06-17 | 2021-07-27 | Gogoro, Inc. | Liquid-cooled heat dissipation device and vehicle |
US11085439B2 (en) | 2018-06-26 | 2021-08-10 | Copper Core Limited | Heat exchanger assembly with heat shielding duct |
US11109509B2 (en) * | 2019-05-03 | 2021-08-31 | Dell Products, Lp | Cooling module with blower system having dual opposite outlets for information handling systems |
US11236738B2 (en) * | 2018-03-30 | 2022-02-01 | Nidec Corporation | Cooling apparatus |
US11240931B1 (en) | 2020-07-16 | 2022-02-01 | Dell Products, Lp | Variable height fan |
US11252837B2 (en) * | 2018-03-30 | 2022-02-15 | Nidec Corporation | Cooling apparatus |
US11412640B2 (en) * | 2019-07-29 | 2022-08-09 | Pratt & Whitney Canada Corp. | Plate cooler for aircraft electronic components |
US20220381476A1 (en) * | 2019-10-18 | 2022-12-01 | Gron Isitma Sogutma Limited Sirketi | A heat exchanger collector configuration |
US11744051B2 (en) | 2019-05-24 | 2023-08-29 | Deka Products Limited Partnership | Apparatus for electronic cooling on an autonomous device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060137860A1 (en) * | 2004-12-29 | 2006-06-29 | Ravi Prasher | Heat flux based microchannel heat exchanger architecture for two phase and single phase flows |
US20060237172A1 (en) * | 2005-04-22 | 2006-10-26 | Cooler Master Co. Ltd. | Water-cooling heat exchanger and heat-dissipating device for the same |
US20060254752A1 (en) * | 2005-04-06 | 2006-11-16 | Matsushita Electric Industrial Co., Ltd. | Radiator and heatsink apparatus having the radiator |
US7441591B2 (en) * | 2005-09-29 | 2008-10-28 | Samsung Electronics Co., Ltd. | Heatsink |
-
2011
- 2011-03-04 US US13/041,345 patent/US20110272120A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060137860A1 (en) * | 2004-12-29 | 2006-06-29 | Ravi Prasher | Heat flux based microchannel heat exchanger architecture for two phase and single phase flows |
US20060254752A1 (en) * | 2005-04-06 | 2006-11-16 | Matsushita Electric Industrial Co., Ltd. | Radiator and heatsink apparatus having the radiator |
US20060237172A1 (en) * | 2005-04-22 | 2006-10-26 | Cooler Master Co. Ltd. | Water-cooling heat exchanger and heat-dissipating device for the same |
US7441591B2 (en) * | 2005-09-29 | 2008-10-28 | Samsung Electronics Co., Ltd. | Heatsink |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2851641A4 (en) * | 2012-04-26 | 2016-03-23 | Mitsubishi Electric Corp | Heat exchanger, indoor unit, and refrigeration cycle device |
US20160029516A1 (en) * | 2012-12-10 | 2016-01-28 | Sieva, Podjetje Za Razvoj In Trzenje V Avtomobilski Industriji, D.O.O. | Advanced heat exchanger with integrated coolant fluid flow deflector |
US9844165B2 (en) * | 2012-12-10 | 2017-12-12 | Sieva, Podjetje Za Razvoj In Trzenje V Avtomobilski Industriji, D. O. O. | Advanced heat exchanger with integrated coolant fluid flow deflector |
US9460985B2 (en) | 2013-01-04 | 2016-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses having a jet orifice surface with alternating vapor guide channels |
US9484283B2 (en) | 2013-01-04 | 2016-11-01 | Toyota Motor Engineering & Manufacturing North America Inc. | Modular jet impingement cooling apparatuses with exchangeable jet plates |
US8981556B2 (en) | 2013-03-19 | 2015-03-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having non-uniform jet orifice sizes |
US9903664B2 (en) | 2013-03-19 | 2018-02-27 | Toyota Jidosha Kabushiki Kaisha | Jet impingement cooling apparatuses having non-uniform jet orifice sizes |
US9247679B2 (en) | 2013-05-24 | 2016-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement coolers and power electronics modules comprising the same |
