US20110281510A1 - Pad Window Insert - Google Patents
Pad Window Insert Download PDFInfo
- Publication number
- US20110281510A1 US20110281510A1 US12/778,760 US77876010A US2011281510A1 US 20110281510 A1 US20110281510 A1 US 20110281510A1 US 77876010 A US77876010 A US 77876010A US 2011281510 A1 US2011281510 A1 US 2011281510A1
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- United States
- Prior art keywords
- polishing
- window
- layer
- polishing pad
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Definitions
- a polishing pad with a window A polishing pad with a window, a system containing such a polishing pad, and a process for making and using such a polishing pad are described.
- planarization may be needed to polish away a conductive filler layer until the top surface of an underlying layer is exposed, leaving the conductive material between the raised pattern of the insulative layer to form vias, plugs and lines that provide conductive paths between thin film circuits on the substrate.
- planarization may be needed to flatten and thin an oxide layer to provide a flat surface suitable for photolithography.
- CMP chemical mechanical polishing
- an optical monitoring system for in-situ measuring of uniformity of a layer on a substrate during polishing of the layer has been employed.
- the optical monitoring system can include a light source that directs a light beam toward the substrate during polishing, a detector that measures light reflected from the substrate, and a computer that analyzes a signal from the detector and calculates whether the endpoint has been detected.
- the light beam is directed toward the substrate through a window in the polishing pad.
- a window can be attached to the underside of a polishing pad such that a portion of the window rests in a recess in a platen. This can permit a large surface area contact between the window and the pad so as to increase bonding strength between the window and the polishing pad.
- a polishing apparatus in one aspect, includes a platen having a planar upper surface, a recess formed in the upper surface, the recess having a bottom surface, and a passage connected to the lower surface of the recess, as well as a polishing pad comprising a polishing layer, a polishing surface, and underside and an aperture therethrough, the aperture having a smaller lateral dimension than the recess, the aperture aligned with the passage.
- a solid light-transmitting window has a first portion positioned at least partially in the aperture in the polishing pad and a second portion positioned at least partially in the recess in the platen, the second portion having a larger lateral dimension than the first portion and extending below the polishing layer, the second portion of the window adhesively attached to an underside of the polishing pad.
- the first portion of the window can plug the aperture in the polishing pad.
- a top surface of the first portion of the window can be coplanar with the upper surface of the platen.
- the bottom surface of the recess can be parallel with the upper surface of the platen.
- a lower surface of the second portion of window can contact the lower surface of the recess.
- the lower surface of the second portion of window may not be adhered to the lower surface of the recess.
- the polishing apparatus can also include an adhesive layer spanning the polishing layer.
- the adhesive layer can include a double-sided adhesive tape.
- the adhesive layer can abut the polishing layer.
- the underside of the polishing pad can be adhesively attached to the upper surface of the platen by the adhesive layer.
- a top surface of the second portion of the window can be adhesively attached to underside of the polishing pad by the adhesive layer.
- a top surface of the second portion of the window can be adhesively attached to underside of the polishing pad.
- the polishing pad can include the polishing layer.
- the polishing pad can include the polishing layer and a lower layer that is less compressible than the polishing layer.
- the second portion can have a lateral dimension between two and ten times larger, e.g., about eight times larger, than the first portion.
- the second portion of the window can laterally fill the recess in the platen.
- the polishing pad can have a thickness less than 1 mm.
- the polishing apparatus can also include an optical fiber in the passage and positioned to direct or receive light through the first portion of the window. The optical fiber can be wider than the first portion of the window.
- the sides of the recess can be sloped and sides of the second portion of the window can be sloped.
- method of assembling a window for a polishing apparatus includes forming an aperture through a polishing pad, the polishing pad comprising a polishing layer having a polishing surface and underside, forming a solid light-transmitting window having a first portion and a second portion having a larger lateral dimension than the first portion, inserting the first portion of the window into the aperture of the pad, adhering a top surface of the second portion of the window to the underside of the polishing pad, and positioning the polishing pad and window on a platen such that the second portion of the window fits into a recess in a planar upper surface of the platen and the underside of the polishing pad is adhered to the planar upper surface of the platen.
- Implementations can include one or more of the following features.
- a layer of adhesive can be formed on the bottom of the polishing layer and a liner covers the adhesive, a portion of the liner can be removed around the aperture, and the top surface of the second portion of the window can contact the adhesive in the removed portion of the liner.
- Implementations may include the following potential advantages.
- a strong bond can be formed between the window and a thin polishing pad, reducing the likelihood of slurry leakage and reducing the likelihood of the window being pulled from the pad due to shear force from the substrate being polished.
- the polishing pad can improve wafer-to-wafer uniformity of spectrum reflected from the substrate, particularly at short wavelengths.
- FIG. 1 is a cross-sectional view of a CMP apparatus containing a polishing pad.
- FIG. 2 is a top view of an embodiment of a polishing pad with a window.
- FIG. 3A is a cross-sectional view of the polishing pad of FIG. 2 installed on a platen.
- FIG. 3B is a cross-sectional view of the polishing pad of FIG. 2 .
- FIGS. 4-7 illustrate a method of forming a polishing pad.
- FIG. 8 is a cross-sectional view of another implementation the polishing pad installed on a platen.
- a window can be attached to the underside of a polishing pad such that a portion of the window rests in a recess in a platen. This can permit a large surface area contact between the window and the pad so as to increase bonding strength between the window and the polishing pad.
- the CMP apparatus 10 includes a polishing head 12 for holding a semiconductor substrate 14 against a polishing pad 18 on a platen 16 .
- the CMP apparatus may be constructed as described in U.S. Pat. No. 5,738,574, the entire disclosure of which is incorporated herein by reference.
- the substrate can be, for example, a product substrate (e.g., which includes multiple memory or processor dies), a test substrate, a bare substrate, and a gating substrate.
- the substrate can be at various stages of integrated circuit fabrication, e.g., the substrate can be a bare wafer, or it can include one or more deposited and/or patterned layers.
- the term substrate can include circular disks and rectangular sheets.
- the effective portion of the polishing pad 18 can include a polishing layer 20 with a polishing surface 24 to contact the substrate and a bottom surface 22 secured to the platen 16 by an adhesive layer 28 , e.g., an adhesive tape.
- the adhesive 28 can be a pressure-sensitive adhesive.
- the polishing pad can be, e.g., consist of, a single-layer pad, with the polishing layer 20 formed of a thin durable material suitable for a chemical mechanical polishing process.
- the layers of the polishing pad can consist of the single-layer polishing layer 20 and the adhesive layer 28 (and optionally a liner, which would be removed when the pad is installed on the polishing platen).
- the polishing layer 20 can be, e.g., consist of, a foamed polyurethane, with at least some open pores on the polishing surface 24 .
- the adhesive layer 28 can be a double-sided adhesive tape, e.g., a thin layer of polyethylene terephthalate (PET), e.g., Mylar®, with adhesive, e.g., pressure-sensitive adhesive, on both sides.
- PET polyethylene terephthalate
- adhesive e.g., pressure-sensitive adhesive
- the polishing pad 18 has a radius R of 15.0 (381.00 mm) to 15.5 inches (393.70 mm), with a corresponding diameter of 30 to 31 inches.