US9803938B2 (en) | 2013-07-05 | 2017-10-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies having porous three dimensional surfaces |
US9257365B2 (en) | 2013-07-05 | 2016-02-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies and power electronics modules having multiple-porosity structures |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US20160238262A1 (en) * | 2013-09-30 | 2016-08-18 | Arcelik Anonim Sirketi | Forced convection heat exchanger for a refrigeration appliance |
US9915437B2 (en) * | 2013-09-30 | 2018-03-13 | Arcelik Anonim Sirketi | Forced convection heat exchanger for a refrigeration appliance |
US20160165752A1 (en) * | 2014-11-04 | 2016-06-09 | Ge Aviation Systems Llc | Heat exchanger assembly |
US9943016B2 (en) | 2014-11-04 | 2018-04-10 | Ge Aviation Systems Llc | Cooling structure |
US20180195804A1 (en) * | 2017-01-09 | 2018-07-12 | Blackbezt Lighting Technology Co., Ltd. | Integrated liquid cooling device and method thereof |
US11252837B2 (en) * | 2018-03-30 | 2022-02-15 | Nidec Corporation | Cooling apparatus |
US11236738B2 (en) * | 2018-03-30 | 2022-02-01 | Nidec Corporation | Cooling apparatus |
US11085439B2 (en) | 2018-06-26 | 2021-08-10 | Copper Core Limited | Heat exchanger assembly with heat shielding duct |
WO2020030386A1 (en) * | 2018-08-06 | 2020-02-13 | Webasto SE | Heat exchanger |
USD896190S1 (en) * | 2018-09-27 | 2020-09-15 | Auras Technology Co., Ltd. | Water cooling device |
US20200214172A1 (en) * | 2018-12-26 | 2020-07-02 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
CN111367386A (en) * | 2018-12-26 | 2020-07-03 | 广达电脑股份有限公司 | Cooling plate substrate, cooling device, and server device |
US10874030B2 (en) * | 2018-12-26 | 2020-12-22 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
EP3675615A1 (en) * | 2018-12-26 | 2020-07-01 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
US10986754B2 (en) * | 2019-02-26 | 2021-04-20 | Career Technology Mfg. Co., Ltd. | Circuit board module and heat-dissipating board structure thereof |
US20200275583A1 (en) * | 2019-02-26 | 2020-08-27 | Career Technology Mfg. Co., Ltd. | Circuit board module and heat-dissipating board structure thereof |
US10851800B2 (en) | 2019-04-25 | 2020-12-01 | Dell Products, Lp | Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems |
US11109509B2 (en) * | 2019-05-03 | 2021-08-31 | Dell Products, Lp | Cooling module with blower system having dual opposite outlets for information handling systems |
US11744051B2 (en) | 2019-05-24 | 2023-08-29 | Deka Products Limited Partnership | Apparatus for electronic cooling on an autonomous device |
TWI776154B (en) * | 2019-06-17 | 2022-09-01 | 英屬開曼群島商睿能創意公司 | Liquid-cooled radiator and vehicle |
US11073338B2 (en) | 2019-06-17 | 2021-07-27 | Gogoro, Inc. | Liquid-cooled heat dissipation device and vehicle |
US11519672B2 (en) | 2019-06-17 | 2022-12-06 | Gogoro Inc. | Liquid-cooled heat dissipation device and vehicle |
US11412640B2 (en) * | 2019-07-29 | 2022-08-09 | Pratt & Whitney Canada Corp. | Plate cooler for aircraft electronic components |
US11028857B2 (en) | 2019-09-18 | 2021-06-08 | Dell Products, Lp | Cooling module with blower system having opposite, blower and impeller outlets for information handling systems |
US20220381476A1 (en) * | 2019-10-18 | 2022-12-01 | Gron Isitma Sogutma Limited Sirketi | A heat exchanger collector configuration |
US10874034B1 (en) * | 2019-11-05 | 2020-12-22 | Facebook, Inc. | Pump driven liquid cooling module with tower fins |
US11240931B1 (en) | 2020-07-16 | 2022-02-01 | Dell Products, Lp | Variable height fan |
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