- the polishing pad 18 can have a radius of 21.0 (533.4 mm) to 21.5 inches (546.1 mm), with corresponding diameter of 42 to 43 inches.
- grooves 26 can be formed in the polishing surface 24 .
- the grooves can be in a “waffle” pattern, e.g., a cross-hatched pattern of perpendicular grooves with sloped side walls that divide the polishing surface into rectangular, e.g., square, areas.
- the polishing pad material is wetted with the chemical polishing liquid 30 , which can include abrasive particles.
- the slurry can include KOH (potassium hydroxide) and fumed-silica particles.
- KOH potassium hydroxide
- some polishing processes are “abrasive-free”.
- the polishing head 12 applies pressure to the substrate 14 against the polishing pad 18 as the platen rotates about its central axis.
- the polishing head 12 is usually rotated about its central axis, and translated across the surface of the platen 16 via a drive shaft or translation arm 32 .
- the pressure and relative motion between the substrate and the polishing surface, in conjunction with the polishing solution, result in polishing of the substrate.
- An optical aperture 34 is formed in the top surface of the platen 16 .
- An optical monitoring system including a light source 36 , such as a laser, and a detector 38 , such as a photodetector, can be located below the top surface of the platen 16 .
- the optical monitoring system can be located in a chamber inside the platen 16 that is in optical communication with the optical aperture 34 , and can rotate with the platen.
- One or more optical fibers 50 can carry light from the light source 36 to the substrate, and from the substrate to the detector 38 .
- the optical fiber 50 can be a bifurcated optical fiber, with a trunk 52 in proximity, e.g., abutting, the window 40 in the polishing pad, a first leg 54 connected to the light source 36 , and a second leg 56 connected to the detector 38 .
- the optical aperture 34 can be filled with a transparent solid piece, such as a quartz block (in which case the fiber would not abut the window 40 but could abut the solid piece in the optical aperture), or it can be an empty hole.
- the optical monitoring system and optical aperture are formed as part of a module that fits into a corresponding recess in the platen.
- the optical monitoring system could be a stationary system located below the platen, and the optical aperture could extend through the platen.
- the light source 36 can employ a wavelength anywhere from the far infrared to ultraviolet, such as red light, although a broadband spectrum, e.g., white light, can also be used, and the detector 38 can be a spectrometer.
- a solid window 40 is formed in the overlying polishing pad 18 and aligned with the optical aperture 34 in the platen.
- the window 40 and aperture 34 can be positioned such that they have a view of the substrate 14 held by the polishing head 12 during at least a portion of the platen's rotation, regardless of the translational position of the head 12 .
- the light source 36 projects a light beam through the aperture 34 and the window 40 to impinge the surface of the overlying substrate 14 at least during a time when the window 40 is adjacent the substrate 14 .
- Light reflected from the substrate forms a resultant beam that is detected by the detector 38 .
- the light source and the detector are coupled to an unillustrated computer that receives the measured light intensity from the detector and uses it to determine the polishing endpoint, e.g., by detecting a sudden change in the reflectivity of the substrate that indicates the exposure of a new layer, by calculating the thickness removed from of the outer layer (such as a transparent oxide layer) using interferometric principles, by monitoring the spectrum of the reflected light and detecting a target spectrum, by matching a sequence of measured spectra to reference spectra from a library and determining where a linear function fit to index values of the reference spectrum reaches a target value, or by otherwise monitoring the signal for predetermined endpoint criteria.
- an unillustrated computer that receives the measured light intensity from the detector and uses it to determine the polishing endpoint, e.g., by detecting a sudden change in the reflectivity of the substrate that indicates the exposure of a new layer, by calculating the thickness removed from of the outer layer (such as a transparent oxide layer) using interferometric principles, by monitoring the
- a normal large rectangular window e.g., a 2.25 by 0.75 inch window
- the lateral frictional force from the substrate during polishing can be greater than the adhesive force of the molding of the window to the sidewall of the pad.
- the window 40 can be small, e.g., less than about 3 mm in diameter, e.g., so as to reduce the frictional force applied by the substrate during polishing.
- the upper portion of the window 40 can be a circular area about 3 mm wide centered a distance D of about 7.5 inches (190.50 mm) from the center of a 30 to 31 inch diameter polishing pad 18 , or centered a distance D of about 9 to 11 inches from the center of a 42 to 43 inch diameter polishing pad 18 .
- the window 40 can have an approximately circular shape (other shapes are possible, such as rectangular). If the window is elongated, its longer dimension can be substantially parallel to the radius of the polishing pad that passes through the center of the window.
- the window 40 can have a ragged perimeter 42 , e.g., the perimeter can be longer than a perimeter of a similarly shaped circle or rectangle, e.g., a zig-zag or other meandering pattern (in a top view). This increases the surface area for contact of the window to the sidewall of the polishing pad, and can thereby improve adhesion of the window to the polishing pad.
- the window 40 includes an upper portion 40 a and a lower portion 40 b .
- the window 40 including the upper portion 40 a and lower portion 40 b , can be a unitary single-piece body of homogeneous material.
- the upper portion 40 a is vertically aligned with the lower portion 40 b but is laterally smaller (i.e., in one or both directions parallel to the polishing surface) than the lower portion 40 b .
- a portion of the polishing layer 20 projects above the lower portion 40 b so that the rim of the lower portion 40 b that projects beyond the upper portion 40 a forms a ledge 49 .
- the lower portion 40 b can project laterally beyond the upper portion 40 a on all sides of the window 40 , or optionally the lower portion 40 b can project laterally beyond the upper portion 40 a on two opposing sides of the window 40 but be aligned along other sides of the window 40 .
- the upper surface of the lower portion 40 b that projects beyond the upper portion 40 a can be a substantially planar surface.
- the upper portion 40 a can be located in the center of, e.g., be concentric with, the lower portion 40 b .
- the lower portion 40 b can have a lateral dimension 2 to 10 times, e.g., about 8 times, as large as the lateral dimension of the upper portion 40 a .
- the window 40 is circular, the upper portion 40 a can have a diameter of 3 mm, and the lower portion 40 b can have a diameter of 25 mm.
- the upper portion 40 a can be about the same thickness as the lower portion 40 b .
- the upper portion 40 a can be thicker than, or be thinner than, the lower portion 40 b.
- the upper portion 40 a of the window 40 can project into an aperture in the adhesive layer 28 .
- the edge of the adhesive layer 28 e.g., adhesive tape, can abut the sides of the upper portion 40 a of the window 40 .
- the lower portion 40 b of the window can project into a recess 78 in the top surface 76 of the platen 16 .
- the upper portion 40 a of the window is as thick as the combination of the polishing layer 20 and the adhesive layer 28 .
- a top surface 44 of the upper portion 40 a of the window 40 is coplanar with the polishing surface 24 .
- a bottom of the upper portion 40 a of the window 40 can be coplanar with a bottom surface of the adhesive layer 28 .
- the upper surface of the lower portion 40 b is secured to the underside of the polishing layer 20 by a portion of the adhesive layer 28 .
- the perimeter of the upper portion 40 a of the window 40 can be secured to the inner sidewall edges 48 of the polishing layer 20 , e.g., by additional adhesive.
- the increased surface area of connection between the window 40 and the polishing layer 20 provided by the connection on the ledge 49 can provide a strong bond, reducing the likelihood of slurry leakage and reducing the likelihood of the window 40 being pulled from the polishing pad 18 due to shear force from the substrate being polished.
- the trunk 52 of the optical fiber abuts or nearly abuts the lower portion 40 b . In some implementations, the trunk 52 may be wider than the upper portion 40 a of the window 40 .
- the bottom surface of the lower portion 40 b of the window can abut, e.g., rests on, without being adhesively or otherwise secured to the bottom of the recess 78 in the upper surface 76 of the platen 16 .
- the lower portion 40 b of the window fills the recess 78 .
- the polishing pad 18 can also include a liner 70 that spans the adhesive layer 28 on the bottom surface 22 of the polishing pad 18 , except in the region covered by the adhesive lower portion 40 b of the window 40 .
- the liner 70 can be a thin flexible material, e.g., paper, with a release coating so that it can be peeled away from the adhesive 28 .
- the liner can be an incompressible and generally fluid-impermeable layer, for example, polyethylene terephthalate (PET), e.g., Mylar®.
- the liner 70 is manually peeled from the adhesive layer 28 , and the polishing layer 20 is applied to the platen 16 with the adhesive layer 28 .
- the liner 70 does not span the window 40 , but is removed in and immediately around the region of the lower portion 40 b of the window 40 , e.g., in a region about 25 cm across, to form a hole 72 into which the lower portion 40 b of the window 40 fits.
- the polishing pad 18 is very thin, e.g., less than 2 mm, e.g., less than 1 mm.
- the total thickness of the polishing layer 20 , adhesive 28 and liner 70 can be about 0.8 or 0.9 mm.
- the polishing layer 20 can be about 0.7 or 0.8 mm thick, with the adhesive 28 and the liner 70 providing about another 0.1 mm.
- the grooves 26 can be about half the depth of the polishing pad, e.g., roughly 0.5 mm.
- the polishing layer 20 is formed and the bottom surface of the polishing layer 20 is covered with the pressure sensitive adhesive 28 and a liner 70 , as shown by FIG. 4 .
- Grooves 26 can be formed in the polishing layer 20 as part of a pad molding process before attachment of the pressure sensitive adhesive 28 , or cut into the polishing layer 20 after the pad is formed. The grooves 26 can be formed before or after the liner 70 is attached.
- the window 40 may be formed by casting and curing a polymer in the shape of the window 40 .
- the polymer is a mixture of 2 parts Calthane A 2300 and 3 parts Calthane B 2300 (available from Cal Polymers, Inc. of Long Beach, Calif.).
- the liquid polymer mixture can be degassed, e.g., for 15-30 minutes, before being placed into the aperture.
- the polymer can be cured at room temperature for about 24 hours, or a heat lamp or oven can be used to decrease cure time.
- the polymer can be poured into a mold and cured or otherwise solidified to form the window 40 in its final shape.
- the window 40 can cured in a large solid block, and then can be formed by machining the solid block of polymer to form the final shape of the window 40 .
- a sidewall 84 of the lower portion 40 b may be substantially perpendicular to the bottom surface 46 of the window 40 .
- the sidewall 84 may be formed at an angle to the bottom surface 46 , as will be discussed further in the description of FIG. 7 .
- a hole 82 is punched through the entire polishing pad 18 , including the polishing layer 20 , the adhesive 28 and the liner 70 .
- the hole 82 is sized to accommodate the upper portion 40 a of the window 40 .
- the upper portion 40 a substantially plugs the hole 82 of the polishing pad 18 .
- the hole 82 can be punched from the top (i.e., the side with the polishing surface) of the pad, e.g., by a machine press. This permits the position of the hole 82 to be positioned and sized with a high degree of accuracy and repeatability.
- a portion 72 of the liner 70 is peeled away or otherwise removed from the adhesive layer 28 .
- the liner 70 need not be peeled of the polishing pad 18 entirely at this time.
- the portion 72 of the liner 70 that is peeled away exposes a portion of a bottom surface 22 of the adhesive layer 28 around the hole 82 .
- the portion 72 that is peeled off can also be cut away, e.g., in a region sized to accommodate the ledge 49 of the bottom portion 40 b of the window 40 , although this step can be performed at a later time.
- the window 40 is secured to the polishing pad 18 such that the upper portion 40 a extends into the hole 82 , and the upper surface of the bottom portion 40 b (e.g., the ledge 49 ) contacts the adhesive layer 28 .
- the upper portion 40 a is sized to extend substantially through and substantially fill the hole 82 such that the upper surface 44 is coplanar with the polishing surface 24 of the polishing layer 20 when the ledge 49 is adhered to the adhesive layer 28 .
- an optional window backing piece 74 can be placed to span the window 40 .
- the window backing piece 74 can be secured to a portion of the adhesive layer 28 immediately around the window 40 .
- the backing piece 74 can be the same thickness as the liner 70 , or thinner than the liner 70 .
- the backing piece 74 can be polytetrafluoroethylene (PTFE), e.g., Teflon®, or another non-stick material.
- PTFE polytetrafluoroethylene
- the customer when the customer receives the combined polishing pad 18 and window 40 , the customer can remove the liner 70 (and window backing piece 74 if present) and then attach the polishing pad 18 on the platen 16 using the adhesive layer 28 .
- the lower portion 40 b of the window 40 is inserted into a recess 78 in the upper surface 76 of the platen 16 .
- the liner 70 can be peeled away partially in an area around the window 40 , the lower portion 40 b of the window 40 is inserted into the recess, and then the remainder of the liner is peeled away and the rest of the polishing pad is secured to the platen 16 .
- the lower portion 40 b can be shaped and sized to substantially fill the recess 78 , for example, the sidewall 84 of the lower portion 40 b can contact substantially all of a sidewall 86 of the recess 78 , and the bottom surface 46 of the window 40 substantially contacts a floor 88 of the recess 78 while the upper surface 76 of the platen 16 contacts the adhesive layer 28 .
- the floor 88 of the recess 78 may be substantially parallel with the upper surface 76 of the platen 16 .
- the sidewall 84 of the lower portion 40 b is perpendicular to the bottom surface 46
- the sidewall 86 of the recess 78 is perpendicular to the polishing surface 75 .
- the sidewall 84 of the lower portion 40 b may be formed at a non-perpendicular angle, e.g., between 20° and 80°, e.g., 45°, to the bottom surface 46
- the sidewall 86 of the recess 78 may be formed at a substantially similar angle such that the sidewall 84 and the sidewall 86 substantially contact each other when the lower portion 40 b is inserted into the recess 78 .
- the sidewall 84 may slope inward from the ledge 49 to the bottom surface 46 , such that the lower portion 40 b forms a conic section.
- the sidewall 86 may be formed to mate with the conic section.
- the sloped sidewall 84 may cause the window 40 and the polishing pad 18 to exhibit a self-centering property as the window 40 is inserted into the recess 78 within the sloped sidewall 86 .
- the polishing pad 18 is adhered to the platen 16 by the adhesive layer 28 , thereby retaining the window 40 within the recess 78 in the platen 16 .
- the window 40 can be vertically supported by the floor 88 of the recess 78 and can be retained laterally by the sidewalls 86 of the recess 78 .
- the window 40 can be adhered to the polishing pad by the contact of the top surface of the ledge 49 to the same adhesive layer that secures the underside of the polishing pad to the platen 16 .
- the invention is not so limited.
- the window could be more complex, such as a rectangle, oval or star.
- the top portion of the window can project past one or more sides of the bottom portion.
Abstract
A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
Description
- A polishing pad with a window, a system containing such a polishing pad, and a process for making and using such a polishing pad are described.
- In the process of fabricating modern semiconductor integrated circuits (IC), it is often necessary to planarize the outer surface of the substrate. For example, planarization may be needed to polish away a conductive filler layer until the top surface of an underlying layer is exposed, leaving the conductive material between the raised pattern of the insulative layer to form vias, plugs and lines that provide conductive paths between thin film circuits on the substrate. In addition, planarization may be needed to flatten and thin an oxide layer to provide a flat surface suitable for photolithography.
- One method for achieving semiconductor substrate planarization or topography removal is chemical mechanical polishing (CMP). A conventional chemical mechanical polishing (CMP) process involves pressing a substrate against a rotating polishing pad in the presence of an abrasive slurry.
- In general, there is a need to detect when the desired surface planarity or layer thickness has been reached or when an underlying layer has been exposed in order to determine whether to stop polishing. Several techniques have been developed for the in-situ detection of endpoints during the CMP process. For example, an optical monitoring system for in-situ measuring of uniformity of a layer on a substrate during polishing of the layer has been employed. The optical monitoring system can include a light source that directs a light beam toward the substrate during polishing, a detector that measures light reflected from the substrate, and a computer that analyzes a signal from the detector and calculates whether the endpoint has been detected. In some CMP systems, the light beam is directed toward the substrate through a window in the polishing pad.
- A window can be attached to the underside of a polishing pad such that a portion of the window rests in a recess in a platen. This can permit a large surface area contact between the window and the pad so as to increase bonding strength between the window and the polishing pad.
- In one aspect, a polishing apparatus includes a platen having a planar upper surface, a recess formed in the upper surface, the recess having a bottom surface, and a passage connected to the lower surface of the recess, as well as a polishing pad comprising a polishing layer, a polishing surface, and underside and an aperture therethrough, the aperture having a smaller lateral dimension than the recess, the aperture aligned with the passage. A solid light-transmitting window has a first portion positioned at least partially in the aperture in the polishing pad and a second portion positioned at least partially in the recess in the platen, the second portion having a larger lateral dimension than the first portion and extending below the polishing layer, the second portion of the window adhesively attached to an underside of the polishing pad.
- Implementations can include one or more of the following features. The first portion of the window can plug the aperture in the polishing pad. A top surface of the first portion of the window can be coplanar with the upper surface of the platen. The bottom surface of the recess can be parallel with the upper surface of the platen. A lower surface of the second portion of window can contact the lower surface of the recess. The lower surface of the second portion of window may not be adhered to the lower surface of the recess. The polishing apparatus can also include an adhesive layer spanning the polishing layer. The adhesive layer can include a double-sided adhesive tape. The adhesive layer can abut the polishing layer. The underside of the polishing pad can be adhesively attached to the upper surface of the platen by the adhesive layer. A top surface of the second portion of the window can be adhesively attached to underside of the polishing pad by the adhesive layer. A top surface of the second portion of the window can be adhesively attached to underside of the polishing pad. The polishing pad can include the polishing layer. The polishing pad can include the polishing layer and a lower layer that is less compressible than the polishing layer. The second portion can have a lateral dimension between two and ten times larger, e.g., about eight times larger, than the first portion. The second portion of the window can laterally fill the recess in the platen. The polishing pad can have a thickness less than 1 mm. The polishing apparatus can also include an optical fiber in the passage and positioned to direct or receive light through the first portion of the window. The optical fiber can be wider than the first portion of the window. The sides of the recess can be sloped and sides of the second portion of the window can be sloped.
- In another aspect, method of assembling a window for a polishing apparatus includes forming an aperture through a polishing pad, the polishing pad comprising a polishing layer having a polishing surface and underside, forming a solid light-transmitting window having a first portion and a second portion having a larger lateral dimension than the first portion, inserting the first portion of the window into the aperture of the pad, adhering a top surface of the second portion of the window to the underside of the polishing pad, and positioning the polishing pad and window on a platen such that the second portion of the window fits into a recess in a planar upper surface of the platen and the underside of the polishing pad is adhered to the planar upper surface of the platen.
- Implementations can include one or more of the following features. A layer of adhesive can be formed on the bottom of the polishing layer and a liner covers the adhesive, a portion of the liner can be removed around the aperture, and the top surface of the second portion of the window can contact the adhesive in the removed portion of the liner.
- Implementations may include the following potential advantages. A strong bond can be formed between the window and a thin polishing pad, reducing the likelihood of slurry leakage and reducing the likelihood of the window being pulled from the pad due to shear force from the substrate being polished. In addition, the polishing pad can improve wafer-to-wafer uniformity of spectrum reflected from the substrate, particularly at short wavelengths.
- The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other aspects, features and advantages will be apparent from the description and drawings, and from the claims.
-
FIG. 1 is a cross-sectional view of a CMP apparatus containing a polishing pad. -
FIG. 2 is a top view of an embodiment of a polishing pad with a window. -
FIG. 3A is a cross-sectional view of the polishing pad ofFIG. 2 installed on a platen. -
FIG. 3B is a cross-sectional view of the polishing pad ofFIG. 2 . -
FIGS. 4-7 illustrate a method of forming a polishing pad. -
FIG. 8 is a cross-sectional view of another implementation the polishing pad installed on a platen. - Like reference symbols in the various drawings indicate like elements.
- A window can be attached to the underside of a polishing pad such that a portion of the window rests in a recess in a platen. This can permit a large surface area contact between the window and the pad so as to increase bonding strength between the window and the polishing pad.
- As shown in
FIG. 1 , theCMP apparatus 10 includes apolishing head 12 for holding asemiconductor substrate 14 against apolishing pad 18 on aplaten 16. The CMP apparatus may be constructed as described in U.S. Pat. No. 5,738,574, the entire disclosure of which is incorporated herein by reference. - The substrate can be, for example, a product substrate (e.g., which includes multiple memory or processor dies), a test substrate, a bare substrate, and a gating substrate. The substrate can be at various stages of integrated circuit fabrication, e.g., the substrate can be a bare wafer, or it can include one or more deposited and/or patterned layers. The term substrate can include circular disks and rectangular sheets.
- The effective portion of the
polishing pad 18 can include apolishing layer 20 with a polishingsurface 24 to contact the substrate and abottom surface 22 secured to theplaten 16 by anadhesive layer 28, e.g., an adhesive tape. The adhesive 28 can be a pressure-sensitive adhesive. Other than the adhesive tape and any liner, the polishing pad can be, e.g., consist of, a single-layer pad, with thepolishing layer 20 formed of a thin durable material suitable for a chemical mechanical polishing process. Thus, the layers of the polishing pad can consist of the single-layer polishing layer 20 and the adhesive layer 28 (and optionally a liner, which would be removed when the pad is installed on the polishing platen). - The
polishing layer 20 can be, e.g., consist of, a foamed polyurethane, with at least some open pores on the polishingsurface 24. Theadhesive layer 28 can be a double-sided adhesive tape, e.g., a thin layer of polyethylene terephthalate (PET), e.g., Mylar®, with adhesive, e.g., pressure-sensitive adhesive, on both sides. Such a polishing pad is available under the trade name H7000HN from Fujibo in Tokyo, Japan. - Referring to
FIG. 2 , in some implementations thepolishing pad 18 has a radius R of 15.0 (381.00 mm) to 15.5 inches (393.70 mm), with a corresponding diameter of 30 to 31 inches. In some implementations, thepolishing pad 18 can have a radius of 21.0 (533.4 mm) to 21.5 inches (546.1 mm), with corresponding diameter of 42 to 43 inches. - Referring to
FIG. 3A , in some implementations,grooves 26 can be formed in the polishingsurface 24. The grooves can be in a “waffle” pattern, e.g., a cross-hatched pattern of perpendicular grooves with sloped side walls that divide the polishing surface into rectangular, e.g., square, areas. - Returning to
FIG. 1 , typically the polishing pad material is wetted with thechemical polishing liquid 30, which can include abrasive particles. For example, the slurry can include KOH (potassium hydroxide) and fumed-silica particles. However, some polishing processes are “abrasive-free”. - The polishing
head 12 applies pressure to thesubstrate 14 against thepolishing pad 18 as the platen rotates about its central axis. In addition, the polishinghead 12 is usually rotated about its central axis, and translated across the surface of theplaten 16 via a drive shaft ortranslation arm 32. The pressure and relative motion between the substrate and the polishing surface, in conjunction with the polishing solution, result in polishing of the substrate. - An
optical aperture 34 is formed in the top surface of theplaten 16. An optical monitoring system, including alight source 36, such as a laser, and adetector 38, such as a photodetector, can be located below the top surface of theplaten 16. For example, the optical monitoring system can be located in a chamber inside theplaten 16 that is in optical communication with theoptical aperture 34, and can rotate with the platen. One or moreoptical fibers 50 can carry light from thelight source 36 to the substrate, and from the substrate to thedetector 38. For example, theoptical fiber 50 can be a bifurcated optical fiber, with atrunk 52 in proximity, e.g., abutting, thewindow 40 in the polishing pad, afirst leg 54 connected to thelight source 36, and asecond leg 56 connected to thedetector 38. - The
optical aperture 34 can be filled with a transparent solid piece, such as a quartz block (in which case the fiber would not abut thewindow 40 but could abut the solid piece in the optical aperture), or it can be an empty hole. In one implementation, the optical monitoring system and optical aperture are formed as part of a module that fits into a corresponding recess in the platen. Alternatively, the optical monitoring system could be a stationary system located below the platen, and the optical aperture could extend through the platen. Thelight source 36 can employ a wavelength anywhere from the far infrared to ultraviolet, such as red light, although a broadband spectrum, e.g., white light, can also be used, and thedetector 38 can be a spectrometer. - A
solid window 40 is formed in theoverlying polishing pad 18 and aligned with theoptical aperture 34 in the platen. Thewindow 40 andaperture 34 can be positioned such that they have a view of thesubstrate 14 held by the polishinghead 12 during at least a portion of the platen's rotation, regardless of the translational position of thehead 12. - The
light source 36 projects a light beam through theaperture 34 and thewindow 40 to impinge the surface of the overlyingsubstrate 14 at least during a time when thewindow 40 is adjacent thesubstrate 14. Light reflected from the substrate forms a resultant beam that is detected by thedetector 38. The light source and the detector are coupled to an unillustrated computer that receives the measured light intensity from the detector and uses it to determine the polishing endpoint, e.g., by detecting a sudden change in the reflectivity of the substrate that indicates the exposure of a new layer, by calculating the thickness removed from of the outer layer (such as a transparent oxide layer) using interferometric principles, by monitoring the spectrum of the reflected light and detecting a target spectrum, by matching a sequence of measured spectra to reference spectra from a library and determining where a linear function fit to index values of the reference spectrum reaches a target value, or by otherwise monitoring the signal for predetermined endpoint criteria. - One problem with placement of a normal large rectangular window (e.g., a 2.25 by 0.75 inch window) into a very thin polishing layer is delamination during polishing. In particular, the lateral frictional force from the substrate during polishing can be greater than the adhesive force of the molding of the window to the sidewall of the pad.
- Returning to
FIG. 2 , thewindow 40 can be small, e.g., less than about 3 mm in diameter, e.g., so as to reduce the frictional force applied by the substrate during polishing. For example, the upper portion of thewindow 40 can be a circular area about 3 mm wide centered a distance D of about 7.5 inches (190.50 mm) from the center of a 30 to 31 inchdiameter polishing pad 18, or centered a distance D of about 9 to 11 inches from the center of a 42 to 43 inchdiameter polishing pad 18. - The
window 40 can have an approximately circular shape (other shapes are possible, such as rectangular). If the window is elongated, its longer dimension can be substantially parallel to the radius of the polishing pad that passes through the center of the window. Thewindow 40 can have aragged perimeter 42, e.g., the perimeter can be longer than a perimeter of a similarly shaped circle or rectangle, e.g., a zig-zag or other meandering pattern (in a top view). This increases the surface area for contact of the window to the sidewall of the polishing pad, and can thereby improve adhesion of the window to the polishing pad. - Referring to
FIG. 3A , thewindow 40 includes anupper portion 40 a and alower portion 40 b. Thewindow 40, including theupper portion 40 a andlower portion 40 b, can be a unitary single-piece body of homogeneous material. Theupper portion 40 a is vertically aligned with thelower portion 40 b but is laterally smaller (i.e., in one or both directions parallel to the polishing surface) than thelower portion 40 b. Thus, a portion of thepolishing layer 20 projects above thelower portion 40 b so that the rim of thelower portion 40 b that projects beyond theupper portion 40 a forms aledge 49. Thelower portion 40 b can project laterally beyond theupper portion 40 a on all sides of thewindow 40, or optionally thelower portion 40 b can project laterally beyond theupper portion 40 a on two opposing sides of thewindow 40 but be aligned along other sides of thewindow 40. The upper surface of thelower portion 40 b that projects beyond theupper portion 40 a can be a substantially planar surface. Theupper portion 40 a can be located in the center of, e.g., be concentric with, thelower portion 40 b. Thelower portion 40 b can have a lateral dimension 2 to 10 times, e.g., about 8 times, as large as the lateral dimension of theupper portion 40 a. For example, if thewindow 40 is circular, theupper portion 40 a can have a diameter of 3 mm, and thelower portion 40 b can have a diameter of 25 mm. - The
upper portion 40 a can be about the same thickness as thelower portion 40 b. Alternatively, theupper portion 40 a can be thicker than, or be thinner than, thelower portion 40 b. - The
upper portion 40 a of thewindow 40 can project into an aperture in theadhesive layer 28. The edge of theadhesive layer 28, e.g., adhesive tape, can abut the sides of theupper portion 40 a of thewindow 40. Thelower portion 40 b of the window can project into arecess 78 in thetop surface 76 of theplaten 16. - The
upper portion 40 a of the window is as thick as the combination of thepolishing layer 20 and theadhesive layer 28. Atop surface 44 of theupper portion 40 a of thewindow 40 is coplanar with the polishingsurface 24. A bottom of theupper portion 40 a of thewindow 40 can be coplanar with a bottom surface of theadhesive layer 28. - The upper surface of the
lower portion 40 b is secured to the underside of thepolishing layer 20 by a portion of theadhesive layer 28. Optionally the perimeter of theupper portion 40 a of thewindow 40 can be secured to the inner sidewall edges 48 of thepolishing layer 20, e.g., by additional adhesive. - The increased surface area of connection between the
window 40 and thepolishing layer 20 provided by the connection on theledge 49 can provide a strong bond, reducing the likelihood of slurry leakage and reducing the likelihood of thewindow 40 being pulled from thepolishing pad 18 due to shear force from the substrate being polished. Thetrunk 52 of the optical fiber abuts or nearly abuts thelower portion 40 b. In some implementations, thetrunk 52 may be wider than theupper portion 40 a of thewindow 40. - The bottom surface of the
lower portion 40 b of the window can abut, e.g., rests on, without being adhesively or otherwise secured to the bottom of therecess 78 in theupper surface 76 of theplaten 16. In some implementations, thelower portion 40 b of the window fills therecess 78. - Referring to
FIG. 3B , before installation on theplaten 16, thepolishing pad 18 can also include aliner 70 that spans theadhesive layer 28 on thebottom surface 22 of thepolishing pad 18, except in the region covered by the adhesivelower portion 40 b of thewindow 40. Theliner 70 can be a thin flexible material, e.g., paper, with a release coating so that it can be peeled away from the adhesive 28. In some implementations, the liner can be an incompressible and generally fluid-impermeable layer, for example, polyethylene terephthalate (PET), e.g., Mylar®. In use, theliner 70 is manually peeled from theadhesive layer 28, and thepolishing layer 20 is applied to theplaten 16 with theadhesive layer 28. Theliner 70, however, does not span thewindow 40, but is removed in and immediately around the region of thelower portion 40 b of thewindow 40, e.g., in a region about 25 cm across, to form ahole 72 into which thelower portion 40 b of thewindow 40 fits. - The
polishing pad 18 is very thin, e.g., less than 2 mm, e.g., less than 1 mm. For example, the total thickness of thepolishing layer 20, adhesive 28 andliner 70 can be about 0.8 or 0.9 mm. Thepolishing layer 20 can be about 0.7 or 0.8 mm thick, with the adhesive 28 and theliner 70 providing about another 0.1 mm. Thegrooves 26 can be about half the depth of the polishing pad, e.g., roughly 0.5 mm. - To manufacture the polishing pad, initially the
polishing layer 20 is formed and the bottom surface of thepolishing layer 20 is covered with the pressuresensitive adhesive 28 and aliner 70, as shown byFIG. 4 .Grooves 26 can be formed in thepolishing layer 20 as part of a pad molding process before attachment of the pressuresensitive adhesive 28, or cut into thepolishing layer 20 after the pad is formed. Thegrooves 26 can be formed before or after theliner 70 is attached. - Referring now to
FIG. 5 , in some implementations thewindow 40 may be formed by casting and curing a polymer in the shape of thewindow 40. In one implementation, the polymer is a mixture of 2parts Calthane A 2300 and 3 parts Calthane B 2300 (available from Cal Polymers, Inc. of Long Beach, Calif.). The liquid polymer mixture can be degassed, e.g., for 15-30 minutes, before being placed into the aperture. The polymer can be cured at room temperature for about 24 hours, or a heat lamp or oven can be used to decrease cure time. In some implementations, the polymer can be poured into a mold and cured or otherwise solidified to form thewindow 40 in its final shape. In some implementations, thewindow 40 can cured in a large solid block, and then can be formed by machining the solid block of polymer to form the final shape of thewindow 40. - In some implementations, a
sidewall 84 of thelower portion 40 b may be substantially perpendicular to thebottom surface 46 of thewindow 40. In some implementations, thesidewall 84 may be formed at an angle to thebottom surface 46, as will be discussed further in the description ofFIG. 7 . - A
hole 82 is punched through theentire polishing pad 18, including thepolishing layer 20, the adhesive 28 and theliner 70. Thehole 82 is sized to accommodate theupper portion 40 a of thewindow 40. In some implementations, theupper portion 40 a substantially plugs thehole 82 of thepolishing pad 18. Thehole 82 can be punched from the top (i.e., the side with the polishing surface) of the pad, e.g., by a machine press. This permits the position of thehole 82 to be positioned and sized with a high degree of accuracy and repeatability. - A
portion 72 of theliner 70 is peeled away or otherwise removed from theadhesive layer 28. Theliner 70 need not be peeled of thepolishing pad 18 entirely at this time. Theportion 72 of theliner 70 that is peeled away exposes a portion of abottom surface 22 of theadhesive layer 28 around thehole 82. Theportion 72 that is peeled off can also be cut away, e.g., in a region sized to accommodate theledge 49 of thebottom portion 40 b of thewindow 40, although this step can be performed at a later time. - Referring to
FIGS. 5 and 6 , thewindow 40 is secured to thepolishing pad 18 such that theupper portion 40 a extends into thehole 82, and the upper surface of thebottom portion 40 b (e.g., the ledge 49) contacts theadhesive layer 28. In some embodiments, theupper portion 40 a is sized to extend substantially through and substantially fill thehole 82 such that theupper surface 44 is coplanar with the polishingsurface 24 of thepolishing layer 20 when theledge 49 is adhered to theadhesive layer 28. - In addition to the
liner 70, an optionalwindow backing piece 74 can be placed to span thewindow 40. For example, thewindow backing piece 74 can be secured to a portion of theadhesive layer 28 immediately around thewindow 40. Thebacking piece 74 can be the same thickness as theliner 70, or thinner than theliner 70. Thebacking piece 74 can be polytetrafluoroethylene (PTFE), e.g., Teflon®, or another non-stick material. The combinedpolishing pad 18 andwindow 40 can then be readied for shipment to the customer, e.g., in a sealed plastic bag. - Referring now to
FIG. 7 , when the customer receives the combinedpolishing pad 18 andwindow 40, the customer can remove the liner 70 (andwindow backing piece 74 if present) and then attach thepolishing pad 18 on theplaten 16 using theadhesive layer 28. Thelower portion 40 b of thewindow 40 is inserted into arecess 78 in theupper surface 76 of theplaten 16. In some methods, theliner 70 can be peeled away partially in an area around thewindow 40, thelower portion 40 b of thewindow 40 is inserted into the recess, and then the remainder of the liner is peeled away and the rest of the polishing pad is secured to theplaten 16. - The
lower portion 40 b can be shaped and sized to substantially fill therecess 78, for example, thesidewall 84 of thelower portion 40 b can contact substantially all of asidewall 86 of therecess 78, and thebottom surface 46 of thewindow 40 substantially contacts afloor 88 of therecess 78 while theupper surface 76 of theplaten 16 contacts theadhesive layer 28. - In some implementations, the
floor 88 of therecess 78 may be substantially parallel with theupper surface 76 of theplaten 16. In some implementations, thesidewall 84 of thelower portion 40 b is perpendicular to thebottom surface 46, and thesidewall 86 of therecess 78 is perpendicular to the polishing surface 75. Referring toFIG. 8 , in some implementations, thesidewall 84 of thelower portion 40 b may be formed at a non-perpendicular angle, e.g., between 20° and 80°, e.g., 45°, to thebottom surface 46, and thesidewall 86 of therecess 78 may be formed at a substantially similar angle such that thesidewall 84 and thesidewall 86 substantially contact each other when thelower portion 40 b is inserted into therecess 78. For example, thesidewall 84 may slope inward from theledge 49 to thebottom surface 46, such that thelower portion 40 b forms a conic section. Similarly, thesidewall 86 may be formed to mate with the conic section. As such, the slopedsidewall 84 may cause thewindow 40 and thepolishing pad 18 to exhibit a self-centering property as thewindow 40 is inserted into therecess 78 within the slopedsidewall 86. - As such, the
polishing pad 18 is adhered to theplaten 16 by theadhesive layer 28, thereby retaining thewindow 40 within therecess 78 in theplaten 16. Thewindow 40 can be vertically supported by thefloor 88 of therecess 78 and can be retained laterally by thesidewalls 86 of therecess 78. Thewindow 40 can be adhered to the polishing pad by the contact of the top surface of theledge 49 to the same adhesive layer that secures the underside of the polishing pad to theplaten 16. - While certain embodiments have been described, the invention is not so limited. For example, although a window with a simple circular shape is described, the window could be more complex, such as a rectangle, oval or star. The top portion of the window can project past one or more sides of the bottom portion. It will be understood that various other modifications may be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims.
Claims (24)
1. A polishing apparatus, comprising:
a platen having a planar upper surface, a recess formed in the upper surface, the recess having a bottom surface, and a passage connected to the lower surface of the recess;
a polishing pad comprising a polishing layer a polishing surface, and underside and an aperture therethrough, the aperture having a smaller lateral dimension than the recess, the aperture aligned with the passage; and
a solid light-transmitting window having a first portion positioned at least partially in the aperture in the polishing pad and a second portion positioned at least partially in the recess in the platen, the second portion having a larger lateral dimension than the first portion and extending below the polishing layer, the second portion of the window adhesively attached to an underside of the polishing pad.
2. The polishing apparatus of claim 1 , wherein the first portion of the window plugs the aperture in the polishing pad.
3. The polishing apparatus of claim 2 , wherein a top surface of the first portion of the window is coplanar with the upper surface of the platen.
4. The polishing apparatus of claim 1 , wherein the bottom surface of the recess is parallel with the upper surface of the platen.
5. The polishing apparatus of claim 1 , wherein a lower surface of the second portion of window contacts the lower surface of the recess.
6. The polishing apparatus of claim 5 , wherein the lower surface of the second portion of window is not adhered to the lower surface of the recess.
7. The polishing apparatus of claim 1 , further comprising an adhesive layer spanning the polishing layer.
8. The polishing apparatus of claim 7 , wherein the adhesive layer comprises a double-sided adhesive tape.
9. The polishing apparatus of claim 7 , wherein the adhesive layer abuts the polishing layer.
10. The polishing apparatus of claim 7 , wherein the underside of the polishing pad is adhesively attached to the upper surface of the platen by the adhesive layer.
11. The polishing apparatus of claim 10 , wherein a top surface of the second portion of the window is adhesively attached to underside of the polishing pad by the adhesive layer.
12. The polishing apparatus of claim 7 , wherein a top surface of the second portion of the window is adhesively attached to underside of the polishing pad.
13. The polishing apparatus of claim 1 , wherein the polishing pad consists of the polishing layer.
14. The polishing apparatus of claim 1 , wherein the polishing pad consists of the polishing layer and a lower layer that is less compressible than the polishing layer.
15. The polishing apparatus of claim 1 , wherein the second portion has a lateral dimension between two and ten times larger than the first portion.
16. The polishing apparatus of claim 15 , wherein the second portion has a lateral dimension about 8 times larger than the first portion.
17. The polishing apparatus of claim 1 , wherein the second portion of the window laterally fills the recess in the platen.
18. The polishing apparatus of claim 1 , wherein the polishing pad has a thickness less than 1 mm.
19. The polishing apparatus of claim 1 , further comprising an optical fiber in the passage and positioned to direct or receive light through the first portion of the window.
20. The polishing apparatus of claim 19 , wherein the optical fiber is wider than the first portion of the window.
21. The polishing apparatus of claim 1 , wherein sides of the recess are sloped and sides of the second portion of the window are sloped.
22. A method of assembling a window for a polishing apparatus, comprising:
forming an aperture through a polishing pad, the polishing pad comprising a polishing layer having a polishing surface and underside;
forming a solid light-transmitting window having a first portion and a second portion having a larger lateral dimension than the first portion;
inserting the first portion of the window into the aperture of the pad;
adhering a top surface of the second portion of the window to the underside of the polishing pad; and
positioning the polishing pad and window on a platen such that the second portion of the window fits into a recess in a planar upper surface of the platen and the underside of the polishing pad is adhered to the planar upper surface of the platen.
23. The method of claim 22 , wherein a layer of adhesive is formed on the bottom of the polishing layer and a liner covers the adhesive, a portion of the liner is removed around the aperture, and the top surface of the second portion of the window contacts the adhesive in the removed portion of the liner.
24. The method of claim 23 , further comprising removing a remainder of the liner before positioning the polishing pad on the platen such that the adhesive adheres the underside of the polishing pad to the planar upper surface of the platen.
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JP2013510125A JP2013526420A (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
PCT/US2011/034215 WO2011142975A2 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
KR1020127032411A KR101762936B1 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
CN201180023970.8A CN102893377B (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
KR1020177020536A KR101956848B1 (en) | 2010-05-12 | 2011-04-27 | Polishing pad assembly |
TW100114926A TWI611866B (en) | 2010-05-12 | 2011-04-28 | Pad window insert |
TW106129437A TWI663020B (en) | 2010-05-12 | 2011-04-28 | Pad window insert |
TW106137496A TWI663021B (en) | 2010-05-12 | 2011-04-28 | Pad window insert |
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Cited By (9)
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---|---|---|---|---|
US20140011429A1 (en) * | 2011-01-28 | 2014-01-09 | Applied Materials, Inc. | Gathering Spectra From Multiple Optical Heads |
US20170246722A1 (en) * | 2016-02-26 | 2017-08-31 | Applied Materials, Inc. | Window in thin polishing pad |
EP3137259A4 (en) * | 2014-05-02 | 2018-01-03 | 3M Innovative Properties Company | Interrupted structured abrasive article and methods of polishing a workpiece |
CN109605208A (en) * | 2017-10-02 | 2019-04-12 | 株式会社迪思科 | Grinding device |
US20200023489A1 (en) * | 2018-06-28 | 2020-01-23 | Ebara Corporation | Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table |
US10744618B2 (en) | 2013-03-15 | 2020-08-18 | Applied Materials, Inc. | Polishing pad with secondary window seal |
US11433502B2 (en) * | 2017-06-06 | 2022-09-06 | Ebara Corporation | Polishing table and polishing apparatus having ihe same |
US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
US11774235B2 (en) | 2013-10-25 | 2023-10-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9308620B2 (en) * | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
JP6794464B2 (en) * | 2016-02-26 | 2020-12-02 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Window in a thin polishing pad |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045439A (en) * | 1995-03-28 | 2000-04-04 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6235365B1 (en) * | 1998-12-18 | 2001-05-22 | W. R. Grace & Co.-Conn. | Waterproofing membrane having release sheet cutting system |
US6451398B1 (en) * | 1998-11-24 | 2002-09-17 | Michael S. Sylvester | Double-sided self-adhesive reinforced foam tape |
US20020193058A1 (en) * | 2001-06-15 | 2002-12-19 | Carter Stephen P. | Polishing apparatus that provides a window |
JP2003188124A (en) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | Polishing cloth |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US20040146682A1 (en) * | 2003-01-29 | 2004-07-29 | David Emmert | Decal form with sub-surface window |
US6832949B2 (en) * | 2001-10-26 | 2004-12-21 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
US7192340B2 (en) * | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
US20070193126A1 (en) * | 2006-01-10 | 2007-08-23 | Mishko Teodorovich | Apparatus and method for door and window side flashing |
US7323415B2 (en) * | 2004-04-23 | 2008-01-29 | Jsr Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
US7513818B2 (en) * | 2003-10-31 | 2009-04-07 | Applied Materials, Inc. | Polishing endpoint detection system and method using friction sensor |
US7815997B2 (en) * | 2006-12-29 | 2010-10-19 | 3M Innovative Properties Company | Window film assembly and method of installing |
US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
US8010222B2 (en) * | 2002-02-04 | 2011-08-30 | Kla-Tencor Technologies Corp. | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6190234B1 (en) * | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
JP2001009699A (en) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | Plane surface grinding device |
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
JP2003163191A (en) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | Polishing pad for mechanochemical polishing device |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
US7731568B2 (en) * | 2004-03-11 | 2010-06-08 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and semiconductor device manufacturing method |
US7226339B2 (en) * | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
WO2007024807A2 (en) * | 2005-08-22 | 2007-03-01 | Applied Materials, Inc. | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
JP5363470B2 (en) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | Thin polishing pad with window and molding process |
KR20090055857A (en) * | 2007-11-29 | 2009-06-03 | 주식회사 동부하이텍 | Chamical machanical polishing pad |
US7839496B2 (en) * | 2008-04-24 | 2010-11-23 | Araca Incorporated | Confocal microscopy pad sample holder and method of hand using the same |
-
2010
- 2010-05-12 US US12/778,760 patent/US20110281510A1/en not_active Abandoned
-
2011
- 2011-04-27 CN CN201180023970.8A patent/CN102893377B/en active Active
- 2011-04-27 WO PCT/US2011/034215 patent/WO2011142975A2/en active Application Filing
- 2011-04-27 JP JP2013510125A patent/JP2013526420A/en not_active Withdrawn
- 2011-04-27 KR KR1020177020536A patent/KR101956848B1/en active IP Right Grant
- 2011-04-27 KR KR1020127032411A patent/KR101762936B1/en active IP Right Grant
- 2011-04-28 TW TW106129437A patent/TWI663020B/en active
- 2011-04-28 TW TW100114926A patent/TWI611866B/en active
- 2011-04-28 TW TW106137496A patent/TWI663021B/en active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7255629B2 (en) * | 1995-03-28 | 2007-08-14 | Applied Materials, Inc. | Polishing assembly with a window |
US6045439A (en) * | 1995-03-28 | 2000-04-04 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6451398B1 (en) * | 1998-11-24 | 2002-09-17 | Michael S. Sylvester | Double-sided self-adhesive reinforced foam tape |
US6235365B1 (en) * | 1998-12-18 | 2001-05-22 | W. R. Grace & Co.-Conn. | Waterproofing membrane having release sheet cutting system |
US7192340B2 (en) * | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
US6857941B2 (en) * | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
US20020193058A1 (en) * | 2001-06-15 | 2002-12-19 | Carter Stephen P. | Polishing apparatus that provides a window |
US6832949B2 (en) * | 2001-10-26 | 2004-12-21 | Jsr Corporation | Window member for chemical mechanical polishing and polishing pad |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
JP2003188124A (en) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | Polishing cloth |
US8010222B2 (en) * | 2002-02-04 | 2011-08-30 | Kla-Tencor Technologies Corp. | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
US20040146682A1 (en) * | 2003-01-29 | 2004-07-29 | David Emmert | Decal form with sub-surface window |
US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
US7513818B2 (en) * | 2003-10-31 | 2009-04-07 | Applied Materials, Inc. | Polishing endpoint detection system and method using friction sensor |
US7323415B2 (en) * | 2004-04-23 | 2008-01-29 | Jsr Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
US20070193126A1 (en) * | 2006-01-10 | 2007-08-23 | Mishko Teodorovich | Apparatus and method for door and window side flashing |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
US7815997B2 (en) * | 2006-12-29 | 2010-10-19 | 3M Innovative Properties Company | Window film assembly and method of installing |
Non-Patent Citations (1)
Title |
---|
"Glossary of Terms." 11 October 2007. GPA Specialty Substrate Solutions. 23 January 2014. . * |
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US20140011429A1 (en) * | 2011-01-28 | 2014-01-09 | Applied Materials, Inc. | Gathering Spectra From Multiple Optical Heads |
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US11618124B2 (en) | 2013-03-15 | 2023-04-04 | Applied Materials, Inc. | Polishing pad with secondary window seal |
US11774235B2 (en) | 2013-10-25 | 2023-10-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US10058970B2 (en) | 2014-05-02 | 2018-08-28 | 3M Innovative Properties Company | Interrupted structured abrasive article and methods of polishing a workpiece |
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US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
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US20200023489A1 (en) * | 2018-06-28 | 2020-01-23 | Ebara Corporation | Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table |
US11642753B2 (en) * | 2018-06-28 | 2023-05-09 | Ebara Corporation | Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table |
US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
Also Published As
Publication number | Publication date |
---|---|
CN102893377A (en) | 2013-01-23 |
TWI663021B (en) | 2019-06-21 |
KR20170088444A (en) | 2017-08-01 |
WO2011142975A2 (en) | 2011-11-17 |
TW201817541A (en) | 2018-05-16 |
KR101956848B1 (en) | 2019-03-11 |
TWI611866B (en) | 2018-01-21 |
TWI663020B (en) | 2019-06-21 |
CN102893377B (en) | 2016-08-10 |
KR20130103674A (en) | 2013-09-24 |
WO2011142975A3 (en) | 2012-03-01 |
JP2013526420A (en) | 2013-06-24 |
TW201217104A (en) | 2012-05-01 |
TW201742705A (en) | 2017-12-16 |
KR101762936B1 (en) | 2017-07-28 |
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